JP5501049B2 - Sheet sticking device and sticking method - Google Patents

Description

  The present invention relates to a sheet sticking apparatus and a sticking method for sticking a sheet to an adherend.

  Conventionally, in a semiconductor manufacturing process, a sheet sticking device for sticking an adhesive sheet such as a protective tape to the surface of a semiconductor wafer as an adherend (hereinafter sometimes simply referred to as a wafer) is used (for example, Patent Document 1). reference). In this sheet sticking apparatus, with the adhesive sheet placed above the surface of the wafer held on the chuck table, the sticking roller is rolled on the adhesive sheet to stick the adhesive sheet onto the wafer surface, and the stuck adhesive sheet Is cut with a cutter blade along the outer edge of the wafer. In addition, the adhesive sheet is attached not only to the surface of the wafer but also to a frame material that surrounds the chuck table and is provided at substantially the same height as the surface of the wafer. The elongation of the adhesive sheet at the time is suppressed, and the wafer after the adhesive sheet is cut is less likely to warp.

JP 2004-47976 A

However, when the frame material is provided at substantially the same height as the surface of the wafer as in the sheet sticking device described in Patent Document 1, the adhesive sheet is not only wrapped around the side surface of the wafer, but only on the surface of the wafer. As a result, the wafer side surface is not covered with the adhesive sheet. For this reason, in the back grinding process of the wafer to which the adhesive sheet is attached, the cleaning water or the like enters the wafer surface from between the wafer and the cut end of the adhesive sheet, and the circuit on the wafer surface is damaged. Occurs.
Also, the thickness of the wafer before backside grinding and the amount of backside grinding, that is, the thickness of the wafer after grinding, are set to various values depending on the type of wafer and the purpose of the chip. Even if it wraps around, if the amount of wraparound is too large, the adhesive sheet gets into the gap between the grinding members in the back grinding process, etc., and the wafer is damaged or the cut end of the adhesive sheet is rolled up. In this case, the cleaning water or the like enters the wafer surface side from the portion, and the circuit on the wafer surface may be damaged. On the other hand, when the amount of wraparound is small, as described above, cleaning water or the like enters from between the wafer and the cut end of the adhesive sheet.

  An object of the present invention is to provide a sheet sticking apparatus and a sticking method capable of sticking an adhesive sheet around a side portion of an adherend appropriately.

In order to achieve the above object, the sheet sticking device of the present invention is a sheet sticking device for sticking an adhesive sheet to one surface of an adherend, and a support surface for supporting the adherend from the other surface side. Inner support means, outer support means surrounding the inner support means and having a flat surface substantially parallel to the support surface, one surface of the adherend supported by the support surface, and flatness of the outer support means A supply means for supplying the adhesive sheet so as to face a surface; a pressing means for pressing the adhesive sheet against one surface of the adherend and a flat surface of the outer support means; and the inner support a moving means for enabling sticking the adhesive sheet in a state of wrapping around the side surface portion of the adherend by relatively moving the flat surface in the plane perpendicular to the direction of the supporting surface and the outer support means means, various information Is entered and And control means for controlling the operation of each of the sheet sticking apparatus Te, the control means, an amount corresponding values wraparound amount by subtracting the various the adhesive sheet from the thickness of the adherend included in the information The moving means is driven so that the support surface is further away from the supplied adhesive sheet than the flat surface, and the adhesive sheet is provided on the adherend by adjusting to a predetermined wraparound amount. there is adopted the configuration that.

At this time, the sheet sticking device of the present invention comprises a cutting means for cutting the adhesive sheet attached to one surface of the adherend and the surface of the outer support means along the outer edge of the adherend , It is preferable that the control means sets the amount of wraparound after cutting so as to be equal to or less than the thickness after grinding of the adherend included in the various information, and drives the cutting means to cut the adhesive sheet .
Also, the cutting means is preferably configured by an inclined angle changing means for changing the cutting angle of inclination.

On the other hand, the sheet sticking method of the present invention is a sheet sticking method for sticking an adhesive sheet to one surface of an adherend, and one surface of the adherend supported by a support surface from the other surface side, Adjusting the relative position with the outer support means surrounding the adherend, supplying the adhesive sheet so as to oppose one surface of the adherend and the outer support means, the one surface of the adherend is It is in a state of being closer to the supplied adhesive sheet than the flat surface of the outer support means, and by the value obtained by subtracting the amount of wraparound of the adhesive sheet from the thickness dimension of the adherend included in various input information The support surface is moved away from the supplied adhesive sheet rather than the flat surface, and is adjusted to a predetermined wraparound amount so that the adhesive sheet is placed on one surface of the adherend and the outer support means. While pressing the adhesive sheet Serial characterized by sticking in a state of wrapping around the side surface portion of the adherend.

According to the present invention as described above, the moving surface relatively moves the support surface of the inner support means and the flat surface of the outer support means in the plane orthogonal direction, and the adhesive sheet wraps around the side surface portion of the adherend. Even if the adherend is processed in a subsequent process using a fluid such as water, the fluid can be prevented from entering between the adherend and the adhesive sheet. Even when the adherend is a wafer as in Patent Document 1, it is possible to eliminate the inconvenience that cleaning water or the like enters the wafer surface side and damages the circuit of the wafer.
Further, in the configuration provided with the cutting means, when an adhesive sheet having a size that protrudes from the adherend is attached, an unnecessary adhesive sheet portion can be removed. In the case of a wafer, it is possible to eliminate the inconvenience that the adhesive sheet enters between the grinding members during back surface grinding.
Furthermore, when the cutting means is provided so that it can be cut by adjusting the adhesive sheet to a predetermined wraparound amount, the adhesive sheet can be cut in consideration of the thickness after grinding of the wafer, and the wraparound amount is large. It is possible to eliminate the inconvenience that the wafer and the circuit are damaged by being too small or too small.
Further, when the cutting means includes the inclination angle changing means, the amount of wraparound of the adhesive sheet can be adjusted by the inclination of the cutting means.

1 is an overall view of a sheet sticking device according to an embodiment of the present invention. Operation | movement explanatory drawing of the sheet sticking apparatus of FIG.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the present embodiment, unless otherwise specified, terms indicating directions such as “up”, “down”, “left”, and “right” are used with reference to FIG.
In FIG. 1, a sheet sticking apparatus 1 has an adhesive sheet S on a front surface WA on which a circuit is formed on a wafer W as an adherend having a front surface WA that is one surface and a rear surface WB that is the other surface. Is a device that cuts the adhered adhesive sheet S along the outer edge of the wafer W. The side surface WC of the wafer W is provided in an arc shape that connects the front surface WA and the back surface WB in a side view. The sheet sticking apparatus 1 includes an inner support means 2 that supports the wafer W from the back surface WB side, an outer support means 3 that is provided surrounding the inner support means 2, and an inner support means 2 for the outer support means 3. And a linear motion motor 4 as a moving means for moving up and down. Furthermore, the sheet sticking apparatus 1 supplies the belt-shaped adhesive sheet S to the surface WA of the wafer W, and supplies the adhesive AD surface of the supplied adhesive sheet S to the outer support means 3 and the wafer W. A pressing unit 6 that presses and adheres to the surface WA, a cutting unit 7 that cuts the adhesive sheet S attached to the wafer W along the outer edge of the wafer W, and a control unit 8 that controls the operation of each unit. Configured.

  The inner support means 2 includes a table 21 having a disk-like outer shape that sucks and holds the wafer W from the back surface WB side through a suction port (not shown). The table 21 is formed to have a flat support surface 22 that has substantially the same outer shape as the back surface WB (flat surface) of the wafer W and can support the entire back surface WB of the wafer W from below. It is configured.

  The outer support means 3 has a bottom plate portion 31 and a side wall portion 32 rising from the outside of the bottom plate portion 31, and has a rectangular outer shape having a cylindrical opening 34 on the upper side. The table 21 is arranged with a gap of a predetermined interval. A flat surface 33 that is parallel to and flat with the support surface 22 of the table 21 is formed on the upper surface of the side wall portion 32, and the adhesive sheet S is attached to the flat surface 33 together with the surface WA of the wafer W. . The flat surface 33 is laminated with a fluororesin or the like so that the adhered adhesive sheet S can be peeled off.

  In the linear motor 4, the main body 41 is fixed to the upper surface of the bottom plate portion 31 of the outer support means 3, and the output shaft 42 is fixed to the lower surface of the table 21, and the output shaft 42 is driven to advance and retreat based on a command from the control means 8. Thus, the table 21 can be moved in the vertical direction.

  The supply means 5 includes a supply side frame 5A provided on the supply side of the adhesive sheet S on the left side with respect to the outer support means 3, and a recovery side frame 5B provided on the recovery side on the right side with respect to the outer support means 3. And a moving frame 5C that is driven by a driving device such as a linear motor (not shown) and is movably provided in the left-right direction.

  On the supply side frame 5A, an adhesive AD is laminated on the base material BS, and a support roller 51 that supports the adhesive sheet S wound in a roll shape, and a guide that guides the adhesive sheet S drawn from the support roller 51. A roller 52, a driving roller 53 that is driven by a motor 53 </ b> A as a driving device to send out the adhesive sheet S, and a pinch roller 54 that sandwiches the adhesive sheet S between the driving roller 53 are provided. The collection side frame 5B has a collection roller 55 that is driven by a driving device such as a motor (not shown) to wind up and collect unnecessary portions of the adhesive sheet S, and two guide rollers 56 that guide the unnecessary portions of the adhesive sheet S. Is provided. The moving frame 5 </ b> C is provided with a driving roller 57 driven by a motor 57 </ b> A as a driving device, and a pinch roller 58 that sandwiches the adhesive sheet S between the driving roller 57.

  The pressing means 6 is driven by a driving device such as a linear motor (not shown) and is provided so as to be movable in the left-right direction. The pressing means 6 is supported by the frame 61 and can be brought into contact with the base material BS side of the adhesive sheet S. The roller 62 and a driving device such as a linear motor (not shown) that moves the frame 61 up and down are provided. The pressing roller 62 is formed of an elastically deformable member made of rubber or resin.

  The cutting means 7 includes an articulated robot 71 as a driving device provided on the back side of the paper surface in FIG. 1 with respect to the outer support means 3 and a cutting blade 72 provided at the tip of the articulated robot 71. Has been. The articulated robot 71 includes a base 73, a first arm 711 that is pivotally supported about the vertical axis PA (vertical axis) with respect to the base 73, and a vertical motion with respect to the first arm 711. A second arm 712 rotatably supported around a horizontal axis orthogonal to the axis PA (in FIG. 1, an axis perpendicular to the plane of the drawing), and rotatable about the horizontal axis with respect to the second arm 712. A third arm 713 that is pivotally supported, a fourth arm 714 that is pivotally supported around an extension axis EA of the third arm 713, and an orthogonal to the extension axis EA with respect to the fourth arm 714 A fifth arm 715 that is pivotally supported about an axis (in FIG. 1, an axis perpendicular to the plane of the drawing), and a sixth arm that is rotatably supported about an extension axis CA of the fifth arm 715. Arm 716, and a sixth arm By a chuck mechanism (not shown) provided in the arm 716, the cutting blade 72 is provided so that it can support the cutter tool 78 attached. The articulated robot 71 also functions as an inclination angle changing unit, and is configured to be able to change the cutting inclination angle θ (see FIG. 2) of the cutting blade 72. Thereby, the articulated robot 71 uses the first to sixth arms 711 to 716 linked to each other, moves the cutting blade 72 along the outer edge of the wafer W, and changes with this movement. At any position of the cutting blade 72, the cutting inclination angle θ can be controlled to be a predetermined angle. The cutting inclination angle θ is an angle formed between the cutting blade 72 and the adhesive sheet S attached to the wafer W when the cutting blade 72 is viewed from the front in the cutting direction.

  The control means 8 controls various information related to the wafer W, the adhesive sheet S, and the like based on an operator's operation and appropriate detection means based on a control device 81 including a computing means such as a CPU and a storage means such as a memory. An input means 82 for inputting to the device 81 is provided. Here, as various information, the diameter dimension and thickness dimension t of the wafer W, the thickness dimension t1 after grinding when the back surface WB is ground in the post-process, the cross-sectional shape of the side surface WC, the arc dimension thereof, the chamfer dimension, and the adhesive sheet wraparound The amount SD1, the amount of wraparound SD2 after cutting, the thickness dimension ts and the width dimension of the adhesive sheet S can be exemplified. The various types of information may be input from the input unit 82 to the control device 81, may be automatically input to the control device 81 by a detection unit such as a sensor (not shown), or stored in advance in the memory of the control device 81. It may be memorized. The control device 81 calculates the adhesive sheet wrap-around amount SD1 with respect to the side WC portion and the cutting inclination angle θ of the cutting blade 72 by calculation means according to various information, and sends a control command based on the calculation result to the linear motor 4 or Output to the driving device such as the cutting means 7.

Hereinafter, operation | movement of the sheet sticking apparatus 1 is demonstrated.
First, various information is input from the input means 82 to the control device 81, and the sheet sticking device 1 is set in a standby state. Thereafter, when the wafer W is placed on the support surface 22 of the inner support means 2, the supply means 5 moves the moving frame 5C from the left side of the outer support means 3 to the right while the drive roller 57 is stopped, In synchronization with this movement, the unused portion of the adhesive sheet S is fed out from the support roller 51 and the unnecessary portion of the adhesive sheet S is taken up by the collection roller 55. As a result, the adhesive AD side of the adhesive sheet S is supplied facing the flat surface 33 of the outer support means 3 and the surface WA of the wafer W. Next, the inner support means 2 is raised or lowered by the driving of the linear motor 4 in response to a command from the control device 81, and the support surface 22 is moved in the height direction relative to the flat surface 33 of the outer support means 3 (FIG. 1). Move in the middle and up / down direction). As shown in FIG. 2, the relative movement amount is calculated by the control device 81 in accordance with the adhesive sheet S wraparound amount SD1 with respect to the side surface WC portion of the wafer W, and the adhesive sheet wraparound amount SD1 is subtracted from the thickness dimension t of the wafer W. The support surface 22 moves downward from the flat surface 33 by the amount of the value.

  Next, the pressing means 6 drives a linear motion motor (not shown) to lower the pressing roller 62, and presses down the adhesive sheet S with the pressing roller 62 to press the adhesive AD surface against the flat surface 33. Further, the pressing means 6 drives a linear motor (not shown) while pressing the pressing roller 62, moves the pressing roller 62 leftward to roll on the adhesive sheet S, and the flat surface 33 and the surface of the wafer W The adhesive AD surface is sequentially pressed and pasted on the WA. At this time, the height position of the inner support means 2 is adjusted as described above, and a predetermined step is formed between the surface WA of the wafer W and the flat surface 33 of the outer support means 3, so that the elastically deformable press The adhesive sheet S pressed by the roller 62 is stuck around the side surface WC by the adhesive sheet wrap-around amount SD1.

  After attaching the adhesive sheet S to the flat surface 33 and the surface WA of the wafer W as described above, the cutting means 7 drives the articulated robot 71 to pierce the cutting blade 72 into the adhesive sheet S, and the control means 8. The adhesive sheet S is cut along the outer edge of the wafer W based on the information on the diameter of the wafer W input to. At this time, the articulated robot 71 determines the cutting inclination angle θ of the cutting blade 72 according to the value of the post-cutting wraparound amount SD2 input to the control means 8. Specifically, as shown in FIG. 2A, when the adhesive sheet S goes to the middle of the thickness of the wafer W, the cutting inclination angle θ is close to a right angle (or a right angle is acceptable). When the amount of wraparound is small as shown in FIG. 2 (B), the cutting inclination angle θ is changed to be an acute angle, and when the amount of wraparound is large as shown in FIG. 2 (C). Then, the cutting inclination angle θ is changed so as to be obtuse and large. By thus cutting the adhesive sheet S while leaving the wraparound amount SD2 after cutting, it is possible to efficiently prevent cleaning water and the like from entering between the wafer and the adhesive sheet S when grinding the back surface WB in a subsequent process. can do. Further, the post-cutting wraparound amount SD2 is preferably set to be equal to or less than the post-grind thickness dimension t1 in consideration of the post-grind thickness dimension t1, and is controlled by the control means 8 so as to be a predetermined ratio with respect to the post-grind thickness dimension t1. You may make it set automatically. By setting the post-cutting wraparound amount SD2 in consideration of the post-grinding thickness dimension t1, the adhesive sheet S is caught in the grinding blade when the back surface WB is ground, and the wafer W and the grinding apparatus are damaged. Can be prevented.

  When the adhesive sheet S is cut as described above, the cutting means 7 is retracted and the pressing roller 62 is raised, and the wafer W to which the adhesive sheet S is adhered is unloaded by an appropriate transfer device and subjected to back grinding or the like. Sent to the process. Thereafter, the supply unit 5 moves the moving frame 5C in the left direction in FIG. 1 to cut the unnecessary portion of the adhesive sheet S that is cut along the outer edge of the wafer W and stuck on the flat surface 33, as the driving roller 57. Peel off. Then, when the next wafer W is placed on the inner support means 2, the same operation as described above is repeated thereafter.

According to this embodiment as described above, the following effects are obtained.
That is, the inner support means 2 is moved up and down to move the support surface 22 and the flat surface 33 of the outer support means 3 relative to each other, and then the adhesive sheet S is pasted, and the adhesive sheet S wraps around the side surface WC portion of the wafer W. By sticking in the state (adhesive sheet wrap-around amount SD1), the adhesive sheet S can be brought into close contact with the side surface WC portion of the wafer W, and even when the back surface WB is ground in a subsequent process, the cleaning water is applied to the front surface WA of the wafer W. Can be prevented from entering. Further, since the articulated robot 71 is provided so that it can be cut by adjusting the adhesive sheet S so as to have a predetermined amount of wraparound (the amount of wraparound after cutting SD2), bonding is performed in consideration of the thickness of the wafer W after grinding. Since the sheet S can be cut and the amount of wraparound SD2 after cutting is too large or too small, the cut end portion of the adhesive sheet S enters between the grinding members or rolls up during grinding in the subsequent process. As a result, the inconvenience of damaging the wafer W and the circuit can be solved.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

For example, in the above-described embodiment, the case where the adherend is the semiconductor wafer W has been described. However, the adherend is not limited to the semiconductor wafer W, and may be a glass plate, a steel plate, a resin plate, or the like. Members can also be targeted, and examples of semiconductor wafers include silicon semiconductor wafers and compound semiconductor wafers.
The adhesive sheet S may be a sheet for mounting, a protective sheet, a dicing tape, a die bonding tape, or other various sheets, tapes, or films attached to a semiconductor wafer, and the adherend is not a semiconductor wafer. In the case of a member, in addition to the adhesive sheet, a sheet for an appropriate use such as a surface coating sheet or film, or a decorative sheet can be used.

Moreover, in the said embodiment, although the adhesive sheet S was cut | disconnected along the outer edge of the wafer W using the cutting means 7, the cutting means 7 is not essential and does not need to cut | disconnect an adhesive sheet. Furthermore, grinding the back surface of the adherend in a subsequent process is not an essential requirement of the present invention, and the back surface may not be ground. Thus, even when the adhesive sheet is not cut or the back surface is not ground, the adhesive sheet is securely wound on the surface of the adherend by sticking the adhesive sheet around the side surface portion of the adherend. The effect that it can stick is acquired.
Moreover, in the said embodiment, although the structure which moves the support surface 22 and the flat surface 33 relatively by raising / lowering the inner side support means 2 with the linear motion motor 4, the outer side support means 3 may be moved. Both the inner support means 2 and the outer support means 3 may be moved.
Furthermore, the drive device in the embodiment employs an electric device such as a rotation motor, a linear motion motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. (Some overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1 Sheet sticking apparatus 2 Inner support means 3 Outer support means 4 Linear motion motor (moving means)
DESCRIPTION OF SYMBOLS 5 Supply means 6 Press means 7 Cutting means 8 Control means 22 Support surface 33 Flat surface 79 Motor (inclination angle change means)
82 Input Means S Adhesive Sheet W Wafer (Substrate)
WA surface (one side)
WB back side (the other side)
WC side

Claims (4)

A sheet sticking device for sticking an adhesive sheet on one surface of an adherend,
An inner support means having a support surface for supporting the adherend from the other surface side;
Outer support means surrounding the inner support means and having a flat surface substantially parallel to the support surface;
Supply means for supplying the adhesive sheet so as to oppose one surface of the adherend supported by the support surface and the flat surface of the outer support means;
A pressing unit that presses and adheres the adhesive sheet to one surface of the adherend and the flat surface of the outer support unit;
A moving means for enabling stuck in a state of wrapping around the adhesive sheet to the side portion of the adherend by relatively moving the flat surface in the plane perpendicular to the direction of the supporting surface and the outer support means of said inner support means ,
Various types of information are input, and control means for controlling the operation of each part of the sheet sticking device according to the various types of information ,
The control means moves the support surface away from the supplied adhesive sheet rather than the flat surface by a value obtained by subtracting the amount of wraparound of the adhesive sheet from the thickness dimension of the adherend included in the various information. The sheet sticking apparatus is characterized in that the moving means is driven and adjusted to a predetermined amount of wrapping so that the adhesive sheet can be stuck on the adherend . Cutting means for cutting an adhesive sheet affixed to one surface of the adherend and the surface of the outer support means along the outer edge of the adherend ;
The control means sets a wraparound amount after cutting so as to be equal to or less than a thickness dimension after grinding of an adherend included in the various information, and drives the cutting means to cut the adhesive sheet. The sheet sticking apparatus according to claim 1. The sheet sticking device according to claim 2 , wherein the cutting means includes an inclination angle changing means for changing a cutting inclination angle. A sheet attaching method for attaching an adhesive sheet to one surface of an adherend,
Adjusting the relative position between one surface of the adherend supported by the support surface from the other surface side and the outer support means surrounding the adherend;
Supplying the adhesive sheet in opposition to one surface of the adherend and the outer support means;
One surface of the adherend is brought closer to the supplied adhesive sheet than the flat surface of the outer support means,
The support surface is moved away from the supplied adhesive sheet rather than the flat surface by the value obtained by subtracting the amount of wraparound of the adhesive sheet from the thickness dimension of the adherend included in the inputted various information. The adhesive sheet is pressed against one surface of the adherend and the outer support means while being adjusted to a predetermined wraparound amount, and the adhesive sheet is wound around the side surface portion of the adherend. A sheet sticking method characterized by sticking.

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