JP5562091B2 - Pressure roller - Google Patents

Description

The present invention relates to a pressing row La for pressing an object such as an adhesive sheet.

  2. Description of the Related Art Conventionally, in a semiconductor manufacturing process, a sheet sticking device for sticking an adhesive sheet such as a protective tape on the surface of a semiconductor wafer (hereinafter sometimes simply referred to as a wafer) as an adherend is a pressure for pressing the adhesive sheet. A roller is provided (see, for example, Patent Document 1). The pressing roller presses the adhesive sheet by rolling on the adhesive sheet in a state where the adhesive sheet is disposed above the surface of the wafer held on the chuck table, and affixes the adhesive sheet to the wafer surface.

  On the other hand, in a fixing device used in a printer or the like in addition to a sheet sticking device, a pressure roller (fixing roller) that presses a pressure belt that conveys an object to be fixed toward a pressure member is used (for example, Patent Document 2). The pressure roller described in Patent Document 2 is configured to include a hollow metal core having a built-in heat source, an elastic layer that covers the surface, and a release layer that covers the surface.

JP 2004-47976 A JP 2006-53494 A

  However, in the pressure rollers described in Patent Document 1 and Patent Document 2, when the force applied to the pressure roller is constant, the pressing force per unit area applied to the pressed object by the elastic force of the member provided on the surface thereof. (Hereinafter referred to as “unit pressing force”) is determined, and in order to change the unit pressing force, the elasticity of the pressing roller or a member provided on the surface of the pressing roller must be changed. For example, in the pressing roller described in Patent Document 2, the elastic layer is formed of silicone rubber, and the unit pressing force is determined by the material and the temperature from the heating source. For this reason, if the elasticity of the pressure roller is not appropriate for the pressing conditions, such as the method of applying the adhesive sheet, the rigidity of the adhesive sheet, the shape of the adherend, or the pressing speed of the pressing roller, the pressing roller itself should be replaced. It has to be troublesome. In addition, if the elasticity of the pressing roller is not appropriate, problems such as poor adhesion of the adhesive sheet and damage to the adherend occur.

An object of the present invention is to provide a press rows La that can appropriately change the elasticity of the pressing surface.

In order to achieve the above object, a pressing roller of the present invention is a pressing roller for attaching an adhesive sheet to an adherend , and includes a pressing surface composed of an elastic member whose hardness changes with temperature change, and the elastic member. Temperature adjusting means for adjusting temperature, and control means for controlling temperature adjustment of the elastic member by the temperature adjusting means, wherein the temperature adjusting means cools the elastic member and heating means for heating the elastic member. Cooling means, and heat insulating means for partitioning the heating means and the cooling means, and the heating means and the cooling means are alternately provided in the direction of the rotation axis of the pressing roller with the heat insulating means interposed therebetween. Is adopted.

At this time, the pressing roller of the present invention, before Symbol control means preferably controls the heating of said resilient member by said heating means.
Further, in the pressing roller of the present invention, before Symbol control means preferably controls the cooling of the elastic member by the cooling means.

According to the present invention as described above, the hardness of the elastic member can be arbitrarily changed by adjusting the temperature of the elastic member constituting the pressing surface of the pressing roller. It can be changed to a suitable state. Thereby, the unit pressing force can be freely changed when the force applied to the pressing roller is constant.
Also, by providing heating means or cooling means and heating or cooling the elastic member, the temperature of the elastic member can be raised or lowered with respect to the ambient temperature, so the elasticity of the pressing surface can be changed, or the adhesive sheet The adhesive sheet can be heated or cooled in accordance with the constituent materials and adhesive properties of the material and can be attached to the pressed object.
Furthermore, if the heat insulating means for partitioning the heating means and the cooling means is provided, the elastic member can be heated or cooled without being affected by each other, so the temperature of the elastic member can be adjusted effectively, The elasticity of the pressing surface can be set more appropriately.

1 is an overall view of a sheet sticking device according to an embodiment of the present invention. Sectional drawing of the press roller provided in the sheet sticking apparatus of FIG. Operation | movement explanatory drawing of a sheet sticking apparatus and a press roller.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the present embodiment, unless otherwise specified, terms indicating directions such as “up”, “down”, “left”, and “right” are used with reference to FIG.
In FIG. 1, a sheet sticking apparatus 1 has an adhesive sheet S on a front surface WA on which a circuit is formed on a wafer W as an adherend having a front surface WA that is one surface and a rear surface WB that is the other surface. And affixing the adhered adhesive sheet S along the outer edge WC of the wafer W. The sheet sticking apparatus 1 includes a supporting unit 2 that supports the wafer W from the back surface WB side, a supply unit 5 that supplies a belt-shaped adhesive sheet S to face the front surface WA of the wafer W, and the supplied adhesive sheet S. The pressing means 6 that presses and sticks to the support means 2 and the surface WA of the wafer W, the cutting means 7 that cuts the adhesive sheet S stuck to the wafer W along the outer edge WC of the wafer W, and the operation of each part And control means 8 for controlling.

  The support means 2 sucks and holds the wafer W from the back surface WB side via a suction port (not shown), and has a disk-shaped table 22 having a flat support surface 21 having the same outer shape as the outer edge WC of the wafer W; A circular hole 23 is formed, and the outer peripheral table 25 having a planar view shape in which a flat flat surface 24 is formed parallel to the support surface 21 of the table 22 is fixed to the bottom surface portion 26 of the hole 23. In addition, an output shaft 27A is provided with a linear motion motor 27 as a drive device fixed to the lower surface of the table 22. The flat surface 24 is laminated with a fluororesin or the like so that the attached adhesive sheet S can be peeled off.

  The supply means 5 includes a supply side frame 5A provided on the supply side of the adhesive sheet S on the left side with respect to the support means 2, a collection side frame 5B provided on the collection side on the right side with respect to the support means 2, and And a moving frame 5C which is driven by a driving device such as a linear motor and is provided so as to be movable in the left-right direction.

  The supply side frame 5 </ b> A has a support roller 51 that supports the adhesive sheet S in which the adhesive AD is laminated on the base material BS in a roll shape, and a guide roller that guides the adhesive sheet S drawn from the support roller 51. 52, a driving roller 53 that is driven by a motor 53 </ b> A as a driving device to send out the adhesive sheet S, and a pinch roller 54 that sandwiches the adhesive sheet S between the driving roller 53. The collection side frame 5B has a collection roller 55 that is driven by a driving device such as a motor (not shown) to wind up and collect unnecessary portions of the adhesive sheet S, and two guide rollers 56 that guide the unnecessary portions of the adhesive sheet S. Is provided. The moving frame 5 </ b> C is provided with a driving roller 57 driven by a motor 57 </ b> A as a driving device, and a pinch roller 58 that sandwiches the adhesive sheet S between the driving roller 57.

  The pressing means 6 includes a frame 62 that is driven by a linear motor 61 as a driving device and is provided so as to be movable in the left-right direction, and a pressing roller that is supported by the frame 62 and can be brought into contact with the base material BS side of the adhesive sheet S. 63 and a linear motion motor 64 as a drive device for moving the frame 62 up and down.

  As shown in FIG. 2, the pressing roller 63 includes a rotation support portion 65 that is rotatably supported by the frame 62 via a rotation shaft 65 </ b> A, and heating that is provided alternately along the rotation axis direction of the rotation support portion 65. A heater 66A as a means and a Peltier element 66B as a cooling means; a heat insulating member 66C as a heat insulating means provided between the heater 66A and the Peltier element 66B to insulate between the heater 66A and the Peltier element 66B; A cylindrical elastic member 67 that is supported by 65 and covers the outer peripheral surfaces of the heater 66A, the Peltier element 66B, and the heat insulating member 66C is attached to the lower surface side of the frame 62 at a predetermined interval, and detects the temperature of the elastic member 67. And a temperature sensor 68 as temperature detecting means.

  In this pressing roller 63, the temperature adjusting means 66 is constituted by the heater 66A, the Peltier element 66B, and the heat insulating member 66C. The member 67 can be heated or cooled. The elastic member 67 is made of rubber, resin, or the like, and the hardness changes with a temperature change. That is, by adjusting the temperature of the elastic member 67 with the temperature adjusting means 66, the elasticity of the pressing surface 67A of the elastic member 67 can be arbitrarily changed.

  The cutting means 7 includes an articulated robot 71 as a driving device provided on the back side in FIG. 1 with respect to the supporting means 2 and a cutting blade 72 provided at the tip of the articulated robot 71. ing. The articulated robot 71 includes a base 73, a first arm 711 that is pivotally supported about the vertical axis PA (vertical axis) with respect to the base 73, and a vertical motion with respect to the first arm 711. A second arm 712 that is rotatably supported around a horizontal axis orthogonal to the axis PA (in FIG. 1, an axis perpendicular to the plane of the drawing), and an axis that is rotatable about the horizontal axis with respect to the second arm 712. A third arm 713 that is supported, a fourth arm 714 that is rotatably supported around an extension axis EA of the third arm 713, and a perpendicular to the extension axis EA with respect to the fourth arm 714 A fifth arm 715 that is rotatably supported around an axis (an axis perpendicular to the plane of the drawing in FIG. 1), and a sixth arm that is rotatably supported around an extension axis CA of the fifth arm 715 716 and the sixth a By a chuck mechanism (not shown) provided in the arm 716, the cutting blade 72 is provided so that it can support the cutter tool 74 attached.

  The control means 8 controls various information related to the wafer W, the adhesive sheet S, and the like based on an operator's operation and appropriate detection means based on a control device 81 including a computing means such as a CPU and a storage means such as a memory. An input means 82 for inputting to the device 81 is provided. Here, as various information, the diameter dimension and thickness dimension of the wafer W, the thickness dimension after grinding when the back surface WB is ground in a subsequent process, the cross-sectional shape and chamfer dimension of the outer edge WC, the thickness dimension and rigidity of the adhesive sheet S The set temperature of the elastic member 67 can be exemplified. The information may be input from the input unit 82 to the control device 81, may be automatically input to the control device 81 by a detection unit such as a sensor (not shown), or is stored in advance in the memory of the control device 81. May be. The control device 81 calculates the relative movement amount of the support surface 21 of the table 22 with respect to the flat surface 24 of the outer peripheral table 25 according to various types of information, and commands a control command based on the calculation result to each drive device. Or a control command is output to the temperature adjusting means 66 so that the elastic member 67 reaches a set temperature. The control means 8 is also connected to a sensor (not shown) as an atmospheric temperature detection means for detecting the temperature of the atmosphere.

Hereinafter, operation | movement of the sheet sticking apparatus 1 is demonstrated.
First, various information is input from the input means 82 to the control device 81, and the sheet sticking device 1 is set in a standby state. Thereafter, when the wafer W is placed on the support surface 21 of the table 22, the supply unit 5 moves the moving frame 5 </ b> C from the left side of the support unit 2 to the right while the drive roller 57 is stopped. Synchronously, the unused portion of the adhesive sheet S is fed out from the support roller 51, and unnecessary portions of the adhesive sheet S are wound up by the collection roller 55. Thereby, the adhesive AD side of the adhesive sheet S is supplied to the upper side of the front surface WA of the wafer W so as to be opposed. Next, the linear motion motor 27 that has received a command from the control device 81 raises or lowers the table 22 so that the surface WA of the wafer W and the flat surface 24 of the outer peripheral table 25 are located in the same plane.

  Further, in the control device 81, the temperature sensor 68 detects the temperature of the elastic member 67, and calculates the difference from the set temperature of the elastic member 67 input to the control device 81 by the calculation means. As a result, a drive command is output to the heater 66A or the Peltier element 66B. The elastic member 67 is heated or cooled by driving the heater 66A or the Peltier element 66B in response to a command from the control device 81, and the heater 66A or the Peltier element 66B is driven so that the elastic member 67 maintains the set temperature. The As a result, the temperature of the elastic member 67 changes and the elasticity of the pressing surface 67A of the pressing roller 63 is changed. When the temperature of the elastic member 67 detected by the temperature sensor 68 is lower than the set temperature of the elastic member 67 input to the control device 81, the control device 81 outputs a drive command to the heater 66A. Conversely, if the detected temperature of the elastic member 67 is higher than the set temperature input to the control device 81, the control device 81 outputs a drive command to the Peltier element 66B.

  Next, the pressing means 6 drives the linear motion motor 64 to lower the pressing roller 63, and presses down the adhesive sheet S with the pressing roller 63 to press the adhesive surface of the adhesive sheet S against the flat surface 24. Further, the pressing means 6 drives the linear motor 61 while pressing the pressing roller 63, moves the pressing roller 63 leftward to roll on the adhesive sheet S, and the flat surface 24 and the surface WA of the wafer W. The adhesive sheet S is pressed and pasted in sequence. At this time, since the temperature of the elastic member 67 is adjusted as described above, the elasticity of the pressing surface 67A of the pressing roller 63 can be appropriately set for various pressing conditions.

For example, as shown in FIG. 3A, when the elasticity of the pressing surface 67A needs to be increased due to the material or rigidity of the adhesive sheet S, or the amount of the wraparound M of the adhesive sheet S with respect to the outer edge WC (FIG. 3). When it is necessary to reduce (see (B)), the set temperature of the elastic member 67 may be set low, and as shown in FIG. 3B, the amount of wraparound M needs to be increased. For this, the set temperature of the elastic member 67 may be set high. In order to increase the amount of wraparound M, the height of the table 22 may be adjusted so that the surface WA of the wafer W is higher than the flat surface 24. Further, as shown in FIG. 3C, when the bumps or other convex portions WD are present on the surface WA of the wafer W, the elastic member 67 is softened by setting the temperature of the elastic member 67 higher. Thus, the pressing surface 67A is easily deformed along the shape of the convex portion WD, and the adhesive sheet S can be attached without mixing bubbles around the convex portion WD.
Further, when the adhesive sheet S has a high rigidity, for example, when the adhesive sheet S in which bubbles are mixed around the convex portion WD of the surface WA of the wafer W is used, or in a temperature region higher than the ambient temperature When sticking the adhesive sheet S suitable for sticking, it can be stuck at a higher set temperature. Furthermore, when the adhesive sheet S is used such that the rigidity of the adhesive sheet S is low and the adhesive sheet S extends due to pressing by the pressing roller 63, or the adhesive sheet S in a temperature region lower than the ambient temperature is more suitable for application. When pasting, it can be pasted at a lower set temperature.

  After affixing the adhesive sheet S to the flat surface 24 and the surface WA of the wafer W, the cutting means 7 drives the articulated robot 71 to pierce the cutting blade 72 into the adhesive sheet S and along the outer edge WC of the wafer W. The adhesive sheet S is cut.

  When the adhesive sheet S is cut as described above, the cutting means 7 is retracted and the pressing roller 63 is raised, and the wafer W to which the adhesive sheet S is adhered is unloaded by an appropriate transfer device and subjected to back grinding or the like. Sent to the process. Thereafter, the supply means 5 moves the moving frame 5C in the left direction while driving the drive roller 57, so that the supply sheet 5 is cut along the outer edge WC of the wafer W and adhered to the flat surface 24. Remove unnecessary parts. When the next wafer W is supported by the support means 2, the same operation as described above is repeated thereafter.

According to this embodiment as described above, the following effects are obtained.
That is, since the elasticity of the elastic member 67 can be arbitrarily changed by adjusting the temperature of the elastic member 67 in the pressing roller 63, the elasticity of the pressing surface 67A can be changed to a state suitable for the pressing condition. Therefore, since the adhesive sheet S can be brought into close contact with the wafer W, the disadvantage that the adhesive sheet S is rolled up can be avoided, and damage to the wafer W can be prevented.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

For example, in the above-described embodiment, the case where the adherend is the wafer W is shown. However, the adherend is not limited to the wafer W, and other members such as a glass plate, a steel plate, or a resin plate are also included. Examples of the wafer W include silicon semiconductor wafers and compound semiconductor wafers.
The adhesive sheet S may be a protective sheet, a mounting sheet, a dicing tape, a die bonding tape, or any other sheet, tape, or film that is affixed to a semiconductor wafer. In the case of a member, a sheet for an appropriate use such as a surface coating sheet or film, or a decorative sheet can be used.

  In the above embodiment, the heater 66A and the Peltier element 66B are provided in the elastic member 67 of the pressing roller 63, and the temperature of the elastic member 67 is adjusted by driving the heater 66A or the Peltier element 66B. The configuration for adjusting the temperature of the elastic member 67 is not limited to the heater 66A and the Peltier element 66B, but a liquid or gas whose temperature is adjusted is supplied to the internal space of the elastic member 67, so that the temperature of the elastic member 67 is increased. May be adjusted. In this case, a flow path communicating with the internal space of the elastic member 67 is formed in the rotation support portion 65, and external inflow pipes and discharge pipes are connected to this flow path.

  In addition to the heater 66A, the heating means may be constituted by hot air, hot water, a discharge heater, an infrared heater, or the like, and the cooling means is cold air, cold water, an electronic cooling element other than the Peltier element 66B, or the like. It may be constituted by.

Moreover, in the said embodiment, although the adhesive sheet S was cut | disconnected along the outer edge WC of the wafer W using the cutting | disconnection means 7, the cutting | disconnection means 7 is not essential and does not need to cut | disconnect an adhesive sheet. Furthermore, grinding the back surface of the adherend in a subsequent process is not an essential requirement of the present invention, and the back surface may not be ground.
Furthermore, the drive device in the embodiment employs an electric device such as a rotation motor, a linear motion motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. (Some overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1 Sheet sticking apparatus 5 Supply means 6 Press means 7 Cutting means 8 Control means 63 Press roller 66 Temperature adjustment means 66A Heater (heating means)
66B Peltier element (cooling means)
66C heat insulation member (heat insulation means)
67 Elastic member 67A Press surface S Adhesive sheet W Wafer (Substrate)
WA surface (one side)
WB back side (the other side)
WC outer edge

Claims (1)

A pressing roller for attaching an adhesive sheet to an adherend,
A pressing surface composed of an elastic member whose hardness changes with temperature change;
Temperature adjusting means for adjusting the temperature of the elastic member;
Control means for controlling temperature adjustment of the elastic member by the temperature adjustment means,
The temperature adjusting means includes heating means for heating the elastic member, cooling means for cooling the elastic member, and heat insulating means for partitioning the heating means and the cooling means, and the heating means and the cooling means are wherein in between the insulating means are alternately arranged in the rotation axis direction of the pressing roller pressing roller, wherein Rukoto.

Images