JP5830377B2 - Sheet sticking device and sheet sticking method - Google Patents

Description

  The present invention relates to a sheet sticking apparatus and a sheet sticking method.

Conventionally, a configuration in which an adhesive sheet is attached to a semiconductor wafer (hereinafter sometimes referred to as “wafer”) is known (see, for example, Patent Document 1).
In the configuration of Patent Document 1, an original sheet in which a belt-like adhesive sheet and a cover sheet overlap each other is supplied onto a wafer by an original sheet supply unit, and the application roller rolls on the original sheet while rolling on the original sheet. The cutter unit cuts the adhesive sheet and the cover sheet along the periphery of the wafer.

JP 2003-257898 A

  In recent years, in an electronic device using a chip obtained by dividing a wafer, a plurality of electronic circuits are provided by stacking a plurality of chips, thereby improving the performance of the electronic device, for example. However, the configuration as in Patent Document 1 has a disadvantage in that an adhesive sheet provided with an adhesive layer in advance must be prepared.

  The objective of this invention is providing the sheet sticking apparatus and the sheet sticking method which do not need to prepare the adhesive sheet in which the adhesive bond layer was provided previously.

In order to achieve the above object, the sheet sticking apparatus of the present invention is a sheet sticking apparatus for sticking a sheet to a plate-like member, and applying a liquid re-adhesive to one surface of the plate-like member. Laminating means for laminating a re-adhesion layer, feeding means for feeding out the sheet, pressing means for pressing and sticking the sheet to the surface of the plate-like member on which the re-adhesion layer is laminated, and the plate-like member A holding means; a moving means for moving the table relative to the pressing means; a fluidizing means for fluidizing the re-adhesion layer; and a control means, wherein the pressing means A pressing roller for pressing, and a thickness control means for adjusting the lifting amount of the pressing roller, wherein the control means includes a feeding speed of the sheet, a lifting amount of the pressing roller, a fluidization state of the re-adhesion layer, and The tape By controlling the moving speed of the Le, controlling the thickness of the re-adhesive layer, it employs the configuration that.

In this case, a sheet sticking apparatus of the present invention, after the sheet is affixed to the plate-like member comprises a solid means for solidifying the re adhesive, it is not preferable.

On the other hand, the sheet sticking method of the present invention is a sheet sticking method for sticking a sheet to a plate-like member, a table capable of holding the plate-like member, a pressing roller for pressing the sheet, and the plate-like member. Fluidizing means for fluidizing the re-adhesion layer to be laminated, and laminating the re-adhesion layer by applying a liquid re-adhesive on one surface of the plate-like member held on the table, feeding the sheet, said relative pressure roller is moved to the table, together with the re-adhesive layer in the plate-like member by the pressing roller is attached by pressing the sheet to the laminated surface, of the sheet feeding A configuration is adopted in which the thickness of the re-adhesion layer is controlled by controlling the speed, the amount of elevation of the pressing roller, the fluidization state of the re-adhesion layer, and the moving speed of the table .

According to the present invention as described above, the re-adhesion layer is laminated on the plate-like member by laminating the re-adhesion layer, and then the sheet is attached to the re-adhesion layer. It is no longer necessary to prepare an adhesive sheet provided with, and for example, a combination of a re-adhesive and a sheet can be arbitrarily set. Further, since the fluidizing means is used, the fluidized re-adhesive can be spread uniformly on the plate-like member in a short time, and the re-adhesive layer can be controlled to an appropriate thickness. Furthermore, by providing the pressing means with thickness control means, the thickness of the re-adhesion layer can be controlled simultaneously with pressing the sheet against the plate-like member, and the accuracy and uniformity of the thickness of the re-adhesion layer can be improved. it can.
The re-adhesion layer refers to a method in which a sheet affixed to a plate-like member via the re-adhesion layer is peeled off from the re-adhesion layer, and then the plate-like member is bonded to another via the re-adhesion layer. It means what can be done.

At this time, by using the solid-formulated means, in response to the step after sticking a sheet to the plate-like member, Ru can be solidified again adhesive layer in the appropriate state.

The side view of the sheet sticking apparatus which concerns on embodiment of this invention. The side view which shows the lamination | stacking means which concerns on the modification of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In each of the drawings, the shape and arrangement of each component are exaggerated for easy understanding of the contents of the present invention.
For example, when directions such as up, down, left, right, near side, and back are shown without referring to a reference figure in the present embodiment, all are based on FIG.
In FIG. 1, a sheet sticking apparatus 1 is configured to stack a re-adhesion layer AD1 by applying a liquid re-adhesive AD to a wafer WF as a plate-like member, and affix a sheet ST to the re-adhesion layer AD1. It is. The re-adhesive AD is not particularly limited as long as it can be made into a liquid, but in the present embodiment, thermoplasticity, thermal polymerization, etc. used for a die attach film are used. Use what has.
The sheet sticking apparatus 1 includes a feeding unit 2 that feeds an original fabric RS temporarily attached to a strip-like release sheet RL at a predetermined interval by pseudo adhesion, and a laminating unit that laminates a re-adhesion layer AD1 on a wafer WF. 3, pressing means 4 for pressing the fed sheet ST against the wafer WF and pasting it via the re-adhesion layer AD 1, moving means 5 for relatively moving the wafer WF and the pressing means 4, and the re-adhesion layer AD 1 Solidifying means 6 for solidifying, and the overall operation is controlled by a control means 7 such as a personal computer or a sequencer.

  The feeding means 2 includes a support roller 21 that supports the original RS wound in a roll shape, guide rollers 22 and 23 that guide the original RS drawn from the support roller 21, and a release sheet RL of the original RS. A peeling plate 24 that peels off the sheet ST from the peeling sheet RL, a driving roller 26 that is driven by a rotation motor 25 as a driving device, and a pinch roller 27 that sandwiches the peeling sheet RL between the driving roller 26 and And a collection roller 28 for collecting the release sheet RL by a rotation motor 29 as a drive device, and the whole is supported by the frame 20.

The laminating means 3 heats the re-adhesive AD supplied from a re-adhesive supply means (not shown), which is fixed to the frame 20 and extends in the direction orthogonal to the paper surface in FIG. The first heater 32 as fluidizing means that fluidizes by spraying, and the spraying means 33 for laminating the re-adhesion layer AD1 on the wafer WF by spraying the fluidized re-adhesive AD in the form of a mist on the wafer WF. With.
The spraying means 33 is not particularly limited as long as the re-adhesive AD can be sprayed onto the entire upper surface of the wafer WF, but as the wafer WF moves leftward by the moving means 5, The spraying range of the re-adhesive AD can be expanded or narrowed in the direction orthogonal to the paper surface, and the re-adhesive AD can be sprayed only on the wafer WF. As such a configuration, for example, a spray unit 33 having a circular or polygonal spray port smaller than the wafer WF may be provided so as to be movable in the direction perpendicular to the paper surface, and the moving range of the spray unit 33 may be adjusted. And it is good also as a structure which fixes the spraying means 33 which has the ellipse shape which extends in the paper surface orthogonal direction, or a rectangular spray port, and adjusts the opening range of the said spray port.

The pressing means 4 is rotatably supported via a support portion 42, and a pressing roller 41 that presses and sticks the sheet ST toward the wafer WF. An output shaft 43 is fixed to the support portion 42, and the pressing roller As a fluidizing means provided in the pressure roller 41 and a linear motion motor 44 as a driving device for moving 41 in the vertical direction, the re-adhesion layer AD1 can be fluidized by heating the re-adhesion layer AD1. The second heater 45 is provided.
The direct acting motor 44 functions as a thickness control unit that controls the thickness of the re-adhesion layer AD <b> 1 by adjusting the lifting / lowering amount of the pressing roller 41 under the control of the control unit 7.

  The moving means 5 is a driving device in which the wafer WF is placed and the wafer WF can be sucked and held by suction means (not shown) such as a vacuum pump or a vacuum ejector, and a slider 52 is fixed to the lower surface of the table 51. And the table 51 can be moved in the left-right direction by sliding the slider 52.

  The solidifying means 6 is provided on the left side of the pressing means 4 and solidifies the re-adhesion layer AD1 laminated between the wafer WF and the sheet ST. As the solidifying means 6, one that emits curing energy according to the curing characteristics of the re-adhesion layer AD1 can be employed. For example, when the re-adhesion layer AD1 is a cooling and curing type, the Peltier effect, Freon, or the like is used. In the case of a cooling device, a blower that blows natural air, a heat curing type, a coil heater, a hot air blower that uses infrared rays, or an energy ray curing type, an ultraviolet irradiation device that irradiates ultraviolet rays or a microwave that emits microwaves A wave irradiation apparatus etc. can be illustrated.

  In the sheet sticking apparatus 1 described above, as a procedure for sticking the sheet ST to the wafer WF, first, the original fabric RS is set as shown in FIG. When an activation signal is input by an operation means such as a touch panel or a keyboard (not shown) electrically connected to the control means 7, the control means 7 drives the rotation motors 25 and 29 under preset conditions. Then feed out the raw fabric RS. Then, when the leading end of the sheet ST in the feeding direction is peeled by a predetermined amount by the peeling plate 24 and the leading edge is detected by a sensor (not shown), the driving of the rotation motors 25 and 29 is stopped and the standby state is set.

  Then, when the transfer means (not shown) places the wafer WF on the table 51, the suction holding means (not shown) starts sucking the wafer WF and drives the single-axis robot 53 to transfer the table 51 in the left direction. Then, the re-adhesive layer AD1 is laminated by spraying the re-adhesive AD fluidized by the first heater 32 in the form of mist by the spraying means 33 and spraying it on the wafer WF in accordance with the transport of the table 51. Thus, by spraying the mist-like re-adhesive AD, the re-adhesive AD can be uniformly laminated on the wafer WF in a short time. Further, when the re-adhesion layer AD1 is laminated, the control means 7 controls the re-adhesion layer AD1 so that the viscosity of the re-adhesive AD is not too low to flow down from the wafer WF and the thickness is uniform. The first heater 32, the spray means 33, and the single axis robot 53 are controlled so as to be stacked.

Thereafter, when a sensor (not shown) detects that the table 51 has reached a predetermined position, the control means 7 drives the rotation motor 25 and the rotation motor 29 to synchronize with the conveyance of the table 51. Then, the sheet ST is fed out, and the pressing roller 41 presses and sticks the sheet ST to the wafer WF. At this time, the control means 7 controls the feeding speed of the sheet ST, the raising / lowering amount of the pressing roller 41, the heating temperature of the second heater 45, and the moving speed of the table 51 based on the setting by the operation means. By this control, even when the temperature of the re-adhesion layer AD1 is lowered and solidified during the transfer of the wafer WF, the re-adhesion layer AD1 can be fluidized again, and the pressure roller 41 is pressed by a predetermined pressing force. The accuracy and uniformity of the thickness of the re-adhesion layer AD1 can be further improved, and the sheet ST can be attached to the wafer WF without generating wrinkles or bubbles.
When the table 51 is conveyed to the left side of the pressing unit 4, the control unit 7 drives the solidifying unit 6 to solidify the rebonding layer AD1, so that the thickness is appropriately controlled. Thus, a sheet sticking body in which the sheet ST is stuck to the wafer WF can be manufactured. The sheet sticking body is transported to an external device such as a dicing device by a transport device (not shown), the table 51 returns to the original position, and the same operation is repeated thereafter.

  According to the embodiment as described above, the re-adhesion layer AD1 is previously applied to the sheet ST in order to apply the sheet ST after laminating the re-adhesion layer AD1 by applying the liquid re-adhesive AD to the wafer WF. It is not necessary to prepare the provided adhesive sheet, and for example, a combination of the re-adhesive AD and the sheet ST can be arbitrarily set.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

  For example, instead of the stacking unit 3 of the above embodiment, a stacking unit 3A as shown in FIG. 2 may be used. The stacking unit 3A includes a holding unit 31, a first heater 32, a dropping unit 33A that drops the re-adhesive AD fluidized by the first heater 32, and a rotation motor 34A as a driving device provided on the table 51A. And a spin table 35A that can be rotated at a high speed by the dropping means 33A. The re-adhesive AD is dropped on the wafer WF placed on the spin table 35A, and the spin table 35A is rotated by the rotation motor 34A to re-adhere. The adhesive layer AD1 is formed by spreading the agent AD by centrifugal force. In such a stacking means 3A, the thickness of the re-adhesion layer AD1 can be controlled by the fluidization state of the re-adhesive AD by the first heater 32 and the rotation speed of the spin table 35A.

Further, as the fluidizing means of the present invention, one that emits fluidization energy according to the characteristics of the rebonding layer AD1 can be adopted. For example, when the rebonding layer AD1 is a cooling fluidization type, In the case of a cooling device using flon or the like, a blower that blows natural wind, a heating fluidization type, a coil heater or a hot air blower using infrared rays, an energy ray fluidization type, an ultraviolet irradiation device that irradiates ultraviolet rays, Examples thereof include a microwave irradiation device that irradiates microwaves. That is, there is no particular limitation as long as the re-adhesive AD can be fluidized.
Furthermore, the 1st heater 32 may be provided in the table 51, and may be provided in the left side rather than the holding | maintenance part 31 in FIG. In addition, the second heater 45 may not be provided in the pressing roller 41, or a cooling unit as a solidifying unit that lowers the temperature of the pressing roller 41 is provided in place of the second heater 45 to simultaneously press the sheet ST. The re-adhesion layer AD1 may be solidified.
Further, the feeding means is configured to support the original fabric in which the belt-like sheet is temporarily attached onto the belt-like release sheet, and before the belt-like sheet is attached to the plate-like member, cutting means such as a cutter blade or a laser cutter. The belt-shaped sheet may be cut into a predetermined shape to form a predetermined shape, and the sheet may be fed out.
Further, the feeding means is configured to feed out the raw material in which the belt-like sheet is temporarily attached onto the belt-like release sheet, and after the belt-like sheet is stuck to the plate-like member by the pressing means, the cutting means such as a cutter blade or a laser cutter is used. It is good also as a structure which provides the cutting means which cut | disconnects a strip | belt-shaped sheet | seat in predetermined shape.

  In addition, the type and material of the sheet ST in the present invention are not particularly limited. For example, a so-called adhesive sheet having a two-layer structure in which an adhesive layer is provided on the sheet ST, or an intermediate between the sheet ST adhesive layer and the sheet ST. Three or more layers may be used, such as one having a layer or another layer. Moreover, the semiconductor wafer can be exemplified by a silicon semiconductor wafer, a compound semiconductor wafer, and the sheet to be attached to such a semiconductor wafer is not limited to a protective sheet, a dicing tape, and a die attach film, but any other sheet, film, A sheet having an arbitrary use and shape such as a tape can be applied. Further, the plate member may be an optical disk substrate, and the adhesive sheet may have a resin layer constituting the recording layer. As described above, as a plate-like member, not only a glass plate, a steel plate, a resin plate, a substrate, and other members, but also other forms of members and articles can be targeted.

  The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1 ... Sheet sticking apparatus 2 ... Feeding means 3, 3A ... Laminating means 4 ... Pressing means 6 ... Solidification means 32, 45 ... 1st, 2nd heater (fluidization means)
44 ... Linear motion motor (thickness control means)
AD ... Re-adhesive AD1 ... Re-adhesive layer ST ... Sheet WF ... Wafer (plate-like member)

Claims (3)

A sheet sticking device for sticking a sheet to a plate-like member,
A laminating means for laminating a re-adhesion layer by applying a liquid re-adhesive on one surface of the plate-like member;
A feeding means for feeding out the sheet;
A pressing means for pressing and sticking the sheet to the surface of the plate-like member on which the re-adhesion layer is laminated ;
A moving means for moving the table with respect to the pressing means;
Fluidizing means for fluidizing the re-adhesion layer;
Control means,
The pressing unit includes a pressing roller that presses the sheet, and a thickness control unit that adjusts an elevation amount of the pressing roller,
The control means controls the thickness of the re-adhesion layer by controlling the feeding speed of the sheet, the raising / lowering amount of the pressing roller, the fluidization state of the re-adhesion layer, and the moving speed of the table. A sheet sticking device. After the sheet has been affixed to the plate-like member, the sheet sticking apparatus according to claim 1, characterized in that it comprises a solid means for solidifying the re adhesive. A sheet sticking method for sticking a sheet to a plate-shaped member,
Using a table capable of holding the plate-like member, a pressing roller for pressing the sheet, and a fluidizing means for fluidizing the re-adhesion layer laminated on the plate-like member,
Laminating a re-adhesion layer by applying a liquid re-adhesive on one surface of the plate-like member held on the table ,
Unwind the sheet,
The table is moved with respect to the pressing roller, and the sheet is pressed and pasted on the surface of the plate-like member on which the re-adhesion layer is laminated with the pressing roller, and the sheet feeding speed, the pressing A sheet sticking method , wherein the thickness of the re-adhesion layer is controlled by controlling a lift amount of the roller, a fluidization state of the re-adhesion layer, and a moving speed of the table .

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