JP5292057B2 - Table, sheet peeling apparatus and peeling method using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the occurrence of cracks on a wafer where protrusions are formed along an external edge thereof. <P>SOLUTION: A sheet peeling device 10 includes: a table 11 for supporting a semiconductor wafer (W); an unreeling means 12 for unreeling a peeling tape (PT), a pushing means 15 for pressing the peeling tape (PT) to an adhesive sheet (S) so as to be adhered thereto; a moving means 16 which allows the peeling tape (PT) and table 11 adhered to the adhesive sheet (S) to carry out relative movement thereof so as to peel the adhesive sheet (S); and a control means 19 for controlling the foregoing means. The table 11 includes a displacement means 20. The displacement means 20 includes a heating means 20A for heating a space enclosed by a semiconductor wafer (W) and mounting tape (MT), and also a cooling means 20B for cooling the space. This results in increasing or decreasing the volume of the space (A). <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a table, a sheet peeling apparatus using the same, and a peeling method, and more particularly, a table used for peeling an adhesive sheet affixed to a semiconductor wafer, a sheet peeling apparatus using the same, and a peeling method. About.

  Recently, for semiconductor wafers (hereinafter simply referred to as “wafers”), the wafer diameter is increased, but ultra-thin grinding is required. For this reason, in transporting a wafer that has been ground to an extremely thin thickness, the wafer is transported in a state of being warped by its own weight, so that there is a disadvantage that the wafer is broken. Here, in order to avoid such an inconvenience, a wafer having a form disclosed in Patent Document 1 is used. In the same document, the concave portion is formed by grinding so that the thickness of the outer edge side of the wafer is relatively larger than the thickness of the other region, and the convex portion is formed along the outer edge of the wafer. It serves as a material to prevent the wafer from being damaged.

  In addition, a protective adhesive sheet is affixed to the circuit surface of the wafer, and is peeled off after various processes. Such an adhesive sheet peeling apparatus is disclosed in, for example, Patent Document 2. In this apparatus, a wafer is held by suction on a table. Further, after a part of the peeling tape is melt bonded to the outer edge portion of the adhesive sheet affixed to the wafer, the adhesive sheet is peeled by moving a chuck that holds the peeling tape.

JP 2007-19379 A Japanese Patent Laid-Open No. 11-16862

  However, when the adhesive sheet is peeled from the wafer on which the convex portion as in Patent Document 1 is peeled by the peeling device as in Patent Document 2, the thickness of the concave bottom side of the wafer becomes extremely thin. It is difficult to keep the position of the surface constant. Therefore, as shown in FIG. 4A, when the mounting tape MT side is placed on the table T, the bottom side of the recess W1 in the wafer W is bent toward the adhesive sheet S side (upper side in the figure). When it is deformed, stress in a direction in which the wafer W is pulled upward is generated. This stress is generated along the direction of the tensile force acting on the wafer W when the adhesive sheet S is peeled off using the peeling tape PT, and the force acting on the wafer W during peeling increases and breaks. There is an inconvenience that it becomes easy (see FIG. 4B). Further, as shown in FIG. 4C, when the bottom of the concave portion W1 is deformed so as to bend toward the mounting tape MT (lower side in the figure), the bottom surface of the concave portion W1 adheres to the mounting tape MT. There is an inconvenience that workability in the case is impaired.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and an object thereof is to prevent and support the occurrence of damage such as cracks in a wafer in which convex portions are formed along the outer edge. It is an object to provide a table, a sheet peeling apparatus, and a peeling method that can be used.

To achieve the above object, the table of the present invention is a table for supporting a semiconductor wafer and a ring frame integrated via a mounting tape from the mounting tape side,
The semiconductor wafer is provided with a convex portion formed along the outer edge by making the thickness of the outer edge side larger than the thickness of the other region, and the mounting tape is attached to the convex portion so as to be integrated with the ring frame. And
Displacement means for displacing the surface position of the semiconductor wafer to a predetermined position is provided . The displacement means is a heating means capable of heating a space surrounded by the semiconductor wafer and the mounting tape, and a cooling means capable of cooling the space. Ru equipped with a door, it adopts a configuration that.
The table of the present invention is a table for supporting the semiconductor wafer and the ring frame integrated via the mounting tape from the mounting tape side,
The semiconductor wafer is provided with a convex portion formed along the outer edge by making the thickness of the outer edge side larger than the thickness of the other region, and the mounting tape is attached to the convex portion so as to be integrated with the ring frame. And
Displacement means for displacing the surface position of the semiconductor wafer to a predetermined position is provided. In this displacement means, a part of the table located on the mounting tape side of the space surrounded by the semiconductor wafer and the mounting tape is used for mounting. By being displaced together with the tape, the surface position of the semiconductor wafer can be displaced to a predetermined position without changing the volume of the space.

Further, the sheet peeling apparatus of the present invention is a sheet peeling apparatus for sticking a peeling tape to an adhesive sheet attached to a semiconductor wafer, and peeling the adhesive sheet from the semiconductor wafer via the peeling tape.
The semiconductor wafer is provided with a convex portion formed along the outer edge by making the thickness of the outer edge side larger than the thickness of the other region, and the mounting tape is attached to the convex portion so as to be integrated with the ring frame. And
A table for supporting the integrated semiconductor wafer and ring frame from the mounting tape side, a feeding means for feeding out the peeling tape, a pressing means for pressing the peeling tape against an adhesive sheet, and an adhesive sheet A moving means for peeling the adhesive sheet by relatively moving the peeling tape attached to the table and a control means for controlling these means,
The table includes displacement means for displacing the surface position of the semiconductor wafer to a predetermined position ,
The control means that controls the displacement means as the surface of the wafer is flexed shape mounting tape side, adopts a configuration that.

In the present invention, further comprising a detecting means capable of detecting the position of the surface of the semiconductor wafer,
The control means preferably controls the displacement means based on detection data of the detection means.

Further, the sheet peeling apparatus of the present invention is a sheet peeling apparatus for sticking a peeling tape to an adhesive sheet attached to a semiconductor wafer, and peeling the adhesive sheet from the semiconductor wafer via the peeling tape.
The semiconductor wafer is provided with a convex portion formed along the outer edge by making the thickness of the outer edge side larger than the thickness of the other region, and the mounting tape is attached to the convex portion so as to be integrated with the ring frame. And
A table for supporting the integrated semiconductor wafer and ring frame from the mounting tape side, a feeding means for feeding out the peeling tape, a pressing means for pressing the peeling tape against an adhesive sheet, and an adhesive sheet A moving means for peeling the adhesive sheet by relatively moving the peeling tape attached to the table and a control means for controlling these means,
The table includes a displacement means for displacing the surface position of the semiconductor wafer to a predetermined position. The displacement means can heat the space surrounded by the semiconductor wafer and the mounting tape, and can cool the space. and a Do cooling means, Ru Ttei adopted a configuration that.

Furthermore, the sheet peeling method of the present invention is a sheet peeling method in which a peeling tape is affixed to an adhesive sheet affixed to a semiconductor wafer, and the adhesive sheet is peeled from the semiconductor wafer via the peeling tape.
The semiconductor wafer is provided with a convex portion formed along the outer edge by making the thickness of the outer edge side larger than the thickness of the other region, and the mounting tape is attached to the convex portion so as to be integrated with the ring frame. And
A step of supporting the integrated semiconductor wafer and ring frame with a table from the mounting tape side;
A step of feeding out the peeling tape;
A step of pressing and adhering the peeling tape to an adhesive sheet;
While detecting the position of the surface of the semiconductor wafer while relatively moving the peeling tape affixed to the adhesive sheet and the table, and controlling the surface position of the semiconductor wafer to be displaced to a predetermined position based on the detection data The method of performing the process of peeling an adhesive sheet is taken.

  According to the present invention, since the surface position of the wafer can be displaced to a predetermined position via the displacing means, the bottom surface of the concave portion of the wafer is deformed so as to bend to the adhesive sheet side or to the mounting tape MT side as in the prior art. Thus, it is possible to prevent the wafer from being damaged when the adhesive sheet is peeled off.

  Furthermore, by detecting the position of the wafer surface and controlling the displacement means based on the detected data, the wafer surface is always automatically maintained at a good position so that there is no problem with the peeling of the adhesive sheet. It becomes possible to do.

  Also, when the displacement means is controlled so that the wafer surface is bent toward the mounting tape side, the stress due to the bending of the wafer and the pulling force due to the peeling tape can be controlled so that the peeling is possible. The load acting on the wafer at the time can be further reduced.

  Furthermore, by constituting the displacement means by the heating means and the cooling means, the volume of the space can be increased and reduced by a simple structure.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic front view of a sheet peeling apparatus according to the embodiment. In this figure, a sheet peeling apparatus 10 is a band-like adhesive bonded to a table 11 for adsorbing and supporting a wafer W, and a protective adhesive sheet S affixed to a circuit forming surface (upper surface in FIG. 1) of the wafer W. The feeding means 12 for feeding the peeling tape PT, the cutting means 14 provided so as to be able to cut the peeling tape PT, the pressing means 15 for pressing the peeling tape PT against the adhesive sheet S, and the adhesive sheet S Moving means 16 for moving the affixed peeling tape PT and table 11 relative to each other, detection means 18 provided above table 11, table 11, feeding means 12, cutting means 14, pressing means 15, moving means 16 and the control means 19 which carries out predetermined control of the detection means 18 as a whole.

  The wafer W is disposed in the opening of the ring frame RF, and a protective adhesive sheet S is attached to the upper surface in FIG. The wafer W includes a concave portion W1 formed by grinding the lower surface side in the figure, and a convex portion W2 connected to the outer periphery of the concave portion W1. Accordingly, the convex portion W2 is formed along the outer edge of the wafer W by making the thickness of the outer edge side of the wafer W larger than the thickness of the other region, that is, the concave portion W1 formation region. The wafer W has a mounting tape MT attached only to the lower surface of the convex portion W2 in the figure, and the bottom surface (upper surface in the figure) of the concave portion W1 and the mounting tape MT are kept in non-contact. As a result, a space A enclosed by the wafer W and the mounting tape MT is closed in the recess W1.

  The table 11 is supported from the side of the mounting tape MT with the wafer W integrated with the ring frame RF facing the mounting tape MT downward. The table 11 includes a displacing means 20 for displacing the surface position of the wafer W to a predetermined position by increasing or reducing the volume of the space A. Here, the surface position of the wafer W is a surface located on the opposite side of the bottom surface of the recess W1, and in the case of the present embodiment, it refers to the position of the circuit forming surface to which the adhesive sheet S is attached. . The displacement means 20 includes a heating means 20A capable of heating the space A and a cooling means 20B capable of cooling the space A. 20 A of heating means is not specifically limited, For example, a heater coil, an infrared heater, piping etc. which hot water circulates can be illustrated, and cooling means 20B is not specifically limited, For example, cold water, Freon Examples thereof include piping through which liquid nitrogen circulates, Peltier elements, and the like. A plurality of heating means 20A and cooling means 20B are provided alternately when the table 11 is viewed in plan view.

  The feeding means 12 is rotatably supported by the frame F and supports a support shaft 21 that supports the wound peeling tape PT, a driving roller 22 that is rotatably provided via a motor M1, and the driving roller. And a pinch roller 23 that sandwiches the peeling tape PT between them. The frame F is provided so as to be movable in the vertical direction in FIG.

  The cutting means 14 includes a cutter blade 26, a vertical cylinder 28 for moving the cutter blade 26 in the vertical direction in FIG. 1, and a cutting cylinder 27 for moving the vertical cylinder 28 in the direction perpendicular to the paper surface in FIG. It is configured with. A tape guide plate 30 having a concave portion on the upper surface is provided below the cutter blade 26. The tape guide plate 30 is provided by a bush 31 so as to be movable in the left-right direction in FIG. 1 via a shaft 32, and is always urged to the left in FIG. 1 by a coil spring 33 provided on the outer peripheral side of the shaft 32. ing.

  The pressing means 15 includes a linear motion motor 35 and a pressure head 36 having a heater 36A as a heating means provided so as to be able to advance and retreat in the vertical direction by the linear motion motor 35. The pressing means 15 welds the peeling tape PT to the adhesive sheet S by pressing and heating the peeling tape PT fed to the upper surface side of the adhesive sheet S with the pressing head 36 by a chuck 41 described later. It is comprised so that both may be connected.

  The moving means 16 is provided so as to be movable in the left-right direction through a linear motor 38 and its slider 39 and a linear motor 40 provided to be able to move the table 11 in the left-right direction in FIG. And a chuck 41 capable of gripping the lead end region of the PT.

  The detection means 18 is attached below the frame F via a bracket (not shown), and the positions of a plurality of optical sensors and the like installed at predetermined intervals in the direction in which the peeling of the adhesive sheet S proceeds, that is, in the left-right direction in FIG. It consists of sensors. The detection means 18 is provided so as to be able to detect the position of the surface of the wafer W, that is, the height position of the upper surface in FIG. 1, and is provided so that the surface position of the mounting tape MT can be output to the control means 19 as detection data.

  The control means 19 can be constituted by a sequencer, a personal computer or the like. The control means 19 is connected to an input means (not shown) composed of an operation panel and the like, and operating conditions, data and the like of each means can be input by this input means. The control means 19 has a function of determining the operating conditions of the heating means 20A and the cooling means 20B based on the detection data of the detection means 18 and controlling them.

  Next, the peeling method of the adhesive sheet S by the sheet peeling apparatus 10 will be described.

  First, it is assumed that the peeling tape PT pulled out from the support shaft 21 is cut by the cutter blade 26 on the tape guide plate 30 through the drive roller 22 and the pinch roller 23.

  Next, after transporting the wafer W to which the adhesive sheet S is attached and the ring frame RF integrated onto the table 11 via the transport means (not shown) so that the mounting tape MT is on the lower side, The mounting tape MT is sucked and supported. Next, the table T is conveyed to the left in FIG. When it is confirmed that the left end side of the adhesive sheet S in FIG. 1 has reached directly below the pressing head 36, the movement of the table 11 is stopped and a standby state is entered.

  Thereafter, the chuck 41 moves the tape guide plate 30 to the right via the linear motor 40 to grip the peeling tape PT, and moves to the left in the gripped state so that the peeling tape PT is pressed against the pressing head. Pull down below 36. Then, as shown in FIG. 1, the pressing head 36 heated by the heater 36 </ b> A is moved downward by the linear motion motor 35, and the peeling tape PT is pressed and applied to the adhesive sheet S while being heated. In this state, the peeling tape PT is cut by the cutter blade 26 on the tape guide plate 30 by operating the cylinders 27 and 28. Next, the linear motor 24 is operated to move the frame F and the detection means 18 upward. Thereafter, as shown in FIG. 2, through the linear motor 38 and the linear motor 38 so that the peeling tape PT attached to the adhesive sheet S and the table 11 move relative to each other in the left-right direction in FIG. The chuck 41 and the table 11 are moved. As a result, the adhesive sheet S is folded back on the wafer W, and the adhesive sheet S is peeled from the outer edge on the left side in the drawing.

  While the peeling of the adhesive sheet S is in progress, the position of the upper surface of the wafer W is detected by each position sensor of the detection means 18. Based on the detected data, the control means 19 controls the operation time, operation timing, and the like of the heating means 20A and the cooling means 20B in the displacement means 20, and heats or cools the space A to increase or decrease the volume thereof. Adjust the height position. Specifically, when the surface position of the wafer W is increased, the heating unit 20A is operated to heat the space A, while when the surface position of the wafer W is decreased, the cooling unit 20B is operated to cool the space A. Let

  Here, as shown in FIG. 3, the control means 19 is formed so that the surface of the wafer W is bent from the position parallel to the mounting tape MT to the mounting tape MT side (lower side in the figure). It is preferable to control the displacement means 20 via According to this, the upward force caused by the pulling of the release sheet PT and the downward force caused by the bending of the wafer W can be offset, and the surface of the wafer W is parallel to the mounting tape MT at the folded position of the adhesive sheet S. Thus, the stress generated on the wafer W can be reduced as much as possible.

  When the peeling of the adhesive sheet S is completed, the wafer W is transported to the next process by a transporting unit (not shown), and the peeled adhesive sheet S is collected by a collecting unit (not shown). Thereafter, the frame F, the chuck 41, and the table 11 are initialized. After returning to the position, the same operation as described above is repeated.

  Therefore, according to such an embodiment, the wafer W placed on the table 11 expands toward the adhesive sheet S, or is recessed toward the mounting tape MT and the bottom side of the recess W1 adheres to the mounting tape MT. This can be prevented. As a result, it is possible to prevent the wafer W from being cracked when the adhesive sheet S is peeled off as in the prior art, and the wafer W can be processed without difficulty in the subsequent process.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  For example, the displacing unit 20 is configured such that, in addition to the heating unit 20A and the cooling unit 20B that increase and decrease the volume of the space A, a part of the table 11 positioned below the space A is displaced up and down together with the mounting tape MT. You may comprise so that the surface position of the wafer W may be displaced to a predetermined position by displacing the bottom face position of the recessed part W1, without changing the volume of the space A.

  The position of each position sensor of the detection means 18, the heating means 20A, and the cooling means 20B can be variously changed.

  Furthermore, the linear motion motors 24, 35, 40 may be replaced with displacement means such as an air cylinder or a hydraulic cylinder.

  In the peeling operation of the adhesive sheet S, the operation of the chuck 41 by the linear motor 40 may be stopped and only the table 11 may be moved, or conversely, the operation of the table 11 by the linear motor 38 may be stopped. You may move only.

  Furthermore, as the peeling tape PT, a heat-sensitive adhesive tape or a pressure-sensitive adhesive tape can be used.

  Further, the heating means 20A and the cooling means 20B are not limited as long as they can be heated and cooled.

  Further, the position sensor of the detecting means 18 is not limited as long as it can measure the distance to the object such as a photoelectric tube or a camera, and is not limited to the horizontal direction in FIG. Multiple rows may be arranged in the direction.

  The mounting tape MT may be a dicing tape or other known adhesive sheet.

The schematic front view of the sheet peeling apparatus which concerns on embodiment. The partial schematic front view in the middle of peeling of an adhesive sheet. The partial schematic front view which shows an example before an adhesive sheet peeling. (A)-(C) are explanatory drawings of the malfunction which concerns on a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sheet peeling apparatus 11 Table 12 Feeding means 15 Pressing means 16 Moving means 18 Detection means 19 Control means 20 Displacement means 20A Heating means 20B Cooling means A Space MT Mounting tape PT Stripping tape RF Ring frame S Adhesive sheet W Semiconductor wafer W2 Convex

Claims (5)

A table for supporting a semiconductor wafer and a ring frame integrated via a mounting tape from the mounting tape side,
The semiconductor wafer is provided with a convex portion formed along the outer edge by making the thickness of the outer edge side larger than the thickness of the other region, and the mounting tape is attached to the convex portion so as to be integrated with the ring frame. And
Displacement means for displacing the surface position of the semiconductor wafer to a predetermined position is provided . The displacement means is a heating means capable of heating a space surrounded by the semiconductor wafer and the mounting tape, and a cooling means capable of cooling the space. And a table. A table for supporting a semiconductor wafer and a ring frame integrated via a mounting tape from the mounting tape side,
The semiconductor wafer is provided with a convex portion formed along the outer edge by making the thickness of the outer edge side larger than the thickness of the other region, and the mounting tape is attached to the convex portion so as to be integrated with the ring frame. And
Displacement means for displacing the surface position of the semiconductor wafer to a predetermined position is provided . In this displacement means, a part of the table located on the mounting tape side of the space surrounded by the semiconductor wafer and the mounting tape is used for mounting. A table provided so as to be able to displace the surface position of the semiconductor wafer to a predetermined position without changing the volume of the space by being displaced together with the tape. In a sheet peeling apparatus for attaching a peeling tape to an adhesive sheet affixed to a semiconductor wafer and peeling the adhesive sheet from the semiconductor wafer via the peeling tape,
The semiconductor wafer is provided with a convex portion formed along the outer edge by making the thickness of the outer edge side larger than the thickness of the other region, and the mounting tape is attached to the convex portion so as to be integrated with the ring frame. And
A table for supporting the integrated semiconductor wafer and ring frame from the mounting tape side, a feeding means for feeding out the peeling tape, a pressing means for pressing the peeling tape against an adhesive sheet, and an adhesive sheet A moving means for peeling the adhesive sheet by relatively moving the peeling tape attached to the table and a control means for controlling these means,
The table includes displacement means for displacing the surface position of the semiconductor wafer to a predetermined position ,
The sheet peeling apparatus according to claim 1, wherein the control means controls the displacing means so that the surface of the wafer is bent toward the mounting tape . In a sheet peeling apparatus for attaching a peeling tape to an adhesive sheet affixed to a semiconductor wafer and peeling the adhesive sheet from the semiconductor wafer via the peeling tape,
The semiconductor wafer is provided with a convex portion formed along the outer edge by making the thickness of the outer edge side larger than the thickness of the other region, and the mounting tape is attached to the convex portion so as to be integrated with the ring frame. And
A table for supporting the integrated semiconductor wafer and ring frame from the mounting tape side, a feeding means for feeding out the peeling tape, a pressing means for pressing the peeling tape against an adhesive sheet, and an adhesive sheet A moving means for peeling the adhesive sheet by relatively moving the peeling tape attached to the table and a control means for controlling these means,
The table includes a displacement means for displacing the surface position of the semiconductor wafer to a predetermined position . The displacement means can heat the space surrounded by the semiconductor wafer and the mounting tape, and can cool the space. A sheet peeling apparatus comprising a cooling means . In a sheet peeling method for sticking a peeling tape to an adhesive sheet affixed to a semiconductor wafer, and peeling the adhesive sheet from the semiconductor wafer via the peeling tape,
The semiconductor wafer is provided with a convex portion formed along the outer edge by making the thickness of the outer edge side larger than the thickness of the other region, and the mounting tape is attached to the convex portion so as to be integrated with the ring frame. And
A step of supporting the integrated semiconductor wafer and ring frame with a table from the mounting tape side;
A step of feeding out the peeling tape;
A step of pressing and adhering the peeling tape to an adhesive sheet;
While detecting the position of the surface of the semiconductor wafer while relatively moving the peeling tape affixed to the adhesive sheet and the table, and controlling the surface position of the semiconductor wafer to be displaced to a predetermined position based on the detection data And a step of peeling the adhesive sheet.

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