JP2006140251A - Sheet cutting method and mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet cutting method and a wafer mounting method for cutting the sheet without giving any damage on a plate member at the time of adhering the sheet to the plate member such as wafer or the like, and then cutting the sheet along the external circumference of the plate member. <P>SOLUTION: A semiconductor wafer W is placed and attractively supported on a table for cutting the external circumference, under the condition that an adhesive sheet S provided with the flat shape larger than the flat shape of the relevant semiconductor wafer W is adhered to the rear surface side of the extremely thin semiconductor wafer W. Under this condition, the external circumference of the relevant sheet S is cut with a cutter under the condition that the sheet is projected by 0.1 mm to 1 mm from the external circumference of the semiconductor wafer W. The wafer W to which the sheet S is adhered is shifted to a mount table and is then mounted to a ring frame RF. In this case, the wafer W is adhered to the dicing table DT by eliminating allowance of the projected sheet portion. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a sheet cutting method and a mounting method, in particular, a method of cutting the outer periphery of the sheet along the outer periphery of the plate-like member after sticking the heat-sensitive adhesive sheet to the plate-like member such as a semiconductor wafer, The present invention relates to a method for mounting a semiconductor wafer on which a sheet is attached to a ring frame.

  A semiconductor wafer (hereinafter simply referred to as “wafer”) on which a circuit surface is formed is divided into chips, and then each chip is picked up and bonded (die bonding) to a lead frame. This die bonding can be performed by sticking a heat-sensitive adhesive sheet for die bonding in the wafer processing step.

  Patent Document 1 discloses a method in which a heat-sensitive adhesive sheet for die bonding is supplied to the upper surface side of a wafer, the sheet is bonded to the wafer, and the sheet is cut with a cutter along the outer peripheral edge of the wafer. ing.

JP 2003-257898 A

  However, in the sheet cutting method disclosed in Patent Document 1, the sheet is cut along the outer peripheral edge of the wafer. When this cutting is performed, the sheet is cut more than the outer peripheral edge of the plate-like member. The method of cutting with the sheet protruding outside is not actively adopted. For this reason, when a positioning error of the wafer with respect to the table supporting the wafer occurs, the outer edge region of the wafer is damaged when the cutter rotates relative to the outer peripheral edge of the wafer. In particular, since recent wafers are subjected to back grinding in the order of several tens of μm in the back grinding process, such inconvenience becomes even more remarkable, and there is an inconvenience that a wasteful economic burden due to damage is imposed. is there.

  By the way, the wafer after the die bonding sheet is attached is divided into individual pieces through a dicing process, and the process of mounting the wafer on the ring frame via the dicing tape at the stage before the dicing is performed. It will go through. A mount table for performing the mounting includes a central raised portion having substantially the same shape as the wafer that supports the wafer, and an outer raised portion that is provided so as to surround the central raised portion and supports the ring frame. It is said that. That is, the mount table is configured to include a concave space between the central raised portion and the outer raised portion, thereby preventing the dicing tape from adhering to the mount table. Therefore, when a pressure is applied to the dicing tape for a sheet that has been cut outside the outer peripheral edge of the wafer, the sheet portion protruding from the outer peripheral edge of the wafer escapes into the concave space and the sheet portion is diced. It will not be affixed to the tape. For this reason, when the wafer is cut with the dicing cutter, the unattached sheet portion is caught in the dicing cutter, which causes damage to the wafer.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and its purpose is to attach a sheet to a plate-like member such as a wafer and cut the sheet along the outer periphery of the plate-like member. Another object of the present invention is to provide a sheet cutting method that does not damage the plate-like member.

  Another object of the present invention is to provide a mounting method capable of reliably sticking the protruding sheet portion to the dicing tape when the sheet is mounted on the ring frame with the sheet protruding from the outer peripheral edge of the wafer. It is in.

In order to achieve the above object, the present invention provides a method of cutting a sheet having a planar shape larger than the planar shape of the plate-like member to the plate-like member and then cutting the sheet along the outer peripheral edge of the plate-like member. In
The cutting is performed in a state where the sheet protrudes from the outer peripheral edge of the plate-shaped member by a predetermined amount.

In the sheet sticking method, the outer edge of the cut sheet is preferably provided so as to be positioned outside in the range of 0.1 mm to 1 mm with respect to the outer edge of the plate-like member.
If it is less than 0.1 mm, the cutter may touch the outer edge of the plate member due to a positional error between the plate member and the cutter. If it exceeds 1 mm, the subsequent processing of the plate member may be hindered. It is to come.

  The plate-like member applied to the sheet sticking method can target a semiconductor wafer.

  The plate-like member may be a back-ground semiconductor wafer.

  Further, a heat-sensitive adhesive sheet is used as the sheet in the sheet sticking method.

Further, the sheet cutting method according to the present invention includes a step of supporting a substantially circular semiconductor wafer, which has been extremely thinned through a back grinding process, on a pasting table;
A step of feeding a belt-like heat-sensitive adhesive sheet having a width larger than the diameter of the semiconductor wafer and pasting the sheet in a state where both sides in the width direction and the front and rear in the feeding direction protrude outside the outer peripheral edge of the semiconductor wafer;
Cutting the downstream side of the sheet feeding direction in the width direction;
A step of transferring the wafer to which the sheet is attached to an outer periphery cutting table;
It is possible to adopt a method comprising a step of cutting the outer periphery of the sheet in a state in which a sheet protruding amount of 0.1 mm to 1 mm is secured from the outer peripheral edge of the semiconductor wafer.

Further, the present invention provides a sheet having a larger surface area than that of a semiconductor wafer and affixing the outer periphery of the sheet to a predetermined amount of protrusion from the outer periphery of the semiconductor wafer. Cut and
Next, a mounting method in which the semiconductor wafer is transferred to the inside of the ring frame supported by the mount table and integrated with the ring frame via a dicing tape,
A mount table including a central raised portion supporting the wafer and having a size substantially corresponding to the size of the sheet; and an outer raised portion provided around the central raised portion and supporting the ring frame; , Using a pressing roll that presses and sticks the dicing tape to a ring frame and a sheet,
When the pressing roll rotates on the dicing tape to apply a pressure, the sheet portion sticking to the dicing tape is eliminated by eliminating the clearance of the sheet portion protruding from the outer peripheral edge of the wafer by the outer peripheral side of the central raised portion. Is used.

According to the present invention, since the cutting is performed in a state where the outer peripheral edge of the sheet is located outside the outer peripheral edge of the plate-like member, the cutter comes into contact with the outer peripheral edge of the plate-like member and the plate-like member The risk of damaging can be avoided.
In addition, since the amount of the outer peripheral edge of the sheet protruding from the outer peripheral edge of the plate-shaped member is 0.1 mm to 1 mm, the amount is sufficient to avoid damage to the plate-shaped member. The advantage of not causing any inconvenience during processing is obtained. Such an advantage is remarkably exhibited when the plate-like member is a wafer, particularly, an extremely thin wafer that is back-ground and has a thickness of the order of several tens of μm.
Furthermore, according to the method of sequentially supplying the strip-shaped sheet to the plate-like member and pasting and cutting the sheet-like member, it is possible to eliminate the need to form a sheet previously formed in the size of the plate-like member. . In addition, in the case where the sheet is formed in accordance with the size of the plate-like member, it is possible to avoid the inconvenience that it becomes very difficult to maintain the accuracy when pasting with the protruding amount.

  Further, according to the mounting method of the present invention, since the central raised portion has a size substantially corresponding to the size of the sheet, when the pressure applied by the pressing roll is applied, the clearance of the protruding sheet portion is substantially reduced. Thus, the sheet portion can be securely attached to the dicing tape. Therefore, when the wafer is separated into pieces by the dicing cutter, it is possible to avoid the inconvenience that the wafer is damaged such as cracking.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic plan view of a wafer processing apparatus to which a sheet cutting method and a mounting method according to the present embodiment are applied, and FIG. 2 is a schematic cross-sectional view for explaining the wafer processing steps over time. It is shown. In these drawings, the wafer processing apparatus 10 targets a wafer W (plate member) having a UV curable protective tape PT (see FIG. 2) affixed to the surface forming the circuit surface, and is bonded to the back surface of the wafer W by die bonding. After applying the heat-sensitive adhesive sheet S for use, the apparatus is configured as a device for processing a series of steps of mounting the wafer W on the ring frame RF via the dicing tape DT.

  As shown in FIG. 1, the wafer processing apparatus 10 includes a robot 12 that sucks and holds a wafer W taken out from a cassette 11 that accommodates the wafer W, a UV irradiation unit 13 that performs UV irradiation on the protective tape PT, and An alignment device 14 for positioning the wafer W, a pasting device 15 for pasting the sheet S (see FIG. 2) on the back surface of the aligned wafer W, and a dicing tape on the wafer W after the sheet S is pasted A mounting device 17 for attaching the DT and mounting the wafer W on the ring frame RF, a tape peeling device 18 for peeling the protective tape PT, and a stocker 19 for storing the wafer W from which the protective tape PT has been peeled off are provided. It is configured.

  Here, the robot 12, the UV irradiation unit 13, the alignment device 14, the tape peeling device 18 and the stocker 19 have the same structure as Japanese Patent Application No. 2004-119567 already filed by the present applicant, and the present invention. Therefore, detailed description thereof will be omitted, and in the following, the pasting device 15 and the mounting device 17 will be described.

  As shown in FIGS. 3 to 5, the sticking device 15 temporarily attaches the sheet S to the sticking table 40 that supports the wafer W, and the back side (upper face side) of the wafer W adsorbed to the sticking table 40. The attaching unit 41 to be attached, the cutting means 43 for cutting the sheet S in the width direction for each wafer W, the transfer device 45 for attracting and transferring the wafer W from the attachment table 40, and the transfer device 45. The outer periphery cutting table 47 for adsorbing and supporting the wafer W to be transferred and cutting the unnecessary sheet portion S1 (see FIG. 4) protruding from the outer periphery of the wafer W by the cutting means 43, and the outer periphery cutting table. 47, and an adhesion table 48 for completely adhering the temporarily-attached sheet S to the wafer W, and a recovery device 50 for recovering the unnecessary sheet portion S1. It has been made.

  As shown in FIG. 4, the sticking table 40 has a top surface formed as a suction surface, a first temperature at which the sheet S can be melted to a certain extent and temporarily attached to the wafer W, In the embodiment, a heater built-in type that is maintained at approximately 110 ° C. is used. The pasting table 40 reciprocates between a position where the wafer W can be received from the previous process via the moving device 52 and a position where it passes through the lower region of the pasting unit 41 and reaches the upper side of the outer peripheral cutting table 47. It is provided so as to be movable, and can be moved up and down via a lifting device 53. The moving device 52 penetrates through a pair of rails 54, 54, a slide plate 55 that is guided by the rails 54 and moves on the rail 54, and a bracket 57 fixed to the slide plate 55. A ball spline shaft 58 and a motor M (see FIG. 1) that rotationally drives the ball spline shaft 58 are configured. Here, the motor M is fixed to a frame (not shown), while the other end is rotatably supported by the bearing 60. Accordingly, the application table 40 reciprocates in the left-right direction (X direction) in FIG. The elevating device 53 includes a vertical movement mechanism 62 arranged at the center of the lower surface of the sticking table 40, a guide block 63 fixed on the slide plate 55, and four pieces that can be raised and lowered along the guide block 63. When the vertical movement mechanism 62 advances and retreats in the vertical direction, the sticking table 40 moves up and down to receive the wafer W from the previous process.

  On the upper surface of the pasting table 40, cutter receiving grooves 40A for cutting the strip-shaped sheet S fed from the pasting unit 41 in the width direction are formed, and upper portions on both side surfaces along the moving direction of the pasting table 40 are formed. Are provided with a rack 65 constituting an interlocking mechanism and a guide bar 67 attached to the outer surface of the rack 65.

  As shown in FIGS. 5 and 6, the sticking unit 41 is provided in a region of a plate-like frame F disposed above the sticking table 40. The sticking unit 41 includes a support roll 70 that supports the heat-sensitive adhesive sheet S wound in a roll shape so that the sheet S can be supplied, a drive roll 71 and a pinch roll 72 that apply a feeding force to the sheet S, and a sheet S. A winding roll 73 for winding the laminated release sheet PS, two guide rolls 74, 74 disposed between the support roll 70 and the pinch roll 72, and a dancer roll provided between the guide rolls 74, 74 75, a pressing member 76 that presses the lead end region of the sheet S from which the release sheet PS has been peeled against the upper surface of the pasting table 40 and sandwiches it, and the sheet S on the back side of the wafer W (upper side in FIG. 5). A press roll 78 that is sequentially pressed and temporarily attached, and a tension roll 7 disposed immediately before the press roll 78 in the feeding direction of the sheet S And it is constituted by a guide roll 80. The press roll 78 has a built-in heater. Further, the lower surface side of the pressing member 76 has a suction portion, and sucks and holds the end portion of the sheet S.

  The drive roll 71 and the take-up roll 73 are driven to rotate by motors M1 and M2 provided on the back side of the frame F, respectively. The pressing member 76, the press roll 78, and the tension roll 79 are provided so as to be movable up and down via cylinders 82, 83, and 84, respectively. As shown in FIGS. 7 and 8, both ends of the press roll 78 are coupled to the cylinder 83 via brackets 85, and both ends of the rotation center shaft 86 interact with the rack 65. A pair of pinions 88, 88 and a pair of rollers 89, 89 are fixed at positions further outside these pinions 88. The pinions 88 and 88 are provided so as to be able to mesh with the rack 65, while the rollers 89 and 89 are configured to roll on the guide bar 67 irrespective of the rotation of the press roll 78.

  As shown in FIGS. 5 and 6, the cutting means 43 is provided on an arm portion 90 extending along the moving direction of the sticking table 40, and a lower surface of the distal end side (left end side in FIG. 5) of the arm portion 90. And a cutter unit 92 provided so as to be able to advance and retreat via a single-axis robot 91. The cutter unit 92 includes a cutter up / down cylinder 95 supported by a bracket 94 that moves along the uniaxial robot 91, and a cutter 96 attached to the tip of the cutter up / down cylinder 95. Here, the cutter up / down cylinder 95 is attached to the bracket 94 in a state in which the cutter up / down cylinder 95 can rotate in a substantially vertical plane. The angle can be adjusted. Further, the single-axis robot 91 can advance and retreat along the extending direction of the arm portion 90, and the sheet S can be set to protrude a predetermined amount from the outer peripheral edge of the wafer W at the time of circular cutting described later. . As shown in FIG. 1, the cutting means 43 is supported so as to be movable by driving the motor M3 on a guide 97 that is directed in a direction (Y direction in FIG. 1) orthogonal to the moving direction of the sticking table 40. Has been. Accordingly, the sheet S is cut in the width direction when the tip of the cutter 96 is in a posture to enter the cutter receiving groove 40 </ b> A of the sticking table 40 and the entire cutting means 43 moves along the guide 97.

  As shown in FIGS. 4 and 9 to 14, the transfer device 45 includes a plate-like suction plate 100 that sucks the wafer W to the lower surface side, and a cooling unit provided on the upper surface side of the suction plate 100. 101, an arm 102 that supports the suction plate 100, and a uniaxial robot 105 that moves the arm 102 in the Y direction. When the suction plate 100 sucks the wafer W after the sheet S is cut in the width direction on the sticking table 40 (see FIG. 10), the suction temperature is the first temperature (110 ° C.) during temporary attachment. The formed wafer W is cooled to room temperature, for example, to reduce or eliminate the viscosity of the sheet S, thereby preventing the adhesive from transferring to the cutter 96. In addition, the transfer device 45 transfers the wafer W from the sticking table 40 to the outer periphery cutting table 47 and attaches the wafer W after the unnecessary sheet portion S1 is cut by the outer periphery cutting table 47 to the bonding table. In addition, the wafer W after the sheet S is completely bonded by the bonding table 48 is transferred to the next process.

  As shown in FIG. 4, the uniaxial robot 105 is disposed substantially parallel to the guide 97 at a position above the guide 97 of the cutting means 43. This single-axis robot 105 is provided with a cylinder 106 extending in a direction perpendicular to the vertical direction and a lift slider 108 that can be lifted and lowered via the cylinder 106, and the lift slider 108 has a base end side of the arm 102 (FIG. 9). The middle right end side) is connected.

  As shown in FIGS. 4 and 11, the outer periphery cutting table 47 receives the wafer W from the pasting table 40 via the transfer device 45 and sucks it to remove unnecessary sheet portions around the wafer W. It is a table for cutting S1 by the cutting means 43. In this embodiment, the outer periphery cutting table 47 is maintained at room temperature as the second temperature. The upper surface is formed as an adsorption surface, and a circumferential groove 47A corresponding to the outer peripheral edge of the wafer W is formed. It is prepared for. The outer periphery cutting table 47 is supported on the elevating plate 111 via the rotation mechanism 110 on the lower surface side. The rotating mechanism 110 includes a rotating shaft 112 whose axial direction is the vertical direction, a rotating bearing 103 that supports the rotating shaft 112, a driven pulley 114 that is fixed to the rotating shaft 112, and a position on the side of the driven pulley 114. In addition, a main driving pulley 115 fixed to the output shaft of the motor M4 and a belt 117 wound around the pulleys 114 and 115 are provided, and the main driving pulley 115 is rotated by driving the motor M4. A table 47 is provided to be rotatable in a plane. Therefore, when the cutter 96 enters the circumferential groove 47A and the outer circumferential cutting table 47 rotates, the circumferential cutting of the sheet S is achieved. At this time, the cutter 96 can be achieved by controlling the uniaxial robot 91 so as to cut the sheet S in a state in which the cutter S is shifted to the outside in the range of 0.1 mm to 1 mm with respect to the outer peripheral edge of the wafer W.

  The lifting plate 111 that supports the outer periphery cutting table 47 is provided so as to be lifted and lowered via the lifting device 120. As shown in FIG. 4, the lifting device 120 includes a block 123 attached to the back side of a substantially L-shaped support body 122 that supports the lifting plate 111, and a pair of links connected to both sides of the support body 122. The elevating side plate 124, a pair of upright guides 125 that guide the elevating side plate 124 in the vertical direction, a screw shaft 126 that extends through the block 123 in the vertical direction, a lower end of the screw shaft 126, and an upright guide 125 The pulleys 127 and 128 are respectively fixed to the output shaft of the motor M5 disposed in the vicinity of the lower end, and the belt 129 is wound around the pulleys 127 and 128. The screw shaft 126 is rotated by driving the motor M5. By doing so, the outer periphery cutting table 47 can be moved up and down.

  The bonding table 48 is disposed on the side upper part of the outer periphery cutting table 47 through a frame (not shown). The bonding table 48 has an upper surface configured as a suction surface. The wafer W is transferred from the outer peripheral cutting table 47 via the transfer device 45, and the wafer W to which the sheet S is temporarily attached is heated. Thus, the sheet S is completely bonded to the wafer W. In the present embodiment, the bonding table 48 is controlled to about 180 ° C. as the third temperature.

  The collection device 50 is a device for adsorbing and collecting the unnecessary sheet portion S1 around the wafer W on the cutting table 47. The recovery device 50 includes a cross arm 130 having a substantially X shape in plan view and a lower surface side of each tip having a suction function, a connection arm 131 that supports a substantially central position of the cross arm 130, and a base of the connection arm 131. A cylinder 132 that supports the end side and is disposed in a direction substantially orthogonal to the guide 97 of the cutting means 43 in a plane, a slider 133 that is movable along the cylinder 132, and an unnecessary sheet portion S1. And a recovery box 135 for recovering the product. The cross arm 130 is provided so as to be able to reciprocate between the upper position of the outer peripheral cutting table 47 and the upper position of the collection box 135, and by releasing the suction to the unnecessary sheet portion S1 on the collection box 135, The unnecessary sheet portion S1 can be dropped into the collection box 135.

  The wafer W to which the sheet S is completely bonded by the bonding table 48 is transferred again to the mounting device 17 side via the transfer device 45. At this time, the transfer device 45 cools the wafer W via the cooling unit 101 in the transfer process. As shown in FIG. 1 and FIGS. 13 to 17, the mount device 17 is configured to mount the mount table 137 toward the mount table 137 for adsorbing the ring frame RF and the wafer W and the tape attaching unit 138 for attaching the dicing tape DT. A pair of rails 139 to be moved is included. Here, the dicing tape DT is used as a raw material in which a dicing tape piece having a slightly smaller diameter than the outer diameter of the ring frame RF is temporarily attached to one surface of a strip-like peeling tape ST.

  As shown in FIG. 15, the mount table 137 includes a table main body 137A, a substantially circular central raised portion 137B that supports the wafer W to which the sheet S is attached, and a central raised portion on the upper surface of the table main body 137A. 137B is provided so as to surround the ring frame RF and has a ring-shaped raised portion 137C as an outer raised portion that supports the ring frame RF. At this time, the central raised portion 137 </ b> B is provided with a diameter slightly larger than the diameter of the wafer W, that is, a size substantially corresponding to the size of the sheet S attached to the wafer W. The mount table 137 is provided so as to be movable up and down in substantially the same manner as the pasting table 40 described above, and is provided so as to be movable along the rail 139.

  The tape applying unit 138 includes a support roll 140 that is provided in the plane of the plate-like support frame F <b> 1 and supports the dicing tape DT wound in a roll shape so that the dicing tape DT can be fed, and the peeling that is fed from the support roll 140. A peel plate 142 that peels off the dicing tape DT by sharply turning back the tape ST, a winding roll 143 that winds up the peeling tape ST folded back by the peel plate 142, and the dicing tape DT of the ring frame RF and the sheet S. And a pressing roll 144 for pressing and pasting the upper surface. Therefore, as shown in FIG. 14, after the mount table 137 is moved to the tape applying unit 138 side, the upper surface position of the mount table 137 is raised, and the mount table 137 is moved in the direction indicated by the solid line position on the left side in the figure. By moving, the dicing tape DT is attached to the upper surface of the ring frame RF and the sheet S, whereby the wafer W can be mounted on the ring frame RF. As shown in FIG. 16, the ring frame RF is accommodated in the frame stocker 145 and transferred onto the mount table 137 via the transfer arm 147. The work K mounted on the ring frame RF on the mount table 137 is sucked and held by the transfer arm 147, and the work K is transferred to the transfer arm 149 in a state where the front and back surfaces of the work K are reversed. The work K held by 149 is transferred to the next step, that is, the peeling device 18 side of the protective sheet PS.

  Next, a sheet cutting method and a mounting method in this embodiment will be described.

  Here, it is assumed that the wafer W having the protective tape PT attached to the circuit surface is transferred to the UV irradiation unit 13 and subjected to a predetermined UV treatment, and then aligned and transferred to the application table 40.

  The sticking table 40 is controlled so as to maintain approximately 110 ° C. as the first temperature at which the sheet S can be temporarily attached. Further, the wafer W is adsorbed in a state where the protective tape PT is in contact with the table surface, and therefore, the back surface of the wafer W is in a state where it is the upper surface side.

  As shown in FIG. 5, when the sticking table 40 is moved to a predetermined position of the sticking unit 41, the lead end region of the sheet S that is sucked and held on the lower surface side of the pressing member 76 is lowered by the lowering of the pressing member 76. It will contact the upper surface of 40. After this contact is completed, the press roll 78 is lowered and the sheet S is sandwiched between the upper surface of the wafer W (see FIGS. 7 and 8). Next, the pressing member 76 is lifted by releasing the suction. At this time, the rollers 89 provided on both end sides of the press roll 78 come into contact with the upper surface of the guide bar 67, and at the same time, the pinion 88 is engaged with the rack 65, and the pinion 88 can rotate and move along the rack 65. . In this state, the sticking table 40 moves to the right side in FIG. 5 and the press roll 78 rotates due to the engagement between the rack 65 and the pinion 88, and the roller 89 rolls on the guide bar 67 as a guide surface. The sheet S to be fed is pasted on the upper surface of the wafer W. The press roll 78 is controlled to maintain approximately 110 ° C. by a built-in heater.

  When the sheet S is thus stuck to the wafer W and the pressing member 76 reaches the upper position immediately after passing through the cutter receiving groove 40A, the sticking table 40 is positioned almost directly above the outer periphery cutting table 47. Will be reached. Then, the pressing member 76 is lowered to bring the sheet S into contact with the pasting table 40 (see FIG. 6). Thereafter, the cutter 96 enters the cutter receiving groove 40A, and the arm portion 90 supporting the cutter unit 92 moves in the direction perpendicular to the paper surface in FIG. 6 to cut the sheet S in the width direction. When the cutting in the width direction is completed, the pressing member 76 adsorbs the sheet S located on the lower surface side of the pressing member 76 and returns to the raised position to prepare for the next bonding to the wafer W. Further, the cutting means 43 is displaced to a position where the cutting edge position of the cutter 96 is raised by the raising of the cutter up / down cylinder 95 and retreats away from the upper surface position of the affixing table 40, that is, upward in FIG. It will be.

  Next, as shown in FIG. 9, the suction plate 100 of the transfer device 45 moves so as to be positioned above the pasting table 40 by the operation of the uniaxial robot 105 and the lowering of the cylinder 106, and the suction is performed by the lowering of the cylinder 107. The surface position of the plate 100 is lowered to suck and hold the wafer W on which the sheet S is stuck. As a result, the sticking table 40 moves to a position for sucking and holding the wafer W to be processed next, and at the same time, the outer peripheral cutting table 47 is lifted and sucked onto the upper surface of the cutting table 47 by the suction plate 100. The wafer W being transferred is transferred. At this time, the wafer W that has reached the temporary attachment temperature on the sticking table 40 receives a cooling action while being adsorbed on the adsorption plate 100 and is kept in a state of being lowered to substantially normal temperature.

  As shown in FIG. 11, when the wafer W is transferred to and held by suction on the outer periphery cutting table 47, the transfer device 45 moves in a direction away from the upper position of the outer periphery cutting table 47 while cutting. The means 43 moves on the outer periphery cutting table 47 (see FIG. 12). Then, by moving the uniaxial robot 91 by a predetermined amount and lowering the cutter up / down cylinder 95, the cutter 96 penetrates downward at a position protruding from the outer peripheral edge of the wafer W in the range of 0.1 mm to 1 mm, and the tip ends. It is received in the circumferential groove 47A. In this state, the sticking table 47 is rotated in the horizontal plane by the rotating mechanism 110 and is cut along the circumferential direction leaving a region protruding from the outer peripheral edge of the wafer W by 0.1 mm to 1 mm. When this cutting is completed, the cutting means 43 moves from the upper position of the outer periphery cutting table 47 to a position where it is retracted again, while the cross arm 130 of the collecting device 50 moves onto the unnecessary sheet portion S1 and the unnecessary sheet is moved. The portion S1 is adsorbed and moved onto the collection box 135 to drop the unnecessary sheet portion S1.

  The transfer device 45 moves onto the outer periphery cutting table 47 so that the cross arm 130 moves to the collection box 135 side, and after the wafer W is adsorbed again, the wafer W is moved to the upper surface of the bonding table 48. Included.

  The wafer W transferred to the bonding table 48 is controlled so that the bonding table 48 maintains a third temperature of approximately 180 ° C., so that the sheet S is completely bonded to the wafer W. It will be affected. Then, after a predetermined time has elapsed, the wafer W is sucked by the suction plate 100 of the transfer device 45 and is subjected to a cooling action to return to normal temperature again.

  The wafer W that has fallen in temperature while being attracted to the transfer device 45 is transferred to the mount table 137 that is attracting the ring frame RF, and then mounted to the ring frame RF via the dicing tape DT. At this time, since the central raised portion 137B of the mount table 137 is provided with a diameter slightly larger than the diameter of the wafer W, the wafer W is moved when the pressing roll 144 moves relative to the dicing tape DT while rotating. Adhesive pressure can be reliably applied to the sheet portion that protrudes to the outside within a range of 0.1 mm to 1 mm from the outer peripheral edge of the sheet, and the protruding sheet portion is separated from the dicing tape DT. There is no.

  The workpiece K on which the wafer W is mounted on the ring frame RF is transferred to the tape peeling device 18 side upside down, and then the UV-cured protective tape PT is transferred to the wafer circuit by the tape peeling device 18. It peels from the surface and is accommodated in the stocker 19.

Therefore, according to such an embodiment, since the sheet S is cut with a predetermined amount protruding from the outer peripheral edge of the wafer W, even the extremely thin wafer W that is back-ground is cut by the cutter 96. The effect that the outer periphery of the wafer W is not damaged is obtained.
Moreover, when the wafer W to which the sheet S is attached is mounted on the ring frame RF, the central raised portion 137B that forms the support surface of the wafer W is attached to the wafer W, that is, a diameter larger than the diameter of the wafer W. Since the sheet S is provided in a size substantially corresponding to the size of the sheet S, when the pressure applied by the pressing roll 144 is applied, the protruding portion of the protruding sheet portion is substantially eliminated. It can be reliably attached to DT. Therefore, in the subsequent process, the dicing cutter for separating the wafer W into pieces does not get entangled with the protruding sheet portion, and it is possible to avoid the disadvantage that the wafer W is broken in the dicing process. .

As described above, the best configuration, method, and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
That is, the present invention has been illustrated and described mainly with respect to specific embodiments, but the shape, position, or position of the above-described embodiments can be reduced without departing from the scope of the technical idea and object of the present invention. With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, in the above-described embodiment, the case where the object to which the sheet S is attached is the wafer W has been illustrated and described, but the present invention is not limited to this and may be other plate-like members. .

1 is a schematic plan view showing an overall configuration in which a sheet cutting method and a mounting method according to the present invention are applied to a wafer processing apparatus. Schematic cross-sectional view for explaining the wafer processing process over time The front view which shows a sticking apparatus. The schematic perspective view of a sticking apparatus. FIG. 2 is a schematic front view showing an initial stage of temporarily attaching a sheet. FIG. 3 is a schematic front view when a sheet is temporarily attached and the sheet is cut in the width direction. The schematic perspective view which shows a sticking table. The side view of FIG. The schematic front view which shows operation | movement of a cutting | disconnection means. The schematic front view which shows the state which transfers a wafer from the sticking table to the table for outer periphery cutting. FIG. 11 is a schematic front view showing the next stage of FIG. 10. The schematic front view which shows the state which cut | disconnects the sheet | seat part which remains on the wafer outer periphery transferred by the outer periphery cut table. The schematic plan view which shows the area | region which transfers a wafer by the transfer apparatus. The schematic front view of a mounting apparatus. The enlarged front view which shows the state which mounted the wafer which stuck the sheet | seat on the mount table, and stuck the dicing tape The schematic front view which shows the transfer state of the workpiece | work which mounted the wafer to the ring frame. FIG. 17 is a schematic plan view of FIG. 16.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Wafer processing apparatus 15 Adhering apparatus 17 Mounting apparatus 40 Adhering table 40A Cutter receiving groove 41 Adhering unit 43 Cutting means 47 Peripheral cutting table 47A Circumferential groove 96 Cutter 137 Mount table 137B Central raised part 137C Ring-like raised part (outer raised part) )
W Semiconductor wafer (plate-like member)
S sheet (heat-sensitive adhesive sheet)
S1 Unnecessary sheet part

Claims (7)

In a method of cutting the sheet along the outer peripheral edge of the plate-shaped member after pasting the sheet having a planar shape larger than the planar shape of the plate-shaped member on the plate-shaped member,
The sheet cutting method, wherein the cutting is performed in a state where the sheet protrudes from the outer peripheral edge of the plate-shaped member by a predetermined amount. 2. The sheet cutting method according to claim 1, wherein an outer edge of the cut sheet is positioned outside in a range of 0.1 mm to 1 mm with respect to the outer edge of the plate-like member. The sheet cutting method according to claim 1, wherein the plate-like member is a semiconductor wafer. 3. The sheet cutting method according to claim 1, wherein the plate-like member is a back-ground semiconductor wafer. The sheet cutting method according to claim 1, wherein the sheet is a heat-sensitive adhesive sheet. A process of supporting a substantially circular semiconductor wafer, which has been extremely thinned through a back grinding process, on a pasting table;
A step of feeding a belt-like heat-sensitive adhesive sheet having a width larger than the diameter of the semiconductor wafer and pasting the sheet in a state where both sides in the width direction and the front and rear in the feeding direction protrude outside the outer peripheral edge of the semiconductor wafer;
Cutting the downstream side of the sheet feeding direction in the width direction;
A step of transferring the wafer to which the sheet is attached to an outer periphery cutting table;
A sheet cutting method comprising a step of cutting the outer periphery of the sheet in a state in which a sheet protruding amount of 0.1 mm to 1 mm is secured from the outer peripheral edge of the semiconductor wafer. After pasting the heat-sensitive adhesive sheet having a larger plane area than the semiconductor wafer to the semiconductor wafer, cutting the outer periphery of the sheet into a predetermined amount of protrusion from the outer peripheral edge of the semiconductor wafer,
Next, a mounting method in which the semiconductor wafer is transferred to the inside of the ring frame supported by the mount table and integrated with the ring frame via a dicing tape,
A mount table including a central raised portion supporting the wafer and having a size substantially corresponding to the size of the sheet; and an outer raised portion provided around the central raised portion and supporting the ring frame; , Using a pressing roll that presses and sticks the dicing tape to a ring frame and a sheet,
When the pressing roll rotates on the dicing tape to apply a pressure, the sheet portion sticking to the dicing tape is eliminated by eliminating the clearance of the sheet portion protruding from the outer peripheral edge of the wafer by the outer peripheral side of the central raised portion. Mounting method.

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