JP4485248B2 - Peeling apparatus and peeling method - Google Patents

Peeling apparatus and peeling method Download PDF

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Publication number
JP4485248B2
JP4485248B2 JP2004133068A JP2004133068A JP4485248B2 JP 4485248 B2 JP4485248 B2 JP 4485248B2 JP 2004133068 A JP2004133068 A JP 2004133068A JP 2004133068 A JP2004133068 A JP 2004133068A JP 4485248 B2 JP4485248 B2 JP 4485248B2
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Prior art keywords
peeling
tape
protective tape
roll
table
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JP2005317711A (en
Inventor
孝久 吉岡
賢治 小林
正樹 辻本
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リンテック株式会社
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Priority to JP2004133068A priority Critical patent/JP4485248B2/en
Priority claimed from EP20050737251 external-priority patent/EP1742255B1/en
Publication of JP2005317711A publication Critical patent/JP2005317711A/en
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Publication of JP4485248B2 publication Critical patent/JP4485248B2/en
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386Separation by peeling
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386Separation by peeling
    • H01L2221/68395Separation by peeling using peeling wheel

Description

  The present invention relates to a peeling apparatus and a peeling method, and more particularly to a peeling apparatus and a peeling method suitable for peeling a protective tape attached to a circuit surface of a semiconductor wafer.

  Conventionally, when a semiconductor wafer (hereinafter simply referred to as “wafer”) is ground to an extremely thin thickness, a protective tape is usually applied to the circuit surface side. The protective tape is peeled off after completing the mounting process on the ring frame. When the protective tape is peeled off, special consideration is required because the wafer is very thin.

  Patent Document 1 discloses the protective tape peeling device and the peeling method described above. This document proposes a configuration in which a plurality of rolls are combined to ensure a large peeling angle, and the protective tape can be peeled in a direction as parallel as possible to the wafer surface to prevent cracking of the wafer.

JP 2001-319906 A

  However, for example, as shown in FIG. 23, a convex portion 201 called a solder bump (hereinafter referred to as “bump”) for ensuring electrical conduction is formed on the circuit surface side on the circuit surface side of the chip. In the case where the wafer W is attached with the protective tape PT as an object to be peeled, in the peeling apparatus and the peeling method of Patent Document 1, the initial peeling angle α1 is an angle approaching 180 degrees. While being able to peel without applying stress, the protective tape PT is peeled off in a state where the initial peeling angle α1 is kept to the end. Therefore, there arises a disadvantage that the adhesive 202 of the protective tape PT is left between the convex portions 201.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and the purpose of the present invention is to specially set an initial peeling angle at which an object to be peeled such as a wafer is likely to be cracked when peeling a sheet. Sheet peeling device that can set and then maintain the next peeling angle smaller than the initial peeling angle so that the sheet can be peeled off, and can prevent the adhesive from remaining when bumps or other convex portions exist And providing a peeling method.

In order to achieve the above object, the present invention provides a peeling table that supports a peeling object to which a protective tape is attached, and is disposed above the peeling table and is relatively disposed along the surface of the peeling object. In the peeling device provided with a tape peeling unit provided movably, the protective tape is provided so as to be peelable by adhering and winding the peeling tape fed from the tape peeling unit to the protective tape,
The tape peeling unit includes a peeling tape supply unit, a peeling tape winding unit, and a peeling head unit positioned between the supply unit and the winding unit,
The peeling head portion is bent in a direction in which the peeling tape is reversed at an end position of the peeling object to form an initial peeling angle that causes the peeling direction to follow the surface of the peeling object, while the folded peeling tape In this winding, the protective tape is peeled off by forming a next peeling angle smaller than the initial peeling angle.

In addition, the present invention is provided with a peeling table that supports a peeling target object to which a protective tape is attached, and is disposed above the peeling table and is relatively movable along the surface of the peeling target object. In the peeling apparatus provided with the tape peeling unit, the peeling tape provided from the tape peeling unit can be peeled off by adhering the tape to the protective tape and winding it.
The tape peeling unit includes a supply unit for a peeling tape, a first roll for bonding the peeling tape to the surface of the protective tape, and a position where the first roll adheres to the protective tape. Including a second roll forming a gap, and a winding portion of the peeling tape,
The peeling tape between the first roll and the second roll is partially loosened and bent between the second roll and the protective tape in the direction of reversing to form an initial peeling angle. Made possible
After the protective tape is peeled off at the initial peel angle, the protective tape can be peeled off at the next peel angle smaller than the initial peel angle by the first roll.

Furthermore, the present invention provides a peeling table for supporting a semiconductor wafer having bumps on the circuit surface and having a protective tape affixed to the circuit surface, and disposed above the peeling table. And a tape peeling unit that can be moved relative to the surface of the wafer where the protective tape is applied, and the protective tape can be peeled off by adhering and winding the peeling tape fed from the tape peeling unit to the protective tape. In the peeling device provided in
The tape peeling unit includes a peeling tape supply unit, a first roll for bonding the peeling tape to the surface of the protective tape, and the protective tape at a position where the first roll adheres to the protective tape. Including a second roll forming a gap, and a winding portion of the peeling tape,
The peeling tape between the first roll and the second roll is partially loosened and bent between the second roll and the protective tape in the direction of reversing to form an initial peeling angle. Made possible
After the protective tape is peeled off at the initial peel angle, the protective tape can be peeled off at the next peel angle smaller than the initial peel angle by the first roll.

Further, the present invention provides a peeling method in which the protective tape is peeled off by adhering a peeling tape to the protective tape attached to the surface of the peeling object.
Adhering a peeling tape to the protective tape, forming the initial peeling angle by bending the peeling tape in the direction of reversing at the end position of the object to be peeled,
The end of the protective tape is peeled off from the end of the object to be peeled at the initial peeling angle,
Next, a method is adopted in which the protective tape is peeled while maintaining a next peel angle smaller than the initial peel angle.

Furthermore, the present invention is a peeling method in which bumps are formed on a circuit surface of a semiconductor wafer, and a protective tape is attached to a protective tape attached to the circuit surface to release the protective tape.
Adhering the peeling tape to the edge position of the wafer,
In a state where the winding operation of the peeling tape is stopped, a pulling force is applied to the feeding side peeling tape on the side opposite to the winding direction,
Folding the peeling tape on the feeding side little by little and generating a slack in the peeling tape, bending the peeling tape in the direction of reversing to form an initial peeling angle,
Next, after winding up the peeling tape at the initial peeling angle and peeling off the end of the protective tape,
A method is adopted in which the bent portion is wound up and the protective tape is peeled off at a next peeling angle smaller than the initial peeling angle.

  According to the present invention, the initial peeling angle is an angle along the surface of the sheet as much as possible, so that it is possible to prevent cracking or the like when the peeling object is thin. In addition, after the initial peeling, because the sheet is peeled off by moving to the next peeling angle smaller than the initial peeling angle, there is a bump or other convex part on the surface where the sheet is affixed In this case, it is possible to eliminate the disadvantage that the adhesive remains between the convex portions.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a plan view of a wafer processing apparatus to which a peeling apparatus and a peeling method according to the present embodiment are applied, and FIG. 2 shows a schematic cross-sectional view for explaining the wafer processing steps over time. Has been. In these drawings, the wafer processing apparatus 10 targets a wafer W on which a UV curable protective tape PT (see FIG. 2) is attached to the surface forming a circuit surface, and has a thermosensitive adhesive property for die bonding on the back surface of the wafer W. After applying the adhesive sheet S (hereinafter referred to as “adhesive sheet S”), the apparatus is configured as a device for processing a series of steps of mounting the wafer W on the ring frame RF via the dicing tape DT.

  As shown in FIG. 1, the wafer processing apparatus 10 performs UV irradiation on a cassette 11 for storing wafers W, a robot 12 for sucking and holding wafers W taken out from the cassettes 11, and the protective tape PT. The UV irradiation unit 13, the alignment device 14 for positioning the wafer W, the sticking device 15 for sticking the adhesive sheet S (see FIG. 2) to the back surface of the aligned wafer W, and the adhesive sheet S were stuck. The protective tape PT is peeled off from the mounting device 18 including the tape attaching unit 16 for attaching the dicing tape DT to the subsequent wafer W and mounting the wafer W on the ring frame RF, and the tape removing unit 17 for removing the protective tape PT. And a stocker 19 for storing the wafer W.

  The wafer W is accommodated in the cassette 11 with the protective tape PT on the upper surface side, and the upper surface side of the protective tape PT is held by the robot 12 and transferred to the UV irradiation unit 13. As shown in FIG. 3, the robot 12 includes a uniaxial movement device 21, a slider 22 that moves along the uniaxial movement device 21, a vertical movement mechanism 24 erected on the slider 22, and the vertical movement. An articulated arm 26 provided at the upper end of the mechanism 24 and rotatable in a substantially horizontal plane; and a suction member 27 having a substantially C-shaped or substantially U-shaped planar shape attached to the tip of the arm 26; It is comprised by. Here, the suction member 27 is connected to the tip of the arm 26 via a rotation mechanism 28 that can reverse the surface of the wafer W to the front and back.

  As shown in FIG. 3, the UV irradiation unit 13 includes a suction table 30 on which the wafer W held by the suction member 27 of the robot 12 is transferred and sucked, and an upper position of the suction table 30. And a case 32 that covers the suction table 30 and the UV lamp 31. The suction table 30 is provided so as to be capable of reciprocating along the left-right direction in FIG.

  The alignment device 14 includes an alignment table 34 that includes an XY movement mechanism and is rotatably provided, and a camera that is provided on the upper surface side of the alignment table 34 and detects a V notch or the like (not shown) of the wafer W. And a uniaxial robot 37 that supports the alignment table 34 so as to be able to advance and retreat with respect to the lower position of the transport plate 36.

  The transfer plate 36 has a suction surface on the lower surface side, and receives the UV irradiated wafer W via the robot 12. At this time, the wafer W is reversed to the state where the protective tape PT side is the lower surface side and is sucked to the suction surface of the transfer plate 36. The transport plate 36 is positioned above the alignment table 34 and is movably provided in the left-right direction in FIG. When the transfer plate 36 receives the UV irradiated wafer W from the robot 12, the alignment table 34 moves to the lower surface side of the wafer W via the uniaxial robot 37 to receive the wafer W, and then performs alignment and transfer. The wafer W is again adsorbed on the plate 36 and transferred to the attaching device 15.

  As shown in FIGS. 3 to 5, the sticking device 15 receives a wafer W from the transfer plate 36 and supports the wafer W, and the back surface of the wafer W attracted to the sticking table 40. Adhering unit 41 for temporarily attaching the adhesive sheet S to the side (upper surface side), cutting means 43 for cutting the adhesive sheet S in the width direction for each wafer W, and the wafer W from the adhering table 40 to be transferred. The transfer device 45 and the wafer W transferred via the transfer device 45 are sucked and supported, and the unnecessary adhesive sheet portion S1 (see FIG. 4) protruding from the outer periphery of the wafer W is cut by the cutting means 43. Peripheral cutting table 47 for bonding, and an adhesive table for adhering the temporarily-attached adhesive sheet S to the wafer W together with the peripheral cutting table 47 48, is configured to include a recovery unit 50 for recovering the unnecessary adhesive sheet part S1 truncated at the outer peripheral edge position of the wafer W.

  As shown in FIG. 4, the pasting table 40 has a first temperature at which the upper surface side is formed as an adsorption surface, and the adhesive sheet S can be melted to a certain extent and temporarily attached to the wafer W. In the present embodiment, the temperature is maintained at approximately 110 ° C. As shown in FIG. 8, the sticking table 40 includes a base table 40B, an inner table portion 40C provided on the upper surface side of the base table 40B, and an outer table portion 40D surrounding the inner table portion 40C. Configured. The inner table portion 40C is provided in substantially the same plane shape as the wafer W so as to form a support surface of the wafer W, and a heater H is disposed therein to keep the wafer W at approximately 110 ° C. . Further, a heat transfer member 44 is disposed in the clearance C formed between the inner table portion 40C and the outer table portion 40D. The heat transfer member 44 causes the outer table portion 40D to have a temperature higher than that of the inner table portion 40C. The lower temperature, in this embodiment, is set to be kept at about 40 ° C. Therefore, the unnecessary adhesive sheet portion S1 protruding outside the wafer W is adhered to the outer table portion 40D with a weak adhesive force, and no wrinkles or the like are generated on the wafer when the adhesive sheet S is attached to the wafer W. .

  The pasting table 40 has a position where the wafer W can be received from the transfer plate 36 via the moving device 52, and a position that passes through the lower region of the pasting unit 41 and reaches the upper side of the outer peripheral cutting table 47. Are provided so as to be able to reciprocate between them, and can be moved up and down via a lifting device 53. In addition, the sticking table 40 can also provide the said inner side table part 40C and the outer side table part 40D so that rotation in a plane is possible. The moving device 52 penetrates through a pair of rails 54, 54, a slide plate 55 that is guided by the rails 54 and moves on the rail 54, and a bracket 57 fixed to the slide plate 55. A ball spline shaft 58 and a motor M (see FIG. 1) that rotationally drives the ball spline shaft 58 are configured. Here, the motor M is fixed to a frame (not shown), while the other end is rotatably supported by the bearing 60. Accordingly, the application table 40 reciprocates in the left-right direction in FIG. The elevating device 53 includes a vertical movement mechanism 62 arranged at the center of the lower surface of the sticking table 40, a guide block 63 fixed on the slide plate 55, and four pieces that can be raised and lowered along the guide block 63. When the vertical movement mechanism 62 moves back and forth in the vertical direction, the sticking table 40 moves up and down to receive the wafer W from the transfer plate 36.

  On the upper surface of the pasting table 40, cutter receiving grooves 40A for cutting the strip-shaped adhesive sheet S fed out from the pasting unit 41 in the width direction are formed, and on both side surfaces along the moving direction of the pasting table 40. A rack 65 constituting an interlocking mechanism and a guide bar 67 attached to the outer surface of the rack 65 are provided at the upper part.

  As shown in FIGS. 5 and 6, the sticking unit 41 is provided in a region of a plate-like frame F disposed above the sticking table 40. The affixing unit 41 is laminated on the adhesive sheet S, a support roll 70 that supports the adhesive sheet S wound in a roll shape so that supply is possible, a drive roll 71 and a pinch roll 72 that apply a feeding force to the adhesive sheet S, and the adhesive sheet S. A take-up roll 73 for winding the release sheet PS, two guide rolls 74, 74 disposed between the support roll 70 and the pinch roll 72, and a dancer roll 75 provided between the guide rolls 74, 74. And a pressing member 76 that presses the lead end region of the adhesive sheet S from which the release sheet PS has been peeled against the upper surface of the pasting table 40 and sandwiches it, and the back side of the wafer W (upper side in FIG. 5). A press roll 78 that is sequentially pressed against the press roll 78 and a tension bar disposed in front of the press roll 78 in the feeding direction of the adhesive sheet S. It is constituted by a Nroru 79 and the guide roll 80. The press roll 78 includes a heater as a heating means. Further, the lower surface side of the pressing member 76 has an adsorbing portion, and adsorbs and holds the end portion of the adhesive sheet S.

  The drive roll 71, the pinch roll 72, and the take-up roll 73 constitute a peeling portion that peels the adhesive sheet S and the release sheet PS in the original fabric state. Among them, the rolls 71 and 73 are rotationally driven by motors M1 and M2 provided on the back side of the frame F, respectively. The pressing member 76, the press roll 78, and the tension roll 79 are provided so as to be movable up and down via cylinders 82, 83, and 84, respectively. As shown in FIGS. 7 and 8, both ends of the press roll 78 are coupled to the cylinder 83 via brackets 85, and both ends of the rotation center shaft 86 interact with the rack 65. Thus, a pair of pinions 88 and 88 constituting an interlocking mechanism, and a pair of rollers 89 and 89 as rotating bodies are arranged at positions further outside these pinions 88. The pinions 88 and 88 are provided so as to be able to mesh with the rack 65, while the rollers 89 and 89 are configured to roll on the guide bar 67 irrespective of the rotation of the press roll 78.

  As shown in FIGS. 5 and 6, the cutting means 43 is provided on an arm portion 90 extending along the moving direction of the sticking table 40, and a lower surface of the distal end side (left end side in FIG. 5) of the arm portion 90. And a cutter unit 92 provided so as to be able to advance and retreat via a single-axis robot 91. The cutter unit 92 includes a cutter up / down cylinder 95 supported by a bracket 94 that moves along the uniaxial robot 91, and a cutter 96 attached to the tip of the cutter up / down cylinder 95. Here, the cutter up / down cylinder 95 is attached to the bracket 95 so as to be rotatable in a substantially vertical plane, whereby the cutter blade can be moved in a state in which the tip position of the cutter 96 follows the arc locus in the substantially vertical plane. The adhesive sheet S is set so as not to protrude from the wafer W at the time of circular cutting, which will be described later, and can be advanced and retracted along the extending direction of the arm portion 90 by the uniaxial robot 91. Has been. As shown in FIG. 1, the cutting means 43 is supported so as to be movable by driving the motor M3 on a guide 97 that is directed in a direction (Y direction in FIG. 1) orthogonal to the moving direction of the sticking table 40. Has been. Therefore, the function of cutting the adhesive sheet S in the width direction when the tip of the cutter 96 enters the cutter receiving groove 40A of the sticking table 40 and the entire cutting means 43 moves along the guide 97 is achieved. It will be.

  As shown in FIGS. 4, 9 to 14, the transfer device 45 includes a plate-like suction plate 100 that sucks the wafer W to the lower surface side, and a temperature adjustment provided on the upper surface side of the suction plate 100. The unit 101 includes an arm 102 that supports the suction plate 100, and a uniaxial robot 105 that moves the arm 102 in the Y direction. The suction plate 100, when adhering the wafer W after the adhesive sheet S has been cut in the width direction on the sticking table 40 (see FIG. 10), is the first temperature during temporary attachment (110 ° C.). For example, the wafer W is cooled to room temperature, and the viscosity of the adhesive sheet S is reduced or eliminated to prevent the transfer of the adhesive to the cutter 96. Further, the transfer device 45 transfers the wafer W from the sticking table 40 to the outer periphery cutting table 47, and bonds the wafer W after the unnecessary adhesive sheet portion S1 is cut by the outer periphery cutting table 47. The wafer W is transferred to the table 48, and the wafer W after the adhesive sheet S is completely bonded by the bonding table 48 is transferred to the next process. The transfer device 45 is mounted from the bonding table 48 to the mounting device while being transferred from the sticking table 40 to the outer periphery cutting table 47 by the temperature adjustment unit 101 and from the outer periphery cutting table 47 to the bonding table 48. In any process of transferring to the temperature 18, the temperature of the wafer W is adjusted, and the temperature adjustment time after the transfer of the wafer is not required or can be shortened.

  As shown in FIG. 4, the uniaxial robot 105 is disposed substantially parallel to the guide 97 at a position above the guide 97 of the cutting means 43. This single-axis robot 105 is provided with a cylinder 106 extending in a direction perpendicular to the vertical direction and a lift slider 108 that can be lifted and lowered via the cylinder 106, and the lift slider 108 has a base end side of the arm 102 (FIG. 9). The middle right end side) is connected.

  As shown in FIGS. 4 and 11, the outer peripheral cutting table 47 receives the wafer W from the sticking table 40 via the transfer device 45 and sucks it to remove an unnecessary adhesive sheet around the wafer W. It is a table for cutting part S1 with cutting means 43. In this embodiment, the outer periphery cutting table 47 is maintained at a normal temperature as the second temperature. The upper surface is formed as an adsorption surface, and a circumferential groove 47A corresponding to the periphery of the outer periphery of the wafer W. It is configured with. The outer periphery cutting table 47 is supported on the elevating plate 111 via the rotation mechanism 110 on the lower surface side. The rotating mechanism 110 includes a rotating shaft 112 whose axial direction is the vertical direction, a rotating bearing 103 that supports the rotating shaft 112, a driven pulley 114 fixed around the rotating shaft 112, and a side of the driven pulley 114. A main driving pulley 115 that is positioned and fixed to the output shaft of the motor M4, and a belt 117 that is wound around the pulleys 114, 115. A table 47 is provided to be rotatable in a plane. Therefore, when the cutter 96 enters the circumferential groove 47A and the outer circumferential cutting table 47 rotates, the function of cutting the adhesive sheet S in the circumferential direction, that is, circumferential cutting is achieved. The cutting in the circumferential direction can also be achieved by configuring the cutter unit 92 to be rotatable in a horizontal plane.

  The lifting plate 111 that supports the outer periphery cutting table 47 is provided so as to be lifted and lowered via the lifting device 120. As shown in FIG. 4, the lifting device 120 includes a block 123 attached to the back side of a substantially L-shaped support body 122 that supports the lifting plate 111, and a pair of links connected to both sides of the support body 122. The elevating side plate 124, a pair of upright guides 125 that guide the elevating side plate 124 in the vertical direction, a screw shaft 126 that extends through the block 123 in the vertical direction, a lower end of the screw shaft 126, and an upright guide 125 The pulleys 127 and 128 are respectively fixed to the output shaft of the motor M5 disposed in the vicinity of the lower end, and the belt 129 is wound around the pulleys 127 and 128. The screw shaft 126 is rotated by driving the motor M5. By doing so, the cutting table 47 can be moved up and down.

  The bonding table 48 is disposed on the side upper part of the outer periphery cutting table 47 through a frame (not shown). The bonding table 48 has an upper surface configured as a suction surface. The wafer W is transferred from the outer peripheral cutting table 47 via the transfer device 45, and the wafer W to which the adhesive sheet S is temporarily attached is attached. The adhesive sheet S is completely bonded to the wafer W by heating. In the present embodiment, the bonding table 48 is controlled to about 180 ° C. as the third temperature.

  The collection device 50 is a device for adsorbing and collecting the unnecessary adhesive sheet portion S1 around the wafer W on the cutting table 47. The recovery device 50 includes a cross arm 130 having a substantially X shape in plan view and a lower surface side of each tip having a suction function, a connection arm 131 that supports a substantially central position of the cross arm 130, and a base of the connection arm 131. A cylinder 132 that supports the end side and is disposed in a direction substantially orthogonal to the guide 97 of the cutting means 43 in a plane, a slider 133 that is movable along the cylinder 132, and an unnecessary adhesive sheet portion It is comprised by the collection box 135 which collect | recovers S1. The cross arm 130 is provided so as to be able to reciprocate between the upper position of the outer periphery cutting table 47 and the upper position of the collection box 135, and by releasing the adsorption to the unnecessary adhesive sheet portion S1 on the collection box 135. The unnecessary adhesive sheet portion S1 can be dropped into the collection box 135.

  The wafer W to which the adhesive sheet S is completely bonded by the bonding table 48 is transferred again to the mounting device 18 side via the transfer device 45. At this time, the transfer device 45 that sucks the wafer W cools the wafer W via the temperature adjustment unit 101 in the transfer process. As shown in FIGS. 1 and 13 to 16, the tape attaching unit 16 includes a mount table 137 that attracts the ring frame RF and the wafer W, and a mount table 137 toward the tape attaching portion 138 that attaches the dicing tape DT. And a pair of rails 139 for moving the. Here, the dicing tape DT is used as a raw material in which a dicing tape piece having a slightly smaller diameter than the outer diameter of the ring frame RF is temporarily attached to one surface of the stripping tape ST continuous in a strip shape.

  Although the mount table 137 is schematically illustrated here, a configuration substantially similar to that of the pasting table 40 described above is employed, whereby the mount table 137 can be moved up and down and along the rail 139. It is movable.

  The tape affixing part 138 is provided in the plane of the plate-like support frame F1 and supports the dicing tape DT wound in a roll shape so that the dicing tape DT can be fed out, and the peeling fed out from the support roll 140. A peel plate 142 that peels off the dicing tape DT by abruptly turning the tape ST, a winding roll 143 that winds up the peeling tape ST folded by the peel plate 142, and a ring frame FR and an adhesive sheet S for the dicing tape DT. And a pressing roll 144 for pressing and affixing to the upper surface. Therefore, as shown in FIG. 14, after the mount table 137 is moved to the tape applying portion 138 side, the upper surface position of the mount table 137 is raised, and the mount table 137 is moved in the direction indicated by the solid line position on the left side in the figure. By moving, the dicing tape DT is attached to the upper surface of the ring frame RF and the adhesive sheet S, whereby the wafer W can be mounted on the ring frame RF. Further, the mount table 137 is provided so as to be rotatable in a plane via a rotation mechanism (not shown), and as a result, the wafer W is diced into individual chips as shown in FIG. In the case of an assembly of W1, the positional relationship is not parallel to the center axis CL of the pressing roll 144 and any side of any chip W, and the dicing line DL is intermittently positioned between the chips W1, thereby By avoiding the possibility that the tip W1 directly below the center axis CL is inclined by the pressing force of the pressing roll 144, a sticking failure of the mount tape DT is prevented (see FIG. 16B). As shown in FIG. 15, the ring frame RF is accommodated in the frame stocker 145 and transferred onto the mount table 137 via the transfer arm 147. The workpiece K mounted on the ring frame RF on the mount table 137 is sucked and held by the transfer arm 147. The transfer arm 147 transfers the workpiece K to the transfer arm 149 with the front and back surfaces of the workpiece K reversed, and the workpiece K held by the transfer arm 149 is transferred to the processing position of the next process. It becomes.

  As shown in FIG. 15, the transfer arm 147 includes a slider 151 that can be moved up and down along the guide column 150, an arm 152 supported by the slider 151, and extends from the arm 152 in all directions. It comprises a branch arm 153 that adsorbs the ring frame RF. The arm 152 is provided so as to be rotatable about the axis thereof, so that the workpiece K can be transferred to the transfer arm 149 with the protective tape PT on the upper surface side.

  The transfer arm 149 is provided so as to be movable in the left-right direction in FIG. 15 via a cylinder device 155. The transfer arm 149 has substantially the same configuration as the transfer arm 147 except that it does not have a rotation function.

  The workpiece K attracted and held by the transfer arm 149 is transferred to the tape peeling unit 17. The tape peeling unit 17 includes a peeling table 156 and a tape peeling portion 157 for peeling the protective tape PT from the workpiece K transferred to the peeling table 156 as shown in FIG. The peeling table 156 is provided so as to be movable along the rail 160, and the protective tape PT on the upper surface side is peeled in the moving process. The workpiece K from which the protective tape PT has been peeled off by the tape peeling unit 157 is transferred to the transfer rail 162 by a transfer mechanism (not shown), moves on the transfer rail 162 via the workpiece transfer cylinder 161, and is stored in the stocker 19. The The workpiece K stored in the stocker 19 is diced into a chip size in a post-process process, and after being subjected to a heat treatment, it is picked up and bonded to the lead frame.

As shown in FIGS. 18 to 22, the tape peeling part 157 is located above the peeling table 156, and is a region of a support roll 164 that constitutes a supply part of the peeling tape ST1 and a plate-like frame F3. A take-up roll 165 which is provided inside and constitutes a take-up portion of the peeling tape ST1, a peeling head portion 166 which adheres the peeling tape ST1 to the protective tape PT and peels off the protective tape PT, and the peeling head Fixed to the output shaft of the motor M7 for applying the winding force of the peeling tape ST1 and the cylinder device 167 for raising and lowering the portion 166, the guide roll 168 provided between the peeling head portion 166 and the support roll 164 A driving roll 170, a pinch roll 171 with a peeling tape ST1 sandwiched between the driving roll 170, and the winding roll 165 It is constituted by a motor M8 for rotating in the winding direction. The support roll 164 is connected to the output shaft of the motor M9, so that a rotational force can be applied in the direction opposite to the feeding direction of the peeling tape ST1 to give a small tension to the peeling tape ST1. It can be done. In this embodiment, the peeling table 156 is provided so as to move in the horizontal direction without horizontally moving the frame F3. However, the frame F3 is provided so as to be movable relative to the peeling table 156 in the horizontal direction. May be.

  The peeling head portion 166 is provided in the lateral direction of the first roll 174 for adhering the peeling tape ST1 to the surface of the protective tape PT and the first roll 174 with an interval through which the peeling tape ST1 can pass. The second roll 175 and the third roll 176 disposed above the first roll 174 are configured. The second roll 175 is provided with a smaller diameter than the first roll 174, and the surface of the protective tape PT when the peeling tape ST1 wound around the first roll 174 contacts the protective tape PT. The clearance C1 (see FIG. 21A) is provided at a height that can be formed, so that the initial peeling of the protective tape PT can be performed with the initial peeling angle α1 (see FIG. 22) formed. It has become. In addition, the third roll 176 is set at a position where the rotation center thereof is almost directly above the rotation center of the first roll 174, so that after the initial peeling, the third roll 176 is more relative to the initial peeling angle. Therefore, the protective tape PT is peeled off at the next peeling angle (see FIG. 22) which is a small angle.

  Next, the wafer processing process in the embodiment will be described.

  A large number of wafers W each having a protective tape PT attached to the circuit surface are accommodated in the cassette 11. The wafer W is transferred to the UV irradiation unit 13 by the robot 12 and subjected to a predetermined UV process, and the wafer W after the UV curing process is transferred to the transfer plate 36 via the robot 12.

  After the wafer W is transferred to the alignment table 34 via the transfer plate 36 and alignment processing is performed, the wafer W is transferred again to the sticking table 40 via the transfer plate 36. At this time, the affixing table 40 is controlled to maintain approximately 110 ° C. as the first temperature at which the inner table portion 40C can temporarily attach the adhesive sheet S, while the outer table portion 40D is controlled by the adhesive sheet S. Is controlled to about 40 ° C., which is a temperature for bonding with a weak adhesive force. Further, the wafer W is adsorbed in a state where the protective tape PT is in contact with the table surface, and therefore, the back surface of the wafer W is in a state where it is the upper surface side.

  As shown in FIG. 5, when the sticking table 40 is moved to a predetermined position of the sticking unit 41, the lead end region of the adhesive sheet S sucked and held on the lower surface side of the pressing member 76 is stuck by the lowering of the pressing member 76. It comes into contact with the upper surface of the table 40. After completion of this contact, the press roll 78 is lowered to sandwich the adhesive sheet S between the upper surface of the wafer W, and the unnecessary adhesive sheet portion S1 other than the wafer W region contacts the outer table portion 40D (FIG. 5, 7, 8). Next, the pressing member 76 is lifted by releasing the suction. At this time, the rollers 89 provided on both end sides of the press roll 78 come into contact with the upper surface of the guide bar 67, and at the same time, the pinion 88 is engaged with the rack 65, and the pinion 88 can rotate and move along the rack 65. . In this state, the sticking table 40 moves to the right side in FIG. 5 and the press roll 78 rotates due to the engagement between the rack 65 and the pinion 88, and the roller 89 rolls on the guide bar 67 as a guide surface. The fed adhesive sheet S is stuck on the upper surface of the wafer W. At the time of sticking, the unnecessary adhesive sheet portion S1 that protrudes from the outer periphery of the wafer W is adhered to the outer table 40D with a weak adhesive force, so that the adhesive sheet is moved when the press roll 78 rotates on the wafer W. There is no inconvenience of generating wrinkles by being pulled by the tension of S and the pressing force of the press roll 78. The press roll 78 is controlled to maintain approximately 110 ° C. by a heater which is a built-in heating means.

  When the adhesive sheet S is stuck to the wafer W in this way and the pressing member 76 reaches the upper position immediately after passing through the cutter receiving groove 40A, the sticking table 40 is located almost directly above the outer periphery cutting table 47. Will be reached. Then, the pressing member 76 is lowered to bring the adhesive sheet S into contact with the sticking table 40 (see FIG. 6). Thereafter, the cutter 96 of the cutting means 43 enters the cutter receiving groove 40A, and the arm portion 90 supporting the cutter unit 92 moves in the direction perpendicular to the paper surface in FIG. 6 to cut the adhesive sheet S in the width direction. . At this time, since the region of the adhesive sheet S corresponding to the cutter receiving groove 40A is not in contact with the table surface, the viscosity of the region is low, and the transfer of the adhesive to the cutter 96 is not a problem. When the cutting in the width direction is completed, the pressing member 76 sucks the adhesive sheet S located on the lower surface side of the pressing member 76 and returns to the raised position to prepare for the next bonding to the wafer W. Further, the cutting means 43 is displaced to a position where the cutting edge position of the cutter 96 is raised by the raising of the cutter up / down cylinder 95 and retreats away from the upper surface position of the affixing table 40, that is, upward in FIG. It will be.

  Next, as shown in FIG. 9, the suction plate 100 of the transfer device 45 moves so as to be positioned above the pasting table 40 by the operation of the uniaxial robot 105 and the lowering of the cylinder 106, and the suction is performed by the lowering of the cylinder 107. The surface position of the plate 100 is lowered to suck and hold the wafer W to which the adhesive sheet S is stuck. As a result, the sticking table 40 moves to a position for sucking and holding the wafer W to be processed next, and at the same time, the outer peripheral cutting table 47 is lifted and sucked onto the upper surface of the cutting table 47 by the suction plate 100. The wafer W being transferred is transferred. At this time, the wafer W that has reached the temporary attachment temperature on the sticking table 40 is subjected to a temperature adjusting action (cooling action) while being attracted to the suction plate 100, and is kept in a state of being lowered to substantially normal temperature. .

  As shown in FIG. 11, when the wafer W is transferred to and held by suction on the outer periphery cutting table 47, the transfer device 45 moves in a direction away from the upper position of the outer periphery cutting table 47 while cutting. The means 43 moves on the outer periphery cutting table 47 (see FIG. 12). Then, by moving the uniaxial robot 91 by a predetermined amount and lowering the cutter vertical cylinder 95, the cutter 96 penetrates downward at a position substantially corresponding to the outer peripheral edge of the wafer W, and the tip is received in the circumferential groove 47A. . In this state, the outer periphery cutting table 47 is rotated in a horizontal plane by the rotation mechanism 110, and the unnecessary adhesive sheet portion S1 protruding outside the outer periphery of the wafer W is cut along the circumferential direction. When this cutting is completed, the cutting means 43 moves from the upper position of the outer periphery cutting table 47 to a position where it is retracted again, while the cross arm 130 of the collecting device 50 moves onto the unnecessary adhesive sheet portion S1 and does not require the cutting. The adhesive sheet portion S1 is adsorbed and moved onto the collection box 135 to drop the unnecessary adhesive sheet portion S1. At this time, since the unnecessary adhesive sheet portion S1 is adhered to the outer table portion 40D only with a very weak adhesive force, the adsorption peeling by the recovery device 50 is not hindered.

  The transfer device 45 moves onto the outer periphery cutting table 47 so that the cross arm 130 is moved to the collection box 135 side, and after adsorbing the wafer W again, the wafer W is completely bonded via the temperature adjustment unit. Then, it is transferred to the upper surface of the bonding table 48 while being raised to a necessary temperature.

  The wafer W transferred to the bonding table 48 is controlled so that the bonding table 48 maintains a third temperature of approximately 180 ° C., whereby the bonding sheet S is completely bonded to the wafer W. Will be affected. Then, after a predetermined time has elapsed, the wafer W is sucked by the suction plate 100 of the transfer device 45 and is subjected to a temperature adjustment action for returning to normal temperature.

  The wafer W that has fallen in temperature while being attracted to the transfer device 45 is transferred to the mount table 137 that is attracting the ring frame RF, and then mounted to the ring frame RF via the dicing tape DT. In the case where the wafer W is an aggregate of chips W1 separated by tip dicing (see FIG. 16), the mount table 137 is rotated by a predetermined angle in the horizontal plane so that the central axis CL of the pressing roll 144 is The dicing tape (mount tape) DT is pasted on the adhesive sheet S in such a state that it is controlled so as not to be parallel to any side of any chip W. As a result, the wafer W is not inclined by the pressing force of the pressing roll 144, and the mounting tape can be attached with high accuracy.

The workpiece K on which the wafer W is mounted on the ring frame RF is transferred to the peeling table 156 in a state where the front and back are reversed. As shown in FIG. 21A, the protective tape PT is peeled off by lowering the peeling head portion 166 to adhere the lowermost portion of the first roll 174 and the end portion WE of the wafer W to each other. Then, while the winding motor M7 is kept in a stopped state, the support roll 164 is rotationally urged to apply tension to the peeling tape ST1 with a small force in a direction opposite to the feeding direction of the peeling tape ST1. Keep it.
Although so that the peeling table 156 peeling tape ST1 move relatively to the right side in FIG. 21 is fed out in response to hand peeling head portion 166, the winding motor M7 is at this point stopped Since it is maintained, a bent portion is formed on the peeling tape ST1 (see FIG. 21B).

As shown in FIG. 21C, when the bent portion formed on the peeling tape ST1 enters the gap C1, an initial peeling angle α1 is formed. In addition, in order to form the initial peeling angle (alpha) 1 reliably, you may repeat the process of FIG. 21 (A)-(C) 2-3 times.
When the initial peeling angle α1 is formed, the motor M7 is driven, and the peeling tape ST1 is exactly along the outer peripheral surface of the first roll 174 (see FIG. 21D). In this way, in a state where the peeling tape ST1 is exactly along the outer peripheral surface of the first roll 174, the next peeling angle α2 (see FIG. 22) determined by the roll diameter is maintained, and the protective tape PT is attached to the wafer W. It will peel to the edge part on the opposite side. FIG. 22 shows a case where the bump B is formed on the circuit surface of the wafer W. When the protective tape PT is provided on the bump B, the adhesive 178 existing between the bumps B is shown. Can be peeled off by being attached to the protective tape PT without remaining on the wafer W by acting so as to be pulled upward by the next peeling angle α2. Even if there is no bump on the wafer W, the peeling starts at the initial peeling angle α1, so that even if the subsequent peeling angle α2 is smaller than the initial peeling angle α1, the wafer W is cracked. There is no stress applied. This is because when the sheet affixed to a thin plate material such as a wafer is peeled off, the initial peeling angle is the most problematic, and the next peeling angle after the peeling is started causes cracks and the like. This is because the factor is low. Thereafter, the UV-cured protective tape PT is peeled off from the wafer circuit surface by the tape peeling device 18 and accommodated in the stocker 19.

  As described above, according to the embodiment of the present invention, in particular, even when the protective tape attached to the circuit surface side of the chip having the bumps B is peeled off, the initial peeling is performed in the wafer surface direction. It is possible to avoid stress on the wafer by performing as large a peeling angle as possible, and after the initial peeling is completed, it is present between the bumps B by peeling off the protective tape PT at the next peeling angle α2 with a relatively small angle. It is possible to prevent the adhesive 178 of the protective tape PT from being left between the bumps B due to the peeling force that the adhesive 178 to be pulled is pulled out almost upward with respect to the surface of the wafer W.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, the peeling head unit 166 in the above embodiment is not limited to the illustrated configuration example, and the initial peeling angle can be formed by performing an operation of bending the peeling tape ST1, and then the next peeling angle can be formed. A structure that does this is sufficient. In addition, the initial peeling angle α1 can be determined within a range that does not damage the peeling target object when the protective tape PT is peeled off from the end WE of the peeling target object such as the wafer W. The next peel angle α2 is smaller than the initial peel angle α1, and can be determined within a range in which the remaining of the adhesive or the like can be eliminated as much as possible. Further, as disclosed in Japanese Patent Application No. 2004-128214, when the first roll 174 comes into contact with the protective tape PT on the surface of the peeling table 156 (see FIG. 21A), it is for peeling. A groove for preventing the tape ST1 from adhering to the upper surface of the dicing tape DT can be provided on the upper surface of the peeling table 156 along the outer periphery of the wafer W.

  Further, when the protective tape PT is peeled off, the peeling tape ST1 may be configured to peel off the protective tape PT by winding the peeling tape ST1 in a state of being bonded to substantially the entire area along the radial direction of the wafer W.

  Furthermore, the peeling object of the peeling apparatus according to the present invention is not limited to the wafer W, and can also be applied to the case where the sheet or the like is peeled from the object to which the sheet or film is attached.

1 is a schematic plan view showing an overall configuration of a work processing apparatus according to a first embodiment. Schematic cross-sectional view for explaining the wafer processing process over time The front view which shows the initial stage process of a wafer, and a sticking apparatus. The schematic perspective view of a sticking apparatus. The schematic front view which shows the initial stage which temporarily attaches an adhesive sheet. The schematic front view when attaching an adhesive sheet temporarily and cut | disconnecting the said sheet | seat in the width direction. The schematic perspective view which shows a sticking table and a interlocking mechanism. FIG. 8 is a partial cross-sectional view of FIG. 7. The schematic front view which shows operation | movement of a cutting | disconnection means. The schematic front view which shows the state which transfers a wafer from the sticking table to the table for outer periphery cutting. FIG. 11 is a schematic front view showing the next stage of FIG. 10. The schematic front view which shows the state which cut | disconnects the sheet | seat part which remains on the wafer outer periphery transferred by the outer periphery cut table. The schematic plan view which shows the area | region which transfers a wafer by the transfer apparatus. The schematic front view of a mounting apparatus. The schematic front view which shows the transfer state of the workpiece | work which mounted the wafer to the ring frame. (A) is a top view which shows the positional relationship with a press roll when a semiconductor wafer is separated into chips, (B) is a schematic sectional view in the middle of the mounting process of the separated wafer. The schematic plan view of a mounting apparatus. The schematic front view of a tape peeling unit. The schematic front view which shows the initial stage which peels a protective tape with a tape peeling unit. The schematic front view which shows the last stage in which the said protective tape peels. (A)-(D) are operation | movement explanatory drawings of the said tape peeling apparatus. (A) is sectional drawing which shows the initial peeling angle and the next peeling angle of a protective tape, (B) is an expanded sectional view of the wafer with a bump after peeling a protective tape. (A) is schematic sectional drawing which shows the case where it peels with the conventional peeling apparatus which peels the protective tape affixed on the wafer with a bump, (B) is a partial expanded sectional view of FIG. 23 (A), (C) FIG. 3 is an enlarged cross-sectional view showing a state after peeling off the protective tape.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Wafer processing apparatus 16 Tape sticking unit 17 Tape peeling unit 156 Stripping table 164 Support roll (supply part)
165 Winding roll (winding part)
166 Peeling head portion 174 First roll 175 Second roll 178 Adhesive B Solder bump C Gap W Semiconductor wafer (peeling object)
PT protective tape ST1 peeling tape α1 initial peeling angle α2 next peeling angle

Claims (5)

  1. A peeling table that supports a peeling object to which a protective tape is attached, and a tape peeling unit that is disposed above the peeling table and is relatively movable along the surface of the peeling object. In the peeling device provided with the protective tape so as to be peelable by adhering and winding the peeling tape fed from the tape peeling unit to the protective tape,
    The tape peeling unit includes a peeling tape supply unit, a peeling tape winding unit, and a peeling head unit positioned between the supply unit and the winding unit,
    The peeling head portion is bent in a direction in which the peeling tape is reversed at an end position of the peeling object to form an initial peeling angle that causes the peeling direction to follow the surface of the peeling object, while the folded peeling tape The peeling device is characterized in that the protective tape is peeled off by forming a next peeling angle smaller than the initial peeling angle by winding up.
  2. A peeling table that supports a peeling object to which a protective tape is attached, and a tape peeling unit that is disposed above the peeling table and is relatively movable along the surface of the peeling object. In the peeling device provided with the protective tape so as to be peelable by adhering and winding the peeling tape fed from the tape peeling unit to the protective tape,
    The tape peeling unit includes a supply unit for a peeling tape, a first roll for bonding the peeling tape to the surface of the protective tape, and a position where the first roll adheres to the protective tape. Including a second roll forming a gap, and a winding portion of the peeling tape,
    The peeling tape between the first roll and the second roll is partially loosened and bent between the second roll and the protective tape in the direction of reversing to form an initial peeling angle. Made possible
    A peeling apparatus characterized in that after the protective tape is peeled off at the initial peeling angle, the protective tape can be peeled off at the next peeling angle smaller than the initial peeling angle by the first roll.
  3. A peeling table for supporting a semiconductor wafer having a bump on the circuit surface and a protective tape affixed to the circuit surface, and a protective tape affixing surface of the semiconductor wafer disposed above the peeling table. And a tape peeling unit provided so as to be relatively movable along the tape, and a peeling device provided with the protective tape so as to be peelable by adhering and winding the peeling tape fed from the tape peeling unit to the protective tape In
    The tape peeling unit includes a peeling tape supply unit, a first roll for bonding the peeling tape to the surface of the protective tape, and the protective tape at a position where the first roll adheres to the protective tape. Including a second roll forming a gap, and a winding portion of the peeling tape,
    The peeling tape between the first roll and the second roll is partially loosened and bent between the second roll and the protective tape in the direction of reversing to form an initial peeling angle. Made possible
    A peeling apparatus characterized in that after the protective tape is peeled off at the initial peeling angle, the protective tape can be peeled off at the next peeling angle smaller than the initial peeling angle by the first roll.
  4. In a peeling method in which the protective tape is peeled off by adhering a peeling tape to the protective tape attached to the surface of the peeling object,
    Adhering a peeling tape to the protective tape, forming the initial peeling angle by bending the peeling tape in the direction of reversing at the end position of the object to be peeled,
    The end of the protective tape is peeled off from the end of the object to be peeled at the initial peeling angle,
    Next, the peeling method characterized in that the protective tape is peeled off while maintaining a next peeling angle smaller than the initial peeling angle.
  5. In the peeling method in which bumps are formed on the circuit surface of the semiconductor wafer and the protective tape is peeled off by applying a peeling tape to the protective tape attached to the circuit surface,
    Adhering the peeling tape to the edge position of the wafer,
    In a state where the winding operation of the peeling tape is stopped, a pulling force is applied to the feeding side peeling tape on the side opposite to the winding direction,
    Folding the peeling tape on the feeding side little by little and generating a slack in the peeling tape, bending the peeling tape in the direction of reversing to form an initial peeling angle,
    Next, after winding up the peeling tape at the initial peeling angle and peeling off the end of the protective tape,
    The peeling method characterized by winding up the bent part and peeling off the protective tape at a next peeling angle smaller than the initial peeling angle.
JP2004133068A 2004-04-28 2004-04-28 Peeling apparatus and peeling method Active JP4485248B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004133068A JP4485248B2 (en) 2004-04-28 2004-04-28 Peeling apparatus and peeling method

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2004133068A JP4485248B2 (en) 2004-04-28 2004-04-28 Peeling apparatus and peeling method
EP20050737251 EP1742255B1 (en) 2004-04-28 2005-04-27 Sheet peeling apparatus and peeling method
US11/587,854 US7846289B2 (en) 2004-04-28 2005-04-27 Sheet peeling apparatus and sheet peeling method
CN 200580013436 CN100449701C (en) 2004-04-28 2005-04-27 Peeling device and peeling method
KR1020067021151A KR20070011372A (en) 2004-04-28 2005-04-27 Sheet peeling apparatus and peeling method
PCT/JP2005/007950 WO2005106937A1 (en) 2004-04-28 2005-04-27 Sheet peeling apparatus and peeling method
SG200902586-7A SG152245A1 (en) 2004-04-28 2005-04-27 Sheet peeling apparatus and sheet peeling method
TW094113480A TWI349952B (en) 2004-04-28 2005-04-27
MYPI20051883 MY139623A (en) 2004-04-28 2005-04-28 Sheet peeling apparatus and sheet peeling method

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JP4485248B2 true JP4485248B2 (en) 2010-06-16

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JP4841262B2 (en) * 2006-02-13 2011-12-21 株式会社東京精密 Wafer processing equipment
JP4693696B2 (en) 2006-06-05 2011-06-01 株式会社東京精密 Work processing device
JP4964070B2 (en) 2007-09-10 2012-06-27 日東精機株式会社 Protective tape peeling method and protective tape peeling apparatus
JP4740296B2 (en) * 2008-08-28 2011-08-03 リンテック株式会社 Sheet peeling apparatus and peeling method
JP5149122B2 (en) * 2008-10-22 2013-02-20 リンテック株式会社 Sheet peeling apparatus and peeling method
JP5296497B2 (en) * 2008-11-06 2013-09-25 リンテック株式会社 Support device pasting device and support pasting device for plate member
JP4961488B2 (en) * 2010-05-24 2012-06-27 長野オートメーション株式会社 Protective film peeling method and protective film peeling apparatus
KR101148766B1 (en) * 2010-10-25 2012-05-25 삼성전기주식회사 Detach device of film
JP5882577B2 (en) * 2010-12-06 2016-03-09 スリーエム イノベイティブ プロパティズ カンパニー Film sticking method, back grinding method, semiconductor chip manufacturing method, and film sticking apparatus
KR101857288B1 (en) * 2011-08-26 2018-05-14 삼성디스플레이 주식회사 Methods and apparatus for peeling a donor film from a substrate
JP5808721B2 (en) * 2012-09-07 2015-11-10 東京エレクトロン株式会社 peeling system
CN103317824A (en) * 2013-06-19 2013-09-25 深圳市华星光电技术有限公司 Release paper stripping device
JP2016160072A (en) * 2015-03-04 2016-09-05 株式会社ジャパンディスプレイ Peeling device and peeling head
CN105172320B (en) * 2015-09-30 2017-07-07 泉州大昌纸品机械制造有限公司 Disposable beautifying face articles for use stripping off device and preparation method thereof
CN106183359B (en) * 2016-08-30 2018-09-25 深圳市兴图科技有限责任公司 A kind of dyestripping mechanism and equipment
CN106450469B (en) * 2016-09-26 2019-09-27 东莞市骏智机电科技有限公司 A kind of lithium battery flexibility dyestripping method
CN106864897B (en) * 2017-04-21 2019-05-17 合肥京东方显示光源有限公司 A kind of optical diaphragm cleaning system

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JPH0691153B2 (en) * 1987-11-28 1994-11-14 日東電工株式会社 Method of removing the protective film
JP4166920B2 (en) * 2000-02-24 2008-10-15 リンテック株式会社 Sheet peeling apparatus and method
JP2001319906A (en) * 2000-05-11 2001-11-16 Takatori Corp Device for peeling wafer surface protective tape

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