JP5501062B2 - Sheet sticking device and sticking method - Google Patents

Description

  The present invention relates to a sheet sticking apparatus and a sticking method for sticking a sheet to an adherend.

Conventionally, in a semiconductor manufacturing process, a sheet sticking apparatus for sticking an adhesive sheet such as an adhesive tape on the surface of a semiconductor wafer as an adherend (hereinafter sometimes simply referred to as a wafer) has been used (for example, Patent Document 1). reference). In this sheet sticking apparatus, with the adhesive sheet placed above the surface of the wafer held on the chuck table, the sticking roller rolls on the adhesive sheet to stick the adhesive sheet to the wafer surface, and the adhesive sheet that is stuck Is cut with a cutter blade along the outer edge of the wafer.
Further, a cutting apparatus that cuts an adhesive sheet along the outer edge of the wafer and also cuts a portion of the adhesive sheet along the notch for a wafer on which a V-shaped notch as a bearing mark indicating a crystal orientation is formed. Used (see, for example, Patent Document 2).

JP 2004-47976 A JP 2009-125871 A

  However, when the attached adhesive sheet is cut along the outer edge of the wafer with the cutter blade as in the devices described in Patent Document 1 and Patent Document 2, the force that the cutter blade advances is applied in the surface direction of the adhesive sheet, and the bonding is performed. A phenomenon occurs in which a part of the adhesive sheet is peeled off from the wafer due to deformation so that the cut edge region of the sheet is raised. Such a phenomenon becomes prominent when the cutter blade is worn or damaged. When the wafer with the adhesive sheet attached in such a state is processed in, for example, a back grinding process, the cleaning water for grinding enters the wafer surface side from the position where the adhesive sheet is peeled off, and is formed on the wafer surface. The inconvenience of damaging the circuit occurs. In particular, in a wafer in which a V-shaped notch is formed as described in Patent Document 2, when the adhesive sheet is cut along the notch shape, the cutter blade is forcibly changed along the notch shape. Therefore, when the adhesive sheet is pushed or pulled in the surface direction, the adhesive sheet around the notch is easily peeled off from the wafer, and the cleaning water enters from the part where the adhesive sheet around the notch is peeled off, It will damage the circuit.

  The objective of this invention is providing the sheet sticking apparatus and sticking method which can prevent peeling of the cutting | disconnection edge area | region of the adhesive sheet cut | disconnected after sticking to a to-be-adhered body.

In order to achieve the above object, the sheet sticking device of the present invention is a sheet sticking device for sticking an adhesive sheet to one surface of an adherend, and the adherend exhibits a crystal orientation on a part of an outer edge. A semiconductor wafer having an orientation mark formed thereon , a supply means for supplying the adhesive sheet so as to oppose one surface of the adherend, and the adhesive sheet pressed against one surface of the adherend Pressing means, cutting means for cutting the adhered adhesive sheet along the outer edge of the adherend, and re-pressing means for pressing the cut edge region of the cut adhesive sheet against the adherend , The re-pressing means includes a pressing member that is constituted by an elastic member and re-presses the cut edge region of the adhesive sheet against only a part of the outer edge of the adherend including the region where the orientation mark is formed. Is adopted.

At this time, the sheet sticking apparatus of the present invention, before Symbol cutting means preferably cuts the adhesive sheet along the orientation mark.
Also, in the sheet sticking apparatus of the present invention, the re-pressing means is preferably configured with a heating means.

On the other hand, the sheet sticking method of the present invention is a sheet sticking method for sticking an adhesive sheet on one surface of an adherend, and the adherend is formed with an orientation mark indicating a crystal orientation on a part of the outer edge. A semiconductor wafer, supplying the adhesive sheet so as to face one surface of the adherend, pressing the adhesive sheet against one surface of the adherend, and attaching the adhered adhesive sheet the cut along the outer edge of the adherend, the pressing member formed of a resilient member, Kise' adhesive sheet before the for only a portion of the outer edge of the adherend including a region in which the orientation indicia is shaped The cutting edge region is pressed again .

  According to the present invention as described above, even when the cut edge region of the adhesive sheet may be peeled off from the adherend by cutting the adhesive sheet, the cut edge region of the adhesive sheet is adhered to the adherend by the repressing means. By pressing onto the adherend, the cut edge region of the adhesive sheet can be brought into close contact with the adherend again. Accordingly, it is possible to prevent peeling of the cut edge region of the adhesive sheet cut after being attached to the adherend. In addition, after cutting the adhesive sheet, the re-pressing means of the present invention attaches a partial area of the adherend, which is a cutting edge area, as compared with the case where the entire surface of the adherend is pressed by a member such as a pressure roller. For example, even if the adherend is ground to several tens of micrometers like a wafer or is a fragile member, excessive stress is applied to the entire adherend. The risk of damage such as cracking can be minimized.

  In addition, when a semiconductor wafer having an orientation mark formed on a part of the outer edge is used as an adherend and the adhesive sheet is cut along the orientation mark, the adhesive sheet may be pushed or pulled in the surface direction. Therefore, the cutting edge area of the adhesive sheet around the bearing mark tends to be peeled off from the wafer, but by pressing the cutting edge area of the adhesive sheet against the wafer by re-pressing means, the peeling of the adhesive sheet from the wafer is prevented. For example, in the wafer back grinding process, etc., the cleaning water enters the wafer surface side from the position where the adhesive sheet has been peeled off and damages the circuit, or the position where the adhesive sheet has been peeled off is used as a starting point. It is possible to prevent such a problem that the edge region is rolled up and the adhesive sheet is caught in a grinding blade (grinding stone) to break the wafer.

In addition, since the re-pressing means includes a pressing member having a pressing surface corresponding to the shape of the orientation mark of the wafer, the cutting edge area around the orientation mark where the cutting edge area of the adhesive sheet is particularly easy to peel off is focused on the wafer. It can be adhered.
Furthermore, since the re-pressing means includes a heating means, the adhesive sheet can be heated and the adhesive of the adhesive sheet can be softened. The degree to which it adheres to a kimono can be enlarged.

1 is an overall view of a sheet sticking device according to an embodiment of the present invention. The perspective view of the repress means provided in the sheet sticking apparatus of FIG.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the present embodiment, unless otherwise specified, terms indicating directions such as “up”, “down”, “left”, and “right” are used with reference to FIG.
In FIG. 1, a sheet sticking apparatus 1 has an adhesive sheet S on a front surface WA on which a circuit is formed on a wafer W as an adherend having a front surface WA that is one surface and a rear surface WB that is the other surface. And affixing the adhered adhesive sheet S along the outer edge WC of the wafer W. Here, a part of the outer edge WC of the wafer W is provided with a V-shaped notch K (see FIG. 2) as an orientation mark indicating the crystal orientation.

  The sheet sticking apparatus 1 supports a support unit 2 that supports the wafer W from the back surface WB side, a supply unit 5 that supplies a belt-like adhesive sheet S facing the front surface WA of the wafer W, and supports the supplied adhesive sheet S. Pressing means 6 for pressing and sticking to means 2 and the surface WA of the wafer W; cutting means 7 for cutting the adhesive sheet S attached to the wafer W along the outer edge WC of the wafer W; and the cut adhesive sheet The re-pressing means 8 presses the cutting edge region of S against the wafer W, and the control means 9 controls the operation of each part.

  The support means 2 sucks and holds the wafer W from the back surface WB side via a suction port (not shown), and has a disk-shaped table 22 having a flat support surface 21 having the same outer shape as the outer edge WC of the wafer W; A circular hole 23 is formed, and the outer peripheral table 25 having a planar view shape in which a flat flat surface 24 is formed parallel to the support surface 21 of the table 22 is fixed to the bottom surface portion 26 of the hole 23. In addition, an output shaft 27A is provided with a linear motion motor 27 as a drive device fixed to the lower surface of the table 22. The flat surface 24 is laminated with a fluororesin or the like so that the attached adhesive sheet S can be peeled off.

  The supply means 5 includes a supply side frame 5A provided on the supply side of the adhesive sheet S on the left side with respect to the support means 2, and a collection side frame 5B provided on the collection side on the right side with respect to the support means 2. And a moving frame 5C that is driven by a driving device such as a linear motor (not shown) and is movable in the left-right direction.

  The supply side frame 5 </ b> A has a support roller 51 that supports the adhesive sheet S in which the adhesive AD is laminated on the base material BS in a roll shape, and a guide roller that guides the adhesive sheet S drawn from the support roller 51. 52, a driving roller 53 that is driven by a motor 53 </ b> A as a driving device to send out the adhesive sheet S, and a pinch roller 54 that sandwiches the adhesive sheet S between the driving roller 53. The collection side frame 5B has a collection roller 55 that is driven by a driving device such as a motor (not shown) to wind up and collect unnecessary portions of the adhesive sheet S, and two guide rollers 56 that guide the unnecessary portions of the adhesive sheet S. Is provided. The moving frame 5 </ b> C is provided with a driving roller 57 driven by a motor 57 </ b> A as a driving device, and a pinch roller 58 that sandwiches the adhesive sheet S between the driving roller 57.

  The pressing means 6 is driven by a driving device such as a linear motor (not shown) and is provided so as to be movable in the left-right direction. The pressing means 6 is supported by the frame 61 and can contact the base material BS side of the adhesive sheet S. The pressing roller 62 and a driving device such as a linear motor (not shown) that moves the frame 61 up and down are provided.

  The cutting means 7 includes an articulated robot 71 as a driving device provided on the back side in FIG. 1 with respect to the supporting means 2 and a cutting blade 72 provided at the tip of the articulated robot 71. ing. The articulated robot 71 includes a base 73, a first arm 711 that is pivotally supported about the vertical axis PA (vertical axis) with respect to the base 73, and a vertical motion with respect to the first arm 711. A second arm 712 that is rotatably supported around a horizontal axis orthogonal to the axis PA (in FIG. 1, an axis perpendicular to the plane of the drawing), and an axis that is rotatable about the horizontal axis with respect to the second arm 712. A third arm 713 that is supported, a fourth arm 714 that is rotatably supported around an extension axis EA of the third arm 713, and a perpendicular to the extension axis EA with respect to the fourth arm 714 A fifth arm 715 that is rotatably supported around an axis (an axis perpendicular to the plane of the drawing in FIG. 1), and a sixth arm that is rotatably supported around an extension axis CA of the fifth arm 715 716 and the sixth a By a chuck mechanism (not shown) provided in the arm 716, the cutting blade 72 is provided so that it can support the cutter tool 74 attached.

  As shown in FIG. 2, the repressing unit 8 includes a pressing member 81 having a pressing surface 81 </ b> A corresponding to a part of the outer edge WC shape of the wafer W including the notch K of the wafer W, and a support for supporting the pressing member 81. A member 82 and an output shaft 83A are attached to the support member 82, and a linear motion motor 83 as a drive device that supports the pressing member 81 so as to be movable back and forth in the vertical direction. The support member 82 includes a heater 84 as a heating means inside, and the pressing member 81 can be heated by the heat of the heater 84. The pressing member 81 can be configured by an elastic member such as rubber or resin, or a plastic member such as metal. As in this embodiment, the pressing surface 81A has a shape corresponding to a part of the outer edge WC shape of the wafer W including the notch K, so that the unit area is larger than that of the shape corresponding to the entire outer edge WC shape. The hit pressing force can be increased, and the area around the notch K where the adhesive sheet S is easily peeled off can be focused closely on the wafer W.

  The control means 9 controls various information related to the wafer W, the adhesive sheet S, etc. based on the operation of the operator and appropriate detection means based on a control device 91 comprising a computer having arithmetic means such as a CPU and storage means such as a memory. An input means 92 for inputting to the device 91 is provided. Here, as various information, the diameter dimension and thickness dimension of the wafer W, the dimension related to the shape of the notch K, the cross-sectional shape of the outer edge WC, the R dimension, the chamfer dimension, the thickness dimension of the adhesive sheet S, and the like can be exemplified. The information may be input from the input unit 92 to the control device 91, may be automatically input to the control device 91 by a detection unit such as a sensor (not shown), or is stored in advance in the memory of the control device 91. May be. The control device 91 outputs a control command to driving devices such as the linear motion motor 27 and the articulated robot 71 according to various information.

Hereinafter, operation | movement of the sheet sticking apparatus 1 is demonstrated.
First, various information is input from the input means 92 to the control device 91, and the sheet sticking device 1 is set in a standby state. Thereafter, when the wafer W is placed on the support surface 21 of the table 22, the supply unit 5 moves the moving frame 5 </ b> C from the left side of the support unit 2 to the right while the drive roller 57 is stopped. Synchronously, the unused portion of the adhesive sheet S is fed out from the support roller 51, and unnecessary portions of the adhesive sheet S are wound up by the collection roller 55. Thereby, the adhesive AD side of the adhesive sheet S is supplied to the upper side of the front surface WA of the wafer W so as to be opposed. Next, the linear motion motor 27 that has received a command from the control device 91 raises or lowers the table 22 so that the surface WA of the wafer W and the flat surface 24 of the outer peripheral table 25 are located in the same plane. Next, the pressing means 6 drives a linear motor (not shown) to lower the pressing roller 62, and presses down the adhesive sheet S with the pressing roller 62 to press the adhesive AD surface against the flat surface 24. Further, the pressing means 6 drives a linear motor (not shown), moves the pressing roller 62 leftward to roll on the adhesive sheet S, and sequentially applies the adhesive AD surface to the flat surface 24 and the surface WA of the wafer W. Press to stick.

  After affixing the adhesive sheet S to the flat surface 24 and the surface WA of the wafer W, the cutting means 7 drives the articulated robot 71 and cuts based on the diameter dimension information of the wafer W input to the control device 91. The blade 72 is pierced into the adhesive sheet S, and the adhesive sheet S is cut along the outer edge WC of the wafer W. At this time, the control device 91 controls the operation of the articulated robot 71 and the cutter tool 74, and cuts the adhesive sheet S while appropriately changing the moving path of the cutting blade 72 and the direction of the blade edge according to the shape of the notch K. To do.

  When the adhesive sheet S is cut as described above, the cutting means 7 is retracted from the wafer W and the pressing roller 62 is raised. Next, the supply unit 5 moves the moving frame 5 </ b> C in the left direction while rotating the driving roller 57, so that the unnecessary portion of the adhesive sheet S cut along the outer edge WC of the wafer W and stuck on the flat surface 24. Is peeled off from the flat surface 24 by the driving roller 57.

  Thereafter, the repressing unit 8 drives the linear motion motor 83 to lower the pressing member 81, presses the cutting edge region of the adhesive sheet S against the wafer W, and brings the adhesive sheet S into close contact with the wafer W again. At this time, since the pressing surface 81A of the pressing member 81 presses the cut edge region of the adhesive sheet S along the outer edge WC of the notch K (see FIG. 2), the cut edge region of the adhesive sheet S is easily peeled around the notch K. The cutting edge region of the adhesive sheet S can be securely adhered to the wafer W. When the adhesive sheet S protrudes from the outer edge WC including the notch K, if the pressing member 81 is formed of an elastic member, the pressing member 81 is deformed so as to follow the shape of the outer edge WC. Therefore, the adhesive sheet S can be attached around the outer edge WC. Further, the adhesive AD of the adhesive sheet S is softened by the heat of the heater 84, so that the adhesive AD of the adhesive sheet S can be easily adapted to the wafer W. Therefore, the adhesive sheet S can be securely adhered to the outer edge WC region of the wafer W including the notch K portion.

  The wafer W to which the adhesive sheet S is affixed is unloaded by an appropriate transfer device and sent to a subsequent process such as back grinding. Thereafter, when the next wafer W is supported by the support means 2, the same operation as described above is repeated thereafter.

According to this embodiment as described above, the following effects are obtained.
That is, the adhesive sheet S can be brought into close contact with the outer edge WC region of the wafer W including the notch K portion by pressing the cutting edge region of the adhesive sheet S against the wafer W by the repressing means 8. Peeling of the cutting edge region can be prevented. Therefore, for example, even when the back surface WB is ground in a subsequent process, it is possible to prevent the cleaning water from entering from the outer edge WC. Furthermore, since the adhesive sheet S can be brought into close contact with the outer edge WC region of the wafer W, the cutting edge of the adhesive sheet S hinders the operation of the grinding blade during the subsequent grinding, or the adhesive sheet S is rolled up. It is possible to avoid inconveniences such as loosening and to prevent the wafer W from being damaged.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

For example, in the above-described embodiment, the case where the adherend is the wafer W is shown. However, the adherend is not limited to the wafer W, and other members such as a glass plate, a steel plate, or a resin plate are also included. Examples of the wafer W include silicon semiconductor wafers and compound semiconductor wafers.
The adhesive sheet S may be a sheet for mounting, a protective sheet, a dicing tape, a die bonding tape, or other various sheets, tapes, or films attached to a semiconductor wafer, and the adherend is not a semiconductor wafer. In the case of a member, a sheet for an appropriate use such as a surface coating sheet or film, or a decorative sheet can be used.

  The shape of the pressing surface 81A of the pressing member 81 is not limited to the shape of the above embodiment. For example, when the orientation mark formed on the wafer W is an orientation flat, the pressing surface 81A The shape can be a shape corresponding to the outer edge WC shape of the wafer W including the orientation flat. It is not excluded to re-press the portion of the wafer W where there is no orientation mark. Further, a wafer W that does not have an orientation mark may be used as an adherend. Furthermore, the shape of the pressing surface 81A of the pressing member 81 may not be formed in a shape corresponding to the bearing mark, or may be provided in a shape that can press the entire outer edge WC region of the wafer W. The shape of the pressing surface 81A of the pressing member 81 may be other shapes such as a U shape or a semicircular shape.

In addition to the heater 84, the heating means may be constituted by hot air, hot water, a discharge heater, an infrared heater, or the like.
In addition, grinding the back surface of the adherend in a subsequent process is not an essential requirement of the present invention, and the back surface may not be ground. Even when the back surface is not ground in this way, effects such as adhesion of the outer edge can be obtained by bringing the adhesive sheet into close contact with the outer edge of the adherend.

  Furthermore, the drive device in the embodiment employs an electric device such as a rotation motor, a linear motion motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. (Some overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1 Sheet sticking apparatus 2 Support means 5 Supply means 6 Press means 7 Cutting means 8 Repress means 9 Control means 81 Press member 81A Press surface 84 Heater (heating means)
S Adhesive sheet W Wafer (Substrate)
WA surface (one side)
WC outer edge K notch

Claims (4)

A sheet sticking device for sticking an adhesive sheet on one surface of an adherend,
The adherend is a semiconductor wafer in which an orientation mark indicating a crystal orientation is formed on a part of an outer edge;
Supply means for supplying the adhesive sheet so as to face one surface of the adherend;
A pressing means for pressing and sticking the adhesive sheet to one surface of the adherend;
Cutting means for cutting the adhered adhesive sheet along the outer edge of the adherend;
Re-pressing means for pressing the cut edge region of the cut adhesive sheet against the adherend ,
The re-pressing means includes a pressing member that is constituted by an elastic member and re-presses the cut edge region of the adhesive sheet against only a part of the outer edge of the adherend including the region where the orientation mark is formed. The sheet sticking apparatus characterized by the above-mentioned. Before SL cutting means, the sheet sticking apparatus according to claim 1, characterized in that cutting the adhesive sheet along the orientation mark. The re-pressing means, the sheet sticking apparatus according to claim 1 or claim 2, characterized in that it is configured with the heating means. A sheet attaching method for attaching an adhesive sheet to one surface of an adherend,
The adherend is a semiconductor wafer in which an orientation mark indicating a crystal orientation is formed on a part of an outer edge;
Supply the adhesive sheet to face one surface of the adherend,
Press and affix the adhesive sheet to one surface of the adherend,
Cutting the affixed adhesive sheet along the outer edge of the adherend,
A pressing member formed of a resilient member, and characterized in that re-presses the cut edge region of the front Kise' adhesive sheet for only part of the outer edge of the adherend including the orientation indicia is shaped region How to stick sheets.

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