JP6216583B2 - Sheet sticking device and sticking method - Google Patents

Description

  The present invention relates to a sheet sticking apparatus and a sticking method.

2. Description of the Related Art Conventionally, a sheet sticking apparatus for sticking an adhesive sheet to a semiconductor wafer (hereinafter sometimes simply referred to as “wafer”) in a semiconductor manufacturing process is known (see, for example, Patent Document 1).
The sheet sticking apparatus described in Patent Document 1 includes a tape supply unit that supplies an adhesive tape (adhesive sheet) to face a wafer (adhered body), an adhesive unit that attaches the adhesive tape to the wafer, and an outer shape of the wafer. A tape cutting mechanism that cuts out the adhesive tape along the tape, and is configured to wind up the cut-out hole portion of the adhesive tape, supply the unused portion of the adhesive tape to the wafer, and attach the adhesive tape to the wafer .

JP 2007-227552 A

  However, in the conventional sheet sticking apparatus as described in Patent Document 1, if the interval between the cutout holes of the adhesive sheet is wide, the adhesive sheet is wasted, and the adherend can be attached with one adhesive sheet. There is a disadvantage that the number of

  An object of the present invention is to provide a sheet sticking apparatus and a sticking method capable of increasing the number of adherends that can be stuck with one adhesive sheet.

  The sheet sticking apparatus of the present invention includes a supply means for supplying an adhesive sheet to a position facing an adherend surface of an adherend, a pressing means for pressing and sticking the adhesive sheet to the adherend surface, and the adhesive sheet. A cutting means for cutting out into a predetermined shape, the cutout hole of the adhesive sheet formed by cutting out the cutting means is adjacent to the outer edge of the next adherend, and the adhesion to the adherend surface of the next adherend It is provided so that a sheet can be attached.

  Further, the sheet sticking device of the present invention includes a supply means for supplying an adhesive sheet to a position facing the adherend surface of the adherend, a pressing means for pressing and sticking the adhesive sheet to the adherend surface, and the adhesive Cutting means for cutting the sheet into a predetermined shape, the cutout hole of the adhesive sheet formed by the cutting of the cutting means is located on the adherend surface inside the outer edge of the next adherend, the next The adhesive sheet is provided on the adherend surface of the adherend so as to be pastable.

  The sheet sticking apparatus of the present invention includes support means for supporting the adherend, and the support means attaches the adherend so that an outer edge of the adherend is at a predetermined position with respect to the cutout hole. It is preferable that the positioning is provided.

  The sheet sticking method of the present invention includes a step of supplying an adhesive sheet to a position facing the adherend surface of an adherend, a step of pressing and sticking the adhesive sheet to the adherend surface, and the adhesive sheet having a predetermined shape. A cutting step for cutting the adhesive sheet, the cutout hole of the adhesive sheet formed by the cutting in the cutting step is adjacent to the outer edge of the next adherend, and the adhesive sheet is attached to the adherend surface of the next adherend. It is affixed.

  The sheet sticking method of the present invention includes a step of supplying an adhesive sheet to a position facing the adherend surface of an adherend, a step of pressing and sticking the adhesive sheet to the adherend surface, and the adhesive sheet. A cutting step of cutting out into a predetermined shape, the cutout hole of the adhesive sheet formed by the cutting out of the cutting step is positioned on the adherend surface inside the outer edge of the next adherend, and the next adherend The adhesive sheet is affixed to the adherend surface of the body.

According to the present invention as described above, when the adhesive sheet is affixed to the adherend surface, the cutout hole of the adhesive sheet is positioned on the outer edge of the adherend or the adherend surface. Can be narrowed or eliminated, and the number of adherends that can be attached with one adhesive sheet can be increased.
Further, if the support means is configured to position the adherend, the position accuracy of the adherend with respect to the cut-out hole when the adhesive sheet is attached to the adherend surface can be improved.

The side view of the sheet sticking apparatus which concerns on one Embodiment of this invention. Operation | movement explanatory drawing of the sheet sticking apparatus of FIG. The partial top view of the sheet sticking apparatus of FIG. The partial top view of the sheet sticking apparatus which concerns on a modification.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In this specification, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis orthogonal to the predetermined plane. To do. Furthermore, in the present embodiment, when viewed from the near side of FIG. 1 parallel to the Y axis, when indicating the direction, “up” is the arrow direction of the Z axis, “down” is the opposite direction, “ “Left” is the arrow direction of the X axis, “Right” is the opposite direction, “Front” is the arrow direction of the Y axis, and “Back” is the opposite direction.

  In FIG. 1, a sheet sticking apparatus 1 includes a support means 2 for supporting a wafer WF as an adherend, a supply means 3 for supplying an adhesive sheet AS to a position facing the adherend surface WF1 of the wafer WF, and an adherend surface. A pressing unit 4 that presses and adheres the adhesive sheet AS to the WF 1 and a cutting unit 5 that cuts the adhesive sheet AS into a predetermined shape are provided, and are arranged in the vicinity of the transfer unit 6 that transfers the wafer WF.

  The support means 2 includes an outer table 21 having a recess 22 recessed from the unnecessary sheet support surface 21A, a linear motor 23 as a drive device provided in the recess 22, and a drive device supported by a slider 23A of the linear motor 23. A linear motor 24, a rotation motor 25 as a driving device supported by a slider 24A of the linear motor 24, and an output shaft 25A of the rotation motor 25, and a decompression unit (not shown) such as a decompression pump or a vacuum ejector. An inner table 26 having an adherend support surface 26A that can be sucked and held by a non-contact sensor such as an optical sensor and an ultrasonic sensor, a contact sensor such as a limit switch, a pressure sensor, and an imaging means such as a camera. The detection means 27 for detecting the position of the outer edge WF2 of the wafer WF and an equivalent to the detection means 27 are configured. It is, and a detectable cut-out hole detecting means 28 the position of the cut-out hole CU of the adhesive sheet AS formed by cutouts of the cutting means 5.

  The supply means 3 includes a support roller 31 that supports a belt-like adhesive sheet AS having an adhesive AD layer on one surface of the base sheet BS, a guide roller 32 that guides the adhesive sheet AS, and a rotation as a driving device. A pinch roller 34 that sandwiches the adhesive sheet AS between the driving roller 33 driven by the motor 33A, a linear motor 35 as a driving device, and a plurality of guide rollers that guide the unnecessary sheet US generated by cutting the adhesive sheet AS. 36, a collection roller 37 that is driven by a rotation motor 37A as a drive device and collects unnecessary sheets US, a linear motor 38 as a drive device supported by a slider 35A of the linear motor 35, and a slider of the linear motor 38 38A and a peeling roller 39 as a peeling member supported via a bracket 38B. That. The rollers 31 to 34 are supported by the supply side frame 3A, and the rollers 36 and 37 are supported by the collection side frame 3B.

  The pressing means 4 is a linear motor 41 as a driving device supported by the slider 35B of the linear motor 35 and a pressing member supported by the slider 41A of the linear motor 41 and driven by a rotation motor 42A as the driving device. And a pressing roller 42.

  The cutting means 5 includes an articulated robot 51 as a drive device and a cutter tool 52 having a cutter blade 53 that is detachably provided on a work arm 51A of the articulated robot 51. The multi-joint robot 51 is a so-called six-axis robot that can displace the one mounted on the work arm 51A within any work range at any position and any angle.

  The conveying means 6 includes an articulated robot 51 and a suction tool 61 that is detachably provided on a work arm 51A of the articulated robot 51 and can communicate with a decompression means (not shown) such as a decompression pump or a vacuum ejector.

In the sheet sticking apparatus 1 described above, a procedure for sticking the adhesive sheet AS to the wafer WF will be described.
First, as shown in FIG. 2A, in an initial state where the peeling roller 39 and the pressing roller 42 are located on the left side, the operator sets the adhesive sheet AS as indicated by the solid line in FIG. When an operation start signal is input via an input unit such as an operation panel or a personal computer, the supply unit 3 drives the linear motor 35 and presses and sandwiches the adhesive sheet AS between the peeling roller 39 and the pressing roller 42. The sticking device 1 enters a standby state.

  Thereafter, when the transfer means 6 drives the articulated robot 51 and the decompression means (not shown), the suction tool 61 sucks and holds the wafer WF and places the wafer WF on the adherend support surface 26A, the support means 2 A decompression means (not shown) is driven to hold the wafer WF by suction. At this time, the adherend surface WF1 of the wafer WF and the unnecessary sheet support surface 21A are positioned in the same plane. Then, the support unit 2 drives the rotation motor 25 and the detection unit 27 to rotate the wafer WF by a predetermined angle, and then drives the linear motors 23 and 24 and the rotation motor 25. Based on the detection result of the detection unit 27. Then, the wafer WF is positioned so that the outer edge WF2 of the wafer WF is at a predetermined position.

  Next, the pressing unit 4 suppresses the rotation of the rotation motor 42A, and the supply unit 3 maintains the rotation motors 33A, 37A and 37A while pressing the adhesive sheet AS between the peeling roller 39 and the pressing roller 42. The linear motor 35 is driven, the peeling roller 39 and the pressing roller 42 are moved to the position shown by the two-dot chain line in FIG. 2A, and the unused portion of the adhesive sheet AS is placed at the position facing the adherend surface WF1 of the wafer WF. Supply (feed out). Next, the supply means 3 and the pressing means 4 drive the linear motors 38 and 41, and the peeling roller 39 and the pressing roller 42 are lowered to the positions indicated by the solid lines in FIG. The AS is pressed against the unnecessary sheet support surface 21A (hereinafter, the feeding of the unused portion of the adhesive sheet AS and the pressing of the adhesive sheet AS to the unnecessary sheet support surface 21A are referred to as “feeding step”).

  Next, the supply unit 3 and the pressing unit 4 drive the linear motor 35 and the rotation motor 42A, and move the pressing roller 42 to a position indicated by a two-dot chain line in FIG. "). Thereafter, the pressure roller 42 is again returned to the position indicated by the solid line in the same manner (hereinafter referred to as “returning step”). Thereby, the adhesive sheet AS is pressed and pasted on the adherend surface WF1 and the unnecessary sheet support surface 21A. Thereafter, the cutting means 5 drives the articulated robot 51, exchanges the tool from the suction tool 61 to the cutter tool 52, and moves the cutter blade 53 along the outer edge WF2 of the wafer WF, whereby the adhesive sheet AS is removed from the wafer WF. Is cut along the outer edge WF2, and a cut-out hole CU is formed in the adhesive sheet AS from which the portion to be attached to the adherend surface WF1 is cut out (hereinafter referred to as “cutting step”).

  Next, after the transfer means 6 drives the articulated robot 51 and exchanges the tool from the cutter tool 52 to the suction tool 61, the decompression means (not shown) is driven, and the wafer WF to which the sticking sheet TS is stuck is taken into the suction tool. Adsorbed and held at 61 and transported to a separate process device (hereinafter referred to as “discharge process”). Next, the supply means 3 and the pressing means 4 drive the linear motor 35 and the rotation motor 42A, and the pressing roller 42 and the peeling roller remain in a state where the unnecessary sheet US is pressed between the pressing roller 42 and the peeling roller 39. While rotating 39, it is moved to the position shown in FIG. 2C, and the unnecessary sheet US is peeled from the unnecessary sheet support surface 21A (hereinafter referred to as “peeling step”). Thereafter, the supplying means 3 and the pressing means 4 drive the linear motors 38 and 41 to raise the peeling roller 39 and the pressing roller 42 to return to the initial state shown by the solid line in FIG. Thereafter, the same operation as described above is repeated.

  Here, in the second and subsequent feeding steps, after the feeding means 3 feeds the unused portion of the adhesive sheet AS to the position facing the adherend surface WF1 of the wafer WF in the same manner as described above, the feeding means 3 and the pressing means. 4 drives the rotation motors 33 </ b> A, 37 </ b> A and 42 </ b> A to rewind the adhesive sheet AS in the direction of the support roller 31 by a predetermined amount. When the adhesive sheet AS is pasted on the adherend surface WF1 and the unnecessary sheet support surface 21A of the next wafer WF in the next pressing step, as shown in FIG. The cutout hole CU of the adhesive sheet AS formed by the cutout is adjusted so as to be adjacent to the outer edge WF2 of the next wafer WF. Thereafter, the supply unit 3 and the pressing unit 4 drive the linear motors 38 and 41 to lower the peeling roller 39 and the pressing roller 42 to the positions indicated by the solid lines in FIG. 2B, and thereafter the same operation as described above is repeated. In the second and subsequent feeding steps, when the adhesive sheet AS is pressed against the unnecessary sheet support surface 21A by the pressing roller 42, the position of the cut-out hole CU may be deviated from the adherend surface WF1 of the next wafer WF. Therefore, before performing the pressing step, the support unit 2 drives the linear motors 23 and 24, and based on the detection result of the cutout hole detection unit 28, aligns the next wafer WF with respect to the cutout hole CU. Those shifts can be eliminated.

According to the present embodiment as described above, when the adhesive sheet AS is attached to the adherend surface WF1, the cutout hole CU of the adhesive sheet AS is disposed so that the cutout hole CU of the adhesive sheet AS is adjacent to the outer edge WF2 of the wafer WF. Can be narrowed or eliminated, and the number of wafers WF that can be attached with one adhesive sheet AS can be increased.
Further, when the cut-out hole CU is adjacent to the outer edge WF2 of the next wafer WF, the cut-out hole CU is positioned on the recess 22, so that the cutter blade 53 is pierced into the adhesive sheet AS when cutting the adhesive sheet AS. There is no need, and the cutter blade 53 having an arbitrary tip shape such as flat, curved, obtuse, and acute can be used, and versatility can be expanded.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description limited to the shape, material, etc. disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such is included in this invention.

  For example, in the second and subsequent feeding steps, when the adhesive sheet AS is pasted on the adherend surface WF1 of the next wafer WF and the unnecessary sheet support surface 21A of the support means 2 in the pressing step, FIG. As shown in (B), the supply means so that the cutout hole CU of the adhesive sheet AS formed by the cutout in the previous cutting step is positioned on the adherend surface WF1 inside the outer edge WF2 of the next wafer WF. 3 and the pressing means 4 may drive the rotation motors 33A, 37A and 42A, and adjust the adhesive sheet AS so as to rewind the adhesive sheet AS in the direction of the support roller 31. At this time, as shown in FIG. 4A, the notch VN which is a part of the outer edge WF2 of the wafer WF is entirely or partially positioned in the cutout CU, or as shown in FIG. 4B. Alternatively, the orientation flat FT, which is a part of the outer edge WF2 of the wafer WF, may be positioned in the cutout hole CU in whole or in part. At this time, the support unit 2 may drive the linear motors 23 and 24 and the rotation motor 25 to position the wafer WF so that the notch VN and the orientation flat FT are at predetermined positions in the cutout hole CU.

Further, in the second and subsequent feeding steps, after the feeding means 3 and the pressing means 4 feed the adhesive sheet AS until the cutout hole CU is at the position shown in FIG. 3, FIG. 4 (A) or FIG. 4 (B). Alternatively, the linear motor 35 and the rotation motor 42A may be driven to move the peeling roller 39 and the pressing roller 42 to the positions indicated by the two-dot chain line in FIG. 2A without feeding the adhesive sheet AS.
Further, in the second and subsequent feeding steps, the support means 2 drives the linear motors 23 and 24 and the rotation motor 25, and the cut-out hole CU of the adhesive sheet AS formed by the cut-out in the previous cutting step is used as the next wafer WF. The outer edge WF2 of the adhesive sheet AS is adjusted so as to be adjacent to the outer edge WF2, or the cutout hole CU of the adhesive sheet AS formed by cutting in the previous cutting step is adjusted to be positioned on the adherend surface WF1 of the next wafer WF. Also good.
Further, in the second and subsequent feeding steps, the support means 2, the supply means 3 and the pressing means 4 are formed by driving the linear motors 23 and 24 and the rotation motors 33A, 37A and 42A and cutting out the previous cutting process. The cutout hole CU of the adhesive sheet AS may be adjusted to be the same position as described above.

  Furthermore, the process from the feeding process to the return process may be set as follows. That is, pressing process → return process → cutting process → peeling process → discharge process. Also, pressing process → cutting process → discharge process → return process → peeling process. Also, pressing process → cutting process → returning process → discharge process → peeling process. Also, pressing process → cutting process → returning process → peeling process → discharge process.

The inner table 26 is formed of glass or resin, for example, as a whole or an outer edge, and the detection means 27 transmits the outer edge WF2 of the wafer WF so that the outer edge WF2 of the wafer WF can be detected. Good.
The detection means 27 may be configured to detect the outer edge WF2 of the wafer WF from above or from the side of the wafer WF.

The supply means 3 may employ a peeling member made of a blade material, a round bar or the like instead of the peeling roller 39.
The pressing means 4 may employ a pressing member made of a blade material, rubber, resin, sponge or the like instead of the pressing roller 42.
The adhesive sheet AS may be a sheet.

  The cutting means 5 can adopt any configuration capable of cutting the adhesive sheet AS, for example, a laser cutter, a device that can be cut by water pressure or wind pressure, or a rotary cutter that rotates and cuts. Other cutter blades may be employed. Further, the cutting means 5 may have a separate and independent configuration from the conveying means 6.

  Further, the material, type, shape and the like of the adhesive sheet AS and the adherend in the present invention are not particularly limited. For example, the adhesive sheet AS is not limited to adhesive forms such as pressure-sensitive adhesiveness and heat-sensitive adhesiveness. When a heat-sensitive adhesive is used, an appropriate heating means for heating the adhesive sheet AS. May be provided. Such an adhesive sheet AS is, for example, a single layer having only an adhesive layer, an intermediate layer between the base sheet and the adhesive layer, a cover layer on the upper surface of the base sheet, etc. Three or more layers, or a so-called double-sided adhesive sheet that can peel the base sheet from the adhesive layer may be used. The double-sided adhesive sheet comprises a single-layer or multi-layer intermediate layer. It may be a single layer or a multilayer having no intermediate layer. Examples of the adherend include, for example, foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit board, information recording substrates such as optical disks, glass plates, steel plates, ceramics, wood plates or resin plates, Arbitrary forms of members, articles, etc. can also be targeted. In addition, the adhesive sheet AS is replaced with a functional and intended reading, for example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc. Arbitrary sheets, films, tapes and the like can be attached to any adherend as described above.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, as long as the supply means can supply the adhesive sheet to the position facing the adherend surface of the adherend, the supply means is limited in view of the technical common sense at the beginning of the application and within the technical scope. (There is no explanation for other means and steps).
Further, the drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1 ... Sheet sticking apparatus 2 ... Supporting means 3 ... Supply means 4 ... Pressing means 5 ... Cutting means AS ... Adhesive sheet CU ... Cut-out hole WF ... Wafer (adhered body)
WF1 ... deposition surface WF2 ... outer edge

Claims (5)

Supply means for supplying an adhesive sheet to a position facing the adherend surface of the adherend;
A pressing means for pressing and adhering the adhesive sheet to the adherend surface;
Cutting means for cutting out the adhesive sheet into a predetermined shape,
A cutout hole of the adhesive sheet formed by the cutting of the cutting means is adjacent to the outer edge of the next adherend, and the adhesive sheet can be attached to the adherend surface of the next adherend. A sheet sticking device characterized by the above. Supply means for supplying an adhesive sheet to a position facing the adherend surface of the adherend;
A pressing means for pressing and adhering the adhesive sheet to the adherend surface;
Cutting means for cutting out the adhesive sheet into a predetermined shape,
The cutout hole of the adhesive sheet formed by the cutting of the cutting means is positioned on the adherend surface inside the outer edge of the next adherend, and the adhesive sheet is placed on the adherend surface of the next adherend. A sheet sticking device, which is provided so as to be stickable. Comprising support means for supporting the adherend,
The said support means is provided so that the said to-be-adhered body can be positioned so that the outer edge of the to-be-adhered body may become a predetermined position with respect to the said cut-out hole. The sheet sticking apparatus according to the description. Supplying an adhesive sheet to a position facing the adherend surface of the adherend;
Pressing and sticking the adhesive sheet on the adherend surface;
A cutting step of cutting the adhesive sheet into a predetermined shape,
A sheet characterized by adhering a cut-out hole of the adhesive sheet formed by cutting in the cutting step to an outer edge of a next adherend, and affixing the adhesive sheet to an adherend surface of the next adherend. Pasting method. Supplying an adhesive sheet to a position facing the adherend surface of the adherend;
Pressing and sticking the adhesive sheet on the adherend surface;
A cutting step of cutting the adhesive sheet into a predetermined shape,
The cutout hole of the adhesive sheet formed by the cutting in the cutting step is positioned on the adherend surface inside the outer edge of the next adherend, and the adhesive sheet is placed on the adherend surface of the next adherend. A sheet sticking method characterized by sticking.

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