JP2010165881A - Holding device for semiconductor wafer, and holding methodtherefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a holding device capable of avoiding damage such as cracks of a wafer by using a receiving member, which supports the wafer in one body, and holding the receiving member to indirectly hold the wafer when the wafer is processed. <P>SOLUTION: The holding device 10 is composed of: the receiving member 12 which supports the semiconductor wafer W; and a table 14 having a receiving portion 13 for receiving the receiving member 12. The holding device 10 includes a positioning means 15 for moving the receiving member 12 along an X axis and a Y axis. Further, the table 14 is provided so as to align the semiconductor wafer W through an alignment means 16. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a semiconductor wafer holding apparatus and holding method, and more particularly to a semiconductor wafer holding apparatus and holding method capable of holding a semiconductor wafer via a receiving member.

Semiconductor wafers (hereinafter simply referred to as “wafers”) are ground to a thickness of several tens of μm and subjected to various treatments. The processing of the wafer thus thinned is performed in a state where it is held by a holding device such as a table, and is transferred between the processing steps via means such as a transfer arm.
Patent Document 1 discloses a configuration in which a protective sheet is peeled in a state where a wafer having a protective sheet attached to the device forming surface is held on a peeling table. The wafer is transferred from the carrier to the peeling table via a transfer arm or the like.

Japanese Patent Laid-Open No. 5-116837

  However, in the configuration described in Patent Document 1, the wafer is directly held on the peeling table, and the wafer is broken before the wafer taken out from the carrier is transferred to the peeling table. There is an inconvenience.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and an object of the present invention is to use a receiving member that is held integrally with the wafer and hold the receiving member when processing and transferring the wafer. Another object of the present invention is to provide a semiconductor wafer holding apparatus and holding method capable of avoiding damage such as cracking of the wafer by indirectly holding the wafer.

  In order to achieve the above object, a semiconductor wafer holding device according to the present invention comprises a receiving member that supports a semiconductor wafer, and a table having a receiving portion that receives the receiving member together with the semiconductor wafer. ing.

In the present invention, a positioning means may be provided in the receiving portion, and the positioning means may be configured to position the receiving member at a predetermined position of the receiving portion.
At this time, the positioning means may be configured such that the receiving member is movable in two orthogonal biaxial directions in a plane, and the outer edge of the receiving member is provided so as to abut against the inner forming edge of the receiving portion. preferable.

  The receiving member may include a through hole, and the table may include a suction unit that sucks the semiconductor wafer through the through hole.

  Further, the semiconductor wafer may further include alignment means.

  In addition, it is possible to adopt a configuration in which a lifting / lowering means is further included and the semiconductor wafer is provided so as to be lifted / lowered through the receiving member.

  Furthermore, in the semiconductor wafer holding method according to the present invention, when the semiconductor wafer is held on the table, the semiconductor wafer is placed on a predetermined receiving member, and the semiconductor wafer is held on the table via the receiving member. The technique of letting it take is adopted.

According to the present invention, since the receiving member that supports the semiconductor wafer is received by the receiving portion of the table, the damage member due to the direct holding of the semiconductor wafer is avoided by transporting the receiving member together with the semiconductor wafer. can do.
In addition, since the receiving member is positioned by the positioning means provided in the receiving portion, the semiconductor wafer is positioned via the receiving member, and the position of the semiconductor wafer when the semiconductor wafer is subjected to a predetermined process is accurately maintained. Can do.
Further, by adopting a configuration in which the semiconductor wafer is sucked through the through hole provided in the receiving member, the position of the semiconductor wafer can be fixed at a predetermined position when various processes are performed on the semiconductor wafer. Become.
Further, in the configuration in which the alignment means is provided, even if the semiconductor wafer is mounted on the receiving member positioned by the positioning means so as to be displaced from the predetermined position, the semiconductor wafer is directed to the predetermined position and the predetermined direction. Various processes can be performed on the semiconductor wafer.
Furthermore, if the receiving member can be raised and lowered via the lifting means, the upper surface position of the semiconductor wafer can be adjusted according to the thickness of the receiving member and / or the thickness of the semiconductor wafer.

The schematic front view which shows the whole structure by which the holding | maintenance apparatus which concerns on embodiment was applied to the sheet sticking apparatus. (A) is a principal part schematic perspective view of a holding | maintenance apparatus, (B) is a schematic perspective view of a receiving member.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic front view in which the semiconductor wafer holding device according to this embodiment is applied to a sheet sticking device, and FIG. 2 is a schematic perspective view of the main part of the holding device. In these drawings, the sheet sticking apparatus includes a wafer W holding device 10 and a sheet sticking means 11 provided above the holding device 10 so as to be separated and approachable to the holding device 10 via a frame (not shown). Configured. The holding device 10 includes a receiving member 12 for supporting the wafer W, a table 14 having a receiving portion 13 for receiving the receiving member 12 together with the wafer W, positioning means 15 for positioning the receiving member 12, and the center of the wafer W. It includes an alignment means 16 that detects the position and the V notch indicating the crystal orientation and directs the wafer W in a predetermined direction.

  As shown in FIG. 2B, the receiving member 12 includes a plate-like support surface 20 that supports the wafer W in its entirety, and an upstanding surface 21 that is connected to one end of the support surface 20. Thus, a plurality of through holes 20 </ b> A for applying a suction force to the wafer W are formed in the support surface 20 along a circumferential direction smaller than the diameter of the wafer W. Thus, the wafer W is provided so as to be able to be transferred together with the receiving member 12.

  The table 14 includes a bottomed outer table 25 having a substantially square outline in a plan view and opening the upper end side, and an inner table 26 arranged inside the outer table 25. The inner table 26 is provided so as to be able to move up and down in the Z-axis direction via lifting means 27 made up of a linear motion motor or the like positioned between the bottom of the outer table 25. In the present embodiment, the elevating means 27 keeps the upper surface of the inner table 26 at a position lower than the upper end surface of the outer table 25, whereby the receiving portion 13 for receiving the receiving member 12 is formed. . The inner table 26 includes a chamber C therein, and a suction hole 31 is formed in the chamber C as a suction means that opens to the upper surface side of the inner table 26 and communicates with the through hole 20A of the receiving member 12. . On the other hand, a communication hole 32 connected to a decompression pump (not shown) is provided on the lower surface side of the inner table 26. Further, the inner table 26 is provided with recesses 26A at two in-plane positions, and the first linear motion motor M1 and the second linear motion motor M2 constituting the positioning means 15 are respectively disposed in the recesses 26A. .

  L-shaped brackets 34 that are movable in the Y-axis direction and the X-axis direction are fixed to the sliders 33 of the first and second linear motion motors M1 and M2, respectively. The member 12 is moved in two axes perpendicular to each other in a plane, that is, in the Y-axis direction and the X-axis direction, and the upright surface 21 serving as the outer edge of the receiving member 12 and one side edge 22 connected thereto are connected to the receiving portion 13. The receiving member 12 is positioned by abutting against the inner forming edges 30A and 30B.

  The alignment means 18 is located on the outer surface side of the bottom of the outer table 25 and supports the outer table 25 so as to be rotatable in a plane. The rotation motor M3 is moved in the X-axis direction via the slider 40. An X-axis motor M4 that can be supported, a Y-axis motor M5 that supports the X-axis motor M4 so as to be movable in the Y-axis direction via a slider 41, and a CCD camera or the like provided above the table 14 And means 43.

  The sheet sticking means 11 includes a support roller 50 that supports the belt-like adhesive sheet S having a width larger than the diameter of the wafer W so that the sheet W can be fed, and a pinch roller 52B that sandwiches the adhesive sheet S, and a driving roller 52A that is rotated by a motor M6. And a pressing roller 53 that moves in the X-axis direction by a driving means (not shown) and presses and adheres the adhesive sheet S to the wafer W, and an adhesive sheet S that is rotated by the motor M7 via the arm 58 and attached to the wafer W. A cutter blade 59 for cutting in accordance with the size of the wafer W, a peeling means 57 for peeling an unnecessary sheet portion S1 generated outside the wafer W by cutting the adhesive sheet S between a pair of pinch rollers 57A and 57B, and And a take-up roller 51 that is rotated by a motor that does not rotate and winds up the unnecessary sheet portion S1.

  Next, a method for holding the wafer W in the present embodiment will be described.

  The wafer W stored in a wafer storage carrier (not shown) is transferred to the holding device 10 together with the receiving member 12 while being supported by the receiving member 12. At this time, the sheet sticking means 11 is generally raised and kept away from the holding device 10. Further, the upper surface of the inner table 26 is kept at a position higher than the upper surface of the outer table 25.

  When the receiving member 12 is placed on the upper surface of the inner table 26, the inner table 26 is lowered so that the upper surface of the wafer W and the upper surface of the outer table 25 are located on the same plane. Thereafter, the first and second linear motors M1 and M2 are driven to advance the bracket 34 respectively, and the rising surface 21 of the receiving member 12 and one side edge 22 connected thereto are connected to the inner forming edge of the receiving portion 13. It hits 30A and 30B, respectively. As a result, the receiving member 12 is positioned on the outer table 25. At this time, the through hole 20A formed in the support surface 20 communicates with the suction hole 31 of the inner table 26, and the wafer W is sucked and held by a decompression pump (not shown).

  Next, control means (not shown) specifies the center position of the wafer W and the position of the V notch by driving the motor M3 and imaging by the imaging means 43, and the center of the wafer W matches the center of the motor M7 by driving the motors M4 and M5. The positioning is performed so that the position of the V notch is positioned in a predetermined direction by driving the motor M3 (see FIG. 2).

When the alignment is performed, the sheet sticking means 11 descends, the pressing roller 53 moves to the right along the X-axis direction in FIG. 1, and the adhesive sheet S is pressed and stuck to the wafer W. Thereafter, the cutting means 55 is lowered and the motor M7 is driven to rotate the cutter blade 59 along the outer periphery of the wafer W, whereby the adhesive sheet S is cut into a closed loop.
Next, in a state where the driving of the winding roller 51 and the driving roller 52A is locked, the peeling means 57 moves to the right side in FIG. 1, whereby the unnecessary sheet S1 on the outer peripheral side of the wafer W is peeled off, and the adhesive sheet is attached to the wafer W. S will be affixed.

  When the application of the adhesive sheet S is completed, the sheet application means 11 is raised again, and the wafer W is conveyed together with the receiving member 12 via a conveyance means (not shown).

  Therefore, according to such an embodiment, the wafer W is indirectly held by the holding device 10 via the receiving member 12, and the wafer W is also transferred via the receiving member 12. The effect that the conventional inconvenience, such as breaking, can be surely prevented is obtained.

The best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
That is, the invention has been illustrated and described with particular reference to particular embodiments, but it should be understood that the above-described embodiments are not deviated from the technical idea and scope of the invention. On the other hand, various modifications can be made by those skilled in the art in shape, quantity, and other detailed configurations.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  For example, the shape of the receiving member 12 is not limited to the illustrated configuration example, and any shape that can hold the wafer W indirectly is sufficient.

  The positioning means 15 is disposed in the recess 26A provided in the inner table 26. However, if the inner table 26 is movably supported in the X and Y axes in the outer table 25, the same positioning can be performed. It is.

  Furthermore, in the above-described embodiment, the case where the holding device 10 is applied to the sheet sticking device is illustrated and described. However, the holding device 10 according to the present invention holds the wafer W when the wafer W is processed in a predetermined manner. It can be applied to devices in general.

DESCRIPTION OF SYMBOLS 10 Holding device 12 Receiving member 13 Receiving part 14 Table 15 Positioning means 16 Alignment means 16A Through hole 27 Elevating means 30A, 30B Inner formation edge 31 Suction hole (suction means)
W Semiconductor wafer

Claims (7)

  An apparatus for holding a semiconductor wafer, comprising: a receiving member for supporting the semiconductor wafer; and a table having a receiving portion for receiving the receiving member together with the semiconductor wafer.   2. The semiconductor wafer holding apparatus according to claim 1, wherein positioning means is provided in the receiving portion, and the positioning means positions the receiving member at a predetermined position of the receiving portion.   3. The semiconductor according to claim 2, wherein the positioning means allows the receiving member to move in two orthogonal axes in a plane, and positions the outer edge of the receiving member against the inner forming edge of the receiving portion. Wafer holding device.   4. The semiconductor wafer holding device according to claim 1, wherein the receiving member includes a through hole, and the table includes suction means for sucking the semiconductor wafer through the through hole.   5. The semiconductor wafer holding apparatus according to claim 1, further comprising alignment means for the semiconductor wafer.   6. The semiconductor wafer holding apparatus according to claim 1, further comprising an elevating means, wherein the semiconductor wafer is provided so as to be able to be raised and lowered via the receiving member.   A method for holding a semiconductor wafer, wherein when the semiconductor wafer is held on a table, the semiconductor wafer is placed on a predetermined receiving member, and the semiconductor wafer is held on the table via the receiving member.

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