JP6145331B2 - Sheet sticking device and sticking method - Google Patents

Description

  The present invention relates to a sheet sticking apparatus and a sticking method for sticking an adhesive sheet to an adherend.

2. Description of the Related Art Conventionally, a sheet sticking apparatus for sticking an adhesive sheet to a semiconductor wafer (hereinafter sometimes simply referred to as “wafer”) in a semiconductor manufacturing process is known (see, for example, Patent Document 1).
The sheet sticking device described in Patent Document 1 is provided with a supply means for feeding an adhesive sheet so as to face a wafer (adhered body) having a notch (reference portion) formed on the outer edge, and the adhesive sheet is pressed against the wafer for pasting. Pressing means for cutting and cutting means for cutting the adhesive sheet, and the adhesive sheet affixed to the wafer is cut along the outer edge of the wafer.

JP 2011-198979 A

By the way, the adherend on which the adhesive sheet is pasted by the conventional sheet pasting apparatus as described in Patent Document 1 is used as a reference by the detection means even after being transported to another apparatus such as a grinding apparatus or a cutting apparatus. The part is detected, the direction is specified based on the position of the reference part, and various processes are performed.
However, when a crack or damage occurs in the adherend, the detection means of another device misrecognizes the crack or damage as a reference part, and the orientation of the adherend cannot be specified. There is an inconvenience that the treatment of the adherend is hindered.
In addition, although the method of forming a notch along the reference | standard part in the adhesive sheet stuck with the sheet sticking apparatus of patent document 1 and detecting the said notch with the detection means of another apparatus is also considered, an adhesive sheet is transparent or semi-transparent In some cases, the incision of the adhesive sheet may not be detected, and the above inconvenience may not be completely eliminated.

  An object of the present invention is to provide a sheet sticking device and a sticking method capable of sticking an adhesive sheet to an adherend so that the orientation of the adherend can be recognized by another device.

Sheet sticking apparatus of the present invention, have a direction identifying unit for identifying the orientation of the semiconductor wafer which reference portion is provided at a predetermined position, recognizing the orientation of the semiconductor wafer to the other device through the orientation specification unit a supply means for supplying an adhesive sheet is Ru can be a direction identification unit detecting means for detecting the orientation specifying unit, and the reference portion detecting means for detecting the other reference portion of the reference portion and the semiconductor wafer, wherein based on the detection result of the reference portion detecting means, positioning the semiconductor wafer as the reference part and the other reference portion is a predetermined position having a predetermined regularity positionally with respect to the orientation specifying unit And a pressing means for pressing and bonding the adhesive sheet to the semiconductor wafer .

In the sheet sticking apparatus of the present invention, the azimuth specifying section detecting means includes first detection means for detecting a position of the azimuth specifying section of one end of the adhesive sheet for the outer edge of the semiconductor wafer, the relative outer edge of said semiconductor wafer Second detection means for detecting the position of the orientation specifying part on the other end side of the adhesive sheet, wherein the reference part detection means includes third detection means for detecting the position of the reference part, and other reference parts. It is preferable to include a fourth detection means for detecting the position.

Sheet sticking method of the present invention, have a direction identifying unit for identifying the orientation of the semiconductor wafer which reference portion is provided at a predetermined position, recognizing the orientation of the semiconductor wafer to the other device through the orientation specification unit a step of supplying an adhesive sheet is Ru can be a step of detecting the azimuth specifying unit, and detecting the other reference portion of the reference portion and the semiconductor wafer, the other of said reference portion and said semiconductor wafer based on the detection results of the step of detecting the reference portion of the as the reference part and the other reference portion is a predetermined position having a predetermined regularity positionally with respect to the orientation specifying unit semiconductor A step of positioning the wafer and a step of pressing and bonding the adhesive sheet to the semiconductor wafer are performed.

According to the present invention as described above, in order to position the adherend with a predetermined law with respect to the orientation specifying portion of the adhesive sheet, the orientation of the adherend can be recognized by other devices. The sheet can be attached to the adherend.
Moreover, if the positions of the orientation specifying portions on one end side and the other end side of the adhesive sheet are positioned, the positioning accuracy of the adhesive sheet can be improved.

The side view of the sheet sticking apparatus which concerns on one Embodiment of this invention. The perspective view which shows an adhesive sheet and a to-be-adhered body.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
Note that the X axis, the Y axis, and the Z axis in this specification are orthogonal to each other, the X axis and the Y axis are axes in a horizontal plane, and the Z axis is an axis that is orthogonal to the horizontal plane. Furthermore, in the present embodiment, when viewed from the near side of FIG. 1 parallel to the Y axis, when indicating the direction, “up” is the arrow direction of the Z axis, “down” is the opposite direction, “ “Left” is the arrow direction of the X axis, “Right” is the opposite direction, “Front” is the arrow direction of the Y axis, and “Back” is the opposite direction.

  1 and 2, the sheet sticking apparatus 1 includes an adhesive sheet AS having an orientation specifying portion PD that can specify the orientation of a wafer WF as an adherend provided with a notch VN as a reference portion at a predetermined position. Supply means 2 for supplying azimuth, azimuth specifying part detecting means 3 for detecting azimuth specifying part PD, reference part detecting means 4 for detecting center WC as another reference part of notch VN and wafer WF, and reference part detection Based on the detection result of the means 4, the adherend positioning means 5 for positioning the wafer WF so that the notch VN and the center WC are at a predetermined position with a predetermined law with respect to the orientation specifying portion PD; A pressing unit 6 that presses and adheres the sheet AS to the wafer WF, a transport unit 8 that transports the wafer WF, and a cutting unit 9 that cuts the adhesive sheet AS are provided. Note that the adhesive sheet AS is formed by laminating an adhesive AD layer on one surface of the base sheet BS, and as shown in FIG. 2, the orientation specifying portion PD is formed by a straight line along the feeding direction of the adhesive sheet AS. Yes.

  The supply means 2 places the adhesive sheet AS between a support roller 21 that supports the adhesive sheet AS, a guide roller 22 that guides the adhesive sheet AS, and a drive roller 23 that is rotated by a rotation motor 23A as a drive device. A pinch roller 24 that sandwiches the adhesive sheet AS between the driving roller 26 and a driving roller 26 that is rotated by a rotating motor 26A that is supported by a slider 25A of a linear motor 25 that is a driving device. A roller 27, a plurality of guide rollers 28 for guiding an unnecessary sheet US generated by cutting the adhesive sheet AS, and a collection roller 29 that is driven by a rotation motor 29A as a driving device and collects the unnecessary sheet US. Yes. The rollers 21 to 24 are supported by the frame 2A, and the rollers 28 and 29 are supported by the frame 2B.

  The direction specifying part detecting means 3 includes a first detecting means 31 for detecting the position of the direction specifying part PD on one end side (left side) of the adhesive sheet AS, and an orientation on the other end side (right side) of the adhesive sheet AS. 2nd detection means 32 which detects the position of specific part PD. Examples of the first detection means 31 and the second detection means 32 include non-contact sensors such as optical sensors and ultrasonic sensors, contact sensors such as limit switches, pressure sensors, and imaging means such as cameras.

  The reference portion detection means 4 includes third detection means 41 that detects the position of the notch VN, and fourth detection means 42 that detects the position of the center WC of the wafer WF. Examples of the third and fourth detection means 41 and 42 include non-contact sensors such as optical sensors and ultrasonic sensors, contact sensors such as limit switches, pressure sensors, and imaging means such as cameras. In the present embodiment, the third and fourth detection means 41 and 42 are configured as a single detection means that serves as both, detects the outer edge position of the wafer WF, and sets the wafer WF at a predetermined angle within the plane. By rotating, it is possible to detect the position of the notch VN and the position of the center WC based on the outer edge position data.

  The adherend positioning means 5 includes a linear motor 52 as a driving device provided in a recess 51B recessed from the upper surface 51A side of the outer table 51, and a linear motor as a driving device supported by a slider 52A of the linear motor 52. 53, a rotation motor 54 as a driving device supported by the slider 53A of the linear motor 53, and an output shaft 54A of the rotation motor 54, and are held by suction by a decompression unit (not shown) such as a decompression pump or a vacuum ejector. And an inner table 55 having a possible support surface 55A.

  The pressing means 6 includes a linear motor 61 as a driving device supported by the slider 25 </ b> B of the linear motor 25, and a pressing roller 62 supported by the slider 61 </ b> A of the linear motor 61.

  The conveying means 8 is detachably provided on the articulated robot 81 as a driving device and the tip (working arm) of the articulated robot 81, and can be connected to a decompression means (not shown) such as a decompression pump or a vacuum ejector. 82. The multi-joint robot 81 is a so-called 6-axis robot that can be displaced at any position and at any angle within the working range.

  The cutting means 9 includes an articulated robot 81 and a cutter tool 92 having a cutter blade 91 that is detachably provided at the tip (working arm) of the articulated robot 81.

In the sheet sticking apparatus 1 described above, a procedure for sticking the adhesive sheet AS to the wafer WF will be described.
First, the adhesive sheet AS is set as shown by a solid line in FIG. Next, the azimuth specifying unit detection unit 3 drives the first detection unit 31 and the second detection unit 32, and for example, with respect to a predetermined position such as a stamp serving as a reference position engraved on the upper surface 51A of the outer table 51. Then, the front-rear direction positions of the left and right direction specifying parts PD are detected.

  Next, the transfer unit 8 drives the articulated robot 81 and a decompression unit (not shown), holds the wafer WF by suction with the suction tool 82, and places the wafer WF on the support surface 55 </ b> A of the inner table 55. Next, the adherend positioning means 5 drives the rotation motor 54 to rotate the wafer WF by a predetermined angle. During this time, the reference portion detection unit 4 drives the third and fourth detection units 41 and 42 to detect the positions of the center WC and the notch VN of the wafer WF. Next, the adherend positioning means 5 drives the linear motors 52 and 53 and the rotation motor 54, and based on the detection results of the third and fourth detection means 41 and 42, the orientation specifying part PD of the adhesive sheet AS. The wafer WF is positioned with a predetermined law. That is, as shown in FIG. 2, a straight line WL passing through the center VC of the notch VN and the center WC of the wafer WF overlaps with the orientation specifying portion PD detected by the orientation specifying portion detecting means 3, and the notch VN is on the wafer WF. The wafer WF is positioned so as to be at the right position of the center WC.

  Next, the pressing means 6 drives the linear motor 25 and moves the pressing roller 62 while rolling on the adhesive sheet AS to the position indicated by the two-dot chain line in FIG. 1 to press the adhesive sheet AS against the surface of the wafer WF. And paste it. Thereby, as shown in FIG. 2, the adhesive sheet AS is attached to the wafer WF so that the orientation specifying portion PD overlaps the straight line WL. After that, the cutting means 9 drives the articulated robot 81, exchanges the tool from the suction tool 82 to the cutter tool 92, and moves the cutter blade 91 along the outer edge of the wafer WF, whereby the adhesive sheet AS is removed from the wafer WF. Cut along the outer edge.

  Next, after the transfer means 8 drives the articulated robot 81 and exchanges the tool from the cutter tool 92 to the suction tool 82, the decompression means (not shown) is driven, and the wafer WF to which the adhesive sheet AS is attached is sucked into the suction tool. Adsorbed and held at 82 and transported to another device used in a separate process. In another apparatus, even when the notch VN cannot be detected, the adhesive sheet AS is attached to the wafer WF with a predetermined law, that is, the orientation specifying portion PD is superimposed on the straight line WL. If the law property is stored in advance, the other apparatus can recognize the orientation of the wafer WF, for example, the position of the notch VN, via the orientation specifying unit PD.

  Next, the pressing means 6 drives the linear motor 61 and raises the pressing roller 62. Next, the supply means 2 drives the rotation motor 26A and the linear motor 25, and moves the drive roller 26 to the position indicated by the two-dot chain line in FIG. 1 to peel the unnecessary sheet US from the upper surface 51A of the outer table 51. To do. Then, the supply means 2 drives the linear motor 25 and the rotation motors 23A and 29A, and moves the slider 25A to the right in a state where the rotation of the drive roller 26 is stopped, so that the unused portion of the adhesive sheet AS is removed. The unwinding sheet US is wound up by the collection roller 29 while being fed out. Thereafter, the pressing means 6 drives the linear motors 25 and 61, moves the pressing roller 62 to the position indicated by the solid line in FIG. 1, and the reference portion detection means 4 drives a driving device (not shown) to detect the third and fourth detections. The means 41 and 42 are moved to the positions indicated by the solid lines in FIG. 1, and the same operation as described above is repeated thereafter.

  According to the present embodiment as described above, the wafer WF is positioned with a predetermined law with respect to the orientation specifying portion PD of the adhesive sheet AS, so that the orientation of the wafer WF can be recognized by another apparatus. The adhesive sheet AS can be attached to the wafer WF.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

For example, in order to position the wafer WF with a predetermined law property with respect to the orientation specifying portion PD of the adhesive sheet AS, in addition to the above embodiment, for example, the orientation specifying portion PD is centered on the wafer WF with respect to the straight line WL. For example, a predetermined angle such as 10 degrees, 30 degrees, 45 degrees, and 90 degrees may be shifted around the WC in the clockwise or counterclockwise direction. It only needs to be stored in advance and allow the other apparatus to recognize the orientation of the wafer WF via the orientation specifying unit PD.
Moreover, the reference | standard part detection means 4 may comprise the 3rd detection means 41 and the 4th detection means 42 separately.

  The adherend positioning means 5 is not particularly limited as long as it positions the wafer WF with respect to the adhesive sheet AS. For example, the wafer WF sucked and held by the suction tool 82 is moved by the articulated robot 81, Both the wafer WF and the adhesive sheet AS may be moved.

  The supply means 2 may supply the adhesive sheet by peeling the adhesive sheet from the original fabric in which a plurality of adhesive sheets having a predetermined shape are temporarily attached to the release sheet, or supply a single-layer adhesive sheet on which the release sheet is not temporarily attached. May be.

  The pressing means 6 may employ a pressing member made of a blade material, rubber, resin, sponge, or the like instead of the pressing roller 62, or may be configured to press by air spraying.

  The cutting means 9 can adopt any configuration capable of cutting the adhesive sheet AS, for example, a laser cutter or a device that can be cut by water pressure or wind pressure, or a rotary cutter that rotates and cuts. Other cutter blades may be employed. Further, the cutting means 9 may be configured separately from the conveying means 8 and independent. Further, the adhesive sheet AS may be cut into a V shape along the notch VN by the cutting means 9.

  Further, the material, type, shape and the like of the adhesive sheet AS and the adherend are not particularly limited. The adhesive sheet AS is, for example, a single layer having only an adhesive AD layer, an intermediate layer between the base sheet BS and the adhesive AD layer, a cover layer on the upper surface of the base sheet BS, etc. 3 It may be a layer or more, or a so-called double-sided adhesive sheet capable of peeling the base sheet BS from the adhesive AD layer. Or a single layer or multiple layers without an intermediate layer. Examples of the adherend include, for example, foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit board, information recording substrates such as optical disks, glass plates, steel plates, ceramics, wood plates or resin plates, Arbitrary forms of members and articles can also be targeted. In addition, the adhesive sheet AS is replaced with a functional and intended reading, for example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc. Arbitrary sheets, films, tapes and the like can be attached to any adherend as described above.

Further, the configuration of the orientation specifying part PD is not particularly limited, and ink, paint, varnish, adhesive, paper, cloth, thread, resin, etc. are provided between the base sheet BS and the adhesive AD layer. Or may be formed in a concave or convex shape on the surface of the base sheet BS where the adhesive AD is laminated or on the opposite surface, or the adhesive AD layer has different characteristics. May be formed adjacent to each other in the in-plane direction of the base material sheet BS, or the surface or the inside of the base material sheet BS on the side of the adhesive AD layer or the base of the adhesive agent AD layer by laser or ultrasonic waves. You may form in the boundary of the surface by the side of material sheet BS, the inside, or base material sheet BS and adhesive agent AD layer. When the orientation specifying part PD is formed by a laser or ultrasonic wave, the base sheet BS and the adhesive AD layer are modified, altered, melted, or burned at the focal position of the output energy. By causing the color to develop, a chemical change can be caused to those constituting the adhesive sheet AS to form the orientation specifying portion PD.
Furthermore, the orientation specifying portion PD may be a planar shape having a narrow portion indicating an orientation such as an arrow, a V-shape, and a gradually narrowing straight line, or a point, a circle such as a perfect circle or an ellipse, A plurality of arbitrary planar shapes such as polygons, letters, numbers, and figures may be arranged in a predetermined direction. The point is that, regardless of the shape and shape of the orientation specifying portion PD, the wafer WF is positioned with a predetermined law with respect to the orientation specifying portion PD of the adhesive sheet AS, and the wafer WF has the predetermined law. When the adhesive sheet AS is affixed to the other, it is only necessary that another apparatus can recognize the orientation of the wafer WF via the orientation specifying unit PD.

Further, in the case of the wafer WF, the reference portion may be an orientation mark such as an orientation flat, a manufacturing number stamped on the wafer WF, a circuit pattern, a kerf, a street, or the like. It will not be limited at all as long as it serves as a mark that allows the position of the adherend to be specified with good characteristics.
Further, the other reference portions do not have to be marks. For example, in the case of the wafer WF, the outer edge position on the opposite side of the notch VN with respect to the center WC of the wafer WF, or from the notch VN to the outer edge of the wafer WF. A position separated by a predetermined distance along the other may be used as another reference portion.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, if the adherend positioning means positions the adherend so that the reference portion and the other reference portion are in a predetermined position with a predetermined law with respect to the orientation specifying portion, In view of the above technical common sense, there is no limitation as long as it is within the technical range (the description of other means and steps is omitted).
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1 Sheet sticking apparatus 2 Supply means 3 Orientation specific part detection means 4 Reference | standard part detection means 5 Adhering body positioning means 6 Pressing means 31 1st detection means 32 2nd detection means 41 3rd detection means 42 4th detection means AS Adhesive sheet PD Orientation specific part VN Notch (reference part)
WC center (other reference part)
WF Wafer (Substrate)

Claims (3)

Have a direction identifying unit for identifying the orientation of the semiconductor wafer which reference portion is provided at a predetermined position, the adhesive sheet through the orientation specifying unit Ru can recognize the orientation of the semiconductor wafer to the other device Supply means for supplying;
Azimuth specifying unit detecting means for detecting the azimuth specifying unit;
A reference portion detecting means for detecting the reference portion and another reference portion of the semiconductor wafer ;
Based on the detection result of the reference portion detecting unit, the semiconductor wafer as the reference part and the other reference portion is positionally predetermined position with a predetermined rule with respect to the orientation specifying unit An adherend positioning means for positioning;
A sheet sticking device, comprising: a pressing unit that presses and sticks the adhesive sheet to the semiconductor wafer . The azimuth specifying section detecting means, said first detecting means for detecting the position of the orientation identification unit at one end of the adhesive sheet for the outer edge of the semiconductor wafer, the other end direction of the adhesive sheet for the outer edge of the semiconductor wafer Second detection means for detecting the position of the specific part,
The said reference | standard part detection means is equipped with the 3rd detection means which detects the position of the said reference | standard part, and the 4th detection means which detects the position of the said other reference | standard part, The Claim 1 characterized by the above-mentioned. Sheet sticking device. Have a direction identifying unit for identifying the orientation of the semiconductor wafer which reference portion is provided at a predetermined position, the adhesive sheet through the orientation specifying unit Ru can recognize the orientation of the semiconductor wafer to the other device Supplying, and
Detecting the orientation specifying unit;
Detecting the reference portion and another reference portion of the semiconductor wafer ;
Based on the detection result of the step of detecting the reference part and the other reference part of the semiconductor wafer , the reference part and the other reference part have predetermined laws in position relative to the orientation specifying part. Positioning the semiconductor wafer to be in a predetermined position;
And a step of pressing and bonding the adhesive sheet to the semiconductor wafer .

Images