JP2017107944A - Sheet peeling device and peeling method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sheet peeling device capable of peeling an adhesive sheet without damaging an adherend, even if a step has been formed by a peeling tape.SOLUTION: A sheet peeling device 10 includes holding means 20 for holding a peeling tape PT, tension applying means 30 for peeling an adhesive sheet AS from an adherend WF by applying tension to the peeling tape PT, and movement regulation means 40 for regulating movement of the adherend WF in the peeling direction of the adhesive sheet AS by peeling thereof by means of the tension applying means 30, by pressing the adhesive sheet AS pasted to the adherend WF, in the direction of the adherend WF via the peeling tape PT. The movement regulation means 40 regulates movement of the adherend WF by moving the pressing part 43A of a pressing member 43 relatively in the direction of the non-retaining edge PT1 as the adhesive sheet AS is peeled, and cancels holding of the adhesive sheet AS, before the pressing part 43A reaches the non-retaining edge PT1.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a sheet peeling apparatus and a peeling method.

  2. Description of the Related Art Conventionally, there has been known a sheet peeling apparatus that pulls a peeling tape and peels an adhesive sheet from an adherend while pressing the adhesive sheet against an adherend with a pressing member (see, for example, Patent Document 1).

JP 2014-150232 A

  However, in the conventional sheet peeling apparatus as described in Patent Document 1, when peeling the adhesive sheet, the peeling tape in which the tip (pressing portion) of the second pressing member (pressing member) is located on the adhesive sheet. When passing through the end edge (non-holding edge), the pressing part falls on the adhesive sheet due to the step formed by the non-holding edge, which has the disadvantage of damaging the adherend.

  An object of the present invention is to provide a sheet peeling apparatus and a peeling method capable of peeling an adhesive sheet without damaging an adherend even if a step is formed by a peeling tape.

  In order to achieve the above object, the sheet peeling apparatus of the present invention is a sheet peeling apparatus that applies a tension to a peeling tape attached to an adhesive sheet to peel the adhesive sheet from an adherend. Holding means for holding the tape, tension applying means for applying a tension to the peeling tape to release the adhesive sheet from the adherend, and peeling the adhesive sheet attached to the adherend. A movement regulation having a pressing member that is pressed in the direction of the adherend through a tape for use and restricts movement of the adherend in the peeling direction of the adhesive sheet due to peeling of the adhesive sheet by the tension applying means. The peeling tape is affixed so that the non-holding edge opposite to the side held by the holding means is positioned on the adhesive sheet affixed to the adherend, and the movement Regulatory hand Regulates the movement of the adherend by relatively moving the pressing portion of the pressing member in the non-holding edge direction along with the peeling of the adhesive sheet, and the pressing portion is moved to the non-holding edge. A configuration is adopted in which the pressing of the adhesive sheet with the pressing member is stopped before reaching.

At this time, in the sheet peeling apparatus of the present invention, the sheet peeling device has a recognition unit capable of recognizing the position of the non-holding edge, and the movement regulating unit is configured to detect the adhesive sheet on the pressing member based on the recognition by the recognition unit. It is preferable to cancel the pressing.
Moreover, in the sheet peeling apparatus of the present invention, the tension applying unit presses the adhesive sheet peeled off from the adherend toward the adherend, and the adherend moves in the peel direction of the adhesive sheet. It is preferable that a pressing means for restricting this is provided, and when the pressing of the adhesive sheet by the movement restricting means is stopped, the pressing of the adhesive sheet is performed by the pressing means.

  On the other hand, the sheet peeling method of the present invention is a sheet peeling method in which tension is applied to a peeling tape attached to an adhesive sheet to peel the adhesive sheet from an adherend, and the peeling tape is held by a holding means. A holding step for holding, a tension applying step for applying tension to the peeling tape to release the adhesive sheet from the adherend, and an adhesive sheet affixed to the adherend by a pressing member. And a movement regulating step for regulating the movement of the adherend in the peeling direction of the adhesive sheet due to the peeling of the adhesive sheet in the tension applying step. The release tape is attached so that the non-holding edge opposite to the side held by the holding means is positioned on the adhesive sheet attached to the adherend, and the movement restricting step includes: The adhesive sheet The movement of the adherend is regulated by relatively moving the pressing portion of the pressing member in the direction of the non-holding edge with the peeling of the tape, and before the pressing portion reaches the non-holding edge. The process of canceling the pressing of the adhesive sheet with the pressing member is employed.

  According to the present invention as described above, a step is formed by the peeling tape in order to stop the pressing of the adhesive sheet by the pressing member before the pressing portion of the pressing member reaches the non-holding edge. However, the adhesive sheet can be peeled without damaging the adherend.

At this time, if a recognizing means capable of recognizing the position of the non-holding edge is employed, the pressing of the adhesive sheet with the pressing member is surely canceled before the pressing portion of the pressing member reaches the non-holding edge. Can do.
Further, if the tension applying means includes the pressing means, it is possible to restrict the adherend from moving in the peeling direction of the adhesive sheet even if the pressing by the movement restricting means is eliminated.

The side view of the sheet peeling apparatus which concerns on one Embodiment of this invention. (A)-(C) are operation | movement explanatory drawings of a sheet peeling apparatus. (A)-(C) are operation | movement explanatory drawings of a sheet peeling apparatus.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In this embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis that is orthogonal to the predetermined plane. To do. Furthermore, in the present embodiment, when viewed from the front side in FIG. 1 parallel to the Y axis, when indicating the direction, “up” is the arrow direction of the Z axis and “down” is the opposite direction, “ The “left” is the arrow direction of the X axis, “right” is the opposite direction, “front” is the front direction in FIG. 1 parallel to the Y axis, and “rear” is the opposite direction.

  In FIG. 1, the sheet peeling apparatus 10 applies tension to the peeling tape PT attached to the adhesive sheet AS and uses the adhesive sheet AS as an adherend (hereinafter simply referred to as “wafer”). ) An apparatus for peeling from the WF, the holding means 20 for holding the peeling tape PT, the tension applying means 30 for applying tension to the peeling tape PT and peeling the adhesive sheet AS from the wafer WF, and the wafer WF The attached adhesive sheet AS is pressed in the direction of the wafer WF via the peeling tape PT, and the wafer WF moves in the peeling direction of the adhesive sheet AS by the peeling of the adhesive sheet AS by the tension applying means 30. The movement restricting means 40 having the movement restricting plate 43 as a pressing member to be restricted and the opposite side of the peeling tape PT held by the holding means 20. And a recognizable recognition means 50 the position of the non-holding edges PT1 side.

  The holding means 20 sandwiches the wound peeling tape PT rotatably and the peeling tape PT supported by the tape supporting means 21 is sandwiched between the tape supporting means 21 and the peeling means PT. The feeding means 22 for applying a feeding force or a winding force to the tape PT, the lead holding means 23 for holding the lead end portion of the peeling tape PT, and assisting the lead holding means 23 to hold the peeling tape PT. A holding auxiliary means 24, a pressing means 25 for pressing and attaching the peeling tape PT held by the lead holding means 23 to the adhesive sheet AS, and a cutting means 26 for cutting the peeling tape PT are provided.

The tape support means 21 is supported on the free end side of a rotating arm 21B that can rotate about a rotating shaft 21A, and feeds the rotating arm 21B and a supporting roller 21C that supports the wound peeling tape PT. And a spring 21D as an urging means for urging in the direction of the means 22.
The feeding means 22 includes a feeding roller 22B that is driven by a rotation motor 22A as a driving device.
The lead holding means 23 is accommodated in an accommodating means 23C supported by an output shaft 23B of a linear motion motor 23A as a driving device, and through a suction hole 23E formed in an adsorption surface 23D which is a bottom surface of the accommodating means 23C. A suction means 23F such as a vacuum pump or a vacuum ejector for adsorbing and holding the peeling tape PT is provided.
The holding auxiliary means 24 includes an auxiliary roller 24C that is supported by an output shaft 24B of a direct acting motor 24A as a driving device and makes the peeling tape PT contact the suction surface 23D.
The pressing means 25 is supported by a slider 25B of a linear motor 25A as a driving device accommodated in the accommodating means 23C, and is provided with a pressing head 25C provided so as to be able to project and retract from the bottom surface of the accommodating means 23C, a coil heater, and a heat pipe. Heating means 25D on the heating side.
The cutting means 26 includes a cutting blade 26C that is supported by a slider 26B of a linear motor 26A as a driving device housed in the housing means 23C and is provided so as to protrude and retract from the bottom surface of the housing means 23C.

The tension applying means 30 includes a moving means 31 for relatively moving the peeling tape PT and the wafer WF, a guiding means 32 for guiding the adhesive sheet AS peeled from the wafer WF in a predetermined direction, and an adhesive sheet peeled from the wafer WF. The AS is pressed in the direction of the wafer WF, and the pressing means 33 for restricting the movement of the wafer WF in the peeling direction of the adhesive sheet AS and the pressing means 33 sandwich the peeling tape PT and the adhesive sheet AS. Means 34.
The moving unit 31 is supported by a slider 31B of a linear motor 31A as a driving device, and includes a table 31D having a support surface 31C that can suck and hold the wafer WF by a decompression unit (not shown) such as a decompression pump or a vacuum ejector.
The guide means 32 includes a guide roller 32C supported by a slider 32B of a linear motor 32A as a driving device.
The pressing means 33 includes a rotation motor 33C as a driving device supported by a slider 33B of a linear motor 33A as a driving device, and a pressing roller 33D supported by an output shaft (not shown) of the rotation motor 33C. ing.
The sandwiching means 34 includes a pinch roller 34C supported by an output shaft 34B of a direct acting motor 34A as a driving device.

  The movement restricting means 40 includes a rotation motor 42 as a drive device supported by a slider 41A of a linear motor 41 as a drive device, and a movement restriction plate 43 supported by an output shaft 42A of the rotation motor 42. Along with the peeling of the adhesive sheet AS, the movement of the wafer WF is regulated by relatively moving the pressing portion 43A of the movement regulating plate 43 in the direction of the non-holding edge PT1.

  The recognition means 50 is configured by control means such as a personal computer or a sequencer, and recognizes the position of the non-holding edge PT1 by storing the distance between the pressing head 25C and the cutting blade 26C. The recognizing means 50 is electrically connected to each member constituting the sheet peeling apparatus 10 by wiring not shown.

In the above sheet peeling apparatus 10, a procedure for peeling the adhesive sheet AS attached to the wafer WF will be described.
First, after the operator sets the peeling tape PT as shown by a solid line in FIG. 1, each member stands by at an initial position. With respect to the sheet peeling apparatus 10 shown by a solid line in FIG. A signal for starting automatic operation is input through an input means such as. At this time, the operator positions the lead end portion of the peeling tape PT on the right side of the cutting blade 26C. Then, after the holding means 20 drives the suction means 23F and sucks and holds the peeling tape PT on the suction surface 23D, the linear motor 26A is driven and the cutting blade 26C is moved up and down to cut the peeling tape PT. Then, when the wafer WF is placed on the support surface 31C in a state where the adhesive sheet AS is placed upward by a conveyance means (not shown) such as a human hand or an articulated robot or a belt conveyor, the tension applying means 30 is a decompression means (not shown). To start holding the wafer WF by suction. After that, the tension applying means 30 drives the linear motor 31A, moves the table 31D to the left, and positions the left end portion of the adhesive sheet AS directly below the pressing head 25C as indicated by a two-dot chain line in FIG.

  Next, the holding means 20 drives the linear motion motor 24A, and as shown by a two-dot chain line in FIG. 1, after the auxiliary roller 24C is retracted from below the accommodating means 23C, the rotation motor 22A and the linear motion motor 23A are moved. Driven and lowers the accommodating means 23C to a predetermined position directly above the adhesive sheet AS while feeding the peeling tape PT. Thereafter, the holding means 20 drives the linear motor 25A, and as shown in FIG. 2A, the pressing head 25C is lowered, and the peeling tape PT is pressed and stuck to the left end portion of the adhesive sheet AS. At this time, the holding means 20 may drive the heating means 25D to heat the peeling tape PT. When the application of the peeling tape PT to the adhesive sheet AS is completed, the holding unit 20 stops driving the suction unit 23F, drives the linear motor 25A and the linear motion motor 23A, and initially sets the pressing head 25C and the housing unit 23C. Return to position. As a result, the peeling tape PT is affixed so that the non-holding edge PT1 is positioned on the adhesive sheet AS that is affixed to the wafer WF. Since the recognition unit 50 stores the distance between the pressing head 25C and the cutting blade 26C, the recognition unit 50 recognizes the distance from the left end portion of the adhesive sheet AS to the non-holding edge PT1. It becomes.

  Thereafter, the tension applying means 30 drives the linear motion motor 34A, and after the peeling tape PT is sandwiched between the pinch roller 34C and the pressing roller 33D with a predetermined pressing force, the linear motor 31A is driven to move the table 31D to the left. The left end portion of the adhesive sheet AS is positioned immediately below the lowermost portion of the pressing roller 33D. Next, the movement restricting means 40 drives the linear motor 41 and the rotation motor 42, and as shown in FIG. 2B, the adhesive sheet AS is moved by the pressing portion 43A of the movement restricting plate 43 via the peeling tape PT. Press the left end. Next, the tension applying means 30 drives the linear motor 31A and the rotation motor 33C to move the table 31D in the left direction and rotate the pressing roller 33D in the counterclockwise direction. As a result, the adhesive sheet AS is peeled off from the wafer WF while maintaining the posture of being folded back by the pressing portion 43A of the movement restricting plate 43, as indicated by a two-dot chain line in FIG. During the peeling of the adhesive sheet AS, the tension applying means 30 drives the linear motor 32A to bring the guide roller 32C into contact with the peeling tape PT and the adhesive sheet AS fed by the pressing roller 33D and the pinch roller 34C. Then, a predetermined tension is applied to them to guide the peeling tape PT and the adhesive sheet AS in a predetermined direction (the same applies hereinafter).

  Thereafter, based on the recognition by the recognition unit 50, the movement restricting unit 40 performs an operation of stopping the pressing of the adhesive sheet AS on the movement restricting plate 43 before the pressing portion 43A reaches the non-holding edge PT1. That is, after the tension applying means 30 stops driving the linear motors 31A, 32A and the rotation motor 33C, the movement restricting means 40 drives the linear motor 41 and the rotation motor 42 to return the movement restricting plate 43 to the initial position. Let Next, the tension applying means 30 drives the linear motor 33A and presses the bent portion of the adhesive sheet AS at the lowermost portion of the pressing roller 33D as shown in FIG. Even after the pressing roller 33D moves, the pinching roller 34C and the pressing roller 33D continue to sandwich the peeling tape PT and the adhesive sheet AS with a predetermined pressing force.

  Next, the tension applying means 30 drives the linear motors 31A, 32A and the rotation motor 33C, moves the table 31D in the left direction, moves the guide roller 32C in the right direction, and rotates the pressing roller 33D in the counterclockwise direction. . Then, as shown in FIG. 3A, the adhesive sheet AS is peeled from the wafer WF while maintaining the posture in which the bent portion is pressed at the lowermost portion of the pressing roller 33D. As a result, when the pressing of the adhesive sheet AS by the movement restricting means 40 is stopped, the pressing of the adhesive sheet AS is performed by the pressing means 33. Then, as shown in FIG. 3B, when the peeling of the adhesive sheet AS is completed, the tension applying unit 30 stops driving the linear motors 31A and 32A, the decompressing unit (not shown), and the rotating motor 33C.

  Next, the holding means 20 drives the linear motion motor 24A and the suction means 23F, and as shown in FIG. 3C, the auxiliary roller 24C is returned to the initial position, and the peeling tape PT is sucked and held by the suction surface 23D. . Thereafter, the holding means 20 drives the linear motor 26A, raises and lowers the cutting blade 26C to cut the peeling tape PT, and a manual or unillustrated transfer means collects the adhesive sheet AS. When the entire adhesive sheet AS is peeled from the wafer WF, a manual or unillustrated transfer means transfers the wafer WF on the table 31D to the next process, and then each means drives each drive device, After returning to the initial position, the same operation is repeated thereafter.

  According to the embodiment as described above, a step is formed by the peeling tape PT in order to stop pressing by the movement restriction plate 43 before the pressing portion 43A of the movement restriction plate 43 reaches the non-holding edge PT1. Even if it has been done, the adhesive sheet AS can be peeled without damaging the wafer WF.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of some or all of such restrictions is included in this invention.

For example, the holding means 20 may have a configuration in which a single-sheet peeling tape is pressed against the adhesive sheet AS.
The tape support means 21 may support the peeling tape PT without being biased in the direction of the feeding means 22, and in this case, the feeding means 22 is a pinch roller that sandwiches the peeling tape PT with the feeding roller 22B. Should be adopted.
The lead holding means 23 is configured to hold the peeling tape PT by chuck means such as a mechanical chuck or a chuck cylinder, coulomb force, adhesive, adhesive, magnetic force, Bernoulli adsorption or the like instead of or in combination with the suction means 23F. Can be adopted.
The holding auxiliary means 24 can employ a configuration in which the peeling tape PT is brought into contact with the suction surface 23D by spraying a rod-like member, a plate-like member, or air instead of or in combination with the auxiliary roller 24C.
The holding auxiliary means 24 may be omitted as long as the peeling tape PT after peeling of the adhesive sheet AS can be held only by the lead holding means 23.
The pressing means 25 can employ a pressing member made of blade material, rubber, resin, sponge, air blowing, or the like, instead of or in combination with the pressing head 25C, and the peeling tape PT is bonded to pressure sensitive adhesive. In the case of a sheet, the heating means 25D may or may not be provided.
At least one of the pressing means 25 and the cutting means 26 may not be accommodated in the accommodating means 23C, and the linear motors 25A and 26A may be supported by a frame (not shown).
The biasing means may employ rubber or resin instead of or in combination with the spring 21D.
When the peeling tape PT is attached to the adhesive sheet AS by another device, the holding means 20 includes the tape support means 21, the feeding means 22, the lead holding means 23, the holding auxiliary means 24, the pressing means 25, and the cutting means 26. In place of them, a configuration may be adopted in which the peeling tape PT attached to the adhesive sheet AS is held by a drive device, suction holding, or the like.
The cutting means 26 may employ other configurations such as a laser cutter, a thermal cutter, an air cutter, and a compressed water cutter instead of or in combination with the cutting blade 26C.
When the peeling tape PT is cut by another device, the cutting means 26 may not be provided in the present invention, or the peeling tape PT may not be cut.

The tension applying means 30 may peel the adhesive sheet AS by at least one of the driving of the feeding means 22, the driving of the rotation motor 33C, the driving of the linear motor 31A, and the driving of the linear motor 32A.
The tension applying means 30 may fix the table 31D and move the holding means 20 or the like, or may move both the means and the table 31D.
The moving means 31 may be configured to support the wafer WF by chuck means such as a mechanical chuck or a chuck cylinder, Coulomb force, adhesive, adhesive, magnetic force, Bernoulli adsorption or the like.
The guiding means 32 may guide the adhesive sheet AS so that the opposite surfaces of the surface that has been in contact with the wafer WF face each other, or the adhesive sheet AS is not folded in half. The adhesive sheet AS may or may not be induced.
The guiding means 32 may employ a rod-shaped member, a plate-shaped member, or the like instead of or in combination with the guiding roller 32C, or may guide the adhesive sheet AS by air blowing or the like.
The tension applying unit 30 may apply tension to the peeling tape PT by moving the wafer WF and the tape supporting unit 21 in place of the guide roller 32C.
When the wafer WF is moved by another apparatus, the moving means 31 may not be provided in the present invention.
The pressing means 33 may press the adhesive sheet AS peeled from the wafer WF so as to come into contact with the adhesive sheet AS attached to the wafer WF, or may press the adhesive sheet AS so as not to come into contact.
The pressing means 33 may press the adhesive sheet AS at any position such as the left end, the middle, or the right end of the adhesive sheet AS.
The pressing means 33 may press the bent portion of the adhesive sheet AS at a position other than the lowermost portion of the pressing roller 33D.
The pressing means 33 may or may not press the adhesive sheet in the direction of the wafer WF by using a plate-like member or air blowing instead of or in combination with the pressing roller 33D.
The sandwiching means 34 may or may not sandwich the peeling tape PT and the like with the pressing roller 33D by a plate-like member or air blowing instead of or in combination with the pinch roller 34C.
After the pressing means 33 peels the left end portion of the adhesive sheet AS with the pressing roller 33D, the pressing roller 33D is returned to the initial position, and the movement restricting means 40 presses the adhesive sheet AS with the movement restricting plate 43, The adhesive sheet AS may be peeled off. In this case as well, the movement restricting means 40 cancels the pressing by the movement restricting plate 43 before the pressing portion 43A of the movement restricting plate 43 reaches the non-holding edge PT1. Just do it.

The movement restricting means 40 may restrict the movement of the wafer WF with a roller member instead of the movement restricting plate 43. In this case, before the portion of the roller member that presses the peeling tape reaches the non-holding edge PT1. In addition, the pressing of the adhesive sheet AS by the roller member may be stopped.
When the peeling of the adhesive sheet AS is completed until the pressing portion 43A of the movement restricting plate 43 does not pass through the step formed by the non-holding edge PT1, the movement restricting means 40 is again applied to the wafer WF by the movement restricting plate 43. The adhered adhesive sheet AS may be pressed and peeled in the direction of the wafer WF.
The adhesive sheet AS may be peeled from the wafer WF by simultaneously pressing the adhesive sheet AS with the movement restricting plate 43 and pressing the adhesive sheet AS with the pressing roller 33D.

The recognition means 50 employs an imaging means such as a camera for detecting the position of the non-holding edge PT1, or a detection means such as an optical sensor, and stores (recognizes) the position of the non-holding edge PT1 based on the detection result. You may make it do.
The recognition means 50 may not be provided. In this case, for example, when the adhesive sheet AS is peeled off by a predetermined length (a length equal to or shorter than the distance from the peeling start portion of the adhesive sheet AS to the non-holding edge PT1), The movement restricting plate 43 may be returned to the initial position at the time when any chance of peeling is formed on the sheet AS.

  In addition, the material, type, shape, and the like of the adhesive sheet AS, the peeling tape PT, and the adherend in the present invention are not particularly limited. For example, the adhesive sheet AS and the peeling tape PT may be circular, elliptical, polygonal, such as a triangle or a quadrangle, or other shapes, or may be adhesive forms such as pressure-sensitive adhesiveness and heat-sensitive adhesiveness. Adhesion in the case where a heat-sensitive adhesive type is adopted may be provided with a heating means such as an appropriate coil heater for heating the adhesive sheet AS or the peeling tape PT, or the heating side of the heat pipe. What is necessary is just to adhere | attach by an appropriate method. In addition, such an adhesive sheet AS and a peeling tape PT are, for example, a single layer having only an adhesive layer, an intermediate layer between the base sheet and the adhesive layer, and an upper surface of the base sheet. It may be a three-layer or more layer having a cover layer, or a so-called double-sided adhesive sheet that can peel the substrate sheet from the adhesive layer. It may be a layer having an intermediate layer or a single layer or a multilayer having no intermediate layer. Examples of the adherend include, for example, foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit board, information recording substrates such as optical disks, glass plates, steel plates, ceramics, wood plates or resin plates, Arbitrary forms of members and articles can also be targeted. In addition, the adhesive sheet AS is replaced with a functional and intended reading, for example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc. Arbitrary sheets, films, tapes and the like can be attached to any adherend as described above.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, as long as the holding means can hold the peeling tape, it is not limited in any way as long as it is within the technical scope in light of the common general technical knowledge at the time of filing (about other means and processes). Will be omitted).
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 10 ... Sheet | seat peeling apparatus 20 ... Holding means 30 ... Tension providing means 33 ... Pressing means 40 ... Movement control means 43 ... Movement control plate (pressing member)
43A ... Pressing part 50 ... Recognizing means AS ... Adhesive sheet PT ... Peeling tape PT1 ... Non-hold edge WF ... Wafer (adhered body)

Claims (4)

A sheet peeling apparatus that applies tension to the peeling tape attached to the adhesive sheet to peel the adhesive sheet from the adherend,
Holding means for holding the peeling tape;
Tension applying means for applying tension to the peeling tape and peeling the adhesive sheet from the adherend;
The adhesive sheet affixed to the adherend is pressed in the direction of the adherend via the peeling tape, and the adherend is peeled off by the tension applying means to cause the adherend to adhere to the adhesive sheet. A movement restricting means having a pressing member for restricting movement in the peeling direction,
The peeling tape is affixed so that the non-holding edge opposite to the side held by the holding means is located on the adhesive sheet affixed to the adherend.
The movement restricting means restricts the movement of the adherend by moving the pressing portion of the pressing member relative to the non-holding edge along with the peeling of the adhesive sheet, and the pressing portion is not moved to the non-holding edge. Before reaching the holding edge, the sheet peeling device is characterized in that the pressing of the adhesive sheet by the pressing member is stopped. Recognizing means capable of recognizing the position of the non-holding edge;
The sheet peeling apparatus according to claim 1, wherein the movement restricting unit stops pressing the adhesive sheet with the pressing member based on recognition by the recognizing unit.   The tension applying means includes a pressing means for pressing the adhesive sheet peeled from the adherend in the direction of the adherend and restricting the adherend from moving in the peeling direction of the adhesive sheet, 3. The sheet peeling device according to claim 1, wherein when the pressing of the adhesive sheet by the movement restricting unit is stopped, the pressing of the adhesive sheet is performed by the pressing unit. 4. A sheet peeling method in which tension is applied to the peeling tape attached to the adhesive sheet to peel the adhesive sheet from the adherend,
A holding step of holding the peeling tape by holding means;
A tension applying step of applying tension to the peeling tape to release the adhesive sheet from the adherend;
The adhesive sheet affixed to the adherend by a pressing member is pressed in the direction of the adherend via the peeling tape, and the adherend is peeled off by the peeling of the adhesive sheet in the tension applying step. A movement restriction step for restricting movement in the peeling direction of the adhesive sheet,
The peeling tape is affixed so that the non-holding edge opposite to the side held by the holding means is located on the adhesive sheet affixed to the adherend.
The movement regulating step regulates the movement of the adherend by relatively moving the pressing portion of the pressing member in the non-holding edge direction along with the peeling of the adhesive sheet, and the pressing portion is not in the non-holding state. Before reaching the holding edge, the sheet peeling method is characterized in that the pressing of the adhesive sheet by the pressing member is stopped.

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