JP2007043048A - Method of separating protective tape and device using method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To separate a protective tape put onto the surface of a semiconductor wafer precisely by using adhesive tapes for separation. <P>SOLUTION: An edge member 50 is brought closer to the semiconductor wafer W, and a release tape is allowed to come in pressure contact with the edge of the protective tape for sticking. In this case, the edge member 50 is maintained at prescribed temperature by a heater, and the adhesive layer of the release tape is subjected to polymerization reaction for heat curing. The release tape, which is adhered to the protective tape firmly by the heat curing, is released from the end edge of the protective tape. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention provides a protective tape attached to the surface of a semiconductor wafer or a protective tape attached to the surface of a semiconductor wafer held from the back surface via a supporting adhesive tape on a ring-shaped frame, and attached to the surface of the semiconductor wafer by a sticking member. A protective tape peeling method for peeling off the protective tape integrally with the adhesive tape for peeling from the surface of the semiconductor wafer by applying the adhesive tape while pressing the non-adhesive surface of the tape, and peeling the adhesive tape for peeling. It relates to the device used.

  As means for thinly processing a semiconductor wafer (hereinafter simply referred to as “wafer”), there are mechanical methods such as grinding and polishing, and chemical methods utilizing etching. Further, when a wafer is processed using these methods, a protective tape is attached to the surface of the wafer in order to protect the wafer surface on which the wiring pattern is formed. The wafer having the protective tape attached and polished is adhered and held from the back surface to the ring frame via the supporting adhesive tape. Thereafter, the protective tape is peeled off from the surface of the wafer held on the ring frame.

As a method of peeling and removing this protective tape, the adhesive tape for peeling is attached to the surface of the protective tape via a sticking member such as a roller or an edge member, and the peeling adhesive tape is peeled off from the wafer surface. A device that is peeled and removed integrally with a protective tape and wound up is known (for example, see Patent Document 1).
JP-A-5-63077

  However, the conventional protective tape peeling method described above has the following problems.

  That is, when the peeling adhesive tape is attached to the surface of the protective tape and the peeling adhesive tape is not in close contact with the edge of the protective tape, the edge of the protective tape peels off. There is a problem that the protective tape cannot be peeled off from the surface of the wafer with the adhesive tape for peeling with high accuracy.

  The present invention has been made in view of such circumstances, and by attaching a peeling adhesive tape to a protective tape affixed to the surface of a semiconductor wafer, the peeling adhesive tape is peeled off. It is a main object of the present invention to provide a protective tape peeling method and an apparatus using the same, which can be accurately peeled from a semiconductor wafer by integrating the protective tape.

  The present invention has the following configuration in order to achieve the above object.

1st invention affixes the adhesive tape for peeling on the protective tape affixed on the surface of the semiconductor wafer, pressing with the affixing member from the non-adhesive surface side, and peels off the said adhesive tape for peeling In the protective tape peeling method in which the protective tape is peeled off from the surface of the semiconductor wafer integrally with the peeling adhesive tape,
The peeling adhesive tapes are thermosetting adhesive tapes, and after the thermosetting adhesive tape is attached to the protective tape while heating, the thermosetting adhesive tape is peeled off integrally with the protective tape. It is characterized by.

  (Function / Effect) According to this method, the adhesive layer of the thermosetting adhesive tape is heated and polymerized to be cured, and the thermosetting adhesive tape is firmly and firmly over the entire surface including the edge of the protective tape. It is pasted. Therefore, it can be peeled from the surface of the semiconductor wafer with precision from the edge of the protective tape integrally with the thermosetting adhesive tape.

A second invention is the method of the first invention, wherein
The heating of the thermosetting adhesive tape is performed by heating a sticking member that presses the thermosetting adhesive tape by a heating means.

  (Operation / Effect) According to this method, the heat from the heating means heats the affixing member, and the heat of the affixing member is transferred to the thermosetting adhesive tape and heated. That is, since the affixing part of the thermosetting adhesive tape can be directly heated by the affixing member, the thermosetting adhesive tape can be affixed to the end of the protective tape without excess or deficiency. That is, the first invention method can be suitably implemented.

  In addition, it is preferable that a heating means operates a heating means according to the kind of thermosetting adhesive tape, and controls the temperature of a sticking member. According to this method, since the polymerization reaction of the adhesive layer can be completed for each type of thermosetting adhesive tape, the thermosetting adhesive tape can be attached to the edge of the protective tape with high accuracy.

  Moreover, it is preferable that the sticking member of the said invention is an edge member with a sharp tip. In other words, the application part of the thermosetting adhesive tape can be linearly pressed in the width direction by the tip of the edge member, so that the adhesive layer can be locally heated to accelerate the polymerization reaction and be hardened firmly. it can. That is, the thermosetting adhesive tape can be applied with high accuracy by line contact even at the edge of the protective tape having a small contact area.

5th invention sticks to the protective tape affixed on the surface of the semiconductor wafer, affixing peeling adhesive tapes from the non-adhesive surface side with the affixing member, and peeling the said adhesive tapes for peeling. A protective tape peeling device for peeling the protective tape from the surface of the semiconductor wafer integrally with the adhesive tape for peeling,
Holding means for mounting and holding a semiconductor wafer with a protective tape;
The peeling adhesive tape is a thermosetting adhesive tape, and an adhesive tape supply means for supplying the thermosetting adhesive tape toward the affixing member;
Heating means for heating the affixing member;
The affixing member and the holding means are relatively moved so that the thermosetting adhesive tape moves to an operating position where the thermosetting adhesive tape is applied to the protective tape and a non-operating position where the thermosetting adhesive tape is separated from the protective tape. Elevating means for moving up and down;
Horizontal driving means for relatively horizontally moving the holding means and the attaching member;
Tape recovery means for recovering the protective tape integrated with the peeled thermosetting adhesive tape;
It is provided with.

  (Operation / Effect) According to this configuration, the holding means and the attaching member are relatively moved up and down to move the attaching member heated by the heating means to the action position. Then, the thermosetting adhesive tape is affixed on the protective tape on the surface of the semiconductor wafer held by the holding means while being heated by the affixing member by relatively horizontally moving the affixing member and the holding means. That is, the first invention method can be suitably realized.

A sixth invention is the above-mentioned fifth invention apparatus,
Detection means for detecting the temperature of the affixing member;
A reference temperature preset according to the type of the thermosetting adhesive tape is compared with a detection result by the detection means, and the temperature of the sticking member is controlled by operating the heating means based on the comparison result. Control means;
It is provided with.

  (Operation / Effect) According to this configuration, the temperature of the affixing member detected by the detection means is fed back to the control means and compared with the reference value. Based on the comparison result, the heat supplied from the heating means is adjusted so that the temperature of the pasting member becomes the reference value. Therefore, the polymerization reaction of the adhesive layer of the thermosetting adhesive tape can be performed with high accuracy and completed, and as a result, the thermosetting adhesive tape can be accurately attached to the edge of the protective tape.

  In addition, it is preferable to mount a heating means on a sticking member. According to this structure, a sticking member can be heated directly and a thermosetting adhesive tape can be heated with the said sticking member. Also. The sticking member is preferably an edge member with a sharp tip.

  According to the protective tape peeling method and the apparatus using the same according to the present invention, the protective tape is peeled off from the end of the protective tape affixed to the surface of the semiconductor wafer with the adhesive tape for peeling accurately. can do.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a semiconductor wafer mounting apparatus equipped with a protective tape peeling apparatus of the present invention will be described below with reference to the drawings. Moreover, the thermosetting adhesive tape is utilized for the peeling adhesive tapes.

  FIG. 1 is a cutaway perspective view showing an overall configuration of a semiconductor wafer mounting apparatus according to an embodiment of the present invention.

  A semiconductor wafer mounting apparatus 1 of this embodiment includes a wafer transfer mechanism including a wafer supply unit 2 in which cassettes C for storing wafers W subjected to back grinding are loaded in multiple stages, a robot arm 4 and a pressing mechanism 5. 3, an alignment stage 7 for aligning the wafer W, an ultraviolet irradiation unit 14 for irradiating the wafer W placed on the alignment stage 7 with ultraviolet rays, a chuck table 15 for attracting and holding the wafer W, and a ring A ring frame supply unit 16 in which frames f are stored in multiple stages, a ring frame transport mechanism 17 for transferring the ring frame f to a support adhesive tape DT that is a dicing tape, and a support adhesive tape DT from the back surface of the ring frame f Tape processing unit 18 to be attached and ring frame to which the support adhesive tape DT is attached A frame frame raising / lowering mechanism 26 for moving up and down, a mount frame producing unit 27 for producing a mount frame MF in which a wafer W is bonded to and integrated with a ring frame f to which a support adhesive tape DT is attached, and a produced mount. The first mount frame transport mechanism 29 that transports the frame MF, the peeling mechanism 30 that peels off the protective tape PT attached to the surface of the wafer W, and the mount frame MF from which the protective tape PT has been peeled off by the peeling mechanism 30 are transported. The second mount frame transport mechanism 35, the turntable 36 for changing the direction and transport of the mount frame MF, and the mount frame collection unit 37 for storing the mount frames MF in multiple stages.

  The wafer supply unit 2 is provided with a cassette table (not shown), and a cassette C in which wafers W each having a protective tape PT affixed to a pattern surface (hereinafter referred to as “surface” as appropriate) is stored in multiple stages. Is to be placed. At this time, the wafer W maintains a horizontal posture with the pattern surface facing upward.

  The wafer transfer mechanism 3 is configured to turn and move up and down by a drive mechanism (not shown). That is, the position of a wafer holding portion of the robot arm 4 described later and the pressing plate 6 provided in the pressing mechanism 5 is adjusted, and the wafer W is transferred from the cassette C to the alignment stage 7.

  The robot arm 4 of the wafer transfer mechanism 3 is provided with a horseshoe-shaped wafer holder (not shown) at its tip. Further, the robot arm 4 is configured such that the wafer holding unit can advance and retreat through the gap between the wafers W stored in multiple stages in the cassette C. The wafer holding part at the tip of the robot arm is provided with a suction hole so that the wafer W is vacuum-sucked from the back side and held.

  The pressing mechanism 5 of the wafer transport mechanism 3 includes a circular pressing plate 6 having substantially the same shape as the wafer W at the tip thereof, and the pressing plate 6 moves above the wafer W placed on the alignment stage 7. Thus, the arm portion is configured to be able to advance and retract. The shape of the pressing plate 6 is not limited to a circular shape, and may be any shape that can correct the warp occurring on the wafer W. For example, the tip of a bar or the like may be pressed against the warped portion of the wafer W.

  Further, the pressing mechanism 5 operates when a suction failure occurs when the wafer W is placed on the holding table of the alignment stage 7 described later. Specifically, when the wafer W is warped and the wafer W cannot be sucked and held, the pressing plate 6 presses the surface of the wafer W, corrects the warpage, and makes the surface flat. In this state, the holding table vacuum-sucks the wafer W from the back surface.

  The alignment stage 7 includes a holding table that aligns the mounted wafer W on the basis of an orientation flat, a notch or the like provided on the periphery thereof, and covers the entire back surface of the wafer W by vacuum suction.

  The alignment stage 7 detects a pressure value when the wafer W is vacuum-sucked, and a reference set in advance in relation to the pressure value during normal operation (when the wafer W is normally sucked by the holding table). Compare the value. If the pressure value is higher than the reference value (that is, the pressure in the intake pipe is not sufficiently reduced), it is determined that the wafer W is warped and not attracted to the holding table. Then, by operating the pressing plate 6 to press the wafer W and correct the warpage, the wafer W is attracted to the holding table.

  The alignment stage 7 includes a wafer over an initial position where the wafer W is placed and aligned, and an intermediate position between the chuck table 15 and the ring frame elevating mechanism 26 arranged in multiple stages above the tape processing unit 18 described later. It is configured to be able to carry and move W in a state where W is sucked and held. In other words, the alignment stage 7 carries the wafer W to the next step while correcting the warpage and holding it in a flat state.

  The ultraviolet irradiation unit 14 is located above the alignment stage 7 in the initial position. The ultraviolet irradiation unit 14 irradiates ultraviolet rays toward the protective tape PT which is an ultraviolet curable adhesive tape attached to the surface of the wafer W. That is, the adhesive strength of the protective tape PT is reduced by irradiation with ultraviolet rays.

  The chuck table 15 has a circular shape that is substantially the same shape as the wafer W so as to cover the surface of the wafer W and can be vacuum-sucked. It moves up and down over the position where it is attached to the frame f.

  That is, the chuck table 15 is in contact with the wafer W which has been warped by the holding table and held in a flat state, and is held by suction.

  Further, the chuck table 15 is accommodated in an opening of a ring frame lifting mechanism 26 that sucks and holds a ring frame f to which a support adhesive tape DT described later is attached from the back surface, and the wafer W is supported in the center of the ring frame f. It descends to a position close to DT.

  At this time, the chuck table 15 and the ring frame elevating mechanism 26 are held by a holding mechanism (not shown).

  The ring frame supply unit 16 has a wagon shape with a pulley provided at the bottom, and is loaded into the apparatus main body. The ring frame f accommodated in multiple stages inside is opened and slid up and sent out.

  The ring frame transport mechanism 17 vacuum-sucks the ring frames f housed in the ring frame supply unit 16 one by one from the top in order, and places the ring frame at an alignment stage (not shown) and a position where the support adhesive tape DT is attached. f is conveyed in order. The ring frame transport mechanism 17 also acts as a holding mechanism that holds the ring frame f at the position where the support adhesive tape DT is applied when the support adhesive tape DT is applied.

  The tape processing unit 18 includes a tape supply unit 19 that supplies the support adhesive tape DT, a tension mechanism 20 that applies tension to the support adhesive tape DT, an attachment unit 21 that attaches the support adhesive tape DT to the ring frame f, and an attachment to the ring frame f. The cutter mechanism 24 for cutting the attached support adhesive tape DT, the peeling unit 23 for peeling the unnecessary tape after being cut by the cutter mechanism 24 from the ring frame f, and the tape collection for collecting the unnecessary residual tape after the cutting Part 25.

  The tension mechanism 20 sandwiches the supporting adhesive tape DT from both ends in the width direction and applies tension in the tape width direction. That is, when the soft support adhesive tape DT is used, vertical tension occurs on the surface of the support adhesive tape DT along the supply direction due to the tension applied in the tape supply direction. In order to avoid this vertical wrinkle and to apply the supporting adhesive tape DT uniformly to the ring frame f, tension is applied from the tape width direction side.

  The affixing unit 21 is disposed at a standby position obliquely below the ring frame f held above the supporting adhesive tape DT (lower left in FIG. 1). The affixing roller 22 provided in the affixing unit 21 conveys and holds the ring frame f at the affixing position of the support adhesive tape DT by the ring frame conveyance mechanism 17 and starts supplying the support adhesive tape DT from the tape supply unit 19. At the same time, it moves to the right sticking start position in the tape supply direction.

  The affixing roller 22 that has reached the affixing start position rises and presses and attaches the support adhesive tape DT to the ring frame f, rolls from the affixation start position toward the standby position, and presses the support adhesive tape DT while pressing the support adhesive tape DT. It is designed to be pasted on the frame f.

  The peeling unit 23 peels an unnecessary portion of the support adhesive tape DT cut by a cutter mechanism 24 described later from the ring frame f. Specifically, when the attachment and cutting of the support adhesive tape DT to the ring frame f are completed, the holding of the support adhesive tape DT by the tension mechanism 20 is released. Next, the peeling unit 23 moves on the ring frame f toward the tape supply unit 19 to peel off the unnecessary supporting adhesive tape DT after cutting.

  The cutter mechanism 24 is disposed below the support adhesive tape DT on which the ring frame f is placed. When the support adhesive tape DT is attached to the ring frame f by the attaching unit 21, the holding of the support adhesive tape DT by the tension mechanism 20 is released, and the cutter mechanism 24 is raised. The raised cutter mechanism 24 cuts the support adhesive tape DT along the ring frame f.

  The ring frame elevating mechanism 26 is in a standby position above the position where the support adhesive tape DT is attached to the ring frame f. The ring frame elevating mechanism 26 descends when the attaching process of the supporting adhesive tape DT to the ring frame f is completed, and holds the ring frame f by suction. At this time, the ring frame transport mechanism 18 holding the ring frame f returns to the initial position above the ring frame supply unit 16.

  Further, when the ring frame elevating mechanism 26 sucks and holds the ring frame f, the ring frame elevating mechanism 26 moves up to the bonding position with the wafer W. At this time, the chuck table 15 holding the wafer W by suction is also lowered to the bonding position of the wafer W.

  The mount frame manufacturing unit 27 includes a sticking roller 28 whose peripheral surface is elastically deformable. The affixing roller 28 rolls while pressing the non-adhesive surface of the support adhesive tape DT affixed to the back surface of the ring frame f.

  The first mount frame transport mechanism 29 is configured to vacuum-suck the mount frame MF integrally formed with the ring frame f and the wafer W and transfer the mount frame MF to a peeling table (not shown) of the peeling mechanism 30.

  As shown in FIG. 2, the peeling mechanism 30 supplies a peeling table 38 on which the wafer W is placed and moved, and a peeling adhesive tape that is a thermosetting adhesive tape (hereinafter simply referred to as “peeling tape Ts”). And a peeling unit 32 for applying and peeling the peeling tape Ts, and a tape collecting part 34 for collecting the peeled peeling tape Ts and the protective tape PT. The configuration excluding the peeling table 38 in the peeling mechanism 30 is mounted on the apparatus main body in a fixed position. The peeling table 38 corresponds to the holding means of the present invention, the tape supply unit 31 corresponds to the adhesive tape supply means, and the peeling tape Ts corresponds to a thermosetting adhesive tape that is an adhesive tape for peeling. The peeling adhesive tapes are not limited to thermosetting adhesive tapes, and examples thereof include pressure-sensitive adhesive tapes that are cured by heat or ultraviolet rays, thermoplastic adhesive tapes, and the like. Furthermore, the present invention can also be applied by replacing these adhesive tapes with adhesive tapes.

  The peeling table 38 is configured to vacuum-suck the mount frame MF from the back surface side, and is supported by a movable table 42 supported so as to be slidable back and forth along a pair of left and right rails 41 provided horizontally. ing. The movable table 42 is screw-driven by a screw shaft 44 that is driven forward and backward by a pulse motor 43. The rail 41, the movable base 42, the pulse motor 43, the screw shaft 44, etc. constitute the horizontal drive means of the present invention.

  The tape supply unit 31 guides and supplies the peeling tape Ts derived from the original fabric roller to the lower end portion of the peeling unit 32 via the guide roller 45.

  The tape collecting unit 34 is configured to guide the peeling tape Ts fed from the lower end of the peeling unit 32 upward through a motor-driven feed roller 46 and a guide roller 47 to wind and collect the tape.

  As shown in FIG. 2, the peeling unit 32 is provided with a movable block 48 that can be moved up and down in parallel and a pulse motor 49 that moves the screw up and down, and at the lower end of the movable block 48, an adhesive member for the peeling tape Ts and The edge member 50 having a sharp tip as a peeling member, the receiving guide roller 51 for guiding the supplied peeling tape Ts to the tip portion of the edge member 50, and the peeling tape Ts folded back at the tip portion of the edge member 50 are collected as a tape. A feed-out guide roller 52 for guiding toward the portion 34 is provided. The movable block 48, the pulse motor 49, etc. constitute the lifting means of the present invention.

  As shown in FIGS. 3 and 4, the edge member 50 is attached to a rectangular cutout formed in the center of a support member 60 that is wider than the diameter of the wafer and is tapered toward the front end via a heat insulating material 61. The tip of the support member 60 is integrated and fixed to the peeling unit 32 in a tilted posture. The shape is a taper shape with substantially the same width as the peeling tape Ts and a sharp tip. In addition, the central portion H at the front end is linear so as to be in close contact with the peeling tape Ts, and both sides of the central portion H are gently inclined toward the base end of the edge member 50. In the case of the present embodiment, the width of the peeling tape Ts is 30 mm, whereas the width of the edge member 50 is 50 mm, the width of the tip center portion H is 35 mm, and both sides of the center portion H are center tips and side edge tips. Is set to an inclination angle at which the gap G is 1 mm. The shape of the tip of the edge member 50 is appropriately changed in design depending on the type of the peeling tape Ts to be used.

  The support member 60 includes an internal heater 62. The heater 62 transfers heat generated by heating the support member 60 to the edge member 50 through the heat insulating material 61, and polymerizes the adhesive layer of the peeling tape Ts, which is an affixed portion in close contact with the edge member 50, to perform thermosetting. Let That is, as shown in FIG. 4, the temperature at the tip of the edge member 50 is detected by the contact or non-contact sensor S and fed back to the control device 63, and the heater 62 adjusts the tip of the edge member 50 to a predetermined temperature. The supply temperature is adjusted. The heater 62 corresponds to the heating means of the present invention.

  The second mount frame transport mechanism 35 is configured to vacuum-suck the mount frame MF delivered from the peeling mechanism 30 and transfer it to the turntable 36.

  The turntable 36 is configured to align the mount frame MF and store it in the mount frame collection unit 37. That is, when the mount frame MF is placed on the turntable 36 by the second mount frame transport mechanism 35, alignment is performed based on the orientation flat of the wafer W, the positioning shape of the ring frame f, and the like. In order to change the direction in which the mount frame MF is stored in the mount frame collection unit 37, the turntable 36 is turned. Further, when the storage direction is determined, the turntable 36 pushes out the mount frame MF with a pusher (not shown) and stores the mount frame MF in the mount frame collection part 37.

  The mount frame collection unit 37 is placed on a mountable table (not shown). In other words, the mount frame MF pushed out by the pusher can be stored in an arbitrary stage of the mount frame collection unit 37 by moving the mounting table up and down.

  Examples of the thermosetting release tape Ts used in the present embodiment include hot melt.

  Next, the operation of the above-described embodiment apparatus will be described with reference to FIGS.

  The wafer holding part of the robot arm 4 is inserted into the gap of the cassette C. The wafers W are sucked and held from below and taken out one by one. The extracted wafer W is transferred to the alignment stage 7.

  The wafer W is placed on the holding table by the robot arm 4 and sucked and held from the back surface. At this time, the suction level of the wafer W is detected by a pressure gauge (not shown) and compared with a reference value determined in advance in relation to the pressure value during normal operation.

  When the suction abnormality is detected, the wafer W is pressed from the surface by the pressing plate 6, and the wafer W is sucked and held in a flat state in which the warp is corrected. The wafer W is aligned based on the orientation flat or notch.

  When the alignment on the alignment stage 7 is completed, the ultraviolet irradiation unit 14 irradiates the surface of the wafer W with ultraviolet rays.

  When the ultraviolet irradiation process is performed, the wafer W is transferred to the next mount frame manufacturing unit 27 together with the alignment stage 7 while being held by suction on the holding table. That is, the alignment stage 7 moves to an intermediate position between the chuck table 15 and the ring frame lifting mechanism 26.

  When the alignment stage 7 stands by at a predetermined position, the upper chuck table 15 is lowered, and the bottom surface of the chuck table 15 comes into contact with the wafer W to start vacuum suction. When the vacuum suction of the chuck table 15 is started, the suction holding on the holding table side is released, and the wafer W is received in a state in which the chuck table 15 is held flat by correcting the warp. The alignment stage 7 that has transferred the wafer W returns to the initial position.

  Next, the ring frames f stored in multiple stages in the ring frame supply unit 16 are vacuum-sucked one by one by the ring frame transport mechanism 17 and taken out. The taken-out ring frame f is aligned on an alignment stage (not shown) and then conveyed to a support adhesive tape attaching position above the support adhesive tape DT.

  When the ring frame f is held by the ring frame transport mechanism 17 and is at the attaching position of the supporting adhesive tape DT, the supply of the supporting adhesive tape DT from the tape supply unit 19 is started. At the same time, the sticking roller 22 moves to the sticking start position.

  When the application roller 22 reaches the application start position, the tension mechanism 20 holds both ends in the width direction of the supporting adhesive tape DT, and tension is applied in the tape width direction.

  Next, the affixing roller 22 is raised, and the supporting adhesive tape DT is affixed to the end of the ring frame f. When the supporting adhesive tape DT is affixed to the end of the ring frame f, the affixing roller 22 rolls toward the tape supply unit 19 side which is the standby position. At this time, the affixing roller 22 rolls while pressing the supporting adhesive tape DT from the non-adhesive surface, and affixes the supporting adhesive tape DT to the ring frame f. When the sticking roller 22 reaches the end of the sticking position, the holding of the supporting adhesive tape DT by the tension mechanism 20 is released.

  At the same time, the cutter mechanism 24 rises and cuts the supporting adhesive tape DT along the ring frame f. When the cutting of the supporting adhesive tape DT is completed, the peeling unit 23 moves toward the tape supply unit 19 and peels off the unnecessary supporting adhesive tape DT.

  Next, the tape supply unit 19 is operated to feed out the supporting adhesive tape DT, and the unnecessary portion of the cut tape is sent out to the tape collecting unit 25. At this time, the sticking roller 22 moves to the sticking start position so as to stick the supporting adhesive tape DT to the next ring frame f.

  The ring frame f to which the supporting adhesive tape DT is attached moves upward while the frame portion is sucked and held by the ring frame lifting mechanism 26. At this time, the chuck table 15 is also lowered. That is, the chuck table 15 and the ring frame elevating mechanism 26 move to a position where the wafer W is bonded to each other.

  When each mechanism 15 and 26 reaches a predetermined position, each mechanism is held by a holding mechanism (not shown). Next, the sticking roller 28 moves to the sticking start position of the supporting adhesive tape DT, rolls while pressing the non-adhesive surface of the supporting adhesive tape DT attached to the bottom surface of the ring frame f, and supports adhesive. The tape DT is attached to the wafer W. As a result, a mount frame MF in which the ring frame f and the wafer W are integrated is manufactured.

  When the mount frame MF is manufactured, the chuck table 15 and the ring frame lifting mechanism 26 move upward. At this time, a holding table (not shown) moves below the mount frame MF, and the mount frame MF is placed on the holding table. The mounted mount frame MF is sucked and held by the first mount frame transport mechanism 29 and transferred to the peeling table 38.

  The peeling table 38 on which the mount frame MF is placed moves forward toward the lower side of the peeling unit 32 as shown in FIGS. At this time, the position of the peeling table 38 is set by controlling the operation of the pulse motor 43 so that the front end edge of the protective tape PT is positioned immediately below the tip of the edge member 50. That is, when the front edge of the protective tape PT reaches a position directly below the tip of the edge member 50, the forward movement is automatically stopped once.

  Once the peeling table 38 is stopped, as shown in FIGS. 5 and 8, the pulse motor 49 is controlled and the movable block 48 is lowered. After that, the edge member 50 is lowered in a state where the peeling tape Ts supplied from the tape supply unit 31 is wound, and as shown in FIG. 10A, the peeling tape Ts is formed on the protective tape PT at the tip of the edge member 50. It moves to the operating position that presses against the upper surface of the front end with a predetermined pressing force.

  When the attachment of the protective tape PT to the front end of the protective tape PT is completed, as shown in FIGS. 6 and 9, the peeling table 38 moves forward again with the edge member 50 pressing the peeling tape Ts against the protective tape PT. Is started and the peeling tape Ts is wound around the tape collecting unit 34 at a speed synchronized with the moving speed. By this operation, as shown in FIG. 10B, the edge member 50 is applied to the protective tape PT on the surface of the wafer W while pressing the release tape Ts, and at the same time, the attached release tape Ts is released. Then, the protective tape PT is peeled off from the surface of the wafer W together.

  In the case of the present embodiment, when reaching the attaching action position of the peeling tape Ts, the edge member 50 is heated by the heat of the heater 62 built in the support member 60 through the heat insulating material as shown in FIG. The peeling tape Ts is applied from the edge of the protective tape PT in a state where the edge member 50 itself is heated. At this time, the heat at the tip of the edge member 50 is directly transmitted to the application site of the release tape Ts, and the polymerization reaction of the adhesive layer at the application site is completed, and the release tape Ts is applied to the protective tape PT.

  In the process of attaching the peeling tape Ts, the temperature of the edge member 50 is detected continuously or intermittently by the sensor S, and the detection result (actually measured value) is fed back to the control device 63. A temperature (reference value) suitable for completing the polymerization reaction of the adhesive layer is preset in the control device 63 for each release tape Ts to be used, and the control device 63 sets the reference value and the actual measurement value. The temperature of the edge member 50 is controlled by adjusting the supply temperature of the heater 62 based on the comparison result.

  When the pulse motor is controlled to move forward by a distance corresponding to the wafer diameter from the peeling tape sticking start position where the edge member 50 is lowered, in other words, the edge member 50 reaches the rear edge of the protective tape PT. When the protective tape PT is completely peeled from the surface of the wafer, the edge member 50 is controlled to rise, and the peeling unit 32 returns to the initial state.

  The mount frame MF that has been subjected to the peeling process of the protective tape PT is moved to the standby position of the second mount frame transport mechanism 35 by the peeling table 38.

  Then, the mount frame MF paid out from the peeling mechanism 30 is transferred to the turntable 36 by the second mount frame transport mechanism 35. The transferred mount frame MF is aligned by an orientation flat or a notch, and the accommodation direction is adjusted. When the alignment and the storage direction are determined, the mount frame MF is pushed out by the pusher and stored in the mount frame collection unit 37.

  As described above, the edge member 50 is heated to complete the polymerization reaction of the adhesive layer of the release tape Ts and thermally cured, thereby firmly attaching the release tape Ts to the edge of the protective tape PT without excess or deficiency. be able to. As a result, since the adhesive force of the peeling tape Ts is greater than the adhesive force of the protective tape PT, the protective tape PT can be peeled from the end edge with high accuracy by peeling off the peeling tape Ts. That is, the occurrence of peeling errors can be suppressed.

  [Another Example 1]

  In the above-described embodiment, while the mount frame MF is moved forward and passed under the peeling unit 32, the edge member 50 simultaneously attaches and peels the peeling tape Ts to the protective tape PT. It is also possible to carry out the embodiment in which Ts is attached to and peeled off from the protective tape PT sequentially in separate steps, and an example thereof is shown in FIGS.

  In this embodiment, the peeling table 38, the tape supply unit 31, and the tape collecting unit 34 are respectively fixed in position, whereas the peeling unit 32 of the peeling mechanism 30 is moved back and forth by a drive mechanism not shown. It is designed to move horizontally and operates as follows.

  First, as shown in FIG. 11, the peeling unit 32 is moved forward from the standby position removed from the peeling table 38 so that the front edge (acting position) of the protective tape PT comes to a position immediately below the tip of the edge member 50.

  When the edge member 50 comes above the operating position, as shown in FIG. 12, the movement is stopped once, and as in the previous example, the edge member 50 is lowered to control the peeling tape Ts on the upper surface of the front end of the protective tape PT. Press on.

  Thereafter, as indicated by the phantom line in FIG. 12, the mount frame MF is moved forward in the pressed state, and the release tape Ts is continuously attached to the upper surface of the protective tape PT. And during this sticking movement, the polymerization reaction of the adhesive layer of the release tape Ts is performed while controlling the temperature of the edge member 50.

  Then, as shown in FIG. 13, the movement is stopped once when it reaches the rear end edge of the protective tape PT. Thereafter, as shown in FIG. 14, the release tape Ts is wound up and collected at a speed synchronized with the backward movement speed while the mount frame MF is moved backward from the stop position. As a result, the protective tape PT is peeled off from the wafer surface integrally with the peeling tape Ts.

  Even another embodiment apparatus as described above has the same effects as the above-described main embodiment apparatus.

  The present invention is not limited to the above-described embodiment, and can be modified as follows.

  (1) In the above-described embodiment, the heater 62 is built in the support member 60. However, the heater 62 may be built in the edge member 50 itself.

  (2) In the above embodiment, the edge member 50 is used as the attaching member of the peeling tape Ts. However, a roller may be used. In this case, it is preferable that the roller has a built-in heater and the peripheral surface is hard, and that the roller diameter is as small as possible.

  (3) The alignment of the edge of the protective tape PT has been performed by controlling the operation of the pal motor 49 at a predetermined position of the peeling table 38. However, the protective tape is utilized using a laser, an optical sensor, a CCD camera, or the like. The alignment may be performed by detecting the edge of the PT and controlling the moving distance of the peeling table 38 based on the detection result.

  (4) In the main embodiment, the mounting frame MF may be fixed and the peeling unit 32 may be moved horizontally.

  (5) In the above embodiment, the edge member (adhering member) 50 is controlled to be lowered and the release tape Ts is pressed against the protective tape PT to be attached. It can also be implemented in a form in which the frame MF is raised and lowered.

  (6) In the above-described embodiment, the strip-shaped tape rolled out is used as the peeling tape Ts for peeling off the protective tape PT. However, the sized sheet is bonded or adhesive tape or adhesive or adhesive sheet. Can also be used.

It is a perspective view which shows the whole semiconductor wafer mount apparatus. It is a side view which shows the operation | movement process of a peeling mechanism. It is a perspective view which shows the edge member periphery of another Example. It is a top view which shows the principal part structure around the edge member of another Example. It is a side view which shows the operation | movement process of a peeling mechanism. It is a side view which shows the operation | movement process of a peeling mechanism. It is a perspective view which shows the operation | movement process of a peeling mechanism. It is a perspective view which shows the operation | movement process of a peeling mechanism. It is a perspective view which shows the operation | movement process of a peeling mechanism. It is an enlarged side view of the principal part which shows the sticking operation | movement and peeling operation | movement of a peeling mechanism. It is a side view which shows operation | movement description of the peeling mechanism of another Example. It is a side view which shows operation | movement description of the peeling mechanism of another Example. It is a side view which shows operation | movement description of the peeling mechanism of another Example. It is a side view which shows operation | movement description of the peeling mechanism of another Example.

Explanation of symbols

50 ... Pasting member (edge member)
60 ... Support member 62 ... Heater f ... Ring frame DT ... Support adhesive tape PT ... Protection tape Ts ... Release tape MF ... Mount frame W ... Semiconductor wafer

Claims (8)

From the surface of the semiconductor wafer, the adhesive tape for peeling is applied to the protective tape attached to the surface of the semiconductor wafer while pressing the adhesive tape from the non-adhesive surface side with an adhesive member, and the adhesive tape for peeling is peeled off. In the protective tape peeling method of peeling the protective tape integrally with the adhesive tape for peeling,
The peeling adhesive tapes are thermosetting adhesive tapes, and after the thermosetting adhesive tape is attached to the protective tape while heating, the thermosetting adhesive tape is peeled off integrally with the protective tape. A protective tape peeling method characterized by the above. In the protective tape peeling method of Claim 1,
Heating of the thermosetting adhesive tape is performed by heating a sticking member for pressing the thermosetting adhesive tape by a heating means. In the masking tape peeling method according to claim 1 or 2,
The protective tape peeling method characterized by controlling the temperature of the said affixing member by operating the said heating means according to the kind of the said thermosetting type adhesive tape. In the masking tape peeling method according to any one of claims 1 to 3,
The sticking member is an edge member having a sharp tip. From the surface of the semiconductor wafer, the adhesive tape for peeling is applied to the protective tape attached to the surface of the semiconductor wafer while pressing the adhesive tape from the non-adhesive surface side with an adhesive member, and the adhesive tape for peeling is peeled off. A protective tape peeling device that peels the protective tape integrally with the adhesive tape for peeling,
Holding means for mounting and holding a semiconductor wafer with a protective tape;
The peeling adhesive tape is a thermosetting adhesive tape, and an adhesive tape supply means for supplying the thermosetting adhesive tape toward the affixing member;
Heating means for heating the affixing member;
The affixing member and the holding means are relatively moved so that the thermosetting adhesive tape moves to an operating position where the thermosetting adhesive tape is applied to the protective tape and a non-operating position where the thermosetting adhesive tape is separated from the protective tape. Elevating means for moving up and down;
Horizontal driving means for relatively horizontally moving the holding means and the attaching member;
Tape recovery means for recovering the protective tape integrated with the peeled thermosetting adhesive tape;
A protective tape peeling device comprising: In the protective tape peeling apparatus according to claim 5,
Detection means for detecting the temperature of the affixing member;
A reference temperature preset according to the type of the thermosetting adhesive tape is compared with a detection result by the detection means, and the temperature of the sticking member is controlled by operating the heating means based on the comparison result. Control means;
A protective tape peeling device comprising: In the protective tape peeling apparatus according to claim 5 or 6,
The protective tape peeling device, wherein the heating means is mounted on the sticking member. In the protective tape peeling apparatus according to any one of claims 5 to 7,
The sticking member is an edge member having a sharp tip.

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