JP4549172B2 - Wafer mounting method and wafer mounting apparatus using the same - Google Patents

Description

  The present invention attaches a dicing adhesive tape across the ring frame and the back surface of the semiconductor wafer placed in the center of the ring frame, and integrates the semiconductor wafer into the ring frame via the adhesive tape. The present invention relates to a wafer mounting method and a wafer mounting apparatus using the same.

As a conventional wafer mounting means, for example, it is known that after attaching a dicing tape to a ring frame for creating a mount frame, the wafer is attached to the center of the dicing tape attached to the ring frame. (See Patent Document 1).
JP-A-1-51911

  In recent years, with the demand for high-density mounting, the thickness of a semiconductor wafer (hereinafter referred to as “wafer” as appropriate) tends to be reduced. Along with this, the beveling portion, which is the edge of the wafer after the back surface thinning, becomes an acute angle. Therefore, when creating an integrated wafer mount by attaching an adhesive tape across the ring frame and the back surface of the wafer, an adhesive roller having elasticity to press and roll the adhesive tape from the end of the ring frame is It falls into the gap with the wafer. Thereafter, the affixing roller that rides over the wafer edge having an acute angle is deformed and cannot be affixed with the adhesive tape in close contact with the wafer edge. When such a sticking failure occurs, there arises a problem that chips located at the sticking failure portion are peeled off and scattered during subsequent dicing.

  This invention is made | formed in view of such a situation, Comprising: It aims at making it possible to stick the adhesive tape to the edge part of a semiconductor wafer reliably.

1st invention rolls, pressing a sticking roller on the non-adhesive surface of the adhesive tape arrange | positioned facing the back surface of the semiconductor wafer with the protective tape mounted in the center of the ring frame and the said ring frame, In the wafer mounting method for attaching and integrating the adhesive surface of the adhesive tape across the ring frame and the back surface of the semiconductor wafer,
The adhesive tape setting the semiconductor wafer back surface height lower placed on the center of the ring frame to a paste ring frame back surface of the back surface height to Rutotomoni, of the semiconductor wafer diameter, the inner diameter of the ring frame, In addition, the gap from the inner peripheral edge of the ring frame to the outer peripheral edge of the wafer is set to an interval that avoids the deformation of the adhesive roller according to the curvature of the application roller, and the surface has elasticity over both the back surface of the ring frame and the semiconductor wafer. A sticking roller is rolled to stick the adhesive tape.

  (Operation / Effect) According to this method, the affixing roller on the end of the semiconductor wafer rolls on a plane where the height of the back surface of the ring frame and the semiconductor wafer is substantially the same. That is, the application to the semiconductor wafer is started without a large drop of the application roller in the gap between the ring frame and the semiconductor wafer. That is, it is possible to eliminate a bonding failure at the bonding start position of the semiconductor wafer.

A second invention is the wafer mounting method according to the first invention,
The ring frame is held on a ring holding table, and the height of the back surface of the ring frame is adjusted by moving the ring holding table up and down.

  According to this, even if there is a change in the back surface height of the semiconductor wafer, the height of the ring holding table is adjusted so that the back surface height of the ring frame is substantially the same as the wafer back surface height. Thus, the adhesive tape can be satisfactorily stuck without the large drop of the sticking roller in the gap between the ring frame and the semiconductor wafer.

A third invention is the wafer mounting method according to the second invention,
Detection means for detecting the back surface height of the semiconductor wafer is provided, and the height of the ring holding table is adjusted based on the detection result of the detection means.

  (Action and effect) According to this, even in continuous pasting processing, the ring holding table can be automatically maintained at a suitable height for each semiconductor wafer, eliminating the sticking failure at the sticking start position of the adhesive tape. can do.

According to a fourth aspect of the present invention, in the wafer mounting method according to the second or third aspect of the invention, the upper limit of the back surface height of the ring frame is adjusted within a range of 200 μm or less from the back surface height of the semiconductor wafer. To do.

  (Operation / Effect) According to this, when the application roller rolls from the ring frame toward the semiconductor wafer, the application roller does not fall into the gap between the ring frame and the semiconductor wafer. That is, the sticking roller does not run on the end portion of the semiconductor wafer, which is the sticking tape sticking start end of the semiconductor wafer, so that sticking failure of the sticking tape at the end portion of the semiconductor wafer does not occur.

5th invention is the wafer mount apparatus which sticks and integrates an adhesive tape over the back surface of the semiconductor wafer with a protective tape mounted in the center of the ring frame and the said ring frame,
According to the diameter of the semiconductor wafer, the inner diameter of the ring frame, and the curvature of the sticking roller, the interval from the inner peripheral edge of the ring frame to the outer peripheral edge of the wafer is set,
A ring holding table for holding the ring frame;
A wafer holding table for holding the semiconductor wafer disposed in the center of the ring holding table;
Drive means for raising and lowering the ring holding table;
Control for adjusting the height of the ring holding table so that the back surface height of the semiconductor wafer placed at the center of the ring frame is lower than the back surface height of the back surface of the ring frame by controlling the driving means. Means,
Affixing means for affixing the adhesive surface of the adhesive tape across the ring frame and the back surface of the semiconductor wafer by rolling while pressing an adhesive roller having elasticity on the non-adhesive surface of the adhesive tape;
Cutting means for cutting the adhesive tape attached across the ring frame and the semiconductor wafer along the ring frame;
Peeling means for peeling off the unnecessary adhesive tape after being cut by the cutting means;
A tape collecting means for collecting unnecessary adhesive tape peeled off by the peeling means;
It is provided with.

(Operation and Effect) According to this configuration, the drive of the drive unit is controlled by the control unit, and the height of the ring holding table is adjusted. That is, the height of the back surface of the ring frame held on the ring holding table can be adjusted according to the height of the back surface of the semiconductor wafer held on the wafer holding table. That is, the wafer mounting method according to the present invention can be suitably realized.

A sixth invention is the wafer mount apparatus according to the fifth invention, wherein:
Detecting means for detecting the back surface height of the semiconductor wafer held on the wafer holding table;
The control means controls the drive of the drive means based on the detection result of the detection means.

  (Operation and Effect) According to this configuration, the height of the back surface of each semiconductor wafer held on the wafer holding table can be detected by the detecting means. Therefore, the height of the back surface of the ring frame can be adjusted corresponding to each semiconductor wafer. That is, the wafer mounting method according to the present invention can be suitably realized.

  According to the wafer mounting method and the wafer mounting method using the same according to the present invention, it is possible to reliably adhere the adhesive tape to the end portion of the semiconductor wafer.

  Embodiments of a wafer mount apparatus for manufacturing a wafer mount by integrating a ring frame and a semiconductor wafer according to the present invention will be described below with reference to the drawings.

  FIG. 1 is a partially broken perspective view showing the entire configuration of a wafer mount apparatus according to an embodiment of the present invention.

  The wafer mount apparatus 1 includes a wafer supply unit 2 in which cassettes C that store semiconductor wafers (hereinafter simply referred to as “wafers W”) W that have undergone back grinding are loaded, a robot arm 4, and a pressing mechanism 5. A wafer transfer mechanism 3, an alignment stage 7 that aligns the wafer W, an ultraviolet irradiation unit 14 that irradiates ultraviolet rays toward the wafer W placed on the alignment stage 7, and the wafer W by suction. A wafer holding table 15, a ring frame supply unit 16 in which the ring frames f are stored in multiple stages, a ring frame transport mechanism 17 that transports the ring frame f to a position where a dicing tape DT, which is an example of an adhesive tape, is attached, The dicing tape DT is moved up and down between the frame f and the wafer W to the attachment position and the standby position. The ring frame elevating mechanism 26 to be moved, the mount frame production unit 18 for producing the integrated mount frame MF by attaching the dicing tape DT to the back surface of the ring frame f and the wafer W, and the produced mount frame MF are conveyed. A first mount frame transport mechanism 29, a peeling mechanism 30 that peels off the protective tape PT that has been attached in advance to the surface of the wafer W, and a second that transports the mount frame MF from which the protective tape PT has been peeled off by the peeling mechanism 30. The mount frame transport mechanism 35, the turntable 36 that changes the direction and transport of the mount frame MF, and the mount frame collection unit 37 that stores the mount frames MF in multiple stages. The ring frame elevating mechanism 26 corresponds to the driving means of the present invention.

  The wafer supply unit 2 includes a cassette table, and a cassette C in which the wafers W on which the protective tape PT is bonded to the pattern surface is stored in multiple stages is placed on the cassette table. At this time, the wafer W maintains a horizontal posture with the pattern surface facing upward.

  The wafer transfer mechanism 3 is configured to turn and move up and down by a drive mechanism (not shown), and adjusts the position of a wafer holding portion of a robot arm 4 described later and a pressing plate 6 provided in the pressing mechanism 5. The wafer W is transferred from the cassette C to the alignment stage 7.

  The robot arm 4 of the wafer transfer mechanism 3 is provided with a horseshoe-shaped wafer holder (not shown) at its tip. Further, the robot arm 4 is configured such that the wafer holding unit can advance and retreat through the gap between the wafers W stored in multiple stages in the cassette C. A suction hole is provided on the upper surface of the wafer holding unit so that the wafer W is held by vacuum suction from the back surface.

  The pressing mechanism 5 of the wafer transport mechanism 3 includes a circular pressing plate 6 having substantially the same shape as the wafer W at the tip thereof, and the pressing plate 6 moves above the wafer W placed on the alignment stage 7. Thus, the arm portion is configured to be able to advance and retract. The shape of the pressing plate 6 is not limited to a circular shape, and may be any shape that can correct the warp occurring on the wafer W. For example, the tip of a bar or the like may be pressed against the warped portion of the wafer W.

  The pressing mechanism 5 operates when a suction failure occurs when the wafer W is placed on a holding table of an alignment stage 7 described later. Specifically, when the wafer W is warped and the wafer W cannot be sucked and held, the pressing plate 6 presses the surface of the wafer W, corrects the warpage, and makes the surface flat. In this state, the holding table vacuum-sucks the wafer W from the back surface.

  The alignment stage 7 includes a holding table that aligns the mounted wafer W based on an orientation flat or the like and covers the entire back surface of the wafer W by vacuum suction.

  The alignment stage 7 includes an initial position where the wafer W is placed and aligned, and an intermediate position between the wafer holding table 15 and the ring frame elevating mechanism 26 arranged in multiple stages above the mount frame manufacturing unit 18 described later. The wafer W is configured to be transported and moved with the wafer W being sucked and held.

  The ultraviolet irradiation unit 14 is located above the alignment stage 7 in the initial position. The ultraviolet irradiation unit 14 irradiates ultraviolet rays toward the protective tape PT which is an ultraviolet curable adhesive tape attached to the surface of the wafer W, thereby reducing the adhesive force of the protective tape PT.

  The wafer holding table 15 has a circular shape having an outer diameter slightly larger than that of the wafer W so as to cover the surface of the wafer W and can be vacuum-sucked, and a standby position above the mount frame manufacturing unit 18 by a drive mechanism (not shown). The wafer W is moved up and down across the position where the wafer W is attached to the ring frame f.

  Further, the wafer holding table 15 moves up and down in a state where the ring frame f to which a dicing tape DT described later is attached from the back surface is sucked and held. That is, it descends to the position where the dicing tape DT is attached.

  The ring frame supply unit 16 has a wagon shape having a pulley at the bottom, and is loaded into the apparatus main body 1. The ring frame f accommodated in multiple stages inside is opened and slid up and sent out.

  The ring frame transport mechanism 17 holds the ring frames f housed in the ring frame supply unit 16 by vacuum suction one by one in order from the upper side, and sequentially places the ring frames f over the alignment stage and the dicing tape attaching position. It is designed to be transported.

  The mount frame production unit 18 is affixed to a tape supply unit 19 that supplies the dicing tape DT, a tension mechanism 20 that applies tension to the dicing tape DT, an affixing unit 21 that affixes the dicing tape DT to the ring frame f, and a ring frame f. A cutter mechanism 24 for cutting the dicing tape DT, a peeling unit 23 for peeling unnecessary tape after being cut by the cutter mechanism 24 from the ring frame f, and a tape collecting unit 25 for collecting unnecessary residual tape after cutting. It has. The pasting unit 21 corresponds to pasting means of the present invention, the cutter mechanism 24 corresponds to cutting means, the peeling unit 23 corresponds to peeling means, and the tape recovery unit 25 corresponds to tape recovery means.

  The tension mechanism 20 sandwiches the dicing tape DT from both ends in the width direction and applies tension in the tape width direction. That is, when a soft dicing tape DT is used, vertical tension occurs on the surface of the dicing tape DT along the supply direction due to the tension applied in the tape supply direction. In order to avoid this vertical wrinkle and to apply the dicing tape DT uniformly to the ring frame f, tension is applied from the tape width direction side.

  The affixing unit 21 is disposed at a standby position obliquely below the ring frame f held above the dicing tape DT. The sticking unit 21 is provided with a sticking roller 22 having an appropriate elasticity on the surface made of rubber or an elastic resin material. When the sticking roller 22 reaches the sticking start position, the sticking roller 22 rolls while pressing the non-adhesive surface of the dicing tape DT, and sticks the dicing tape DT across the ring frame f and the back surface of the wafer W. Yes.

  The cutter mechanism 24 is disposed below the dicing tape DT on which the ring frame f is placed. When the dicing tape DT is affixed to the ring frame f by the affixing unit 21, the holding of the dicing tape DT by the tension mechanism 20 is released, and the cutter mechanism 24 is raised. The raised cutter mechanism 24 cuts the dicing tape DT along the ring frame f.

  The peeling unit 23 peels off unnecessary portions of the dicing tape DT cut by the cutter mechanism 24 from the ring frame f. Specifically, when the attachment and cutting of the dicing tape DT to the ring frame f is completed, the holding of the dicing tape DT by the tension mechanism 20 is released. Next, the peeling unit 23 moves toward the tape supply unit 19 on the ring frame f, and peels off unnecessary dicing tape DT after cutting.

  The ring frame elevating mechanism 26 includes a ring holding table 41 that holds the ring frame f by suction. That is, the ring frame elevating mechanism 26 is lowered when the ring frame f is conveyed to the dicing tape attaching position by the ring frame conveying mechanism 17, and the ring frame f is adsorbed and held by the ring holding table 41 and is adsorbed and held. The dicing tape is moved up and down to a position where the dicing tape is attached to the ring frame f. When the ring frame f is sucked and held on the ring holding table 41, the ring frame transport mechanism 17 that has held the ring frame f returns to the initial position above the ring frame supply unit 16.

  At this time, the wafer holding table 15 holding the wafer W by suction is also lowered to the wafer W attaching position.

  The first mount frame transport mechanism 29 is configured to vacuum-suck the mount frame MF in which the ring frame f and the wafer W are integrated and transfer them to a peeling table (not shown) of the peeling mechanism 30.

  The peeling mechanism 30 includes a peeling table (not shown) for placing and moving the wafer W, a tape supply unit 31 for supplying the peeling tape Ts, a peeling unit 32 for attaching and peeling the peeling tape Ts, and a peeling unit. It comprises a peeling tape Ts and a tape collecting part 34 for collecting the protective tape PT.

  The tape supply unit 31 supplies the peeling tape Ts derived from the original fabric roller through the upper part of the peeling table.

  The peeling unit 32 includes a peeling plate 33. The release plate 33 presses the surface of the protective tape PT attached to the pattern surface of the wafer W (wafer W attached to the mount frame MF via the dicing tape DT) conveyed by the release table. Moving. At this time, the peeling plate 33 attaches the peeling tape Ts to the protective tape PT while pressing the non-adhesive surface of the peeling tape Ts, and peels the peeling tape Ts and the protective tape PT together. . As the peeling tape Ts, a tape having a width smaller than the diameter of the wafer W is used.

  The second mount frame transport mechanism 35 is configured to vacuum-suck the mount frame MF delivered from the peeling mechanism 30 and transfer it to the turntable 36.

  The turntable 36 is configured to align the mount frame MF and store it in the mount frame collection unit 37. That is, when the mount frame MF is placed on the turntable 36 by the second mount frame transport mechanism 35, alignment is performed based on the orientation flat of the wafer W, the positioning shape of the ring frame f, and the like. In order to change the direction in which the mount frame MF is stored in the mount frame collection unit 37, the turntable 36 is turned. Further, when the storage direction is determined, the turntable 36 pushes out the mount frame MF with a pusher (not shown) and stores the mount frame MF in the mount frame collection part 37.

  The mount frame collection unit 37 is placed on a mountable table (not shown). In other words, the mount frame MF pushed out by the pusher can be stored in an arbitrary stage of the mount frame collection unit 37 by moving the mounting table up and down.

  Next, an outline of one round operation of the above-described embodiment apparatus will be described.

  The wafer holding part of the robot arm 4 is inserted into the gap of the cassette C. The wafers W are sucked and held from below and taken out one by one. The extracted wafer W is transferred to the alignment stage 7.

  The wafer W is placed on the holding table 8 by the robot arm 4 and sucked and held from the back surface. At this time, alignment is performed based on the orientation flat or notch.

  When the alignment on the alignment stage 7 is completed, the ultraviolet irradiation unit 14 irradiates the surface of the wafer W with ultraviolet rays.

  When the ultraviolet irradiation process is performed, the wafer W is conveyed to the next mount frame manufacturing unit 27 together with the alignment stage 7 while being held by suction on the holding table 8. That is, the alignment stage 7 moves to an intermediate position between the wafer holding table 15 and the ring frame lifting mechanism 26.

  When the alignment stage 7 stands by at a predetermined position, the wafer holding table 15 positioned above is lowered, the bottom surface of the wafer holding table 15 comes into contact with the wafer W, and vacuum suction is started. When the vacuum holding of the wafer holding table 15 is started, the suction holding on the holding table 8 side is released, and the wafer W is received in a state in which the wafer holding table 15 is held flat by correcting the warp.

  The alignment stage 7 that has transferred the wafer W returns to the initial position.

  The ring frames f housed in multiple stages in the ring frame supply unit 16 are vacuum-sucked one by one by the ring frame transport mechanism 17 and taken out. The taken-out ring frame f is aligned on an alignment stage (not shown) and then conveyed to a pasting position above the dicing tape DT.

  When the ring frame f held by the ring frame transport mechanism 17 reaches the affixing position, the ring frame elevating mechanism 26 waiting upward is lowered, and the ring holding table 41 provided below the ring frame elevating mechanism 26 lowers the surface of the ring frame f. Adsorb and hold. With this suction, the ring frame transport mechanism 17 releases the suction of the ring frame and returns to the initial position.

  As the ring frame transport mechanism 17 returns to the initial position, the wafer holding table 15 is lowered to the position where the dicing tape DT is applied.

  When the wafer holding table 15 reaches the attaching position, the ring frame elevating mechanism 26 is further lowered to the attaching position of the dicing tape DT. When the ring frame elevating mechanism 26 reaches a predetermined position, each is held by a holding mechanism (not shown). At this time, supply of the dicing tape DT from the tape supply unit 19 is started. At the same time, the application roller 22 moves to the application start position. That is, the bottom surface of the wafer holding table 15 that sucks and holds the wafer W is accommodated in the opening provided in the center of the ring frame lifting mechanism 26, and the ring frame f and the wafer W are close to the adhesive surface of the dicing tape DT.

  When the affixing roller 22 reaches the affixing start position, the tension mechanism 20 holds both ends in the width direction of the dicing tape DT, and tension is applied in the tape width direction.

  Next, the affixing roller 22 rises, and the dicing tape DT is affixed to the end of the ring frame f. When the dicing tape DT is affixed to the end of the ring frame f, the affixing roller 22 rolls toward the tape supply unit 19 that is the standby position. At this time, the affixing roller 22 rolls while pressing the upper surface (non-adhesive surface) of the dicing tape DT, and affixes the dicing tape DT across the ring frame f and the back surface of the wafer W. As a result, a mount frame MF in which the ring frame f and the wafer W are integrated is manufactured.

  Prior to the application of the dicing tape DT, the back surface height of the wafer W is detected by an optical back surface height detection sensor 44 as shown in FIG. 2, for example, and the detection result is input to the control unit 42. The control unit 42 controls the operation of the drive mechanism based on the detection result, and moves the ring holding table 41 up and down to adjust the back surface height of the ring frame f. In this case, the height of the back surface of the ring frame f is set to be higher than the height of the back surface of the wafer W and within a range within 200 μm from the height of the back surface of the wafer W. In other words, the upper limit height from the wafer back surface is set to 200 μm or less. Further, as shown in the enlarged view of FIG. 3, the gap L between the inner peripheral end of the ring frame f and the outer peripheral end of the wafer W is preferably narrow. The gap L varies depending on the diameter of the wafer W, the inner diameter of the ring frame f, and the curvature of the pasting roll 22, but for example, the diameter of the wafer W is 200 mm, the inner diameter of the ring frame f is 250 mm, and the diameter of the pasting roll 22 Is 40 mm, the gap L is preferably within 3 mm. The back surface height detection sensor 44 corresponds to the detection means of the present invention, and the control unit 42 corresponds to the control means.

  Moreover, a difficult adhesion process is given to the back surface of the outer peripheral ring 41 for attachment so that the dicing tape DT attached to the outer peripheral ring 41 for attachment can be easily peeled off.

  When the sticking roller 22 reaches the end of the sticking position, the holding of the dicing tape DT by the pulling mechanism 20 is released.

  At the same time, the cutter mechanism 24 rises and cuts the dicing tape DT along the ring frame f. When the cutting of the dicing tape DT is completed, the peeling unit 23 moves toward the tape supply unit 19 and peels unnecessary dicing tape DT.

  The mount frame MF created by attaching the dicing tape DT is sucked and held by the ring frame lifting mechanism 26 with respect to the ring frame f, and the wafer W is linked upward while being sucked and held by the wafer holding table 15. It is conveyed to.

  At this time, a holding table (not shown) moves below the mount frame MF, and the mount frame MF is placed on the holding table. The mounted mount frame MF is sucked and held by the first mount frame transport mechanism 29 and transferred to a peeling table (not shown).

  The peeling table on which the mount frame MF is mounted moves toward the lower side of the peeling unit 32. When the mount frame MF reaches the lower side of the peeling unit 32, the peeling plate 33 sticks the peeling tape Ts supplied from the tape supply unit 31 while pressing it against the protective tape PT on the surface of the wafer W. The peeling plate 33 peels off the protective tape PT from the surface of the wafer W together with the peeling tape Ts while peeling the attached peeling tape Ts.

  The mount frame MF that has completed the peeling process of the protective tape PT moves to the standby position of the second mount frame transport mechanism 35 by the peeling table.

  The mount frame MF paid out from the peeling mechanism 30 is transferred to the turntable 36 by the second mount frame transport mechanism 35. The transferred mount frame MF is aligned by an orientation flat or a notch, and the accommodation direction is adjusted. When the alignment and the storage direction are determined, the mount frame MF is pushed out by the pusher and stored in the mount frame collection unit 37.

  In the above-described embodiment apparatus, the back surface height of the wafer W held on the wafer holding table 15 at the position where the dicing tape DT is attached is detected by the back surface height detection sensor 44, and the ring frame f is detected according to the detection result. Since the ring frame elevating mechanism 26 is driven and adjusted so that the back surface height is substantially the same as the back surface height of the wafer W, the adhering roller 28 is used in adhering the dicing tape DT at the wafer end. Can be reduced in deformation into the gap L. That is, it is possible to prevent the occurrence of defective sticking at the outer peripheral edge of the wafer.

  The present invention is not limited to the above-described embodiment, and can be modified as follows.

  In the above embodiment, the dicing tape DT is simultaneously attached to the ring frame f and the back surface of the wafer W. However, after the dicing tape DT is attached to the ring frame f, the wafer W is brought close to the center of the ring frame f. Then, the dicing tape DT may be rolled while being pressed by the sticking roller.

  In the case of attaching such a dicing tape DT, in the above-described embodiment apparatus, the portion of the wafer mount production section 18 is used as the tape processing section 28, and an individual application roller is provided for the information, and that portion is used as the wafer mount production section. What is necessary is just to comprise so that it may become 18.

  Specifically, as shown in FIG. 4, the tape processing unit 28 uses the ring frame f whose surface is sucked and held by the ring frame transport mechanism 17 as a holding mechanism at the position where the dicing tape DT is attached. That is, the dicing tape DT is supplied to the back surface while being held by the ring frame f, and the dicing tape DT is applied by rolling while pressing the adhering roller 22 against the non-adhesive surface in a state where tension is applied in the width direction. wear. Further, the attached dicing tape DT is cut along the ring frame f by the cutter mechanism 24.

  The ring frame f to which the dicing tape DT is affixed is attracted and held by the ring frame elevating mechanism 26 disposed above and is raised to the affixing position of the wafer W in the mount frame creation unit 18. At this time, the wafer holding table 15 is lowered so as to be close to the adhesive surface of the dicing tape DT located at the center of the ring frame. That is, the wafer holding table 15 is first reached at a predetermined position, and then the back surface height detection sensor 44 detects the back surface height of the wafer W on which the dicing tape is applied, and the ring frame is raised and lowered according to the detection result. The height of the mechanism 26 is adjusted. The set back surface height is set to be higher than the back surface height of the wafer W so that the dicing tape DT is not attracted to the wafer W during alignment.

  When the wafer pasting positions of both mechanisms 15 and 26 are determined, the individual pasting rollers 28 provided in the vicinity of the pasting positions are moved to the pasting position, and the dicing tape DT that is pasted on the back surface of the ring frame f is removed. Rolling while pressing the adhesive surface, the dicing tape DT is attached to the back surface of the wafer W. As a result, the ring frame f and the wafer W are integrated to form the mount frame MF.

  By configuring in this way, it is possible to avoid the sticking roller 28 from dropping and deforming between the ring frame f and the wafer W. That is, the same effect as the above embodiment is achieved.

  (2) The above embodiment may be configured as follows. For example, in the first half area of the outer peripheral edge of the wafer to which the dicing tape DT is stuck, a sticking failure occurs due to deformation of the sticking roller that falls into the gap between the ring frame f and the wafer W, so the inner diameter of the ring holding table 41 in the first half part Further, an affixing inner diameter ring 50 as shown in FIGS. 5 and 6 having a shape close to the outer peripheral edge of the wafer W may be provided. The inner diameter ring for application is set to have the same surface height as the back surface height of the ring frame.

  According to this configuration, since the ring frame f to the bonding surface of the dicing tape DT of the wafer W are flush with each other, a bonding failure due to the dropping of the bonding roller does not occur.

  (3) In the above embodiment, the dicing tape DT is attached from the lower side of the wafer back side. However, the dicing tape DT may be turned upside down and the dicing tape DT is attached from the upper side.

It is a whole perspective view of a wafer mount device. It is a schematic sectional drawing of a mount frame production part. It is an enlarged view of the sticking start position of a semiconductor wafer. It is a whole perspective view of a modified embodiment apparatus. It is a top view of the mount frame preparation part of a modification Example apparatus. It is AA arrow sectional drawing of a modification Example apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 15 ... Wafer holding table 22 ... Pasting roller 26 ... Ring frame raising / lowering mechanism 41 ... Ring holding table 42 ... Control part 28 ... Pasting roller f ... Ring frame DT ... Adhesive tape (dicing tape)
W ... Semiconductor wafer

Claims (6)

The ring frame and the semiconductor wafer are rolled while pressing the affixing roller against the non-adhesive surface of the adhesive tape placed opposite to the back surface of the semiconductor wafer with the protective tape placed in the center of the ring frame and the ring frame. In the wafer mounting method of pasting and integrating the adhesive surface of the adhesive tape across the back surface,
The adhesive tape setting the semiconductor wafer back surface height lower placed on the center of the ring frame to a paste ring frame back surface of the back surface height to Rutotomoni, of the semiconductor wafer diameter, the inner diameter of the ring frame, In addition, the gap from the inner peripheral edge of the ring frame to the outer peripheral edge of the wafer is set to an interval that avoids the deformation of the adhesive roller according to the curvature of the application roller, and the surface has elasticity over both the back surface of the ring frame and the semiconductor wafer. A wafer mounting method, wherein a sticking roller is rolled to attach the adhesive tape. The wafer mounting method according to claim 1,
A wafer mounting method comprising: holding the ring frame on a ring holding table; and adjusting the back surface height of the ring frame by moving the ring holding table up and down. The wafer mounting method according to claim 2,
A wafer mounting method comprising: detecting means for detecting a back surface height of the semiconductor wafer; and adjusting a height of the ring holding table based on a detection result of the detecting means. The wafer mounting method according to any one of claims 1 to 3,
A wafer mounting method, wherein the upper limit of the back surface height of the ring frame is adjusted within a range of 200 μm or less from the back surface height of the semiconductor wafer. In the wafer mount device for attaching and integrating the adhesive tape across the back surface of the semiconductor wafer with the protective tape placed in the center of the ring frame and the ring frame,
According to the diameter of the semiconductor wafer, the inner diameter of the ring frame, and the curvature of the sticking roller, the interval from the inner peripheral edge of the ring frame to the outer peripheral edge of the wafer is set,
A ring holding table for holding the ring frame;
A wafer holding table for holding the semiconductor wafer disposed in the center of the ring holding table;
Drive means for raising and lowering the ring holding table;
Control for controlling the height of the ring holding table so that the back surface height of the semiconductor wafer placed at the center of the ring frame is lower than the back surface height of the back surface of the ring frame by controlling the driving means. Means,
Affixing means for affixing the adhesive surface of the adhesive tape across the ring frame and the back surface of the semiconductor wafer by rolling while pressing an adhesive roller having elasticity on the non-adhesive surface of the adhesive tape;
Cutting means for cutting the adhesive tape attached across the ring frame and the semiconductor wafer along the ring frame;
Peeling means for peeling off the unnecessary adhesive tape after being cut by the cutting means;
A tape collecting means for collecting an unnecessary adhesive tape peeled off by the peeling means;
A wafer mounting apparatus comprising: The wafer mount apparatus according to claim 5, wherein
Detecting means for detecting the back surface height of the semiconductor wafer held on the wafer holding table;
The wafer mount apparatus characterized in that the control means controls the drive means based on the detection result of the detection means.

Images