JP5829505B2 - Sheet sticking device and sticking method - Google Patents

Description

  The present invention relates to a sheet sticking device and a sticking method, and more specifically, a sheet sticking device and a sticking method capable of avoiding wrinkles occurring in the surface of an adhesive sheet after the adhesive sheet is stuck to an adherend. About.

  The adhesive sheet is peeled off in the process of drawing out the original sheet in which the adhesive sheet is temporarily attached to the strip-shaped release sheet, and the peeled adhesive sheet is referred to as a ring frame and a semiconductor wafer (hereinafter sometimes simply referred to as “wafer”). 2. Description of the Related Art A sheet sticking device that can be attached to a wafer and mounted on a ring frame is known (see, for example, Patent Document 1).

JP-A-2005-116929

  However, in the sheet sticking device described in Patent Document 1, the tension in the sticking direction is determined by the speed difference between the feeding speed of the adhesive sheet and the moving speed of the table when sticking the adhesive sheet. Although it can be compensated by pulling, tension cannot be applied because it cannot be pulled in the direction orthogonal to the sticking direction. In addition, since the tension in the sticking direction increases, the sticking state of the adhesive sheet becomes unbalanced. Accordingly, when the adhesive sheet is affixed to the ring frame and the wafer located inside the ring frame, wrinkles and slack are generated in the adhesive sheet between the ring frame and the wafer. For example, the ring frame and the wafer are When it is supported on the table, the wafer cannot be held at an accurate position and proper dicing cannot be performed.

[Object of invention]
An object of the present invention is to adhere an adhesive sheet without causing wrinkles or slack in the surface of the adhesive sheet when the adhesive sheet is pasted at a position across the opening of the first adherend having an opening. It is providing the sheet sticking apparatus and sticking method which can be stuck on a body.

In order to achieve the above object, a sheet sticking device according to the present invention is a sticking device for sticking an adhesive sheet across an opening to an elastically deformable first adherend having an opening inside,
A holding means for holding the first adherend, a sheet supply means for feeding out the adhesive sheet, a pressing means for applying a pressing force to the adhesive sheet and bringing the adhesive sheet into contact with the first adherend, and the pressing Moving means for attaching the adhesive sheet to the first adherend by relatively moving the means and the holding means,
Said holding means further seen including a deformation force applying means for applying a deforming force to the first adherend,
The deformation force applying means adopts a configuration in which the first adherend is compressed in a direction orthogonal to the relative movement direction of the holding means .
Further, the present invention is a sticking device for sticking an adhesive sheet across the opening to the elastically deformable first adherend having an opening on the inside,
A holding means for holding the first adherend, a sheet supply means for feeding out the adhesive sheet, a pressing means for applying a pressing force to the adhesive sheet and bringing the adhesive sheet into contact with the first adherend, and the pressing Moving means for attaching the adhesive sheet to the first adherend by relatively moving the means and the holding means,
The holding means further includes a deforming force applying means for applying a deforming force to the first adherend, and the deforming force applying means is provided on both sides of the first adherend from both sides along the relative movement direction of the holding means. The structure of applying a tensile force toward the outside of the opening is adopted.

  The said sheet sticking apparatus WHEREIN: The said holding means can take the structure provided in the opening part of a said 1st to-be-adhered body so that a 2nd to-be-adhered body can be hold | maintained.

Furthermore, the present invention includes a step of holding an adherend having an opening on the inside by a holding means, a step of applying a deforming force to the first adherend in a state of being held by the holding means, and deforming the first adherend, The step of applying the pressing force by bringing the adhesive sheet into contact with the first adherend that has deformed the adhesive sheet by pressing means, and applying the pressing force to the holding means for holding the adherend and the adhesive sheet. A method of sticking the adhesive sheet to the adherend by relatively moving the pressing means, and when the first adherend is deformed, the sheet sticking method is orthogonal to the relative movement direction of the holding means. A method of compressing the first adherend in the direction to be taken is employed .
Further, the present invention includes a step of holding an adherend having an opening on the inside by a holding means, a step of applying a deformation force to the first adherend in a state of being held by the holding means, and deforming the first adherend, The step of applying the pressing force by bringing the adhesive sheet into contact with the first adherend that has deformed the adhesive sheet by pressing means, and applying the pressing force to the holding means for holding the adherend and the adhesive sheet. A method of sticking the adhesive sheet to the adherend by relatively moving the pressing means, and when the first adherend is deformed, along the relative movement direction of the holding means. A technique is adopted in which a tensile force is applied from both sides toward the outside of the opening of the first adherend.

In the sheet sticking device according to the present invention, the first adherend is temporarily elastically deformed by the deforming force applying means, and after the adhesive sheet is stuck, the deforming force is released and the original shape is restored. . Thereby, it can avoid that the sticking state of an adhesive sheet becomes unbalanced and a wrinkle and a slack generate | occur | produce in the adhesive sheet part in the opening part of a 1st to-be-adhered body.
Further, in the configuration in which the second adherend is arranged in the opening of the first adherend and integrated with each other, as described above, the occurrence of wrinkles and slack can be avoided, and as a result, the relative position of each adherend Is always in a fixed position. Therefore, for example, when the first adherend is a ring frame and the second adherend is a wafer, and the wafer is diced, there is a disadvantage that dicing is not performed due to deviation from the dicing line. Does not occur.
Furthermore, since the size of the opening of the ring frame in the orthogonal direction can be temporarily reduced by applying a compressive force to the first adherend from the direction orthogonal to the relative movement direction, the deformation by the deformation force applying means When the application of force is released and the ring frame returns to its original dimensions, it acts to absorb wrinkles and slack. That is, it is possible to cancel the deformation by preliminarily deforming the adherend side in consideration of the occurrence of wrinkles generated when the adhesive sheet to which tension is applied is applied. This relationship, deformation force applying means, the same effect may from both sides along the relative movement direction that interest to impart tensile force toward the outside of the opening portion of the first adherend of the holding means .

The schematic side view of the sheet sticking apparatus which concerns on this embodiment. (A) is a top view which shows the state before deforming a ring frame, (B) is the front view. (A) is a top view which shows the state which deform | transformed the ring frame, (B) is the front view. (A), (B) is front sectional drawing which shows a modification, (C) is A arrow sectional drawing of (B). (A), (B) is a top view which shows a modification.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. Unless otherwise specified, terms used in the present specification are based on FIG. 1, and “front” indicates the front side in the figure, while “rear” is used for the same depth side. Similarly, “left”, “right”, “upper”, and “lower” are based on FIG.

  As shown in FIG. 1, the sheet sticking apparatus 10 holds a ring frame FR as a first adherend and a wafer WF as a second adherend disposed in the opening FRa of the ring frame FR. Holding means 12, sheet feeding means 14 for feeding out the adhesive sheet AS, pressing means 16 for applying a pressing force to the adhesive sheet AS and bringing the adhesive sheet AS into contact with the ring frame FR, pressing means 16 and holding means 12, a moving means 18 for attaching the adhesive sheet AS to the ring frame FR and the wafer WF by relative movement, and a deformation force applying means 20 for applying a deformation force to the ring frame FR.

  The ring frame FR according to the present invention employs, for example, a resin ring frame and is deformed when an external force is applied, but can be restored to its original shape when the external force is released. The one with is used. As shown in FIG. 2, the ring frame FR according to the embodiment has a circular inner edge and a shape having a linear edge FRb at four positions on the outer periphery.

  The holding means 12 is constituted by a table 21. The upper surface of the table 21 is a mounting surface for the wafer WF, and the wafer WF can be sucked and held by a decompression unit such as a decompression pump or a vacuum ejector (not shown).

  The sheet supply means 14 is driven by a support roller 25 that supports the original fabric RS, a peeling member 26 that folds the release sheet RL and peels the adhesive sheet AS from the release sheet RL, and a rotation motor 27 as a drive device. Drive roller 28, a pinch roller 29 that sandwiches the release sheet RL between the drive roller 28, a take-up roller 30 that is driven by a driving device (not shown) and winds up the release sheet RL, and a plurality of guide rollers 31 to 33. And is configured. Each of these members can be configured as a single unit supported by a plate-like frame.

  The pressing means 16 includes a roller 34. The roller 34 is rotatably supported by a plate-like frame that supports each member of the sheet supply unit 14.

  The moving means 18 is composed of a linear motion motor 40 as a drive device extending in the left-right direction. A table 21 is supported on the upper surface of a slider 41 of the linear motion motor 40, and the table 21 is moved in the sticking direction. It can move in the direction DR.

  The deforming force applying means 20 is provided on the table 21 and is located on both sides in a direction orthogonal to the moving direction DR of the table 21 (hereinafter referred to as “orthogonal direction DS”), that is, the ring frame FR. A pair of abutting members 51 that abut on the ring frame FR from the front and rear linear edge portions FRb, and a linear motor 53 as a drive device that moves the abutting members 51. The contact member 51 is supported by the output shaft 54 of the linear motor 53, and is provided so as to be able to apply a deformation force (compression force) in the orthogonal direction DS to the ring frame FR.

  Next, the sheet sticking method in this embodiment is demonstrated.

  The wafer WF is transferred onto the table 21 through a transfer means (not shown) so that the wafer WF is disposed inside the opening FRa of the ring frame FR. At this time, the ring frame FR is arranged in a direction in which the pair of linear edges FRb are parallel to the moving direction DR of the table 21. Since no deformation force is applied to the ring frame FR in the disposed state, the inner diameter of the opening FRa of the ring frame FR is the inner diameter DW1 before deformation as shown in FIG.

Next, the linear motion motor 53 drives the pair of contact members 51 in directions approaching each other, and applies a deformation force inward in the orthogonal direction DS to the ring frame FR.
Thereby, as shown in FIG. 3B, the ring frame FR is deformed so that the inner diameter dimension of the opening FRa along the direction orthogonal to the moving direction DR becomes a post-deformation inner diameter DW2 smaller than the pre-deformation inner diameter DW1. To do.

  In the sheet supply means 14, the adhesive sheet AS stands by with the lead end positioned at the left end of the release plate 26, and the table 21 is moved along the moving direction DR from the position indicated by the two-dot chain line in FIG. 1. When it is detected by a sensor (not shown) that the movement has started and reached a predetermined position, the rotation motor 27 is driven to feed out the original fabric RS, and the lead end of the adhesive sheet AS is fed out to the upper surface of the ring frame FR. . Then, the adhesive sheet AS is pressed against and brought into contact with the ring frame FR by the pressing means 16.

  The table 21 is further moved in the movement direction DR in synchronization with the feeding of the original fabric RS, so that the adhesive sheet AS is attached to the entire surface of the ring frame FR and the wafer WF. At this time, it is possible to apply tension to the adhesive sheet AS by relatively increasing the moving speed of the table 21 with respect to the peeling speed of the adhesive sheet AS, that is, the feeding speed of the original fabric RS.

  Next, the ring frame FR returns to its original shape due to its elasticity by driving the pair of contact members 51 in directions away from each other and releasing the application of the deformation force by the deformation force applying means 20. The inner diameter of the opening FRa of the FR returns to the inner diameter DW1 before deformation. Thereby, a tension | tensile_strength is provided to the said orthogonal direction DS with respect to the adhesive sheet in which the tension | tensile_strength was not provided to orthogonal direction DS. Therefore, even if the adhesive sheet AS is applied in a tensioned state due to the speed difference between the feeding speed of the adhesive sheet AS and the moving speed of the table, the adhesive sheet is formed in the opening FRa between the ring frame FR and the wafer WF. Occurrence of wrinkles and slack in the AS can be avoided.

  Next, the wafer WF integrated with the ring frame FR via the adhesive sheet AS is transferred to the next process by a transfer means (not shown), the table 21 returns to the position indicated by the two-dot chain line in FIG. Will be repeated.

  Therefore, according to the present embodiment, when the wafer WF is mounted on the ring frame FR, wrinkles or the like are not generated in the adhesive sheet AS portion between the ring frame FR and the wafer WF. In the case where the wafer WF is diced later, there is an effect of not causing a problem that dicing is not performed properly due to deviation from the dicing line.

The best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
That is, the invention has been illustrated and described with particular reference to particular embodiments, but it should be understood that the above-described embodiments are not deviated from the technical idea and scope of the invention. On the other hand, various modifications can be made by those skilled in the art in shape, quantity, and other detailed configurations.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

For example, as shown in FIG. 4, the deformation force applying means 20 moves the clamper 50 that fixes both sides of the moving direction DR in the ring frame FR to the table 21 side, and both sides of the ring frame FR in the orthogonal direction DS upward. You may comprise with the lift means 51. FIG. The clamper 50 includes a claw member 54 on an output shaft 53 of a direct acting motor 52 as a driving device, and the lift means 51 is a universal joint at the tip of an output shaft 56 of a direct acting motor 55 as a driving device. The structure provided with the raising board 58 provided with the structure can be illustrated.
According to such a modification, the ring frame FR is deformed to have an inner diameter DW3 smaller than the inner diameter DW1 along the orthogonal direction DS, as shown in FIGS. And after sticking adhesive sheet AS to ring frame RF similarly to the above, when cancellation | release of provision of a deformation | transformation force is returned to the internal diameter DW1 before a deformation | transformation, it will cancel out and it will become possible to avoid generation | occurrence | production of wrinkles.

  In the embodiment, the wafer WF is disposed in the opening FRa of the ring frame FR and the adhesive sheet AS is pasted. However, the adhesive sheet AS is pasted only on the ring frame FR without placing the wafer WF. You may do it.

  In the embodiment, the holding means 12 is attached by moving the holding means 12 without moving the pressing means 16, but the pressing means 16 may be moved without moving the holding means 12 side. Moreover, both the holding means 12 and the pressing means 16 may be moved.

  Further, as shown in FIG. 5, the ring frame FR may be pulled from both sides in the feeding direction of the adhesive sheet AS so that the inner diameter dimension of the opening portion FRa is larger than the inner diameter DL1 before deformation to be the inner diameter DL2 after deformation. Good.

  Further, in the above-described embodiment, the pasting of the single-sheet adhesive sheet AS previously punched in accordance with the shape of the ring frame FR has been exemplified. However, the adhesive sheet AS is a band-shaped one, and after the pasting operation is performed, the ring is attached. It is good also as a structure further provided with the cutting | disconnection means which cut | disconnects adhesive sheet AS according to the shape of flame | frame FR.

  Furthermore, the ring frame FR is not limited to a resin one, but may be any one that can be elastically deformed, and may be a rubber one, a metal one, or the like.

  Further, the ring frame FR may be processed in a state where the linear edge FRb is rotated by a predetermined angle in the circumferential direction of the ring frame FR and placed on the table 21.

  In addition, the type and material of the adherend and the adhesive sheet AS in the present invention are not particularly limited. For example, the adhesive sheet AS has an intermediate layer between the base sheet and the adhesive layer, Three or more layers such as those having a cover layer on the upper surface of the material sheet may be used, or a single layer composed only of an adhesive layer may be used. The semiconductor wafer can be exemplified by a silicon semiconductor wafer, a compound semiconductor wafer, and the like. The adhesive sheet to be attached to such a semiconductor wafer is not limited to a protective sheet, dicing tape, and die attach film, but any other sheet or film. Adhesive sheets with arbitrary uses and shapes, such as tape, can be applied. Further, the second adherend may be an optical disk substrate, and the adhesive sheet S may have a resin layer constituting a recording layer. As described above, as the second adherend, not only a glass plate, a steel plate, a resin plate, and other plate-like members but also members and articles of any form can be targeted.

  Furthermore, the drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

Further, the deformation force applying means 20 may fix one of the orthogonal directions DS in the ring frame FR and apply a compression force from the other, or fix one of the moving directions DR in the ring frame FR, and A tensile force may be applied.
Furthermore, it is good also as a structure which provides a tensile force from the both sides of the moving direction DR, providing a deformation force from the both sides of the orthogonal direction DS in the ring frame FR.
Moreover, it is good also as a structure which provides a deformation | transformation force to the ring frame FR by the lift means 51, providing a tensile force from the both sides of the moving direction DR.

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 12 Holding means 14 Sheet supply means 16 Press means 18 Moving means 20 Deformation force provision means AS Adhesive sheet FR Ring frame (1st adherend)
FRa opening WF semiconductor wafer (second adherend)

Claims (4)

A sticking device for sticking an adhesive sheet across the opening to an elastically deformable first adherend having an opening on the inside,
A holding means for holding the first adherend, a sheet supply means for feeding out the adhesive sheet, a pressing means for applying a pressing force to the adhesive sheet and bringing the adhesive sheet into contact with the first adherend, and the pressing Moving means for attaching the adhesive sheet to the first adherend by relatively moving the means and the holding means,
Said holding means further seen including a deformation force applying means for applying a deforming force to the first adherend,
The deforming force applying means compresses the first adherend in a direction orthogonal to the relative movement direction of the holding means . A sticking device for sticking an adhesive sheet across the opening to an elastically deformable first adherend having an opening on the inside,
A holding means for holding the first adherend, a sheet supply means for feeding out the adhesive sheet, a pressing means for applying a pressing force to the adhesive sheet and bringing the adhesive sheet into contact with the first adherend, and the pressing Moving means for attaching the adhesive sheet to the first adherend by relatively moving the means and the holding means,
The holding means further includes a deforming force applying means for applying a deforming force to the first adherend, and the deforming force applying means is provided on both sides of the first adherend from both sides along the relative movement direction of the holding means. A sheet sticking device that applies a tensile force toward an outside of an opening . Holding the adherend having an opening on the inside with a holding means;
Applying a deforming force to the first adherend in a state of being held by the holding means and deforming the first adherend,
Applying the pressing force by bringing the adhesive sheet into contact with the first adherend that has deformed the adhesive sheet by pressing means;
A method of sticking the adhesive sheet to the adherend by relatively moving a holding means for holding the adherend and a pressing means for applying a pressing force to the adhesive sheet ,
A sheet sticking method, comprising: compressing the first adherend in a direction orthogonal to a relative movement direction of the holding means when the first adherend is deformed . Holding the adherend having an opening on the inside with a holding means;
Applying a deforming force to the first adherend in a state of being held by the holding means and deforming the first adherend,
Applying the pressing force by bringing the adhesive sheet into contact with the first adherend that has deformed the adhesive sheet by pressing means;
A method of sticking the adhesive sheet to the adherend by relatively moving a holding means for holding the adherend and a pressing means for applying a pressing force to the adhesive sheet,
When the first adherend is deformed, a tensile force is applied from both sides along the relative movement direction of the holding means toward the outside of the opening of the first adherend. .

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