JPS6451911A - Sticking device for mounting frame for semiconductor wafer - Google Patents

Sticking device for mounting frame for semiconductor wafer

Info

Publication number
JPS6451911A
JPS6451911A JP20757887A JP20757887A JPS6451911A JP S6451911 A JPS6451911 A JP S6451911A JP 20757887 A JP20757887 A JP 20757887A JP 20757887 A JP20757887 A JP 20757887A JP S6451911 A JPS6451911 A JP S6451911A
Authority
JP
Japan
Prior art keywords
mounting frame
sticking roller
frame
adhesive tape
sticking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20757887A
Other languages
Japanese (ja)
Inventor
Minoru Ametani
Mitsuharu Daimatsu
Saburo Miyamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP20757887A priority Critical patent/JPS6451911A/en
Publication of JPS6451911A publication Critical patent/JPS6451911A/en
Pending legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To enable favorable adhesion free from entering of air extending over the whole circumference of a mounting frame, by a method wherein a sticking roller is extruded through a position on the opposite side of a frame/ chuck table and an extruded adhesion tape part is stuck to the mounting frame by pressing the same against the mounting frame under a linear contacting state. CONSTITUTION:A part of an adhesive tape B against which a sticking roller 6 abuts is pressed against a mounting frame F. The pressing is made in a linear contact at the top of the sticking roller 6. Therefore, a wedgy space having a linear contact pressing position P with the sticking roller 6 for its top is generated between the mounting frame F and adhesive tape B. When the sticking roller 6 is turned along the mounting frame F under this state, the sticking roller 6 is turned over the frame F so that the adhesive tape B is pulled in between them. Therefore, there is no gap between the adhesive tape B and molding frame F, into which air is allowed to enter and they become a state where they adhere close to each other at their sticking part.
JP20757887A 1987-08-21 1987-08-21 Sticking device for mounting frame for semiconductor wafer Pending JPS6451911A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20757887A JPS6451911A (en) 1987-08-21 1987-08-21 Sticking device for mounting frame for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20757887A JPS6451911A (en) 1987-08-21 1987-08-21 Sticking device for mounting frame for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS6451911A true JPS6451911A (en) 1989-02-28

Family

ID=16542076

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20757887A Pending JPS6451911A (en) 1987-08-21 1987-08-21 Sticking device for mounting frame for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS6451911A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59213979A (en) * 1983-05-20 1984-12-03 Nippon Piston Ring Co Ltd Device for fluidly supporting rotary sleeve in rotary compressor
US5494549A (en) * 1992-01-08 1996-02-27 Rohm Co., Ltd. Dicing method
JP2006165385A (en) * 2004-12-09 2006-06-22 Nitto Denko Corp Wafer mounting method and wafer mounting equipment using the same
JP2007036111A (en) * 2005-07-29 2007-02-08 Tokyo Seimitsu Co Ltd Film peeling method and device
CN100353504C (en) * 2003-07-14 2007-12-05 日东电工株式会社 Substrate joining method and apparatus
JP2011055000A (en) * 2010-12-01 2011-03-17 Tokyo Seimitsu Co Ltd Method and device for peeling film
JP2018006618A (en) * 2016-07-05 2018-01-11 株式会社ディスコ Expansion device and expansion method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59213979A (en) * 1983-05-20 1984-12-03 Nippon Piston Ring Co Ltd Device for fluidly supporting rotary sleeve in rotary compressor
US5494549A (en) * 1992-01-08 1996-02-27 Rohm Co., Ltd. Dicing method
CN100353504C (en) * 2003-07-14 2007-12-05 日东电工株式会社 Substrate joining method and apparatus
JP2006165385A (en) * 2004-12-09 2006-06-22 Nitto Denko Corp Wafer mounting method and wafer mounting equipment using the same
JP2007036111A (en) * 2005-07-29 2007-02-08 Tokyo Seimitsu Co Ltd Film peeling method and device
JP2011055000A (en) * 2010-12-01 2011-03-17 Tokyo Seimitsu Co Ltd Method and device for peeling film
JP2018006618A (en) * 2016-07-05 2018-01-11 株式会社ディスコ Expansion device and expansion method

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