JP2021197544A - Adhesive sheet pasting method, adhesive sheet pasting device, and manufacturing method of semiconductor product - Google Patents

Abstract

To provide an adhesive sheet pasting method that can accurately paste an adhesive sheet to an annular convex portion forming surface of a semiconductor wafer on which an annular convex portion is formed while more reliably avoiding damage to the semiconductor wafer, an adhesive sheet pasting device, and a manufacturing method of a semiconductor product.SOLUTION: An adhesive sheet pasting method includes a pasting step of pasting an adhesive sheet DT to an annular convex portion forming surface of a wafer W having an annular convex portion Ka on the outer periphery of one surface by applying pressure higher than atmospheric pressure to a sheet composite M formed by adhering the adhesive sheet DT to the annular convex portion forming surface of the wafer W. In the pasting step, since sufficiently large pressing force V1 can be applied to the adhesive sheet DT, the adhesive force between the adhesive sheet DT and the wafer W can be greatly improved. Therefore, it is possible to prevent the adhesive sheet DT from peeling off from the wafer W even when the time has passed.SELECTED DRAWING: Figure 14

Description

The present invention is a method for attaching an adhesive sheet, an adhesive sheet, which is used to attach an adhesive sheet using a tape-shaped adhesive material as an example to a work such as a semiconductor wafer (hereinafter, appropriately referred to as "wafer") or a substrate. The present invention relates to a pasting device and a method for manufacturing a semiconductor product.

After the circuit pattern is formed on the surface of the wafer, the back surface of the wafer is ground by a back grind process, and the wafer is further divided into a large number of chip parts by a dicing process.
In the back surface grinding step, only the central portion may be ground while leaving the back surface outer circumference of the wafer, and an annular convex portion may be formed on the back surface outer circumference of the wafer so as to surround the back grind area.

In this case, even when the central portion of the wafer is thinned, it is reinforced by the annular convex portion, so that it is possible to avoid distortion or the like during handling. After the back grind step, a wafer having an annular protrusion is placed in the center of the ring frame, and a supporting adhesive tape (dicing tape) is attached over the ring frame and the back surface of the wafer. A mount frame is created by attaching the dicing tape and used for the dicing process.

The following is proposed as an example of a method of attaching an adhesive sheet using a dicing tape as an example to a wafer in which a step is formed by an annular convex portion. That is, the adhesive sheet is sandwiched between the joint portions of the chamber consisting of a pair of upper and lower housings. Then, the pressure inside the chamber is reduced to generate a differential pressure in the two spaces partitioned by the adhesive sheet, and the adhesive tape is recessed and curved to attach the adhesive sheet to the back surface of the wafer. Further, after the differential pressure in the chamber is eliminated, the gas is supplied from the first pressing member to the inner corner portion of the adhesive sheet that is floating without being completely adhered at the inner corner portion of the annular convex portion for the second time. The pasting process is performed (see Patent Document 1).

Japanese Unexamined Patent Publication No. 2013-232582

However, the above-mentioned conventional apparatus has the following problems. That is, in the conventional method of attaching the adhesive sheet, a time elapses after the adhesive sheet is attached. Therefore, there is a problem that the adhesive sheet is peeled off from the inner corner portion of the annular convex portion toward the center of the wafer. Further, in the conventional adhesive sheet attaching method, there is a problem that the wafer is damaged such as cracked or chipped when the adhesive sheet is attached to the wafer. Wafer damage occurs relatively frequently in the thinner parts of the wafer, especially in the inner corners of the annular protrusion.

The present invention has been made in view of such circumstances, and it is more certain that the semiconductor wafer is damaged with respect to the annular convex portion forming surface of the semiconductor wafer on which the annular convex portion is formed. The main object of the present invention is to provide a method for attaching an adhesive sheet, an apparatus for attaching an adhesive sheet, and a method for manufacturing a semiconductor product, which can attach the adhesive sheet with high accuracy while avoiding the problem.

As a result of studies by the present inventors in order to solve the above problems, the following findings were obtained. That is, in the conventional configuration in which the second sticking process is performed using the first pressing member, the force acting on the adhesive sheet is small. Therefore, it is difficult to sufficiently improve the adhesion between the wafer and the pressure-sensitive adhesive sheet, and it is considered that the pressure-sensitive adhesive sheet is peeled off from the wafer over time.

Further, in the second pasting process, a relatively large pressing force acts on the inner corner portion of the annular convex portion of the wafer as compared with the central portion of the wafer. It is considered that cracking or chipping occurs particularly frequently in the inner corner portion of the annular convex portion of the wafer on which a relatively large pressing force acts due to such a biased pressing force.

The first pressing member is a columnar member having a gas supply hole and made of metal, resin, or the like. In the conventional configuration, the bottom surface of the first pressing member is brought close to the wafer to supply gas. By bringing the first pressing member closer to the wafer, the first pressing member may come into contact with the central portion of the wafer which has been made concave due to the thinning process, and the thin concave portion of the wafer may be damaged. When the flatness of the bottom surface of the first pressing member is low, even if the first pressing member is close to the inner corner portion of the annular convex portion of the wafer, the first pressing member is placed on another portion (for example, the central portion) of the wafer. 1 It is considered that the pressing members come into contact with each other, resulting in damage to the wafer.

In order to achieve such an object, the present invention has the following configuration.
That is, in the method for attaching an adhesive sheet according to the present invention, the pressure is applied to a sheet complex formed by adhering an adhesive sheet to the annular convex portion forming surface of a work having an annular convex portion on the outer periphery of one surface. The sticking process of sticking the adhesive sheet to the annular convex portion forming surface by applying high pressure, and
It is characterized by having.

(Action / Effect) According to this configuration, the adhesive sheet is attached to the annular convex portion forming surface of the work by applying a pressure higher than the atmospheric pressure to the sheet complex in the attaching process. In this case, since a sufficiently large pressing force can be applied to the pressure-sensitive adhesive sheet, the adhesion between the pressure-sensitive adhesive sheet attached to the work and the annular convex portion forming surface of the work can be further improved. Therefore, it is possible to more reliably prevent the adhesive sheet from peeling off from the work after the lapse of time.

Further, in the above-described invention, the accommodation process of accommodating the sheet complex in the chamber is provided. It is preferable to attach it to the part forming surface.

(Action / Effect) According to this configuration, after the sheet complex is housed in the chamber, the pressure in the internal space of the chamber is increased to apply a pressure higher than the atmospheric pressure to the sheet complex. In this case, the pressing force can be uniformly applied to the entire pressure-sensitive adhesive sheet by pressurizing the internal space. Therefore, it is possible to reliably avoid the occurrence of irregularities on the surface of the pressure-sensitive adhesive sheet due to the bias of the force acting on the pressure-sensitive adhesive sheet, so that the flatness of the pressure-sensitive adhesive sheet in the state where the pressure-sensitive adhesive sheet is attached to the wafer can be more reliably prevented. Can be improved. Further, it is possible to avoid a situation in which the wafer is damaged due to the bias of the force acting on a part of the wafer due to the bias of the force acting on the adhesive sheet.

Further, in the above-described invention, the chamber includes an upper housing and a lower housing, and in the pasting process, the adhesive sheet is sandwiched between the upper housing and the lower housing to create an internal space of the chamber. The upper and lower space forming process that divides the lower space in which the work is arranged with the annular convex portion forming surface facing upward, and the upper space facing the lower space via the adhesive sheet, and the upper space. It is preferable to have a space pressurizing process in which the pressure-sensitive adhesive sheet is attached to the annular convex portion forming surface by pressurizing at least the upper space among the lower space.

(Action / Effect) According to this configuration, the internal space of the chamber is divided into a lower space and an upper space by sandwiching the adhesive sheet between the upper housing and the lower housing. At this time, since the adhesive sheet acts as a sealing material, it is possible to prevent gas from leaking between the lower space and the upper space in the internal space of the chamber. Therefore, at least by pressurizing the upper space, the pressing force in the upper space acts on the pressure-sensitive adhesive sheet with high accuracy. Therefore, it is possible to further improve the adhesion between the adhesive sheet attached to the work and the surface of the work on which the annular convex portion is formed.

Further, in the above-described invention, the adhesive sheet has a predetermined shape corresponding to the annular convex portion forming surface of the work and is held by a long transport sheet, and the chamber has an upper housing and a lower housing. In the pasting process, the transport sheet is sandwiched between the upper housing and the lower housing, so that the work is arranged in the internal space of the chamber with the annular convex portion forming surface facing upward. A process of forming an upper and lower space that divides the lower space to be divided into an upper space facing the lower space via the adhesive sheet held by the transport sheet, and at least one of the upper space and the lower space. It is preferable to have a space pressurizing process in which the pressure-sensitive adhesive sheet is attached to the annular convex portion forming surface by pressurizing the upper space.

(Action / Effect) According to this configuration, the pressure-sensitive adhesive sheet has a predetermined shape in advance according to the annular convex portion forming surface of the work. Therefore, the pressure-sensitive adhesive sheet can be appropriately attached to the annular convex portion forming surface according to the position and shape of the annular convex portion forming surface of the work. Further, since a step of cutting the adhesive sheet into an appropriate predetermined shape is not required, the step of attaching the adhesive sheet can be shortened.

Further, the adhesive sheet is held by a long transport sheet, and the transport sheet is sandwiched between the upper housing and the lower housing to form a chamber. In this case, even when a material having a high adhesive strength is used as the adhesive sheet in order to bring the work and the adhesive sheet into close contact with each other, both housings can sandwich the transport sheet without coming into contact with the adhesive sheet. Therefore, it is possible to avoid a situation in which the adhesive sheet adheres to the chamber and does not peel off, which hinders the pasting process.

Further, by holding the adhesive sheet on the long transport sheet, even if the adhesive sheet is preliminarily molded into a predetermined shape, the long transport sheet is fed and supplied along a predetermined path. By doing so, the adhesive sheet can be accurately conveyed along the predetermined path. That is, it is possible to improve the transport accuracy of the adhesive sheet while avoiding making the adhesive sheet long and incurring unnecessary costs.

Further, in the above-described invention, the adhesive sheet is provided by providing a sheet-like elastic body disposed inside the upper housing, and the adhesive sheet is sandwiched between the upper housing and the lower housing in the process of forming the upper and lower spaces. It is preferable that the sheet-shaped elastic body is arranged so that the sheet-shaped elastic body comes into contact with the pressure-sensitive adhesive sheet.

(Action / Effect) According to this configuration, according to this configuration, the sheet-shaped elastic body is deformed convexly with a more uniform curvature over the entire surface due to the differential pressure. Therefore, the adhesive sheet is easily deformed according to the shape of the annular convex portion forming surface of the work, so that the adhesion between the annular convex portion forming surface and the adhesive sheet can be improved. Therefore, the adhesive sheet can be attached to the annular convex portion forming surface with higher accuracy.

Further, in the above-described invention, a heating process for heating the pressure-sensitive adhesive sheet by heating at least one of the lower space and the upper space is provided, and the pasting process is heated by the heating process. It is preferable to attach the pressure-sensitive adhesive sheet to the annular convex portion forming surface by applying a pressure higher than atmospheric pressure to the pressure-sensitive adhesive sheet in a state of being in a state of being.

(Action / Effect) According to this configuration, the adhesive sheet becomes softer by heating the adhesive sheet by the heating process. That is, since the adhesive sheet is easily deformed according to the shape of the annular convex portion forming surface of the work, the adhesion between the annular convex portion forming surface and the adhesive sheet can be improved.

In order to achieve such an object, the present invention may have the following configuration.
That is, the pressure-sensitive adhesive sheet affixing device according to the present invention is applied to a sheet complex formed by adhering an adhesive sheet to the annular convex portion forming surface of a work having an annular convex portion on the outer periphery of one surface, from atmospheric pressure. It is also characterized by comprising a sticking mechanism for sticking the pressure-sensitive adhesive sheet to the annular convex portion forming surface by applying a high pressure.

(Action / Effect) In the sticking mechanism according to the present invention, the adhesive sheet is stuck to the annular convex portion forming surface of the work by applying a pressure higher than the atmospheric pressure to the sheet composite. In this case, since a sufficiently large pressing force can be applied to the pressure-sensitive adhesive sheet, the adhesion between the pressure-sensitive adhesive sheet attached to the work and the annular convex portion forming surface of the work can be further improved. Therefore, it is possible to more reliably prevent the adhesive sheet from peeling off from the work after the lapse of time.

In order to achieve such an object, the present invention may have the following configuration.
That is, the method for manufacturing a semiconductor product according to the present invention is a semiconductor for manufacturing a semiconductor product in which an adhesive sheet is attached to an annular convex portion forming surface of a work having an annular convex portion on the outer periphery of one surface. It ’s a product manufacturing method.
Affixing the adhesive sheet to the annular convex portion forming surface by applying a pressure higher than atmospheric pressure to the sheet complex formed by adhering the adhesive sheet to the annular convex portion forming surface of the work. The process and
It is characterized by having.

(Action / Effect) According to this configuration, it is possible to suitably manufacture a semiconductor product in which an adhesive sheet is attached to an annular convex portion forming surface of a work having an annular convex portion on the outer periphery of one surface. That is, in the pasting process, the pressure-sensitive adhesive sheet is pasted on the annular convex portion forming surface of the work by applying a pressure higher than the atmospheric pressure to the sheet composite. In this case, since a sufficiently large pressing force can be applied to the pressure-sensitive adhesive sheet, the adhesion between the pressure-sensitive adhesive sheet and the annular convex portion forming surface of the work can be further improved in the sheet composite through the pasting process. Therefore, it is possible to more reliably prevent the adhesive sheet from peeling off from the work after the lapse of time.

According to the pressure-sensitive adhesive sheet sticking method, the pressure-sensitive adhesive sheet sticking device, and the method for manufacturing a semiconductor product according to the present invention, the pressure-sensitive adhesive sheet is formed into an annular convex portion of a work by applying a pressure higher than atmospheric pressure to the sheet composite. Paste on the surface. In this case, since a sufficiently large pressing force can be applied to the pressure-sensitive adhesive sheet, the adhesion between the pressure-sensitive adhesive sheet attached to the work and the annular convex portion forming surface of the work can be further improved. Therefore, it is possible to more reliably prevent the adhesive sheet from peeling off from the work after the lapse of time. Further, since the large pressing force can be applied uniformly over the entire work, it is possible to prevent damage such as cracking or chipping of the work due to the bias of the pressing force acting on the work.

It is a figure which shows the structure of the semiconductor wafer which concerns on Example 1. FIG. (A) is a partially cutaway perspective view of the semiconductor wafer, (b) is a perspective view of the back surface side of the semiconductor wafer, and (c) is a partial vertical sectional view of the semiconductor wafer. It is a vertical sectional view which shows the structure of the adhesive sheet which concerns on Example 1. FIG. It is a top view of the adhesive sheet sticking apparatus which concerns on Example 1. FIG. It is a front view of the adhesive sheet sticking apparatus which concerns on Example 1. FIG. It is a front view of the pasting unit which concerns on Example 1. FIG. It is a vertical sectional view of the chamber which concerns on Example 1. FIG. It is a flowchart which shows the operation of the adhesive sheet sticking apparatus which concerns on Example 1. FIG. It is a perspective view of the mount frame which concerns on Example 1. FIG. It is a figure explaining the step S2 which concerns on Example 1. FIG. It is a figure explaining step S3 which concerns on Example 1. FIG. It is a figure explaining step S3 which concerns on Example 1. FIG. It is a figure explaining step S4 which concerns on Example 1. FIG. It is a figure explaining step S4 which concerns on Example 1. FIG. It is a figure explaining the step S5 which concerns on Example 1. FIG. It is a figure explaining step S6 which concerns on Example 1. FIG. It is a figure explaining step S6 which concerns on Example 1. FIG. It is a figure explaining the step S7 which concerns on Example 1. FIG. It is a figure which shows the structure of the adhesive sheet and the transport sheet which concerns on Example 2. FIG. (A) is a perspective view of the back surface side of the adhesive sheet and the transport sheet, and (b) is a vertical sectional view of the adhesive sheet and the transport sheet. It is a flowchart which shows the operation of the adhesive sheet sticking apparatus which concerns on Example 2. FIG. It is a figure explaining the step S1 which concerns on Example 2. FIG. It is a figure explaining step S2 which concerns on Example 2. FIG. It is a figure explaining step S3 which concerns on Example 2. FIG. It is a figure explaining step S3 which concerns on Example 2. FIG. It is a figure explaining step S4 which concerns on Example 2. FIG. It is a figure explaining step S4 which concerns on Example 2. FIG. It is a figure explaining the step S5 which concerns on Example 2. FIG. It is a figure explaining step S6 which concerns on Example 2. FIG. It is a figure explaining step S6 which concerns on Example 2. FIG. It is a figure explaining step S7 which concerns on Example 2. FIG. It is a figure explaining the structure which concerns on the modification. It is a figure explaining the structure which concerns on the modification. (A) is a vertical sectional view showing the configuration of the adhesive tape and the transport sheet according to the modified example, and (b) is a vertical sectional view illustrating the configuration of the sheet cutting device according to the modified example. It is a figure explaining the structure which concerns on the modification. (A) is a vertical sectional view showing a configuration including an elastic body according to a modified example, (b) is a diagram for explaining a problem that may occur in a configuration without an elastic body, and (c) is a diagram for explaining an elastic body. It is a figure explaining the advantage in the structure which has. It is a figure explaining the structure which concerns on the modification. (A) is a vertical cross-sectional view showing a configuration including a heating mechanism according to a modified example, and (b) is a vertical cross-sectional view illustrating an example of a step of heating the adhesive tape by the heating mechanism.

Hereinafter, the first embodiment of the present invention will be described with reference to the drawings. In the adhesive sheet attaching device 1 according to the first embodiment, the adhesive tape DT (dicing tape) for support is used as the adhesive sheet, and the semiconductor wafer W (hereinafter referred to as “wafer W”) is used as the work to which the adhesive sheet is attached. ), And the ring frame f shall be used. That is, in the adhesive sheet attaching device 1 according to the first embodiment, the mount frame MF is created by attaching the adhesive tape DT over the wafer W and the ring frame f.

As shown in FIGS. 1A to 1C, the wafer W is backgrinded with a protective tape PT for circuit protection attached to the surface on which the circuit pattern is formed. be. The back surface of the wafer W is ground (back grinded) with the outer peripheral portion remaining about 3 mm in the radial direction. That is, a flat concave portion He is formed on the back surface thereof, and an annular convex portion Ka is processed along the outer peripheral portion thereof to be used. As an example, the flat recess He is processed so that the depth d to be ground is several hundred μm and the wafer thickness J of the flat recess He is 30 μm to 50 μm. Therefore, the annular convex portion Ka formed on the outer periphery of the back surface functions as an annular rib that enhances the rigidity of the wafer W, and suppresses bending deformation of the wafer W in handling and other processing steps. The inner corner portion of the annular convex portion Ka is shown using the reference numeral Kf. The inner corner portion Kf corresponds to the boundary between the annular convex portion Ka and the flat concave portion He. The back surface of the wafer W corresponds to the annular convex portion forming surface of the work in the present invention.

As shown in FIG. 2, the adhesive tape DT used in this embodiment has a long structure in which a non-adhesive base material Ta and an adhesive adhesive material Tb are laminated. A separator S is attached to the adhesive material Tb. That is, the separator S is attached to the adhesive surface of the adhesive tape DT, and the adhesive surface of the adhesive tape DT is exposed by peeling the separator S from the adhesive tape DT.

Examples of materials constituting the base material Ta include polyolefin, polyethylene, ethylene-vinyl acetate copolymer, polyester, polyimide, polyurethane, vinyl chloride, polyethylene terephthalate, polybutylene terephthalate, polyethylene terenaphthalate, polyvinylidene chloride, and polyethylene methacrylic. Examples thereof include acid copolymers, polypropylenes, terephthalates methacrylic acid, polyamideimides, and polyurethane elastomers. A combination of a plurality of the above-mentioned materials may be used as the base material Ta. Further, the base material Ta may be a single layer or may be configured by laminating a plurality of layers.

The adhesive material Tb is preferably composed of a material that can ensure the function of maintaining the state in which the adhesive tape DT adheres to the wafer W and the ring frame f and the function of preventing the chip parts from scattering in the subsequent dicing step. .. Examples of the material constituting the adhesive material Tb include an acrylic acid ester copolymer and the like. Examples of the separator S include long paper materials and plastics. An adhesive or an adhesive may be used instead of the adhesive Tb.

<Explanation of the overall configuration>
Here, the overall configuration of the adhesive sheet pasting device 1 according to the first embodiment will be described. FIG. 3 is a plan view showing a basic configuration of the adhesive sheet pasting device 1 according to the first embodiment. The adhesive sheet attaching device 1 is configured to include a horizontally long rectangular portion 1a and a protruding portion 1b. The protruding portion 1b is configured to be connected at the central portion of the rectangular portion 1a and protrude upward. In the following description, the longitudinal direction of the rectangular portion 1a is referred to as a left-right direction (x direction), and the horizontal direction (y direction) orthogonal to the left-right direction is referred to as a front-back direction.

A wafer transfer mechanism 3 is provided on the right side of the rectangular portion 1a. Two containers 5 accommodating the wafer W are placed in parallel at a position on the lower right side of the rectangular portion 1a. Inside the container 5, the wafer W to which the protective tape PT is attached to the surface is stored in multiple stages with the surface side facing downward. At the left end of the rectangular portion 1a, a frame recovery unit 6 for collecting the mount frame MF shown in FIG. 8 in which the wafer W has been mounted is provided.

The aligner 7, the elevating table 8, the holding table 9, and the frame supply unit 12 are arranged in this order from the upper right of the rectangular portion 1a. A sticking unit 13 for sticking a supporting adhesive tape DT (dicing tape) over the back surface of the wafer W and the ring frame f is provided on the protruding portion 1b.

As shown in FIG. 4, the wafer transfer mechanism 3 is provided with a wafer transfer device 16 supported so as to be reciprocating left and right on the right side of a guide rail 15 erected horizontally on the upper portion of the rectangular portion 2a. Further, on the left side of the guide rail 15, a frame transfer device 17 supported so as to be movable left and right is provided.

The wafer transfer device 16 is configured to be able to transfer the wafer W taken out from any one of the containers 5 to the left and right and back and forth. The wafer transfer device 16 is equipped with a left-right movable table 18 and a front-back movable table 19.

The left-right movable table 18 is configured to be able to reciprocate in the left-right direction along the guide rail 15. The front-back movable table 19 is configured to be able to reciprocate in the front-rear direction along the guide rail 20 provided on the left-right movable table 18.

Further, a holding unit 21 for holding the wafer W is mounted on the lower portion of the front-back movable table 19. The holding unit 21 is configured to be able to reciprocate in the vertical direction (z direction) along the elevating rail 22 extending in the vertical direction. Further, the holding unit 21 can be swiveled around an axis in the z direction by a rotation axis (not shown).

A horseshoe-shaped holding arm 23 is mounted on the lower part of the holding unit 21. A plurality of suction pads slightly protruding are provided on the holding surface of the holding arm 23, and the wafer W is sucked and held via the suction pads. Further, the holding arm 23 is communicated and connected to the compressed air device via a flow path formed inside the holding arm 23 and a connection flow path connected at the base end side of the flow path.

By using the above-mentioned movable structure, the wafer W sucked and held can be moved back and forth, left and right, and swiveled around the z-direction axis by the holding arm 23.

The frame transfer device 17 includes a left-right movable table 24, a front-back movable table 25, a bending / stretching link mechanism 26 connected to the lower part of the left-right moving movable table 24, and a suction plate 27 provided at the lower end of the bending / stretching link mechanism 26. And so on. The suction plate 27 sucks and holds the wafer W. A plurality of suction pads 28 for sucking and holding the ring frame f are arranged around the suction plate 27. Therefore, the frame transport device 17 can suck and hold the ring frame f or the mount frame MF placed and held on the holding table 9 to move up and down and transport it back and forth and left and right. The suction pad 28 can be slidably adjusted in the horizontal direction according to the size of the ring frame f.

The elevating table 8 holds the wafer W, and as an example, it is a metal chuck table having a size equal to or larger than that of the wafer W. As a preferable configuration of the elevating table 8, the wafer W is configured to be sucked and held by a suction device provided inside. As shown in FIG. 5 and the like, the elevating table 8 is connected to one end of a rod 52 penetrating the support base 51 that supports the elevating table 8. The other end of the rod 52 is driven and connected to an actuator 53 including a motor or the like. The elevating table 8 can be moved up and down by the rod 52 and the actuator 53.

As shown in FIGS. 3 and 5, the elevating table 8 is configured to be reciprocating between the initial position and the attachment position along the rail 54 attached in the front-rear direction. The initial position is inside the rectangular portion 1a, and is the position where the elevating table 8 is shown by a solid line in FIG. At the initial position, the wafer W is placed on the elevating table 8.

The sticking position is inside the protrusion 1b, and the elevating table 8 is the position shown by the dotted line in FIG. By moving the elevating table 8 to the sticking position, the wafer W placed on the elevating table 8 can be brought into contact with the adhesive tape DT.

As shown in FIGS. 5 and 6, the holding table 9 is a metal chuck table having a size equal to or larger than that of the wafer W, and is communicated with and connected to a pressurizing device 32 deployed outside. There is. The operation of the pressurizing device 32 is controlled by the control unit 33. Further, the holding table 9 is provided with a suction device inside, and is configured to suck and hold the wafer W.

In the first embodiment, the holding table 9 is provided with an annular protrusion 9a on the outer peripheral portion, and is hollow as a whole. The protrusion 9a is configured at a position substantially matching the arrangement of the annular convex portion Ka of the wafer W in a plan view, and the protrusion 9a supports the annular convex portion Ka of the wafer W so that the holding table 9 is thin and flat. The wafer W can be held without contacting the recess He.

Further, as shown in FIG. 5, the holding table 9 is housed in the lower housing 29A constituting the chamber 29, and is connected to one end of the rod 35 penetrating the lower housing 29A. The other end of the rod 35 is driven and connected to an actuator 37 including a motor or the like. Therefore, the holding table 9 can be moved up and down inside the chamber 29.

The lower housing 29A includes a frame holding portion 38 that surrounds the lower housing 29A. The frame holding portion 38 is configured so that the upper surface of the ring frame f and the top of the cylinder of the lower housing 29A are flush with each other when the ring frame f is placed. Further, it is preferable that the top of the cylinder of the lower housing 29A is subjected to a mold release treatment.

As shown in FIG. 3, the holding table 9 is configured to be reciprocating between the initial position and the sticking position along the rail 40 attached in the front-rear direction together with the lower housing 29A. The initial position is inside the rectangular portion 1a, and is the position where the holding table 9 is shown by a solid line in FIG. At the initial position, the ring frame f is placed on the holding table 9.

The sticking position is inside the protrusion 1b, and the holding table 9 is the position shown by the dotted line in FIG. By moving the holding table 9 to the sticking position, it becomes possible to execute the sticking step of sticking the adhesive tape DT to the wafer W placed on the holding table 9.

The frame supply unit 12 stores a drawer-type cassette in which a predetermined number of ring frames f are laminated and stored.

As shown in FIG. 5, the sticking unit 13 is composed of a sheet supply section 71, a separator recovery section 72, a sheet sticking section 73, a sheet recovery section 74, and the like. The sheet supply unit 71 includes a supply bobbin loaded with an original roll on which a supporting adhesive tape DT is wound. Then, in the process of supplying the adhesive tape DT from the supply bobbin of the sheet supply unit 71 to the sticking position, the separator S is configured to be peeled off by the peeling roller 75. The supply bobbin provided in the seat supply unit 71 is interlocked with the electromagnetic brake to apply an appropriate rotational resistance. Therefore, excessive tape feeding from the supply bobbin is prevented.

The separator recovery unit 72 is provided with a recovery bobbin that winds up the separator S peeled off from the adhesive tape DT. This recovery bobbin is rotationally driven and controlled by a motor in the forward and reverse directions.

The sheet attaching portion 73 includes a chamber 29, a sheet attaching mechanism 81, a sheet cutting mechanism 82, and the like.

The chamber 29 is composed of a lower housing 29A and an upper housing 29B. The lower housing 29A is arranged so as to surround the holding table 9, and moves back and forth between the initial position and the sealing position together with the holding table 9. The upper housing 29B is arranged on the protrusion 1b and is configured to be able to move up and down.

As shown in FIG. 6, the lower housing 29A and the upper housing 29B are communicated with and connected to the pressurizing device 32 via the flow path 101. The flow path 101 on the upper housing 29B side is provided with a solenoid valve 103. Further, the flow paths 109 provided with the solenoid valves 105 and 107 for opening to the atmosphere are communicated and connected to both the housings 29A and 29B, respectively.

Further, a flow path 111 provided with an electromagnetic valve 110 that adjusts the internal pressure once decompressed by a leak is communicated with the upper housing 29B. The opening / closing operation of the solenoid valves 103, 105, 107, 110 and the operation of the pressurizing device 32 are performed by the control unit 33.

That is, the pressurizing device 32 is configured so that the air pressure in the space on the lower housing 29A side and the air pressure in the space on the upper housing 29B side can be independently pressurized and adjusted.

The sheet pasting mechanism 81 includes a movable base 84, a pasting roller 85, a nip roller 86, and the like. The movable base 84 moves horizontally along the guide rail 88 erected in the left-right direction. The sticking roller 85 is pivotally supported by a bracket connected to the tip of a cylinder provided on the movable base 84. The nip roller 86 is arranged on the seat collecting unit 74 side, and includes a feed roller 89 driven by a motor and a pinch roller 90 that moves up and down by a cylinder.

The seat cutting mechanism 82 is provided on an elevating drive base 91 for raising and lowering the upper housing 29B, and includes a support shaft 92 extending in the z direction and a boss portion 93 rotating around the support shaft 92. The boss portion 93 includes a plurality of support arms 94 extending in the radial direction. At the tip of at least one support arm 94, a disk-shaped cutter 95 that cuts the adhesive tape DT along the ring frame f is arranged so as to be movable up and down. A pressing roller 96 is provided at the tip of the other support arm 94 so as to be able to move up and down.

The sheet recovery unit 74 includes a recovery bobbin that winds up unnecessary adhesive tape DT that has been peeled off after cutting. The recovery bobbin is rotationally driven and controlled in the forward and reverse directions by a motor (not shown).

As shown in FIG. 4, the frame collecting unit 6 is provided with a cassette 41 for loading and collecting the mount frame MF. The cassette 41 is provided with a vertical rail 45 that is connected and fixed to the apparatus frame 43, and an elevating table 49 that is screwed up and down by a motor 47 along the vertical rail 45. Therefore, the frame collecting unit 6 is configured to mount the mount frame MF on the elevating table 49 and feed and lower the pitch.

<Outline of operation>
Here, the basic operation of the adhesive sheet pasting device 1 according to the first embodiment will be described. FIG. 7 is a flowchart illustrating a series of steps of attaching the adhesive tape DT to the wafer W by using the adhesive sheet attaching device 1.

Step S1 (supply of work)
When the attachment command is issued, the ring frame f is conveyed from the frame supply portion 12 to the frame holding portion 38 of the lower housing 29A, and the wafer W is conveyed from the container 5 to the elevating table 8.

That is, the frame transfer device 17 sucks the ring frame f from the frame supply unit 12 and transfers it to the frame holding unit 38. When the frame transfer device 17 releases the suction of the ring frame f and rises, the ring frame f is aligned. The alignment is performed, for example, by synchronously moving a plurality of support pins erected so as to surround the frame holding portion 38 toward the center. When the frame holding portion 38 holds the ring frame f, the lower housing 29A moves along the rail 40 from the initial position to the sticking position on the sheet sticking mechanism 81 side together with the holding table 9.

While the frame transfer device 17 conveys the ring frame f, the wafer transfer device 16 inserts a holding arm 23 between the wafers W stored in multiple stages inside the container 5. The holding arm 23 sucks and holds the wafer W, carries it out, and conveys it to the aligner 7. The aligner 7 sucks the center of the wafer W by the suction pad protruding from the center. At the same time, the wafer transfer device 16 releases the adsorption of the wafer W and retracts it upward. The aligner 7 holds the wafer W with a suction pad and rotates it while aligning the wafer W based on a notch or the like.

When the alignment is completed, the suction pad adsorbing the wafer W is projected from the surface of the aligner 7. The wafer transfer device 16 moves to that position and sucks and holds the wafer W. The suction pad releases suction and descends.

The wafer transfer device 16 moves above the elevating table 8 and places the wafer W on the elevating table 8 with the surface side to which the protective tape PT is attached facing downward. When the elevating table 8 attracts and holds the wafer W, the elevating table 8 moves from the initial position to the attachment position on the sheet attachment mechanism 81 side along the rail 54. FIG. 9 shows a state in which each of the elevating table 8 and the holding table 9 has moved to the attachment position.

Step S2 (Supplying adhesive sheet)
When the work is supplied by the wafer transfer device 16 or the like, the adhesive tape DT is supplied by the sticking unit 13. That is, a predetermined amount of the adhesive tape DT is fed out from the sheet supply unit 71 while the separator S is peeled off. The adhesive tape DT, which is long as a whole, is guided above the sticking position along a predetermined transport path.

Step S3 (1st pasting process)
When the work and the adhesive tape DT are supplied, the first sticking process is started. That is, the control unit 33 drives the actuator 53 to raise the elevating table 8. As the elevating table 8 rises, the back surface of the wafer W comes into contact with the adhesive tape DT as shown in FIG. 10, and the back surface of the wafer W is covered with the adhesive tape DT.

By the contact, the back surface of the wafer W adheres to the adhesive layer Tb, and the wafer W is held by the adhesive tape DT. A sheet composite M in which the wafer W and the adhesive tape DT are integrated is hereinafter referred to as a sheet composite M. After the sheet complex M is formed, the adhesive tape DT is unwound by a predetermined amount, so that the sheet complex M is conveyed above the holding table 9 as shown in FIG. As the seat complex M is conveyed, the elevating table 8 descends and returns to the initial state. By forming the sheet complex M and transporting it to the holding table 9, the first pasting process according to step S3 is completed.

Step S4 (Chamber formation)
When the sheet composite M is transported above the holding table 9, the sticking roller 85 is lowered. Then, as shown in FIG. 12, the adhesive tape DT is attached over the ring frame f and the top of the lower housing 29A while rolling on the adhesive tape DT.

When the adhesive tape DT is attached to the ring frame f, the attachment roller 85 is returned to the initial position and the upper housing 29B is lowered. As the upper housing 29B descends, as shown in FIG. 13, the adhesive tape DT of the portion attached to the top of the lower housing 29A is sandwiched between the upper housing 29B and the lower housing 29A to form the chamber 29. ..

At this time, the adhesive tape DT functions as a sealing material, and the chamber 29 is divided into two spaces by the adhesive tape DT. That is, the adhesive tape DT is sandwiched between the lower space H1 on the lower housing 29A side and the upper space H2 on the upper housing 29B side. The wafer W located in the lower housing 29A has a predetermined clearance and is in close proximity to the adhesive tape DT.

Step S5 (second pasting process)
After forming the chamber 29, the second pasting process is started. First, the control unit 33 controls the actuator 37 to lower the holding table 9 to the initial position. Next, the control unit 33 operates the pressurizing device 32 in a state where the solenoid valves 105, 107, and 110 shown in FIG. 6 are closed to supply gas to the lower space H1 and the upper space H2, and the lower space H1 and the lower space H1 and the control unit 33 operate the pressurizing device 32. The upper space H2 is pressurized to a specific value. Examples of specific values include 0.3 MPa to 0.5 MPa. When the pressurizing device 32 performs the pressurizing operation, the pressure in the lower space H1 and the pressure in the upper space H2 are both higher than the atmospheric pressure.

As shown in FIG. 14, the pressing force V1 acts from the upper space H2 toward the adhesive tape DT by the pressurization of the upper space H2. Since the entire upper space H2 is pressurized, the pressing force V1 acts uniformly over the entire adhesive tape DT. Further, by pressurizing the entire lower space H1, the pressing force V2 acts uniformly from the lower space H1 toward the lower surface of the wafer W (the surface side of the wafer W in this embodiment). That is, the adhesive tape DT is accurately attached to the back surface of the wafer W by the action of the pressing force V1 and the pressing force V2. As a result, the adhesion between the wafer W and the adhesive tape DT is improved, so that it is possible to avoid a situation in which the adhesive tape DT is peeled off from the back surface of the wafer W with the passage of time.

In a state where the lower space H1 and the upper space H2 are pressurized to a pressure higher than the atmospheric pressure, a pressing force is applied between the adhesive tape DT and the wafer W for a predetermined time, and then the control unit 33 stops the pressurizing device 32. Let me. Then, the control unit 33 fully opens the solenoid valves 103, 105, 107, 110 to open the lower space H1 and the upper space H2 to the atmosphere. The control unit 33 raises the upper housing 29B to open the chamber 29, and raises the holding table 9 to bring the surface of the wafer W into contact with the wafer holding surface of the holding table 9. The second pasting process corresponds to the pasting process in the present invention.

Step S6 (cutting the sheet)
While the step S5 is being performed in the chamber 29, the sheet cutting mechanism 82 is operated to cut the adhesive tape DT. At this time, as shown in FIG. 15, the cutter 95 cuts the adhesive tape DT attached to the ring frame f into the shape of the ring frame f, and the pressing roller 96 follows the cutter 95 on the ring frame f. Press while rolling the sheet cutting part.

Since the second sticking process according to step S5 is completed when the upper housing 29B is raised, the pinch roller 90 is raised to release the nip of the adhesive tape DT. After that, as shown in FIG. 16, the nip roller 86 is moved toward the sheet collecting unit 74 to wind up and collect the unnecessary adhesive tape DT after cutting, and at the same time, a predetermined amount of the adhesive tape DT is collected from the sheet supply unit 71. To pay out. By each step up to step S6, the sheet complex M is integrated with the ring frame f. As a result, a mount frame MF in which the ring frame f and the wafer W are integrated is formed via the adhesive tape DT.

When the unnecessary adhesive tape DT is wound up and collected, the nip roller 86 and the sticking roller 85 return to the initial positions. Then, the holding table 9 moves from the pasting position to the initial position while holding the mount frame MF.

Step S7 (Recovery of mount frame)
When the holding table 9 returns to the initial position, as shown in FIG. 17, the suction pad 28 provided in the frame transfer device 17 sucks and holds the mount frame MF, and the mount frame MF is detached from the lower housing 29A. The frame transport device 17 that attracts and holds the mount frame MF transports the mount frame MF to the frame recovery unit 6. The transported mount frame MF is loaded and stored in the cassette 41.

This completes the round operation of attaching the adhesive tape DT to the wafer W. After that, the above process is repeated until the number of mount frames MF reaches a predetermined number. As described above, the sheet composite M in which the adhesive tape DT is attached in close contact with the wafer W is manufactured by the adhesive sheet attaching device 1. The sheet composite M in which the adhesive tape DT is attached to the wafer W by the second attachment process corresponds to the semiconductor product in the present invention.

<Effect of the configuration of Example 1>
According to the apparatus according to the first embodiment, the adhesive tape DT is attached to the wafer W by the first attaching process, and then the adhesive tape DT is adhered to the wafer W with higher accuracy by performing the second attaching process. Paste as you like. In the second sticking process according to the present invention, the adhesive tape DT is accurately stuck to the back surface of the wafer W by pressurizing the pressure in the lower space H1 and the upper space H2 so as to be larger than the atmospheric pressure.

In the conventional configuration, the adhesive tape is attached to the wafer by the differential pressure generated by depressurizing the inside of the chamber using a vacuum device. However, the magnitude of the differential pressure generated by the decompression from the atmospheric pressure state is less than the atmospheric pressure. That is, when the adhesive tape DT is attached to the wafer W using a differential pressure, there is an upper limit to the magnitude of the force that presses the adhesive tape DT against the back surface of the wafer W.

Therefore, the adhesiveness between the adhesive tape DT and the wafer W is low in a state where the adhesive tape DT is in contact with the wafer W by using the differential pressure due to the reduced pressure. Further, in the conventional configuration in which the first pressing member is used for the second attachment, the pressing force can be applied only to a limited portion of the adhesive tape DT. Further, since the magnitude of the pressing force is insufficient, it is difficult to improve the adhesion between the adhesive tape DT and the wafer W.

On the other hand, in the present invention, the pressurizing device 32 is used to pressurize the upper space H1 and the lower space H2 in the chamber 29 so as to have a pressure larger than the atmospheric pressure. That is, in the second sticking process, the pressing pressures V1 and V2, which are sufficiently larger than the differential pressure generated by the reduced pressure, can be applied to the adhesive tape DT and the wafer W. Further, the pressing pressures V1 and V2 act on the entire surface of the adhesive tape DT attached to the wafer W. Therefore, since the adhesiveness between the adhesive tape DT and the wafer W can be greatly improved by performing the second sticking process, the adhesive tape DT is peeled off from the wafer W even after a lapse of time after the series of sticking processes are completed. You can avoid that.

Further, in the second pasting process, the sizes of the pressing pressures V1 and V2 can be adjusted to arbitrary values by appropriately controlling the pressurizing device 32. Therefore, even when various conditions such as the constituent material of the adhesive material Tb, the size of the wafer W, and the thickness of the annular convex portion Ka are changed, the sizes of the pressing forces V1 and V2 are appropriately adjusted. As a result, the adhesive tape DT can be reliably attached to the annular convex portion forming surface of the wafer W. Further, since the pressing pressures V1 and V2 having appropriate sizes act uniformly over the entire adhesive tape DT, it is possible to avoid the situation where the wafer W is damaged due to the action of the pressing force or the bias of the pressing force.

Hereinafter, a second embodiment of the present invention will be described with reference to the drawings. In the first embodiment, a long adhesive tape DT is attached over the back surface of the wafer W and the ring frame f, and then has a predetermined shape according to the shape of the work (here, the shape of the wafer W or the ring frame f). The configuration for disconnecting has been described as an example. In the second embodiment, a configuration in which an adhesive tape having a predetermined shape corresponding to the shape of the work is attached to the work in advance will be described as an example. The same configuration as that of the adhesive sheet pasting device 1 according to the first embodiment is designated by the same reference numerals, and different components will be described in detail.

First, the configuration of the adhesive tape DT according to the second embodiment will be described. FIG. 18A is a perspective view showing the back surface side of the transport sheet P and the adhesive tape DT, and FIG. 18B is a vertical sectional view of the transport sheet P and the adhesive tape DT.

As shown in FIG. 18A, the adhesive tape DT according to the second embodiment is held by a long transport sheet P. That is, the adhesive tape DT having a predetermined shape is attached and held at a predetermined pitch on one surface of the long transport sheet P. The adhesive tape DT is pre-cut into a predetermined shape according to the shape of the forming surface (back surface in this embodiment) of the annular convex portion Ka on the wafer W. In Example 2, it is assumed that the adhesive tape DT is cut into a circular shape in advance.

As shown in FIG. 18B, the transport sheet P has a structure in which a non-adhesive base material Pa and an adhesive adhesive material Pb are laminated. Examples of the material constituting the base material Pa include polyolefin, polyethylene and the like. Examples of the material constituting the adhesive material Pb include an acrylic acid ester copolymer and the like. The base material Ta of the adhesive tape DT is attached to the adhesive material Tb of the transport sheet P, so that the transport sheet P holds the adhesive tape DT. In this embodiment, the shape of the adhesive tape DT is circular, but it can be appropriately changed according to the shape of the wafer W.

The adhesive sheet pasting device 1 according to the second embodiment has the same basic configuration as the device according to the first embodiment shown in FIGS. 3 to 6. However, the sheet supply unit 71 is loaded with a transport sheet P that holds a plurality of adhesive tapes DT preformed into a predetermined shape. The sheet cutting mechanism 82 cuts the transport sheet P at the portion attached to the ring frame f. The sheet collecting unit 74 is configured to collect unnecessary transport sheets P remaining around the mount frame MF after the transport sheet P is cut by the sheet cutting mechanism 82.

<Operation in Example 2>
Here, the operation of the adhesive sheet pasting device 1 according to the second embodiment will be described. FIG. 19 is a flowchart illustrating a series of steps of attaching the adhesive tape DT to the wafer W by using the adhesive sheet attaching device 1 according to the second embodiment. The description of the same process as the operation of the adhesive sheet pasting device 1 according to the first embodiment will be simplified, and different processes will be described in detail.

Step S1 (supply of work)
When the attachment command is issued, the wafer W and the ring frame f are supplied in the same manner as in the first embodiment. That is, the ring frame f housed in the frame supply unit 12 is transferred to the frame holding unit 38 by the frame transfer device 17. When the frame holding portion 38 holds the ring frame f, the lower housing 29A moves along the rail 40 from the initial position to the sticking position on the sheet sticking mechanism 81 side together with the holding table 9.

Then, the wafer W stored in the container 5 is transferred to the elevating table 8 by the wafer transfer device 16 via the aligner 7. When the elevating table 8 sucks and holds the substrate 10, the elevating table 8 moves from the initial position to the affixing position on the sheet affixing mechanism 81 side along the rail 54. The state in which each of the elevating table 8 and the holding table 9 has moved to the attachment position is shown in FIG.

Step S2 (Supplying adhesive sheet)
When the work is supplied by the wafer transfer device 16 or the like, the adhesive tape DT is supplied by the sticking unit 13. That is, a predetermined amount of the adhesive tape DT is fed out from the sheet supply unit 71 together with the transport sheet P while the separator S is peeled off. The transport sheet P, which is elongated as a whole, is guided above the sticking position along a predetermined transport path. At this time, as shown in FIG. 21, the adhesive tape DT held on the transport sheet P is positioned above the wafer W placed on the elevating table 8.

Step S3 (1st pasting process)
When the work and the wafer W are supplied, the first pasting process is executed in the same manner as in the first embodiment. That is, the control unit 33 drives the actuator 53 to raise the elevating table 8. As the elevating table 8 rises, the back surface of the wafer W comes into contact with the adhesive tape DT as shown in FIG. 22, and the back surface of the wafer W is covered with the adhesive tape DT.

The back surface of the wafer W adheres to the adhesive layer Tb by the contact, and the wafer W is held by the adhesive tape DT. Then, a sheet composite M in which the wafer W and the adhesive tape DT are integrated is created. After the sheet complex M is created, the adhesive tape DT is unwound by a predetermined amount, so that the sheet complex M is conveyed above the holding table 9 as shown in FIG. 23. As the seat complex M is conveyed, the elevating table 8 descends and returns to the initial state.

Step S4 (Chamber formation)
When the sheet complex M is transported above the holding table 9, the chamber 29 is formed. That is, as shown in FIG. 24, the sticking roller 85 is lowered. Then, the transport sheet P is attached over the ring frame f and the top of the lower housing 29A while rolling on the transport sheet P. In conjunction with the movement of the sticking roller 85, a predetermined amount of the adhesive tape DT is fed out from the sheet supply unit 71 together with the transport sheet P while the separator S is peeled off.

When the transport sheet P is attached to the ring frame f, the attachment roller 85 is returned to the initial position and the upper housing 29B is lowered. As the upper housing 29B descends, as shown in FIG. 25, the transport sheet P of the portion attached to the top of the lower housing 29A is sandwiched between the upper housing 29B and the lower housing 29A to form the chamber 29. To. At this time, the transport sheet P functions as a sealing material, and the chamber 29 is divided into a lower space H1 and an upper space H2 by the transport sheet P.

Step S5 (second pasting process)
After forming the chamber 29, the second pasting process is performed in the same manner as in the first embodiment. First, the control unit 33 lowers the holding table 9 and operates the pressurizing device 32 to supply gas to the lower space H1 and the upper space H2, and pressurizes the lower space H1 and the upper space H2 to a specific value. When the pressurizing device 32 performs the pressurizing operation, the pressure in the lower space H1 and the pressure in the upper space H2 are both higher than the atmospheric pressure.

By pressurizing the upper space H2, as shown in FIG. 26, the pressing force V1 acts uniformly from the upper space H2 toward the adhesive tape DT. Further, by pressurizing the entire lower space H1, the pressing force V2 acts uniformly on the downward surface of the wafer W from the lower space H1. That is, the adhesive tape DT is accurately attached to the back surface of the wafer W by the action of the pressing force V1 and the pressing force V2, which are sufficiently large forces, and the adhesion between the wafer W and the adhesive tape DT is improved.

In a state where the lower space H1 and the upper space H2 are pressurized to a pressure higher than the atmospheric pressure, a pressing force is applied between the adhesive tape DT and the wafer W for a predetermined time, and then the control unit 33 stops the pressurizing device 32. Let me. Then, the control unit 33 fully opens the solenoid valves 103, 105, 107, 110 to open the lower space H1 and the upper space H2 to the atmosphere. The control unit 33 raises the upper housing 29B to open the chamber 29, and raises the holding table 9 to bring the surface of the wafer W into contact with the wafer holding surface of the holding table 9.

Step S6 (cutting the transport sheet)
The sheet cutting mechanism 82 is operated while the process according to step S5 is being performed in the chamber 29. In the second embodiment, the sheet cutting mechanism 82 is different from the step of the first embodiment in that the sheet P for transportation is cut. That is, as shown in FIG. 27, the cutter 95 cuts the transport sheet P attached to the ring frame f into the shape of the ring frame f, and the pressing roller 96 follows the cutter 95 to form the sheet on the ring frame f. Press while rolling the cut part.

After cutting the transport sheet P into a circle, the upper housing 29B is raised. Since the process according to step S5 is completed when the upper housing 29B is raised, the pinch roller 90 is raised to release the nip of the adhesive tape DT. After that, as shown in FIG. 28, the nip roller 86 is moved toward the sheet collecting unit 74 to wind up and collect the unnecessary transport sheet P after cutting, and a predetermined amount of adhesive tape is collected from the sheet supply unit 71. The DT is fed out together with the transport sheet P.

The mount frame MF is formed by each step up to step S6. In the mount frame MF according to the second embodiment, the ring frame f and the wafer W are integrated via the adhesive tape DT and the transport sheet P. When the unnecessary transport sheet P is wound up and collected, the nip roller 86 and the sticking roller 85 return to the initial positions. Then, the holding table 9 moves from the pasting position to the initial position while holding the mount frame MF.

Step S7 (Recovery of mount frame)
When the holding table 9 returns to the initial position, as shown in FIG. 29, the suction pad 28 provided in the frame transfer device 17 sucks and holds the mount frame MF, and the mount frame MF is detached from the lower housing 29A. The frame transport device 17 that attracts and holds the mount frame MF transports the mount frame MF to the frame recovery unit 6. The transported mount frame MF is loaded and stored in the cassette 41.

This completes the round operation of attaching the adhesive tape DT to the wafer W. After that, the above process is repeated until the number of mount frames MF reaches a predetermined number. By using the adhesive sheet attaching device 1 according to the second embodiment, the same effect as that of the first embodiment can be obtained even when the adhesive tape DT cut into a predetermined shape in advance is used. That is, when the adhesive tape DT is attached to the annular convex portion forming surface of the wafer W having the annular convex portion, the adhesive tape DT can be accurately attached to the wafer W while avoiding damage to the wafer. can.

It should be noted that the embodiments disclosed this time are exemplary in all respects and are not restrictive. The scope of the present invention is shown by the scope of claims rather than the description of the above-described embodiment, and further includes all modifications (modifications) within the meaning and scope equivalent to the scope of claims. As an example, the present invention can be modified as follows.

(2) In step S5 according to each embodiment, the pressurizing device 32 pressurizes the inside of both the lower space H1 and the upper space H2, but the pressure device 32 is not limited to this. That is, the pressurizing device 32 may pressurize only the upper space H2 until the pressure becomes higher than the atmospheric pressure, and the adhesive tape DT may be attached more accurately by the pressing force V1.

(3) In step S5 according to each embodiment, the pressure inside the chamber 29 is made higher than the atmospheric pressure by using the pressurizing device 32, so that the adhesive tape DT is pressed so as to be in close contact with the wafer W. Is occurring. However, the step according to step S5 is not limited to the configuration using the chamber 29 as long as it is configured to generate a pressing force larger than the atmospheric pressure between the adhesive tape DT and the wafer W.

As an example of the configuration in which the chamber 29 is omitted, as shown in FIG. 30, a pressing plate 141 is arranged above the holding table 9, and the pressing plate 141 is lowered to press the sealing sheet S to press the pressing force V1. Can be mentioned.

The pressing member 141 has a flat bottom surface and is arranged so as to be located above the adhesive tape DT. Therefore, by lowering the pressing member 141, the bottom surface of the flat pressing member 141 presses the adhesive tape DT, and the adhesive tape DT is deformed in a convex shape and can come into contact with the wafer W.

(4) In each embodiment, the configuration in which the adhesive tape DT for support is attached to the wafer W has been described as an example, but the adhesive sheet to be attached to the wafer W is not limited to this. The configuration according to each embodiment can be applied as long as the configuration is such that a sheet-shaped adhesive material such as an adhesive tape for circuit protection is attached.

(5) In each embodiment, the wafer W and the ring frame f are exemplified as the work to which the adhesive sheet is attached, but the work is not limited to this. As an example, the ring frame f may be omitted and the adhesive sheet may be attached only to the wafer W. Further, in the configuration according to this embodiment, various semiconductor members such as a substrate and a panel can be applied as a work. Further, the shape of the work may be a rectangular shape, a polygonal shape, a substantially circular shape, or the like, in addition to the circular shape.

(6) In each embodiment, the holding table 9 is moved up and down at a predetermined timing to attach the adhesive tape DT to the wafer W, but the moving up and down of the holding table 9 may be changed as appropriate. As an example, the pressurizing treatment according to step S5 is not limited to the configuration performed after the holding table 9 is lowered, and the pressurizing treatment may be performed while maintaining the raised state.

(7) In each embodiment, the frame holding portion 38 is arranged outside the lower housing 29A, but the frame holding portion 38 may be provided inside the lower housing 29A. In this case, the process after step S4 is performed with each of the ring frame f and the wafer W housed inside the chamber 29.

(8) In the second embodiment, the adhesive tape DT is preformed so as to have a predetermined shape according to the shape of the annular convex portion forming surface of the wafer W, but the present invention is not limited to this. That is, the sheet supply unit 71 may be loaded with a long adhesive tape DT to which a long transport sheet P is attached. The configuration of the long adhesive tape DT to which the long transport sheet P is attached is as shown in FIG. 31 (a). In this case, the adhesive sheet attaching device 1 is provided with a sheet cutting device 201 upstream of the chamber 29, and the sheet cutting device 201 molds a long adhesive tape DT into a predetermined shape.

The configuration of the sheet cutting device 201 is as shown in FIG. 31 (b). The sheet cutting device 201 includes a support table 203, a cutter 205, and an adhesive sheet collecting unit 207. The adhesive tape DT and the transport sheet P unwound from the sheet supply unit 71 are inverted by a reversing device (not shown), and are supplied to the sheet cutting device 201 in a state where the adhesive tape DT is on the upper side of the transport sheet P. Will be done.

The support table 203 horizontally receives the lower transfer sheet P among the long adhesive tape DT and the transfer sheet P that are fed and supplied from the sheet supply unit 71 along the direction L. It is arranged. The cutter 205 is arranged above the support table 203, and can be moved up and down by a movable table (not shown). An annular Thomson blade is used as an example of the cutter 205.

As the cutter 205 descends, the layer of the adhesive tape DT of the adhesive tape DT and the transport sheet P is cut out in the shape of an annular locus K. The configuration in which the cutter 205 cuts the adhesive tape DT is not limited to this, and another example is a configuration in which the knife-shaped cutter 205 is moved along a circular trajectory and the adhesive tape DT is cut out in a circular shape. ..

The adhesive sheet collecting unit 207 collects unnecessary adhesive tape DTn left around the adhesive tape DT cut into a circular shape. The adhesive tape DTn in the unnecessary portion is peeled off from the transport sheet P immediately after the feed roller 208. The peeled adhesive tape DTn is guided to the recovery bobbin 210 by the guide roller 209. The recovery bobbin 201 winds up and collects the adhesive tape DTn peeled off from the transport sheet P. Therefore, the sheet cutting device 201 leaves the adhesive tape DT circularly molded by the cutter 205 on the transport sheet P.

The adhesive tape DT cut into a circle is guided to the chamber 29 together with the transport sheet P. The adhesive tape DT and the transport sheet P are inverted again by a reversing device (not shown) downstream of the sheet cutting device 201, and are guided to the chamber 29 in a state where the adhesive tape DT is on the lower side of the transport sheet P. To.

(9) In each embodiment, as shown in FIG. 32 (a), the chamber 29 may include a sheet-shaped elastic body Ds. Hereinafter, the present modification will be described by exemplifying the configuration of the second embodiment.

The elastic body Ds is arranged inside the upper housing 29B, and is configured to be in contact with the inner diameter of the upper housing 29B. Further, the lower surface of the elastic body Ds and the bottom of the cylinder of the upper housing 29B are configured to be flush with each other. Therefore, when the lower housing 29A and the upper housing 29B sandwich the transport sheet P to form the chamber 29, the elastic body Ds comes into contact with the transport sheet P. Specifically, in the transport sheet P, the elastic body Ds is brought into contact with the side (upper surface side in the figure) opposite to the surface holding the adhesive tape DT. By arranging the elastic body Ds so as to be in contact with the inner diameter of the lower housing 29A, the elastic body Ds is not sandwiched when forming the chamber 29, so that the sealing property of the chamber 29 is lowered by the elastic body Ds. Can be prevented. Examples of the material constituting the elastic body Ds include rubber, an elastomer, a gel-like polymer material, and the like.

Since the chamber 29 is provided with the elastic body Ds, the bending rate of the adhesive tape DT can be made more uniform when the adhesive tape DT is deformed in a convex shape in step S4. Here, the effect of the configuration including the elastic body Ds will be described. As an example, when the adhesive tape DT is made of a relatively hard material, the bending rate of the adhesive tape DT tends to be non-uniform as shown in FIG. 32 (b).

That is, in the region P1 of the transport sheet P in which the adhesive tape DT is held by the transport sheet P, the adhesive tape DT is present, so that the bending rate of the transport sheet P due to the pressing force V1 is small. On the other hand, in the region P2 of the transport sheet P where the adhesive tape DT is not held by the transport sheet P, the bending rate of the transport sheet P due to the pressing force V1 is relatively large. That is, the region P2 is more easily deformed by the pressing force V1, and the bending rate of the transport sheet P in the region P1 is further reduced.

Further, the bending rate of the adhesive tape DT is large on the side (peripheral portion) of the adhesive tape DT close to the region P2, and the bending rate of the adhesive tape DT is small on the central portion of the adhesive tape DT. As described above, in each of the adhesive tape DT and the transport sheet P, the bending rate due to the pressing force V1 becomes non-uniform. As a result, with respect to the adhesive tape DT attached to the wafer W, the adhesiveness between the adhesive tape DT and the wafer W is lowered.

On the other hand, when the elastic body Ds is provided, as shown in FIG. 32 (c), the entire elastic body Ds is uniformly convexally deformed by the pressing force V1. Therefore, the bending rate of the transport sheet P in the region P1 is improved and the difference from the bending rate in the region P2 is small, so that the bending rate of the transport sheet P and the adhesive tape DT becomes uniform as a whole. That is, since the adhesive tape DT is easily deformed according to the shape of the annular convex portion forming surface of the wafer W, the adhesion between the adhesive tape DT and the wafer W can be further improved.

(10) In each embodiment, a configuration for heating the adhesive tape DT may be further provided. As an example of the configuration for heating the adhesive tape DT, the sheet attaching mechanism 81 has a heating mechanism 120 inside the upper housing 29B as shown in FIG. 33 (a). The heating mechanism 120 includes a cylinder 121 and a heating member 123. The cylinder 121 is connected to the upper part of the heating member 123, and the heating member 123 can be raised and lowered inside the chamber 29 by the operation of the cylinder 121. The heating member 123 does not have to be configured to be movable up and down as long as the adhesive tape DT can be heated.

A heater 125 for heating the adhesive tape DT is embedded inside the heating member 123. The temperature of heating by the heater 125 is adjusted so as to be a temperature at which the adhesive tape DT becomes soft. An example of the heating temperature is about 50 ° C to 70 ° C. The shape of the bottom surface of the heating member 123 may be changed according to the shape of the wafer W. As an example, the heating member 123 has a columnar shape as a whole.

Before starting step S5, it is preferable to heat the upper space H2 by using the heating mechanism 120 in advance. That is, the control unit 33 operates the heater 125 to heat the heating device 123 to a predetermined temperature. By heating the heating device 123, the upper space H2 is heated by the heat conduction effect, and the adhesive tape DT is further heated.

Since the adhesive tape DT becomes soft when heated, the deformability of the adhesive tape DT due to the pressing force V1 is improved. That is, when the wafer W is covered with the adhesive tape DT, the followability of the adhesive tape DT to the wafer W can be further enhanced. As shown in FIG. 33B, the heating member 123 may be lowered so as to be close to or in contact with the adhesive tape DT, and the adhesive tape DT may be directly heated by the heating member 123.

(11) In the embodiment, the heating mechanism 120 is arranged on the side of the upper space H2 in the chamber 29, and is configured to heat the upper space H2, but the present invention is not limited to this. That is, the heating mechanism 120 may be configured to heat the lower space H1. As an example, a configuration in which the heater 125 is arranged inside the holding table 9 and the heater 125 heats the lower space H1 to heat the adhesive tape DT can be mentioned. Further, the heating mechanism 120 may be configured to heat both the upper space H1 and the lower space H2.

(12) In each embodiment, a configuration in which the adhesive sheet affixing device 1 performs the first affixing process according to step S3 to create the sheet complex M has been described as an example, but the sheet complex M is the adhesive sheet affixing device 1. It is not limited to the configuration created inside. That is, a sheet composite M formed by adhering the wafer W to the adhesive tape DT is prepared in advance, and a pressure higher than the atmospheric pressure is applied to the sheet composite M using the adhesive sheet pasting device 1. Therefore, the adhesive tape DT may be attached to the wafer W.

1 ... Adhesive sheet pasting device 3 ... Wafer transfer mechanism 5 ... Container 6 ... Frame collection unit 7 ... Aligner 8 ... Lifting table 9 ... Holding table 12 ... Frame supply unit 13 ... Pasting unit 16 ... Wafer transfer device 17 ... Frame transfer device 23 ... Holding arm 27 ... Suction plate 28 ... Suction pad 32 ... Pressurizing device 33 ... Control unit 38 ... Frame holding unit 71 ... Sheet supply unit 72 ... Separator collection unit 73 ... Sheet pasting unit 74 ... Sheet collection unit 81 ... Sheet pasting mechanism 82… Sheet cutting mechanism 85… Pasting roller 86… Nip roller 95… Cutter f… Ring frame DT… Adhesive tape P… Transport sheet M… Sheet composite MF… Mount frame Ta… Base material Tb… Adhesive material Pa… Base material Pb … Adhesive material

Claims (8)

The pressure-sensitive adhesive sheet is applied by applying a pressure higher than atmospheric pressure to a sheet complex formed by adhering an adhesive sheet to the annular convex portion forming surface of a work having an annular convex portion on the outer periphery of one surface. The process of pasting on the surface of the annular convex portion,
A method of attaching an adhesive sheet, which is characterized by being provided with. In the method for attaching an adhesive sheet according to claim 1,
It comprises a containment process for accommodating the sheet complex in a chamber.
The pasting process is
A method for attaching an adhesive sheet, which comprises attaching the adhesive sheet to the annular convex portion forming surface by increasing the pressure in the internal space of the chamber after the accommodating process. In the method for attaching an adhesive sheet according to claim 2,
The chamber comprises an upper housing and a lower housing.
The pasting process is
By sandwiching the adhesive sheet between the upper housing and the lower housing, the internal space of the chamber is divided into a lower space in which the work is arranged with the annular convex portion forming surface facing upward, and the adhesive sheet. The process of forming the upper and lower spaces, which divides the lower space into the upper space facing the lower space,
A method for attaching an adhesive sheet, which comprises a space pressurizing process for attaching the adhesive sheet to the annular convex portion forming surface by pressurizing at least the upper space among the upper space and the lower space. In the method for attaching an adhesive sheet according to claim 2,
The adhesive sheet has a predetermined shape corresponding to the annular convex portion forming surface of the work, and is held by a long transport sheet.
The chamber comprises an upper housing and a lower housing.
The pasting process is
By sandwiching the transport sheet between the upper housing and the lower housing, the internal space of the chamber is divided into a lower space in which the work is arranged with the annular convex portion forming surface facing upward, and the transport. The process of forming the upper and lower spaces, which are divided into the upper space facing the lower space via the adhesive sheet held by the sheet, and the process of forming the upper and lower spaces.
A method for attaching an adhesive sheet, which comprises a space pressurizing process for attaching the adhesive sheet to the annular convex portion forming surface by pressurizing at least the upper space among the upper space and the lower space. In the method for attaching an adhesive sheet according to claim 3,
A sheet-like elastic body disposed inside the upper housing is provided.
By sandwiching the pressure-sensitive adhesive sheet between the upper housing and the lower housing in the process of forming the upper and lower spaces, the sheet-shaped elastic body is arranged so that the sheet-shaped elastic body comes into contact with the pressure-sensitive adhesive sheet. A method of attaching an adhesive sheet, which is characterized by this. In the method for attaching an adhesive sheet according to any one of claims 3 to 5.
A heating process for heating the adhesive sheet by heating at least one of the lower space and the upper space is provided.
The sticking process is characterized in that the pressure-sensitive adhesive sheet is attached to the annular convex portion forming surface by applying a pressure higher than atmospheric pressure to the pressure-sensitive adhesive sheet heated by the heating process. How to attach the adhesive sheet. The pressure-sensitive adhesive sheet is applied by applying a pressure higher than atmospheric pressure to a sheet complex formed by adhering an adhesive sheet to the annular convex portion forming surface of a work having an annular convex portion on the outer periphery of one surface. A sticking mechanism that sticks to the surface of the annular convex portion,
An adhesive sheet pasting device characterized by being provided with. A method for manufacturing a semiconductor product, which manufactures a semiconductor product in which an adhesive sheet is attached to an annular convex portion forming surface of a work having an annular convex portion on the outer periphery of one surface.
Affixing the adhesive sheet to the annular convex portion forming surface by applying a pressure higher than atmospheric pressure to the sheet complex formed by adhering the adhesive sheet to the annular convex portion forming surface of the work. The process and
A method for manufacturing a semiconductor product, which comprises.

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