JP2018137415A - Pressure-sensitive adhesive tape sticking method and pressure-sensitive adhesive tape sticking device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive tape sticking method and a pressure-sensitive adhesive tape sticking device capable of sticking a new pressure-sensitive adhesive tape accurately to the other side of a wafer having one side to which the pressure-sensitive adhesive tape has been stuck, while circumventing breakdown of the wafer or impairment of the circuit.SOLUTION: In a configuration for sticking a protective tape PT to a mount frame MF, a chamber 7 is formed by sandwiching the support tape DT of the mount frame MF. A holding table 37 for holding the protective tape PT is brought close to the support tape DT, and the distance between the protective tape PT a wafer W is maintained at D2. Internal pressure of the chamber 7 is reduced while maintaining that distance, and the protective tape PT is stuck by the differential pressure. Even if bubbles expand between the support tape DT and the wafer W and the wafer W is pressed, the wafer W can be received promptly by the holding table maintaining the contact position. Consequently, breakdown of the wafer and impairment of the circuit due to deformation of the wafer can be circumvented.SELECTED DRAWING: Figure 18

Description

  The present invention provides an adhesive tape that includes a protective tape that protects a circuit pattern formed on a semiconductor wafer, and a dicing tape that is applied to a ring frame and a back surface of a semiconductor wafer placed at the center of the ring frame. The present invention relates to a method and an adhesive tape attaching device.

  When manufacturing a chip component from a semiconductor wafer (hereinafter referred to as “wafer” as appropriate), a circuit pattern is formed on the surface of the wafer, and then a protective adhesive tape (protective tape) is attached to the wafer surface. It is thinned by grinding. After the protective tape is peeled off from the thinned wafer, a supporting adhesive tape is pasted over the back surface of the wafer and the ring frame. By attaching the supporting adhesive tape, that is, the dicing tape, the wafer is integrated (mounted) with the ring frame via the dicing tape.

  When affixing various types of adhesive tape to a wafer, the inside of the chamber containing the wafer is depressurized in order to reduce the size of the device in addition to the configuration in which the adhesive roller is rolled and pressed against the wafer. The structure which sticks an adhesive tape is used. That is, a chamber composed of a pair of upper and lower housings is partitioned with an adhesive tape to form two spaces, and the adhesive tape is affixed to the wafer while the pressure in one space is lower than the pressure in the other space (for example, Patent Literature 1).

JP 2014-49626 A

  However, the conventional apparatus has the following problems.

  In recent years, due to diversification of wafer processing steps, a new adhesive tape may be attached to the other surface of the wafer having the adhesive tape attached to one surface. As an example, there is a case where an adhesive tape is affixed again to the surface of the wafer mounted on the ring frame. At this time, when an operation of attaching an adhesive tape to the wafer surface using the conventional configuration according to Patent Document 1, problems such as wafer breakage and circuit damage occur.

  As a result of earnest examination on the occurrence of such problems, the following knowledge has been obtained. That is, when a minute bubble is caught between the wafer and the dicing tape affixed to the back surface of the wafer, the air bubble is reduced when the pressure inside the chamber is reduced to affix the adhesive tape to the surface of the wafer. Expands.

  The bubbles press the wafer during expansion, and as a result, problems such as circuit damage and wafer breakage may occur. Such a problem occurs more remarkably when a dicing tape is attached to the wafer under atmospheric pressure. Further, in recent years, since the wafer is becoming thinner, the wafer is more easily damaged by the pressure of the bubbles.

  The present invention has been made in view of such circumstances, and while avoiding wafer breakage and circuit damage, a new surface is provided on the other surface of the wafer having an adhesive tape attached to one surface. The main object is to provide an adhesive tape application method and an adhesive tape application device capable of attaching an adhesive tape with high accuracy.

In order to achieve such an object, the present invention has the following configuration.
That is, the present invention is an adhesive tape attaching method for attaching the second adhesive tape to the other surface of the semiconductor wafer having the first adhesive tape attached to one surface,
A tape holding process for holding the second adhesive tape on a holding table;
Forming a chamber by sandwiching and bonding the first adhesive tape protruding from the outer edge of the semiconductor wafer between a pair of housings; and
A first proximity process in which the holding table is brought close to the semiconductor wafer, and a distance between the semiconductor wafer and the adhesive surface of the second adhesive tape is maintained at a first predetermined value set in advance;
Affixing the second adhesive tape to a semiconductor wafer while holding the first adhesive tape sandwiched between a pair of housings while lowering the air pressure in the chamber on the side of the semiconductor wafer lower than the other space Process,
It is characterized by providing.

  (Function / Effect) According to this method, the holding table approaches the semiconductor wafer in the first approaching process, and the distance between the semiconductor wafer and the adhesive surface of the second adhesive tape is maintained at a first predetermined value set in advance. Is done. Therefore, even when the air bubbles entrained between the semiconductor wafer and the first adhesive tape expand and press the semiconductor wafer in the pasting process, the pressed semiconductor wafer is maintained in the proximity position. Received by holding table. That is, since the warp of the semiconductor wafer due to pressing is quickly suppressed by the holding table, deformation and breakage of the semiconductor wafer due to the warp can be suitably avoided.

  In the above-described invention, the semiconductor wafer is bonded and held to a ring frame via the first adhesive tape. In the chamber forming process, the ring frame is held while holding the ring frame by a frame holding portion. The first adhesive tape between the semiconductor wafer and the semiconductor wafer is preferably sandwiched between a pair of housings to form a chamber. In this case, in the mounting frame in which the first adhesive tape is attached to one surface, the step of attaching the second adhesive tape to the other surface of the semiconductor wafer is carried out by the deformation or breakage of the semiconductor wafer. It can be executed while avoiding it.

  Further, in the above-described invention, a restraining member having a flat surface is brought close to or in contact with the non-adhesive surface of the first adhesive tape, and a distance between the flat surface and the first adhesive tape is set in advance. It is preferable to provide a second proximity process for maintaining the predetermined value.

  (Operation / Effect) According to this configuration, in the second approach process, the restraining member comes close to the first adhesive tape, and the distance between the restraining member and the first adhesive tape is maintained at a preset second predetermined value. Is done. For this reason, even when the air bubbles entrained between the semiconductor wafer and the first adhesive tape expand in the pasting process, the expansion of the air bubbles in the direction perpendicular to the surface of the semiconductor wafer is not flat. Is suppressed by. Therefore, since the pressing force acting on the surface of the semiconductor wafer due to the expansion of the bubbles can be greatly reduced, damage to the wafer W due to the expansion of the bubbles can be suitably avoided. Moreover, since the expansion | extension of the 1st adhesive tape resulting from expansion | swelling of a bubble can be suppressed, it can avoid that the base material and adhesive material of a 1st adhesive tape deteriorate.

In order to achieve such an object, the present invention may take the following configurations.
That is, the present invention is an adhesive tape attaching method for attaching the second adhesive tape to the other surface of the semiconductor wafer having the first adhesive tape attached to one surface,
A wafer holding process for holding the semiconductor wafer on a holding table;
A first pasting step of pasting the second adhesive tape on one joint of a pair of housings constituting the chamber;
A first proximity process in which the holding table is brought close to the second adhesive tape, and a distance between the semiconductor wafer and the adhesive surface of the second adhesive tape is maintained at a preset first predetermined value;
A second proximity process in which a restraining member having a flat surface is brought close to or in contact with a non-adhesive surface of the second adhesive tape, and a distance between the flat surface and the second adhesive tape is maintained at a second predetermined value;
In a state where the chamber is formed by sandwiching and joining the second adhesive tape between a pair of housings, the second wafer is placed in the chamber on the side of the semiconductor wafer while lowering the air pressure than the other space. A second pasting process for pasting the adhesive tape to the semiconductor wafer;
It is characterized by providing.

  (Operation / Effect) According to this configuration, in the first approaching process, the holding table comes close to the second adhesive tape, and the distance between the semiconductor wafer and the adhesive surface of the second adhesive tape is a first predetermined value set in advance. Maintained at the value. Therefore, even when the air bubbles entrained between the semiconductor wafer and the first adhesive tape expand and press the semiconductor wafer in the pasting process, the pressed semiconductor wafer is maintained in the proximity position. Received by holding table. That is, since the warp of the semiconductor wafer due to pressing is quickly suppressed by the holding table, deformation and breakage of the semiconductor wafer due to the warp can be suitably avoided.

  Further, in the second approach process, the restraining member comes close to the second adhesive tape, and the distance between the restraining member and the second adhesive tape is maintained at a preset second predetermined value. For this reason, even when the air bubbles entrained between the semiconductor wafer and the first adhesive tape expand in the pasting process, the expansion of the air bubbles in the direction perpendicular to the surface of the semiconductor wafer is not flat. Is suppressed by. Therefore, since the pressing force acting on the surface of the semiconductor wafer due to the expansion of the bubbles can be greatly reduced, damage to the wafer W due to the expansion of the bubbles can be suitably avoided. Moreover, since the expansion | extension of the 2nd adhesive tape resulting from expansion | swelling of a bubble can be suppressed, it can avoid that the base material and adhesive material of a 2nd adhesive tape deteriorate.

  Further, in the above-described invention, a frame holding process for holding the ring frame by the frame holding part is provided. In the first pasting process, the frame holding process is held by one joint part of the pair of housings constituting the chamber and the frame holding process. It is preferable to affix the second adhesive tape across the ring frame.

  (Operation / Effect) According to this configuration, in the semiconductor wafer in which the first adhesive tape is attached to one surface, the second adhesive tape is attached to the other surface of the semiconductor wafer and the ring frame using the chamber. The pasting step can be executed while avoiding deformation and breakage of the semiconductor wafer. Therefore, it is possible to execute a more preferable mounting frame creation process while protecting one surface of the semiconductor wafer.

In order to achieve such an object, the present invention may take the following configurations.
That is, the present invention is an adhesive tape attaching method for attaching the second adhesive tape to the other surface of the semiconductor wafer having the first adhesive tape attached to one surface,
A tape holding process for holding the second adhesive tape on a holding table;
A wafer holding process for holding the semiconductor wafer by a wafer holding unit;
Forming a chamber for housing the holding table and the wafer holding unit by joining a pair of housings;
A first proximity member accommodated in the chamber and having a flat surface is brought close to the semiconductor wafer, and a distance between the semiconductor wafer and the first restraining member is maintained at a first predetermined value set in advance. Process,
A second restraining member housed in the chamber and having a flat surface is brought close to or in contact with the non-adhesive surface of the first adhesive tape, and the distance between the flat surface and the first adhesive tape is preset. A second proximity process maintained at a second predetermined value;
After the second proximity process, with the chamber formed, the pasting process of pasting the second adhesive tape to the semiconductor wafer while lowering the atmospheric pressure inside the chamber;
It is characterized by providing.

  (Operation / Effect) According to this configuration, in the first approach process, the first restraining member comes close to the semiconductor wafer, and the distance between the semiconductor wafer and the adhesive surface of the first restraining member is set to a first predetermined value set in advance. Maintained. Therefore, even when the air bubbles entrained between the semiconductor wafer and the first adhesive tape expand and press the semiconductor wafer in the pasting process, the pressed semiconductor wafer is maintained in the proximity position. It is received by the first deterrent member. That is, since the warp of the semiconductor wafer due to pressing is quickly suppressed by the holding table, deformation and breakage of the semiconductor wafer due to the warp can be suitably avoided.

  Further, in the second proximity process, the second suppression member approaches or contacts the first adhesive tape, and the distance between the second suppression member and the first adhesive tape is maintained at a second predetermined value set in advance. For this reason, even if the air bubbles entrained between the semiconductor wafer and the first adhesive tape expand in the pasting process, the expansion of the air bubbles in the direction perpendicular to the surface of the semiconductor wafer Suppressed by the flat surface. Therefore, since the pressing force acting on the surface of the semiconductor wafer due to the expansion of the bubbles can be greatly reduced, damage to the wafer W due to the expansion of the bubbles can be suitably avoided. Moreover, since the expansion | extension of the 1st adhesive tape resulting from expansion | swelling of a bubble can be suppressed, it can avoid that the base material and adhesive material of a 1st adhesive tape deteriorate. The present configuration is not limited to the configuration in which the second pressure-sensitive adhesive tape is applied after the pressure is reduced using the chamber, and is not limited to the configuration in which the differential pressure is applied, so the features of the present invention can be applied to more various chamber configurations. Applicable.

  In the above-described invention, it is preferable that a frame holding process of holding the ring frame by the frame holding part is provided, and the chamber holds the frame holding part. In this case, even in the configuration in which the ring frame and the frame holding unit are housed in the chamber, the step of attaching the second adhesive tape to the semiconductor wafer can be executed while avoiding deformation and breakage of the semiconductor wafer.

  In the above-described invention, it is preferable that the first restraining member is the holding table, and the second adhesive tape is brought close to the semiconductor wafer together with the holding table in the first approaching process. In this case, since the holding table also functions as the first suppression member, it is possible to avoid complication of the apparatus.

  Furthermore, since the second adhesive tape is close to the semiconductor wafer in the first approaching process, even when air bubbles are caught between the second adhesive tape and the holding table, the second adhesive tape is perpendicular to the surface of the adhesive tape. Expansion of the bubble with respect to the direction is quickly suppressed by the semiconductor wafer. Therefore, it can prevent more reliably that a part of 2nd adhesive tape expand | extends and an unevenness | corrugation and a wrinkle generate | occur | produce. As a result, it is possible to reliably avoid the situation where the second adhesive tape is affixed non-uniformly to the semiconductor wafer and the situation where the adhesion between the second adhesive tape and the semiconductor wafer is lowered.

  In the invention described above, it is preferable that the second restraining member is the wafer holding portion. In this case, since the wafer holding part also functions as the second suppression member, it is possible to avoid complication of the apparatus. Further, since the wafer holding unit is in contact with or closer to the first adhesive tape attached to the semiconductor wafer, the wafer W is more reliably damaged or expanded by the expansion of the bubbles. Can be prevented.

  In the above-described invention, the first predetermined value is preferably 0.1 mm or more and 0.5 mm or less. In this case, since the holding table is sufficiently close, the pressing force acting on the semiconductor wafer due to the expansion of the bubbles entrained between the semiconductor wafer and the first adhesive tape can be further reduced. Therefore, deformation and breakage of the semiconductor wafer due to pressing can be avoided more reliably.

  In the above-described invention, the second predetermined value is preferably 0.5 mm or less. In this case, since the restraining member is sufficiently close, the expansion of bubbles in the direction perpendicular to the surface of the semiconductor wafer can be restrained more reliably. Therefore, damage to the wafer W due to expansion of bubbles can be avoided more reliably.

In order to achieve such an object, the present invention may take the following configurations.
That is, the present invention is an adhesive tape attaching method for attaching an adhesive tape to a semiconductor wafer,
A tape holding process for holding the adhesive tape on a holding table;
A wafer holding process for holding the semiconductor wafer by a wafer holding unit;
Forming a chamber for housing the holding table and the wafer holding unit by joining a pair of housings;
A first proximity process in which a wafer holding unit holding the semiconductor wafer is brought close to the adhesive tape, and a distance between the adhesive surface of the adhesive tape and the semiconductor wafer is maintained at a preset first predetermined value;
A restraining member housed in the chamber and having a flat surface is brought close to or in contact with the non-adhesive surface of the adhesive tape, and a distance between the flat surface and the adhesive tape is maintained at a second predetermined value set in advance. 2 proximity processes,
After the second proximity process, in the state where the chamber is formed, the pasting process of pasting the adhesive tape to the semiconductor wafer while lowering the pressure inside the chamber;
It is characterized by providing.

  (Operation / Effect) According to this configuration, when the adhesive tape is attached to the semiconductor wafer, the wafer holding portion holding the semiconductor wafer is close to the adhesive tape in the first proximity process, and the semiconductor wafer and the adhesive tape are The distance from the adhesive surface is maintained at a first predetermined value set in advance. In the second proximity process, the suppression member approaches or contacts the non-adhesive surface of the adhesive tape, and the distance between the suppression member and the non-adhesive surface of the adhesive tape is maintained at a preset second predetermined value.

  Therefore, even if the air bubbles caught between the holding table and the adhesive tape expand and press the adhesive tape in the pasting process, the pressed adhesive tape is held by the semiconductor wafer maintained in the proximity position. It is accepted. Further, the expansion of the bubbles in the direction perpendicular to the surface of the adhesive tape is suppressed by the flat surface of the suppression member.

  Therefore, a part of the adhesive tape is pressed and stretched in a direction perpendicular to the surface of the adhesive tape due to the expansion of the bubbles, and it is possible to more reliably prevent unevenness and wrinkles from occurring. As a result, a situation where the adhesive tape is affixed non-uniformly to the semiconductor wafer and a situation where the adhesiveness between the adhesive tape and the semiconductor wafer is lowered can be reliably avoided. In addition, it is possible to avoid deterioration of the base material and adhesive material of the adhesive tape due to suppression of the expansion of the adhesive tape. In addition, the present configuration is not limited to the configuration in which the tape is previously applied to one surface of the semiconductor wafer as long as the pressure inside the chamber is reduced and the adhesive tape is applied to the semiconductor wafer. The features of the present invention can be applied to.

In order to achieve such an object, the present invention may take the following configurations.
That is, the present invention is an adhesive tape attaching apparatus for attaching a second adhesive tape to the other surface of a semiconductor wafer having a first adhesive tape attached to one surface,
A tape supply section for supplying the second adhesive tape;
A holding table for holding the second adhesive tape;
A chamber for storing the holding table, which is formed by sandwiching the first adhesive tape protruding from the outer edge of the semiconductor wafer between a pair of housings;
A first proximity mechanism that performs control to bring the holding table close to the semiconductor wafer and maintain a distance between the semiconductor wafer and the adhesive surface of the second adhesive tape at a first predetermined value set in advance;
In a state where the first proximity mechanism is operating, a differential pressure is generated in two spaces in the chamber partitioned by the first adhesive tape, and the second adhesive tape is attached to the other of the semiconductor wafers. A pasting mechanism for pasting on the surface;
It is characterized by comprising.

  (Operation and Effect) According to this configuration, the holding table is brought close to the semiconductor wafer by the first proximity mechanism, and the distance between the semiconductor wafer and the adhesive surface of the second adhesive tape is maintained at the first predetermined value set in advance. Is done. Therefore, even when the second adhesive tape is pasted to the semiconductor wafer by the pasting mechanism, even if the air bubbles caught between the semiconductor wafer and the first adhesive tape expand and press the semiconductor wafer, The pressed semiconductor wafer is received by a holding table maintained at a close position. That is, since the warp of the semiconductor wafer due to pressing is quickly suppressed by the holding table, deformation and breakage of the semiconductor wafer due to the warp can be suitably avoided.

  In the above-described invention, the semiconductor wafer is bonded and held to a ring frame via the first adhesive tape, and includes a frame holding unit that holds the ring frame, and the chamber is the frame holding unit. Preferably, the first adhesive tape between the held ring frame and the semiconductor wafer is sandwiched between a pair of housings. In this case, in the mounting frame in which the first adhesive tape is attached to one surface, the step of attaching the second adhesive tape to the other surface of the semiconductor wafer is carried out by the deformation or breakage of the semiconductor wafer. It can be executed while avoiding it.

  Further, in the above-described invention, the suppression member having a flat surface and the suppression member are brought close to or in contact with the non-adhesive surface of the first adhesive tape, and the distance between the flat surface and the first adhesive tape is set in advance. It is preferable to include a second proximity mechanism that performs control to maintain the set second predetermined value.

  (Operation / Effect) According to this configuration, the second adjoining mechanism causes the restraining member to approach the first adhesive tape, and the distance between the restraining member and the first adhesive tape is maintained at a preset second predetermined value. Is done. For this reason, when the second adhesive tape is attached to the semiconductor wafer by the attaching mechanism, even if the bubbles entrained between the semiconductor wafer and the first adhesive tape expand, they are perpendicular to the surface of the semiconductor wafer. The expansion of the bubbles in a certain direction is suppressed by the flat surface of the suppression member. Therefore, since the pressing force acting on the surface of the semiconductor wafer due to the expansion of the bubbles can be greatly reduced, damage to the wafer W due to the expansion of the bubbles can be suitably avoided. Moreover, since the expansion | extension of the 1st adhesive tape resulting from expansion | swelling of a bubble can be suppressed, it can avoid that the base material and adhesive material of a 1st adhesive tape deteriorate.

In order to achieve such an object, the present invention may take the following configurations.
That is, the present invention is an adhesive tape attaching apparatus for attaching a second adhesive tape to the other surface of a semiconductor wafer having a first adhesive tape attached to one surface,
A tape supply section for supplying the second adhesive tape;
A holding table for holding the semiconductor wafer;
A deterrent member having a flat surface;
A chamber comprising a pair of housings for housing the holding table and the restraining member;
A first attaching mechanism for attaching the second adhesive tape to one joint of the housing;
A first proximity mechanism that performs control to bring the holding table close to the second adhesive tape and maintain a distance between the semiconductor wafer and the adhesive surface of the second adhesive tape at a first predetermined value set in advance; ,
A second proximity mechanism that causes the restraining member to approach or contact the non-adhesive surface of the second adhesive tape, and maintains a distance between the flat surface and the second adhesive tape at a second predetermined value set in advance; ,
In a state where the first proximity mechanism and the second proximity mechanism are in operation, a differential pressure is generated in two spaces in the chamber partitioned by the second adhesive tape, and the second adhesive tape is A second attaching mechanism for attaching to the other surface of the semiconductor wafer;
It is characterized by comprising.

  (Operation / Effect) According to this configuration, the holding table is brought close to the second adhesive tape by the first proximity mechanism, and the distance between the semiconductor wafer and the adhesive surface of the second adhesive tape is set to a first predetermined value. Maintained at the value. For this reason, when the second adhesive tape is attached to the semiconductor wafer, even if the air bubbles caught between the semiconductor wafer and the first adhesive tape expand and press the semiconductor wafer, the second adhesive tape is pressed. The semiconductor wafer is received by a holding table maintained at a close position. That is, since the warp of the semiconductor wafer due to pressing is quickly suppressed by the holding table, deformation and breakage of the semiconductor wafer due to the warp can be suitably avoided.

  Further, the suppression member is brought close to the second adhesive tape by the second proximity mechanism, and the distance between the suppression member and the second adhesive tape is maintained at a second predetermined value set in advance. Therefore, when the second pressure-sensitive adhesive tape is attached to the semiconductor wafer, even if the bubbles entrained between the semiconductor wafer and the first pressure-sensitive adhesive tape expand, the direction perpendicular to the surface of the semiconductor wafer Expansion of the bubbles is suppressed by the flat surface of the suppression member. Therefore, since the pressing force acting on the surface of the semiconductor wafer due to the expansion of the bubbles can be greatly reduced, damage to the wafer W due to the expansion of the bubbles can be suitably avoided. Moreover, since the expansion | extension of the 2nd adhesive tape resulting from expansion | swelling of a bubble can be suppressed, it can avoid that the base material and adhesive material of a 2nd adhesive tape deteriorate.

  Further, in the above-described invention, a frame holding portion that holds a ring frame is provided, and the first pasting mechanism extends over the second frame across the one joint portion of the housing and the ring frame held by the frame holding portion. It is preferable to attach an adhesive tape.

  (Operation / Effect) According to this configuration, in the semiconductor wafer in which the first adhesive tape is attached to one surface, the second adhesive tape is attached to the other surface of the semiconductor wafer and the ring frame using the chamber. The pasting step can be executed while avoiding deformation and breakage of the semiconductor wafer. Therefore, it is possible to execute a more preferable mounting frame creation process while protecting one surface of the semiconductor wafer.

In order to achieve such an object, the present invention may take the following configurations.
That is, the present invention is an adhesive tape attaching apparatus for attaching a second adhesive tape to the other surface of a semiconductor wafer having a first adhesive tape attached to one surface,
A tape supply section for supplying the second adhesive tape;
A holding table for holding the second adhesive tape;
A wafer holder for holding the semiconductor wafer;
A first deterrent member having a flat surface;
A second deterrent member having a flat surface;
A chamber comprising a pair of housings for housing the holding table, the wafer holding unit, the first suppression member, and the second suppression member;
A first proximity mechanism for controlling the first deterring member to be brought close to the other surface of the semiconductor wafer and maintaining a distance between the semiconductor wafer and the first deterring member at a preset first predetermined value;
Second proximity that causes the second restraining member to approach or contact the non-adhesive surface of the first adhesive tape and maintain the distance between the flat surface and the first adhesive tape at a preset second predetermined value. Mechanism,
A depressurization mechanism for depressurizing the interior of the chamber in a state where the first proximity mechanism and the second proximity mechanism are operating;
An attaching mechanism for attaching the second adhesive tape to the other surface of the semiconductor wafer in a state where the inside of the chamber is decompressed;
It is characterized by providing.

  (Operation / Effect) According to this configuration, the first deterrent member is brought close to the semiconductor wafer by the first proximity mechanism, and the distance between the semiconductor wafer and the adhesive surface of the first deterrent member is set to a first predetermined value set in advance. Maintained. For this reason, when the semiconductor wafer and the first pressure-sensitive adhesive tape are stuck by the sticking mechanism, even if the air bubbles entrained between the semiconductor wafer and the first adhesive tape expand due to the reduced pressure and press the semiconductor wafer, the pressed semiconductor wafer is close It is received by the first deterrent member maintained in position. That is, since the warp of the semiconductor wafer due to pressing is quickly suppressed by the holding table, deformation and breakage of the semiconductor wafer due to the warp can be suitably avoided.

  Moreover, a 2nd suppression member adjoins or contacts a 1st adhesive tape by a 2nd proximity mechanism, and the distance of a 2nd suppression member and a 1st adhesive tape is maintained by the 2nd predetermined value set beforehand. For this reason, even when the bubbles entrained between the semiconductor wafer and the first adhesive tape are expanded due to the reduced pressure when performing the pasting by the pasting mechanism, the bubbles in the direction perpendicular to the surface of the semiconductor wafer are expanded. Expansion is restrained by the flat surface of the second restraining member. Therefore, since the pressing force acting on the surface of the semiconductor wafer due to the expansion of the bubbles can be greatly reduced, damage to the wafer W due to the expansion of the bubbles can be suitably avoided. Moreover, since the expansion | extension of the 1st adhesive tape resulting from expansion | swelling of a bubble can be suppressed, it can avoid that the base material and adhesive material of a 1st adhesive tape deteriorate. The present configuration is not limited to the configuration in which the second pressure-sensitive adhesive tape is applied after the pressure is reduced using the chamber, and is not limited to the configuration in which the differential pressure is applied, so the features of the present invention can be applied to more various chamber configurations. Applicable.

  In the above-described invention, it is preferable that a frame holding process of holding the ring frame by the frame holding part is provided, and the chamber holds the frame holding part. In this case, even in the configuration in which the ring frame and the frame holding unit are housed in the chamber, the step of attaching the second adhesive tape to the semiconductor wafer can be executed while avoiding deformation and breakage of the semiconductor wafer.

  In the above-described invention, it is preferable that the first suppression member is the holding table, and the second adhesive tape is brought close to the semiconductor wafer together with the holding table by the first proximity mechanism. In this case, since the holding table also functions as the first suppression member, it is possible to avoid complication of the apparatus.

  Furthermore, since the second adhesive tape is close to the semiconductor wafer in the first approaching process, even when air bubbles are caught between the second adhesive tape and the holding table, the second adhesive tape is perpendicular to the surface of the adhesive tape. Expansion of the bubble with respect to the direction is quickly suppressed by the semiconductor wafer. Therefore, it can prevent more reliably that a part of 2nd adhesive tape expand | extends and an unevenness | corrugation and a wrinkle generate | occur | produce. As a result, it is possible to reliably avoid the situation where the second adhesive tape is affixed non-uniformly to the semiconductor wafer and the situation where the adhesion between the second adhesive tape and the semiconductor wafer is lowered.

  In the invention described above, it is preferable that the second restraining member is the wafer holding portion. In this case, since the wafer holding part also functions as the second suppression member, it is possible to avoid complication of the apparatus. Further, since the wafer holding unit is in contact with or closer to the first adhesive tape attached to the semiconductor wafer, the wafer W is more reliably damaged or expanded by the expansion of the bubbles. Can prevent

  In the above-described invention, the first predetermined value is preferably 0.1 mm or more and 0.5 mm or less. In this case, since the holding table is sufficiently close, the pressing force acting on the semiconductor wafer due to the expansion of the bubbles entrained between the semiconductor wafer and the first adhesive tape can be further reduced. Therefore, deformation and breakage of the semiconductor wafer due to pressing can be avoided more reliably.

  In the above-described invention, the second predetermined value is preferably 0.5 mm or less. In this case, since the restraining member is sufficiently close, the expansion of bubbles in the direction perpendicular to the surface of the semiconductor wafer can be restrained more reliably. Therefore, damage to the wafer W due to expansion of bubbles can be avoided more reliably.

  In the above-described invention, a cutting mechanism for cutting the second adhesive tape along the outer shape of the semiconductor wafer, a peeling mechanism for peeling the second adhesive tape cut out in the shape of the semiconductor wafer, and a peeling It is preferable to include a tape recovery unit that recovers the second adhesive tape later. In this case, since the second adhesive tape attached to the semiconductor wafer is cut along the outer shape of the semiconductor wafer, the second adhesive tape does not protrude from the outer edge of the semiconductor wafer. Therefore, the situation where the 2nd adhesive tape adheres to other composition can be avoided suitably.

In order to achieve such an object, the present invention may take the following configurations.
That is, the present invention is an adhesive tape attaching apparatus for attaching an adhesive tape to a semiconductor wafer,
A tape supply unit for supplying the adhesive tape;
A holding table for holding the adhesive tape;
A wafer holder for holding the semiconductor wafer;
A deterrent member having a flat surface;
A chamber comprising a pair of housings for housing the holding table, the wafer holding unit, and the restraining member;
First proximity for controlling the wafer holding part holding the semiconductor wafer to be close to the adhesive surface of the adhesive tape and maintaining the distance between the adhesive tape and the semiconductor wafer at a first predetermined value set in advance. Mechanism,
A second proximity mechanism that brings the restraining member into proximity with or in contact with the non-adhesive surface of the adhesive tape and maintains a distance between the flat surface and the adhesive tape at a second predetermined value set in advance;
A depressurization mechanism for depressurizing the interior of the chamber in a state where the first proximity mechanism and the second proximity mechanism are operating;
A sticking mechanism for sticking the adhesive tape to the semiconductor wafer in a state where the inside of the chamber is decompressed;
Characterized by comprising

  (Operation / Effect) According to this configuration, when the adhesive tape is attached to the semiconductor wafer, the wafer holding unit holding the semiconductor wafer is brought close to the adhesive tape by the first proximity mechanism, and the semiconductor wafer and the adhesive tape are The distance from the adhesive surface is maintained at a first predetermined value set in advance. And the suppression member approaches or contacts the non-adhesive surface of the adhesive tape by the second proximity mechanism, and the distance between the suppression member and the non-adhesive surface of the adhesive tape is maintained at a preset second predetermined value.

  Therefore, even when the air bubbles entrained between the holding table and the adhesive tape expand due to reduced pressure and press the adhesive tape during application by the application mechanism, the pressed adhesive tape is maintained in the proximity position. It is received by the semiconductor wafer. Further, the expansion of the bubbles in the direction perpendicular to the surface of the adhesive tape is suppressed by the flat surface of the suppression member.

  Therefore, a part of the adhesive tape is pressed and stretched in a direction perpendicular to the surface of the adhesive tape due to the expansion of the bubbles, and it is possible to more reliably prevent unevenness and wrinkles from occurring. As a result, a situation where the adhesive tape is affixed non-uniformly to the semiconductor wafer and a situation where the adhesiveness between the adhesive tape and the semiconductor wafer is lowered can be reliably avoided. In addition, it is possible to avoid deterioration of the base material and adhesive material of the adhesive tape due to suppression of the expansion of the adhesive tape. In addition, the present configuration is not limited to the configuration in which the tape is previously applied to one surface of the semiconductor wafer as long as the pressure inside the chamber is reduced and the adhesive tape is applied to the semiconductor wafer. The features of the present invention can be applied to.

  According to the adhesive tape attaching method and the adhesive tape attaching apparatus of the present invention, a new adhesive is applied to the other surface of the wafer on which the adhesive tape is attached to one surface while avoiding wafer breakage and circuit damage. Tape can be applied with high accuracy.

It is a figure explaining the structure of a mount frame. (A) is sectional drawing which shows the structure of the mount frame before and behind a sticking process, (b) is a perspective view of a mount frame. It is a front view which shows the whole adhesive tape sticking apparatus which concerns on Example 1. FIG. It is a top view which shows the whole adhesive tape sticking apparatus which concerns on Example 1. FIG. FIG. 3 is a longitudinal sectional view illustrating a configuration provided in the rotation drive mechanism according to the first embodiment. 1 is a longitudinal sectional view illustrating a configuration of a chamber according to Example 1. FIG. 1 is a longitudinal sectional view illustrating a configuration of a chamber according to Example 1. FIG. It is a flowchart explaining operation | movement of the adhesive tape sticking apparatus which concerns on each Example. (A) is a flowchart explaining the operation | movement which concerns on Example 1, (b) is a flowchart explaining the operation | movement which concerns on Example 2. FIG. FIG. 6 is a longitudinal sectional view showing an operation in step S1 according to the first embodiment. FIG. 6 is a longitudinal sectional view showing an operation in step S1 according to the first embodiment. FIG. 6 is a plan view showing the operation in step S1 according to the first embodiment. FIG. 6 is a longitudinal sectional view showing an operation in step S1 according to the first embodiment. FIG. 6 is a longitudinal sectional view showing an operation in step S1 according to the first embodiment. FIG. 6 is a longitudinal sectional view showing an operation in step S1 according to the first embodiment. FIG. 6 is a longitudinal sectional view showing an operation in step S1 according to the first embodiment. It is a longitudinal cross-sectional view which shows operation | movement of step S2 which concerns on Example 1. FIG. It is a longitudinal cross-sectional view which shows operation | movement of step S3 which concerns on Example 1. FIG. It is a longitudinal cross-sectional view which shows operation | movement of step S3 which concerns on Example 1. FIG. It is a longitudinal cross-sectional view which shows operation | movement of step S4 which concerns on Example 1. FIG. It is a longitudinal cross-sectional view which shows operation | movement of step S5 which concerns on Example 1. FIG. It is a longitudinal cross-sectional view which shows operation | movement of step S6 which concerns on Example 1. FIG. It is a figure explaining the effect by Example 1. FIG. (A) is a figure which shows the structure of a prior art example, (b) is a figure which shows the problem which generate | occur | produces in the structure of a prior art example, (c) is the holding table which maintains a proximity position in Example 1, and It is a figure which shows the positional relationship with a semiconductor wafer, (d) is a figure explaining the effect of the holding table which maintains a proximity position in Example 1, (e) is a figure which maintains a proximity position in Example 1. It is a figure which shows the positional relationship of the suppression member to perform and the 1st adhesive tape, (f) is a figure explaining the effect of the suppression member which maintains a proximity position in Example 1. FIG. It is a longitudinal cross-sectional view which shows the whole adhesive tape sticking apparatus which concerns on Example 2. FIG. It is a top view which shows the whole adhesive tape sticking apparatus which concerns on Example 2. FIG. 6 is a longitudinal sectional view showing a configuration of a chamber according to Example 2. FIG. It is a longitudinal cross-sectional view which shows operation | movement of step S1 which concerns on Example 2. FIG. It is a longitudinal cross-sectional view which shows operation | movement of step S3 which concerns on Example 2. FIG. (A) is a figure which shows the state before affixing a support tape, (b) is a figure which shows the state after affixing a support tape. It is a longitudinal cross-sectional view which shows operation | movement of step S5 which concerns on Example 2. FIG. It is a longitudinal cross-sectional view which shows operation | movement of step S6 which concerns on Example 2. FIG. It is a longitudinal cross-sectional view which shows operation | movement of step S7 which concerns on Example 2. FIG. It is a longitudinal cross-sectional view which shows the operation | movement of the sticking process which concerns on a modification. 6 is a longitudinal sectional view illustrating a configuration of a chamber according to Example 3. FIG. It is a longitudinal cross-sectional view which shows operation | movement of step S4 which concerns on Example 3. FIG. It is a longitudinal cross-sectional view which shows operation | movement of step S5 which concerns on Example 3. FIG. It is a longitudinal cross-sectional view which shows the structure of the chamber which concerns on a modification (5). In modification (5), it is a longitudinal cross-sectional view which shows the structure which affixes an adhesive tape with an affixing roller. It is a longitudinal cross-sectional view which shows the structure of the chamber which concerns on a modification (7). It is a longitudinal cross-sectional view which shows operation | movement of step S4 which concerns on a modification (7). It is a longitudinal cross-sectional view which shows the structure of the chamber which concerns on a modification (8). (A) is a figure which shows the structure of the state which completed step S3, (b) is a figure which shows the structure which concerns on step S4. It is a figure explaining the effect of the composition concerning a modification (8). (A) is a figure which shows the structure before pressure reduction about the conventional structure which does not perform control which makes a wafer holding part adjoin to an adhesive tape, (b) is the figure after the pressure reduction in the conventional structure, and the state of an adhesive tape (C) is a figure which shows the structure which affixed the adhesive tape to the wafer in the conventional structure, (d) is a figure which shows the state of the bubble after pressure_reduction | reduced_pressure, and an adhesive tape in the modification (8) It is. It is a longitudinal cross-sectional view which shows the structure of the chamber which concerns on a modification.

<Description of overall configuration>
Embodiment 1 of the present invention will be described below with reference to the drawings. In this embodiment, a case where an adhesive tape for surface protection is attached to a circuit forming surface of a semiconductor wafer (hereinafter simply referred to as “wafer”) mounted on a ring frame will be described as an example.

  That is, as shown in FIG. 1A, in a mount frame MF in which a supporting adhesive tape DT is attached to the back surface of a semiconductor wafer W (hereinafter simply referred to as “wafer W”), the front surface (circuit) A protective tape PT for protection is affixed to the forming surface. Hereinafter, the supporting adhesive tape is referred to as “supporting tape DT”, and the protective adhesive tape is referred to as “protecting tape PT”. As shown in FIG. 1B, the mount frame MF is manufactured by attaching a support tape DT to the back surface of the wafer W and the ring frame f. In Example 1, the support tape DT corresponds to the first adhesive tape in the present invention, and the protective tape PT corresponds to the second adhesive tape in the present invention.

  FIG. 2 is a front view showing the entire configuration of the pressure-sensitive adhesive tape applying apparatus according to the first embodiment of the present invention, and FIG. 3 is a plan view of the pressure-sensitive adhesive tape applying apparatus according to the first embodiment.

  The adhesive tape pasting apparatus according to the first embodiment includes a wafer supply / recovery unit 1, a wafer transport mechanism 2, an alignment stage 3, a tape supply unit 4, a mounting unit 5, a tape cutting mechanism 6, a chamber 7, a deterring unit 8, and a peeling unit. A unit 9 and a tape collecting unit 10 are provided. Hereinafter, a specific configuration of each of the structural units and mechanisms will be described.

  Two cassettes C 1 and C 2 are placed in parallel on the wafer supply / recovery unit 1. In each cassette C, a large number of mount frames MF are inserted and stored in multiple stages in a horizontal posture with the circuit formation surface (front surface) of the wafer W facing downward.

  The wafer transfer mechanism 2 includes two robot arms 2A and 2B. Both the robot arms 2A and 2B are configured to be able to move forward and backward horizontally, and can be turned and raised as a whole. The robot arms 2A and 2B are provided at their tips with a horseshoe-shaped vacuum suction type wafer holder. The wafer holding unit is inserted into a gap between the mount frames MF stored in multiple stages in the cassette C, and holds the upper surface of the mount frame MF by suction. The sucked and held mount frame MF is pulled out from the cassette C and conveyed in the order of the alignment stage 3, the holding table 37, and the wafer supply / collection unit 1.

  The alignment stage 3 aligns the mount frame MF carried in and placed by the wafer transfer mechanism 2 based on notches formed on the outer periphery of the wafer W, flat portions formed on the outer periphery of the frame f, and the like. Composed.

  The tape supply unit 4, the mounting unit 5, the separator recovery unit 12, and the cutting unit 23 are mounted on the same vertical plate 14 as shown in FIG. The vertical plate 14 moves horizontally along the upper frame 16 via the movable table 15.

  In the tape supply unit 4, a roll-wrapped wide protective tape PT is loaded on the supply bobbin 17, and the protective tape PT with the separator S fed out from the supply bobbin 17 is wound around the guide roller 18 group. The protective tape PT from which the separator S is peeled off is guided to the mounting unit 5. Further, the supply bobbin 17 is provided with an appropriate rotational resistance so that excessive tape feeding is not performed.

  In the separator collection unit 12, a collection bobbin 19 that winds up the separator S peeled off from the protective tape PT is driven to rotate in the winding direction.

  The mounting unit 5 is for mounting the protective tape PT from which the separator S has been peeled off on the holding table 37 with the adhesive surface facing upward. As shown in FIG. 21 and a pressure roller 22 are provided.

  The peeling member 20 has an edge with a sharp tip. The separator S is folded back and the protective tape PT is peeled off by the peeling member 20 whose edge is inclined downward. That is, the protective tape PT protrudes forward from the peeling member 20. The elevating roller 21 holds the protective tape PT in a timely manner in cooperation with the peeling member 20. The pressure roller 22 is subjected to non-adhesive processing, and presses the front end of the protective tape PT protruding from the front end of the peeling member 20 and places it on a holding table 37 described later.

  The cutting unit 23 includes a movable table 25 that moves along a frame 24 provided on the front side of the peeling member 20, and a cutter 26 at a lower portion of the movable table 25 via a cutter holder. That is, the cutting unit 23 cuts the protective tape PT in the width direction.

  As shown in FIGS. 2 and 3, the tape cutting mechanism 6 includes a cutter unit via a support arm 29 that extends in the radial direction at the lower end of the arm that is cantilevered from a movable base 28 that can be moved up and down along the frame 27. 30. The cutter unit 30 is mounted with a cutter 31 with a cutting edge facing downward via a cutter holder. The cutter unit 30 can adjust the turning radius via the support arm 29. The tape cutting mechanism 6 cuts the protective tape PT placed on the holding table 37 so as to have substantially the same shape and size as the wafer W.

  The chamber 7 is constituted by a pair of upper and lower housings having an outer shape smaller than the width of the adhesive tape T. In the present embodiment, one upper housing 33A and two lower housings 33B and 33C are provided.

  The lower housings 33 </ b> B and 33 </ b> C are connected and fixed to the rotary shaft 35 of the rotary drive mechanism 34 such as a motor, and are respectively provided at both ends of the turning arm 36. That is, for example, when one lower housing 33B forms the upper housing 33A and the chamber 7, the other lower housing 33C is configured to be positioned at the tape placement position on the placement unit 5 side. Further, the upper and lower surfaces of the lower housings 33B and 33C are subjected to mold release processing such as fluorine processing.

  A holding table 37 that can be raised and lowered is provided in the lower housings 33B and 33C. The holding table 37 is connected to a rod 38 that passes through the lower housings 33B and 33C. The other end of the rod 38 is drivingly connected to an actuator 39 made of a motor or the like. Accordingly, the holding table 37 moves up and down in the lower housings 33B and 33C. The position of the holding table 37 is controlled to an arbitrary height by the control unit 60 described later.

  The holding table 37 places and holds the protective tape PT with the separator S peeled off and the adhesive surface facing upward. As shown in FIG. 5, a cutter running groove 37 a is formed on the upper surface of the holding table 37 in order to cut the protective tape PT by turning the cutter blade 31 provided in the cutter unit 30. In the plan view of the holding table 37, the cutter running groove 37 a is formed at a position having substantially the same shape and size as the wafer W.

  The upper housing 33A is provided in the lifting drive mechanism 40 as shown in FIG. The elevating drive mechanism 40 includes a movable frame 43 that can be moved up and down along a rail 42 that is vertically disposed on the back of a vertical wall 41, a movable frame 44 that is supported by the movable platform 43 so that the height can be adjusted, and the movable frame An arm 45 extending forward from 44 is provided. An upper housing 33 </ b> A is mounted on a support shaft 46 that extends downward from the tip of the arm 45.

  The movable base 43 is moved up and down by screw feed 47 by rotating the screw shaft 47 forward and backward by a motor 48.

  As shown in FIG. 6, the upper and lower housings 33 </ b> A to 33 </ b> C are connected to a vacuum device 51 through a flow path 50. The flow path 50 on the upper housing 33A side includes an electromagnetic valve 52. In addition, a flow path 55 including electromagnetic valves 53 and 54 for opening to the atmosphere is connected to each of the housings 33A to 33C. Further, a flow path 57 including an electromagnetic valve 56 that adjusts the internal pressure once reduced by leakage is connected to the upper housing 33A. The opening / closing operation of the electromagnetic valves 52, 53, 54, and 56 and the operation of the vacuum device 51 are performed by the control unit 60.

  As shown in FIG. 5, the restraining unit 8 includes a restraining member 61 in the upper housing 33A. The restraining member 61 is a plate having a flat bottom surface. A cylinder 62 is connected to the upper portion of the restraining member and moves up and down in the upper housing 33A. Further, the position of the restraining member 61 is controlled to an arbitrary height by the control unit 60. The control unit 60 corresponds to the first proximity mechanism and the second proximity mechanism of the present invention.

  As shown in FIGS. 2, 3, and 17, the peeling unit 9 includes a movable table 65 that moves horizontally along the guide rail 64, a fixed receiving piece 66 that moves up and down on the movable table 65, and the fixed receiving piece. 66 and a movable piece 68 that is opened and closed by a cylinder 67 is provided. That is, the peeling unit 9 grips and peels one end side of the unnecessary protective tape PT cut into the shape of the wafer W by the tape cutting mechanism 6 by the fixed receiving piece 66 and the movable piece 68.

  A recovery container 69 for recovering the protective tape PT peeled off by the peeling unit 9 is disposed in the tape collecting unit 10 at the peeling end end side of the peeling unit 9.

  The adhesive tape attaching device includes a frame holding table 77. As shown in FIGS. 3, 4, and 15, the frame holding table 77 has an annular shape that surrounds the outer periphery of the lower housings 33 </ b> B and 33 </ b> C, and is provided on the turning arm 36. Therefore, the lower housings 33B and 33C are rotated together. When the ring frame f is placed on the frame holding table 77, the height is set so that the upper surfaces of the joint portions 70 of the lower housings 33B and 33C are flush with the upper surface of the ring frame f. The frame holding table 77 corresponds to the frame holding unit in the present invention.

<Description of operation>
Next, a description will be given of a round of operation of attaching the protective tape PT to the wafer W of the mount frame MF using the above-described embodiment apparatus. FIG. 7A is a flowchart illustrating a process of attaching the protective tape PT to the wafer W of the mount frame MF according to the first embodiment.

Step S1 (placement of protective tape)
In accordance with an instruction to start the application of the protective tape PT, the tape supply unit 4 first feeds the protective tape PT with the separator S to the placement unit 5. Then, as shown in FIG. 8, the holding table 37 rises so that the height of the upper surface thereof is the same as the top (joining portion) 70 of the lower housing 33B, and moves to the tape receiving position indicated by the solid line.

  Furthermore, as shown in FIG. 8, the mounting unit 5 is moved from the initial position indicated by the dotted line to the pressing process start position indicated by the solid line. The protective tape PT is protruded from the peeling member 20 by a predetermined length while synchronizing the supply and winding of the protective tape PT. Thereafter, the pressing roller 22 is lowered to press the tip of the protective tape PT against the joint portion 70 of the lower housing 33B.

  Thereafter, as shown in FIG. 9, the protective tape PT is placed on the entire surface of the joint 70 and the holding table 37 by pressing the protective tape PT downward while moving the mounting unit 5 in the left direction in the figure. Will be placed. At this time, the placed protective tape PT is sucked and held by the holding table 37. Then, as indicated by a solid line in FIG. 9, the mounting unit 5 stops at a position exceeding a predetermined distance from the joint 70 on the pressing process end side.

  The cutting unit 23 is activated, and the cutter 26 cuts the rear end side of the protective tape PT in the width direction (y direction in the figure) as shown in FIG. After the protective tape PT is cut into single sheets, the placement unit 5 and the cutting unit 23 return to the initial positions.

  The placement unit 5 and the cutting unit 23 operate the tape cutting mechanism 6 after returning to the initial position. That is, as shown in FIG. 11, the cutter unit 30 is lowered to a predetermined height, and the cutter 31 is pierced by the protective tape PT in the cutter running groove 37 a of the holding table 37.

  When the cutter 31 is stabbed into the protective tape PT, the support arm 29 pivots about the vertical axis P as the pivot center. Along with this, the cutter 31 pivots along the cutter running groove 37a, and the protective tape PT sucked and held by the holding table 37 is cut into substantially the same shape and size as the wafer W. At this time, the surface of the protective tape PT is kept horizontal. When the cutting of the protective tape PT is completed, the cutter unit 30 moves up and returns to the standby position.

  After the protective tape PT is cut, the peeling unit 9 is moved to the peeling start position. As shown in FIG. 12, both ends of the protective tape PT protruding from the lower housing 33 </ b> B are sandwiched between the fixed receiving piece 66 and the movable piece 68. Then, as shown in FIG. 13, the peeling unit 9 is moved obliquely upward by a predetermined distance in this state, and then the unnecessary protective tape PT cut out in the same shape as the wafer is peeled off while being horizontally moved. .

  When the unnecessary protective tape PT is peeled off, the protective tape PT cut out in the same shape as the wafer W is placed on the holding table 37 with the adhesive surface exposed upward. When the peeling unit 9 reaches the tape recovery unit 10, the gripping of the protective tape PT is released and the protective tape PT is dropped into the recovery container 69.

  After the unnecessary protective tape PT is peeled off, the holding table 37 is lowered while returning to the initial position while adsorbing and holding the protective tape PT as shown in FIG. At this time, the surface of the protective tape PT held by the holding table 37 is at a position lower than the joint portion 70. When the holding table 37 on which the protective tape is placed returns to the initial position, the step S1 is completed.

Step S2 (mounting frame mounting)
After the protective tape PT is placed on the holding table 37, placement of the mount frame is started. That is, the robot arm 2A carries out the mount frame MF from the cassette C1 and places it on the alignment stage 3. After alignment with the alignment stage 3, the mount frame MF is transported above the holding table 37 by the robot arm 2 </ b> A.

  As shown in FIG. 15, the robot arm 2A lowers the mount frame MF, and the mount frame MF is placed on the lower housing 33B. At this time, the support tape DT located between the ring frame f and the outer periphery of the wafer W is in contact with the top portion (joining portion) 70 of the lower housing 33B, and the ring frame f is placed on the frame holding table 77. Therefore, the support tape DT is in a flat state at the same height as the joint portion 70.

  At this time, the distance D1 from the adhesive surface of the protective tape PT held on the holding table 37 to the surface of the wafer W is such that contact between the protective tape PT and the wafer W under atmospheric pressure can be reliably avoided. It is enough distance. As an example, the distance D1 is about 3 to 5 cm. By placing the mount frame MF on the lower housing 33B, the step S2 is completed.

Step S3 (Formation of chamber)
After the mounting of the mount frame is completed, formation of the chamber is started, that is, as shown in FIG. 16, the rotary drive 34 is operated to pivot the lower housing 33B below the upper housing 33A. At this time, the lower housing 33C attached to the other end side of the swivel arm 36 moves to the tape placement position. After rotating the lower housing 33B, as shown in FIG. 17, the upper housing 33A is lowered, and the support tape DT is sandwiched between the lower housing 33B and the chamber 7 is formed.

Step S4 (table proximity movement)
After the chamber is formed, the table is moved closer. That is, as shown in FIG. 18, the holding table 37 is raised from the initial position indicated by the dotted line to the attaching position indicated by the solid line according to the control of the control unit 60, and the protective tape PT is brought close to the wafer W. As a result, the distance from the protective tape PT to the surface of the wafer W is D1 to D2. The control unit 60 performs various controls so that the position of the holding table 37 is maintained at the pasting position.

  The distance D2 is set in advance so as to be equal to or less than the predetermined value Lt1 so that damage to the wafer W can be avoided in the step of attaching the protective tape PT described later. The predetermined value Lt1 varies depending on various conditions such as the thickness of the wafer W and the material of the protective tape PT. In Example 1, the predetermined value Lt1 is about 0.5 mm to 1 mm.

  At this time, the protective tape PT and the surface of the wafer W are not in contact with each other. That is, the distance D2 is not less than a predetermined positive value Lt2, and is not less than 0.1 mm as an example. When the distance D2 is equal to or greater than the predetermined value Lt2, it is possible to avoid a situation in which the protective tape PT is in contact with the surface of the wafer W even under atmospheric pressure. The predetermined value Lt1 corresponds to the first predetermined value in the present invention.

  Here, in addition to the proximity movement of the holding table 37, it is preferable to further perform the proximity movement of the restraining member 61. When the restraining member 61 is moved in proximity, the cylinder 62 is driven according to the control of the control unit 60. By the driving, the restraining member 61 is lowered from the initial position indicated by the dotted line to the restraining position indicated by the solid line as shown in FIG. 18, and approaches the support tape DT. As a result, the distance from the flat surface 61a of the restraining member 61 to the support tape DT is E1 to E2. The control unit 60 performs various controls so that the position of the suppression member 61 is maintained at the suppression position.

  The distance E2 is set in advance so as to be equal to or less than a predetermined value Lt3 so as to avoid occurrence of bubble expansion in a direction perpendicular to the wafer surface (z direction in the drawing). The predetermined value Lt3 varies depending on various conditions such as the thickness of the wafer W and the material of the protective tape PT. In Example 1, the predetermined value Lt3 is about 0.5 mm to 1 mm. In addition, it is more preferable that the non-adhesive surface of the support tape DT and the flat surface 61a maintain a contact state from a viewpoint of preventing bubble expansion. That is, unlike the distance D2, the distance E2 may be zero. The predetermined value Lt3 corresponds to the second predetermined value in the present invention.

Step S5 (Attaching the protective tape)
After the close movement of the holding table and the restraining member is completed, sticking of the protective tape is started. That is, the control unit 60 operates the vacuum device 51 with the electromagnetic valves 53, 54, and 56 closed, and depressurizes the interior of the upper housing 33A and the interior of the lower housing 33B. At this time, the opening degree of the electromagnetic valve 52 is adjusted so that the pressure in the housings 33A and 33B is reduced at the same speed.

  When both housings 33A and 33B are depressurized to a predetermined pressure, the controller 60 closes the electromagnetic valve 52 and stops the operation of the vacuum device 51.

  The controller 60 gradually increases the inside of the lower housing 33B to a predetermined atmospheric pressure while adjusting the opening of the electromagnetic valve 56 to leak. At this time, as shown in FIG. 19, the air pressure in the upper housing 33A becomes lower than the air pressure in the lower housing 33B, and the protective tape PT is drawn into the upper housing 33A from the center by the differential pressure. Therefore, the protective tape PT is gradually affixed from the center of the wafer W arranged in proximity to the outer periphery.

  At this time, the non-adhesive surface of the support tape DT and the flat surface 61a of the suppression member 61 are brought closer in step S4. Therefore, even if bubbles are included between the support tape DT and the back surface of the wafer W, the bubbles are prevented from expanding in a direction (z direction) perpendicular to the surface of the wafer W. Is suppressed by. Therefore, damage to the wafer W due to expansion of bubbles in the z direction can be preferably avoided.

  Further, the adhesive surface of the protective tape PT and the surface of the wafer maintain a position close to the distance D2. For this reason, even if bubbles expand in the z direction between the support tape DT and the back surface of the wafer W and the wafer W is pressed downward, the pressed wafer W is quickly transferred to the holding table 37 via the protective tape PT. To be accepted. That is, since the deformation of the wafer W due to the downward pressing force is suppressed by the holding table 37, it is possible to preferably avoid the warpage or breakage of the wafer W due to the expansion of the bubbles.

  When the inside of the upper housing 33A reaches a preset atmospheric pressure, the control unit 60 adjusts the opening degree of the electromagnetic valve 54 so that the atmospheric pressure in the upper housing 33A is the same as the atmospheric pressure in the lower housing 33B. In accordance with this atmospheric pressure adjustment, the holding table 37 is raised so that the mounting surface (upper surface) of the holding table 37 and the surface of the wafer W are at the same height.

  When the protective tape PT is affixed to the entire surface of the wafer W, the control unit 60 raises the upper housing 33A to open the upper housing 33A to the atmosphere, and fully opens the electromagnetic valve 54 to open the lower housing 33B. Open. By the release to the atmosphere, the protective tape attaching process according to step S5 is completed.

  Note that the steps S1 to S2 can be performed in the lower housing 33C that has been moved to the tape mounting position while the protective tape PT is being attached to the wafer W in the chamber 7. That is, the protective tape PT from which the separator S has been peeled is placed on the holding table 37 in the lower housing 33C with the adhesive surface facing upward. Then, the protective tape PT is cut out in the same shape as the wafer W, and unnecessary protective tape PT is peeled off. Thereafter, the mount frame MF unloaded from the cassette C2 by the robot arm 2B is placed on the lower housing 33C. As described above, by providing a plurality of lower housings and alternately performing the steps S1 to S2, the efficiency of attaching the protective tape PT to the mount frame MF can be improved.

Step S6 (mount frame collection)
When the attaching process of the protective tape PT is completed in the chamber 7, collection of the mount frame is started. That is, as shown in FIG. 20, the holding table 37 is lowered to the initial position, and the turning arm 36 is reversed. At this time, the restraining member 61 is also raised to the initial position.

  By reversing the swivel arm 36, one lower housing 33B is moved to the tape placement position on the placement unit 5, and the other lower housing 33C is moved to the joining position below the upper housing 33A. The mount frame MF on which the protective tape PT is affixed is conveyed from the lower housing 33B by the robot arm 2A and collected at the original position of the cassette C1.

  Note that while the mount frame MF is being collected on the lower housing 33B side, a chamber is formed and a protective tape PT is attached to the mount frame MF on the lower housing 33C side. With the above, one round of affixing operation of the protective tape PT to the mount frame MF is completed, and thereafter the same processing is repeatedly performed.

<Effects of Configuration of Example 1>
According to the configuration according to the first embodiment, in the case where a new adhesive tape is attached to the other surface of the wafer having the adhesive tape attached to one surface using the pressure difference of the chamber, A new adhesive tape can be applied with high accuracy while reliably avoiding damage and the like.

  As shown in FIG. 21A, there is a case where air bubbles Ar are mixed between the adhesive tape T1 and the wafer W, which have been bonded to one surface of the wafer W in advance. In the conventional adhesive tape attaching apparatus, when a new adhesive tape T2 is attached to the wafer W using differential pressure in the chamber, the bubbles Ar expand in all directions as shown in FIG.

  As a result, a relatively large pressing force Ps is applied to the wafer W by the expanding bubbles Ar. Further, since the configuration such as the holding table is not close to the wafer W, a wide space is formed on the other surface of the wafer W. Therefore, the wafer W is warped so as to be warped by the pressing force Ps, and as a result, problems such as breakage of the wafer W and damage of the circuit occur. Further, when the bubble Ar expands in the z direction, the length that the adhesive tape T1 expands due to the expansion increases, and the elasticity of the base material and the adhesive material of the adhesive tape T1 is lost and deteriorates.

  In the apparatus according to the first embodiment, as shown in FIG. 21C, the holding table 37 on which the adhesive tape T <b> 2 (protective tape PT) is placed is brought close to and opposed to the wafer W before the differential pressure is generated in the chamber 7. , The proximity facing state is maintained. That is, during the application of the adhesive tape T2 by the differential pressure, each position is controlled so that the distance between the holding table 37 and the wafer W is always a predetermined small value D2.

  In this case, even when the wafer W is pressed by bubbles or the like, as shown in FIG. 21 (d), the wafer W is quickly moved by the holding table 37 whose distance from the wafer W is maintained at D2. Supported. At this time, the control unit 60 controls each component so that the holding table 37 is held (fixed) at a position close to the semiconductor wafer. Therefore, the holding table 37 does not move downward due to the pressure of the bubbles. Therefore, deformation of the wafer W can be suppressed, and problems such as breakage of the wafer W and circuit damage can be avoided more reliably.

  Further, since the distance D2 is set so that the adhesive tape T2 and the wafer W are not in contact with each other, it is possible to avoid the bubbles from being mixed due to the contact between the adhesive tape T2 and the wafer W under atmospheric pressure. Even when the wafer W is pressed by the pressing force Ps caused by the expanded bubbles Ar and comes into contact with the adhesive tape T2, in this case, since the vacuum suction has already started, the space between the adhesive tape T2 and the wafer is Air bubbles do not get mixed in. Therefore, a new adhesive tape T2 can be attached to the wafer W with high accuracy while avoiding damage to the wafer W.

  Furthermore, in the apparatus according to the first embodiment, as shown in FIG. 21 (e), before the pressure difference is generated, the restraining member 61 is brought into close proximity to the adhesive tape T1 (support tape DT), and the proximity facing is maintained. Let That is, while the protective tape PT is applied by the differential pressure, each position is controlled so that the distance between the suppression member 61 and the adhesive tape T1 is always a predetermined small value E2.

  In this case, even if the bubbles Ar are mixed between the support tape DT and the wafer W and the bubbles Ar expand due to the reduced pressure, as shown in FIG. Expansion of the bubble Ar with respect to the vertical direction (z direction) is quickly suppressed by the flat surface 61a of the suppression member 61 that is in close proximity.

  That is, since the bubble Ar that is about to expand in the z direction receives a repulsive force by the flat surface 61a of the restraining member 61 whose position is fixed, expansion in the z direction is limited. At this time, the control member 60 controls each component so that the restraining member 61 is maintained (fixed) at a predetermined position where the flat surface 61a is close to the adhesive tape T1. Therefore, the suppression member 61 does not move upward due to the pressure of the bubbles.

  As a result, since the bubbles Ar expand so as to spread along the surface (xy plane) of the wafer W, the pressing force Ps in the z direction is reduced as compared with the conventional configuration. Therefore, deformation of the wafer W due to excessive pressing force Ps can be suppressed, and problems such as breakage of the wafer W and circuit damage can be more reliably avoided. Moreover, since the situation where the adhesive tape T1 extends due to the expansion of bubbles in the z direction can be suppressed, the deterioration of the adhesive tape T1 due to the expansion can be avoided.

  Furthermore, the restraining member 61 is configured to maintain the proximity facing state or the contact state with the wafer W by maintaining a predetermined short distance E2. For this reason, since the restraining member 61 does not apply unnecessary pressure to the wafer W, it is possible to reliably avoid the occurrence of a situation in which the wafer W is damaged or a situation in which the wafer W is in contact with the adhesive tape T2 under atmospheric pressure. it can.

  In the first embodiment, both the restraining member 61 and the holding table 37 are moved in proximity to each other, and the differential pressure is generated after maintaining the proximity facing state with the adhesive tape T2. Therefore, when sticking the adhesive tape T2 on the wafer W by the differential pressure, it is possible to obtain the effects of reducing the pressing force Ps and suppressing the deformation of the wafer W, respectively. As a result, when the pressure inside the chamber 7 is reduced and the adhesive tape T2 is attached by the differential pressure, the effects of preventing the wafer W from being damaged and the circuit from being damaged can be synergistically improved.

  Next, a second embodiment of the present invention will be described. In the first embodiment, the configuration in which the protective tape PT is attached to the wafer W of the mount frame MF has been described as an example. In the second embodiment, an example of a mount processing configuration in which the mount frame MF is created by newly attaching the support tape DT across the back surface of the wafer W on which the protective tape PT is previously attached to the front surface and the ring frame will be described. To do. In addition, about the same structure as the adhesive tape sticking apparatus which concerns on Example 1, only the same code | symbol is attached | subjected and a different component is explained in full detail. In Example 2, the protective tape PT corresponds to the first adhesive tape in the present invention, and the support tape DT corresponds to the second adhesive tape in the present invention.

  As shown in FIGS. 22 and 23, the adhesive tape attaching apparatus according to the second embodiment newly includes a frame supply unit 75, a robot arm 76, and a cutting unit 78. Further, the position of the tape collecting unit 4 and the position of the separator collecting unit 12 are reversed. The tape cutting mechanism 6 can be omitted.

  The frame supply unit 75 is provided beside the cassette C1. A wagon type transport vehicle 79 in which the ring frame f is stacked and stored is connected to the space. The transport vehicle 78 is provided with an elevator. A ring frame f is stacked on the lifting platform, and is configured to deliver the ring frames f to the robot arm 76 one by one from the upper opening while moving up and down at a predetermined pitch.

  The robot arm 76 holds and conveys the upper surface of the ring frame f with a horseshoe-shaped holding unit.

  The cutting unit 78 cuts the supporting tape DT attached over the wafer W and the ring frame f along the ring frame f. As shown in FIG. 24, the cutting unit 78 is disposed in a lifting drive mechanism 40 that lifts and lowers the upper housing 33A. The cutting unit 78 includes a boss portion 80 that rotates around the support shaft 46 via a bearing 79. The boss portion 80 is provided with four support arms 81 to 84 extending radially in the center.

  A cutter bracket that horizontally supports a disc-shaped cutter 85 is mounted at the tip of one support arm 81 so as to be vertically movable, and a pressing roller 87 is provided at the tip of the other support arms 82 to 84. It is mounted so that it can be moved up and down via.

  A connecting portion 89 is provided on the upper portion of the boss portion 80, and the connecting portion 89 is drivingly connected to the rotating shaft of the motor 90 provided in the arm 45.

  Next, in the adhesive tape pasting apparatus according to the second embodiment, a configuration having a function different from that of the apparatus according to the first embodiment will be described.

  In the cassettes C1 and C2 of the wafer supply / recovery unit 1, a large number of wafers W are inserted and stored in multiple stages in a horizontal posture with the surface facing downward. A protective tape PT is attached to the surface of each wafer W in advance.

  The wafer holding unit of the wafer transfer mechanism 2 is inserted into a gap between the wafers W stored in multiple stages in the cassette C, and sucks and holds the wafer W from the back surface. The wafer W held by suction is pulled out from the cassette C and conveyed in the order of the alignment stage 3, the holding table 37, and the wafer supply / recovery unit 1.

  The alignment stage 3 is configured to align the wafer W loaded and placed by the wafer transfer mechanism 2 based on a notch or an orientation flat formed on the outer periphery of the wafer W.

  In the tape supply unit 4, a wide support tape DT wound in a roll is loaded on the supply bobbin 17, and the support tape DT with the separator S fed out from the supply bobbin 17 is wound and guided to the group of guide rollers 18. The support tape DT from which the separator S is peeled is guided to the affixing unit 2A.

  In the separator collection unit 12, a collection bobbin 19 that winds up the separator S peeled off from the support tape DT is driven to rotate in the winding direction.

  The mounting unit 5 attaches the support tape DT from which the separator S has been peeled off to the joint 70 of the lower housings 33B and 33C with the adhesive surface facing downward. And a pressure roller 22.

  The peeling member 20 has an edge with a sharp tip. The separator S is folded back and the support tape DT is peeled off by the peeling member 20 whose edge is inclined downward. That is, the support tape DT protrudes forward from the peeling member 20. The lifting roller 21 holds the support tape DT in a timely manner in cooperation with the peeling member 20. The pressing roller 22 presses the tip of the protective tape PT protruding from the tip of the peeling member 20 and affixes it to the joint 70 of the lower housings 33B and 33C. The cutting unit 23 cuts the support tape DT in the width direction.

  The holding table 37 sucks and holds the wafer W to which the protective tape PT is attached with the surface of the wafer W facing downward. As shown in FIGS. 22 and 24, the holding table 37 has a plurality of support pins 71 built therein. The support pin 71 is configured to be movable up and down, and its tip can be pushed up higher than the holding surface of the holding table 37.

The peeling unit 9 grips and peels one end side of the unnecessary support tape DT after being cut out by the cutting unit 78 by the fixed receiving piece 66 and the movable piece 68. In the tape recovery unit 10, a recovery container 69 for recovering unnecessary support tape DT peeled off by the peeling unit 9 is arranged.
<Description of operation>
Here, the operation of making a mount frame MF by attaching the support tape DT across the wafer W with the protective tape PT and the ring frame f by the adhesive tape attaching apparatus according to the second embodiment will be described. FIG. 7B is a flowchart for explaining an operation process of the mounting process according to the second embodiment.

Step S1 (wafer placement)
The robot arm 2A first unloads the wafer W from the cassette C1 and places it on the alignment stage 3 in accordance with an instruction to start sticking the support tape DT. After alignment with the alignment stage 3, the robot arm 2A conveys to the holding tape 37 in the tape application position.

  As shown in FIG. 25, the holding table 37 receives the wafer W by pushing up a plurality of support pins 71 higher than the top (joining portion) 70 of the lower housing 33 </ b> B. The support pins 71 that have received the wafer W are lowered, and the wafer W is sucked and held by the holding surface of the holding table 37. At this time, the surface of the wafer W is at a position lower than the bonding portion 70. When the holding table 37 sucks and holds the wafer W via the protective tape PT, the step S1 is completed.

Step S2 (Placement of ring frame)
After the mounting of the wafer is completed, the mounting of the ring frame is started. That is, the robot arm 76 carries out the ring frame f from the frame supply unit 75 and places it on the frame holding table 77 at the tape attaching position. The process of step S2 may be performed before step S1, or may be performed while executing step S1.

Step S3 (Attach the support tape to the ring frame)
When the placement of the wafer and the placement of the ring frame are completed, the process of step S3 is started. That is, as shown in FIG. 26A, the mounting unit 5 is moved from the initial position indicated by the dotted line to the application processing start position indicated by the solid line. The support tape DT protrudes from the peeling member 20 by a predetermined length while synchronizing the supply and winding of the support tape DT. Thereafter, the pressing roller 22 is lowered to press the tip of the support tape DT against the upper surface of the ring frame f.

  As shown in FIG. 26 (b), the mounting unit 5 moves from the pressing process start position indicated by the dotted line to the end position indicated by the solid line, and supports the support tape DT across the ring frame f and the joint 70 of the lower housing 33B. Paste. At this time, the back surface of the wafer W and the adhesive surface of the support tape DT are opposed to each other with a predetermined distance D1. When the mounting unit 5 reaches the end position, the cutting tape 23 cuts the support tape DT in the width direction. Step S3 according to Example 2 corresponds to the first pasting process in the present invention.

Step S4 (Formation of chamber)
When the support tape DT is attached to the ring frame f, the chamber is formed as in the first embodiment. That is, the rotary drive 34 is operated to pivot the lower housing 33B below the upper housing 33A, and then the upper housing 33A is lowered. The chamber 7 is formed by sandwiching the support tape DT between the lower housing 33B and the upper housing 33A. At this time, the distance from the non-adhesive surface of the support tape DT to the flat surface 61a of the suppression member 61 is E1.

Step S5 (table proximity movement)
After the chamber is formed, the table is moved closer. That is, as shown in FIG. 27, the holding table 37 is raised from the initial position indicated by the dotted line to the attaching position indicated by the solid line in accordance with the control of the control unit 60, and the wafer W is brought close to the support tape DT. As a result, the distance from the support tape DT to the surface of the wafer W is D1 to D2. The control unit 60 performs various controls so that the position of the holding table 37 is maintained at the pasting position. At this time, the support tape DT and the surface of the wafer W are not in contact with each other.

  The distance D2 is set in advance so as to be equal to or less than the predetermined value Lt1 so that damage to the wafer W can be avoided in the step of attaching the protective tape PT described later. The predetermined value Lt1 varies depending on various conditions such as the thickness of the wafer W and the material of the protective tape PT. In Example 1, the predetermined value Lt1 is about 0.5 mm to 1 mm. The value of the distance D2 is the same as that in the first embodiment.

  Here, in addition to the proximity movement of the holding table 37, it is preferable to further perform the proximity movement of the restraining member 61. When the restraining member 61 is moved in proximity, the cylinder 62 is driven according to the control of the control unit 60. By this driving, the restraining member 61 is lowered from the initial position indicated by the dotted line to the restraining position indicated by the solid line as shown in FIG. 27 and approaches the non-adhesive surface of the support tape DT.

  As a result, the distance from the flat surface 61a of the restraining member 61 to the support tape DT is E1 to E2. The control unit 60 performs various controls so that the position of the suppression member 61 is maintained at the suppression position. That is, the distance from the flat surface 61a to the support tape DT is controlled to always be E2. In order to suppress the deformation of the wafer W more quickly, the distance E2 is preferably smaller. In particular, it is preferable to control the height of the restraining member 61 so that the flat surface 61a is kept in contact with the support tape DT.

Step S6 (support tape is affixed to the wafer)
After the close movement of the holding table and the restraining member is completed, sticking of the support tape is started. That is, as in the first embodiment, the controller 60 operates the vacuum device 51 with the electromagnetic valves 53, 54, and 56 closed, and depressurizes the upper housing 33A and the lower housing 33B at the same speed. When both housings 33A and 33B are depressurized to a predetermined pressure, the controller 60 closes the electromagnetic valve 52 and stops the operation of the vacuum device 51.

  The controller 60 gradually increases the inside of the upper housing 33A to a predetermined pressure while adjusting the opening of the electromagnetic valve 56 to cause leakage. At this time, as shown in FIG. 28, the atmospheric pressure in the lower housing 33B becomes lower than the atmospheric pressure in the lower housing 33B, and the support tape DT is drawn into the lower housing 33B from the center by the differential pressure. For this reason, the support tape DT is gradually attached from the center of the wafer W arranged close to the outer periphery.

  At this time, since the holding table 37 holds the protective tape PT by suction, the distance between the holding table 37 and the protective tape PT is controlled to be zero. Therefore, even when bubbles are involved between the protective tape PT and the wafer W, it is possible to avoid the bubbles from expanding in the z direction during decompression. Therefore, it is possible to avoid a situation in which the wafer W is damaged due to an excessive pressing force acting on the wafer W upward.

  Further, the distance from the wafer W to the restraining member 61 is maintained to be a very small value (D2 + E2). Therefore, even when the wafer W is pressed upward due to the expansion of bubbles entrained between the protective tape PT and the wafer W, the wafer W is promptly pressed by the flat surface 61a of the restraining member 61. It is accepted. That is, warpage and deformation of the wafer W are preferably suppressed by the suppression member 61. As a result, the occurrence of a situation such as deformation or breakage of the wafer W can be prevented more reliably.

  When the inside of the upper housing 33A reaches the preset atmospheric pressure, the control unit 60 adjusts the opening degree of the electromagnetic valve 54 so that the atmospheric pressure in the lower housing 33B is the same as the atmospheric pressure in the upper housing 33A. In accordance with this atmospheric pressure adjustment, the holding table 37 is raised so that the upper surface of the wafer W (here, the back surface of the wafer) and the upper surface of the ring frame f have the same height.

  Note that the cutting unit 78 is activated while the support tape DT is being applied in the chamber 7. At this time, as shown in FIG. 28, the cutting unit 78 turns about the vertical axis P as the turning center. By this turning, the support tape DT with the cutter 85 attached to the ring frame f is cut into the shape of the ring frame f. Then, the pressing roller 87 follows the cutter 85 and presses while rolling the tape cutting portion on the ring frame f.

  That is, when the chamber 7 is configured by the lowered upper housing 33A and the lower housing 33B, the cutter 85 and the pressing roller 87 of the cutting unit 78 have also reached the cutting action position. As described above, the support tape DT is attached to the entire back surface of the wafer W and is cut along the ring frame f.

  When the attaching and cutting of the support tape DT are completed, the control unit 60 raises the upper housing 33A to release the atmosphere in the upper housing 33A, and fully opens the electromagnetic valve 54 to release the lower housing 33B. With the release to the atmosphere, the supporting tape attaching step according to step S6 is completed. Step S6 according to Example 2 corresponds to the second pasting process in the present invention.

  While the protective tape PT is attached to the wafer W in the chamber 7, the robot arm 2A and the robot arm 76 cause the wafer W and the ring frame f to be placed on the lower housing 33C and the frame holding table 77 at the tape placement position. Is mounted, and the adhesive tape DT is attached.

Step S7 (collection of mount frame)
When the attaching process of the support tape DT is completed in the chamber 7, the mounting frame collection is started. That is, the holding table 37 is lowered to the initial position, and the turning arm 36 is reversed. At this time, the restraining member 61 is also raised to the initial position (see FIG. 20).

  By reversing the swivel arm 36, one lower housing 33B is moved to the tape placement position on the placement unit 5, and the other lower housing 33C is moved to the joining position below the upper housing 33A.

  After reversing the swivel arm 36, the peeling unit 9 is moved to the peeling start position. As shown in FIG. 29, both end sides of the support tape DT protruding from the ring frame f are sandwiched between the fixed receiving piece 66 and the movable piece 68. In this state, after moving a predetermined distance obliquely upward, unnecessary support tape DT after being cut out along the ring frame f is peeled off while being horizontally moved.

  When the peeling unit 9 reaches the tape recovery unit 10, the support tape DT is released and the unnecessary support tape DT is dropped into the recovery container 69. The mount frame MF created by attaching the support tape DT to the wafer W is transported from the lower housing 33B by the robot arm 2A and collected at the original position of the cassette C1.

  In addition, while the peeling process and the peeling process of the adhesive tape DT are completed on the lower housing 33B side and the mounting frame in which the wafer W and the ring frame f are integrally formed is being unloaded, on the lower housing 33C side. A process of attaching the support tape DT to the wafer W and a cutting process are performed. This completes one round of operation of attaching the support tape DT to the wafer W, and thereafter, the same processing is repeated.

  Thus, also in the adhesive tape sticking apparatus which concerns on Example 2, the support tape DT is stuck by the differential pressure | voltage of a chamber with respect to the other surface of the wafer W in which the protective tape PT is affixed on one side. In the process, deformation and breakage of the wafer W can be avoided more reliably. That is, when the pressure inside the chamber 7 is reduced, the holding table 37 is brought close to the adhesive surface of the support tape DT, and the restraining member 61 is brought close to or in contact with the non-adhesive surface of the support tape DT.

  For this reason, even if a bubble is caught between the protective tape PT and the wafer W that have been attached in advance, the bubble that expands in the z direction during decompression causes the pressure to act on the wafer W. The pressure can be greatly reduced. Even if the wafer W is pressed upward, the deformation of the wafer W is quickly suppressed by the flat surface 61a of the suppression member 61. As a result, the deformation and breakage of the wafer W can be more reliably prevented in the attaching process of the support tape DT.

  In addition, since the holding table 37 adsorbs the wafer W, it is possible to prevent bubbles entrained between the protective tape PT and the wafer W from expanding in the z direction. Therefore, the pressing force acting on the circuit surface of the wafer W can be reduced, and deterioration of the protective tape PT due to the expansion of the protective tape PT can be suitably avoided.

  Next, a third embodiment of the present invention will be described. In the third embodiment, similarly to the first embodiment, the mounting tape MF is attached to the front surface of the wafer W in the mount frame MF in which the support tape DT is attached to the back surface of the wafer W. However, the configuration inside the chamber 7 is different between the first embodiment and the third embodiment.

  In the first embodiment, as illustrated in FIG. 17, the configuration in which the frame holding table 77 is disposed outside the chamber 7 has been described as an example. That is, in the first embodiment, the chamber 7 is formed by sandwiching the support tape DT between the ring frame f and the wafer W between the pair of housings 33A and 33B. On the other hand, in the third embodiment, as shown in FIG. 31, a frame holding portion 77 that holds the ring frame f is disposed inside the chamber 7. That is, the chamber 7 is formed in a state where the entire mount frame MF is accommodated in the chamber 7.

  In the third embodiment, the holding table 37 that holds the protective tape PT is provided in the upper housing 33A, and the restraining member 61 is provided in the lower housing 33B. The restraining member 61 having the flat surface 61a can be moved up and down, and has a function of placing and holding the wafer W thereon. The holding table 37 is configured to be movable up and down. As in the first embodiment, the holding table 37 may be provided in the lower housing 33B and the restraining member 61 may be provided in the upper housing 33A. In the third embodiment, the holding table 37 corresponds to the tape holding unit and the first suppression member in the present invention, and the suppression member 61 corresponds to the wafer holding unit and the second suppression member in the present invention.

  A description will be given of a single operation of attaching the protective tape PT to the wafer W of the mount frame MF using the adhesive tape attaching apparatus according to the third embodiment. The flowchart of the operation in the third embodiment is the same as that in the first embodiment. Similar to Example 1, in Example 3, the support tape DT corresponds to the first adhesive tape in the present invention, and the protective tape PT corresponds to the second adhesive tape in the present invention.

Step S1 (holding the protective tape)
In accordance with an instruction to start the application of the protective tape PT, the protective tape PT with the separator S is first fed out, and the placing unit 5 peels the separator S from the protective tape PT, while the pressing roller 22 transfers the protective tape PT to the holding table 37. Press upward. The protective tape PT is placed on the holding table 37 by the pressing, and the holding table 37 sucks and holds the protective tape PT. As in the first embodiment, the protective tape PT is cut out in the same shape as the wafer W by the cutting unit 23 and the tape cutting mechanism 6. The unnecessary protective tape PT after being cut off is peeled off by the peeling unit 9 and collected in the collection container 69.

Step S2 (mounting frame mounting)
After the protective tape PT is held on the holding table 37, the mount frame MF is unloaded in the same manner as in the first embodiment. After the alignment is performed by the alignment stage 3, the mount frame MF is placed on the lower housing 33B. At this time, the wafer W is placed on the restraining member 61, and the ring frame f is placed on the frame holding table 77.

Step S3 (Formation of chamber)
After the mounting of the mount frame is completed, the lower housing 33B is pivotally moved below the upper housing 33A. Then, the upper housing 33A is lowered and the upper housing 33A and the lower housing 33B are brought into close contact with each other to form the chamber 7. FIG. 31 shows a state where the chamber 7 is formed in the third embodiment. At this time, the distance D1 from the adhesive surface of the protective tape PT held on the holding table 37 to the surface of the wafer W is sufficiently large so as to reliably avoid contact between the protective tape PT and the wafer W under atmospheric pressure. It is a long distance.

Step S4 (table proximity movement)
After the chamber is formed, the table is moved closer. That is, as shown in FIG. 32, the holding table 37 is lowered from the initial position indicated by the dotted line to the attaching position indicated by the solid line under the control of the control unit 60, and the holding table 37 and the protective tape PT are brought close to the wafer W. As a result, the distance from the protective tape PT to the surface of the wafer W is D1 to D2. The control unit 60 performs various controls so that the position of the holding table 37 is maintained at the pasting position. In Example 3, the holding table 37 corresponds to the first suppression member in the present invention, and the suppression member 61 corresponds to the second suppression member in the present invention.

  The distance D2 is set in advance so as to be equal to or less than the predetermined value Lt1 so that damage to the wafer W can be avoided in the step of attaching the protective tape PT described later. In Example 3, the predetermined value Lt1 is about 0.5 mm to 1 mm. Further, the protective tape PT and the surface of the wafer W are not in contact with each other. That is, the distance D2 is not less than a predetermined positive value Lt2, and is not less than 0.1 mm as an example.

Step S5 (Attaching the protective tape)
After the close movement of the holding table is completed, the protective tape is applied. That is, the control unit 60 operates the vacuum device 51 in a state where the electromagnetic valves 53, 54, and 56 are closed to decompress the inside of the chamber 7.

  At this time, the non-adhesive surface of the support tape DT and the flat surface 61a of the suppression member 61 are in contact. Therefore, even when bubbles are included between the support tape DT and the back surface of the wafer W, the bubbles expand in a direction (z direction) perpendicular to the surface of the wafer W during decompression. The deterring member 61 deters. Therefore, damage to the wafer W due to expansion of bubbles in the z direction can be preferably avoided. In addition, since the distance D2 is equal to or greater than the predetermined value Lt2, it is possible to avoid a situation in which the protective tape PT is in contact with the surface of the wafer W despite being under atmospheric pressure.

  Further, the adhesive surface of the protective tape PT and the surface of the wafer maintain a position close to the distance D2. For this reason, even if bubbles expand in the z direction between the support tape DT and the back surface of the wafer W and the wafer W is pressed upward, the pressed wafer W is quickly transferred to the holding table 37 via the protective tape PT. To be accepted. That is, since the deformation of the wafer W due to the upward pressing force is suppressed by the holding table 37, it is possible to preferably avoid the warpage or breakage of the wafer W due to the expansion of the bubbles at the time of decompression.

  When the atmospheric pressure inside the chamber 7 is reduced to a predetermined value, the control unit 60 closes the electromagnetic valve 52 and stops the operation of the vacuum device 51. Then, as shown in FIG. 33, the control unit 60 moves the holding table 37 further downward and releases the suction and holding of the protective tape PT by the holding table 37. At this time, the protective tape PT is pressed against the surface of the wafer W by the holding table 37 under reduced pressure. Therefore, the protective tape PT can be affixed to the wafer W without air bubbles being involved.

  When the protective tape PT is attached to the entire surface of the wafer W, the control unit 60 opens the chamber 7 to the atmosphere by fully opening the electromagnetic valves 53, 54, and 56. By the release to the atmosphere, the protective tape attaching process according to step S5 is completed.

Step S6 (mount frame collection)
When the attaching process of the protective tape PT is completed in the chamber 7, collection of the mount frame is started. Step S6 is the same as that in the first embodiment. That is, the revolving arm 36 is reversed and the lower housing 33B is moved to the tape placement position on the placement unit 5 side. The mount frame MF on which the protective tape PT is affixed is conveyed from the lower housing 33B by the robot arm 2A and collected at the original position of the cassette C1.

  As shown in the third embodiment, the configuration according to the present invention is applied to the configuration in which the inside of the chamber 7 is decompressed and the protective tape PT is attached to the mount frame MF while the mount frame MF is housed in the chamber 7. it can. When the mount frame MF is created under atmospheric pressure, fine bubbles Ar may be caught between the wafer W and the support tape DT. If the pressure around the mount frame MF is reduced in this state, the bubbles Ar may expand and the wafer may be deformed or damaged, or the support tape DT may be deformed or deteriorated.

  In the apparatus according to the present invention, the holding table 37 having a flat surface and holding the protective tape PT is brought close to the wafer W before the inside of the chamber 7 is decompressed. Therefore, even if the wafer W is pressed due to the expansion of the bubbles Ar, the wafer W is quickly received by the flat surface of the holding table 37. That is, since the deformation of the wafer W due to the pressing force of the expanded bubbles is suppressed by the holding table 37, it is possible to suitably avoid the warpage or breakage of the wafer W due to the expansion of the bubbles Ar during decompression.

  At this time, by bringing the holding table 37 close to the wafer W, the protective tape PT held by the holding table 37 is also close to the flat wafer W. That is, even when the air bubbles entrained between the holding table 37 and the protective tape PT expand due to the reduced pressure and the protective tape PT is pressed in the z direction, the protective tape PT promptly removes the wafer W and restrains it. It is restrained by the member 61. Therefore, it is possible to more surely avoid an inconvenient situation such as unevenness and wrinkles occurring on the protective tape PT due to the expansion of the bubbles, and the protective tape PT being affixed to the wafer W unevenly.

  Furthermore, in the apparatus according to the present invention, the depressing member 61 is brought into contact with the support tape DT before the pressure inside the chamber 7 is reduced. Therefore, the extension of the support tape DT due to the expansion of the bubbles Ar is quickly suppressed by the suppression member 61. Therefore, the deformation and deterioration of the support tape DT due to the extension of the support tape DT can be more reliably prevented.

  As described above, the pressure-sensitive adhesive tape is pressed or deformed in the surface direction by reducing the pressure in a state where a member having a flat surface is brought close to or in contact with both surfaces of the protective tape PT or the support tape DT. It is restrained by a member having a surface. As a result, it is possible to prevent an adverse effect on the adhesive tape or the wafer W due to the expansion of the bubbles that have been caught in the adhesive tape under atmospheric pressure.

  The configuration in which the entire ring frame f and the wafer W are accommodated in the chamber 7 as in the third embodiment can also be applied to the configuration in the second embodiment. That is, the wafer W having the protective tape PT previously attached to the front surface and the ring frame f are accommodated in the chamber 7, and the support tape DT is newly attached to the back surface of the wafer W and the ring frame f. The mount frame MF may be created.

  The present invention can also be implemented in the following forms.

  (1) In each of the above embodiments, the configuration using the ring frame f has been described as an example, but the present invention is not limited to this. That is, as shown in FIG. 30, the second adhesive tape T <b> 2 is attached to the other surface of the wafer W on which the first adhesive tape T <b> 1 is already attached to one surface by the differential pressure of the chamber 7. If it is a process, the structure of this invention is applicable.

  (2) In each of the above-described embodiments and modifications, the configuration includes the two lower housings 33B and 33C, but may be one. In this case, the lower housing may be swung by the swivel arm 36 as in the above embodiment, or may be configured to slide along the straight rail.

  (3) In each of the above embodiments and modifications, each of the holding table 37 and the restraining member 61 may further include a heater. As an example, FIG. 24 shows a configuration in which a heater 63 is built in the restraining member 61. In this case, when the pasting process is executed inside the chamber 7, the adhesive and the base material constituting each of the protective tape PT and the support tape DT are heated and softened by the heater. As a result, it becomes easier to deform each adhesive tape. In addition, the structure provided with a heater in any one of the holding table 37 and the suppression member 61 may be sufficient.

  (4) In the above-described step S1 according to the first embodiment, the configuration in which the strip-shaped protective tape PT from which the separator S has been peeled is placed on the holding table 37 and cut into the shape of the wafer W has been described as an example. However, if the protective tape PT with the adhesive surface exposed upward is placed on the holding table 37, the process of step S1 is not limited to this.

  As an example of a modification of the first embodiment, there is a configuration in which the protective tape PT precut according to the shape of the wafer W is placed on the holding table 37. Further, step S1 is completed in a state where the protective tape PT placed on the holding table 37 is cut into single sheets, and the protective tape PT is cut along the outer shape of the wafer W after the attaching step of step S5. Also good.

  (5) As shown in FIG. 34, in the configuration according to the present invention, the second adhesive tape T2 is applied to the other surface of the wafer W on which the first adhesive tape T1 is previously attached to one surface. Can be widely applied to a configuration in which is attached under reduced pressure. That is, the periphery of the wafer W is depressurized with a member having a flat surface in proximity to at least one surface (preferably both surfaces) of the wafer W, and the second adhesive tape T2 is attached in a depressurized state. If there is, the configuration for reducing the pressure is not limited to the chamber 7.

  Further, the method of attaching the second adhesive tape T2 to the wafer W is not limited to the configuration using differential pressure. As another example of the method, as shown in FIG. 33, a pressing operation for pressing a flat member (holding table 37 in the third embodiment) holding the second adhesive tape T2 (protective tape PT) against the wafer W. 35, or a configuration in which affixing is performed by rolling of an affixing roller 91 housed in the chamber 7, as shown in FIG.

  Examples of the operation of the configuration using the sticking roller 91 include the following. That is, the pressure inside the chamber 7 is reduced while the holding table 37 holding the protective tape PT is brought close to the wafer W. After completion of the decompression, the protective tape PT is placed on the wafer W by releasing the suction holding while further lowering the holding table 37. Then, the protective tape PT is pressed and attached to the wafer W by rolling the application roller 91 from the position indicated by the dotted line in FIG.

  (6) In the third embodiment, the configuration in which the support tape DT is brought into contact with the restraining member 61 by placing the mount frame MF on the restraining member 61 is exemplified, but the configuration is such that the pressure is reduced while the restraining member 61 is in contact. Not limited. That is, the depressurizing member 61 having the flat surface 61a may be depressurized while being close to the mount frame MF. In this case, the pressure reduction is started in a state where the distance from the flat surface 61a to the support tape DT is controlled to be E2 which is equal to or less than the predetermined value Lt3, and the tape is attached in the reduced pressure state.

  (7) In the third embodiment, the holding table 37 has been described by taking as an example a configuration in which the function as the first deterring member and the function of holding the protective tape PT are described. However, as shown in FIG. As another member, a restraining member 93 having a flat surface may be provided. In Example 3, the restraining member 61 has a function as a second restraining member and a function as a wafer holding unit for holding the wafer W. However, as a member separate from the restraining member 61 having a flat surface, As an example, a configuration including a ring-shaped wafer holding unit 95 may be used. In the modified example (7), the suppression member 93 corresponds to the first suppression member in the present invention, and the suppression member 61 corresponds to the second suppression member in the present invention.

  When the second adhesive tape T2 is attached to the other surface of the wafer W in the adhesive tape attaching apparatus according to the modified example (7), the flowchart of the operation conforms to the first embodiment. First, the second adhesive tape T2 is held on the holding table 37 (corresponding to step S1). Next, the wafer W to which the first adhesive tape T1 is attached is held by the wafer holder 95 (corresponding to step S2). Then, the upper housing 33A and the lower housing are joined to form the chamber 7 (corresponding to step S3). FIG. 36 shows a state in which Step S3 is completed in Modification Example (7). At this time, the restraining member 61 and the restraining member 93 are separated from the wafer W.

  In step S4, the restraining member 61 and the restraining member 93 are brought close to the wafer W as shown in FIG. That is, the deterring member 61 is brought close to (or brought into contact with) the non-adhesive surface of the first adhesive tape T1 attached to the wafer W, and the restraining member 93 is brought close to the other surface of the wafer W. As a result, the distance between the restraining member 93 and the wafer W is changed from D1 to D2, which is a minute distance. Further, the distance between the restraining member 61 and the first adhesive tape T1 is E2 which is a minute distance from E1.

  In step S5, the inside of the chamber 7 is depressurized. Even when the air bubbles entrained between the first adhesive tape T1 and the wafer W expand due to the reduced pressure and a part of the first adhesive tape T1 is pressed in the z direction, the first adhesive tape T1 is Immediately deterred by the deterring member 61. Therefore, it is possible to prevent the first adhesive tape T1 from deteriorating or the adhesiveness between the first adhesive tape T1 and the wafer W from being lowered by partially extending the first adhesive tape T1 in the z direction. Further, even if the wafer W is pressed in the z direction, it is restrained by the restraining member 93, so that damage or deformation of the wafer W can be prevented.

  When the depressurization is completed, the second adhesive tape T2 is attached to the wafer W by pressing with the holding table 37 or rolling of the attaching roller. At this time, the second pressure-sensitive adhesive tape T2 is pasted after the restraining member 61 and the first restraining member 93 are separated and retracted from the wafer W as necessary. After the application of the second adhesive tape T2 is completed, the process proceeds to step S6, and the wafer W with the adhesive tape attached on both sides is collected.

  (8) The configuration of performing pressure reduction in a state in which a member having a flat surface is brought close to the adhesive tape T according to the present invention is widely applicable to a configuration in which the adhesive tape T is attached to the wafer W under reduced pressure. FIG. 38A shows an example of a configuration in which the adhesive tape T is attached to one surface of the wafer W under reduced pressure.

  In the adhesive tape applying apparatus according to the modification (8), the holding table 37 for holding the adhesive tape T is provided in the lower housing 33B, and the wafer holding portion 95 for holding the wafer W by suction or the like is provided in the upper housing 33A. It has been. In this configuration, the holding table 37 also has a function as a restraining member that prevents the adhesive tape T from being pressed and expanded in the z direction.

  The wafer holding unit 95 has a configuration that can be moved up and down by the control unit 60. The adhesive tape T is held on the holding table 37 in a state where it is attached to the flat support plate G. Adhesion of the adhesive tape T to the support plate G is generally performed under atmospheric pressure. However, the support plate G may be omitted and the adhesive tape T may be placed and held directly on the holding table 37.

  When the adhesive tape T is attached to the wafer W in the modified example (8), the support plate G attached with the adhesive tape T is held on the holding table 37 and the wafer W is held on the wafer holder 95, and then the chamber 7 Are formed (steps S1 to S3). Then, before the pressure inside the chamber 7 is reduced, the wafer holding portion 95 is lowered and brought close to the adhesive surface of the adhesive tape T as shown in FIG. By the proximity control, the distance between the wafer W held by the wafer holding unit 95 and the adhesive tape T is maintained to be a minute distance D2 (step S4).

  In the proximity state, the adhesive surface of the adhesive tape T and the wafer W are configured to face each other with a small distance. Thereafter, the inside of the chamber 7 is depressurized while the wafer holding portion 95 is brought close to the adhesive tape T, and the holding table 37 and the support plate G are pressed against the wafer W under the reduced pressure to attach the adhesive tape T to the wafer W. (Step S5).

  In the configuration in which the adhesive tape T is attached to the wafer W under reduced pressure, when the pressure is reduced without bringing the wafer holding portion 95 close to the wafer W, the pressure is reduced with a wide space in contact with the adhesive tape T in the z direction. Since sticking of the adhesive tape T to the support plate G is generally performed in advance under atmospheric pressure, a minute bubble Ar may be caught between the adhesive tape T and the support plate G (FIG. 39A). .

  Accordingly, when the inside of the chamber 7 is depressurized, the bubble Ar entrained expands and a strong pressing force Ps is generated in the z direction. As a result, when the wafer holding part 95 is depressurized without being brought close to the adhesive tape T, a part of the adhesive tape T is pressed in the z direction (direction perpendicular to the surface of the adhesive tape T) and greatly expanded, and the adhesive tape Unevenness and wrinkles are generated on T (FIG. 39B). As a result, the adhesive tape T with unevenness and wrinkles is attached to the wafer W, so that the adhesion between the wafer W and the adhesive tape T is lowered (FIG. 39 (c)).

  In the configuration of the modification (8), the non-adhesive surface of the adhesive tape T is in contact with the flat holding table 37, and the flat wafer holding portion 95 (and the wafer W) are close to the adhesive surface of the adhesive tape T. State is maintained. For this reason, even if the bubble Ar entrained between the support plate G and the adhesive tape T expands due to the decompression process, the adhesive tape T that is about to be pressed in the z-direction is quickly held by the holding table 37 or It is restrained by the wafer holder 95 (and the wafer W) (FIG. 39D). Further, the expansion of the bubbles Ar in the z direction is suppressed by the wafer holding unit 95 and the holding table 37 that are close to the adhesive tape T in the z direction.

  Therefore, in the configuration in which the adhesive tape T is attached to the wafer W under reduced pressure, irregularities and wrinkles are formed on the adhesive tape T before being attached to the wafer W due to the expansion of the bubbles Ar during the decompression process. Can be avoided. As a result, the deterioration of the adhesive tape T due to the formation of irregularities and wrinkles, the situation where the adhesive tape T is affixed unevenly on the wafer W, the situation where the support plate G and the adhesive tape T are misaligned, etc. It can be avoided more reliably.

  In addition, the structure which concerns on each Example and each modification is applicable also in a modification (8). For example, the holding table 37 may be configured to be close to the adhesive tape T instead of being in contact. As shown in FIG. 40, a restraining member 61 having a flat surface 61a may be provided separately from the holding table 37. In this case, the depressing member 61 is brought close to or in contact with the non-adhesive surface of the adhesive tape T, and the decompression of the chamber 7 is reduced while maintaining the state where the flat surface 61a of the deterring member 61 inhibits the non-adhesive surface of the adhesive tape T. Do.

DESCRIPTION OF SYMBOLS 4 ... Tape supply part 5 ... Mounting unit 6 ... Tape cutting mechanism 7 ... Chamber 8 ... Deterring unit 9 ... Peeling unit 10 ... Tape collection | recovery part 20 ... Peeling member 22 ... Pasting roller 23 ... Cutting unit 33A ... Upper housing 33B, 33C ... Lower housing 37 ... Holding table 60 ... Control part 61 ... Inhibiting member 77 ... Frame holding table 91 ... Adhering roller 93 ... Inhibiting member 95 ... Wafer holding part PT ... Protective tape W ... Semiconductor wafer f ... Ring frame DT ... Support tape

Claims (25)

An adhesive tape attaching method for attaching a second adhesive tape to the other surface of a semiconductor wafer having a first adhesive tape attached to one surface,
A tape holding process for holding the second adhesive tape on a holding table;
Forming a chamber by sandwiching and bonding the first adhesive tape protruding from the outer edge of the semiconductor wafer between a pair of housings; and
A first proximity process for bringing the holding table close to the semiconductor wafer and maintaining a distance between the semiconductor wafer and the adhesive surface of the second adhesive tape at a first predetermined value set in advance;
Affixing the second adhesive tape to a semiconductor wafer while holding the first adhesive tape sandwiched between a pair of housings while lowering the air pressure in the chamber on the side of the semiconductor wafer lower than the other space Process,
The adhesive tape sticking method characterized by comprising. In the adhesive tape sticking method of Claim 1,
The semiconductor wafer is bonded and held to a ring frame via the first adhesive tape,
In the chamber forming process, the chamber is formed by sandwiching the first adhesive tape between the ring frame and the semiconductor wafer between a pair of housings while holding the ring frame by a frame holding portion. How to stick adhesive tape. In the adhesive tape sticking method according to claim 1 or 2,
A second member that causes a restraining member having a flat surface to approach or contact the non-adhesive surface of the first adhesive tape, and maintains a distance between the flat surface and the first adhesive tape at a preset second predetermined value. A method of applying an adhesive tape, comprising a proximity process. An adhesive tape attaching method for attaching a second adhesive tape to the other surface of a semiconductor wafer having a first adhesive tape attached to one surface,
A wafer holding process for holding the semiconductor wafer on a holding table;
A first pasting step of pasting the second adhesive tape on one joint of a pair of housings constituting the chamber;
A first proximity process in which the holding table is brought close to the second adhesive tape, and a distance between the semiconductor wafer and the adhesive surface of the second adhesive tape is maintained at a preset first predetermined value;
A second member that keeps a distance between the flat surface and the second pressure-sensitive adhesive tape at a second predetermined value that is set in advance by bringing a restraining member having a flat surface close to or in contact with the non-stick surface of the second pressure-sensitive adhesive tape. The proximity process,
In a state where the chamber is formed by sandwiching and joining the second adhesive tape between a pair of housings, the second wafer is placed in the chamber on the side of the semiconductor wafer while lowering the air pressure than the other space. A second pasting process for pasting the adhesive tape to the semiconductor wafer;
The adhesive tape sticking method characterized by comprising. In the adhesive tape sticking method according to claim 4,
A frame holding process for holding the ring frame at the frame holding unit,
In the first affixing process, the second adhesive tape is affixed across one joint portion of a pair of housings constituting the chamber and the ring frame held by the frame holding process. Pasting method. An adhesive tape attaching method for attaching a second adhesive tape to the other surface of a semiconductor wafer having a first adhesive tape attached to one surface,
A tape holding process for holding the second adhesive tape on a holding table;
A wafer holding process for holding the semiconductor wafer by a wafer holding unit;
Forming a chamber for housing the holding table and the wafer holding unit by joining a pair of housings;
A first proximity member accommodated in the chamber and having a flat surface is brought close to the semiconductor wafer, and a distance between the semiconductor wafer and the first restraining member is maintained at a first predetermined value set in advance. Process,
A second restraining member housed in the chamber and having a flat surface is brought close to or in contact with the non-adhesive surface of the first adhesive tape, and the distance between the flat surface and the first adhesive tape is preset. A second proximity process maintained at a second predetermined value;
After the second proximity process, with the chamber formed, the pasting process of pasting the second adhesive tape to the semiconductor wafer while lowering the atmospheric pressure inside the chamber;
The adhesive tape sticking method characterized by comprising. In the adhesive tape sticking method according to claim 6,
A frame holding process for holding the ring frame at the frame holding unit,
The said chamber accommodates the said frame holding part. The adhesive tape sticking method characterized by the above-mentioned. In the adhesive tape sticking method according to claim 6 or 7,
The first taper member is the holding table, and the second adhesive tape is brought close to the semiconductor wafer together with the holding table in the first approaching process. In the adhesive tape sticking method in any one of Claims 6 thru | or 8,
The second taper member is the wafer holding part. An adhesive tape sticking method, wherein: In the adhesive tape sticking method according to any one of claims 3 to 9,
Said 2nd predetermined value is 0.5 mm or less. The adhesive tape sticking method characterized by the above-mentioned. In the adhesive tape sticking method according to any one of claims 1 to 10,
Said 1st predetermined value is 0.1 mm or more and 0.5 mm or less. The adhesive tape sticking method characterized by the above-mentioned. An adhesive tape attaching method for attaching an adhesive tape to a semiconductor wafer,
A tape holding process for holding the adhesive tape on a holding table;
A wafer holding process for holding the semiconductor wafer by a wafer holding unit;
Forming a chamber for housing the holding table and the wafer holding unit by joining a pair of housings;
A first proximity process in which a wafer holding unit holding the semiconductor wafer is brought close to the adhesive tape, and a distance between the adhesive surface of the adhesive tape and the semiconductor wafer is maintained at a preset first predetermined value;
A restraining member housed in the chamber and having a flat surface is brought close to or in contact with the non-adhesive surface of the adhesive tape, and a distance between the flat surface and the adhesive tape is maintained at a second predetermined value set in advance. 2 proximity processes,
After the second proximity process, in the state where the chamber is formed, the pasting process of pasting the adhesive tape to the semiconductor wafer while lowering the pressure inside the chamber;
The adhesive tape sticking method characterized by comprising. An adhesive tape attaching apparatus for attaching a second adhesive tape to the other surface of the semiconductor wafer having the first adhesive tape attached to one surface,
A tape supply section for supplying the second adhesive tape;
A holding table for holding the second adhesive tape;
A chamber for storing the holding table, which is formed by sandwiching the first adhesive tape protruding from the outer edge of the semiconductor wafer between a pair of housings;
A first proximity mechanism that performs control to bring the holding table close to the semiconductor wafer and maintain a distance between the semiconductor wafer and the adhesive surface of the second adhesive tape at a first predetermined value set in advance;
In a state where the first proximity mechanism is operating, a differential pressure is generated in two spaces in the chamber partitioned by the first adhesive tape, and the second adhesive tape is attached to the other of the semiconductor wafers. A pasting mechanism for pasting on the surface;
An adhesive tape affixing device characterized by comprising: In the adhesive tape sticking device according to claim 13,
The semiconductor wafer is bonded and held to a ring frame via the first adhesive tape,
A frame holding part for holding the ring frame;
The chamber is formed by sandwiching the first adhesive tape between the ring frame held by the frame holder and the semiconductor wafer between a pair of housings. In the adhesive tape sticking device according to claim 13 or 14,
A deterrent member having a flat surface;
A second control is performed to bring the restraining member close to or in contact with the non-adhesive surface of the first adhesive tape and to maintain the distance between the flat surface and the first adhesive tape at a second predetermined value set in advance. A proximity mechanism;
A pressure-sensitive adhesive tape affixing device comprising: An adhesive tape attaching apparatus for attaching a second adhesive tape to the other surface of the semiconductor wafer having the first adhesive tape attached to one surface,
A tape supply section for supplying the second adhesive tape;
A wafer holder for holding the semiconductor wafer;
A deterrent member having a flat surface;
A chamber comprising a pair of housings for housing the holding table and the restraining member;
A first attaching mechanism for attaching the second adhesive tape to one joint of the housing;
A first proximity mechanism that performs control to bring the holding table close to the second adhesive tape and maintain a distance between the semiconductor wafer and the adhesive surface of the second adhesive tape at a first predetermined value set in advance; ,
A second proximity mechanism that causes the restraining member to approach or contact the non-adhesive surface of the second adhesive tape, and maintains a distance between the flat surface and the second adhesive tape at a second predetermined value set in advance; ,
In a state where the first proximity mechanism and the second proximity mechanism are in operation, a differential pressure is generated in two spaces in the chamber partitioned by the second adhesive tape, and the second adhesive tape is A second attaching mechanism for attaching to the other surface of the semiconductor wafer;
An adhesive tape affixing device characterized by comprising: In the adhesive tape sticking device according to claim 16,
A frame holding part for holding the ring frame;
The first adhesive mechanism affixes the second adhesive tape across one joint part of the housing and the ring frame held by the frame holding part. An adhesive tape attaching apparatus for attaching a second adhesive tape to the other surface of the semiconductor wafer having the first adhesive tape attached to one surface,
A tape supply section for supplying the second adhesive tape;
A holding table for holding the second adhesive tape;
A wafer holder for holding the semiconductor wafer;
A first deterrent member having a flat surface;
A second deterrent member having a flat surface;
A chamber comprising a pair of housings for housing the holding table, the wafer holding unit, the first suppression member, and the second suppression member;
A first proximity mechanism for controlling the first deterring member to be brought close to the other surface of the semiconductor wafer and maintaining a distance between the semiconductor wafer and the first deterring member at a preset first predetermined value;
Second proximity that causes the second restraining member to approach or contact the non-adhesive surface of the first adhesive tape and maintain the distance between the flat surface and the first adhesive tape at a preset second predetermined value. Mechanism,
A depressurization mechanism for depressurizing the interior of the chamber in a state where the first proximity mechanism and the second proximity mechanism are operating;
An attaching mechanism for attaching the second adhesive tape to the other surface of the semiconductor wafer in a state where the inside of the chamber is decompressed;
A pressure-sensitive adhesive tape affixing device comprising: In the adhesive tape sticking device according to claim 18,
A frame holding part for holding the ring frame;
The said chamber accommodates the said frame holding part. The adhesive tape sticking apparatus characterized by the above-mentioned. In the adhesive tape sticking device according to claim 18 or 19,
The first taper member is the holding table, and the first proximity mechanism brings the second adhesive tape close to the semiconductor wafer together with the holding table. In the adhesive tape sticking device according to any one of claims 18 to 20,
The second restraining member is the wafer holding unit. In the adhesive tape sticking device according to any one of claims 16 to 21,
Said 2nd predetermined value is 0.5 mm or less. The adhesive tape sticking apparatus characterized by the above-mentioned. In the adhesive tape sticking device according to any one of claims 13 to 22,
Said 1st predetermined value is 0.1 mm or more and 0.5 mm or less. The adhesive tape sticking apparatus characterized by the above-mentioned. In the adhesive tape sticking device according to any one of claims 13 to 23,
A cutting mechanism for cutting the second adhesive tape along the outer shape of the semiconductor wafer;
A peeling mechanism for peeling the second adhesive tape cut out in the shape of the semiconductor wafer;
A tape recovery unit for recovering the second adhesive tape after peeling;
A pressure-sensitive adhesive tape affixing device comprising: An adhesive tape attaching device for attaching an adhesive tape to a semiconductor wafer,
A tape supply unit for supplying the adhesive tape;
A holding table for holding the adhesive tape;
A wafer holder for holding the semiconductor wafer;
A deterrent member having a flat surface;
A chamber comprising a pair of housings for housing the holding table, the wafer holding unit, and the restraining member;
First proximity for controlling the wafer holding part holding the semiconductor wafer to be close to the adhesive surface of the adhesive tape and maintaining the distance between the adhesive tape and the semiconductor wafer at a first predetermined value set in advance. Mechanism,
A second proximity mechanism that brings the restraining member into proximity with or in contact with the non-adhesive surface of the adhesive tape and maintains a distance between the flat surface and the adhesive tape at a second predetermined value set in advance;
A depressurization mechanism for depressurizing the interior of the chamber in a state where the first proximity mechanism and the second proximity mechanism are operating;
A sticking mechanism for sticking the adhesive tape to the semiconductor wafer in a state where the inside of the chamber is decompressed;
A pressure-sensitive adhesive tape affixing device comprising:

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