JP2011071472A - Vacuum sticking method and apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To excellently stick a sticking member such as a dicing tape on an extremely thin workpiece, with simple constitution. <P>SOLUTION: In a state wherein one sheet-type, film-type or tape-type sticking member 130 and a member 200 to be stuck with the sticking member are opposed to each other across a fine gap in an airtight chamber in which a vacuum atmosphere is generated and which can be opened to air, the airtight chamber is separated into two chambers C1, C2 independent of each other with the sticking member 130 interposed therebetween. In a state wherein the pressure in the first chamber C2 where the member 200 to be stuck with the sticking member is disposed between the two chambers is reduced, the pressure in the other second chamber C1 is made higher than that in the first chamber C2. The sticking member 130 is pressed against the member 200 to be stuck with the sticking member by the pressure difference between the two chambers, thereby the sticking member 130 is stuck on the member 200 to be stuck with the sticking member. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

The present invention relates to a vacuum pasting method and apparatus for pasting any one of a sheet-like, film-like, or tape-like pasting member to a member to be stuck as a workpiece in a reduced pressure state under vacuum.
As the workpiece, for example, a plate-like member such as a semiconductor wafer, glass for liquid crystal, a solar battery cell, or a printed circuit board is suitable, and as a pasting member, for example, in the pre-dicing step, on one surface of the plate-like member such as a semiconductor wafer. Typical examples include dicing tape (DC tape), diattach film (DAF) tape, back grind (BG) tape, solar cells, glass for liquid crystal, and films and sheets that protect printed circuit boards. It doesn't matter what kind.

  For example, in the manufacturing process of a semiconductor wafer, the wafer is diced to a chip size after being subjected to a pre-process such as exposure-diffusion-etching.

  FIG. 4A shows a typical example in the past when the dicing tape 2 is attached to the wafer 1. The surface of the wafer 1 on the circuit forming side (the lower surface side in FIG. 4A) is covered with a protective tape (BG tape) 4 in advance. The protective tape 4 is used to prevent warpage that occurs in the manufacturing process as the wafer becomes thinner.

  A dicing tape 2 is attached to the surface of the wafer 1 opposite to the circuit forming surface (the upper surface side in FIG. 4A). The dicing tape 2 is affixed to the wafer 1 by pressing the circular dicing tape 2 (see FIG. 5) held by the annular dicing frame 3 against one surface of the wafer 1 by the pressure of the roll 5. paste. Thereafter, the protective tape 4 is peeled off, and a dicing process is performed by the dicing cutter 6 as shown in FIG. Reference numeral 400 denotes a workpiece receiver.

The dicing tape 2 is used to prevent the semiconductor chips from being scattered during the dicing operation, hold the chips at their current positions, and transport the chips as they are to the next process. For this purpose, the dicing cutter only reaches the middle of the thickness of the dicing tape when dicing the semiconductor wafer, so that the dicing tape is not cut.
FIG. 5 is a schematic plan view of the semiconductor chip after dicing bonded to the dicing tape 2 as viewed from the circuit forming surface side of the semiconductor chip.

  When the dicing tape is attached to the wafer by such a roll pressurization method, since mechanical pressure is applied to the wafer, it is expected that the wafer will be damaged by cracking or cracking. In particular, in recent years, since the wafer has reached a thickness of 350 μm to an extremely thin thickness of 50 μm or even 10 μm, it is difficult to cope with the dicing tape sticking method using the roll pressure method.

  Therefore, in recent years, instead of a mechanical pressurization method, a method has been proposed in which an adhesive member such as a tape is attached to a workpiece such as a wafer (material to be attached) using a vacuum / atmospheric pressure difference with little damage. Has been. For example, in Patent Documents 1 to 3 (Japanese Patent Laid-Open Nos. 2006-310338, 2005-129678, and 2005-26377), an airtight space is divided into an upper space and a lower space via an elastic sheet, The wafer is placed on the elastic sheet surface via an alignment jig, and a sticking member such as a dicing tape is placed above the elastic sheet. The upper space is evacuated and the lower space is at atmospheric pressure. A technique is disclosed in which an elastic sheet and a wafer are moved to the dicing tape side by pressure, and the wafer is attached to the dicing tape.

  Further, for example, in JP-A-2005-135931, a plate-like object (work: a member to be attached) and a tape (attachment member) are arranged to face each other in a vacuum chamber, and the plate-like object is further interposed via a first elastic body. It is supported by a pressing member (piston), and this pressing member is pushed upward by the pressure difference between the vacuum atmosphere of the vacuum chamber and the atmospheric pressure acting on the opposite side of the vacuum chamber, thereby causing the plate-like object and the tape to move upward. 2 discloses a technique in which a tape is affixed to a plate-like member by pressing against an elastic body.

JP 2006-310338 A JP 2005-129678 A JP 2005-26377 A JP 2005-135931 A

  In the method of attaching the work piece to the tape by moving the elastic sheet by the pressure difference as described above, a dedicated elastic sheet must be provided in the airtight chamber, and the work such as a wafer is positioned on the elastic sheet surface. However, a work positioning jig that requires a special device for mounting is required. In addition, the method of pressing the workpiece and the tape against the elastic body using a pressure member such as a piston using the pressure difference is a double elastic body structure for buffering in order to employ mechanical pressure applied by the piston. It is necessary to consider.

The present invention does not require consideration of the dedicated elastic sheet or double elastic body structure as described above, and furthermore, an ultra-thin wafer, a three-dimensional structure MEMS (Micro Electro Mechanical System) wafer, a high bump wafer, a compound semiconductor Tape on fragile wafers (DC tape, DA
F tape, BG tape), and other vacuum cells, a printed circuit board, a protective film for glass for liquid crystal, a sealing resin film, and the like.

In order to achieve the above object, the present invention is basically configured as follows.
(1) In a hermetic chamber capable of forming a vacuum atmosphere and opening to the atmosphere, either one of a sheet-like, film-like, or tape-like affixing member and a member to be affixed are opposed to each other through a gap. And separating the hermetic chamber into two chambers independent of each other via the affixing member,
In a state where the first chamber of the two chambers where the adherend member is disposed is decompressed, the pressure of the other second chamber is set higher than that of the first chamber;
Have
From the pressure difference of these two chambers, the said sticking member is pressed and stuck on the to-be-bonded member side, The vacuum sticking method characterized by the above-mentioned.
(2) Moreover, the following vacuum sticking methods are proposed as the preferable aspect.
A member mounting portion that is mounted in a state in which any one of a sheet-like, film-like, or tape-like affixing member supported by an annular frame and an affixed member to be affixed face each other, and the affixing member and the affixed member With a position control mechanism for controlling the position of these members in the vertical direction in a state of facing each other through a minute gap, and
A lid member that closes an airtight chamber serving as a space of the member mounting portion so as to be openable and closable and has a seal ring on an inner surface;
A pressure control mechanism for controlling the pressure of the hermetic chamber;
Use
Depressurizing the hermetic chamber to a vacuum atmosphere by the pressure control mechanism;
Under the vacuum atmosphere, the annular frame of the affixing member is provided on the inner surface of the lid member in a state where the affixing member and the affixed member are opposed to each other through a minute gap by the position control mechanism. A step of contacting the seal ring and separating the hermetic chamber into two chambers, a first chamber on the attachment member mounting side and a second chamber on the inner surface side of the lid member, through the attaching member. When,
Maintaining the pressure-reduced state of the first chamber in which the member to be bonded of the two chambers is mounted, while increasing the pressure of the other second chamber to be higher than that of the first chamber; ,
Have
From the pressure difference of these two chambers, the said sticking member is pressed and stuck on the to-be-bonded member side, The vacuum sticking method characterized by the above-mentioned.
(3) Furthermore, the following is proposed as an apparatus used for the above-mentioned vacuum pasting method.

To-be-attached member mounting portion for mounting the to-be-attached member;
A pasting member mounting portion for mounting any one pasting member in the form of a sheet, film, or tape;
In a state where the member to be bonded and the bonding member are opposed to each other through a minute gap in an airtight chamber capable of forming a vacuum atmosphere and opening to the atmosphere, the airtight chamber is separated from each other through the bonding member. A two-chamber separating mechanism configured to separate the chambers and to position the member to be adhered in the first chamber of the two chambers;
A pressure control mechanism that forms a pressure difference in the second chamber of the two chambers so that the pressure is higher than that of the first chamber after the two chambers are depressurized to a vacuum state;
With
A vacuum pasting apparatus, wherein the pasting member is pressed against the pasting member side by this pressure difference and pasted.

As a preferable aspect of this vacuum apparatus, for example,
The sticking member is held by an annular frame,
The attachment part of the pasting member is covered with a lid member through a seal member from above,
A seal ring is provided on the inner surface of the lid member, and the seal ring is opposed to the upper surface of the annular frame of the adhesive member when the lid member is in a state where the mounting portion of the adhesive member is closed. Provided in
The two-chamber separating mechanism is a position control mechanism that moves the adhered member and the affixing member upward while maintaining a predetermined minute gap so that the upper surface of the annular frame of the affixing member contacts the seal ring. The annular frame is in contact with the seal ring, so that the second chamber independent from the first chamber is formed between the inner surface of the lid member and the upper surface of the affixing member. Has been.

  According to the vacuum pasting method and apparatus according to the present invention, the pasting member (work) is obtained by directly reacting the pasting member using the pressure difference (atmospheric pressure difference) of vacuum / atmospheric pressure or vacuum / pressurized air. Therefore, it is possible to realize vacuum pasting without damage due to light load in a vacuum atmosphere without requiring mechanical pressurization. Furthermore, since the sticking member is driven by differential pressure, it is possible to realize a simple and simple vacuum sticking method that does not require consideration of the conventionally proposed dedicated elastic sheet or double elastic body structure.

Sectional drawing which shows the whole structure of the vacuum sticking apparatus which concerns on 1st Example of this invention. Explanatory drawing which shows an example of the vacuum sticking process using the vacuum sticking apparatus which concerns on a present Example. Explanatory drawing which shows an example of the vacuum sticking process using the vacuum sticking apparatus which concerns on a present Example. Explanatory drawing which shows an example of the vacuum sticking process using the vacuum sticking apparatus which concerns on a present Example. Explanatory drawing which shows an example of the vacuum sticking process using the vacuum sticking apparatus which concerns on a present Example. Explanatory drawing which shows an example of the vacuum sticking process using the vacuum sticking apparatus which concerns on a present Example. Explanatory drawing which shows an example of the vacuum sticking process using the vacuum sticking apparatus which concerns on a present Example. Sectional drawing which shows the cover member (upper cover) of the vacuum sticking apparatus used for the other application example of the said Example. Explanatory drawing which shows an example of the conventional dicing process. The plane schematic diagram which looked at the state where the semiconductor after dicing is bonded to the dicing tape from the circuit formation surface side of the semiconductor chip. Sectional drawing which shows the whole structure of the vacuum sticking apparatus which concerns on 2nd Example of this invention.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a longitudinal sectional view of a vacuum bonding apparatus according to an embodiment (first embodiment) of the present invention, and FIGS. 2A to 2F are vacuum bonding using the vacuum bonding apparatus according to the present embodiment. It is explanatory drawing which shows an example of a process.

  In the vacuum bonding apparatus 10 according to the present embodiment, as an example, the bonding member 130 is a film or sheet that protects a DC tape, DAF tape, BG tape, solar cells, liquid crystal glass, or printed circuit board for a semiconductor wafer. The workpiece 200 as a pasting member is a wafer, glass for liquid crystal, a solar battery cell, and a printed board.

  The vacuum bonding device 10 is roughly divided into a lid member (upper lid) 11 and a main body 12. In FIG. 1, the lid member 11 and the main body 12 are separated from each other for easy understanding of the drawing, but in actuality, both are in a coupled state that can be opened and closed.

  As shown in FIGS. 2A, 2 </ b> B, and 2 </ b> F, the lid member 11 is opened by sliding horizontally to the side of the upper portion of the main body via a slide mechanism (not shown). Thus, the upper part of the main body 12 is opened.

  Here, the configuration on the main body 12 side will be described first.

  The main body 12 includes a fixed upper frame 121, a support frame 122 that supports the upper frame 121, and a lower frame 123.

  In the center of the gantry 121, a space for forming an airtight chamber S1 is secured in cooperation with the lid member 11 to be described later. In this space, a member 200 (hereinafter referred to as a workpiece) 200 is held. Vacuum chuck (attachment member attaching part: work attaching part) 124, position control mechanism (elevating mechanism) 125 for moving the vacuum chuck 124 in the vertical direction, and attaching any one of sheet, film, and tape And a pasting member mounting part 133 for mounting the member 130. The workpiece mounting unit may use an electrostatic chuck or a mechanical chuck instead of the vacuum chuck 124.

  Various shapes can be adopted for the affixing member 130 in accordance with the shape of the workpiece 200. In this embodiment, as an example, the workpiece 200 is a circular wafer, and the pasting member 130 is a dicing tape having adhesiveness on one surface. The tape 130 is circular and supported by an annular frame 131 provided on the periphery thereof. Has been.

  The vacuum chuck 124 and the affixing member mounting part 133, which are workpiece mounting parts, are arranged on the top of the stand 121 so that the affixing member mounting part 133 is on the upper side and the vacuum chuck 124 is on the lower side. When the affixing member 130 and the workpiece 200 are mounted on the respective mounting portions, the affixing member 130 and the workpiece 200 are disposed to face each other in the vertical direction.

  The attachment portion 133 of the affixing member 130 includes a stepped annular holder that fits on an annular shelf 132 formed around the inner periphery of the upper frame 121 so as to be vertically movable (hereinafter, the affixing member attachment portion is referred to as an “annular holder”). 133 "). By attaching the annular frame 131 of the attaching member 130 to the step portion of the annular holder 133, the attaching member 130 is mounted in the upper central space of the main body 12. A plurality of ventilation grooves 133a used for forming a vacuum are arranged in the circumferential direction below the annular holder 133 (attachment member mounting portion).

  A plurality of guide holes 134 are provided on the bottom surface of the annular shelf 132, and a guide pin 135 that is slidably fitted in the guide hole 134 so as to be slidable in the vertical direction is fixed to the annular holder 133.

The vertical position control mechanism (elevating mechanism) 125 includes an upper plate 125 a that fixes and supports the vacuum chuck 124, an intermediate plate 125 b that includes a heater 136, and a lower plate 125 c, and these plates have a laminated structure (three-layer structure). Are connected via bolts.
These plate laminates are mechanically coupled to the lifting platform 141 via the plate receiver 140.

  At the center of the bottom of the lifting platform 141, a hole 144 for attaching a lifting sleeve is provided, and a guide sleeve 142 of the lifting mechanism is fixed to the hole 144.

  A screw rod 143 of an elevating mechanism that is driven by a servo motor (not shown) is rotatably engaged with the guide sleeve 142. The vacuum chuck 124 and the plate laminate (125a, 125b, 125c) are lifted together with the lifting platform 141 by the forward rotation of the screw rod 143, and are lowered by the reverse rotation of the screw rod 143.

  The vacuum chuck 124, the plate stack (125a, 125b, 125c), and the elevator base 141 are a connection plate 150 provided at the lower part of the elevator base, a bellows 151 for sealing, a fixed connector 152, and appropriate seal rings 161 and 162. , 163 and the like, are connected to the upper frame 121 of the main body 12 so as to be movable in the vertical direction.

  When the main body 12 is closed by a lid member (upper lid) 11 which will be described later, the inner space of the lid member 11 and the internal space of the main body 12 (vacuum chuck 124, plate laminate (125a, 125b, 125c), and lifting platform 141 are accommodated. Space) is maintained in an airtight state via the seal rings 160 to 163 and the like.

  A lifting engagement portion 170 is provided on the outer peripheral portion of the upper plate 125a of the elevating mechanism 125 which is a vertical position control mechanism. When the vertical position control mechanism (elevating mechanism) 125 is raised, the lift engaging portion 170 contacts the lower surface of the annular holder (attaching member mounting portion) 133 at a predetermined raised position, and the annular holder 133 and the annular fitting therewith are fitted. The sticking member 130 with the frame 131 is lifted.

  The lift engaging portion 170 can adjust the surface of the annular holder 133 that contacts the lower surface, that is, the height of the top of the engaging portion 170. For example, the height of the top portion can be changed by adjusting the number of stacked steps by making the engaging portions 170 into a stacked type. The engaging portion 170 can change the top height by a screw mechanism, and the top height position can be changed by other appropriate means. By changing the moving distance (rising distance) L of the engaging portion 170 until it comes into contact with the annular holder 133 by adjusting the top height, a desired minute gap G between the workpieces 200 with respect to the affixing member 130 can be arbitrarily set. It can be adjusted.

  Further, after the engaging portion 170 abuts (engages) with the annular holder 133, when the workpiece 200 and the pasting member 130 are further lifted via the lifting mechanism 125, the engaging portion 170 is engaged with the annular holder 133. Therefore, the workpiece 200 and the affixing member 130 have a predetermined minute gap G (the gap G is easy to see in the drawing for convenience of drawing, but in practice, for example, a fraction of a millimeter to a milliorder. Narrow gaps (the gap dimensions are not limited to the above), and both move upward, and finally the upper surface of the annular frame 131 is a seal provided inside the lid member 11. Pressing against the ring (O-ring) 118 stops the ascending operation. In the figure, in this state, the internal hermetic chamber S1 of the vacuum bonding apparatus maintains the predetermined minute gap G between the workpiece 200 and the bonding member 130, and uses the bonding member 130 as a differential pressure responsive partition wall (second chamber). The two chambers C1 and the lower chamber (first chamber) C2 are formed separately (see FIG. 2D). The upper chamber C <b> 1 is formed by a space 111 c between the attaching member 130 and the inner surface of the lid member 11. The lower chamber C <b> 2 is formed by an internal space of the main body 12 (vacuum chuck 124, plate stack (125 a, 125 b, 125 c), storage space for the lifting platform 141) covered with the attaching member 130.

  The upper chamber C1 and the lower chamber C2 are airtight spaces independent of each other.

  That is, the two-chamber forming mechanism (two-chamber separating mechanism) is configured by raising the sticking member 130 and bringing the annular frame 131 into contact with the seal ring 118.

  The upper frame 121 is formed with a through hole 171 for depressurizing the hermetic chamber S <b> 1 formed by the lid member 11 and the main body 12 to a vacuum state, and the through hole 171 is connected to the vacuum system pipe 80.

  The vacuum system pipe 80 is provided with a vacuum pump 82 with a frequency converter 81 for converting the drive frequency, an on-off valve 83, and a vacuum gauge 84. The frequency converter 81 controls the number of rotations of the vacuum pump 82. The degree of vacuum can be changed at any time.

  The vacuum piping 80 can be switched from vacuum to the atmosphere via the branch piping 85, the on-off valve 86, and the flow rate adjustment valve 87.

  A plurality of through holes 126 for the vacuum chuck 124 are uniformly arranged in the upper plate 125 a and the intermediate plate 125 b of the position control mechanism 125. The vacuum chuck 124 is composed of a microporous plate.

  The plurality of through-holes 126 communicate with the central through-hole 126a via radial communication passages 127 provided on the bottom surface of the intermediate plate 125b, the central through-hole 128 provided in the lower plate 125c, and the passage 128a provided at the bottom of the plate 125c. The plate receiver 140, the elevator base 141, and the connecting plate 150 are connected to a vacuum source (not shown) for a vacuum chuck through a through hole 129.

  The through holes 128 of the intermediate plate 125 b and the lower plate 125 c are also used for the passage of the power supply line 137 of the heater 136. The passage of the power supply line 137 includes a through hole 128, a passage 138 provided in the bottom surface of the intermediate plate 125 b, a through hole 139 provided in the lifting platform 141 and the connection plate 150.

  Next, the lid member 11 will be described.

  In the lid member 11, a stepped recess 111 having a plurality of steps is formed at the center of the inner surface (lower surface). The diameter of the stepped recess 111 increases stepwise (at least in four steps) from the inside toward the outside. The first stage 111a having the smallest diameter is for maintaining a certain gap 112 between the inner surface of the lid member 11 and the upper surface of the porous plate 90 attached to the lid member. The second stage 111b is for mounting the porous plate 90. The perforated plate 90 is provided with a large number of holes 90a for evacuating and introducing air.

  The third step 111c of the stepped recess 111 secures a space that becomes the upper chamber C1 when the two chambers of the upper chamber C1 and the lower chamber C2 are separately formed via the attaching member 130 attached to the main body 12 side. Is for. An annular groove 117 for attaching an O-ring is provided around the third stage 111c, and an O-ring 118 serving as a seal ring is attached to the annular groove 117.

  The O-ring 118 is for finally contacting when the attaching member 130 moves upward through the position control mechanism 125.

  The outermost fourth step 111 d of the stepped recess 111 serves as a receiving space for the attaching member 130 when the attaching member 130 moves upward via the position control mechanism 125.

  As described above, when the upper surface of the workpiece mounting annular holder (non-adhering member mounting portion) 133 on the main body 12 side comes into contact with the O-ring 118, the airtight chamber S1 is connected to the upper chamber C1 via the attaching member 130. It isolate | separates into lower chamber C2 (refer FIG.2 (d), (e)).

  In the present embodiment, the stepped recess 111 is a circular hole, but the shape may be a square hole or a polygonal hole, and the shape is not limited.

A central through hole 119 for evacuating and introducing the atmosphere is provided in the central portion of the lid member 111, and a common (shared) pipe 40 for evacuating and introducing the atmosphere is connected to the through hole 119.
The common pipe 40 is connected to a vacuum pipe 50, an atmosphere open pipe 60, and a pressurized air pipe 70 that are switchably branched via respective on-off valves (53, 63, 73). .

  The vacuum system pipe 50 is provided with a vacuum pump 52 with a frequency converter 51 for converting a driving frequency, an on-off valve 53, and a vacuum gauge 54, and the frequency converter 51 controls the number of rotations of the vacuum pump 52. The degree of vacuum can be changed at any time.

  The atmosphere opening system pipe 60 is provided with a flow rate control valve 61, a minute flow rate control valve 62, and an on-off valve 63, and the atmosphere opening speed can be adjusted by the flow rate control valve 61 and the minute flow rate control valve 62.

  The pressurized air piping 70 is provided with an air pressure source (compressor) 71, a pressure controller 72, an on-off valve 74, and a flow rate control valve 73.

  Next, the operation (sticking process) of this embodiment will be described with reference to FIGS.

  First, as shown in FIG. 2A, the work piece (wafer) 200 is set on a vacuum chuck (suction member) 124 with the lid member 11 opened in an air atmosphere. In this state, the vacuum source of the vacuum chuck system is driven, and the workpiece 200 is vacuum-sucked by the vacuum chuck 124.

  Next, as shown in FIG. 2B, the attaching member 130 is mounted by fitting the annular frame 131 of the attaching member 130 into the annular holder 133. That is, the upper part of the airtight chamber of the main body 12 is mounted in a state where the pasting member 130 and the workpiece 200 (the pasting member) to be pasted face each other.

  Next, as shown in FIG. 2C, the lid member 11 is placed on the main body 12, and the upper portion of the main body 12 is closed, so that an airtight chamber S <b> 1 is secured between the lid member 11 and the main body 12. In this state, by driving the vacuum pump (pressure control mechanism) 82, the hermetic chamber is kept in a vacuum state.

  Here, the degree of vacuum of the vacuum chuck 124 is set higher than the degree of vacuum of the hermetic chamber S1, so that the workpiece adsorption by the chuck is not impaired. The degree of vacuum in the hermetic chamber can be set to various values corresponding to various workpieces. In the case of a dicing tape, for example, 20 Pa is given as an example.

  Next, when the workpiece 200 is moved upward by the position control mechanism 125 in a vacuum atmosphere, the workpiece 200 is moved by the lift engaging portion 170 at a position where the desired gap G is formed with respect to the pasting member 130. When the abutting member is brought into contact with the lower surface of the annular holder 133 and further moved upward by the position control mechanism 125, the affixing member 130 and the workpiece 200 are lifted upward by the engaging portion 170 while maintaining the minute gap G. Finally, the upper surface of the annular frame 131 of the attaching member 130 comes into contact with the seal ring 118 on the lid member 11 side. In this state, the raising operation of the position control mechanism 125 stops. In this state, the hermetic chamber S1 formed by the lid member 11 and the main body 12 has a workpiece as shown in FIG. 2 (d) through the affixing member 130, that is, the affixing member 130 as a differential pressure responsive partition wall. The chamber is separated into two chambers, a first chamber (lower chamber) C2 on the mounting side and a second chamber (upper chamber) C1 on the inner surface side of the lid member 11.

  In this state, the vacuum system pipe 53 is closed, and as shown in FIG. 2 (e), the upper chamber C1 side opens the open / close valve 63 provided in the atmosphere open system pipe 60, and the flow control valve 61 and the minute flow rate are set. The atmospheric pressure is gradually changed or stepped through the control valve 62, while the lower chamber C2 side is kept in a vacuum state.

  As a result, a pressure difference is generated between the upper chamber C1 and the lower chamber C2, and the affixing member 130 is pressed and affixed to the workpiece 200 side so as to eliminate the gap G due to the pressure difference. In order to suppress the extension of the attaching member 130 due to the pressure difference as much as possible, the gap G is desirably as small as possible. This pasting is performed in a vacuum atmosphere because the lower chamber C2 side is maintained in a vacuum state.

  After this pasting is performed, the vacuum suction of the vacuum chuck 124 is stopped (released to the atmosphere).

  Next, as shown in FIG. 2 (f), when the vertical position control mechanism 125 is lowered to the initial position, the annular holder 133 is seated on the bottom surface of the annular shelf 132 with the attaching member 130 in the middle of the downward movement. The affixing member 130 is affixed to the workpiece 200. In this state, the lower chamber C2 is also opened to the atmosphere like the upper chamber C1, and the lid member 11 is opened to take out the workpiece.

According to the present embodiment, a conventional elastic sheet for differential pressure response is used by using a pressure difference between a member (tape, film, sheet) and a workpiece (wafer, substrate, etc.) under high vacuum. Without any problem, the affixing member can be directly and lightly affixed with a differential pressure responder. In particular, it has the following advantages over the conventional pressure roller system.
-It is possible to affix a tape to an ultrathin wafer (for example, 10 μm) without cracks and bubbles.
-It is possible to affix a tape to a movable part of a MEMS wafer without damage or bubbles.
・ Tapes can be applied to high bump wafers without damage or bubbles.
・ It is possible to apply tape to fragile wafers of compound semiconductors without damage or bubbles.
(Application examples)
Furthermore, an application example of this embodiment will be described.

  In FIG. 2D, after the upper chamber C1 and the lower chamber C2 are separated from each other, in the above-described embodiment, the atmospheric opening speed control of the upper chamber C1 is performed by the atmospheric opening speed adjusting system (the atmospheric opening system pipe 60). However, instead of this, it is also possible to change and control the degree of vacuum at any time by a vacuum system adjustment system (vacuum system pipe 50). In addition, by combining these air release speed adjustment system and vacuum adjustment system, multi-stage pressure difference control is enabled. Furthermore, depending on the product, it is possible to introduce compressed air pressure supply control using the pressurized air system piping 70. By combining these, even if there are irregularities on the surface of the workpiece, the pasting member Can be attached to the workpiece with improved adhesion (no bubbles). In particular, by allowing the arbitrary two vacuum pressures (or pressurization) and timing to be freely changed in the upper and lower two chambers, it is possible to perform the application in which the optimum application force for the workpiece is freely controlled only by the gas pressure.

  Furthermore, by heating the workpiece 200 with a heater 136 (for example, Max 200 ° C.) via the support plate 125a, combining this heating with the above-described vacuum bonding due to the pressure difference, a sealing resin is applied to the workpiece such as a solar battery cell. A film (for example, a heat-resistant resin film such as EVA resin) or a protective resin film can be thermocompression bonded.

  FIG. 3 shows a lid member used in another embodiment of the present invention, and the configuration on the main body 12 side is the same as that of the above-described embodiment, so that the description thereof is omitted.

  The difference between this embodiment and the above-described embodiment is that the lid member is divided into an outer region 11a and an inner region 11b, and the inner region 11b located above the upper chamber C1 is formed of a transparent plate. Further, the perforated plate 90 'located immediately below the transparent plate 11b is also made of a transparent material.

  According to the present embodiment, it is possible to monitor the process of sticking a sticking member such as a tape to a work in the vacuum sticking process, and the state of the product can be checked in the process step.

  Next, another embodiment (second embodiment) of the present invention will be described with reference to FIG. FIG. 6 is a cross-sectional view showing the overall structure of a vacuum bonding apparatus according to another embodiment of the present invention. The difference between the present embodiment and the first embodiment described above is mainly the workpiece vertical position control mechanism (lifting mechanism), and the rest is the same as in the first embodiment. In the figure, parts that are the same as or common to the first embodiment are denoted by the same reference numerals.

  The vertical position control mechanism 125 of the first embodiment described above uses the screw rod 143 driven by a servo motor as a lifting mechanism and the guide sleeve 142 screwed to the screw rod to move the vertical chuck of the vacuum chuck 124 as a work mounting portion. Although the position control in the direction is performed, the vertical position control mechanism 125 ′ of this embodiment is replaced with the airtight chamber S1 in which the workpiece is mounted and the working pressure chamber S2 provided below the lower plate 125c. The vacuum chuck 124 is moved in the vertical direction using the differential pressure between the two.

  Specifically, a double-layered first and second bellows are disposed under a three-layer plate structure (an upper plate 125a, an intermediate plate 125b, and a lower plate 125c) similar to the first embodiment that holds the vacuum chuck 124. (302, 303) are arranged. One end of the first bellows 302 is coupled to the lower surface of the lower plate 125 c via the seal ring 305, and the other end is coupled to the upper surface of the connection plate 150 via the seal ring 306. One end of the second bellows 303 on the outer side is coupled to the lower surface of the lower plate 125 c via the seal ring 307, and the other end is coupled to the upper surface of the connecting plate 150 via the seal ring 308. The working pressure chamber S <b> 2 is formed by an airtight chamber 301 between the first bellows 302 and the second bellows 303. In the working pressure chamber S2, the vacuum pressure from the vacuum pump 52 and the atmospheric pressure from the atmosphere opening section (507) are connected to the working pressure chamber S2 via the external pressure introducing section 503 provided in the connecting plate 150 and the working pressure supply system 504 connected thereto. Any one of the pressurized air pressures from the air pressure source (compressor) 513 is supplied to be selectable.

  The operating pressure supply system 504 is branched into three on the pressure supply source side, and one is connected to the vacuum pump 52 via a vacuum system pipe 501 and an on-off valve 502. In the first embodiment, the vacuum pump 52 is connected only to the second chamber (upper chamber) C1 on the inner surface side of the lid member 11 via the on-off valve 53 and the vacuum pipe 50, but in this embodiment, As described above, it is also connected to the working pressure chamber S2. The other is connected to an atmospheric source via an atmospheric system pipe 508, an on-off valve 505, a flow rate control valve 506, and a minute flow rate control valve 507. The other is connected to an air pressure source 513 through an on-off valve 510, a flow rate control valve 511, and a pressure control unit 512 via a pressurizing system pipe 509.

  The internal space 300 of the first bellows 302 is provided in the plurality of through holes 126 and 127 for the vacuum chuck 124 described in the first embodiment, the central through holes 128 and 128a provided in the lower plate 125c, and the connection plate 150. Further, it is connected via a central through hole 128b, and is connected to a vacuum source (not shown) for a vacuum chuck.

  In the present embodiment, a cylindrical frame 304 surrounding the second bellows 303 of the position control mechanism 125 ′ is interposed between the upper frame 121 and the connecting plate 150 via seal members 311 and 312. Between the outer surface of the second bellows 303 and the inner surface of the cylindrical frame 304, an airtight chamber S3 that communicates with the airtight chamber S1 of the workpiece mounting portion is formed.

  The operation (the pasting process) of the second embodiment having the above-described position control mechanism 125 'will now be described. The operation in this case will be described with reference to FIGS. 2A to 2F as in the first embodiment.

  In this embodiment, first, when setting the workpiece (wafer) 200 on the vacuum chuck 124, the vacuum pumps 52 and 82 are preliminarily operated in advance. The illustrated on-off valves 53, 63, 74, 83, 86, 502, 505, 510 are in a closed state in advance.

  In this state, as shown in FIG. 2A, the lid member 11 is opened in an air atmosphere, and the workpiece (wafer) 200 is set on the vacuum chuck (suction member) 124. In this state, a vacuum source (not shown) of the vacuum chuck system is driven, and the workpiece 200 is vacuum-sucked by the vacuum chuck 124.

  Next, since only the on-off valve 502 of the vacuum piping system is opened, the working pressure chamber S2 is in a vacuum state (negative pressure), so the vacuum chuck 124 and the plate structure 125 (125a, 125b, 125c) that holds the lowering are lowered. In this state, the affixing member 130 is set above the workpiece 200 as shown in FIG. This setting is performed by fitting the annular frame 131 of the attaching member 130 to the annular holder 133 as already described in the first embodiment.

  Next, as shown in FIG. 2C, the airtight chamber S <b> 1 is secured between the lid member 11 and the main body 12 by placing the lid member 11 on the main body 12 and closing the upper portion of the main body 12. In this state, by driving the vacuum pump 82, the hermetic chamber S1 is maintained in a vacuum state.

  As described above, the vacuum degree of the vacuum chuck 124 is set higher than the vacuum degree of the hermetic chamber S1.

  Next, the vacuum system on / off valve 502 is closed and the air system on / off valve 505 is opened, or the pressure system on / off valve 510 is opened. With the stepwise increase in the operating pressure (opening 510), the plate 125, the vacuum chuck 124, and the workpiece 200 are pushed up by the atmospheric pressure in the operating pressure chamber S2 or the pressure difference between the pressurized air pressure and the hermetic chamber S1. As a result, the workpiece 200 is moved upward, and as in the first embodiment, the workpiece 200 has the lifting engagement portion 170 attached to the attachment member 130 at a position where the desired minute gap G is formed with respect to the attachment member 130. Contact with the lower surface of the annular holder 133 for use, and when the upward movement by the position control mechanism (differential pressure raising / lowering mechanism) 125 ′ is continued, the engaging member 170 and the workpiece 200 maintain the minute gap G while maintaining the minute gap G. As a result, the upper surface of the annular frame 131 of the attaching member 130 comes into contact with the seal ring 118 on the lid member 11 side. In this state, the raising operation of the position control mechanism 125 stops. In this state, the hermetic chamber S1 formed by the lid member 11 and the main body 12 has a workpiece as shown in FIG. 2 (d) through the affixing member 130, that is, the affixing member 130 as a differential pressure responsive partition wall. The chamber is separated into two chambers, a first chamber (lower chamber) C2 on the mounting side and a second chamber (upper chamber) C1 on the inner surface side of the lid member 11 (state shown in FIG. 2D).

  The subsequent operation is the same as in the first embodiment.

  That is, first, the vacuum system pipe 53 is closed, and as shown in FIG. 2 (e), the upper chamber C1 side opens the on-off valve 63 provided in the air release system pipe 60, and the flow control valve 61 and the minute flow rate are set. The atmospheric pressure is gradually changed or stepped through the control valve 62, while the lower chamber C2 side is kept in a vacuum state. Alternatively, the open / close valve 73 of the pressurized / pneumatic piping system is opened instead of the atmosphere opening system piping 60 to drive the compressor 71 to bring the upper chamber C1 side into the pressurized / pneumatic state. As a result, a pressure difference is generated between the upper chamber C1 and the lower chamber C2, and the affixing member 130 is pressed and affixed to the workpiece 200 side so as to eliminate the gap G due to the pressure difference.

  After this pasting is performed, the vacuum suction of the vacuum chuck 124 is stopped (released to the atmosphere).

  Next, as shown in FIG. 2 (f), the lower chamber C2 is opened to the atmosphere in the same manner as the upper chamber C1 by closing the vacuum system on / off valve 83 and opening the air system on / off valve 86. In this state, the pressure system pipe 510 is closed and the vacuum system opening / closing valve 502 is opened, so that the vacuum chuck 124 is lowered, and the annular holder 133 is attached with the attaching member 130 in the middle of the downward movement. It sits on the bottom surface of the part 132. The affixing member 130 is affixed to the workpiece 200. The vacuum system opening / closing valve 502 is closed after the chuck 124 is lowered to a predetermined position. In this state, the workpiece is taken out by opening the lid member 11.

  In this embodiment, the same effect as that of the first embodiment can be obtained.

DESCRIPTION OF SYMBOLS 11 ... Lid member, 12 ... Vacuum apparatus main body, 124 ... Vacuum chuck (attached member mounting part) 125 ... Position control mechanism, 130 ... Adhering member, 131 ... Ring frame, 133 ... Adhering member mounting part (annular holder), 200 ... Attached member (workpiece), 50 ... Vacuum piping system (vacuum degree adjusting system), 60 ... Air opening piping system (atmospheric opening speed adjusting system), 70 ... Pressurized air piping, 80 ... Vacuum piping system (vacuum degree) Adjustment system).

Claims (9)

In an airtight chamber capable of forming a vacuum atmosphere and opening to the atmosphere, in a state where any one of a sheet-like, film-like, or tape-like affixing member and a member to be affixed are opposed to each other via a gap Separating the hermetic chamber into two chambers independent from each other via the affixing member;
In a state where the first chamber of the two chambers where the adherend member is disposed is decompressed, the pressure of the other second chamber is set higher than that of the first chamber;
Have
From the pressure difference of these two chambers, the said sticking member is pressed and stuck on the to-be-bonded member side, The vacuum sticking method characterized by the above-mentioned. A member mounting portion that is mounted in a state in which any one of a sheet-like, film-like, or tape-like affixing member supported by an annular frame and an affixed member to be affixed face each other, and the affixing member and the affixed member With a position control mechanism for controlling the position of these members in the vertical direction in a state of facing each other through a gap, and
A lid member that closes an airtight chamber serving as a space of the member mounting portion so as to be openable and closable and has a seal ring on an inner surface;
A pressure control mechanism for controlling the pressure of the hermetic chamber;
Use
Depressurizing the hermetic chamber to a vacuum atmosphere by the pressure control mechanism;
Under the vacuum atmosphere, the annular frame of the affixing member is provided on the inner surface of the lid member in a state where the affixing member and the affixed member are opposed to each other through a minute gap by the position control mechanism. A step of contacting the seal ring and separating the hermetic chamber into two chambers, a first chamber on the attachment member mounting side and a second chamber on the inner surface side of the lid member, through the attaching member. When,
Maintaining the pressure-reduced state of the first chamber in which the member to be bonded of the two chambers is mounted, while increasing the pressure of the other second chamber to be higher than that of the first chamber; ,
Have
From the pressure difference of these two chambers, the said sticking member is pressed and stuck on the to-be-bonded member side, The vacuum sticking method characterized by the above-mentioned.   3. The vacuum according to claim 1, wherein the pressure difference between the two chambers is formed by reducing both the two chambers to a vacuum and then setting only the second chamber to atmospheric pressure or a pressurized atmosphere. Pasting method.   The vacuum according to any one of claims 1 to 3, wherein at least one of the pressure difference and the minute gap is variably controlled according to at least one of a kind, a shape, and a thickness of the member to be pasted and the pasting member. Pasting method.   2. The position control mechanism variably adjusts the vertical position of the member to be attached according to the thickness of the member to be attached when the member to be attached is opposed to the member to be attached via a minute gap. 5. The vacuum pasting method according to any one of 4 above. To-be-attached member mounting portion for mounting the to-be-attached member;
A pasting member mounting portion for mounting any one pasting member in the form of a sheet, film, or tape;
In a state where the member to be bonded and the bonding member are opposed to each other through a minute gap in an airtight chamber capable of forming a vacuum atmosphere and opening to the atmosphere, the airtight chamber is separated from each other through the bonding member. A two-chamber separating mechanism configured to separate the chambers and to position the member to be adhered in the first chamber of the two chambers;
A pressure control mechanism that forms a pressure difference in the second chamber of the two chambers so that the pressure is higher than that of the first chamber after the two chambers are depressurized to a vacuum state;
With
A vacuum pasting apparatus, wherein the pasting member is pressed against the pasting member side by this pressure difference and pasted. The sticking member is held by an annular frame,
The attachment part of the pasting member is covered with a lid member through a seal member from above,
A seal ring is provided on the inner surface of the lid member, and the seal ring is opposed to the upper surface of the annular frame of the adhesive member when the lid member is in a state where the mounting portion of the adhesive member is closed. Abrasive
The two-chamber separating mechanism is a position control mechanism that moves the adhered member and the affixing member upward while maintaining a predetermined minute gap so that the upper surface of the annular frame of the affixing member contacts the seal ring. The annular frame is in contact with the seal ring, so that the second chamber independent from the first chamber is formed between the inner surface of the lid member and the upper surface of the affixing member. The vacuum bonding apparatus according to claim 6.   The vacuum pasting device according to claim 6 or 7, wherein the two chambers are connected to a vacuum pump with a frequency converter capable of independently changing the degree of vacuum as needed.   The vacuum bonding apparatus according to any one of claims 6 to 8, wherein a heater for heating the member to be bonded is built in the member that supports the member to be bonded member mounting portion.

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