JP2009295847A - Mounting device and mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting device and a mounting method that unite an adherend with a ring frame with an adhesive sheet interposed under reduced pressure without requiring complicated pressure reduction control. <P>SOLUTION: The mounting device includes the ring frame RF, a table 11 for supporting a semiconductor wafer W, a sticking means 13 of sticking an adhesive sheet S on the ring frame RF, a case 12 which houses the table 11 and in which a single pressure-reduced chamber C is formed, and a clamping means 37 disposed opposite the table 11. The clamping means 37 cooperates with the table 11 to clamp only an outer peripheral portion of the semiconductor wafer W together with the adhesive sheet S in a state wherein the pressure in the pressure-reduced chamber C is reduced. The pressure-reduced chamber C is released from being reduced in pressure to stick the semiconductor wafer W on the adhesive sheet S, to that the semiconductor wafer W and ring frame RF are united. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a mounting apparatus and a mounting method, and more particularly, to a mounting apparatus and a mounting method suitable for integrating an adherend such as a semiconductor wafer and a ring frame through an adhesive sheet in a reduced pressure atmosphere.

The processing process of a semiconductor wafer (hereinafter simply referred to as “wafer”) includes a dicing process for dividing the wafer into a large number of chips, and the wafer is mounted on a ring frame prior to the dicing process. Yes. This mounting is performed by attaching an adhesive sheet (dicing sheet) to the ring frame and a wafer disposed on the inner peripheral side of the ring frame.
In Patent Document 1, a ring frame to which an adhesive sheet is attached and a wafer supported by a rubber sheet are relatively arranged in a case, a space formed above the adhesive sheet, and a lower part of the rubber sheet The structure which controls the pressure with the space formed in this, and affixes a wafer to an adhesive sheet via the elastic deformation of a rubber sheet is disclosed.
Patent Document 2 discloses a wafer in which the outer peripheral portion is provided with a relatively thick plate and the outer peripheral portion is used as a reinforcing portion.
JP 2005-26377 A JP 2007-19379 A

However, in the configuration of Patent Document 1, the pressure control is very complicated because the pressure must be reduced while keeping the pressure in the lower surface side space of the rubber sheet and the upper surface side space of the adhesive sheet equal. There is a disadvantage of becoming.
In addition, the wafer is an all-contact type that is supported in a state where the entire lower surface side is in contact with the rubber sheet. If foreign matter such as dust adheres between the lower surface of the wafer and the rubber sheet, the wafer is bonded. When pressure for applying the sheet is applied, the wafer is damaged such as cracking.
In particular, since the wafer disclosed in Patent Document 2 is provided with a stepped portion so that the outer peripheral portion thereof is relatively thick, when the wafer is mounted on a ring frame, the rubber is used. When the sheet is elastically deformed, there is an inconvenience that the wafer is easily broken at the position where the step portion is formed.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and an object of the present invention is to provide a mounting apparatus and a mounting method capable of attaching an adhesive sheet to an adherend without complicated pressure reduction control. Is to provide.
Another object of the present invention is to provide a limited area for supporting the adherend, thereby effectively eliminating damage factors that may occur when a pressing force is applied to the adherend. To provide a mounting device and a mounting method.
Furthermore, an object of the present invention is to provide a mounting apparatus and a mounting method capable of mounting an adherend having shapes having different thicknesses without causing damage such as cracks on the adherend. There is.

  In order to achieve the above object, a mounting apparatus according to the present invention includes a table for arranging a plate-shaped adherend on the inner peripheral side of a ring frame and supporting the adherend, and an inner peripheral side of the ring frame. A sticking means for sticking an adhesive sheet of a size to be closed to the ring frame, and an openable / closable case for accommodating the table and forming a decompression chamber therein, and controlling the pressure in the decompression chamber by closing the case In the mounting device that integrates the adherend into the ring frame via the adhesive sheet, further includes a sandwiching unit disposed in the case at a position facing the table, the sandwiching unit including the case In a state where a single decompression chamber is formed by closing the plate, the structure is such that only the outer peripheral portion of the adherend is sandwiched with the adhesive sheet by interacting with the table.

  The present invention also provides a table for supporting the adherend by arranging a plate-like adherend on the inner peripheral side of the ring frame, and a belt-like adhesive sheet at a position facing the ring frame and the plate-like member. A supply means that accommodates the table, and an openable / closable case that forms a decompression chamber therein, and the adherend is ringed through an adhesive sheet by closing the case and controlling the pressure in the decompression chamber to a predetermined level. In a mounting device comprising a cutting means for cutting the adhesive sheet into a predetermined size after being integrated with the frame, the mounting apparatus further includes a sandwiching means disposed in the case at a position facing the table, The sandwiching means adopts a configuration in which the case is closed and a single decompression chamber is formed to interact with the table and sandwich only the outer periphery of the adherend together with the adhesive sheet. It can be.

  In the mounting apparatus, the table includes an inner table having a support convex portion that supports an outer peripheral portion of the adherend from below, and an outer table that supports the ring frame, and the inner table and the sandwiching means. Is provided so as to form a pre-sticking space independent of the decompression chamber between the adhesive sheet and the adherend.

  Further, the sandwiching means includes a sandwiching projection that sandwiches the outer periphery of the adherend, and the sandwiching means and the table are independent of the decompression chamber between the adhesive sheet and the adherend. It is possible to adopt a configuration in which a space before pasting is formed.

  Furthermore, the mounting method according to the present invention includes a step of placing a plate-shaped adherend on the inner peripheral side of the ring frame, and an adhesive sheet having a size for closing the inner peripheral side of the ring frame is attached to the ring frame. A step of accommodating the ring frame and the adherend to form a single decompression chamber, a step of decompressing the decompression chamber, and a step of sandwiching only the outer peripheral portion of the adherend together with the adhesive sheet And a step of releasing the decompression of the decompression chamber and attaching the adhesive sheet to the adherend and integrating the adherend with the ring frame.

  The mounting method according to the present invention includes a step of placing a plate-shaped adherend on the inner peripheral side of the ring frame, and a step of supplying a band-shaped adhesive sheet to a position facing the ring frame and the adherend. A step of accommodating the ring frame and the adherend to form a single decompression chamber, a step of decompressing the decompression chamber, a step of sandwiching only an outer peripheral portion of the adherend together with an adhesive sheet, Adopting the method of releasing the decompression of the decompression chamber and attaching the adhesive sheet to the adherend to integrate the adherend into the ring frame and cutting the adhesive sheet into a predetermined size You can also

  In the mounting method, a support convex portion that supports the outer peripheral portion of the adherend from below, and a sandwich convex portion that corresponds to the support convex portion and sandwiches the adhesive sheet from above the adhesive sheet. It is preferable to adopt a method of sandwiching the outer peripheral portion together with the adhesive sheet.

According to the present invention, since the outer periphery of the adherend is sandwiched together with the adhesive sheet by the table and the sandwiching means while the decompression chamber is decompressed, pressure control is performed so that the decompression chamber is opened to the atmosphere. Only the adhesive sheet is attached to the adherend.
This eliminates the need for a plurality of pressure control valves, piping, and pressure balance adjustment required when a plurality of decompression chambers are provided, and eliminates the need for complicated configuration, pressure control, or management.
Further, the decompression chamber is opened to the atmosphere by the configuration in which an independent pre-pasting space is formed between the adherend and the adhesive sheet by the table and the sandwiching means while the decompression chamber is decompressed. By performing pressure control in this manner, the space before application is substantially lost due to atmospheric pressure, the adhesive sheet is attached to the adherend, and the adherend can be mounted on the ring frame.
Moreover, since only the outer peripheral part of the adherend is supported by the table, the contact area between the adherend and the table can be reduced. Therefore, foreign matter on the table is not pressed against the adherend, so that damage can be effectively avoided even with an adherend having brittleness such as a wafer.
In this specification, the term “reduced pressure” is used as a concept including a vacuum, and the “space before application” refers to an adherend and an adhesive sheet in a region where a force sandwiching the adherend and the adhesive sheet does not act. It is used for the gap generated between the two. Further, the ring does not necessarily mean a closed loop, and includes a ring having a loop shape such as a C shape in a plan view.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a schematic front view showing a cross section of a part of the mount device according to the first embodiment of the present invention. In this figure, the mount apparatus 10 accommodates a closed loop ring frame RF and a plate member as an adherend, specifically a table 11 that supports a substantially circular wafer W, and the table 11. An openable / closable case 12 that forms a single decompression chamber C (see FIG. 3) inside, and a pressure-sensitive adhesive having a size that closes the inner peripheral side of the ring frame RF with the case 12 opened. And an attaching means 13 for attaching the adhesive sheet S to the ring frame RF. Here, the wafer W in the present embodiment is not particularly limited, but the wafer W having the reinforcing portion W2 can be mounted on the outer peripheral portion side through the stepped portion W1 so that the wafer W having the reinforcing portion W2 is mounted. Has been.

  The table 11 has a flat surface portion 15 located on the lower surface side of the wafer W in a state where the wafer W is supported, and a support protrusion which is located on the outer peripheral side of the flat surface portion 15 and supports only the outer peripheral portion of the wafer W from below. A substantially circular inner table 17 having a portion 16 and a size that accommodates the inner table 17, and an outer table 18 having a substantially circular shape in plan view that supports the ring frame RF, and the outer table 18. And a linear motion motor M1 which is disposed on the upper surface of the bottom portion 19 and supports the inner table 17 so as to be movable up and down. Communication holes 15 </ b> A and 19 </ b> A are respectively formed in the flat portion 15 of the inner table 17 and the bottom portion 19 of the outer table 18, and between the wafer W and the inner table 17 when the wafer W is supported by the inner table 17. A space C2 (see FIG. 3) formed between the space C1 to be formed and the adhesive sheet S when the adhesive sheet S is attached to the ring frame RF and the outer table 18 communicates with the decompression chamber C and A part of the decompression chamber C is formed. Here, the outer table 18 is supported so as to be movable up and down in the case 12 via the linear motor M2.

  The case 12 includes a first case 21 located on the lower side in FIG. 1 and a second case 22 located on the upper side. The first case 21 includes a bottom portion 24 and an upright portion 25 located on the outer peripheral side of the bottom portion 24, and a linear motion motor M <b> 2 is supported on the upper surface side of the bottom portion 24. The first case 21 is connected to a three-way electromagnetic valve 28 via a pipe 26 connected to the upright portion 25 and is movably provided along the left-right direction in FIG. The three-way solenoid valve 28 is connected to a piping 31 connected to a decompression pump (not shown) and a piping 32 for introducing air, and decompresses the decompression chamber C or releases the decompression to atmospheric pressure. be able to.

  The second case 22 includes a top portion 34 and a hanging portion 35, and sandwiching means 37 is disposed on the lower surface side of the top portion 34 at a position facing the table 11. The sandwiching means 37 includes a sandwiching plate 38 that can be moved up and down via a linear motion motor M3, and an annular sandwiching convex portion 40 that is provided on the outer peripheral side of the lower surface of the sandwiching plate 38. including. The sandwiching convex portion 40 has substantially the same shape as the support projecting portion 16, whereby the sandwiching convex portion 40 presses only the upper surface side of the outer peripheral portion of the wafer W through the adhesive sheet S from above, that is, the reinforcing portion W <b> 2. And then it is sandwiched. Further, a through hole 38A is formed in the surface of the sandwiching plate 38, and even when the adhesive sheet S and the wafer W are sandwiched between the inner table 17 by the sandwiching means 37, the adhesive sheet S and A space C3 (see FIG. 4) formed between the sandwiching plate 38 communicates with the decompression chamber C and constitutes a part of the decompression chamber C. An O-ring 42 is received on the lower end surface of the drooping portion 35.

  The second case 22 is supported by a moving means (not shown) so as to be movable in the vertical direction. The second case 22 descends to the first case 21 side so that the lower end surface of the drooping portion 35 faces the upper end side of the upright portion 25. When pressed, it interacts with the first case 21 to form the decompression chamber C.

  The affixing means 13 is supported by a frame F, and supports a support roller 45 that supports an unrolled sheet R on which an adhesive sheet S is temporarily attached to a strip-shaped release sheet RL, and guides the release sheet RL in a reverse direction. A peel plate 46 that peels the adhesive sheet S, a pressing roller 47 that presses the adhesive sheet S against the ring frame RF, a driving means 48 that applies a repetitive output to the original fabric R, and a winding roller 49 for the release sheet RL. It is comprised by. The driving means 48 includes a driving roller 50 connected to the output shaft of the motor M4, and a pinch roller 51 that sandwiches the release sheet RL between the driving roller 50. The adhesive sheet S has a substantially circular shape whose planar shape is larger than the inner diameter of the ring frame RF, and the adhesive sheet S is temporarily attached to the release sheet RL at a predetermined interval.

  Next, the sheet sticking method according to the first embodiment will be described with reference to FIGS.

  As shown in FIG. 1, when the ring frame RF is transferred onto the outer table 18 via transfer means (not shown), and further, the wafer W is transferred onto the inner table 17, the first case 21. Is located below the sticking means 13 (see FIG. 2). The wafer W is placed so that the lower surface of the reinforcing portion W2 is positioned on the upper surface of the support convex portion 16. And the outer side table 18 raises via the linear motor M2. Due to this rise, the upper surface of the ring frame RF is positioned above the upper end surface of the standing portion 25 of the first case 21.

  Next, when the first case 21 moves along the single-axis motor 30 in the direction of arrow a in FIG. 2 and the ring frame RF is detected to move to a predetermined sticking start position, the first case 21 is driven. The means 48 is driven to apply a feed force to the original fabric R, and the adhesive sheet S is peeled off from the release sheet RL via the peel plate 46, and the adhesive sheet S is stuck so as to close the inner peripheral side of the ring frame RF. Is done.

  When the first case 21 moves to a position immediately below the second case 22, the second case 22 is lowered via a moving means (not shown), and a single decompression chamber C is formed with the first case 21. (See FIG. 3). In this state, the three-way solenoid valve 28 is controlled, and the decompression chamber C is decompressed via the pipe 31. When the decompression chamber C is in a decompressed state, the inner table 17 rises, the sandwiching plate 38 of the sandwiching means 37 descends, and the sandwiching projection 40 interacts with the support projection 16. Thus, only the reinforcing portion W2 of the wafer W is sandwiched with the adhesive sheet S. As a result, it is possible to prevent a pressing force from being applied to the inner surface of the fragile wafer W and to prevent an external force from being applied to the surface on which the circuit is formed. Further, by this sandwiching, a pre-sticking space C4 (see FIG. 4) is formed between the inside of the wafer W and the adhesive sheet S so as to be isolated from the decompression chamber C.

  After the pre-sticking space C4 is thus formed, the three-way solenoid valve 28 is controlled to introduce the atmosphere from the pipe 32 and the decompression of the decompression chamber C is released. By this release to the atmosphere, the space C4 before pasting is substantially lost due to atmospheric pressure and the adhesive sheet S is stuck to the wafer W, as shown in FIG. It will be mounted on the frame RF.

  When the application of the adhesive sheet S is completed, the second case 22 is raised and the case 11 is opened. Then, the wafer W mounted on the ring frame RF is transferred to the next process via transfer means (not shown).

  Therefore, according to the first embodiment as described above, the adhesive sheet S can be stuck in the single decompression chamber C without applying a pressing force to the inner surface of the wafer W. Further, the adhesive sheet S can be stuck to the wafer W by forming the pre-sticking space C4 and erasing the pre-sticking space C4 by pressure control for releasing the decompression of the decompression chamber C. Complicated pressure control such as reducing the pressure while maintaining the same pressure in the chamber is unnecessary, and the pressure reduction control in the pressure reducing chamber C is extremely simple. In addition, since the lower surface of the outer peripheral side of the wafer W is supported by the inner table 17, even if foreign matter such as dust is present on the upper surface of the table 11, the wafer W may be damaged. Does not occur. Furthermore, even if there are bumps and other irregularities on the surface of the wafer W to be adhered, the sheet S can be stuck without mixing bubbles. Further, since the wafer W is configured to maintain the surface shape supported by the inner table 17, that is, the surface shape is not deformed by the elastic deformation of the rubber sheet as in the conventional example, the reinforcing portion W2 is provided on the outer periphery. Even in the shape, it is possible to eliminate the inconvenience that the wafer W is broken at the position of the stepped portion W1 for forming the reinforcing portion W2.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIGS. In the following description, the same or equivalent components as those in the first embodiment are denoted by the same reference numerals as necessary, and the description is omitted or simplified.

  The second embodiment employs a supply means 60 instead of the sticking means 13 in the first embodiment, and the first case 21 is moved up and down directly below the second case 22 via a moving means (not shown). It is characterized by a configuration that is movably provided.

  The supply means 60 includes a support roller 61 having a lock mechanism for supporting the original fabric R in which the strip-shaped release sheet RL is temporarily attached to the adhesive layer side of the strip-shaped adhesive sheet S, and a winding for collecting the release sheet RL. The means 62, the peel plate 63 for peeling the adhesive sheet S from the release sheet RL, and the adhesive sheet S are pulled out to a position facing the adherend surface of the wafer W, that is, the upper surface and the upper surface of the ring frame RF, and affixed to the ring frame RF. The take-up winding means 65 for winding up the unnecessary adhesive sheet S1 on the outer peripheral side of the adhesive sheet S, and the cutting means 66 for cutting the adhesive sheet S attached to the wafer W and the ring frame RF within the size of the ring frame RF. (Refer to FIG. 9) and a moving means 68 for supporting the drawing and winding means 65 so as to be movable in the left-right direction in FIG. The width of the adhesive sheet S in the second embodiment is smaller than the inner diameter of the case 12. Therefore, even when the adhesive sheet S is pulled out to a position facing the wafer W and the ring frame RF and the case 12 is closed, the single decompression chamber C is formed without the case 12 being partitioned vertically.

  The winding means 62 includes a driving roller 70 that is rotated by driving the motor M5 supported by the frame F1, a pinch roller 71 that sandwiches the release sheet RL between the driving roller 70, and a driving roller 70 that is driven by the motor M5. The release sheet winding roller 74 is configured to rotate synchronously and wind the release sheet RL.

  The drawing and winding means 65 includes a driving roller 75 that is rotated by driving a motor M6 supported by the frame F2, a pinch roller 76 that sandwiches an unnecessary adhesive sheet S1 between the driving roller 75, and a driving roller that is driven by the motor M6. And an unnecessary sheet take-up roller 77 that takes up the unnecessary adhesive sheet S <b> 1 while being rotated synchronously with 75.

  The moving means 68 is constituted by a single-axis robot 80 extending in the left-right direction in FIG. 6, and the frame F2 is fixed to the slider 81 of the single-axis robot 80 so that the drawing and winding means 65 can move in the left-right direction. .

As shown in FIG. 9, the cutting means 66 is provided so as to be positioned above the table 11 via a moving means (not shown) when the case 12 is opened. The cutting means 66 includes a rotary shaft 82 connected to an output shaft of a motor (not shown), an arm 83 fixed to the rotary shaft 82 and rotatable in a horizontal plane, and a rotary cutter 85 provided on the arm 83. It is comprised by. Note that the cutting means 66 is normally positioned on the side of the case 12.
Other configurations are substantially the same as those of the first embodiment.

  Next, a mounting method according to the second embodiment will be described.

  As shown in FIG. 6, with the first and second cases 21 and 22 spaced apart from each other and opening the case 12, the lead end of the original fabric R supported by the support roller 61 is set to a predetermined length. The peeling sheet RL is peeled from the adhesive sheet S at the tip position of the peel plate 63, and the peeling sheet RL is fixed to the peeling sheet take-up roller 74. On the other hand, the adhesive sheet S is fixed to an unnecessary sheet take-up roller 77 of the take-up take-up means 65 located at a position indicated by a two-dot chain line in FIG.

  When the ring frame RF is transferred onto the outer table 18 via transfer means (not shown), and further transferred so that the lower surface of the reinforcing portion W2 of the wafer W is supported by the support convex portion 16, the drive roller In a state where the rotation of 75 is locked, the take-up winding means 65 moves from the position indicated by the two-dot chain line in FIG. 6 to the position indicated by the solid line, and in synchronization with this operation, the winding means 62 is driven to release the release sheet RL. Is collected. As a result, the adhesive sheet S is supplied across the first case 21 to a position facing the upper surfaces of the wafer W and the ring frame RF.

Next, the first case 21 rises through a moving means (not shown), and the second case 22 descends through a moving means (not shown), and a single decompression chamber C (see FIG. 7) is formed. In this state, the electromagnetic valve 28 is controlled, and the decompression chamber C is decompressed via the pipe 31.
When the decompression chamber C is in a decompressed state, the inner table 17 is raised, the sandwiching plate 38 is lowered, and the sandwiching projections 40 interact with the support projections 16 so that the outer circumference of the wafer W is increased. Only the part is sandwiched with the adhesive sheet S. As a result, it is possible to prevent a pressing force from being applied to the inner surface of the fragile wafer W and to prevent an external force from being applied to the surface on which the circuit is formed. Further, by this sandwiching, a pre-sticking space C4 (see FIG. 7) is formed between the inside of the wafer W and the adhesive sheet S, and after the pre-sticking space C4 is formed, the pressure is reduced as in the first embodiment. By setting the chamber C to atmospheric pressure, the space C4 before pasting disappears and the adhesive sheet S is pasted on the wafer W (see FIG. 8).

  When the application of the adhesive sheet S is completed, as shown in FIG. 9, the second case 22 moves upward away from the first case 21, and the cutting means 66 is retracted to the side of the case 12. It moves onto the first case 21 and the adhesive sheet S is cut in a closed loop shape in the plane of the ring frame RF.

  After the cutting of the adhesive sheet S, the position indicated by the two-dot chain line in FIG. 6 while the driving roller 75 and the unnecessary sheet take-up roller 77 rotate while the support roller 61 and the driving roller 70 are locked. Thus, the unnecessary adhesive sheet S1 generated by the cutting is wound up (see FIG. 10).

  The wafer W mounted on the ring frame RF via the adhesive sheet S is transferred to a predetermined location via a transfer means (not shown).

  Therefore, the same effect as that of the first embodiment can be obtained by the second embodiment.

Although the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, the present invention is not limited to this.
That is, the invention has been illustrated and described with particular reference to particular embodiments, but it should be understood that the above-described embodiments are not deviated from the technical idea and scope of the invention. On the other hand, various modifications can be made by those skilled in the art in shape, quantity, and other detailed configurations.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  For example, in the above-described embodiment, a pressure-sensitive adhesive sheet is used as the adhesive sheet S, but the present invention is not limited to this, and a heat-sensitive adhesive sheet for die bonding can also be adopted. In this case, a heater may be built in the table, or the air supplied via the pipe 26 may be warm air.

  Furthermore, the adherend is not limited to the wafer W, and other plate-like members such as a glass plate, a steel plate, or a resin plate can be targeted. The semiconductor wafer may be a silicon wafer or a compound wafer. . Further, the wafer W or the plate-like member can be applied even if they have the same thickness.

  The sandwiching means 37 may be changed in design as long as the adhesive sheet S and the wafer W can be sandwiched between the inner table 17 to form the pre-sticking space C4.

The partial cross section front view of the mounting apparatus which concerns on 1st Embodiment. The partial cross section front view which shows the state just before sticking an adhesive sheet on a ring frame. The partial cross section front view which shows the state in which the decompression chamber was formed. The partial cross section front view which shows the state in which the space before sticking was formed between the adhesive sheet and the wafer. The partial cross section front view which shows the state mounted on the ring frame. The partial cross section front view of the mounting apparatus which concerns on 2nd Embodiment. The partial cross section front view which shows the state in which the space before sticking was formed between the adhesive sheet and the wafer. The partial cross section front view which shows the state by which the adhesive sheet was affixed on the wafer. The partial cross section front view which shows the state which cut | disconnects an adhesive sheet within the surface of a ring frame. The partial cross section front view which shows the state which wound up the unnecessary adhesive sheet produced by the cutting | disconnection of an adhesive sheet.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Mount apparatus 11 Table 12 Case 13 Sticking means 14 Case 16 Supporting convex part 17 Inner table 18 Outer table 37 Clamping means 40 Clamping convex part 60 Supply means 66 Cutting means C Decompression chamber C4 Space before sticking RF ring frame S Adhesive sheet W Semiconductor wafer (adherence)

Claims (7)

A table for supporting the adherend by arranging a plate-like adherend on the inner peripheral side of the ring frame; and an attaching means for attaching an adhesive sheet having a size for closing the inner peripheral side of the ring frame to the ring frame; An openable and closable case that accommodates the table and forms a decompression chamber therein, and the adherend is attached to the ring frame via an adhesive sheet by closing the case and controlling the pressure in the decompression chamber to a predetermined level. In the mounting device to be integrated,
It further includes clamping means arranged in the case at a position facing the table, and the clamping means interacts with the table in a state where the case is closed to form a single decompression chamber. A mounting apparatus characterized by sandwiching only the outer peripheral portion of the adherend together with the adhesive sheet. A table for arranging a plate-like adherend on the inner peripheral side of the ring frame and supporting the adherend; a supply means for supplying a belt-like adhesive sheet to a position facing the ring frame and the plate-like member; An openable / closable case that houses a table and forms a decompression chamber therein, and the adherend is integrated with the ring frame via an adhesive sheet by closing the case and controlling the pressure in the decompression chamber to a predetermined level. Later, in a mounting device comprising a cutting means for cutting the adhesive sheet into a predetermined size,
It further includes clamping means arranged in the case at a position facing the table, and the clamping means interacts with the table in a state where the case is closed to form a single decompression chamber. A mounting apparatus characterized by sandwiching only the outer peripheral portion of the adherend together with the adhesive sheet.   The table includes an inner table having a support convex portion that supports an outer peripheral portion of the adherend from below, and an outer table that supports the ring frame, and the inner table and the sandwiching means include the adhesive sheet. The mounting device according to claim 1, wherein a pre-sticking space independent of the decompression chamber is formed between the substrate and the adherend.   The sandwiching means includes a sandwiching projection that sandwiches the outer periphery of the adherend, and the sandwiching means and the table are affixed between the adhesive sheet and the adherend independently from the decompression chamber. 4. The mounting device according to claim 1, wherein a front space is formed. A step of placing a plate-shaped adherend on the inner peripheral side of the ring frame;
Attaching an adhesive sheet of a size that closes the inner peripheral side of the ring frame to the ring frame;
Accommodating the ring frame and the adherend to form a single decompression chamber;
Depressurizing the decompression chamber;
Sandwiching only the outer periphery of the adherend together with the adhesive sheet;
Releasing the reduced pressure in the decompression chamber, attaching the adhesive sheet to the adherend, and integrating the adherend with the ring frame. A step of placing a plate-shaped adherend on the inner peripheral side of the ring frame;
Supplying a band-shaped adhesive sheet to a position facing the ring frame and the adherend;
Accommodating the ring frame and the adherend to form a single decompression chamber;
Depressurizing the decompression chamber;
Sandwiching only the outer periphery of the adherend together with the adhesive sheet;
Releasing the reduced pressure in the decompression chamber and attaching the adhesive sheet to the adherend to integrate the adherend into a ring frame; and
A cutting step of cutting the adhesive sheet into a predetermined size.   The outer peripheral portion of the adherend is bonded to the outer peripheral portion of the adherend by a support convex portion that supports the outer peripheral portion from below and a sandwich convex portion that corresponds to the support convex portion and sandwiches the adhesive sheet from above the adhesive sheet. The mounting method according to claim 5 or 6, wherein the mounting method is carried out together.

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