JP2008294026A - Apparatus and method of sticking sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus and a method of sticking an adhesive sheet capable of getting rid of air bubbles occurring when an adhesive sheet is stuck to a target such as a semiconductor wafer. <P>SOLUTION: A pressure regulation chamber 11 is partitioned by a pressurizing force applying sheet 45 to provide first and second chambers C1 and C2. The semiconductor wafer W and the adhesive sheet S are relatively placed in the first chamber C1. In addition, the first and second chambers C1 and C2 are pressure-reduced, to have the sheet S stuck to the wafer W. Thereafter, the first and second chambers are pressurized to stick the sheet S to the wafer W. The air bubbles b which can occur around a bump B provided on the semiconductor wafer W are absorbed into an adhesive layer A of the adhesive sheet S by the pressurized atmosphere and disappear, so that the sheet can be stuck without the bubbles b. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a sheet sticking apparatus and a sticking method, and more particularly, to a sheet sticking apparatus and a sticking method suitable for sticking an adhesive sheet to a semiconductor wafer having protrusions such as bumps.

In general, a semiconductor wafer (hereinafter simply referred to as a “wafer”) is bonded to a circuit surface using a sheet sticking apparatus and processed in each step.
Patent Document 1 discloses an adhesive sheet pasting device. The apparatus includes a base having an open portion at the top, an upper lid that opens and closes the open portion and forms a vacuum chamber together with the base, and a piston that is provided on the base so as to be movable up and down and mounts a substrate on the upper surface side. A pressurizing chamber for pushing up the piston, and a rubber sheet provided on the inner surface of the top wall of the upper lid. The vacuum chamber is kept in a vacuum with the tape relatively disposed on the base, and the pressure is increased. A configuration is adopted in which a pressure can be applied to the pressure chamber and the piston can be raised to attach a tape to the substrate.
JP 2005-135931 A

However, the sheet sticking device of Patent Document 1 is merely a configuration in which the substrate is pressed against the tape in a vacuum atmosphere and the tape is stuck to the substrate.
In general, it is difficult to form a complete vacuum state, and even if the substrate is pressed against the tape, it is not easy to apply the tape in a state where no bubbles are generated. In particular, when the substrate is a semiconductor wafer, and the adherend is one having protrusions such as bumps on the tape application surface, bubbles often occur around the bumps.
Therefore, even with the configuration of Patent Document 1, there is a disadvantage that the tape is stuck with air bubbles remaining around the bumps.

  Therefore, in order to eliminate bubbles remaining between the adherend and the adhesive sheet, the bubbles are absorbed into the adhesive to be lost by applying a pressure state.

[Object of invention]
An object of the present invention is to provide an adhesive sheet sticking apparatus and sticking method capable of eliminating bubbles that may be generated when an adhesive sheet is stuck on an adherend.

In order to achieve the above object, the present invention provides a pressing means in the pressure adjustment chamber, and covers the adhesive sheet via the pressing means in a state where the adherend and the adhesive sheet are relatively arranged in the pressure adjustment chamber. In the sheet sticking device for sticking to the kimono,
A pressure reduction means and a pressure means for selectively performing pressure reduction and pressurization of the pressure regulation chamber;
The pressure reducing means maintains the pressure adjusting chamber in a reduced pressure atmosphere when the adhesive sheet is attached to the adherend via the pressing means, while the pressure means is applied after the adhesive sheet is attached, The pressure adjusting chamber is maintained in a pressurized atmosphere.

In addition, the present invention provides a pressure adjustment chamber formed by a lower case having an opening at the top and accommodating an adherend via a supporting means, and an upper case for opening and closing the opening, and the pressure adjustment chamber And a sheet supply means for supplying an adhesive sheet so as to face the adherend, and the adhesive sheet is attached to the adherend via the pressing means with the pressure adjusting chamber as a predetermined pressure. In the sheet sticking device to stick,
A pressure reduction means and a pressure means for selectively performing pressure reduction and pressurization of the pressure regulation chamber;
The pressure reducing means maintains the pressure adjusting chamber in a reduced pressure atmosphere when the adhesive sheet is attached to the adherend via the pressing means, while the pressure means is applied after the adhesive sheet is attached, A configuration in which the pressure adjusting chamber is maintained in a pressurized atmosphere can be employed.

  The sheet sticking device further includes a pressure reduction detection unit and a pressure detection unit that communicate with the pressure adjustment chamber, respectively, between the pressure reduction detection unit and the pressure adjustment chamber, and between the pressure detection unit and the pressure adjustment chamber. Has a configuration in which an opening / closing mechanism is provided.

  Moreover, in this invention, the structure of further including the heating means which heats the said to-be-adhered body and / or an adhesive sheet can be taken.

Furthermore, the present invention supports the adherend in the pressure adjustment chamber, and arranges an adhesive sheet relative to the adherend, and attaches the adhesive sheet to the adherend via the pressing means with the pressure adjustment chamber as a predetermined pressure. In the sheet sticking method to stick,
Attaching the adhesive sheet to the adherend via the pressing means in a state where the pressure adjusting chamber is maintained in a reduced pressure atmosphere,
Next, a method is adopted in which the pressure adjusting chamber is set to a pressurized atmosphere.

  In the sheet sticking method, by holding the adherend to which the adhesive sheet is stuck in a pressurized atmosphere, air bubbles remaining between the adherend and the adhesive sheet are absorbed into the adhesive layer of the adhesive sheet. The method of letting it disappear is adopted.

  The “reduced pressure” in the present invention includes a vacuum.

  According to the present invention, the pressure adjusting chamber is provided with a decompression means and a pressurization means, respectively, so that pressure reduction and pressurization can be performed selectively. After the adhesive sheet is attached to the adherend in a reduced pressure atmosphere, By changing to a pressurized atmosphere, bubbles that may be generated between the adherend and the adhesive sheet are absorbed into the adhesive layer and disappear. As a result, it is possible to attach a good adhesive sheet free from bubbles.

  In addition, since the pressure adjustment chamber, the decompression detection unit, and the pressurization detection unit can be blocked by the open / close mechanism, respectively, the pressurization detection unit can be protected during decompression, and the decompression detection unit can be protected during pressurization. It is possible to use highly accurate sensors and prevent them from being damaged.

  Furthermore, by having a heating means for heating the adherend and / or the adhesive sheet, bubbles are easily absorbed into the adhesive layer.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a schematic front view of a sheet sticking apparatus according to the present embodiment, and FIG. 2 shows an enlarged cross-sectional view of a main part. In these drawings, a sheet sticking apparatus 10 includes a pressure adjustment chamber 11 disposed in the center of FIG. 1, a sheet supply means 12 disposed on the left side of the pressure adjustment chamber 11 in the figure, and the opposite side. The winding means 14 is arranged, and a cutting means (not shown) arranged in the vicinity of the pressure adjusting chamber 11 is provided.

The sheet supply means 12 includes an adhesive sheet S in which an adhesive layer A is provided on a base sheet BS, and a release sheet RL temporarily attached to the adhesive sheet S, as shown in an enlarged view of part P in FIG. The raw material R including The sheet supply means 12 includes a support roller 20 that supports the unrolled roll R in a rollable manner, and a release sheet winding that is disposed below the support roller 20 and winds the release sheet RL. A peel plate 23 provided between the roller 21 and the support roller 20 and the release sheet take-up roller 21 so that the front end faces the pressure adjusting chamber 11 side, and the support roller 20 and the release sheet Guide rollers 24 to 29 disposed between the take-up roller 21, a drive roller 30 driven by a motor (not shown), a pinch roller 31 that sandwiches the original fabric R between the drive roller 30, and the guide A brake 33 which is disposed relative to each of the rollers 26 and 29 and temporarily stops the feeding of the original fabric R via air cylinders 33A and 34A. And a 34.
The release sheet take-up roller 21 is connected to a rotation shaft of the drive roller 30 via a pulley, a belt, and the like, and is configured to take up the release sheet RL by rotating following the drive roller 30. Yes.

  As shown in FIGS. 1 to 3, the pressure adjusting chamber 11 includes a case 42 including a lower case 40 whose upper end is opened, and an upper case 41 that opens and closes the upper end of the lower case 40. And a pressing force applying sheet 45 as pressing means, which is made of an elastic sheet that is attached so as to close the lower end side of the cylindrical portion 44 and that partitions the inside of the case 42. The lower case 40 includes a bottom wall 47 and a side wall 48 connected to the peripheral edge of the bottom wall 47, and the side wall 48 has a first pressure reducing pump 50 that constitutes a pressure reducing means, and a first pressure applying a pressure means. A pump 51 is connected. Further, the side wall 48 is provided with a first pressure reduction detection unit 56 and a first pressure detection unit 57 for detecting a pressure during pressure reduction and a pressure during pressure application through the through holes 53 and 54. Each detection unit 56, 57 is provided with a first pressure reduction sensor 60 and a first pressure sensor 61, respectively. Here, the first decompression detection unit 56 and the first pressurization detection unit 57 are respectively provided with shutters 56A and 57A as opening / closing mechanisms that can be disconnected from the pressure adjustment chamber 11.

  The upper case 41 includes a top wall 63 and a peripheral wall 64 connected to the top wall 63, and the top wall 63 has a second decompression pump 65 that constitutes a decompression unit and a second decompression that constitutes a pressurization unit. A pressure pump 66 is connected. In addition, the top wall 63 is provided with a second pressure reduction detection unit 70 that detects a pressure during pressure reduction and a pressure during pressure application through the through holes 67 and 68, and a second pressure detection unit 71, Each of the detection units 70 and 71 is provided with a second pressure reduction sensor 73 and a second pressure sensor 74, respectively. An O-ring 69 is provided at the lower end of the peripheral wall 64. Here, the second decompression detection unit 70 and the second pressurization detection unit 71 are respectively provided with shutters 70A and 71A as opening / closing mechanisms that can be disconnected from the pressure adjustment chamber 11.

  In the pressure adjusting chamber 11, a space outside the pressing force applying sheet 45, the cylindrical portion 44, and the top wall 63 is a first chamber C <b> 1 with the lower case 40 closed by the upper case 41. On the other hand, a space excluding the first room C1, that is, a space surrounded by the pressing force applying sheet 45, the cylindrical portion 44, and the top wall 63 is formed as the second room C2.

  A table 75 as a support means is disposed in the first chamber C1, and the table 75 can support the wafer W. The table 75 includes a heater 75 </ b> A that constitutes heating means inside, and is provided in a size that substantially corresponds to the size of the wafer W in this embodiment. Further, the table 75 is provided so as to be lifted and lowered via a single-axis robot 76.

The winding means 14 includes a driving roller 77 that can be rotated via a motor (not shown), a pinch roller 78 that is urged to abut on the outer peripheral surface of the driving roller 77, and a pulley on the rotating shaft of the driving roller 77. The winding roller 80 is rotatably provided via a belt or the like. The winding means 14 is configured such that the adhesive sheet S is affixed to the wafer W, the adhesive sheet S is cut according to the size of the wafer W via a cutting means (not shown), and then the driving roller 77 is moved by a moving means (not shown). Is rotated on the wafer W to wind up the unnecessary adhesive sheet S1.
The cutting of the adhesive sheet S can be performed using an articulated robot substantially the same as that described in Japanese Patent Application No. 2006-15783 filed by the present applicant.
In addition, the part shown with the symbol V in a figure shows a solenoid valve, respectively.

  Next, the sheet sticking method according to the present embodiment will be described with reference to FIG.

  In the initial setting, the lead end of the raw fabric R supported by the support roller 20 is pulled out by a predetermined length, the release sheet RL is peeled from the adhesive sheet S at the tip position of the peel plate 23, and the lead end of the release sheet RL is peeled off. Fix to the sheet take-up roller 21. On the other hand, the adhesive sheet S from which the release sheet RL has been peeled is pulled out across the upper portion of the lower case 40 and passed between the drive roller 77 and the pinch roller 78, as shown in FIG. The roller 80 is fixed. In a state where the initial setting is completed in this manner, a certain space is formed between the lower case 40 and the adhesive sheet S on the lower case 40, and the wafer is moved by a transfer arm (not shown). Space required for setting W on the table 75 is secured.

  When the wafer W is set on the table 75, the sheet supply unit 12 and the winding unit 14 are lowered so that the adhesive sheet S comes into contact with the upper surface of the lower case 40 (the upper end surface of the side wall 48). Is done. Next, the pressure adjustment chamber 11 is hermetically sealed with the upper case 41 sandwiching the adhesive sheet S via an arm or lifting device (not shown), and the single-axis robot 76 is driven so that the upper surface of the wafer W adheres to the adhesive sheet. The wafer W is raised to a position close to the lower surface of S.

  In the above state, the electromagnetic valves communicating with the first pressure pump 51 and the second pressure pump 66 are closed, while the electromagnetic valves communicating with the first pressure pump 50 and the second pressure pump 65 are opened. While the pressure adjustment is performed so that the first chamber C1 and the second chamber C2 are in substantially the same reduced pressure state, the inside of the pressure adjustment chamber 11 is made a reduced pressure atmosphere. Next, with the first chamber C1 kept in a predetermined reduced pressure state, the reduced pressure state only on the second chamber C2 side is gradually opened (approached to atmospheric pressure). When the first and second decompression pumps 50 and 65 are driven, the shutters 56A and 70A in the first decompression detection unit 56 and the second decompression detection unit 70 are opened, while the first and second decompression pumps 50 and 65 are driven. The shutters 57A and 71A of the pressure detection units 57 and 71 are kept in the closed position.

  By releasing the reduced pressure in the second chamber C2, the adhesive force application sheet 45 is elastically deformed by the differential pressure with respect to the first chamber C1, and the surface position is pushed downward, and the pressure generated by this depression causes the adhesive sheet S to be pressed down. Is affixed to the wafer W. After the application of the sheet S is completed in this way, the first and second decompression chambers C1 and C2 are controlled to be at atmospheric pressure. Note that these pressure reduction controls are performed under pressure control under the control of the first and second pressure reduction sensors 60 and 73.

In the state where the primary bonding of the adhesive sheet S is completed as described above, that is, in a reduced-pressure atmosphere, even in a reduced-pressure atmosphere, as shown in FIG. There may be bubbles b around.
Therefore, the solenoid valves communicating with the first decompression pump 50 and the second decompression pump 65 are closed, while the solenoid valves communicating with the first pressurization pump 51 and the second pressurization pump 66 are opened, and the first While the pressure adjustment is performed so that the room C1 and the second room C2 are in substantially the same pressurized state, the inside of the pressure adjusting chamber 11 is made a pressurized atmosphere. Next, the adhesive sheet S is heated by the heater 75 </ b> A provided on the table 75. When the first and second pressure pumps 51 and 66 are driven, the shutters 57A and 71A in the first pressure detection unit 57 and the second pressure detection unit 71 are opened, while the first pressure detection unit 57 and the second pressure detection unit 71 are opened. The shutters 56A and 70A of the second decompression detectors 56 and 70 are kept in the closed position. Note that the pressure control is performed under the control of the first and second pressure sensors 61 and 74.

  As shown in FIG. 4 (B), the gas forming the bubbles b is dispersed in the surroundings so as to be absorbed in the adhesive layer A, and the bubbles b are formed by setting the pressurized atmosphere. As shown in FIG. 4C, the adhesive sheet S can be stuck without any bubbles around the bumps B.

  After the application of the adhesive sheet S is completed, the upper case 41 is opened, the case 42 is opened, and the cutter blade of a cutting means (not shown) moves according to a preset teaching locus so as to match the size of the wafer W. Thus, the adhesive sheet S is cut in a closed loop shape. By this sheet cutting, the outer peripheral area excluding the adhesive sheet S attached to the wafer W becomes a winding target as an unnecessary adhesive sheet portion S1.

  Next, after the winding means 14 moves to the left side in FIG. 1 and winds up the unnecessary adhesive sheet S1, it returns to the initial position while pulling out the original fabric R to be attached to the next wafer. S can be attached. When the unnecessary adhesive sheet S1 is taken up while the drive roller 77 and the take-up roller 80 move to the left side in FIG. 1, the brakes 33, 34 are provided around the outer periphery of the guide rollers 26, 29 via the air cylinders 33A, 34A. While the abutment R is abutted and the feeding out of the original fabric R is suppressed, when returning to the initial position, the suppression by the brakes 33 and 34 is released and the sheet supply is allowed.

  In the present embodiment, the pressure setting value for maintaining the first and second rooms C1 and C2 in the reduced pressure atmosphere and the pressurized atmosphere, the differential pressure generated in the reduced pressure atmosphere, and the like are set in advance in a control device (not shown). The control device performs the overall control using the outputs of the sensors 60, 61, 73, and 74 as an input, thereby applying the adhesive sheet S. This pressure set value is variably set according to the adherend having no protrusion, the adherend having the protrusion, or the type of the adhesive sheet, and can be set by performing test attachment.

  Therefore, according to such an embodiment, after the adhesive sheet S is attached to the wafer W using the reduced pressure atmosphere, the bubbles b that may be generated around the bumps B of the wafer W are further generated by setting the pressure atmosphere. The effect that it can be effectively lost and the adhesive sheet S can be applied with high accuracy is obtained.

Although the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, the present invention is not limited to this.
That is, the invention has been illustrated and described with particular reference to particular embodiments, but it should be understood that the above-described embodiments are not deviated from the technical idea and scope of the invention. On the other hand, various modifications can be made by those skilled in the art in shape, quantity, and other detailed configurations.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  For example, the adhesive sheet S may be a pressure-sensitive adhesive sheet such as a dicing sheet or a surface protective sheet, or a heat-sensitive adhesive sheet such as a die bonding sheet.

  In addition, the adherend is not limited to the wafer W, but can also be a plate member having no other bump such as a glass plate, a steel plate, or a resin plate. The semiconductor wafer is a silicon wafer or a compound wafer. It may be.

  Furthermore, in the above-described embodiment, the case where the strip-shaped raw fabric R is used and cut according to the size of the wafer W has been described. However, a single-wafer type adhesive sheet corresponding to the size of the wafer W is used. You can also. In short, the present invention only needs to have a configuration in which a pressure atmosphere is applied after pasting in a reduced pressure atmosphere.

  In addition, the shutters 56A, 57A, 70A, and 71A are used as the opening / closing mechanism, but other opening / closing mechanisms such as an electromagnetic valve may be used.

The schematic sectional drawing of the sheet sticking apparatus which concerns on this embodiment. The partially expanded view of FIG. The schematic sectional drawing which shows the state which open | released the case which comprises a pressure regulation chamber. (A), (B), and (C) are enlarged cross sections showing a state where bubbles are generated around the bumps, a state where the bubbles disappear, and a state where the bubbles disappear and the adhesive sheet is stuck to the wafer. Figure.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 11 Pressure adjustment chamber 12 Sheet supply means 40 Lower case 41 Upper case 45 Pressing force provision sheet (pressing means)
50 First decompression pump (decompression means)
51 First pressurizing pump (pressurizing means)
56 1st decompression detection part 56A Shutter (opening-closing mechanism)
57 1st pressurization detection part 57A Shutter (opening-closing mechanism)
60 1st decompression sensor 61 1st pressurization sensor 65 2nd decompression pump (decompression means)
66 Second pressurizing pump (pressurizing means)
70 Second decompression detector 70A Shutter (opening / closing mechanism)
71 2nd pressurization detection part 71A Shutter (opening-closing mechanism)
73 Second pressure sensor 74 Second pressure sensor 75 Table (support means)
75A heater (heating means)
A Adhesive layer B Bump (projection)
b Bubble C1 First chamber C2 Second chamber S Adhesive sheet W Semiconductor wafer (Substrate)

Claims (6)

In the sheet sticking apparatus for placing the adhesive sheet on the adherend via the pressing means in a state in which the pressing means is disposed in the pressure regulation chamber and the adherend and the adhesive sheet are relatively disposed in the pressure regulation chamber,
A pressure reduction means and a pressure means for selectively performing pressure reduction and pressurization of the pressure regulation chamber;
The pressure reducing means maintains the pressure adjusting chamber in a reduced pressure atmosphere when the adhesive sheet is attached to the adherend via the pressing means, while the pressure means is applied after the adhesive sheet is attached, A sheet sticking apparatus, wherein the pressure adjusting chamber is maintained in a pressurized atmosphere. A pressure adjusting chamber formed by a lower case having an opening at the top and accommodating an adherend via a supporting means, and an upper case for opening and closing the opening, and a pressing means disposed in the pressure adjusting chamber And a sheet feeding device for feeding the adhesive sheet to the adherend via the pressing means with the pressure adjusting chamber as a predetermined pressure. ,
A pressure reduction means and a pressure means for selectively performing pressure reduction and pressurization of the pressure regulation chamber;
The pressure reducing means maintains the pressure adjusting chamber in a reduced pressure atmosphere when the adhesive sheet is attached to the adherend via the pressing means, while the pressure means is applied after the adhesive sheet is attached, A sheet sticking apparatus, wherein the pressure adjusting chamber is maintained in a pressurized atmosphere.   Further comprising a decompression detection unit and a pressurization detection unit respectively communicating with the pressure regulation chamber, an opening / closing mechanism is provided between the decompression detection unit and the pressure regulation chamber, and between the pressurization detection unit and the pressure regulation chamber. The sheet sticking device according to claim 1, wherein the sheet sticking device is provided.   The sheet sticking apparatus according to claim 1, 2, or 3, further comprising heating means for heating the adherend and / or the adhesive sheet. In a sheet sticking method of supporting an adherend in a pressure adjustment chamber, arranging an adhesive sheet relative to the adherend, and sticking the adhesive sheet to the adherend via a pressing means with the pressure adjustment chamber as a predetermined pressure ,
Attaching the adhesive sheet to the adherend via the pressing means in a state where the pressure adjusting chamber is maintained in a reduced pressure atmosphere,
Next, the sheet sticking method is characterized in that the pressure adjusting chamber is a pressurized atmosphere.   By holding the adherend to which the adhesive sheet is affixed in a pressurized atmosphere, air bubbles remaining between the adherend and the adhesive sheet are absorbed into the adhesive layer of the adhesive sheet and eliminated. The sheet sticking method according to claim 5, wherein:

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