JP2006222231A - Tape bonding device and tape bonding method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a tape bonding device capable of removing the slack of a placing means for placing a work, bonding a tape member to the work much more favorably, exfoliating the tape member easily, preventing dust from sticking to the work, and also preventing the work from deviating at the time of vacuum suction. <P>SOLUTION: The tape bonding device for bonding the tape member to the work comprises a placing means for placing the work, a vacuum room which can be blockaded in an internally sealed state while making inherent the placing means and the work placed in the placing means, a moving device for moving the placing means toward the normal line direction of the work, a tape support means for supporting the tape member at a position estranged in the normal line direction to the work, while being provided in the inside of the vacuum room, a suction means for carrying out the vacuum suction of the inside of the vacuum room, and further a positioning means for positioning the work which is brought into contact with the outer circumferential edge of the work in the inside of the vacuum room. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a tape bonding apparatus and a tape bonding method for bonding a tape member to a workpiece.

  In the semiconductor manufacturing process, a circuit pattern is formed on the surface of a semiconductor wafer (hereinafter referred to as a wafer), and then the back surface of the wafer is polished to reduce the thickness, thereby reducing the size and thickness of the formed semiconductor chip. There are things to do. In addition, a chemical etching process may be performed using a chemical solution to perform a manufacturing process for reducing the thickness of the wafer.

  In this manufacturing process, an adhesive protective tape (hereinafter referred to as a tape member) is attached to the wafer surface. As a result, the wafer surface is prevented from being contaminated, and the wafer surface is scratched to prevent the circuit from being damaged.

  There exists a thing of patent document 1 as a tape bonding apparatus which adhere | attaches a tape member on such a wafer surface. In the tape bonding apparatus described in Patent Document 1, the room on the upper lid side is switched to atmospheric pressure from the state where both the room on the main body side and the room on the upper lid side are evacuated. Thereby, a differential pressure is generated between the chamber on the upper lid side and the room on the main body side, and the rubber sheet swells in the chamber on the main body side due to the differential pressure. The bulge causes the rubber sheet to press the tape member, thereby bonding the tape member to the workpiece.

  Another tape bonding apparatus is described in Patent Document 2. In the thing of this patent document 2, using the differential pressure | voltage between a 1st vacuum chamber and a 2nd vacuum chamber, the center part of a base with high smoothness is bent toward the tape member side. Yes. At the same time, the wafer is lifted by driving the lifting device while pressing a base having a bent central portion against a tape member affixed to the wafer. By doing so, the tape member is bonded to the wafer while air is pushed outward from the center side of the tape member.

Japanese Patent Laid-Open No. 2003-7808 (see paragraph number 0007, FIGS. 2 to 4) Japanese Unexamined Patent Publication No. 2000-349047 (summary, see FIGS. 1 to 5)

  The configuration described in Patent Document 1 described above remains at the idea level, and the configuration is not specific. Therefore, various problems arise when actually trying to implement based on such a configuration. For example, in the configuration described in Patent Document 1, since the rubber sheet is located at the upper part, it is necessary to considerably increase the tension when the rubber sheet is stretched in order to remove the slack due to the weight of the rubber sheet. For this reason, it has the subject that the attachment operation | work of a rubber sheet becomes difficult.

  In particular, in order to efficiently bond the tape member, at the initial position where the operation of bonding the tape member to the wafer is started, there is a gap between the tape member in contact with the rubber sheet and the wafer. Usually small. If the rubber sheet is slack in a state where the gap is small, there may be a problem that the tape member adheres to the wafer and bubbles enter the adhesion surface from the stage before vacuum suction.

  Further, in the configuration described in Patent Document 1, a plurality of push screws are provided, and it is necessary to rotate all of these push screws. When it is necessary to rotate the push screws simultaneously, it is a difficult task. Furthermore, in the configuration described in Patent Document 1, it is necessary to install a tape member and a wafer with the upper lid removed. For this reason, it takes extra man-hours.

  Further, in the configuration described in Patent Document 2, a tape member to which a wafer is attached by bending a base such as a glass plate using a differential pressure between the first vacuum chamber and the second vacuum chamber. The base is bonded to the tape, and the tape member and the base to which the wafer is further attached are lifted from the bonded state. For this reason, it has a two-step bonding process, which takes time and is not preferable in terms of cost. Further, since a separate lifting device is required to lift the wafer or the like, the configuration becomes complicated, and the cost increases accordingly.

  Here, the present applicant has applied for Japanese Patent Application Nos. 2003-289809 and 2004-154050, and has improved these conventional tape bonding apparatuses. According to these, the malfunction with which the structure currently disclosed by the above-mentioned patent document 1 and patent document 2 grade | etc., Is removed.

  By the way, in the tape bonding apparatuses disclosed in the above-mentioned Patent Documents 1 and 2, Japanese Patent Application No. 2003-289809 and Japanese Patent Application No. 2004-154050, the configuration for attaching the tape member is mainly disclosed. Yes. Therefore, there is no disclosure about a configuration in which the tape member is peeled off after the tape is attached to the workpiece. Here, when the tape member is peeled from the work, static electricity often occurs due to friction generated between the work and the tape member. When such static electricity is generated, dust scattered around the surrounding atmosphere may be attracted to the workpiece by the electrostatic coulomb force, and the dust may adhere to the workpiece. Such dust adhesion causes a defect in the subsequent processes. Therefore, when peeling off a tape member, it is desired not to make dust adhere to a work.

  Here, when peeling a tape member from a workpiece | work, the tape member is peeled from a workpiece | work now in the state where surrounding atmosphere, such as a clean room, was cleaned. However, even when a clean room is used, it is difficult to prevent fine dust from adhering to the work because the generation of static electricity due to the peeling of the tape member cannot be prevented.

  Moreover, when a tape member is affixed to a workpiece, the tape member usually protrudes from the outer peripheral edge of the workpiece. When the area of the protruding portion is large, the tape member is cut along the outer peripheral edge of the workpiece. Here, when cutting a tape member, the cutting tool is currently used. However, in cutting using a blade, chips and the like are generated from the tape member. And when this chip etc. stays in the inside of a tape bonding device, for example, when newly bonding a tape member to a work, the chip etc. adheres to a work or a tape member, and a good adhesion state is obtained. The problem that it is not possible also occurs.

  In addition, when a wafer is installed inside the tape bonding apparatus disclosed in Japanese Patent Application Nos. 2003-289809 and 2004-154050, there is a problem that the wafer vibrates (runs out) due to an air flow generated by vacuum suction. . When such vibration (fluctuation) occurs, the outer peripheral edge of the upper surface of the wafer comes into contact with the tape member, causing a problem that adhesion cannot be performed satisfactorily.

  The present invention has been made on the basis of the above circumstances, and the object thereof is to remove the slack of the elastic sheet member on which the work is placed, and to adhere the tape member to the work better, and the tape. An object of the present invention is to provide a tape adhering apparatus and a tape adhering method that can be easily peeled off, prevent dust from adhering to the work, and prevent the work from being displaced during vacuum suction.

  In order to solve the above problems, the present invention is a tape bonding apparatus for bonding a tape member to a work, and an elastic sheet member on which the work is placed on the upper surface, and an upper surface side of the elastic sheet member, A vacuum chamber partitioned by the stretchable sheet member, an air introduction portion partitioned by the stretchable sheet member and a portion on the lower surface side of the stretchable sheet member that does not interfere with the air introduction portion. A mounting portion on which the elastic sheet member is mounted, a holding member that holds the elastic sheet member in a state that prevents air conduction to the vacuum chamber, and a workpiece that is mounted on the elastic sheet member A tape holding means for holding the tape member at the upper part of the tape, and an outer peripheral edge of the work placed on the upper surface of the stretchable sheet inside the vacuum chamber to position the work Positioning means to perform, first suction means for vacuum suction of the inside of the vacuum chamber, second suction means for vacuum suction of the air introduction part, and air introduction means for introducing air into the air introduction part. Is.

  When comprised in this way, a workpiece | work is mounted in the upper surface of an expansion-contraction sheet member, and a tape member is hold | maintained by the tape holding means on the upper part. In this state, the first suction unit and the second suction unit are operated to evacuate the vacuum chamber and the air introduction unit. Thereafter, the air introduction means is operated to introduce air into the air introduction unit. Then, due to the differential pressure between the vacuum chamber in which the vacuum state is maintained and the air introduction portion into which air is introduced, the stretchable sheet member whose boundary portion is sealed with the holding member is placed inside the vacuum chamber. Inflates towards. By this expansion, the stretchable sheet member lifts the workpiece, and the workpiece contacts the tape member.

  When the stretchable sheet member is further expanded from that state, the tape member can be favorably pressed against the entire surface of the workpiece and bonded. As described above, by placing the work on the upper surface of the stretchable sheet member and expanding the stretchable sheet member, the tape member can be adhered to the work while preventing the entry of bubbles. In such adhesion, it is possible to remove the influence of the slackness of the elastic sheet member as compared with the case where the work is positioned on the lower surface of the elastic sheet member. Further, since the expansion of the elastic sheet member is used, a special configuration for moving the workpiece toward the tape member is not necessary. For this reason, a workpiece | work can be moved toward a tape member by simple structure.

  Here, the tape bonding apparatus is provided with positioning means. The positioning means can satisfactorily position the workpiece inside the vacuum chamber. For this reason, it is possible to prevent a situation in which the wafer vibrates (explodes) due to an air flow generated inside the vacuum chamber due to vacuum suction. Thereby, it is possible to prevent a situation in which, for example, the outer peripheral edge of the upper surface of the wafer contacts the tape member, the tape member is bonded to the workpiece in an abnormal state, wrinkles, etc. It is possible to prevent the occurrence of bubbles or the entry of bubbles between the workpiece and the tape member. Therefore, it becomes possible to adhere | attach the tape member with respect to a workpiece | work more favorably.

  Further, in addition to the above-described invention, in another invention, the elastic sheet member is a rubber sheet, and the positioning means is a rubber protrusion provided in a state protruding from the surface of the rubber sheet. .

  In such a configuration, since the elastic sheet member is a rubber sheet, the rubber sheet is inflated to the vacuum chamber side by changing various pressures in the vacuum chamber and the air introduction part, or conversely the vacuum chamber side It is possible to easily perform the operation of returning from the state of swelling. As a result, the workpiece can be easily bonded to the tape member. Further, the outer peripheral edge portion of the work comes into contact with the outer peripheral portion of the rubber projection, and the work is positioned and fixed on the rubber sheet. For this reason, it can prevent that malfunctions, such as a damage | wound producing in the outer periphery part of a workpiece | work, arise. In addition, since the workpiece can be directly placed on the rubber sheet, even when the workpiece is warped, the rubber sheet can be made to follow the warpage of the workpiece. Thereby, compared with the case where a workpiece | work is hold | maintained using a rigid jig | tool, a workpiece | work can be hold | maintained uniformly and it becomes possible to adhere | attach the workpiece | work with respect to a tape member favorably.

  Furthermore, in another aspect of the present invention, there is provided a tape bonding apparatus for bonding a tape member to a work, an elastic sheet member on which the work is placed on an upper surface, and an upper surface of the elastic sheet member. The vacuum chamber to be partitioned, located on the lower surface side of the stretchable sheet member, and the air introducing portion partitioned by the stretchable sheet member, located on the lower surface side of the stretchable sheet member and not interfering with the air introducing portion, A mounting portion on which the stretchable sheet member is placed, a holding member that holds the stretchable sheet member in a state of preventing air conduction to the vacuum chamber, and a tape member above the work placed on the stretchable sheet member The tape holding means for holding the tape, the tip portion is provided in the vacuum chamber so as to be able to appear, the cutting means for cutting the tape member, and the vacuum chamber for vacuum suction First suction means, second suction means for vacuum suction of the air introduction part, and air introduction means for introducing air into the air introduction part, and the tape member is formed by the tip of the cutting means, It is provided so that it can cut | disconnect along the outer periphery part of a workpiece | work.

  When comprised in this way, a workpiece | work is mounted in the upper surface of an expansion-contraction sheet member, and a tape member is hold | maintained by the tape holding means on the upper part. In this state, the first suction unit and the second suction unit are operated to evacuate the vacuum chamber and the air introduction unit. Thereafter, the air introduction means is operated to introduce air into the air introduction unit. Then, due to the differential pressure between the vacuum chamber in which the vacuum state is maintained and the air introduction portion into which air is introduced, the stretchable sheet member whose boundary portion is sealed with the holding member is placed inside the vacuum chamber. Inflates towards. By this expansion, the stretchable sheet member lifts the workpiece, and the workpiece contacts the tape member.

  When the stretchable sheet member is further expanded from that state, the tape member can be favorably pressed against the entire surface of the workpiece and bonded. As described above, by placing the work on the upper surface of the stretchable sheet member and expanding the stretchable sheet member, the tape member can be adhered to the work while preventing the entry of bubbles. In such adhesion, it is possible to remove the influence of the slackness of the elastic sheet member as compared with the case where the work is positioned on the lower surface of the elastic sheet member. Further, since the expansion of the elastic sheet member is used, a special configuration for moving the workpiece toward the tape member is not necessary. For this reason, a workpiece | work can be moved toward a tape member by simple structure.

  Here, by using the cutting means, it is possible to cut the tape member protruding from the outer peripheral edge of the workpiece after the tape member is bonded to the workpiece. For this reason, after the tape member is bonded to the workpiece, it is not necessary to separately cut the protruding portion of the tape member outside the tape bonding apparatus, and the number of steps can be reduced.

  In another invention, in addition to the above-described invention, the tape member is formed by stretching a resin into a sheet shape, and the cutting means heats the contact portion when contacting the tape member. The tape member is thermally cut by being melted by.

  When comprised in this way, the part which protrudes from the outer peripheral edge part of a workpiece | work among tape members can be cut | disconnected by thermal cutting. Therefore, no chips or the like are generated as compared with the cutting by pressing the blade. That is, when adopting a method of cutting by pressing the blade, if fine chips or the like are generated from the cut portion of the tape member and the chips or the like adhere to the workpiece, the post-processing of the workpiece is defective. It causes and is not preferable. However, the cause of the defect can be removed by cutting the tape member by thermal cutting. Further, when cutting the tape member by pressing the blade, the cutting edge of the blade is always required to be sharp, and it is necessary to replace the blade due to wear. However, when the cutting means incorporates a heater, the cutter is not required to be sharp, and therefore it is possible to suppress the occurrence of problems such as wear.

  According to another aspect of the present invention, there is provided a tape bonding apparatus for bonding a tape member to a work, an elastic sheet member on which the work is placed on an upper surface, and an upper surface side of the elastic sheet member. The vacuum chamber to be partitioned, located on the lower surface side of the stretchable sheet member, and the air introducing portion partitioned by the stretchable sheet member, located on the lower surface side of the stretchable sheet member and not interfering with the air introducing portion, A mounting portion on which the stretchable sheet member is placed, a holding member that holds the stretchable sheet member in a state of preventing air conduction to the vacuum chamber, and a tape member above the work placed on the stretchable sheet member A tape holding means for holding the tape member, a tape peeling means for peeling the tape member in the vacuum chamber from the workpiece to which the tape member has already been bonded, and the interior of the vacuum chamber A first suction means for vacuum suction are those comprising a second suction means for vacuum sucking the air inlet portion, and an air introduction means for introducing air into the air inlet portion.

  When comprised in this way, a workpiece | work is mounted in the upper surface of an expansion-contraction sheet member, and a tape member is hold | maintained by the tape holding means on the upper part. In this state, the first suction unit and the second suction unit are operated to evacuate the vacuum chamber and the air introduction unit. Thereafter, the air introduction means is operated to introduce air into the air introduction unit. Then, due to the differential pressure between the vacuum chamber in which the vacuum state is maintained and the air introduction portion into which air is introduced, the stretchable sheet member whose boundary portion is sealed with the holding member is placed inside the vacuum chamber. Inflates towards. By this expansion, the stretchable sheet member lifts the workpiece, and the workpiece contacts the tape member.

  When the stretchable sheet member is further expanded from that state, the tape member can be favorably pressed against the entire surface of the workpiece and bonded. As described above, by placing the work on the upper surface of the stretchable sheet member and expanding the stretchable sheet member, the tape member can be adhered to the work while preventing the entry of bubbles. In such adhesion, it is possible to remove the influence of the slackness of the elastic sheet member as compared with the case where the work is positioned on the lower surface of the elastic sheet member. Further, since the expansion of the elastic sheet member is used, a special configuration for moving the workpiece toward the tape member is not necessary. For this reason, a workpiece | work can be moved toward a tape member by simple structure.

  Here, a tape peeling means for peeling the tape member is provided. For this reason, for example, when the tape member has already been affixed to the workpiece and the separate processing has already been completed and the tape member needs to be peeled off from the workpiece, the workpiece can be easily removed. Further, since the tape member is peeled inside the vacuum chamber, the tape member is removed from the work in a state where the first suction means and the second suction means are operated to vacuum-suck the inside of the vacuum chamber or the like. If it peels off, it can prevent that dust adheres to the surface of a workpiece | work by the static electricity which arises in the case of the peeling. Accordingly, it is possible to prevent a problem from occurring due to the adhesion of dust in a subsequent process performed after the tape member is peeled off.

  Furthermore, in addition to the above-mentioned inventions, in another invention, the tape member is an ultraviolet curable tape, and the tape peeling means includes ultraviolet irradiation means for irradiating the tape member with ultraviolet rays. .

  When comprised in this way, an ultraviolet-ray is irradiated with respect to the workpiece | work affixed on the tape member. As a result, the ultraviolet curable tape member is cured and is easily peeled off from the workpiece. For this reason, it becomes possible to easily perform the peeling operation of the tape member inside the tape bonding apparatus.

  According to another aspect of the present invention, there is provided a tape adhering method for adhering a tape member to a work, a tape holding step for holding the tape member located on the upper side of the work by a tape holding means, and a work piece on the upper surface of the elastic sheet member. And the vacuum chamber located on the upper surface side of the elastic sheet member is vacuum-sucked by the first suction means in a state where the tape member is stretched and positioned on the upper part of the workpiece by the tape holding means. The vacuum chamber and the air introduction part are set by a suction step in which the air introduction part which is partitioned from the vacuum chamber by the elastic sheet member and is vacuum-suctioned by the second suction means is located on the lower surface side of the elastic sheet member, and the suction step A vacuum degree detection step for detecting that the vacuum degree reached has been reached, and a vacuum degree set by the vacuum degree detection step. After detecting this, the vacuum suction of the air introduction unit is stopped by stopping the operation of the second suction unit, and the air introduction step of operating the air introduction unit to introduce air into the air introduction unit, and the air introduction step Thereafter, the expansion sheet member is expanded toward the inside of the vacuum chamber, and the expansion step of the expansion sheet member lifts the workpiece toward the tape member to be bonded to the tape member. A cutting step of cutting a portion protruding from the surface of the workpiece of the tape member bonded to the workpiece using a cutting means.

  When configured in this manner, in the tape holding step, the tape member is held by the tape holding means, and in the suction step, vacuum suction of both the vacuum chamber and the air introduction unit is performed. After the suction step, the arrival of the vacuum level is detected in the vacuum level detection step. Then, when it is detected that the set degree of vacuum has been reached, the air introduction unit is operated in the air introduction step to introduce air into the air introduction unit. Thereby, the elastic sheet member starts to expand toward the vacuum chamber side that is the upper surface side thereof. Thereafter, an adhesion step is started, and the work is lifted by the expansion of the stretchable sheet member and bonded to the tape member. If such expansion is continuously performed for a predetermined time, the tape member is bonded over the entire surface of the workpiece by continuing the expansion. After this adhesion, in the cutting step, the portion of the tape member that protrudes from the work is cut using a cutting means.

  For this reason, after the tape member is bonded to the workpiece, it is not necessary to separately cut the protruding portion of the tape member outside the tape bonding apparatus, and the number of steps can be reduced.

  According to the present invention, the tape member can be more favorably bonded to the work while removing the slack of the elastic sheet member such as a rubber sheet on which the work is placed. Further, it is possible to easily peel off the tape, to prevent dust from adhering to the work, and to prevent the work from being displaced during vacuum suction.

  Hereinafter, a tape bonding apparatus 10 according to an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a plan view of the main body 20 in a state where the lid 60 shown in FIG. 2 is seen through, and shows a state where the wafer 11 is placed on the rubber sheet 25. FIG. 2 is a plan view showing a state in which the lid 60 is closed in the tape bonding apparatus 10. FIG. 3 is a side view showing a state where a part of the internal structure (rubber sheet 25 and the like) of the tape bonding apparatus 10 is transmitted. FIG. 4 is a schematic configuration diagram showing the exhaust system and the control system of the tape bonding apparatus 10 of FIG. 1 in a simplified manner.

  As shown in FIG. 1, the planar shape of the main body 20 is a square such as a substantially square. A plurality of (for example, four) support legs 21 (see FIG. 3) are attached to the bottom surface of the main body 20. As shown in FIG. 3, the tape bonding apparatus 10 includes a main body portion 20 and a lid portion 60 that is provided so as to be rotatable with respect to the main body portion 20.

  As shown in FIGS. 3 and 4, a main body upper surface portion 22 that is close to and faces the lid body portion 60 is provided in the main body portion 20. The main body upper surface portion 22 is configured to have an appropriate strength in order to receive a pressure applied during vacuum suction (particularly, a vertical load applied from the lid body 60 side). In addition, the side wall and the bottom wall that support the main body 20 and are a part of the main body 20 have a strength that can sufficiently resist the pressure applied during vacuum suction.

  As shown in FIGS. 1, 3, and 4, a seal ring 23 is attached to the outer peripheral side of the main body upper surface portion 22. The seal ring 23 is an O-ring-shaped member and abuts on a ring abutting portion 63 of the lid portion 60 described later. Thereby, the inside of the tape bonding apparatus 10 is sealed from the outside (atmosphere), and the inside of the tape bonding apparatus 10 can be vacuumed.

  Further, in the upper surface portion 22 of the main body, a mounting portion 22b is provided (see FIG. 4) on the central portion side (see FIGS. 1 and 4; hereinafter referred to as the inner diameter portion 22a) from the seal ring 23. The placement portion 22b is a portion for placing a rubber sheet 25 described later. In addition, even when the upper side (the lid body 60 side) is sucked and exhausted, the mounting portion 22b has a sufficient thickness to prevent the upper portion from bending.

  A hole 24 (see FIGS. 4 and 6) is provided in a substantially central portion of the mounting portion 22b. An air pipe 38 to be described later is fitted into the hole 24. Then, it is possible to suck air present in the air introduction part 51 described later or supply air to the air introduction part 51 through the air pipe 33. For this reason, the hole portion 24 is covered with the rubber sheet 25.

  In FIG. 4, FIG. 6, and the like, the air introducing portion 51 is a portion surrounded by the rubber sheet 25 and the opening 39 in the hole 24. However, when the rubber sheet 25 expands toward the upper bottom surface 64a, the area of the air introduction part 51 is also enlarged, and not only the part surrounded by the hole 24 and the opening part 39, but also the upper surface of the placement part 22b and the rubber The part surrounded by the sheet 25 also becomes the air introduction part 51.

  In the following description, a space surrounded by the seal ring 23, the ring contact portion 63, the inner diameter portion 22a, and the rubber sheet 25 is referred to as a vacuum chamber 50.

  Moreover, the mounting part 22b is provided with a rubber sheet 25 as an elastic sheet member so as to cover the hole part 24. The rubber sheet 25 is a member on which the wafer 11 as a work is mounted. As will be described later, when the rubber sheet 25 is expanded upward in a state where the wafer 11 is mounted on the rubber sheet 25, the wafer 11 rises toward the tape member 12 described later.

  The rubber sheet 25 is made of a material that can reduce the generation of bubbles, such as EPT rubber (Ethylene-Propylene Terpolymer Rubber) or chloroprene. However, the material of the rubber sheet 25 is not limited to such EPT rubber and chloroprene, and normal natural rubber or synthetic rubber may be used. A preferable material for the rubber sheet 25 is a material that can prevent the generation of bubbles, such as the above-mentioned EPT rubber and chloroprene.

  In the present embodiment, the diameter of the wafer 11 mounted on the upper surface of the rubber sheet 25 is 12 inches. However, the size of the wafer 11 is not particularly limited, and may be other sizes such as an 8-inch wafer and a 6-inch wafer. When the size of the wafer 11 is changed, the size of other members (rubber sheet 25, pressing ring 26, etc.) is also changed accordingly. However, for bonding to a small-sized wafer 11 such as an 8-inch wafer, for example, a tape bonding apparatus 10 that supports bonding of a 12-inch wafer 11 may be used. In this case, it is preferable to use a jig as will be described later.

  As shown in FIGS. 1 and 5, a pressing ring 26 as a holding member is attached to the outer peripheral edge of the rubber sheet 25 and has a substantially ring-like appearance. The pressing ring 26 is for pressing the rubber sheet 25. The pressing ring 26 is pressed against the inner diameter portion 22a from above by, for example, a screw 26a (see FIG. 1), and is fixed at an appropriate interval along the circumferential direction. Note that when the screw 26 a is fixed, the screw 26 a passes through the rubber sheet 25. Therefore, a hole corresponding to the through hole of the screw 26a may be formed in the rubber sheet 25 in advance.

  Further, as shown in FIG. 4, in order to vacuum-suck the vacuum chamber 50, an end portion side of the air duct 33 is disposed inside the vacuum chamber 50. One end 33a of the air pipe 33 is branched into four (FIG. 4 shows only two because of the cross-sectional view). And the opening part 34 of each branched air pipe 33 exists in the inside of the vacuum chamber 50, as shown in FIG. In the present embodiment, the openings 34 are arranged at intervals of approximately 90 degrees in the plan view shown in FIG. The opening 34 is an inner diameter portion 22 a that is the inner side of the seal ring 23, and exists between the pressing ring 26 and the seal ring 23. However, the position of the opening 34 is not limited to this part, and may be provided, for example, at a part that reaches the upper side of the pressing ring 26.

  Further, the air duct 33 passes through the inner diameter portion 22a, and merges from the branched state into one below the main body portion 20 or outside the main body portion 20 (see FIG. 4). Further, the other end portion 33 b of the air duct 33 protrudes downward from the bottom wall 22 c of the main body upper surface portion 22. Then, one end portion of the tube member 35 is connected to the other end portion 33 b, and the other end portion 35 b of the tube member 35 is connected to the vacuum pump 36. Accordingly, when the vacuum pump 36 is activated, the vacuum chamber 50 can be vacuumed.

  A first valve member 37 is provided in the middle of the pipe member 35. The first valve member 37 can be switched so as to communicate with the vacuum pump 36 in order to vacuum the inside of the vacuum chamber 50 (hereinafter, this switching is referred to as switching to the suction side). In addition, it is possible to switch to open to the atmosphere introduction side (switching to the protruding tube portion 35a side in FIG. 4; this switching is hereinafter referred to as switching to the atmosphere introduction side). When the tube member 35 is opened to the atmosphere introduction side by switching the first valve member 37, the atmosphere is introduced into the vacuum chamber 50 through the tube member 35. Further, as the first valve member 37, for example, an electromagnetic valve that can be opened and closed by a solenoid can be used, but a system that opens and closes using another driving source such as a motor may be used.

  Further, the vacuum pump 36 is provided outside the main body 20 in the present embodiment. However, a configuration in which the vacuum pump 36 is built in the main body 20 may be adopted. The vacuum pump 36, the air pipe 33, the pipe member 35, the first valve member 37 and the like constitute a first suction means. The first valve member 37, the air pipe 33, the pipe member 35, the protruding pipe portion 35a, etc. constitute a second air introduction means.

  The vacuum pump 36 and the first valve member 37 are connected to a control device 90 to be described later, and operate after receiving a signal corresponding to a control command from the control device 90.

  As shown in FIGS. 4 and 6, an air duct 38 similar to the above-described air duct 33 is provided so as to face the back side of the rubber sheet 25. Unlike the air pipe 33, only one air pipe 38 is provided so as to be inserted through the hole 24 described above. In addition, the opening 39 of the air duct 38 exists inside the hole 24 (see FIG. 6). In the present embodiment, since the hole portion 24 is located at the center of the inner diameter portion 22a, the opening 39 is also located at the center of the inner diameter portion 22a.

  Similarly to the air pipe 33 described above, the other end 38b of the air pipe 38 protrudes downward from the bottom wall 22c of the main body upper surface portion 22, and the other end 38b One end side of the tube member 40 is connected. The other end of the tube member 40 is connected to the vacuum pump 36. Thereby, when the vacuum pump 36 is operated, the air introduction part 51 can be vacuumed.

  A second valve member 41 is also provided in the middle of the pipe member 40. Similarly to the first valve member 37 described above, the second valve member 41 can be switched so as to communicate with the vacuum pump 36 side (switch to the suction side), and via the protruding pipe portion 40a. Can be switched to open to the atmosphere introduction side. When the tube member 40 is opened to the atmosphere introduction side by switching the second valve member 41, the atmosphere is introduced into the air introduction portion 51 through the tube member 40. The second valve member 41 is also electrically connected to the control device 90.

  The vacuum pump 36, the second valve member 41, the air pipe 38, and the pipe member 40 constitute a second suction unit. The second valve member 41, the air pipe 38, the pipe member 40, the protruding pipe portion 40a, and the like constitute an air introduction means.

  Furthermore, as shown in FIG. 4, a tube member 42 similar to the above-described tube members 35 and 40 is provided inside the main body 20. For example, the pipe member 42 faces the rear end side (the hinge 61 side) of the main body portion 20, and one end side 42 a protrudes from the back surface of the main body portion 20. A pipe joint may be attached to one end side 42 a of the pipe member 42. One end side 43 a of a hose 43 that can be bent flexibly is connected to one end side 42 a of the pipe member 42. The hose 43 extends from the main body portion 20 toward the upper lid portion 60 side, and from the hinge 61 side toward the front side (the handle 73a side shown in FIGS. 1 and 2), the upper surface of the lid portion 60. It is provided along the side. The other end side 43 b of the hose 43 is connected to one end side of an air pipe 67 described later at a substantially central portion in the radial direction of the upper surface of the lid body 60.

  As described above, since the hose 43 that bends flexibly is provided between the pipe member 42 and the air pipe 67, the lid body 60 can be opened and closed (rotated).

  In addition, a third valve member 44 similar to the first valve member 37 and the second valve member 41 described above is provided in the middle portion of the pipe member 42. The third valve member 44 can also be switched so as to communicate with the vacuum pump 36 side (switch to the suction side) and can be switched to open to the atmosphere introduction side via the protruding pipe part 42b. It is. When the tube member 42 is opened to the atmosphere introduction side, the atmosphere is introduced to the back surface side of the tape member 12 (the upper surface side of the tape member 12 in FIG. 4) via the tube member 42. Thereby, the holding state of the tape member 12 is released. The third valve member 44 is also electrically connected to the control device 90.

  The vacuum pump 36, the pipe member 42, the hose 43, the third valve member 44, and the air pipe 67 constitute a third suction means. In addition, a tape holding unit is configured by the adsorption member 66, the vacuum pump 36, the pipe member 42, the hose 43, the third valve member 44, the air pipe 67, and the clamping member 70 which will be described later.

  Here, in the present embodiment, as described above, by using the flexible hose 43, the suction force generated by the vacuum pump 36 is transmitted to the lid body 60 side, and the lid body 60 is opened and closed (rotated). ). However, the configuration for transmitting the suction force generated by the vacuum pump 36 to the lid body 60 side is not limited to that using the hose 43. For example, a configuration in which a member such as a hose 43 for vacuum suction does not protrude outside from the tape bonding apparatus 10 may be desired.

  In such a case, for example, a lid side opening is formed in the ring contact portion 63 of the lid body portion 60, and a main body side opening is formed in a portion of the main body upper surface portion 22 facing the lid side opening. Together with these, a ring-shaped rubber seal is attached to protrude around at least one of the lid side opening or the main body side opening. Further, one end side of the tube member is connected to the lid side opening, and the other end side of the tube member is communicated with the recess 64. In addition, an air duct similar to that described above is provided in the main body side opening. If it does in this way, when the cover part 60 is closed, a pipe member and an air pipe line will be connected. Further, the rubber seal is interposed between the ring contact part 63 and the main body upper surface part 22 so that both the lid side opening and the main body side opening are airtightly closed.

  Further, among the portions where the main body portion 20 and the lid portion 60 face each other, a bendable and extendable bellows-like pipe joint is provided at a portion where the hinge 61 exists, and the main body portion is provided via this pipe joint. You may make it connect the pipe member provided in the inside of 20 and the air pipe line which advances the inside of the cover body part 60. FIG.

  In the present embodiment, only one vacuum pump 36 is provided. Further, by switching the first to third valve members 37, 41, 44 to the atmosphere introduction side and the suction side, at least one of the vacuum chamber 50, the air introduction part 51, and the back surface side (upper surface side) of the tape member 12. Two vacuum suction and atmospheric pressure are possible.

  However, the number of vacuum pumps 36 is not limited to one, and two or three vacuum pumps 36 are provided corresponding to each of the first suction means, the second suction means, and the third suction means. You may be the structure provided so. Further, without using three-way valves such as the first valve member 37, the second valve member 41, and the third valve member 44, both the suction side valve member and the atmosphere introduction side valve member are connected to the respective pipe members. 35, the pipe member 40 and the pipe member 42 may be provided. Even in this case, it is possible to satisfactorily switch the suction / non-suction of the vacuum chamber 50, the air introduction part 51, and the back surface side (upper surface side) of the tape member 12.

  Further, as shown in FIG. 3, a vacuum gauge 45 is attached to the outer surface of the side wall of the main body 20. In this embodiment, two vacuum gauges 45 are provided. However, in the present embodiment, it is preferable to provide three in accordance with the number of the pipe members 35, 40, and 42. One of the vacuum gauges 45 is for measuring the atmospheric pressure inside the vacuum chamber 50 (hereinafter referred to as a vacuum gauge 45a as necessary). The other one of the vacuum gauges 45 is for measuring the atmospheric pressure of the air introduction part 51 (hereinafter referred to as a vacuum gauge 45b as necessary). The two vacuum gauges 45a and 45b are also connected to the control device 90.

  In addition, a sensor 46 is provided in one corner portion 22 d (see FIG. 1) of two upper corner portions of the main body upper surface portion 22 that are, for example, farthest from a hinge 61 described later. The sensor 46 uses, for example, a magnetic sensor, and detects whether or not the lid body portion 60 is closed until it approaches the main body portion 20 by a predetermined distance. The sensor 46 is also connected to the control device 90 and transmits a detection signal indicating whether or not the lid 60 is closed to the control device 90. And the control apparatus 90 transmits the signal corresponding to an action | operation with respect to the vacuum pump 36 etc., only when the detection signal corresponding to the state which the cover body part 60 is closed is received.

  Next, the configuration of the lid body 60 will be described. As shown in FIGS. 1, 2, and 5, the lid body portion 60 is connected to the main body portion 20 via a hinge 61. That is, with the hinge 61 as a fulcrum, the lid body 60 is rotatable. Further, as shown in FIG. 1, one end side 62 a of two damper members 62 is attached to the lid portion 60. Further, each other end 62 b of the damper member 62 is attached to the main body upper surface portion 22. The damper member 62 is extendable and prevents the lid body portion 60 from being suddenly lowered with respect to the main body portion 20 due to the viscous resistance of a viscous body (oil or the like) existing inside. .

  The damper member 62 also incorporates a spring member (not shown), and can maintain a state in which the lid 60 is open (for example, the state shown in FIG. 7A). However, when it is not necessary to maintain the state where the lid 60 is open, the spring member may be omitted.

  Further, as shown in FIGS. 3 and 4, a portion of the lid 60 that contacts the seal ring 23 of the main body 20 is a ring contact portion 63. The ring contact portion 63 seals the vacuum chamber 50 by contact with the seal ring 23. In addition, in order to make this sealing favorable, the ring contact part 63 is comprised from the flat part which makes the same plane in this Embodiment.

  As shown in FIGS. 3 to 5, a concave portion 64 is formed in a portion of the lid body portion 60 that faces the main body portion 20 and is located on the inner diameter side of the ring contact portion 63. . The concave portion 64 is formed in a state that is recessed from the ring contact portion 63. The concave portion 64 has a size corresponding to the above-described inner diameter portion 22a. For this reason, when the lid 60 is closed and the seal ring 23 comes into a sealed state where the seal ring 23 comes into contact with the ring contact portion 63, the space surrounded by the recess 64, the seal ring 23, the inner diameter portion 22a, and the rubber sheet 25 is formed. Appear. This space becomes the vacuum chamber 50.

  In addition, a bottom surface (hereinafter referred to as an upper bottom surface 64a) of the concave portion 64 is a portion that suppresses (accepts) the peripheral edge of the tape member 12 from moving upward when the rubber sheet 25 expands. It becomes. For this reason, the recess 64 is set to a depth at which the peripheral edge of the tape member 12 is received and the tape member 12 can be favorably bonded to the wafer 11.

  The recess 64 is provided with a fitting recess 65. The fitting recess 65 is a portion that is recessed from the recess 64 toward the upper surface side, and is provided with a smaller diameter than the recess 64. An adsorption member 66 made of a porous material such as porous ceramics is fitted into the fitting recess 65. The tape member 12 is sucked and held through the suction member 66. The adsorption member 66 has a size slightly smaller than that of the fitting recess 65 corresponding to the fitting into the fitting recess 65.

  As shown in FIGS. 4 and 6, the lid body 60 is provided with an air pipe 67. The air pipe 67 is provided so that its cross-sectional shape is substantially L-shaped. Thereby, one end side of the air duct 67 is provided in a state along the upper surface of the lid part 60, and the other end side of the air duct 67 penetrates the lid part 60 and reaches the fitting recess 65. It is provided in the state to do. In addition, the part opened with respect to the fitting recessed part 65 among the other end side of the air pipe line 67 is set as the opening part 68. FIG. Further, in the present embodiment, a fixing member 67a is provided on the upper surface of the lid body portion 60, and the air duct 67 is attached to the upper surface of the lid body portion 60 via the fixing member 67a. Yes.

  Here, the fitting recess 65 is preferably provided with a recess 69 that is slightly recessed from the upper bottom surface 65a of the fitting recess 65. In this case, the recess 69 has a shape having a diameter smaller than the diameter of the fitting recess 65, and the outer peripheral portion of the adsorption member 66 is received by the upper bottom surface 65 a of the fitting recess 65 other than the recess 69. When the dent 69 is present, the negative pressure generated between the dent 69 and the suction member 66 is increased in area. Therefore, the adsorption member 66 can be adsorbed to the wafer 11 in a large area state.

  As shown in FIGS. 3, 5, and 8, a clamping member 70 for fixing the corner of the tape member 12 is provided outside the fitting recess 65 and inside the recess 64. Yes. As shown in FIG. 5, the clamping member 70 includes a leaf spring 71, and one end side of the leaf spring 71 is attached to the recess 64 by a screw 72. The other end side of the leaf spring 71 is pressed against the upper bottom surface 64 a by the urging force, but the other end side of the leaf spring 71 can be opened while resisting the urging force of the leaf spring 71. In the present embodiment, four clamping members 70 are provided at intervals of approximately 90 degrees in the circumferential direction of the recess 64.

  A handle 73 a is attached to a portion of the side wall portion of the lid body 60 that faces the hinge 61. Therefore, the operator can easily open and close the lid 60 by grasping the handle 73a. In addition, a total of four handles 73b are provided on the side wall portion of the main body 20 so as to face each other. By holding this handle 73b, the tape bonding apparatus 10 can be easily moved.

  As shown in FIGS. 2, 8, and 9, the tape bonding apparatus 10 is provided with a lock mechanism 80 as an opening / closing lock means. The lock mechanism 80 includes a block portion 81 attached to the main body portion 20 side. The block portion 81 is provided with a screw hole 82, and the screw portion 84 of the lever member 83 is screwed into the screw hole 82. The lever member 83 includes a screw portion 84 and a grip portion 85 that protrudes in a direction deviating from the axis of the screw portion 84.

  Among these, the screw portion 84 is formed with a screw thread for screwing into the screw hole 82. A clamp member 86 is inserted into the screw portion 84. The grip 85 is a portion gripped by the operator, and the lever member 83 can be rotated by the grip.

  The clamp member 86 inserted through the screw portion 84 is a rectangular parallelepiped member, and is provided so as to be rotatable with respect to the screw portion 84. The longitudinal direction of the clamp member 86 can be arranged so as to be perpendicular to the side edge direction of the lid body portion 60. In this case, the clamp member 86 reaches the upper portion of the lid body portion 60, and the lid body. The opening of the part 60 is prevented. Further, the clamp member 86 may be arranged so that the length of the clamp member 86 is parallel to the side edge direction of the lid body portion 60. In this case, the clamp member 86 does not reach the upper portion of the lid body portion 60, and the lid The body part 60 is allowed to be opened.

  In the present embodiment, a bolt 87 is attached to a portion of the lid 60 that faces the clamp member 86, and the clamp member 86 is in contact with the bolt 87. .

  Further, as shown in FIG. 4, the tape bonding apparatus 10 is provided with a control device 90 as control means. As described above, the control device 90 is electrically connected to the vacuum pump 36, the first to third valve members 37, 41, 44, the vacuum gauge 45, and the sensor 46. The control device 90 is connected to an operation button (not shown) for performing an ON operation. For this reason, when the operator pushes the operation button in the closed state of the lid portion 60 that permits the sensor 46 to be turned on, the vacuum pump 36 is activated.

  Here, the control device 90 first switches the second valve member 41 and the third valve member 44 to the suction side and maintains the state in which the first valve member 37 is switched to the atmosphere introduction side, A control signal is issued to each of the first to third valve members 37, 41, and 44 so as to vacuum-suck the rubber sheet 25 and the wafer 11 only for a period of time. Then, after a predetermined time has elapsed, a control signal is issued to the first valve member 37, the first valve member 37 is switched from the atmosphere introduction side to the suction side, and vacuum suction is performed also to the vacuum chamber 50. .

  Further, the control device 90 switches the second valve member 41 to the atmosphere introduction side when the sensor 46 measures that the vacuum chamber 50 and the air introduction unit 51 have reached a predetermined degree of vacuum. A control command is issued. As a result, the rubber sheet 25 expands and adhesion between the wafer 11 and the tape member 12 is started. Furthermore, after a predetermined time has passed from this state and the bonding is completed, the control device 90 issues a control command for switching the first valve member 37 to the atmosphere introduction side. By such switching, both the vacuum chamber 50 and the air introduction part 51 are in a state equal to the atmospheric pressure, and the bonding operation is completed.

  Further, the control device 90 reversely rotates the vacuum pump 36 and switches the first valve member 37 or the third valve member 44 to the same side as the suction side. Thereby, air is introduced into the vacuum chamber 50 in a pressurized state. In addition, the pipe member connected to the discharge side of the vacuum pump 36 and the pipe member capable of introducing the air separately connected to the inflow side of the vacuum pump 36 without adopting the configuration for rotating the vacuum pump 36 in the reverse direction. You may comprise so that the pressurization state inside the vacuum chamber 50 may be implement | achieved by switching the connection between these.

  An example of the above-mentioned predetermined degree of vacuum is about 20 Pa. However, the predetermined degree of vacuum is not limited to this, and may be any degree of vacuum as long as it is lower than atmospheric pressure. In addition, the controller 90 issues a control command to the vacuum pump 36 so as to stop the vacuum pump 36 together with an operation of switching the first valve member 37 to the atmosphere introduction side after the bonding is completed. It may be configured. However, in this case, the suction time for the next vacuum suction is somewhat longer than when the vacuum pump 36 is kept operating.

  The operation (operation) of the tape bonding apparatus 10 having the above configuration will be described below. This action (operation) is executed based on the operation flow shown in FIG.

  First, the operator opens the lid body 60, places the wafer 11 on the rubber sheet 25, and attaches the tape member 12 to the clamping member 70 (step S10). In this case, the tape member 12 is held between the leaf spring 71 and the upper bottom surface 64a. As a result, the back surface of the tape member 12 comes into contact with the adsorption member 66 and the adhesive surface (front surface) of the tape member 12 faces downward.

  When the tape member 12 is attached by the clamping member 70, the vacuum pump 36 may be operated. When the vacuum pump 36 is operated in the open state of the lid 60, the suction holding force is transmitted to the adsorption member 66 through the tube member 42 and the air pipe 67. As a result, the tape member 12 is sucked and held by the suction member. Then, the suction and holding of the tape member 12 brings the tape member 12 into a state in which no wrinkles exist in the opened state of the lid portion 60.

  Next, the lid body portion 60 is lowered relative to the main body portion 20 until the sensor 46 detects that the lid body portion 60 is closed (step S11). And the control apparatus 90 judges whether the sensor 46 detected the obstruction | occlusion state of the cover body part 60 by this fall (step S12). When the sensor 46 detects the closed state, the control device 90 permits the operation of the vacuum pump 36. In this state, when the operator presses the operation button, the vacuum pump 36 starts operating.

  In addition, after the lid 60 is in the closed state, the operator rotates the clamp member 86 so that the distal end portion of the clamp member 86 reaches the upper surface of the lid 60. Thereafter, the operator grips the lever member 83, rotates the lever member 83 in the closing direction, and makes the lower surface of the clamp member 86 contact the bolt 87. In this contact state, when the lever member 83 is further rotated in the closing direction, the lid body portion 60 is pressed by the clamp member 86 and the ring contact portion 63 is pressed against the seal ring 23. In addition, when rotating the lever member 83, it is preferable to rotate all the lever members 83 little by little sequentially so that the biased state does not occur.

  When the lever member 83 is closed and rotated by a predetermined amount, the seal ring 23 is pressed and elastically deformed by the ring contact portion 63, and the inside of the vacuum chamber 50 is airtightly closed from the outside (step S13). . As described above, when the opening of the lid body 60 is locked by the lock mechanism 80, even if the inside of the vacuum chamber 50 is pressurized, the lid body 60 is not lifted and opened, and the vacuum chamber 50 is sealed from the outside. Can be stopped.

  Next, when the operator presses the operation button, the control device 90 detects the pressing and issues a command for operation to the vacuum pump 36. Thereby, the vacuum pump 36 is operated to perform vacuum suction of the vacuum chamber 50, the tape member 12, and the rubber sheet 25 (corresponding to the suction step). Note that, when the tape member 12 is sucked and held in the opened state of the lid body 60, the sucking and holding is continued. When the above-described vacuum pump 36 is operated, the second valve member 41 and the third valve member 44 are initially switched to the suction side, and the first valve member 37 is switched to the atmosphere introduction side, so that the tape member 12 and the rubber sheet 25 are vacuumed first (step S14).

  Then, after vacuum suction of the tape member 12 and the rubber sheet 25 is performed for a predetermined time, the first valve member 37 is switched from the air introduction side to the suction side, and together with the tape member 12 and the rubber sheet 25, Vacuum suction is performed (step S15).

  When the vacuum pump 36 performs vacuum suction for a predetermined time, the vacuum gauge 45 detects that the vacuum chamber 50 and the back side of the rubber sheet 25 have reached a predetermined vacuum level (step S16; vacuum level detection step). Corresponding). When the vacuum gauge 45 detects a predetermined degree of vacuum, a predetermined detection signal is transmitted to the control device 90. Then, the control device 90 switches the second valve member 41 to the atmosphere introduction side while maintaining the operation of the vacuum pump 36 (step S17; corresponding to the air introduction step). Thereby, the air is introduced into the air introduction part 51 through the protruding pipe part 40a.

  When the atmosphere is introduced into the air introduction part 51, the rubber sheet 25 expands toward the vacuum chamber 50 due to the pressure difference existing in the vacuum chamber 50 and the air introduction part 51. In this case, the wafer 11 is lifted by the expansion of the rubber sheet 25, and the upper surface of the wafer 11 contacts the tape member 12. Then, adhesion of the tape member 12 to the upper surface of the wafer 11 is started (step S18; corresponding to the adhesion step).

  Here, there are two types of bonding between the upper surface of the wafer 11 and the tape member 12 as shown in FIGS. 11 (a) and 11 (b). First, as shown in FIG. 11A, the wafer 11 is maintained parallel to the tape member 12 without being inclined as shown in FIG. In this case, the tape member 12 is bonded.

  In this case, when the wafer 11 is lifted by the expansion of the rubber sheet 25, the wafer 11 comes into contact with the tape member 12 that has been loosened by being held by the suction member 66 from the center portion of the wafer 11. When the rubber sheet 25 further expands from this contact state, the central portion of the rubber sheet 25 cannot move any further because the central portion of the wafer 11 touches the tape member 12, but the peripheral side of the rubber sheet 25 continues to expand. To move the wafer 11 in contact with the tape member 12 sequentially.

  For this reason, as the rubber sheet 25 expands, the wafer 11 is no longer bent at the peripheral portion, and the wafer 11 is sequentially bonded to the tape member 12 from the central side toward the peripheral side. In this state, when a predetermined time elapses, the bonding between the wafer 11 and the tape member 12 is reliably performed.

  In the bonding mode as described above, bonding between the upper surface of the wafer 11 and the tape member 12 is performed while air is released from the central portion of the wafer 11 (tape member 12) outward. In this bonding mode, the vacuum pump 36 continues to be in a state where the vacuum chamber 50 side is vacuum-sucked. For this reason, in combination with the above-described bonding mode, the air existing between the upper surface of the wafer 11 and the tape member 12 is excluded, so that the adhesion between the wafer 11 and the tape member 12 is in a good state. Done.

  Further, as a second mode of bonding, as shown in FIG. 11B, the highest portion of the inclined wafer 11 (with the wafer 11 inclined with respect to the tape member 12 ( Hereinafter, it is the case where it adheres to the tape member 12. In this case, first, the bonding to the tape member 12 is started from the upper end of the inclined wafer 11. That is, when the wafer 11 is lifted along with the expansion of the rubber sheet 25, adhesion is started from the upper end of the wafer 11 to the tape member 12 that has been loosened by the holding of the suction member 66.

  Here, since the tape member 12 is held by the adsorption member 66, even if the tape member 12 is pushed by the wafer 11, the tape member 12 does not move upward. Therefore, when the rubber sheet 25 is gradually expanded, the wafer 11 is lifted in a state in which the inclination angle of the wafer 11 is gradually narrowed while using the contact portion (upper end portion) of the wafer 11 as the fulcrum. The wafer 11 is lifted up until the tilt angle of the wafer 11 becomes zero. In addition, when the inclination angle of the wafer 11 becomes zero and a predetermined time elapses, the bonding between the wafer 11 and the tape member 12 is surely performed.

  In the bonding mode as described above, bonding between the upper surface of the wafer 11 and the tape member 12 is performed while air is released from the upper end of the wafer 11 (tape member 12) toward the other end. . In this bonding mode as well, the vacuum pump 36 continues to be in a state where the vacuum chamber 50 side is vacuum-sucked. For this reason, in combination with the above-described bonding mode, the air existing between the upper surface of the wafer 11 and the tape member 12 is excluded, so that the adhesion between the wafer 11 and the tape member 12 is in a good state. Done.

  As described above, the control device 90 continues the switching of the second valve member 41 to the atmosphere introduction side for a predetermined time while continuing the switching state of the first valve member 37 to the suction side (step S19). Thereby, the bonding between the wafer 11 and the tape member 12 is performed.

  Note that, when the tape member 12 is bonded to the wafer 11, the vacuum chamber 50 and the back side of the tape member 12 are finally discharged because the vacuum is simultaneously exhausted through the air conduit 38 and the air conduit 67. Are the same pressure. For this reason, when the vacuum suction proceeds, the tape member 12 is easily separated from the adsorption member 66.

  In step S19, when the control device 90 determines that the predetermined time has elapsed, the control device 90 rotates the vacuum pump 36 in the reverse direction and moves the third valve member 44 to the same side as the vacuum suction (pressure side). Switch. At the same time, the first valve member 37 and the second valve member 41 are closed.

  As a result, the tape member 12 is separated from the adsorbing member 66, and air is introduced into the vacuum chamber 50 through the air pipe 67 in a pressurized state. In this case, the expansion of the rubber sheet 25 is first released by releasing the vacuum suction of the vacuum chamber 50, and the rubber sheet 25 is placed on the placement portion 22b. Next, the vacuum chamber 50 is in a pressurized state higher than the atmospheric pressure, and the tape member 12 is pressed toward the wafer 11 and pressurized (Step S20; corresponding to the pressurized step). Such pressurization improves the adhesion between the tape member 12 and the wafer 11.

  In the present embodiment, the pressure applied to the tape member 12 and the like by pressurization is about 4 to 5 kg per cm @ 2. Further, not only the third valve member 44 but also the first valve member 37 may be switched to the same side (pressure side) as the vacuum suction. In this case, air is introduced into the vacuum chamber 50 in a pressurized state not only through the air pipe 67 but also through the air pipe 33.

  Further, when the vacuum pumps 36 are provided by the number of the first to third valve members 37, 41, 44, at least one of the vacuum pumps 36 to which the first valve member 37 and the third valve member 41 are connected. Is reversely rotated to pressurize the inside of the vacuum chamber 50. Further, the second valve member 41 is switched to the atmosphere introduction side and the vacuum pump 36 is stopped, or the second valve member 41 is switched to the vacuum suction side and the vacuum pump 36 is rotated forward so that the air introduction portion 51 is changed. Apply vacuum. In this way, the tape member 12 can be satisfactorily adhered to the wafer 11.

  When the control device 90 determines that the pressurization state in the vacuum chamber 50 has elapsed for a predetermined time, the control device 90 stops the operation of the vacuum pump 36 and causes the first to third valve members 37, 41, 44 to be in the atmosphere. Switch to the introduction side (step S21). Thereby, the back surface side of the tape member 12, the vacuum chamber 50, and the air introduction part 51 become atmospheric pressure, and the above-described pressurized state is released.

  In step S21 described above, when the first to third valve members 37, 41, and 44 are switched to the atmosphere introduction side, the operation of the vacuum pump 36 is maintained. As a result, it is possible to quickly cope with the bonding operation to the next wafer 11. However, such an operation may be stopped.

  Thereafter, the operator rotates the lever member 83 in the opening direction to open the lid body portion 60. Then, the operator releases the holding of the tape member 12 by the holding member 70 and takes out the wafer 11 with the tape member 12 adhered (step S22). As described above, the bonding of the tape member 12 to the upper surface of the wafer 11 is completed.

  In addition, after the adhesion of the tape member 12 to the upper surface of the wafer 11 is completed, the process proceeds to the next step such as a dicing process.

  According to the tape bonding apparatus 10 having such a configuration, the tape member 12 can be bonded to the upper surface of the wafer 11 by utilizing the expansion of the rubber sheet 25. For this reason, the tape member 12 can be reliably bonded to the upper surface of the wafer 11 by a pressure difference between the atmospheric pressure and the vacuum state with a simple configuration. In particular, by using the rubber sheet 25, even if the wafer 11 comes into contact with the tape member 12 in a so-called one-sided state, the posture of the wafer 11 can be easily recovered by elastic deformation of the rubber sheet 25. Can do. For this reason, the adhesiveness of the tape member 12 with respect to the upper surface of the wafer 11 can be made favorable.

  Moreover, when the above-mentioned tape bonding apparatus 10 is used, the inside of the vacuum chamber 50 can be pressurized. For this reason, the adhesiveness between the wafer 11 and the tape member 12 can be further enhanced, and the adhesion between the wafer 11 and the tape member 12 can be further ensured. For this reason, it is possible to prevent the tape member 12 from being easily detached from the wafer 11.

  Further, the wafer 11 is placed on the upper surface of the rubber sheet 25. For this reason, the influence of the slackness of the rubber sheet 25 can be removed. Thus, since the influence of slack is removed, it is not necessary to provide a structure for applying a large tension to the rubber sheet 25, and the structure can be simplified. Moreover, since the tension | tensile_strength provided to the rubber sheet 25 may be small, the man-hour of the operator who manufactures the tape bonding apparatus 10 can be reduced. Further, when the rubber sheet 25 is pressed by the pressing ring 26, the airtightness can be improved.

  Further, since the expansion of the rubber sheet 25 is used, a special configuration for moving the wafer 11 to the upper tape member 12 is not required. Therefore, the wafer 11 can be moved toward the tape member 12 (upward) with a simple configuration.

  The tape member 12 is held by suction by the suction member 66. Therefore, it is not necessary to separately provide a member for stretching the tape member 12 such as a tape frame and a means for supporting the member for stretching, and the configuration existing inside the recess 64 is simplified. be able to. Further, since the tape member 12 is adsorbed and held by the adsorbing member 66, it is not necessary to apply tension to the tape member 12, and the tape member 12 can be prevented from extending due to a tension load. Further, when the tape member 12 is held, the tape member 12 is not stretched, so that it is not necessary to apply tension to the tape member 12. For this reason, it is possible to prevent the tape member 12 bonded to the wafer 11 from contracting corresponding to the tension, and to improve the bonding state of the tape member 12.

  The adsorbing member 66 is made of porous ceramics. Therefore, the entire surface of the tape member 12 can be reliably suctioned and held. Thereby, it is possible to prevent the tape member 12 from being slackened.

  Further, the tape member 12 is clamped by the clamping member 70. Thereby, even if the inside of the vacuum chamber 50 is vacuum-sucked and no pressure difference occurs between the front surface and the back surface of the tape member 12, the tape member 12 can be prevented from falling from the adsorption member 66. Thereby, the tape member 12 can be favorably adhered to the wafer 11.

  In addition, a lock mechanism 80 is provided between the lid 60 and the main body 20. When the opening of the lid body 60 is locked using the locking mechanism 80, the lid body 60 can be prevented from being lifted and opened even when the inside of the vacuum chamber 50 is pressurized. Thereby, the vacuum chamber 50 can be sealed from the outside, and the pressurized state can be continued.

  Furthermore, the control device 90 is connected to the vacuum pump 36, the first to third valve members 37, 41, 44, the vacuum gauge 45, and the sensor 46, and can control the operations thereof. In particular, the control device 90 operates the vacuum pump 36 to perform vacuum suction of the vacuum chamber 50 and the air introduction unit 51, and after this vacuum suction, operates the second valve member 41 to the atmosphere introduction side, Air is introduced into the air introduction part 51. Thereby, the rubber sheet 25 can be expanded toward the vacuum chamber 50 side, and the tape member 12 is securely bonded to the upper surface of the wafer 11 by utilizing the expansion of the rubber sheet 25 from which the slack is removed. It becomes possible.

  Further, when performing vacuum suction of the vacuum chamber 50 and the air introduction part 51, the control device 90 switches the first valve member 37 to the atmosphere introduction side and switches the second valve member 41 to the vacuum suction side, First, the air introduction part 51 is sucked and exhausted. For this reason, the pressure of the air introduction part 51 with respect to the vacuum chamber 50 falls initially. Therefore, the rubber sheet 25 is pressed against the placement portion 22b and is prevented from expanding toward the vacuum chamber 50 first. Accordingly, it is possible to prevent the wafer 11 and the tape member 12 from being bonded before the second valve member 41 is switched to the atmosphere introduction side.

  Further, the control device 90 switches the second valve member 41 to the atmosphere introduction side and, after a predetermined time has elapsed, rotates the vacuum pump 36 in the reverse direction and moves the third valve member 44 to the same side as the vacuum suction (pressure side). ) To switch to. As a result, air is introduced into the vacuum chamber 50 in a pressurized state via the air pipe 67, and the tape member 12 is pressed toward the wafer 11. Thereby, the adhesiveness (adhesion degree) of the tape member 12 to the wafer 11 can be increased, and the tape member 12 can be prevented from being easily peeled off from the wafer 11.

(Second Embodiment)
Hereinafter, a second embodiment of the present invention will be described with reference to FIGS. FIG. 12 is a plan view of the main body 20 in a state where the tape bonding apparatus 100 according to the present embodiment is shown and the lid 60 shown in FIG. 15 is seen through. FIG. 13 is a side view of a state where a part of the internal configuration (release lever 135 and the like) of the tape bonding apparatus 100 is seen through. FIG. 14 is a front view showing the configuration of the tape bonding apparatus 100. FIG. 15 is a plan view showing a configuration centering on the lid 60 and the balancer mechanism 110 in the tape bonding apparatus 100.

  The tape bonding apparatus 100 of the present embodiment uses a glass substrate 101 as a workpiece, and bonds the tape member 12 to the upper surface of the glass substrate 101. Therefore, the basic structure of the tape bonding apparatus 100 is the same as that of the tape bonding apparatus 10 in the first embodiment described above. For this reason, the description of the same parts as those described in the first embodiment is omitted.

  The tape member 12 bonded to the glass substrate 101 in the present embodiment is an ultraviolet curable UV tape (sheet) similar to the tape member 12 in the first embodiment described above. Therefore, if the tape member 12 is bonded to the glass substrate 101 and then irradiated with ultraviolet rays, the tape member 12 is cured and easily peeled off from the glass substrate 101. However, the tape member 12 is not limited to the ultraviolet curable type, and a polarizing film may be used as the tape member 12. A polarizing plate that is functionally the same as the polarizing film may be used as the tape member 12. The glass substrate 101 is a mother glass substrate used for, for example, a liquid crystal display, a plasma display, etc., and has a large size (for example, 25 inches to 35 inches or more). However, the glass substrate 101 may have a small size. In the present embodiment, the glass substrate 101 has a rectangular planar shape. However, the glass substrate 101 may have a shape other than a rectangular shape such as a circular shape or an elliptical shape in plan view.

  As shown in FIG. 12, the planar shape of the tape bonding apparatus 100 is provided so as to form a substantially rectangular shape. That is, the main body 20, the main body upper surface portion 22, the hole portion 23, the rubber sheet 25, the lid body portion 60, the concave portion 64, etc. are formed in a substantially rectangular shape. Further, the seal ring 24, the pressing ring 26, the tape frame 28, and the like are provided in a rectangular ring shape in which a corner portion has R. Similarly, the hole 23, the recess 64, and the like are also provided in a rectangular shape with a corner portion having R.

  Also, as shown in FIG. 12, the main body 20 in the present embodiment is provided so that the overall planar shape is substantially rectangular. Therefore, the main body upper surface portion 22 and the like of the main body portion 20 are also provided so that the planar shape is substantially rectangular.

  Further, as shown in FIGS. 13 and 15 and the like, the tape bonding apparatus 100 of the present embodiment is provided with a balancer mechanism 110 that forms a part of the opening / closing auxiliary means. The balancer mechanism 110 is a mechanism for facilitating the opening and closing of the lid portion 60 having a large area and weight corresponding to the glass substrate 101 having a large area. As shown in FIG. 15, the balancer mechanism 110 is a mechanism that can attach a weight 111 to a portion on the opposite side of the lid 60 with the hinge 61 interposed therebetween. Further, the balancer mechanism 110 includes a substantially rectangular housing 112, and members such as the weight 111 and the mounting shaft 114 are accommodated in the housing 112.

  Further, as shown in FIGS. 13 and 15, the balancer mechanism 110 has an attachment fixing portion 113. The attachment fixing portion 113 is attached to a portion between the pair of hinges 61 on the upper surface side and the rear end side (side on which the hinge 61 is provided) of the lid body portion 60. An attachment shaft 114 is attached to the rear end side of the attachment fixing portion 113 (the side away from the lid body portion 60). That is, the attachment shaft 114 is attached to the lid body portion 60 via the attachment fixing portion 113. The attachment shaft 114 has a large diameter portion 114a and a small diameter portion 114b. A weight 111 can be attached to each of the large diameter portion 114a and the small diameter portion 114b.

  In addition, in the level | step-difference part 114c which exists between the large diameter part 114a and the small diameter part 114b, the weight 111 attached to the small diameter part 114b can be received. In the present embodiment, the weight 111 attached to the large diameter portion 114a is lighter than the weight 111 attached to the small diameter portion 114b. However, the weight of the weight 111 attached to the large diameter portion 114a and the small diameter portion 114b can be selected as appropriate.

  In addition, a collar 115 is attached to a portion of the large diameter portion 114a that extends from the stepped portion 114c toward the lid portion 60 by a predetermined dimension. The collar 115 is for determining the mounting position of the weight 111 described above. In addition, a collar 116 is attached to a predetermined portion of the large diameter portion 114 a closer to the lid body 60 than the collar 115. A joint pin 133 described later is locked to the collar 116. Further, on the outer peripheral surface of the collar 116, a locking pin 117 corresponding to the protruding portion protrudes toward the outer diameter side. The locking pin 117 is a part that enters a notch part 134 described later. In the present embodiment, the locking pin 117 extends in a state of being substantially parallel to the main body upper surface portion 22.

  A retaining ring 118 is attached to the tip of the small diameter portion 114b. The retaining ring 118 is a member for maintaining the attachment state without the weight 111 coming out of the attachment shaft 114 even if the attachment shaft 114 rotates as the lid 60 is opened and closed.

  Further, as shown in FIGS. 13 and 15, a support base 120 that forms a part of the opening / closing auxiliary means is provided inside the main body portion 20, and the support base 120 is inserted through the rotary shaft 122. A hole 121 is provided. The rotating shaft 122 rotatably supports the arm 130 that forms part of the opening / closing assisting means. A shaft hole 131 is formed on the lower end side of the arm 130, and a rotating shaft 122 that passes through the insertion hole 121 is inserted into the shaft hole 131. Thereby, the arm 130 is rotatably supported with respect to the support stand 120. In the present embodiment, a pair of arms 130 are provided across the center line L (see FIG. 12) of the main body 20. Therefore, a pair of support bases 120 are also provided inside the main body 20. The rotating shaft 122 has a length dimension that penetrates both of the pair of support tables 120.

  FIG. 16 is a partial side view showing a configuration near the arm 130. As shown in FIG. 16, the pair of arms 130 has an appearance in which a short piece (upper end portion in FIG. 16) of the elongated plate-like member is bent at an obtuse angle with respect to the long piece. The shaft hole 131 described above is formed on one end side (lower end side) of the arm 130, but a through hole 132 is also formed on the other end side (upper end side) of the arm 130. Here, the upper end side of the arm 130 in which the through hole 132 is provided is located above the attachment shaft 114 in the closed state of the lid body portion 60. In addition, a joint pin 133 is inserted into the through-hole 132 so as to straddle both the pair of arms 130. Due to the presence of the joint pin 133, both the pair of arms 130 can be integrally rotated.

  Here, the joint pin 133 is stretched across the pair of arms 130 on the upper side of the mounting shaft 114. Therefore, the joint pin 133 is always located above the mounting shaft 114. In the closed state of the lid 60, the joint pin 133 is in a state of being locked to the collar 116 described above.

  Further, as shown in FIG. 16, the arm 130 is provided with a notch 134. The notch 134 is provided at a substantially central portion of the arm 130. In FIG. 16, the cutout portion 134 is cut out from the side surface of the arm 130 on the rear end side (side away from the lid body portion 60) and cut out from below to upward. As a result, the arm 130 has a configuration in which a downward projecting portion 130b located below the top portion 130a of the notch exists. For this reason, when the locking pin 117 enters the notch 134, the movement of the locking pin 117 toward the rear end side is restricted by the presence of the downward projecting portion 130b. Thereby, the state in which the locking pin 117 enters the notch 134 is maintained, and the open state of the lid 60 can be maintained.

  As shown in FIGS. 13 and 16, one end side 135 a of a release lever 135 is connected to the arm 130. One end side 135 a of the release lever 135 is connected to the arm 130 on a lower side than the notch portion 134. In addition, the other end side 135 b of the release lever 135 protrudes from the front side surface of the main body 20. A gripping portion 136 having a collar portion is attached to the other end side 135b. Therefore, by pulling the grip portion 136 toward the front side, the arm 130 can be rotated toward the front side with the rotation shaft 122 as a fulcrum. In the state where the locking pin 117 is fitted in the notch part 134, the arm 130 is rotated forward and the lid body part 60 is slightly lifted by hand, etc., so that the notch of the locking pin 117 is obtained. It is possible to release the fitting into the portion 134.

  Also, as shown in FIGS. 12, 15 and 17, the tape bonding apparatus 100 of the present embodiment is provided with a lock mechanism 140 as an opening / closing lock means. The lock mechanism 140 is a member for ensuring the closed state of the lid body portion 60. As shown in FIG. 17, the lock mechanism 140 includes a receiving portion 141 provided in the lid body portion 60, a lock main body portion 142 provided in the main body portion 20, and a lever portion 143. . Among these, the receiving portion 141 is formed with a hole 144. A lock pin 145 described later enters the hole 144.

  The lock main body 142 is provided with a lever portion 143. A lock pin 145 is provided in the lever portion 143 so as to be interlocked. That is, when the operator holds the lever portion 143 and rotates the lever portion 143 by, for example, about 180 degrees, the lock pin 145 enters the hole portion 144 on the receiving portion 141 side. Thereby, the opening of the lid 60 is locked. Further, when the lever portion 143 is rotated by, for example, about 180 degrees from the state in which the lock pin 145 enters the hole portion 144, the lock pin 145 that has entered the hole portion 144 comes out of the hole portion 144. As a method for moving the lock pin 145 into and out of the hole 144, various methods such as a screw method, a method for releasing the biasing force of the spring by rotation, a cam method, and the like can be used.

  In addition, as the lock mechanism 140, a method of moving the lock pin 145 into and out of the hole 144 may not be used, and another method such as a slide lock method may be used.

  18 is arranged on the right side of the cross-sectional view along the line AA in FIG. 12 and on the left side of the cross-sectional view along the line BB in FIG. 12, and the center line X of the short pin 150 and the long pin 151 is bounded. It is a half sectional view joined together as a line. As shown in FIGS. 12 and 18, in the present embodiment, the holding ring 26 includes a short pin 150 as a pin member and a first support member, and a long pin as a pin member and a second support member. 151. The short pin 150 is a pin member that protrudes upward from the upper surface of the pressing ring 26 by approximately 1 mm. Similarly, the long pin 151 is a pin member that protrudes upward from the upper surface of the pressing ring 26 and protrudes approximately 1.7 mm.

  The protruding length of the short pin 150 and the long pin 151 is not limited to this length, and the length of the long pin 151 is longer than that of the short pin 150 and the tape member 12 is initially formed on the upper bottom surface 64a. Any length is possible as long as the tape member 12 is in contact with the upper bottom surface 64a when the rubber sheet 25 is expanded, although it does not contact.

  Here, in this embodiment, the press ring 26 is provided with a total of ten short pins 150 and long pins 151 (see FIG. 12). Of these, a total of three short pins 150 and long pins 151 are provided on the left longitudinal piece 26b and the right longitudinal piece 26c of the press ring 26, respectively. Further, a total of two short pins 150 and long pins 151 are provided on the upper short piece 26d and the lower short piece 26e of the pressing ring 26, respectively. The left longitudinal piece 26b is provided with a long pin 151 at the lower part and short pins 150 at the central part and the upper part. Further, in the right longitudinal piece 26c, a long pin 151 is disposed at the upper portion, and a short pin 150 is disposed at the central portion and the lower portion. Further, the upper short piece 26d has a long pin 151 on the left side and a short pin 150 on the right side, and the lower short piece 26e has a long pin 151 on the right side. A short pin 150 is arranged in the part.

  When the four long pins 151 arranged in this way are connected, a parallelogram having a shape close to a rectangle is formed. As shown in FIG. 18, a tape frame 28 is installed above the short pins 150 and the long pins 151. The tape frame 28 is for maintaining the tension state of the tape member 12 such as an ultraviolet curable UV (Ultra Violet light) tape. Therefore, the upper surface of the tape frame 28 is covered with the tape member 12. When the tape member 12 is stretched on the tape frame 28, the tape member 12 is stretched with the adhesive surface facing the lower side (the glass substrate 101 side).

  In addition, a plurality of positioning pins (not shown) are attached to the tape frame 28. 18 shows the positional relationship among the rubber sheet 25, the glass substrate 101, the pressing ring 26, the short pins 150, the long pins 151, the tape frame 28, and the tape member 12. As shown in this figure, in a state where the glass substrate 101 is mounted on the rubber sheet 25, a predetermined gap 50 a exists between the tape member 12 and the glass substrate 101. However, the gap 50a is such that when the rubber sheet 25 is inflated as will be described later, the glass substrate 101 mounted on the rubber sheet 25 is lifted and the glass substrate 101 and the tape member 12 are well bonded. Is set to

  The operation (operation) of the tape bonding apparatus 100 having the above configuration will be described below. Since the operation (operation) of the tape bonding apparatus 100 is basically the same as the operation of the tape bonding apparatus 10 described in the first embodiment, description of common parts is omitted or abbreviated. To do.

  First, the worker places the glass substrate 101 on the rubber sheet 25. Next, the tape member 12 is stretched on the tape frame 28. Thereafter, the tape frame 28 is placed on the holding ring 26 (step S10; see FIG. 18).

  In this case, the tape frame 28 is installed above the short pins 150 and the long pins 151 provided on the holding ring 26. Due to the difference in length between the short pins 150 and the long pins 151, the tape frame 28 is Portions other than the vicinity of the four portions that are in contact with the long pin 151 (the contact portion with the short pin 150 and the portion between the short pin 150 and the long pin 151) bend downward. The tape member 12 stretched on the tape frame 28 also bends downward at portions other than the vicinity of the four locations where the long pins 151 are in contact with the tape frame 28. As described above, the installation of the glass substrate 101 and the tape member 12 is completed.

  Next, the operator grasps the grasping portion 136 and pulls it toward the front side. In this case, it is preferable that the operator lightly pushes the lid body 60 toward the rear end side (rotates clockwise in FIG. 13). Then, since the arm 130 receives a force toward the near side via the release lever 135, the arm 130 rotates toward the near side with the rotation shaft 122 as a fulcrum. At this time, the lid 60 is slightly lifted (turns slightly clockwise in FIG. 13), so that the locking pin 117 gets over the lower end side of the downward projecting portion 130b. Then, the engagement of the locking pin 117 with the notch 134 is released. Thereby, the lid part 60 can rotate in the closing direction (rotate counterclockwise in FIG. 13).

  Subsequently, the lid body portion 60 is lowered with respect to the main body portion 20 until the sensor 43 detects that the lid body portion 60 is closed (step S11). Then, after closing the lid portion 60, the lever portion 143 of the lock mechanism 140 is rotated. Thereby, the lock pin 145 enters the hole portion 144, the ring contact portion 63 (see FIG. 3) of the lid body portion 60 is pressed against the seal ring 24, and the lid body portion 60 is locked. The subsequent steps are the same as the steps before the pressurization of the vacuum chamber 50 described in the first embodiment (see FIG. 10). And after passing each step, the tape member 12 can be reliably adhere | attached with respect to the glass substrate 101 so that a bubble may not enter between the glass substrate 101 and the tape member 12. FIG.

  According to the tape bonding apparatus 100 having such a configuration, even when the glass substrate 101 is used as a workpiece, the glass sheet 101 is utilized by utilizing the expansion of the rubber sheet 25 as in the case of the first embodiment described above. The tape member 12 can be adhered to the upper surface of the substrate 101. In other words, the tape member 12 can be reliably bonded to the upper surface of the glass substrate 101 by the pressure difference between the atmospheric pressure and the vacuum state with a simple configuration.

  Further, the tape bonding apparatus 100 is provided with a balancer mechanism 110. Therefore, it becomes easy for the operator to perform the operation of opening and closing the lid body 60, and the burden on the operator can be reduced. In particular, the balancer mechanism 110 includes an attachment shaft 114, and the weight 111 is attached to the attachment shaft 114. Therefore, the weight balance between the lid body portion 60 and the weight 111 can be maintained across the hinge 61. Become. Therefore, it becomes easier to open and close the lid 60.

  Further, the balancer mechanism 110 includes an arm 130, and the arm 130 is provided with a notch portion 134 into which the locking pin 117 is fitted. For this reason, when the lid 60 is opened and the locking pin 117 enters and hits the notch 134, the locking pin 117 is prevented from coming out of the notch 134 due to the presence of the lower protrusion 130b. Is maintained. As a result, the rotation of the arm 130 is prevented, and the open state of the lid body 60 can be maintained, and the operator needs to maintain the open state of the lid body 60 by pressing the lid 60 with his / her hand. Disappears. Therefore, the operator can perform other operations, and the tape bonding apparatus 100 is excellent in convenience.

  Further, the press ring 26 is provided with a short pin 150 and a long pin 151, and the tape frame 28 is supported by the short pin 150 and the long pin 151. Therefore, the height of the tape member 12 fixed to the tape frame 28 is high in the vicinity of the support portion of the long pin 151, and the height position is low in other portions. Therefore, it is possible to prevent the tape member 12 from coming into contact with the glass substrate 101 with the long pins 151, and by providing the short pins 150, compared to the case where the entire tape member 12 is supported by the long pins 151, The height position of the tape member 12 can be lowered. In this case, if the bending of the tape member 12 is taken into consideration, a space can be provided above the tape member 12.

  Moreover, it is not necessary to make the depth of the recessed part 64 which exists in the cover body part 60 deeper than necessary. For this reason, when there is little space margin, the recessed part 64 can be deepened by cutting etc., and it becomes possible to adjust arbitrarily. That is, if the depth of the upper bottom surface 64a for pressing the tape member 12 from above is appropriately adjusted, the adhesiveness between the glass substrate 101 lifted by the expansion of the rubber sheet 25 and the tape member 12 is improved. Is possible.

  In the above-described embodiment, the tape bonding apparatus 100 is provided with the lock mechanism 140. Therefore, it is possible to prevent the lid body portion 60 from being opened during the bonding operation of the tape member 12, and the closed state of the lid body portion 60 can be reliably maintained.

  Although the first and second embodiments of the present invention have been described above, the present invention can be variously modified in addition to this. This will be described below.

  In the above-described first embodiment, the case where the wafer 11 is used as a workpiece has been described. However, as a workpiece, in addition to a wafer, a substrate for forming devices used in various micro electro mechanical systems (MEMS) such as a glass substrate such as liquid crystal, a special glass material, a glass substrate for organic EL, and various media (DVD) Etc.) may be employed. Further, the workpiece is not limited to these examples, and any workpiece may be used as long as the above-described pasting and peeling described later are performed. In the above-described embodiment, the atmosphere (air) is introduced after evacuation, but a state other than air, such as argon gas, may be introduced and pressurized.

  Further, the tape member 12 is not limited to the above-described embodiments, and can be bonded to the surface of a workpiece such as a UV curable (ultraviolet curable) tape, a polarizing film, a protective sheet, a transparent electrode, Various things can be used.

  Further, in each of the above-described embodiments, a tape peeling means for peeling the tape member 12 bonded to the surface of the workpiece may be provided inside the tape bonding apparatus 10 or 100. By providing such a tape peeling means, the tape member 12 can be peeled inside the tape bonding apparatus 10 which is vacuum-sucked. Therefore, when the tape is peeled off, it is possible to prevent dust from adhering to the surface of the workpiece. In particular, even if the tape member 12 is peeled off in a clean room, it is difficult to prevent dust from adhering to the surface of the workpiece. However, when using the tape bonding apparatuses 10 and 100 described above, a vacuum is used. Since the tape member 12 is peeled inside, it is possible to more reliably prevent dust from being attached to the workpiece.

  In addition, when the tape member 12 is peeled from the work inside the vacuum chamber 50 described above, it is possible to prevent dust from adhering to the work surface due to static electricity generated when the tape member 12 is peeled off. That is, when the tape member 12 is peeled off inside the vacuum chamber 50, even if static electricity is generated at the time of peeling, dust scattered in the external atmosphere can be prevented from adhering to the surface of the workpiece. .

  Here, as a specific example of the tape peeling means, for example, a suction holding mechanism for sucking and holding one end portion of the tape member 12 may be provided inside the lid portion 60 or the main body portion 20. When the suction holding mechanism is provided, a configuration may be adopted in which the force of picking one end of the tape member 12 is applied by using the suction of the vacuum pump 36 described above. Further, for example, a separate clamping mechanism may be provided so that one end of the tape member 12 can be picked. In addition, for example, by providing an adhesive unit that has an adhesive force with respect to the surface of the tape member 12 that is stronger than the adhesive force between the workpiece and the tape member 12, the adhesive unit is brought into contact with the surface of the tape member 12. The tape member 12 may be peeled off from the work.

  In the case where a glass substrate such as a liquid crystal is used as the work, the operation of peeling the tape member inside the vacuum chamber 50 is particularly important. Further, after peeling off the tape member 12, a member corresponding to a new tape member such as a polarizing film may be attached inside the vacuum chamber 50. If it does in this way, when performing various processing using a glass substrate, it will become possible to reduce a man-hour.

  Further, for example, when the tape member 12 is an ultraviolet curable tape, it is preferable to adopt a configuration in which the tape peeling means includes ultraviolet irradiation means. In this case, if the tape member 12 is irradiated with ultraviolet rays from the ultraviolet irradiation means, the tape member 12 is cured, and the adhesive force of the tape member 12 to the workpiece can be greatly reduced. As a result, the tape member 12 can be easily peeled from the workpiece.

  Moreover, in each above-mentioned embodiment, the tape member 12 is affixed on a workpiece | work, The workpiece | work and the tape member 12 are taken out from the inside of the vacuum chamber 50 with the state of the affixation. However, a cutting means for cutting the tape member 12 to an appropriate size inside the vacuum chamber 50 may be provided inside the tape bonding apparatus 10. For example, you may make it provide the cutter provided with a cutter as the cutting | disconnection means of the tape member 12 which can rotate along the outer periphery of a workpiece | work on the cover body part 60 side. In this case, if the tape member 12 is cut along the outer peripheral edge of the work after the tape member 12 is attached to the upper surface of the work, the work for cutting the excess portion of the tape member 12 is performed. There is no need to do it separately.

  In addition, the above-described cutting unit may adopt a configuration that incorporates a heater for heating the tip of the cutting unit, which corresponds to, for example, a cutter. In the case of incorporating such a heater, when the tip part contacts the tape member 12, the tape member 12 is melted by heat. Therefore, the tape member 12 can be easily cut by pressing the tip portion against the tape member 12 and moving the tip portion relative to the tape member 12.

  Here, when the cutting means incorporates a heater, it is possible to prevent generation of chips and the like as compared with a method of cutting the tape member 12 by pressing a blade. That is, when a method of cutting by pressing the blade is adopted, if fine chips or the like are generated from the cut portion of the tape member 12 and the chips or the like adhere to the workpiece, the post-processing of the workpiece is defective. This is not preferable. However, when the cutting means has a built-in heater, it is possible to prevent the generation of such chips and the like, so that the cause of such a defect can be removed. Further, when the tape member 12 is cut by pressing the blade, the cutting edge of the blade is always required to be sharp, and it is necessary to replace the blade due to wear. However, when the cutting means has a built-in heater, sharpness is not required at the tip of the cutting means, and it is possible to suppress the occurrence of problems such as wear.

  In addition, as a cutting | disconnection means, you may employ | adopt the structure which comprises the laser beam irradiation apparatus which irradiates a laser beam other than the above-mentioned heater. In the case of irradiating laser light, it is possible to cut the tape member 12 while melting it with heat, like the heater.

  In each of the above-described embodiments, the rubber sheet 25 does not have a workpiece positioning function, and employs a configuration in which the workpiece is simply placed on the upper surface of the rubber sheet 25. However, the rubber sheet 25 may have a workpiece positioning function. For example, as shown in FIG. 19, rubber protrusions 27 as positioning means that protrude upward from the upper surface of the rubber sheet 25 may be provided. For example, the rubber protrusion 27 can be integrally formed when the rubber sheet 25 is formed.

  The rubber protrusions 27 are provided along the outer peripheral edge of the work after the work is placed on the rubber sheet 25 in accordance with the size of a predetermined work (wafer 11 or the like). In this case, at least three rubber protrusions 27 are provided on the rubber sheet 25. Thereby, when the work is placed on the rubber sheet 25, the outer periphery of the work can be favorably held.

  When the workpiece is the wafer 11, a rubber protrusion 27 for contacting the orientation flat portion of the wafer 11 may be additionally provided so as to perform positioning in the circumferential direction of the wafer 11. In this way, not only the positioning of the wafer 11 on the upper surface of the rubber sheet 25 but also the positioning of the wafer 11 in the rotational direction (circumferential direction) can be performed satisfactorily.

  Here, when the rubber protrusion 25 is provided on the rubber sheet 25, the work is first placed on the rubber sheet 25, and the outer peripheral edge of the work abuts on the rubber protrusion 27. Thus, when the work is first placed, the position of the work on the upper surface of the rubber sheet 25 is determined. Even if the vacuum pump 36 operates in this state and the workpiece moves or vibrates (runs) on the rubber sheet 25 by the air flow generated by vacuum suction, for example, in the vacuum chamber 50, , Its movement and vibration (ramp) are prevented. For this reason, it is possible to prevent such a problem that a part of the workpiece comes into contact with the tape member 12 before the proper adhesion is started due to the movement and vibration (roughness) of the workpiece, thereby realizing good adhesion. Is possible.

  Moreover, it is not necessary to use a separate jig for positioning and fixing the workpiece. For this reason, it becomes possible to reduce man-hours, such as installation of a jig. The jig is usually made of metal and has a predetermined rigidity. For this reason, in the positioning of the workpiece using the jig, even if the workpiece (wafer 11 or the like) is warped, the deformation of the jig is suppressed by the rigidity of the jig. Thereby, when the workpiece is warped, there is a problem that the workpiece is only partially in contact with the jig. However, when adopting a configuration in which the rubber protrusions 27 are provided on the rubber sheet 25, the rubber sheet 25 can be made to follow the warp of the workpiece due to the flexibility of the rubber sheet 25. Thereby, the work can be held uniformly, and the work can be favorably adhered to the tape member 12.

  For example, when a ring-shaped jig is used and the workpiece is the wafer 11, the jig is in a state of supporting the outer peripheral portion of the wafer 11. For this reason, the case where the center part of the wafer 11 is dented and the adhesion | attachment with respect to the wafer 11 of the tape member 12 starts from the outer peripheral part of the wafer 11 may also arise. However, when the rubber protrusion 27 is provided, the recess of the central portion of the wafer 11 does not occur, and adhesion from the central portion of the wafer 11 can be performed. Therefore, the tape member 12 can be more favorably bonded to the wafer 11.

  In addition, when the rubber sheet 25 swells, it swells from the central part of the rubber sheet 25. Therefore, if the height of the rubber protrusion 27 is suppressed so that it is not significantly different from the thickness dimension of the workpiece, for example, even when the rubber sheet 25 swells, the top of the rubber protrusion 27 contacts the tape member 12. It becomes possible to prevent.

  Here, the rubber protrusion 27 is provided so that its external appearance is a substantially cylindrical shape, a substantially triangular prism shape, or a substantially quadrangular prism shape. The rubber protrusions 27 come into contact with the outer peripheral edge of the work in a state of approximately one point, and the work is easily placed on the upper surface of the rubber sheet 25. However, the rubber protrusion 27 is not necessarily limited to a substantially cylindrical shape, and various shapes can be employed. Further, FIG. 19 shows a rubber protrusion 27 provided integrally with the rubber sheet 25. However, the rubber protrusion 27 is not necessarily provided integrally with the rubber sheet 25. For example, the rubber protrusion 27 may be formed on the upper surface of the rubber sheet 25 by attaching a rubber member separate from the rubber sheet 25. Further, the material of the positioning means is not necessarily limited to the rubber protrusion 27. For example, it may be formed from various resins such as sponge and silicon, or may be formed from a metal material such as aluminum.

  Further, the positioning means is not limited to that formed on the rubber sheet 25. For example, the cylinder rod is provided so as to protrude toward the inside of the vacuum chamber 50, and an abutting member for abutting the outer peripheral edge of the workpiece and positioning the workpiece is attached to the protruding end of the cylinder rod. You may do it. In such a configuration, when a workpiece is placed on the upper surface of the rubber sheet 25, the cylinder rod extends toward the inside of the vacuum chamber 50, the abutting member abuts on the outer peripheral edge of the workpiece, and the workpiece is positioned / held. Is done. The positioning position is set at a position where the work can be satisfactorily adhered to the tape member 12.

  Thus, even when the positioning means is configured using a cylinder rod or the like, the position of the workpiece on the upper surface of the rubber sheet 25 is determined as in the case of providing the rubber protrusion 27, and the workpiece moves during vacuum suction, It is possible to prevent the occurrence of problems such as vibration (ramp). In the positioning using such a cylinder rod or the like, it is preferable that when the rubber sheet 25 starts to swell, the contact member is driven so as to escape from the outer peripheral edge portion of the workpiece. In this way, the workpiece can be adhered to the tape member 12 more smoothly.

  Moreover, in each above-mentioned embodiment, the tape bonding apparatuses 10 and 100 are installed in a normal atmosphere. However, the tape bonding apparatuses 10 and 100 may be installed in a vacuum atmosphere. In this way, after the tape member 12 is bonded to the workpiece and various treatments are performed, the tape member 12 can be peeled off from the workpiece in the vacuum atmosphere. In addition, by setting a vacuum atmosphere around the tape bonding apparatuses 10 and 100, the vacuum chamber 50 of the tape bonding apparatuses 10 and 100 can be quickly reached a predetermined degree of vacuum.

  When the tape bonding apparatus 10 or 100 is installed in a vacuum atmosphere, it may be installed in a vacuum chamber larger than the tape bonding apparatus 10 or 100.

  Moreover, you may make it install the conveyance robot for conveying a workpiece | work with respect to the tape bonding apparatuses 10 and 100. FIG. In this case, the adhesion of the tape member 12 to the workpiece can be further automated. In the above-described embodiment, the workpieces are installed one by one inside the tape bonding apparatus 10. However, a cassette capable of storing a plurality of workpieces may be installed inside the tape bonding apparatus 10 and 100, and the workpieces may be sequentially taken out from the cassettes.

  In each of the above-described embodiments, the workpiece is placed on the upper surface of the rubber sheet 25. However, a sheet-like member made of, for example, a resin may be placed on the upper surface of the rubber sheet 25, and a workpiece may be placed on the upper part of the sheet-like member. In this way, it is possible to prevent the dust from adhering to the work caused by rubbing the rubber sheet 25 and the like, and it is possible to reduce the subsequent cleaning process using the cleaning processing apparatus.

  Further, in each of the above-described embodiments, the seal ring 23 is attached to the main body upper surface portion 22. However, the seal ring 23 may be attached to the lid body 60 side. In such a configuration, a ring contact portion is provided on the upper surface portion 22 of the main body.

  Further, in each of the above-described embodiments, the case where the rubber sheet 25 is used as the elastic sheet member has been described. However, the elastic sheet member is not limited to the rubber sheet 25, and may be made of a material other than the rubber material such as a resin such as an elastomer resin. Moreover, in the above-mentioned embodiment, the case where the pressing ring 26 is used as the holding member has been described. However, the holding member is not limited to the pressing ring 26, and for example, a material having adhesiveness such as an adhesive applied to the inner diameter portion 22a may be used as the holding member. Further, the shape of the holding member is not limited to the ring shape, and various shapes such as a ring shape having an outer diameter forming a polygon can be adopted.

  In the first embodiment described above, the case where the tape holding unit has the suction member 66 and the tape member 12 is sucked and held by the suction member 66 has been described. However, the configuration for holding the tape member 12 is not limited to this. For example, a configuration in which the tape member 12 is stretched using a ring-shaped tape frame may be employed.

  In the first embodiment described above, the adsorption member 66 made of porous ceramics is used to adsorb and hold the tape member 12. However, the adsorption member may be any porous material. Any material may be used. Another example of the porous body is a sponge body.

  Moreover, as a control means, the control condition may be set beforehand, and the structure which can set a control condition arbitrarily on the operator side may be sufficient. Furthermore, the sealing member may have any shape and configuration as long as the sealing member can be hermetically closed between the main body 20 and the lid 60.

  In the first embodiment described above, the case where the lock mechanism 80 is used as the open / close lock means has been described. However, the open / close lock means is not limited to the lock mechanism 80. For example, an insertion hole is provided on the main body portion 20 side, a claw portion that rotates while receiving a biasing force from a spring is provided on the lid body portion 60 side, and the claw portion is inserted into the insertion hole when the lid body portion 60 is closed. It may be configured such that the opening of the lid body portion 60 is locked by being locked in the insertion hole of the claw portion. Further, a configuration in which the opening / closing lock means is omitted may be employed. Further, in the first embodiment, the lock mechanism 140 may be provided, and in the second embodiment, the lock mechanism 80 may be provided.

  In addition, the tape bonding apparatus 10 in the first embodiment described above includes a lid portion 60 that can apply pressure. However, the tape bonding apparatus 10 may be easily replaceable with such a lid body portion 60 and a lid body portion of a type that does not include the air pipe 67 and cannot be pressurized.

  Further, in the first embodiment described above, the adsorbing member 66 is made of porous ceramics. In this case, a mechanism for separately heating the porous ceramics may be provided so that the adsorption member 66 has a heating function such as a ceramic heater. In this case, since the tape member 12 is heated, the adhesiveness (adhesiveness) of the tape member 12 to the work (wafer 11 or the like) is improved. For this reason, it becomes possible to adhere the tape member 12 more firmly to the workpiece.

  Further, in each of the above-described embodiments, the work such as the wafer 11 and the glass substrate 101 is placed on the upper surface of the rubber sheet 25, and the rubber sheet 25 is expanded upward to come into contact with the tape member 12. These positional relationships may be reversed in the vertical direction. That is, the rubber sheet 25 can be placed at the top, the workpiece at the middle, the tape member 12 at the bottom, and the rubber sheet 25 can be expanded downward to contact the tape member 12. In such a case, it is necessary to reverse the positional relationship between the first vacuum chamber and the second vacuum chamber in the vertical direction. Before bonding, it is necessary to provide means for fixing the work to the rubber sheet 25 in order to prevent the work from dropping due to gravity. Specifically, for example, an adhesive member or the like is provided on the rubber sheet 25 and the workpiece is fixed by the adhesive member, or a locking member that engages with a locking member provided on the workpiece is provided on the workpiece. It can be fixed. In that case, it is assumed that when the expansion of the rubber sheet 25 is released and restored after the work is bonded to the tape member 12, the work may be peeled off from the tape member 12. Therefore, for example, the work is removed from the rubber sheet by electromagnetic means. The electromagnetic force may be released when the bonding is completed. According to such a configuration, since the workpiece is pressed against the tape member 12 by its own weight, even when there is an insufficiently bonded portion between the tape member 12 and the workpiece, the portion is peeled off. Can be prevented.

  Further, in each of the above-described embodiments, the workpiece is bonded to the tape member 12 in a vacuum. However, for example, it is possible to bond the workpiece under normal pressure. That is, if there is a difference in atmospheric pressure so that the workpiece moves toward the tape member 12 above and below the rubber sheet 25 on which the workpiece is placed, these can be bonded. Specifically, the first vacuum chamber 50 located on the upper surface side of the rubber sheet 25 is opened to the atmosphere, and the second vacuum chamber 51 located on the lower surface side of the rubber sheet 25 is also in a pressurized state. The rubber sheet 25 can be moved to the tape member 12 side to bond them. Alternatively, the second vacuum chamber 51 positioned on the lower surface side of the rubber sheet 25 is opened to the atmosphere, and the first vacuum chamber 50 positioned on the upper surface side of the rubber sheet 25 is also decompressed so that the rubber sheet 25 is taped. They can be moved to the member 12 side to bond them. In this case, if the capacity of the vacuum chamber on the side opened to the atmosphere is sufficiently large, the original purpose can be achieved without opening to the atmosphere. As described above, the pressure inside the first vacuum chamber 50 serving as the first chamber is made lower than the pressure of the second vacuum chamber 51 serving as the second chamber. Can be expanded in the direction. In addition, when expanding the rubber sheet 25 downward, it is achieved by making the pressure inside the first chamber higher than the pressure inside the second chamber. Here, the air pipe 33, the pipe member 35, the protruding pipe part 35a, the vacuum pump 36, the first valve member 37, the air pipe 38, the pipe member 40, the protruding pipe part 40a, the second valve member 41, etc. Adjustment means are configured. As the adjusting means, for example, a pressurizing pump can be used instead of the vacuum pump. That is, it is only necessary to generate a pressure difference between the pressure inside the first chamber and the pressure inside the second chamber, so that not only a vacuum pump but also a pressure pump can be used.

  Further, in each of the above-described embodiments, only one air introduction part 51 is illustrated in FIG. However, the air introduction part 51 is not limited to a configuration in which only one location is provided, and a plurality of locations may be provided, and the air duct 38 may be connected to each location. For example, even when a large glass substrate 101 is used as a workpiece, the presence of a plurality of air introduction portions 51 / air ducts 38 allows air to spread more quickly and the rubber sheet 25 to be inflated. . The plurality of air introduction portions 51 are provided in the central portion of the main body upper surface portion 22 in the radial direction, and a plurality of outer air introduction portions 51 are arranged so as to surround the air introduction portion 51 in the central portion. preferable. And the outer air introducing | transducing part 51 may be made not to use by shielding etc., when sticking other than a large sized workpiece | work. Moreover, you may make it control introduction of the air with respect to each outer air introduction part 51 according to the sticking condition of the tape member 12 with respect to a workpiece | work.

  The tape bonding apparatus and the tape bonding method of the present invention can be used in the manufacturing process of a semiconductor integrated circuit using a wafer and the manufacturing process of a liquid crystal display device using a liquid crystal. That is, it can be used in the semiconductor manufacturing industry. It can also be used in the display manufacturing industry using a glass substrate.

It is a figure which shows the structure of the tape bonding apparatus which concerns on the 1st Embodiment of this invention, and is a top view which sees through a cover body part in the state which has arrange | positioned the wafer on the rubber sheet. It is a figure which shows the structure of the tape bonding apparatus of FIG. 1, and is a top view which shows the state which closed the cover part. It is a figure which shows the structure of the tape bonding apparatus of FIG. 1, and is a side view which shows the state which looked through a part of internal structure while showing the state which closed the cover part. It is a schematic block diagram which simplifies and shows the state of the exhaust system and control system of the tape bonding apparatus of FIG. In the tape bonding apparatus of FIG. 1, it is a partial sectional side view which expands and shows the press ring vicinity among the structures which hold | maintain a rubber sheet and a tape member. In the tape bonding apparatus of FIG. 1, it is a partial sectional side view which expands and shows the vicinity of an air introduction part among the structures holding a rubber sheet and a tape member. It is a figure which shows the structure of the tape bonding apparatus of FIG. 1, (a) is the side view which partially saw through the inside which shows the state which opened the cover part, (b) is the state which closed the cover part. It is principal part sectional drawing seen from the front side to show. It is a side view which shows the mode of attachment of the lock mechanism which exists between a lid body part and a main-body part while seeing through and showing the internal structure of a lid body part among the tape bonding apparatuses of FIG. It is a rear view which shows the structure of the tape bonding apparatus of FIG. It is a figure which shows the operation | movement flow at the time of adhere | attaching a tape member with respect to a wafer using the tape bonding apparatus of FIG. It is an image figure which shows the aspect of adhesion | attachment when a wafer is lifted and adhere | attached on a tape member using the tape bonding apparatus of FIG. 1, (a) is a case where adhesion | attachment is started from the center part of a wafer with respect to a tape member. (B) is a figure which shows the case where adhesion | attachment is started from the upper end of the wafer inclined with respect to a tape member. It is a figure which shows the structure of the tape bonding apparatus which concerns on the 2nd Embodiment of this invention, and is a top view which sees through and shows a cover body part. It is a figure which shows the structure of the tape bonding apparatus of FIG. 8, and is a side view which shows the state which looked through a part of internal structure while showing the state which closed the cover part. It is a front view which shows the structure of the tape bonding apparatus of FIG. It is a top view which shows the structure centering on a cover body part among the tape bonding apparatuses of FIG. It is a partial side view which shows the structure of the arm vicinity among the tape bonding apparatuses of FIG. It is a partial side view which shows the structure of a lock mechanism vicinity among the tape bonding apparatuses of FIG. The side cross-sectional view along the line AA of the tape bonding apparatus in FIG. 8 is arranged on the right side, and the side cross-sectional view along the line BB is arranged on the left side. It is sectional drawing. It is a sectional side view which expands and shows a mode that the rubber protrusion was provided in the rubber sheet concerning the modification of the tape bonding apparatus of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10,100 ... Tape bonding apparatus 11 ... Wafer (workpiece)
DESCRIPTION OF SYMBOLS 12 ... Tape member 20 ... Main body part 22 ... Main body upper surface part 22b ... Mounting part 24 ... Hole part 25 ... Rubber sheet (expandable sheet member)
26 ... Presser ring (holding member)
27. Rubber protrusion (positioning means)
33 ... Air pipe (part of first suction means, part of second air introduction means)
35 ... Tube member (part of first suction means, part of second air introduction means)
36 ... Vacuum pump (part of first suction means, part of second suction means, part of third suction means)
37 ... 1st valve member (a part of 1st suction means, a part of 2nd air introduction means)
38 ... Air pipe (part of second suction means, part of air introduction means)
40 ... Tube member (part of second suction means, part of air introduction means)
41 ... 2nd valve member (a part of 2nd suction means, a part of air introduction means)
42 ... Tube member (part of tape holding means, part of third suction means)
43 ... Hose (part of tape holding means, part of third suction means)
44 ... Third valve member (part of tape holding means, part of third suction means)
45 (45a, 45b) ... Vacuum gauge 50 ... Vacuum chamber 51 ... Air introduction part 60 ... Cover body part 61 ... Hinge 62 ... Damper member 63 ... Ring contact part 64 ... Recess 64a ... Upper bottom surface 65 ... Fitting recess 66 ... Adsorption member (part of tape holding means)
67 ... Air pipe (part of tape holding means, part of third suction means)
80, 140 ... Lock mechanism 90 ... Control device (control means)
101 ... Glass substrate (work)
110 ... Balancer mechanism

Claims (7)

In a tape bonding apparatus that bonds a tape member to a workpiece,
An elastic sheet member on which the workpiece is placed on the upper surface;
A vacuum chamber located on the upper surface side of the elastic sheet member and partitioned by the elastic sheet member;
An air introduction part located on the lower surface side of the elastic sheet member and partitioned by the elastic sheet member;
Located on the lower surface side of the stretchable sheet member and located at a site that does not interfere with the air introduction portion, and a placement portion on which the stretchable sheet member is placed;
A holding member that holds the stretchable sheet member in a state that prevents air conduction to the vacuum chamber;
Tape holding means for holding the tape member at the upper part of the work placed on the stretchable sheet member;
Positioning means for abutting the outer peripheral edge of the work placed on the upper surface of the stretchable sheet inside the vacuum chamber and positioning the work;
First suction means for vacuum suction of the inside of the vacuum chamber;
A second suction means for vacuum suction of the air introduction part;
Air introduction means for introducing air into the air introduction section;
A tape bonding apparatus comprising:   2. The tape bonding apparatus according to claim 1, wherein the elastic sheet member is a rubber sheet, and the positioning means is a rubber protrusion provided so as to protrude from the surface of the rubber sheet. In a tape bonding apparatus that bonds a tape member to a workpiece,
An elastic sheet member on which the workpiece is placed on the upper surface;
A vacuum chamber located on the upper surface side of the elastic sheet member and partitioned by the elastic sheet member;
An air introduction part located on the lower surface side of the elastic sheet member and partitioned by the elastic sheet member;
Located on the lower surface side of the stretchable sheet member and located at a site that does not interfere with the air introduction portion, and a placement portion on which the stretchable sheet member is placed;
A holding member that holds the stretchable sheet member in a state that prevents air conduction to the vacuum chamber;
Tape holding means for holding the tape member at the upper part of the work placed on the stretchable sheet member;
A cutting means for cutting the tape member, and a tip portion is provided in the vacuum chamber so that it can appear.
First suction means for vacuum suction of the inside of the vacuum chamber;
A second suction means for vacuum suction of the air introduction part;
Air introduction means for introducing air into the air introduction section;
And the tape member is provided so as to be cut along the outer peripheral edge of the workpiece by the tip of the cutting means.   The tape member is formed by stretching a resin into a sheet shape, and the cutting means thermally cuts the tape member by melting the contact portion with heat when contacting the tape member. The tape bonding apparatus according to claim 3. In a tape bonding apparatus that bonds a tape member to a workpiece,
An elastic sheet member on which the workpiece is placed on the upper surface;
A vacuum chamber located on the upper surface side of the elastic sheet member and partitioned by the elastic sheet member;
An air introduction part located on the lower surface side of the elastic sheet member and partitioned by the elastic sheet member;
Located on the lower surface side of the stretchable sheet member and located at a site that does not interfere with the air introduction portion, and a placement portion on which the stretchable sheet member is placed;
A holding member that holds the stretchable sheet member in a state that prevents air conduction to the vacuum chamber;
Tape holding means for holding the tape member at the upper part of the work placed on the stretchable sheet member;
From the work to which the tape member has already been bonded, a tape peeling means for peeling the tape member in the vacuum chamber;
First suction means for vacuum suction of the inside of the vacuum chamber;
A second suction means for vacuum suction of the air introduction part;
Air introduction means for introducing air into the air introduction section;
A tape bonding apparatus comprising:   6. The tape bonding apparatus according to claim 5, wherein the tape member is an ultraviolet curable tape, and the tape peeling means includes ultraviolet irradiation means for irradiating the tape member with ultraviolet rays. In a tape bonding method for bonding a tape member to a workpiece,
A tape holding step for holding the tape member positioned on the upper side of the workpiece by a tape holding means;
A vacuum chamber located on the upper surface side of the stretchable sheet member in a state where the work is placed on the upper surface of the stretchable sheet member and the tape member is positioned in a stretched state on the work by the tape holding means. A suction step in which the second suction means vacuum-sucks the air introduction portion that is partitioned from the vacuum chamber by the stretchable sheet member and located on the lower surface side of the stretchable sheet member; ,
A vacuum reach detection step for detecting that the vacuum chamber and the air introduction part have reached a set vacuum by the suction step;
After detecting that the degree of vacuum set by the vacuum achievement level detection step has been reached, the vacuum suction of the air introduction unit is stopped by stopping the operation of the second suction unit, and the air introduction unit is operated. An air introduction step for introducing air into the air introduction section;
After the air introduction step, the expansion sheet member is expanded toward the inside of the vacuum chamber, and the expansion of the expansion sheet member lifts the workpiece toward the tape member and adheres it to the tape member. When,
A cutting step of cutting a portion protruding from the surface of the workpiece among the tape member bonded to the workpiece after the bonding step has been performed using a cutting means;
A tape bonding method characterized by comprising:

Images