JP2011009422A - Vacuum sticking machine for dicing tape - Google Patents

Vacuum sticking machine for dicing tape Download PDF

Info

Publication number
JP2011009422A
JP2011009422A JP2009150932A JP2009150932A JP2011009422A JP 2011009422 A JP2011009422 A JP 2011009422A JP 2009150932 A JP2009150932 A JP 2009150932A JP 2009150932 A JP2009150932 A JP 2009150932A JP 2011009422 A JP2011009422 A JP 2011009422A
Authority
JP
Japan
Prior art keywords
dicing tape
vacuum
workpiece
dicing
work
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009150932A
Other languages
Japanese (ja)
Other versions
JP5457088B2 (en
Inventor
Isamu Shimizu
勇 清水
Koichi Saito
公一 斎藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Setsubi Engineering Co Ltd
Original Assignee
Hitachi Setsubi Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Setsubi Engineering Co Ltd filed Critical Hitachi Setsubi Engineering Co Ltd
Priority to JP2009150932A priority Critical patent/JP5457088B2/en
Publication of JP2011009422A publication Critical patent/JP2011009422A/en
Application granted granted Critical
Publication of JP5457088B2 publication Critical patent/JP5457088B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a vacuum sticking machine allowing the sticking situation of a dicing tape to a workpiece such as a silicon wafer to be easily observed and confirmed from the outside during sticking work.SOLUTION: This vacuum sticking machine is structured such that a dicing tape 2 stuck to a frame 3 and a plate-like workpiece 1 are arranged on an upper side and a lower side in a vacuum chamber 15, respectively; the workpiece 1 is lifted through a vertically-movable workpiece support mechanism 20; and the dicing tape is stuck to one surface of the plate-like workpiece 1 in the vacuum chamber. A transparent plate 19 is arranged on a lid part 11 for opening/closing the upper part of the vacuum chamber 15, force in sticking the dicing tape 2 to the workpiece 1 is received by the undersurface of the transparent plate 19; and the sticking condition is observed from the upper outside through the transparent plate 19.

Description

本発明は、半導体ウエハ、液晶ガラスなどの板状部材のダイシング前工程において、ダイシングテープを板状部材の一面に貼付ける装置に関する。板状部材は、ダイシングの対象であれば、その種類を問わない。   The present invention relates to an apparatus for attaching a dicing tape to one surface of a plate-like member in a pre-dicing process for a plate-like member such as a semiconductor wafer or liquid crystal glass. The type of plate member is not limited as long as it is an object of dicing.

例えば、半導体ウエハの製造工程では、シリコンウエハに露光−拡散−エッチングなどの前工程処理を施した後に、シリコンウエハをチップサイズにダイシングする。その具体例を、図４の（１）、（２）、（３）、（４）、（５）の工程により模式的に示す。   For example, in a semiconductor wafer manufacturing process, a silicon wafer is diced to a chip size after pre-processing such as exposure-diffusion-etching is performed on the silicon wafer. Specific examples thereof are schematically shown by steps (1), (2), (3), (4), and (5) in FIG.

通常、半導体ウエハとして用いられるシリコンウエハ１は、投入時の初期の厚みｔ１が７００〜２００μｍであり、前工程（回路形成）終了まで、その厚みで処理される（図４（１））。これは、前工程処理が酸化膜形成−露光−熱拡散−エッチングなどの回路形成工程を何回も繰り返すため、温度履歴や表面処理履歴の影響でシリコンウエハに変形を発生させない厚みを保つ必要があるためである。   Normally, a silicon wafer 1 used as a semiconductor wafer has an initial thickness t1 of 700 to 200 μm at the time of loading, and is processed with that thickness until the end of the previous process (circuit formation) (FIG. 4 (1)). This is because the pre-process treatment repeats the circuit formation process such as oxide film formation-exposure-thermal diffusion-etching many times, so it is necessary to maintain a thickness that does not cause deformation of the silicon wafer due to the influence of temperature history and surface treatment history. Because there is.

次いで、前工程が終了したシリコンウエハ１を、回路形成面を保護テープ４で覆う（図４（２））。保護テープ４は、ウエハの薄型化に伴って製造過程で生じる反りを防止するために使用される。通常のＩＣチップの厚みは、３５０μｍ程度であり、投入時の厚みをそのまま使用して、ダイシングを行っていたが、近年、ＩＣチップはフラッシュメモリ用などに対応するため、例えば５０μｍの厚みにするなど、その薄型化が図られている。このような薄型にする場合には、グラインダでシリコンウエハ１の裏面から所定の肉厚部分１´までを削っている（図４（３））。   Next, the silicon wafer 1 for which the pre-process has been completed is covered with a protective tape 4 on the circuit forming surface (FIG. 4 (2)). The protective tape 4 is used to prevent warpage that occurs in the manufacturing process as the wafer becomes thinner. The thickness of a normal IC chip is about 350 μm, and dicing has been carried out using the thickness at the time of introduction as it is. However, in recent years, the IC chip is made to have a thickness of, for example, 50 μm to cope with flash memory and the like. For example, the thickness is reduced. In order to reduce the thickness, a grinder is used to cut from the back surface of the silicon wafer 1 to a predetermined thick portion 1 ′ (FIG. 4 (3)).

この、薄くした後のシリコンウエハ１の一面（回路形成面と反対側）に、ダイシングテープ２を貼付ける（図４（４））。   A dicing tape 2 is attached to one surface of the silicon wafer 1 after being thinned (on the side opposite to the circuit formation surface) (FIG. 4 (4)).

ここで、シリコンウエハ１へのダイシングテープ２の貼付けには、例えば、図４（４）に示すように、張力を与えた状態で円環状のダイシングフレーム３に貼付けられたダイシングテープ２（円形状にカットされている）が用意される。このようにしてダイシングフレームで張力を保持されたダイシングテープ２とシリコンウエハ１とを真空室内で上下方向に対向配置して、ダイシングテープ２の一面（接着面）に、上下移動可能なウエハ支持機構３０などで保持されたシリコンウエハ１の一面を押し当てて、ダイシングテープにシリコンウエハが貼付けられる。ダイシングテープで保持されたシリコンウエハは、ダイシング装置（ダイシングカッター）に供給される。   Here, for attaching the dicing tape 2 to the silicon wafer 1, for example, as shown in FIG. 4 (4), the dicing tape 2 (circular shape) attached to the annular dicing frame 3 in a state where tension is applied. Is cut). A wafer support mechanism capable of moving up and down on one surface (adhesive surface) of the dicing tape 2 by disposing the dicing tape 2 and the silicon wafer 1 held in tension by the dicing frame in the vertical direction in the vacuum chamber. A silicon wafer 1 is affixed to the dicing tape by pressing one surface of the silicon wafer 1 held by 30 or the like. The silicon wafer held by the dicing tape is supplied to a dicing apparatus (dicing cutter).

ダイシング工程前に、保護テープ４を剥がしダイシングカッター（レジンに砥石を混ぜたブレード）６を用いてダイシング工程が行われる（図４（５））。   Prior to the dicing step, the protective tape 4 is peeled off and the dicing step is performed using a dicing cutter (blade obtained by mixing a grindstone with a resin) 6 (FIG. 4 (5)).

ダイシングテープ２は、ダイシング作業で半導体チップが散乱するのを防止し、チップの現状の位置に保持してそのまま次の工程へまとめてチップを搬送するために使用される。そのためにダイシングカッターは半導体ウエハのダイシングの際にダイシングテープの肉厚の途中までしか及ばないようにして、ダイシングテープは切断されないようにしてある。
図５は、ダイシング後の半導体がダイシングテープ２に接着されている状態を半導体チップの回路形成面側から見た平面模式図である。 The dicing tape 2 is used to prevent the semiconductor chips from being scattered during the dicing operation, hold the chips at their current positions, and transport the chips as they are to the next process. For this purpose, the dicing cutter only reaches the middle of the thickness of the dicing tape when dicing the semiconductor wafer, so that the dicing tape is not cut.
FIG. 5 is a schematic plan view of the semiconductor chip after dicing bonded to the dicing tape 2 as viewed from the circuit forming surface side of the semiconductor chip.

ダイシングテープ貼り付け用の真空貼付機の従来例としては、例えば、特許文献１（特開2008-153597号公報）に開示されたものがある。   As a conventional example of a vacuum applicator for attaching a dicing tape, for example, there is one disclosed in Patent Document 1 (Japanese Patent Laid-Open No. 2008-153597).

特開2008-153597号公報JP 2008-153597 A

上記のようなダイシングテープのシリコンウエハへの貼り付けは、真空貼付機を用いて行われるが、従来は、その貼り付け状態を、貼り付け作業中に外部から観察することができない。ダイシングテープとシリコンウエハとの接合面に気泡が残留していた場合には、張力のバランスが崩れるため、以後のダイシングに支障をきたす不具合が生じることになる。したがって、ダイシングテープの貼り付け作業中に、その作業状況を確認できれば、その不具合品の排除と改善を講じる場合に便利である。   Affixing the dicing tape as described above to a silicon wafer is performed using a vacuum applicator. Conventionally, the affixing state cannot be observed from the outside during the affixing operation. If bubbles remain on the bonding surface between the dicing tape and the silicon wafer, the balance of tension is lost, which causes a problem that hinders subsequent dicing. Therefore, if the work status can be confirmed during the dicing tape affixing operation, it is convenient for eliminating and improving the defective product.

本願発明は、以上の課題解決のためになされたものであり、その目的は、ダイシングテープのシリコンウエハ等のワークへの貼り付けの状況を、貼り付け作業中に外部から容易に観察、確認できる真空貼付機を提供することにある。   The present invention has been made to solve the above problems, and the purpose of the present invention is to easily observe and confirm the status of dicing tape affixing to a work such as a silicon wafer from the outside during the affixing operation. It is to provide a vacuum applicator.

上記目的を達成するために、本発明は、基本的には次のように構成する。   In order to achieve the above object, the present invention is basically configured as follows.

真空室内の上側に、フレームに貼り付けたダイシングテープを、下側に板状のワークを配置し、前記ワークを上下方向に移動可能なワーク支持機構を介して上昇させて、前記真空室内で板状のワークの一面に前記ダイシングテープを貼り付ける真空貼付機において、
前記真空室の上部を開閉するための蓋部には透明板が設けられ、前記ワークに前記ダイシングテープを貼り付ける時の力を前記透明板の下面で受け、且つその貼り付け状態を、前記透明板を介して上方外部から観察可能な構造にしたことを特徴とする。 A dicing tape affixed to the frame is placed on the upper side of the vacuum chamber, a plate-like work is placed on the lower side, and the work is lifted via a work support mechanism that can move in the vertical direction. In a vacuum applicator for attaching the dicing tape to one surface of the workpiece,
The lid for opening and closing the upper part of the vacuum chamber is provided with a transparent plate, receiving a force when the dicing tape is attached to the work on the lower surface of the transparent plate, and the attached state is the transparent It is characterized by having a structure that can be observed from above and outside through a plate.

上記構成によれば、ダイシングテープのワークへの貼り付け中に、そのテープ貼付け状況を容易に観察することができる。   According to the said structure, the tape sticking condition can be easily observed during the sticking of the dicing tape to the workpiece | work.

本発明の一実施例に係る真空貼付機を、真空引き装置と切り離して、その蓋部（上蓋）を閉じた状態で示す外観斜視図。The external appearance perspective view which shows the vacuum sticking machine which concerns on one Example of this invention in the state which cut | disconnected from the vacuum drawing apparatus and closed the cover part (upper cover). 本実施例に係る真空貼付機を真空引き装置と接続した状態で、且つダイシングテープ貼り付け前の状態を示す断面概略図。The cross-sectional schematic which shows the state before the dicing tape sticking in the state which connected the vacuum sticking machine which concerns on a present Example with the vacuum drawing apparatus. 本実施例に係る真空貼付機のダイシングテープ貼り付け作業中の状態を示す断面概略図。The cross-sectional schematic which shows the state in the dicing tape sticking operation | work of the vacuum sticking machine which concerns on a present Example. シリコンウエハに対するダイシングテープの貼付け方式を示す半導体製造工程図。The semiconductor manufacturing process figure which shows the sticking system of the dicing tape with respect to a silicon wafer. ダイシングカット後の半導体ウエハの平面図である。It is a top view of the semiconductor wafer after a dicing cut.

以下、本発明の実施例を、図面を用いて説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図１は、本発明の一実施例に係る真空貼付機を、真空引き装置と切り離して、その蓋部（上蓋）を閉じた状態で示す外観斜視図である。図２は、本実施例に係る真空貼付機を真空引き装置と接続した状態で、且つダイシングテープ貼り付け前の状態を示す断面概略図、
図３は、本実施例に係る真空貼付機のダイシングテープ貼り付け作業中の状態を示す断面概略図である。 FIG. 1 is an external perspective view showing a vacuum applicator according to an embodiment of the present invention in a state where the vacuum applicator is separated from the vacuum drawing device and the lid (upper lid) is closed. FIG. 2 is a schematic cross-sectional view showing a state where the vacuum applicator according to the present embodiment is connected to a vacuum drawing device and before the dicing tape is attached,
FIG. 3 is a schematic cross-sectional view showing a state during the dicing tape attaching operation of the vacuum applicator according to the present embodiment.

本実施例に係る真空貼付機１０は、蓋部（上蓋）１１と本体（ハウジング）１２とからなる。   The vacuum applicator 10 according to this embodiment includes a lid (upper lid) 11 and a main body (housing) 12.

蓋部１１は、本体１２の上部開口を覆い（閉じ）、背面側１１ａを支点にして図１、図２の矢印方向（上下方向）Ａに開くことができる。図２の一点鎖線は、蓋部１１を開いた状態を示す。   The lid 11 covers (closes) the upper opening of the main body 12 and can open in the arrow direction (vertical direction) A in FIGS. 1 and 2 with the back side 11a as a fulcrum. The dashed-dotted line of FIG. 2 shows the state which opened the cover part 11. FIG.

本体１２は、その内部に、環状のダイシングフレーム３に貼り付けたダイシングテープ２、被貼り付けワーク（半導体ウエハ、液晶ガラスなどの板状部材）１、及びワーク１を支持する上下移動可能なワーク支持機構２０を収容するダイシングテープ・ワーク収容部１５を有する。   The main body 12 includes a dicing tape 2 attached to an annular dicing frame 3, a work to be attached (a plate member such as a semiconductor wafer or liquid crystal glass) 1, and a vertically movable work that supports the work 1. A dicing tape / work receiving part 15 for receiving the support mechanism 20 is provided.

収容部１５の内部には、その下部側にワーク支持機構となるゴムシート製のダイヤフラム２０が配置され、ダイヤフラム２０の周縁側が、環状のフレーム支持台１６と共に収容部１５の内底部に固定されている。フレーム支持台１６は、ダイシングフレーム３を着脱自在に支持するためのものであり、ダイシングフレーム３は、図示されていない係止機構を介してフレーム支持台１６に係り止めされる。   A rubber sheet diaphragm 20 serving as a work support mechanism is disposed on the lower side of the housing portion 15, and the peripheral side of the diaphragm 20 is fixed to the inner bottom portion of the housing portion 15 together with the annular frame support 16. ing. The frame support 16 is for detachably supporting the dicing frame 3, and the dicing frame 3 is locked to the frame support 16 via a locking mechanism (not shown).

蓋部１１が開状態にあるときに、収容部１５の上部開口１５ｃを通して、ダイシングフレーム３に貼り付けられたダイシングテープ２を上側に、保護テープ４付きのワーク１を下側にして、両者が対向状態で、収容部１５にセットされる。   When the lid portion 11 is in the open state, the dicing tape 2 attached to the dicing frame 3 is placed on the upper side and the work 1 with the protective tape 4 is placed on the lower side through the upper opening 15c of the housing portion 15, In the facing state, it is set in the accommodating portion 15.

蓋部１１が閉状態にあるときに、環状のシール部材１７を介して、収容部１５の上部開口１５ａが気密状態で閉ざされ、それによって、収容部１５が真空ポンプ２１により真空引きされたときに真空室１５を形成する。   When the lid portion 11 is in the closed state, the upper opening 15a of the housing portion 15 is closed in an airtight state via the annular seal member 17, and thereby the housing portion 15 is evacuated by the vacuum pump 21. A vacuum chamber 15 is formed.

真空形成装置は、真空ポンプ２１と、真空チューブ２２（２２ａ，２２ｂ）と、真空チューブ２２を開閉制御するための制御弁２３（２３ａ，２３ｂ）とを備える。真空チューブ２２ａは、収容部１５内部におけるダイシングテープ外側１５ａを真空引きするものであり、一方、真空チューブ２２ｂは、収容部１５内部におけるダイシングテープ内側１５ｂを真空引きするものである。   The vacuum forming apparatus includes a vacuum pump 21, a vacuum tube 22 (22a, 22b), and a control valve 23 (23a, 23b) for controlling opening and closing of the vacuum tube 22. The vacuum tube 22a is used to evacuate the dicing tape outer side 15a inside the accommodating part 15, while the vacuum tube 22b is used to evacuate the dicing tape inner side 15b inside the accommodating part 15.

ダイシングテープ内側１５ｂは、ダイシングテープ２の内面、フレーム３の内周面、フレーム支持台１６の内周面、及びダイヤフラム２０の上面で囲まれる空間よりなる。ダイシングテープ外側１５ａは、蓋部１１の内面、本体１２の内壁面、ダイシングテープ２の外面、フレーム３の外周面、フレーム支持台１６の外周面、及びダイヤフラム２０の上面で囲まれる空間よりなる。   The dicing tape inner side 15 b includes a space surrounded by the inner surface of the dicing tape 2, the inner peripheral surface of the frame 3, the inner peripheral surface of the frame support 16, and the upper surface of the diaphragm 20. The dicing tape outer side 15 a includes a space surrounded by the inner surface of the lid 11, the inner wall surface of the main body 12, the outer surface of the dicing tape 2, the outer peripheral surface of the frame 3, the outer peripheral surface of the frame support 16, and the upper surface of the diaphragm 20.

本体１２の底壁には、ダイヤフラム２０の下面に作用する大気を導く大気孔１８が設けられている。   The bottom wall of the main body 12 is provided with an air hole 18 that guides the air acting on the lower surface of the diaphragm 20.

蓋部１１は、その中央にワーク１より面積を大きくした円形の観察窓１１ｂが形成され、観察窓１１ｂの下方に、透明板１９、例えば透明アクリル板が設けられている。透明板１９は、例えば蓋部１１の内面に嵌め込み接着により固定されているが、その固定方式は、気密性を維持する任意の手法を採用すればよい。また、透明板１９は、その一部が蓋部１１の内面から突出している。収容部１５が大気圧にあるときには、透明板１９の内面が、セットされたダイシングテープ１と微小空隙Ｑを保って対向するように設定してある。   The lid 11 is formed with a circular observation window 11b having a larger area than the work 1 at the center, and a transparent plate 19, for example, a transparent acrylic plate, is provided below the observation window 11b. For example, the transparent plate 19 is fitted and fixed to the inner surface of the lid portion 11 by adhesion, and the fixing method may be any method that maintains airtightness. A part of the transparent plate 19 protrudes from the inner surface of the lid portion 11. When the accommodating portion 15 is at atmospheric pressure, the inner surface of the transparent plate 19 is set so as to face the set dicing tape 1 while maintaining the minute gap Q.

蓋部１１を開いて、収容部１５に保護テープ４付きワーク１及びフレーム３付きダイシングテープ２をセットし、その後に、蓋部１１を閉じて、制御弁２３ａ，２３ｂを開いて真空ポンプ２１を駆動することにより、収容部１５が真空状態（真空室）になる。この状態で、ダイヤフラム２０が真空（減圧）と大気圧との差圧により図３に示すように上方に移動し、ワーク１の一面がダイシングテープ２に押し当てられテープ２に接着する。   The lid 11 is opened, the work 1 with the protective tape 4 and the dicing tape 2 with the frame 3 are set in the accommodating part 15, and then the lid 11 is closed and the control valves 23a and 23b are opened to open the vacuum pump 21. By driving, the accommodating portion 15 is in a vacuum state (vacuum chamber). In this state, the diaphragm 20 moves upward as shown in FIG. 3 by the pressure difference between the vacuum (reduced pressure) and the atmospheric pressure, and one surface of the work 1 is pressed against the dicing tape 2 and adhered to the tape 2.

このときに、透明板１９の下面が、ワーク１にダイシングテープ２を貼り付ける時の力を受け、且つその貼り付け状態を、透明板１９を介して上方外部から観察することができる。   At this time, the lower surface of the transparent plate 19 receives a force when the dicing tape 2 is attached to the work 1, and the attached state can be observed from above through the transparent plate 19.

したがって、透明板１９を介して、ダイシングテープ２の貼り付け状況をその貼り付け作業中に真空貼付機の外部から容易に確認することができる。   Therefore, it is possible to easily confirm the pasting status of the dicing tape 2 from the outside of the vacuum applicator through the transparent plate 19 during the pasting operation.

本実施例では、透明板１９は、アクリル板を使用するが、その材質を限定するものではなく、アクリル以外の透明な合成樹脂や、強化ガラスなどを用いてもよい。   In this embodiment, an acrylic plate is used as the transparent plate 19, but the material is not limited, and a transparent synthetic resin other than acrylic, tempered glass, or the like may be used.

なお、図中、図１に符号１３で示す部分は、真空貼付機の操作パネルである。   In the figure, the part indicated by reference numeral 13 in FIG. 1 is an operation panel of the vacuum applicator.

なお、本実施例のワーク支持機構は、ダイヤフラム２０を使用するが、これに代えて機械的な昇降機構を使用することも可能である。例えば、本願出願人らが既に提案している特開２００８−１５３５９７号公報に記載されるような、ボールスクリューを利用した機械式の上下移動機構（昇降機構）によりワークホルダー（真空チャック機構）を上下移動させる方式や油圧方式の昇降機構などを用いてもよい。   In addition, although the workpiece | work support mechanism of a present Example uses the diaphragm 20, it can replace with this and can also use a mechanical raising / lowering mechanism. For example, a work holder (vacuum chuck mechanism) is mounted by a mechanical vertical movement mechanism (elevating mechanism) using a ball screw as described in Japanese Patent Application Laid-Open No. 2008-153597 already proposed by the present applicants. A vertically moving system or a hydraulic lifting mechanism may be used.

１…半導体ウエハ（ワーク）、２…ダイシングテープ、３…ダイシングフレーム、１１…蓋部、１２…真空貼付機の本体、１５…真空室（ダイシングテープ・ワーク収容部）１９…透明板、２０…ダイヤフラム（ワーク支持機構）、２１…真空ポンプ。 DESCRIPTION OF SYMBOLS 1 ... Semiconductor wafer (work), 2 ... Dicing tape, 3 ... Dicing frame, 11 ... Cover part, 12 ... Main body of vacuum applicator, 15 ... Vacuum chamber (dicing tape and work accommodating part) 19 ... Transparent plate, 20 ... Diaphragm (work support mechanism), 21 ... vacuum pump.

Claims (2)

真空室内の上側に、フレームに貼り付けたダイシングテープを、下側に板状のワークを配置し、前記ワークを上下方向に移動可能なワーク支持機構を介して上昇させて、前記真空室内で板状のワークの一面に前記ダイシングテープを貼り付ける真空貼付機において、
前記真空室の上部を開閉するための蓋部には透明板が設けられ、前記ワークに前記ダイシングテープを貼り付ける時の力を前記透明板の下面で受け、且つその貼り付け状態を、前記透明板を介して上方外部から観察可能な構造にしたことを特徴とする真空貼付機。 A dicing tape affixed to the frame is placed on the upper side of the vacuum chamber, a plate-like work is placed on the lower side, and the work is raised via a work support mechanism that can move in the vertical direction. In a vacuum applicator for attaching the dicing tape to one surface of the workpiece,
The lid for opening and closing the upper part of the vacuum chamber is provided with a transparent plate, receiving a force when the dicing tape is attached to the workpiece on the lower surface of the transparent plate, and the attached state is the transparent A vacuum applicator characterized by having a structure that can be observed from above and outside through a plate. 前記透明板は、合成樹脂或いは強化ガラスよりなり、前記ワークよりも面積を大きく設定してある請求項１記載の真空貼付機。   The vacuum applicator according to claim 1, wherein the transparent plate is made of synthetic resin or tempered glass, and has an area set larger than that of the workpiece.
JP2009150932A 2009-06-25 2009-06-25 Vacuum pasting machine for dicing tape Expired - Fee Related JP5457088B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009150932A JP5457088B2 (en) 2009-06-25 2009-06-25 Vacuum pasting machine for dicing tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009150932A JP5457088B2 (en) 2009-06-25 2009-06-25 Vacuum pasting machine for dicing tape

Publications (2)

Publication Number Publication Date
JP2011009422A true JP2011009422A (en) 2011-01-13
JP5457088B2 JP5457088B2 (en) 2014-04-02

Family

ID=43565742

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009150932A Expired - Fee Related JP5457088B2 (en) 2009-06-25 2009-06-25 Vacuum pasting machine for dicing tape

Country Status (1)

Country Link
JP (1) JP5457088B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016062928A (en) * 2014-09-12 2016-04-25 株式会社東芝 Device and method of manufacturing semiconductor device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006222231A (en) * 2005-02-09 2006-08-24 Tsubaki Seiko:Kk Tape bonding device and tape bonding method
JP2007221034A (en) * 2006-02-20 2007-08-30 Fujitsu Ltd Film sticking apparatus and method therefor and manufacturing method of semiconductor device
JP2008153597A (en) * 2006-12-20 2008-07-03 Hitachi Setsubi Eng Co Ltd Dicing-tape sticking method and device for semiconductor wafer
JP2009121737A (en) * 2007-11-14 2009-06-04 Panasonic Corp Cooking apparatus
JP2010062269A (en) * 2008-09-02 2010-03-18 Three M Innovative Properties Co Method and apparatus for manufacturing wafer laminate, wafer laminate manufacturing method, method for exfoliating support layer, and method for manufacturing wafer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006222231A (en) * 2005-02-09 2006-08-24 Tsubaki Seiko:Kk Tape bonding device and tape bonding method
JP2007221034A (en) * 2006-02-20 2007-08-30 Fujitsu Ltd Film sticking apparatus and method therefor and manufacturing method of semiconductor device
JP2008153597A (en) * 2006-12-20 2008-07-03 Hitachi Setsubi Eng Co Ltd Dicing-tape sticking method and device for semiconductor wafer
JP2009121737A (en) * 2007-11-14 2009-06-04 Panasonic Corp Cooking apparatus
JP2010062269A (en) * 2008-09-02 2010-03-18 Three M Innovative Properties Co Method and apparatus for manufacturing wafer laminate, wafer laminate manufacturing method, method for exfoliating support layer, and method for manufacturing wafer

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016062928A (en) * 2014-09-12 2016-04-25 株式会社東芝 Device and method of manufacturing semiconductor device
CN105990206A (en) * 2014-09-12 2016-10-05 株式会社东芝 Manufacturing apparatus of semiconductor device, and manufacturing method of semiconductor device
US10170352B2 (en) 2014-09-12 2019-01-01 Alpad Corporation Manufacturing apparatus of semiconductor device, and manufacturing method of semiconductor device
US20190080953A1 (en) * 2014-09-12 2019-03-14 Alpad Corporation Manufacturing apparatus of semiconductor device, and manufacturing method of semiconductor device
CN105990206B (en) * 2014-09-12 2019-06-14 阿尔发得株式会社 The manufacturing device of semiconductor device and the manufacturing method of semiconductor device

Also Published As

Publication number Publication date
JP5457088B2 (en) 2014-04-02

Similar Documents

Publication Publication Date Title
KR100852655B1 (en) Semiconductor substrate jig and method of manufacturing a semiconductor device
KR101458399B1 (en) Apparatus and method for adhering sheet
JP5117934B2 (en) MOUNTING DEVICE AND MOUNTING METHOD
JPH04201145A (en) Method and device for bonding wafer
JP5563423B2 (en) Sheet sticking device and sticking method
KR101543630B1 (en) Apparatus and method for attaching sheet
JP2011071472A (en) Vacuum sticking method and apparatus
JP2013232582A (en) Method of applying adhesive tape and adhesive tape applying apparatus
JP6559013B2 (en) Sheet sticking device and sticking method
JP2008153597A (en) Dicing-tape sticking method and device for semiconductor wafer
KR101684288B1 (en) Separating protective film apparatus
JP5457088B2 (en) Vacuum pasting machine for dicing tape
SG189309A1 (en) Dies prepeeling apparatus and method
JP4839284B2 (en) Method of attaching protective tape for peeling off protective sheet of plate-like member such as semiconductor wafer and method of peeling off protective sheet
US20230014530A1 (en) Affixing method and affixing apparatus
JP2015187648A (en) Bonding method and bonding device
JP6472666B2 (en) Holding method for plate workpiece
JP2012038880A (en) Sheet pasting device and pasting method
JPH11277422A (en) Adhesive bonding device for wafer
JP5660821B2 (en) Sheet sticking device and sticking method
KR101006216B1 (en) Semiconductor wafer dicing tape attaching method and apparatus
US20230031772A1 (en) Processing method of workpiece
JP2023081084A (en) Holding mechanism and sticking device
JP2022132971A (en) Integration method for work and sheet material, integration device for work and sheet material, and manufacturing method of semiconductor product
JP2018006504A (en) Support device and support method

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120406

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130509

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130514

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130712

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20131115

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20131224

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140109

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees