KR101684288B1 - Separating protective film apparatus - Google Patents

Separating protective film apparatus Download PDF

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Publication number
KR101684288B1
KR101684288B1 KR1020150187126A KR20150187126A KR101684288B1 KR 101684288 B1 KR101684288 B1 KR 101684288B1 KR 1020150187126 A KR1020150187126 A KR 1020150187126A KR 20150187126 A KR20150187126 A KR 20150187126A KR 101684288 B1 KR101684288 B1 KR 101684288B1
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South Korea
Prior art keywords
wafer
stage
plate
separating
film
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KR1020150187126A
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Korean (ko)
Inventor
송낙현
이상천
주영민
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코리아테크노(주)
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Priority to KR1020150187126A priority Critical patent/KR101684288B1/en
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Publication of KR101684288B1 publication Critical patent/KR101684288B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3512—Cracking
    • H01L2924/35121—Peeling or delaminating

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a wafer transfer apparatus for transferring a wafer, comprising: a stage transfer section for transferring a wafer to be transferred back and forth; a first lift section provided behind the stage movement locus separately from the stage transfer section; And a second elevating portion provided on the rear side of the stage moving track, the stage elevating portion being provided separately from the stage moving portion, And a second elevating part including a suction member that is attracted to the wafer protecting film in the lowered state of the first elevating part, thereby separating the protective film attached to the surface of the circular wafer from the wafer and separating the wafer from the wafer. do.

Description

[0001] SEPARATING PROTECTIVE FILM APPARATUS [0002]

More particularly, the present invention relates to a wafer separating apparatus for separating a protective film adhered to a surface of a circular wafer, which separates the protective film from the wafer, To a separation device for a protective film.

In general, when processing a wafer, a dicing protection film for fixing the semiconductor wafer when the wafer is cut and separated (diced) into individual chips, a dicing protection film for adhering the cut semiconductor chip to a lead frame or a package substrate, A dicing die bonding film (DDF) has been developed which has two functions of an adhesive film (a die bonding film and a die attach film) for stacking and bonding semiconductor chips together. Such a dicing die-bonding film is subjected to free cutting in consideration of workability such as adhesion to a semiconductor wafer and mounting to a ring frame at the time of dicing. In order to manufacture a protective film for wafer processing having a dicing die-bonding film subjected to free cutting, as described in, for example, Japanese Patent Laid-Open No. 2007-2173, The outer side of the circular portion is separated from the release film and is wound up (hereinafter, referred to as a winding process of the adhesive layer), and the adhesive layer is laminated on the adhesive layer of the adhesive layer, The pressure-sensitive adhesive layer of the dicing protection film having the pressure-sensitive adhesive layer laminated on the adhesive layer of the circular adhesive film cut off by the winding step of the pressure-sensitive adhesive layer is bonded to the pressure- It is necessary to insert the incision with a blade and separate and wind up the portion corresponding to the ring frame.

On the other hand, a semiconductor wafer (hereinafter, simply referred to as a " wafer ") that has undergone pattern formation processing has a protective tape (or protective film, hereinafter referred to as a protective film) adhered on the wafer surface in advance, The film is cut along the peripheral edge of the wafer and the rear surface of the wafer is polished with the rear surface of the wafer facing upward while protecting the entire surface of the wafer with the surface protective film. Thereafter, the wafer subjected to the wafer backside polishing treatment is integrated with the ring frame by adhering the adhesive protective film for dicing to the backside of the wafer for a cutting process to a so-called dicing chip. At this time, the adhesive protective film is cut into a circular shape by being made to adhere to the ring frame, and then making one revolution of the ring frame from the center of the ring frame by bringing the blade into contact with the adhesive protective film bonded to the ring frame (for example, Japanese Patent Laid- 3876).

Meanwhile, in the semiconductor manufacturing process, the wafer size has increased and the thickness of the wafer has been decreased to increase the packing density. In a so-called back-grind process, a surface protective film is attached to the front surface of the wafer formed with the semiconductor element to cause the wafer surface to be adsorbed to an adsorption table, and the back surface of the wafer It is grinded. The surface protection protective film (film, film) described above is separated after the backgrind process. According to the prior art, a release tape is attached over the entire wafer surface protective film by an application roller, and is attached with a surface protective film to separate the surface protective film.

Further, for example, a sensor such as a CMOS (Complementary Metal Oxide Semiconductor) manufactured by a small piece (chip) from a wafer is required to avoid adhesion, contamination and damage of dust to the chip until just before mounting on the substrate have. Therefore, the wafer is subjected to dicing treatment with the protective tape attached to the wafer surface before back grinding. Thereafter, the separation tape is attached to the protective tape on the chip held and adhered to the ring frame via the dicing tape (see Japanese Patent Application Laid-Open No. 2003-209073). Further, the wafer is subjected to dicing treatment while adhering a protective tape, which is cylindrically dried along one axis, to the surface by heating. After the dicing, the chip bonded and held to the ring frame is heated via the dicing tape to separate the protective tape. Thereafter, a method of separating and removing the separation tape from the chip by attaching the separation tape to the protective tape has been carried out (see Japanese Patent Application Laid-Open No. 12125607).

In recent years, in order to protect the surface of the wafer temporarily before the chip processing of the wafer, a film having a circular shape larger than the diameter of the wafer is attached with an adhesive or the like. There has been a demand for the realization of automated means for separating such wafer protective films.

In view of the above, it is an object of the present invention to provide an apparatus for separating a protective film attached to a surface of a semiconductor wafer transferred before semiconductor processing.

According to an aspect of the present invention, there is provided a wafer separating apparatus for separating a wafer,

A stage transfer unit for loading a wafer and transferring the wafer back and forth; A first elevating part provided behind the stage moving part separately from the stage moving part; And a second lifting portion having an adsorption member that is adsorbed to the wafer protecting film in a state where the first lifting portion is in a lowered state.

According to an aspect of the present invention, there is provided a wafer transfer apparatus comprising:

A stage having a predetermined circular space on which a wafer is to be mounted; a first driving shaft portion fixed to the fixed frame so as to enable movement of the stage at one side of the stage and having a sliding bar; A first guide arm which is extended from one side of the stage so as to be slidable on the first drive shaft and is connected to the sliding bar and the screw bar so as to be moved forward and backward of the stage, And a first energizing means made up of means.

In order to accomplish the above object, according to the present invention, there is provided a wafer-

A second driving shaft portion mounted on the support plate and driven by a power supply controlled by the predetermined driving means and connected to each other in a fixed frame; A suction plate which is coupled as a ball screw at a lower end of a drive shaft of the first drive shaft portion and which is formed in a disk-like plate and is guided in a vertical direction up and down by a guide mechanism, And a suction device connected to the vacuum mechanism at a position below the suction plate. The apparatus for separating a wafer protecting film according to claim 1,

In order to achieve the above object, the second elevating portion of the wafer protecting film separating device comprises:

The second lifting plate is installed in the fixed frame and moves upward and downward along the second guide unit vertically installed on the fixed frame. The inside of the second lifting plate is integrally connected to the second lifting plate and the cylindrical pressing member is moved downward The formed ring plate and the second lift plate may include a second drive shaft coupled to the drive shaft by a ball screw and driven by a predetermined power supply to lift the second lift plate.

In order to attain the above object, the pressing member of the separating device for a wafer protecting film has a cylindrical shape, and the end of the pressing member has a waveform end forming a height in the vertical direction.

As described above, in separating the film adhered to the surface of the wafer, the effect of easily separating the adsorbed film through the vacuum adsorption mechanism with a precise interval is obtained before damage of the wafer surface is prevented.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a main portion of a separation apparatus for a wafer-
Fig. 2 is a perspective view of the cutaway of the separation device of the wafer protecting film of the present invention,
FIG. 3A is a perspective view illustrating a stage transferring unit of a separation apparatus for a wafer protecting film of the present invention,
FIG. 3B is an enlarged perspective view of the first lift portion of the separation device of the wafer protecting film of the present invention,
Fig. 3C is a configuration diagram of the adsorption section of the separation device of the wafer protecting film of the present invention,
FIG. 4A is a partially exploded perspective view of a second lifting portion of a wafer separating apparatus of the present invention,
4B is an exploded perspective view of a second driving part of the second elevating part of the separating device of the wafer protecting film of the present invention,
FIG. 4C is a view showing the coupling between the second lifting plate, the second guide mechanism, and the second driving unit of the second lifting unit of the wafer separating apparatus of the present invention,
4D is an exploded perspective view of the second elevating part bottom of the separating device of the wafer protecting film of the present invention,
FIG. 4E is an exploded upper perspective view of the second elevating portion of the separating apparatus for the wafer protecting film of the present invention,
FIG. 4F is a cross-sectional view of a main portion of the first and second lifting portions of the separation device of the wafer protecting film according to the present invention,
FIGS. 5A to 5E are explanatory views showing operation steps of the separating apparatus of the wafer protecting film of the present invention,
6 is a block diagram showing a stepwise process of the separation apparatus for a wafer protecting film of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail.

FIG. 1 is a perspective view of a separating apparatus for a wafer protecting film of the present invention, FIG. 2 is a perspective cut-away perspective view of a separating apparatus for a wafer protecting film of the present invention, Fig. 3B is a perspective view of the first lift portion of the separation device of the present invention, Fig. 3C is a configuration diagram of a suction portion of the separation device of the wafer protective film of the present invention, Fig. 4B is an exploded perspective view of the second driving part of the second elevating part of the separating device of the wafer protecting film of the present invention, and FIG. 4C is a perspective view showing the separation of the wafer protecting film of the present invention FIG. 4D is a view showing the coupling between the second lift plate and the second guide mechanism of the second elevation part of the apparatus, and FIG. FIG. 4E is an explanatory perspective view of the second elevating part of the separating device of the wafer protecting film of the present invention, FIG. 4F is a perspective view of the second elevating part of the separating device of the present invention, Sectional view of the main portion of the adsorbed and pressurized portion of the adsorbent.

1 to 4F of the accompanying drawings, the constitution of the separating apparatus for a wafer protecting film according to the present invention will be described.

The basic structure constituting the whole apparatus necessary for the whole wafer processing step is not described and shown. However, in the construction of the present invention, the stationary frames 11 and 21 constituting the stationary frame are connected to each other in the basic structure to form the stationary frames 11 and 21 of the present invention.

The separation device of the wafer protecting film according to the present invention is divided into a stage conveying part (10), a first elevating part (20), and a second elevating part (30).

The stage transferring unit 10 includes a stage 12 on which a predetermined circular space on which a wafer is mounted is formed as shown in FIG. 3A and a stage 12 on which a stage 12 is mounted. A first driving shaft portion 14 fixed to the driving shaft portion 11 and connected to the driving shaft by a ball screw bar 142 in parallel with the sliding bar 141, A guide arm 13 extended from one side or both sides of the stage 12 so as to be slidable on the stage 12 and connected to the sliding bar 141 and the screw bar 142 to be moved forward and backward of the stage 12, And a first energizing means 15 composed of a flexible power supply means for supplying a predetermined control power to a driving motor for rotating the shaft of the screw bar 142, a speed reducer, a pulley, and a belt (not shown).

That is, the stage 12 on which the wafer is mounted is moved back and forth as a predetermined control signal along the first drive shaft portion 14, and the guide arm 13 of the stage 12 is moved to the first drive shaft portion 14, Backward and pause operations along the length of the wafer to enable the protective film separating operation of the wafer top surface.

An operation structure for separating the protective film will be described with reference to Figs. 1, 2 and 3B to 4E.

The first elevating and lowering unit 20 includes a support plate 21 connected in parallel to the fixed frame 1 and fixed in parallel to the support plate 21 and fixed to the support plate 21 by a predetermined driving motor, a reducer, a pulley, a belt, A second driving shaft portion 24 which is driven by a predetermined controlled power supply and which is provided in parallel with the support plate 21 so as to be parallel to each other and which has a guide slot (not shown) formed therein, A guide plate 22 which is coupled as a ball screw at the lower end of the drive shaft of the first drive shaft portion 24 and is formed in a plate shape in the form of a disk and which is guided vertically up and down by a first guide portion 22, A vacuum mechanism 26 provided above the adsorption plate 23 and connected to a vacuum line and an adsorption member 25 connected to the vacuum mechanism 26 below the adsorption plate 23. [

That is, the first drive shaft portion 24 on the top surface of the wafer 11 on the backward stage 11 is provided with a downward force on the lifting plate 23 and the first guide portion 22 extending from the support plate 21 The upper surface of the wafer is vacuum-adsorbed on the upper surface of the wafer, and then the pressing member of the second elevation portion 30 (the lower surface of the protective film attached to the wafer surface, The corrugated end portion 331 of the corrugated cardboard 33 is folded by pressing the protective film.

The second lifting and lowering portion 30 is provided on the fixed frame 11 and includes a lifting plate 31 so as to move up and down along the second guide portion 32 installed vertically to the fixed frame 11, A ring plate 35 is formed integrally with the lifting plate 31 and having a cylindrical pressing member 33 formed on the lower side thereof. This pressing member 33 has a corrugated end face 331 at its lower end so as not to generate a pressure at which the pressing moment is formed.

In addition, the lifting plate 31 is driven by a predetermined controlled power supply and includes a predetermined driving motor, a speed reducer, a pulley, a belt, a pulley, and a driving shaft (not shown) (34) coupled to the first drive shaft (31).

That is, the second lift portion 30 is driven by the third drive shaft portion 34 by the supply of the predetermined power so that the second lift portion 30 is lowered immediately after being attracted to the protective film on the wafer surface of the first lift portion 20, The ring plate 35 integrally attached to the ring plate 35 is lowered and the pressing member 33 under the ring plate 35 presses the extension portion of the protective film attached to the surface of the wafer and has a smaller diameter than the ring plate 35, .

Then, when the extension part (a) of the protective film is bent, the lifting plate 31 and the ring plate 35 are raised by a predetermined sensing operation (description of the structure of the sensing structures is omitted) The first lift portion 20, which has been vacuum adsorbed and held as the adsorption member 25 on the protective film on the surface of the rising instantaneous wafer of the rising portion 30, simultaneously ascends and stops at a predetermined height.

Thereafter, the stage 12 on which the separated wafer of the stage transporting unit 10 is mounted is transported backward, and the first one of the first and second lifting portions 20 and 30, Only the lifting portion 20 is lowered again to release the vacuum applied to the vacuum adsorption member 25 to separate the protective film and to drop it downward.

FIGS. 5A to 5E are explanatory views showing operation steps of a step-by-step operation of the separator of the wafer protecting film of the present invention, and FIG. 6 is a block diagram showing steps of the separating apparatus of the wafer protecting film of the present invention.

The operation of the wafer protecting film separating apparatus of the present invention will be described with reference to the drawings.

The apparatus for separating a wafer protecting film of the present invention is controlled by the following process steps. Since the configuration of the controller is generally used in the control process, the description thereof is omitted.

The first step (stage mounting step)

A wafer tapered in a circular shape with a protective film larger than the diameter on the upper surface of the wafer is transferred to the wafer mounting stage through a predetermined transfer process and mounted.

The second step (stage transfer step)

As shown in Fig. 5A, the stage on which the wafer on which the communication film is formed is mounted and transferred to below the first and second elevation portions.

The third step (film adsorption step)

The first lift portion 20 is lowered on the conveyed stage and the adsorption member 25 adsorbed and controlled through a vacuum mechanism with a predetermined pressure is adsorbed on the protective film tapped on the surface of the wafer.

Fourth step (film margin pressing step)

As shown in FIG. 5C, the second lift portion 30 is lowered immediately after the first lift portion 20 descends from the outside of the first lift portion 20 to which the film is adsorbed, and the margin portion of the protective film is moved downward Press to bend.

Fifth step (rising and pausing steps of the film)

As shown in FIG. 5D, the first and second elevation portions of the first elevation portion 20 and the second elevation portion 30 are elevated at the same time immediately after the margin portion of the film is bent, Immediately after the pause.

Sixth step (Wafer backward and film separation step)

As shown in Fig. 5E, the wafer with the film peeled off is moved backward from the mounted state, and at the same time, the first elevating part 20 in the waiting position is lowered and the protective film is dropped and separated.

The process of separating a wafer protecting film according to the present invention is performed in the above-described steps. Since it is a general control method, detailed control and procedure structures are omitted.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims.

11, 21: Fixed frame,
10: stage conveyance unit, 11: fixed frame,
12: stage, 13: guide arm,
14: first driving shaft part, 141: sliding bar,
142: ball screw bar, 15: first energizing means,
20: first elevating part, 21: fixed frame,
22: first guide portion, 23: adsorption plate,
24: second driving shaft portion, 25: suction member,
26: vacuum mechanism, 27: corrugated end,
30: second elevating portion, 31: elevating plate,
32: second guide portion, 33: pressure member,
34: third drive shaft portion, 35: ring plate,

Claims (5)

A separation device for a wafer protective film,
A stage transfer unit for loading a wafer and transferring the wafer back and forth;
A first elevating part provided behind the stage moving part separately from the stage moving part; And
A second lifting unit having an adsorbing member that is adsorbed to the wafer protecting film in a lowered state of the first lifting unit;
Lt; / RTI >
The second elevation portion
A lift plate installed in the fixed frame and installed to move up and down along the second guide unit installed perpendicularly to the fixed frame;
A ring plate integrally connected to the lifting plate and having a cylindrical shape, the end of the ring plate being formed with a pressing member having a corrugated end portion having a height in the vertical direction; And
A third driving shaft part connected to the driving shaft of the motor driven by a ball screw and driven by a predetermined power supply to elevate the elevating plate;
And separating the wafer from the wafer.
2. The apparatus according to claim 1,
A stage in which a predetermined circular space on which a wafer is mounted is formed;
A sliding bar fixed to the stationary frame so that the stage can be moved from one side of the stage;
A first driving shaft portion directly connected to the driving shaft in parallel with the sliding bar;
A first guide arm extending a predetermined length from one side of the stage so as to be slidable on the first drive shaft portion and slidably coupled to the sliding bar so as to be moved forward and backward of the stage; And
A first energizing means comprising a power supply means for rotating the shaft of the ball screw bar;
Wherein the wafer protecting film separating apparatus comprises:
The apparatus according to claim 1,
A support plate connected and fixed in parallel in the fixed frame;
A second drive shaft mounted on the support plate and driven by a controlled power supply, the drive shaft comprising a predetermined drive means;
A first guide portion arranged vertically and side by side on the support plate and each having a guide slot formed therein;
A suction plate which is ball-screwed at a lower end of a drive shaft of the second drive shaft portion and guided in a vertical direction up and down by the first guide portion; And
A vacuum mechanism provided above the adsorption plate and connected with a vacuum line; an adsorption member connected to the vacuum mechanism below the adsorption plate;
And separating the wafer from the wafer.
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KR1020150187126A 2015-12-28 2015-12-28 Separating protective film apparatus KR101684288B1 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109449108A (en) * 2018-12-18 2019-03-08 吉林华微电子股份有限公司 Membrane removal machine slide holder and silicon wafer processing equipment
CN111630651A (en) * 2018-01-31 2020-09-04 三星钻石工业股份有限公司 Film peeling mechanism and substrate breaking system
CN112670215A (en) * 2020-12-31 2021-04-16 北京中电科电子装备有限公司 Device for wafer bonding and debonding and wafer bonding and debonding method
KR20210045054A (en) * 2019-10-16 2021-04-26 코리아테크노(주) Failure Chip Shattering Apparatus For Semiconductor Device and method for thereof

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JP2014017473A (en) * 2012-06-15 2014-01-30 Tokyo Electron Ltd Sheet peeling device, joining system, peeling system, sheet peeling method, program, and computer storage medium
JP2014179355A (en) * 2011-07-04 2014-09-25 Asahi Glass Co Ltd Glass substrate peeling method and peeling device of the same

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2002313881A (en) * 2001-04-10 2002-10-25 Nec Corp Wafer take-out device
KR20060053848A (en) * 2004-07-16 2006-05-22 도쿄 세이미츄 코퍼레이션 리미티드 Film peeling method and film peeling device
JP2014179355A (en) * 2011-07-04 2014-09-25 Asahi Glass Co Ltd Glass substrate peeling method and peeling device of the same
JP2014017473A (en) * 2012-06-15 2014-01-30 Tokyo Electron Ltd Sheet peeling device, joining system, peeling system, sheet peeling method, program, and computer storage medium

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111630651A (en) * 2018-01-31 2020-09-04 三星钻石工业股份有限公司 Film peeling mechanism and substrate breaking system
CN111630651B (en) * 2018-01-31 2024-01-09 三星钻石工业股份有限公司 Film peeling mechanism and substrate breaking system
CN109449108A (en) * 2018-12-18 2019-03-08 吉林华微电子股份有限公司 Membrane removal machine slide holder and silicon wafer processing equipment
CN109449108B (en) * 2018-12-18 2024-07-05 吉林华微电子股份有限公司 Film removing machine-carried wafer table and silicon wafer processing equipment
KR20210045054A (en) * 2019-10-16 2021-04-26 코리아테크노(주) Failure Chip Shattering Apparatus For Semiconductor Device and method for thereof
KR102290086B1 (en) 2019-10-16 2021-08-17 코리아테크노 주식회사 Failure Chip Shattering Apparatus For Semiconductor Device and method for thereof
CN112670215A (en) * 2020-12-31 2021-04-16 北京中电科电子装备有限公司 Device for wafer bonding and debonding and wafer bonding and debonding method
CN112670215B (en) * 2020-12-31 2023-06-20 北京中电科电子装备有限公司 Device for bonding and debonding wafers and wafer bonding and debonding method

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