JP2018006504A - Support device and support method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a support device capable of surely releasing the close contact state between an adhered supporting means and an adherend.SOLUTION: A support device 20 comprises: adhered supporting means 23 for supporting an adherend WF; sheet supporting means 24 that is provided on an outer side of the adhered supporting means 23 while having a predetermined interval, and supports a squeeze-out part AS1 of an adhesive sheet AS squeezed from an adherend surface WF1 of the adherend WF; and sealing releasing means 25 that releases the sealing of the adhered supporting means 23 and the adherend WF. The sealing releasing means 25 comprises: blocking means 25A for blocking a gap GA between the adhered supporting means 23 and the sheet supporting means 24; and inner pressure elevating means 25B that elevates an inner pressure in a sealing space formed in the blocking means 25A, the sheet supporting means 24, the squeeze-out part AS1, the adherend WF, and the adhered supporting means 23. By elevating the inner pressure of the sealing space by the inner pressure elevating means 25B, the sealing between the adhered supporting means 23 and the adherend WF are released.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a support device and a support method.

  Conventionally, an adherend support means for supporting an adherend to which an adhesive sheet of a size protruding from the adherend surface is attached, and a predetermined interval outside the adherend support means, There is known a support device including a sheet support unit that supports a protruding portion of an adhesive sheet that protrudes from an adherend surface, and an adhesion release unit that releases adhesion between the adherend support unit and the adherend (for example, , See Patent Document 1).

JP 2014-241331 A

  However, in the conventional support apparatus described in Patent Document 1, gas is generated in a contact region between a semiconductor wafer (hereinafter, also simply referred to as “wafer”) (adhered body) and a support surface (adherent support means). Since the structure is used to release the adhesion between the adherend support means and the adherend, depending on the outer edge shape and characteristics of the adherend, the outer edge and the support surface of the adherend are retained. Inadequate sealing performance, gas flows out from the portion, and the gas cannot be retained in the contact area, and the adhesion between the adherend support means and the adherend cannot be released. .

  An object of the present invention is to provide a support device and a support method that can reliably release the adhesion between the adherend support means and the adherend.

  In order to achieve the above object, the support device of the present invention comprises an adherend support means for supporting an adherend to which an adhesive sheet of a size protruding from the adherend surface is attached, and an outer side of the adherend support means. A sheet support means for supporting a protruding portion of the adhesive sheet that protrudes from the adherend surface of the adherend, and provides adhesion between the adherend support means and the adherend. A contact release means for releasing the contact, the contact release means comprising: a closing means for closing a gap between the adherend support means and the sheet support means; the closing means; the sheet support means; and the protruding portion. And an adherent support means for increasing the internal pressure of the sealed space formed by the adherence support means, and the internal pressure increase means for increasing the internal pressure of the sealed space by the internal pressure increase means. And the adherend To cancel the close contact, it has adopted the configuration that.

  At this time, in the support device of the present invention, it is preferable that the closing means includes a sealing member that elastically deforms to close the gap.

  On the other hand, the support method of the present invention includes an adherend support step of supporting an adherend to which an adhesive sheet of a size protruding from the adherend surface is attached by an adherend support means, and an outer side of the adherend support means. A sheet supporting means for supporting a protruding portion that protrudes from the adherend surface of the adherend, and a close contact between the adherend support means and the adherend. An adhesion release step for releasing the contact, and the adhesion release step includes a closing step of closing a gap between the adherend support means and the sheet support means with a closing means, the closing means, and the sheet support means. And an internal pressure increasing step for increasing the internal pressure of the sealed space formed by the protruding portion, the adherend, and the adherend support means, and the increase in the internal pressure of the sealed space by the internal pressure increasing step. The body support means and the To release the adhesion to the adherend, it has adopted the configuration that.

  According to the present invention as described above, the inner pressure of the closed space formed by the closing means, the sheet support means, the protruding portion, the adherend, and the adherend support means is increased to increase the adherend support means and the adherend. Since the adhesion with the body is released, the tightness of the sealed space is not insufficient due to the outer edge shape and characteristics of the adherend, and the adhesion between the adherend support means and the adherend is surely released. Can do.

  At this time, if the closing means includes a sealing member that elastically deforms to close the gap, the sealing performance of the gap can be improved.

The side view of the sheet sticking apparatus which concerns on one Embodiment of this invention. (A), (B) is operation | movement explanatory drawing of a sheet sticking apparatus. (A), (B) is a side view which concerns on the modification of this invention.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In this embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis that is orthogonal to the predetermined plane. To do. Furthermore, in the present embodiment, when viewed from the front side in FIG. 1 parallel to the Y axis, when indicating the direction, “up” is the arrow direction of the Z axis and “down” is the opposite direction, “ The “left” is the arrow direction of the X axis, “right” is the opposite direction, “front” is the front direction in FIG. 1 parallel to the Y axis, and “rear” is the opposite direction.

  In FIG. 1, a sheet sticking device 10 includes a support device 20 that supports a wafer WF as an adherend, a sticking unit 30 that presses and sticks an adhesive sheet AS to the wafer WF, a support device 20, and a sticking unit 30. And a linear motor 41 as a driving device that supports the support device 20 with a slider 41A.

The supporting device 20 is supported by a linear motion motor 22 as a driving device supported on a frame 21 supported by a slider 41A and an output shaft 22A, and an adhesive sheet AS of a size protruding from the adherend surface WF1 is attached. The support member 23 is supported on the frame 21 via the bracket 21A and the adherend support means 23 for supporting the wafer WF, and is provided outside the adherend support means 23 at a predetermined interval. A sheet supporting unit 24 that supports the protruding portion AS1 of the adhesive sheet AS that protrudes from the adherend surface WF1, and an adhesion releasing unit 25 that releases the adhesion between the adherend supporting unit 23 and the wafer WF are provided.
The adherend support means 23 is formed of a circular member in a top view having a plurality of through holes 23B on a wafer support surface 23A that supports the wafer WF, and holds the wafer WF via a pipe 23C communicating with the through holes 23B. A pressure reducing means 23D is connected as a holding means such as a pressure reducing pump or a vacuum ejector.
The sheet support means 24 includes a ring frame RF and a ring-shaped member having a plurality of through holes 24B on the frame support surface 24A that supports the ring frame RF, and a pipe 24C that communicates with the through holes 24B. A pressure reducing means 24D as a holding means such as a pressure reducing pump or a vacuum ejector for holding the ring frame RF is connected thereto.
The adhesion release means 25 includes a closing means 25A that closes the gap GA between the adherend support means 23 and the sheet support means 24, a closing means 25A, a sheet support means 24, an overhang portion AS1, a wafer WF, and an adhesion. An internal pressure increasing means 25B for increasing the internal pressure of the sealed space SC (see FIG. 2) formed by the body support means 23, and the adherend support means 23 and the wafer are increased by the increase of the internal pressure of the sealed space SC by the internal pressure increasing means 25B. The close contact with the WF is released.
The closing means 25A is composed of a linear motion motor 25C as a driving device supported on the frame 21, a plate 25E supported on the output shaft 25D, and an elastic member such as rubber or resin supported on the plate 25E. And a sealing member 25F having an annular shape in a top view that is elastically deformed to close the gap GA.
The internal pressure increasing means 25B includes a pressurizing means 25H such as a pressurizing pump or a turbine for sending the air AR between the wafer WF and the wafer support surface 23A via a pipe 25G communicating with the through hole 23B.

  The affixing means 30 includes a support roller 31 that supports the original fabric RS with the adhesive sheet AS temporarily attached to the release sheet RL, a guide roller 32 that guides the original fabric RS, and a release sheet RL that is folded back from the release sheet RL. A pinch roller driven by a peeling plate 33 as a peeling means for peeling the adhesive sheet AS, a pressing roller 34 as a pressing means for pressing the adhesive sheet AS against the wafer WF, and a rotation motor 35A as a driving device. 36, a drive roller 35 that sandwiches the release sheet RL, and a recovery roller 37 that recovers the release sheet RL.

In the sheet sticking apparatus 10 described above, a procedure for forming the integrated object WK will be described.
First, after the operator sets the original fabric RS as shown in FIG. 1 with respect to the sheet sticking device 10 indicated by the solid line in FIG. 1 in which each member is arranged at the initial position, an operation panel, personal computer, etc. (not shown) An automatic operation start signal is input via the input means. Then, an unillustrated transfer means such as an operator or an articulated robot or a belt conveyor places the wafer WF and the ring frame RF on the adherend support means 23 and the sheet support means 24 as indicated by solid lines in FIG. Then, the support device 20 drives the decompression means 23D and 24D to start sucking and holding the wafer WF and the ring frame RF on the wafer support surface 23A and the frame support surface 24A, respectively. Next, when the detection means (not shown) such as an optical sensor or an imaging means detects that the upper surfaces of the wafer WF and the ring frame RF are not located on the same plane, the support device 20 drives the linear motor 22 to The height of the adherend support means 23 is adjusted so that are positioned on the same plane.

  Thereafter, the moving unit 40 drives the linear motor 41 to move the support device 20 leftward, and when the detection unit (not shown) such as an optical sensor or an imaging unit detects that the support device 20 has reached a predetermined position. The pasting means 30 drives the rotation motor 35A, and feeds the original fabric RS so that the adhesive sheet AS is supplied to the left at the same speed as the moving speed of the support device 20 to the left. As a result, the adhesive sheet AS is peeled off from the release sheet RL by the release plate 33, and is pressed and stuck to the wafer WF and the ring frame RF by the pressing roller 34, thereby forming an integrated object WK. After the integrated object WK is formed, when the support device 20 reaches a predetermined position on the left side of the pressing roller 34, the moving unit 40 and the support device 20 stop driving the linear motor 41 and the pressure reducing unit 23D. Thereafter, the support device 20 drives the linear motion motor 25C, and as shown in FIG. 2A, the sealing member 25F is raised to close the gap GA between the adherend support means 23 and the sheet support means 24, A sealed space SC is formed. Since the sealing member 25F is elastically deformed when the gap GA is closed, even if there is a step between the bottom surface of the adherend support means 23 and the bottom surface of the sheet support means 24, or the bottom surface thereof is rough, The sealing property of the sealed space SC does not deteriorate.

  Next, the support device 20 drives the pressurizing means 25H, and sends the air AR between the wafer WF and the wafer support surface 23A to release the adhesion between the adherend support means 23 and the wafer WF. At this time, if the supplied air AR flows out from only a part between the wafer support surface 23A and the wafer WF and leaks into the atmosphere through the gap GA, the adherend support means 23, the wafer WF, However, in this embodiment, since the gap GA is closed and the sealed space SC is formed, the air AR that is about to leak into the atmosphere is removed. It can be retained in the sealed space SC. As a result, the internal pressure of the sealed space SC rises and the protruding portion AS1 of the adhesive sheet AS is deformed so as to swell upward, and as shown in FIG. 2B, the wafer WF is pulled up to adhere to the adherend support means 23. The close contact of the entire contact portion in contact with the wafer WF is released. When it is detected by a detection means (not shown) such as an optical sensor or an imaging means that the entire contact portion is released, the support device 20 stops driving the pressurizing means 25H, and then drives the linear motion motor 25C. By lowering the sealing member 25F, the wafer WF is placed again on the wafer support surface 23A.

  Next, after the support device 20 stops driving the decompression means 24D and the transport means (not shown) transports the integrated object WK to the next process, each means drives each drive device to return each member to the initial position. Thereafter, the same operation as described above is repeated.

  According to the embodiment described above, the adherend support is performed by increasing the internal pressure of the sealed space SC formed by the closing means 25A, the sheet support means 24, the protruding portion AS1, the wafer WF, and the adherend support means 23. Since the close contact between the means 23 and the wafer WF is released, the tightness of the sealed space SC is not insufficient due to the outer edge shape and characteristics of the wafer WF, and the close contact between the adherend support means 23 and the wafer WF is ensured. Can be released.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of some or all of such restrictions is included in this invention.

  For example, instead of or together with the closing means 25A, the supporting device 20 has an inner edge portion on an annular plate 26C as viewed from above as shown in FIG. 3A. And a pressure pump that sends air between the plate 26C and the sealing member 26D via a through hole 26E and a pipe 26F formed in the plate 26C. The closing means 26A provided with pressure means 26G such as a turbine or the like is employed, or the upper end and the lower end thereof are supported on the inner peripheral surface of the sheet support means 24 as shown in FIG. The air is sent between the sealing member 27C having an annular shape when viewed from above, the inner peripheral surface of the sheet support means 24 and the sealing member 27C through the through hole 27D and the pipe 27E formed in the sheet support means 24. The closing means 27A that includes a pressurizing means 27F pumps and turbines, etc. to or employed, the sealing member 26D and 27C is expanded may be to close the gap GA. The sealing member 27C shown in FIG. 3B is supported on the outer peripheral surface of the adherend support means 23, and the adherend support means is formed through a through hole and a pipe (not shown) formed in the adherend support means 23. An unillustrated closing means for closing the gap GA by sending air between the outer peripheral surface of 23 and the sealing member 27C may be adopted.

  The support device 20 does not need to raise and lower the adherend support means 23, and employs a driving device that raises and lowers the sheet support means 24 even when the adherend support means 23 is not raised or lowered. The upper surface of the WF and the ring frame RF may be positioned on the same plane, or after the adhesion of the entire contact portion where the adherend support means 23 and the wafer WF are in contact is released, the deposition is performed. The body support means 23 and the wafer WF are relatively moved to place the wafer WF again on the wafer support surface 23A, and then the sealing member 25F is lowered to prevent the wafer WF from being subjected to an impact. Alternatively, the upper surfaces of the wafer WF and the ring frame RF may not be located on the same plane, and if the upper surface positions of the wafer WF and the ring frame RF are known in advance, It may be no detection means for detecting the upper surface position of al, may support the wafer WF to advance the adhesive sheet AS is attached, in this case, bonding means 30 and the moving means 40 may be omitted.

  The adherend support means 23 may be polygonal, elliptical, or any other shape that is a triangle or more when viewed from above, and when the through-hole 23B is not required, such as when the decompression means 23D is not used as the holding means, The through hole 23B may not be provided.

  The seat support unit 24 may support the protruding portion AS1 directly on the frame support surface 24A without using the ring frame RF as a constituent element, or may include other members other than the ring frame RF as a constituent element. The protruding portion AS1 may be supported via a polygonal shape, may be a polygonal ring having a triangular shape larger than the top view, an elliptical ring, or another ring shape, and the pressure reducing unit 24D is not employed as the holding unit. If the through-hole 24B is unnecessary in some cases, the through-hole 24B may not be provided, and the ring frame RF and other members that replace the ring frame RF may have a polygonal ring shape, a circular shape, or a circular shape that is a triangle or more in top view. An oval annular shape, an annular shape having other shapes, a non-annular shape, or the like may be used, and the protruding portion AS from above the protruding portion AS1 toward the sheet support means 24 may be used. It may be provided sheet auxiliary supporting means for supporting and pressing a.

  The closing means 25A may fix the sealing member 25F or move the adherend support means 23 and the sheet support means 24 while moving them to close the gap GA, or may close the wafer WF. The gap GA may be closed before or in parallel with the application of the adhesive sheet AS, and elastically deformable members such as rubber and soft resin can be employed as the sealing members 25F, 26D, and 27C. However, instead of the sealing members 25F, 26D, and 27C, a member that is not elastically deformed, such as a metal or a hard resin, may be employed, the plate 25E may be omitted, and the member that expands the sealing members 26D and 27C may be It may be a gas such as the atmosphere, a single gas or a mixed gas, a liquid such as water or oil, a fluid such as a gel, or a solid, or the plates 25E, 26C, the sealing members 25F, 2 D and 27C are viewed from a circular annular, or polygonal annular triangular, oval annular, may be cyclic other shapes.

  The internal pressure raising means 25B is replaced with or used in combination with the pressurizing means 25H, and between the wafer WF and the wafer support surface 23A, a gas such as air, a single gas or a mixed gas, a liquid such as water or oil, or a gel It is possible to send a fluid such as a body, and not directly between the wafer WF and the wafer support surface 23A, but directly from the outer peripheral surface of the adherend support means 23, the inner peripheral surface of the sheet support means 24, etc. The above air, gas, liquid, gel or solid may be sent to the inner pressure to increase the internal pressure.

  The sticking means 30 is formed by forming a closed-loop cut in the belt-like adhesive sheet base material, so that the inner side thereof becomes an adhesive sheet AS, and a plurality of adhesive sheets AS are temporarily attached to the release sheet RL at a predetermined interval. The attached original fabric may be fed out, or when a raw fabric in which the belt-like adhesive sheet base material is temporarily attached to the release sheet RL is adopted, a closed loop cut is formed in the adhesive sheet base material by the cutting means The adhesive sheet AS may be formed inside the cut, or a band-shaped adhesive sheet base material is attached to the wafer WF and the ring frame RF, and then a closed loop cut is made in the adhesive sheet base material by a cutting means. The adhesive sheet AS may be formed inside the notch, or the adhesive sheet AS may be attached to the wafer WF and the ring frame RF by another apparatus to form the integrated object WK. Good.

  The moving means 40 may or may not fix the position of the support device 20 or move the sticking means 30 while moving the sticking means 30 and stick the adhesive sheet AS to the wafer WF with the sticking means 30. Good.

  The material, type, shape, etc. of the adhesive sheet AS and the adherend are not particularly limited. For example, the adhesive sheet AS may be a circle, an ellipse, a polygon such as a triangle or a quadrangle, or other shapes, or may be of an adhesive form such as pressure sensitive adhesive or heat sensitive adhesive, When the heat-sensitive adhesive sheet AS is employed, it may be bonded by an appropriate method such as providing an appropriate coil heater for heating the adhesive sheet AS or a heating means such as the heating side of the heat pipe. Such an adhesive sheet AS is, for example, a single layer having only an adhesive layer, an intermediate layer between the base sheet and the adhesive layer, a cover layer on the upper surface of the base sheet, etc. Three or more layers, or a so-called double-sided adhesive sheet that can peel the base sheet from the adhesive layer may be used. The double-sided adhesive sheet comprises a single-layer or multi-layer intermediate layer. It may be a single layer or a multilayer having no intermediate layer. Examples of the adherend include, for example, foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit board, information recording substrates such as optical disks, glass plates, steel plates, ceramics, wood plates or resin plates, Arbitrary forms of members and articles can also be targeted. In addition, the adhesive sheet AS is replaced with a functional and intended reading, for example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc. Arbitrary sheets, films, tapes, and the like in shape can be attached to any processing object as described above.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, if the adherend support means is capable of supporting an adherend to which an adhesive sheet of a size protruding from the adherend surface of the adherend is attached, it can be compared with the technical common sense at the beginning of the application. There is no limitation as long as it is within the range (the description of other means and steps is omitted).
Further, the drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).
In the above-described embodiment, when rollers are employed, a drive device that rotationally drives each roller may be provided, or the surface of each roller may be configured with a member capable of elastic deformation such as rubber or resin. In addition, each roller may be constituted by a member that does not elastically deform, or when a pressing means or pressing member such as a pressing roller or a pressing head is employed, instead of or in combination with those exemplified above, a roller , A pressing member made of a round bar, blade material, rubber, resin, sponge, etc., or a structure of pressing by blowing air such as air or gas, or a pressing means or pressing member The part may be composed of a member that can be elastically deformed, such as rubber or resin, or may be composed of a member that is not elastically deformed, and if a stripping means or stripping member is employed, a round bar, a roller Etc. In the case where a structure that supports or holds a supported member such as a supporting (holding) means or a supporting (holding) member is employed, a gripping means such as a mechanical chuck or a chuck cylinder, a coulomb force, an adhesive, or an adhesive In addition, a configuration that supports (holds) a supported member by magnetic force, Bernoulli adsorption, driving equipment, or the like may be employed, and when a cutting means or a cutting blade is employed, instead of or in combination with those exemplified above Then, use a cutting member such as a cutter blade, laser cutter, ion beam, thermal power, heat, water pressure, heating wire, spraying of gas or liquid, etc., or move the cutting member with a combination of appropriate driving equipment Or may be cut.

20 support device 23 adherend support means 24 sheet support means 25 adhesion release means 25A, 26A, 27A closing means 25B internal pressure raising means 25F, 26D, 27C sealing member AS adhesive sheet AS1 protruding portion GA gap SC sealed space WF wafer (covered) Kimono)
WF1 surface

Claims (3)

An adherend support means for supporting an adherend to which an adhesive sheet of a size protruding from the adherend surface is attached;
A sheet supporting means that is provided outside the adherend support means at a predetermined interval and supports a protruding portion of the adhesive sheet that protrudes from the adherend surface of the adherend;
An adhesion release means for releasing adhesion between the adherend support means and the adherend;
The adhesion release means includes a closing means for closing a gap between the adherend support means and the sheet support means, the closing means, the sheet support means, the protruding portion, the adherend, and the cover. An internal pressure increasing means for increasing the internal pressure of the sealed space formed by the adherend support means, and the adhesion between the adherend support means and the adherend is increased by increasing the internal pressure of the sealed space by the internal pressure increasing means. A support device that is released.   The support device according to claim 1, wherein the closing unit includes a sealing member that elastically deforms to close the gap. An adherend support step of supporting an adherend to which an adhesive sheet of a size protruding from the adherend surface is attached by an adherend support means;
A sheet support step for supporting a protruding portion protruding from the adherend surface of the adherend by sheet support means provided at a predetermined interval outside the adherend support means;
An adhesion release step for releasing adhesion between the adherend support means and the adherend,
The adhesion releasing step includes a closing step of closing a gap between the adherend support means and the sheet support means with a closing means, the closing means, the sheet support means, the protruding portion, the adherend, An internal pressure increasing step for increasing the internal pressure of the sealed space formed by the adherend support means, and the adherend support means and the adherend are formed by increasing the internal pressure of the sealed space by the internal pressure increasing step. The support method characterized by canceling the close contact.

Images