WO2013035854A1

WO2013035854A1 - Contact exposure device and contact exposure method

Info

Publication number: WO2013035854A1
Application number: PCT/JP2012/072952
Authority: WO
Inventors: 宏池淵; 敦桝添; 秀樹岡谷
Original assignee: Ｎｓｋテクノロジー株式会社
Priority date: 2011-09-09
Filing date: 2012-09-07
Publication date: 2013-03-14
Also published as: JP2013070042A; KR101558111B1; JP6142450B2; TWI506381B; KR20140041819A; TW201316137A

Abstract

A holding surface (11a) of a substrate holding part (11) is provided with a plurality of first air flow holes (31) and a plurality of second air flow holes (32) provided outside the plurality of first air flow holes (31), the first air flow holes and the second air flow holes being bored toward the back surface of a workpiece (W), and on the inner peripheral side and the outer peripheral side of a region (E) in which the plurality of second air flow holes (32) are bored, annular inner peripheral side elastic member (33) and outer peripheral side elastic member (34) that are able to be in contact with the back surface of the workpiece (W) are disposed, respectively. Between a mask holding part (4) and the substrate holding part (11), an elastic sealing member (35) that surrounds a mask (M) and the workpiece (W) is provided, and a sealed space (S) is defined by the mask (M), the mask holding part (4), the substrate holding part (11), and the sealing member (35). A control means (30) causes the plurality of first air flow holes (31) to be open to the atmosphere, sucks in air from the plurality of second air flow holes (32), sucks in air within the sealed space (S) to make the pressure in the sealed space (S) negative pressure, and when the pressure in the sealed space (S) reaches a predetermined reference negative pressure, causes the plurality of second air flow holes (32) to be open to the atmosphere.

Description

Contact exposure apparatus and contact exposure method

The present invention relates to a contact exposure apparatus and a contact exposure method for performing exposure by bringing a mask and a workpiece into close contact with each other.

Conventionally, as a method for exposing a liquid crystal display panel or a semiconductor element, a contact exposure method in which exposure is performed in a state where a mask and a work are in contact with each other is known. In this exposure method, the resolution can be improved as compared with the proximity exposure method in which exposure is normally performed with a mask and a workpiece in close proximity to each other.

As a conventional contact exposure apparatus, there is one in which the area surrounded by the vacuum seal portion is smaller than the area of the mask (see, for example, Patent Document 1). As a result, even if the pressure in the seal space is brought close to the mask suction pressure to increase the contact force between the mask and the workpiece, the mask will not lift or come off from the mask stage, so that sufficient contact force can be secured. ing.

Also, the amount of displacement between the alignment marks of the mask and the substrate is calculated, the amount of deformation that deforms the mask and the substrate into a concave or convex shape is converted into pressure according to the calculation result, and the substrate support member is controlled by reducing the pressure. An exposure method is disclosed in which the mask pattern does not deviate from the workpiece (see, for example, Patent Document 2).

Further, in the contact exposure method, as a method for adsorbing the workpiece to the mask, at least two systems of pipelines are provided in the workpiece fixing portion, the pipeline ends of one system are arranged at the ends of the workpiece, and the pipeline is It is known that the work and the mask are brought into close contact (soft contact) by evacuating and fixing the work to the work fixing part, stopping the exhaust from the pipes of other systems and releasing the gas (for example, , See Patent Document 3).

In the contact exposure method described in Patent Document 4, a seal member is interposed between the workpiece and the mask, and the space surrounded by the workpiece support base, the workpiece, the seal member, and the mask and the pressure inside the seal member are adjusted. However, by changing the outer diameter of the seal, the mask is made to adhere uniformly over the entire surface of the workpiece.

Further, in the contact exposure method described in Patent Document 5, a convex mask having one surface of the mask as a convex surface is used, and the mask and the wafer are brought into close contact with each other at a peripheral portion of the mask after the convex surface and the wafer are in close contact with each other. By applying pressure, the wafer is deformed, and good adhesion is obtained over the entire surface of the convex surface of the mask. In addition, the pressure at which the mask and the wafer are brought into close contact with each other is adjusted by a screw tightening torque, the number of screw tightening pitches, or the like.

Japanese Unexamined Patent Publication No. 11-186124 Japanese Patent No. 3993278 Japanese Unexamined Patent Publication No. 8-83749 Japanese Unexamined Patent Publication No. 2004-54255 Japanese Unexamined Patent Publication No. 2005-156590

However, in Patent Document 1 and Patent Document 2, when the work is brought into close contact with the mask, the shear strain generated in the work is not taken into account, and there is a possibility that the substrate may be broken by this shear strain. There is a possibility that good exposure accuracy cannot be obtained due to the deviation of the workpiece.

Further, in the contact exposure method described in Patent Document 3, since the work is brought into close contact with the mask by adjusting the pressure only by opening and closing the valve, the contact between the work and the mask locally varies and exposure is performed. There is a problem that accuracy is not good. Further, in Patent Document 3, since the workpiece is disposed on the workpiece stage in a protruding shape, when air is ejected onto the workpiece, the center of gravity of the workpiece is displaced due to variations in the pressure of the air discharged from the piping, and the workpiece When the workpiece stage is in contact with the workpiece stage, the workpiece may be damaged.

Also, in the contact exposure method of Patent Document 4, since the outer diameter of the seal varies, there is a problem that this variation affects the exposure accuracy and the exposure accuracy is not good.

Furthermore, in the contact exposure method of Patent Document 5, since the pressure for bringing the mask and wafer into close contact with each other by screw tightening is managed, the contact state between the mask and the wafer cannot be accurately grasped, and the exposure accuracy is not good. is there.

The present invention has been made in view of the above-described problems, and an object thereof is to provide a contact exposure apparatus and a contact exposure method that can improve the contact performance between a substrate and a mask.

The above object of the present invention can be achieved by the following constitution.
(1) a mask holding unit for holding a mask having a pattern to be exposed;
A substrate holding part having a holding surface for holding a substrate as an exposed material;
An illumination optical system that irradiates exposure light through the mask onto the substrate held on the holding surface, and a contact exposure apparatus that exposes the mask and the substrate in close contact with each other,
The holding surface has a plurality of air circulation holes that are open toward the back surface of the substrate and through which air flows.
The plurality of air circulation holes include a plurality of first air circulation holes and a plurality of second air circulation holes provided outside the plurality of first air circulation holes,
On the holding surface, annular inner peripheral side elastic members and outer peripheral side elastic members that can come into contact with the back surface of the substrate are disposed on the inner peripheral side and the outer peripheral side of the region where the plurality of second air circulation holes are opened. And
A contact exposure apparatus, wherein a control means for controlling the pressure or flow rate of air flowing through each of the air flow holes is provided so that the mask and the substrate are in close contact with each other.
(2) A region where the plurality of second air circulation holes are open corresponds to a peripheral edge of the back surface of the substrate,
The contact exposure apparatus according to (1), wherein a peripheral portion of the substrate is restrained by the substrate holding portion by sucking the plurality of second air circulation holes.
(3) An elastic sealing member that surrounds the mask and the substrate is provided between the mask holding unit and the substrate holding unit,
The sealed space surrounded by the mask, the mask holding portion, the substrate holding portion, and the sealing member is decompressed by sucking air in the sealed space (1) or (2) ) Contact exposure apparatus.
(4) The control means opens the plurality of first air circulation holes to the atmosphere, sucks air from the plurality of second air circulation holes, and sucks air in the sealed space to seal the sealing Negative pressure in the space,
The contact exposure apparatus according to (3), wherein when the pressure in the sealed space reaches a predetermined reference negative pressure, the plurality of second air circulation holes are opened to the atmosphere.
(5) The contact exposure apparatus according to (1), wherein the substrate is constrained by the substrate holding portion by being in close contact with the inner peripheral elastic member and the outer peripheral elastic member.
(6) a mask holding unit for holding a mask having a pattern to be exposed;
A substrate holding part having a holding surface for holding a substrate as an exposed material;
An illumination optical system that irradiates exposure light onto the substrate held on the holding surface through the mask;
The holding surface is formed with a plurality of air circulation holes that open on the back surface of the substrate and through which air flows.
The plurality of air circulation holes include a plurality of first air circulation holes and a plurality of second air circulation holes provided outside the plurality of first air circulation holes,
On the holding surface, annular inner peripheral side elastic members and outer peripheral side elastic members that can come into contact with the back surface of the substrate are disposed on the inner peripheral side and the outer peripheral side of the region where the plurality of second air circulation holes open, respectively. And
Between the mask holding part and the substrate holding part, an elastic sealing member surrounding the mask and the substrate is provided,
A contact exposure method that forms a sealed space by the mask, the mask holding unit, the substrate holding unit, and the sealing member, and that exposes the mask and the substrate in close contact with each other using a contact exposure apparatus,
By opening the plurality of first air circulation holes to the atmosphere and sucking air from the plurality of second air circulation holes, the peripheral edge portion of the substrate is restrained by the substrate holding portion, and the air in the sealed space is discharged. Suction to create a negative pressure in the sealed space,
The contact exposure method, wherein when the pressure in the sealed space reaches a predetermined reference negative pressure, the plurality of second air circulation holes are opened to the atmosphere.
(7) a mask holding unit for holding a mask having a pattern to be exposed;
A substrate holding part having a holding surface for holding a substrate as an exposed material;
An illumination optical system that irradiates exposure light through the mask onto the substrate held on the holding surface, and a contact exposure apparatus that exposes the mask and the substrate in close contact with each other,
The holding surface is formed with a plurality of protrusions that can contact the back surface of the substrate, and a plurality of air circulation holes that open toward the back surface of the substrate and through which air flows,
A contact exposure apparatus, comprising: a control means for controlling a pressure or a flow rate of air ejected from each air circulation hole toward the substrate so that the mask and the substrate are in close contact with each other.
(8) The control unit controls the pressure or flow rate of air ejected from each air circulation hole so as to increase from the central portion of the mask toward the periphery. Contact exposure apparatus.
(9) The holding surface is formed with a partition wall defining an area so as to surround at least one of the air circulation holes and capable of contacting the back surface of the substrate (7) or The contact exposure apparatus according to (8).
(10) The apparatus further includes a substrate driving unit that drives the substrate holding unit so as to move the holding surface in the vertical direction.
When the substrate is exposed, the substrate driving unit moves the holding surface so that the substrate is not separated from the holding surface by the air ejected from the air circulation hole (7) to (7) 9) The contact exposure apparatus according to any one of the above.
(11) further comprising a sensor for detecting a gap between the substrate and the mask;
The control means controls the pressure or flow rate of air ejected from each of the air circulation holes according to the gap detected by the sensor, according to any one of (7) to (10), Contact exposure apparatus.
(12) a mask holding unit for holding a mask having a pattern to be exposed;
A substrate holding part having a holding surface for holding a substrate as an exposed material;
An illumination optical system that irradiates exposure light through the mask onto the substrate held on the holding surface, and a contact exposure method that exposes the mask and the substrate in close contact with each other,
The holding surface is formed with a plurality of protrusions that can come into contact with the back surface of the substrate, and a plurality of air circulation holes that are open on the back surface of the substrate and through which air flows.
A contact exposure method characterized in that the mask and the substrate are brought into close contact with each other by controlling the pressure or flow rate of air ejected from the air flow holes toward the substrate.
(13) When the mask and the substrate are brought into close contact with each other, the pressure or flow rate of the air ejected from each air circulation hole is controlled to increase from the central portion of the mask toward the periphery ( The contact exposure method according to 12).
(14) The holding surface is formed with a partition wall defining an area so as to surround at least one of the air circulation holes and capable of contacting the back surface of the substrate (12) or The contact exposure method according to (13).
(15) It further includes a substrate driving unit that drives the substrate holding unit so as to move the holding surface in the vertical direction.
When exposing the substrate, the substrate driving unit moves the holding surface so that the substrate is not separated from the holding surface by the air ejected from the air circulation hole (12) to (12) The contact exposure method according to any one of 14).
(16) It further comprises a sensor for detecting a gap between the substrate and the mask,
(12) to (15), wherein when the mask and the substrate are brought into close contact with each other, the pressure or flow rate of the air ejected from each of the air circulation holes is controlled according to the gap detected by the sensor. The contact exposure method according to any one of the above.

Here, “controlling the pressure or flow rate of air flowing through each air circulation hole” includes the case where the air circulation hole is opened to the atmosphere.

According to the contact exposure apparatus and the contact exposure method of the present invention, the holding surface has a plurality of first air circulation holes through which air flows, and a plurality of second air holes provided outside the plurality of first air circulation holes. An air circulation hole is opened toward the back surface of the substrate, and an inner circumferential side and an outer circumferential side of a region where the plurality of second air circulation holes are opened are annular inner circumferential elastic members that can contact the back surface of the substrate, and The outer peripheral side elastic member is disposed, and the mask and the substrate are brought into close contact with each other by controlling the pressure or flow rate of the air flowing through each air circulation hole. Therefore, the deviation between the substrate and the mask can be prevented, the adhesion performance can be improved, and the exposure accuracy can be improved.

Further, according to the contact exposure apparatus and the contact exposure method of the present invention, the holding surface has a plurality of protrusions that can contact the back surface of the substrate, and a plurality of air that opens toward the back surface of the substrate and through which air flows. A flow hole is formed, and the mask and the substrate are brought into close contact with each other by controlling the pressure or flow rate of air ejected from each air flow hole toward the substrate. Therefore, the adhesion performance between the substrate and the mask can be improved, and the exposure accuracy can be improved. Further, the protrusion provided on the holding surface can prevent damage to the substrate caused by friction between the substrate and the holding surface.

1 is a side sectional view of a contact exposure apparatus according to a first embodiment of the present invention. It is the figure which expanded the site | part shown by the arrow II of the structure of FIG. It is a top view of the holding surface of the board | substrate holding part shown in FIG. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3, showing a state in which air is sucked from a second air circulation hole and the peripheral edge of the substrate is restrained by the holding surface. Line IV-IV in FIG. 3 shows a state in which the central portion of the substrate whose peripheral portion is constrained by the holding surface is elastically deformed upward by opening the first air circulation hole to the atmosphere and making the sealed space negative pressure. FIG. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3, showing a state in which the substrate is elastically deformed and is in close contact with the mask from the central portion of the substrate. FIG. 4 is a cross-sectional view taken along the line IV-IV in FIG. 3, showing a state in which the second air circulation hole is opened to the atmosphere and the substrate whose peripheral portion is restrained is in close contact with the mask. It is a top view of the holding surface of the board | substrate holding part of 2nd Embodiment. (A), (b) is sectional drawing along the IX-IX line of FIG. 8, which shows the process which adhere | attaches a mask and a board | substrate. FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. 8, showing a state in which a mask and a substrate according to a first modification of the second embodiment are in close contact with each other. It is a top view of the holding surface of the board | substrate holding part which concerns on the 2nd modification of 2nd Embodiment. FIG. 12 is a cross-sectional view taken along the line XII-XII of FIG. 11 showing a process of closely attaching the mask and the substrate.

Hereinafter, each preferred embodiment of the present invention will be described with reference to the drawings.
(First embodiment)
FIG. 1 is a side sectional view of a contact exposure apparatus according to the first embodiment. FIG. 2 is an enlarged view of a portion indicated by an arrow II in the configuration of FIG. In FIGS. 1 and 2, an aperture mechanism that blocks a part of the exposure light is omitted.

In the contact exposure apparatus CE of the present embodiment, the base 1 is placed on the surface plate G in FIG. A frame 3 is installed on the base 1. The frame 3 includes a leg portion 3a having a lower end fixed to the edge of the base 1, and a rectangular frame-shaped top plate 3b attached to the upper end of the leg portion 3a. A rectangular opening is formed at the center of the top plate 3b, and a mask holding portion 4 that holds the periphery of the mask M by suction is attached around the opening. A sensor 20 for detecting a gap between a workpiece (substrate) W as a material to be exposed and the mask M is attached to the top plate 3b. On the mask M, a pattern to be exposed on the workpiece W is drawn.

On the upper surface of the base 1, four guide rails 5 are arranged in parallel and extend in the left-right direction (X-axis direction) in FIG. A slider 6 is movably provided along each guide rail 5. The slider 6 is attached to the lower surface of the X-axis stage 7. An X-axis linear motor (not shown) is provided between the base 1 and the X-axis stage 7 so that the X-axis stage 7 can be driven in the X-axis direction with respect to the base 1.

On the upper surface of the X-axis stage 7, four guide rails 9 are arranged in parallel and extend in the direction perpendicular to the paper surface (Y-axis direction) in FIG. A slider 10 is movably provided along each guide rail 9. The slider 10 is attached to the lower surface of the Y-axis stage 13. A Y-axis linear motor 12 is provided between the X-axis stage 7 and the Y-axis stage 13 so that the Y-axis stage 13 can be driven in the Y-axis direction with respect to the X-axis stage 7. The substrate holding unit 11 is driven between the Y-axis stage 13 and the substrate holding unit 11 provided above the Y-axis stage 13 so that the holding surface 11a moves in the vertical direction (Z-axis direction) and the tilt direction in FIG. A Z-axis drive unit (substrate drive unit) 14 is provided. The substrate holding unit 11 constitutes a holding surface 11 a that holds the workpiece W.

In FIG. 2, the sensor 20 includes a support portion 22 that is movably supported via a slider 21 with respect to a guide rail 3 c that is attached to the upper surface of the top plate 3 b, and a measurement portion that is attached to the tip of the support portion 22. 23. The measurement unit 23 includes a light emitting unit 23a and a light receiving unit 23b. The support portion 22 is driven to an arbitrary position along the guide rail 3c by a linear motor (not shown). It is preferable to provide a plurality of (for example, four) sensors 20. The sensor 20 may be an optical transmission type, an eddy current type, or an ultrasonic type.

Further, an illumination optical system (not shown) that irradiates the workpiece W held on the holding surface 11a with exposure light through the mask M is disposed above the mask holding unit 4.

As shown in FIGS. 3 and 4, the holding surface 11 a of the substrate holding unit 11 has a plurality of first air circulation holes 31 that open toward the back surface of the workpiece W and through which air flows, and the plurality of first air holes. A plurality of second air circulation holes 32 provided outside the air circulation holes 31 and a plurality of pins (not shown) that advance from the holding surface 11a when the workpiece W is conveyed to the holding surface 11a by a work loader (not shown). And a plurality of pin holes (not shown) that can be moved back and forth. The plurality of second air circulation holes 32 are opened in a substantially rectangular frame-shaped region E corresponding to the peripheral edge 15 on the back surface of the workpiece W. In addition, on the holding surface 11 a, annular inner peripheral side elastic members 33 and outer peripheral side elastic members 34 that can come into contact with the back surface of the workpiece W are disposed on the inner peripheral side and the outer peripheral side of the region E, respectively.

The holding surface 11a on the outer peripheral side further than the outer peripheral elastic member 34 is formed in an annular shape so as to surround the mask M and the work W, and comes into contact with the back surface 4a of the mask holding unit 4 to hold the mask holding unit 4 and the substrate holding unit 11. An elastic sealing member 35 capable of sealing between the two is provided. Thereby, as shown in FIGS. 2 and 4, a sealed space S surrounded by the mask M, the mask holding unit 4, the substrate holding unit 11, and the sealing member 35 is defined. The mask holding part 4 is provided with a suction hole 36 communicating with the sealed space S.

The plurality of second air circulation holes 32 and suction holes 36 are all connected to a negative pressure generating device such as a vacuum pump through a pipe (not shown). Regulators and valves provided in the middle of the piping are controlled by the control means 30 (see FIG. 1), and the negative pressure generator is operated to suck the air from the suction hole 36, thereby reducing the inside of the sealed space S. In addition, air is sucked from the plurality of second air circulation holes 32 or released to the atmosphere.

In the contact exposure apparatus CE configured as described above, as shown in FIG. 4, the mask M is sucked and held on the mask holding unit 4, the workpiece W is placed on the holding surface 11 a of the substrate holding unit 11, and the sealing member The space between the mask holding unit 4 and the substrate holding unit 11 is sealed at 35, and a sealed space S is defined by the mask M, the mask holding unit 4, the substrate holding unit 11, and the sealing member 35.

The control means 30 sucks air in the sealed space S from the suction hole 36 and depressurizes the sealed space S. Further, immediately after the pressure reduction, air is sucked from the plurality of second air circulation holes 32 to reduce the pressure in the region E surrounded by the inner peripheral side elastic member 33 and the outer peripheral side elastic member 34, and the peripheral edge of the back surface of the work W The part 15 is constrained to the holding surface 11a.

Thereby, as shown in FIG. 5, since the plurality of first air circulation holes 31 are opened to the atmosphere, the workpiece W in which the peripheral edge portion 15 is restrained by the holding surface 11a is negative on the surface side (sealed space S). The central portion starts to bulge upward due to the pressure, and eventually comes into close contact with the mask M. At this time, the workpiece W is subjected to shear strain due to elastic deformation. However, since the shear strain is alleviated by the inner peripheral side elastic member 33 and the outer peripheral side elastic member 34 which are elastic bodies, there is no possibility that the workpiece W is broken. Further, when the workpiece W comes in contact with the mask M, the peripheral edge portion 15 of the workpiece W does not suck air from the plurality of second air circulation holes 32 due to the force received from the mask M. And the outer peripheral side elastic member 34, and can be restrained by the substrate holder 11. Accordingly, in this case, suction from the plurality of second air circulation holes 32 is not performed thereafter.

As shown in FIG. 6, when the sealed space S is further depressurized, the contact area of the mask M, the workpiece W, and the contact area gradually spreads outward from the central portion, and the pressure in the sealed space S eventually reaches a predetermined reference negative pressure. . As shown in FIG. 7, when the pressure in the sealed space S reaches a predetermined reference negative pressure, the control means 30 opens the plurality of second air circulation holes 32 to the atmosphere. As a result, the workpiece W, which has been elastically deformed with the peripheral edge 15 restrained by the holding surface 11a, is separated from the holding surface 11a by releasing this restraining force, and the mask M is not displaced. It adheres closely to the mask M in accordance with the flatness.

As described above, according to the contact exposure apparatus CE and the contact exposure method of the present embodiment, the holding surface 11a includes the plurality of first air circulation holes 31 that open toward the back surface of the workpiece W, and the plurality of first air circulation holes 31a. A plurality of second air circulation holes 32 provided outside the one air circulation hole 31 are formed, and the back surface of the work W is disposed on the inner peripheral side and the outer peripheral side of the region E where the plurality of second air circulation holes 32 open. An annular inner peripheral elastic member 33 and an outer peripheral elastic member 34 that are in contact with each other are arranged, and the control means 30 controls the pressure or flow rate of the air flowing through each of the air flow holes 31 and 32 so that the mask M And the work W are brought into close contact with each other. Therefore, the inner peripheral side elastic member 33 and the outer peripheral side elastic member 34 reduce the shear strain generated in the workpiece W to prevent the workpiece W from being broken, improve the adhesion performance between the workpiece W and the mask M, and the exposure accuracy. Can be improved. In addition, since the workpiece W comes into contact with the mask M from the central portion, the contact area is gradually expanded toward the outer peripheral side, and finally the entire surface comes into contact with each other, so that the mask M and the workpiece W are in close contact with each other.

Moreover, since the peripheral part 15 of the workpiece | work W is restrained by the board | substrate holding | maintenance part 11 by attracting | sucking the several 2nd air circulation hole 32 opened to the area | region E corresponding to the peripheral part 15 of the back surface of the workpiece | work W, it is reliable. The peripheral edge 15 of the work W can be restrained by the substrate holding part 11.

Further, an elastic sealing member 35 surrounding the mask M and the workpiece W is provided between the mask holding unit 4 and the substrate holding unit 11, and the mask M, the mask holding unit 4, the substrate holding unit 11, and the sealing member are provided. Since the air in the sealed space S surrounded by 35 is sucked and depressurized, the workpiece W comes into close contact with the mask M.

Further, the control means 30 opens the plurality of first air circulation holes 31 to the atmosphere, sucks air from the plurality of second air circulation holes 32, and sucks the air in the sealed space S to create the inside of the sealed space S. When the pressure in the sealed space S reaches a predetermined reference negative pressure, the plurality of second air circulation holes 32 are opened to the atmosphere, so that the workpiece W is elastically deformed to gradually start the mask M from the central portion. After the contact, the work piece W can be brought into close contact with the mask M in accordance with the flatness of the mask M by releasing the restraint of the peripheral edge 15 by the holding surface 11a (region E).

In the above embodiment, the peripheral edge 15 of the workpiece W is restrained by the substrate holding part 11 by sucking air from the second air circulation hole 32, but air is sucked from the second air circulation hole 32. Alternatively, the peripheral edge 15 of the workpiece W may be brought into close contact with the inner peripheral elastic member 33 and the outer peripheral elastic member 34 so that the peripheral edge 15 of the workpiece W is restrained by the substrate holding portion 11.

(Second Embodiment)
Next, a contact exposure apparatus CE and a contact exposure method according to a second embodiment of the present invention will be described with reference to FIGS. Note that the same or equivalent parts as those of the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.

As shown in FIG. 8, the holding surface 11 a of the substrate holding portion 11 has a plurality of protrusions 11 b that can contact the back surface of the workpiece W and a plurality of air circulation holes from which air is ejected toward the back surface of the workpiece W. 11c and a plurality of pin holes (not shown) through which a plurality of pins (not shown) advanced from the holding surface 11a can be advanced and retracted when the workpiece W is conveyed to the holding surface 11a by a work loader (not shown). Is formed. The role of the protrusion 11b is to reduce damage to the work W caused by friction between the work W and the holding surface 11a. When the protrusion 11b is not provided, when air is ejected to the workpiece W, the air flow rate or pressure is nonuniform, and the workpiece may be tilted and the portion contacting the holding surface 11a may be damaged.

A plurality of air circulation holes 11c are supplied with air passing through a pipe from a fan and a blower (not shown), and the pressure or flow rate of the air is controlled by a regulator provided in the middle of the pipe. It is controlled by driving a valve or the like, and the amount of air ejected onto the workpiece W is controlled. The plurality of air circulation holes 11c can be arbitrarily arranged, and the ejection of air can be performed selectively and independently according to the arrangement of the piping and the air circulation holes 11c.

In the contact exposure apparatus CE configured as described above, the mask M held by the mask holding unit 4 and the workpiece W held by the holding surface 11a of the substrate holding unit 11 are provided on the holding surface 11a so as to closely contact each other. Further, air is ejected toward the workpiece W from the plurality of air circulation holes 11c. For example, as shown in FIG. 9 (a), the portion of the work W facing the vicinity of the center of the mask M is the highest, and the work W is ejected from each air circulation hole 11c so as to have a convex arch shape. Control air pressure or flow rate. 9A and 9B, the length of the arrow in the air circulation hole 11c indicates the magnitude of the air flow rate.

Further, since the mask M is normally bent near the center, the control means 30 controls the pressure or flow rate of the air ejected from each air circulation hole 11c so as to increase from the central portion of the mask M toward the periphery. . Thereby, the air accumulated in the vicinity of the center between the mask M and the workpiece W can be released toward the periphery.

Thereafter, as shown in FIG. 9B, the pressure or flow rate of the air ejected from each air circulation hole 11c is controlled so as to follow the flatness of the mask M. And the control means 30 makes the sensor 20 scan, and when the clearance gap between the mask M and the workpiece | work W is confirmed by the sensor 20, the pressure or flow volume of the air which ejects from each air circulation hole 11c is raised, The mask M and the work W are brought into close contact with each other.

When the workpiece W is exposed, it is preferable that the workpiece W is not separated from the holding surface 11a by the air ejected from the air circulation hole 11c while the mask M and the workpiece W are in close contact with each other. For this reason, the Z-axis drive part 14 moves the holding surface 11a so that the workpiece | work W may not leave | separate from the holding surface 11a.
However, as in the modification shown in FIG. 10, the workpiece W may be exposed while being lifted by air. In this case, the projection 11b of the holding surface 11a, the air circulation hole 11c, and the like are surely affected by the transfer pattern. Can be prevented.

Also, in order to bring the mask M and the workpiece W into close contact, the thickness of the workpiece W is preferably 2 mm or more in consideration of cracks in the workpiece W. On the other hand, in order to adhere the mask and the workpiece W along the flatness of the mask M, the thickness of the workpiece W is preferably 3 mm or less. Accordingly, the thickness of the workpiece W is preferably 2 to 3 mm ± 0.2 mm, and more preferably 2.5 mm ± 0.2 in consideration of exposure accuracy.

As described above, according to the contact exposure apparatus CE and the contact exposure method of the present embodiment, the holding surface 11a has the plurality of protrusions 11b that can contact the back surface of the work W and the back surface of the work W. A plurality of air circulation holes 11c through which air is ejected are formed, and the mask M and the workpiece W are brought into close contact with each other by controlling the pressure or flow rate of the air ejected from each air circulation hole 11c toward the workpiece W. I did it. Therefore, the adhesion performance between the workpiece W and the mask M can be improved, and the exposure accuracy can be improved. Further, the protrusion 11b provided on the holding surface 11a can prevent the workpiece W from being damaged due to friction between the workpiece W and the holding surface 11a.

As a modification of the present embodiment, as shown in FIGS. 11 and 12, the holding surface 11a has regions 80a to 80e so as to surround at least one air circulation hole 11c. A partition wall 11d that can abut on may be formed. Note that the partition wall 11d has a height equal to that of the protrusion 11b.

Thus, by providing the partition wall 11d, the air pressure or flow rate may be controlled for each region. Further, for example, as in the above-described embodiment, first, the flow rate of the air ejected from the central region 80a is increased, and then the outer annular region so as to follow the flatness of the mask M. You may make it enlarge the flow volume of the air which blows out from 80b and the long area |

region

80c, 80d, 80e of the circumference | surroundings around it.

Note that the present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the gist of the present invention.

For example, in the present invention, the holding surface 11a is configured to have at least a plurality of protrusions 11b, but may be configured to include a partition wall 11d instead of providing the plurality of protrusions 11b.
The present invention is based on a Japanese patent application filed on September 9, 2011 (Japanese Patent Application No. 2011-197363) and a Japanese patent application filed on September 3, 2012 (Japanese Patent Application No. 2012-193297). The contents are incorporated herein by reference.

4 Mask holding part 11 Substrate holding part 11a Holding surface 11b Projection 11c Air flow hole 11d Partition wall 14 Z-axis drive part (substrate drive part)
15 peripheral edge 20 sensor 30 control means 31 first air circulation hole 32 second air circulation hole 33 inner circumference side elastic member 34 outer circumference side elastic member 35 sealing members 80a to 80e adsorption area CE contact exposure apparatus E second air circulation hole Opening area M Mask S Sealing space W Workpiece (substrate)

Claims

A mask holding unit for holding a mask having a pattern to be exposed;
A substrate holding part having a holding surface for holding a substrate as an exposed material;
An illumination optical system that irradiates exposure light through the mask onto the substrate held on the holding surface, and a contact exposure apparatus that exposes the mask and the substrate in close contact with each other,
The holding surface has a plurality of air circulation holes that are open toward the back surface of the substrate and through which air flows.
The plurality of air circulation holes include a plurality of first air circulation holes and a plurality of second air circulation holes provided outside the plurality of first air circulation holes,
On the holding surface, annular inner peripheral side elastic members and outer peripheral side elastic members that can come into contact with the back surface of the substrate are disposed on the inner peripheral side and the outer peripheral side of the region where the plurality of second air circulation holes are opened. And
A contact exposure apparatus, wherein a control means for controlling the pressure or flow rate of air flowing through each of the air flow holes is provided so that the mask and the substrate are in close contact with each other.
The region where the plurality of second air circulation holes open corresponds to the peripheral edge of the back surface of the substrate,
The contact exposure apparatus according to claim 1, wherein a peripheral portion of the substrate is restrained by the substrate holding portion by sucking the plurality of second air circulation holes.
Between the mask holding part and the substrate holding part, an elastic sealing member surrounding the mask and the substrate is provided,
3. The sealed space surrounded by the mask, the mask holding part, the substrate holding part, and the sealing member is decompressed by sucking air in the sealed space. The contact exposure apparatus described.
The control means opens the plurality of first air circulation holes to the atmosphere, sucks air from the plurality of second air circulation holes, and sucks air in the sealed space, Negative pressure,
The contact exposure apparatus according to claim 3, wherein when the pressure in the sealed space reaches a predetermined reference negative pressure, the plurality of second air circulation holes are opened to the atmosphere.
The contact exposure apparatus according to claim 1, wherein the substrate is constrained by the substrate holding unit by being in close contact with the inner peripheral elastic member and the outer peripheral elastic member.
A mask holding unit for holding a mask having a pattern to be exposed;
A substrate holding part having a holding surface for holding a substrate as an exposed material;
An illumination optical system that irradiates exposure light onto the substrate held on the holding surface through the mask;
The holding surface is formed with a plurality of air circulation holes that open on the back surface of the substrate and through which air flows.
The plurality of air circulation holes include a plurality of first air circulation holes and a plurality of second air circulation holes provided outside the plurality of first air circulation holes,
On the holding surface, annular inner peripheral side elastic members and outer peripheral side elastic members that can come into contact with the back surface of the substrate are disposed on the inner peripheral side and the outer peripheral side of the region where the plurality of second air circulation holes open, respectively. And
Between the mask holding part and the substrate holding part, an elastic sealing member surrounding the mask and the substrate is provided,
A contact exposure method that forms a sealed space by the mask, the mask holding unit, the substrate holding unit, and the sealing member, and that exposes the mask and the substrate in close contact with each other using a contact exposure apparatus,
By opening the plurality of first air circulation holes to the atmosphere and sucking air from the plurality of second air circulation holes, the peripheral edge portion of the substrate is restrained by the substrate holding portion, and the air in the sealed space is discharged. Suction to create a negative pressure in the sealed space,
The contact exposure method, wherein when the pressure in the sealed space reaches a predetermined reference negative pressure, the plurality of second air circulation holes are opened to the atmosphere.
A mask holding unit for holding a mask having a pattern to be exposed;
A substrate holding part having a holding surface for holding a substrate as an exposed material;
An illumination optical system that irradiates exposure light through the mask onto the substrate held on the holding surface, and a contact exposure apparatus that exposes the mask and the substrate in close contact with each other,
The holding surface is formed with a plurality of protrusions that can contact the back surface of the substrate, and a plurality of air circulation holes that open toward the back surface of the substrate and through which air flows,
A contact exposure apparatus, comprising: a control means for controlling a pressure or a flow rate of air ejected from each air circulation hole toward the substrate so that the mask and the substrate are in close contact with each other.
The contact exposure apparatus according to claim 7, wherein the control unit controls the pressure or flow rate of the air ejected from each air circulation hole so as to increase from the central portion of the mask toward the periphery. .
9. The partition wall, which defines an area so as to surround at least one of the air circulation holes, is formed on the holding surface and is capable of contacting the back surface of the substrate. Adhesion exposure equipment.
A substrate driving unit for driving the substrate holding unit so as to move the holding surface in the vertical direction;
10. The substrate driving unit, when exposing the substrate, moves the holding surface so that the substrate is not separated from the holding surface by air ejected from the air circulation hole. The contact exposure apparatus according to any one of the above.
A sensor for detecting a gap between the substrate and the mask;
The control means according to any one of claims 7 to 10, wherein the control means controls the pressure or flow rate of the air ejected from each of the air circulation holes according to the gap detected by the sensor. Contact exposure apparatus.
A mask holding unit for holding a mask having a pattern to be exposed;
A substrate holding part having a holding surface for holding a substrate as an exposed material;
An illumination optical system that irradiates exposure light through the mask onto the substrate held on the holding surface, and a contact exposure method that exposes the mask and the substrate in close contact with each other,
The holding surface is formed with a plurality of protrusions that can come into contact with the back surface of the substrate, and a plurality of air circulation holes that are open on the back surface of the substrate and through which air flows.
A contact exposure method, wherein the mask and the substrate are brought into close contact with each other by controlling a pressure or a flow rate of air ejected from the air circulation holes toward the substrate.
13. When the mask and the substrate are brought into close contact with each other, the pressure or flow rate of air ejected from each of the air circulation holes is controlled to increase from the central portion of the mask toward the periphery. The contact exposure method according to the description.
14. The partition wall, which defines an area so as to surround at least one of the air circulation holes, is formed on the holding surface and can be in contact with the back surface of the substrate. Contact exposure method.
A substrate driving unit for driving the substrate holding unit so as to move the holding surface in the vertical direction;
The substrate driving unit, when exposing the substrate, moves the holding surface so that the substrate is not separated from the holding surface by air ejected from the air circulation hole. The contact exposure method according to any one of the above.
A sensor for detecting a gap between the substrate and the mask;
The pressure or flow rate of air ejected from each of the air circulation holes is controlled in accordance with the gap detected by the sensor when the mask and the substrate are brought into close contact with each other. 2. The contact exposure method according to item 1.