KR20140041819A

KR20140041819A - Contact exposure device and contact exposure method

Info

Publication number: KR20140041819A
Application number: KR1020147002774A
Authority: KR
Inventors: 히로시 이케부치; 아츠시 마스조에; 히데키 오카타니
Original assignee: 엔에스케이 테쿠노로지 가부시키가이샤
Priority date: 2011-09-09
Filing date: 2012-09-07
Publication date: 2014-04-04
Also published as: JP2013070042A; KR101558111B1; TWI506381B; WO2013035854A1; JP6142450B2; TW201316137A

Abstract

In the holding surface 11a of the board | substrate holding part 11, it is formed in the outer side rather than the some 1st air flow hole 31 and the some 1st air flow hole 31 which are opened toward the back surface of the workpiece | work W. The annular shape which is provided with the some 2nd air flow hole 32, and which can contact the back surface of the workpiece | work W on the inner peripheral side and the outer peripheral side of the area | region E where the some 2nd air flow hole 32 opens. The inner circumferential side elastic member 33 and the outer circumferential side elastic member 34 are disposed, respectively. Between the mask holding part 4 and the board | substrate holding part 11, the elastic sealing member 35 which surrounds the mask M and the workpiece | work W is formed, and the mask M and the mask holding part 4 are formed. The sealing space S is defined by the substrate holding part 11 and the sealing member 35. The control means 30 atmospherically opens the plurality of first air flow holes 31, sucks air from the plurality of second air flow holes 32, and sucks air in the sealed space S to seal the air. When the inside of space S is made into negative pressure, when the pressure in sealed space S reaches the predetermined | prescribed reference negative pressure, the some 2nd air flow hole 32 is open | released to the air | atmosphere.

Description

Close exposure apparatus and close exposure method {CONTACT EXPOSURE DEVICE AND CONTACT EXPOSURE METHOD}

TECHNICAL FIELD This invention relates to the close_contact | adherence exposure apparatus and close_contact | adherence exposure method which perform exposure by bringing a mask and a workpiece together.

DESCRIPTION OF RELATED ART Conventionally, as a method of exposing a liquid crystal display panel or a semiconductor element, the close_contact | adherence exposure system which performs exposure in the state which contact | adhered a mask and a workpiece | work is known. In this exposure system, the resolution can be improved as compared with the proximity exposure system in which exposure is normally performed by facing the mask and the workpiece in close proximity.

As a conventional close_contact | adherence exposure apparatus, the thing enclosed by the vacuum seal part was made smaller than the area of a mask (for example, refer patent document 1). Thereby, even if the pressure of the seal space approaches the pressure for mask adsorption to increase the adhesion between the mask and the work, sufficient contact force can be ensured without causing the mask to float or escape from the mask stage.

In addition, the positional displacement amount between the mask and the alignment mark of the substrate is calculated, and the deformation amount for deforming the mask and the substrate into a concave or convex shape is converted into pressure according to the calculation result, and the substrate supporting member is controlled by reducing the pressure. An exposure method in which the pattern of the mask is not shifted from the workpiece is disclosed (see Patent Document 2, for example).

Further, in the close exposure method, as a method of adsorbing the workpiece to the mask, at least two system pipes are formed in the work fixing part, the pipe end of one system is disposed at the end of the work, and the work is exhausted by the work. It is known that the workpiece and the mask are brought into close contact (soft contact) by fixing the to the work fixing part and stopping the exhaust from the other system pipe to release the gas (see, for example, Patent Document 3).

Moreover, in the close_contact | adherence exposure system of patent document 4, the seal member is interposed between a workpiece | work and a mask, the space | part enclosed by the workpiece support stand, the workpiece | work, the seal member, and the mask, and the pressure inside the seal member are adjusted, and a seal outer diameter is changed. As a result, the mask is to be brought into uniform contact over the entire surface of the workpiece.

Moreover, in the close_contact | adherence exposure system of patent document 5, after using the convex mask which made one surface of a mask convex, and contacting this convex surface and a wafer, pressure is made to adhere | attach a mask and a wafer in the peripheral part of a mask. By adding, the wafer is deformed and good adhesion is obtained over the entire surface of the mask convex surface. The pressure for bringing the mask into close contact with the wafer is adjusted according to the tightening torque of the screw, the number of tightening pitches of the screw, and the like.

Japanese Laid-Open Patent Publication No. 11-186124 Japanese Patent Publication No. 3983278 Japanese Patent Application Laid-open No. Hei 8-83749 Japanese Unexamined Patent Publication No. 2004-54255 Japanese Laid-Open Patent Publication 2005-156590

However, in Patent Literature 1 and Patent Literature 2, when the work is brought into close contact with the mask, the shear deformation generated in the work is not taken into account, and the substrate may be broken by this shear deformation, and the pattern and the work provided in the mask Is misaligned and good exposure accuracy may not be obtained.

Moreover, in the close_contact | adherence exposure method of patent document 3, since pressure is adjusted only by opening and closing of a valve and a valve, and a workpiece | work is brought into close contact with a mask, a deviation arises locally in close_contact | adherence of a workpiece | work and a mask, and exposure exposure is not favorable. No problem. Moreover, in patent document 3, since the workpiece | work is arrange | positioned and formed in a processus | protrusion shape, when air is blown out to a workpiece | work, the center position of a workpiece will shift | deviate according to the deviation of the air pressure discharged from piping, etc. There is a possibility that the work may be scratched when the work stage is in contact locally.

Moreover, in the close_contact | adherence exposure system of patent document 4, since there exists a dispersion | variation in the outer diameter of a seal | sticker, there exists a subject that this dispersion | variation affects exposure precision and that exposure accuracy is not favorable.

Moreover, in the close_contact | adherence exposure system of patent document 5, since the pressure which adhere | attaches a mask and a wafer by tightening a screw is managed, the contact | adherence state of a mask and a wafer cannot be grasped | ascertained correctly, and there exists a subject that exposure accuracy is not good.

This invention is made | formed in view of the subject mentioned above, The objective is to provide the close_contact | adherence exposure apparatus and the close_contact | adherence exposure method which can improve the close_contact | adherence performance of a board | substrate and a mask.

The above object of the present invention is achieved by the following configuration.

(1) a mask holding part for holding a mask having a pattern to be exposed;

A substrate holding portion having a holding surface for holding a substrate as an exposed material,

A close-up exposure apparatus provided with the illumination optical system which irradiates exposure light through the said mask to the board | substrate hold | maintained at the said holding surface, and exposes it in the state which contact | adhered the said mask and a board | substrate,

The holding surface is provided with a plurality of air distribution holes opening toward the rear surface of the substrate to allow air to flow therethrough,

The plurality of air flow holes include a plurality of first air flow holes and a plurality of second air flow holes formed outside the plurality of first air flow holes.

On the holding surface, an annular inner circumferential side elastic member and an outer circumferential side elastic member, which are in contact with the back surface of the substrate, are disposed on the inner circumferential side and the outer circumferential side of a region where the plurality of second air flow holes are opened, respectively.

And a control means for controlling the pressure or flow rate of the air flowing through the respective air flow holes to form a close contact between the mask and the substrate.

(2) An area in which the plurality of second air flow holes are opened corresponds to the periphery of the back surface of the substrate,

The peripheral exposure part of the said board | substrate is restrained by the said board | substrate holding part by attracting the said 2nd air flow hole, The close_contact | adherence exposure apparatus as described in (1) characterized by the above-mentioned.

(3) An elastic sealing member surrounding the mask and the substrate is formed between the mask holding portion and the substrate holding portion,

The sealing space enclosed by the said mask, the said mask holding part, the said board | substrate holding part, and the said sealing member is pressure-reduced by sucking air in the sealing space, The close_contact | adherence exposure apparatus as described in (1) or (2) characterized by the above-mentioned.

(4) The control means opens the plurality of first air flow holes to the atmosphere, sucks air from the plurality of second air flow holes, and sucks air in the sealed spaces so that the inside of the sealed spaces Set to negative pressure,

When the pressure in the said sealing space reaches the predetermined | prescribed reference | standard negative pressure, the said 2nd air flow hole opens to air | atmosphere, The close_contact | adherence exposure apparatus of (3) characterized by the above-mentioned.

(5) Said board | substrate is restrained by the said board | substrate holding part by being in close contact with the said inner peripheral side elastic member and the said outer peripheral side elastic member, The close_contact | adherence exposure apparatus of (1) characterized by the above-mentioned.

(6) a mask holding part for holding a mask having a pattern to be exposed;

An illumination optical system for irradiating light for exposure through the mask to a substrate held on the holding surface;

In the holding surface, a plurality of air distribution holes are formed in the rear surface of the substrate to allow air to flow.

Between the mask holding portion and the substrate holding portion, an elastic sealing member surrounding the mask and the substrate is formed,

As a close-up exposure method which exposes the said mask and a board | substrate in close contact using the close_contact | adherence exposure apparatus which forms the sealing space by the said mask, the said mask holding part, the said board | substrate holding part, and the said sealing member,

By opening the plurality of first air flow holes to the air and sucking air from the plurality of second air flow holes, the peripheral portion of the substrate is constrained to the substrate holding portion, and the air in the sealing space is sucked to seal the air. Negative pressure in the space,

When the pressure in the sealing space reaches a predetermined reference negative pressure, the plurality of second air flow holes are opened to the atmosphere.

(7) a mask holding portion for holding a mask having a pattern to be exposed,

The holding surface is provided with a plurality of projections that can contact the rear surface of the substrate, and a plurality of air distribution holes that are opened toward the rear surface of the substrate and allow air to flow therethrough,

And a control means for controlling the pressure or flow rate of the air blown from the respective air flow holes toward the substrate so as to bring the mask into close contact with the substrate.

(8) The close-up exposure apparatus according to (7), wherein the control means controls the pressure or flow rate of the air blown out from the respective air flow holes to increase from the center portion of the mask toward the periphery. .

(9) The said holding surface is provided with the partition wall which can contact the back surface of the said board | substrate which forms an area | region so as to surround the at least 1 said air flow hole, The description of (7) or (8) characterized by the above-mentioned. Close exposure apparatus.

(10) further comprising a substrate driving portion for driving the substrate holding portion to move the holding surface in the vertical direction,

At the time of exposing the said board | substrate, the said board | substrate drive part moves the said holding surface so that the said board | substrate may not be separated from the said holding surface by the air blown out from the said air flow hole, It is characterized by any of (7)-(9) The close_contact | adherence exposure apparatus of one.

(11) Further provided with a sensor for detecting a gap between the substrate and the mask,

Said control means controls the pressure or flow volume of the air blown out from each said air flow hole according to the clearance detected by the said sensor, The close_contact | adherence exposure apparatus in any one of (7)-(10) characterized by the above-mentioned. .

(12) a mask holding part for holding a mask having a pattern to be exposed;

As a close-up exposure method which equips the board | substrate hold | maintained at the said holding surface with the illumination optical system which irradiates exposure light through the said mask, and exposes the said mask and a board | substrate in the state which contact | adhered,

The holding surface is provided with a plurality of projections that can be in contact with the back surface of the substrate, and a plurality of air distribution holes that are opened on the back surface of the substrate and allow air to flow therethrough,

The close exposure method according to claim 1, wherein the mask and the substrate are brought into close contact with each other by controlling the pressure or flow rate of the air ejected from the respective air flow holes toward the substrate.

(13) When the mask and the substrate are brought into close contact with each other, the pressure or flow rate of the air blown out from the respective air flow holes is controlled so as to increase from the central portion of the mask toward the circumference. The close contact exposure method described.

(14) The said holding surface is provided with the partition wall which can contact the back surface of the said board | substrate which forms an area | region so as to surround the at least 1 said air flow hole, The description of (12) or (13) characterized by the above-mentioned. Close exposure method.

(15) further comprising a substrate driving portion for driving the substrate holding portion to move the holding surface in the vertical direction;

At the time of exposing the said board | substrate, the said board | substrate drive part moves the said holding surface so that the said board | substrate may not be separated from the said holding surface by the air blown out from the said air flow hole, Any of (12)-(14) characterized by the above-mentioned. The close_contact | adherence exposure method of one.

(16) further comprising a sensor for detecting a gap between the substrate and the mask,

When the mask is in close contact with the substrate, the pressure or the flow rate of the air blown out from the respective air flow holes is controlled according to the gap detected by the sensor, according to any one of (12) to (15). The close contact exposure method described.

Here, "control of the pressure or flow volume of the air which flows through each air flow hole" includes the case where the air flow hole is opened to the air.

According to the close_contact | adherence exposure apparatus and the close_contact | adherence exposure method of this invention, in the holding surface, the some 1st air distribution hole which air flows through, and the some 2nd air distribution hole formed in the outer side rather than the some 1st air distribution hole of a board | substrate On the inner circumferential side and the outer circumferential side of the region that is opened toward the rear surface and the plurality of second air flow holes are opened, annular inner circumferential side elastic members and outer circumferential side elastic members that are in contact with the back surface of the substrate are disposed, respectively, and each air flow hole The mask and the substrate were brought into close contact with each other by controlling the pressure or flow rate of the air flowing through the gas. Therefore, the shift | offset | difference of a board | substrate and a mask can be prevented, adhesion performance can be improved, and exposure precision can be improved.

Moreover, according to the close_contact | adherence exposure apparatus and the close_contact | adherence exposure method of this invention, the holding surface is provided with the some protrusion which can contact the back surface of a board | substrate, and the some air distribution hole which opens toward the back surface of a board | substrate, and through which air flows. The mask and the substrate were brought into close contact with each other by controlling the pressure or flow rate of the air ejected from the respective air flow holes toward the substrate. Therefore, the adhesion performance of a board | substrate and a mask can be improved, and an exposure precision can be improved. In addition, damage to the substrate caused by friction between the substrate and the holding surface can be prevented by the projections formed on the holding surface.

BRIEF DESCRIPTION OF THE DRAWINGS It is a side cross-sectional view of the close_contact | adherence exposure apparatus of 1st Embodiment which concerns on this invention.
FIG. 2 is an enlarged view of a portion indicated by arrow II of FIG. 1 configuration.
3 is a top view of the holding surface of the substrate holding portion shown in FIG. 1.
4 is a cross-sectional view taken along the line IV-IV of FIG. 3 showing a state in which air is sucked from the second air flow hole to restrain the periphery of the substrate to the holding surface.
FIG. 5 is a cross-sectional view taken along the line IV-IV in FIG. 3 showing a state in which the central portion of the substrate constrained to the holding surface is elastically deformed upward by opening the first air distribution hole to the atmosphere and making the sealing space negative pressure. FIG. .
FIG. 6 is a cross-sectional view taken along line IV-IV of FIG. 3 illustrating a state in which the substrate is elastically deformed and adhered to the mask from the center portion of the substrate.
FIG. 7 is a cross-sectional view taken along the line IV-IV of FIG. 3 showing a state in which the substrate in which the second air distribution hole is open to the atmosphere and the restraint of the peripheral portion is open is in close contact with the mask.
8 is a top view of a holding surface of the substrate holding portion of the second embodiment.
9 (a) and 9 (b) are cross-sectional views taken along the line IX-IX of FIG. 8 showing a process of bringing the mask into close contact with the substrate.
FIG. 10 is a cross-sectional view taken along line IX-IX in FIG. 8 showing a state in which the mask and the substrate according to the first modification of the second embodiment are brought into close contact with each other. FIG.
11 is a top view of a holding surface of the substrate holding part according to the second modification of the second embodiment.
12 is a cross-sectional view taken along line XII-XII of FIG. 11 illustrating a process of closely contacting a mask with a substrate.

EMBODIMENT OF THE INVENTION Hereinafter, each preferred embodiment of this invention is described with reference to drawings.

(First Embodiment)

1 is a side sectional view of a close exposure apparatus according to a first embodiment. FIG. 2 is an enlarged view of a portion indicated by arrow II of FIG. 1 configuration. In addition, in FIG. 1, 2, the aperture mechanism which shields a part of exposure light is abbreviate | omitted.

As for the close_contact | adherence exposure apparatus CE of this embodiment, the base 1 is mounted on the surface plate G in FIG. The frame 3 is provided on the base 1. The frame 3 consists of the leg part 3a which the lower end was fixed to the edge of the base 1, and the ceiling plate 3b of the rectangular frame shape attached to the upper end of the leg part 3a. The rectangular opening is formed in the center of the top plate 3b, and the mask holding part 4 which adsorbed-held the circumference | surroundings of the mask M is attached to the circumference | surroundings. The top plate 3b is also provided with a sensor 20 that detects a gap between the workpiece (substrate) W and the mask M as an exposed material. In the mask M, the pattern which should be exposed to the workpiece | work W is drawn.

On the upper surface of the base 1, four guide rails 5 are arranged so as to extend in parallel and in the left-right direction (X-axis direction) in FIG. The slider 6 is formed so that it may move freely along each guide rail 5. The slider 6 is attached to the lower surface of the X axis stage 7. An X axis linear motor (not shown) is formed between the base 1 and the X axis stage 7, and the X axis stage 7 can be driven in the X axis direction with respect to the base 1.

On the upper surface of the X axis stage 7, four guide rails 9 are arranged in parallel and extending in the paper vertical direction (Y axis direction) in FIG. 1. The slider 10 is formed so that it may move freely along each guide rail 9. The slider 10 is attached to the lower surface of the Y axis stage 13. A Y axis linear motor 12 is formed between the X axis stage 7 and the Y axis stage 13, and the Y axis stage 13 can be driven in the Y axis direction with respect to the X axis stage 7. have. Between the Y-axis stage 13 and the board | substrate holding part 11 formed above it, the board | substrate holding part 11 is driven so that the holding surface 11a may move to an up-down direction (Z-axis direction) and an inclination direction in FIG. A Z-axis drive unit (substrate drive unit) 14 is formed. The board | substrate holding part 11 comprises the holding surface 11a holding the workpiece | work W. As shown in FIG.

In FIG. 2, the sensor 20 is provided at the tip of the support 22 and the support 22 supported so as to be movable through the slider 21 with respect to the guide rail 3c attached to the top surface of the ceiling plate 3b. It consists of the measurement part 23 attached. The measuring unit 23 includes a light emitting unit 23a and a light receiving unit 23b. In addition, the support part 22 is driven to arbitrary positions along the guide rail 3c by the linear motor not shown. It is preferable to form a plurality of sensors (for example, four). The sensor 20 may be an optical transmission type, an eddy current type, or an ultrasonic type.

Moreover, the illumination optical system not shown in figure which irradiates the exposure light through the mask M is arrange | positioned above the mask holding part 4 is arrange | positioned.

As shown to FIG. 3 and FIG. 4, the holding surface 11a of the board | substrate holding part 11 is opened to the back surface of the workpiece | work W, The some 1st air distribution hole 31 which air flows through, Holding surface when conveying the workpiece | work W to the holding surface 11a by the some 2nd air distribution hole 32 formed in the outer side rather than the some 1st air distribution hole 31, and the work loader not shown in figure. A plurality of pin holes (not shown) in which a plurality of pins (not shown) advancing from 11a are allowed to advance and retreat are formed. The plurality of second air flow holes 32 correspond to the periphery 15 on the back surface of the work W and are opened in the region E having a substantially rectangular frame shape. Moreover, in the holding surface 11a, the annular inner peripheral side elastic member 33 and the outer peripheral side elastic member 34 which can contact the back surface of the workpiece | work W on the inner peripheral side and the outer peripheral side of the area | region E are respectively, respectively. It is arranged.

The outer circumferential side holding surface 11a is formed in an annular shape so as to surround the mask M and the work W, and abuts against the back surface 4a of the mask holding portion 4. An elastic sealing member 35 capable of sealing between the mask holding portion 4 and the substrate holding portion 11 is formed. Thereby, the sealing space S enclosed by the mask M, the mask holding | maintenance part 4, the board | substrate holding part 11, and the sealing member 35 is defined as shown in FIG.2 and FIG.4. Moreover, the suction hole 36 which communicates with the sealing space S is formed in the mask holding part 4.

The plurality of second air flow holes 32 and the suction holes 36 are all connected to a negative pressure generating device such as a vacuum pump through a pipe not shown. The regulator, the valve, etc. formed in the middle of the piping are controlled by the control means 30 (see FIG. 1), and the inside of the sealed space S is made into negative pressure by operating the negative pressure generating device to suck air from the suction hole 36. In addition, air is sucked from the plurality of second air flow holes 32 or air is opened.

In the close_contact | adherence exposure apparatus CE comprised in this way, as shown in FIG. 4, the mask M is adsorbed-held by the mask holding | maintenance part 4, and the workpiece | work (on the holding surface 11a of the board | substrate holding part 11 is carried out. W) is mounted and the sealing member 35 seals between the mask holding portion 4 and the substrate holding portion 11 to seal the mask M, the mask holding portion 4, the substrate holding portion 11 and the sealing member. The sealing space S is defined by (35).

The control means 30 sucks air in the sealing space S from the suction hole 36, and decompresses the sealing space S. Further, immediately after the depressurization, by sucking air from the plurality of second air flow holes 32, the inside of the region E surrounded by the inner circumferential side elastic member 33 and the outer circumferential side elastic member 34 is reduced in pressure to form a workpiece W. The peripheral part 15 of the back surface is restrained by the holding surface 11a.

Thereby, as shown in FIG. 5, since the some 1st air flow hole 31 is open | released to the workpiece | work W by which the peripheral part 15 was restrained by the holding surface 11a, the surface side (sealing space ( The center part swells upward by the negative pressure of S)), and immediately adheres to the mask M. FIG. At this time, shear deformation by elastic deformation occurs in the workpiece | work W. However, since the shear deformation is alleviated by the inner circumferential side elastic member 33 and the outer circumferential side elastic member 34 which are elastic bodies, there is no fear that the work W will break. Moreover, when the workpiece | work W contacts the mask M, the periphery part 15 of the workpiece | work W sucks air from the some 2nd air flow hole 32 by the force received from the mask M. The inner peripheral side elastic member 33 and the outer peripheral side elastic member 34 can be closely contacted with and restrained by the board | substrate holding part 11, even if it is not necessary. Therefore, in this case, suction from the some 2nd air flow hole 32 is not performed after that.

As shown in FIG. 6, when the sealing space S is further depressurized, the mask M, the work W, and the contact region gradually widen outward from the center portion, and the pressure in the sealing space S becomes a predetermined standard. Reaches negative pressure. As shown in FIG. 7, when the pressure in the sealing space S reaches a predetermined reference negative pressure, the control means 30 opens the plurality of second air flow holes 32 to the atmosphere. Thereby, the workpiece | work W in which the peripheral edge part 15 was restrained by the holding surface 11a and was elastically deformed, As this restraint force is opened, the peripheral edge 15 falls from the holding surface 11a, and a position shift does not occur and a mask ( It adheres to the mask M along the flatness of M).

As explained above, according to the close_contact | adherence exposure apparatus CE and the close_contact | adherence exposure method of this embodiment, the holding surface 11a has the several 1st air flow hole 31 opened toward the back surface of the workpiece | work W, and The inner circumferential side and the outer circumference of the region E in which the plurality of second air distribution holes 32 formed outside the plurality of first air distribution holes 31 are formed, and the plurality of second air distribution holes 32 are opened. On the side, an annular inner circumferential side elastic member 33 and an outer circumferential side elastic member 34 which are in contact with the rear surface of the work W are disposed, respectively, and each air distribution hole 31, 32 is provided by the control means 30. The mask M and the workpiece | work W were made to adhere closely by controlling the pressure or flow volume of the air which distribute | circulates). Therefore, the shear deformation generated in the work W by the inner circumferential side elastic member 33 and the outer circumferential side elastic member 34 is reduced to prevent the breakage of the work W, thereby preventing the work W and the mask M. The adhesion accuracy can be improved to improve the exposure accuracy. Moreover, since the workpiece | work W contacts the mask M from a center part, and a contact area is gradually extended to the outer periphery side, and the front surface finally contacts, the contact | adhesion of the mask M and the workpiece | work W will be in close contact.

In addition, by sucking the plurality of second air flow holes 32 opened in the region E corresponding to the peripheral portion 15 on the rear surface of the workpiece W, the peripheral portion 15 of the workpiece W is connected to the substrate holding portion ( Since it restrains to 11, the peripheral part 15 of the workpiece | work W can be restrained to the board | substrate holding part 11 certainly.

Moreover, between the mask holding part 4 and the board | substrate holding part 11, the elastic sealing member 35 which surrounds the mask M and the workpiece | work W is formed, and the mask M and the mask holding part ( 4) Since the air in the sealing space S enclosed by the board | substrate holding part 11 and the sealing member 35 is sucked and pressure-reduced, the workpiece | work W adheres to the mask M closely.

In addition, the control means 30 opens the plurality of first air distribution holes 31 to the atmosphere, sucks air from the plurality of second air distribution holes 32, and further controls the air in the sealed space S. When the inside of the sealing space S is made into negative pressure by suction, when the pressure in the sealing space S reaches the predetermined | prescribed reference negative pressure, the some air flow hole 32 is open | released to the air | atmosphere, and the workpiece | work W is opened. After elastically deforming and making contact with the mask M gradually from a center part, the constraint of the periphery part 15 by the holding surface 11a (region E) is opened, and the workpiece | work W is made flat of the mask M It can be made to adhere without shifting along the figure.

In addition, in the said embodiment, although the periphery part 15 of the workpiece | work W is restrained to the board | substrate holding part 11 by sucking air from the 2nd air flow hole 32, the 2nd air flow hole 32 Even if air is not sucked from the upper surface, the peripheral portion 15 of the work W is brought into close contact with the inner circumferential side elastic member 33 and the outer circumferential side elastic member 34, and the peripheral portion 15 of the work W is attached to the substrate holding part ( 11).

(Second Embodiment)

Next, the close_contact | adherence exposure apparatus CE and the close_contact | adherence exposure method which concern on 2nd Embodiment of this invention are demonstrated with reference to FIG. 8 and FIG. In addition, about the part which is the same as or equivalent to 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted or simplified.

As shown in FIG. 8, the holding surface 11a of the board | substrate holding part 11 has several protrusions 11b which can contact the back surface of the workpiece | work W, and air toward the back surface of the workpiece | work W. As shown in FIG. When the workpiece | work W is conveyed to the holding surface 11a by the some air distribution hole 11c blown out and the work loader which is not shown in figure, several fins (not shown) which advance from the holding surface 11a advance and retreat. A plurality of possible pinholes (not shown) are formed. The role of the projection 11b is to reduce the damage of the work W generated by friction between the work W and the holding surface 11a. When the projection 11b is not formed, when the air is blown out to the workpiece W, a nonuniformity in the flow rate or pressure of the air may occur, and the workpiece may be inclined to damage the portion in contact with the holding surface 11a. There is.

Air which passes through piping from the fan and blower which are not shown is supplied to some air flow hole 11c, and the pressure or flow volume of air is a regulator and the valve | bulb provided in the middle of piping by the control means 30 (refer FIG. 1). It controls by driving etc., and the quantity of air blown out to the workpiece | work W is controlled. The plurality of air distribution holes 11c can be arranged arbitrarily, and the air can be ejected selectively and independently according to the arrangement of the pipes and the air distribution holes 11c.

In the close_contact | adherence exposure apparatus CE comprised in this way, the holding surface so that the mask M hold | maintained by the mask holding | maintenance part 4 and the workpiece | work W held by the holding surface 11a of the board | substrate holding part 11 may be in close_contact | adherence. Air is blown off toward the workpiece | work W from the some air flow hole 11c formed in 11a. For example, as shown in FIG. 9 (a), each air flow hole (so that the portion of the workpiece W facing the vicinity of the center of the mask M is the highest, has the arch shape in which the workpiece W is convex upward). The pressure or flow rate of the air blown out from 11c) is controlled. In addition, in FIG.9 (a), (b), the length of the arrow in the air flow hole 11c has shown the magnitude | size of the flow volume of air.

In addition, since the mask M is generally bent near the center, the control means 30 directs the pressure or flow rate of the air blown out from the respective air flow holes 11c from the center portion of the mask M to the surroundings. Control to increase accordingly. Thereby, the air gathered in the vicinity of the center between the mask M and the workpiece | work W can be taken out toward the circumference.

Thereafter, as shown in FIG. 9B, the pressure or flow rate of the air blown out from each air flow hole 11c is controlled so as to follow the flatness of the mask M. FIG. And the control means 30 scans the sensor 20, and when a clearance is confirmed between the mask M and the workpiece | work W by the sensor 20, it blows out from each air flow hole 11c. The mask M and the work W are brought into close contact with each other by increasing the pressure or flow rate of the air.

In addition, when exposing the workpiece | work W, it is said that the workpiece | work W does not fall from the holding surface 11a by the air blown out from the air flow hole 11c, while the mask M and the workpiece | work W are in close_contact | adherence. desirable. Therefore, the Z-axis drive part 14 moves the holding surface 11a so that the workpiece | work W may not fall from the holding surface 11a.

However, like the modification shown in FIG. 10, you may expose the workpiece | work W in the state which floated with air, and in this case, transfer by the protrusion 11b of the holding surface 11a, the air flow hole 11c, etc. The influence on a pattern can be prevented certainly.

Moreover, in order to closely contact the mask M and the workpiece | work W, when the crack of the workpiece | work W is considered, it is preferable that the thickness of the workpiece | work W is 2 mm or more. On the other hand, in order for the mask and the workpiece | work W to adhere closely along the flatness of the mask M, it is preferable that the thickness of the workpiece | work W is 3 mm or less. Therefore, it is preferable that the thickness of the workpiece | work W is 2-3 mm ± 0.2 mm, and it is more preferable that it is 2.5 mm ± 0.2 in consideration of exposure precision.

As explained above, according to the close_contact | adherence exposure apparatus CE and the close_contact | adherence exposure method of this embodiment, in the holding surface 11a, the several protrusion 11b which can contact the back surface of the workpiece | work W, and the workpiece | work ( A plurality of air flow holes 11c through which air is blown toward the back surface of W are formed, and the mask M is controlled by controlling the pressure or flow rate of the air blown out from each air flow holes 11c toward the work W. FIG. ) And the work W were brought into close contact. Therefore, the adhesion performance of the workpiece | work W and the mask M can be improved, and an exposure precision can be improved. Moreover, the damage of the workpiece | work W which arises by friction between the workpiece | work W and the holding surface 11a can be prevented by the projection 11b formed in the holding surface 11a.

In addition, as shown to FIG. 11 and FIG. 12 as a modification of this embodiment, the workpiece | work W which defines the area | region 80a-80e on the holding surface 11a so that the at least 1 air flow hole 11c may be enclosed. The partition wall 11d which can abut on the back surface of the) may be formed. In addition, the partition wall 11d has the same height as the protrusion 11b.

By forming the partition wall 11d in this manner, the pressure or the flow rate of air may be controlled for each region. For example, similarly to the above-described embodiment, the flow rate of the air blown out from within the central region 80a is first increased, and then the annular region on the outer side is made to follow the flatness of the mask M. The flow rate of the air blown out of the 80b and the long region 80c, 80d, 80e around it may be increased.

In addition, this invention is not limited to each embodiment mentioned above, It can change suitably in the range which does not deviate from the summary of this invention.

For example, in this invention, although the holding surface 11a was made into the structure which has the some processus | protrusion 11b, the structure which has the partition wall 11d may be sufficient instead of forming the some processus | protrusion 11b.

In addition, the present invention relates to a Japanese patent application filed on September 9, 2011 (Japanese Patent Application No. 2011-197363), and a Japanese patent application filed on September 3, 2012 (Japanese Patent Application No. 2012-193297). ), The contents of which are hereby incorporated by reference.

4: mask holding part
11: substrate holding part
11a: holding surface
11b: projection
11c: Air Distribution Hole
11d: partition wall
14: Z axis drive (substrate drive)
15: periphery
20: Sensor
30 control means
31: the first air distribution hole
32: second air distribution hole
33: inner peripheral elastic member
34: outer peripheral elastic member
35: sealing member
80a to 80e: adsorption area
CE: Close Exposure Equipment
E: area in which the second air distribution hole is opened
M: Mask
S: sealing space
W: Work board

Claims

A mask holding part for holding a mask having a pattern to be exposed,
A substrate holding portion having a holding surface for holding a substrate as an exposed material,
A close-up exposure apparatus provided with the illumination optical system which irradiates exposure light through the said mask to the board | substrate hold | maintained at the said holding surface, and exposes it in the state which contact | adhered the said mask and a board | substrate,
The holding surface is provided with a plurality of air distribution holes opening toward the rear surface of the substrate to allow air to flow therethrough,
The plurality of air flow holes include a plurality of first air flow holes and a plurality of second air flow holes formed outside the plurality of first air flow holes.
On the holding surface, an annular inner circumferential side elastic member and an outer circumferential side elastic member, which are in contact with the back surface of the substrate, are disposed on the inner circumferential side and the outer circumferential side of a region where the plurality of second air flow holes are opened, respectively.
And a control means for controlling the pressure or flow rate of the air flowing through the respective air flow holes to form a close contact between the mask and the substrate.

The method according to claim 1,
An area where the plurality of second air flow holes are opened corresponds to a peripheral portion of the back surface of the substrate,
The peripheral exposure portion of the substrate is constrained to the substrate holding portion by sucking the plurality of second air flow holes.

3. The method according to claim 1 or 2,
Between the mask holding portion and the substrate holding portion, an elastic sealing member surrounding the mask and the substrate is formed,
The sealing space enclosed by the said mask, the said mask holding part, the said board | substrate holding part, and the said sealing member is pressure-reduced by sucking air in the sealing space.

The method of claim 3, wherein
The control means opens the plurality of first air flow holes to the atmosphere, sucks air from the plurality of second air flow holes, and also sucks air in the sealed space to prevent negative pressure in the sealed space.壓),
When the pressure in the said sealing space reaches the predetermined | prescribed reference negative pressure, the said 2nd air flow hole opens to air | atmosphere, The close_contact | adherence exposure apparatus characterized by the above-mentioned.

The method according to claim 1,
The substrate is in close contact with the substrate holding portion by being in close contact with the inner circumferential side elastic member and the outer circumferential side elastic member.

A mask holding part for holding a mask having a pattern to be exposed,
A substrate holding portion having a holding surface for holding a substrate as an exposed material,
An illumination optical system for irradiating light for exposure through the mask to a substrate held on the holding surface;
In the holding surface, a plurality of air distribution holes are formed in the rear surface of the substrate to allow air to flow.
The plurality of air flow holes include a plurality of first air flow holes and a plurality of second air flow holes formed outside the plurality of first air flow holes.
On the holding surface, an annular inner circumferential side elastic member and an outer circumferential side elastic member, which are in contact with the back surface of the substrate, are disposed on the inner circumferential side and the outer circumferential side of a region where the plurality of second air flow holes are opened, respectively.
Between the mask holding portion and the substrate holding portion, an elastic sealing member surrounding the mask and the substrate is formed,
As a close-up exposure method which exposes the said mask and a board | substrate in close contact using the close_contact | adherence exposure apparatus which forms the sealing space by the said mask, the said mask holding part, the said board | substrate holding part, and the said sealing member,
By opening the plurality of first air flow holes to the air and sucking air from the plurality of second air flow holes, the peripheral portion of the substrate is constrained to the substrate holding portion, and the air in the sealing space is sucked to seal the air. Negative pressure in the space,
When the pressure in the sealing space reaches a predetermined reference negative pressure, the plurality of second air flow holes are opened to the atmosphere.

A mask holding part for holding a mask having a pattern to be exposed,
A substrate holding portion having a holding surface for holding a substrate as an exposed material,
A close-up exposure apparatus provided with the illumination optical system which irradiates exposure light through the said mask to the board | substrate hold | maintained at the said holding surface, and exposes it in the state which contact | adhered the said mask and a board | substrate,
The holding surface is provided with a plurality of projections that can contact the rear surface of the substrate, and a plurality of air distribution holes that are opened toward the rear surface of the substrate and allow air to flow therethrough,
And a control means for controlling the pressure or flow rate of the air blown from the respective air flow holes toward the substrate so as to bring the mask into close contact with the substrate.

The method of claim 7, wherein
And the control means controls the pressure or flow rate of the air blown out from the respective air flow holes so as to increase from the center portion of the mask toward the periphery.

9. The method according to claim 7 or 8,
And said partition surface is formed in said holding surface so that the partition wall which abuts the back surface of the said board | substrate may be formed so that the area | region may be enclosed so that at least one said said air flow hole may be formed.

10. The method according to any one of claims 7 to 9,
Further provided with a substrate driver for driving the substrate holding portion to move the holding surface in the vertical direction,
When exposing the substrate, the substrate driving unit moves the holding surface such that the substrate is not separated from the holding surface by air blown out of the air flow hole.

11. The method according to any one of claims 7 to 10,
Further provided with a sensor for detecting a gap between the substrate and the mask,
The control means controls the pressure or flow rate of the air blown out from the respective air flow holes in accordance with the gap detected by the sensor.

A mask holding part for holding a mask having a pattern to be exposed,
A substrate holding portion having a holding surface for holding a substrate as an exposed material,
As a close-up exposure method which equips the board | substrate hold | maintained at the said holding surface with the illumination optical system which irradiates exposure light through the said mask, and exposes the said mask and a board | substrate in the state which contact | adhered,
The holding surface is provided with a plurality of projections that can be in contact with the back surface of the substrate, and a plurality of air distribution holes that are opened on the back surface of the substrate and allow air to flow therethrough,
The close exposure method according to claim 1, wherein the mask and the substrate are brought into close contact with each other by controlling the pressure or flow rate of the air ejected from the respective air flow holes toward the substrate.

13. The method of claim 12,
And the pressure or flow rate of the air blown out from the respective air flow holes when the mask and the substrate are brought into close contact with each other so as to increase from the central portion of the mask toward the periphery.

The method according to claim 12 or 13,
And said partition surface is formed in said holding surface so that the partition wall which abuts on the back surface of the said board | substrate may be formed so that the area | region may be enclosed at least one said said air flow hole.

15. The method according to any one of claims 12 to 14,
Further provided with a substrate driver for driving the substrate holding portion to move the holding surface in the vertical direction,
When exposing the substrate, the substrate driving unit moves the holding surface such that the substrate is not separated from the holding surface by air blown out of the air flow hole.

16. The method according to any one of claims 12 to 15,
Further provided with a sensor for detecting a gap between the substrate and the mask,
When the mask and the substrate are in close contact, the pressure or flow rate of the air blown out from the respective air flow holes is controlled in accordance with the gap detected by the sensor.