JP6142450B2 - Contact exposure apparatus and contact exposure method - Google Patents

Contact exposure apparatus and contact exposure method Download PDF

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JP6142450B2
JP6142450B2 JP2012193297A JP2012193297A JP6142450B2 JP 6142450 B2 JP6142450 B2 JP 6142450B2 JP 2012193297 A JP2012193297 A JP 2012193297A JP 2012193297 A JP2012193297 A JP 2012193297A JP 6142450 B2 JP6142450 B2 JP 6142450B2
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substrate
mask
holding
air
air circulation
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JP2013070042A (en
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宏 池淵
宏 池淵
敦 桝添
敦 桝添
秀樹 岡谷
秀樹 岡谷
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V Technology Co Ltd
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/7035Proximity or contact printers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2002Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame

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  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Description

本発明は、マスクとワークを密着させて露光を行う密着露光装置及び密着露光方法に関する。   The present invention relates to a contact exposure apparatus and a contact exposure method for performing exposure by bringing a mask and a workpiece into close contact with each other.

従来、液晶ディスプレイパネルや半導体素子を露光する方法として、マスクとワークとを密着させた状態で、露光を行う密着露光方式が知られている。この露光方式では、通常、マスクとワークとを近接対向して露光を行う近接露光方式に比べ、解像度を向上することができる。   2. Description of the Related Art Conventionally, as a method for exposing a liquid crystal display panel or a semiconductor element, a contact exposure method is known in which exposure is performed in a state where a mask and a work are in close contact. In this exposure method, the resolution can be improved as compared with the proximity exposure method in which exposure is normally performed with a mask and a workpiece in close proximity to each other.

従来の密着露光装置としては、マスクの面積より真空シール部によって囲まれる面積を小さくしたものがある(例えば、特許文献1参照。)。これにより、シール空間の圧力をマスク吸着用圧力に近づけてマスクとワークの密着力を大きくしても、マスクがマスクステージから浮き上がったり外れたりすることがなく、充分なコンタクト力を確保できるようにしている。   As a conventional contact exposure apparatus, there is an apparatus in which an area surrounded by a vacuum seal portion is smaller than an area of a mask (see, for example, Patent Document 1). As a result, even if the pressure in the seal space is brought close to the mask suction pressure to increase the contact force between the mask and the workpiece, the mask will not lift or come off from the mask stage, so that sufficient contact force can be secured. ing.

また、マスクと基板との位置合わせマーク間の位置ずれ量を演算し、演算結果に従ってマスクおよび基板を凹状または凸状に変形させる変形量を圧力に変換し、減圧して基板支持部材を制御して、マスクのパターンがワークとずれないようにした露光方法が開示されている(例えば、特許文献2参照。)。   Also, the amount of displacement between the alignment marks of the mask and the substrate is calculated, the amount of deformation that deforms the mask and the substrate into a concave or convex shape is converted into pressure according to the calculation result, and the substrate support member is controlled by reducing the pressure. An exposure method is disclosed in which the mask pattern does not deviate from the workpiece (see, for example, Patent Document 2).

また、密着露光方式において、マスクにワークを吸着させる方法としては、ワーク固定部に少なくとも2系統の管路を設け、一方の系統の管路端をワークの端部に配置し、上記管路を排気してワークをワーク固定部に固定し、他系統の管路からの排気を停止して気体を放出することにより、ワークとマスクとを密着(ソフトコンタクト)させることが知られている(例えば、特許文献3参照。)。   Further, in the contact exposure method, as a method for adsorbing the workpiece to the mask, at least two systems of pipelines are provided in the workpiece fixing portion, the pipeline ends of one system are arranged at the ends of the workpiece, and the pipeline is It is known that the work and the mask are brought into close contact (soft contact) by evacuating and fixing the work to the work fixing part, stopping the exhaust from the pipes of other systems and releasing the gas (for example, , See Patent Document 3).

また、特許文献4に記載の密着露光方式では、ワークとマスクの間にシール部材を介在させ、ワーク支持台、ワーク、シール部材、マスクで囲まれた空間と、シール部材の内部の圧力を調整し、シール外径を変えることで、マスクをワークの表面全体に亘って均一に密着させるようにしている。   In the contact exposure method described in Patent Document 4, a seal member is interposed between the workpiece and the mask, and the space surrounded by the workpiece support base, the workpiece, the seal member, and the mask and the pressure inside the seal member are adjusted. However, by changing the outer diameter of the seal, the mask is made to adhere uniformly over the entire surface of the workpiece.

また、特許文献5に記載の密着露光方式では、マスクの一面を凸面とした凸マスクを使用し、かかる凸面とウェハを密着させた上で、マスクの周辺部位においてマスクとウェハを密着させるように圧力を加えることで、ウェハを変形させ、マスク凸面の全面に亘り良好な密着が得られるようにしている。また、マスクとウェハを密着させる圧力は、ねじの締め付けトルクやねじの締め込みピッチ数などにより調整している。   Further, in the contact exposure method described in Patent Document 5, a convex mask having one surface of the mask as a convex surface is used, and the mask and the wafer are brought into close contact with each other at a peripheral portion of the mask after the convex surface and the wafer are brought into close contact with each other. By applying pressure, the wafer is deformed, and good adhesion is obtained over the entire surface of the convex surface of the mask. In addition, the pressure at which the mask and the wafer are brought into close contact with each other is adjusted by a screw tightening torque, the number of screw tightening pitches, or the like.

特開平11‐186124号公報Japanese Patent Laid-Open No. 11-186124 特許第3983278号公報Japanese Patent No. 398278 特開平8−83749号公報Japanese Patent Laid-Open No. 8-83749 特開2004−54255号公報JP 2004-54255 A 特開2005−156590号公報JP 2005-156590 A

しかしながら、特許文献1及び特許文献2では、ワークをマスクに密着させる際、ワークに発生するせん断ひずみは考慮されておらず、このせん断ひずみにより基板が破断する虞があり、マスクに備えられたパターンとワークがずれて、良好な露光精度が得られない可能性がある。   However, in Patent Document 1 and Patent Document 2, when the work is brought into close contact with the mask, the shear strain generated in the work is not taken into account, and there is a possibility that the substrate may be broken by this shear strain. There is a possibility that good exposure accuracy cannot be obtained due to the deviation of the workpiece.

また、特許文献3に記載の密着露光方法では、バルブと弁の開閉のみで圧力を調整して、ワークをマスクに密着させているため、局所的にワークとマスクの密着にばらつきが生じ、露光精度がよくないという課題がある。また、特許文献3では、突起状にワークをワークステージに配設しているため、ワークへエアを噴出すると、配管から排出されるエアの圧力等のばらつきによって、ワークの重心位置がずれ、ワークとワークステージが局所的に接触した際に、ワークが傷つく虞もある。   Further, in the contact exposure method described in Patent Document 3, since the work is brought into close contact with the mask by adjusting the pressure only by opening and closing the valve, the contact between the work and the mask locally varies and exposure is performed. There is a problem that accuracy is not good. Further, in Patent Document 3, since the workpiece is disposed on the workpiece stage in a protruding shape, when air is ejected onto the workpiece, the center of gravity of the workpiece is displaced due to variations in the pressure of the air discharged from the piping, and the workpiece When the workpiece stage is in contact with the workpiece stage, the workpiece may be damaged.

また、特許文献4の密着露光方式では、シールの外径にばらつきがあるため、このばらつきが露光精度に影響し、露光精度がよくないという課題がある。   Further, in the contact exposure method of Patent Document 4, since the outer diameter of the seal varies, there is a problem that this variation affects the exposure accuracy and the exposure accuracy is not good.

さらに、特許文献5の密着露光方式では、ねじの締め付けによってマスクとウェハを密着させる圧力を管理しているため、マスクとウェハの密着状態は正確に把握できず、露光精度がよくないという課題がある。   Furthermore, in the contact exposure method of Patent Document 5, since the pressure for bringing the mask and wafer into close contact with each other by screw tightening is managed, the contact state between the mask and the wafer cannot be accurately grasped, and the exposure accuracy is not good. is there.

本発明は、前述した課題に鑑みてなされたものであり、その目的は、基板とマスクの密着性能を向上することができる密着露光装置及び密着露光方法を提供することにある。   The present invention has been made in view of the above-described problems, and an object thereof is to provide a contact exposure apparatus and a contact exposure method that can improve the contact performance between a substrate and a mask.

本発明の上記目的は、下記の構成により達成される。
(1) 露光すべきパターンを有するマスクを保持するマスク保持部と、
被露光材としての基板を保持する保持面を有する基板保持部と、
前記保持面に保持された基板に、露光用光を前記マスクを介して照射する照明光学系と、を備え、前記マスクと基板とを密着させた状態で露光する密着露光装置であって、
前記保持面には、前記基板の裏面に向けて開口し、エアが流通する複数のエア流通孔が形成され、
前記複数のエア流通孔は、複数の第1エア流通孔と、該複数の第1エア流通孔よりも外側に設けられた複数の第2エア流通孔と、を備え、
前記保持面には、前記複数の第2エア流通孔が開口する領域の内周側及び外周側に、前記基板の裏面と接触可能な環状の内周側弾性部材及び外周側弾性部材がそれぞれ配置され、
前記マスクと基板を密着させるように、前記各エア流通孔を流通するエアの圧力又は流量を制御する制御手段が設けられ、
前記マスク保持部と前記基板保持部との間には、前記マスク及び前記基板を囲む、弾性の密封部材が設けられ、
前記マスク、前記マスク保持部、前記基板保持部、及び前記密封部材によって囲まれた密封空間は、該密封空間内のエアを吸引することで減圧されることを特徴とする密着露光装置。
(2) 前記複数の第2エア流通孔が開口する領域は、前記基板の裏面の周縁部に対応しており、
前記複数の第2エア流通孔を吸引することで、前記基板の周縁部は前記基板保持部に拘束されることを特徴とする(1)に記載の密着露光装置。
(3) 前記制御手段は、前記複数の第1エア流通孔を大気開放し、前記複数の第2エア流通孔からエアを吸引し、且つ、前記密封空間内のエアを吸引して、前記密封空間内を負圧にし、
前記密封空間内の圧力が所定の基準負圧に達したとき、前記複数の第2エア流通孔を大気開放することを特徴とする(1)に記載の密着露光装置。
(4) 前記基板は、前記内周側弾性部材と前記外周側弾性部材に密着されることで、前記基板保持部に拘束されることを特徴とする(1)に記載の密着露光装置。
(5) 露光すべきパターンを有するマスクを保持するマスク保持部と、
被露光材としての基板を保持する保持面を有する基板保持部と、
前記保持面に保持された基板に、露光用光を前記マスクを介して照射する照明光学系と、を備え、
前記保持面には、前記基板の裏面に開口し、エアが流通する複数のエア流通孔が形成され、
前記複数のエア流通孔は、複数の第1エア流通孔と、該複数の第1エア流通孔よりも外側に設けられた複数の第2エア流通孔と、を備え、
前記保持面には、前記複数の第2エア流通孔が開口する領域の内周側及び外周側に、前記基板の裏面と接触可能な環状の内周側弾性部材及び外周側弾性部材がそれぞれ配置され、
前記マスク保持部と前記基板保持部との間には、前記マスク及び前記基板を囲む、弾性の密封部材が設けられ、
前記マスク、前記マスク保持部、前記基板保持部、及び前記密封部材によって密封空間を形成する、密着露光装置を用いて前記マスクと基板とを密着させた状態で露光する密着露光方法であって、
前記複数の第1エア流通孔を大気開放し、前記複数の第2エア流通孔からエアを吸引することで、前記基板の周縁部を前記基板保持部に拘束し、前記密封空間内のエアを吸引して、前記密封空間内を負圧にし、
前記密封空間内の圧力が所定の基準負圧に達したとき、前記複数の第2エア流通孔を大気開放することを特徴とする密着露光方法。
(6) 露光すべきパターンを有するマスクを保持するマスク保持部と、
被露光材としての基板を保持する保持面を有する基板保持部と、
前記保持面に保持された基板に、露光用光を前記マスクを介して照射する照明光学系と、を備え、前記マスクと基板とを密着させた状態で露光する密着露光装置であって、
前記保持面には、前記基板の裏面に当接可能な複数の突起と、前記複数の突起よりも低い位置で、前記基板の裏面に向けて開口し、エアが流通する複数のエア流通孔と、前記複数の突起及び少なくとも一つの前記エア流通孔をそれぞれ囲う複数の領域を画成する、前記基板の裏面に当接可能な仕切り壁と、が形成され、
前記マスクと基板とを密着させるように、前記各エア流通孔から前記基板に向けて噴出するエアの圧力又は流量を制御する制御手段が設けられ、
前記制御手段は、前記マスクの中央付近と対向するワークの部分が最も高くなるようにエアの圧力又は流量を制御し、前記マスクの中央付近と前記ワークの部分を密着させた後、前記各エア流通孔から噴出するエアの圧力又は流量を、前記マスクの中央部分から周囲に向かうにつれて増加するように制御することを特徴とする密着露光装置。
(7) 前記保持面を上下方向に移動するように、前記基板保持部を駆動する基板駆動部をさらに備え、
前記基板を露光する際、前記基板駆動部は、前記エア流通孔から噴出されるエアによって前記基板が前記保持面から離れないように前記保持面を移動させることを特徴とする(6)に記載の密着露光装置。
(8) 前記基板とマスクとの間の隙間を検出するセンサをさらに備え、
前記制御手段は、前記センサによって検出された隙間に応じて、前記各エア流通孔から噴出するエアの圧力又は流量を制御することを特徴とする(6)又は(7)に記載の密着露光装置。
(9) 露光すべきパターンを有するマスクを保持するマスク保持部と、
被露光材としての基板を保持する保持面を有する基板保持部と、
前記保持面に保持された基板に、露光用光を前記マスクを介して照射する照明光学系と、を備え、前記マスクと基板とを密着させた状態で露光する密着露光方法であって、
前記保持面には、前記基板の裏面に当接可能な複数の突起と、前記複数の突起よりも低い位置で、前記基板の裏面に開口し、エアが流通する複数のエア流通孔と、前記複数の突起及び少なくとも一つの前記エア流通孔をそれぞれ囲う複数の領域を画成する、前記基板の裏面に当接可能な仕切り壁と、が形成され、
前記各エア流通孔から前記基板に向けて噴出するエアの圧力又は流量を制御することで、前記マスクと基板とを密着させ、
前記マスクと基板とを密着させる際、前記マスクの中央付近と対向するワークの部分が最も高くなるようにエアの圧力又は流量を制御し、前記マスクの中央付近と前記ワークの部分を密着させた後、前記各エア流通孔から噴出するエアの圧力又は流量を、前記マスクの中央部分から周囲に向かうにつれて増加するように制御することを特徴とする密着露光方法。
(10) 前記保持面を上下方向に移動するように、前記基板保持部を駆動する基板駆動部をさらに備え、
前記基板を露光する際、前記基板駆動部は、前記エア流通孔から噴出されるエアによって前記基板が前記保持面から離れないように前記保持面を移動させることを特徴とする(9)に記載の密着露光方法。
(11) 前記基板とマスクとの間の隙間を検出するセンサをさらに備え、
前記マスクと基板とを密着させる際、前記センサによって検出された隙間に応じて、前記各エア流通孔から噴出するエアの圧力又は流量を制御することを特徴とする(9)又は(10)に記載の密着露光方法。
The above object of the present invention can be achieved by the following constitution.
(1) a mask holding unit for holding a mask having a pattern to be exposed;
A substrate holding part having a holding surface for holding a substrate as an exposed material;
An illumination optical system that irradiates exposure light through the mask onto the substrate held on the holding surface, and a contact exposure apparatus that exposes the mask and the substrate in close contact with each other,
The holding surface has a plurality of air circulation holes that are open toward the back surface of the substrate and through which air flows.
The plurality of air circulation holes include a plurality of first air circulation holes and a plurality of second air circulation holes provided outside the plurality of first air circulation holes,
On the holding surface, annular inner peripheral side elastic members and outer peripheral side elastic members that can come into contact with the back surface of the substrate are disposed on the inner peripheral side and the outer peripheral side of the region where the plurality of second air circulation holes open, respectively. And
Control means for controlling the pressure or flow rate of the air flowing through each of the air circulation holes is provided so as to bring the mask and the substrate into close contact with each other.
Between the mask holding part and the substrate holding part, an elastic sealing member surrounding the mask and the substrate is provided,
The contact exposure apparatus, wherein a sealed space surrounded by the mask, the mask holding unit, the substrate holding unit, and the sealing member is decompressed by sucking air in the sealed space.
(2) A region where the plurality of second air circulation holes are open corresponds to a peripheral edge of the back surface of the substrate,
The contact exposure apparatus according to (1), wherein a peripheral portion of the substrate is restrained by the substrate holding portion by sucking the plurality of second air circulation holes.
(3) The control means opens the plurality of first air circulation holes to the atmosphere, sucks air from the plurality of second air circulation holes, and sucks air in the sealed space to seal the sealing Negative pressure in the space,
The contact exposure apparatus according to (1), wherein when the pressure in the sealed space reaches a predetermined reference negative pressure, the plurality of second air circulation holes are opened to the atmosphere.
(4) The contact exposure apparatus according to (1), wherein the substrate is constrained by the substrate holding portion by being in close contact with the inner peripheral elastic member and the outer peripheral elastic member.
(5) a mask holding unit for holding a mask having a pattern to be exposed;
A substrate holding part having a holding surface for holding a substrate as an exposed material;
An illumination optical system that irradiates exposure light onto the substrate held on the holding surface through the mask;
The holding surface is formed with a plurality of air circulation holes that open on the back surface of the substrate and through which air flows.
The plurality of air circulation holes include a plurality of first air circulation holes and a plurality of second air circulation holes provided outside the plurality of first air circulation holes,
On the holding surface, annular inner peripheral side elastic members and outer peripheral side elastic members that can come into contact with the back surface of the substrate are disposed on the inner peripheral side and the outer peripheral side of the region where the plurality of second air circulation holes open, respectively. And
Between the mask holding part and the substrate holding part, an elastic sealing member surrounding the mask and the substrate is provided,
A contact exposure method that forms a sealed space by the mask, the mask holding unit, the substrate holding unit, and the sealing member, and that exposes the mask and the substrate in close contact with each other using a contact exposure apparatus,
By opening the plurality of first air circulation holes to the atmosphere and sucking air from the plurality of second air circulation holes, the peripheral edge portion of the substrate is restrained by the substrate holding portion, and the air in the sealed space is discharged. Suction to create a negative pressure in the sealed space,
The contact exposure method, wherein when the pressure in the sealed space reaches a predetermined reference negative pressure, the plurality of second air circulation holes are opened to the atmosphere.
(6) a mask holding unit for holding a mask having a pattern to be exposed;
A substrate holding part having a holding surface for holding a substrate as an exposed material;
An illumination optical system that irradiates exposure light through the mask onto the substrate held on the holding surface, and a contact exposure apparatus that exposes the mask and the substrate in close contact with each other,
The holding surface includes a plurality of protrusions that can contact the back surface of the substrate, and a plurality of air circulation holes that are open toward the back surface of the substrate at a position lower than the plurality of protrusions and through which air flows. A partition wall defining a plurality of regions surrounding each of the plurality of protrusions and at least one of the air circulation holes, the partition wall being capable of contacting the back surface of the substrate ,
Control means is provided for controlling the pressure or flow rate of air ejected from the air circulation holes toward the substrate so that the mask and the substrate are brought into close contact with each other.
The control means controls the air pressure or flow rate so that the portion of the workpiece facing the vicinity of the center of the mask is the highest, and after bringing the vicinity of the center of the mask and the portion of the workpiece into close contact, A contact exposure apparatus, wherein the pressure or flow rate of air ejected from the flow hole is controlled so as to increase from the central portion of the mask toward the periphery.
(7) The apparatus further includes a substrate driving unit that drives the substrate holding unit so as to move the holding surface in the vertical direction.
(6), when exposing the substrate, the substrate driving unit moves the holding surface so that the substrate is not separated from the holding surface by air ejected from the air circulation hole. Adhesion exposure equipment.
(8) further comprising a sensor for detecting a gap between the substrate and the mask;
The contact exposure apparatus according to (6) or (7) , wherein the control unit controls a pressure or a flow rate of air ejected from each air circulation hole according to a gap detected by the sensor. .
(9) a mask holding unit for holding a mask having a pattern to be exposed;
A substrate holding part having a holding surface for holding a substrate as an exposed material;
An illumination optical system that irradiates exposure light through the mask onto the substrate held on the holding surface, and a contact exposure method that exposes the mask and the substrate in close contact with each other,
Said holding surface comprises a plurality of projections capable of contacting the rear surface of the substrate, at a position lower than said plurality of protrusions, open to the rear surface of the substrate, and a plurality of air flow holes that air flows, the A plurality of protrusions and a plurality of regions surrounding each of the at least one air circulation hole, and a partition wall capable of contacting the back surface of the substrate ; and
By controlling the pressure or flow rate of air ejected from each air circulation hole toward the substrate, the mask and the substrate are brought into close contact with each other,
When the mask and the substrate are brought into close contact with each other, the air pressure or flow rate is controlled so that the portion of the workpiece facing the vicinity of the center of the mask is the highest, and the portion near the center of the mask and the portion of the workpiece are brought into close contact Thereafter, the contact exposure method is characterized in that the pressure or flow rate of the air ejected from each air circulation hole is controlled to increase from the central portion of the mask toward the periphery.
(10) The apparatus further includes a substrate driving unit that drives the substrate holding unit so as to move the holding surface in the vertical direction.
(9) In the exposure of the substrate, the substrate driving unit moves the holding surface so that the substrate is not separated from the holding surface by air ejected from the air circulation hole. Contact exposure method.
(11) further comprising a sensor for detecting a gap between the substrate and the mask;
(9) or (10) , wherein when the mask and the substrate are brought into close contact with each other, the pressure or flow rate of the air ejected from each of the air circulation holes is controlled according to the gap detected by the sensor. The contact exposure method according to the description.

ここで、「各エア流通孔を流通するエアの圧力又は流量を制御する」とは、エア流通孔を大気開放する場合も含まれる。   Here, “controlling the pressure or flow rate of air flowing through each air circulation hole” includes the case where the air circulation hole is opened to the atmosphere.

本発明の密着露光装置及び密着露光方法によれば、保持面には、エアが流通する複数の第1エア流通孔、及び複数の第1エア流通孔よりも外側に設けられた複数の第2エア流通孔、が基板の裏面に向けて開口し、複数の第2エア流通孔が開口する領域の内周側及び外周側には、基板の裏面と接触可能な環状の内周側弾性部材及び外周側弾性部材がそれぞれ配置され、各エア流通孔を流通するエアの圧力又は流量を制御することで、マスクと基板とを密着させるようにした。また、マスク保持部と基板保持部との間には、マスク及び基板を囲む、弾性の密封部材が設けられ、マスク、マスク保持部、基板保持部、及び密封部材によって囲まれた密封空間は、該密封空間内のエアを吸引することで減圧され、基板をマスクに密着する。従って、基板とマスクとのずれを防止し、且つ密着性能を向上することができ、露光精度を向上することができる。 According to the contact exposure apparatus and the contact exposure method of the present invention, the holding surface has a plurality of first air circulation holes through which air flows, and a plurality of second air holes provided outside the plurality of first air circulation holes. An air circulation hole is opened toward the back surface of the substrate, and an inner circumferential side and an outer circumferential side of a region where the plurality of second air circulation holes are opened are annular inner circumferential elastic members that can contact the back surface of the substrate, and The outer peripheral side elastic member is disposed, and the mask and the substrate are brought into close contact with each other by controlling the pressure or flow rate of the air flowing through each air circulation hole. Further, an elastic sealing member that surrounds the mask and the substrate is provided between the mask holding unit and the substrate holding unit, and the sealed space surrounded by the mask, the mask holding unit, the substrate holding unit, and the sealing member is: By sucking air in the sealed space, the pressure is reduced and the substrate is brought into close contact with the mask. Therefore, the deviation between the substrate and the mask can be prevented, the adhesion performance can be improved, and the exposure accuracy can be improved.

また、本発明の密着露光装置及び密着露光方法によれば、保持面には、基板の裏面に当接可能な複数の突起と、複数の突起よりも低い位置で、基板の裏面に向けて開口し、エアが流通する複数のエア流通孔と、複数の突起及び少なくとも一つのエア流通孔をそれぞれ囲う複数の領域を画成する、基板の裏面に当接可能な仕切り壁と、が形成され、各エア流通孔から基板に向けて噴出するエアの圧力又は流量を制御することで、マスクと基板とを密着させるようにした。特に、マスクの中央付近と対向するワークの部分が最も高くなるようにエアの圧力又は流量を制御し、マスクの中央付近とワークの部分を密着させた後、各エア流通孔から噴出するエアの圧力又は流量を、マスクの中央部分から周囲に向かうにつれて増加するように制御する。従って、基板とマスクの密着性能を向上することができ、露光精度を向上することができる。また、保持面に設けた突起によって、基板と保持面との間で摩擦によって生じる基板の損傷を防止することができる。 Further, according to the contact exposure apparatus and the contact exposure method of the present invention, the holding surface has a plurality of protrusions capable of contacting the back surface of the substrate and an opening toward the back surface of the substrate at a position lower than the plurality of protrusions. A plurality of air flow holes through which air flows, and a plurality of projections and a plurality of regions surrounding each of the at least one air flow hole, and a partition wall capable of contacting the back surface of the substrate, are formed, The mask and the substrate are brought into close contact with each other by controlling the pressure or flow rate of air ejected from each air circulation hole toward the substrate. In particular, the air pressure or flow rate is controlled so that the portion of the workpiece facing the vicinity of the center of the mask is the highest, and after the portion of the mask is in close contact with the portion of the workpiece, the air blown out from each air circulation hole is controlled. The pressure or flow rate is controlled to increase from the central portion of the mask toward the periphery. Therefore, the adhesion performance between the substrate and the mask can be improved, and the exposure accuracy can be improved. Further, the protrusion provided on the holding surface can prevent damage to the substrate caused by friction between the substrate and the holding surface.

本発明に係る第1実施形態の密着露光装置の側面断面図である。1 is a side sectional view of a contact exposure apparatus according to a first embodiment of the present invention. 図1の構成の矢印IIで示す部位を拡大した図である。It is the figure which expanded the site | part shown by the arrow II of the structure of FIG. 図1に示す基板保持部の保持面の上面図である。It is a top view of the holding surface of the board | substrate holding part shown in FIG. 第2エア流通孔からエアを吸引して基板の周縁部を保持面に拘束する状態を示す、図3のIV−IV線に沿った断面図である。It is sectional drawing along the IV-IV line of FIG. 3 which shows the state which attracts | sucks air from a 2nd air circulation hole and restrains the peripheral part of a board | substrate to a holding surface. 第1エア流通孔を大気開放し、密封空間を負圧にすることで、周縁部が保持面に拘束された基板の中央部が上方に弾性変形する状態を示す、図3のIV−IV線に沿った断面図である。Line IV-IV in FIG. 3 shows a state in which the central portion of the substrate whose peripheral portion is constrained by the holding surface is elastically deformed upward by opening the first air circulation hole to the atmosphere and making the sealed space negative pressure. FIG. 基板が弾性変形して基板の中央部からマスクに密着する状態を示す、図3のIV−IV線に沿った断面図である。FIG. 4 is a cross-sectional view taken along the line IV-IV in FIG. 3, showing a state where the substrate is elastically deformed and is in close contact with the mask from the central portion of the substrate. 第2エア流通孔が大気開放されて周縁部の拘束が開放された基板がマスクに密着する状態を示す、図3のIV−IV線に沿った断面図である。FIG. 4 is a cross-sectional view taken along the line IV-IV in FIG. 3, showing a state in which the second air circulation hole is opened to the atmosphere and the substrate whose peripheral edge is released is in close contact with the mask. 第2実施形態の基板保持部の保持面の上面図である。It is a top view of the holding surface of the board | substrate holding part of 2nd Embodiment. (a)、(b)は、マスクと基板を密着させる過程を示す、図8のIX−IX線に沿った断面図である。(A), (b) is sectional drawing along the IX-IX line | wire of FIG. 8, which shows the process which adhere | attaches a mask and a board | substrate. 第2実施形態の第1変形例に係るマスクと基板を密着させた状態を示す、図8のIX−IX線に沿った断面図である。It is sectional drawing along the IX-IX line | wire of FIG. 8 which shows the state which contact | adhered the mask and board | substrate which concern on the 1st modification of 2nd Embodiment. 第2実施形態の第2変形例に係る基板保持部の保持面の上面図である。It is a top view of the holding surface of the board | substrate holding part which concerns on the 2nd modification of 2nd Embodiment. マスクと基板を密着させる過程を示す、図11のXII−XII線に沿った断面図である。FIG. 12 is a cross-sectional view taken along line XII-XII in FIG. 11, showing a process of bringing the mask and the substrate into close contact with each other.

以下、図面を参照して、本発明の好適な各実施形態について説明する。
(第1実施形態)
図1は、第1実施形態にかかる密着露光装置の側面断面図である。図2は、図1の構成の矢印IIで示す部位を拡大した図である。尚、図1,2において、露光光の一部を遮蔽するアパーチャ機構は省略している。
Hereinafter, each preferred embodiment of the present invention will be described with reference to the drawings.
(First embodiment)
FIG. 1 is a side sectional view of a contact exposure apparatus according to the first embodiment. FIG. 2 is an enlarged view of a portion indicated by an arrow II in the configuration of FIG. In FIGS. 1 and 2, an aperture mechanism that blocks a part of the exposure light is omitted.

本実施形態の密着露光装置CEは、図1において、ベース1は定盤G上に載置されている。ベース1上には、フレーム3が設置されている。フレーム3は、下端がベース1の縁に固定された脚部3aと、脚部3aの上端に取り付けられた矩形枠状の天板3bとからなる。天板3bの中央には矩形開口が形成され、その周囲にマスクMの周囲を吸着保持したマスク保持部4が取り付けられている。又、天板3bには、被露光材としてのワーク(基板)WとマスクMとの隙間を検出するセンサ20が取り付けられている。マスクMには、ワークWに露光すべきパターンが描画されている。   In the contact exposure apparatus CE of the present embodiment, the base 1 is placed on a surface plate G in FIG. A frame 3 is installed on the base 1. The frame 3 includes a leg portion 3a having a lower end fixed to the edge of the base 1, and a rectangular frame-shaped top plate 3b attached to the upper end of the leg portion 3a. A rectangular opening is formed at the center of the top plate 3b, and a mask holding portion 4 that holds the periphery of the mask M by suction is attached around the opening. A sensor 20 for detecting a gap between a workpiece (substrate) W as a material to be exposed and the mask M is attached to the top plate 3b. On the mask M, a pattern to be exposed on the workpiece W is drawn.

ベース1の上面には、4本のガイドレール5が平行に且つ図1で左右方向(X軸方向)に延在するように配置されている。各ガイドレール5に沿って、スライダ6が移動自在に設けられている。スライダ6は、X軸ステージ7の下面に取り付けられている。ベース1とX軸ステージ7との間には、X軸リニアモータ(不図示)が設けられ、ベース1に対してX軸ステージ7をX軸方向に駆動可能となっている。   On the upper surface of the base 1, four guide rails 5 are arranged in parallel and extend in the left-right direction (X-axis direction) in FIG. A slider 6 is movably provided along each guide rail 5. The slider 6 is attached to the lower surface of the X-axis stage 7. An X-axis linear motor (not shown) is provided between the base 1 and the X-axis stage 7 so that the X-axis stage 7 can be driven in the X-axis direction with respect to the base 1.

X軸ステージ7の上面には、4本のガイドレール9が平行に且つ図1で紙面垂直方向(Y軸方向)に延在するように配置されている。各ガイドレール9に沿って、スライダ10が移動自在に設けられている。スライダ10は、Y軸ステージ13の下面に取り付けられている。X軸ステージ7とY軸ステージ13との間には、Y軸リニアモータ12が設けられ、X軸ステージ7に対してY軸ステージ13をY軸方向に駆動可能となっている。Y軸ステージ13とその上方に設けられた基板保持部11との間には、保持面11aを図1で上下方向(Z軸方向)及び傾き方向に移動するように、基板保持部11を駆動するZ軸駆動部(基板駆動部)14が設けられる。基板保持部11は、ワークWを保持する保持面11aを構成する。   Four guide rails 9 are arranged on the upper surface of the X-axis stage 7 so as to extend in parallel and in a direction perpendicular to the paper surface (Y-axis direction) in FIG. A slider 10 is movably provided along each guide rail 9. The slider 10 is attached to the lower surface of the Y-axis stage 13. A Y-axis linear motor 12 is provided between the X-axis stage 7 and the Y-axis stage 13 so that the Y-axis stage 13 can be driven in the Y-axis direction with respect to the X-axis stage 7. The substrate holding unit 11 is driven between the Y-axis stage 13 and the substrate holding unit 11 provided above the Y-axis stage 13 so that the holding surface 11a moves in the vertical direction (Z-axis direction) and the tilt direction in FIG. A Z-axis drive unit (substrate drive unit) 14 is provided. The substrate holding unit 11 constitutes a holding surface 11 a that holds the workpiece W.

図2において、センサ20は、天板3bの上面に取り付けられたガイドレール3cに対してスライダ21を介して移動可能に支持された支持部22と、支持部22の先端に取り付けられた測定部23とから構成されている。測定部23は、発光部23aと受光部23bとを含む。尚、支持部22は、不図示のリニアモータによって、ガイドレール3cに沿って任意の位置に駆動されるようになっている。センサ20は、複数(例えば4つ)設けると好ましい。なお、センサ20としては、光学式透過型、渦電流式、超音波型のものであってもよい。   In FIG. 2, the sensor 20 includes a support portion 22 that is movably supported via a slider 21 with respect to a guide rail 3 c that is attached to the upper surface of the top plate 3 b, and a measurement portion that is attached to the tip of the support portion 22. 23. The measurement unit 23 includes a light emitting unit 23a and a light receiving unit 23b. The support portion 22 is driven to an arbitrary position along the guide rail 3c by a linear motor (not shown). It is preferable to provide a plurality of (for example, four) sensors 20. The sensor 20 may be an optical transmission type, an eddy current type, or an ultrasonic type.

また、マスク保持部4の上方には、保持面11aに保持されたワークWに、露光用光をマスクMを介して照射する不図示の照明光学系が配置されている。   In addition, an illumination optical system (not shown) that irradiates the work W held on the holding surface 11 a with the exposure light through the mask M is disposed above the mask holding unit 4.

図3及び図4に示すように、基板保持部11の保持面11aには、ワークWの裏面に向けて開口し、エアが流通する複数の第1エア流通孔31と、該複数の第1エア流通孔31よりも外側に設けられた複数の第2エア流通孔32と、不図示のワークローダによってワークWを保持面11aに搬送する際に保持面11aから進出する複数のピン(図示せず)が進退可能な複数のピン孔(図示せず)と、が形成されている。複数の第2エア流通孔32は、ワークWの裏面の周縁部15に対応して略矩形枠状の領域E内に開口している。また、保持面11aには、領域Eの内周側及び外周側に、ワークWの裏面と接触可能な環状の内周側弾性部材33及び外周側弾性部材34が、それぞれ配置されている。   As shown in FIGS. 3 and 4, the holding surface 11 a of the substrate holding unit 11 has a plurality of first air circulation holes 31 that open toward the back surface of the workpiece W and through which air flows, and the plurality of first air holes. A plurality of second air circulation holes 32 provided outside the air circulation holes 31 and a plurality of pins (not shown) that advance from the holding surface 11a when the workpiece W is conveyed to the holding surface 11a by a work loader (not shown). And a plurality of pin holes (not shown) that can be moved back and forth. The plurality of second air circulation holes 32 are opened in a substantially rectangular frame-shaped region E corresponding to the peripheral edge 15 on the back surface of the workpiece W. In addition, on the holding surface 11 a, annular inner peripheral side elastic members 33 and outer peripheral side elastic members 34 that can come into contact with the back surface of the workpiece W are disposed on the inner peripheral side and the outer peripheral side of the region E, respectively.

外周側弾性部材34より更に外周側の保持面11aには、マスクM及びワークWを囲うように環状に形成され、マスク保持部4の裏面4aに当接してマスク保持部4と基板保持部11との間を封止可能な弾性の密封部材35が設けられている。これにより、図2及び図4に示すように、マスクM、マスク保持部4、基板保持部11、及び密封部材35によって囲まれた密封空間Sが画成される。また、マスク保持部4には、密封空間Sに連通する吸引孔36が設けられている。   The holding surface 11a on the outer peripheral side further than the outer peripheral elastic member 34 is formed in an annular shape so as to surround the mask M and the work W, and comes into contact with the back surface 4a of the mask holding unit 4 to hold the mask holding unit 4 and the substrate holding unit 11. An elastic sealing member 35 capable of sealing between the two is provided. Thereby, as shown in FIGS. 2 and 4, a sealed space S surrounded by the mask M, the mask holding unit 4, the substrate holding unit 11, and the sealing member 35 is defined. The mask holding part 4 is provided with a suction hole 36 communicating with the sealed space S.

複数の第2エア流通孔32及び吸引孔36は、いずれも不図示の配管を介して、真空ポンプなどの負圧発生装置に接続されている。配管の途中に設けられたレギュレータやバルブなどは、制御手段30(図1参照)により制御され、負圧発生装置を作動して、吸引孔36からエアを吸引することで密封空間S内を負圧にし、また、複数の第2エア流通孔32からエアを吸引し、或いは大気開放する。   The plurality of second air circulation holes 32 and suction holes 36 are all connected to a negative pressure generating device such as a vacuum pump via a pipe (not shown). Regulators and valves provided in the middle of the piping are controlled by the control means 30 (see FIG. 1), and the negative pressure generator is operated to suck the air from the suction hole 36, thereby reducing the inside of the sealed space S. In addition, air is sucked from the plurality of second air circulation holes 32 or released to the atmosphere.

このように構成された密着露光装置CEでは、図4に示すように、マスク保持部4にマスクMを吸着保持し、基板保持部11の保持面11a上にワークWを載置し、密封部材35でマスク保持部4と基板保持部11との間を封止してマスクM、マスク保持部4、基板保持部11、及び密封部材35によって密封空間Sを画成する。   In the contact exposure apparatus CE configured as described above, as shown in FIG. 4, the mask M is sucked and held on the mask holding unit 4, the workpiece W is placed on the holding surface 11 a of the substrate holding unit 11, and the sealing member The space between the mask holding unit 4 and the substrate holding unit 11 is sealed at 35, and a sealed space S is defined by the mask M, the mask holding unit 4, the substrate holding unit 11, and the sealing member 35.

制御手段30は、吸引孔36から密封空間S内のエアを吸引して該密封空間Sを減圧する。また、減圧直後、複数の第2エア流通孔32からエアを吸引することで、内周側弾性部材33及び外周側弾性部材34で囲まれた領域E内を減圧してワークWの裏面の周縁部15を保持面11aに拘束する。   The control means 30 sucks air in the sealed space S from the suction hole 36 and depressurizes the sealed space S. Further, immediately after the pressure reduction, air is sucked from the plurality of second air circulation holes 32 to reduce the pressure in the region E surrounded by the inner peripheral side elastic member 33 and the outer peripheral side elastic member 34, and the peripheral edge of the back surface of the work W The part 15 is constrained to the holding surface 11a.

これにより、図5に示すように、周縁部15が保持面11aに拘束されたワークWは、複数の第1エア流通孔31が大気開放されているので、表面側(密封空間S)の負圧により、中央部分が上方に膨らみだし、やがてマスクMに密着する。このとき、ワークWには、弾性変形によるせん断ひずみが生じる。しかし、このせん断ひずみは、弾性体である内周側弾性部材33及び外周側弾性部材34によって緩和されるのでワークWが破断する虞はない。また、ワークWがマスクMに接触したときには、マスクMから受ける力により、ワークWの周縁部15は、複数の第2エア流通孔32からエアを吸引をしなくても内周側弾性部材33と外周側弾性部材34によって密着され、基板保持部11に拘束することができる。従って、この場合には、その後は複数の第2エア流通孔32からの吸引を行なわない。   Thereby, as shown in FIG. 5, since the plurality of first air circulation holes 31 are opened to the atmosphere, the workpiece W in which the peripheral edge portion 15 is restrained by the holding surface 11a is negative on the surface side (sealed space S). The central portion starts to bulge upward due to the pressure, and eventually comes into close contact with the mask M. At this time, the workpiece W is subjected to shear strain due to elastic deformation. However, since the shear strain is alleviated by the inner peripheral side elastic member 33 and the outer peripheral side elastic member 34 which are elastic bodies, there is no possibility that the workpiece W is broken. Further, when the workpiece W comes in contact with the mask M, the peripheral edge portion 15 of the workpiece W does not suck air from the plurality of second air circulation holes 32 due to the force received from the mask M. And the outer peripheral side elastic member 34, and can be restrained by the substrate holder 11. Accordingly, in this case, suction from the plurality of second air circulation holes 32 is not performed thereafter.

図6に示すように、更に密封空間Sが減圧されると、マスクMとワークWと接触領域が中央部から徐々に外側に広がり、やがて密封空間S内の圧力が所定の基準負圧に達する。そして、図7に示すように、密封空間S内の圧力が所定の基準負圧に達したとき、制御手段30は、複数の第2エア流通孔32を大気開放する。これにより、周縁部15が保持面11aに拘束されて弾性変形していたワークWは、この拘束力が開放されることで周縁部15が保持面11aから離れ、位置ずれが生じることなくマスクMの平坦度に倣ってマスクMに密着する。   As shown in FIG. 6, when the sealed space S is further depressurized, the contact area of the mask M, the workpiece W, and the contact area gradually spreads outward from the central portion, and the pressure in the sealed space S eventually reaches a predetermined reference negative pressure. . As shown in FIG. 7, when the pressure in the sealed space S reaches a predetermined reference negative pressure, the control means 30 opens the plurality of second air circulation holes 32 to the atmosphere. As a result, the workpiece W, which has been elastically deformed with the peripheral edge 15 restrained by the holding surface 11a, is separated from the holding surface 11a by releasing this restraining force, and the mask M is not displaced. It adheres closely to the mask M in accordance with the flatness.

以上説明したように、本実施形態の密着露光装置CE及び密着露光方法によれば、保持面11aには、ワークWの裏面に向けて開口する複数の第1エア流通孔31、及び複数の第1エア流通孔31よりも外側に設けられた複数の第2エア流通孔32が形成され、複数の第2エア流通孔32が開口する領域Eの内周側及び外周側に、ワークWの裏面と接触可能な環状の内周側弾性部材33及び外周側弾性部材34がそれぞれ配置され、制御手段30により各エア流通孔31、32を流通するエアの圧力又は流量を制御することで、マスクMとワークWとを密着させるようにした。従って、内周側弾性部材33及び外周側弾性部材34により、ワークWに発生するせん断ひずみを軽減させてワークWの破断を防止し、ワークWとマスクMとの密着性能を向上させて露光精度を向上させることができる。また、ワークWは、中央部分からマスクMに接触し、接触領域を徐々に外周側に広げて最終的に全面が接触するので、マスクMとワークWの位置がずれることなく、密着する。   As described above, according to the contact exposure apparatus CE and the contact exposure method of the present embodiment, the holding surface 11a includes the plurality of first air circulation holes 31 that open toward the back surface of the workpiece W, and the plurality of first air circulation holes 31a. A plurality of second air circulation holes 32 provided outside the one air circulation hole 31 are formed, and the back surface of the work W is disposed on the inner peripheral side and the outer peripheral side of the region E where the plurality of second air circulation holes 32 open. An annular inner peripheral elastic member 33 and an outer peripheral elastic member 34 that are in contact with each other are arranged, and the control means 30 controls the pressure or flow rate of the air flowing through each of the air flow holes 31 and 32 so that the mask M And the work W are brought into close contact with each other. Therefore, the inner peripheral side elastic member 33 and the outer peripheral side elastic member 34 reduce the shear strain generated in the workpiece W to prevent the workpiece W from being broken, improve the adhesion performance between the workpiece W and the mask M, and the exposure accuracy. Can be improved. In addition, since the workpiece W comes into contact with the mask M from the central portion, the contact area is gradually expanded toward the outer peripheral side, and finally the entire surface comes into contact with each other, so that the mask M and the workpiece W are in close contact with each other.

また、ワークWの裏面の周縁部15に対応する領域Eに開口する複数の第2エア流通孔32を吸引することで、ワークWの周縁部15を基板保持部11に拘束するので、確実にワークWの周縁部15を基板保持部11に拘束することができる。   Moreover, since the peripheral part 15 of the workpiece | work W is restrained by the board | substrate holding | maintenance part 11 by attracting | sucking the several 2nd air circulation hole 32 opened to the area | region E corresponding to the peripheral part 15 of the back surface of the workpiece | work W, it is reliable. The peripheral edge 15 of the work W can be restrained by the substrate holding part 11.

更に、マスク保持部4と基板保持部11との間には、マスクM及びワークWを囲む、弾性の密封部材35が設けられ、マスクM、マスク保持部4、基板保持部11、及び密封部材35によって囲まれた密封空間S内のエアを吸引して減圧するので、ワークWがマスクMに密着する。   Further, an elastic sealing member 35 surrounding the mask M and the workpiece W is provided between the mask holding unit 4 and the substrate holding unit 11, and the mask M, the mask holding unit 4, the substrate holding unit 11, and the sealing member are provided. Since the air in the sealed space S surrounded by 35 is sucked and depressurized, the workpiece W comes into close contact with the mask M.

また、制御手段30は、複数の第1エア流通孔31を大気開放し、複数の第2エア流通孔32からエアを吸引し、且つ、密封空間S内のエアを吸引して密封空間S内を負圧にし、密封空間S内の圧力が所定の基準負圧に達したとき、複数の第2エア流通孔32を大気開放するので、ワークWを弾性変形させて中央部分から徐々にマスクMに接触させた後、保持面11a(領域E)による周縁部15の拘束を開放して、ワークWをマスクMの平坦度に倣って位置ずれすることなく密着させることができる。   Further, the control means 30 opens the plurality of first air circulation holes 31 to the atmosphere, sucks air from the plurality of second air circulation holes 32, and sucks the air in the sealed space S to create the inside of the sealed space S. When the pressure in the sealed space S reaches a predetermined reference negative pressure, the plurality of second air circulation holes 32 are opened to the atmosphere, so that the workpiece W is elastically deformed to gradually start the mask M from the central portion. After the contact, the work piece W can be brought into close contact with the mask M in accordance with the flatness of the mask M by releasing the restraint of the peripheral edge 15 by the holding surface 11a (region E).

なお、上記実施形態では、第2エア流通孔32からエアを吸引することで、ワークWの周縁部15を基板保持部11に拘束しているが、第2エア流通孔32からエアを吸引しなくても、ワークWの周縁部15を内周側弾性部材33と外周側弾性部材34とに密着させて、ワークWの周縁部15を基板保持部11に拘束させるようにしてもよい。   In the above embodiment, the peripheral edge 15 of the workpiece W is restrained by the substrate holding part 11 by sucking air from the second air circulation hole 32, but air is sucked from the second air circulation hole 32. Alternatively, the peripheral edge 15 of the workpiece W may be brought into close contact with the inner peripheral elastic member 33 and the outer peripheral elastic member 34 so that the peripheral edge 15 of the workpiece W is restrained by the substrate holding portion 11.

(第2実施形態)
次に、本発明の第2実施形態に係る密着露光装置CE及び密着露光方法について、図8及び図9を参照して説明する。なお、第1実施形態と同一又は同等部分については、同一符号を付して説明を省略或は簡略化する。
(Second Embodiment)
Next, a contact exposure apparatus CE and a contact exposure method according to a second embodiment of the present invention will be described with reference to FIGS. Note that the same or equivalent parts as those of the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.

図8に示すように、基板保持部11の保持面11aには、ワークWの裏面に当接可能な複数の突起11bと、ワークWの裏面に向けてエアが噴出される複数のエア流通孔11cと、不図示のワークローダによってワークWを保持面11aに搬送する際に保持面11aから進出する複数のピン(図示せず)が進退可能な複数のピン孔(図示せず)と、が形成されている。突起11bの役割としては、ワークWと保持面11aとの間で、摩擦によって生じるワークWの損傷を小さくするためである。突起11bが設けられていない場合、ワークWにエアを噴出する際に、エアの流量又は圧力の不均一が生じ、ワークが傾いて保持面11aに接触した部分が損傷する虞がある。   As shown in FIG. 8, the holding surface 11 a of the substrate holding portion 11 has a plurality of protrusions 11 b that can contact the back surface of the workpiece W and a plurality of air circulation holes from which air is ejected toward the back surface of the workpiece W. 11c and a plurality of pin holes (not shown) through which a plurality of pins (not shown) advanced from the holding surface 11a can be advanced and retracted when the workpiece W is conveyed to the holding surface 11a by a work loader (not shown). Is formed. The role of the protrusion 11b is to reduce damage to the work W caused by friction between the work W and the holding surface 11a. When the protrusion 11b is not provided, when air is ejected to the workpiece W, the air flow rate or pressure is nonuniform, and the workpiece may be tilted and the portion contacting the holding surface 11a may be damaged.

複数のエア流通孔11cには、図示しないファン、ブロワから配管を通過するエアが供給され、エアの圧力又は流量は、制御手段30(図1参照。)が配管の途中に設けられたレギュレータやバルブなどを駆動することで制御され、ワークWに噴出するエアの量が制御される。なお、複数のエア流通孔11cは、任意に配列可能であり、また、エアの噴出は、配管やエア流通孔11cの配列に応じて、選択的に、また、独立して行うことができる。   A plurality of air circulation holes 11c are supplied with air passing through a pipe from a fan and a blower (not shown), and the pressure or flow rate of the air is controlled by a regulator provided in the middle of the pipe. It is controlled by driving a valve or the like, and the amount of air ejected onto the workpiece W is controlled. The plurality of air circulation holes 11c can be arbitrarily arranged, and the ejection of air can be performed selectively and independently according to the arrangement of the piping and the air circulation holes 11c.

このように構成された密着露光装置CEでは、マスク保持部4に保持されたマスクMと基板保持部11の保持面11aに保持されたワークWとを密着させるように、保持面11aに設けられた複数のエア流通孔11cからワークWに向けてエアを噴出させる。例えば、図9(a)に示すように、マスクMの中央付近と対向するワークWの部分が最も高い、ワークWが上に凸のアーチ形状になるように、各エア流通孔11cから噴出されるエアの圧力又は流量を制御する。なお、図9(a)、(b)において、エア流通孔11c内の矢印の長さは、エアの流量の大きさを示している。   In the contact exposure apparatus CE configured as described above, the mask M held by the mask holding unit 4 and the workpiece W held by the holding surface 11a of the substrate holding unit 11 are provided on the holding surface 11a so as to closely contact each other. Further, air is ejected toward the workpiece W from the plurality of air circulation holes 11c. For example, as shown in FIG. 9 (a), the portion of the work W facing the vicinity of the center of the mask M is the highest, and the work W is ejected from each air circulation hole 11c so as to have a convex arch shape. Control air pressure or flow rate. 9A and 9B, the length of the arrow in the air circulation hole 11c indicates the magnitude of the air flow rate.

また、マスクMは、通常中央付近が撓むので、制御手段30は、各エア流通孔11cから噴出するエアの圧力又は流量を、マスクMの中央部分から周囲に向かうにつれて増加するように制御する。これにより、マスクMとワークWとの間の中央付近に溜まっている空気を周囲に向かって逃がすことができる。   Further, since the mask M is normally bent near the center, the control means 30 controls the pressure or flow rate of the air ejected from each air circulation hole 11c so as to increase from the central portion of the mask M toward the periphery. . Thereby, the air accumulated in the vicinity of the center between the mask M and the workpiece W can be released toward the periphery.

その後、図9(b)に示すように、マスクMの平坦度に倣わせるように、各エア流通孔11cから噴出されるエアの圧力又は流量を制御する。そして、制御手段30は、センサ20を走査させ、センサ20によってマスクMとワークWとの間に隙間が確認された場合には、各エア流通孔11cから噴出するエアの圧力又は流量を高め、マスクMとワークWとを密着させる。   Thereafter, as shown in FIG. 9B, the pressure or flow rate of the air ejected from each air circulation hole 11c is controlled so as to follow the flatness of the mask M. And the control means 30 makes the sensor 20 scan, and when the clearance gap between the mask M and the workpiece | work W is confirmed by the sensor 20, the pressure or flow volume of the air which ejects from each air circulation hole 11c is raised, The mask M and the work W are brought into close contact with each other.

なお、ワークWを露光する際には、マスクMとワークWとが密着しつつ、エア流通孔11cから噴出されるエアによってワークWが保持面11aから離れないことが好ましい。このため、Z軸駆動部14は、ワークWが保持面11aから離れないように保持面11aを移動させる。
ただし、図10に示す変形例のように、ワークWをエアによって浮上させたまま露光してもよく、この場合、保持面11aの突起11b、エア流通孔11cなどによる転写パターンへの影響を確実に防止することができる。
When the workpiece W is exposed, it is preferable that the workpiece W is not separated from the holding surface 11a by the air ejected from the air circulation hole 11c while the mask M and the workpiece W are in close contact with each other. For this reason, the Z-axis drive part 14 moves the holding surface 11a so that the workpiece | work W may not leave | separate from the holding surface 11a.
However, as in the modification shown in FIG. 10, the workpiece W may be exposed while being lifted by air. In this case, the projection 11b of the holding surface 11a, the air circulation hole 11c, and the like are surely affected by the transfer pattern. Can be prevented.

また、マスクMとワークWとを密着させるため、ワークWの割れを考慮すると、ワークWの厚さは、2mm以上であることが好ましい。一方、マスクMの平坦度に沿ってマスクとワークWとを密着させるためには、ワークWの厚さは、3mm以下であることが好ましい。従って、ワークWの厚さは、2〜3mm±0.2mmであることが好ましく、露光精度を考慮すると、2.5mm±0.2であることがより好ましい。   In order to bring the mask M and the workpiece W into close contact, the thickness of the workpiece W is preferably 2 mm or more in consideration of cracks in the workpiece W. On the other hand, in order to adhere the mask and the workpiece W along the flatness of the mask M, the thickness of the workpiece W is preferably 3 mm or less. Therefore, the thickness of the workpiece W is preferably 2 to 3 mm ± 0.2 mm, and more preferably 2.5 mm ± 0.2 in consideration of exposure accuracy.

以上説明したように、本実施形態の密着露光装置CE及び密着露光方法によれば、保持面11aには、ワークWの裏面に当接可能な複数の突起11bと、ワークWの裏面に向けてエアが噴出される複数のエア流通孔11cと、が形成され、各エア流通孔11cからワークWに向けて噴出するエアの圧力又は流量を制御することで、マスクMとワークWとを密着させるようにした。従って、ワークWとマスクMの密着性能を向上することができ、露光精度を向上することができる。また、保持面11aに設けた突起11bによって、ワークWと保持面11aとの間で摩擦によって生じるワークWの損傷を防止することができる。   As described above, according to the contact exposure apparatus CE and the contact exposure method of the present embodiment, the holding surface 11a has the plurality of protrusions 11b that can contact the back surface of the work W and the back surface of the work W. A plurality of air circulation holes 11c through which air is ejected are formed, and the mask M and the workpiece W are brought into close contact with each other by controlling the pressure or flow rate of the air ejected from each air circulation hole 11c toward the workpiece W. I did it. Therefore, the adhesion performance between the workpiece W and the mask M can be improved, and the exposure accuracy can be improved. Further, the protrusion 11b provided on the holding surface 11a can prevent the workpiece W from being damaged due to friction between the workpiece W and the holding surface 11a.

なお、本実施形態の変形例として、図11及び図12に示すように、保持面11aには、少なくとも一つのエア流通孔11cを囲うように領域80a〜80eを画成する、ワークWの裏面に当接可能な仕切り壁11dが形成されてもよい。なお、仕切り壁11dは、突起11bと等しい高さを有する。   As a modification of the present embodiment, as shown in FIGS. 11 and 12, the holding surface 11a has regions 80a to 80e so as to surround at least one air circulation hole 11c. A partition wall 11d that can abut on may be formed. Note that the partition wall 11d has a height equal to that of the protrusion 11b.

このように、仕切り壁11dを設けることで、領域毎にエアの圧力又は流量を制御するようにしてもよい。また、例えば、上記実施の形態と同様、最初に、中央の領域80a内から噴出するエアの流量を大きくしておき、その後、マスクMの平坦度に倣わせるようにその外側の環状の領域80bや、その周囲の長尺の領域80c,80d、80e内から噴出するエアの流量を大きくするようにしてもよい。   In this manner, the pressure or flow rate of air may be controlled for each region by providing the partition wall 11d. Further, for example, as in the above-described embodiment, first, the flow rate of the air ejected from the central region 80a is increased, and then the outer annular region so as to follow the flatness of the mask M. You may make it enlarge the flow volume of the air which blows out from 80b and the long area | region 80c, 80d, 80e of the circumference | surroundings around it.

なお、本発明は前述した各実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲において適宜変更可能である。   In addition, this invention is not limited to each embodiment mentioned above, In the range which does not deviate from the summary of this invention, it can change suitably.

例えば、本発明では、保持面11aは、少なくとも複数の突起11bを有する構成としたが、複数の突起11bを設ける代わりに、仕切り壁11dを有する構成であってもよい。   For example, in the present invention, the holding surface 11a is configured to have at least a plurality of protrusions 11b, but may be configured to include a partition wall 11d instead of providing the plurality of protrusions 11b.

4 マスク保持部
11 基板保持部
11a 保持面
11b 突起
11c エア流通孔
11d 仕切り壁
14 Z軸駆動部(基板駆動部)
15 周縁部
20 センサ
30 制御手段
31 第1エア流通孔
32 第2エア流通孔
33 内周側弾性部材
34 外周側弾性部材
35 密封部材
80a〜80e 吸着領域
CE 密着露光装置
E 第2エア流通孔が開口する領域
M マスク
S 密封空間
W ワーク(基板)
4 Mask holding part 11 Substrate holding part 11a Holding surface 11b Projection 11c Air circulation hole 11d Partition wall 14 Z-axis drive part (substrate drive part)
15 peripheral edge 20 sensor 30 control means 31 1st air circulation hole 32 2nd air circulation hole 33 inner peripheral side elastic member 34 outer peripheral side elastic member 35 sealing member 80a-80e adsorption | suction area | region CE contact | adhesion exposure apparatus E 2nd air distribution hole Opening area M Mask S Sealing space W Workpiece (substrate)

Claims (11)

露光すべきパターンを有するマスクを保持するマスク保持部と、
被露光材としての基板を保持する保持面を有する基板保持部と、
前記保持面に保持された基板に、露光用光を前記マスクを介して照射する照明光学系と、を備え、前記マスクと基板とを密着させた状態で露光する密着露光装置であって、
前記保持面には、前記基板の裏面に向けて開口し、エアが流通する複数のエア流通孔が形成され、
前記複数のエア流通孔は、複数の第1エア流通孔と、該複数の第1エア流通孔よりも外側に設けられた複数の第2エア流通孔と、を備え、
前記保持面には、前記複数の第2エア流通孔が開口する領域の内周側及び外周側に、前記基板の裏面と接触可能な環状の内周側弾性部材及び外周側弾性部材がそれぞれ配置され、
前記マスクと基板を密着させるように、前記各エア流通孔を流通するエアの圧力又は流量を制御する制御手段が設けられ、
前記マスク保持部と前記基板保持部との間には、前記マスク及び前記基板を囲む、弾性の密封部材が設けられ、
前記マスク、前記マスク保持部、前記基板保持部、及び前記密封部材によって囲まれた密封空間は、該密封空間内のエアを吸引することで減圧されることを特徴とする密着露光装置。
A mask holding unit for holding a mask having a pattern to be exposed;
A substrate holding part having a holding surface for holding a substrate as an exposed material;
An illumination optical system that irradiates exposure light through the mask onto the substrate held on the holding surface, and a contact exposure apparatus that exposes the mask and the substrate in close contact with each other,
The holding surface has a plurality of air circulation holes that are open toward the back surface of the substrate and through which air flows.
The plurality of air circulation holes include a plurality of first air circulation holes and a plurality of second air circulation holes provided outside the plurality of first air circulation holes,
On the holding surface, annular inner peripheral side elastic members and outer peripheral side elastic members that can come into contact with the back surface of the substrate are disposed on the inner peripheral side and the outer peripheral side of the region where the plurality of second air circulation holes open, respectively. And
Control means for controlling the pressure or flow rate of the air flowing through each of the air circulation holes is provided so as to bring the mask and the substrate into close contact with each other.
Between the mask holding part and the substrate holding part, an elastic sealing member surrounding the mask and the substrate is provided,
The contact exposure apparatus, wherein a sealed space surrounded by the mask, the mask holding unit, the substrate holding unit, and the sealing member is decompressed by sucking air in the sealed space.
前記複数の第2エア流通孔が開口する領域は、前記基板の裏面の周縁部に対応しており、
前記複数の第2エア流通孔を吸引することで、前記基板の周縁部は前記基板保持部に拘束されることを特徴とする請求項1に記載の密着露光装置。
The region where the plurality of second air circulation holes open corresponds to the peripheral edge of the back surface of the substrate,
The contact exposure apparatus according to claim 1, wherein a peripheral portion of the substrate is restrained by the substrate holding portion by sucking the plurality of second air circulation holes.
前記制御手段は、前記複数の第1エア流通孔を大気開放し、前記複数の第2エア流通孔からエアを吸引し、且つ、前記密封空間内のエアを吸引して、前記密封空間内を負圧にし、
前記密封空間内の圧力が所定の基準負圧に達したとき、前記複数の第2エア流通孔を大気開放することを特徴とする請求項1に記載の密着露光装置。
The control means opens the plurality of first air circulation holes to the atmosphere, sucks air from the plurality of second air circulation holes, and sucks air in the sealed space, Negative pressure,
The contact exposure apparatus according to claim 1, wherein when the pressure in the sealed space reaches a predetermined reference negative pressure, the plurality of second air circulation holes are opened to the atmosphere.
前記基板は、前記内周側弾性部材と前記外周側弾性部材に密着されることで、前記基板保持部に拘束されることを特徴とする請求項1に記載の密着露光装置。   The contact exposure apparatus according to claim 1, wherein the substrate is constrained by the substrate holding portion by being in close contact with the inner peripheral elastic member and the outer peripheral elastic member. 露光すべきパターンを有するマスクを保持するマスク保持部と、
被露光材としての基板を保持する保持面を有する基板保持部と、
前記保持面に保持された基板に、露光用光を前記マスクを介して照射する照明光学系と、を備え、
前記保持面には、前記基板の裏面に開口し、エアが流通する複数のエア流通孔が形成され、
前記複数のエア流通孔は、複数の第1エア流通孔と、該複数の第1エア流通孔よりも外側に設けられた複数の第2エア流通孔と、を備え、
前記保持面には、前記複数の第2エア流通孔が開口する領域の内周側及び外周側に、前記基板の裏面と接触可能な環状の内周側弾性部材及び外周側弾性部材がそれぞれ配置され、
前記マスク保持部と前記基板保持部との間には、前記マスク及び前記基板を囲む、弾性の密封部材が設けられ、
前記マスク、前記マスク保持部、前記基板保持部、及び前記密封部材によって密封空間を形成する、密着露光装置を用いて前記マスクと基板とを密着させた状態で露光する密着露光方法であって、
前記複数の第1エア流通孔を大気開放し、前記複数の第2エア流通孔からエアを吸引することで、前記基板の周縁部を前記基板保持部に拘束し、前記密封空間内のエアを吸引して、前記密封空間内を負圧にし、
前記密封空間内の圧力が所定の基準負圧に達したとき、前記複数の第2エア流通孔を大気開放することを特徴とする密着露光方法。
A mask holding unit for holding a mask having a pattern to be exposed;
A substrate holding part having a holding surface for holding a substrate as an exposed material;
An illumination optical system that irradiates exposure light onto the substrate held on the holding surface through the mask;
The holding surface is formed with a plurality of air circulation holes that open on the back surface of the substrate and through which air flows.
The plurality of air circulation holes include a plurality of first air circulation holes and a plurality of second air circulation holes provided outside the plurality of first air circulation holes,
On the holding surface, annular inner peripheral side elastic members and outer peripheral side elastic members that can come into contact with the back surface of the substrate are disposed on the inner peripheral side and the outer peripheral side of the region where the plurality of second air circulation holes open, respectively. And
Between the mask holding part and the substrate holding part, an elastic sealing member surrounding the mask and the substrate is provided,
A contact exposure method that forms a sealed space by the mask, the mask holding unit, the substrate holding unit, and the sealing member, and that exposes the mask and the substrate in close contact with each other using a contact exposure apparatus,
By opening the plurality of first air circulation holes to the atmosphere and sucking air from the plurality of second air circulation holes, the peripheral edge portion of the substrate is restrained by the substrate holding portion, and the air in the sealed space is discharged. Suction to create a negative pressure in the sealed space,
The contact exposure method, wherein when the pressure in the sealed space reaches a predetermined reference negative pressure, the plurality of second air circulation holes are opened to the atmosphere.
露光すべきパターンを有するマスクを保持するマスク保持部と、
被露光材としての基板を保持する保持面を有する基板保持部と、
前記保持面に保持された基板に、露光用光を前記マスクを介して照射する照明光学系と、を備え、前記マスクと基板とを密着させた状態で露光する密着露光装置であって、
前記保持面には、前記基板の裏面に当接可能な複数の突起と、前記複数の突起よりも低い位置で、前記基板の裏面に向けて開口し、エアが流通する複数のエア流通孔と、前記複数の突起及び少なくとも一つの前記エア流通孔をそれぞれ囲う複数の領域を画成する、前記基板の裏面に当接可能な仕切り壁と、が形成され、
前記マスクと基板とを密着させるように、前記各エア流通孔から前記基板に向けて噴出するエアの圧力又は流量を制御する制御手段が設けられ、
前記制御手段は、前記マスクの中央付近と対向するワークの部分が最も高くなるようにエアの圧力又は流量を制御し、前記マスクの中央付近と前記ワークの部分を密着させた後、前記各エア流通孔から噴出するエアの圧力又は流量を、前記マスクの中央部分から周囲に向かうにつれて増加するように制御することを特徴とする密着露光装置。
A mask holding unit for holding a mask having a pattern to be exposed;
A substrate holding part having a holding surface for holding a substrate as an exposed material;
An illumination optical system that irradiates exposure light through the mask onto the substrate held on the holding surface, and a contact exposure apparatus that exposes the mask and the substrate in close contact with each other,
The holding surface includes a plurality of protrusions that can contact the back surface of the substrate, and a plurality of air circulation holes that are open toward the back surface of the substrate at a position lower than the plurality of protrusions and through which air flows. A partition wall defining a plurality of regions surrounding each of the plurality of protrusions and at least one of the air circulation holes, the partition wall being capable of contacting the back surface of the substrate ,
Control means is provided for controlling the pressure or flow rate of air ejected from the air circulation holes toward the substrate so that the mask and the substrate are brought into close contact with each other.
The control means controls the air pressure or flow rate so that the portion of the workpiece facing the vicinity of the center of the mask is the highest, and after bringing the vicinity of the center of the mask and the portion of the workpiece into close contact, A contact exposure apparatus, wherein the pressure or flow rate of air ejected from the flow hole is controlled so as to increase from the central portion of the mask toward the periphery.
前記保持面を上下方向に移動するように、前記基板保持部を駆動する基板駆動部をさらに備え、
前記基板を露光する際、前記基板駆動部は、前記エア流通孔から噴出されるエアによって前記基板が前記保持面から離れないように前記保持面を移動させることを特徴とする請求項6に記載の密着露光装置。
A substrate driving unit for driving the substrate holding unit so as to move the holding surface in the vertical direction;
When exposing the substrate, the substrate drive unit according to claim 6, wherein the substrate by air ejected from the air flow hole is characterized in that moving the holding surface so as not to leave from the holding surface Adhesion exposure equipment.
前記基板とマスクとの間の隙間を検出するセンサをさらに備え、
前記制御手段は、前記センサによって検出された隙間に応じて、前記各エア流通孔から噴出するエアの圧力又は流量を制御することを特徴とする請求項6又は7に記載の密着露光装置。
A sensor for detecting a gap between the substrate and the mask;
The control means, in response to a gap detected by the sensor, contact exposure apparatus according to claim 6 or 7, characterized in that to control the pressure or flow of the air ejected from the respective air circulation holes.
露光すべきパターンを有するマスクを保持するマスク保持部と、
被露光材としての基板を保持する保持面を有する基板保持部と、
前記保持面に保持された基板に、露光用光を前記マスクを介して照射する照明光学系と、を備え、前記マスクと基板とを密着させた状態で露光する密着露光方法であって、
前記保持面には、前記基板の裏面に当接可能な複数の突起と、前記複数の突起よりも低い位置で、前記基板の裏面に開口し、エアが流通する複数のエア流通孔と、前記複数の突起及び少なくとも一つの前記エア流通孔をそれぞれ囲う複数の領域を画成する、前記基板の裏面に当接可能な仕切り壁と、が形成され、
前記各エア流通孔から前記基板に向けて噴出するエアの圧力又は流量を制御することで、前記マスクと基板とを密着させ、
前記マスクと基板とを密着させる際、前記マスクの中央付近と対向するワークの部分が最も高くなるようにエアの圧力又は流量を制御し、前記マスクの中央付近と前記ワークの部分を密着させた後、前記各エア流通孔から噴出するエアの圧力又は流量を、前記マスクの中央部分から周囲に向かうにつれて増加するように制御することを特徴とする密着露光方法。
A mask holding unit for holding a mask having a pattern to be exposed;
A substrate holding part having a holding surface for holding a substrate as an exposed material;
An illumination optical system that irradiates exposure light through the mask onto the substrate held on the holding surface, and a contact exposure method that exposes the mask and the substrate in close contact with each other,
Said holding surface comprises a plurality of projections capable of contacting the rear surface of the substrate, at a position lower than said plurality of protrusions, open to the rear surface of the substrate, and a plurality of air flow holes that air flows, the A plurality of protrusions and a plurality of regions surrounding each of the at least one air circulation hole, and a partition wall capable of contacting the back surface of the substrate ; and
By controlling the pressure or flow rate of air ejected from each air circulation hole toward the substrate, the mask and the substrate are brought into close contact with each other,
When the mask and the substrate are brought into close contact with each other, the air pressure or flow rate is controlled so that the portion of the workpiece facing the vicinity of the center of the mask is the highest, and the portion near the center of the mask and the portion of the workpiece are brought into close contact with each other. Thereafter, the contact exposure method is characterized in that the pressure or flow rate of the air ejected from each air circulation hole is controlled to increase from the central portion of the mask toward the periphery.
前記保持面を上下方向に移動するように、前記基板保持部を駆動する基板駆動部をさらに備え、
前記基板を露光する際、前記基板駆動部は、前記エア流通孔から噴出されるエアによって前記基板が前記保持面から離れないように前記保持面を移動させることを特徴とする請求項9に記載の密着露光方法。
A substrate driving unit for driving the substrate holding unit so as to move the holding surface in the vertical direction;
When exposing the substrate, the substrate drive unit according to claim 9, wherein the substrate by air ejected from the air flow hole is characterized in that moving the holding surface so as not to leave from the holding surface Contact exposure method.
前記基板とマスクとの間の隙間を検出するセンサをさらに備え、
前記マスクと基板とを密着させる際、前記センサによって検出された隙間に応じて、前記各エア流通孔から噴出するエアの圧力又は流量を制御することを特徴とする請求項9又は10に記載の密着露光方法。
A sensor for detecting a gap between the substrate and the mask;
When brought into close contact with said mask and the substrate, depending on the gap detected by the sensor, according to claim 9 or 10, characterized in that to control the pressure or flow of the air ejected from the respective air circulation holes Contact exposure method.
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