TWI661505B - Transfer device, transfer method, exposure device, and component manufacturing method - Google Patents

Abstract

The conveying device includes: a first support portion that supplies gas to one surface of the substrate and can support the substrate through gas suspension; a second support portion that can support one surface of the substrate; and a drive portion that is at least the first and second support portions. One is moved so that the first and second supporting portions are brought close to or in contact with each other and are aligned in the first direction; and the transfer portion moves the substrate supported by one of the first and second supporting portions aligned by the driving portion along the first Move to the other side.

Description

   Transfer device, transfer method, exposure device, and component manufacturing method   

The present invention relates to a conveying device, a conveying method, an exposure device, and a component manufacturing method.

This application claims priority based on US Provisional Applications Nos. 61 / 305,355 and 61 / 305,439 filed on February 17, 2010, and incorporates the contents thereof.

In the process of manufacturing electronic components such as flat panel displays, processing equipment that uses large substrates such as exposure equipment or inspection equipment. In the exposure step and the inspection step using these processing devices, a transfer device for transferring a large substrate (for example, a glass substrate) to the processing device is used as disclosed in the following patent documents.

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2001-100169

In the above-mentioned large-sized substrate conveying device, when a substrate supported by a substrate supporting member is transferred to a substrate holding portion, a layer of air is interposed between the substrate and the substrate holding portion. Therefore, the substrate may be deformed after the transfer. Or, the substrate may be shifted from the mounting position on the substrate holding portion. If the substrate is shifted or deformed after the transfer, for example, in an exposure device, a problem such as failure to perform a predetermined exposure on a proper and correct position on the substrate may occur. When the substrate is shifted or deformed, in order to solve the problem, for example, by re-transmitting the substrate, the substrate may be delayed in processing. In addition, if the transfer speed of the substrate is reduced, for example, so that the air layer does not remain after the transfer, there is a problem that the processing of the substrate is further delayed.

An aspect of the present invention is to provide a transfer device, a transfer method, an exposure device, and a device manufacturing method capable of transferring a substrate without causing a displacement or a deformation of the substrate.

According to a first aspect of the present invention, there is provided a transfer device including: a first support portion that supplies a gas to one surface of a substrate and can support the substrate through the gas suspension; a second support portion that can support the substrate; The aforementioned side; the driving section moves at least one of the first and second supporting sections so that the first and second supporting sections approach or contact each other and are aligned in the first direction; and the transfer section is driven by the aforementioned driving The substrate supported by one of the first and second support portions arranged in a row is moved to the other side in the first direction.

According to a second aspect of the present invention, there is provided a conveying device including: a first supporting portion that supplies gas to one surface of a substrate and can support the substrate through the gas suspension; the second and third supporting portions can support The first side of the substrate; the first driving section moves at least one of the first and second supporting sections so that the first and second supporting sections approach or contact each other and are aligned in the first direction; the second driving section Is to move at least one of the first and third support portions so that the first and third support portions are close to or in contact with each other and arranged in the second direction; the first transfer portion is to be moved by the first drive portion. The substrates supported by the second support portion arranged in the first support portion are moved toward the first support portion side in the first direction; the second transfer portion is arranged in the first portion by the second drive portion. The substrate supported by the first support portion of the three support portions moves toward the third support portion side in the second direction.

According to a third aspect of the present invention, there is provided a conveying method for conveying a substrate, comprising: a first support portion capable of suspending and supporting the substrate through a gas supplied to one surface of the substrate; and a substrate supporting the substrate. The movement of at least one of the second support portions on the aforementioned side so that the first and second support portions approach or contact each other and are aligned in the first direction; and one of the first and second support portions arranged The supported substrate moves to the other side in the first direction.

According to a fourth aspect of the present invention, there is provided a transport method for transporting a substrate, comprising: a first support portion capable of suspending and supporting the substrate through a gas supplied to one surface of the substrate; and the aforementioned support capable of supporting the substrate. Movement of at least one of the second supporting portions on one side so that the first and second supporting portions approach or contact each other and are aligned in the first direction; supporting the second supporting portion arranged in the first supporting portion The movement of the substrate in the first direction toward the first support portion; moving at least one of the first support portion and a third support portion that can support the first surface of the substrate, so that the first and the first 3 supporting parts approaching or contacting each other and being arranged in the second direction; and moving the substrate supported by the first supporting part arranged in the third supporting part along the second direction toward the third supporting part side action.

According to a fifth aspect of the present invention, there is provided a conveying device including: a first support portion that supplies gas to one surface of a substrate and can support the substrate by floating through the gas; and a second support portion that can support the substrate. The aforementioned side; the driving part is to move at least one of the first and second supporting parts so that the first and second supporting parts are close to or in contact with each other and arranged; the transfer part will be arranged by the driving part The substrate supported by the second support portion moves toward the first support portion side in the arrangement direction; the jacking mechanism supports the mounting portion placed on the first support portion by stopping the supply of the gas. The substrate is jacked up above the mounting portion; and a carry-out mechanism is configured to carry out the substrate supported by the jacking mechanism above the mounting portion from the first support portion.

According to a sixth aspect of the present invention, there is provided a conveying method for conveying a substrate, comprising: a first support portion capable of suspending and supporting the substrate through a gas supplied to one surface of the substrate; and the aforementioned support capable of supporting the substrate. The movement of at least one of the second support portions on one side so that the first and second support portions approach or contact each other and line up; move the substrates supported by the lined up second support portions toward the line in the lined-up direction. Movement of the first supporting portion; supporting the substrate placed on the placing portion of the first supporting portion by lifting the supply of the gas; and lifting the substrate above the placing portion; and The operation of carrying out the substrate above the placing portion from the first supporting portion.

According to a seventh aspect of the present invention, there is provided an exposure device that exposes a substrate with exposure light, and includes the above-mentioned transport device that holds the substrate and moves the substrate to an irradiation area of the exposure light.

According to an eighth aspect of the present invention, there is provided a device manufacturing method including: an operation of transferring the aforementioned pattern on the substrate using the exposure device; and an operation of processing the aforementioned substrate to which the aforementioned pattern is transferred according to the pattern.

According to the aspect of the present invention, it is possible to perform the handover of the substrate without causing a displacement or deformation of the placement.

1‧‧‧Exposure device

2‧‧‧ chamber

3‧‧‧Exposure device body

4,104‧‧‧Moving in

5‧‧‧moved out

9,109‧‧‧ plate holder

12‧‧‧ Fork

19‧‧‧Position detection sensor

31‧‧‧ substrate mounting section

33‧‧‧The first mobile mechanism

34‧‧‧ Holding Department

35‧‧‧ Mobile body

36‧‧‧Guide pin

37‧‧‧ Locating Pin

40,140‧‧‧moved into the table

42,149,249‧‧‧‧First Transfer Department

43‧‧‧The second mobile mechanism

44‧‧‧ Holding Department

45‧‧‧ mobile body

50‧‧‧Removal table

52‧‧‧The second transfer department

53‧‧‧The third mobile agency

54‧‧‧ Holding Department

55‧‧‧ Mobile mechanism body

142‧‧‧Roller

148‧‧‧Roller mechanism

150‧‧‧ jacking mechanism

205‧‧‧Remove the robot arm

250‧‧‧ Adsorption Department

251‧‧‧holding department

252‧‧‧Position detection sensor

350‧‧‧ Adsorption mechanism

351‧‧‧holding department

401‧‧‧ substrate mounting table

405‧‧‧Transfer Department

408‧‧‧Adsorption Department

P‧‧‧ substrate

IL‧‧‧Exposure light

M‧‧‧Photomask

PL‧‧‧ projection optical system

K, K1, K4, K6, K8 ‧‧‧ suction holes

K2, K3, K5, K7‧‧‧‧gas injection holes

K205‧‧‧ opening

FIG. 1 is a cross-sectional top view showing the overall outline of the exposure apparatus.

FIG. 2 is an external perspective view showing a specific structure in a cavity.

FIG. 3A is a diagram showing a peripheral configuration of a display panel holder.

FIG. 3B is a diagram showing a peripheral configuration of the display panel holder.

FIG. 4A is a diagram showing the configuration of main parts of the carry-in section.

FIG. 4B is a diagram showing the configuration of main parts of the carry-in section.

FIG. 5A is a diagram showing the configuration of main parts of the carry-out section.

FIG. 5B is a diagram showing the configuration of main parts of the carry-out section.

FIG. 6 is a diagram illustrating a procedure for transferring a substrate to a loading table.

FIG. 7A is an explanatory diagram of a board transfer process between a board holder and a carry-out section.

FIG. 7B is an explanatory diagram of a board transfer process between a board holder and a carry-out section.

FIG. 8 is a view showing a state where a substrate is suspended and supported on a loading table.

FIG. 9 is a diagram illustrating a procedure for transferring a substrate on a loading table.

FIG. 10 is a diagram illustrating a step of transferring a substrate to a plate holder side.

FIG. 11 is a diagram illustrating a state where a substrate is placed on a plate holder.

FIG. 12 is a diagram illustrating a procedure for transferring a substrate to a carry-out stage.

13 is a view showing a state where a substrate is suspended and supported on a carrying-out table.

FIG. 14A is a diagram illustrating the transfer of a substrate from a plate holder to a carry-out portion side. FIG.

FIG. 14B is a diagram illustrating the transfer of the substrate from the plate holder to the side of the carry-out portion.

FIG. 14C is a diagram illustrating the transfer of the substrate from the plate holder to the side of the carry-out portion.

FIG. 15 is a diagram illustrating an operation of unloading a substrate from a unloading section.

FIG. 16A is a diagram showing the configuration of a carry-in section of the second embodiment.

FIG. 16B is a diagram showing the configuration of a carry-in section of the second embodiment.

FIG. 17 is a diagram illustrating a configuration for transferring a substrate from the loading section to the plate holder side.

FIG. 18 is a diagram for explaining the steps following FIG. 18.

Fig. 19 is a view showing the structure of a plate holder according to a third embodiment.

FIG. 20A is a diagram illustrating a configuration for transferring a substrate from a loading section to a plate holder side. FIG.

FIG. 20B is a diagram illustrating a configuration for transferring a substrate from the loading section to the plate holder side.

Fig. 21 is a diagram showing the configuration of the fourth embodiment.

Fig. 22A is a diagram illustrating a substrate transfer operation in the fourth embodiment.

Fig. 22B is a diagram illustrating a substrate transfer operation in the fourth embodiment.

Fig. 22C is a diagram illustrating a substrate transfer operation in the fourth embodiment.

Fig. 22D is a diagram illustrating a substrate transfer operation in the fourth embodiment.

Fig. 23 is a perspective view showing the structure of the interior of the chamber in the fifth embodiment.

FIG. 24A is a plan view showing a schematic configuration of a loading / unloading unit. FIG.

FIG. 24B is a plan view showing a schematic configuration of the loading / unloading section.

Fig. 25 is a diagram illustrating a board carrying-in procedure in the fifth embodiment.

FIG. 26 is a diagram illustrating the transfer of a substrate from the loading / unloading section to the board holder side.

FIG. 27 is a diagram illustrating the transfer of a substrate from the plate holder to the side of the carry-in / out section.

FIG. 28 is a cross-sectional top view showing the overall outline of the exposure apparatus.

FIG. 29 is an external perspective view showing a specific structure in a cavity.

FIG. 30A is a diagram showing a peripheral configuration of a display panel holder. FIG.

FIG. 30B is a diagram showing a peripheral configuration of the display panel holder.

FIG. 31A is an explanatory diagram of a board transfer process between a board holder and a carry-out section. FIG.

FIG. 31B is an explanatory diagram of a board transfer process between a board holder and a carry-out section.

FIG. 32 is a view showing a state where a substrate is suspended and supported on a loading table.

Fig. 33 is a diagram illustrating a procedure for transferring a substrate on a loading table.

FIG. 34 is a diagram illustrating a procedure for transferring a substrate to a plate holder side.

FIG. 35 is a diagram for explaining the movement of the robot arm.

FIG. 36A is a front view illustrating an operation of carrying out a substrate from a plate holder. FIG.

Fig. 36B is a front view illustrating the operation of carrying out the substrate from the plate holder.

Fig. 37 is a side view illustrating an operation of carrying out a substrate from a plate holder.

Fig. 38 is a diagram showing the configuration of a carry-in section of the third embodiment.

FIG. 39A is a diagram illustrating a configuration for transferring a substrate from a loading section to a plate holder side. FIG.

FIG. 39B is a diagram illustrating a configuration for transferring a substrate from the loading section to the plate holder side. FIG.

Fig. 40 is a diagram showing the structure of an exposure apparatus body according to a fourth embodiment.

Fig. 41 is a plan view showing the structure of a panel holder.

Fig. 42A is a side sectional view of a plate holder.

Fig. 42B is a side sectional view of the plate holder.

Fig. 43 is a diagram showing the structure of the up-and-down moving part.

FIG. 44A is a diagram illustrating a configuration for transferring a substrate from a loading section to a plate holder side. FIG.

FIG. 44B is a diagram illustrating a configuration for transferring a substrate from the loading section to the plate holder side.

Fig. 45 is a view showing a state in which the support substrate is suspended on the carrying-in stage.

FIG. 46 is a diagram showing a state where the abutting portion is connected to an end portion of the substrate.

FIG. 47 is a diagram illustrating a procedure for moving a substrate from a loading table to a plate holder.

FIG. 48 is a perspective view for explaining the movement of the robot arm.

FIG. 49A is an explanatory diagram of a step of carrying out a substrate from a plate holder. FIG.

FIG. 49B is an explanatory diagram of a step of carrying out a substrate from a plate holder. FIG.

FIG. 49C is an explanatory diagram of a step of carrying out a substrate from a plate holder. FIG.

Fig. 50A is a plan view showing the structure of an adsorption mechanism according to a fifth embodiment.

Fig. 50B is a side view showing the structure of the adsorption mechanism of the fifth embodiment.

Fig. 51A is a side view illustrating the operation of carrying out a substrate from a plate holder.

Fig. 51B is a side view illustrating the operation of carrying out the substrate from the plate holder.

Fig. 52A is a diagram showing the configuration of a modification of the adsorption mechanism.

FIG. 52B is a diagram showing the configuration of a modified example of the adsorption mechanism.

FIG. 53 is a flowchart illustrating an example of a manufacturing process of a micro device.

An embodiment of the present invention will be described with reference to the drawings. The present invention is not limited to this. Hereinafter, an exposure apparatus provided with the transfer device of the present invention and performing an exposure process (exposing a pattern for a liquid crystal display element to a substrate coated with a photosensitizer) will be described, and an embodiment of the transfer method and the device manufacturing method of the present invention will be described.

(First Embodiment)

FIG. 1 is a cross-sectional plan view showing a schematic configuration of an exposure apparatus according to this embodiment. As shown in FIG. 1, the exposure device 1 includes an exposure device body 3, a carrying-in section 4, and a carrying-out section 5 for exposing a pattern for a liquid crystal display element to a substrate. These are highly cleaned and housed in a chamber 2 adjusted to a predetermined temperature. Inside. In this embodiment, the substrate is a large glass plate, and the size of one side thereof is, for example, 500 mm or more.

FIG. 2 is an external perspective view showing a specific structure in the chamber 2. As shown in FIG. 2, the exposure device body 3 includes an unillustrated illumination system for illuminating the mask M with exposure light IL, an unillustrated mask stage holding a mask M formed with a pattern for a liquid crystal display element, and is disposed on the The projection optical system PL under the reticle stage is provided with a plate holder 9 as a substrate holder that can move two-dimensionally on a base (not shown) disposed below the projection optical system PL, and a holding plate holder. 9 and a first moving mechanism 33 for moving the plate holder 9 in the chamber 2.

In the following description, the two-dimensional movement of the plate holder 9 provided on the base (not shown) of the chamber 2 is performed in a horizontal plane, and the X and Y axes are set in directions orthogonal to each other in this horizontal plane. . The holding surface of the plate holder 9 on the substrate P is parallel to the horizontal plane in a reference state (for example, a state when the substrate P is transferred). The Z axis is set in a direction orthogonal to the X axis and the Y axis, and the optical axis of the projection optical system PL is parallel to the Z axis. The directions around the X-axis, Y-axis, and Z-axis are referred to as the θ X direction, θ Y direction, and θ Z direction, respectively.

The first moving mechanism 33 includes a moving mechanism body 35 and a holding portion 34 that is disposed on the moving mechanism body 35 and holds the plate holder 9. The moving mechanism body 35 is non-contactly supported on a guide surface (base portion) (not shown) by a gas bearing, and can move in the XY direction on the guide surface. With this configuration, the plate holder 9 is moved within a predetermined area of the guide surface on the light emitting side (the image plane side of the projection optical system PL) while the substrate P is held.

The moving mechanism body 35 can be moved in the XY plane on the guide surface by the operation of a coarse motion system including an actuator such as a linear motor. The holding portion 34 can move relative to the movement mechanism body 35 in the Z-axis, θ X, θ Y directions by the operation of a micro-motion system including an actuator such as a voice coil motor. The holding portion 34 can move on the X-axis, Y-axis, Z-axis, θ X, θ Y, and θ Z while the substrate P is held by the substrate stage driving system including a coarse motion system and a micro-motion system. Six directions.

The exposure device 1 performs exposure in a step-and-scan manner in a state where a rectangular substrate P is placed on the board holder 9, and a pattern formed on the mask M is sequentially transferred to the substrate P, for example, a plurality of four exposure Area (pattern transfer area). That is, the exposure device 1 is in a state where the slit-shaped illumination area on the mask M is illuminated by the exposure light IL from the illumination system, and the controller The driving system moves the mask stage holding the mask M and the plate holder 9 holding the substrate P synchronously in a predetermined scanning direction (here, the Y-axis direction), and transfers the mask to an exposed area on the substrate P The pattern of M, that is, scanning exposure. In addition, the exposure device 1 of this embodiment constitutes a so-called multi-lens scanning exposure device, that is, the projection optical system PL has a plurality of projection optical modules, and the illumination system includes a plurality of illumination modules corresponding to the plurality of projection optical modules. group.

After the scanning exposure of one exposure area is completed, a step operation is performed to move the plate holder 9 in the X direction by a predetermined amount to reach the scanning start position of the next exposure area. Next, the exposure device body 3 performs such scanning exposure and stepping operations repeatedly, and sequentially transfers the pattern of the photomask M in four exposure areas.

As shown in FIG. 2, the loading unit 4 is provided with a coating and developing machine (not shown) disposed adjacent to the exposure device 1 and a loading stage supporting a surface (lower surface) of the substrate P when the substrate P coated with the photosensitizer is loaded therein. 40, and a second moving mechanism 43 for moving the carry-in table 40. In addition, the carry-in section 4 can adjust the temperature of the substrate P carried into the carry-in stage 40.

The second moving mechanism 43 includes a moving mechanism body 45 and a holding portion 44 that is disposed on the moving mechanism body 45 and holds the carry-in table 40. The moving mechanism body 45 is non-contactly supported on a guide surface (not shown) by a gas bearing, and can move in the XY direction on the guide surface. With this configuration, the carry-in stage 40 can move within a predetermined area of the guide surface while the substrate P is held. In addition, the support of the moving mechanism body 45 with respect to the guide surface not shown is not limited to the support of the gas bearing, and a well-known guide mechanism (a drive mechanism with respect to the guide surface) different from the gas bearing can also be used.

The moving mechanism body 45 has the same structure as the moving mechanism body 35 described above, and can move in the XY plane on the guide surface. The holding portion 44 has the same configuration as the holding portion 34 described above, and can move in the Z-axis, θ X, and θ Y directions relative to the moving mechanism body 45. The holding portion 44 can be moved in six directions of the X-axis, Y-axis, Z-axis, θ X, θ Y, and θ Z directions while the substrate P is held.

As shown in FIG. 2, the carrying-out section 5 includes a carrying-out table 50 that supports one surface (lower side) of the substrate P when transferring the substrate P that has been subjected to exposure processing by the exposure apparatus body 3, and a method for moving the carrying-out table 50. Third movement mechanism 53.

The third moving mechanism 53 includes a moving mechanism body 55 and a holding portion 54 disposed on the moving mechanism body 55 and holding the carrying-out table 50. The moving mechanism body 55 is non-contactly supported on a guide surface (not shown) by a gas bearing, and can move in the XY direction on the guide surface. With this configuration, the carrying-out table 50 can be moved within a predetermined area of the guide surface while the substrate P is held.

The moving mechanism body 55 has the same structure as the moving mechanism bodies 35 and 45 described above, and can move in the XY plane on the guide surface. The holding portion 54 has the same configuration as the holding portions 34 and 44 described above, and can move in the Z-axis, θ X, θ Y directions relative to the movement mechanism body 55. The holding portion 54 can be moved in six directions of the X-axis, Y-axis, Z-axis, θ X, θ Y, and θ Z directions while the substrate P is held.

Next, the peripheral configuration of the plate holder 9 will be described with reference to Figs. 3A and 3B. FIG. 3A is a plan view of the display panel holder 9 in a plan view, and FIG. 3B is a view illustrating a side view configuration of the display panel holder 9. As shown in FIG. 3A, a substrate mounting portion 31 on which the substrate P is mounted is formed on the plate holder 9. The upper part of the board | substrate mounting part 31 is formed so that the substantially holding surface of the board | substrate holder 9 with respect to the board | substrate P may be a favorable flatness. Furthermore, a plurality of suction holes K1 are provided on the substrate mounting portion 31 to make the substrate P closely adhere to this surface. Each suction hole K1 is connected to a vacuum pump (not shown).

In addition, a plurality of gas injection holes K2 are provided on the upper surface of the substrate mounting portion 31 to support the substrate P through the gas by spraying a gas such as air on the lower surface of the substrate P. Each gas injection hole K2 is connected to a gas injection pump (not shown). The suction holes K1 and the gas injection holes K2 are alternately arranged in a grid shape.

In addition, positioning pins 37 are provided on the peripheral portion of the plate holder 9 to guide the substrate P when the substrate P is carried in and to position the substrate P on the substrate holding portion 31 of the plate holder 9 on the substrate P. . These guide pins 36 and positioning pins 37 can be moved together with the plate holder 9 in the exposure apparatus body 3.

As shown in FIG. 3B, the plate holder 9 is provided with a position detection sensor 19 that detects the relative positions to the carry-in stage 40 and the carry-out stage 50 on the side surface portion 9 a. The position detection sensor 19 includes a distance detection sensor 19a for detecting the relative distance between the carrying-in stage 40 and the carrying-out stage 50 and a relative height of the relative carrying-in stage 40 and the carrying-out stage 50 Height detection sensor 19b. In addition, recessed portions are formed at positions corresponding to the position detection sensor 19 in the carrying-in stage 40 and the carrying-out stage 50, thereby preventing the position detection sensor 19 from interfering with the carrying-in stage 40 and the carrying-out stage 50.

Next, the main part configuration of the carrying-in part 4 is demonstrated with reference to FIG. 4A and FIG. 5B. FIG. 4A is a plan view showing the peripheral configuration of the carrying-in table 40, and FIG. 4B is a view showing a cross-sectional view taken along the line A-A of FIG. 4A.

As shown in FIGS. 4A and 4B, the carry-in unit 4 is provided with a first transfer unit 42 that transfers the substrate P from the carry-in stage 40 to the board holder 9. The first transfer portion 42 includes a guide portion 42 a and a contact portion 42 b that is in contact with the substrate P.

Two groove-shaped recesses 40 a formed in one direction (the Y direction shown in the figure) are formed on the upper surface of the carrying-in table 40. The guide portion 42a is provided in the recessed portion 40a. The abutting portion 42b is attached to the guide portion 42a in a state protruding from the upper surface of the carrying-in table 40. The contact portion 42b is made of an elastic member such as rubber, and can reduce damage to the substrate P during contact.

In addition, a plurality of gas injection holes K3 are provided on the upper surface of the carrying-in stage 40 to support the substrate P through the gas by spraying gas such as air on the lower surface of the substrate P. Each gas injection hole K3 is connected to a gas injection pump (not shown).

Furthermore, a plurality of suction holes K4 are provided on the upper surface of the carry-in table 40 so that the substrate P can closely adhere to this surface. Each suction hole K4 is connected to a vacuum pump (not shown). The gas injection holes K3 and the suction holes K4 are alternately arranged in a grid shape along the Y direction. In addition, the gas injection holes K3 and the suction holes K4 are not limited to such a grid-like arrangement, and may be arranged in various forms (for example, alternately arranged in the Y direction). In addition, the gas injection holes K3 and the suction holes K4 are not limited to be provided independently of each other, and the same hole may be used as the gas injection holes K3 and the suction holes K4. In this case, each hole can be appropriately connected to a gas injection pump and a vacuum pump.

In addition, a through-hole 47 is formed in the carry-in stage 40, and the through-hole 47 can be used to move a substrate support pin of a substrate P to and from a coating and developing machine (not shown) as described later. Plug in.

Next, the main part configuration of the carrying-out part 50 is demonstrated with reference to FIG. 5A and FIG. 5B. As shown in FIGS. 5A and 5B, the carrying-out unit 50 is a second transferring unit 52 that transfers the substrate P from the plate holder 9 to the carrying-out stage 50. The second transfer section 52 includes a guide section 52a and a suction section 52b for holding and holding the substrate P.

Two groove-shaped recesses 50 a formed in one direction (the Y direction shown in the figure) are formed on the upper surface of the carrying-out table 50. The guide portion 52a is provided in the recessed portion 50a. The suction portion 52b is attached to the guide portion 52a in a state protruding from the upper surface of the carrying-out table 50. The suction unit 52b includes a vacuum suction pad that holds the substrate P by vacuum suction.

In addition, the suction portion 52b is provided with a contact portion 58 that comes into contact with the substrate P pushed out from the plate holder 9 when the substrate is carried out. The contact portion 58 is made of an elastic member such as rubber.

Further, a plurality of gas injection holes K5 are provided on the upper surface of the carrying-out table 50 to support the substrate P through the gas by spraying gas such as air on the lower surface of the substrate P. Each gas injection hole K5 is connected to a gas injection pump (not shown).

Furthermore, a plurality of suction holes K6 are provided on the upper surface of the carrying-out table 50 so that the substrate P can closely adhere to this surface. Each suction hole K6 is connected to a vacuum pump (not shown). In addition, the gas injection holes K5 and the suction holes K6 are alternately arranged in a grid shape.

In addition, a through-hole 57 is formed in the carrying-out table 50, and the through-hole 57 can be used to move a substrate supporting pin of a substrate P to and from a coating and developing machine (not shown) as described later. Plug in.

Next, the operation of the exposure apparatus 1 will be described with reference to FIGS. 6 to 15. Specifically, the transfer operation of the substrate P between the carry-in portion 4 and the plate holder 9 and the transfer operation of the substrate P between the plate holder 9 and the carry-out portion 50 will be mainly described. In addition, in the present embodiment, the carrying-in table 40 of the carrying-in section 4 and the carrying-out table 50 of the carrying-out section 5 are arranged at different positions in the same horizontal plane. That is, the carrying-in stage 40 and the carrying-out stage 50 are arranged at positions where they do not overlap each other in a plan view (a state viewed from the + Z direction shown in FIG. 2).

First, a substrate P coated with a photosensitizer in a coating and developing machine (not shown) is loaded into the loading unit 4. At this time, the upper and lower moving mechanism 49 located below the carrying-in stage 40 first arranges the substrate support pin 49 a above the carrying-in stage 40 through the through hole 47. Next, the arm portion 48 of the coating and developing machine (not shown) is inserted between the substrate support pins 49 a as shown in FIG. 6. The substrate P is transferred to the substrate support pin 49 a by being lowered by the arm portion 48, and is then retracted from the carry-in portion 4. The up-and-down movement mechanism 49 finishes the loading operation of the board | substrate P to the loading stage 40 by lowering the board | substrate support pin 49a which supports the board | substrate P. After that, by driving the vacuum pump, the substrate P is sucked and held on the loading stage 40 through the suction hole K4.

Next, as shown in FIG. 7A, the plate holder 9 is moved to approach the loading table 40 of the loading section 4. Specifically, the first moving mechanism 33 is arranged in a state where the plate holder 9 and the carry-in table 40 are approached in the Y direction. Here, the state where the plate holder 9 and the carrying-in stage 40 are close to each other refers to a state in which the movement of the substrate P can be smoothly performed during the transfer of the substrate P described later.

The second moving mechanism 43 can be driven when the loading platform 40 and the plate holder 9 are aligned. In this way, the loading stage 40 and the plate holder 9 can be moved to the transfer position of the substrate P in a short time, and the time required for the loading operation of the substrate P can be shortened. In this case, the carrying-out table 50 is retracted to a position where it does not interfere with the carrying-in table 40.

In addition, since the substrate P is sucked and held on the loading table 40 through the suction hole K4, the substrate P can be prevented from moving on the loading table 40 when the second moving mechanism 43 is driven.

In the present embodiment, as shown in FIG. 7B, when the carrying-in stage 40 and the plate holder 9 are brought close to each other, the substrate P is arranged higher than the plate holder 9. That is, the first moving mechanism 33 brings the plate holder 9 closer to the carry-in table 40 so that the upper surface of the carry-in table 40 supporting the substrate P is higher than the upper surface of the board holder 9. In addition, the second moving mechanism 43 can also raise the loading platform 40 so that the upper surface of the loading platform 40 is higher than the upper surface of the plate holder 9.

In addition, the first moving mechanism 33 can also arrange the plate holder 9 and the carry-in table 40 in contact with each other. In this way, it is possible to smoothly transfer the substrate P between the plate holder 9 and the carrying-in stage 40 described later.

Next, as shown in FIG. 8, the carrying-in stage 40 ejects a gas from a plurality of gas injection holes K3 formed on the upper surface, and supports the substrate P in a suspended state through the gas. On the other hand, when the plate holder 9 receives the substrate P, it first injects gas from the plurality of gas injection holes K2 formed on the upper surface.

The carrying-in portion 4 is a state in which the substrate P is suspended and supported on the carrying-in stage 40, and the abutting portion 42b is brought into contact with one end portion of the substrate P as shown in FIG. 9. The abutting portion 42b moves the substrate P to the plate holder 9 side by moving along the guide portion 42a in the recessed portion 40a.

Since the substrate P is suspended on the carry-in table 40, the abutting portion 42b can smoothly slide the substrate P to the plate holder 9 side. The upper surface of the plate holder 9 is a floating support substrate P as described above. Here, it is also possible to make the gas ejected from the gas ejection holes K3, K2 directional.

As shown in FIG. 10, the board | substrate P which slides on the carrying-in stage 40 by the contact part 42b is smoothly transferred to the upper surface of the board holder 9. As shown in FIG. In this embodiment, since the upper surface of the carrying-in table 40 is higher than the upper surface of the plate holder 9, the substrate P can be smoothly transferred to the plate holder 9 without touching the side surface of the plate holder 9.

As shown in FIG. 9, the substrate P is slid in a state where the guide pins 36 provided in the peripheral portion of the plate holder 9 are defined at positions in the X direction in the figure. The abutting portion 42 b moves the substrate P to abut on the positioning pin 37 provided on the downstream side of the substrate conveying direction in the plate holder 9. The substrate P is defined in the position in the X direction in the figure by the guide pin 36, and is held in the state in the Y direction in the figure by being held by the positioning pin 37 and the abutting portion 42b. The plate holder 9 stops gas injection from the gas injection hole K2. The substrate P is placed in a state where the substrate P is aligned with the substrate placing portion 31 as shown in FIG. 11.

In addition, in the past, when a substrate is placed on a plate holder, there is a possibility that a substrate placement deviation (a position deviation from a predetermined placement position) or a substrate deformation may occur. One of the reasons for this placement deviation can be considered, for example, immediately before the substrate is placed, because the substrate becomes a floating state due to the thin air layer generated between the substrate and the plate holder. One of the reasons for the deformation of the substrate can be considered, for example, when the substrate is placed between the substrate and the plate holder after the air is trapped and the substrate is in an expanded state.

In contrast, in this embodiment, since the substrate P is transported in a state of being suspended by the jet of gas as described above, it is transferred to the plate holder 9 in a state of high flatness without distortion. In addition, since the substrate P is placed on the substrate mounting portion 31 from a height of being suspended and supported, it is possible to prevent air stagnation or an air layer between the substrate P and the substrate placing portion 31. Therefore, it is possible to suppress the substrate P from being in an expanded state, and to prevent occurrence of displacement or deformation of the placement of the substrate P. Therefore, the substrate P can be placed in a state of high flatness at a predetermined position of the opposing plate holder 9. Thereafter, the substrate P is sucked and held on the substrate mounting portion 31 through the suction hole K1 by driving the vacuum pump.

After the substrate P is placed on the plate holder 9, the mask M is illuminated with the exposure light IL from the illumination system. The pattern of the mask M illuminated with the exposure light IL is projected and exposed to the substrate P placed on the plate holder 9 through the projection optical system PL.

In the exposure apparatus 1, since the substrate P can be satisfactorily placed on the plate holder 9 as described above, a predetermined exposure can be performed with high accuracy at an appropriate position on the substrate P, and a highly reliable exposure can be achieved. deal with.

In this embodiment, a photosensitizer can be applied by a coating and developing machine (not shown) during the exposure processing of the substrate P, or while the substrate P after the exposure processing is transported to the carry-out section 5 as described later. Next, the one substrate P is placed on the carry-in stage 40 of the carry-in unit 4.

Next, the unloading operation of the substrate P from the plate holder 9 after the exposure process is described will be described.

After the exposure process is completed, the plate holder 9 is moved to approach the carrying-out table 50 of the carrying-out section 5 as shown in FIG. 12. Specifically, the first moving mechanism 33 is arranged in a state where the plate holder 9 and the carrying-out table 50 are approached in the Y direction. At this time, since the substrate P is sucked and held through the suction hole K1, it is possible to prevent the substrate P from moving on the substrate mounting portion 31 when the first moving mechanism 33 is driven.

The third moving mechanism 53 can be driven when the carrying-out table 50 and the plate holder 9 are arranged. In this way, the carrying-out stage 50 and the plate holder 9 can be moved to the transfer position of the substrate P in a short time, and the time required for the carrying-out operation of the substrate P can be shortened. In this case, the carry-in table 40 is retracted to a position where it does not interfere with the carry-out table 50.

In the present embodiment, when the plate holder 9 and the carrying-out table 50 are approached, the substrate P is arranged to hold the plate corresponding to the transfer destination of the substrate P in the same manner as when the plate holder 9 and the carrying-in table 40 are approached. With 9 high. That is, the first moving mechanism 33 brings the plate holder 9 closer to the carrying-out table 50 so that the upper surface of the plate holder 9 supporting the substrate P is higher than the upper surface of the carrying-out table 50. In addition, the third moving mechanism 53 can lower the carrying-out table 50 so that the upper surface of the carrying-out table 50 is lower than the upper surface of the plate holder 9.

The first moving mechanism 33 can also arrange the plate holder 9 and the carrying-out table 50 in a state of contact. In this way, it is possible to smoothly transfer the substrate P between the plate holder 9 and the carrying-out stage 50 described later.

The plate holder 9 stops driving of the vacuum pump, and releases the suction and holding of the substrate P by the substrate P through the suction hole K1 to the substrate mounting portion 31. Next, as shown in FIG. 13, the plate holder 9 injects a gas from a plurality of gas injection holes K2 formed on the upper surface of the substrate mounting portion 31, and supports the substrate P in a suspended state through the gas. On the other hand, when receiving the substrate P, the carrying-out unit 5 ejects gas from a plurality of gas injection holes K5 formed on the carrying-out table 50.

The carrying-out part 5 moves the suction part 52b of the 2nd transfer part 52 along the guide part 52a toward the board | substrate P side which is suspended and supported on the board | substrate mounting part 31 of the board holder 9. The positioning pins 37 press the ends of the substrate P floating on the substrate mounting portion 31 as shown in FIG. 14A. Thereby, the board | substrate P suspended by the board | substrate mounting part 31 slides to the carrying-out stage 50 side, and as shown in FIG. 14B, it contacts the contact part 58 attached to the adsorption | suction part 52b. As described above, the substrate P is slid toward the abutting portion 58 side by using the positioning pin 37 without moving the suction portion 52b along the sliding portion 52a to a position facing the substrate P on the plate holder 9. After the end portion of the substrate P contacts the abutting portion 58, the suction portion 52 b sucks and holds the substrate P, and moves along the guide portion 52 a in the Y direction in the figure as shown in FIG. 14C.

At this time, since the substrate P is supported in a state floating on the plate holder 9, the suction portion 52b can smoothly slide the substrate P to the carrying-out stage 50 side. In addition, the upper surface of the carrying-out table 50 is a floating support substrate P as described above. Here, it is also possible to make the gas sprayed from the gas spray holes K2, K5 directional.

The board | substrate P which slides on the board | substrate mounting part 31 by the movement of the adsorption | suction part 52b is smoothly transferred to the upper surface of the carrying-out table 50. In this embodiment, since the upper surface of the plate holder 9 is higher than the upper surface of the carrying-out table 50, the substrate P can be smoothly transferred to the carrying-out table 50 without touching the side of the carrying-out table 50.

After the movement of the substrate P is completed by the suction portion 52b, the carrying-out stage 50 stops gas injection from the gas injection hole K5, and sucks and holds the substrate P through the suction hole K6. The unloading unit 5 drives the third moving mechanism 53 in a state where the substrate P is sucked and held, and moves the unloading stage 50 to the unloading position of the substrate P.

After the exposure device 1 transfers the substrate P from the plate holder 9 to the carry-out portion 5, the exposure device 1 moves the plate holder 9 close to the carry-in table 40 of the carry-in portion 4. Next, similarly, the substrate P is transferred between the carry-in stage 40 and the plate holder 9, and the substrate P placed on the plate holder 9 can be exposed.

In this embodiment, during the period when the next substrate P is carried in from the carry-in section 4 to the plate holder 9 or during the exposure processing of the next substrate P, the exposure processing carried out and placed on the carry-out table 50 is carried out. Finished substrate P. At this time, the upper and lower moving mechanism 60 located below the carrying-out table 50 is configured to place the substrate support pin 60 a above the carrying-out table 50 through the through hole 57. Thereby, the board | substrate P is hold | maintained above the carrying-out stage 50 by being supported by the board | substrate support pin 60a. Next, the arm portion 48 of the coating and developing machine (not shown) is inserted between the substrate support pins 60 a as shown in FIG. 15. Thereafter, the substrate P is transferred to the arm portion 48 by lowering the substrate support pin 60 a. The arm portion 48 moves the substrate P in a coating and developing machine (not shown) to perform a developing process.

As described above, the plate holder 9 is alternately connected by moving the carrying-in portion 4 and the carrying-out portion 5 in the same horizontal plane (XY plane) to carry out the loading and unloading operation of the substrate P to the exposure device body 3. In this embodiment, since the plate holder 9 is moved along the arrangement direction of the carry-in section 4 and the carry-out section 5, the board holder 9 and the carry-in section 4 and carry-out section 5 can be arranged in close proximity or in contact with each other in a short time. Of the state. Therefore, it is possible to shorten the processing time (so-called production distance (Takt)) accompanying the loading / unloading operation of the substrate P.

According to this embodiment, since the substrate P supported by the suspension can be slid and transferred from the carry-in portion 4 to the plate holder 9, it is possible to prevent air stagnation or an air layer from being generated between the substrate P and the substrate placing portion 31. It prevents the substrate P from being displaced or deformed. Therefore, highly reliable exposure processing can be performed.

In addition, in the first embodiment, when the substrate P is transferred from the loading table 40 to the plate holder 9, the upper surface of the loading table 40 can be inclined. Specifically, the holding portion 44 of the second moving mechanism 43 is tilted toward the plate holder 9 side (θ Y) on the upper surface of the carrying-in stage 40 that supports the substrate P in a state where the gas is ejected from the gas injection hole K3 and floats. . Thereby, the substrate P can be moved to the plate holder 9 side by its own weight.

In addition, when the substrate P is transferred from the plate holder 9 to the carrying-out table 50, the upper surface of the plate holder 9 can be inclined. Specifically, the holding portion 34 of the first moving mechanism 33 tilts the upper surface of the plate holder 9 that supports the substrate P in a state where the gas is ejected from the gas injection hole K2 and floats toward the carrying-out table 50 side (θ Y). . Thereby, the substrate P can be moved to the carrying-out stage 50 side by its own weight.

(Second Embodiment)

Next, the structure of the second embodiment of the present invention will be described. In this embodiment, the same reference numerals are given to the same components as those in the first embodiment, and descriptions thereof are omitted. In the second embodiment, the configuration of the first transfer section 149 of the carry-in section 104 is different from that of the first embodiment.

16A and 16B are diagrams showing the structure of the carry-in section 104 in this embodiment, FIG. 16A is a diagram showing the plan structure of the carry-in section 104, and FIG. 16B is a side view of the arrow AA of FIG. 16A Sectional drawing.

As shown in Figs. 16A and 16B, the first transfer unit 149 of the carry-in unit 104 of this embodiment has a roller mechanism 148 instead of a structure in which a gas is sprayed onto one surface of the substrate P to support the suspension.

A plurality of cutouts 141 are formed on one end side of the carry-in stage 140 as shown in FIG. 16A. A roller 142 constituting the roller mechanism 148 that is rotatable about the shaft 143 is supported at each notch 141. The roller 142 can rotate by a driving mechanism (not shown). As shown in FIG. 16B, the roller mechanism 148 is configured so that the roller 142 can contact the substrate P or be separated from the substrate P.

According to this configuration, the roller mechanism 148 can hold the substrate P to the plate by rotating the roller P in a predetermined direction while bringing the plurality of rollers 142 into contact with the lower surface of the substrate P supported on the carry-in stage 140. With 9 side moves. As a material for forming the roller 142, an elastic member such as rubber that generates a large frictional force with the substrate P can be used. By constituting the roller 142 using such an elastic member, damage (scratch, etc.) to the substrate P can be prevented. In addition, only the suction hole K4 is provided on the upper surface of the carry-in table 140.

Next, the operation of the exposure apparatus 1 according to this embodiment will be described. Specifically, the transfer operation of the substrate P between the carry-in portion 104 and the plate holder 9 which is different from the first embodiment will be described.

First, the substrate P on which a photosensitizer is applied to a coating and developing machine (not shown) is loaded into the loading unit 104. The substrate P is sucked and held on the upper surface of the carry-in stage 140 through the suction hole K4. Thereafter, the plate holder 9 is moved so as to approach the loading table 140 (see Fig. 7A).

Also in this embodiment, it is preferable to bring the plate holder 9 closer to the carry-in table 140 so that the upper surface of the carry-in table 140 supporting the substrate P is higher than the upper surface of the board holder 9 (see FIG. 7B).

However, in this embodiment, if the upper surface of the carrying-in table 140 is lower than the upper surface of the plate holder 9, as long as at least the upper surface of the roller 142 is higher than the upper surface of the plate holder 9, the substrate loaded on the roller 142 can be loaded. P is reliably transported from the carrying-in stage 140 side to the plate holder 9 side.

Next, as shown in FIG. 17, the carrying-in stage 140 causes the roller 142 of the roller mechanism 148 to abut the lower surface of the substrate P and rotate in a predetermined direction. On the other hand, when the plate holder 9 receives the substrate P, it first injects gas from the plurality of gas injection holes K2 formed on the upper surface. The substrate P smoothly slides to the plate holder 9 side by the frictional force with the roller 142.

Here, the board holder 9, which is the destination of the transfer of the substrate P, is configured to levitate the substrate P on the substrate mounting portion 31 by spraying gas from the gas injection hole K2.

Therefore, the substrate P which slides on the upper surface of the carrying-in table 140 by the roller mechanism 148 is smoothly transferred to the upper surface of the plate holder 9.

As shown in FIG. 18, the substrate P slides in a state where the guide pins 36 provided on the peripheral portion of the plate holder 9 are defined at positions in the X direction in the figure. The roller mechanism 148 moves the substrate P to abut the positioning pin 37 provided on the downstream side of the substrate carrying direction in the plate holder 9. The substrate P is defined in the position in the X direction in the figure by the guide pin 36, and is held in the state in the Y direction in the figure by being held by the positioning pin 37 and the abutting portion 42b. The plate holder 9 stops gas injection from the gas injection hole K3. The substrate P is placed in a state of being aligned with the substrate placing portion 31.

Similarly in this embodiment, since the substrate P is transported in a state of being suspended by the spray of gas as described above, it can be transferred to the plate holder 9 in a state of high flatness without distortion, and can be prevented from An air stagnation or an air layer is generated between the substrate P and the substrate mounting portion 31. Therefore, the substrate P can be placed in a state of high flatness at a predetermined position of the opposing plate holder 9. Therefore, a predetermined exposure can be performed with high accuracy at an appropriate position on the substrate P, and highly reliable exposure processing can be realized.

In addition, since the operation of carrying out the substrate P from the plate holder 9 after the exposure process is completed is the same as that of the first embodiment, description thereof will be omitted.

In the above description, the roller mechanism 148 is used as the first transfer unit 149 of the carry-in unit 104. However, the roller mechanism can also be used as the second transfer unit 52 of the carry-out unit 5. In addition, as for the carry-in stage 140, similarly to the first embodiment, it is possible to adopt a configuration in which the substrate P is suspended by a gas jet. With this configuration, since the substrate P is transferred by the roller mechanism 148 in a floating state, the substrate P can be smoothly transferred to the plate holder 9 side.

(Third Embodiment)

Next, the structure of the third embodiment of the present invention will be described. In this embodiment, the same reference numerals are given to the same components as those in the first and second embodiments, and descriptions thereof are omitted. The main difference in the third embodiment is that the plate holder 109 includes a first transfer mechanism.

FIG. 19 is a diagram showing the structure of a plate holder 109 according to this embodiment. As shown in FIG. 19, the plate holder 109 of this embodiment is provided with the 1st transfer part 249 which transfers the board | substrate P from the carrying-in stage 40 to the plate holder 109. As shown in FIG. This first transfer section 249 includes suction sections 250 that suck and hold both sides of the substrate P in the width direction. This suction part 250 can move freely in the XY plane along the P-plane direction of the substrate.

In the present embodiment, a position detection sensor 252 is provided on the peripheral portion of the plate holder 109 to detect the position of the substrate P carried by the first transfer portion 249 relative to the substrate placing portion 31. An example of the position detection sensor 252 is a potentiometer. The present invention can use either a contact type or a non-contact type.

The suction part 250 is designed to suck and hold the end portion of the substrate P which is suspended and supported on the carrying-in stage 40 by gas injection from the gas injection hole K3, and from the carrying-in stage 40 to the plate holder 109 as shown in FIG. 20A. Side transport. On the other hand, when the plate holder 109 receives the substrate P, it first injects gas from a plurality of gas injection holes K2 formed on the upper surface. At this time, it is also possible to make the gas sprayed from the gas spray holes K2, K3 to have directivity.

As shown in FIG. 2013, the suction unit 250 is capable of detecting the position deviation of the substrate P relative to the substrate mounting portion 31 by contacting the end of the substrate P with the position detection sensor 252. The suction unit 250 is configured to be driven based on the detection result of the position detection sensor 252.

Therefore, the exposure device 1 can correct the position of the substrate P held in the suction section 250 relative to the substrate mounting section 31 based on the detection result of the position detection sensor 252.

Also in this embodiment, since the substrate P is transported in a state of being suspended by the spray of gas as described above, it can be transferred to the plate holder 109 in a state of high flatness without distortion, and can be prevented from An air stagnation or an air layer is generated between the substrate P and the substrate mounting portion 31. Therefore, the substrate P can be placed in a state of high flatness at a predetermined position of the opposing plate holder 109. Therefore, a predetermined exposure can be performed with high accuracy at an appropriate position on the substrate P, and highly reliable exposure processing can be realized.

In addition, since the substrate P unloading operation from the plate holder 109 after the exposure process is completed is the same as that of the first embodiment, description thereof will be omitted.

(Fourth Embodiment)

Next, the structure of the fourth embodiment of the present invention will be described. In this embodiment, the same reference numerals are given to the same components as those in the first embodiment, and descriptions thereof are omitted. As shown in FIG. 21, the fourth embodiment is mainly different from the first embodiment in that the board carrying-in stage 40 and the carrying-out stage 50 are arranged at positions overlapping each other in a plan view. That is, when the substrate P is transferred to and from the plate holder 9, the carry-in table 40 and the carry-out table 50 are moved up and down with respect to the plate holder 9.

Hereinafter, the transfer operation of the substrate P in this embodiment will be described with reference to FIGS. 22A, 22B, and 22C.

After the exposure processing for the substrate P placed on the plate holder 9 is completed, the carrying-out table 50 is arranged in a state approaching the plate holder 9 in the Y direction. In the present embodiment, as shown in FIG. 22A, the opposing plate holder 9 raises the carrying-out table 50 which is waiting at the lower side to a position where the substrate P can be received. At this time, the upper surface of the carrying-out table 50 can also be arranged lower than the upper surface of the plate holder 9 (refer FIG. 13).

During the exposure process on the substrate P, the next substrate P is transferred from the coating and developing machine (not shown) to the loading stage 40. Thereby, while the carrying-in stage 40 is carrying out the board | substrate P from the board holder 9 to the carrying-out stage 50, it waits on the board | substrate holder 9 in the state which mounted the next board | substrate P.

The plate holder 9 stops driving of the vacuum pump, and releases the suction and holding of the substrate P by the substrate P through the suction hole K1 to the substrate mounting portion 31. Next, the plate holder 9 injects gas from the gas injection hole K2, and supports the substrate P in a suspended state through the gas (see FIGS. 14A-14C). On the other hand, when carrying out the substrate P, the carrying-out unit 5 ejects gas from a plurality of gas injection holes K5 formed on the carrying-out table 50. At this time, the gas sprayed from the gas spray holes K2, K5 can also be made directional.

As shown in FIG. 22B, the carrying-out section 5 moves the substrate P held by the suction section 52b in the Y direction in the same manner as in the first embodiment. At this time, since the substrate P is supported in a state of being suspended on the plate holder 9, the substrate P is smoothly slid on the carrying-out table 50. In addition, the upper surface of the carrying-out table 50 is a floating support substrate P as described above. Therefore, the substrate P is smoothly transferred onto the upper surface of the carrying-out table 50.

After the movement of the substrate P is completed, the carrying-out stage 50 stops the gas injection from the gas injection hole K5, and sucks and holds the substrate P through the suction hole K6. The carrying-out stage 50 moves the substrate P downward as shown in FIG. 22C while the substrate P is sucked and held. In addition, when the substrate P is large in size and is placed beyond the upper surface of the carrying-out table 50, the carrying-out table 50 is separated from the plate holder 9 so that the substrate P does not interfere with the plate holder 9. The downward movement is performed in a state of retreating toward the + Y direction in the figure.

On the other hand, the carrying-out table 50 starts a lowering operation, and as shown in FIG. 22C, the carrying-in table 40 waiting above the board holder 9 is lowered to a position where the board holder 9 can hand over the substrate P. Thereby, the plate holder 9 and the carrying-in stage 40 are aligned in the state which approached in the Y direction. At this time, the upper surface of the carrying-in table 40 can also be arranged lower than the upper surface of the plate holder 9 (refer to FIG. 8).

The carry-in stage 40 ejects gas from a plurality of gas ejection holes K3 formed on the upper surface, and supports the substrate P in a suspended state through the gas. On the other hand, when the plate holder 9 receives the substrate P, it first injects gas from the plurality of gas injection holes K2 formed on the upper surface. At this time, the gas sprayed from the gas spray holes K2, K5 can also be made directional.

The carrying-in portion 4 is a state in which the substrate P is suspended and supported on the carrying-in stage 40, and the abutting portion 42b abuts on one end portion of the substrate P. The abutting portion 42b moves the substrate P to the plate holder 9 side by moving along the guide portion 42a in the recessed portion 40a (see FIGS. 9 and 10).

Since the substrate P is suspended on the carry-in table 40, it smoothly slides to the plate holder 9 side. Since the upper surface of the plate holder 9 is a floating support substrate P as described above, the substrate P is smoothly transferred from the loading table 40 to the plate holder 9 as shown in FIG. 22D.

As with the first embodiment, the substrate P can be loaded with the guide pin 36 and the positioning pin 37 in a state where the substrate mounting portion 31 is aligned with a predetermined position (see FIG. 9). Next, the substrate P is subjected to an exposure process.

In the present embodiment, during the time when the substrate P is carried in from the carry-in section 4 to the plate holder 9 or during the exposure processing of the substrate P, the substrate P that has been subjected to the exposure processing placed on the carry-out table 50 is carried out.

In the present embodiment, as described above, the carrying-in portion 4 and the carrying-out portion 5 are moved to the plate holder 9 in the height direction (Z direction) and are successively connected, so that the substrate P of the exposure apparatus body 3 can be carried in and out. In addition, since the carrying-in unit 4 and the carrying-out unit 5 are on standby above the board holder 9 when they are not in use, and can be connected to the board holder 9 by moving up and down, respectively, the processing accompanying the carrying in and out operations of the substrate P can be shortened. Time (so called Takt).

In the above-mentioned embodiment, although the first direction in which the carrying-in stage 40 and the plate holder 9 are arranged is described in parallel with the second direction in which the carrying-out stage 50 and the plate holder 9 are arranged, the present invention is not limited thereto Here, the present invention can also be applied to a case where the first direction and the second direction are different (for example, securities exchange).

(Fifth Embodiment)

Next, the structure of the fifth embodiment of the present invention will be described. In this embodiment, the same reference numerals are given to the same components as those in the first embodiment, and descriptions thereof are omitted. In the fifth embodiment, the main point of difference is that it has a carry-in / out unit that functions as a carry-in unit and a carry-out unit.

FIG. 23 is a perspective view showing the structure of the interior of the chamber, and FIGS. 24A and 24B are plan views showing a schematic structure of the carry-in / out section 400.

As shown in FIG. 23, the carry-in / out section 400 includes a substrate mounting table 401 and a moving mechanism 402 that moves the substrate mounting table 401. The moving mechanism 402 has the same configuration as the first and second moving mechanisms 33 and 43 of the first embodiment. With this configuration, the substrate mounting table 401 can move within a predetermined area of the guide surface on the light emitting side (the image plane side of the projection optical system PL) while the substrate P is held. The substrate mounting table 401 can also move in the Z-axis direction. Therefore, the substrate mounting table 401 functions as a loading table and a loading table.

As shown in FIGS. 24A and 24B, the loading / unloading unit 400 includes a transfer unit 405 that transfers the substrate P from the substrate mounting table 401 to the plate holder 9. The transfer section 405 includes a guide section 406 and a suction section 408 that suction-holds the substrate P.

On the substrate mounting table 401, two groove-shaped recesses 401a formed in one direction (the Y direction shown in the figure) are formed. The guide portion 406 is provided in the recessed portion 401a. The suction portion 408 is mounted on the guide portion 406 in a state protruding from the upper surface of the substrate mounting table 401. The adsorption unit 408 includes, for example, a vacuum adsorption pad that holds the substrate P by vacuum adsorption.

Furthermore, a plurality of gas injection holes K7 are provided on the upper surface of the substrate mounting table 401 to support the substrate P through the gas by spraying gas such as air on the lower surface of the substrate P. Each gas injection hole K7 is connected to a gas injection pump (not shown). In addition, a plurality of suction holes K8 are provided on the substrate mounting table 401 to make the substrate P closely adhere to this surface. Each suction hole K8 is connected to a vacuum pump (not shown). In addition, the gas injection holes K7 and the suction holes K8 are alternately arranged in a grid shape.

In addition, a through hole 407 is formed in the substrate mounting table 401, and the through hole 407 can be used to move the substrate support pin of the substrate P to and from a coating and developing machine (not shown) as described later. Plug in.

The plate holder 9 is provided with the position detection sensor 19 for detecting the relative position to the substrate mounting table 401 on the side surface thereof, as in the above-described embodiment. The position detection sensor 19 includes a distance detection sensor 19a for detecting a relative distance with respect to the substrate mounting table 401 and a height detection sensor 19b for detecting a relative height with respect to the substrate mounting table 401 (see Figure 3B).

Next, a transfer operation of the substrate P between the carry-in / out portion 400 and the plate holder 9 will be described with reference to the drawings. First, a substrate P coated with a photosensitizer in a coating and developing machine (not shown) is loaded into the loading / unloading unit 400. At this time, the upper and lower moving mechanism 409 located below the substrate mounting table 401 firstly arranges the substrate support pin 410 above the substrate mounting table 401 through the through hole 407. Next, the arm portion 48 of the coating and developing machine (not shown) is inserted between the substrate support pins 410 as shown in FIG. 25. The substrate P is transferred to the substrate support pin 410 by being lowered by the arm portion 48, and then retracted from the loading / unloading portion 400. The up-and-down movement mechanism 409 lowers the substrate support pin 410 that supports the substrate P to end the loading operation of the substrate P into the substrate mounting table 401. Thereafter, by driving the vacuum pump, the substrate P is sucked and held on the substrate mounting table 401 through the suction hole K8.

Next, the plate holder 9 moves so as to approach the substrate mounting table 401 of the loading / unloading section 400. In addition, when the substrate placing table 401 and the plate holder 9 are arranged, the substrate placing table 401 and the plate holder 9 can be moved to the transfer position of the substrate P in a short time by driving the transfer section 405 to shorten the loading of the substrate P. The time required for the action. In this case, since the substrate P is sucked and held on the substrate mounting table 401 through the suction hole K8, the substrate P can be prevented from moving on the substrate mounting table 401 when the transfer unit 405 is driven.

In this embodiment, as shown in FIG. 26, the board holder 9 is brought closer to the board | substrate mounting base 401 so that the upper surface of the board | substrate mounting base 401 which supports the board | substrate P may be higher than the upper surface of the board holder 9. In addition, by arranging the plate holder 9 and the substrate mounting table 401 in contact with each other, the moving distance of the substrate P can be shortened so that the transfer can be performed more smoothly.

Next, as shown in FIG. 26, the substrate mounting table 401 ejects gas from a plurality of gas injection holes K7 formed on the substrate, and supports the substrate P in a suspended state through the gas. On the other hand, when the plate holder 9 receives the substrate P, it first injects gas from the plurality of gas injection holes K2 formed on the upper surface. At this time, the gas sprayed from the gas spray holes K2, K7 can also be made directional.

The carry-in / out portion 400 is a state in which the substrate P is suspended and supported on the substrate mounting table 401, and one end portion of the substrate P is sucked and held by the suction portion 408. The suction portion 408 moves the substrate P toward the plate holder 9 side by moving along the guide portion 406 in the recessed portion 401a (see FIGS. 24A and 24B).

Since the substrate P is suspended on the substrate mounting table 401, the suction portion 408b can smoothly slide the substrate P to the plate holder 9 side. The upper surface of the plate holder 9 is a floating support substrate P as described above.

Therefore, the substrate P sliding on the substrate mounting table 401 by the suction section 408 is smoothly transferred to the upper surface of the plate holder 9. In this embodiment, since the upper surface of the substrate mounting table 401 is higher than the upper surface of the plate holder 9 as shown in FIG. 26, the substrate P can be smoothly transferred to the plate holder 9 without touching the side surface of the plate holder 9. on.

The substrate P is brought into contact with the guide pin 36 and the positioning pin 37 provided on the peripheral portion of the plate holder 9 to be aligned with the substrate placing portion 31 at a predetermined position (see FIG. 9).

Also in this embodiment, since the substrate P is transported in a state of being suspended by the spray of the gas as described above, it is possible to prevent air stagnation or an air layer from being generated between the substrate P and the substrate placing portion 31. The substrate P is prevented from being displaced or deformed. Therefore, the substrate P can be placed in a state of high flatness at a predetermined position of the opposing plate holder 9. Thereafter, the substrate P is sucked and held on the substrate mounting portion 31 through the suction hole K1 by driving the vacuum pump. Next, after the substrate P is placed on the plate holder 9, the substrate P is subjected to an exposure process.

After the exposure process is completed, the plate holder 9 is moved so as to approach the substrate mounting table 401 of the carry-in / out section 400. In this embodiment, the plate holder 9 and the substrate mounting table 401 are brought closer to each other such that the upper surface of the plate holder 9 is higher than the upper surface of the substrate mounting table 401.

In addition, when the substrate mounting table 401 and the plate holder 9 are arranged, the time required for the substrate P carrying-out operation can be shortened by moving the substrate mounting table 401. In addition, the plate holder 9 and the substrate mounting table 401 can be arranged in a contact state. Accordingly, since no gap is formed between the plate holder 9 and the substrate mounting table 401, the substrate P can be smoothly transferred.

The plate holder 9 stops driving of the vacuum pump, and releases the suction and holding of the substrate P by the substrate P through the suction hole K1 to the substrate mounting portion 31. Next, as shown in FIG. 27, the plate holder 9 ejects gas from a plurality of gas injection holes K2 formed on the upper surface of the substrate mounting portion 31, and supports the substrate P in a suspended state through the gas. On the other hand, when carrying out the substrate P, the carry-out unit 5 ejects gas from a plurality of gas injection holes K7 formed on the substrate mounting table 401. At this time, the gas sprayed from the gas spray holes K2, K7 can also be made directional.

The carry-in / out portion 400 moves the suction portion 408 of the transfer portion 405 along the guide portion 406 toward the substrate P side which is levied and supported on the substrate placing portion 31 of the plate holder 9. The suction unit 408 sucks and holds the substrate P, and moves the substrate P in the + Y direction in the figure (see FIGS. 24A and 24B).

At this time, since the substrate P is supported in a state of being suspended on the plate holder 9, the suction portion 408 can smoothly slide the substrate P to the substrate mounting table 401 side. The upper surface of the substrate mounting table 401 is a floating support substrate P as described above.

Therefore, the substrate P sliding on the substrate mounting portion 31 is smoothly transferred onto the substrate mounting table 401. In this embodiment, since the upper surface of the plate holder 9 is higher than the upper surface of the substrate mounting table 401, the substrate P can be smoothly transferred to the substrate mounting table 401 without touching the side surface of the substrate mounting table 401.

After the movement of the substrate P is completed by the adsorption portion 408, the substrate mounting table 401 stops gas injection from the gas injection hole K7, and adsorbs and holds the substrate P through the suction hole K8. The carry-in / out unit 400 drives the transfer unit 405 to move the substrate mounting table 401 to the carrying-out position of the substrate P in a state where the substrate P is sucked and held.

Next, the substrate P on which the exposure processing on the substrate mounting table 401 is completed is carried out. At this time, the upper and lower movement mechanism 409 located below the substrate mounting table 401 is configured to place the substrate support pin 410 above the substrate mounting table 401 through the through hole 407. Thereby, the substrate P is supported by the substrate support pin 410 and is held above the substrate mounting table 401 (see FIG. 25). Next, the arm portion 48 of the coating and developing machine (not shown) is inserted between the substrate support pins 410, and the substrate P is transferred to the arm portions 48 by lowering the substrate support pins 410. The arm portion 48 moves the substrate P in a coating and developing machine (not shown) to perform a developing process.

According to the present embodiment, since the substrate P supported by the suspension can be slid and transported from the loading / unloading section 400 to the board holder 9, it is possible to prevent air stagnation or an air layer between the substrate P and the substrate mounting section 31, and prevent The substrate P is displaced or deformed. Therefore, highly reliable exposure processing can be performed. In addition, since the carry-in / out section 400 also serves as the carry-in section 4 and the carry-out section 5 in the above-mentioned first to third embodiments, the device configuration can be simplified.

In addition, in the fifth embodiment, when the substrate P is transferred from the substrate mounting table 401 to the plate holder 9, the upper surface of the substrate mounting table 401 can be inclined. Specifically, the moving mechanism 402 tilts the upper surface of the substrate mounting table 401 that supports the substrate P in a state where the gas is ejected from the gas injection hole K7 and floats toward the plate holder 9 side (θ Y). Thereby, the substrate P can be moved to the plate holder 9 side by its own weight.

In addition, when the substrate P is transferred from the plate holder 9 to the substrate mounting table 401, the upper surface of the plate holder 9 can be inclined. Specifically, the first moving mechanism 33 (holding portion 34) moves the upper surface of the plate holder 9 that supports the substrate P in a state where the gas is ejected from the gas injection hole K2 and floats toward the substrate mounting table 401 side (θ Y). tilt. Thereby, the substrate P can be moved to the substrate mounting table 401 side by its own weight.

In addition, in this embodiment, a roller mechanism 148 as shown in the second embodiment can also be used as the transfer unit 405. In addition, as the transfer portion 405, the suction portion 408 constituting the transfer portion 405 can be provided on the plate holder 9 side as shown in the third embodiment.

(Sixth embodiment)

Next, the structure of the sixth embodiment of the present invention will be described. In addition, in the following description, the same reference numerals are given to the same elements as the constituent elements of the above-mentioned embodiment to simplify or omit their description.

FIG. 28 is a cross-sectional plan view showing a schematic configuration of the exposure apparatus of this embodiment, and FIG. 29 is a perspective view showing a schematic configuration of the apparatus in the chamber.

As in the embodiment described above, the exposure apparatus 1 includes an exposure apparatus body 3 and a carry-in unit 4 as shown in FIG. 28. In this embodiment, the exposure apparatus 1 includes a carry-out robot arm 205. These are contained in a chamber 2 which is highly purified and adjusted to a predetermined temperature.

As shown in FIG. 29, the carry-out robot arm 205 has, for example, a horizontal joint type structure, and includes an arm portion 10 composed of a plurality of portions connected by a vertical joint axis, a fork portion 12 connected to the front end of the arm portion 10, Driving device 13. The arm portion 10 can be moved in, for example, the vertical direction (Z-axis direction) by the driving device 13. The driving device 13 is driven by a control device (not shown). As a result, the carry-out robot arm 205 receives the substrate P from the plate holder 9. In addition, carrying out the robot arm 205 is not limited to a robot with a horizontal articulated structure, and a known robot arm (generally, a conveying mechanism) can be appropriately adopted or combined for implementation.

FIG. 30A is a plan view of the display panel holder 9 in a plan view, and FIG. 30B is a view illustrating a side view configuration of the display panel holder 9. In this embodiment, as shown in FIG. 30A, a substrate mounting portion 31 on which the substrate P is mounted is formed on the plate holder 9.

In the present embodiment, a groove portion 30 is formed in the plate holder 9 to accommodate the fork portion 12 of the robot arm 205 when the substrate P is carried out. The groove portion 30 is formed along the moving direction of the fork portion 12 (the Y direction in the figure). A region other than the groove portion 30 in the upper surface of the fork portion 9 constitutes the above-mentioned substrate mounting portion 31.

In addition, the thickness of the fork portion 12 is smaller than the depth of the groove portion 30. Thereby, after the fork part 12 is accommodated in the groove part 30 as mentioned later, the board | substrate P mounted on the board | substrate mounting part 31 is handed over to the fork part 12 by raising it.

As shown in FIG. 3B, as shown in FIG. 30B, the plate holder 9 is provided with a position detection sensor 19 that detects a relative position to the carry-in table 40 on the side surface portion 9 a. The position detection sensor 19 includes a distance detection sensor 19a for detecting a relative distance with respect to the carry-in stage 40 and a height detection sensor 19b for detecting a relative height with respect to the carry-in stage 40. In addition, a recess is formed at a position corresponding to the position detection sensor 19 in the carry-in stage 40, thereby preventing the position detection sensor 19 from interfering with the carry-in stage 40.

Next, the operation of the exposure apparatus 1 according to this embodiment will be described with reference to FIGS. 6, 11, and 31A to 34. Specifically, the transfer operation of the substrate P between the carry-in portion 4 and the plate holder 9 and the transfer operation of the substrate P between the plate holder 9 and the carry-out robot arm 205 will be mainly described.

First, a substrate P coated with a photosensitizer in a coating and developing machine (not shown) is loaded into the loading unit 4. At this time, the upper and lower moving mechanism 49 located below the carrying-in stage 40 first arranges the substrate support pin 49 a above the carrying-in stage 40 through the through hole 47. Next, the arm portion 48 of the coating and developing machine (not shown) is inserted between the substrate support pins 49 a as shown in FIG. 6. The substrate P is transferred to the substrate support pin 49 a by being lowered by the arm portion 48, and is then retracted from the carry-in portion 4. The up-and-down movement mechanism 49 finishes the loading operation of the board | substrate P to the loading stage 40 by lowering the board | substrate support pin 49a which supports the board | substrate P. After that, by driving the vacuum pump, the substrate P is sucked and held on the loading stage 40 through the suction hole K4.

Next, as shown in FIG. 31A, the plate holder 9 is moved so as to approach the loading table 40 of the loading section 4. In addition, the illustration of carrying out the robot arm is omitted in FIGS. 31A and 31B.

Specifically, the first moving mechanism 33 is arranged in a state where the plate holder 9 and the carry-in table 40 are approached in the Y direction. Here, the state where the plate holder 9 and the carrying-in stage 40 are close to each other refers to a state in which the movement of the substrate P can be smoothly performed during the transfer of the substrate P described later.

The second moving mechanism 43 can be driven when the loading platform 40 and the plate holder 9 are aligned. Thus, the loading stage 40 and the board holder 9 can be moved to the transfer position of the substrate P in a short time, and the time required for the loading operation of the substrate P can be shortened. At this time, since the substrate P is sucked and held on the loading table 40 through the suction hole K4, the substrate P can be prevented from moving on the loading table 40 when the second moving mechanism 43 is driven.

In this embodiment, as shown in FIG. 31B, when the plate holder 9 and the carrying-in stage 40 are brought close to each other, the substrate P is arranged so that the plate holder 9 is high. That is, the first moving mechanism 33 brings the plate holder 9 closer to the carry-in table 40 so that the upper surface of the carry-in table 40 supporting the substrate P is higher than the upper surface of the board holder 9. In addition, the second moving mechanism 43 can also raise the loading platform 40 so that the upper surface of the loading platform 40 is higher than the upper surface of the plate holder 9.

In addition, the first moving mechanism 33 can also arrange the plate holder 9 and the carrying-in stage 40 in contact with each other. In this way, it is possible to smoothly transfer the substrate P between the plate holder 9 and the carrying-in stage 40 described later.

Next, as shown in FIG. 32, the carry-in stage 40 ejects a gas from a plurality of gas ejection holes K3 formed on the upper surface, and supports the substrate P in a suspended state through the gas. On the other hand, when the plate holder 9 receives the substrate P, it first injects gas from the plurality of gas injection holes K2 formed on the upper surface.

The carrying-in portion 4 is a state in which the substrate P is suspended and supported on the carrying-in stage 40, and the abutting portion 42 b is abutted against one end portion of the substrate P as shown in FIG. 33. The abutting portion 42b moves the substrate P to the plate holder 9 side by moving along the guide portion 42a in the recessed portion 40a.

Since the substrate P is suspended on the carry-in table 40, the abutting portion 42b can smoothly slide the substrate P to the plate holder 9 side. The upper surface of the plate holder 9 is a floating support substrate P as described above. Here, it is also possible to make the gas ejected from the gas ejection holes K3, K2 directional.

As shown in FIG. 34, the board | substrate P which slides on the upper surface of the carrying-in stage 40 by the contact part 42b is smoothly transferred to the upper surface of the board holder 9. As shown in FIG. In this embodiment, since the upper surface of the carrying-in table 40 is higher than the upper surface of the plate holder 9, the substrate P can be smoothly transferred to the plate holder 9 without touching the side surface of the plate holder 9.

As shown in FIG. 33, the substrate P slides in a state where the guide pins 36 provided on the peripheral portion of the plate holder 9 are defined at positions in the X direction in the figure. The abutting portion 42 b moves the substrate P to abut on the positioning pin 37 provided on the downstream side of the substrate conveying direction in the plate holder 9. The substrate P is defined in the position in the X direction in the figure by the guide pin 36, and is held in the state in the Y direction in the figure by being held by the positioning pin 37 and the abutting portion 42b. The plate holder 9 stops gas injection from the gas injection hole K2. The substrate P is placed in a state where the substrate P is aligned with the substrate placing portion 31 as shown in FIG. 11.

In addition, in the past, when a substrate is placed on a plate holder, there is a possibility that a substrate placement deviation (a position deviation from a predetermined placement position) or a substrate deformation may occur. One of the reasons for this placement deviation can be considered, for example, immediately before the substrate is placed, because the substrate becomes a floating state due to the thin air layer generated between the substrate and the plate holder. One of the reasons for the deformation of the substrate can be considered, for example, when the substrate is placed between the substrate and the plate holder after the air is trapped and the substrate is in an expanded state.

In contrast, in this embodiment, since the substrate P is transported in a state of being suspended by the jet of gas as described above, it is transferred to the plate holder 9 in a state of high flatness without distortion. In addition, since the substrate P is placed on the substrate mounting portion 31 from a height of being suspended and supported, it is possible to prevent air stagnation or an air layer between the substrate P and the substrate placing portion 31. Therefore, it is possible to suppress the substrate P from being in an expanded state, and to prevent occurrence of displacement or deformation of the placement of the substrate P. Therefore, the substrate P can be placed in a state of high flatness at a predetermined position of the opposing plate holder 9. Thereafter, the substrate P is sucked and held on the substrate mounting portion 31 through the suction hole K1 by driving the vacuum pump.

After the substrate P is placed on the plate holder 9, the mask M is illuminated with the exposure light IL from the illumination system. The pattern of the mask M illuminated with the exposure light IL is projected and exposed to the substrate P placed on the plate holder 9 through the projection optical system PL.

Since the substrate P can be satisfactorily placed on the plate holder 9 as described above, a predetermined exposure can be performed at an appropriate position on the substrate P with high accuracy, and a highly reliable exposure process can be realized.

In this embodiment, a photosensitizer can be applied by a coating and developing machine (not shown) during the exposure processing of the substrate P, or while the exposed substrate P is transferred by the take-out robot arm 205 as described later. Next, the one substrate P is placed on the carry-in stage 40 of the carry-in unit 4.

Next, the unloading operation of the substrate P from the plate holder 9 after the exposure process is described will be described.

Specifically, the method of carrying out the substrate P by the carrying-out robot arm 205 is demonstrated. Fig. 35 is a perspective view for explaining the movement of the robot arm 205. Figs. 36A and 36B are cross-sectional structural views when the substrate P is viewed from the Y-axis direction when the substrate P is carried out from the plate holder 9. Fig. 37 is a perspective view when viewed from the X-axis direction. A side view of the substrate P when the substrate P is moved out of the plate holder 9. Note that only the fork portion 12 is shown in FIG. 35, and the overall configuration of the carry-out robot arm 205 is omitted. 36A and 36B, for convenience of illustration, the illustration of the fork portion 12 supporting the substrate P is simplified.

After the exposure process is completed, the suction of the suction hole K1 of the vacuum pump is released to release the suction of the substrate P by the plate holder 9. Next, as shown in Fig. 35, the carry-out robot arm 205 is inserted into the groove portion 30 formed in the plate holder 9 from the -Y direction side.

Next, the driving device 13 moves the fork portion 12 upward by a predetermined amount, and causes the fork portion 12 to abut the lower surface of the substrate P as shown in FIG. 36A. Further, as shown in FIG. 36B, the fork portion 12 is further moved upward, thereby lifting the substrate P above the plate holder 9 and separating it from the substrate placing portion 31.

In addition, the robot arm 205 is carried out to raise (retreat) the fork portion 12 to a height of the carrying-in stage 40 (on which the next substrate P coated with the photosensitive agent is placed) that does not contact the carrying-in portion 4. After the fork portion 12 is raised so as not to contact the substrate P on the carry-in table 40, as shown in FIG. 37, the carry-in table 40 of the carry-in portion 4 is moved close to the plate holder 9, and the substrate P is moved toward the board as described above The holder 9 carries it.

While the substrate P is being transferred from the carrying-in portion 4 to the plate holder 9, the carrying-out robot arm 205 moves the substrate P placed on the fork portion 12 into a coating and developing machine (not shown). As described above, the unloading operation of unloading the substrate P from the exposure apparatus body 3 is completed.

As described above, according to this embodiment, since the substrate P supported by the suspension can be slid and transferred from the carry-in portion 4 to the plate holder 9, it is possible to prevent air stagnation or an air layer between the substrate P and the substrate placing portion 31. , Can prevent the substrate P from being displaced or deformed. Therefore, highly reliable exposure processing can be performed.

In addition, in this embodiment, since the substrate P is slid and carried in from the carry-in portion 4 to the plate holder 9 using gas injection, compared with the case of carrying in the substrate using the plate holder 9 of the conventional tray, the lead time is changed. long.

In contrast, in the present embodiment, since the fork portion 12 of the carry-out robot arm 205 can be inserted into the groove portion 30 and the substrate P is lifted up from below, the substrate P is retracted from the plate holder 9 and the substrate portion P is retracted from the loading portion 4. Since the next substrate P is carried into the plate holder 9, the overall production time required to carry in and out of the substrate P from the plate holder 9 can be approximately the same as that in the case of using a conventional tray. Therefore, the substrate P can be carried into the plate holder 9 in a good state without increasing the lead time when the substrate P is carried in and out.

In addition, in the present embodiment, when the substrate P is transferred from the loading table 40 to the plate holder 9, the upper surface of the loading table 40 can be tilted. Specifically, the holding portion 44 of the second moving mechanism 43 is tilted toward the plate holder 9 side (θ Y) on the upper surface of the carrying-in stage 40 that supports the substrate P in a state where the gas is ejected from the gas injection hole K3 and floats. . Thereby, the substrate P can be moved to the plate holder 9 side by its own weight.

(Seventh embodiment)

Next, the structure of the seventh embodiment of the present invention will be described. In this embodiment, the same reference numerals are given to the same components as those of the sixth embodiment, and descriptions thereof are omitted. In the seventh embodiment, the structure of the carry-in unit is different from that in the sixth embodiment.

In this embodiment, the carrying-in portion 104 is the same as that described with reference to FIGS. 16A and 16B.

The operation of the exposure device 1 in this embodiment is the same as that described with reference to FIGS. 17 and 18.

In this embodiment, since the substrate P is transported in a state of being suspended by the spray of gas as described above, it can be transferred to the plate holder 9 in a state of high flatness without distortion, and can be prevented from being transferred between the substrate P and the substrate P. An air stagnation or an air layer is generated between the substrate mounting portions 31. Therefore, the substrate P can be placed in a state of high flatness at a predetermined position of the opposing plate holder 9. Therefore, a predetermined exposure can be performed with high accuracy at an appropriate position on the substrate P, and a highly reliable exposure process can be realized.

(Eighth embodiment)

Next, the structure of the eighth embodiment of the present invention will be described. In this embodiment, the same reference numerals are given to the same components as those in the sixth and seventh embodiments, and descriptions thereof are omitted. The main difference between the eighth embodiment and the sixth and seventh embodiments is that the plate holder 109 includes a transfer unit.

Fig. 38 is a diagram showing the structure of a plate holder 109 according to this embodiment. As shown in FIG. 38, the plate holder 109 of this embodiment is provided with the 1st transfer part 249 which transfers the board | substrate P from the carrying-in stage 40 to the plate holder 109. As shown in FIG. This first transfer section 249 includes suction sections 250 that suck and hold both sides of the substrate P in the width direction. This suction part 250 can move freely in the XY plane along the P-plane direction of the substrate.

In the present embodiment, a position detection sensor 252 is provided on the peripheral portion of the plate holder 109 to detect the position of the substrate P carried by the first transfer portion 249 relative to the substrate placing portion 31. An example of the position detection sensor 252 is a potentiometer. The present invention can use either a contact type or a non-contact type.

The suction part 250 is designed to suck and hold the end portion of the substrate P which is suspended and supported on the carrying-in stage 40 by gas injection from the gas injection hole K3, and from the carrying-in stage 40 to the plate holder 109 as shown in FIG. 39A. Side transport. On the other hand, when the plate holder 109 receives the substrate P, it first injects gas from a plurality of gas injection holes K2 formed on the upper surface. At this time, it is also possible to make the gas sprayed from the gas spray holes K2, K3 to have directivity.

As shown in FIG. 39B, the suction unit 250 is capable of detecting the position deviation of the substrate P relative to the substrate mounting portion 31 by contacting the end of the substrate P with the position detection sensor 252. The suction unit 250 is configured to be driven based on the detection result of the position detection sensor 252.

Therefore, the exposure device 1 can correct the position of the substrate P held in the suction section 250 relative to the substrate mounting section 31 based on the detection result of the position detection sensor 252.

Also in this embodiment, since the substrate P is transported in a state of being suspended by the spray of gas as described above, it can be transferred to the plate holder 109 in a state of high flatness without distortion, and can be prevented from An air stagnation or an air layer is generated between the substrate P and the substrate mounting portion 31. Therefore, the substrate P can be placed in a state of high flatness at a predetermined position of the opposing plate holder 109. Therefore, a predetermined exposure can be performed with high accuracy at an appropriate position on the substrate P, and highly reliable exposure processing can be realized.

In addition, since the substrate P unloading operation from the plate holder 109 after the exposure process is completed is the same as that of the first embodiment, the description thereof is omitted.

(Ninth Embodiment)

Next, the structure of a ninth embodiment of the present invention will be described. In this embodiment, the same reference numerals are given to the same components as those in the sixth to eighth embodiments, and descriptions thereof are omitted. The main difference between the ninth embodiment and the sixth to eighth embodiments is the configuration of the exposure device. FIG. 40 is a perspective view showing a schematic configuration of the exposure apparatus main body 3 of this embodiment.

As shown in FIG. 40, the exposure apparatus main body 3 of this embodiment includes a plate holder 9, a substrate lifting mechanism 150 provided on the plate holder 9, and a first moving mechanism 33. The substrate lifting mechanism 150 is used to lift the substrate P upward when the substrate P is unloaded.

Fig. 41 is a plan view of the display board holder 9, Figs. 42A and 42B are side sectional views of the board holder 9, Fig. 42A is a diagram showing a state before the substrate is handed over, and Fig. 42B is a state after the substrate is handed over. Figure.

As shown in FIGS. 41, 42A, and 42B, the substrate jacking mechanism 150 includes a plurality of substrate support members 151 that support the substrate P, and an upper and lower operation portion 152 that moves the substrate support member 151 up and down (see FIG. 43).

The substrate supporting member 151 includes a first linear member 119 mounted on the shaft portion (up-and-down moving member) 155 in the X direction (first direction) in FIG. 41 and a second member mounted in the Y direction (second direction) in FIG. 41. The linear member 120 is formed in a substantially lattice shape as a whole. The first linear member 119 and the second linear member (second erection portion) 120 are welded to each other or combined into a grid shape. Each substrate supporting member 151 is bridged between a plurality of (for example, six in the present embodiment) shaft portions 155.

Each of the lattice shapes constituting each of the substrate supporting members 151 has a plurality of opening portions 121 having a substantially rectangular shape smaller than the substrate P. In addition, the shape of the substrate support member 151 is not limited to the shape shown in FIG. 41, and for example, a single frame-like frame having only one opening 121 may be formed.

In this embodiment, the four substrate supporting members 151 are arranged in a state where the gap S is left in the extending direction of the second linear member 120 (the Y direction shown in FIG. 41). The gap S between the substrate supporting members 151 is a space for inserting the fork portion 12 when the substrate P is carried out from the plate holder 9 as described later.

In addition, as a material for forming the substrate supporting member 151 (the first linear member 119 and the second linear member 120), it is preferable to use the substrate supporting member 151 to suppress deflection due to the weight of the substrate P when the substrate P is supported by the substrate P For example, various synthetic resins or metals can be used. Specific examples include nylon, polypropylene, AS resin, ABS resin, polycarbonate, fiber-reinforced plastic, and stainless steel. Examples of the fiber-reinforced plastic include GFRP (Glass Fiber Reinforced Plastic) and CFRP (Carbon Fiber Reinforced Plastic).

The up-and-down operation portion 152 includes a shaft portion (up-and-down moving member) 155 and a driving device 153 that drives the shaft portion 155 up and down as shown in FIG. 43. The driving device 153 is provided for each of the shaft portions 155 so that each of the shaft portions 155 can move up and down independently.

Based on this configuration, as shown in FIGS. 42A and 42B, the substrate supporting member 151 moves up and down as the up and down operation portion 152 (the shaft portion 155) moves up and down against the substrate mounting portion 31 of the plate holder 9.

On the other hand, a recess 130 is formed in the plate holder 9 to receive the substrate support member 151. The recesses 130 are provided in a lattice shape in accordance with the frame structure of the substrate support member 151. A region (partially mounted portion) other than the recessed portion 130 on the upper surface of the plate holder 9 constitutes a substrate mounting portion 31 that holds the substrate P.

The thickness of the substrate supporting member 151 is smaller than the depth of the recessed portion 130. As a result, as shown in FIG. 42B, the substrate support member 151 is housed in the recessed portion 130, and only the substrate P placed on the substrate support member 151 is transferred to the substrate placement portion 31 and placed.

Moreover, the board | substrate mounting part 31 is set so that the substantially holding surface which the board | substrate holder 9 has with respect to the board | substrate P will be favorable flatness. In addition, a suction opening is formed on the substrate holding surface (upper surface) of the substrate mounting portion 31 so that the substrate P closely adheres to this surface, or air (gas) is ejected when the substrate is carried in to be described later to eject the substrate. P is an opening K205 functioning as a gas injection port on this surface. A vacuum pump and a gas injection pump (not shown) are connected to the opening K205, respectively, and the opening K205 functions as a suction port or a spray port as described above by switching the driving of these pumps.

Positioning pins 37 (refer to the reference plate 36 for guiding the substrate P and a predetermined position where the substrate P is placed on the substrate mounting portion 31 of the plate holder 9 when the substrate P is carried in are provided on the peripheral portion of the plate holder 9 (refer to 44A and 44B). These guide pins 36 and positioning pins 37 can be moved together with the plate holder 9 in the exposure apparatus body 3.

Next, the operation of the exposure apparatus 1 according to this embodiment will be described with reference to FIGS. 44A to 50B. Specifically, the transfer operation of the substrate P between the carry-in portion 4 and the plate holder 9 and the transfer operation of the substrate P between the plate holder 9 and the carry-out robot arm 205 will be mainly described.

First, as in the sixth embodiment, the substrate P on which the photosensitizer is applied to the coating and developing machine (not shown) is carried into the carrying section 4. At this time, at this time, the substrate P is sucked and held on the upper table 40 through the suction hole K4.

Next, as shown in FIG. 44A, the plate holder 9 is moved so as to approach the loading table 40 of the loading section 4. In addition, the illustration of carrying out the robot arm is omitted in FIGS. 44A and 44B. Specifically, the first moving mechanism 33 is arranged in a state where the plate holder 9 and the carry-in table 40 are approached in the Y direction. At this time, the second moving mechanism 43 is driven to move the loading stage 40 and the plate holder 9 to the transfer position of the substrate P in a short time, thereby reducing the time required for the loading operation of the substrate P. In addition, since the substrate P is sucked and held above the carrying-in stage 40 through the suction hole K4, it is possible to prevent the substrate P from moving on the carrying-in stage 40 when the second moving mechanism 43 is driven.

In the present embodiment, as shown in FIG. 44B, the first moving mechanism 33 brings the plate holder 9 closer to the carry-in table 40 so that the upper surface of the carry-in table 40 supporting the substrate P is higher than the upper surface of the board holder 9. In addition, the second moving mechanism 43 can also raise the loading platform 40 so that the upper surface of the loading platform 40 is higher than the upper surface of the plate holder 9. In addition, the first moving mechanism 33 can also smoothly transfer the substrate P by arranging the plate holder 9 and the carrying-in stage 40 in contact with each other.

Next, as shown in FIG. 45, the carry-in stage 40 ejects a gas from a plurality of gas injection holes K3 formed on the upper surface, and supports the substrate P in a suspended state through the gas. On the other hand, when receiving the substrate P, the plate holder 9 first drives a gas injection pump (not shown) and ejects air from an opening K205 provided in the substrate mounting portion 31.

The carrying-in portion 4 is in a state where the substrate P is suspended and supported on the carrying-in stage 40, and the abutting portion 42 b is abutted against one end portion of the substrate P as shown in FIG. 46. The abutting portion 42b moves the substrate P to the plate holder 9 side by moving along the guide portion 42a in the recessed portion 40a.

Since the substrate P is suspended on the carry-in table 40, the abutting portion 42b can smoothly slide the substrate P to the plate holder 9 side. The upper surface of the plate holder 9 is a floating support substrate P as described above. Here, the gas injected from the gas injection hole K3 and the opening K205 may be made directional.

As shown in FIG. 47, the board | substrate P which slides on the carrying-in stage 40 by the contact part 42b is smoothly transferred to the upper surface of the board holder 9. As shown in FIG. In this embodiment, since the upper surface of the carrying-in table 40 is higher than the upper surface of the plate holder 9, the substrate P can be smoothly transferred to the plate holder 9 without touching the side surface of the plate holder 9.

The substrate P is positioned in the X direction in the figure by the guide pin 36, and is held in the Y direction in the figure by being held by the positioning pin 37 and the abutting portion 42b. The plate holder 9 stops the gas injection from the opening K205. Thereby, the substrate P is placed in a state of being aligned with the substrate placing portion 31.

In the present embodiment, since the substrate P is transported in a state of being suspended by the spray of gas as described above, it is transferred to the plate holder 9 in a state of high flatness without distortion. In addition, since the substrate P is placed on the substrate mounting portion 31 from a height of being suspended and supported, it is possible to prevent air stagnation or an air layer between the substrate P and the substrate placing portion 31. Therefore, it is possible to suppress the substrate P from being in an expanded state, and to prevent occurrence of displacement or deformation of the placement of the substrate P. Therefore, the substrate P can be placed in a state of high flatness at a predetermined position of the opposing plate holder 9. After that, by driving the vacuum pump, the substrate P is sucked and held on the substrate mounting portion 31 through the opening K205.

After the substrate P is placed on the plate holder 9, the mask M is illuminated with the exposure light IL from the illumination system. The pattern of the mask M illuminated with the exposure light IL is projected and exposed to the substrate P placed on the plate holder 9 through the projection optical system PL.

Since the exposure device 1 of this embodiment can satisfactorily place the substrate P on the plate holder 9 as described above, a predetermined exposure can be performed at a suitable position on the substrate P with high accuracy, and reliability can be achieved. High exposure processing.

Next, the unloading operation of the substrate P from the plate holder 9 after the exposure process is described will be described.

Specifically, the method of carrying out the substrate P by the carrying-out robot arm 205 is demonstrated. Fig. 48 is a perspective view for explaining the movement of the robot arm 205, and Figs. 49A, 49B, and 49C are sectional structural views when the substrate P is viewed from the Y-axis direction when the substrate P is carried out from the plate holder 9. Note that only the fork portion 12 is shown in FIG. 48, and the overall configuration of the carry-out robot arm 205 is omitted. In this embodiment, the substrate supporting portion in the fork portion 12 is different from the above-mentioned embodiment in correspondence with the shape of the jacking mechanism 150. 49A, 49B, and 49C are simplified illustrations of the fork portion 12 of the support substrate P for convenience of explanation.

After the exposure process is completed, the suction through the opening K205 of the vacuum pump is released to release the suction of the substrate P by the plate holder 9. Next, the jacking mechanism 150 drives the shaft portion 155 to raise the substrate supporting member 151. At this time, as shown in FIG. 49A, the substrate P, which is placed on the substrate mounting portion 31 together with the substrate supporting member 151, is lifted upward. At this time, since the substrate P is supported by a plurality of substrate support members 151 and is pushed upward, it is possible to prevent the occurrence of peeling charging. In addition, since the substrate P can be supported on a wider surface than the conventional case where the substrate P is pushed up by pins, the amount of deflection generated by the substrate P can be reduced, and cracks can be prevented from occurring on the substrate P.

The robot arm 205 is carried out to drive the fork 12, and as shown in FIG. 48, the fork 12 is moved from the −Y direction side to the gap S and the X-axis direction both ends of the substrate supporting mechanism 151 disposed above the substrate mounting portion 31 The fork portion 12 is inserted into the gap S and both end portions (FIG. 49B).

Next, the driving device 13 moves the fork portion 12 upward by a predetermined amount so that the fork portion 12 abuts on the lower surface of the substrate P. By further moving the fork portion 12 upward, the substrate P is lifted above the plate holder 9 and separated from the lift mechanism 150.

The jacking mechanism 150 receives the substrate support member 151 in the recess 130 after the substrate P is separated. After the substrate supporting member 151 is housed in the recess 130, the plate holder 9 is moved close to the loading table 40 of the carry-in portion 4, and the substrate P is transferred to the plate holder 9 side as described above.

While the substrate P is being transferred from the carrying-in portion 4 to the plate holder 9, the carrying-out robot arm 205 moves the substrate P placed on the fork portion 12 into a coating and developing machine (not shown). As described above, the unloading operation of unloading the substrate P from the exposure apparatus body 3 is completed.

As described above, according to the present embodiment, since the substrate P supported by the suspension can be slid and transferred from the carry-in portion 4 to the plate holder 9, it is possible to prevent the substrate P from being displaced or deformed. In addition, similarly in the present embodiment, the overall production time required for carrying in and out of the substrate P of the plate holder 9 can be approximately the same as in the case of using a conventional tray. Therefore, the substrate P can be carried into the plate holder 9 in a good state without increasing the lead time when the substrate P is carried in and out.

In addition, in the above embodiment, the case where the opening portion K205 as the gas injection port is formed only on the substrate mounting portion 31 has been described. However, the gas injection port can also be formed on the substrate supporting member 151. In this way, when the substrate P is carried into the plate holder 9, the amount of gas sprayed onto the substrate transfer surface is increased, so that the substrate P can be transferred more smoothly.

(Tenth embodiment)

Next, the structure of the tenth embodiment of the present invention will be described. In this embodiment, the same reference numerals are given to the same components as those of the sixth embodiment, and descriptions thereof are omitted. The main difference between the tenth embodiment and the above-mentioned embodiment is that a suction mechanism that sucks the substrate P in a non-contact state is provided as a means for removing the substrate P from the plate holder 9.

The suction mechanism is used to hold the substrate P, and lifts the substrate P upward from the substrate mounting portion 31 of the plate holder 9 to move it to a coating and developing machine (not shown). FIG. 50A is a diagram showing the structure of the adsorption surface, and FIG. 50B is a diagram showing the entire structure of the adsorption mechanism.

As shown in FIGS. 50A and 50B, the suction mechanism 350 includes a plurality of holding portions 351 that hold the substrate P in a non-contact state, a base portion 352 that holds the holding portions 351, and a driving mechanism 355 that can move the base portion 352. The base portion 352 is a plate-shaped member having a size substantially equal to that of the substrate P. The holding portions 351 are regularly arranged on the base portion 352, whereby the substrate P can be held well.

As the holding portion 351, a so-called Benui chuck is used. The holding portion 351 ejects compressed air between the holding portion 351 and the substrate P so that a negative pressure is generated between the holding portion 351 and the substrate P. Thereby, a pressing force is generated to press the substrate P on the holding portion 351 side. On the other hand, when the gap between the holding portion 351 and the substrate P becomes smaller, the flow velocity of the compressed air decreases, and the pressure between the holding portion 351 and the substrate P increases. As a result, a force for separating the substrate P from the holding portion 351 is generated. The holding portion 351 is configured to achieve a balance between the two forces described above by spraying compressed air, whereby the substrate P and the holding portion 351 can be held at a constant state, that is, the substrate P is held in a non-contact state.

Next, the operation of the exposure apparatus 1 will be described with reference to the drawings. The transfer operation of the substrate P between the carry-in unit 4 and the plate holder 9 is the same as the first embodiment, and therefore description thereof is omitted.

The operation of carrying out the substrate P from the plate holder 9 will be described below. Specifically, a method for carrying out the substrate P from the plate holder 9 by the suction mechanism 350 will be described. 51A and 51B are side views when the operation of carrying out the substrate P from the plate holder 9 is viewed from the X-axis direction.

After the exposure process is completed, the suction of the suction hole K1 of the vacuum pump is released to release the suction of the substrate P by the plate holder 9. Next, the adsorption mechanism 350 is moved above the plate holder 9. Next, as shown in FIG. 51A, the suction mechanism 350 is lowered to a position where the holding portion 351 can hold the substrate P. Next, the upper surface of the substrate P is held in a non-contact state by the plurality of holding portions 351. At this time, the plurality of holding portions 351 can be driven simultaneously or sequentially to hold the substrate P.

The suction mechanism 350 is configured to hold the substrate P by a plurality of holding portions 351, and the driving mechanism 355 lifts the substrate P to the top of the plate holder 9, and leaves the substrate P from the substrate placing portion 31 as shown in FIG. 51B. At this time, since the holding portion 351 is in non-contact with the substrate P, there is no residual adsorption mark on the substrate P.

After the suction mechanism 350 is raised to a position where it does not contact the substrate P on the carrying-in stage 40, the carrying-in stage 40 of the carrying-in unit 4 moves to approach the plate holder 9. Next, in the same manner as in the above-mentioned embodiment, the substrate P is transferred from the loading table 40 to the plate holder 9 in a suspended state.

While the substrate P is being carried in from the carrying-in portion 4 to the plate holder 9, the suction mechanism 350 moves the substrate P held by the holding portion 351 to a coating and developing machine (not shown). In the above manner, the unloading operation of the substrate P from the exposure apparatus body 3 is completed.

In addition, as shown in FIGS. 52A and 52B, a support member 353 under the support substrate P can also be provided around the base portion 352. The support member 353 is formed of a frame-like member surrounding the periphery of the substrate P, and has a plurality of protruding portions 354 protruding in the surface direction of the substrate P. The protruding portion 354 is in contact with the lower surface of the substrate P. With this structure, when holding a large substrate that is likely to cause the substrate P to collapse, the peripheral end portion of the substrate P is supported by the protruding portion 354, so that the substrate P can be prevented even when the large substrate is held. Indentation occurs and the substrate P can be held in a high flatness state by the holding portion 351.

In addition, as the substrate P of the above embodiment, not only a glass substrate for a display element, but also a semiconductor wafer for manufacturing a semiconductor element, a ceramic wafer for a thin-film magnetic head, or a mask or a reticle used for an exposure device. The original version of the film (synthetic quartz, silicon wafer), etc.

In addition, as the exposure device, in addition to a scanning type exposure device of a step-and-scan method that can be adapted to move the mask M and the substrate P in synchronization to perform scanning exposure of the substrate P through the exposure light IL on the pattern of the mask M ( In addition to the scanning stepper), it can also be applied to projection exposure in a step-and-repeat manner in which the pattern of the mask M is exposed once while the mask M and the substrate P are stationary. Device (stepper).

In addition, the present invention can also be applied to a dual-stage type exposure apparatus having a plurality of substrate stages as disclosed in US Patent No. 6341007, US Patent No. 6208407, and US Patent No. 6262796.

In addition, the present invention can also be applied to a substrate stage provided with a holding substrate as disclosed in U.S. Patent No. 6897963, European Patent Application No. 1713113, and a reference member having a reference mark formed thereon without holding the substrate, and / Or an exposure device for a measuring stage of various optical sensors. Further, an exposure device having a plurality of substrate stages and measurement stages may be used.

In addition, in the above-mentioned embodiment, although a light-transmitting photomask in which a predetermined light-shielding pattern (or a phase pattern or a light-reduction pattern) is formed on a light-transmitting substrate is used, instead of this photomask, for example, a US invention patent According to the publication No. 6778257, a variable shape photomask (also called an electronic photomask, an active photomask, or an image generator) that forms a transmission pattern or a reflection pattern, or forms a light emission pattern according to the electronic data of the pattern to be exposed. In addition, instead of a variable-shaped mask provided with a non-emission type image display element, a pattern forming device including a self-emission type image display element may be provided.

The exposure apparatus of the above embodiment is manufactured by assembling various sub-systems (including each constituent element) so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. To ensure these various precisions, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are used to achieve electrical accuracy. Adjustment. The assembly process from various sub-systems to exposure devices includes mechanical connections, wiring connections for circuits, and piping connections for pneumatic circuits. Of course, before the assembly process from the various sub-systems to the exposure device, there is an individual assembly process for each sub-system. After the assembly process from the various sub-systems to the exposure device is completed, comprehensive adjustments are performed to ensure the overall accuracy of the exposure device EX. In addition, it is preferable to manufacture the exposure device in a clean room where temperature and cleanliness are managed.

Microelements such as semiconductor elements, as shown in FIG. 53, are subjected to the step 201 of designing the function and performance of the microelement, and the step 202 of making a photomask (reticle) according to this design step, and manufacturing the substrate of the element substrate Step 203 includes performing substrate processing (exposure) according to the above embodiment. Light processing includes a substrate processing step 204 including an operation of exposing a substrate with an exposure light using a mask pattern and an operation of developing a substrate after the exposure, and a component assembly step (including a cutting step, a bonding step, a packaging step, and the like). ) 205, and check step 206 and the like. In addition, in step 204, an exposure pattern layer (layer of developed photosensitizer) corresponding to the pattern of the photomask is formed by developing the photosensitive agent, and the substrate is processed through the exposure pattern layer.

In addition, the requirements of each of the above embodiments and modifications can be appropriately combined. In addition, there are cases where some components are not used. In addition, to the extent permitted by laws and regulations, all the publications of the exposure devices and the like cited in each of the above-mentioned embodiments and modifications and the disclosure of the US patent are incorporated as part of the description in this document.

Claims (24)

A conveying device includes: a first support section for supporting a first object; a carry-out section for carrying out the first object supported by the first support section; and a second support section for non-contactly supporting a difference from the first object. A second object; a driving unit that aligns the first support portion and the second support portion such that the first support portion and the second support portion are aligned in a predetermined direction after the first object is carried out by the carrying-out portion; At least one of the support portions is moved; and the carry-in portion moves the second object, which is supported by the second support portion in a non-contact manner, relative to the second support portion in the predetermined direction, and moves the second object toward the first portion. The first support portion is carried in after one object is carried out, and the first support portion supports non-contact portions of the second object outside the area supported by the second support portion without contact. The conveying device according to item 1 of the scope of patent application, wherein the carrying-in portion is configured to face the second object supported by at least one of the first support portion and the second support portion in a non-contact manner in the predetermined direction. The second object is moved from the second support portion to the first support portion by moving. The conveying device according to item 1 of the scope of patent application, wherein the drive section moves one of the first support section and the second support section relative to the other support section in an up-down direction relative to the other support section, so that the drive section The first support portion and the second support portion are arranged in the predetermined direction. The conveying device according to item 1 of the scope of patent application, wherein the driving section moves one of the first supporting section and the second supporting section in the predetermined direction to be arranged to approach or contact the first supporting section. The first support portion and the other support portion of the second support portion. The conveying device according to any one of claims 1 to 4, further comprising: a third support section that supports the first object that is carried out from the first support section by the carrying-out section, and the carrying-out The first object is relatively moved relative to the first support part, and the first object is carried out from the first support part to the third support part. The conveying device according to item 5 of the scope of patent application, wherein the driving section moves the first support section so as to be aligned with the third support section in the predetermined direction. The conveyance device according to item 5 of the scope of patent application, wherein the third support portion can support the first object in a non-contact manner. The conveying device according to any one of claims 1 to 4, wherein the carrying-in portion is provided on the second support portion. The conveying device according to any one of claims 1 to 4, wherein the first support section further includes: an adjusting section that adjusts the second object moved into the first section by the moving section. Location of the support. The conveyance device according to item 9 of the scope of patent application, wherein the first support portion further includes an adjustment portion that adjusts a position of the second object carried in by the carry-in portion with respect to the first support portion. The conveyance device according to item 9 of the scope of the patent application, wherein the first support section sucks and supports the second object that has been carried in. An exposure device for exposing an object with exposure light, comprising: the conveying device according to any one of claims 1 to 11 of the scope of application for a patent, the second object being supported by the second supporting part toward the second object; The irradiation area of the exposure light moves. The exposure apparatus according to item 12 of the scope of patent application, wherein the aforementioned object is a substrate for a flat panel display device. The exposure device according to item 13 of the scope of patent application, wherein the size of at least one side of the substrate is 500 mm or more. A method for manufacturing a component, comprising: using an exposure device described in item 12 of the scope of the patent application, to perform an exposure of an object before being coated with a photosensitive material, and a pattern is transferred to the object; An operation of developing the photosensitive material to form an exposure pattern layer corresponding to the pattern; and an operation of processing the object through the exposure pattern layer. A conveying method comprising: an operation of unloading a first object supported by a first supporting portion; and a second portion of the first supporting portion and a second object supporting a second object different from the first object after the first object is removed. An operation in which at least one of the first support portion and the second support portion is moved so that the support portions are arranged in a predetermined direction; and the second object supported by the second support portion in a non-contact manner with respect to the aforementioned The movement of the second support portion in the predetermined direction to move the second object to the first support portion after the first object is carried out. When the moving operation is carried in by the loading operation, A part of the second object outside the area supported by the second support portion in a non-contact manner is supported by the first support portion in a non-contact manner, so that the one support portion is moved. The conveying method according to item 16 of the scope of patent application, wherein the second object is relatively moved relative to at least one of the first supporting portion and the second supporting portion during the loading operation, and the aforementioned The second object is carried into the first support portion. The conveying method according to item 16 of the scope of patent application, wherein the moving operation is to move one of the first support portion and the second support portion in a vertical direction relative to the other support portion, The first support portion and the second support portion are arranged in the predetermined direction. The conveying method according to item 16 of the scope of patent application, wherein the moving operation is to move one of the first support portion and the second support portion to the predetermined direction so as to line up or contact the support portion. The other support portion of the first support portion and the second support portion. The conveying method according to any one of claims 16 to 19 of the scope of patent application, wherein the unloading operation is to unload the first object supported by the first supporting portion to a third supporting portion. The conveying method according to item 20 of the scope of patent application, further comprising: an operation of moving the first support portion so that the first support portion and the third support portion are arranged in a predetermined direction; and The operation of the third support portion to non-contactly support a portion of the first object outside the area that is non-contactly supported by the first support portion. The conveying method according to item 16 of the scope of patent application, further comprising: an operation of adjusting a position of the second object carried into the first support portion. The conveying method according to item 22 of the scope of patent application, further comprising an operation of sucking and supporting the second object carried in by the first support portion. An exposure method for exposing an object with exposure light, comprising: the conveying method according to any one of claims 16 to 23 of the scope of application for a patent, wherein the second object supported by the second support section is moved toward the second object; The irradiation area of the exposure light moves.