CN102763209A - Transfer apparatus, transfer method, exposure apparatus, and device manufacturing method - Google Patents
Transfer apparatus, transfer method, exposure apparatus, and device manufacturing method Download PDFInfo
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- CN102763209A CN102763209A CN2011800098150A CN201180009815A CN102763209A CN 102763209 A CN102763209 A CN 102763209A CN 2011800098150 A CN2011800098150 A CN 2011800098150A CN 201180009815 A CN201180009815 A CN 201180009815A CN 102763209 A CN102763209 A CN 102763209A
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
- B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
- B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
- B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
Abstract
Disclosed is a transfer apparatus which is provided with: a first supporting section (3), which supplies a gas to one surface of a substrate, and which can float and support the substrate by means of the gas; a second supporting section (400), which can support said surface of the substrate; a drive section (402), which moves the first supporting section and/or the second supporting section, and which arranges the first and the second supporting sections in the first direction by having the supporting sections close to or in contact with each other; and a transfer section, which moves the substrate supported by the first supporting section or the second supporting section to the other supporting section along the first direction, said first supporting section and second supporting section being arranged by the drive section.
Description
Technical field
The invention relates to carrying device, transport method, exposure device and manufacturing method.
The application's case is according to No. the 61/305th, 355, the temporary transient application of the U.S. of carrying the Shen on February 17th, 2010, reaches the opinion priority 61/305, No. 439, and its content is applied at this.
Background technology
In the technology of electronic components such as flat panel display, be to use the processing unit of large substrates such as exposure device or testing fixture.In using the step of exposure of these processing unit, inspection step, be to use in order to large substrate (for example glass substrate) conveyance to processing unit as being disclosed in the carrying device of following patent documentation.
[patent documentation]
[patent documentation 1] TOHKEMY 2001-100169 communique
Summary of the invention
In the carrying device of above-mentioned large substrate; Because of being understood the layer of Jie between substrate and the substrate maintaining part when the substrate maintaining part is transferred by the substrate of supporting member for substrate supporting at air; So the substrate that has sometimes after the transfer produces distortion, or substrate carries the situation that offset moves to the seated position generation of carrying on the substrate maintaining part.If the generation of the substrate after transferring a year offset moves or is out of shape, then for example can produce and to carry out ill-exposed problems such as set exposure to the suitable correct position on the substrate in the exposure device.When producing carrying that an offset moves or when being out of shape, for example through carrying out the transfer of substrate again, can producing the problem that the processing of substrate is delayed of substrate in order to remove this problem.Again, if after transfer, do not make the layer of air residual and for example reduce the transfer speed of substrate, then can produce the problem that the processing of substrate is delayed more.
Aspect of the present invention, its purpose be to provide can do not produce carry that offset moves or the situation of being out of shape under carry out the transfer of substrate carrying device, transport method, exposure device and manufacturing method.
According to the 1st aspect of the present invention, provide a kind of carrying device, it possesses: the 1st support, to a supply gas of substrate, can be through this gas suspension supporting aforesaid base plate; The 2nd support can support the aforementioned one side of aforesaid base plate; Drive division, at least one that makes the aforementioned the 1st and the 2nd support moves, and makes the closer to each other or contact of the 1st and the 2nd support and is arranged in the 1st direction; And handover portion, the aforesaid base plate that a side of the aforementioned the 1st and the 2nd support that will arrange through aforementioned drive division is supported is along aforementioned the 1st direction toward the opposing party's side shifting.
According to the 2nd aspect of the present invention, provide a kind of carrying device, it possesses: the 1st support, to a supply gas of substrate, can be through this gas suspension supporting aforesaid base plate; The the 2nd and the 3rd support can support the aforementioned one side of aforesaid base plate; The 1st drive division, at least one that makes the aforementioned the 1st and the 2nd support moves, and makes the closer to each other or contact of the 1st and the 2nd support and is arranged in the 1st direction; The 2nd drive division, at least one that makes the aforementioned the 1st and the 3rd support moves, and makes the closer to each other or contact of the 1st and the 3rd support and is arranged in the 2nd direction; The 1st handover portion will be arranged in aforesaid base plate that aforementioned the 2nd support of aforementioned the 1st support supported along aforementioned the 1st direction toward aforementioned the 1st support side shifting through aforementioned the 1st drive division; The 2nd handover portion will be arranged in aforesaid base plate that aforementioned the 1st support of aforementioned the 3rd support supported along aforementioned the 2nd direction toward aforementioned the 3rd support side shifting through aforementioned the 2nd drive division.
According to the 3rd aspect of the present invention; Provide a kind of transport method; The conveyance substrate; It comprises: enable pass is crossed the one side gas supplied of aforesaid base plate is moved with the 1st support of the supporting aforesaid base plate that suspends and at least one side of the 2nd support that can support the aforementioned one side of aforesaid base plate, so that the 1st and the 2nd support is closer to each other or contact and be arranged in the action of the 1st direction; And the action of aforesaid base plate that a side of the aforementioned the 1st and the 2nd support of being arranged is supported along aforementioned the 1st direction toward the opposing party's side shifting.
According to the 4th aspect of the present invention; Provide a kind of transport method; The conveyance substrate; It comprises: enable pass is crossed the one side gas supplied of aforesaid base plate is moved with the 1st support of the supporting aforesaid base plate that suspends and at least one side of the 2nd support that can support the aforementioned one side of aforesaid base plate, so that the 1st and the 2nd support is closer to each other or contact and be arranged in the action of the 1st direction; The action of the aforesaid base plate that aforementioned the 2nd support that is arranged in aforementioned the 1st support is supported along aforementioned the 1st direction toward aforementioned the 1st support side shifting; At least one side of the 3rd support who makes aforementioned the 1st support and can support the aforementioned one side of aforesaid base plate moves, so that the 1st and the 3rd support is closer to each other or contact and be arranged in the action of the 2nd direction; And the action of the aforesaid base plate that supported of aforementioned the 1st support that will be arranged in aforementioned the 3rd support along aforementioned the 2nd direction toward aforementioned the 3rd support side shifting.
According to the 5th aspect of the present invention, provide a kind of carrying device, it possesses: the 1st support, to a supply gas of substrate, can be through this gas suspension supporting aforesaid base plate; The 2nd support can support the aforementioned one side of aforesaid base plate; Drive division, at least one that makes the aforementioned the 1st and the 2nd support moves, and makes the closer to each other or contact of the 1st and the 2nd support and arranges; Handover portion, the aforesaid base plate that will be supported through aforementioned the 2nd support that aforementioned drive division is arranged is along aforementioned orientation toward aforementioned the 1st support side shifting; Jacking mechanism, through stopping the supply of aforementioned gas, a carrying places the aforesaid base plate that carries the portion of putting and the past top jack-up of putting portion this year of aforementioned the 1st support; And take out of mechanism, will be supported in the aforesaid base plate of putting the portion top in aforementioned year through this jacking mechanism and take out of from aforementioned the 1st support.
According to the 6th aspect of the present invention; Provide a kind of transport method; The conveyance substrate; It comprises: enable pass is crossed the one side gas supplied of aforesaid base plate is moved with the 1st support of the supporting aforesaid base plate that suspends and at least one side of the 2nd support that can support the aforementioned one side of aforesaid base plate, so that the 1st and the 2nd support is closer to each other or the contact and the action of arranging; The action that the aforesaid base plate that aforementioned the 2nd support of being arranged is supported send along aforementioned orientation toward aforementioned the 1st support sidesway; Through stopping the supply of aforementioned gas, a carrying places the aforesaid base plate that carries the portion of putting and the past action of putting the top jack-up of portion this year of aforementioned the 1st support; And will be supported in the action that the aforesaid base plate above the portion of putting in aforementioned year is taken out of from aforementioned the 1st support.
According to the 7th aspect of the present invention, provide a kind of exposure device, make base plate exposure with exposure light, it possesses: keep aforesaid base plate and make aforesaid base plate move to the above-mentioned carrying device of the irradiation area of aforementioned exposure light.
According to the 8th aspect of the present invention, provide a kind of manufacturing method, it comprises: use the action of above-mentioned exposure device in aforesaid base plate transfer printing aforementioned pattern; And the action that the aforesaid base plate of aforementioned pattern is arranged according to this pattern machining transferring.
According to aspect of the present invention, can do not produce carry that offset moves or the situation of being out of shape under carry out the transfer of substrate.
Description of drawings
Fig. 1 is the cross sectional plan view of the whole summary of demonstration exposure device.
Fig. 2 is for showing the stereoscopic figure of the concrete formation in the chamber.
Fig. 3 A is the figure that display panel keeps the periphery of tool to constitute.
Fig. 3 B is the figure that display panel keeps the periphery of tool to constitute.
The figure that Fig. 4 A constitutes for the main position that shows the portion that moves into.
The figure that Fig. 4 B constitutes for the main position that shows the portion that moves into.
The figure that Fig. 5 A constitutes for the main position that shows the portion that takes out of.
The figure that Fig. 5 B constitutes for the main position that shows the portion that takes out of.
Fig. 6 is for explaining that substrate is to moving into the figure with the transfer step of platform.
Fig. 7 A is plate maintenance tool and the key diagram of taking out of the conveyance step of the substrate between portion.
Fig. 7 B is plate maintenance tool and the key diagram of taking out of the conveyance step of the substrate between portion.
Fig. 8 is shown in the figure that moves into the state that is supported with substrate with suspending on the platform.
Fig. 9 moves into the figure with the step of the substrate on the platform for the explanation conveyance.
Figure 10 keeps the figure of the step of tool side for explanation substrate transfer to plate.
Figure 11 is illustrated in plate to keep tool to upload the figure of the state that is equipped with substrate.
Figure 12 is for explaining that substrate is to taking out of the figure with the transfer step of platform.
Figure 13 is shown in the figure that takes out of the state that is supported with substrate with suspending on the platform.
Figure 14 A keeps tool toward the figure that takes out of the substrate transferring of portion's side for the explanation slave plate.
Figure 14 B keeps tool toward the figure that takes out of the substrate transferring of portion's side for the explanation slave plate.
Figure 14 C keeps tool toward the figure that takes out of the substrate transferring of portion's side for the explanation slave plate.
Figure 15 from the portion of taking out of the figure of the action of substrate for explanation.
Figure 16 A is the figure of the formation of the portion that moves into of demonstration the 2nd example.
Figure 16 B is the figure of the formation of the portion that moves into of demonstration the 2nd example.
Figure 17 is for explaining from moving into portion keeps the formation of tool side conveyance substrate toward plate figure.
Figure 18 is for being connected in the figure of the step of Figure 18 in order to explanation.
The figure that Figure 19 keeps tool to constitute for the plate that shows the 3rd example.
Figure 20 A is for explaining from moving into portion keeps the formation of tool side conveyance substrate toward plate figure.
Figure 20 B is for explaining from moving into portion keeps the formation of tool side conveyance substrate toward plate figure.
Figure 21 is the figure of the formation of demonstration the 4th example.
Figure 22 A is the figure of the transfer action of the substrate of explanation the 4th example.
Figure 22 B is the figure of the transfer action of the substrate of explanation the 4th example.
Figure 22 C is the figure of the transfer action of the substrate of explanation the 4th example.
Figure 22 D is the figure of the transfer action of the substrate of explanation the 4th example.
Figure 23 is the stereogram of the formation of the chamber interior of demonstration the 5th example.
Figure 24 A is for showing the vertical view of taking out of into the summary formation of portion.
Figure 24 B is for showing the vertical view of taking out of into the summary formation of portion.
Figure 25 is the figure that moves into step of the substrate of explanation the 5th example.
Figure 26 is for explaining the figure that keeps the substrate of tool side to transfer into portion toward plate from taking out of.
Figure 27 keeps tool toward taking out of the figure that transfers into the substrate of portion's side for the explanation slave plate.
Figure 28 is the cross sectional plan view of the whole summary of demonstration exposure device.
Figure 29 is for showing the stereoscopic figure of the concrete formation in the chamber.
Figure 30 A is the figure that display panel keeps the periphery of tool to constitute.
Figure 30 B is the figure that display panel keeps the periphery of tool to constitute.
Figure 31 A is plate maintenance tool and the key diagram of taking out of the conveyance step of the substrate between portion.
Figure 31 B is plate maintenance tool and the key diagram of taking out of the conveyance step of the substrate between portion.
Figure 32 is shown in the figure that moves into the state that is supported with substrate with suspending on the platform.
Figure 33 moves into the figure with the step of the substrate on the platform for the explanation conveyance.
Figure 34 keeps the figure of the step that the tool sidesway carries to plate for the explanation substrate.
Figure 35 is for taking out of the figure of the action of robotic arm in order to explanation.
Figure 36 A takes out of the front view of the action of substrate for the explanation slave plate keeps tool.
Figure 36 B takes out of the front view of the action of substrate for the explanation slave plate keeps tool.
Figure 37 takes out of the end view of the action of substrate for the explanation slave plate keeps tool.
The figure that Figure 38 constitutes for the portion of moving into that shows the 3rd example.
Figure 39 A is for explaining from moving into portion keeps the formation of tool side conveyance substrate toward plate figure.
Figure 39 B is for explaining from moving into portion keeps the formation of tool side conveyance substrate toward plate figure.
Figure 40 is the figure of the formation of the exposure device body of demonstration the 4th example.
Figure 41 keeps the figure that overlooks formation of tool for display panel.
Figure 42 A is the sectional side view that plate keeps tool.
Figure 42 B is the sectional side view that plate keeps tool.
Figure 43 is for showing the figure of the formation of moving portion up and down.
Figure 44 A is for explaining from moving into portion keeps the formation of tool side conveyance substrate toward plate figure.
Figure 44 B is for explaining from moving into portion keeps the formation of tool side conveyance substrate toward plate figure.
Figure 45 is shown in the figure that moves into the state of suspension supporting substrates on the platform.
Figure 46 meets the figure of the state of the end that is in substrate for showing abutting part.
Figure 47 moves to the figure that plate keeps the step of tool for the explanation substrate from moving into platform.
Figure 48 is for taking out of the stereogram of the action of mechanical arm in order to explanation.
Figure 49 A is that slave plate keeps tool to take out of the key diagram of the step of substrate.
Figure 49 B is that slave plate keeps tool to take out of the key diagram of the step of substrate.
Figure 49 C is that slave plate keeps tool to take out of the key diagram of the step of substrate.
Figure 50 A is the vertical view of the formation of the adsorbing mechanism of demonstration the 5th example.
Figure 50 B is the end view of the formation of the adsorbing mechanism of demonstration the 5th example.
Figure 51 A takes out of the end view of the action of substrate for the explanation slave plate keeps tool.
Figure 51 B takes out of the end view of the action of substrate for the explanation slave plate keeps tool.
Figure 52 A is the figure of the formation of the variation of demonstration adsorbing mechanism.
Figure 52 B is the figure of the formation of the variation of demonstration adsorbing mechanism.
Figure 53 is the flow chart in order to technology one example of explanation micro element.
Drawing reference numeral:
The P substrate
K1, K4, K6, K8 attracts the hole
K2, K3, K5, K7 gas jetting hole
The K205 peristome
1 exposure device
4,104 move into portion
5 take out of portion
9,109 plates keep tool
12 fork portions
19 position probing sensors
33 the 1st travel mechanisms
40,140 move into and use platform
42,149,249 the 1st handover portions
43 the 2nd travel mechanisms
50 take out of and use platform
52 the 2nd handover portions
53 the 3rd travel mechanisms
142 rollers
148 roller mechanisms
150 jacking mechanisms
205 take out of mechanical arm
250 adsorption sections
251 maintaining parts
252 position probing sensors
350 adsorbing mechanisms
351 maintaining parts
401 substrate-placing platforms
405 handover portions
408 adsorption sections
Embodiment
With reference to graphic explanation example of the present invention.In addition, the present invention is not limited thereto.Below, explain to possess carrying device of the present invention and carry out the exposure-processed exposure device of (to being coated with the base plate exposure used for liquid crystal display element pattern of emulsion), and an example of transport method of the present invention and manufacturing method is described.
(the 1st example)
Fig. 1 shows the cross sectional plan view that the summary of the exposure device of this example constitutes.Exposure device 1 is as shown in Figure 1 to possess exposure device body 3 to base plate exposure used for liquid crystal display element pattern, move into portion 4, take out of portion 5, and these are by high cleaningization, and is accommodated in the chamber 2 that is adjusted to both fixed temperatures.In this example, substrate is the large glass plate, Yi Bian it is of a size of for example more than the 50mm.
Fig. 2 shows the stereoscopic figure of the concrete formation in the chamber 2.Exposure device body 3 is as shown in Figure 2, possess not shown illuminator with exposure light IL illumination mask M, keep being formed with the mask M of used for liquid crystal display element pattern not shown mask microscope carrier, be disposed at this mask microscope carrier below projection optical system PL, be set as and can keep the plate of tool to keep tool 9 and holding plate to keep tool 9 and make this plate keep tool 9 mobile the 1st travel mechanism 33 chamber 2 in as substrate what be disposed at that base portion (not shown) below the projection optical system PL goes up that two dimension moves.
In addition, below in the explanation, keep the two dimension of tool 9 to move in horizontal plane relative to the plate of the base portion of being located at chamber 2 (not shown) and carry out, set X axle and Y axle in mutually orthogonal directions in this horizontal plane.Plate keeps the maintenance face of 9 pairs of substrate P of tool, and is parallel with horizontal plane down in normal condition (state when for example carrying out the transfer of substrate P).Again, with the direction setting Z axle of X axle and Y axle quadrature, the optical axis of projection optical system PL is parallel to the Z axle.In addition, will be called θ directions X, θ Y direction and θ Z direction around all directions of X axle, Y axle and Z axle respectively.
The 1st travel mechanism 33 has travel mechanism's body 35 and is disposed on travel mechanism's body 35 and holding plate keeps the maintaining part 34 of tool 9.Travel mechanism's body 35 is supported on not shown guiding face (base portion) through gas bearing with the noncontact mode, can on guiding face, be displaced into the XY direction.Based on this kind formation, plate keeps tool 9 maintaining under the state of substrate P, in the set zone of light emitting side (the image planes side of projection optical system PL) at guiding face, moves.
Travel mechanism's body 35 can be displaced on guiding face in the XY plane through comprising the for example start of the coarse motion system of actuator such as linear motor.Maintaining part 34 can be through comprising the for example start of the fine motion system of actuator such as voice coil motor, and relative moving mechanism body 35 is displaced into Z axle, θ X, θ Y direction.Maintaining part 34 can be through comprising coarse motion system and fine motion system the start of baseplate carrier drive system, maintaining under the state of substrate P, be displaced into the six direction of X axle, Y axle, Z axle, θ X, θ Y and θ Z direction.
After the scan exposure of this exposure area finishes, make plate keep tool 9 to move the stepwise operation that both quantitatively reaches the scanning starting position of a time exposure area in directions X.Then, exposure device body 3, through carrying out this kind scan exposure and stepwise operation repeatedly, and in regular turn in the pattern of four exposure area transfer mask M.
Move into portion 4, as shown in Figure 2 possess and the coating developing machine (not shown) of configuration at adjacent exposure device 1 support when moving into the substrate P that is coated with emulsion this substrate P one side (below) move into platform 40 and mobile this and move into the 2nd travel mechanism 43 with platform 40.In addition, move into portion 4 and can adjust the temperature of moving into to moving into the substrate P of platform 40.
The 2nd travel mechanism 43 has travel mechanism's body 45 and is disposed on travel mechanism's body 45 and keeps moving into the maintaining part 44 with platform 40.Travel mechanism's body 45 is supported on not shown guiding face through gas bearing with the noncontact mode, can on guiding face, be displaced into the XY direction.Based on this kind formation, move into platform 40 and can move maintaining under the state of substrate P in the set zone at guiding face.In addition, the supporting of travel mechanism's body 45 of not shown relatively guiding face is not limited to the supporting of gas bearing, also can use the known guide mechanism different with gas bearing (driving mechanism of guiding face relatively).
Travel mechanism's body 45 is identical formation with above-mentioned travel mechanism body 35, can on guiding face, be displaced in the XY plane.Again, maintaining part 44 is identical formation with above-mentioned maintaining part 34, can be displaced into Z axle, θ X, θ Y direction by relative moving mechanism body 45.Maintaining part 44 can maintain under the state of substrate P, is displaced into the six direction of X axle, Y axle, Z axle, θ X, θ Y and θ Z direction.
Take out of portion 5, as shown in Figure 2 possess transfer the one side that supports this substrate P when imposing the substrate P of exposure-processed through exposure device body 3 (below) take out of with platform 50 and mobile this and take out of the 3rd travel mechanism 53 with platform 50.
The 3rd travel mechanism 53 has travel mechanism's body 55 and is disposed on travel mechanism's body 55 and keeps taking out of the maintaining part 54 with platform 50.Travel mechanism's body 55 is supported on not shown guiding face through gas bearing with the noncontact mode, can on guiding face, be displaced into the XY direction.Based on this kind formation, take out of with platform 50 and can move maintaining under the state of substrate P in the set zone at guiding face.
Travel mechanism's body 55 is identical formation with above-mentioned travel mechanism body 35,45, can on guiding face, be displaced in the XY plane.Again, maintaining part 54 is identical formation with above-mentioned maintaining part 34,44, can be displaced into Z axle, θ X, θ Y direction by relative moving mechanism body 55.Maintaining part 54 can maintain under the state of substrate P, is displaced into the six direction of X axle, Y axle, Z axle, θ X, θ Y and θ Z direction.
Secondly, keep the periphery of tool 9 to constitute with reference to Fig. 3 A and Fig. 3 B explanation plate.Fig. 3 A display panel keeps the figure that overlooks formation of tool 9, the figure that Fig. 3 B display panel keeps the side-looking of tool 9 to constitute.Shown in Fig. 3 A, keep tool 9 to be formed with in plate and carry the substrate-placing portion 31 of putting substrate P.It is good flatness that the top of substrate-placing portion 31 makes the essence maintenance face with 9 pairs of substrate P of plate maintenance tool.Moreover, above substrate-placing portion 31, be provided with a plurality of usefulness so that imitative proud this face of substrate P and the attraction hole K1 that is close to.Each attracts hole K1 to be connected in not shown vacuum pump.
Above substrate-placing portion 31, be provided with a plurality of through the gases such as following injection air of substrate P being passed through the gas jetting hole K2 of this gas suspension supporting substrates P again.Each gas jetting hole K2 is connected in not shown gas blowing and uses pump.In addition, attract hole K1 and gas jetting hole K2 to be configured to clathrate alternately.
Keep the periphery of tool 9 to be provided with when substrate P is moved in order to the guiding of guiding this substrate P in plate with pin 36 and the alignment pin 37 of regulation substrate P to the position of the substrate-placing portion 31 of plate maintenance tool 9 again.These guidings can keep tool 9 to move with plate in exposure device body 3 with pin 36 and alignment pin 37.
Plate keeps tool 9 shown in Fig. 3 B, possesses in its side surface part 9a to detect and move into platform 40 and take out of the position probing sensor 19 with the relative position of platform 50.Position probing sensor 19 comprise in order to detect move into relatively with platform 40 and take out of with the distance detecting of the relative distance of platform 50 with sensor 19a with move into platform 40 relatively and take out of with the height detection of the relative altitude of platform 50 and use sensor 19b in order to detect.In addition, in moving into platform 40 and taking out of, by this, prevent position probing sensor 19 and move into platform 40 and take out of with platform 50 interference with being formed with recess with position probing sensor 19 corresponding positions in the platform 50.
Secondly, explain that with reference to Fig. 4 A and Fig. 5 B the main position of moving into portion 4 constitutes.Fig. 4 A shows the vertical view of moving into the periphery formation of platform 40, and the A-A line arrow of Fig. 4 B displayed map 4A is looked the figure of section.
Shown in Fig. 4 A and 4B, move into portion 4 and be provided with substrate P from moving into the 1st handover portion 42 that keeps tool 9 handovers with platform 40 toward plate.The 1st handover portion 42 comprises guidance part 42a and the abutting part 42b that is connected to substrate P.
Above moving into, be formed with two groove shape recess 40a that form along a direction (the Y direction shown in this figure) with platform 40.In this recess 40a, be provided with above-mentioned guidance part 42a.In guidance part 42a, above-mentioned abutting part 42b to be installed from moving into state outstanding above the platform 40.Abutting part 42b is made up of elastic components such as for example rubber, in the time of lowering butt to the damage of substrate P.
Above moving into, be provided with a plurality of through the gases such as following injection air of substrate P being passed through the gas jetting hole K3 of this gas suspension supporting substrates P with platform 40 again.Each gas jetting hole K3 is connected in not shown gas blowing and uses pump.
Moreover, above moving into, be provided with a plurality of usefulness so that imitative proud this face of substrate P and the attraction hole K4 that is close to platform 40.Each attracts hole K4 to be connected in not shown vacuum pump.Gas jetting hole K3 is configured to clathrate with attracting hole K4 along the Y direction alternately.In addition, gas jetting hole K3 is not limited to the cancellate configuration of this kind with attracting hole K4, can also various form configurations (for example disposing alternately along the Y direction).Again, gas jetting hole K3 is not limited to setting independently of one another with attracting hole K4, also can same hole double as is gas jetting hole K3 and attract hole K4.Under this situation, can each hole can suitably be switched and be connected in gas blowing with pump and vacuum pump.
Again, be formed with through hole 47 in moving into platform 40, this through hole 47 can supply as the back said in order to and coating developing machine (not shown) between carry out the transfer of substrate P the substrate rest pin of actuation mechanism up and down insert logical.
Secondly, explain that with reference to Fig. 5 A and Fig. 5 B the major part of taking out of portion 50 constitutes.Shown in Fig. 5 A and Fig. 5 B, take out of portion 50 and keep tool 9 toward taking out of the 2nd handover portion 52 that transfers with platform 50 the substrate P slave plate.The 2nd handover portion 52 comprises guidance part 52a and adsorbs the adsorption section 52b that keeps substrate P.
Above taking out of, be formed with two groove shape recess 50a that form along a direction (the Y direction shown in this figure) with platform 50.In this recess 50a, be provided with above-mentioned guidance part 52a.In guidance part 52a, above-mentioned adsorption section 52b to be installed from taking out of with state outstanding above the platform 50.Adsorption section 52b comprises the vacuum suction pad that for example keeps substrate P through vacuum suction absorption.
Again, the 52b in the adsorption section is provided with when substrate is taken out of and slave plate keeps the abutting part 58 of the substrate P butt of tool 9 extrusions.This abutting part 58 is made up of elastic components such as for example rubber.
Above taking out of, be provided with a plurality of through the gases such as following injection air of substrate P being passed through the gas jetting hole K5 of this gas suspension supporting substrates P with platform 50 again.Each gas jetting hole K5 is connected in not shown gas blowing and uses pump.
Moreover, above taking out of, be provided with a plurality of usefulness so that imitative proud this face of substrate P and the attraction hole K6 that is close to platform 50.Each attracts hole K6 to be connected in not shown vacuum pump.In addition, gas jetting hole K5 is configured to clathrate alternately with attracting hole K6.
Again, be formed with through hole 57 in taking out of with platform 50, this through hole 57 can supply as the back said in order to and coating developing machine (not shown) between carry out the transfer of substrate P the substrate rest pin of actuation mechanism up and down insert logical.
Secondly, the action of exposure device 1 is described with reference to Fig. 6～Figure 15.Particularly, main explanation is moved into the transfer that transfer action and plate that portion 4 and plate keep the substrate P between the tool 9 keep tool 9 and take out of the substrate P between the portion 50 and is moved.In addition, in this example, move into portion 4 move into platform 40 with take out of taking out of of portion 5 and be disposed at the interior different position of same horizontal plane with platform 50.That is, move into platform 40 and be disposed at the position that does not overlap each other under the state (from shown in Figure 2+state that the Z direction is watched) overlooking with taking out of with platform 50.
At first, move into the substrate P that is coated with emulsion at coating developing machine (not shown) to moving into portion 4.At this moment, being positioned at the actuation mechanism of moving into the below of platform 40 up and down 49 is disposed at substrate rest pin 49a earlier through through hole 47 and moves into platform 40 tops.Secondly, between the arm 48 insertion substrate rest pin 49a as shown in Figure 6 of coating developing machine (not shown).Through arm 48 descend and with substrate P after substrate rest pin 49a transfer, recess from moving into portion 4.Actuation mechanism 49 finishes substrate P to moving into the action of moving into platform 40 through the substrate rest pin 49a that is supported with substrate P is descended up and down.Thereafter, through driving vacuum pump, substrate P is moved into above the platform 40 through attracting hole K4 to be adsorbed to remain in.
Secondly, plate keeps tool 9 shown in Fig. 7 A, to move near the mode of moving into platform 40 of moving into portion 4.Particularly, the 1st travel mechanism 33 keeps tool 9 with plate and moves into platform 40 to arrange along the approaching state of Y direction.Here, so-called plate keeps tool 9 and moves into the approaching state of platform 40, refer to after separated the mobile state that can smooth and easy distance of carrying out of substrate P during the transfer of the substrate P stated.
, arrangement can drive the 2nd travel mechanism 43 when moving into platform 40 and plate maintenance tool 9 again.So, can make to move into to keep tool 9 to move to the transfer position of substrate P, can shorten the required time of action of moving into of substrate P in the short time with platform 40 and plate.Under this situation, take out of with platform 50 and recess the position of moving into platform 40 to not interfering.
Again, therefore substrate P can prevent to move on substrate P is being moved into platform 40 when the driving of the 2nd travel mechanism 43 owing to move into above the platform 40 through attracting hole K4 to be adsorbed to remain in.
In this example, shown in Fig. 7 B, make move into platform 40 and plate keep tool 9 near the time, substrate P is configured to keep tool 9 height than plate.That is the 1st travel mechanism 33 makes plate keep tool 9 near moving into platform 40 to be supported with moving into the top of platform 40 of substrate P than high mode above the plate maintenance tool 9.In addition, also can make to move into and rise so that move into top top height than plate maintenance tool 9 with platform 40 through the 2nd travel mechanism 43 with platform 40.
In addition, the 1st travel mechanism 33 also can keep plate tool 9 and moves into platform 40 and under state of contact, arrange.So, the plate of stating after can successfully carrying out keeps tool 9 and moves into the transfer with the substrate P of 40 of platforms.
Secondly, move into platform 40 as shown in Figure 8ly, a plurality of gas jetting hole K3 jet gas above being formed at support substrate P through this gas with suspended state.On the other hand, plate keeps tool 9 when accessing substrate P, earlier a plurality of gas jetting hole K2 jet gas above being formed at.
Move into portion 4 substrate P is suspended be supported on move into the state on the platform 40 under, as shown in Figure 9 make abutting part 42b be connected to substrate P an end.Abutting part 42b keeps tool 9 side shiftings with substrate P toward plate through moving along the guidance part 42a in the recess 40a.
Because substrate P becomes and is suspended in the state of moving into on the platform 40, so abutting part 42b can make substrate P successfully slide into plate maintenance tool 9 sides.In addition, above the plate maintenance tool 9, become suspension supporting substrates P as stated., also can make from gas jetting hole K3, the gas that K2 sprays has directive property here.
Through the substrate P that abutting part 42b slides on move into platform 40, shown in figure 10, the top transfer successfully that keeps tool 9 toward plate.In this example, keep the top height of tool 9 than plate, so substrate P can keep under the situation of tool 9 sides transfer successfully on plate maintenance tool 9 at contact plate not owing to move into the top of platform 40.
Substrate P is as shown in Figure 9, be located at guiding that plate keeps tool 9 peripheries stipulate with pin 36 directions X in the figure the position slide in state moving.Abutting part 42b moves to substrate P and is connected to the alignment pin 37 of being located at substrate transferring direction downstream in the plate maintenance tool 9.Substrate P is guided with pin 36 and stipulates the position of directions X in the figure, and seizes the state that the position that becomes Y direction among this figure is stipulated on both sides by the arms through be positioned pin 37 and abutting part 42b.Plate keeps tool 9 to stop the gas blowing from gas jetting hole K2.Substrate P is shown in figure 11, under the state that substrate-placing portion 31 is alignd, is carried and puts.
In addition, in the past with substrate-placing when plate keeps tool, the offset of carrying that might produce substrate moves (from the offset of set year seated position) or substrate deformation.Produce one of reason that this year, offset moved, for example can consider and to put eve carrying of substrate and make substrate become floating state because of the thin air layer that between substrate and plate maintenance tool, produces.Again, make one of reason that substrate deformation produces, for example can consider carrying and keep between the tool Jie at air trapping and substrate becomes the state of expansion in substrate and plate after putting substrate.
With respect to this, in this example because substrate P such as above-mentioned under the state that the injection through gas suspends by conveyance, therefore under high flatness state, be handed over to plate distortionlessly and keep tool 9.Because from being put in 31 years toward substrate-placing portion by the height of suspension supporting, therefore can preventing terminating in, substrate P produces air trapping or air layer between substrate P and the substrate-placing portion 31 again.Therefore, can suppress substrate P becomes swelling state, prevents the generation that offset moves or is out of shape of carrying of substrate P.Therefore, can keep both allocations of tool 9 to carry in relative plate and put substrate P with the high state of flatness.Thereafter, through driving vacuum pump, substrate P promptly through attract hole K1 to be adsorbed to remain in substrate-placing portion 31 above.
After plate kept tool to put substrate P in 9 years, mask M was thrown light on the exposure light IL from illuminator.By the pattern of the mask M that throws light on exposure light IL, place plate to keep the substrate P of tool 9 to carrying through projection optical system PL projection exposure.
In the exposure device 1, place plate to keep therefore carrying out set exposure accurately in the appropriate location on substrate P, and realizing the exposure-processed that reliability is high on the tool 9 owing to can as described above substrate P be carried well.
In this example; Substrate P is being carried out in the exposure-processed; Or as after state during substrate P conveyance to the portion of taking out of 5 that exposure-processed is finished, can carry through the inferior substrate P that coating developing machine (not shown) is coated with emulsion and place the moving into of the portion of moving into 4 with on the platform 40.
Secondly, explain that exposure-processed finishes the back slave plate and keeps tool 9 to take out of the action of substrate P.
After exposure-processed finished, plate kept tool 9 shown in figure 12, to move near the mode of taking out of with platform 50 of taking out of portion 5.Particularly, the 1st travel mechanism 33 keeps tool 9 with plate and takes out of with platform 50 to arrange along the approaching state of Y direction.At this moment, therefore substrate P owing to through attracting hole K1 to be adsorbed maintenance, can prevent that substrate P moves when the driving of the 1st travel mechanism 33 in substrate-placing portion 31.
, arrangement can drive the 3rd travel mechanism 53 when taking out of with platform 50 and plate maintenance tool 9 again.So, can make to take out of to keep tool 9 to move to the transfer position of substrate P, can shorten taking out of the required time of action of substrate P in the short time with platform 50 and plate.Under this situation, move into platform 40 and recess the position of taking out of with platform 50 to not interfering.
In this example, plate keep tool 9 and take out of with platform 50 near the time, with make plate keep tool 9 and move into platform 40 near the time likewise, substrate P is configured to be equivalent to plate maintenance tool 9 height of the conveyance destination of substrate P.That is the 1st travel mechanism 33 keeps top the taking out of with mode high above the platform 50 of tool 9 to make plate keep tool 9 near taking out of with platform 50 so that be supported with the plate of substrate P.In addition, also can make to take out of and descend so that take out of top with platform 50 than low above the plate maintenance tool 9 through the 3rd travel mechanism 53 with platform 50.
The 1st travel mechanism 33 also can keep plate tool 9 and takes out of with platform 50 and under state of contact, arrange.So, the plate of stating after can successfully carrying out keeps tool 9 and takes out of the transfer with the substrate P of 50 of platforms.
Plate keeps tool 9 to stop the driving of vacuum pump, removes and passes through to attract the absorption maintenance of the substrate P of hole K1 to substrate-placing portion 31.Secondly, plate keeps tool 9 shown in figure 13, and a plurality of gas jetting hole K2 jet gas above being formed at substrate-placing portion 31 support substrate P through this gas with suspended state.On the other hand, take out of portion 5 when accessing substrate P, earlier from being formed at a plurality of gas jetting hole K5 jet gas of taking out of with above the platform 50.
Take out of portion 5 and the adsorption section 52b of the 2nd handover portion 52 is kept the substrate P side shifting of the supporting that suspends in the substrate-placing portion 31 of tool 9 along guidance part 52a toward plate.Alignment pin 37 is pushed the end that is suspended in the substrate P in the substrate-placing portion 31 shown in Figure 14 A.By this, the substrate P that is suspended in the substrate-placing portion 31 is moving toward taking out of with platform 50 sideslips, and shown in Figure 14 B, contacts the abutting part 58 that is installed on adsorption section 52b.So, moving through using alignment pin 37 that substrate P is breakked away toward abutting part 58, and need not make adsorption section 52b move to the position that keeps the substrate P subtend on the tool 9 with plate along sliding part 52a.Behind the end of substrate P contact abutting part 58, adsorption section 52b promptly adsorbs the maintenance substrate P, shown in Figure 14 C, moves along Y direction among this figure along guidance part 52a.
At this moment, because substrate P keeps the state on the tool 9 to be supported to be suspended in plate, so adsorption section 52b can make substrate P successfully slide into to take out of with platform 50 sides.Again, take out of, become suspension supporting substrates P as stated with above the platform 50., also can make from gas jetting hole K2, the gas that K5 sprays has directive property here.
The substrate P of on substrate-placing portion 31, sliding through moving of adsorption section 52b is toward taking out of the top transfer successfully with platform 50.In this example because plate keeps the top top height of taking out of with platform 50 of tool 9, so substrate P can do not contact take out of with the situation of platform 50 sides under transfer successfully on take out of with platform 50.
After mat adsorption section 52b makes the mobile end of substrate P, take out of with platform 50 and stop gas blowing from gas jetting hole K5, and through attracting K6 absorption in hole to keep substrate P.Take out of portion 5 and maintain under the state of substrate P, drive the 3rd travel mechanism 53, move toward the position of taking out of of substrate P taking out of with platform 50 in absorption.
In this example, will a time substrate P from move into portion 4 move into keep to plate tool 9 during, or this time substrate P is carried out exposure-processed during, take out of to carry to place and take out of the substrate P that the exposure-processed with platform 50 finishes.At this moment, being positioned at the actuation mechanism up and down 60 of taking out of with the below of platform 50 is disposed at substrate rest pin 60a through through hole 57 and takes out of with platform 50 tops.By this, substrate P is held in the top of taking out of with platform 50 because of being supported in substrate rest pin 60a.Secondly, between the arm 48 insertion substrate rest pin 60a shown in figure 15 of coating developing machine (not shown).Through substrate rest pin 60a descended substrate P be handed over to arm 48 thereafter.Arm 48, moving substrate P in coating developing machine (not shown) is to carry out development treatment.
As above-mentioned, plate keeps tool 9 through to moving into portion 4 and to take out of portion 5 mobile and continue alternately same horizontal plane (XY plane) in, to carry out substrate P taking out of into action exposure device body 3.In this example owing to keep the formation of tool 9 along the orientation movable plate of moving into portion 4 and taking out of portion 5, therefore can the short time carry out with plate keep tool 9 with move into portion 4 and take out of portion 5 be arranged near to or in contact with state.Therefore, can shorten take out of processing time (so-called the producing) of following substrate P apart from (Takt) into action.
According to this example; Keep tools 9 conveyances through making toward plates by the substrate P slip of suspension supporting and from moving into portion 4; Therefore generation air trapping or air layer between substrate P and the substrate-placing portion 31 can be prevented terminating in, the generation that offset moves or is out of shape of carrying of substrate P can be prevented.Therefore, can carry out the high exposure-processed of reliability.
In addition, in the 1st example, also can make the last face tilt of moving into platform 40 from moving into when keeping tool 9 conveyance substrate P toward plates with platform 40.Particularly, the maintaining part 44 of the 2nd travel mechanism 43 makes the moving into the top of platform 40 of state support substrate P to suspend from the gas blowing of gas jetting hole K3 keep tool 9 sides (θ Y) to tilt toward plate.By this, can utilize the deadweight of substrate P to make this substrate P keep tool 9 side shiftings toward plate.
Again, also can slave plate keep tool 9 make when taking out of with platform 50 conveyance substrate P plate keep tool 9 on face tilt.Particularly, the maintaining part 34 of the 1st travel mechanism 33 makes the plate with the state support substrate P that suspends from the gas blowing of gas jetting hole K2 keep the top toward taking out of with platform 50 sides (θ Y) of tool 9.By this, can utilize the deadweight of substrate P to make this substrate P toward taking out of with platform 50 side shiftings.
(the 2nd example)
Secondly, the formation of the 2nd example of the present invention is described.In addition, in this example, give prosign, to omit its explanation to the key element identical with the inscape of the 1st example.The 2nd example, formation and the 1st example of moving into the 1st handover portion 149 in the portion 104 are different.
Figure 16 A and Figure 16 B show the figure of formation of the portion that moves into 104 of this example, and Figure 16 A shows the figure that overlooks formation that moves into portion 104, and Figure 16 B shows the figure of the side section that A-A line arrow is looked among Figure 16 A that moves into portion 104.
The 1st handover portion 149 of the portion that moves into 104 of this example replaces through the suspend formation of supporting of the one side jet gas to substrate P and has roller mechanism 148 shown in Figure 16 A and 16B.
Moving into distolateral with platform 140, shown in Figure 16 A, be formed with a plurality of breach 141.Being supported with respectively in each breach 141 can be around the roller 142 of the above-mentioned roller mechanism 148 of formation of axle 143 rotation.Roller 142 can be through not shown driving mechanism rotation.Roller mechanism 148 is shown in Figure 16 B, and constituting roller 142 can contact substrate P or leave from substrate P.
According to this kind formation,,, and can this substrate P be kept tool 9 side shiftings toward plate Yi Bian make it to rotate on set direction Yi Bian roller mechanism 148 is moved into below the substrate P that is supported on the platform 140 through a plurality of rollers 142 are contacted with.As the formation material of roller 142, can use and substrate P between produce the elastic components such as for example rubber of big frictional force.Through using this kind elastic component to constitute roller 142, and can prevent damage (scar etc.) to substrate P.Above moving into, only be provided with above-mentioned attraction hole K4 with platform 140 again.
Secondly, the action of the exposure device 1 of this example is described.What particularly, narration and the 1st example were different is moving into the transfer action that portion 104 and plate keep the substrate P between the tool 9.
At first, move into the substrate P that is coated with emulsion at coating developing machine (not shown) to moving into portion 104.Substrate P is moved into above the platform 140 through attracting hole K4 to be adsorbed to remain in.Thereafter, plate keeps tool 9 to move (with reference to Fig. 7 A) near the mode of moving into platform 140.
Also likewise, preferably make plate keep tool 9 than high mode above the plate maintenance tool 9 in this example near moving into platform 140 (with reference to Fig. 7 B) to be supported with moving into of substrate P with the top of platform 140.
Yet; In this example; If move into platform 140 top than plate keep tool 9 above low, as long as keep the top height of tool 9 at least above the roller 142 than plate, can be with taking advantage of the substrate P that is stated from the roller 142 from moving into platform 140 sides toward the conveyance positively of plate maintenance tool 9 sides.
Secondly, move into platform 140 shown in figure 17ly, make the roller 142 of roller mechanism 148 be connected to the following of substrate P and rotate on set direction.On the other hand, plate keeps tool 9 when accessing substrate P, earlier a plurality of gas jetting hole K2 jet gas above being formed at.Substrate P is through keeping the slippage successfully of tool 9 sides with the frictional force of roller 142 toward plate.
Here, the conveyance destination of substrate P is that plate keeps tool 9, is supported in the substrate-placing portion 31 through by jet gas substrate P being suspended from gas jetting hole K2.
Therefore, through transfer successfully above the past plate maintenance of the substrate P of roller mechanism 148 slip on the move into tool 9 with platform 140.
Substrate P is shown in figure 18, be located at guiding that plate keeps tool 9 peripheries stipulate with pin 36 directions X in the figure the position slide in state moving.Roller mechanism 148 moves to substrate P and is connected to the alignment pin 37 of being located at substrate transferring direction downstream in the plate maintenance tool 9.Substrate P is guided with pin 36 and stipulates the position of directions X in the figure, and seizes the state that the position that becomes Y direction among this figure is stipulated on both sides by the arms through be positioned pin 37 and abutting part 42b.Plate keeps tool 9 to stop the gas blowing from gas jetting hole K3.Substrate P is carried under the state that substrate-placing portion 31 is alignd puts.
In this example also likewise; Because substrate P such as above-mentioned under the state that the injection through gas suspends by conveyance; Therefore can under high flatness state, be handed over to plate distortionlessly and keep tool 9, can prevent terminating in generation air trapping or air layer between substrate P and the substrate-placing portion 31.Therefore, can keep both allocations of tool 9 to carry in relative plate and put substrate P with the high state of flatness.Therefore, can carry out set exposure accurately in the appropriate location on substrate P, and can realize the exposure-processed that reliability is high.
In addition, the substrate P from plate maintenance tool 9 after exposure-processed finishes is taken out of action owing to identical with the 1st example, therefore omits its explanation.
In addition, in the above-mentioned explanation, though bright employing roller mechanism 148 as the 1st handover portion 149 that moves into portion 104, also can adopt roller mechanism as the 2nd handover portion 52 that takes out of portion 5.Move into platform 140 and also can likewise adopt formation with the 1st example through gas blowing suspension supporting substrates P again.Constitute through this and since substrate P under the state that suspends by roller mechanism 148 conveyances, therefore, can substrate P successfully be kept tool 9 side conveyances toward plate.
(the 3rd example)
Secondly, the formation of the 3rd example of the present invention is described.In addition, in this example, give prosign, to omit its explanation to the key element identical with the inscape of the 1st, 2 examples.The main discrepancy of the 3rd example is that plate keeps tool 109 to possess the 1st transfer mechanism.
Figure 19, the plate that shows this example keeps the figure of the formation of tool 109.The plate of this example keeps tool 109, and shown in figure 19 possess substrate P from moving into the 1st handover portion 249 that keeps tool 109 handovers with platform 40 toward plate.This 1st handover portion 249 comprises the adsorption section 250 that absorption keeps the both sides of substrate P Width.This adsorption section 250 can be along moving freely in the XY plane of substrate P face direction.
In this example, keep the periphery of tool 109 to be provided with position probing sensor 252 in order to the position that detects the relative substrate-placing of the substrate P portion 31 that mat the 1st handover portion 249 moves in plate again.As this position probing sensor 252 can illustrations potentiometer for example, the present invention can use any one gauge of the way of contact or noncontact mode.
The offset of the relative substrate-placing of substrate P portion 31 detect sensor 252 through the end contact position that makes substrate P, and exposure device 1 can be detected in adsorption section 250 shown in Figure 20 B.In addition, adsorption section 250 constitutes the testing result driving according to above-mentioned position probing sensor 252.
Therefore, exposure device 1 can remain in the position of the relative substrate-placing of the substrate P portion 31 of adsorption section 250 according to the testing result correction of position probing sensor 252.
In this example also likewise; Because substrate P such as above-mentioned under the state that the injection through gas suspends by conveyance; Therefore can under high flatness state, be handed over to plate distortionlessly and keep tool 109, can prevent terminating in generation air trapping or air layer between substrate P and the substrate-placing portion 31.Therefore, can keep both allocations of tool 109 to carry in relative plate and put substrate P with the high state of flatness.Therefore, can carry out set exposure accurately in the appropriate location on substrate P, and can realize the exposure-processed that reliability is high.
In addition, the substrate P from plate maintenance tool 109 after exposure-processed finishes is taken out of action owing to identical with the 1st example, therefore omits its explanation.
(the 4th example)
Secondly, the formation of the 4th example of the present invention is described.In addition, in this example, give prosign, to omit its explanation to the key element identical with the inscape of the 1st example.The 4th example is shown in figure 21, with the main discrepancy of the 1st example be that plate is moved into platform 40 and taken out of with platform 50 and is disposed at the position that overlaps each other under the state overlooking.That is, and plate when keeping carrying out the transfer of substrate P between the tool 9, move into platform 40 and take out of with platform 50 relative plates maintenance tools 9 and carry out knee-action.
Below, with reference to Figure 22 A, Figure 22 B, and the transfer action of the substrate P of this example of Figure 22 C explanation.
After the exposure-processed of carrying the substrate P that places plate maintenance tool 9 is finished, take out of with platform 50 and be arranged in the state that keeps tool 9 along the Y direction near plate.In this example, shown in Figure 22 A, relatively plate keep tool 9 make below taking out of of standby with platform 50 rise to the position that can access substrate P.At this moment, also can be with taking out of with being configured to above the platform 50 than above the plate maintenance tool 9 low (with reference to Figure 13).
In addition, substrate P is carried out exposure-processed during, will a time substrate P be handed over to from coating developing machine (not shown) and move into platform 40.By this, move into platform 40 and keep tool 9 substrate P to be taken out of during take out of, carrying standby above plate maintenance tool 9 under the state that is equipped with a time substrate P with platform 50 at slave plate.
Plate keeps tool 9 to stop the driving of vacuum pump, removes and passes through to attract the absorption maintenance of the substrate P of hole K1 to substrate-placing portion 31.Secondly, plate keeps tool 9 from gas jetting hole K2 jet gas, through this gas substrate P is supported (with reference to Figure 14 A-Figure 14 C) with suspended state.On the other hand, take out of portion 5 when accessing substrate P, earlier from being formed at a plurality of gas jetting hole K5 jet gas of taking out of with above the platform 50.At this moment, also can make from gas jetting hole K2, the gas that K5 sprays has directive property.
Shown in Figure 22 B, take out of portion 5 and the 1st example likewise, the substrate P that adsorption section 52b is kept moves along Y direction among this figure.At this moment, because substrate P keeps the state on the tool 9 to be supported to be suspended in plate, so substrate P slippage successfully is on taking out of with platform 50.Again, take out of, become suspension supporting substrates P as stated with above the platform 50.Therefore, substrate P transfer successfully is toward taking out of with above the platform 50.
Behind the mobile end of substrate P, take out of with platform 50 and stop gas blowing from gas jetting hole K5, and through attracting K6 absorption in hole to keep substrate P.Take out of with platform 50 and maintain in absorption under the state of substrate P, substrate P is moved toward the below.In addition; Big and carried with the state that above taking out of, exceeds under when putting in the size of substrate P with platform 50, take out of with platform 50 with substrate P not interference plate maintenance tool 9 mode with 9 separation of slave plate maintenance tool in this figure+state that the Y direction is recessed carries out above-mentioned down maneuver.
On the other hand, take out of, and shown in Figure 22 C, moving into platform 40 of standby drops to the position that can keep tool 9 transfer substrate P to plate above plate keeps tool 9 with platform 50 beginning down maneuvers.By this, plate keeps tool 9 and moves into platform 40 to arrange along the approaching state of Y direction.At this moment, also can be with moving into being configured to above the platform 40 than above the plate maintenance tool 9 low (with reference to Fig. 8).
Move into a plurality of gas jetting hole K3 jet gas of platform 40 above being formed at, substrate P is supported with suspended state through this gas.On the other hand, plate keeps tool 9 when accessing substrate P, earlier a plurality of gas jetting hole K2 jet gas above being formed at.At this moment, also can make from gas jetting hole K2, the gas that K5 sprays has directive property.
Move into portion 4 substrate P is suspended be supported on move into the state on the platform 40 under, make abutting part 42b be connected to an end of substrate P.Abutting part 42b keeps tool 9 side shiftings (with reference to Fig. 9,10) with substrate P toward plate through moving along the guidance part 42a in the recess 40a.
Because substrate P becomes the state of moving into on the platform 40 that is suspended in, therefore successfully slide into plate and keep tool 9 sides.Again, above the plate maintenance tool 9, owing to be to become suspension supporting substrates P as stated, so substrate P keeps tool 9 transfers successfully from moving into platform 40 toward plates shown in Figure 22 D.
Substrate P and the 1st example likewise can be put (with reference to Fig. 9) with pin 36 and alignment pin 37 substrate-placing portion 31 being aligned in both state downloads of allocation through guiding.Then, substrate P is carried out exposure-processed.
In this example, with substrate P from move into portion 4 move into keep to plate tool 9 during, or substrate P is carried out exposure-processed during, take out of to carry to place and take out of the substrate P that the exposure-processed with platform 50 finishes.
In this example, be displaced into short transverse (Z direction) and continue alternately with taking out of portion's 5 relative plates maintenance tools 9, and can carry out taking out of the substrate P of exposure device body 3 into action like the above-mentioned portion 4 of will moving into.Again, above plate keeps tool 9, and can keep tool 9 to continue to plate, therefore can shorten and follow taking out of processing time (what is called product distance (Takt)) of substrate P into action through knee-action respectively owing to move into portion 4 and take out of portion 5 standby when non-uses.
In addition; In the above-mentioned example; Though bright move into platform 40 and plate keep the 1st direction that tool 9 arranged, the 2nd direction of being arranged with platform 50 and plate maintenance tool 9 is parallel with taking out of; But the present invention is not limited thereto, and the present invention also can be applicable to that above-mentioned the 1st direction and the 2nd direction are the situation of different direction (for example card is handed over).
(the 5th example)
Secondly, the formation of the 5th example of the present invention is described.In addition, in this example, give prosign, to omit its explanation to the key element identical with the inscape of the 1st example.The 5th example, main discrepancy are to possess performance to move into portion and take out of the taking out of into portion of portion's function.
Figure 23 shows the stereogram that chamber interior constitutes, and Figure 24 A and Figure 24 B show the vertical view of taking out of into the summary formation of portion 400.
Shown in figure 23, take out of the travel mechanism 402 that possesses substrate-placing platform 401 and move this substrate-placing platform 401 into portion 400.In addition, travel mechanism 402 is made up of the 1st, the 2nd travel mechanism 33, the 43 identical formations with the 1st example.Based on this kind formation, substrate-placing platform 401 can maintain under the state of substrate P, is displaced in the set zone of guiding face at light emitting side (the image planes side of projection optical system PL).Again, substrate-placing platform 401 also can move along Z-direction.Therefore, substrate-placing platform 401 performances are moved into platform and are taken out of the function with platform.
Shown in Figure 24 A and 24B, take out of into portion 400 and possess the handover portion 405 that keeps tools 9 to transfer from substrate-placing platform 401 toward plates substrate P.Handover portion 405 comprises guidance part 406 and adsorbs the adsorption section 408 that remains in substrate P.
On substrate-placing platform 401, be formed with two groove shape recess 401a that form along a direction (the Y direction shown in this figure).In this recess 401a, be provided with above-mentioned guidance part 406.With state outstanding above substrate-placing platform 401 above-mentioned adsorption section 408 is installed at guidance part 406.Adsorption section 408 comprises the vacuum suction pad that for example keeps substrate P through vacuum suction absorption.
Above substrate-placing platform 401, be provided with a plurality of gas jetting hole K7 that pass through this gas suspension supporting substrates P through gases such as injection airs below substrate P again.Each gas jetting hole K7 is connected in not shown gas blowing and uses pump.Moreover, on substrate-placing platform 401, be provided with a plurality of usefulness so that imitative proud this face of substrate P and the attraction hole K8 that is close to.Each attracts hole K8 to be connected in not shown vacuum pump.In addition, gas jetting hole K7 is configured to clathrate alternately with attracting hole K8.
Again, be formed with through hole 407 in substrate-placing platform 401, this through hole 407 can supply as the back said in order to and coating developing machine (not shown) between carry out the transfer of substrate P the substrate rest pin of actuation mechanism up and down insert logical.
Plate keeps tool 9 and above-mentioned example likewise, possesses the above-mentioned position probing sensor 19 of the relative position of detection and substrate-placing platform 401 in its side surface part.Position probing sensor 19 comprise in order to the distance detecting of the relative distance that detects relative substrate-placing platform 401 with sensor 19a with in order to the height detection of the relative altitude that detects relative substrate-placing platform 401 with sensor 19b (with reference to Fig. 3 B).
Secondly, the graphic explanation of reference is taken out of into portion 400 and plate and is kept the transfer of the substrate P of 9 of tools to move.At first, move into the substrate P that is coated with emulsion at coating developing machine (not shown) to taking out of into portion 400.At this moment, the actuation mechanism up and down 409 that is positioned at the below of substrate-placing platform 401 is disposed at substrate-placing platform 401 tops with substrate rest pin 410 earlier through through hole 407.Secondly, between the arm 48 insertion substrate rest pins 410 shown in figure 25 of coating developing machine (not shown).Through arm 48 descend and with substrate P after substrate rest pin 410 transfers, recess from taking out of into portion 400.Actuation mechanism 409 finishes the move into action of substrate P to substrate-placing platform 401 through the substrate rest pin 410 that is supported with substrate P is descended up and down.Thereafter, through driving vacuum pump, substrate P through attract hole K8 to be adsorbed to remain in substrate-placing platform 401 above.
Secondly, plate keeps tool 9 to move near the mode of taking out of into the substrate-placing platform 401 of portion 400.In addition, also can carry when putting platform 401 and keeping tool 9, make substrate-placing platform 401 and plate keep tool 9 to move to the transfer position of substrate P through driving handover portion 405, and shorten the required time of action of moving into of substrate P in the short time in array substrate with plate.Under this situation, again, substrate P since through attract hole K8 to be adsorbed to remain in substrate-placing platform 401 above, can prevent that therefore substrate P moves when the driving of handover portion 405 on substrate-placing platform 401.
In this example, shown in figure 26, make plate keep tool 9 with the top of substrate-placing platform 401 that is supported with substrate P than high mode above the plate maintenance tool 9 near substrate-placing platform 401.In addition, also can arrange with state of contact through plate being kept tool 9 and substrate-placing platform 401, and shorten substrate P displacement, more successfully to transfer.
Secondly, substrate-placing platform 401 is shown in figure 26, and a plurality of gas jetting hole K7 jet gas above being formed at support substrate P through this gas with suspended state.On the other hand, plate keeps tool 9 when accessing substrate P, earlier a plurality of gas jetting hole K2 jet gas above being formed at.At this moment, also can make from gas jetting hole K2, the gas that K7 sprays has directive property.
Take out of portion 400 the substrate P suspension is being supported under the state on the substrate-placing platform 401, through an end of adsorption section 408 absorption maintenance substrate P.Adsorption section 408 keeps tool 9 side shiftings (with reference to Figure 24 A and 24B) with substrate P toward plate through moving along the guidance part in the recess 401a 406.
Because substrate P becomes the state that is suspended on the substrate-placing platform 401, so adsorption section 408b can make substrate P successfully slide into plate maintenance tool 9 sides.Above the plate maintenance tool 9, become suspension supporting substrates P as stated again.
Therefore, through the substrate P of sliding on substrate-placing platform 401 in adsorption section 408, the top transfer successfully that keeps tool 9 toward plate.In this example, because the top of substrate-placing platform 401 shown in figure 26 keeps the top height of tool 9 than plate, so substrate P can keep under the situation of tool 9 sides transfer successfully on plate maintenance tool 9 at contact plate not.
Substrate P is located at plate and keeps the guiding of tool 9 peripheries to become with pin 36 and alignment pin 37 substrate-placing portion 31 is aligned in both states of allocation (with reference to Fig. 9) through being connected to.
In this example also likewise because substrate P such as above-mentioned under the state that the injection through gas suspends by conveyance, therefore can prevent terminating in and produce air trapping or air layer between substrate P and the substrate-placing portion 31, year offset that can prevent substrate P moves or is out of shape.Therefore, can keep both allocations of tool 9 to carry in relative plate and put substrate P with the high state of flatness.Thereafter, through driving vacuum pump, substrate P promptly through attract hole K1 to be adsorbed to remain in substrate-placing portion 31 above.Then, after plate keeps tool to put substrate P in 9 years, substrate P is carried out exposure-processed.
After exposure-processed finished, plate kept tool 9 to move near the mode of taking out of into the substrate-placing platform 401 of portion 400.In this example, toply make plate keep tool 9 and substrate-placing platform 401 approaching than mode high above the substrate-placing platform 401 so that plate keeps tool 9.
In addition, also can carry when putting platform 401 and keeping tool 9, carry through moving substrate and put platform 401 to shorten taking out of the required time of action of substrate P in array substrate with plate.Also can keep tool 9 and substrate-placing platform 401 to arrange plate with contact condition again.By this, owing to keep tool 9 and 401 of substrate-placing platforms not to form the gap, therefore can successfully carry out the transfer of substrate P at plate.
Plate keeps tool 9 to stop the driving of vacuum pump, removes and passes through to attract the absorption maintenance of the substrate P of hole K1 to substrate-placing portion 31.Secondly, plate keeps the tool 9 a plurality of gas jetting hole K2 jet gas above being formed at substrate-placing portion 31 shown in figure 27, through this gas substrate P is supported with suspended state.On the other hand, take out of portion 5 when accessing substrate P, earlier a plurality of gas jetting hole K7 jet gas above being formed at substrate-placing platform 401.At this moment, also can make from gas jetting hole K2, the gas that K7 sprays has directive property.
Taking out of portion 400 is supported on plate with the adsorption section 408 of handover portion 405 along guidance part 406 and keeps the substrate P side shifting in the substrate-placing portion 31 of tool 9 toward suspending.Adsorption section 408 absorption keep substrate P, in scheming along this+and Y direction moving substrate P (with reference to Figure 24 A and 24B).
At this moment, because substrate P keeps the state on the tool 9 to be supported to be suspended in plate, so adsorption section 408 can make substrate P successfully slide into substrate-placing platform 401 sides.Above the substrate-placing platform 401, become suspension supporting substrates P as stated again.
Therefore, the substrate P of on substrate-placing portion 31, sliding is toward the top transfer successfully of substrate-placing platform 401.In this example, because plate keeps the top top height than substrate-placing platform 401 of tool 9, so substrate P can be carried under the situation of putting platform 401 sides transfer successfully on substrate-placing platform 401 at contact substrate not.
After mat adsorption section 408 made the mobile end of substrate P, substrate-placing platform 401 stopped the gas blowing from gas jetting hole K7, and through attracting K8 absorption in hole to keep substrate P.Take out of portion 400 and maintain in absorption under the state of substrate P, drive handover portion 405, substrate-placing platform 401 is moved toward the position of taking out of of substrate P.
Secondly, take out of and carry the substrate P that the exposure-processed that places substrate-placing platform 401 finishes.At this moment, the actuation mechanism up and down 409 that is positioned at the below of substrate-placing platform 401 is disposed at substrate-placing platform 401 tops through through hole 407 with substrate rest pin 410.By this, substrate P is held in the top of substrate-placing platform 401 (with reference to Figure 25) because of being supported in substrate rest pin 410.Secondly, the arm 48 of coating developing machine (not shown) inserts between the substrate rest pin 410, through substrate rest pin 410 is descended substrate P is handed over to arm 48.Arm 48, moving substrate P in coating developing machine (not shown) is to carry out development treatment.
According to this example; Owing to can make the substrate P slip of the supporting that suspended and keep tool 9 conveyances toward plates from taking out of into portion 400; Therefore generation air trapping or air layer between substrate P and the substrate-placing portion 31 can be prevented terminating in, the generation that offset moves or is out of shape of carrying of substrate P can be prevented.Therefore, can carry out the high exposure-processed of reliability.Because to take out of portion's 400 double as be the portion that moves into 4 in above-mentioned the 1st～the 3rd example and take out of portion 5, therefore can constitute by simplification device again.
In addition, in the 5th example, also can when keeping tool 9 conveyance substrate P, make the last face tilt of substrate-placing platform 401 from substrate-placing platform 401 toward plate.Particularly, travel mechanism 402 makes the top of substrate-placing platform 401 with the state support substrate P that suspends from the gas blowing of gas jetting hole K7 keep tool 9 sides (θ Y) to tilt toward plate.By this, can utilize the deadweight of substrate P to make this substrate P keep tool 9 side shiftings toward plate.
Again, also can when slave plate keeps tool 9 toward substrate-placing platform 401 conveyance substrate P, make plate keep tool 9 on face tilt.Particularly, the 1st travel mechanism 33 (maintaining part 34) makes the plate with the state support substrate P that suspends from the gas blowing of gas jetting hole K2 keep the top of tool 9 to tilt toward substrate-placing platform 401 sides (θ Y).By this, can utilize the deadweight of substrate P to make this substrate P toward substrate-placing platform 401 side shiftings.
In addition, in this example, also can adopt roller mechanism 148 shown in the 2nd example as handover portion 405.Again, as handover portion 405, plate maintenance tool 9 sides are located in the adsorption section 408 that also can shown in the 3rd example, will constitute handover portion 405.
(the 6th example)
Secondly, the formation of the 6th example of the present invention is described.In addition, below in the explanation, give prosign, to simplify or to omit its explanation to the key element identical with the inscape of above-mentioned example.
Figure 28 shows the cross sectional plan view that the summary of the exposure device of this example constitutes, and Figure 29 shows the stereogram of the summary that the device in the chamber constitutes.
With above-mentioned example likewise, exposure device 1 is shown in figure 28 to be possessed exposure device body 3 and moves into portion 4.Again, in this example, exposure device 1 possesses the mechanical arm of taking out of 205.These are accommodated in by high purification and adjust in the chamber 2 of both fixed temperatures.
Shown in figure 29, take out of mechanical arm 205 and for example for example have flapping articulation type structure, and possess the arm 10 that constitutes by the plural number part that links through vertical joint shaft, fork portion 12, the drive unit 13 of the front end that is linked to this arm 10.Arm 10 can be displaced into for example above-below direction (Z-direction) through drive unit 13.Drive unit 13 is by not shown its driving of control device control.By this, taking out of mechanical arm 205 slave plates keeps tool 9 to access substrate P.In addition, take out of the mechanical arm that mechanical arm 205 is not limited to flapping articulation type structure, also can suitably adopt or make up known mechanical arm (generally speaking being transport mechanism) and realize.
Figure 30 A display panel keeps the figure that overlooks formation of tool 9, the figure that Figure 30 B display panel keeps the side-looking of tool 9 to constitute.In this example, shown in Figure 30 A, keep tool 9 to be formed with in plate and carry the substrate-placing portion 31 of putting substrate P.
Again, in this example, when plate keeps tool 9 to be formed with the taking out of of substrate P in order to accommodate the slot part 30 of the fork portion 12 that takes out of mechanical arm 205.This slot part 30 forms along the moving direction (this figure Y direction) of fork portion 12.Zone beyond the top middle slot part 30 of fork portion 9 constitutes aforesaid substrate and carries the portion of putting 31.
In addition, the thickness of fork portion 12 is little than the degree of depth of slot part 30.By this, be contained in fork portion 12 in the slot part 30 like the back saidly after, make through making it to rise and to carry the substrate P that places in the substrate-placing portion 31 and transferred the fork portion 12 that places of carrying.
With Fig. 3 B likewise, plate keeps tool 9 shown in Figure 30 B, possesses the position probing sensor 19 that detects and move into the relative position of platform 40 in its side surface part 9a.Position probing sensor 19 comprise in order to detect move into relatively with the distance detecting of the relative distance of platform 40 with sensor 19a with use sensor 19b in order to detect the height detection of moving into relatively with the relative altitude of platform 40.In addition, in moving into, by this, prevent position probing sensor 19 and move into platform 40 interference with being formed with recess with position probing sensor 19 corresponding positions in the platform 40.
Secondly, the action of the exposure device 1 of this example is described with reference to Fig. 6, Figure 11,31A～Figure 34.Particularly, main explanation is moved into the transfer that transfer action and plate that portion 4 and plate keep the substrate P between the tool 9 keep tool 9 and take out of the substrate P between the mechanical arm 205 and is moved.
At first, move into the substrate P that is coated with emulsion at coating developing machine (not shown) to moving into portion 4.At this moment, being positioned at the actuation mechanism of moving into the below of platform 40 up and down 49 is disposed at substrate rest pin 49a earlier through through hole 47 and moves into platform 40 tops.Secondly, between the arm 48 insertion substrate rest pin 49a as shown in Figure 6 of coating developing machine (not shown).Through arm 48 descend and with substrate P after substrate rest pin 49a transfer, recess from moving into portion 4.Actuation mechanism 49 finishes substrate P to moving into the action of moving into platform 40 through the substrate rest pin 49a that is supported with substrate P is descended up and down.Thereafter, through driving vacuum pump, substrate P is moved into above the platform 40 through attracting hole K4 to be adsorbed to remain in.
Secondly, plate keeps tool 9 shown in Figure 31 A, to move near the mode of moving into platform 40 of moving into portion 4.In addition, omit the diagram of taking out of mechanical arm among Figure 31 A and the 31B.
Particularly, the 1st travel mechanism 33 keeps tool 9 with plate and moves into platform 40 to arrange along the approaching state of Y direction.Here, so-called plate keeps tool 9 and moves into the approaching state of platform 40, be meant after separated the mobile state that can smooth and easy distance of carrying out of substrate P during the transfer of the substrate P stated.
, arrangement can drive the 2nd travel mechanism 43 when moving into platform 40 and plate maintenance tool 9 again.So, can make to move into to keep tool 9 to move to the transfer position of substrate P, can shorten the required time of action of moving into of substrate P in the short time with platform 40 and plate.At this moment, therefore substrate P can prevent to move on substrate P is being moved into platform 40 when the driving of the 2nd travel mechanism 43 owing to move into above the platform 40 through attracting hole K4 to be adsorbed to remain in.
In this example, shown in Figure 31 B, make plate keep tool 9 and move into platform 40 near the time, substrate P is configured to plate maintenance tool 9 height.That is the 1st travel mechanism 33 makes plate keep tool 9 near moving into platform 40 to be supported with moving into the top of platform 40 of substrate P than high mode above the plate maintenance tool 9.In addition, also can make to move into and rise so that move into top top height than plate maintenance tool 9 with platform 40 through the 2nd travel mechanism 43 with platform 40.
Again, the 1st travel mechanism 33 also can keep plate tool 9 and moves into platform 40 and under state of contact, arrange.So, the plate of stating after can successfully carrying out keeps tool 9 and moves into the transfer with the substrate P of 40 of platforms.
Secondly, move into platform 40 shown in figure 32ly, a plurality of gas jetting hole K3 jet gas above being formed at support substrate P through this gas with suspended state.On the other hand, plate keeps tool 9 when accessing substrate P, earlier a plurality of gas jetting hole K2 jet gas above being formed at.
Move into portion 4 substrate P is suspended be supported on move into the state on the platform 40 under, an end that makes abutting part 42b be connected to substrate P shown in figure 33.Abutting part 42b keeps tool 9 side shiftings with substrate P toward plate through moving along the guidance part 42a in the recess 40a.
Because substrate P becomes and is suspended in the state of moving into on the platform 40, so abutting part 42b can make substrate P successfully slide into plate maintenance tool 9 sides.In addition, above the plate maintenance tool 9, become suspension supporting substrates P as stated., also can make from gas jetting hole K3, the gas that K2 sprays has directive property here.
Through the substrate P that abutting part 42b slides on move into platform 40, shown in figure 34, the top transfer successfully that keeps tool 9 toward plate.In this example, keep the top height of tool 9 than plate, so substrate P can keep under the situation of tool 9 sides transfer successfully on plate maintenance tool 9 at contact plate not owing to move into the top of platform 40.
Substrate P is shown in figure 33, be located at guiding that plate keeps tool 9 peripheries stipulate with pin 36 directions X in the figure the position slide in state moving.Abutting part 42b moves to substrate P and is connected to the alignment pin 37 of being located at substrate transferring direction downstream in the plate maintenance tool 9.Substrate P is guided with pin 36 and stipulates the position of directions X in the figure, and seizes the state that the position that becomes Y direction among this figure is stipulated on both sides by the arms through be positioned pin 37 and abutting part 42b.Plate keeps tool 9 to stop the gas blowing from gas jetting hole K2.Substrate P is shown in figure 11, under the state that substrate-placing portion 31 is alignd, is carried and puts.
In addition, in the past with substrate-placing when plate keeps tool, the offset of carrying that might produce substrate moves (from the offset of set year seated position) or substrate deformation.Produce one of reason that this year, offset moved, for example can consider and to put eve carrying of substrate and make substrate become floating state because of the thin air layer that between substrate and plate maintenance tool, produces.Again, make one of reason that substrate deformation produces, for example can consider carrying and keep between the tool Jie at air trapping and substrate becomes the state of expansion in substrate and plate after putting substrate.
With respect to this, in this example because substrate P such as above-mentioned under the state that the injection through gas suspends by conveyance, therefore under high flatness state, be handed over to plate distortionlessly and keep tool 9.Because from being put in 31 years toward substrate-placing portion by the height of suspension supporting, therefore can preventing terminating in, substrate P produces air trapping or air layer between substrate P and the substrate-placing portion 31 again.Therefore, can suppress substrate P becomes swelling state, prevents the generation that offset moves or is out of shape of carrying of substrate P.Therefore, can keep both allocations of tool 9 to carry in relative plate and put substrate P with the high state of flatness.Thereafter, through driving vacuum pump, substrate P promptly through attract hole K1 to be adsorbed to remain in substrate-placing portion 31 above.
After plate kept tool to put substrate P in 9 years, mask M was thrown light on the exposure light IL from illuminator.By the pattern of the mask M that throws light on exposure light IL, place plate to keep the substrate P of tool 9 to carrying through projection optical system PL projection exposure.
Because can as described above substrate P be carried well places plate to keep therefore carrying out set exposure accurately in the appropriate location on substrate P, and realizing the exposure-processed that reliability is high on the tool 9.
In this example; Substrate P is being carried out in the exposure-processed; Or as after state by take out of substrate P that mechanical arm 205 conveyance exposure-processed finish during, can carry through the inferior substrate P that coating developing machine (not shown) is coated with emulsion and place the moving into of the portion of moving into 4 with on the platform 40.
Secondly, explain that exposure-processed finishes the back slave plate and keeps tool 9 to take out of the action of substrate P.
Particularly, explain through taking out of mechanical arm 205 and take out of the method for substrate P.Figure 35 takes out of the stereogram of the action of mechanical arm 205 in order to explanation, the section pie graph when Figure 36 A and 36B keep tool 9 to take out of the substrate P slave plate when Y direction is watched, and Figure 37 watches the end view when the substrate P slave plate kept action that tool 9 takes out of from X-direction.In addition, only illustrate fork portion 12 among Figure 35, the integral body of taking out of mechanical arm 205 constitutes to be omitted.Among Figure 36 A and the 36B, for convenience of description, simplify the diagram of the fork portion 12 of supporting substrates P again.
After exposure-processed finishes, remove the absorption of the attraction hole K1 of vacuum pump, to remove the absorption that plate keeps 9 pairs of substrate P of tool.Secondly, take out of that mechanical arm 205 is shown in figure 35 to be inserted fork portion 12 to be formed at the slot part 30 that plate keeps tool 9 from-Y direction side.
Then, drive unit 13 was both quantitative through fork portion 12 is moved toward tops, and shown in Figure 36 A, make fork portion 12 be connected to substrate P below.Again, shown in Figure 36 B, fork portion 12 further moves toward the top, by this substrate P jack-up to plate is kept tool 9 tops and leaves from substrate-placing portion 31.
Again, take out of mechanical arm 205, make fork portion 12 rise (recessing) to the height of moving into that does not contact the portion of moving into 4 with platform 40 (carry and be equipped with a time substrate P that is coated with emulsion).Fork portion 12 rises to not contact and moves into after the substrate P on the platform 40, and is shown in figure 37, moves into moving into platform 40 to keep the mode of tool 9 to move near plate, as described above with the 9 side conveyances of the past plate maintenance of substrate P tool of portion 4.
From move into portion 4 keep toward plate tool 9 conveyance substrate P during, take out of mechanical arm 205 and make and carry the substrate P that places fork portion 12 and move in the coating developing machine (not shown).With with upper type, the action of taking out of of taking out of substrate P from exposure device body 3 promptly finishes.
As above-mentioned; According to this example; Slide and keep tools 9 conveyances toward plates owing to can make, therefore can prevent terminating in generation air trapping or air layer between substrate P and the substrate-placing portion 31, can prevent the generation that year offset of substrate P moves or is out of shape from moving into portion 4 by the substrate P of the supporting that suspends.Therefore, can carry out the high exposure-processed of reliability.
Again, in this example, substrate P is kept tools 9 to slide and moves into toward plates from moving into portion 4 because using gases sprays, therefore with keep the substrate of tool 9 to move into to the plate that uses existing pallet comparing, produce elongated apart from the time.
With respect to this; In this example; Since can will take out of the fork portion 12 of mechanical arm 205 insert slot parts 30 and from following jack-up substrate P and slave plate keeps tool 9 to make under the state that substrate P recesses by moving into portion 4 will a time substrate P moving into plate and keep tool 9, therefore to plate keep tool 9 substrate P take out of into required integral body produce apart from the time can be roughly equal with the situation of using existing pallet.Therefore, can with kilter substrate P be moved into plate under the situation of time and keep tool 9 not increasing the fashionable product of taking out of of substrate P.
In addition, in this example,, also can make the last face tilt of moving into platform 40 from moving into when keeping tool 9 conveyance substrate P toward plates with platform 40.Particularly, the maintaining part 44 of the 2nd travel mechanism 43 makes the moving into the top of platform 40 of state support substrate P to suspend from the gas blowing of gas jetting hole K3 keep tool 9 sides (θ Y) to tilt toward plate.By this, can utilize the deadweight of substrate P to make this substrate P keep tool 9 side shiftings toward plate.
(the 7th example)
Secondly, the formation of the 7th example of the present invention is described.In addition, in this example, give prosign, to omit its explanation to the key element identical with the inscape of the 6th example.The 7th example, formation and the 6th example of moving into portion are different.
In this example, move into portion 104 and use Figure 16 A and Figure 16 B expositor identical.
Again, the action of the exposure device in this example 1 is identical with use Figure 17 and Figure 18 expositor.
In this example; Because substrate P such as above-mentioned under the state that the injection through gas suspends by conveyance; Therefore can under high flatness state, be handed over to plate distortionlessly and keep tool 9, can prevent terminating in generation air trapping or air layer between substrate P and the substrate-placing portion 31.Therefore, can keep both allocations of tool 9 to carry in relative plate and put substrate P with the high state of flatness.Therefore, can carry out set exposure accurately in the appropriate location on substrate P, and can realize the exposure-processed that reliability is high.
(the 8th example)
Secondly, the formation of the 8th example of the present invention is described.In addition, in this example, give prosign, to omit its explanation to the key element identical with the inscape of the 6th, 7 examples.The 8th example and the main discrepancy of the 6th and the 7th example are that plate keeps tool 109 to possess handover portion.
Figure 38, the plate that shows this example keeps the figure of the formation of tool 109.The plate of this example keeps tool 109, and shown in figure 38 possess substrate P from moving into the 1st handover portion 249 that keeps tool 109 handovers with platform 40 toward plate.This 1st handover portion 249 comprises the adsorption section 250 that absorption keeps the both sides of substrate P Width.This adsorption section 250 can be along moving freely in the XY plane of substrate P face direction.
In this example, keep the periphery of tool 109 to be provided with position probing sensor 252 in order to the position that detects the relative substrate-placing of the substrate P portion 31 that mat the 1st handover portion 249 moves in plate again.As this position probing sensor 252 can illustrations potentiometer for example, the present invention can use any one gauge of the way of contact or noncontact mode.
The offset of the relative substrate-placing of substrate P portion 31 detect sensor 252 through the end contact position that makes substrate P, and exposure device 1 can be detected in adsorption section 250 shown in Figure 39 B.In addition, adsorption section 250 constitutes the testing result driving according to above-mentioned position probing sensor 252.
Therefore, exposure device 1 can remain in the position of the relative substrate-placing of the substrate P portion 31 of adsorption section 250 according to the testing result correction of position probing sensor 252.
In this example also likewise; Because substrate P such as above-mentioned under the state that the injection through gas suspends by conveyance; Therefore can under high flatness state, be handed over to plate distortionlessly and keep tool 109, can prevent terminating in generation air trapping or air layer between substrate P and the substrate-placing portion 31.Therefore, can keep both allocations of tool 109 to carry in relative plate and put substrate P with the high state of flatness.Therefore, can carry out set exposure accurately in the appropriate location on substrate P, and can realize the exposure-processed that reliability is high.
In addition, the substrate P from plate maintenance tool 109 after exposure-processed finishes is taken out of action owing to identical with the 1st example, therefore omits its explanation.
(the 9th example)
Secondly, the formation of the 9th example of the present invention is described.In addition, in this example, give prosign, to omit its explanation to the key element identical with the inscape of the 6th～8 example.The 9th example and the main discrepancy of the 6th～8 example are the formation of exposure device.Figure 40 shows the stereogram that the summary of the exposure device body 3 of this example constitutes.
Shown in figure 40, the exposure device body 3 of this example possesses plate and keeps tool 9, is located at substrate jacking mechanism 150 and the 1st travel mechanism 33 that this plate keeps tool 9.Substrate jacking mechanism 150 in order to when taking out of substrate P with substrate P toward above the jack-up person.
Figure 41 display panel keeps the formation of overlooking of tool 9, and Figure 42 A and Figure 42 B are the sectional side views that plate keeps tool 9, and Figure 42 A is the figure of the state before the transfer of display base plate, and Figure 42 B is the figure of the state after the transfer of display base plate.
Supporting member for substrate 151 comprises the 1st wire-like members 119 and the 2nd wire-like members 120 that is set up in Y direction among Figure 41 (the 2nd direction) that axial region (moving member up and down) 155 are set up in directions X among Figure 41 (the 1st direction), and integral body forms roughly clathrate.This 1st wire-like members 119 and the 2nd wire-like members (the 2nd sets up portion) 120, welding each other herein, or be combined into clathrate.155 of the axial regions that each supporting member for substrate 151 is set up in a plurality of (being for example six in this example).
Constitute each lattice shape of each supporting member for substrate 151, all have the plurality of openings portion 121 of the essentially rectangular little than substrate P.In addition, the shape of supporting member for substrate 151 is not limited to shape shown in Figure 41, for example also peristome 121 only be formed with one the single framework of frame shape.
In this example, four supporting member for substrate 151 are to vacate the state of gap S along the bearing of trend (Y direction shown in Figure 41) of the 2nd wire-like members 120 and to dispose.Between 151 of the aforesaid substrate supporting members crack S as the back said in order to be formed in as after state the space that supplies fork portion 12 to insert when slave plate keeps tool 9 to take out of substrate P.
In addition; Formation material as supporting member for substrate 151 (the 1st wire-like members 119 and the 2nd wire-like members 120); Preferably use and when supporting member for substrate 151 supporting substrates P, can suppress the deflection that the deadweight because of substrate P causes, can use for example various synthetic resin or metal.Particularly, can enumerate nylon, polypropylene, AS resin, ABS resin, Merlon, fibre strengthening plastic cement, stainless steel etc.Glass fiber-reinforced thermmohardening shape glue) or CFRP (Carbon Fiber Reinforced Plastic: carbon fiber-reinforced thermmohardening shape glue) as the fibre strengthening plastic cement, can enumerate GFRP (Glass Fiber Reinforced Plastic:.
Knee-action portion 152 drive units 153 that have axial region (moving up and down member) 155 and drive this axial region 155 up and down shown in figure 43.153 pairs of each axial regions of drive unit 155 are provided with, and each axial region 155 independently carries out knee-action by this.
Based on this formation, supporting member for substrate 151 is shown in Figure 42 A and Figure 42 B, and along with moving up and down of knee-action portion 152 (axial region 155), plate keeps the substrate-placing portion 31 of tool 9 to carry out knee-action relatively.
On the other hand, keep tool 9 to be formed with recess 130 in plate in order to accommodate supporting member for substrate 151.This recess 130 is corresponding with the belfry of supporting member for substrate 151 and be arranged to clathrate.Plate keeps top recess 130 zone (part is carried the portion of putting) in addition of tool 9 to constitute the substrate-placing portion 31 that keeps substrate P.
The thickness of supporting member for substrate 151 is little than the degree of depth of recess 130.By this, shown in Figure 42 B, be accommodated in the recess 130 and only carry the substrate P that places on the supporting member for substrate 151 and be handed over to substrate-placing portion 31 and carry and put through supporting member for substrate 151.
Again, substrate-placing portion 31 makes and has plate to keep the essence maintenance face of 9 pairs of substrate P of tool be good flatness.Moreover, the substrate of substrate-placing portion 31 keep face (above) be formed with that performance makes imitative proud this face of substrate P and the attraction mouth be close to or through after the substrate stated when moving into injection air (gas) be supported on so that substrate P is suspended gas ejection ports function on this face peristome K205.Be connected with not shown vacuum pump respectively and pump is used in gas blowing in peristome K205, peristome K205 such as above-mentioned brought into play attract mouthful or the jet function through the driving of switching these pumps.
Keep the periphery of tool 9 to be provided with when substrate P is moved in order to the guiding of guiding this substrate P in plate with pin 36 and the alignment pin 37 (with reference to Figure 44 A and Figure 44 B) of regulation substrate P to the position of the substrate-placing portion 31 of plate maintenance tool 9.These guidings can keep tool 9 to move with plate in exposure device body 3 with pin 36 and alignment pin 37.
Secondly, the action of the exposure device 1 of this example is described with reference to Figure 44 A～Figure 50 B.Particularly, main explanation is moved into the transfer that transfer action and plate that portion 4 and plate keep the substrate P between the tool 9 keep tool 9 and take out of the substrate P between the mechanical arm 205 and is moved.
At first, with the 6th example likewise, move at coating developing machine (not shown) and be coated with the substrate P of emulsion moving into portion 4.At this moment, at this moment, substrate P is moved into above the platform 40 through attracting hole K4 to be adsorbed to remain in.
Secondly, plate keeps tool 9 shown in Figure 44 A, to move near the mode of moving into platform 40 of moving into portion 4.In addition, omit the diagram of taking out of mechanical arm among Figure 44 A and the 44B.Particularly, the 1st travel mechanism 33 keeps tool 9 with plate and moves into platform 40 to arrange along the approaching state of Y direction.At this moment, make to move into and keep tool 9 to move to the transfer position of substrate P through driving the 2nd travel mechanism 43, and shorten the required time of action of moving into of substrate P in the short time with platform 40 and plate.In addition, therefore substrate P can prevent to move on substrate P is being moved into platform 40 when the driving of the 2nd travel mechanism 43 owing to move into above the platform 40 through attracting hole K4 to be adsorbed to remain in.
In this example, shown in Figure 44 B, the 1st travel mechanism 33 makes plate keep tool 9 near moving into platform 40 to be supported with moving into the top of platform 40 of substrate P than high mode above the plate maintenance tool 9.In addition, also can make to move into and rise so that move into top top height than plate maintenance tool 9 with platform 40 through the 2nd travel mechanism 43 with platform 40.Again, the 1st travel mechanism 33 also can successfully carry out the transfer of substrate P through plate being kept tool 9 and moving into platform 40 and arrange with state of contact by this.
Secondly, move into platform 40 shown in figure 45ly, a plurality of gas jetting hole K3 jet gas above being formed at support substrate P through this gas with suspended state.On the other hand, plate keeps tool 9 when accessing substrate P, drives not shown gas blowing earlier and uses pump, from being located at the peristome K205 injection air of substrate-placing portion 31.
Move into portion 4 substrate P is suspended be supported on move into the state on the platform 40 under, an end that makes abutting part 42b be connected to substrate P shown in figure 46.Abutting part 42b keeps tool 9 side shiftings with substrate P toward plate through moving along the guidance part 42a in the recess 40a.
Because substrate P becomes and is suspended in the state of moving into on the platform 40, so abutting part 42b can make substrate P successfully slide into plate maintenance tool 9 sides.In addition, above the plate maintenance tool 9, become suspension supporting substrates P as stated.Also can make the gas that sprays from gas jetting hole K3 and peristome K205 have directive property here.
Through the substrate P that abutting part 42b slides on move into platform 40, shown in figure 47, the top transfer successfully that keeps tool 9 toward plate.In this example, keep the top height of tool 9 than plate, so substrate P can keep under the situation of tool 9 sides transfer successfully on plate maintenance tool 9 at contact plate not owing to move into the top of platform 40.
Substrate P is guided with pin 36 and stipulates the position of directions X in the figure, and seizes the state that the position that becomes Y direction among this figure is stipulated on both sides by the arms through be positioned pin 37 and abutting part 42b.Plate keeps tool 9 to stop the gas blowing from peristome K205.By this, substrate P is carried under the state that substrate-placing portion 31 is alignd and is put.
In this example because substrate P such as above-mentioned under the state that the injection through gas suspends by conveyance, therefore under high flatness state, be handed over to plate distortionlessly and keep tool 9.Because from being put in 31 years toward substrate-placing portion by the height of suspension supporting, therefore can preventing terminating in, substrate P produces air trapping or air layer between substrate P and the substrate-placing portion 31 again.Therefore, can suppress substrate P becomes swelling state, prevents the generation that offset moves or is out of shape of carrying of substrate P.Therefore, can keep both allocations of tool 9 to carry in relative plate and put substrate P with the high state of flatness.Thereafter, through driving vacuum pump, substrate P promptly through peristome K205 be adsorbed remain in substrate-placing portion 31 above.
After plate kept tool to put substrate P in 9 years, mask M was thrown light on the exposure light IL from illuminator.By the pattern of the mask M that throws light on exposure light IL, place plate to keep the substrate P of tool 9 to carrying through projection optical system PL projection exposure.
The exposure device 1 of this example places plate to keep therefore carrying out set exposure accurately in the appropriate location on substrate P, and realizing the exposure-processed that reliability is high on the tool 9 owing to can as described above substrate P be carried well.
Secondly, explain that exposure-processed finishes the back slave plate and keeps tool 9 to take out of the action of substrate P.
Particularly, explain through taking out of mechanical arm 205 and take out of the method for substrate P.Figure 48 takes out of the stereogram of the action of mechanical arm 205 in order to explanation, Figure 49 A, Figure 49 B, and Figure 49 C section pie graph when Y direction is watched when keeping tool 9 to take out of the substrate P slave plate.In addition, only illustrate fork portion 12 among Figure 48, the integral body of taking out of mechanical arm 205 constitutes to be omitted.In this example, with the shape of jacking mechanism 150 accordingly, substrate supporting portion and above-mentioned example in the fork portion 12 are different.Again, Figure 49 A, Figure 49 B, and Figure 49 C in, for convenience of description, simplify the diagram of the fork portion 12 of supporting substrates P.
After exposure-processed finishes, remove absorption, to remove the absorption that plate keeps 9 pairs of substrate P of tool through the peristome K205 of vacuum pump.Secondly, jacking mechanism 150 rises for driving shaft part 155 makes supporting member for substrate 151.At this moment, shown in Figure 49 A, carried the past top of the substrate P quilt jack-up that places in the substrate-placing portion 31 with supporting member for substrate 151.At this moment, therefore past top can be prevented the generation of stripping charge by jack-up to substrate P owing to being supported by a plurality of supporting member for substrate 151.Owing to compare and therefore can lower the deflection that produces in substrate P with broad surface bearing substrate P through the situation of pin jack-up substrate P, produce slight crack and can prevent terminating in substrate P with existing again.
Take out of mechanical arm 205 and drive fork portions 12, shown in figure 48 with fork portion 12 from-Y direction side toward the base supporting mechanism that is disposed at substrate-placing portion 31 tops between 151 crack S and X-direction both ends move, and with the 12 insertion gap S of fork portion and both ends (Figure 49 B).
Then, drive unit 13 was both quantitative through fork portion 12 is moved toward tops, make fork portion 12 be connected to substrate P below.Fork portion 12 is moved toward tops, by this substrate P jack-up to plate is kept tool 9 tops and leave from jacking mechanism 150.
Jacking mechanism 150 is contained in supporting member for substrate 151 in the recess 130 after substrate P is left.After in recess 130, accommodating supporting member for substrate 151, plate keeps tool 9, to move near the mode of moving into platform 40 of moving into portion 4, as described above substrate P is kept tool 9 side conveyances toward plate.
From move into portion 4 keep toward plate tool 9 conveyance substrate P during, take out of mechanical arm 205 and make and carry the substrate P that places fork portion 12 and move in the coating developing machine (not shown).With with upper type, the action of taking out of of taking out of substrate P from exposure device body 3 promptly finishes.
As above-mentioned,,, therefore can prevent the generation that offset moves or is out of shape of carrying of substrate P owing to can make the substrate P slip of the supporting that suspended and keep tool 9 conveyances toward plates from moving into portion 4 according to this example.Again, this example also likewise, plate is kept tool 9 substrate P take out of into required integral body produce apart from the time can be roughly equal with the situation of using existing pallet.Therefore, can with kilter substrate P be moved into plate under the situation of time and keep tool 9 not increasing the fashionable product of taking out of of substrate P.
In addition, in the above-mentioned example, the situation that only forms as the peristome K205 of gas ejection ports in substrate-placing portion 31 has been described, but also can above supporting member for substrate 151, have been formed gas ejection ports.So, plate maintenance tool 9 is real in that substrate P is moved into, owing to spray in the amount increase of the gas of substrate transferring face, therefore conveyance substrate P more successfully.
(the 10th example)
Secondly, the formation of the 10th example of the present invention is described.In addition, in this example, give prosign, to omit its explanation to the key element identical with the inscape of the 6th example.The main discrepancy of the 10th example and above-mentioned example is for the adsorbing mechanism that possesses with contactless state absorption substrate P keeps tool 9 to take out of the means of substrate P as slave plate.
Adsorbing mechanism is in order to keep substrate P, and the substrate-placing portion 31 past top jack-up with the substrate P slave plate keeps tool 9 make it to move to coating developing machine (not shown).Figure 50 A shows the formation of adsorption plane, and Figure 50 B shows the figure that the integral body of adsorbing mechanism constitutes.
Shown in Figure 50 A and Figure 50 B, adsorbing mechanism 350 possess with contactless state keep substrate P a plurality of maintaining parts 351, keep these maintaining parts 351 base portion 352, can move the driving mechanism 355 of this base portion 352.Base portion 352 has and the roughly equal big or small tabular component of substrate P.Maintaining part 351 is configuration regularly on base portion 352, can keep substrate P well by this.
Used so-called Bei Nuyi chuck as maintaining part 351.Maintaining part 351 through with blast injection in and substrate P between so that negative pressure in and substrate P between produce.By this, produce the pressing force that substrate P is pressed on maintaining part 351 sides.On the other hand, maintaining part 351 is with the gap smaller of substrate P the time, and velocity of compressed air reduces, and the pressure between maintaining part 351 and substrate P rises.Produce the power that substrate P is left from maintaining part 351 by this.Maintaining part 351 through injecting condensed air to obtain above-mentioned two equilibrium of forces, by this can with between substrate P and the maintaining part 351 at a distance from remaining in certain state that is keeping substrate P with contactless state.
Secondly, the action of the graphic explanation exposure device 1 of reference.In addition, about moving into the transfer action that portion 4 and plate keep the substrate P of 9 of tools, because so omission explanation identical with the 1st example.
Below, explain that slave plate keeps tool 9 to take out of the action of substrate P.Particularly, the method that keeps tool 9 to take out of the substrate P slave plate through above-mentioned adsorbing mechanism 350 is described.Figure 51 A and Figure 51 B watch the end view when the substrate P slave plate kept action that tool 9 takes out of from X-direction.
After exposure-processed finishes, remove the absorption of the attraction hole K1 of vacuum pump, to remove the absorption that plate keeps 9 pairs of substrate P of tool.Secondly, adsorbing mechanism 350 moves to plate maintenance tool 9 tops.Then, adsorbing mechanism 350 drops to the position that maintaining part 351 can keep substrate P shown in Figure 51 A.Then, through a plurality of maintaining parts 351 with contactless state keep substrate P above.At this moment, a plurality of maintaining parts 351 are driven simultaneously or drive in regular turn to keep substrate P.
With substrate P from move into portion 4 move into keep to plate tool 9 during, the substrate P that adsorbing mechanism 350 is kept maintaining part 351 moves to coating developing machine (not shown).Through with upper type, the action of taking out of of taking out of substrate P from exposure device body 3 promptly finishes.
In addition, shown in Figure 52 A and Figure 52 B, also can be in the supporting member 353 below base portion 352 be provided with supporting substrates P on every side.Supporting member 353 constitutes by surrounding substrate P frame shape member on every side, has a plurality of extensions 354 that stretch out in the face direction of substrate P.This extension 354 be connected to substrate P below.Through this formation; When keeping probably having the large substrate of the sunken anxiety of the pressure that produces substrate P; Because all ends of substrate P are extended portion's 354 supportings,, also can prevent that substrate P from producing to press to fall into and can be through the state maintenance substrate P of maintaining part 351 with high flatness even therefore keep the situation of large substrate.
Again; Substrate P as above-mentioned example; Being not only the glass substrate that display element is used, can also be the ceramic wafer used of semiconductor crystal wafer, the film magnetic head of semiconductor element manufacturing usefulness or master (synthetic quartz, Silicon Wafer) of employed mask of exposure device or graticule etc.
Again; As exposure device; Except being applicable to mask M and substrate P are come the scanning exposure apparatus (scanning stepper) with the step-scan mode of the scan exposure that carries out substrate P through the exposure light IL to the pattern of mask M with moved further; Also can be applicable to make under the static state of mask M and substrate P, make the pattern single exposure of mask M, and make the projection aligner (stepper) of the stepping repetitive mode that substrate P stepping in regular turn moves.
Again, the present invention also can be applicable to the exposure device of the two microscope carrier types that possess a plurality of baseplate carriers that disclosed like No. the 6341007th, U.S.'s patent of invention, No. the 6208407th, U.S.'s patent of invention, No. the 6262796th, U.S.'s patent of invention etc.
Again, the present invention also can be applicable to like what No. the 6897963rd, U.S.'s patent of invention, No. the 1713113rd, Europatent application etc. was disclosed and possess the baseplate carrier that keeps substrate and do not keep substrate and carried the exposure device of the measurement microscope carrier of the reference feature that is formed with reference mark and/or various photo switches, photo sensors.Also can adopt the exposure device that possesses a plurality of baseplate carriers and measure microscope carrier again.
In addition; In the above-mentioned example; Though use the transmittance type mask on the transmitance substrate, be formed with set light-shielding pattern (or phase pattern, dim light pattern); But also this mask of instead for example uses that No. 6778257 communique of U.S.'s patent of invention discloses, and forms transmission pattern or reflection graphic patterns or forms the variable shaping mask (also be called electronics mask, initiatively mask or image generator) of luminous pattern according to the electronic bits of data of treating exposing patterns.Again, also instead possesses the variable shaping mask of non-light emitting-type image display element, and possesses the pattern apparatus for converting that comprises the emissive type image display element.
The exposure device of above-mentioned example is through assembling various subsystems (containing each inscape), can keep the mode manufacturing of set mechanical precision, electric precision, optical accuracy.For guaranteeing these various precision; Before and after assembling, carry out various optical systems are carried out in order to the adjustment of reaching optical accuracy, various mechanical systems are carried out in order to the adjustment of reaching mechanical precision, various electrical systems are carried out in order to reach the adjustment of electric precision.From the packaging technology of various subsystems to exposure device, comprise the distribution connection of mechanical connection, circuit, the pipe arrangement connection of pneumatic circuit etc.Certainly, before the packaging technology of various subsystems to exposure device, each subsystem other packaging technology is arranged.After the packaging technology of various subsystems to exposure device finishes, promptly comprehensively adjust, with the various precision of guaranteeing that exposure device EX is whole.In addition, the manufacturing of exposure device is preferably carried out in the clean room that temperature and cleannes etc. is all managed.
The microcomponent of semiconductor element etc.; Shown in Figure 53; Through the function of carrying out microcomponent, the step 201 of performance design,, make the step 203 of the substrate of device substrate according to the step 202 that this design procedure is made mask (graticule); Comprise according to above-mentioned example and carry out processing substrate (exposure-processed; Comprise the action of using mask pattern to make the action of base plate exposure and the exposure metacoxal plate being developed with exposure light) processing substrate step 204, element number of assembling steps (processing technology that comprises cutting step, integrating step, encapsulation step etc.) 205, and inspection step 206 etc. and making.In addition, in step 204, comprise through emulsion is developed, and form the exposing patterns layer corresponding (emulsion of having developed layer), and pass through the action of this exposing patterns layer substrate processing with the pattern of mask.
In addition, the important document of above-mentioned each example and variation can suitably make up.The situation of not using a part of inscape is also arranged again.Again, in the decree tolerance band, quote that above-mentioned each example and variation quote about the announcement of all the open communiques of exposure device etc. and United States Patent (USP) a part as this paper record.
Claims (66)
1. carrying device, it possesses:
The 1st support, a supply gas to substrate can support said substrate through this gas suspension;
The 2nd support can support the said one side of said substrate;
Drive division, at least one that makes the said the 1st and the 2nd support moves, and makes the closer to each other or contact of the 1st and the 2nd support and is arranged in the 1st direction; And
Handover portion, the said substrate that a side of the said the 1st and the 2nd support that will arrange through said drive division is supported is along said the 1st direction toward the opposing party's side shifting.
2. carrying device as claimed in claim 1; Wherein, Said drive division is arranged in the said substrate that a side of the said the 1st and the 2nd support is supported with the said the 1st and the 2nd support in said the 1st direction, is disposed at the more said the 1st and the high position of the opposing party of the 2nd support.
3. carrying device as claimed in claim 2; Wherein, Said drive division; The the said the 1st and the 2nd support is arranged in a side's of the said the 1st and the 2nd support that is supported with said substrate top surface portion in said the 1st direction, is disposed at the more said the 1st and the opposing party's of the 2nd support the high position of top surface portion.
4. like each described carrying device in the claim 1 to 3, wherein, said drive division is arranged at least a portion and said the 2nd support is an one.
5. like each described carrying device in the claim 1 to 4, wherein, said drive division is set as at least a portion and can moves with said the 1st support one.
6. like each described carrying device in the claim 1 to 5, wherein, said the 2nd support, the said supply gas to said substrate can support said substrate through this gas suspension.
7. like each described carrying device in the claim 1 to 6, wherein, the said the 1st and the 2nd support is configured at least a portion and under overlooking, overlaps each other, and said drive division makes the said the 1st and the 2nd support be displaced into vertical direction at least.
8. like each described carrying device in the claim 1 to 7, wherein, said handover portion has with the roller mechanism that is contacted with the state rotation below the said substrate and the said substrate of regulation the said the 1st or the position specified part of the position of the 2nd support;
Said roller mechanism is so that the mode of said position specified part butt moves said substrate.
9. like each described carrying device in the claim 1 to 7, wherein, said handover portion, have absorption keep said substrate the end adsorbing mechanism with detect said substrate to the said the 1st or the position detection part of the position of the 2nd support;
Said adsorbing mechanism moves said substrate according to the testing result of said position detection part.
10. like each described carrying device in the claim 1 to 9, the leaning device that its top surface portion with the said the 1st or the 2nd support that makes the said substrate of supporting tilts.
11. like each described carrying device in the claim 1 to 10, it possesses the position detection part of the relative position that detects said the 1st support and said the 2nd support.
12. a carrying device, it possesses:
The 1st support, a supply gas to substrate can support said substrate through this gas suspension;
The the 2nd and the 3rd support can support the said one side of said substrate;
The 1st drive division, at least one that makes the said the 1st and the 2nd support moves, and makes the closer to each other or contact of the 1st and the 2nd support and is arranged in the 1st direction;
The 2nd drive division, at least one that makes the said the 1st and the 3rd support moves, and makes the closer to each other or contact of the 1st and the 3rd support and is arranged in the 2nd direction;
The 1st handover portion will be arranged in said substrate that said the 2nd support of said the 1st support supported along said the 1st direction toward said the 1st support side shifting through said the 1st drive division; And
The 2nd handover portion will be arranged in said substrate that said the 1st support of said the 3rd support supported along said the 2nd direction toward said the 3rd support side shifting through said the 2nd drive division.
13. carrying device as claimed in claim 12, wherein, said the 1st drive division is arranged in the said substrate that said the 2nd support is supported with the said the 1st and the 2nd support in said the 1st direction, is disposed at the high position of more said the 1st support.
14. carrying device as claimed in claim 13; Wherein, Said the 1st drive division is arranged in the top surface portion of said the 2nd support that is supported with said substrate with the said the 1st and the 2nd support in said the 1st direction, is disposed at the high position of top surface portion of more said the 1st support.
15. like each described carrying device in the claim 12 to 14; Wherein, Said the 2nd drive division is arranged in the said substrate that said the 1st support is supported with the said the 1st and the 3rd support in said the 2nd direction, is disposed at the high position of more said the 3rd support.
16. carrying device as claimed in claim 15; Wherein, Said the 2nd drive division is arranged in the top surface portion of said the 1st support that is supported with said substrate with the said the 1st and the 3rd support in said the 2nd direction, is disposed at the high position of top surface portion of more said the 3rd support.
17. like each described carrying device in the claim 12 to 16, wherein, said the 1st drive division is arranged at least a portion and said the 2nd support is an one;
Said the 2nd drive division is arranged at least a portion and said the 3rd support is an one.
18. like each described carrying device in the claim 12 to 17, wherein, the said the 1st and the 2nd drive division, being set as at least a portion respectively can move with said the 1st support one.
19. like each described carrying device in the claim 12 to 18, wherein, the said the 2nd and the 3rd support is disposed at the different position in the same horizontal plane.
20. like each described carrying device in the claim 12 to 19; Wherein, The the said the 2nd and the 3rd support is configured at least a portion and under overlooking, overlaps each other, and the said the 1st and the 2nd drive division makes the said the 2nd and the 3rd support be displaced into vertical direction at least respectively.
21. like each described carrying device in the claim 12 to 20, wherein, at least one side of said the 2nd support and said the 3rd support, the said supply gas to said substrate can support said substrate through this gas suspension.
22. like each described carrying device in the claim 12 to 21, the 2nd leaning device that the 1st leaning device that its top surface portion with said the 2nd support that makes the said substrate of supporting tilts and top surface portion of said the 1st support that makes the said substrate of supporting tilt.
23. like each described carrying device in the claim 12 to 22, it possesses and detects said the 1st support and the said the 2nd or the position detection part of the relative position of said the 3rd support.
24. like each described carrying device in the claim 12 to 23; Wherein, At least one side of said the 1st handover portion and the 2nd handover portion, have with the roller mechanism that is contacted with the state rotation below the said substrate, with regulation as the said substrate of the mobile destination of said substrate position specified part to the position of said the 1st support or the 2nd support;
Said roller mechanism is so that the mode of said position specified part butt moves said substrate.
25. like each described carrying device in the claim 12 to 23; Wherein, At least one of said the 1st handover portion and the 2nd handover portion, have absorption keep the end of said substrate adsorbing mechanism, with detect as the said substrate of the mobile destination of said substrate position detection part the position of said the 1st support or the 2nd support;
Said adsorbing mechanism moves said substrate according to the testing result of said position detection part.
26. like each described carrying device in the claim 12 to 25, wherein, said the 1st direction that said the 1st drive division is arranged the said the 1st and the 2nd support is parallel with said the 2nd direction that said the 2nd drive division is arranged the said the 1st and the 3rd support.
27. like each described carrying device in the claim 1 to 20, wherein, said the 1st support stops after the supply of said gas this substrate-placing in top surface portion.
28. a transport method, the conveyance substrate, it comprises:
Enable pass cross to the one side gas supplied of said substrate with the 1st support of the said substrate of supporting that suspends, and at least one side of the 2nd support that can support the said one side of said substrate move so that the 1st and the 2nd support is closer to each other or contact and be arranged in the action of the 1st direction; And
The action of said substrate that one side of the said the 1st and the 2nd support of being arranged is supported along said the 1st direction toward the opposing party's side shifting.
29. transport method as claimed in claim 28, it is arranged in the said substrate that a side of the said the 1st and the 2nd support is supported with the said the 1st and the 2nd support in said the 1st direction, is disposed at the more said the 1st and the high position of the opposing party of the 2nd support.
30. a transport method, the conveyance substrate, it comprises:
Enable pass is crossed the one side gas supplied of said substrate is moved with the 1st support of the said substrate of supporting that suspends and at least one side of the 2nd support that can support the said one side of said substrate, so that the 1st and the 2nd support is closer to each other or contact and be arranged in the action of the 1st direction;
Said substrate the action that said the 2nd support that is arranged in said the 1st support is supported along said the 1st direction toward said the 1st support side shifting;
At least one side of the 3rd support who makes said the 1st support and can support the said one side of said substrate moves, so that the 1st and the 3rd support is closer to each other or contact and be arranged in the action of the 2nd direction; And
Said substrate the action that said the 1st support that is arranged in said the 3rd support is supported along said the 2nd direction toward said the 3rd support side shifting.
31. transport method as claimed in claim 30, it is arranged in the said substrate that said the 2nd support is supported with the said the 1st and the 2nd support in said the 1st direction, is disposed at the high position of more said the 1st support.
32. like claim 30 or 31 described transport methods, it is arranged in the said substrate that said the 1st support is supported with the said the 1st and the 3rd support in said the 2nd direction, is disposed at the high position of more said the 3rd support.
33. like each described transport method in the claim 30 to 32; Wherein, Said the 1st support sector is disposed at said the 2nd support and said the 3rd support of different position in the same horizontal plane relatively, moves along the orientation of said the 2nd support and said the 3rd support.
34. like each described transport method in the claim 30 to 32; Wherein, Relatively move, and 2nd or 3rd support said the 1st overlooking the said the 2nd and the 3rd support that overlaps each other down and be disposed to arrange in the different position of vertical direction with being configured at least a portion through said the 1st support.
35. an exposure device makes base plate exposure with exposure light, it possesses:
Keep said substrate and make said substrate move to each described carrying device in the claim 1 to 27 of irradiation area of said exposure light.
36. a manufacturing method, it comprises:
Use the described exposure device of claim 35 to be coated with the exposure of the said substrate of emulsion, with in the action of this substrate pattern transferring;
The said emulsion of making public through said exposure is developed, with the action of the exposing patterns layer that forms corresponding said pattern; And
The action of processing said substrate through said exposing patterns layer.
37. a carrying device, it possesses:
The 1st support, a supply gas to substrate can support said substrate through this gas suspension;
The 2nd support can support the said one side of said substrate;
Drive division, at least one that makes the said the 1st and the 2nd support moves, and makes the closer to each other or contact of the 1st and the 2nd support and arranges;
Handover portion, the said substrate that will be supported through said the 2nd support that said drive division is arranged is along said orientation toward said the 1st support side shifting;
Jacking mechanism, supporting are carried because of the supply that stops said gas places carrying of said the 1st support to put the said substrate of portion, and toward the top jack-up of putting portion this year; And
Take out of mechanism, will be supported in the said substrate of putting the portion top in said year through this jacking mechanism and take out of from said the 1st support.
38. carrying device as claimed in claim 37, wherein, said jacking mechanism possessed: to the said year moving up and down a plurality of movable links of the portion of putting; And
Be set up at least two said movable links and can support at least one supporting member of said substrate;
Said movable link is with said supporting member moving up and down to the said year outstanding mode of submerging of the portion of putting with contact site said substrate.
39. carrying device as claimed in claim 38, wherein, said supporting member comprises relatively at least two said movable links and is set up in a plurality of the 1st of the 1st direction and sets up portion and be set up in a plurality of the 2nd of the 2nd direction and set up portion, forms lattice shape.
40. carrying device as claimed in claim 39, wherein, a plurality of said supporting members, said the 1st direction in edge is disposed at the long side direction of said lattice shape, and along the apart arranged spaced of said the 2nd direction.
41. like each described carrying device in the claim 38 to 40, wherein, said movable link is set as from said the 1st support outstanding.
42. like each described carrying device in the claim 38 to 41, wherein, said supporting member is accommodated in said the 1st support and put the different position of portion in said year.
43. carrying device as claimed in claim 42, wherein, a plurality of parts that said year portion of putting comprises the groove shape recess zoning that is formed on said the 1st support are carried the portion of putting;
Said supporting member is accommodated in said recess.
44. carrying device as claimed in claim 43, wherein, said movable link is set as from said recess outstanding.
45. like each described carrying device in the claim 38 to 44, wherein, the said mechanism that takes out of comprises the fork portion of accepting by the said substrate of said supporting members supports.
46. carrying device as claimed in claim 45, wherein, said jacking mechanism possesses a plurality of said supporting members;
Said substrate supports in said fork portion between adjacent said supporting member.
47. carrying device as claimed in claim 37, wherein, a plurality of parts that said year portion of putting comprises the groove shape recess zoning that is formed on said the 1st support are carried the portion of putting;
Said jacking mechanism comprise through the state that inserts said recess down rising support the fork portion below the said substrate.
48. carrying device as claimed in claim 47, wherein, said jacking mechanism comprises: drive division, the fork portion that drives the said substrate of supporting move it to the different position of said the 1st support, this jacking mechanism double as is the said mechanism that takes out of.
49. carrying device as claimed in claim 37, wherein, said jacking mechanism comprises the maintaining part that keeps said substrate and rise.
50. carrying device as claimed in claim 49, wherein, said maintaining part keeps said substrate with contactless state.
51. like claim 49 or 50 described carrying devices, wherein, said jacking mechanism has a plurality of said maintaining parts.
52. like each described carrying device in the claim 49 to 51, wherein, said jacking mechanism comprises the supporting member of the end of supporting said substrate.
53. like each described carrying device in the claim 49 to 52; Wherein, Said jacking mechanism comprises: drive division, drive to keep the said maintaining part of said substrate move it to the different position of said the 1st support, this jacking mechanism double as is the said mechanism that takes out of.
54. like each described carrying device in the claim 37 to 53, wherein, said drive division is arranged in the said substrate that said the 2nd support is supported with the said the 1st and the 2nd support, is disposed at the high position of more said the 1st support.
55. carrying device as claimed in claim 54, wherein, said drive division is arranged in the top surface portion of said the 2nd support that is supported with said substrate with the said the 1st and the 2nd support, is disposed at the high position of top surface portion of more said the 1st support.
56. like each described carrying device in the claim 37 to 55, wherein, said drive division is arranged at least a portion and said the 2nd support is an one.
57. like each described carrying device in the claim 37 to 56, wherein, said drive division is set as at least a portion and can moves with said the 1st support one.
58. like each described carrying device in the claim 37 to 57, wherein, said the 2nd support, the said supply gas to said substrate can support said substrate through this gas suspension.
59. like each described carrying device in the claim 37 to 58; Wherein, Said handover portion has with the roller mechanism of the following state rotation that is contacted with said substrate and the said substrate of regulation the said the 1st or the position specified part of the position of the 2nd support;
Said roller mechanism is so that the mode of said position specified part butt moves said substrate.
60. like each described carrying device in the claim 37 to 59, wherein, said handover portion, have absorption keep said substrate the end adsorbing mechanism with detect said substrate to the said the 1st or the position detection part of the position of the 2nd support;
Said adsorbing mechanism moves said substrate according to the testing result of said position detection part.
61. like each described carrying device in the claim 37 to 60, the leaning device that its top surface portion with the said the 1st or the 2nd support that makes the said substrate of supporting tilts.
62. like each described carrying device in the claim 37 to 61, it possesses the relative position test section of the relative position that detects said the 1st support and said the 2nd support.
63. a transport method, the conveyance substrate, it comprises:
Enable pass is crossed the one side gas supplied of said substrate is moved with the 1st support of the said substrate of supporting that suspends and at least one side of the 2nd support that can support the said one side of said substrate, so that the 1st and the 2nd support is closer to each other or contact and the action of arrangement;
The action that the said substrate that said the 2nd support of being arranged is supported send along said orientation toward said the 1st support sidesway;
Through stopping the supply of said gas, a carrying places the said substrate that carries the portion of putting and the past action of putting the top jack-up of portion this year of said the 1st support; And
With being supported in the action that the said substrate of putting portion top in said year is taken out of from said the 1st support.
64. like the described transport method of claim 63, it is arranged in more said the 1st support height of said substrate that said the 2nd support is supported with the said the 1st and the 2nd support.
65. an exposure device makes base plate exposure with exposure light, it possesses:
Keep said substrate and make said substrate move to each described carrying device in the claim 37 to 62 of irradiation area of said exposure light.
66. a manufacturing method, it comprises:
Use the described exposure device of claim 65 to be coated with the exposure of the said substrate of emulsion, with in the action of this substrate pattern transferring;
The said emulsion of making public through said exposure is developed, with the action of the exposing patterns layer that forms corresponding said pattern; And
The action of processing said substrate through said exposing patterns layer.
Priority Applications (2)
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| CN201611216877.XA CN106876311B (en) | 2010-02-17 | 2011-02-17 | Transfer apparatus, transfer method, exposure apparatus, and device manufacturing method |
| CN201611218293.6A CN107017191B (en) | 2010-02-17 | 2011-02-17 | Transfer apparatus, exposure apparatus, and device manufacturing method |
Applications Claiming Priority (5)
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| US30543910P | 2010-02-17 | 2010-02-17 | |
| US30535510P | 2010-02-17 | 2010-02-17 | |
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| US61/305,355 | 2010-02-17 | ||
| PCT/JP2011/053356 WO2011102410A1 (en) | 2010-02-17 | 2011-02-17 | Transfer apparatus, transfer method, exposure apparatus, and device manufacturing method |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201611216877.XA Division CN106876311B (en) | 2010-02-17 | 2011-02-17 | Transfer apparatus, transfer method, exposure apparatus, and device manufacturing method |
| CN201611218293.6A Division CN107017191B (en) | 2010-02-17 | 2011-02-17 | Transfer apparatus, exposure apparatus, and device manufacturing method |
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| CN102763209B CN102763209B (en) | 2017-02-08 |
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| CN201611216877.XA Active CN106876311B (en) | 2010-02-17 | 2011-02-17 | Transfer apparatus, transfer method, exposure apparatus, and device manufacturing method |
| CN201611218293.6A Active CN107017191B (en) | 2010-02-17 | 2011-02-17 | Transfer apparatus, exposure apparatus, and device manufacturing method |
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| CN201611216877.XA Active CN106876311B (en) | 2010-02-17 | 2011-02-17 | Transfer apparatus, transfer method, exposure apparatus, and device manufacturing method |
| CN201611218293.6A Active CN107017191B (en) | 2010-02-17 | 2011-02-17 | Transfer apparatus, exposure apparatus, and device manufacturing method |
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| JP (6) | JP5915521B2 (en) |
| KR (3) | KR102172551B1 (en) |
| CN (3) | CN102763209B (en) |
| TW (4) | TWI777060B (en) |
| WO (1) | WO2011102410A1 (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201933520A (en) | 2019-08-16 |
| KR102172551B1 (en) | 2020-11-02 |
| KR102023655B1 (en) | 2019-09-23 |
| TWI777060B (en) | 2022-09-11 |
| JP2019124962A (en) | 2019-07-25 |
| JPWO2011102410A1 (en) | 2013-06-17 |
| KR20180088493A (en) | 2018-08-03 |
| CN102763209B (en) | 2017-02-08 |
| JP5915521B2 (en) | 2016-05-11 |
| KR20130006612A (en) | 2013-01-17 |
| JP2017059852A (en) | 2017-03-23 |
| KR101883319B1 (en) | 2018-07-31 |
| TWI631649B (en) | 2018-08-01 |
| JP6512248B2 (en) | 2019-05-15 |
| CN106876311A (en) | 2017-06-20 |
| TWI661505B (en) | 2019-06-01 |
| CN107017191A (en) | 2017-08-04 |
| TWI587430B (en) | 2017-06-11 |
| JP2015008334A (en) | 2015-01-15 |
| TW201731009A (en) | 2017-09-01 |
| TW201838076A (en) | 2018-10-16 |
| JP6780732B2 (en) | 2020-11-04 |
| JP6191721B2 (en) | 2017-09-06 |
| TW201142977A (en) | 2011-12-01 |
| CN107017191B (en) | 2020-08-14 |
| JP2016157133A (en) | 2016-09-01 |
| JP2017207779A (en) | 2017-11-24 |
| KR20190108202A (en) | 2019-09-23 |
| CN106876311B (en) | 2021-01-05 |
| WO2011102410A1 (en) | 2011-08-25 |
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