KR20180088493A - Transfer apparatus, transfer method, exposure apparatus, and device manufacturing method - Google Patents

Abstract

The transfer device comprises a first support part (3) capable of supplying gas to one surface of the substrate and lifting and supporting the substrate through the substrate, a second support part (400) capable of supporting one surface of the substrate, A driving part (402) for moving at least one of the second supporting parts and arranging the first and second supporting parts in proximity to or in contact with each other in the first direction, and a first supporting part And a transfer unit for moving the substrate along the first direction to the other side.

Description

TECHNICAL FIELD [0001] The present invention relates to a transfer apparatus, a transfer method, an exposure apparatus, and a device manufacturing method,

The present invention relates to a transport apparatus, a transport method, an exposure apparatus, and a device manufacturing method.

This application claims priority based on US Provisional Application No. 61 / 305,355, filed February 17, 2010, and 61/305, 439, the contents of which are incorporated herein by reference.

2. Description of the Related Art In a manufacturing process of an electronic device such as a flat panel display, a processing apparatus for a large substrate such as an exposure apparatus or an inspection apparatus is used. In the exposure process and inspection process using these processing apparatuses, a transport apparatus as disclosed in the following Patent Document is used which transports a large substrate (for example, a glass substrate) to a processing apparatus.

Japanese Patent Application Laid-Open No. 2001100169

In the above-described transporting apparatus for a large substrate, when the substrate supported by the substrate supporting member is transferred (transferred) to the substrate holding unit, an air layer is interposed between the substrate and the substrate holding unit, There is a case where the substrate is misaligned with respect to the placement position of the sub-image. If a misalignment or deformation occurs on the post-processed substrate, for example, in the exposure apparatus, there arises a problem of poor exposure, for example, a predetermined exposure can not be performed at an appropriate position on the substrate. When the substrate is misaligned or deformed, for example, there is a problem that the processing of the substrate is delayed, for example, by repeating the transfer of the substrate. Further, if the conveying speed of the substrate is lowered, for example, the processing of the substrate is further delayed so that the air layer does not remain after the transfer.

An aspect of the present invention is to provide a carrying apparatus, a carrying method, an exposure apparatus, and a device manufacturing method which can carry out transfer of a substrate without causing misalignment or deformation.

According to a first aspect of the present invention, there is provided a plasma processing apparatus comprising: a first support portion that supplies gas to one surface of a substrate and lifts and supports the substrate through the substrate; a second support portion capable of supporting the one surface of the substrate; A driving part for moving at least one of the first and second supporting parts and arranging the first and second supporting parts in a first direction in close proximity to or in contact with each other; And a transfer unit for moving the substrate supported by one side of the support unit to the other side along the first direction.

According to a second aspect of the present invention, there is provided a plasma processing apparatus comprising: a first support section for supplying gas to one surface of a substrate and floating the substrate through the substrate; A first driving part for moving at least one of the first and second supporting parts and arranging the first and second supporting parts in a first direction in proximity to or in contact with each other; A second driving part for moving at least one of the first supporting part and the second supporting part in a second direction by moving the first and third supporting parts in proximity to or in contact with each other, A first transfer unit that moves the substrate supported by the first support unit toward the first support unit along the first direction and a second transfer unit that supports the substrate supported by the first support unit by the second drive unit, Along the second direction, the transport apparatus and a second transfer unit for moving the side of the third support portion is provided.

According to a third aspect of the present invention, there is provided a carrying method for carrying a substrate, comprising: a first supporting part capable of lifting and supporting the substrate through a base supplied to one surface of the substrate; And at least one of the first and second support portions is arranged to be arranged in a first direction by moving at least one of the first and second support portions in proximity to or in contact with each other, To the other side along the direction of the conveying path.

According to a fourth aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: moving at least one of a first support portion capable of lifting and supporting the substrate through a gas supplied to a first surface of the substrate; and a second support portion capable of supporting the one surface of the substrate , Arranging the first and second support portions in a first direction in proximity to or in contact with each other, and arranging the substrate supported by the second support portion arranged on the first support portion toward the first support portion along the first direction Moving at least one of the first supporting portion and the third supporting portion supporting one surface of the substrate and arranging the first and third supporting portions in a second direction in proximity to or in contact with each other; And moving the substrate supported by the first support portion arranged on the third support portion toward the third support portion along the second direction, It is provided.

According to a fifth aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: a first supporting portion for supplying a gas to one surface of a substrate and lifting and supporting the substrate through the substrate; a second supporting portion for supporting the one surface of the substrate; A driving part for moving at least one of the first and second supporting parts so as to arrange the first and second supporting parts in close proximity to or in contact with each other and a supporting part for supporting the substrate supported by the second supporting part arranged by the driving part, A lift mechanism for supporting the substrate placed on the placement portion of the first support portion by stopping the supply of the base and lifting the substrate up to a position above the placement portion, And a carry-out mechanism for taking out the substrate supported above the placement portion by the first support portion from the first support portion.

According to a sixth aspect of the present invention, there is provided a transport method for transporting a substrate, comprising: a first support portion capable of lifting and supporting the substrate through a base supplied to one surface of the substrate; At least one of the first and second support portions is moved so that the first and second support portions are arranged close to or in contact with each other and the substrate supported by the arranged second support portion is conveyed to the first support portion side along the arrangement direction Holding the substrate mounted on the mounting portion of the first supporting portion by stopping the supply of the base and raising the mounting portion upward; holding the substrate supported above the mounting portion from the first supporting portion A carrying method is provided which includes carrying out.

According to a seventh aspect of the present invention, there is provided an exposure apparatus comprising: the above-described exposure apparatus for exposing a substrate with exposure light, the above-described transfer apparatus holding the substrate and moving the substrate to an area irradiated with the exposure light .

According to an eighth aspect of the present invention, there is provided a device manufacturing method comprising transferring the pattern onto the substrate using the above exposure apparatus, and processing the substrate on which the pattern is transferred based on the pattern .

According to the aspect of the present invention, it is possible to carry out the transfer of the substrate without generating a misalignment or deformation.

1 is a cross-sectional plan view showing an entire outline of an exposure apparatus.
2 is an external perspective view showing a specific configuration in the chamber.
3A is a diagram showing a peripheral configuration of the plate holder.
3B is a view showing a peripheral configuration of the plate holder.
4A is a view showing the configuration of the main part of the carry-in part.
4B is a view showing the configuration of the main part of the carry-in part.
5A is a view showing a configuration of a main part of a carry-out section.
5B is a view showing the configuration of the main part of the carry-out part.
FIG. 6 is a view for explaining a process of transferring a substrate to a transfer table. FIG.
Fig. 7A is an explanatory diagram of the step of transporting the substrate between the plate holder and the carry-out part.
Fig. 7B is an explanatory view of the step of transporting the substrate between the plate holder and the carry-out part.
8 is a view showing a state in which a substrate is lifted and supported on a loading table.
Fig. 9 is a view for explaining a step of transporting a substrate on a carry-in table. Fig.
10 is a view for explaining a step of moving the substrate to the plate holder side.
11 is a view showing a state in which a substrate is placed on a plate holder.
Fig. 12 is a view for explaining a process of transferring a substrate to a carry-out table.
13 is a view showing a state in which a substrate is lifted and supported on a plate holder.
14A is a view for explaining the conveying of the substrate from the plate holder to the carry-out side.
14B is a view for explaining the conveying of the substrate from the plate holder to the carry-out side.
14C is a view for explaining the conveying of the substrate from the plate holder to the carry-out side.
15 is a view for explaining an operation of carrying out the substrate from the carry-out portion.
16A is a diagram showing a configuration of a carry-in section according to the second embodiment.
16B is a view showing a configuration of a carry-in section according to the second embodiment.
17 is a view for explaining a configuration for transporting a substrate from a carry-in part to a plate holder side.
Fig. 18 is a view for explaining the process subsequent to Fig. 17. Fig.
19 is a view showing the configuration of the plate holder according to the third embodiment.
20A is a view for explaining a configuration for transporting a substrate from a carry-in part to a plate holder side.
20B is a view for explaining a configuration for transporting a substrate from a carry-in portion to a plate holder side.
21 is a diagram showing a configuration according to the fourth embodiment.
Fig. 22A is a view for explaining the feeding operation of the substrate according to the fourth embodiment. Fig.
Fig. 22B is a view for explaining the feeding operation of the substrate according to the fourth embodiment. Fig.
22C is a view for explaining the feeding operation of the substrate according to the fourth embodiment.
Fig. 22D is a view for explaining the feeding operation of the substrate according to the fourth embodiment. Fig.
Fig. 23 is a perspective view showing a configuration inside the chamber according to the fifth embodiment. Fig.
24A is a plan view showing a schematic configuration of the carry-in / out section.
24B is a plan view showing a schematic configuration of the carry-in / out section.
25 is a view for explaining a carrying-in step of the substrate according to the fifth embodiment.
26 is a view for explaining the transfer of the substrate from the carry-in / out section to the plate holder side.
27 is a view for explaining the transfer of the substrate from the plate holder to the carry-in / out side.
28 is a cross-sectional plan view showing an entire outline of the exposure apparatus.
29 is an external perspective view showing a specific configuration in the chamber.
30A is a diagram showing a peripheral configuration of the plate holder.
30B is a diagram showing a peripheral configuration of the plate holder.
31A is an explanatory view of a step of transporting a substrate between a plate holder and a carry-out portion.
Fig. 31B is an explanatory diagram of the step of transporting the substrate between the plate holder and the carry-out portion.
32 is a view showing a state in which the substrate is lifted and supported on the loading table.
Fig. 33 is a view for explaining the step of transporting the substrate on the loading table. Fig.
34 is a view for explaining a step of moving the substrate to the plate holder side.
35 is a diagram for explaining the operation of the carry-out robot.
36A is a front view for explaining the operation of carrying out the substrate from the plate holder.
36B is a front view for explaining the operation of carrying out the substrate from the plate holder.
37 is a side view for explaining the operation of carrying out the substrate from the plate holder.
38 is a diagram showing a configuration of a carry-in section according to the third embodiment.
39A is a view for explaining a configuration for transporting a substrate from a carry-in part to a plate holder side.
39B is a view for explaining a configuration for transporting the substrate from the carry-in portion to the plate holder side.
40 is a view showing a configuration of the exposure apparatus main body according to the fourth embodiment.
41 is a view showing a planar configuration of the plate holder.
42A is a side sectional view of the plate holder.
42B is a side sectional view of the plate holder.
Fig. 43 is a diagram showing the configuration of the up-and-down moving unit.
44A is a view for explaining a configuration for transporting a substrate from a carry-in portion to a plate holder side.
Fig. 44B is a view for explaining a configuration for transporting the substrate from the carry-in part to the plate holder side.
45 is a view showing a state in which the substrate is floated and supported on the loading table.
46 is a view showing a state in which an abutting portion is in contact with an end portion of the substrate.
47 is an explanatory diagram of a process in which a substrate is moved from a carry-in table to a plate holder.
48 is a perspective view for explaining the operation of the carry-out robot.
FIG. 49A is an explanatory diagram of a step of taking out a substrate from a plate holder. FIG.
FIG. 49B is an explanatory diagram of a step of taking out the substrate from the plate holder. FIG.
49C is an explanatory diagram of a step of taking out the substrate from the plate holder.
50A is a plan view showing the structure of the adsorption mechanism according to the fifth embodiment.
50B is a side view showing the structure of the adsorption mechanism according to the fifth embodiment.
51A is a side view for explaining the operation of taking out the substrate from the plate holder.
51B is a side view for explaining an operation of taking out the substrate from the plate holder.
FIG. 52A is a view showing a configuration related to a modification of the adsorption mechanism. FIG.
FIG. 52B is a view showing a configuration related to a modification of the adsorption mechanism. FIG.
53 is a flowchart for explaining an example of a manufacturing process of a microdevice.

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described with reference to the drawings. The present invention is not limited to this. Hereinafter, an exposure apparatus for carrying out an exposure process for exposing a pattern for a liquid crystal display device to a substrate to which a photosensitive agent is applied is provided and a transfer apparatus according to the present invention is described. One embodiment of the method will also be described.

(First Embodiment)

1 is a sectional plan view showing a schematic structure of an exposure apparatus according to the present embodiment. 1, the exposure apparatus 1 includes an exposure apparatus main body 3 for exposing a pattern for a liquid crystal display device to a substrate, a carry-in unit 4, and a carry-out unit 5, And is housed in a chamber 2 that is highly cleaned and adjusted to a predetermined temperature. In this embodiment, the substrate is a large glass plate, and the size of one side thereof is, for example, 500 mm or more.

Fig. 2 is an external perspective view showing a specific configuration in the chamber 2. Fig. As shown in Fig. 2, the main body 3 of the exposure apparatus is provided with an illumination system (not shown) for illuminating the mask M with the exposure light IL and an illumination system (not shown) for holding the mask M in which the pattern for the liquid crystal display device is formed A projection optical system PL disposed below the mask stage, and a base (not shown) disposed below the projection optical system PL. And a first moving mechanism 33 for holding the holder 9 and the plate holder 9 and for moving the plate holder 9 in the chamber 2.

In the following description, it is assumed that the plate holder 9 is two-dimensionally moved in a horizontal plane with respect to a base portion (not shown) formed in the chamber 2. In this horizontal plane, And the Y axis. The holding surface of the plate holder 9 with respect to the substrate P becomes parallel to the horizontal plane in the reference state (for example, the state when the substrate P is being transferred). In addition, the Z axis is set in the direction orthogonal to the X axis and the Y axis, and the optical axis of the projection optical system PL is parallel to the Z axis. The angular directions around the X axis, the Y axis, and the Z axis are referred to as? X direction,? Y direction, and? Z direction, respectively.

The first moving mechanism 33 has a moving mechanism main body 35 and a holding portion 34 which is disposed on the moving mechanism main body 35 and holds the plate holder 9. The moving mechanism body 35 is supported by a gas bearing in a noncontact manner on a guide surface (base portion) (not shown), and is movable on the guide surface in the X and Y directions. Based on such a configuration, the plate holder 9 is movable within a predetermined region of the guide surface on the light emitting side (the image plane side of the projection optical system PL) while holding the substrate P.

The moving mechanism main body 35 is movable in the XY plane on the guide surface by the operation of a coarse motion system including, for example, an actuator such as a linear motor. The holding portion 34 is movable in the Z-axis,? X, and? Y directions with respect to the moving mechanism main body 35 by the operation of a fine motion system including an actuator such as a voice coil motor. The holding unit 34 holds the substrate P in the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions in the state of holding the substrate P by the operation of the substrate stage driving system including the coarse system and the fine moving system. Direction.

The exposure apparatus 1 performs step-and-scan exposure in a state in which a rectangular substrate P is placed on the plate holder 9 and a pattern formed on the mask M is transferred onto the substrate P For example, four exposure regions (pattern transfer regions). That is, in this exposure apparatus 1, in the state in which the illumination region on the slit on the mask M is illuminated by the exposure light IL from the illumination system, a mask (not shown) And the plate holder 9 for holding the substrate P are moved in a predetermined scanning direction (here, in the Y-axis direction) in synchronism with a mask stage for holding the substrate P, (M) is transferred, that is, scan exposure is performed. The exposure apparatus 1 according to the present embodiment is characterized in that the projection optical system PL has a plurality of projection optical modules and the illumination system includes a plurality of illumination modules corresponding to a plurality of projection optical modules, Thereby constituting a scan exposure apparatus.

After the end of the scanning exposure of this one exposure area, a stepping operation is performed in which the plate holder 9 is moved in the predetermined X direction to the scanning start position of the next exposure area. In the exposure apparatus main body 3, the pattern of the mask M is sequentially transferred to the four exposure regions by repeating such scanning exposure and stepping operations.

As shown in Fig. 2, when the substrate P coated with a photosensitive agent is carried in a coater / developer (not shown) disposed adjacent to the exposure apparatus 1, And a second moving mechanism 43 for moving the table 40 for carrying it. In addition, the carrying-in unit 4 is capable of adjusting the temperature of the substrate P carried in the carrying-in table 40.

The second moving mechanism 43 has a moving mechanism main body 45 and a holding portion 44 which is disposed on the moving mechanism main body 45 and holds the loading table 40. The moving mechanism main body 45 is supported by a gas bearing in a non-contact manner on a guide surface (not shown), and is movable on the guide surface in the X and Y directions. Based on such a configuration, the carry-in table 40 is movable in a predetermined area of the guide surface while holding the substrate P. The support of the moving mechanism body 45 relative to the guide surface (not shown) is not limited to the support by the gas bearing, but a known guide mechanism (drive mechanism for the guide surface) different from the gas bearing may be used .

The moving mechanism main body 45 has the same configuration as the moving mechanism main body 35 and is movable in the XY plane on the guide surface. The holding portion 44 has the same structure as the holding portion 34 and is movable in the Z-axis,? X, and? Y directions with respect to the moving mechanism main body 45. The holding portion 44 is movable in six directions in the X-axis, Y-axis, Z-axis,? X,? Y, and? Z directions while holding the substrate P.

2, when the substrate P subjected to the exposure process by the exposure apparatus main body 3 is transferred, the carry-out section 5 is provided with one surface (lower surface) of the substrate P , And a third moving mechanism (53) for moving the carrying-out table (50).

The third moving mechanism 53 has a moving mechanism main body 55 and a holding portion 54 which is disposed on the moving mechanism main body 55 and holds the carrying-out table 50. The moving mechanism body 55 is supported by a gas bearing in a non-contact manner with a guide surface (not shown), and is movable on the guide surface in the X and Y directions. Based on such a configuration, the carrying-out table 50 can move within a predetermined region of the guide surface while holding the substrate P.

The moving mechanism body 55 has the same configuration as the moving mechanism bodies 35 and 45 and is movable in the XY plane on the guide surface. The holding portion 54 has the same configuration as that of the holding portions 34 and 44 and is movable in the Z-axis,? X, and? Y directions with respect to the moving mechanism main body 55. The holding portion 54 is movable in six directions in the X-axis, Y-axis, Z-axis,? X,? Y, and? Z directions while holding the substrate P.

Next, the peripheral configuration of the plate holder 9 will be described with reference to Figs. 3A and 3B. Fig. 3A is a plan view of the plate holder 9, and Fig. 3B is a side view of the plate holder 9. Fig. As shown in Fig. 3A, the plate holder 9 is provided with a substrate mounting portion 31 on which a substrate P is placed. The upper surface of the substrate mounting portion 31 is finished so that the substantially holding surface of the plate holder 9 with respect to the substrate P has a good flatness. A plurality of suction holes K1 are formed on the upper surface of the substrate mounting portion 31 so as to bring the substrate P in close contact with this surface. Each suction hole K1 is connected to a vacuum pump (not shown).

A plurality of gas injection holes K2 are formed on the upper surface of the substrate mounting portion 31 for supporting the substrate P by floating the substrate P by spraying a gas such as air onto the lower surface of the substrate P . Each gas injection hole K2 is connected to a gas branch pump not shown. In addition, the suction hole K1 and the gas injection hole K2 are arranged in a zigzag pattern.

A guide pin 36 for guiding the substrate P at the time of carrying the substrate P and a guide pin 36 for guiding the substrate P to the substrate mounting portion 31 of the plate holder 9 are formed in the periphery of the plate holder 9, A positioning pin 37 for defining the position of the positioning pin P is formed. The guide pins 36 and the positioning pins 37 are movable together with the plate holder 9 in the exposure apparatus main body 3.

3B, the plate holder 9 is provided with a position detection sensor 19 for detecting the relative position of the carry-in table 40 and the carry-out table 50 to the side portion 9a thereof. The position detection sensor 19 is provided with a distance detection sensor 19a for detecting the relative distance to the carry-in table 40 and the carry-out table 50, And a height detection sensor 19b for detecting a relative height to the height detection sensor 19b. The position detecting sensor 19 and the loading table 40 are provided with recesses at positions corresponding to the position detecting sensor 19 in the loading table 40 and the loading table 50. Therefore, And the carrying-out table 50 are prevented from interfering with each other.

Next, the configuration of the main part of the carry-in unit 4 will be described with reference to Figs. 4A and 4B. FIG. 4A is a plan view showing the peripheral configuration of the loading table 40, and FIG. 4B is a view showing a section taken along the line AA in FIG. 4A.

4A and 4B, the carrying section 4 is formed with a first carrying section 42 for carrying the substrate P from the carrying-in table 40 to the plate holder 9. The first transfer section 42 includes a guide section 42a and an abutting section 42b abutting the substrate P. [

On the upper surface of the loading table 40, two groove-shaped concave portions 40a formed in one direction (the Y direction shown in the drawing) are formed. The guide portion 42a is formed in the concave portion 40a. The guide portion 42a is provided with the abutting portion 42b so as to protrude from the upper surface of the loading table 40. [ The abutting portion 42b is made of, for example, an elastic member such as rubber, and the damage to the substrate P when abutted can be reduced.

A plurality of gas ejection holes K3 are formed on the upper surface of the loading table 40 for supporting the substrate P by floating the substrates P by blowing a gas such as air onto the lower surface of the substrate P . Each gas injection hole K3 is connected to a gas branch pump not shown.

On the upper surface of the loading table 40, there are formed a plurality of suction holes K4 for bringing the substrate P in close contact with this surface. Each suction hole K4 is connected to a vacuum pump (not shown). The gas injection holes K3 and the suction holes K4 are arranged in a staggered manner along the Y direction. The gas injection hole K3 and the suction hole K4 are not limited to such a zigzag arrangement, and may be arranged in various forms (for example, alternately arranged along the Y direction). Further, the gas injection holes K3 and the suction holes K4 are not limited to being formed independently of each other, and the same holes may be used as the gas injection holes K3 and the suction holes K4. In this case, each of the holes may be appropriately switchably connected to the gas branch pump and the vacuum pump.

The carry-in table 40 is provided with a through-hole (not shown) for allowing the substrate support pin of the up-and-down moving mechanism to be inserted thereinto for carrying the substrate P between the coater / developer 47 are formed.

Next, the configuration of the main part of the take-out unit 5 will be described with reference to Figs. 5A and 5B. 5A and 5B, the carry-out section 5 is formed with a second transfer section 52 for transferring the substrate P from the plate holder 9 to the carry-out table 50. The second transfer part 52 includes a suction part 52b for sucking and holding the guide part 52a and the substrate P. [

On the upper surface of the carrying-out table 50, there are formed two groove-shaped concave portions 50a formed along one direction (the Y direction shown in the drawing). The guide portion 52a is formed in the concave portion 50a. In the guide portion 52a, the suction portion 52b is mounted so as to protrude from the upper surface of the carry-out table 50. The adsorption section 52b includes, for example, a vacuum adsorption pad for adsorbing and holding the substrate P by vacuum adsorption.

An abutting portion 58 abutting on the substrate P pushed out of the plate holder 9 is formed in the suction portion 52b. The abutting portion 58 is made of, for example, an elastic member such as rubber.

A plurality of gas injection holes K5 are formed on the upper surface of the carry-out table 50 for supporting the substrate P by floating the substrate P by spraying a gas such as air onto the lower surface of the substrate P . Each gas injection hole K5 is connected to a gas branch pump not shown.

On the upper surface of the carry-out table 50, a plurality of suction holes K6 are formed to bring the substrate P in close contact with this surface. Each suction hole K6 is connected to a vacuum pump (not shown). In addition, the gas injection holes K5 and the suction holes K6 are arranged in a staggered manner.

The carrying-out table 50 is provided with a through-hole (not shown) for allowing the substrate supporting pin of the up-and-down moving mechanism to carry the substrate P between the coater / developers (not shown) 57 are formed.

Next, the operation of the exposure apparatus 1 will be described with reference to Figs. 6 to 15. Fig. Concretely, the transfer operation of the substrate P between the carry-in unit 4 and the plate holder 9 and the transfer operation of the substrate P between the plate holder 9 and the carry- The transfer operation will be mainly described. In this embodiment, the carry-in table 40 of the carry-in unit 4 and the carry-out table 50 of the carry-out unit 5 are disposed at different positions in the same horizontal plane. That is, the carrying-in table 40 and the carrying-out table 50 are disposed at positions which do not overlap with each other in a state viewed from a plane (a state viewed from the + Z direction shown in FIG. 2).

First, a substrate P coated with a photosensitive agent is loaded into a carry-in unit 4 in a cotter developer (not shown). At this time, the up-and-down moving mechanism 49 located below the loading table 40 places the substrate supporting pins 49a above the loading table 40 through the through holes 47. [ Subsequently, the arm portion 48 of the cotter developer (not shown) is inserted between the substrate support pins 49a as shown in Fig. The arm portion 48 descends to retract the substrate P to the substrate support pin 49a and retract from the carry-in portion 4. [ The up-and-down moving mechanism 49 lowers the substrate support pin 49a supporting the substrate P so that the loading operation of the substrate P with respect to the loading table 40 is completed. Thereafter, the vacuum pump is driven so that the substrate P is adsorbed and held on the upper surface of the carrying-in table 40 through the suction holes K4.

Subsequently, the plate holder 9 is moved close to the loading table 40 of the loading section 4 as shown in Fig. 7A. Specifically, the first moving mechanism 33 arranges the plate holder 9 and the loading table 40 in the state of being close to each other along the Y direction. Here, the state in which the plate holder 9 and the carry-in table 40 are close to each other means a state in which the substrate P is separated by a distance that the substrate P moves smoothly when the substrate P is removed.

The second moving mechanism 43 may also be driven when the loading table 40 and the plate holder 9 are arranged. This makes it possible to move the carry-in table 40 and the plate holder 9 to the transfer position of the substrate P in a short time, thereby shortening the time required for the carrying-in operation of the substrate P. In this case, the carry-out table 50 is retreated to a position where it does not interfere with the carry-in table 40.

The substrate P is attracted and held on the upper surface of the loading table 40 through the suction hole K4 so that the substrate P is moved on the loading table 40 while the second moving mechanism 43 is driven It is possible to prevent movement.

The substrate P is disposed higher than the plate holder 9 when the plate holder 9 and the loading table 40 are brought close to each other as shown in Fig. The first moving mechanism 33 moves the plate holder 9 to the loading table 40 so that the upper surface of the loading table 40 supporting the substrate P is higher than the upper surface of the plate holder 9 Close. It is also possible to raise the loading table 40 such that the upper surface of the loading table 40 is higher than the upper surface of the plate holder 9 by the second moving mechanism 43.

The first moving mechanism 33 may be arranged in a state in which the plate holder 9 and the loading table 40 are in contact with each other. In this manner, the transfer of the substrate P between the plate holder 9 and the loading table 40 to be described later can be carried out smoothly.

Subsequently, as shown in Fig. 8, the loading table 40 injects a gas from a plurality of gas injection holes K3 formed on the upper surface, and supports the substrate P in a floated state through the substrate. On the other hand, when receiving the substrate P, the plate holder 9 injects gas from a plurality of gas injection holes K2 formed on the upper surface.

The carry section 4 is provided with the abutment section 42b at one end of the substrate P as shown in Fig. 9, with the substrate P lifted and held on the carry- Let's face it. The abutting portion 42b moves along the guide portion 42a in the concave portion 40a to move the substrate P toward the plate holder 9 side.

The substrate P is floated on the loading table 40 so that the abutting portion 42b can smoothly slide the substrate P toward the plate holder 9. [ The upper surface of the plate holder 9 supports the substrate P in a floating manner as described above. Here, the gas injected from the gas injection holes K3 and K2 may have directivity.

The substrate P on which the upper surface of the loading table 40 is slid by the abutting portion 42b smoothly moves to the upper surface of the plate holder 9 as shown in Fig. The upper surface of the loading table 40 is higher than the upper surface of the plate holder 9 so that the substrate P does not contact the side surface of the plate holder 9 and moves smoothly onto the plate holder 9 I can move on.

9, the substrate P is slid in a state in which the position in the X direction in the drawing is defined by the guide pins 36 formed in the peripheral portion of the plate holder 9. [ The abutting portion 42b moves the substrate P until it abuts against the positioning pin 37 formed on the downstream side in the substrate carrying direction of the plate holder 9. [ The position of the substrate P in the X direction in the drawing is defined by the guide pin 36 and the positioning pin 37 and the abutting portion 42b interpose the substrate P in the Y direction The state of the position of the switch is defined. The plate holder 9 stops gas injection from the gas injection hole K2. The substrate P is placed in a state of being aligned with the substrate mounting section 31 as shown in Fig.

However, when the conventional substrate is placed on the plate holder, there is a possibility that the substrate is misaligned (positional deviation from a predetermined position) or the substrate is deformed. As one of the causes of the deviation, for example, it is conceivable that the substrate is in a floating state due to a thin air layer formed between the substrate and the plate holder just before the substrate is mounted. As a cause of the deformation of the substrate, it is conceivable that, for example, after the substrate is mounted, the substrate is swollen by interposing an air space between the substrate and the plate holder.

On the other hand, in the present embodiment, since the substrate P is transported in a floating state by the jetting of gas as described above, the substrate P is transferred to the plate holder 9 in a state of high flatness without deformation. Since the substrate P is mounted on the substrate mounting portion 31 from the height at which the substrate P is lifted up, air or an air layer is prevented from occurring between the substrate P and the substrate mounting portion 31. Therefore, the substrate P is prevented from being in an inflated state, and it is possible to prevent the substrate P from being misaligned or deformed. Therefore, the substrate P can be placed on the plate holder 9 at a predetermined position with a high planarity. Thereafter, the vacuum pump is driven so that the substrate P is adsorbed and held on the upper surface of the substrate mounting portion 31 through the suction holes K1.

After the substrate P is placed on the plate holder 9, the mask M is illuminated by the exposure light IL from the illumination system. The pattern of the mask M illuminated by the exposure light IL is projected and exposed through the projection optical system PL onto the substrate P placed on the plate holder 9. [

The exposure apparatus 1 can mount the substrate P on the plate holder 9 well as described above so that the predetermined exposure can be performed at a proper position on the substrate P with high accuracy, The high exposure process can be realized.

In the present embodiment, while the substrate P is being exposed in the middle of the exposure process, or as described later, the substrate P having been subjected to the exposure process is transferred to the take-out unit 5, The substrate P to which the photosensitive agent has been applied by the transfer unit 4 can be placed on the loading table 40 of the loading unit 4. [

Next, the carrying-out operation of the substrate P from the plate holder 9 after the end of the exposure processing will be described.

When the exposure process is completed, the plate holder 9 is moved so as to be close to the carrying-out table 50 of the carry-out section 5 as shown in Fig. Specifically, the first moving mechanism 33 is arranged in a state in which the plate holder 9 and the carry-out table 50 are brought close to each other along the Y direction. At this time, since the substrate P is attracted and held via the suction holes K1, it is possible to prevent the substrate P from moving on the substrate mounting portion 31 when the first moving mechanism 33 is driven.

When arranging the carrying-out table 50 and the plate holder 9, the third moving mechanism 53 may also be driven. This makes it possible to move the carrying table 40 and the plate holder 9 to the receiving position of the substrate P in a short time and shorten the time required for the carrying-out operation of the substrate P. In this case, the carry-in table 40 is retreated to a position where it does not interfere with the carry-out table 50.

In this embodiment, when the plate holder 9 and the carrying-out table 50 are brought close to each other, as in the case where the plate holder 9 and the carrying-in table 40 are brought close to each other, The substrate P is arranged higher than the plate holder 9. [ That is, the first moving mechanism 33 moves the plate holder 9 to the carry-out table 50 so that the upper surface of the plate holder 9 supporting the substrate P is higher than the upper surface of the carry- Close. Further, the third moving mechanism 53 may lower the carrying-out table 50 such that the upper surface of the carrying-out table 50 is lower than the upper surface of the plate holder 9.

The first moving mechanism 33 may be arranged in a state in which the plate holder 9 and the carry-out table 50 are in contact with each other. In this manner, the transfer of the substrate P between the plate holder 9 and the carry-out table 50, which will be described later, can be carried out smoothly.

The plate holder 9 stops the driving of the vacuum pump and releases suction holding of the substrate P via the suction hole K1 with respect to the substrate placing portion 31. [ Subsequently, as shown in Fig. 13, the plate holder 9 injects a gas from a plurality of gas injection holes K2 formed on the upper surface of the substrate mounting portion 31, and the substrate P is lifted . On the other hand, when the substrate P is received, the carry-out section 5 sprays a gas from a plurality of gas injection holes K5 formed on the upper surface of the carry-out table 50. [

The carry-out section 5 moves the attracting section 52b of the second conveying section 52 along the guide section 52a to the side of the substrate P lifted and supported on the substrate placing section 31 of the plate holder 9 . The positioning pin 37 presses the end portion of the substrate P floating on the substrate mounting portion 31 as shown in Fig. The substrate P lifted onto the substrate mounting portion 31 is slid toward the carrying-out table 50 side and is brought into contact with the abutting portion 58 mounted on the sucking portion 52b as shown in Fig. 14B . By sliding the substrate P toward the abutting portion 58 side by using the positioning pin 37 as described above, the suction portion 52b is guided to the position facing the substrate P on the plate holder 9, 52a. After the end portion of the substrate P is brought into contact with the abutting portion 58, the sucking portion 52b sucks and holds the substrate P, and as shown in Fig. 14C, along the guide portion 52a, Direction.

At this time, since the substrate P is supported on the plate holder 9 in a floating state, the suction portion 52b can smoothly slide the substrate P toward the take-out table 50 side. The upper surface of the carry-out table 50 supports the substrate P in a floating manner as described above. Here, the gas injected from the gas injection holes K2 and K5 may have a directivity.

The substrate P that slides on the upper surface of the substrate mounting portion 31 is moved smoothly to the upper surface of the carry-out table 50 by the movement of the attracting portion 52b. Since the upper surface of the plate holder 9 is higher than the upper surface of the carry-out table 50 in the present embodiment, the substrate P does not contact the side surface of the carry-out table 50, You can move to the top.

After the movement of the substrate P by the sucking portion 52b is completed, the carrying-out table 50 stops the gas injection from the gas injection hole K5, and also, through the suction hole K6, (P). The carry-out section 5 drives the third moving mechanism 53 while holding the substrate P by suction, and moves the carry-out table 50 to the carry-out position of the substrate P.

The exposure apparatus 1 transfers the substrate P from the plate holder 9 to the carry-out section 5 and then moves the plate holder 9 close to the carry-in table 40 of the carry-in section 4. Similarly, the substrate P can be exchanged between the carrying-in table 40 and the plate holder 9, and the substrate P placed on the plate holder 9 can be exposed.

In the present embodiment, while the next substrate P is carried into the plate holder 9 from the carry-in unit 4 or while the exposure is being performed on the next substrate P, 50 on which the exposure process has been completed. At this time, the up-and-down moving mechanism 60 located below the carry-out table 50 places the substrate support pins 60a above the carry-out table 50 via the through-holes 57. [ Thus, the substrate P is held above the carry-out table 50 by being supported by the substrate support pins 60a. Subsequently, the arm portion 48 of the cotter developer (not shown) is inserted between the substrate support pins 60a as shown in Fig. Thereafter, the substrate P is transferred to the arm portion 48 by lowering the substrate support pin 60a. The arm portion 48 moves the substrate P into a cotter developer (not shown) and performs development processing.

As described above, the plate holder 9 moves in the same horizontal plane (XY plane) with respect to the carry-in unit 4 and the carry-out unit 5 and alternately accesses them, The carrying-out operation can be performed. The plate holder 9 and the carry-in unit 4 and the carry-out unit 5 are moved in the direction of arrangement of the carry-in unit 4 and the carry-out unit 5 in this embodiment, It is possible to arrange them in a state of being in proximity to or in contact with each other in a short time. Therefore, the processing time (so-called tact) involved in the carrying-in / out operation of the substrate P can be shortened.

The substrate P can be transported from the carry-in unit 4 to the plate holder 9 by sliding the substrate P so that air can flow between the substrate P and the substrate mount unit 31 It is possible to prevent an air layer from being generated, and it is possible to prevent the substrate P from being misaligned or deformed. Therefore, highly reliable exposure processing can be performed.

In the first embodiment, the upper surface of the carry-in table 40 may be inclined when the substrate P is carried from the carry-in table 40 to the plate holder 9. More specifically, the holding portion 44 of the second moving mechanism 43 moves the upper surface of the carry-in table 40 supporting the substrate P in a floating state by gas injection from the gas injection hole K3 , And to the plate holder 9 side (? Y direction). Thereby, the substrate P can be moved toward the plate holder 9 side by using the weight of the substrate P itself.

When the substrate P is transported from the plate holder 9 to the carry-out table 50, the upper surface of the plate holder 9 may be inclined. More specifically, the holding portion 34 of the first moving mechanism 33 moves the upper surface of the plate holder 9, which supports the substrate P in a floating state by the gas injection from the gas injection hole K2, Y direction) of the table 50 side. Thereby, the substrate P can be moved toward the carrying-out table 50 side by using the weight of the substrate P itself.

(Second Embodiment)

Next, the configuration according to the second embodiment of the present invention will be described. In this embodiment, the same elements as those of the first embodiment are denoted by the same reference numerals, and a description thereof will be omitted. The second embodiment is different from the first embodiment in the configuration of the first transfer section 149 in the carry-in section 104. [

16A and 16B are diagrams showing the configuration of the loading section 104 according to the present embodiment. FIG. 16A is a diagram showing a plan configuration of the loading section 104, , And a cross-sectional view taken along the line AA in Fig.

16A and 16B, the first transfer section 149 of the loading section 104 according to the present embodiment is provided with a roller mechanism 148 (not shown) instead of a structure for floating the substrate P by spraying gas on one surface of the substrate P ).

As shown in Fig. 16A, a plurality of notches 141 are formed on one end side of the loading table 140. As shown in Fig. A roller 142 constituting the roller mechanism 148 is rotatably supported by a shaft 143 on each of the notches 141. The roller 142 is rotatable by a driving mechanism have. As shown in Fig. 16B, the roller mechanism 148 is configured such that the roller 142 can contact or move away from the substrate P.

The roller mechanism 148 rotates in a predetermined direction while bringing a plurality of rollers 142 into contact with the lower surface of the substrate P supported on the carry-in table 140, To the plate holder 9 side. As the material for forming the roller 142, for example, an elastic member such as rubber which generates a large frictional force with the substrate P can be used. Damage (scratches or the like) to the substrate P can be prevented by constructing the roller 142 by using such an elastic member. On the upper surface of the loading table 140, only the suction hole K4 is formed.

Next, the operation of the exposure apparatus 1 in the present embodiment will be described. Specifically, description will be given of the transfer operation of the substrate P between the carry-in section 104 and the plate holder 9 which is different from the first embodiment.

First, a substrate P coated with a photosensitive agent is carried into a carry-in section 104 in a copier developer (not shown). The substrate P is adsorbed and held on the upper surface of the carry-in table 140 via the suction holes K4. Thereafter, the plate holder 9 is moved close to the loading table 140 (see Fig. 7A).

The plate holder 9 is preferably brought close to the loading table 140 so that the upper surface of the loading table 140 supporting the substrate P is higher than the upper surface of the plate holder 9 (See FIG. 7B).

However, in this embodiment, even if the upper surface of the loading table 140 is lower than the upper surface of the plate holder 9, if the upper surface of the roller 142 is higher than the upper surface of the plate holder 9, It is possible to reliably transport the substrate P lifted up to the plate holder 9 side from the loading table 40 side.

Subsequently, as shown in Fig. 17, the carry-in table 140 brings the roller 142 of the roller mechanism 148 into contact with the lower surface of the substrate P and rotates it in a predetermined direction. On the other hand, when receiving the substrate P, the plate holder 9 injects gas from a plurality of gas injection holes K2 formed on the upper surface. The substrate P smoothly slides toward the plate holder 9 side due to the frictional force with the roller 142. [

Here, the plate holder 9, which is the transporting destination of the substrate P, is configured such that the substrate P is lifted and supported on the substrate mounting portion 31 by the gas being injected from the gas injection holes K2.

Therefore, the substrate P, which slides on the upper surface of the carry-in table 140 by the roller mechanism 148, smoothly moves to the upper surface of the plate holder 9.

As shown in Fig. 18, the substrate P is slid by a guide pin 36 formed on the periphery of the plate holder 9 so as to define a position in the X direction in the drawing. The roller mechanism 148 moves the substrate P until it abuts the positioning pin 37 formed on the downstream side in the substrate carrying direction of the plate holder 9. [ The position of the substrate P in the X direction in the drawing is defined by the guide pin 36 and the positioning pin 37 and the abutting portion 42b interpose the substrate P in the Y direction The state of the position of the switch is defined. The plate holder 9 stops the gas injection from the gas injection hole K3. Thereby, the substrate P is placed in alignment with the substrate mounting portion 31. [

The substrate P can be transferred to the plate holder 9 in a state of high flatness without any deformation and the substrate P can be transported in a state of high flatness, It is possible to prevent an air flow or an air layer from being formed between the substrate mounting portion 31 and the substrate mounting portion 31. [ Therefore, the substrate P can be placed on the plate holder 9 at a predetermined position with a high planarity. Therefore, predetermined exposure can be performed at a proper position on the substrate P with high accuracy, and exposure processing with high reliability can be performed.

The carrying-out operation of the substrate P from the plate holder 9 after the completion of the exposure processing is the same as that in the first embodiment, and a description thereof will be omitted.

In the above description, the case where the roller mechanism 148 is employed as the first conveying unit 149 of the carry-in unit 104 will be described. However, a roller mechanism is employed as the second conveying unit 52 of the carry-out unit 5 It is possible. In addition, as in the first embodiment, it is also possible to employ a configuration in which the substrate P is lifted and supported by the gas injection on the loading table 140. According to this configuration, since the substrate P is conveyed by the roller mechanism 148 in a floating state, the substrate P can be smoothly conveyed to the plate holder 9 side.

(Third Embodiment)

Next, the configuration according to the third embodiment of the present invention will be described. In this embodiment, the same elements as those of the first and second embodiments are denoted by the same reference numerals, and a description thereof will be omitted. The third embodiment mainly differs in that the plate holder 9 is provided with a first feeding mechanism.

19 is a view showing a configuration of the plate holder 109 according to the present embodiment. The plate holder 109 according to the present embodiment has a first transfer section 249 for transferring the substrate P from the transfer table 40 to the plate holder 9 as shown in Fig. The first transfer section 249 includes a suction section 250 for sucking and holding both sides of the substrate P in the width direction. The adsorption unit 250 is freely movable in the XY plane along the plane direction of the substrate P.

In the present embodiment, the position detection sensor 252 for detecting the position of the substrate P to be carried by the first transfer unit 249 with respect to the substrate placement unit 31 is formed in the periphery of the plate holder 9 . The position detecting sensor 252 may be, for example, a potentiometer. In the present invention, any of a contact type or a non-contact type meter may be used.

The adsorption unit 250 sucks and holds the end portion of the substrate P lifted and held on the loading table 40 by gas injection from the gas injection hole K3 and as shown in FIG. 40 to the plate holder 9 side. On the other hand, when receiving the substrate P, the plate holder 9 injects gas from a plurality of gas injection holes K2 formed on the upper surface. At this time, the gas injected from the gas injection holes K2 and K3 may have directivity.

The adsorption unit 250 contacts the end of the substrate P with the position detection sensor 252 as shown in Fig. 20B so that the exposure apparatus 1 can detect the position of the substrate P on the substrate P The positional deviation can be detected. The suction unit 250 is configured to be driven based on the detection result of the position detection sensor 252.

The exposure apparatus 1 can correct the position of the substrate P held by the suction unit 250 with respect to the substrate placement unit 31 based on the detection result of the position detection sensor 252. [

The substrate P can be transferred to the plate holder 9 in a state of high flatness without any deformation and the substrate P can be transported in a state of high flatness, It is possible to prevent an air flow or an air layer from being formed between the substrate mounting portion 31 and the substrate mounting portion 31. [ Therefore, the substrate P can be placed on the plate holder 9 at a predetermined position with a high planarity. Therefore, predetermined exposure can be performed at a proper position on the substrate P with high accuracy, and exposure processing with high reliability can be performed.

The carrying-out operation of the substrate P from the plate holder 9 after the end of the exposure processing is the same as that in the first embodiment, and a description thereof will be omitted.

(Fourth Embodiment)

Next, the configuration according to the fourth embodiment of the present invention will be described. In this embodiment, the same elements as those of the first embodiment are denoted by the same reference numerals, and a description thereof will be omitted. The fourth embodiment is different from the first embodiment in that the carrying-in table 40 and the carrying-out table 50 are arranged at positions where they overlap each other in a plan view as shown in Fig. That is, when the substrate P is exchanged with the plate holder 9, the carry-in table 40 and the carry-out table 50 are vertically moved with respect to the plate holder 9.

Hereinafter, the transfer operation of the substrate P in the present embodiment will be described with reference to Figs. 22A, 22B, and 22C.

After the exposure processing for the substrate P placed on the plate holder 9 is completed, the carry-out table 50 is arranged in the state of being close to the plate holder 9 along the Y direction. In this embodiment, as shown in Fig. 22A, the carry-out table 50, which is waiting downward with respect to the plate holder 9, is raised to a position where the substrate P can be received. At this time, the upper surface of the carrying-out table 50 may be arranged lower than the upper surface of the plate holder 9 (see FIG. 13).

While the exposure process is being performed on the substrate P, the next substrate P is transferred from the copier developer (not shown) to the loading table 40. Thus, the carry-in table 40 holds the next substrate P while the substrate P is being carried out from the plate holder 9 to the carry-out table 50, .

The plate holder 9 stops the driving of the vacuum pump and releases suction holding of the substrate P via the suction hole K1 with respect to the substrate placing portion 31. [ Subsequently, the plate holder 9 injects a gas from the gas injection hole K2, and supports the substrate P in a floated state through the substrate (see Fig. 14A14C). On the other hand, when the substrate P is received, the carry-out section 5 sprays a gas from a plurality of gas injection holes K5 formed on the upper surface of the carry-out table 50. [ At this time, the gas injected from the gas injection holes K2 and K5 may have a directivity.

As shown in Fig. 22B, the carry-out section 5 moves the substrate P held by the attracting section 52b along the Y direction in the same figure as in the first embodiment. At this time, since the substrate P is supported on the plate holder 9 in a floating state, the substrate P smoothly slides on the carrying-out table 50. The upper surface of the carry-out table 50 supports the substrate P in a floating manner as described above. Therefore, the substrate P is smoothly transferred to the upper surface of the carry-out table 50.

After the movement of the substrate P is completed, the carry-out table 50 stops the gas injection from the gas injection hole K5 and sucks and holds the substrate P via the suction hole K6 . The carrying-out table 50 moves the substrate P downward as shown in FIG. 22C while holding the substrate P by suction. Further, when the size of the substrate P is large and placed on the upper surface of the carry-out table 50, the carry-out table 50 moves the substrate P to the plate holder 9, The lowering operation is performed in a state of being retracted in the + Y direction in the figure separated from the plate holder 9. [

On the other hand, as shown in FIG. 22C, the carrying-out table 50 starts to move downward, and the carrying table 40 standing by above the plate holder 9 is moved to the plate holder 9 P) to a permissible position. Thereby, the plate holder 9 and the loading table 40 are arranged in the state of being close to each other along the Y direction. At this time, the upper surface of the loading table 40 may be disposed lower than the upper surface of the plate holder 9 (see FIG. 8).

The loading table 40 injects a gas from a plurality of gas injection holes K3 formed on the upper surface and supports the substrate P in a floated state through the substrate. On the other hand, when receiving the substrate P, the plate holder 9 injects gas from a plurality of gas injection holes K2 formed on the upper surface. At this time, the gas injected from the gas injection holes K2 and K3 may have directivity.

The carrying unit 4 brings the abutting portion 42b into contact with one end of the substrate P while floating the substrate P on the carrying table 40. [ The abutting portion 42b moves along the guide portion 42a in the concave portion 40a to move the substrate P toward the plate holder 9 side (see Figs. 9 and 10).

Since the substrate P is floating on the loading table 40, the substrate P is smoothly moved to the plate holder 9 side. 22D, the upper surface of the plate holder 9 is lifted from the carry-in table 40 to the plate holder 9 (as shown in Fig. 22D) It moves smoothly.

The substrate P can be placed in a state in which it is positioned at a predetermined position with respect to the substrate placing portion 31 by the guide pin 36 and the positioning pin 37 as in the first embodiment 9). Then, the substrate P is subjected to exposure processing.

In the present embodiment, the exposure process is carried out while the substrate P is being carried from the carry-in section 4 to the plate holder 9 or during the exposure process to the substrate P, The substrate P is taken out.

In this embodiment, the carry-in unit 4 and the carry-out unit 5 are moved alternately in the height direction (Z direction) with respect to the plate holder 9, (P) can be carried out. The carry-in unit 4 and the carry-out unit 5 stand by above the plate holder 9 when not in use and each can access the plate holder 9 by the upward and downward movement, It is possible to shorten the processing time (so-called tact) involved in the loading / unloading operation.

In the above-described embodiment, the first direction in which the loading table 40 and the plate holder 9 are arranged is parallel to the second direction in which the loading table 50 and the plate holder 9 are arranged However, the present invention is not limited to this, and the present invention is also applicable to the case where the first direction and the second direction are different directions (for example, orthogonal).

(Fifth Embodiment)

Next, the configuration according to the fifth embodiment of the present invention will be described. In this embodiment, the same elements as those of the first embodiment are denoted by the same reference numerals, and a description thereof will be omitted. The fifth embodiment mainly differs from the fifth embodiment in that it has a carry-in / out section that functions as a carry-in or carry-out section.

Fig. 23 is a perspective view showing a configuration inside the chamber, and Figs. 24A and 24B are plan views showing a schematic configuration of the carry-in / out unit 400. Fig.

As shown in FIG. 23, the carry-in / out section 400 includes a substrate placement table 401 and a moving mechanism 402 for moving the substrate placement table 401. The moving mechanism 402 has the same configuration as the first and second moving mechanisms 33 and 43 of the first embodiment. Based on such a configuration, the substrate placement table 401 can be moved in a predetermined region of the guide surface on the light emitting side (the image plane side of the projection optical system PL) while holding the substrate P . In addition, the substrate placement table 401 is movable along the Z-axis direction. Therefore, the substrate placement table 401 functions as a carry-in table and a carry-out table.

As shown in Figs. 24A and 24B, the carry-in / out section 400 includes a transfer section 405 for transferring the substrate P from the substrate placement table 401 to the plate holder 9. The transfer section 405 includes a guide section 406 and an adsorption section 408 which is adsorbed and held on the substrate P. [

On the upper surface of the substrate placement table 401, there are formed two groove-shaped concave portions 401a formed along one direction (the Y direction shown in the drawing). The guide portion 406 is formed in the concave portion 401a. The suction unit 408 is mounted on the guide unit 406 so as to protrude from the upper surface of the substrate placement table 401. The adsorption section 408 includes, for example, a vacuum adsorption pad for adsorbing and holding the substrate P by vacuum adsorption.

A plurality of gas injection holes K7 are formed on the upper surface of the substrate placement table 401 for injecting a gas such as air into the lower surface of the substrate P to float and support the substrate P through the substrate . Each gas injection hole K7 is connected to a gas branch pump not shown. A plurality of suction holes K8 are formed on the upper surface of the substrate placement table 401 so as to bring the substrate P in close contact with this surface. Each suction hole K8 is connected to a vacuum pump (not shown). In addition, the gas injection holes K7 and the suction holes K8 are arranged in a zigzag pattern with each other.

The substrate table 401 is provided with a through hole (not shown) for allowing the substrate support pin of the up-and-down moving mechanism to be inserted and passed between the substrate table 401 and the coater / developer (not shown) 407 are formed.

The plate holder 9 is provided with the position detection sensor 19 for detecting the relative position with respect to the substrate placement table 401 on its side portion as in the above-described embodiment. The position detection sensor 19 includes a distance detection sensor 19a for detecting a relative distance to the substrate placement table 401 and a height detection sensor 19b for detecting a relative height to the substrate placement table 401 (See FIG. 3B).

Next, the transfer operation of the substrate P between the loading / unloading section 400 and the plate holder 9 will be described with reference to the drawings. First, a substrate P coated with a photosensitive agent is carried in a coat developer (not shown) to the carry-in / take-out unit 400. At this time, the up-and-down moving mechanism 409 located below the substrate placement table 401 places the substrate support pins 410 above the substrate placement table 401 via the through-holes 407. Subsequently, the arm portion 48 of the cotter developer (not shown) is inserted between the substrate support pins 410 as shown in Fig. The arm portion 48 descends to retract the substrate P to the substrate support pin 410, and then retracts from the loading / unloading portion 400. The up-and-down moving mechanism 409 moves down the substrate support pins 410 supporting the substrate P to terminate the loading operation of the substrate P with respect to the substrate placement table 401. Thereafter, by driving the vacuum pump, the substrate P is sucked and held on the upper surface of the substrate placement table 401 via the suction holes K8.

Subsequently, the plate holder 9 is moved close to the substrate placement table 401 of the loading / unloading section 400. When the substrate table 401 and the plate holder 9 are arranged, the substrate holding table 401 and the plate holder 9 are moved to the receiving position of the substrate P in a short time The time required for carrying-in of the substrate P may be shortened. In this case, since the substrate P is attracted and held on the upper surface of the substrate placement table 401 via the suction hole K8, the substrate P is moved on the substrate placement table 401 at the time of driving the transfer section 405 Discarding is prevented.

The plate holder 9 is placed on the substrate table 401 so that the upper surface of the substrate table 401 supporting the substrate P is higher than the upper surface of the plate holder 9 as shown in Fig. Lt; / RTI > Further, by arranging the plate holder 9 and the substrate placement table 401 in contact with each other, the moving distance of the substrate P can be shortened and the feeding can be performed more smoothly.

Subsequently, as shown in Fig. 26, the substrate placement table 401 sprays gas from a plurality of gas injection holes K7 formed on the upper surface, and supports the substrate P in a floated state through the substrate. On the other hand, when receiving the substrate P, the plate holder 9 injects gas from a plurality of gas injection holes K2 formed on the upper surface. At this time, the gas injected from the gas injection holes K2 and K7 may have directivity.

The loading and unloading section 400 sucks and holds one end of the substrate P by the sucking section 408 while floating the substrate P on the substrate placement table 401. The adsorption portion 408 moves along the guide portion 406 in the concave portion 401a to move the substrate P toward the plate holder 9 side (see FIGS. 24A and 24B).

The substrate P can float smoothly toward the plate holder 9 because the substrate P is floated on the substrate placement table 401. The upper surface of the plate holder 9 supports the substrate P in a floating manner as described above.

The substrate P on which the upper surface of the substrate placement table 401 is slid is smoothly transferred to the upper surface of the plate holder 9 by the suction unit 408. [ The upper surface of the substrate table 401 is higher than the upper surface of the plate holder 9 as shown in Fig. 26 so that the substrate P does not contact the side surface of the plate holder 9, And can be transferred onto the holder 9.

The substrate P is brought into a state in which it is positioned at a predetermined position with respect to the substrate placing section 31 by abutting against the guide pin 36 and the positioning pin 37 formed in the periphery of the plate holder 9 (See FIG. 9).

In this embodiment as well, since the substrate P is transported in a floating state by the injection of gas as described above, air or an air layer is prevented from being generated between the substrate P and the substrate mounting section 31, It is possible to prevent the occurrence of misalignment and deformation of the pawl P. [ Therefore, the substrate P can be placed on the plate holder 9 at a predetermined position with a high planarity. Thereafter, the vacuum pump is driven so that the substrate P is sucked and held on the upper surface of the substrate mounting portion 31 via the suction holes K1. After the substrate P is placed on the plate holder 9, the substrate P is subjected to exposure processing.

When the exposure process is completed, the plate holder 9 is moved to approach the substrate placement table 401 of the loading / unloading section 400. The plate holder 9 and the substrate placement table 401 are brought close to each other such that the upper surface of the plate holder 9 is higher than the upper surface of the substrate placement table 401 in this embodiment.

It is also possible to shorten the time required for carrying out the substrate P by moving the substrate placement table 401 when the substrate placement table 401 and the plate holder 9 are arranged. It is also possible to arrange the plate holder 9 and the substrate placement table 401 in contact with each other. In this manner, no clearance is formed between the plate holder 9 and the substrate placement table 401, so that the transfer of the substrate P can be performed smoothly.

The plate holder 9 stops the driving of the vacuum pump and releases suction holding of the substrate P via the suction hole K1 with respect to the substrate placing portion 31. [ Subsequently, as shown in Fig. 27, the plate holder 9 injects a gas from a plurality of gas injection holes K2 formed on the upper surface of the substrate mounting portion 31, floats the substrate P through the substrate . On the other hand, when the substrate P is received, the carry-out section 5 sprays a gas from a plurality of gas injection holes K7 formed on the upper surface of the substrate placement table 401. [ At this time, the gas injected from the gas injection holes K2 and K7 may have directivity.

The loading and unloading unit 400 moves the suction unit 408 of the transfer unit 405 along the guide unit 406 toward the substrate P supported on the substrate placing unit 31 of the plate holder 9. The adsorption section 408 adsorbs and holds the substrate P, and moves the substrate P along the + Y direction in the figure (see FIGS. 24A and 24B).

At this time, since the substrate P is supported on the plate holder 9 in a floating state, the suction unit 408 can smoothly slide the substrate P toward the substrate placement table 401 side. The upper surface of the substrate placement table 401 supports the substrate P in a floating manner as described above.

Therefore, the substrate P, which slides on the upper surface of the substrate mounting portion 31, is smoothly transferred to the upper surface of the substrate placement table 401. The upper surface of the plate holder 9 is higher than the upper surface of the substrate table 401 so that the substrate P does not contact the side surface of the substrate table 401, You can move to the top.

After the movement of the substrate P by the suction unit 408 is completed, the substrate placement table 401 stops the gas injection from the gas injection hole K7 and, through the suction hole K8, (P). The loading and unloading unit 400 drives the transferring unit 405 while holding the substrate P by suction and moves the substrate table 401 to the unloading position of the substrate P. [

Subsequently, the substrate P on which the exposure processing to be mounted on the substrate placement table 401 is completed is carried out. At this time, the up-and-down moving mechanism 409 located below the substrate placement table 401 is disposed above the substrate placement table 401 with the substrate support pins 410 via the through-holes 407. Thus, the substrate P is held above the substrate placement table 401 by being supported by the substrate support pins 410 (see FIG. 25). Subsequently, the arm portion 48 of the cotter developer (not shown) is inserted between the substrate support pins 410, and the substrate P is lowered to the arm portion 48, It is received. The arm portion 48 moves the substrate P into a cotter developer (not shown) and performs development processing.

The substrate P can be transported from the loading / unloading section 400 to the plate holder 9 by sliding the substrate P so that air or air can flow between the substrate P and the substrate mounting section 31, It is possible to prevent the substrate P from being misaligned or deformed. Therefore, highly reliable exposure processing can be performed. Furthermore, since the carry-in / out unit 400 serves also as the carry-in unit 4 and the carry-out unit 5 in the first to third embodiments, the device configuration can be simplified.

In the fifth embodiment, the upper surface of the substrate placement table 401 may be inclined when the substrate P is transported from the substrate placement table 401 to the plate holder 9. Specifically, the moving mechanism 402 moves the upper surface of the substrate placement table 401, which supports the substrate P in a floating state by the gas injection from the gas injection hole K7, to the plate holder 9 side? Y Direction). Thereby, the substrate P can be moved toward the plate holder 9 side by using the weight of the substrate P itself.

When the substrate P is transferred from the plate holder 9 to the substrate placement table 401, the upper surface of the plate holder 9 may be inclined. More specifically, the first moving mechanism 33 (the holding portion 34) holds the upper surface of the plate holder 9 supporting the substrate P in a floating state by the gas injection from the gas injection hole K2, And is inclined toward the mounting table 401 side (? Y direction). Thereby, the substrate P can be moved to the substrate placement table 401 side by using the weight of the substrate P itself.

In the present embodiment, the roller mechanism 148 as shown in the second embodiment may be employed as the transfer unit 405. [ As the transfer unit 405, the suction unit 408 constituting the transfer unit 405 may be formed on the plate holder 9 side as shown in the third embodiment.

(Sixth Embodiment)

Next, the configuration according to the sixth embodiment of the present invention will be described. In the following description, elements that are the same as or equivalent to those of the above-described embodiments are denoted by the same reference numerals, and the description thereof is simplified or omitted.

FIG. 28 is a sectional plan view showing a schematic configuration of an exposure apparatus according to the present embodiment, and FIG. 29 is a perspective view schematically showing the configuration of a device in a chamber.

Similar to the above-described embodiment, the exposure apparatus 1 includes an exposure apparatus main body 3 and a carry-in unit 4 as shown in Fig. In the present embodiment, the exposure apparatus 1 is provided with a carry-out robot 205. These are contained in a chamber 2 that is highly cleaned and adjusted to a predetermined temperature.

29, the take-out robot 205 has, for example, a horizontal joint type structure and includes an arm portion 10 having a plurality of parts connected to each other via a vertical joint shaft, A fork portion 12 connected to the drive shaft 13, and a drive device 13. The arm portion 10 is movable, for example, in the vertical direction (Z-axis direction) by the drive device 13. [ The drive of the drive unit 13 is controlled by a control unit (not shown). Thus, the take-out robot 205 is adapted to receive the substrate P from the plate holder 9. Further, the take-out robot 205 is not limited to a robot having a horizontal joint type structure, but can be realized by appropriately employing or combining known robots (generally, a transport mechanism).

30A is a plan view of the plate holder 9, and FIG. 30B is a side view of the plate holder 9. As shown in FIG. In this embodiment, as shown in Fig. 30A, the plate holder 9 is provided with a substrate mounting portion 31 on which a substrate P is placed.

In this embodiment, the plate holder 9 is provided with a groove 30 for accommodating the fork portion 12 of the carry-out robot 205 in the return of the substrate P. The groove portion 30 is formed along the moving direction of the fork portion 12 (Y direction in the drawing). A region other than the groove portion 30 on the upper surface of the plate holder 9 constitutes the substrate mounting portion 31. [

The thickness of the fork portion 12 is smaller than the depth of the groove portion 30. This allows the substrate P placed on the substrate placing portion 31 to be received and placed on the fork portion 12 by accommodating the fork portion 12 in the groove portion 30 and raising the fork portion 12 as described later .

3B, the plate holder 9 is provided with a position detection sensor 19 for detecting a relative position with respect to the loading table 40 in its side portion 9a, as shown in Fig. 30B. The position detection sensor 19 includes a distance detection sensor 19a for detecting the relative distance to the loading table 40 and a height detection sensor 19b for detecting the relative height to the loading table 40 ). A concave portion is formed at a position corresponding to the position detection sensor 19 in the carry-in table 40 to prevent the position detection sensor 19 from interfering with the carry-in table 40 .

Next, the operation of the exposure apparatus 1 in the present embodiment will be described with reference to Figs. 6, 11, 31A to 34. Fig. More specifically, the transfer operation of the substrate P between the carry-in unit 4 and the plate holder 9 and the transfer operation of the substrate P between the plate holder 9 and the carry- The transfer operation will be mainly described.

First, a substrate P coated with a photosensitive agent is loaded into a carry-in unit 4 in a cotter developer (not shown). At this time, the up-and-down moving mechanism 49 located below the loading table 40 places the substrate supporting pins 49a above the loading table 40 via the through-holes 47. [ Subsequently, the arm portion 48 of the cotter developer (not shown) is inserted between the substrate support pins 49a as shown in Fig. The arm portion 48 descends to retract the substrate P from the carry-in portion 4 after receiving the substrate P to the substrate support pin 49a. The up-and-down moving mechanism 49 lowers the substrate support pin 49a supporting the substrate P so that the loading operation of the substrate P with respect to the loading table 40 is completed. Thereafter, the vacuum pump is driven so that the substrate P is sucked and held on the upper surface of the carry-in table 40 via the suction holes K4.

Subsequently, the plate holder 9 is moved close to the loading table 40 of the loading section 4 as shown in Fig. 31A. 31A and 31B, the illustration of the carry-out robot is omitted.

Specifically, the first moving mechanism 33 arranges the plate holder 9 and the loading table 40 in the state of being close to each other along the Y direction. Here, the state in which the plate holder 9 and the carry-in table 40 are close to each other means a state in which the substrate P is separated by a distance at which the movement of the substrate P can be smoothly performed.

The second moving mechanism 43 may also be driven when the loading table 40 and the plate holder 9 are arranged. This makes it possible to move the carry-in table 40 and the plate holder 9 to the transfer position of the substrate P in a short time, thereby shortening the time required for the carrying-in operation of the substrate P. Since the substrate P is sucked and held on the upper surface of the loading table 40 via the suction hole K4, the substrate P is held by the loading table 40 at the time of driving the second moving mechanism 43, Can be prevented from moving on.

The substrate P is arranged higher than the plate holder 9 when the plate holder 9 and the loading table 40 are brought close to each other as shown in Fig. The first moving mechanism 33 moves the plate holder 9 to the loading table 40 so that the upper surface of the loading table 40 supporting the substrate P is higher than the upper surface of the plate holder 9 Close. It is also possible to raise the loading table 40 such that the upper surface of the loading table 40 is higher than the upper surface of the plate holder 9 by the second moving mechanism 43.

The first moving mechanism 33 may be arranged so that the plate holder 9 and the loading table 40 are in contact with each other. In this manner, the transfer of the substrate P between the plate holder 9 and the loading table 40 to be described later can be carried out smoothly.

Subsequently, as shown in Fig. 32, the loading table 40 injects gas from a plurality of gas injection holes K3 formed on the upper surface, and supports the substrate P in a floating state through the substrate. On the other hand, when receiving the substrate P, the plate holder 9 injects gas from a plurality of gas injection holes K2 formed on the upper surface.

The carrying unit 4 brings the abutting portion 42b into contact with the one end of the substrate P as shown in Fig. 33, with the substrate P lifted and held on the carrying table 40. [ The abutting portion 42b moves along the guide portion 42a in the concave portion 40a to move the substrate P toward the plate holder 9 side.

The substrate P is floated on the loading table 40 so that the abutting portion 42b can smoothly slide the substrate P toward the plate holder 9. [ The upper surface of the plate holder 9 supports the substrate P in a floating manner as described above. Here, the gas injected from the gas injection holes K3 and K2 may have directivity.

The substrate P on which the upper surface of the loading table 40 is slid by the abutting portion 42b smoothly moves to the upper surface of the plate holder 9 as shown in Fig. The upper surface of the loading table 40 is higher than the upper surface of the plate holder 9 so that the substrate P does not contact the side surface of the plate holder 9 and moves smoothly onto the plate holder 9 I can move on.

33, the substrate P is slid by a guide pin 36 formed in the peripheral portion of the plate holder 9 in a state where the position in the X direction in the figure is defined. The abutting portion 42b moves the substrate P until it abuts the positioning pin 37 formed on the downstream side in the substrate carrying direction of the plate holder 9. [ The position of the substrate P in the X direction in the drawing is defined by the guide pin 36 and the positioning pin 37 and the abutting portion 42b interpose the substrate P in the Y direction The state of the position of the switch is defined. The plate holder 9 stops gas injection from the gas injection hole K2. The substrate P is placed in a state of being aligned with the substrate mounting section 31 as shown in Fig.

However, when a conventional substrate is placed on a plate holder, there is a possibility that the substrate is misaligned (positional deviation from a predetermined position) or the substrate is deformed. As one of the causes of this displacement, for example, it is conceivable that the substrate is brought into a floating state by a thin air layer formed between the substrate and the plate holder immediately before mounting the substrate. As one of the causes for causing deformation of the substrate, for example, it is conceivable that an air flow is interposed between the substrate and the plate holder after the substrate is mounted, thereby causing the substrate to become inflated.

On the other hand, in the present embodiment, since the substrate P is transported in a floating state by the jetting of gas as described above, the substrate P is transferred to the plate holder 9 in a state of high flatness without deformation. Since the substrate P is mounted on the substrate mounting portion 31 from the height at which the substrate P is floated and supported, air or an air layer is prevented from occurring between the substrate P and the substrate mounting portion 31. Therefore, the substrate P is prevented from being in an inflated state, and it is possible to prevent the substrate P from being misaligned or deformed. Therefore, the substrate P can be placed on the plate holder 9 at a predetermined position with a high planarity. Thereafter, the vacuum pump is driven so that the substrate P is sucked and held on the upper surface of the substrate mounting portion 31 via the suction holes K1.

After the substrate P is placed on the plate holder 9, the mask M is illuminated by the exposure light IL from the illumination system. The pattern of the mask M illuminated by the exposure light IL is projected and exposed through the projection optical system PL onto the substrate P placed on the plate holder 9. [

The exposure apparatus 1 can perform predetermined exposure at a proper position on the substrate P with high accuracy because the substrate P is preferably placed on the plate holder 9 as described above, The exposure process can be realized.

In the present embodiment, while the carrying robot 205 is carrying out the exposure processing on the substrate P in the middle of the exposure processing on the substrate P or in the exposure processing as described later, a coater / developer (not shown) The substrate P to which the photosensitive agent has been applied by the transfer unit 4 can be placed on the loading table 40 of the loading unit 4. [

Next, the carrying-out operation of the substrate P from the plate holder 9 after the end of the exposure processing will be described.

Specifically, a method of carrying out the substrate P by the carry-out robot 205 will be described. Figs. 36A and 36B are sectional views of the substrate P when viewed from the Y-axis direction when the substrate P is taken out from the plate holder 9, and Fig. 37 Is a side view when the operation of taking out the substrate P from the plate holder 9 is viewed in the X-axis direction. 35, only the fork portion 12 is shown, and the overall configuration of the carry-out robot 205 is omitted. 36A and 36B, the fork portion 12 for supporting the substrate P is simplified for the sake of convenience.

When the exposure process is completed, the suction of the suction hole K1 by the vacuum pump is released, and the suction of the substrate P by the plate holder 9 is released. Subsequently, the take-out robot 205 inserts the fork portion 12 from the -Y direction side into the groove portion 30 formed in the plate holder 9, as shown in Fig.

The driving device 13 moves the fork portion 12 upward by a predetermined amount to bring the fork portion 12 against the lower surface of the substrate P as shown in Fig. 36A. 36B, the fork portion 12 is further moved upward, so that the substrate P is lifted up from the plate holder 9 and separated from the substrate mounting portion 31. [

The take-out robot 205 also raises (retracts) the fork portion 12 to a height that does not contact the carry-in table 40 of the carry-in portion 4 on which the substrate P on which the photosensitive agent has been applied is mounted . The carry-in table 40 of the carry-in part 4 is moved to the position where the fork portion 12 does not contact the substrate P on the carry-in table 40, And the substrate P is transported to the plate holder 9 side as described above.

The transfer robot 205 transfers the substrate P placed on the fork portion 12 into the cotter developer (not shown) while the substrate P is being transferred from the loading portion 4 to the plate holder 9, . Thus, the carrying-out operation of the substrate P from the exposure apparatus main body 3 is completed.

As described above, according to the present embodiment, since the substrate P lifted and held can be transported from the carry-in unit 4 to the plate holder 9 by sliding, air (air) It is possible to prevent the occurrence of misalignment and deformation of the substrate P. Therefore, highly reliable exposure processing can be performed.

In this embodiment, since the substrate P is slid from the carry-in section 4 to the plate holder 9 side by using the gas injection, the tact time is longer than that of the plate holder using the conventional tray Loses.

On the other hand, in the present embodiment, the fork portion 12 of the take-out robot 205 is inserted into the groove portion 30, the substrate P is lifted from the bottom surface, and the substrate P is retracted from the plate holder 9 The entire tact time necessary for carrying the substrate P in and out of the plate holder 9 can be reduced by using the conventional tray because the carry-in unit 4 can bring the next substrate P into the plate holder 9. [ It can be made substantially equal to the case. Therefore, the substrate P can be brought into the plate holder 9 in a good state without increasing the tact time at the time of carrying the substrate P in and out.

In the present embodiment, when the substrate P is carried from the carry-in table 40 to the plate holder 9, the upper surface of the carry-in table 40 may be inclined. More specifically, the holding portion 44 of the second moving mechanism 43 moves the upper surface of the carry-in table 40 supporting the substrate P in a floating state by gas injection from the gas injection hole K3 And is inclined toward the plate holder 9 side (? Y direction). Thereby, the substrate P can be moved toward the plate holder 9 side by using the weight of the substrate P itself.

(Seventh Embodiment)

Next, a configuration according to a seventh embodiment of the present invention will be described. In this embodiment, the same elements as those of the sixth embodiment are denoted by the same reference numerals, and a description thereof will be omitted. The seventh embodiment differs from the sixth embodiment in the configuration of the carry-in part.

In this embodiment, the carrying-in unit 104 is the same as that described with reference to Figs. 16A and 16B.

The operation of the exposure apparatus 1 in this embodiment is also the same as that described with reference to Figs. 17 and 18. Fig.

In the present embodiment, since the substrate P is transported in a floating state by the jetting of gas as described above, the substrate P can be transported to the plate holder 9 in a state of no deformation and high flatness, And the substrate mounting portion 31 is prevented. Therefore, the substrate P can be placed on the plate holder 9 at a predetermined position with a high planarity. Therefore, predetermined exposure can be performed at a proper position on the substrate P with high accuracy, and exposure processing with high reliability can be performed.

(Eighth embodiment)

Next, the configuration according to the eighth embodiment of the present invention will be described. In this embodiment, the same elements as those of the sixth and seventh embodiments are denoted by the same reference numerals, and a description thereof will be omitted. The eighth embodiment differs from the sixth and seventh embodiments mainly in that the plate holder 9 has a transfer portion.

38 is a view showing a configuration of the plate holder 109 according to the present embodiment. The plate holder 109 according to the present embodiment has a first transfer section 249 for transferring the substrate P from the loading table 40 to the plate holder 9 as shown in Fig. The first transfer section 249 includes a suction section 250 for sucking and holding both sides of the substrate P in the width direction. The adsorption unit 250 is freely movable in the XY plane along the plane direction of the substrate P.

In the present embodiment, the position detection sensor 252 for detecting the position of the substrate P to be carried by the first transfer unit 249 with respect to the substrate placement unit 31 is formed in the periphery of the plate holder 9 . As the position detection sensor 252, for example, a potentiometer can be exemplified, and in the present invention, any of a contact type or a non-contact type meter can be used.

The adsorption unit 250 sucks and holds the end portion of the substrate P lifted and held on the loading table 40 by the gas injection from the gas injection hole K3 and as shown in FIG. 40 to the plate holder 9 side. On the other hand, when receiving the substrate P, the plate holder 9 injects gas from a plurality of gas injection holes K2 formed on the upper surface. At this time, the gas injected from the gas injection holes K2 and K3 may have directivity.

39B, the adsorption unit 250 contacts the end of the substrate P with the position detection sensor 252 so that the exposure apparatus 1 can move the substrate P toward the substrate placement unit 31 of the substrate P The positional deviation can be detected. The suction unit 250 is configured to be driven based on the detection result of the position detection sensor 252.

The exposure apparatus 1 can correct the position of the substrate P held by the suction unit 250 with respect to the substrate placement unit 31 based on the detection result of the position detection sensor 252. [

The substrate P can be transferred to the plate holder 9 in a state in which there is no deformation and a high degree of flatness, It is possible to prevent an air flow or an air layer from being formed between the substrate mounting portion 31 and the substrate mounting portion 31. [ Therefore, the substrate P can be placed on the plate holder 9 at a predetermined position with a high planarity. Therefore, predetermined exposure can be performed at a proper position on the substrate P with high accuracy, and exposure processing with high reliability can be performed.

The carrying-out operation of the substrate P from the plate holder 9 after the completion of the exposure processing is the same as that in the first embodiment, and a description thereof will be omitted.

(Ninth embodiment)

Next, a configuration according to a ninth embodiment of the present invention will be described. In the present embodiment, the same elements as those of the sixth to eighth embodiments are denoted by the same reference numerals, and a description thereof will be omitted. The ninth embodiment differs from the sixth to eighth embodiments mainly in the configuration of the exposure apparatus main body. 40 is a perspective view showing a schematic structure of the exposure apparatus main body 3 according to the present embodiment.

40, the exposure apparatus main body 3 of the present embodiment includes a plate holder 9, a substrate lift mechanism 150 formed on the plate holder 9, and a first moving mechanism 33 . The substrate lift mechanism 150 lifts the substrate P upward when the substrate P is carried out.

42A and 42B are side cross-sectional views of the plate holder 9, Fig. 42A is a view showing a state before the substrate is transferred, and Fig. 42B is a cross- Fig. 8 is a view showing the state of the substrate after the transfer.

41, 42a and 42b, the lift mechanism 150 includes a plurality of substrate support members 151 for supporting the substrate P, and upper and lower operation portions (upper and lower operation portions) for vertically moving the substrate support member 151 152) (see FIG. 43).

The substrate support member 151 is provided with a first linear member 119 that is installed in the X direction (first direction) in FIG. 41 and a first linear member 119 that is extended in the Y direction And a second linear member 120 which is installed in a second direction (second direction), and is formed in a substantially lattice shape as a whole. The first linear members 119 and the second linear members (second temporary portions) 120 are welded to each other or combined in a lattice pattern here. Each substrate support member 151 is sandwiched between a plurality of (for example, six) shaft portions 155 in this embodiment.

Each lattice shape constituting each substrate support member 151 has a plurality of substantially rectangular openings 121 that are smaller than the substrate P. The shape of the substrate support member 151 is not limited to the shape shown in Fig. 41, and may be a single frame on the frame where only one opening 121 is formed, for example.

In this embodiment, the four substrate support members 151 are arranged with the gap S along the extending direction of the second linear member 120 (the Y direction shown in FIG. 41). The clearance S between the substrate support members 151 serves to constitute a space in which the fork portion 12 is inserted in the counterclockwise rotation of the substrate P from the plate holder 9 as described later.

It should be noted that the substrate supporting member 151 is a material for forming the first linearly moving member 119 and the second linearly moving member 120 so that when the substrate supporting member 151 supports the substrate P, It is preferable to use a material capable of restraining warping due to its own weight. For example, various synthetic resins or metals can be used. Specific examples include nylon, polypropylene, AS resin, ABS resin, polycarbonate, fiber reinforced plastic, and stainless steel. Examples of the fiber reinforced plastic include GFRP (glass fiber reinforced thermosetting plastic) and CFRP (carbon fiber reinforced thermosetting plastic).

As shown in Fig. 43, the vertical movement section 152 includes a shaft section (vertical moving member) 155 and a drive device 153 for driving the shaft section 155 up and down. The drive device 153 is formed with respect to the shaft portions 155, whereby the shaft portions 155 independently perform the up-and-down movement.

42A and 42B, the substrate supporting member 151 is moved in the upward and downward directions of the upper and lower operating portions 152 (the shaft portions 155) of the plate holder 9 In the vertical direction.

On the other hand, the plate holder 9 is formed with a recess 130 for accommodating the substrate supporting member 151 therein. The concave portion 130 is formed in a lattice pattern corresponding to the frame structure of the substrate supporting member 151. A region (partial placement portion) other than the concave portion 130 on the upper surface of the plate holder 9 constitutes the substrate placement section 31 for holding the substrate P.

The thickness of the substrate supporting member 151 is smaller than the depth of the concave portion 130. 42B, only the substrate P placed on the substrate supporting member 151 is received and placed on the substrate mounting portion 31 by the substrate supporting member 151 being accommodated in the concave portion 130 .

The substrate holder 31 is completed so that the substantial holding surface of the plate holder 9 with respect to the substrate P has a good flatness. A suction port for bringing the substrate P in close contact with the surface of the substrate P or an air (gas) is blown to the substrate holding surface of the substrate mounting portion 31 And an opening K205 functioning as a gas jet opening for supporting and floating on this surface is formed. A vacuum pump and a gas branch pump (not shown) are connected to the opening K205, respectively. By switching the driving of these pumps, the opening K205 can function as a suction port or a jetting port as described above.

A guide pin 36 for guiding the substrate P when the substrate P is carried in and a guide pin 36 for guiding the substrate P to the substrate mounting portion 31 of the plate holder 9 are formed in the periphery of the plate holder 9, (See Figs. 44A and 44B). The guide pins 36 and the positioning pins 37 are movable together with the plate holder 9 in the exposure apparatus main body 3.

Next, the operation of the exposure apparatus 1 of the present embodiment will be described with reference to Figs. 44A to 50B. More specifically, the transfer operation of the substrate P between the carry-in unit 4 and the plate holder 9 and the transfer operation of the substrate P between the plate holder 9 and the carry- The transfer operation will be mainly described.

First, in the same manner as in the sixth embodiment, the substrate P having the photosensitive agent applied thereon is carried into the carry-in unit 4 by a cotter developer (not shown). At this time, the substrate P is adsorbed and held on the upper surface of the carry-in table 40 through the suction hole K4.

Subsequently, the plate holder 9 is moved close to the loading table 40 of the loading section 4 as shown in Fig. 44A. 44A and 44B, the illustration of the carry-out robot is omitted. Specifically, the first moving mechanism 33 arranges the plate holder 9 and the loading table 40 in the state of being close to each other along the Y direction. At this time, by driving the second moving mechanism 43, the carrying-in table 40 and the plate holder 9 are moved to the receiving position of the substrate P in a short time, and the time required for the carrying- Can be shortened. The substrate P is attracted and held on the upper surface of the carry-in table 40 via the suction hole K4 so that when the substrate P is moved at the time of driving the second movement mechanism 43, There is no case of moving on.

44B, the first moving mechanism 33 moves the plate holder 9 such that the upper surface of the loading table 40 supporting the substrate P is higher than the upper surface of the plate holder 9, ) Is brought close to the loading table (40). It is also possible to raise the loading table 40 such that the upper surface of the loading table 40 is higher than the upper surface of the plate holder 9 by the second moving mechanism 43. The first moving mechanism 33 may be arranged in a state in which the plate holder 9 and the loading table 40 are brought into contact with each other so that the transfer of the substrate P can be carried out smoothly.

Subsequently, as shown in Fig. 45, the loading table 40 injects a gas from a plurality of gas injection holes K3 formed on the upper surface thereof, and the substrate P is supported in a floating state through the substrate. On the other hand, when receiving the substrate P, the plate holder 9 drives a gas pump (not shown) and injects air from the opening K205 formed in the substrate mounting portion 31. [

The carrying unit 4 brings the abutting portion 42b into contact with the one end of the substrate P as shown in Fig. 46 in a state in which the substrate P is lifted and supported on the carrying table 40. Fig. The abutting portion 42b is moved along the guide portion 42a in the concave portion 40a to move the substrate P to the plate holder 9 side.

The substrate P is floated on the loading table 40 so that the abutting portion 42b can smoothly slide the substrate P toward the plate holder 9. [ The upper surface of the plate holder 9 supports the substrate P in a floating manner as described above. Here, the gas injected from the gas injection hole K3 and the opening K205 may have directivity.

The substrate P on which the upper surface of the loading table 40 is slid by the abutting portion 42b smoothly moves to the upper surface of the plate holder 9 as shown in Fig. The upper surface of the loading table 40 is higher than the upper surface of the plate holder 9 so that the substrate P does not contact the side surface of the plate holder 9 and moves smoothly onto the plate holder 9 I can move on.

The position of the substrate P in the X direction in the drawing is defined by the guide pin 36 and the positioning pin 37 and the abutting portion 42b interpose the substrate P in the Y direction The state of the position of the switch is defined. The plate holder 9 stops gas injection from the opening K205. Thereby, the substrate P is placed in alignment with the substrate mounting portion 31. [

In the present embodiment, since the substrate P is transported in a floating state by the jetting of gas as described above, it is transferred to the plate holder 9 in a state of high flatness without deformation. Since the substrate P is mounted on the substrate mounting portion 31 from the height at which the substrate P is lifted up, air or an air layer is prevented from occurring between the substrate P and the substrate mounting portion 31. Therefore, the substrate P is prevented from being in an inflated state, and it is possible to prevent the substrate P from being misaligned or deformed. Therefore, the substrate P is placed at a predetermined position with respect to the plate holder 9 in a state of high planarity. Thereafter, the vacuum pump is driven so that the substrate P is sucked and held on the upper surface of the substrate mounting portion 31 via the opening K205.

After the substrate P is placed on the plate holder 9, the mask M is illuminated by the exposure light IL from the illumination system. The pattern of the mask M illuminated by the exposure light IL is projected and exposed through the projection optical system PL onto the substrate P placed on the plate holder 9. [

The exposure apparatus 1 according to the present embodiment is capable of performing a predetermined exposure at a proper position on the substrate P with high accuracy since the substrate P is preferably placed on the plate holder 9 as described above Thus, highly reliable exposure processing can be realized.

Next, the carrying-out operation of the substrate P from the plate holder 9 after the end of the exposure processing will be described.

Specifically, a method of carrying out the substrate P by the carry-out robot 205 will be described. Figs. 49A, 49B and 49C are cross-sectional views taken along the Y-axis direction when the substrate P is taken out from the plate holder 9; Fig. 48 is a perspective view for explaining the operation of the carry- . 48, only the fork portion 12 is shown, and the overall configuration of the carry-out robot 205 is omitted. In the present embodiment, the shape corresponds to the shape of the lift mechanism 150, and the substrate supporting portion of the fork portion 12 is different from the above embodiment. 49A, 49B, and 49C, for the sake of convenience, the illustration of the fork portion 12 supporting the substrate P is simplified.

Upon completion of the exposure process, the suction through the opening K205 by the vacuum pump is released, and the suction of the substrate P by the plate holder 9 is released. Subsequently, the lift mechanism 150 drives the shaft portion 155 to raise the substrate support member 151. [ At this time, as shown in FIG. 49A, the substrate P placed on the substrate mounting portion 31 together with the substrate supporting member 151 is lifted upward. At this time, since the substrate P is lifted up by being supported by the plurality of substrate supporting members 151, the occurrence of peeling electrification can be prevented. In addition, since the substrate P can be supported on a wider plane than in the case of lifting the substrate P by the pins as in the conventional case, the amount of deflection occurring on the substrate P can be reduced, Cracks can be prevented from occurring.

The take-out robot 205 drives the fork portion 12 to move the gap S between the substrate support members 151 disposed above the substrate mounting portion 31 and the gap S between both ends in the X- The fork portion 12 is moved toward the -Y direction toward the gap S and the fork portion 12 is inserted at both ends (Fig. 49B).

When the driving unit 13 moves the fork unit 12 upward by a predetermined amount, the fork unit 12 is brought into contact with the lower surface of the substrate P. [ When the fork portion 12 is moved upward, as shown in FIG. 49C, the substrate P is lifted upwards from the plate holder 9, and is then separated from the lift mechanism 150.

The lift mechanism 150 accommodates the substrate supporting member 151 in the concave portion 130 after the substrate P is separated. After the substrate support member 151 is received in the concave portion 130, the plate holder 9 is moved so as to be close to the loading table 40 of the carry-in portion 4 and the substrate P To the plate holder 9 side.

The transfer robot 205 transfers the substrate P placed on the fork portion 12 into the cotter developer (not shown) while the substrate P is being transferred from the loading portion 4 to the plate holder 9, . Thus, the carrying-out operation of the substrate P from the exposure apparatus main body 3 is completed.

As described above, according to the present embodiment, since the substrate P lifted and held is transported from the carry-in unit 4 to the plate holder 9 by sliding, it is possible to prevent the substrate P from being misaligned or deformed. Also in the present embodiment, the total tact time required for carrying the substrate P in and out of the plate holder 9 can be made substantially equal to that in the case of using a conventional tray. Therefore, the substrate P can be brought into the plate holder 9 in a good state without increasing the tact time at the time of carrying the substrate P in and out.

In the above-described embodiment, the case of forming the opening K205 as the gas ejection port is described only in the substrate mounting portion 31, but the gas ejection port may be formed on the upper surface of the substrate supporting member 151. [ In this case, when the substrate P is carried into the plate holder 9, the amount of gas injected onto the substrate carrying surface increases, so that the substrate P can be transported more smoothly.

(Tenth Embodiment)

Next, the configuration according to the tenth embodiment of the present invention will be described. In this embodiment, the same elements as those of the sixth embodiment are denoted by the same reference numerals, and a description thereof will be omitted. The tenth embodiment is different from the above-described embodiment in that it comprises an adsorption mechanism for adsorbing the substrate P in a non-contact state by a means for taking out the substrate P from the plate holder 9.

The adsorption mechanism is for holding the substrate P and lifting the substrate P from the substrate placing portion 31 of the plate holder 9 to move it into a cotter developer (not shown). Fig. 50A shows the structure of the adsorption surface, and Fig. 50B shows the entire structure of the adsorption mechanism.

50A and 50B, the suction mechanism 350 includes a plurality of holding portions 351 for holding the substrate P in a non-contact state, a base portion 352 for holding the holding portions 351, A drive mechanism 355 capable of moving the base portion 352, and a base portion 352. The base portion 352 is a plate-shaped member having a size substantially equal to that of the substrate P. [ The holding portions 351 are regularly arranged on the base portion 352, whereby the substrate P can be maintained well.

As the holding portion 351, a so-called Bernoulli chuck was used. The holding portion 351 generates a negative pressure between the holding portion 351 and the substrate P by jetting compressed air between the holding portion 351 and the substrate P. [ As a result, a pushing force for pressing the substrate P toward the holding portion 351 side is generated. On the other hand, when the gap between the holding portion 351 and the substrate P becomes smaller, the flow velocity of the compressed air is lowered, and the pressure between the holding portion 351 and the substrate P is raised. As a result, a force for separating the substrate P from the holding portion 351 is generated. The holding portion 351 is formed in a state in which the gap between the substrate P and the holding portion 351 is kept constant by ejecting compressed air so as to balance the two forces, .

Next, the operation of the exposure apparatus 1 will be described with reference to the drawings. The feeding operation of the substrate P between the carry-in portion 4 and the plate holder 9 is the same as that in the first embodiment, and therefore, description thereof will be omitted.

Hereinafter, an operation of taking out the substrate P from the plate holder 9 will be described. Specifically, a method of taking out the substrate P from the plate holder 9 by the suction mechanism 350 will be described. Figs. 51A and 51B are side views of the operation of taking out the substrate P from the plate holder 9 when viewed in the X-axis direction.

When the exposure process is completed, the suction of the suction hole K1 by the vacuum pump is released, and the suction of the substrate P by the plate holder 9 is released. Subsequently, the adsorption mechanism 350 moves to the upper side of the plate holder 9. Then, the adsorption mechanism 350 is lowered to a position where the holding portion 351 can hold the substrate P, as shown in Fig. 51A. The upper surface of the substrate P is held in a noncontact state by the plurality of holding portions 351. [ At this time, the plurality of holding portions 351 can be driven simultaneously or sequentially so as to hold the substrate P. [

The adsorption mechanism 350 lifts the substrate P to the upper side of the plate holder 9 by the driving mechanism 355 while holding the substrate P by the plurality of holding portions 251, And is moved away from the substrate mounting section 31 as shown in Fig. At this time, since the holding portion 351 is not in contact with the substrate P, there is no case in which a trace of adsorption remains on the substrate P.

The carry-in table 40 of the carry-in section 4 is moved close to the plate holder 9 after the suction mechanism 350 is raised to a position where it does not contact the substrate P on the carry- Then, in the same manner as in the above-described embodiment, the substrate P is conveyed from the carry-in table 40 to the plate holder 9 in a floating state.

While the substrate P is being conveyed from the carrying-in part 4 to the plate holder 9, the suction mechanism 350 moves the substrate P held by the holding part 351 into a cotter developer (not shown) . The carrying-out operation of the substrate P from the exposure apparatus main body 3 is completed as described above.

As shown in Figs. 52A and 52B, a support member 353 for supporting the lower surface of the substrate P may be formed around the base portion 352. Fig. The support member 353 is a frame member surrounding the periphery of the substrate P and has a plurality of protrusions 354 protruding in the surface direction of the substrate P. [ The projecting portion 354 is in contact with the lower surface of the substrate P. According to this configuration, when the large-sized substrate on which the substrate P is likely to be deflected is held, the peripheral end portion of the substrate P is supported by the protruding portion 354, The substrate P can be held in a state of high planarity by the holding portion 351 while preventing the edge of the substrate P from being sagged.

As the substrate P of the above-described embodiment, not only a glass substrate for a display device but also a semiconductor wafer for semiconductor device fabrication, a ceramic wafer for a thin film magnetic head, or a mask or reticle used for an exposure apparatus Synthetic quartz, silicon wafer).

The exposure apparatus includes a step-and-scan method of synchronously moving the mask M and the substrate P to scan-expose the substrate P by the exposure light IL through the pattern of the mask M A step-and-repeat operation for sequentially moving the substrate P step by step while exposing the pattern of the mask M in a state in which the mask M and the substrate P are stopped in addition to the scanning type exposure apparatus (scanning stepper) The present invention is also applicable to a projection exposure apparatus (stepper).

The present invention can also be applied to a twin-stage type exposure apparatus having a plurality of substrate stages as disclosed in U.S. Patent No. 6341007, U.S. Patent No. 6,208,407, U.S. Patent No. 622,796, and the like.

The present invention is also applicable to a substrate stage for holding a substrate and a reference member in which a reference mark is formed and / or various photoelectric sensors without holding the substrate, as disclosed in U.S. Patent No. 6897963 and European Patent Application Publication No. 1713113 The present invention is also applicable to an exposure apparatus having a measurement stage mounted thereon. In addition, an exposure apparatus having a plurality of substrate stages and a measurement stage can be employed.

In the above-described embodiment, the light-transmitting mask in which the predetermined light-shielding pattern (or the phase pattern / light-shielding pattern) is formed on the light-transmissive substrate is used. Instead of this mask, for example, US Pat. No. 6,778,257 (Also referred to as an electron mask, an active mask, or an image generator) for forming a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed may be used. Instead of the variable mold mask having the non-light emitting type image display element, a pattern forming apparatus including the self light emitting type image display element may be provided.

The exposure apparatus of the above-described embodiment is manufactured by assembling various subsystems including respective components to maintain predetermined mechanical precision, electrical precision, and optical precision. In order to secure these various accuracies, it is necessary to make adjustments to achieve optical precision for various optical systems before and after the assembly, adjustments for achieving mechanical precision for various mechanical systems, and adjustment for achieving electrical precision for various machines . The assembling process from the various subsystems to the exposure apparatus includes mechanical connection between the various subsystems, wiring connection of electric circuits, piping connection of the air pressure circuit, and the like. Needless to say, there is a process of assembling each subsystem before the assembling process to the exposure apparatus in these various subsystems. When the assembling process of various sub-systems to the exposure apparatus is completed, comprehensive adjustment is made, and various precision of the entire exposure apparatus is ensured. The manufacturing of the exposure apparatus is preferably carried out in a clean room where temperature, cleanliness and the like are managed.

As shown in FIG. 53, a micro device such as a semiconductor device includes a step 201 of designing a function and a performance of a micro device, a step 202 of manufacturing a mask (reticle) based on the design step, (Exposure processing) including exposing the substrate to exposure light using the pattern of the mask and developing the exposed substrate (photosensitive agent) in accordance with the above-described embodiment, A step 204, a device assembly step 205 (including a dicing process, a bonding process, and a packaging process), an inspection step 206, and the like. Step 204 includes developing the photoresist to form an exposure pattern layer (layer of the developed photoresist) corresponding to the pattern of the mask, and processing the substrate through the exposure pattern layer.

Further, the requirements of the above-described embodiments and modifications can be combined as appropriate. In addition, some components may not be used. In addition, as far as the laws and ordinances permit, all publications relating to the exposure apparatus and the like cited in the above-described embodiment and modified examples and the disclosure of the U.S. patent are referred to as a part of the text.

P ... Substrate, K1, K4, K6, K8 ... Suction ball, K2, K3, K5, K7 ... Gas sprayer, K205 ... Opening, 1 ... Exposure apparatus, 4, 104 ... Carrying part, 5 ... Export section, 9, 109 ... Plate holder, 12 ... Fork section, 19 ... Position detection sensor, 33 ... The first moving mechanism, 40, 140 ... Table for import, 42, 149, 249 ... A first transfer part, 43 ... The second moving mechanism, 50 ... Export table, 52 ... A second transfer part 53, The third moving mechanism, 109 ... Plate holder, 142 ... Rollers, 148 ... Roller mechanism, 149 ... A first transfer unit, 150 ... Lift mechanism, 205 ... Removing robot, 250 ... Absorption portion, 251 ... 252 ... Position detection sensor, 350 ... Absorption mechanism, 351 ... The holding part, 401 ... Substrate placement table, 405 ... The transfer section, 408 ... Absorption portion

Claims (8)

A plasma processing apparatus comprising: a first supporting unit that supplies a substrate to one surface of a substrate and supports the substrate by floating through the substrate;
A second support portion capable of supporting the one surface of the substrate,
A lift mechanism that supports the substrate placed on the placement portion of the first support portion and lifts up the placement portion,
A loading mechanism for bringing another substrate supported by the second supporting portion into the mounting portion between the substrate and the mounting portion supported by the lift mechanism,
. The method according to claim 1,
Wherein the lift mechanism includes a holding portion that holds the substrate and rises. The method according to claim 1,
Wherein the holding section holds the substrate in a non-contact state. 3. The method of claim 2,
Wherein the lift mechanism includes a plurality of the holding portions. 3. The method of claim 2,
Wherein the lift mechanism includes a support member for supporting an end portion of the substrate. 3. The method of claim 2,
Wherein the lift mechanism includes a driving unit that drives the holding unit holding the substrate to move to a position different from the first supporting unit. 7. The method according to any one of claims 1 to 6,
Wherein the second support portion supplies a gas to the one surface of the substrate and allows the substrate to float up through the substrate. 8. The method according to any one of claims 1 to 7,
And a relative position detecting section for detecting a relative position between the first supporting section and the second supporting section.

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