JP6142217B2 - Substrate transfer device for exposure - Google Patents

Description

  The present invention relates to a substrate transport mechanism for an exposure apparatus, and more particularly to a substrate transport mechanism for an exposure apparatus suitable for exposing and transferring a mask pattern onto a substrate of a large flat panel display such as a liquid crystal display or a plasma display.

  Large flat panel displays such as liquid crystal displays and plasma displays used in large thin televisions are manufactured by bringing the substrate close to the mask and exposing and transferring the mask pattern onto the substrate using the division sequential exposure method. The As a conventional sequential sequential exposure apparatus of this type, for example, a mask smaller than the substrate as the material to be exposed is used, the mask is held on the mask stage and the substrate is held on the work stage, and both are placed close to each other. In this state, the work stage is moved stepwise with respect to the mask, and the substrate is exposed to light for pattern exposure from the mask side at each step, thereby exposing a plurality of mask patterns drawn on the mask onto the substrate. There is known one in which a plurality of displays and the like are created on a single substrate by transfer. In particular, in the technique of Patent Document 1, a mask pattern can be exposed on a large substrate by moving a smaller mask and a light source in synchronization with the substrate.

  By the way, in proximity exposure, there is a method in which the mask is made the same size as the substrate and is exposed in a lump. However, in such a method, when the mask pattern is exposed and transferred onto a large substrate, the mask becomes large and the mask is exposed. This causes problems in terms of the influence on the pattern accuracy due to the bending of the pattern and the cost. Under these circumstances, conventionally, when a mask pattern is exposed and transferred onto a large substrate, a mask smaller than the substrate is used, the work stage is moved stepwise relative to the mask, and the mask is moved to the substrate for each step. There is a case where a so-called stepwise proximity exposure method is used in which pattern exposure light is irradiated in a state of being closely arranged, whereby a plurality of patterns drawn on a mask are exposed and transferred onto a substrate.

    Japanese Patent Laid-Open No. 11-237744

  In such an exposure apparatus, a substrate lift pin or the like is attached to the exposure substrate transport mechanism.

  By the way, with the recent increase in size of a substrate, when the substrate is transferred to an adjacent lift pin, the substrate may be brought into contact with the substrate transport mechanism and the substrate may be damaged.

The present invention has been made in view of the above circumstances, and an object thereof is to provide an exposure substrate transport apparatus that can reciprocate a substrate without contacting the substrate transport mechanism.

The above object of the present invention can be achieved by the following constitution.
(1) a substrate gripping mechanism for gripping one or both ends of the substrate;
A substrate moving mechanism for moving the substrate gripping mechanism;
A substrate levitating mechanism for levitating the substrate;
With
The substrate is floated by the medium, and as the substrate reciprocates on the plurality of substrate floating mechanism, the substrate moving mechanism to reciprocate the substrate holding mechanism,
A substrate transport apparatus for exposure , wherein rollers or air nozzles are provided between the plurality of substrate floating mechanisms .
(2) The substrate transport apparatus for an exposure apparatus according to (1) , wherein the height of the adjacent substrate floating mechanism is gradually reduced.
(3) The substrate transport apparatus for exposure according to (1) , wherein a surface of the substrate floating mechanism is inclined.
(4) The substrate transport apparatus for an exposure apparatus according to any one of (1) to (3), wherein the substrate is levitated by the medium blown from the substrate levitating mechanism.
(5) The substrate transport apparatus for an exposure apparatus according to any one of (1) to (3) , wherein the substrate is levitated by ultrasonic waves generated by vibrating the substrate levitating mechanism.
(6) The substrate transport apparatus for an exposure apparatus according to any one of (1) to (5), wherein the medium is a gas.
(7) The substrate transport apparatus for an exposure apparatus according to (6), wherein the gas is air.

According to the exposure for the substrate transfer apparatus of the present invention, the substrate in order not to contact with the substrate to the transport mechanism, the substrate is floated by the medium, by reciprocating the gripping means for gripping the or at least one location the end portion of the substrate The substrate can be reciprocated. In addition, since rollers or air nozzles are provided between the plurality of substrate floating mechanisms, the substrate can be transported without the tip of the substrate contacting the surface or edge of the substrate floating mechanism.

The schematic perspective view which shows the Example of the board | substrate conveyance apparatus for exposure using the board | substrate holding | grip mechanism of this invention. FIG. 2A is a schematic cross-sectional view showing a first embodiment of a substrate floating mechanism of an exposure substrate transfer apparatus. FIG. 2B is a schematic cross-sectional view showing a modification of the first embodiment of the substrate floating mechanism. FIG. 3A and FIG. 3B are explanatory views showing a specific floating state of the exposure substrate transfer apparatus in the first embodiment. FIG. 3C and FIG. 3D are explanatory views showing a specific floating state of the exposure substrate transfer apparatus in the modification of the first embodiment. FIG. 4A is a schematic sectional view showing a second embodiment of the substrate floating mechanism of the exposure substrate transfer apparatus. FIG. 4B is a schematic cross-sectional view showing a modification of the second embodiment of the substrate floating mechanism. FIG. 5A and FIG. 5B are explanatory views showing a specific floating state of the exposure substrate transfer apparatus in the second embodiment. FIG. 5C and FIG. 5D are explanatory views showing a specific floating state of the exposure substrate transport apparatus in a modification of the second embodiment. FIG. 6A is a schematic cross-sectional view showing a third embodiment of the substrate floating mechanism of the exposure substrate transfer apparatus. FIG. 6B is a schematic cross-sectional view showing a modification of the third embodiment of the substrate floating mechanism. FIG. 7A and FIG. 7B are explanatory views showing a specific floating state of the exposure substrate transfer apparatus in the third embodiment. FIG. 7C and FIG. 7D are explanatory views showing a specific floating state of the exposure substrate transfer apparatus in the modification of the third embodiment.

(First embodiment)
Hereinafter, an exposure substrate transport apparatus having a substrate gripping configuration according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a block diagram of an exposure substrate transfer apparatus.
FIG. 2 is a schematic cross-sectional view showing the substrate floating mechanism of the exposure substrate transfer apparatus. FIG. 3 is an explanatory view showing a specific floating state of the substrate being transported.

  An exposure substrate transport apparatus 1 according to the present invention fixes a substrate floating mechanism 3 that transports a substrate 2 while floating the substrate 2 by blowing air, and one end and both ends of the substrate 2 protruding from the side surface of the substrate floating mechanism 3. And a substrate transport mechanism 6 which is provided adjacent to the side surface of the substrate floating mechanism 3 and reciprocates the substrate 2 in the positive and negative X-axis directions via the substrate gripping mechanism 5.

  Next, the structure of the substrate floating mechanism 3 will be described with reference to FIG. FIG. 2A is a schematic cross-sectional view of the substrate floating mechanism 3.

  The substrate floating mechanism 3 in the exposure substrate transport apparatus 1 of the present invention is a rectangular hollow structure, and the substrate 2 is floated by blowing air from the surface 3 a of the substrate floating mechanism 3 facing the substrate 2. Is possible.

As shown in FIG. 1, the substrate transport mechanism 6 in the exposure substrate transport apparatus 1 of the present invention is provided adjacent to one side or both sides of the substrate floating mechanism 3, and the substrate 2 is kept uniform along the X-axis direction. It is a uniaxial transport mechanism that transports at a speed. For example, a combination of a linear motor and a linear guide is suitable.
However, in the future, when the required accuracy of inspection will increase and this transport device will be applied to an ultra-high resolution inspection machine, it may be possible to combine an air levitation guide with a coreless type linear motor.

  Further, as shown in FIG. 2B, as a modification of the first embodiment, instead of blowing air from the surface 3a of the base transport levitation mechanism 3, the base transport levitation mechanism 3 is vibrated in the Z-axis direction. The substrate 2 may be levitated by the ultrasonic waves generated by this.

  Further, as shown in FIG. 3A, the substrate 2 that has been levitated by the air blown from the surface 3a of the substrate levitating mechanism 3 is conveyed in the positive X-axis direction. Since air does not blow out between the substrate levitation mechanism 3 and the adjacent levitation mechanism 3, the tip 2a of the substrate 2 bends. The tip portion 2 a of the bent substrate 2 is conveyed onto the surface 3 a of the adjacent substrate floating mechanism 3. As shown in FIG. 3B, the air blown from the surface 3 a of the substrate floating mechanism 3 lifts the tip portion 2 a of the bent substrate 2. Therefore, the substrate 2 can be transported while floating while maintaining the flatness. Since the substrate gripping mechanism 5 that grips the substrate 2 can reciprocate in the positive and negative X-axis directions, the substrate 2 can be reciprocated in the positive and negative X-axis directions.

  Further, as shown in FIG. 3C, ultrasonic waves generated by vibrating the base transport levitation mechanism 3 in the Z-axis direction can float and transport the substrate 2. Since no ultrasonic wave is generated between the substrate levitation mechanism 3 and the adjacent levitation mechanism 3, the tip 2a of the substrate 2 bends. The tip portion 2 a of the substrate 2 that has drooped is conveyed onto the surface 3 a of the adjacent substrate floating mechanism 3. As shown in FIG. 3 (d), the ultrasonic waves generated by vibrating the base transport levitation mechanism 3 in the Z-axis direction lift the tip portion 2 a of the bent substrate 2. Therefore, the substrate 2 can be transported by floating while maintaining the flatness of the substrate 2. Since the substrate gripping mechanism 5 that grips the substrate 2 can reciprocate in the positive and negative X-axis directions, the substrate 2 can be reciprocated in the positive and negative X-axis directions.

(Second Embodiment)
Next, a second embodiment of the exposure substrate transfer apparatus will be described with reference to FIG. In addition, about the same or equivalent part as 1st Embodiment, the same code | symbol or an equivalent code | symbol is attached | subjected, and description is simplified or abbreviate | omitted.
As shown in FIG. 3 (a) or 3 (c), when the flying height is small, the tip 2a of the substrate 2 hangs down so that the tip 2a of the substrate 2 becomes the surface 3a or edge 3b of the substrate floating mechanism 3. There is a risk of contact.

  As shown in FIG. 4A, in order to avoid such contact, the height of the substrate floating mechanism 3 adjacent in the positive X-axis direction is gradually lowered. Accordingly, when the substrate gripping mechanism 5 (FIG. 1) is moved in the positive X-axis direction, there is no possibility that the tip 2a of the substrate 2 contacts the surface 3a or the edge 3b of the adjacent substrate floating mechanism 3.

  Since the board | substrate 2 can be floated without considering the amount of bending of the front-end | tip part 2a of the board | substrate 2, the electric energy consumed by a floating control part not shown can be reduced. Therefore, the amount of air blown to float the substrate 2 can be reduced and the power consumption can be reduced.

  Further, as shown in FIG. 4B, as a modification of the second embodiment, instead of blowing air from the surface 3a of the base transport levitation mechanism 3, the base transport levitation mechanism 3 is vibrated in the Z-axis direction. The substrate 2 may be levitated by the ultrasonic waves generated by this.

  Further, as shown in FIG. 5A, when the substrate 2 is transported in the negative X-axis direction, the tip 2a of the substrate 2 may come into contact with the surface 3a or the edge 3b of the adjacent substrate levitation mechanism 3. is there. In order to avoid such contact, a nozzle 4b (auxiliary machine 4) is provided between adjacent substrate levitation mechanisms 3. Air is blown out from the nozzle 4b only when the tip 2a of the substrate 2 is in the sky. The blown air lifts up the front end 2 a of the substrate 2. Therefore, the tip 2a of the substrate 2 can transport the substrate 2 in the negative X-axis direction without contacting the surface 3a or the edge 3b of the adjacent substrate floating mechanism 3.

  Further, as shown in FIG. 5 (b), when the substrate 2 is transported in the negative X-axis direction, the tip 2a of the substrate 2 contacts the surface 3a or the edge 3b of the adjacent substrate levitation mechanism 3 bent. There is a fear. In order to avoid such contact, a roller 4a (auxiliary machine 4) is provided between adjacent substrate floating mechanisms 3. When the front end portion of the substrate 2 is conveyed between the adjacent substrate floating mechanisms 3, the roller 4a rises in the Z-axis direction to lift the front end portion 2a of the substrate 2. Therefore, the tip 2a of the substrate 2 can transport the substrate 2 without contacting the surface 3a or the edge 3b of the adjacent substrate floating mechanism 3.

  Further, as shown in FIGS. 5 (c) and 5 (d), when the substrate 2 is levitated by ultrasonic waves generated by causing the base conveyance levitation mechanism 3 to vibrate air in the Z-axis direction, the compensation is also performed. By the machine 4 (roller 4a, nozzle 4b), the tip 2a of the substrate 2 can transport the substrate 2 without contacting the surface 3a or the edge 3b of the adjacent substrate floating mechanism 3.

(Third embodiment)
Next, a third embodiment of the exposure substrate transfer apparatus will be described with reference to FIG. In addition, about the same or equivalent part as 1st Embodiment, the same code | symbol or an equivalent code | symbol is attached | subjected, and description is simplified or abbreviate | omitted.
As shown in FIG. 4A or FIG. 4C, the height of the substrate floating mechanism 3 adjacent in the positive X-axis direction is gradually reduced. Thereby, the board | substrate 2 is conveyed to the positive X-axis direction according to the height of the board | substrate floating mechanism 3. As shown in FIG. Therefore, since the heights of the adjacent substrate floating mechanisms 3 are different, there is a possibility that the tip 2a of the substrate 2 contacts the surface 3a or the edge 3b of the adjacent substrate floating mechanism 3.

  In order to avoid such contact, as shown in FIG. 6A, the surface 3a is inclined. Thereby, even if the substrate gripping mechanism 5 is moved in the positive X-axis direction, the front end 2a of the substrate 2 does not change on the surface 3a or the edge 3b of the substrate floating mechanism 3 without changing the transport height of the substrate 2. The fear of contact can be eliminated.

  Further, as shown in FIG. 6 (b), the base transport levitating mechanism 3 is vibrated at an ultrasonic frequency in the Z-axis direction to float the substrate 2, and the tip 2a of the substrate 2 is adjacent to the adjacent substrate. The substrate 2 can be transported without contacting the surface 3a or the edge 3b of the levitation mechanism 3.

  Further, as shown in FIGS. 7A and 7B, when the substrate gripping mechanism 5 (FIG. 1) is moved in the negative X-axis direction, the front end portion 2a of the substrate 2 is adjacent to the substrate floating mechanism. In order to avoid contact with the surface 3a or the edge 3b of the three, the auxiliary machine 4 is provided between the adjacent substrate floating mechanisms 3.

  Further, as shown in FIGS. 7 (c) and 7 (d), when the base transport levitation mechanism 3 is caused to oscillate with air at an ultrasonic frequency in the X-axis direction, the substrate 2 is levitated. The auxiliary machine 4 (roller 4a, nozzle 4b) produces the same effect as when the substrate 2 is floated by blowing air from the surface 3a of the base transport floating mechanism 3.

  The arrangement of the auxiliary machines 4 (rollers 4a and nozzles 4b) is not limited to this embodiment, and can be changed as appropriate. In the present embodiment, air, which is a gas rather than a fluid, is used as a medium. However, when an ultraviolet ray having a wavelength of 200 nm or less is used for the substrate 2 in an exposure irradiation apparatus (not shown), oxygen in the air is an ultraviolet ray. There is a risk that ozone may be generated due to a chemical reaction. Therefore, it is necessary to provide equipment for removing ozone. By making the medium an inert gas such as nitrogen, argon or helium, ozone can be removed without providing a facility for removing ozone. Considering the cost, nitrogen is a good medium.

DESCRIPTION OF SYMBOLS 1 ... Exposure substrate conveying apparatus 2 ... Substrate 3 ... Substrate floating mechanism 3a ... Surface 3b of substrate floating mechanism ... Edge of substrate floating mechanism 4 ... Auxiliary machine 4a ... Roller 4b ... Nozzle 5 ... Substrate gripping mechanism 6 ... Substrate transport mechanism

Claims (7)

A substrate gripping mechanism for gripping one or both ends of the substrate;
A substrate moving mechanism for moving the substrate gripping mechanism;
A plurality of substrate levitating mechanisms for generating a medium for levitating the substrate;
With
The substrate is floated by the medium, and as the substrate reciprocates on the plurality of substrate floating mechanism, the substrate moving mechanism to reciprocate the substrate holding mechanism,
A substrate transport apparatus for exposure , wherein rollers or air nozzles are provided between the plurality of substrate floating mechanisms . 2. The substrate transfer apparatus for an exposure apparatus according to claim 1 , wherein the height of the adjacent substrate floating mechanism is gradually lowered. 2. The exposure substrate transfer apparatus according to claim 1 , wherein an inclination is provided on a surface of the substrate floating mechanism. An exposure apparatus for substrate transfer apparatus according to any one of claims 1 to 3, characterized in that for floating by the medium to be blown to the substrate from the substrate floating mechanism. 4. The substrate transfer apparatus for an exposure apparatus according to any one of claims 1 to 3, wherein the substrate is levitated by a medium that vibrates the substrate levitation mechanism to an ultrasonic frequency. An exposure apparatus for substrate transfer apparatus according to any one of claims 1 to 5, wherein the medium is a gas. The substrate transport apparatus for an exposure apparatus according to claim 6, wherein the gas is air.