JP2010155250A - Laser scribing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser scribing apparatus and method, wherein there is no risk for the damage of a thin film surface formed on a substrate, and laser scribing can be applied even in the conveyance of the substrate without obstacle. <P>SOLUTION: The laser scribing apparatus is provided with a stage which is composed of an air floating unit for floating the substrate by blowing air against the thin film formed surface of the substrate which is in the downward state and a holding means for holding the edge part on one side of the substrate in a non-contact state of this stage and the thin film formation surface of the substrate, wherein the thin film of the substrate is scribed by a laser in a state where the edge part on one side is held, and the substrate is conveyed by the holding means. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a laser scribing apparatus for processing a thin film formed on a substrate used for a solar cell, a liquid crystal panel, or the like.

  In general, a substrate used for a solar cell has, for example, a TCO (Transparent Conducting Oxide), an amorphous silicon film, a metal film, etc. laminated on one side of a transparent base material (for example, a glass substrate). The thin film is formed, and this thin film is patterned (separated into strips) with a certain width, whereby the substrate is insulated.

  Conventionally, patterning of a thin film formed on a substrate is often performed by laser scribing by irradiating the thin film with laser. In this laser scribing process, for example, a predetermined pattern is formed by selectively removing a thin film by irradiating a thin film by transmitting a laser through a transparent substrate from the side opposite to the thin film forming surface formed on the substrate. There are a method of forming, a method of forming a predetermined pattern by irradiating the thin film portion directly with a laser and selectively removing the thin film.

  In order to transmit the laser through the transparent substrate, a wavelength of a high transmittance with respect to glass such as a fundamental laser (wavelength: 1064 nm), a second harmonic laser (wavelength: 532 nm), a third harmonic laser (wavelength: 355 nm), or the like. This is possible by using a laser.

  For example, Patent Document 1 discloses a conventional technical example in which a thin film is processed by irradiating a laser from the side opposite to the thin film forming surface formed on the substrate. The outline is shown below.

  That is, an X table that moves a stage in a two-dimensional direction while placing a glass substrate on a stage of a thin-film solar cell manufacturing apparatus in a posture with the thin-film formation surface facing down and irradiating the glass substrate with a laser from a laser oscillator. And the Y table is driven to pattern the thin film by laser scribing the thin film laminated on the glass substrate. And while supporting the peripheral part of a glass substrate, in order to prevent the bending and curvature of the glass substrate which arises near the center of a glass substrate, it hold | maintains at the recessed part provided in the said stage so that a glass substrate may be hold | maintained flat from the downward direction A mechanism is provided.

  The holding mechanism in this case has a structure in which the members constituting the holding mechanism are in direct contact with the thin film surface, so that the structural members of the holding mechanism do not adversely affect the electrical characteristics by damaging the thin film surface. A soft material such as Teflon tetrafluoride (registered trademark) is used. Further, the adjustment of the holding height of the glass substrate is performed by operating an adjustment screw assembled in the holding mechanism.

Japanese Patent Laid-Open No. 2001-111078

  However, as a means for holding the glass substrate in a flat state, even if a soft material is used as the member constituting the holding mechanism so as not to adversely affect the thin film surface, the substrate is subjected to laser scribe processing on the substrate. Since it is in direct contact with the thin film surface, it is difficult to say that the thin film surface has no adverse effects such as damage. In addition, since the stage provided with the holding mechanism for holding the substrate is moved in the two-dimensional direction by the X table and the Y table, the contact portion between the thin film surface and the member may be damaged during the movement. is there. In addition, since the adjustment of the holding height from the stage of the substrate is performed by the operation of the adjusting screw assembled in the holding mechanism, it takes a lot of time for the adjustment, and there is a concern that the manufacturing efficiency of the substrate may be reduced. Is done.

  In the present invention, there is no risk of damage to the thin film surface in laser scribing of the thin film surface formed on the substrate as described above, the holding height from the stage of the substrate can be easily adjusted, and the substrate An object of the present invention is to provide a laser scribing apparatus which can be carried out without any trouble.

  In the laser scribing apparatus of the present invention, a substrate having a thin film formed on one side thereof is arranged so that the thin film forming surface faces downward, and the laser oscillation device is used from the side opposite to the thin film forming surface side of the substrate. In a laser scribing apparatus that irradiates a laser and scribes a thin film formed on the substrate by transmitting the laser through the substrate, air is blown to the thin film forming surface of the substrate in a downward state to float the substrate. A stage comprising an air levitation unit; and a holding means for holding one edge of the substrate in a state where the stage and the thin film forming surface of the substrate are not in contact with each other. The thin film is scribed, and the substrate is conveyed by the holding means.

  In addition, a dust collection duct provided with an opening for collecting scribe waste generated by the scribing process is provided immediately below the laser irradiation position in the laser scribing process, and a predetermined gap is provided above the opening of the dust collection duct. The air levitation unit constituting the stage is disposed on the upstream side and the downstream side with respect to the substrate transport direction of the gap portion, and the upstream side is disposed in a direction in which the longitudinal direction is parallel to the substrate transport direction. By placing another air levitation unit in the gap between the air levitation unit and the downstream air levitation unit, the longitudinal direction of which is perpendicular to the substrate transport direction, and by blowing air to the thin film formation surface side of the substrate, It is possible to easily transfer the substrates at the interval portion when the substrates are conveyed.

  The means for facilitating the transfer of the substrate at the gap between the upstream air levitation unit and the downstream air levitation unit can be as follows.

  One is to provide an auxiliary roller in contact with the thin film forming surface side of the substrate in the gap between the upstream air levitation unit and the downstream air levitation unit to support the substrate, so that the gap when the substrate is transported In addition, it is possible to easily transfer the substrates at the substrate, and in addition, by providing an air blowing nozzle in the gap between the upstream air levitation unit and the downstream air levitation unit, It is also possible to facilitate the connection of the substrates at the gap.

  According to the present invention, by adopting an air levitation unit to bring the thin film forming surface of the substrate and the stage into a non-contact state, the thin film forming surface is not damaged and hangs down over the entire substrate. Since the thin film formed on the substrate is in a state suitable for laser processing, a good laser scribing result with high accuracy can be obtained. Further, by adopting an air levitation unit, when adjustment of the flying height of the substrate is necessary, it can be easily performed by adjusting the air blowing pressure or the like.

  Further, according to the present invention, in transporting a substrate in a gap between air levitation units arranged in a dust collection duct portion directly under laser irradiation, the substrate can be transported smoothly without contact with the air levitation unit. Therefore, the thin film formed on the substrate can be prevented from being damaged, and the thin film scribing efficiency can be increased.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing the entirety of a laser scribing apparatus 1 according to the present invention. The laser scribing apparatus 1 has a glass substrate 3 having a thin film 2 formed on one side thereof, with the thin film 2 side facing downward. As shown in FIG. 1, the laser beam R is irradiated from the anti-thin film forming surface side of the glass substrate 3, and the laser beam R passes through the glass substrate 3 to process the thin film 2 in the X direction shown in FIG. Then, the board | substrate 3 is conveyed in the Y direction shown in FIG.

  Such a glass substrate 3 includes, for example, a thin film 2 on which a TCO (Transparent Conducting Oxide), an amorphous silicon film, a metal film, and the like are laminated is formed on one side of the glass substrate 3. 2 is patterned (separated into strips) with a certain width by the laser processing, so that insulation treatment is performed and used for solar cells.

  Next, the configuration of the laser scribing apparatus 1 will be described with reference to FIG.

  A portal frame 6 is erected on the machine base 5, and a gantry 7 is installed on one side of the machine base 5 so as to straddle the end of the portal frame 6. The portal frame 6 and the gantry 7 are provided with a laser oscillation device 8.

  The laser oscillation device 8 oscillates the laser beam R and guides the laser beam R oscillated to the glass substrate 3 for laser processing. The laser oscillator 9 oscillates the laser beam R provided on the gantry 7. An L-shaped laser irradiation head 11 attached to a stage X axis 10 provided on the upper part of the portal frame 6 by a mechanism movable in the X direction, and a laser accompanying the movement of the laser irradiation head 11 in the X direction. The optical box 12 has a function of correcting the fluctuation of the laser optical path length from the oscillator 9.

  The laser light is guided from the oscillation of the laser light R to the glass substrate 3 by the optical box 12 and a plurality of reflection mirrors 13 disposed in the laser irradiation head 11, and the laser light R is transmitted through the condenser lens 14. A thin film 2 that passes through the glass substrate 3 and faces downward is scribed.

  Immediately below the position of laser irradiation to the glass substrate 3, a dust collection duct 15 is provided in the longitudinal arrangement direction of the stage X axis 10 for collecting scribe waste when the thin film 2 is removed by scribing. The dust collection duct 15 is essential for simplifying the scribe waste discharge process.

  An opening 16 for taking in the scribe waste is provided in the upper part of the dust collection duct 15, and the scribe waste is collected by a dust collector 18 connected by the dust collection duct 15 and the suction hose 17. .

  The machine base 5 is provided with a stage 4 having a size on which the glass substrate 3 can be placed. The stage 4 has a commercially available air levitation unit 20 (for example, a high levitation type manufactured by Myokutoku Co., Ltd.) at a plurality of locations on the machine frame 19 assembled in a lattice shape. It is the structure mounted in parallel with the conveyance direction (Y direction).

  The stage 4 is provided on the upstream side and the downstream side with respect to the conveyance direction (Y direction) of the glass substrate 3 with a predetermined gap 35 interposed above the opening 16 of the dust collection duct 15 immediately below the laser irradiation position. It has been.

  All of the air levitation units 20 in the stage 4 have a plurality of predetermined air blowing holes arranged on the upper surface in a suitable arrangement, and an air circulation hole communicating with the blowing holes penetrates to one end surface in the longitudinal direction. And is connected to the chamber 22 through the hose 21 from its end face. The chamber 22 is provided with a blower 24 via an air filter 23. The blower 24 includes an electric motor (not shown) and a blower (not shown), and supplies compressed air to each air floating unit 20. By blowing the supplied compressed air onto the thin film 2, the substrate is lifted, and the stage 4 and the thin film on the substrate 3 are not in contact with each other.

  Further, a holding means 25 for holding the edge portion on one side of the glass substrate 3 is assembled on one edge portion of the machine base 5. The holding means 25 includes a well-known and conventional gripper 26 that sandwiches and holds one edge portion of the glass substrate 3 by a pneumatic action, and a mechanism that moves the gripper 26 in the transport direction (Y direction) of the glass substrate 3. The stage is composed of a Y axis 27, and the glass substrate 3 is moved in the Y direction after laser scribing to the thin film of the glass substrate 3.

  Here, the characteristic part of the present invention will be described.

  In transporting the substrate 3 on the stage 4, the substrate 3 needs to pass through the predetermined gap 35 interposed between the stage 4 positioned upstream of the laser irradiation position and the stage 4 positioned downstream. However, at that time, the thin film 2 of the substrate 3 and the upper surface of the air levitation unit 20 due to the breakage of the substrate 3 due to the collision with the air levitation unit 20 constituting the stage 4 in the gap 35 or the sagging from the upper surface of the air levitation unit 20. The thin film surface may be damaged by rubbing against the surface.

  Therefore, an embodiment for compensating for these drawbacks will be described with reference to FIGS.

  FIG. 2 shows the case of the first embodiment, and shows the stage 4 portion described previously, but the machine frame 9 constituting the stage 4 is omitted.

  In the first embodiment, as shown in FIG. 2, the end portions (gap 35 shown in FIG. 2) of both the upstream and downstream air levitation units 20 arranged in the conveyance direction (Y direction) of the glass substrate 3. Another part of the air levitation unit 20a is arranged in a direction in which the longitudinal direction is orthogonal to the transport direction (Y direction) of the glass substrate 3. At this time, it is necessary to provide a gap 35 a above the opening 16 of the dust collection duct 15 so as not to hinder the collection of the scribe waste. The compressed air supply system to the air levitation unit 20a is the same as that of the air levitation unit 20 described above.

  By providing the air floating unit 20a, when the glass substrate 3 gets over the gap 35 above the dust collection duct 15, the compressed air is blown onto the thin film surface from the air floating unit 20 installed in the conveying direction. At the same time, since compressed air is blown from the air levitation unit 20a oriented in the direction orthogonal to the conveyance direction to the surface orthogonal to the conveyance direction, the amount of occurrence of bending of the glass substrate 3 is reduced, and the glass substrate 3 is smoothly The clearance 35 can be overcome.

  FIG. 3 shows the case of the second embodiment and shows the stage 4 portion described above, but the machine frame 9 constituting the stage 4 is omitted.

  In the second embodiment, as shown in FIG. 3, the gap between the upstream and downstream air levitation units 20 disposed in the transport direction (Y direction) of the glass substrate 3 above the dust collection duct 15. In the portion 35, an auxiliary roller 28 is provided to support both edge ends from which the thin film on the thin film forming surface side of the glass substrate 3 is not formed from below. The auxiliary roller 28 is rotatable and attached to the machine frame 9 of the stage 4 so as to come into contact with both edge portions of the glass substrate 3. The auxiliary roller 28 is preferably made of a soft material so as not to damage the surface of the glass substrate 3. Specifically, a resin such as Teflon tetrafluoride (registered trademark) can be used. In addition, the range in which the thin film is not formed in the both edge edge parts of the glass substrate 3 is 5 mm-10 mm respectively from both edge parts inside.

  By providing this auxiliary roller 28, when the glass substrate 3 gets over the gap 35 above the dust collection duct 15, compressed air is blown from the air levitation unit 20 installed in the conveying direction to assist the thin film surface. Since the both edge portions of the glass substrate 3 are conveyed while being in contact with the roller 28, the generation amount of the glass substrate 3 such as bending is reduced, and the glass substrate 3 can smoothly get over the gap portion 35.

  In order to increase the size of the glass substrate 3, a plurality of multi-surfaces are taken from a single substrate, and the auxiliary roller 28 is provided at a location where the thin film at the multi-surface boundary is not formed. It is possible to cope with overcoming the glass substrate 3 at the gap 35 above the dust duct 15.

  FIG. 4 shows the case of the third embodiment and shows the stage 4 portion described above, but the machine frame 9 constituting the stage 4 is omitted.

  In the third embodiment, as shown in FIG. 4, the gap between the upstream and downstream air levitation units 20 disposed in the transport direction (Y direction) of the glass substrate 3 above the dust collection duct 15. In the portion 35, well-known and commonly used air nozzles 29 are provided at a plurality of locations on a line orthogonal to the transport direction (Y direction) on the thin film forming surface side (lower side) of the glass substrate 3. The air nozzle 29 is connected to the compressed air supply means 30 and attached to the machine frame 9 of the stage 4.

  By providing the air nozzle 29, when the glass substrate 3 gets over the gap 35 above the dust collection duct 15, compressed air is blown from the air levitation unit 20 installed in the transport direction to the thin film surface. Since the compressed air supplied from the compressed air supply means 30 is also blown onto the thin film surface from the air nozzle 29, the amount of bending of the glass substrate 3 is reduced, and the glass substrate 3 smoothly passes over the gap 35. It is done.

  Next, the laser scribing operation by the laser scribing apparatus 1 of the present invention will be described.

  A glass substrate 3 having a thin film formed on one side is placed on the surface of the air levitation unit 20 of the stage 4 with the thin film formation side facing downward (stage 4 side). Then, the compressed air from the blower 24 is blown out from the air levitation unit 20 so that the glass substrate 3 is floated, and the edge portion on one side of the glass substrate 3 is sandwiched and held by the gripper 26 of the holding means 25. The blowout pressure (amount) of the compressed air with respect to the glass substrate 3 is set by an inverter attached to the blower 24, and the set value is determined by actually floating the glass substrate 3.

  Next, the glass substrate 3 is moved to the processing position by driving the Y-axis 27 assembled in the holding means 25 in a state where the edge portion on one side is held. At this time, the thin film 2 of the glass substrate 3 and the air floating unit 20 are in a non-contact state.

  When the glass substrate 3 is set at a predetermined position, as described above, the laser oscillation device 8 guides the laser light R from the oscillation of the laser light R to the glass substrate 3, and the laser light R is converted into the glass substrate 3. A so-called laser scribing process is performed in which a predetermined portion of the thin film that passes through the surface and faces downward is selectively removed.

  In laser scribing, the laser irradiation head 11 is moved from one end of the glass substrate 3 in the direction (X direction) orthogonal to the conveyance direction (Y direction) of the glass substrate 3 by driving the stage X axis 10 to process one way. Is done.

  When one-way laser scribe processing is performed on the glass substrate 3, after the glass substrate 3 is moved in the Y direction by a predetermined pitch by driving the stage Y axis 27, the return path is laser scribed in the above-described process, and one round trip is performed. Complete.

  Then, the desired thin film patterning can be obtained on the thin film 2 of the glass substrate 3 by repeatedly performing the laser scribe process by reciprocation at a predetermined interval.

  Here, by providing any one of the means for conveying the glass substrate 3 described in the first to third embodiments, which can be said to be characteristic of the present invention, the glass substrate 3 can be smoothly conveyed in the laser scribe process without any trouble. Can do

  Further, when laser scribing is performed in which the laser light is transmitted through the glass substrate 3 and the thin film 2 on the lower side is removed, scribing debris is generated from the thin film 2 in this way. The generated scribing debris is collected by dropping into a dust collection duct 15 immediately below the laser irradiation position and collected by a dust collector 18.

  In addition, control of the processing operation in the laser scribing apparatus 1 of the present invention is performed by the control panel 34 in which various electric devices, instruments, and the like are accommodated.

It is a perspective view which shows the whole laser scribe processing apparatus of this invention. 1 is a schematic view showing a first embodiment according to the present invention (the substrate 3 is shown in a perspective view). It is a schematic diagram which shows 2nd Embodiment by this invention (The board | substrate 3 is shown with the perspective view). It is a schematic diagram which shows 3rd Embodiment by this invention (The board | substrate 3 is shown with the perspective view).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Laser scribe processing apparatus 2 Thin film 3 Glass substrate 4 Stage 15 Dust collection duct 16 Opening part 17 Suction hose 18 Dust collector 19 Machine frame 20 Air floating unit 20a Air floating unit 24 Blower 25 Holding means 26 Gripper 27 Stage Y axis 28 Auxiliary roller 29 Air nozzle 35 Clearance

Claims (4)

  A substrate having a thin film formed on one side is arranged so that the thin film forming surface faces downward, and a laser is irradiated from the side opposite to the thin film forming surface side of the substrate by a laser oscillation device, and the laser irradiates the substrate. In a laser scribing apparatus in which a thin film formed on the substrate through transmission is scribed, a stage comprising an air levitation unit that blows air onto the thin film formation surface of the substrate in a downward state and levitates the substrate, and this A holding means for holding one edge of the substrate in a state where the stage and the thin film forming surface of the substrate are not in contact with each other, and the thin film on the substrate is scribed and held while the edge on one side is held. A laser scribing apparatus characterized in that the substrate is conveyed by means.   A dust collection duct provided with an opening for collecting scribe waste generated by the scribing process is provided immediately below the laser irradiation position in the laser scribing process, and a predetermined gap is interposed above the opening of the dust collection duct. The air levitation unit constituting the stage is arranged on the upstream side and the downstream side with respect to the substrate transport direction in the gap portion so that the longitudinal direction thereof is parallel to the substrate transport direction. Another air levitation unit is placed in the gap between the unit and the downstream air levitation unit so that its longitudinal direction is perpendicular to the substrate conveyance direction, and the substrate is conveyed by blowing air toward the thin film formation surface of the substrate. The laser scribing apparatus according to claim 1, wherein the substrate is easily connected at the interval portion at the time.   A dust collection duct provided with an opening for collecting scribe waste generated by the scribing process is provided immediately below the laser irradiation position in the laser scribing process, and a predetermined gap is interposed above the opening of the dust collection duct. The air levitation unit constituting the stage is arranged on the upstream side and the downstream side with respect to the substrate transport direction in the gap portion so that the longitudinal direction thereof is parallel to the substrate transport direction. Supporting the substrate by providing an auxiliary roller in contact with the thin film forming surface side of the substrate in the gap between the unit and the downstream air levitation unit facilitates the transfer of the substrate in the gap during substrate transfer The laser scribing apparatus according to claim 1.   A dust collection duct provided with an opening for collecting scribe waste generated by the scribing process is provided immediately below the laser irradiation position in the laser scribing process, and a predetermined gap is interposed above the opening of the dust collection duct. The air levitation unit constituting the stage is arranged on the upstream side and the downstream side with respect to the substrate transport direction in the gap portion so that the longitudinal direction thereof is parallel to the substrate transport direction. The air blowing nozzle to the thin film forming surface side of the substrate is provided in the gap between the unit and the downstream air levitation unit to facilitate the transfer of the substrate in the gap during substrate transfer. The laser scribing apparatus according to 1.

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