JP5888891B2 - Substrate transfer device - Google Patents

Description

  The present invention relates to a substrate transfer apparatus that transfers a substrate by levitating it from a stage.

  2. Description of the Related Art Conventionally, in the technical field of flat panel display (FPD) photolithography, for example, a substrate transfer apparatus is used to transfer a substrate from a substrate processing apparatus that performs a predetermined process to a substrate to a substrate processing apparatus in the next process. Above all, the floating substrate transfer device has an advantage that the tact time can be shortened because there is no movement of the posture of the substrate as compared with a transfer device using a robot hand or the like.

  In general, a floating substrate transport apparatus ejects air from a stage to form an air layer between the substrate and the surface of the stage to slightly lift the substrate and guide the floated substrate in a predetermined direction (transport) Member). This substrate guide restrains the movement of the substrate that has floated by contacting the substrate, and guides the substrate in a predetermined direction (conveys it) by performing a transport operation while the substrate guide is in contact with the substrate. )

  For example, Patent Document 1 below describes a configuration in which a roller (conveying member) that protrudes from the surface of a stage is provided, the back surface of the substrate is brought into contact with this roller, and the substrate is conveyed by rotating the roller in that state. ing. However, when the roller is brought into contact with the back surface of the substrate, the drying state of the coating film applied to the surface of the substrate is different between the portion that is in contact with the roller and the portion that is not in contact with the roller. is there. For this reason, as shown in FIG. 10 of Patent Document 1 below, a plurality of guide rollers having a rotation axis in the direction perpendicular to the surface of the stage are provided as substrate guides in the transport direction, and the side surfaces of the substrate are applied to the guide rollers. A configuration is also described in which drying unevenness is suppressed by a configuration in which the substrate is transported by contacting and rotating the guide roller in that state.

JP 2008-166359 A

  However, the substrate transport apparatus (substrate transport apparatus) has a problem that uneven drying cannot be suppressed even when the side surfaces of the substrate are brought into contact with a plurality of guide rollers. That is, in the substrate transport apparatus described in Patent Document 1, the side surface of the substrate is restrained by the guide roller, so that the substrate is transported with a part of the substrate protruding from the stage. That is, the stage width is set smaller than the dimension of the substrate. In this state, the coating film formed on the substrate being transferred has a dry state that differs between the portion where the substrate is located on the stage and the portion where the substrate protrudes from the stage. There was a problem.

  Here, in order to make the dry state of the entire surface of the substrate uniform, the stage width is set larger than the size of the substrate so that the entire surface of the substrate faces the stage surface, and the guide roller protrudes from the surface of the stage, thereby It is also conceivable to adopt a configuration that abuts against. However, in general, the surface of the stage may have a flatness error in the longitudinal direction, and the straightness of the arrangement in the guide roller may have an error. Therefore, when the error in manufacturing and assembling these devices is large, the minute gap between the guide roller and the surface of the stage cannot be effectively maintained, and the guide roller and the surface of the stage are in contact with each other. There was a problem that particles were generated.

  The present invention has been made in view of the above problems, and can transport a substrate while suppressing the occurrence of uneven drying in a coating film on the substrate. An object of the present invention is to provide a substrate transfer device that can suppress the generation of particles even when the error is large.

  In order to solve the above problems, a substrate transport apparatus according to the present invention is a substrate transport apparatus that transports a substrate levitated from the surface of a stage while guiding the substrate with a substrate guide, and the substrate guide contacts a side surface of the substrate. A substrate guide body that can be displaced in a direction perpendicular to the surface of the stage, a levitation unit that levitates the substrate guide body from the surface of the stage, and the substrate guide body that is attached to the surface side of the stage. Biasing means for biasing, and the substrate guide body has a substrate abutting portion that abuts against a side surface of the substrate, and the height position of the substrate abutting portion is determined by the height of the floating unit and the abutting portion. It is characterized in that it is maintained at the height position of the substrate floating from the surface of the stage by the biasing means.

  According to the substrate transporting device, the substrate is restrained by contacting the side surface of the substrate, so that the substrate can be transported while suppressing the occurrence of uneven drying on the coating film on the substrate. Further, since the height position of the substrate contact portion of the substrate guide body is maintained at the height position of the substrate that floats from the surface of the stage by the floating unit and the urging means, the flatness error of the stage, etc. Even when there is an error in manufacturing and assembling the apparatus, the generation of particles can be suppressed. Specifically, the substrate guide body receives a levitation force from the surface of the stage by the levitation unit, and is pressed to the surface side of the stage by the urging means. That is, the substrate guide body is held at a position where the levitation force of the levitation unit and the urging force of the urging means are balanced. And while traveling the substrate guide while restraining the substrate to the substrate guide and transporting the substrate in the transport direction of the stage, even if traveling the part where the flatness of the stage is disturbed, the substrate guide body is Since it is pressed against the surface of the stage by the urging means while receiving the levitation force, the substrate guide body can travel to follow the surface of the stage and transport the substrate. Therefore, even if there is an error in manufacturing and assembling the apparatus, the substrate guide body does not contact the surface of the stage by keeping the flying height of the substrate guide body constant. The generation of particles caused by the substrate guide coming into contact with the surface of the stage can be suppressed.

  As a specific embodiment of the substrate guide, the substrate guide includes an air pad at a position facing the surface of the stage, and the levitation unit is configured to supply the air pad with the air pad. The substrate guide body can be lifted from the stage surface by ejecting air from the stage toward the surface of the stage.

  The air pad of the floating unit may be formed separately from the substrate contact portion of the substrate guide body.

  According to this configuration, since the substrate does not directly contact the air pad, it is possible to prevent the mounting position of the air pad from changing due to the substrate contacting.

  Further, the air pad of the levitation unit may be provided at a position away from the substrate transfer area on the stage.

  According to this configuration, since it is possible to prevent the air ejected from the air pad from directly hitting the substrate transport region where the substrate is transported on the stage, it is possible to suppress a temperature change in the substrate transport region on the stage. Thereby, the drying nonuniformity of the coating film formed on the board | substrate can be suppressed.

  As another specific embodiment of the substrate guide, the substrate guide includes an air pad on a bottom surface portion of the substrate guide body facing the surface of a stage, and the levitation unit has an air pad on the air pad. By being supplied, air can be ejected from the air pad to float the substrate guide body from the stage surface.

  The substrate guide further includes a guide support portion that supports the substrate guide body, and is supported by the guide support portion so as to be displaceable in a direction in which the substrate guide body is in contact with and away from the surface of the stage. A spring member may be provided in a contracted state between the guide support portion and the substrate guide body, and the substrate guide body may be urged toward the surface side of the stage by the spring member.

  According to this configuration, the urging force of the spring member and the levitation force of the levitation unit are balanced, whereby a predetermined gap is formed between the bottom surface portion of the substrate guide body and the surface of the stage, and the substrate guide body The substrate contact portion of the substrate can be maintained at the height position of the substrate that floats from the surface of the stage.

  Further, the guide support portion may be configured such that a suction portion is formed in the vicinity where the substrate guide main body is supported, and the suction portion is open to the substrate contact portion side.

  According to this configuration, when the substrate guide body is displaced relative to the guide support portion, there is a possibility that particles are generated due to the contact state between the two. Even if particles are generated, the particles can be prevented from diffusing to the substrate contact portion side by being sucked from the opening of the suction portion.

  The guide support portion includes a cover extending toward the substrate contact portion, and the cover is disposed outside the opening of the suction portion and is provided to cover the entire circumference of the substrate guide body. In addition, a gap may be formed between the cover and the substrate contact portion.

  According to this configuration, when a suction force is generated from the opening of the suction portion, a suction force toward the opening of the suction portion is generated between the cover and the substrate contact portion. Therefore, the guide support portion and the substrate Particles generated by contact with the guide body can be prevented from falling to the surface side of the substrate.

  According to the substrate transport device of the present invention, it is possible to transport the substrate while suppressing the occurrence of drying unevenness in the coating film on the substrate, and even if the error in manufacturing and assembling the device is large, Occurrence can be suppressed.

It is a top view which shows the board | substrate conveyance apparatus in one Embodiment of this invention. It is the top view to which 1 unit of the said board | substrate conveyance apparatus was expanded. It is a side view of 1 unit of the above-mentioned substrate conveyance device. It is a front view of 1 unit of the above-mentioned substrate conveyance device. It is a top view which shows the state which conveyed the board | substrate to the adjacent stage by the board | substrate guide of the said board | substrate conveyance apparatus. It is a top view which shows the state which the said board | substrate guide retract | saves and a positioning pin is a protrusion state. It is a top view which shows the state which the said board | substrate guide returned to the original position. It is a figure which shows the said board | substrate guide, (a) is the side view, (b) is the sectional drawing. It is a flowchart which shows operation | movement of the said board | substrate conveyance apparatus. It is a top view of the board | substrate guide in other embodiment. It is AA sectional drawing of FIG. It is a top view of the board | substrate guide in other embodiment. It is a figure which shows the state by which the board | substrate was hold | maintained at the board | substrate contact part in other embodiment.

Embodiments of the substrate transfer apparatus of the present invention will be described with reference to the drawings.
[Example 1]
FIG. 1 is a top view showing an embodiment of a substrate transfer apparatus, FIG. 2 is an enlarged top view of one unit of the substrate transfer apparatus, FIG. 3 is a side view of one unit of the substrate transfer apparatus, and FIG. These are the front views of 1 unit of a substrate conveyance apparatus.

  1 to 4, a substrate transport apparatus 1 is for transporting a substrate 2 in a levitated state. The substrate 2 is transferred from an upstream substrate processing apparatus 1 to a downstream substrate processing apparatus in the next process. It is to be transported. For example, after a coating film is formed on the substrate 2 by a coating device that discharges a coating solution such as a resist solution, the substrate 2 supplied from the coating device is floated when the substrate 2 is transported to a drying device that dries the coating film. In this state, it can be conveyed to the drying device without changing the direction.

  In the following description, the transport direction in which the substrate 2 is transported is the X-axis direction, the direction orthogonal to the horizontal plane is the Y-axis direction, and the direction orthogonal to both the X-axis direction and the Y-axis direction is the Z-axis direction. The explanation will proceed as a direction.

  The substrate transfer apparatus 1 includes a stage unit 10 and a transfer unit 20, and the transfer units 20 are disposed on both sides of the stage unit 10 in the Y-axis direction. The stage unit 10 mounts the substrate 2 and can keep the mounted substrate 2 in a floating state. Moreover, the conveyance unit 20 conveys the board | substrate 2 which floated in the conveyance direction (X-axis direction), restraining. That is, the substrate 2 supplied to the stage unit 10 from the upstream side is floated on the stage 12 and is restrained by the substrate 2 guide provided in the transport unit 20. The substrate 2 guide travels in the X-axis direction, so that the substrate 2 is transported in the X-axis direction.

  As shown in FIGS. 3 and 4, the stage unit 10 includes a stage 12 that is placed on the base 11 and formed flat, and a floating means 13 that floats the substrate 2 from the surface of the stage 12. ing. The stage 12 is a rectangular metal flat plate-like member, and a plurality of stages 12 are arranged along the transport direction. In the example of FIG. 1, four stages 12 are arranged. The stage 12 has a stage surface 12a (also simply referred to as a surface 12a of the stage) facing the substrate 2 to be supplied, and the whole is formed in a flat shape. In the present embodiment, the stage surface 12a is formed in a size larger than the substrate 2, and the entire surface of the supplied substrate 2 is opposed to the stage surface 12a without protruding. Thereby, since the whole substrate 2 faces the stage surface 12a, the drying environment becomes constant, and when the coating film formed on the substrate 2 dries during transportation, drying unevenness due to non-uniform drying environment can be suppressed. .

  The stage 12 is provided with positioning pins 14, and the substrate 2 that has been conveyed is positioned at a predetermined position by the positioning pins 14. Four positioning pins 14 are provided on one stage 12, and two of the positioning pins 14 are arranged on one diagonal line. Specifically, when the substrate 2 is supplied onto the stage 12, the substrate 2 is disposed at a position sandwiching two corner portions on the diagonal line of the substrate 2. That is, the positioning pins 14 are arranged at positions where the substrate 2 and the positioning pins 14 form a slight gap according to the size of the substrate 2 to be conveyed. Further, the positioning pin 14 can be moved up and down. In the accommodated state, the entire positioning pin 14 is accommodated in the stage 12, and in the protruding state, the positioning pin 14 projects on the surface of the stage 12. It has become. Therefore, when the substrate 2 is supplied with the positioning pins 14 in the accommodated state and the substrate 2 is supplied onto the stage surface 12a, the positioning pins 14 are in a protruding state, and the side surface 2a of the substrate 2 contacts the positioning pins 14. Thus, the substrate 2 is positioned. That is, when the substrate 2 is supplied onto the stage 12, the substrate 2 floats and can move freely, but when the positioning pins 14 come into contact with the side surface 2a of the substrate 2, the movement of the substrate 2 is restricted. The substrate 2 is positioned at a predetermined position (positioning range) on the stage 12.

  The levitation means 13 levitates the supplied substrate 2 from the stage surface 12a. In the present embodiment, as shown in FIGS. 3 and 4, a vibrator 13a is provided on the back surface of the stage 12 (the back surface of the stage surface 12a), and vibration with a specific frequency is supplied by the vibrator 13a. Thus, the substrate 2 on the stage 12 can float from the stage surface 12a. Specifically, for example, when the vibrator 13a is vibrated with ultrasonic waves, the vibrations are transmitted, and the stage 12 itself vibrates with ultrasonic waves. Thereby, a slight air layer is formed between the stage surface 12a and the substrate 2, and the substrate 2 floats from the stage surface 12a. That is, when the vibrator 13a is vibrated at a specific frequency, the substrate 2 is held on the stage 12 in a state where the substrate 2 floats from the stage surface 12a to a predetermined height position.

  The transport unit 20 transports the substrate 2 on the stage 12 via the substrate guide 30 in the transport direction. The transport unit 20 has a base 11 a extending in one direction, and is installed so as to sandwich the stage 12 along the transport direction of the stage 12. Further, the transport unit 20 includes a substrate guide 30, and the substrate 2 can be transported when the plurality of substrate guides 30 are moved by the transport driving unit 40 on the base 11 a. That is, the substrate guide 30 is provided corresponding to each stage 12, and each substrate guide 30 moves from one stage 12 to the next downstream stage 12 and then returns to the original stage 12. Can be performed. The substrate guide 30 for each stage 12 can carry the substrate 2 in the carrying direction by performing such an operation simultaneously.

  Specifically, when supplied to one stage 12, the substrate 2 is restrained by the substrate guide 30 (state shown in FIG. 1). Then, the substrate guide 30 is moved to the next downstream stage 12 (state shown in FIG. 5) and placed on the downstream stage 12 (state shown in FIG. 6). Then, the downstream side substrate guide 30 returns to the original stage 12 on the upstream side (the state of FIG. 7), and the substrate 2 conveyed by the upstream side substrate guide 30 is newly restrained. By repeating this on each stage 12, the substrate 2 is transported in the transport direction. That is, the substrate 2 is transported by a relay system of a plurality of substrate guides 30.

  The transport driving unit 40 includes a rail 41 extending in one direction, a transport main body 42 on which the substrate guide 30 is mounted, and a linear motor 43 that drives the transport main body 42. The rail 41 is a flat plate-like member having a smooth surface, and is provided on each base 11 so that the smooth surface faces upward. That is, as shown in FIGS. 2 and 4, the rail 41 is provided at a position equidistant from the stage 12 so as to sandwich the stage surface 12 a along the conveying direction of the stage 12. Moreover, the height position of the smooth surface of each rail 41 is set to a common height position.

  An LM guide 44 and a linear motor 43 are provided on the smooth surface of the rail 41. Specifically, a stator (magnet plate) of the linear motor 43 extends in the X-axis direction at the center of the smooth surface in the Y-axis direction, and LM guides 44 are provided on both sides of the stator in the X-axis direction. It is provided so that it may extend. The LM guide 44 is connected to a transport main body 42, and a mover provided on the transport main body 42 is connected to a stator. Therefore, by driving the linear motor 43, the transport main body 42 can move along the rail 41 when the mover moves along the stator. That is, by controlling the driving of the linear motor 43, the transport main body 42 moves along the X-axis direction and can be stopped at an arbitrary position.

  The transport main body 42 includes a mounting portion 42a for mounting the substrate guide 30 and a leg portion 42b extending from the mounting portion 42a, and is formed in a substantially U-shaped cross section. An LM guide 44 is coupled to the leg portion 42b, and the mounting portion 42a is arranged to face upward. The mounting portion 42 a is provided with one substrate guide 30, and the substrate guides 30 are respectively arranged on the diagonal lines of the stage 12. That is, they are arranged on a diagonal line different from the diagonal line on which the positioning pins 14 exist. When the linear motor 43 is driven and controlled, the transport main body 42 moves in the transport direction while maintaining the positional relationship in which the substrate guide 30 exists on a diagonal line. 2 indicates the transport main body 42 and the substrate guide 30 after the movement.

  As shown in FIG. 8, the substrate guide 30 includes a substrate guide main body 31 that restrains the substrate 2 and a guide support portion 32 that supports the substrate guide main body 31, and the substrate guide main body 31 is placed on the stage. The levitation unit 50 floats from the surface 12a and the urging means 60 for urging the substrate guide main body 31 toward the stage surface 12a. The levitation unit 50 and the urging means 60 allow the substrate guide main body 31 to move to the stage. It can float from the surface 12a.

  The guide support portion 32 has a flat arm portion 32a, and a substrate guide main body 31 is provided at a tip portion thereof. The arm portion 32a is provided on the mounting portion 42a (see FIG. 4) of the transport main body portion 42 via an elevating mechanism, and can be moved up and down in the Z direction with respect to the mounting portion 42a. Specifically, the board guide body 31 can be raised from the position where the board guide body 31 restrains the board 2 to the extent that the board guide body 31 does not contact the protruding positioning pins 14. That is, as shown in FIG. 5, after the substrate 2 is transported to the next downstream stage 12, the substrate 2 is restrained by the protruding positioning pins 14 as shown in FIG. 6. In FIGS. 1 and 5 to 7, when the positioning pin 14 is black, it indicates a protruding state, and when it is white, it indicates an accommodated state. Then, after the substrate guide body 31 is lifted, the substrate body 30 can return to the original stage 12 over the protruding positioning pins 14 by running the transport body 42 (FIG. 7). State).

  Further, the guide support portion 32 has an advance / retreat mechanism so that the arm portion 32 a can be advanced / retracted with respect to the substrate 2. That is, when the substrate 2 is constrained to the substrate guide body 31, the arm portion 32a is protruded toward the substrate 2 (FIG. 7 → FIG. 1), and is stopped in a state where the substrate guide body 31 is in contact with the substrate 2. Then, as shown in FIG. 5, when the substrate 2 is transported to the next stage 12, the substrate 2 can be released by moving the protruding arm portion 32 a to the opposite side to the retracted state. (The state of FIG. 6).

  The arm portion 32a is provided with a spring that can expand and contract in the advancing and retreating direction. Even if the corner portion of the supplied substrate 2 is displaced, the arm portion 32a is advanced as it is, and the substrate guide main body 31 is moved. When the contact is made, the spring absorbs the shift amount, so that the substrate guide body 31 can be brought into contact with the corner portion of the substrate 2 with certainty.

  As shown in FIG. 8, the substrate guide body 31 is supported by the arm portion 32 a of the guide support portion 32, and the substrate 2 is restrained when the substrate guide body 31 comes into contact with the substrate 2. ing. Specifically, the two substrate guide bodies 31 are attached to the arm portion 32a (see FIG. 2), and the two substrate guide bodies 31 arranged on the diagonal line come into contact with the substrate 2 to contact the substrate 2. Can be restrained. The substrate guide body 31 includes a guide shaft portion 33 and a substrate contact portion 34 formed on the stage surface 12 a side of the guide shaft portion 33, and the substrate contact portion 34 is the side surface 2 a of the substrate 2. The board | substrate 2 can be restrained by contact | abutting to.

  The substrate guide body 31 is supported by the guide support portion 32 so as to be displaceable in the Z direction. Specifically, the guide shaft portion 33 is formed in a cylindrical shape, and the guide shaft portion 33 is supported via a slide bush 35 in a through hole formed in the arm portion 32a. Thereby, the board | substrate guide main body 31 is supported so that it can displace to the Z direction with respect to the guide support part 32. FIG. That is, the substrate guide body 31 can be displaced in the Z direction with respect to the stage surface 12a.

  The substrate contact portion 34 restrains the substrate 2 by contacting the side surface 2 a of the substrate 2. The substrate contact portion 34 is formed in a cylindrical shape made of resin and has a larger diameter than the guide shaft portion 33. Then, the arm portion 32a of the guide support portion 32 protrudes toward the substrate 2 side to bring the substrate guide body 31 into contact with the substrate 2, so that the outer peripheral surface of the substrate contact portion 34 contacts the side surface 2a of the substrate 2 and the substrate 2. Can be restrained. That is, the substrate contact portions 34 of the respective substrate guides 30 arranged on the diagonal lines are slightly pressed against the side surface 2a at the corner portion of the substrate 2, thereby restraining the movement of the substrate 2 floating on the stage surface 12a. . In this embodiment, the substrate 2 is restrained by the substrate contact portion 34 with a small pressure, but the substrate contact portion 34 does not apply pressure to the side surface 2a of the substrate 2 so that a slight gap can be formed. Even when it contacts the side surface 2a, the substrate 2 can be restrained. That is, restraining the substrate 2 means that the substrate 2 is held in a state in which the substrate 2 floating on the stage surface 12a is restrained from freely moving.

  The levitation unit 50 levitates the substrate guide body 31 from the stage surface 12a. The levitation unit 50 according to the present embodiment includes an air pad 51 provided on the bottom surface portion 36 of the substrate guide body 31 and an air supply path 52 that communicates with the air pad 51. The air supply path 52 is connected to an air cylinder (not shown), and air is supplied through the air supply path 52 by opening / closing operation of a valve (not shown). That is, the air supplied to the air supply path 52 is ejected from the air pad 51 to the stage surface 12a side. Thereby, a levitating force is generated in the substrate guide body 31, and the substrate guide body 31 is slightly lifted from the stage surface 12a. Here, the floating amount of the substrate guide main body 31 is adjusted by the opening amount of the valve, but in this embodiment, the substrate contact portion 34 is positioned at the height position of the substrate 2 floating on the stage surface 12a. It has been adjusted. The adjustment of the height of the substrate 2 where the substrate contact portion 34 is lifted is not only the case where the flying height of the substrate 2 and the height of the substrate contact portion 34 are common, but also the substrate contact. It is only necessary to adjust the height so that the substrate contact portion 34 can contact the side surface of the substrate 2 with the portion 34 floating.

  The urging means 60 presses the substrate guide body 31 toward the stage surface 12a. In the urging means 60 of this embodiment, a coil spring 61 (spring member) is provided between the substrate contact portion 34 and the guide support portion 32, and the substrate guide body 31 is moved to the stage by the elastic force of the coil spring 61. It is pressed to the surface 12a side. Specifically, a coil spring 61 is provided between the substrate contact portion 34 and the guide support portion 32 in a state where the coil spring 61 is contracted by a certain amount so as to be substantially concentric with the center of the guide shaft portion 33. The restoring force of the coil spring 61 acts on the substrate contact portion 34 as a biasing force, whereby the substrate contact portion 34 (substrate guide body 31) is pressed toward the stage surface 12a.

  Here, when the amount of air supply is increased by opening the valve of the levitation unit 50, the air ejected from the air pad 51 increases, the levitation force increases, and the substrate guide body 31 is displaced upward. On the other hand, when the substrate guide body 31 is displaced upward, the restoring force of the coil spring 61 of the urging means 60 is increased, so that the substrate contact portion 34 receives a pressing force downward. Thus, the height position of the substrate contact portion 34 can be adjusted by the position where the levitation force of the levitation unit 50 and the urging force of the urging means 60 are balanced. In the present embodiment, the air supply amount of the levitation unit 50 is adjusted so that the substrate contact portion 34 is at the height position of the substrate 2 that has floated on the stage surface 12a.

  Such a substrate guide 30 can transport the substrate 2 while suppressing generation of particles even when an error in manufacturing and assembling of the apparatus such as a flatness error on the surface of the stage 12 occurs. That is, the substrate abutment portion 34 abuts against the side surface 2 a of the substrate 2 at a position where the levitation force of the levitation unit 50 and the urging force of the urging means 60 are balanced by the substrate guide 30, thereby restraining the substrate 2. In this state, when the substrate guide 30 is moved in the transport direction and the substrate 2 is being transported, if there is a flatness error on the surface of the stage 12, for example, assuming that the surface of the stage 12 is raised, the substrate Since the amount of air ejected from the air pad 51 of the guide main body 31 does not change, the substrate guide main body 31 is displaced upward by receiving an upward force from the adjacent stage surface 12a due to the flying force of the air ejection. However, since the arm portion 32 a is fixed to the surface of the stage 12, the coil spring 61 is compressed and deformed between the arm portion 32 a and the substrate contact portion 34, and the restoring force acts on the substrate contact portion 34. To do. That is, even if the stage surface 12a approaches or separates, the levitation force of the levitation unit 50 and the urging force (restoring force) of the urging means 60 are balanced at the new height position. The floating state of the substrate guide body 31 is maintained so as to follow the above. Therefore, even if an error in manufacturing and assembling of the apparatus such as a flatness error on the surface of the stage 12 occurs, it is possible to suppress the substrate guide 30 during traveling from contacting the surface of the stage 12, and the substrate guide. It is possible to suppress the generation of particles caused by the contact of the 30 with the surface of the stage 12.

  The substrate guide 30 is provided with a dustproof mechanism. That is, the generation of particles generated when the substrate guide body 31 is displaced in the Z-axis direction can be suppressed by the suction portion 71 provided on the arm portion 32 a of the guide support portion 32 and the dustproof cover 72.

  The suction unit 71 prevents particles from adhering to the substrate 2 by sucking the generated particles. The suction portion 71 is provided near the through hole of the arm portion 32a through which the substrate guide body 31 is inserted. Specifically, an opening 71a that opens to the substrate contact portion 34 side is formed in the arm portion 32a, and a vacuum pump is connected to the opening 71a from the opposite side of the substrate contact portion 34. . Accordingly, when the vacuum pump is operated, a suction force is generated at the opening of the opening 71a on the substrate contact portion 34 side, so that particles generated between the arm portion 32a and the substrate contact portion 34 can be sucked. . That is, when the substrate guide main body 31 is displaced in the Z-axis direction, particles generated when the guide shaft portion 33 and the slide bush 35 slide can be sucked.

  The dust cover 72 prevents the generated particles from diffusing. The dust cover 72 is provided on the outer diameter side of the opening of the suction part 71 and extends from the arm part 32a toward the substrate contact part 34, and is formed in a cylindrical shape. The dust cover 72 covers the outer peripheral surface of the guide shaft portion 33 and a part of the outer peripheral surface of the substrate contact portion 34 over the entire periphery. That is, the dustproof cover 72 is formed to have a larger diameter than the substrate contact portion 34, and a gap is formed between the outer periphery of the substrate contact portion 34. Thereby, the diffusion of particles generated between the arm portion 32a and the substrate contact portion 34 can be prevented. That is, when particles are generated when the guide shaft portion 33 and the slide bush 35 slide, the particles diffuse, but the presence of the cylindrical dust-proof cover 72 allows the particle diffusion to be kept in the dust-proof cover 72. . Then, when the vacuum pump is operated to generate a suction force in the suction portion 71, air enters through a gap formed between the dust cover 72 and the substrate contact portion 34 and is sucked into the suction portion 71. A flow is formed. Thereby, the particles diffusing in the region covered with the dustproof cover 72 can be discharged from the suction portion 71 without leaking outside the dustproof cover 72.

  Next, the operation of the substrate transfer apparatus will be described based on the flowchart shown in FIG.

  Here, in a state before the substrate 2 is transported, each substrate guide 30 stands by at a position adjacent to each stage 12, and the arm portion 32a of the guide support portion 32 is in a retracted state. And the positioning pin 14 is accommodated below the stage surface 12a, and the accommodation state is maintained.

  First, in step S1, the substrate 2 is positioned. That is, the positioning operation of the substrate 2 is performed in order to restrain the substrate 2 by the substrate guide 30. Specifically, when the substrate 2 that has finished the previous process is supplied, the positioning pins 14 in the accommodated state protrude from the stage surface 12a, thereby positioning the substrate 2 in the positioning range. That is, when the substrate 2 is supplied onto the stage 12 vibrated by the vibrator 13a, the substrate 2 floats from the stage surface 12a and freely moves on the stage surface 12a, but contacts the protruding positioning pins 14. This restricts the movement of the substrate 2. Thereby, the board | substrate 2 is positioned in the positioning range (FIG. 7).

  Next, a restraining operation by the substrate guide 30 is performed in step S2. That is, the arm portion 32a of the guide support portion 32 extends toward the substrate 2 side. Specifically, air is ejected from the air pad 51 of the substrate guide body 31, and the substrate guide body 31 is supported by the arm portion 32a while the floating force and the urging force of the coil spring 61 are balanced. Has emerged. In this state, the height position of the substrate contact portion 34 is adjusted to a height position that contacts the side surface 2 a of the substrate 2. When the arm portion 32a extends, the substrate guide body 31 approaches the side surface 2a of the substrate 2 and the substrate contact portion 34 contacts the side surface 2a of the substrate 2, whereby the arm portion 32a stops the extending operation. That is, the substrate 2 is restrained when the side surface 2a at the corner portion of the substrate 2 contacts the substrate contact portions 34 of the four substrate guide bodies 31 arranged on the diagonal lines (FIG. 1). Therefore, in this state, the movement of the substrate 2 is restricted by the substrate guide 30 and the positioning pins 14.

  Next, the board | substrate 2 is conveyed by step S3. That is, the constrained substrate guide 30 is placed on the next stage 12 adjacent to the downstream side from the current stage 12, and the substrate 2 is transported by repeating this operation. Specifically, the positioning pin 14 that restrains the movement of the substrate 2 is lowered to be restrained only by the substrate guide 30. Then, the conveyance driving unit 40 is driven to move the substrate guide 30 to the downstream side. During the movement, the substrate guide body 31 can be kept floating from the stage surface 12a by continuing to blow air from the air pad 51 of the substrate guide 30. Even if there is an error in the flatness of the stage surface 12a, by following the shape of the stage surface 12a, particles are generated when the arm portion 32a of the guide support portion 32 contacts the stage surface 12a. Can be suppressed. When the substrate 2 reaches the next stage 12 adjacent to the downstream side, the conveyance driving unit 40 is driven and controlled to stop the substrate guide 30. That is, when the positioning pin 14 is in a protruding state, the positioning is stopped at a position where the back surface of the substrate 2 and the positioning pin 14 do not collide (FIG. 5).

  Next, in step S4, the substrate 2 is released by the substrate guide 30. Specifically, the positioning pins 14 protrude from the stage surface 12a, and the substrate 2 conveyed by the positioning pins 14 is restrained on the next stage surface 12a on the downstream side. That is, the substrate 2 is restrained by the positioning pins 14 and the substrate guide 30. Then, while the arm portion 32a of the substrate guide 30 is retracted and returned to the original position, the arm portion 32a is raised by the lifting mechanism. That is, the substrate guide body 31 is raised to a position where it does not contact the positioning pins 14. Thereby, the board | substrate 2 is released by the board | substrate guide 30, and the board | substrate 2 is restrained only by the positioning pin 14 (FIG. 6).

  Next, when the retracting operation and the raising operation of the arm portion 32a are completed, the substrate guide 30 is returned to the original position in step S5 (FIG. 7). That is, the substrate driving unit 40 is driven to move the substrate guide 30 to the upstream stage 12 adjacent to the stage 12 that has released the substrate 2. At that time, the positioning pins 14 are in a protruding state to restrain the substrate 2, but the substrate guide body 31 is raised above the positioning pins 14, and therefore, the substrate guide body 31 and the positioning pins 14 are moved by the movement of the substrate guide 30. Will not touch.

  The substrate 2 conveyed to the downstream stage 12 is restrained by the substrate guide 30 provided on the stage 12 from the beginning, that is, the substrate guide 30 returned from the stage 12 downstream of the stage 12, and further It is conveyed to the stage 12 on the downstream side. In this way, the substrate 2 is relay-constrained by the substrate guide 30 provided on each stage 12 and moved to the next downstream stage 12, so that the substrate 2 is transported to the final position of the substrate transport apparatus 1. Is done.

  As described above, according to the substrate transport apparatus 1, the substrate 2 is restrained by coming into contact with the side surface 2 a of the substrate 2, so that the substrate 2 can be transported while suppressing the occurrence of drying unevenness in the coating film on the substrate 2. Can do. Further, the height position of the substrate contact portion 34 of the substrate guide main body 31 is maintained at the height position of the substrate 2 that is levitated from the surface 12 a of the stage 12 by the levitating unit 50 and the urging means 60. Even when there is a large error in manufacturing and assembling the apparatus, such as when there is an error in the flatness of the stage 12, the substrate guide body 31 is kept constant in the flying height, thereby maintaining the substrate guide. Since the main body 31 does not contact the surface 12 a of the stage 12, it is possible to suppress the generation of particles that occur when the substrate guide 30 contacts the surface 12 a of the stage 12.

  In the above embodiment, the case where the coil spring 61 is used as the urging means 60 has been described. However, the substrate abutting portion 34 may be urged toward the stage surface 12a using a magnet. That is, the repulsive force of the magnet when the substrate contact portion 34 approaches the arm portion 32a is used as the urging force by providing the substrate contact portion 34 and the arm portion 32a at a position where the N or S poles face each other. can do.

[Example 2]
Another embodiment of the substrate transfer apparatus will be described with reference to FIGS. Here, FIG. 10 is the figure which looked at the board | substrate guide 30 in other embodiment from the top, and FIG. 11 is AA sectional drawing of FIG. In the embodiment shown in FIGS. 10 and 11, the air pad 51 of the levitation unit 50 is an example in which the substrate contact portion 34 of the substrate guide body 31 is formed separately. Since the configuration other than the substrate guide 30 is the same as that of the above-described embodiment, the description thereof is omitted.

  As shown in FIGS. 10 and 11, the substrate guide 30 includes a substrate guide main body 31 that restrains the substrate 2, and a guide support portion 32 that supports the substrate guide main body 31. The levitation unit 50 that levitates 31 from the stage surface 12a and the urging means 60 that urges the substrate guide body 31 toward the stage surface 12a are provided. 31 can float from the stage surface 12a.

  The guide support portion 32 has a flat arm portion 32a, and a substrate guide main body 31 is provided at a tip portion thereof. The arm portion 32a is provided on the mounting portion 42a (see FIG. 4) of the transport main body portion 42 via an elevating mechanism, and can be moved up and down in the Z direction with respect to the mounting portion 42a. In the present embodiment, an air slide table 81 is used as the elevating mechanism. By controlling the amount of air supplied to the air slide table 81, the arm portion 32a can move in the Z direction. . That is, the air slide table 81 has a linearly moving table 81 a attached so as to be movable in the Z direction, and an arm portion 32 a is attached to the table 81 a via the air slide table 82. Then, by controlling the air supply amount and moving the arm portion 32a downward, the substrate guide main body 31 approaches the substrate 2, and by moving the arm portion 32a upward, the substrate guide main body 31 moves from the substrate 2. Move in the direction of separation. In the present embodiment, as in the above-described embodiment (Example 1), the substrate guide body 31 can be raised from a position where the substrate guide body 31 is restrained to an extent where it does not contact the protruding positioning pins 14. ing. The air slide table 81 also acts as an urging means as will be described later.

  Further, the guide support portion 32 has an advance / retreat mechanism so that the arm portion 32 a can be advanced / retracted with respect to the substrate 2. In this embodiment, an air slide table 82 is used for the advance / retreat mechanism, and the substrate guide body 31 can be brought into contact with and separated from the substrate 2 by controlling the amount of air supplied to the air slide table 82. Can be operated. Specifically, the main body of the air slide table 82 is attached to the slide table 81, and the table 82a of the air slide table 82 that moves linearly is attached so as to be movable toward the center of the positioned substrate 2. ing. By controlling the amount of air supplied to the air slide table 82, the table 82 a can be moved back and forth in the center direction of the substrate 2. That is, the arm portion 32a can move between a protruding state in which the arm portion 32a extends in the center direction of the substrate 2 and a retracted state in which the arm portion 32a contracts toward the main body side. That is, when the substrate 2 is constrained to the substrate guide body 31, the arm portion 32a is protruded toward the substrate 2 (FIG. 7 → FIG. 1), and is stopped in a state where the substrate guide body 31 is in contact with the substrate 2. As shown in FIG. 5, when the substrate 2 is transported to the next stage 12, the substrate 2 can be released by moving the arm portion 32 a to the opposite side to the substrate 2 to be in the retracted state. (State of FIG. 6).

  As shown in FIGS. 10 and 11, the substrate guide body 31 is supported by the arm portion 32 a of the guide support portion 32, and the substrate 2 is restrained when the substrate guide body 31 abuts on the substrate 2. It is like that. Specifically, two substrate guide bodies 31 are attached to the tip portion of the arm portion 32a (see FIG. 2), and these two substrate guide bodies 31 arranged on a diagonal line come into contact with the substrate 2. The substrate 2 can be restrained.

  Specifically, the substrate guide main body 31 includes a columnar guide shaft portion 33 and a substrate contact portion 34 formed on the side surface of the guide shaft portion 33 on the stage surface 12a side. Two substrate guide bodies 31 are fixed at positions equidistant from the center of the arm portion 32a. Then, by driving the air slide table 82, the arm portion 32 a of the guide support portion 32 protrudes toward the substrate 2, whereby the substrate contact portion 34 contacts the side surface 2 a of the substrate 2 and restrains the substrate 2. Can do. That is, the substrate contact portions 34 of the respective substrate guides 30 arranged on the diagonal lines are slightly pressed against the side surface 2a at the corner portion of the substrate 2, thereby restraining the movement of the substrate 2 floating on the stage surface 12a. . In this embodiment as well, the substrate 2 is restrained even when contacting the side surface 2a of the substrate 2 to such an extent that a slight gap can be formed without pressing the side surface 2a of the substrate 2 by the substrate contact portion 34. . That is, it is only necessary that the substrate 2 floating on the stage surface 12a is restrained from freely moving.

  The levitation unit 50 levitates the substrate guide body 31 from the stage surface 12a. The levitation unit 50 of the present embodiment is fixed to the guide support portion 32 and is disposed between the board guide main body 31 and the air slide table 82 of the advance / retreat mechanism. The levitation unit 50 includes a levitation unit main body 55 and an air pad 51, and the air pad 51 is provided on the bottom surface of the levitation unit main body 55 as shown in FIG. That is, the air pad 51 is attached at a position facing the stage surface 12a. The air pad 51 is connected to an air cylinder (not shown), and air is supplied by opening and closing a valve (not shown). That is, when air is supplied to the air pad 51, the guide support portion 32 receives the levitation force and the substrate guide body 31 connected to the guide support portion 32 also rises by being ejected from the air pad 51 to the stage surface 12 a side. Under the force, the substrate guide body 31 slightly floats from the stage surface 12a. Here, the floating amount of the substrate guide main body 31 is adjusted by the opening amount of the valve, but in this embodiment, the substrate contact portion 34 is positioned at the height position of the substrate 2 floating on the stage surface 12a. It has been adjusted. The adjustment of the height of the substrate 2 where the substrate contact portion 34 is lifted is not only the case where the flying height of the substrate 2 and the height of the substrate contact portion 34 are common, but also the substrate contact. It is only necessary to adjust the height so that the substrate contact portion 34 can contact the side surface of the substrate 2 with the portion 34 floating.

  The urging means 60 presses the substrate guide body 31 toward the stage surface 12a. The biasing means 60 of the present embodiment is an air slide table 81, and the substrate guide body 31 is pressed toward the stage surface 12 a side by controlling the air supplied to the air slide table 81. Specifically, by controlling the air, when the table 81a of the air slide table 81 tries to move downward, the advance / retreat mechanism connected to the table 81a, the guide support portion 32, and the substrate guide body 31 always face downward. Under the force, the substrate guide body 31 is pressed toward the stage surface 12a.

  Here, when the amount of air supply is increased by opening the valve of the levitation unit 50, the air ejected from the air pad 51 increases, the levitation force increases, and the substrate guide body 31 is displaced upward. On the other hand, if the substrate guide body 31 is displaced upward, the air pressure supplied to the air slide table 81 of the urging means 60 does not change, so the air pressure slightly increases by the amount that the table 81a is displaced upward. However, the thrust for the table 81a to move downward increases. That is, the substrate guide body 31 receives a pressing force downward. Thus, the height position of the substrate contact portion 34 can be maintained at the height position of the side surface of the substrate 2 by the position where the levitation force of the levitation unit 50 and the urging force of the urging means 60 are balanced.

  Such a substrate guide 30 can transport the substrate 2 while suppressing generation of particles even when an error in manufacturing and assembling of the apparatus such as a flatness error on the surface of the stage 12 occurs. That is, the substrate abutment portion 34 abuts against the side surface 2 a of the substrate 2 at a position where the levitation force of the levitation unit 50 and the urging force of the urging means 60 are balanced by the substrate guide 30, thereby restraining the substrate 2. In this state, when the substrate guide 30 is moved in the transport direction and the substrate 2 is transported, if there is a flatness error on the surface of the stage 12, for example, assuming that the surface of the stage 12 is raised, the air pad Since the amount of air ejected from 51 does not change, the substrate guide body 31 receives an upward force from the adjacent stage surface 12a due to the air ejection force and is displaced upward. When the substrate guide main body 31 is displaced upward, the table 81a of the air slide table 81 is slightly upwardly displaced, so that the downward thrust of the table 81a is increased and the substrate guide main body 31 receives a downward pressure. That is, even if the stage surface 12a is close to or away from the substrate guide body 31, the flying force of the flying unit 50 and the biasing force (restoring force) of the biasing means 60 are balanced at the new height position. The floating state of the substrate guide body 31 is maintained so that 31 follows the stage surface 12a. Therefore, even if an error in manufacturing and assembling of the apparatus such as an error in flatness of the surface of the stage 12 occurs, it is possible to suppress the traveling substrate guide 30 from contacting the stage surface 12a. It is possible to suppress the generation of particles that occur when 30 contacts the stage surface 12a.

  In the above embodiment (Example 2), the case where the air pad 51 of the levitation unit 50 is common to the two substrate guide bodies 31 has been described. However, as in the example shown in FIG. On the other hand, an air pad of the levitation unit 50 may be provided. Since each configuration is the same as that of the second embodiment, description thereof will be omitted. However, in the example of FIG. 12, the floating unit 50 is provided independently for each substrate guide body 31. The quantity is more reliably maintained. However, in the example of FIGS. 10 and 11, the air pad 51 of the levitation unit 50 is disposed outside the region (substrate transport region) where the substrate 2 is transported. It is possible to suppress the temperature change. That is, since it is possible to suppress the formation of temperature unevenness in the substrate transport region, it is possible to suppress the occurrence of drying unevenness due to the temperature unevenness of the substrate transport region in the coating film formed on the substrate 2.

  In the above embodiment, the case where the substrate contact portion 34 of the substrate guide body 31 has a surface perpendicular to the side surface of the substrate 2 has been described. However, the substrate contact portion 34 has an inclined surface 34 a with respect to the side surface of the substrate 2. It may be. That is, since the substrate guide body 31 is floating from the stage surface 12a, a gap is formed between the bottom surface of the substrate guide body 31 and the stage surface 12a. Therefore, there is a possibility that the substrate 2 may sink into the gap while the substrate 2 is being transported and damage the substrate 2. Therefore, as shown in FIG. 13, by forming the substrate contact portion 34 on the inclined surface 34a whose diameter increases toward the stage surface 12a, it is possible to avoid the problem that the substrate 2 sinks into the gap. That is, when the substrate contact portion 34 formed on the inclined surface 34a whose diameter increases toward the stage surface 12a contacts the side surface of the substrate 2, the substrate 2 is compared with the case where the substrate contact portion 34 is a vertical surface. When an upward force acts on the substrate 2, it is possible to suppress the substrate 2 from being displaced downward. If the substrate 2 is displaced downward, the holding interval of the substrate contact portion 34 formed on the inclined surface 34a is narrowed, so that the force for sandwiching the substrate 2 further increases, and the substrate 2 The downward displacement can be suppressed. That is, by forming the substrate contact portion 34 on the inclined surface 34a, it is possible to suppress the substrate 2 from entering a gap generated between the substrate guide main body 31 and the stage surface 12a formed by floating with the air pad. it can.

  In the above-described embodiment, the example in which the levitation unit 13 oscillates the stage 12 using the vibrator 13a to levitate the substrate 2 has been described. However, the substrate 2 is levitated by ejecting air from the stage surface 12a. It may be a thing.

  In the above-described embodiment, an example in which four stages 12 are arranged has been described. However, two sheets may be arranged as the minimum structural unit, or four or more sheets may be arranged according to the transport distance. .

  Moreover, although the example which conveys the board | substrate 2 to the drying apparatus was demonstrated in the said embodiment, the drying function may be provided in the board | substrate conveyance apparatus 1, and you may convey to the exposure apparatus in a next process. That is, if it is a use which conveys the board | substrate 2, the use is not specifically limited.

  Moreover, although the said embodiment demonstrated the case where the shape of the board | substrate contact part 34 was a cylindrical shape, the cross section may be an elliptical cylindrical member and is not specifically limited. However, the contact portion with the substrate 2 is formed in an arc shape, which is preferable in that the contact with the side surface of the substrate 2 can be easily adjusted.

  The substrate transport apparatus in the above embodiment is applicable not only to FPD but also to various fields as long as it is a field that needs to be transported with a constant dry state of the surface of the substrate, such as a solar cell and an organic EL. be able to.

DESCRIPTION OF SYMBOLS 1 Substrate conveyance apparatus 2 Substrate 12 Stage 30 Substrate guide 31 Substrate guide main body 32 Guide support part 32a Arm part 34 Substrate contact part 50 Lifting unit 51 Air pad 60 Energizing means 61 Coil spring 71 Suction part 72 Dust-proof cover

Claims (9)

A substrate transfer device that transfers a substrate levitated from the surface of the stage while guiding it with a substrate guide,
The substrate guide is
A substrate guide body that restrains the substrate by contacting the side surface of the substrate and is displaceable in a direction perpendicular to the surface of the stage;
A levitating unit for levitating the substrate guide body from the surface of the stage;
Biasing means for biasing the substrate guide body toward the surface side of the stage;
With
The substrate guide body has a substrate contact portion that contacts the side surface of the substrate, and the height position of the substrate contact portion is determined by the floating unit and the urging means. A substrate transfer apparatus, wherein the substrate transfer apparatus is maintained at a height position. The substrate guide includes an air pad at a position facing the surface of the stage, and the levitation unit ejects air from the air pad toward the surface of the stage by supplying air to the air pad. The substrate transport apparatus according to claim 1, wherein the substrate guide body is floated from the surface of the stage. The substrate transfer apparatus according to claim 2 , wherein the air pad of the floating unit is formed separately from a substrate contact portion of the substrate guide body. The substrate transfer apparatus according to claim 2 , wherein the air pad of the levitation unit is provided at a position deviating from the substrate transfer area on the stage. The substrate guide includes an air pad on a bottom surface portion of the substrate guide body facing the surface of the stage, and the levitation unit ejects air from the air pad by supplying air to the air pad. The substrate transport apparatus according to claim 1, wherein the substrate guide body is floated from the surface of the stage. The substrate guide further includes a guide support portion that supports the substrate guide body, and the guide support portion is supported so as to be displaceable in a direction in which the substrate guide body is in contact with and away from the surface of the stage. The spring member is provided in a contracted state between the support portion and the substrate guide main body, and the substrate guide main body is biased toward the surface side of the stage by the spring member. Substrate transfer device. The suction guide portion is formed in the vicinity of the guide support portion where the substrate guide main body is supported, and the suction portion is open to the substrate contact portion side. Substrate transfer device. The guide support portion includes a cover extending toward the substrate contact portion, and the cover is disposed outside the opening of the suction portion and is provided to cover the entire circumference of the substrate guide body. The substrate transfer apparatus according to claim 7, wherein a gap is formed between the cover and the substrate contact portion. The substrate contact portion has an inclined surface that is inclined with respect to the side surface of the substrate, and the inclined surface has a shape that increases in diameter toward the surface of the stage. The board | substrate conveyance apparatus of 1-8.

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