WO2017163887A1 - Substrate floating transport device - Google Patents

Substrate floating transport device Download PDF

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Publication number
WO2017163887A1
WO2017163887A1 PCT/JP2017/009363 JP2017009363W WO2017163887A1 WO 2017163887 A1 WO2017163887 A1 WO 2017163887A1 JP 2017009363 W JP2017009363 W JP 2017009363W WO 2017163887 A1 WO2017163887 A1 WO 2017163887A1
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WO
WIPO (PCT)
Prior art keywords
substrate
unit
holding frame
holding
suction
Prior art date
Application number
PCT/JP2017/009363
Other languages
French (fr)
Japanese (ja)
Inventor
健史 濱川
奥田　大輔
森　俊裕
貫志 岡本
俊文 伊藤
Original Assignee
東レエンジニアリング株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東レエンジニアリング株式会社 filed Critical 東レエンジニアリング株式会社
Priority to CN201780013592.2A priority Critical patent/CN108701635B/en
Priority to KR1020187027801A priority patent/KR102268373B1/en
Publication of WO2017163887A1 publication Critical patent/WO2017163887A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/912—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems with rectilinear movements only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
    • B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
    • B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat

Definitions

  • the present invention relates to a substrate levitation conveyance device that conveys a substrate while levitating, and particularly relates to a substrate levitation conveyance device that can suppress the formation of coating unevenness in a coating film on a substrate due to vibration during conveyance. Is.
  • a flat panel display such as a liquid crystal display or a plasma display uses a substrate coated with a resist solution (referred to as a coated substrate).
  • a coating film is formed by uniformly applying a resist solution onto the substrate by the coating device while the substrate is transported by the substrate transport device. Thereafter, the coating film is further transported by a substrate transporting device, and the coating film is dried by a drying device or the like to be produced.
  • the substrate levitation transfer apparatus includes a levitation stage unit 100 that levitates a substrate W, a substrate holding unit 102 that sucks and holds the substrate W in a levitated state, and the substrate holding unit 102 as a substrate W.
  • a transfer driving unit 103 that moves the substrate holding unit 102 by driving the transfer driving unit 103 and moving the substrate holding unit 102 in the transfer direction in a state where the substrate W floats on the floating stage unit 100. It is designed to be conveyed.
  • the substrate holding unit 102 is formed so that the flying height of several tens of ⁇ m to several hundreds of ⁇ m can be kept constant while maintaining the substrate W in a horizontal posture.
  • the substrate holding unit 102 includes a plurality of suction units 104 arranged in the transport direction, and these are provided on the transport drive unit 103 via an elevating mechanism 105. ing. That is, the suction units 104 are arranged at a predetermined interval in the transport direction, and an elevating mechanism 105 is provided in each suction unit 104.
  • the transport driving unit 103 moves in the transport direction in this state, the substrate W that has floated on the levitation stage unit 100 can be transported with high precision in the transport direction while maintaining a slight flying height.
  • the above substrate levitation transfer apparatus has a problem that it is difficult to adjust the floating substrate W to a certain height in the transfer direction. That is, in the above substrate floating transfer device, since the lifting mechanism 105 is provided in each of the suction portions 104, it is necessary to individually control each lifting mechanism 105 to adjust the height of the substrate W. Therefore, in order to adjust the flying height of the substrate W to be constant in the transport direction, it is necessary to accurately control the positions of the suction portions 104 of all the lifting mechanisms 105, and the configuration of the substrate holding unit 102 is There was a problem that it was complicated.
  • an object of the present invention is to provide a substrate levitating and conveying apparatus that can easily hold a levitated substrate at a constant height without increasing the cost of the apparatus without complicating the apparatus configuration.
  • a substrate levitation transfer apparatus includes a levitation stage for levitating a substrate, a substrate holding unit for holding a substrate levitated on the levitation stage, and a substrate held by the substrate holding unit.
  • a substrate driving unit that moves the substrate holding unit in a state to move the substrate in the conveying direction, and the substrate holding unit includes a plurality of adsorption units that adsorb the substrate and all the adsorption units in the conveyance direction.
  • the substrate holding unit has the holding frame portion to which all the suction portions are attached, it is possible to easily control the height position of the substrate. That is, since all the suction portions are attached to the holding frame portion, the height positions of all the suction portions can be adjusted at a time by moving the holding frame portion up and down. And the raising / lowering mechanism which raises / lowers a holding
  • the said conveyance drive part has a base part which moves along the said floating stage, and this base part and the said holding
  • the reinforcing support portion is provided separately from the connecting portion, the integrity between the base portion and the holding frame portion can be strengthened. That is, since all the suction parts are attached to the holding frame part, when the base part of the transport driving part travels, minute vibrations due to assembly accuracy or the like are likely to occur in the holding frame part. This vibration causes a coating unevenness in the coating film formed on the substrate, for example, when a coating process is performed.
  • the base portion and the holding frame portion are provided by providing a reinforcing support portion separately from the lifting portion. And the vibration generated during the conveyance is suppressed, and the influence of the vibration can be suppressed when substrate processing such as coating processing is performed.
  • the reinforcing support part may have a guide member that allows displacement in only one specific direction, and the base part and the holding frame part may be connected by this guide member.
  • the reinforcing support portion may be arranged at a position where the suction portion is provided in the transport direction.
  • the reinforcing support portion is provided in the suction portion that is likely to be a vibration source, it is possible to effectively suppress the occurrence of vibration in the holding frame.
  • the reinforcing support part may be arranged at all positions where the suction part is provided.
  • the reinforcing support part is provided with a spring part that expands and contracts according to the raising and lowering operation of the holding frame, and the connection between the base part and the holding frame is strengthened by the restoring force of the spring part. It may be configured.
  • connection between the base portion and the holding frame is strengthened by the restoring force of the spring portion, and vibration generated in the holding frame can be suppressed.
  • the reinforcing support portion is provided with a displacement limiting mechanism that limits the displacement of the holding frame in the up-and-down direction.
  • the displacement support mechanism is provided in the reinforced support portion, the displacement of the holding frame is restricted by the displacement limiting mechanism at least during substrate processing, thereby suppressing the vibration of the holding frame.
  • the influence of vibration on the substrate processing can be suppressed.
  • the displacement limiting mechanism may be formed by restraining displacement of the holding frame on the guide member in the up-and-down direction.
  • the present invention it is possible to easily hold the floating substrate at a certain height without increasing the complexity of the apparatus configuration and without increasing the cost.
  • FIG. 1 It is a perspective view which shows roughly the coating device combined with the board
  • FIG. 1 is a perspective view schematically showing a coating apparatus 2 combined with the substrate floating conveyance apparatus 1 of the present invention
  • FIG. 2 is a front view of the coating apparatus 2 combined with the substrate floating conveyance apparatus 1 in FIG. is there.
  • a substrate floating transfer device 1 that transfers a substrate W is combined with a coating unit 21 of a coating device 2 that forms a coating film on the substrate W to be transferred to form a series of substrate processing devices. is doing.
  • the substrate levitation transport apparatus 1 has a levitation stage portion 10 extending in one direction, and the substrate W is transported along the direction in which the levitation stage portion 10 extends.
  • the levitation stage unit 10 is formed to extend in the X-axis direction so that the substrate W is transported from the upstream side (pre-process side) to the downstream side (post-process side) in the X-axis direction. It has become.
  • a coating film is formed on the substrate W by discharging the coating liquid from the coating unit 21.
  • a coating film having a uniform thickness is formed on the substrate W by discharging the coating liquid from the coating unit 21 while being transported in the X-axis direction while the substrate W is floated on the floating stage unit 10. It is supposed to be formed.
  • the direction in which the substrate W is transported is the X-axis direction
  • the X-axis direction corresponds to the transport direction.
  • the direction orthogonal to the X-axis direction on the horizontal plane is defined as the Y-axis direction
  • the Y-axis direction is also referred to as the river width direction.
  • the description will be made with the direction orthogonal to both the X-axis direction and the Y-axis direction as the Z-axis direction.
  • the application unit 21 applies a coating solution to the substrate W, and includes a frame portion 22 and a base portion 23.
  • the frame portion 22 has support columns 22a disposed on both sides in the Y-axis direction of the levitation stage unit 10, and a base portion 23 is provided on the support column 22a.
  • the support columns 22a are fixedly provided on both sides in the Y-axis direction (river width direction), so that the travel of the substrate holding unit 30 to be described later is prevented from being hindered. Is also arranged on the outside.
  • the base part 23 is spanned over these support
  • the support 22a is provided with an elevating mechanism, and the base 23 can be moved in the Z direction by operating the elevating mechanism. That is, the base portion 23 can be moved toward and away from the floating stage portion 10 by the lifting mechanism.
  • the base part 23 is for discharging the coating liquid and is formed extending in one direction.
  • the base part 23 is formed with a slit nozzle 23a (see FIG. 2) extending in one direction so that the coating liquid stored in the base part 23 can be discharged from the slit nozzle 23a.
  • the slit nozzle 23a is formed on a surface facing the levitation stage unit 10, and the base unit 23 is installed in a state where the slit nozzle 23a extends in the river width direction. Then, the base 23 is moved up and down with respect to the substrate W to be transported, and the coating liquid is discharged from the slit nozzle 23a in a state where the distance between the substrate W and the slit nozzle 23a is adjusted to a predetermined distance.
  • a uniform coating film is continuously formed in the transport direction.
  • a coating film having a uniform thickness is formed on the substrate W by moving the substrate W while discharging the coating liquid from the slit nozzle 23a.
  • the substrate surfacing and conveying apparatus 1 conveys the substrate W in one direction (in this embodiment, the X-axis direction) while levitating.
  • the substrate levitation transport apparatus 1 includes a levitation stage unit 10 that levitates the substrate W, and a substrate transport unit 3 that holds and transports the substrate W levitated on the levitation stage unit 10.
  • the levitation stage unit 10 levitates the substrate W, and has an air levitation mechanism in this embodiment.
  • the levitation stage unit 10 is formed by providing a flat plate portion 12 on a base 11, and is formed by arranging a plurality of flat plate portions 12 along the X-axis direction. That is, the flat plate portion 12 has a smooth substrate air bearing surface 12a (see FIG. 3), and the substrate air bearing surfaces 12a are arranged so as to have a uniform height. An air layer is formed between the substrate floating surface 12a and the substrate W to be transported, so that the substrate W can be floated to a predetermined height position.
  • the flat plate portion 12 is formed with a fine jet port (not shown) and a suction port (not shown) that open to the substrate floating surface 12a, and the jet port and the compressor are connected by a pipe.
  • the suction port and the vacuum pump are connected by piping. Then, by balancing the air ejected from the ejection port and the suction force generated at the suction port, the substrate W can be floated in a horizontal posture at a predetermined height from the substrate air bearing surface 12a. . As a result, the substrate W can be transported in a state in which the planar posture (referred to as flatness) is maintained with high accuracy.
  • the flat plate portion 12 of the levitation stage portion 10 is formed such that the dimension in the Y-axis direction is smaller than the dimension in the Y-axis direction of the substrate W to be transported, and when the substrate W is placed on the substrate floating surface 12a, the substrate The end of the substrate W in the Y-axis direction protrudes from the air bearing surface 12a.
  • the dimension of the flat plate portion 12 in the Y-axis direction is set so that the protruding region T has a minimum necessary size that can be held by the substrate holding portion 30.
  • the protruding amount of the protruding region T is such that a slight gap that does not contact each other is formed between the substrate holding unit 30 and the flat plate portion 12 when the substrate holding unit 30 holds the protruding region T of the substrate W. It is set to the extent to be.
  • the substrate transport unit 3 transports the floating substrate W, and includes a substrate holding unit 30 that holds the substrate W and a transport drive unit 31 that travels the substrate holding unit 30.
  • the transport driving unit 31 is configured to move the substrate holding unit 30 in the transport direction, and includes a transport rail unit 31a that extends in the transport direction along the floating stage unit 10, and a base that travels on the transport rail unit 31a. It is formed with the part 31b. Specifically, bases 31c (see FIG. 2) provided so as to extend in the transport direction are disposed on both sides in the river width direction of the levitation stage unit 10, and transport rails 31a are provided on the respective bases 31c. It has been. That is, the conveyance rail part 31a is continuously provided along the levitation stage part 10 without interruption.
  • the base part 31b is a plate-shaped member formed in a concave shape, and is provided so as to cover the upper surface of the transport rail part 31a, for example, as shown in FIGS.
  • the base portion 31b is provided so as to cover the transport rail portion 31a via the air pad 32, and the base portion 31b moves over the transport rail portion 31a by driving a linear motor (not shown). It is supposed to run. That is, by driving and controlling the linear motor, the base portion 31b can travel without contacting the transport rail portion 31a and can be stopped at a predetermined position.
  • the substrate holding unit 30 holds the substrate W and is attached to the base portion 31b.
  • the substrate holding unit 30 includes a holding frame portion 40 extending in the transport direction and a suction portion 41 attached to the holding frame portion 40.
  • the part 40 is connected to the base part 31b via the elevating part 42. Then, by driving the elevating unit 42, the holding frame unit 40 moves up and down, so that the suction unit 41 can come into contact with and separate from the back surface of the substrate W.
  • the holding frame part 40 is for attaching the adsorbing part 41, and has a long flat plate shape.
  • the holding frame portion 40 is disposed on each base portion 31b, and is disposed on the base portion 31b via an elevating portion 42.
  • the holding frame portion 40 is disposed so as to sandwich the floating stage portion 10 in the river width direction, and the longitudinal direction thereof is disposed along the transport direction.
  • the conveyance driving unit 31 is driven, the two holding frame units 40 are synchronized and travel along the levitation stage unit 10.
  • the length of the holding frame unit 40 in the longitudinal direction is formed according to the length of the substrate W to be transferred in the transfer direction, and a plurality of suction units 41 are arranged at the upper end portion of the holding frame unit 40. ing. That is, when the elevating part 42 is driven and the holding frame part 40 is raised, all the suction parts 41 are raised at once, and when the holding frame part 40 is lowered, all the suction parts 41 are lowered at once. As a result, the configuration is facilitated compared to the conventional case where the suction unit 41 has the elevating unit 42, and the control can be prevented from becoming complicated.
  • the holding frame portion 40 has the respective suction portions 41 arranged at equal intervals, and the dimension from the one end portion in the transport direction to the other end portion is the length in the transport direction of the substrate W. It is set to be less than this. That is, when the holding frame portion 40 is raised while the substrate W is floating on the floating stage, all the suction portions 41 come into contact with the back surface of the substrate W, and when the holding frame portion 40 is lowered, all the suction portions are attracted. The part 41 is separated from the substrate W.
  • the suction part 41 is for holding the substrate W by suction, and is formed in a substantially rectangular parallelepiped block shape.
  • the substrate holding unit 30 is set so that the upper surface (suction surface 33) thereof is at the height and surface position of the lower surface of the substrate W that has been levitated.
  • an opening 34 is formed in the suction surface 33, and an accordion-shaped suction pad 35 that can be elastically deformed is embedded in the opening 34.
  • the suction pad 35 generates suction force and sucks and holds the substrate W.
  • a normal state a state where there is no substrate W
  • the suction pad 35 waits with its tip slightly protruding from the opening 34. Has been set (see FIG. 5A).
  • the elevating part 42 is for elevating operation while supporting the holding frame part 40 on the base part 31b.
  • one unit is provided near both ends in the conveying direction.
  • a total of two units are provided.
  • FIG. 6 is the figure which looked at the raising / lowering part 42 in the conveyance direction.
  • the elevating part 42 is formed by combining wedge-shaped blocks 43, and is fixed to the base part 31 b with the inclined surfaces of the triangular prism-shaped blocks 43 in contact with each other. Of these blocks 43, one block 43a is connected to the holding frame portion 40 via the stay 44, and the other block 43b is connected to the base portion 31b.
  • One block 43a is provided with an actuator 45.
  • one block 43a can be displaced along the slope with respect to the other block 43b. That is, when one block 43a is pressed in the Y-axis direction (for example, the plus side), the block 43a moves along the slope, and as a result, is displaced in the Z direction (vertically upward) to raise the holding frame portion 40. (FIG. 6 (a) ⁇ FIG. 6 (b)). Further, when one block is pressed in the reverse direction (for example, the negative side in the Y-axis direction), the block 43a moves along the slope, and as a result, is displaced in the Z direction (vertically downward) to lower the holding frame portion 40. (FIG. 6 (b) ⁇ FIG. 6 (a)).
  • the elevating unit 42 combined with the wedge-shaped block 43, the operation accuracy of the holding frame unit 40 in the elevating direction with respect to the input can be improved, and the position control of the suction unit 41 with respect to the substrate W can be performed with high accuracy. It is like that.
  • the holding frame portion 40 is provided with a reinforcing support portion 50 that strengthens the connection between the holding frame portion 40 and the base portion 31b.
  • This reinforced support part 50 has a stronger connection strength between the holding frame part 40 and the base part 31b than when the holding frame part 40 and the base part 31b are connected only by the elevating part 42 at least during substrate processing. It improves and suppresses the generation of vibration caused by insufficient rigidity.
  • the reinforcing support part 50 is provided so as to connect the holding frame part 40 and the base part 31 b.
  • the reinforcing support part 50 is It is provided at a position where the suction part 41 is attached in the transport direction. That is, the portion where the suction portion 41 is disposed is likely to be a vibration source due to the influence of the weight of the suction portion 41 and the like, and therefore the reinforcement support portion 50 is disposed immediately below the suction portion 41, thereby Generation
  • the reinforcement support part 50 is arrange
  • the reinforced support portion 50 includes a support main body portion 51 fixed on the base portion 31 b and a linear guide 52 (guide member).
  • the linear guide 52 and the holding frame portion 40 are provided. Are connected to each other.
  • FIG. 7A is a view of the reinforcing support portion 50 viewed in the transport direction
  • FIG. 7B is a view of the linear guide 52 as the reinforcing support portion 50 viewed in the Y-axis direction.
  • the support main body 51 is a flat plate member having an L-shaped cross section, and is fixed by bolts 54 on the base 31b in a posture in which the mounting surface 53 faces the holding frame 40 side.
  • a linear guide 52 is provided on the mounting surface 53, and a rail 55 of the linear guide 52 is attached in a direction extending in the Z direction (the lifting direction of the holding frame portion 40).
  • the block 56 of the linear guide 52 is connected to the holding frame portion 40.
  • the holding frame portion 40 is allowed to be displaced only in the Z direction and is restricted from being displaced in directions other than the Z direction. That is, the holding frame part 40 moves smoothly along the linear guide 52 when the elevating part 42 is driven.
  • the displacement in the direction other than the Z direction is limited, so that the direction other than the Z direction can be achieved. Displacement (vibration, etc.) is limited.
  • the reinforced support portion 50 is provided with a displacement limiting mechanism 60.
  • the displacement limiting mechanism 60 limits the displacement of the holding frame portion 40 in the up and down direction.
  • the holding frame portion 40 is provided with a linear clamp 62, and the linear clamp 62 sandwiches the rail of the linear guide 52, thereby restraining displacement in the ascending / descending direction (Z direction).
  • the linear clamp 62 is disposed between the clamp body 62a, the wedge-shaped piston part 62b that moves forward and backward with respect to the clamp body 62a, and the piston part 62b and the rail.
  • the linear clamp 62 is configured to displace on the linear guide 52 in accordance with the lifting and lowering operation of the holding frame portion 40. Then, by driving and controlling the piston portion 62b, for example, when the piston portion 62b is displaced into the clamp body 62a, the contact portion 62c is pressed toward the rail 55, so that the rail 55 is sandwiched and fixed between the contact portions 62c. Is done.
  • the linear clamp 62 when the linear clamp 62 is operated at a predetermined position on the rail 55, the displacement of the holding frame portion 40 in the ascending / descending direction is limited, and the holding frame portion 40 is fixed to the rigid at that position.
  • maintenance frame part 40 and the base part 31b can be improved more, and generation
  • the displacement limiting mechanism 60 is operated while holding the substrate. That is, in the loading / unloading operation of the substrate W, the holding frame portion 40 is disposed at the lowered position, and the displacement limiting mechanism 60 does not operate. Then, when the substrate W is placed on the levitation stage unit 10, the holding frame unit 40 rises, and the adsorption unit 41 contacts the back surface of the substrate W to adsorb the substrate W. When the holding posture of the substrate W becomes stable, the displacement limiting mechanism 60 is actuated so that the position of the holding frame portion 40 is fixed to the rigid.
  • the reinforcing support portion 50 is provided separately from the elevating portion 42, the integrity of the base portion 31b and the holding frame portion 40 can be strengthened.
  • the suction portions 41 are attached to the holding frame portion 40, when the base portion 31b of the transport driving portion 31 travels, a slight vibration is generated in the holding frame portion 40 due to assembly accuracy, own weight, and the like. It becomes easy.
  • This vibration causes a coating unevenness in the coating film formed on the substrate W when, for example, a coating process is performed, but the base portion 31b is provided by providing the reinforcing support portion 50 separately from the elevating portion 42.
  • the holding frame portion 40 are increased in rigidity, and vibrations generated during conveyance can be suppressed, and the influence of vibrations can be suppressed when substrate processing such as coating processing is performed.
  • a link clamp 63 may be used. Specifically, it is formed of a support column 64 fixedly disposed on the base portion 31b immediately below the suction unit 41, and a link clamp 63 provided on the support column 64. By controlling the pressure, the lever portion 63a rotates and the holding frame portion 40 can be locked. That is, the lever part 63a of the link clamp 63 is formed so as to be able to contact and separate from the holding frame part 40 according to the operation of the piston 63b, and the tip of the lever part 63a supports the lower end of the holding frame part 40. Thus, the position of the holding frame portion 40 is fixed to the rigid.
  • the piston 63b presses the lever portion 63a to rotate the lever portion 63a, and the tip of the lever portion 63a is the holding frame portion.
  • the lower end of 40 is supported. Even with such a displacement limiting mechanism 60, the rigidity of the holding frame portion 40 and the base portion 31b can be further increased, and the generation of vibrations can be more effectively suppressed as compared with the case of only the reinforcing support portion 50. Can do.
  • the configuration having only the reinforcing support portion 50 may be used without providing the displacement limiting mechanism 60.
  • the linear guide 52 and the linear motion guide (guide member) such as a ball screw are used as the reinforcing support portion 50, and the holding frame portion 40 and the base portion 31b are connected by connecting the holding frame portion 40 and the base portion 31b.
  • Relative displacement is limited to only one specific direction, and displacement in directions other than the specific direction is limited. Thereby, it can suppress that a vibration generate
  • the reinforcing support portion 50 includes the spring portion 70, and the holding frame portion 40 and the holding frame portion 40 are connected by the restoring force of the spring portion 70.
  • the connection with the base portion 31b may be strengthened.
  • it is formed by a rod-shaped shaft main body 71 and a spring portion 70 provided on the shaft main body 71.
  • the spring portion 70 is provided by being contracted by a predetermined amount in a state where the holding frame portion 40 is located at a height position during substrate holding.
  • the restoring force of the spring portion 70 acts in the direction of strengthening the connection between the holding frame portion 40 and the base portion 31b.
  • the rigidity of the holding frame portion 40 and the base portion 31b is improved, and the occurrence of vibration can be suppressed.
  • the said embodiment demonstrated the example provided in all the positions (position directly under the adsorption
  • the substrate W floating conveyance device is combined with the coating device.
  • the substrate W can be combined with various substrate processing devices such as an exposure machine, an inspection device, and a marking device. Then, by suppressing the occurrence of vibration during the conveyance of the substrate W, it is possible to suppress the vibration from affecting the substrate processing as much as possible.

Abstract

Provided is a substrate floating transport device which makes it possible to easily hold a floating substrate at a certain height without complicating the device configuration or increasing the cost thereof. Specifically, the substrate floating transport device is provided with: a floating stage which causes a substrate to float; a substrate holding unit which holds the substrate being caused to float by the floating stage; and a transport drive unit which causes the substrate to be moved in a transport direction by moving the substrate holding unit with the substrate being held by the substrate holding unit. The substrate holding unit includes a plurality of suction attachment units which suction-attach the substrate, and a holding frame unit on which all of the suction attachment units are mounted in a state of being arranged in the transport direction. The holding frame unit is attached to the transport drive unit via a lifting/lowering unit, and is formed such that, as the lifting/lowering unit is operated, the holding frame unit performs a lifting/lowering operation to move all of the suction attachment units toward or away from the substrate.

Description

基板浮上搬送装置Substrate floating transfer device
　本発明は、基板を浮上させながら搬送する基板浮上搬送装置に関するものであり、特に、搬送時の振動により基板上の塗布膜に塗布ムラが形成されるのを抑えることができる基板浮上搬送装置に関するものである。 The present invention relates to a substrate levitation conveyance device that conveys a substrate while levitating, and particularly relates to a substrate levitation conveyance device that can suppress the formation of coating unevenness in a coating film on a substrate due to vibration during conveyance. Is.
　液晶ディスプレイやプラズマディスプレイ等のフラットパネルディスプレイには、基板上にレジスト液が塗布されたもの（塗布基板と称す）が使用されている。この塗布基板は、基板搬送装置で基板を搬送しつつ塗布装置により基板上にレジスト液が均一に塗布されることによって塗布膜が形成される。その後、さらに基板搬送装置により搬送され、乾燥装置等により塗布膜が乾燥されることにより生産される。 A flat panel display such as a liquid crystal display or a plasma display uses a substrate coated with a resist solution (referred to as a coated substrate). In the coated substrate, a coating film is formed by uniformly applying a resist solution onto the substrate by the coating device while the substrate is transported by the substrate transport device. Thereafter, the coating film is further transported by a substrate transporting device, and the coating film is dried by a drying device or the like to be produced.
　最近の基板搬送装置では、塗布基板Ｗの裏面（塗布面と反対側）の損傷を回避するため、エア浮上や超音波浮上等、基板Ｗを浮上させながら基板Ｗを搬送させる基板浮上搬送装置が使用されている。この基板浮上搬送装置は、図１０に示すように、基板Ｗを浮上させる浮上ステージ部１００と、浮上した状態の基板Ｗを吸着して保持する基板保持ユニット１０２と、基板保持ユニット１０２を基板Ｗの搬送方向に移動させる搬送駆動部１０３とを有しており、搬送駆動部１０３を駆動させて基板保持ユニット１０２を移動させることにより、基板Ｗが浮上ステージ部１００上を浮上した状態で搬送方向に搬送されるようになっている。 In recent substrate transport apparatuses, in order to avoid damage to the back surface (the side opposite to the coating surface) of the coated substrate W, there is a substrate floating transport apparatus that transports the substrate W while floating the substrate W, such as air levitation or ultrasonic levitation. in use. As shown in FIG. 10, the substrate levitation transfer apparatus includes a levitation stage unit 100 that levitates a substrate W, a substrate holding unit 102 that sucks and holds the substrate W in a levitated state, and the substrate holding unit 102 as a substrate W. A transfer driving unit 103 that moves the substrate holding unit 102 by driving the transfer driving unit 103 and moving the substrate holding unit 102 in the transfer direction in a state where the substrate W floats on the floating stage unit 100. It is designed to be conveyed.
　搬送される基板Ｗは、浮上ステージ部１００と接触するのを回避し、搬送途中に設けられた基板処理部（例えば塗布処理部）１０６で精度のよい処理を行う必要がある。そのため、基板保持ユニット１０２では、基板Ｗが水平な姿勢を維持しつつ、数十μｍ～数百μｍの浮上量を一定に保つことができるように形成されている。具体的には、図１１に示すように、基板保持ユニット１０２は、複数の吸着部１０４が搬送方向に沿って複数配列されており、これらが搬送駆動部１０３に昇降機構１０５を介して設けられている。すなわち、吸着部１０４が搬送方向に所定間隔で配置されており、それぞれの吸着部１０４に昇降機構１０５が設けられている。そして、それぞれの昇降機構１０５を制御することにより、浮上した基板Ｗを吸着し、基板Ｗが設定された浮上高さ位置で吸着保持されるようになっている（図１１（ｂ））。この状態で搬送駆動部１０３が搬送方向に移動することにより、浮上ステージ部１００上に浮上した基板Ｗは、微少な浮上量を維持した状態で搬送方向に精度よく搬送できるようになっている。 The substrate W to be transported needs to avoid contact with the levitation stage unit 100 and be subjected to accurate processing by a substrate processing unit (for example, a coating processing unit) 106 provided in the middle of transport. Therefore, the substrate holding unit 102 is formed so that the flying height of several tens of μm to several hundreds of μm can be kept constant while maintaining the substrate W in a horizontal posture. Specifically, as shown in FIG. 11, the substrate holding unit 102 includes a plurality of suction units 104 arranged in the transport direction, and these are provided on the transport drive unit 103 via an elevating mechanism 105. ing. That is, the suction units 104 are arranged at a predetermined interval in the transport direction, and an elevating mechanism 105 is provided in each suction unit 104. Then, by controlling each lifting mechanism 105, the floating substrate W is sucked and sucked and held at the set flying height position (FIG. 11B). When the transport driving unit 103 moves in the transport direction in this state, the substrate W that has floated on the levitation stage unit 100 can be transported with high precision in the transport direction while maintaining a slight flying height.
２０１１－２１３４３５号公報2011-213435
　しかし、上記基板浮上搬送装置では、浮上した基板Ｗを搬送方向に亘って一定高さに調節することが困難であるという問題があった。すなわち、上記基板浮上搬送装置では、すべての吸着部１０４それぞれに昇降機構１０５が設けられているため、それぞれの昇降機構１０５を個別に制御して基板Ｗの高さを調節する必要がある。そのため、基板Ｗの浮上量が搬送方向に亘って一定になるように調節するには、すべての昇降機構１０５の吸着部１０４の位置を精度よく制御する必要があり、基板保持ユニット１０２の構成が複雑化してしまうという問題があった。 However, the above substrate levitation transfer apparatus has a problem that it is difficult to adjust the floating substrate W to a certain height in the transfer direction. That is, in the above substrate floating transfer device, since the lifting mechanism 105 is provided in each of the suction portions 104, it is necessary to individually control each lifting mechanism 105 to adjust the height of the substrate W. Therefore, in order to adjust the flying height of the substrate W to be constant in the transport direction, it is necessary to accurately control the positions of the suction portions 104 of all the lifting mechanisms 105, and the configuration of the substrate holding unit 102 is There was a problem that it was complicated.
　また、すべての吸着部１０４の高さ位置を精度よく調整するために高性能の昇降機構１０５を採用すると、すべての吸着部１０４の昇降機構１０５について高性能の昇降機構１０５を採用する必要があり、装置全体のコストが増加してしまうという問題があった。 In addition, when the high-performance lifting mechanism 105 is used to accurately adjust the height positions of all the suction units 104, it is necessary to employ the high-performance lifting mechanism 105 for the lifting mechanisms 105 of all the suction units 104. There is a problem that the cost of the entire apparatus increases.
　そこで、本発明は、装置構成の複雑化を避け、コストアップすることなく、浮上した基板を容易に一定高さに保持することができる基板浮上搬送装置を提供することを目的としている。 Accordingly, an object of the present invention is to provide a substrate levitating and conveying apparatus that can easily hold a levitated substrate at a constant height without increasing the cost of the apparatus without complicating the apparatus configuration.
　上記課題を解決するために本発明の基板浮上搬送装置は、基板を浮上させる浮上ステージと、前記浮上ステージで浮上された基板を保持する基板保持ユニットと、前記基板保持ユニットで基板が保持された状態で前記基板保持ユニットを移動させることにより基板を搬送方向に移動させる搬送駆動部と、を備え、前記基板保持ユニットは、基板を吸着する複数の吸着部と、これらすべての吸着部を搬送方向に並んだ状態で取り付ける保持フレーム部とを有しており、前記保持フレーム部は、前記搬送駆動部に昇降部を介して設けられており、昇降部を動作させることにより、前記保持フレーム部が昇降動作を行って、すべての前記吸着部が基板に対して接離動作するように形成されていることを特徴としている。 In order to solve the above problems, a substrate levitation transfer apparatus according to the present invention includes a levitation stage for levitating a substrate, a substrate holding unit for holding a substrate levitated on the levitation stage, and a substrate held by the substrate holding unit. A substrate driving unit that moves the substrate holding unit in a state to move the substrate in the conveying direction, and the substrate holding unit includes a plurality of adsorption units that adsorb the substrate and all the adsorption units in the conveyance direction. A holding frame portion that is attached in a state where the holding frame portion is provided on the conveyance drive portion via an elevating portion, and by operating the elevating portion, the holding frame portion is It is characterized in that it is formed so as to move up and down and all the adsorbing parts move toward and away from the substrate.
　本発明によれば、基板保持ユニットが、すべての吸着部を取り付ける保持フレーム部を有しているため、基板の高さ位置の制御を容易にすることができる。すなわち、保持フレーム部には、すべての吸着部が取り付けられているため、この保持フレーム部を昇降動作させることにより、すべての吸着部の高さ位置を一度に調節することができる。そして、保持フレーム部を昇降させる昇降機構は、従来のように、すべての吸着部それぞれに設ける必要はなく、保持フレーム部を昇降させる最小限の昇降機構だけでよい。したがって、従来に比べて昇降機構の数を減らすことができるため、装置構成の複雑化を避けることができ、コストアップすることなく、浮上した基板を容易に一定高さに保持することができる。 According to the present invention, since the substrate holding unit has the holding frame portion to which all the suction portions are attached, it is possible to easily control the height position of the substrate. That is, since all the suction portions are attached to the holding frame portion, the height positions of all the suction portions can be adjusted at a time by moving the holding frame portion up and down. And the raising / lowering mechanism which raises / lowers a holding | maintenance frame part does not need to be provided in each of all the adsorption | suction parts like the past, and only the minimum raising / lowering mechanism which raises / lowers a holding | maintenance frame part is sufficient. Therefore, since the number of lifting mechanisms can be reduced as compared with the conventional case, the configuration of the apparatus can be prevented from becoming complicated, and the floating substrate can be easily held at a constant height without increasing the cost.
　また、前記搬送駆動部は、前記浮上ステージに沿って移動するベース部を有しており、このベース部と、前記保持フレーム部とがこれらを連結する連結部で一体化されており、この連結部とは別に前記ベース部と前記保持フレーム部との連結を強化する強化支持部が設けられていることを構成とすることができる。 Moreover, the said conveyance drive part has a base part which moves along the said floating stage, and this base part and the said holding | maintenance frame part are integrated by the connection part which connects these, This connection Apart from the part, a reinforcing support part for reinforcing the connection between the base part and the holding frame part may be provided.
　この構成によれば、連結部とは別に強化支持部が設けられているため、ベース部と保持フレーム部との一体性を強固にすることができる。すなわち、保持フレーム部には、すべての吸着部が取り付けられているため、搬送駆動部のベース部が走行すると保持フレーム部に組付け精度等による微少な振動が発生しやすくなる。この振動が、例えば塗布処理を行った場合に、基板上に形成された塗布膜に塗布ムラを発生させる要因になるが、昇降部とは別に強化支持部を設けることによりベース部と保持フレーム部との剛性が増し、搬送時に発生する振動が抑えられ、塗布処理等の基板処理を行った場合に振動による影響を抑えることができる。 According to this configuration, since the reinforcing support portion is provided separately from the connecting portion, the integrity between the base portion and the holding frame portion can be strengthened. That is, since all the suction parts are attached to the holding frame part, when the base part of the transport driving part travels, minute vibrations due to assembly accuracy or the like are likely to occur in the holding frame part. This vibration causes a coating unevenness in the coating film formed on the substrate, for example, when a coating process is performed. However, the base portion and the holding frame portion are provided by providing a reinforcing support portion separately from the lifting portion. And the vibration generated during the conveyance is suppressed, and the influence of the vibration can be suppressed when substrate processing such as coating processing is performed.
　また、前記強化支持部は、特定の一方向のみの変位を許容するガイド部材を有しており、このガイド部材により前記ベース部と前記保持フレーム部とが連結されている構成にしてもよい。 Further, the reinforcing support part may have a guide member that allows displacement in only one specific direction, and the base part and the holding frame part may be connected by this guide member.
　この構成によれば、強化支持部により、ベース部と保持フレーム部とが特定の方向以外の方向の相対的変位が抑えられるため、保持フレーム部に振動が発生するのを抑えることができる。 According to this configuration, since the relative displacement in the direction other than the specific direction between the base portion and the holding frame portion is suppressed by the reinforcing support portion, generation of vibration in the holding frame portion can be suppressed.
　また、前記強化支持部は、搬送方向において、前記吸着部が設けられた位置に配置されている構成にしてもよい。 Further, the reinforcing support portion may be arranged at a position where the suction portion is provided in the transport direction.
　この構成によれば、振動源になりやすい吸着部に強化支持部を設けられるため、保持フレームに振動が発生するのを効果的に抑えることができる。 According to this configuration, since the reinforcing support portion is provided in the suction portion that is likely to be a vibration source, it is possible to effectively suppress the occurrence of vibration in the holding frame.
　また、前記強化支持部は、前記吸着部が設けられた位置すべてに配置されている構成としてもよい。 Further, the reinforcing support part may be arranged at all positions where the suction part is provided.
　この構成によれば、振動源になりやすい吸着部すべてに強化支持部が設けられるため、保持フレームに振動が発生するのをより確実に抑えることができる。 According to this configuration, since the reinforcing support portions are provided in all the suction portions that are likely to become vibration sources, it is possible to more reliably suppress the occurrence of vibration in the holding frame.
　また、前記強化支持部には、前記保持フレームの昇降動作に応じて伸縮動作するバネ部が設けられており、前記バネ部の復元力により前記ベース部と前記保持フレームとの連結が強化される構成にしてもよい。 Further, the reinforcing support part is provided with a spring part that expands and contracts according to the raising and lowering operation of the holding frame, and the connection between the base part and the holding frame is strengthened by the restoring force of the spring part. It may be configured.
　この構成によれば、バネ部の復元力によりベース部と保持フレームとの連結が強化され、保持フレームに生じる振動を抑えることができる。 According to this configuration, the connection between the base portion and the holding frame is strengthened by the restoring force of the spring portion, and vibration generated in the holding frame can be suppressed.
　また、前記強化支持部は、前記保持フレームの昇降方向の変位が制限される変位制限機構が設けられている構成にすることが好ましい。 Further, it is preferable that the reinforcing support portion is provided with a displacement limiting mechanism that limits the displacement of the holding frame in the up-and-down direction.
　この構成によれば、強化支持部に変位制限機構が設けられているため、少なくとも基板処理時において変位制限機構により保持フレームの昇降方向の変位を制限することにより、保持フレームの振動が抑えられ、基板処理に対する振動の影響を抑えることができる。 According to this configuration, since the displacement support mechanism is provided in the reinforced support portion, the displacement of the holding frame is restricted by the displacement limiting mechanism at least during substrate processing, thereby suppressing the vibration of the holding frame. The influence of vibration on the substrate processing can be suppressed.
　また、前記変位制限機構は、前記ガイド部材上における前記保持フレームの昇降方向の変位が拘束されることにより形成されている構成にしてもよい。 The displacement limiting mechanism may be formed by restraining displacement of the holding frame on the guide member in the up-and-down direction.
　この構成によれば、前記ガイド部材により許容された特定方向の変位が拘束されるため、ベース部と保持フレーム部とが一体化され、振動の発生を効果的に抑えることができる。 According to this configuration, since the displacement in a specific direction allowed by the guide member is restrained, the base portion and the holding frame portion are integrated, and generation of vibration can be effectively suppressed.
　本発明によれば、装置構成の複雑化を避け、コストアップすることなく、浮上した基板を容易に一定高さに保持することができる。 According to the present invention, it is possible to easily hold the floating substrate at a certain height without increasing the complexity of the apparatus configuration and without increasing the cost.
本発明の基板浮上搬送装置と組み合わされる塗布装置を概略的に示す斜視図である。It is a perspective view which shows roughly the coating device combined with the board | substrate floating conveyance apparatus of this invention. 上記実施形態の基板浮上搬送装置と組み合わされる塗布装置を搬送方向に見た図である。It is the figure which looked at the coating device combined with the substrate floating conveyance apparatus of the said embodiment in the conveyance direction. 上記実施形態において、浮上した基板を保持した状態を示す図である。In the said embodiment, it is a figure which shows the state holding the board | substrate which floated. 上記実施形態の基板保持ユニットをＹ軸方向に見た図である。It is the figure which looked at the board | substrate holding unit of the said embodiment in the Y-axis direction. 上記実施形態における基板浮上搬送装置の基板保持部の吸着パッドを示す図であり、（ａ）は吸着する前の状態を示す図であり、（ｂ）は吸着した状態を示す図である。It is a figure which shows the suction pad of the board | substrate holding | maintenance part of the substrate floating conveyance apparatus in the said embodiment, (a) is a figure which shows the state before adsorbing, (b) is a figure which shows the adsorbed state. 上記実施形態における基板浮上搬送装置の昇降部を示す図であり、（ａ）は、基板を保持していない高さ位置に下降した状態を示す図であり、（ｂ）は、基板を保持する高さ位置に上昇した状態を示す図である。It is a figure which shows the raising / lowering part of the board | substrate levitation conveyance apparatus in the said embodiment, (a) is a figure which shows the state which fell to the height position which is not holding the board | substrate, (b) is holding a board | substrate. It is a figure which shows the state raised to the height position. 上記実施形態における基板浮上搬送装置の強化支持部を示す図であり、（ａ）は、強化支持部を搬送方向に見た図であり、（ｂ）は強化支持部を浮上ステージ部側から見た図である。It is a figure which shows the reinforcement | strengthening support part of the board | substrate levitation conveyance apparatus in the said embodiment, (a) is the figure which looked at the reinforcement | strengthening support part in the conveyance direction, (b) looked at the reinforcement | strengthening support part from the floating stage part side. It is a figure. 他の実施形態における基板浮上搬送装置の強化支持部を示す図であり、（ａ）は、リンククランプがロックされる前の状態を示す図であり、（ｂ）は、リンククランプがロックされた状態を示す図である。It is a figure which shows the reinforcement | strengthening support part of the board | substrate floating conveyance apparatus in other embodiment, (a) is a figure which shows the state before a link clamp is locked, (b) is the link clamp locked. It is a figure which shows a state. さらに、他の実施形態における基板浮上搬送装置の強化支持部を示す図であり、（ａ）は、基板を保持していない高さ位置に下降した状態を示す図であり、（ｂ）は、基板を保持する高さ位置に上昇した状態を示す図である。Furthermore, it is a figure which shows the reinforcement | strengthening support part of the board | substrate levitation conveyance apparatus in other embodiment, (a) is a figure which shows the state lowered | hung to the height position which does not hold | maintain a board | substrate, (b) It is a figure which shows the state raised to the height position holding a board | substrate. 従来の基板浮上搬送装置の一実施形態を示す概略的な斜視図である。It is a schematic perspective view which shows one Embodiment of the conventional board | substrate floating conveyance apparatus. 従来の基板保持ユニットをＹ軸方向に見た図であり、（ａ）は、基板を保持していない高さ位置に下降した状態を示す図であり、（ｂ）は、基板を保持する高さ位置に上昇した状態を示す図である。It is the figure which looked at the conventional board | substrate holding unit in the Y-axis direction, (a) is a figure which shows the state which fell to the height position which is not holding a board | substrate, (b) is the height which hold | maintains a board | substrate. It is a figure which shows the state raised to the vertical position.
　以下、本発明の基板浮上搬送装置に係る実施の形態について図面を用いて説明する。 Hereinafter, embodiments according to the substrate levitation transfer apparatus of the present invention will be described with reference to the drawings.
　図１は、本発明の基板浮上搬送装置１と組み合わされる塗布装置２を概略的に示す斜視図であり、図２は、図１における基板浮上搬送装置１と組み合わされる塗布装置２の正面図である。 FIG. 1 is a perspective view schematically showing a coating apparatus 2 combined with the substrate floating conveyance apparatus 1 of the present invention, and FIG. 2 is a front view of the coating apparatus 2 combined with the substrate floating conveyance apparatus 1 in FIG. is there.
　図１、図２において、基板Ｗを搬送させる基板浮上搬送装置１は、搬送される基板Ｗに塗布膜を形成する塗布装置２の塗布ユニット２１と組み合わされており、一連の基板処理装置を形成している。この基板浮上搬送装置１は、一方向に延びる浮上ステージ部１０を有しており、この浮上ステージ部１０の延びる方向に沿って基板Ｗが搬送される。図１の例では、浮上ステージ部１０は、Ｘ軸方向に延びて形成されており、基板ＷがＸ軸方向に上流側（前工程側）から下流側（後工程側）に搬送されるようになっている。そして、塗布ユニット２１から塗布液を吐出することにより、基板Ｗ上に塗布膜が形成される。 In FIG. 1 and FIG. 2, a substrate floating transfer device 1 that transfers a substrate W is combined with a coating unit 21 of a coating device 2 that forms a coating film on the substrate W to be transferred to form a series of substrate processing devices. is doing. The substrate levitation transport apparatus 1 has a levitation stage portion 10 extending in one direction, and the substrate W is transported along the direction in which the levitation stage portion 10 extends. In the example of FIG. 1, the levitation stage unit 10 is formed to extend in the X-axis direction so that the substrate W is transported from the upstream side (pre-process side) to the downstream side (post-process side) in the X-axis direction. It has become. Then, a coating film is formed on the substrate W by discharging the coating liquid from the coating unit 21.
　具体的には、基板Ｗが浮上ステージ部１０に浮上された状態でＸ軸方向に搬送されつつ、塗布ユニット２１から塗布液が吐出されることにより、基板Ｗ上に均一厚さの塗布膜が形成されるようになっている。 Specifically, a coating film having a uniform thickness is formed on the substrate W by discharging the coating liquid from the coating unit 21 while being transported in the X-axis direction while the substrate W is floated on the floating stage unit 10. It is supposed to be formed.
　以下の説明では、基板Ｗが搬送される方向をＸ軸方向とし、Ｘ軸方向が搬送方向に相当する。また、Ｘ軸方向と水平面上で直交する方向をＹ軸方向とし、特にＹ軸方向を川幅方向ともいう。そして、Ｘ軸方向及びＹ軸方向の双方に直交する方向をＺ軸方向として説明を進めることとする。 In the following description, the direction in which the substrate W is transported is the X-axis direction, and the X-axis direction corresponds to the transport direction. Further, the direction orthogonal to the X-axis direction on the horizontal plane is defined as the Y-axis direction, and the Y-axis direction is also referred to as the river width direction. The description will be made with the direction orthogonal to both the X-axis direction and the Y-axis direction as the Z-axis direction.
　塗布ユニット２１は、基板Ｗに塗布液を塗布するものであり、フレーム部２２と口金部２３とを有している。フレーム部２２は、浮上ステージ部１０のＹ軸方向両側にそれぞれ配置される支柱２２ａを有しており、この支柱２２ａに口金部２３が設けられている。具体的には、支柱２２ａは、Ｙ軸方向（川幅方向）両側に固定して設けられており、後述する基板保持部３０の走行を妨げることのないように、基板保持部３０の走行経路よりも外側に配置されている。そして、これらの支柱２２ａに口金部２３が架け渡されており、口金部２３が浮上ステージ部１０を横切る状態で取り付けられている。また、支柱２２ａには昇降機構が設けられており、昇降機構を作動させることにより口金部２３がＺ方向に移動できるようになっている。すなわち、昇降機構により口金部２３が浮上ステージ部１０に対して接離動作できるようになっている。 The application unit 21 applies a coating solution to the substrate W, and includes a frame portion 22 and a base portion 23. The frame portion 22 has support columns 22a disposed on both sides in the Y-axis direction of the levitation stage unit 10, and a base portion 23 is provided on the support column 22a. Specifically, the support columns 22a are fixedly provided on both sides in the Y-axis direction (river width direction), so that the travel of the substrate holding unit 30 to be described later is prevented from being hindered. Is also arranged on the outside. And the base part 23 is spanned over these support | pillars 22a, and the base part 23 is attached in the state which crosses the floating stage part 10. FIG. The support 22a is provided with an elevating mechanism, and the base 23 can be moved in the Z direction by operating the elevating mechanism. That is, the base portion 23 can be moved toward and away from the floating stage portion 10 by the lifting mechanism.
　口金部２３は、塗布液を吐出するものであり、一方向に延びて形成されている。この口金部２３は、一方向に延びるスリットノズル２３ａ（図２参照）が形成されており、口金部２３内に貯留された塗布液をスリットノズル２３ａから吐出できるようになっている。具体的には、スリットノズル２３ａは、浮上ステージ部１０と対向する面に形成されており、口金部２３はスリットノズル２３ａが川幅方向に延びる状態で設置されている。そして、搬送される基板Ｗに対して口金部２３を昇降させて基板Ｗとスリットノズル２３ａとの距離を所定の距離に合わせた状態で、スリットノズル２３ａから塗布液を吐出することにより、川幅方向に一様な塗布膜が搬送方向に連続的に形成されるようになっている。そして、スリットノズル２３ａから塗布液を吐出させつつ、基板Ｗを移動させることにより、基板Ｗ上には、均一厚さの塗布膜が形成されるようになっている。 The base part 23 is for discharging the coating liquid and is formed extending in one direction. The base part 23 is formed with a slit nozzle 23a (see FIG. 2) extending in one direction so that the coating liquid stored in the base part 23 can be discharged from the slit nozzle 23a. Specifically, the slit nozzle 23a is formed on a surface facing the levitation stage unit 10, and the base unit 23 is installed in a state where the slit nozzle 23a extends in the river width direction. Then, the base 23 is moved up and down with respect to the substrate W to be transported, and the coating liquid is discharged from the slit nozzle 23a in a state where the distance between the substrate W and the slit nozzle 23a is adjusted to a predetermined distance. A uniform coating film is continuously formed in the transport direction. A coating film having a uniform thickness is formed on the substrate W by moving the substrate W while discharging the coating liquid from the slit nozzle 23a.
　また、基板浮上搬送装置１は、基板Ｗを浮上させつつ、一方向（本実施形態ではＸ軸方向）に搬送させるものである。基板浮上搬送装置１は、基板Ｗを浮上させる浮上ステージ部１０と、浮上ステージ部１０に浮上させた基板Ｗを保持し搬送させる基板搬送ユニット３とを有している。 Further, the substrate surfacing and conveying apparatus 1 conveys the substrate W in one direction (in this embodiment, the X-axis direction) while levitating. The substrate levitation transport apparatus 1 includes a levitation stage unit 10 that levitates the substrate W, and a substrate transport unit 3 that holds and transports the substrate W levitated on the levitation stage unit 10.
　浮上ステージ部１０は、基板Ｗを浮上させるものであり、本実施形態ではエア浮上機構を有している。浮上ステージ部１０は、基台１１上に平板部１２が設けられて形成されており、複数枚の平板部１２がＸ軸方向に沿って配列されて形成されている。すなわち、平板部１２は、平滑な基板浮上面１２ａ（図３参照）を有しており、それぞれの基板浮上面１２ａが均一高さになるように配列されている。そして、基板浮上面１２ａには、搬送させる基板Ｗとの間に空気層が形成されることにより基板Ｗを所定高さ位置に浮上させることができるようになっている。具体的には、平板部１２には、基板浮上面１２ａに開口する微小な噴出口（不図示）と吸引口（不図示）とが形成されており、噴出口とコンプレッサとが配管で接続され、吸引口と真空ポンプとが配管で接続されている。そして、噴出口から噴出されるエアと吸引口に発生する吸引力とをバランスさせることにより、基板Ｗが基板浮上面１２ａから所定高さに水平の姿勢で浮上させることができるようになっている。これにより、基板Ｗの平面姿勢（平面度という）を高精度に維持した状態で搬送できるようになっている。 The levitation stage unit 10 levitates the substrate W, and has an air levitation mechanism in this embodiment. The levitation stage unit 10 is formed by providing a flat plate portion 12 on a base 11, and is formed by arranging a plurality of flat plate portions 12 along the X-axis direction. That is, the flat plate portion 12 has a smooth substrate air bearing surface 12a (see FIG. 3), and the substrate air bearing surfaces 12a are arranged so as to have a uniform height. An air layer is formed between the substrate floating surface 12a and the substrate W to be transported, so that the substrate W can be floated to a predetermined height position. Specifically, the flat plate portion 12 is formed with a fine jet port (not shown) and a suction port (not shown) that open to the substrate floating surface 12a, and the jet port and the compressor are connected by a pipe. The suction port and the vacuum pump are connected by piping. Then, by balancing the air ejected from the ejection port and the suction force generated at the suction port, the substrate W can be floated in a horizontal posture at a predetermined height from the substrate air bearing surface 12a. . As a result, the substrate W can be transported in a state in which the planar posture (referred to as flatness) is maintained with high accuracy.
　また、浮上ステージ部１０の平板部１２は、そのＹ軸方向寸法が搬送される基板ＷのＹ軸方向寸法よりも小さく形成されており、基板浮上面１２ａ上に基板Ｗを載置すると、基板浮上面１２ａから基板ＷのＹ軸方向端部がはみ出した状態となる。このはみ出した部分（はみ出し領域Ｔ）を後述の基板搬送ユニット３で保持することにより、基板Ｗを搬送できるようになっている。この平板部１２のＹ軸方向寸法は、はみ出し領域Ｔが基板保持部３０で保持できる必要最小限の寸法になるように設定されている。すなわち、はみ出し領域Ｔのはみ出し量は、基板保持部３０で基板Ｗのはみ出し領域Ｔを保持した場合に、基板保持部３０と平板部１２との間に互いに接触することのない僅かな隙間が形成される程度に設定されている。 Further, the flat plate portion 12 of the levitation stage portion 10 is formed such that the dimension in the Y-axis direction is smaller than the dimension in the Y-axis direction of the substrate W to be transported, and when the substrate W is placed on the substrate floating surface 12a, the substrate The end of the substrate W in the Y-axis direction protrudes from the air bearing surface 12a. By holding the protruding portion (protruding region T) by the substrate transfer unit 3 described later, the substrate W can be transferred. The dimension of the flat plate portion 12 in the Y-axis direction is set so that the protruding region T has a minimum necessary size that can be held by the substrate holding portion 30. That is, the protruding amount of the protruding region T is such that a slight gap that does not contact each other is formed between the substrate holding unit 30 and the flat plate portion 12 when the substrate holding unit 30 holds the protruding region T of the substrate W. It is set to the extent to be.
　また、基板搬送ユニット３は、浮上状態の基板Ｗを搬送させるものであり、基板Ｗを保持する基板保持ユニット３０と、基板保持ユニット３０を走行させる搬送駆動部３１とを有している。 The substrate transport unit 3 transports the floating substrate W, and includes a substrate holding unit 30 that holds the substrate W and a transport drive unit 31 that travels the substrate holding unit 30.
　搬送駆動部３１は、基板保持ユニット３０を搬送方向に移動させるように構成されており、浮上ステージ部１０に沿って搬送方向に延びる搬送レール部３１ａと、この搬送レール部３１ａ上を走行するベース部３１ｂとで形成されている。具体的には、搬送方向に延びるように設けられた基台３１ｃ（図２参照）が浮上ステージ部１０の川幅方向両側に配置されており、それぞれの基台３１ｃ上に搬送レール部３１ａが設けられている。すなわち、搬送レール部３１ａが浮上ステージ部１０に沿って途切れることなく連続して設けられている。また、ベース部３１ｂは、凹形状に形成された板状部材であり、例えば図２、図６に示すように、搬送レール部３１ａの上面を覆うように設けられている。具体的には、ベース部３１ｂは、エアパッド３２を介して搬送レール部３１ａに覆うように設けられており、リニアモータ（不図示）を駆動させることにより、ベース部３１ｂが搬送レール部３１ａ上を走行するようになっている。すなわち、リニアモータを駆動制御することにより、ベース部３１ｂが搬送レール部３１ａ上を接触することなく走行し、所定の位置で停止できるようになっている。 The transport driving unit 31 is configured to move the substrate holding unit 30 in the transport direction, and includes a transport rail unit 31a that extends in the transport direction along the floating stage unit 10, and a base that travels on the transport rail unit 31a. It is formed with the part 31b. Specifically, bases 31c (see FIG. 2) provided so as to extend in the transport direction are disposed on both sides in the river width direction of the levitation stage unit 10, and transport rails 31a are provided on the respective bases 31c. It has been. That is, the conveyance rail part 31a is continuously provided along the levitation stage part 10 without interruption. Moreover, the base part 31b is a plate-shaped member formed in a concave shape, and is provided so as to cover the upper surface of the transport rail part 31a, for example, as shown in FIGS. Specifically, the base portion 31b is provided so as to cover the transport rail portion 31a via the air pad 32, and the base portion 31b moves over the transport rail portion 31a by driving a linear motor (not shown). It is supposed to run. That is, by driving and controlling the linear motor, the base portion 31b can travel without contacting the transport rail portion 31a and can be stopped at a predetermined position.
　また、基板保持ユニット３０は、基板Ｗを保持するものであり、ベース部３１ｂに取り付けられている。具体的には、図４に示すように、基板保持ユニット３０は、搬送方向に延びる保持フレーム部４０と、この保持フレーム部４０に取り付けられた吸着部４１とを有しており、この保持フレーム部４０がベース部３１ｂと昇降部４２を介して連結されている。そして、昇降部４２を駆動させることにより保持フレーム部４０が昇降動作し、吸着部４１が基板Ｗの裏面に対して接離できるようになっている。 The substrate holding unit 30 holds the substrate W and is attached to the base portion 31b. Specifically, as shown in FIG. 4, the substrate holding unit 30 includes a holding frame portion 40 extending in the transport direction and a suction portion 41 attached to the holding frame portion 40. The part 40 is connected to the base part 31b via the elevating part 42. Then, by driving the elevating unit 42, the holding frame unit 40 moves up and down, so that the suction unit 41 can come into contact with and separate from the back surface of the substrate W.
　保持フレーム部４０は、吸着部４１を取り付けるためのものであり、長尺の平板形状を有している。この保持フレーム部４０は、それぞれのベース部３１ｂ上に配置されており、ベース部３１ｂ上に昇降部４２を介して配置されている。この保持フレーム部４０は、浮上ステージ部１０を川幅方向に挟むように配置され、その長手方向が搬送方向に沿うように配置されている。そして、搬送駆動部３１を駆動させると、２つの保持フレーム部４０が同調し浮上ステージ部１０に沿って走行するようになっている。 The holding frame part 40 is for attaching the adsorbing part 41, and has a long flat plate shape. The holding frame portion 40 is disposed on each base portion 31b, and is disposed on the base portion 31b via an elevating portion 42. The holding frame portion 40 is disposed so as to sandwich the floating stage portion 10 in the river width direction, and the longitudinal direction thereof is disposed along the transport direction. When the conveyance driving unit 31 is driven, the two holding frame units 40 are synchronized and travel along the levitation stage unit 10.
　また、保持フレーム部４０の長手方向の長さは、搬送される基板Ｗの搬送方向長さに応じて形成されており、保持フレーム部４０の上端部分には、複数の吸着部４１が配置されている。すなわち、昇降部４２を駆動させて保持フレーム部４０が上昇するとすべての吸着部４１が一度に上昇し、保持フレーム部４０が下降するとすべての吸着部４１が一度に下降する。これにより、吸着部４１毎に昇降部４２を有していた従来に比べて構成が容易になり、制御が複雑化するのを回避することができる。 The length of the holding frame unit 40 in the longitudinal direction is formed according to the length of the substrate W to be transferred in the transfer direction, and a plurality of suction units 41 are arranged at the upper end portion of the holding frame unit 40. ing. That is, when the elevating part 42 is driven and the holding frame part 40 is raised, all the suction parts 41 are raised at once, and when the holding frame part 40 is lowered, all the suction parts 41 are lowered at once. As a result, the configuration is facilitated compared to the conventional case where the suction unit 41 has the elevating unit 42, and the control can be prevented from becoming complicated.
　また、本実施形態では、保持フレーム部４０には、それぞれの吸着部４１が等間隔に配置されており、搬送方向一方側端部から他方側端部までの寸法は、基板Ｗの搬送方向長さ以下になるように設定されている。すなわち、基板Ｗが浮上ステージに浮上している状態で、保持フレーム部４０を上昇させると、すべての吸着部４１が基板Ｗの裏面に当接し、保持フレーム部４０を下降させると、すべての吸着部４１が基板Ｗから離れるようになっている。 Further, in the present embodiment, the holding frame portion 40 has the respective suction portions 41 arranged at equal intervals, and the dimension from the one end portion in the transport direction to the other end portion is the length in the transport direction of the substrate W. It is set to be less than this. That is, when the holding frame portion 40 is raised while the substrate W is floating on the floating stage, all the suction portions 41 come into contact with the back surface of the substrate W, and when the holding frame portion 40 is lowered, all the suction portions are attracted. The part 41 is separated from the substrate W.
　また、吸着部４１は、基板Ｗを吸着保持するものであり、ほぼ直方体のブロック状に形成されている。基板保持ユニット３０は、その上面（吸着面３３）が浮上させた基板Ｗの下面の高さ位置と面位置になるように設定されている。そして、図５に示すように、吸着面３３には、開口部３４が形成されており、その開口部３４内に弾性変形可能な蛇腹形状の吸着パッド３５が埋設されている。この吸着パッド３５は、吸引力を発生させて基板Ｗを吸着保持するものであり、通常状態（基板Ｗがない状態）では、その先端が開口部３４から僅かに突出した状態で待機するように設定されている（図５（ａ）参照）。そして、基板浮上面１２ａに基板Ｗが載置されると基板浮上面１２ａから川幅方向にはみ出した部分が吸着パッド３５に当接する。この状態で吸着パッド３５に吸引力を発生させると、基板Ｗの下面が吸着パッド３５で吸引されつつ、その吸引状態を保ったまま、吸着パッド３５自体が開口部３４内に収縮して基板Ｗの下面が吸着面３３に当接し基板Ｗが保持されるようになっている（図５（ｂ）参照）。これにより、浮上ステージ部１０で浮上された基板Ｗが、川幅方向に亘って同じ浮上高さ位置を維持した状態で保持される。 Further, the suction part 41 is for holding the substrate W by suction, and is formed in a substantially rectangular parallelepiped block shape. The substrate holding unit 30 is set so that the upper surface (suction surface 33) thereof is at the height and surface position of the lower surface of the substrate W that has been levitated. As shown in FIG. 5, an opening 34 is formed in the suction surface 33, and an accordion-shaped suction pad 35 that can be elastically deformed is embedded in the opening 34. The suction pad 35 generates suction force and sucks and holds the substrate W. In a normal state (a state where there is no substrate W), the suction pad 35 waits with its tip slightly protruding from the opening 34. Has been set (see FIG. 5A). When the substrate W is placed on the substrate air bearing surface 12a, the portion protruding from the substrate air bearing surface 12a in the river width direction comes into contact with the suction pad 35. When a suction force is generated on the suction pad 35 in this state, the lower surface of the substrate W is sucked by the suction pad 35 while the suction pad 35 itself contracts into the opening 34 while maintaining the suction state. Is in contact with the suction surface 33 to hold the substrate W (see FIG. 5B). Thereby, the board | substrate W levitated by the levitating stage part 10 is hold | maintained in the state which maintained the same levitating height position over the river width direction.
　また、昇降部４２は、保持フレーム部４０をベース部３１ｂ上に支持しつつ昇降動作させるためのものであり、本実施形態では、図４に示すように、搬送方向両端部付近に１台ずつ、計２台設けられている。ここで、図６は、昇降部４２を搬送方向に見た図である。図６に示すように、昇降部４２は、くさび形のブロック４３を組み合わせて形成されており、三角柱形状のブロック４３の斜面同士が当接した状態でベース部３１ｂに固定されている。これらブロック４３のうち、一方のブロック４３ａは、ステー４４を介して保持フレーム部４０と連結されており、もう一方のブロック４３ｂは、ベース部３１ｂと連結されている。そして、一方のブロック４３ａにはアクチュエータ４５が設けられており、このアクチュエータ４５を駆動制御することにより、一方のブロック４３ａを他方のブロック４３ｂに対して斜面に沿って変位させることができる。すなわち、一方のブロック４３ａがＹ軸方向（例えばプラス側）に押圧されると、ブロック４３ａが斜面に沿って移動する結果、Ｚ方向（鉛直上向き）に変位して保持フレーム部４０を上昇させることができる（図６（ａ）→図６（ｂ））。また、一方のブロックが逆方向（例えばＹ軸方向マイナス側）に押圧されると、ブロック４３ａが斜面沿って移動する結果、Ｚ方向（鉛直下向き）に変位して保持フレーム部４０を下降させることができる（図６（ｂ）→図６（ａ））。このくさび形のブロック４３を組み合わせた昇降部４２を使用することにより、入力に対する保持フレーム部４０の昇降方向の動作精度を向上させることができ、基板Ｗに対する吸着部４１の位置制御を精度よく行えるようになっている。 Further, the elevating part 42 is for elevating operation while supporting the holding frame part 40 on the base part 31b. In this embodiment, as shown in FIG. 4, one unit is provided near both ends in the conveying direction. A total of two units are provided. Here, FIG. 6 is the figure which looked at the raising / lowering part 42 in the conveyance direction. As shown in FIG. 6, the elevating part 42 is formed by combining wedge-shaped blocks 43, and is fixed to the base part 31 b with the inclined surfaces of the triangular prism-shaped blocks 43 in contact with each other. Of these blocks 43, one block 43a is connected to the holding frame portion 40 via the stay 44, and the other block 43b is connected to the base portion 31b. One block 43a is provided with an actuator 45. By driving and controlling this actuator 45, one block 43a can be displaced along the slope with respect to the other block 43b. That is, when one block 43a is pressed in the Y-axis direction (for example, the plus side), the block 43a moves along the slope, and as a result, is displaced in the Z direction (vertically upward) to raise the holding frame portion 40. (FIG. 6 (a) → FIG. 6 (b)). Further, when one block is pressed in the reverse direction (for example, the negative side in the Y-axis direction), the block 43a moves along the slope, and as a result, is displaced in the Z direction (vertically downward) to lower the holding frame portion 40. (FIG. 6 (b) → FIG. 6 (a)). By using the elevating unit 42 combined with the wedge-shaped block 43, the operation accuracy of the holding frame unit 40 in the elevating direction with respect to the input can be improved, and the position control of the suction unit 41 with respect to the substrate W can be performed with high accuracy. It is like that.
　また、保持フレーム部４０には、保持フレーム部４０とベース部３１ｂとの連結を強化する強化支持部５０が設けられている。この強化支持部５０は、少なくとも基板処理時において、保持フレーム部４０とベース部３１ｂとが昇降部４２のみで連結されている場合に比べて、保持フレーム部４０とベース部３１ｂとの連結強度を向上させて、剛性不足から生じる振動の発生を抑えるものである。 Further, the holding frame portion 40 is provided with a reinforcing support portion 50 that strengthens the connection between the holding frame portion 40 and the base portion 31b. This reinforced support part 50 has a stronger connection strength between the holding frame part 40 and the base part 31b than when the holding frame part 40 and the base part 31b are connected only by the elevating part 42 at least during substrate processing. It improves and suppresses the generation of vibration caused by insufficient rigidity.
　強化支持部５０は、図４に示すように、保持フレーム部４０とベース部３１ｂとを連結するように設けられており、本実施形態では、図４に示すように、強化支持部５０は、搬送方向において、吸着部４１が取り付けられた位置に設けられている。すなわち、吸着部４１が配置される部分では、吸着部４１の自重の影響等により振動源になりやすいため、この吸着部４１直下に強化支持部５０が配置されることにより、保持フレーム部４０とベース部３１ｂとの連結を強化しつつ、振動の発生を効果的に抑えることができる。本実施形態では、強化支持部５０は、すべての吸着部４１直下に配置されている。 As shown in FIG. 4, the reinforcing support part 50 is provided so as to connect the holding frame part 40 and the base part 31 b. In this embodiment, as shown in FIG. 4, the reinforcing support part 50 is It is provided at a position where the suction part 41 is attached in the transport direction. That is, the portion where the suction portion 41 is disposed is likely to be a vibration source due to the influence of the weight of the suction portion 41 and the like, and therefore the reinforcement support portion 50 is disposed immediately below the suction portion 41, thereby Generation | occurrence | production of a vibration can be suppressed effectively, strengthening the connection with the base part 31b. In this embodiment, the reinforcement support part 50 is arrange | positioned directly under all the adsorption | suction parts 41. FIG.
　強化支持部５０は、図７に示すように、ベース部３１ｂ上に固定された支持本体部５１と、リニアガイド５２（ガイド部材）とを有しており、このリニアガイド５２と保持フレーム部４０とが連結されることによって形成されている。ここで、図７（ａ）は強化支持部５０を搬送方向に見た図、図７（ｂ）は強化支持部５０としてのリニアガイド５２をＹ軸方向に見た図である。 As shown in FIG. 7, the reinforced support portion 50 includes a support main body portion 51 fixed on the base portion 31 b and a linear guide 52 (guide member). The linear guide 52 and the holding frame portion 40 are provided. Are connected to each other. Here, FIG. 7A is a view of the reinforcing support portion 50 viewed in the transport direction, and FIG. 7B is a view of the linear guide 52 as the reinforcing support portion 50 viewed in the Y-axis direction.
　支持本体部５１は、断面Ｌ字型の平板部材であり、取付面５３を保持フレーム部４０側に対向する姿勢でベース部３１ｂ上にボルト５４で固定されている。取付面５３には、リニアガイド５２が設けられており、リニアガイド５２のレール５５がＺ方向（保持フレーム部４０の昇降方向）に延びる方向に取り付けられている。そして、リニアガイド５２のブロック５６が保持フレーム部４０と連結されている。これにより、保持フレーム部４０は、Ｚ方向のみの変位が許容されＺ方向以外の方向への変位が制限される。すなわち、保持フレーム部４０は、昇降部４２を駆動させた場合にはリニアガイド５２に沿ってスムーズに移動するが、Ｚ方向以外の方向への変位が制限されることにより、Ｚ方向以外の方向への変位（振動等）は制限される。 The support main body 51 is a flat plate member having an L-shaped cross section, and is fixed by bolts 54 on the base 31b in a posture in which the mounting surface 53 faces the holding frame 40 side. A linear guide 52 is provided on the mounting surface 53, and a rail 55 of the linear guide 52 is attached in a direction extending in the Z direction (the lifting direction of the holding frame portion 40). The block 56 of the linear guide 52 is connected to the holding frame portion 40. As a result, the holding frame portion 40 is allowed to be displaced only in the Z direction and is restricted from being displaced in directions other than the Z direction. That is, the holding frame part 40 moves smoothly along the linear guide 52 when the elevating part 42 is driven. However, the displacement in the direction other than the Z direction is limited, so that the direction other than the Z direction can be achieved. Displacement (vibration, etc.) is limited.
　また、この強化支持部５０には、変位制限機構６０が設けられている。この変位制限機構６０は、保持フレーム部４０が昇降方向に変位するのを制限するものである。具体的には、保持フレーム部４０には、リニアクランプ６２が設けられており、このリニアクランプ６２がリニアガイド５２のレールを挟持することにより昇降方向（Ｚ方向）への変位が拘束される。 Further, the reinforced support portion 50 is provided with a displacement limiting mechanism 60. The displacement limiting mechanism 60 limits the displacement of the holding frame portion 40 in the up and down direction. Specifically, the holding frame portion 40 is provided with a linear clamp 62, and the linear clamp 62 sandwiches the rail of the linear guide 52, thereby restraining displacement in the ascending / descending direction (Z direction).
　すなわち、図７（ｂ）に示すように、リニアクランプ６２は、クランプ本体６２ａと、クランプ本体６２ａに対して進退するくさび形のピストン部６２ｂと、ピストン部６２ｂとレールとの間に配置されるコンタクト部６２ｃとを有しており、保持フレーム部４０の昇降動作に応じてリニアクランプ６２がリニアガイド５２上を変位するように構成されている。そして、ピストン部６２ｂを駆動制御することにより、例えば、ピストン部６２ｂがクランプ本体６２ａ内に変位するとコンタクト部６２ｃがレール５５側に押圧されることにより、コンタクト部６２ｃ同士でレール５５を挟持し固定される。すなわち、レール５５上の所定の位置でリニアクランプ６２を作動させると、保持フレーム部４０の昇降方向の変位が制限され、その位置で保持フレーム部４０がリジットに固定されるようになっている。これにより、保持フレーム部４０とベース部３１ｂとの剛性をより高めることができ、強化支持部５０のみの場合に比べて振動の発生をより効果的に抑えることができる。 That is, as shown in FIG. 7B, the linear clamp 62 is disposed between the clamp body 62a, the wedge-shaped piston part 62b that moves forward and backward with respect to the clamp body 62a, and the piston part 62b and the rail. The linear clamp 62 is configured to displace on the linear guide 52 in accordance with the lifting and lowering operation of the holding frame portion 40. Then, by driving and controlling the piston portion 62b, for example, when the piston portion 62b is displaced into the clamp body 62a, the contact portion 62c is pressed toward the rail 55, so that the rail 55 is sandwiched and fixed between the contact portions 62c. Is done. That is, when the linear clamp 62 is operated at a predetermined position on the rail 55, the displacement of the holding frame portion 40 in the ascending / descending direction is limited, and the holding frame portion 40 is fixed to the rigid at that position. Thereby, the rigidity of the holding | maintenance frame part 40 and the base part 31b can be improved more, and generation | occurrence | production of a vibration can be suppressed more effectively compared with the case where only the reinforcement | strengthening support part 50 is used.
　本実施形態では、変位制限機構６０は、基板保持中に作動されるようになっている。すなわち、基板Ｗの搬入、搬出動作では、保持フレーム部４０が下降した位置に配置され、変位制限機構６０は作動しない。そして、浮上ステージ部１０に基板Ｗが載置されると、保持フレーム部４０が上昇し、吸着部４１が基板Ｗの裏面に当接して基板Ｗを吸着する。そして、この基板Ｗの保持姿勢が安定した状態になると変位制限機構６０が作動し、保持フレーム部４０の位置がリジットに固定されるようになっている。 In the present embodiment, the displacement limiting mechanism 60 is operated while holding the substrate. That is, in the loading / unloading operation of the substrate W, the holding frame portion 40 is disposed at the lowered position, and the displacement limiting mechanism 60 does not operate. Then, when the substrate W is placed on the levitation stage unit 10, the holding frame unit 40 rises, and the adsorption unit 41 contacts the back surface of the substrate W to adsorb the substrate W. When the holding posture of the substrate W becomes stable, the displacement limiting mechanism 60 is actuated so that the position of the holding frame portion 40 is fixed to the rigid.
　上記実施形態の基板浮上搬送装置によれば、昇降部４２とは別に強化支持部５０が設けられているため、ベース部３１ｂと保持フレーム部４０との一体性を強固にすることができる。すなわち、保持フレーム部４０には、すべての吸着部４１が取り付けられているため、搬送駆動部３１のベース部３１ｂが走行すると保持フレーム部４０に組付け精度、自重等による微少な振動が発生しやすくなる。この振動が、例えば塗布処理を行った場合に、基板Ｗ上に形成された塗布膜に塗布ムラを発生させる要因になるが、昇降部４２とは別に強化支持部５０を設けることによりベース部３１ｂと保持フレーム部４０との剛性が増し、搬送時に発生する振動が抑えられ、塗布処理等の基板処理を行った場合に振動による影響を抑えることができる。 According to the substrate levitation transfer apparatus of the above embodiment, since the reinforcing support portion 50 is provided separately from the elevating portion 42, the integrity of the base portion 31b and the holding frame portion 40 can be strengthened. In other words, since all the suction portions 41 are attached to the holding frame portion 40, when the base portion 31b of the transport driving portion 31 travels, a slight vibration is generated in the holding frame portion 40 due to assembly accuracy, own weight, and the like. It becomes easy. This vibration causes a coating unevenness in the coating film formed on the substrate W when, for example, a coating process is performed, but the base portion 31b is provided by providing the reinforcing support portion 50 separately from the elevating portion 42. And the holding frame portion 40 are increased in rigidity, and vibrations generated during conveyance can be suppressed, and the influence of vibrations can be suppressed when substrate processing such as coating processing is performed.
　また、上記実施形態では、変位制限機構６０にリニアクランプ６２である場合について説明したが、図８に示すように、リンククランプ６３を用いるものであってもよい。具体的には、吸着部４１直下のベース部３１ｂ上に固定して配置される支柱部６４と、この支柱部６４に設けられたリンククランプ６３とで形成されており、リンククランプ６３は、空圧制御されることにより、レバー部６３ａが回動し、保持フレーム部４０をロックできるようになっている。すなわち、リンククランプ６３のレバー部６３ａは、ピストン６３ｂの動作に応じて保持フレーム部４０に対して接離できるように形成されており、レバー部６３ａの先端が保持フレーム部４０の下端を支持することにより保持フレーム部４０の位置がリジットに固定されるようになっている。本実施形態では、保持フレーム部４０が基板保持中の高さ位置に達した際に、ピストン６３ｂがレバー部６３ａを押圧することによりレバー部６３ａが回動し、レバー部６３ａ先端が保持フレーム部４０の下端を支持するようになっている。このような変位制限機構６０であっても、保持フレーム部４０とベース部３１ｂとの剛性をより高めることができ、強化支持部５０のみの場合に比べて振動の発生をより効果的に抑えることができる。 In the above embodiment, the case where the displacement limiting mechanism 60 is the linear clamp 62 has been described. However, as shown in FIG. 8, a link clamp 63 may be used. Specifically, it is formed of a support column 64 fixedly disposed on the base portion 31b immediately below the suction unit 41, and a link clamp 63 provided on the support column 64. By controlling the pressure, the lever portion 63a rotates and the holding frame portion 40 can be locked. That is, the lever part 63a of the link clamp 63 is formed so as to be able to contact and separate from the holding frame part 40 according to the operation of the piston 63b, and the tip of the lever part 63a supports the lower end of the holding frame part 40. Thus, the position of the holding frame portion 40 is fixed to the rigid. In the present embodiment, when the holding frame portion 40 reaches the height position during holding the substrate, the piston 63b presses the lever portion 63a to rotate the lever portion 63a, and the tip of the lever portion 63a is the holding frame portion. The lower end of 40 is supported. Even with such a displacement limiting mechanism 60, the rigidity of the holding frame portion 40 and the base portion 31b can be further increased, and the generation of vibrations can be more effectively suppressed as compared with the case of only the reinforcing support portion 50. Can do.
　また、上記実施形態では、変位制限機構６０が設けられた例について説明したが、変位制限機構６０を設けることなく、強化支持部５０のみの構成であってもよい。例えば、強化支持部５０としてリニアガイド５２、ボールネジなどの直動ガイド（ガイド部材）のみを使用して、保持フレーム部４０とベース部３１ｂとを連結することにより、保持フレーム部４０とベース部３１ｂとの相対的変位が特定の一方向のみに限定され、特定の方向以外の方向への変位が制限される。これにより、保持フレーム部４０とベース部３１ｂとの連結が昇降部４２のみの場合に比べて振動が発生するのを抑えることができる。 In the above embodiment, the example in which the displacement limiting mechanism 60 is provided has been described. However, the configuration having only the reinforcing support portion 50 may be used without providing the displacement limiting mechanism 60. For example, only the linear guide 52 and the linear motion guide (guide member) such as a ball screw are used as the reinforcing support portion 50, and the holding frame portion 40 and the base portion 31b are connected by connecting the holding frame portion 40 and the base portion 31b. Relative displacement is limited to only one specific direction, and displacement in directions other than the specific direction is limited. Thereby, it can suppress that a vibration generate | occur | produces compared with the case where the connection of the holding | maintenance frame part 40 and the base part 31b is only the raising / lowering part 42. FIG.
　また、上記実施形態では、強化支持部５０にガイド部材を使用する例について説明したが、強化支持部５０がバネ部７０を有しており、このバネ部７０の復元力により保持フレーム部４０とベース部３１ｂとの連結を強化するものであってもよい。例えば、図９に示すように、棒状の軸本体７１と、この軸本体７１に設けられるバネ部７０とで形成されている。このバネ部７０は、保持フレーム部４０が基板保持中の高さ位置に位置した状態で、所定量だけ収縮させて設けられている。これにより、保持フレーム部４０が基板保持中である場合には、バネ部７０の復元力が保持フレーム部４０とベース部３１ｂとの連結を強固する方向に作用するため、昇降部４２のみの場合に比べて保持フレーム部４０とベース部３１ｂとの剛性が向上し振動が発生するのを抑えることができる。 In the above-described embodiment, the example in which the guide member is used for the reinforcing support portion 50 has been described. However, the reinforcing support portion 50 includes the spring portion 70, and the holding frame portion 40 and the holding frame portion 40 are connected by the restoring force of the spring portion 70. The connection with the base portion 31b may be strengthened. For example, as shown in FIG. 9, it is formed by a rod-shaped shaft main body 71 and a spring portion 70 provided on the shaft main body 71. The spring portion 70 is provided by being contracted by a predetermined amount in a state where the holding frame portion 40 is located at a height position during substrate holding. As a result, when the holding frame portion 40 is holding the substrate, the restoring force of the spring portion 70 acts in the direction of strengthening the connection between the holding frame portion 40 and the base portion 31b. In comparison with this, the rigidity of the holding frame portion 40 and the base portion 31b is improved, and the occurrence of vibration can be suppressed.
　また、上記実施形態では、強化支持部５０を設ける位置について、吸着部４１が設けられた位置（吸着部４１直下の位置）すべてに設ける例について説明したが、吸着部４１が設けられた位置から適宜選択し配置する構成であってもよい。また、強化支持部５０が、吸着部４１が設けられた位置以外の位置に設ける構成であってもよく、保持フレーム部４０とベース部３１ｂとの剛性が比較的低いところ、すなわち、保持フレーム部４０の搬送方向中央部、保持フレーム部４０の搬送方向端部に適宜分散して配置してもよい。 Moreover, although the said embodiment demonstrated the example provided in all the positions (position directly under the adsorption | suction part 41) where the adsorption | suction part 41 was provided about the position which provides the reinforcement | strengthening support part 50, from the position where the adsorption | suction part 41 was provided. It may be configured to be appropriately selected and arranged. Further, the reinforcing support part 50 may be provided at a position other than the position where the suction part 41 is provided, and the rigidity of the holding frame part 40 and the base part 31b is relatively low, that is, the holding frame part. The central portion of the transport direction of 40 and the end portion of the holding frame portion 40 in the transport direction may be appropriately dispersed.
　また、上記実施形態では、基板Ｗ浮上搬送装置を塗布装置と組み合わせる例について説明したが、露光機、検査装置、マーキング装置など、さまざまな基板処理装置と組み合わせることができる。そして、基板Ｗ搬送中の振動の発生を抑えることにより、振動が基板処理に影響を与えるのを極力抑えることができる。 In the above-described embodiment, the example in which the substrate W floating conveyance device is combined with the coating device has been described. However, the substrate W can be combined with various substrate processing devices such as an exposure machine, an inspection device, and a marking device. Then, by suppressing the occurrence of vibration during the conveyance of the substrate W, it is possible to suppress the vibration from affecting the substrate processing as much as possible.
　１　基板浮上搬送装置
　２　塗布装置
　１０　浮上ステージ部
　３０　基板保持ユニット
　３１　搬送駆動部
　３１ｂ　ベース部
　４０　保持フレーム部
　４１　吸着部
　４２　昇降部
　５０　強化支持部
　６０　変位制限機構 DESCRIPTION OF SYMBOLS 1 Substrate floating conveyance apparatus 2 Coating apparatus 10 Levitation stage part 30 Substrate holding unit 31 Conveyance drive part 31b Base part 40 Holding frame part 41 Adsorption part 42 Lifting part 50 Strengthening support part 60 Displacement limiting mechanism

Claims (8)

  1. 　基板を浮上させる浮上ステージと、
    　前記浮上ステージで浮上された基板を保持する基板保持ユニットと、
    　前記基板保持ユニットで基板が保持された状態で前記基板保持ユニットを移動させることにより基板を搬送方向に移動させる搬送駆動部と、
    を備え、
    　前記基板保持ユニットは、基板を吸着する複数の吸着部と、これらすべての吸着部を搬送方向に並んだ状態で取り付ける保持フレーム部とを有しており、
    　前記保持フレーム部は、前記搬送駆動部に昇降部を介して設けられており、前記昇降部を動作させることにより、前記保持フレーム部が昇降動作を行って、すべての前記吸着部が基板に対して接離動作するように形成されていることを特徴とする基板浮上搬送装置。     A levitation stage for levitating the substrate;
    A substrate holding unit for holding the substrate levitated on the levitation stage;
    A transport driving unit that moves the substrate in the transport direction by moving the substrate holding unit while the substrate is held by the substrate holding unit;
    With
    The substrate holding unit has a plurality of suction portions for sucking a substrate, and a holding frame portion for attaching all these suction portions in a state of being aligned in the transport direction,
    The holding frame unit is provided in the transport driving unit via an elevating unit. By operating the elevating unit, the holding frame unit performs an elevating operation, and all the adsorbing units are attached to the substrate. The substrate floating and conveying device is formed so as to be moved toward and away from the substrate.
  2. 　前記搬送駆動部は、前記浮上ステージに沿って移動するベース部を有しており、このベース部と、前記保持フレーム部とが前記昇降部で連結されており、この昇降部とは別に前記ベース部と前記保持フレーム部との連結を強化する強化支持部が設けられていることを特徴とする請求項１に記載の基板浮上搬送装置。 The transport driving unit includes a base unit that moves along the levitation stage. The base unit and the holding frame unit are connected by the elevating unit, and the base is separated from the elevating unit. The substrate levitation transfer apparatus according to claim 1, further comprising a reinforcing support portion that reinforces the connection between the portion and the holding frame portion.
  3. 　前記強化支持部は、特定の一方向のみの変位を許容するガイド部材を有しており、このガイド部材により前記ベース部と前記保持フレーム部とが連結されていることを特徴とする請求項２に記載の基板浮上搬送装置。 3. The reinforcing support portion includes a guide member that allows displacement in only one specific direction, and the base portion and the holding frame portion are connected by the guide member. The substrate levitation transfer apparatus described in 1.
  4. 　前記強化支持部は、搬送方向において、前記吸着部が設けられた位置に配置されていることを特徴とする請求項２又は３に記載の基板浮上搬送装置。 4. The substrate levitating / conveying apparatus according to claim 2, wherein the reinforcing support part is arranged at a position where the suction part is provided in the conveying direction.
  5. 　前記強化支持部は、前記吸着部が設けられた位置すべてに配置されていることを特徴とする請求項２～４のいずれかに記載の基板浮上搬送装置。 The substrate levitation transfer apparatus according to any one of claims 2 to 4, wherein the reinforcing support portion is arranged at all positions where the suction portion is provided.
  6. 　前記強化支持部には、前記保持フレームの昇降動作に応じて伸縮動作するバネ部が設けられており、前記バネ部の復元力により前記ベース部と前記保持フレームとの連結が強化されることを特徴とする請求項２～５のいずれかに記載の基板浮上搬送装置。 The reinforcing support part is provided with a spring part that expands and contracts according to the raising and lowering operation of the holding frame, and the connection between the base part and the holding frame is strengthened by the restoring force of the spring part. 6. The substrate floating and conveying apparatus according to claim 2, wherein
  7. 　前記強化支持部は、前記保持フレームの昇降方向の変位が制限される変位制限機構が設けられていることを特徴とする請求項２～５のいずれかに記載の基板浮上搬送装置。 The substrate levitation transfer apparatus according to any one of claims 2 to 5, wherein the reinforced support portion is provided with a displacement limiting mechanism for limiting displacement of the holding frame in the up-and-down direction.
  8. 　前記変位制限機構は、前記ガイド部材上における前記保持フレームの昇降方向の変位が拘束されることにより形成されていることを特徴とする請求項７に記載の基板浮上搬送装置。 The substrate levitation transfer apparatus according to claim 7, wherein the displacement limiting mechanism is formed by restraining displacement of the holding frame on the guide member in the up and down direction.
PCT/JP2017/009363 2016-03-22 2017-03-09 Substrate floating transport device WO2017163887A1 (en)

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