TW201214609A - Substrate conveying apparatus - Google Patents

Substrate conveying apparatus Download PDF

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Publication number
TW201214609A
TW201214609A TW100127327A TW100127327A TW201214609A TW 201214609 A TW201214609 A TW 201214609A TW 100127327 A TW100127327 A TW 100127327A TW 100127327 A TW100127327 A TW 100127327A TW 201214609 A TW201214609 A TW 201214609A
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TW
Taiwan
Prior art keywords
substrate
guide
platform
floating
guide body
Prior art date
Application number
TW100127327A
Other languages
Chinese (zh)
Inventor
Tomoo Uchikata
Daisuke Okuda
Shunichi Okamoto
Yuya Miyajima
Takamasa Himeno
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Toray Eng Co Ltd
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Publication date
Priority claimed from JP2011160641A external-priority patent/JP5888891B2/en
Application filed by Toray Eng Co Ltd filed Critical Toray Eng Co Ltd
Publication of TW201214609A publication Critical patent/TW201214609A/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90Devices for picking-up and depositing articles or materials
    • B65G47/91Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/911Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with air blasts producing partial vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063Transporting devices for sheet glass
    • B65G49/064Transporting devices for sheet glass in a horizontal position
    • B65G49/065Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G51/00Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
    • B65G51/02Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
    • B65G51/03Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04Arrangements of vacuum systems or suction cups
    • B65G2249/045Details of suction cups suction cups

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The objective of the present invention is to provide a substrate conveying apparatus capable of restraining dry and non-uniformity of the coated film on a substrate to convey the substrate and capable of restraining the generation of particles as well although there is the state of huge error on the manufacturing and assembly of the apparatus. The solution of the present invention comprises: a substrate conveying apparatus for guiding a substrate floating on the surface of a platform through a substrate guiding component and for conveying the substrate, wherein the substrate guiding component comprises: a substrate guiding component body restraining the substrate by leaning against a side of the substrate and capable of being displaced in the direction perpendicular to the surface of the platform; a floating unit capable of floating the substrate guiding component body from the surface of the platform; and a pushing means that pushes the substrate guiding component body toward the surface side of the platform. The substrate guiding component body has a substrate leaning part for leaning against the side of the substrate while the height position of the substrate leaning part is held at the height position of the substrate floating on the surface of the platform through the floating unit and the pushing means.

Description

201214609 六、發明說明: 【發明所屬之技術領域】 [0001] 本發明是關於由平台(stage)使基板(substrate)浮 起並運送之基板運送|置。 【先前技術】 [0002] 以往例如在平面面板顯示器(FPD:Flat Panel Display) 的微影 (ph〇t〇iith〇graphy) 的技術領域中 ,基板 運送裝置被使驗切練進行狀處理㈣板處理裝 0 置將基板運送到下—個製程中的基板處理裝置》其中浮 起基板運送裝置與由機械手(r〇b〇t hand)等構成的運送 裝置比較,因無基板的姿勢變化的動作,故具有可縮短 作業時間(tact time)之優點。201214609 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a substrate transporting and transporting a substrate by a stage. [Prior Art] [0002] In the technical field of, for example, lithography of a flat panel display (FPD: Flat Panel Display), the substrate transport apparatus is subjected to inspection and processing (four) boards. The processing apparatus transports the substrate to the substrate processing apparatus in the next process. The floating substrate transport apparatus is compared with the transport apparatus consisting of a robot or the like, and the posture of the substrate is changed. The action has the advantage of shortening the tact time.

一般在浮起基板運送裝置中具備藉由使空氣由平台喷 出並在基板與平台表面之間形成空氣層,龍使基板浮 起,將浮起的基板導引到規定的方向之基板導件(運送構 件)。该基板導件是藉由抵接基板限制浮起的基板的移動 的構件,可藉由在基板導件抵接基板的狀態下進行運送 動作,將基板導引(運送)到規定的方向。 例如在下述的專利文獻〗中記載有配設由平台的表面 突出的滾輪(roller)(運送構件),使基板的背面抵接該 滾輪,藉由在該狀態下使滾輪旋轉以運送基板的構成。 但是,若使滾輪抵接基板的背面,則因塗佈於基板的表 面的塗佈膜的乾燥狀態在抵接滾輪的部分與未抵接滾輪 的部分不同,故有成為乾燥不均的原因之虞。因此,如 100127327 顯示於下述的專利文獻1的圖10,也記載有如下之構成: 基板導件在運送方向具備複數個在與平台的表面成垂直 表單編號A0101 第3頁/共44頁 1003351886-0 201214609 的方向具有旋轉軸(rotating shaft)的導滾子(guide roller),透過藉由使基板的側面抵接該導滾子,在該狀 態下使導滚子旋轉而運送基板的構成,抑制乾燥不均。 [專利文獻1 ]日本國特開20 08-1 66359號公報 【發明内容】 [0003] 但是,在上述的浮起基板運送裝置(基板運送裝置)中 有即使是使基板的侧面抵接複數個導滾子的情形也無法 抑制乾燥不均的問題。亦即,在記載於專利文獻1的基板 運送裝置中因藉由導滾子限制基板的側面,故在由平台 露出基板的一部分的狀態下被運送。亦即,平台寬比基 板的尺寸小而被設定。因在該狀態下,形成於運送中的 基板的塗佈膜在基板位於平台上的部分與由平台露出的 部分乾燥狀態不同,故有塗佈膜形成有乾燥不均之虞的 問題。 此處,為了使基板全面的乾燥狀態均勻,作成如下之 構成也被考慮:使基板全面對向於平台表面而設定平台寬 比基板的尺寸大,使導滾子露出到平台的表面而抵接基 板的側面。但是,一般平台的表面有遍及縱向具有平面 度誤差(flatness error)的情形,而且,有導滚子中 的排列配置的真直度(straightness)具有誤差的情形。 因此,當該等裝置的製造上及組裝上的誤差大時,有無 法有效地保持導滾子與平台的表面的微小間隙,會因導 滾子與平台的表面接觸而產生微粒(particle)的問題。 本發明是鑑於上述的問題點所進行的創作,其目的為 提供一種基板運送裝置,可抑制基板上的塗佈膜產生乾 燥不均而運送基板,而且,即使是裝置的製造上及組裝 100127327 表單編號 A0101 第 4 頁/共 44 頁 1003351886-0 201214609 上的誤差大的情形也能抑制微粒的產生。 為了解決上述課題,本發明的基板運送裝置,一邊藉 由基板導件導引由平台的表面使其浮起的基板—邊運 送,其特徵為:前述基板導件包含:藉由抵接基板的側面 限制基板,並且可位移於與平台的表面垂直的方向之基 板導件本體;由平台的表面使前述基板導件本體浮起之 浮起單元;將前述基板導件本體推迫於平台的表面侧之 推迫手段,前述基板導件本體具有抵接基板的側面的基 Q 板㈣部,該基板抵接部的高度位置藉丨前述浮起單元 與前述推迫手段被維持於由平台的表面浮起的基板的高 度位置。 依照上述基板運送襄置,因抵接基板的侧面限制基板 ,故可抑制基板上的塗_產生乾燥不均而運送基板。 而且,因基板導件本體的基板抵接部的高度位置藉由前 述浮起單元與前述推迫手段維持於由平⑽ 基板的高度位置,故即使是產生平台的平面度誤差等裝 ◎ 置的裝xe上及組裝上的誤差的情形,也能抑制微粒的產 生。具體上’基板導件本體藉由浮起單元由平台的表面 受到浮起力,而且,藉由推迫手段被緊壓於平台的表面 侧。亦即,基板導件本體被保持於浮起單元的浮起力與 推迫手段的推迫力平衡的位置。而且,正一邊將基板限 制於基板導件’-邊使基板導件行线將基板運送於平 台的運送方向的時候’即使行走於平台的平面度產生擾 動(tUrbUleilCe)的部分,基板導件本體也會一邊受到浮 起力’ -邊藉由推迫手段被緊壓於平台的表面侧,故基 板導件本體可追蹤平台的表面而行走並運送基板。因此 100127327 表單編號A〇101 第5頁/共44頁 1003351886-0 201214609 ,即使是產生裝置的製造上及組裝上的誤差的情形,也 藉由基板導件本體的浮起量被㈣_定而*會使基板導 件本體接觸平台的表面,故可抑洲基板導件接觸平台 的表面所造成的微粒的產生。 具體的前述基板導件的實施態樣能以如下之構成:前 述基板導件在與前述平台的表面對向的位置包含氣塾 (air pad),前述浮起單元藉由空氣被供給到前述氣墊 而由前述氣墊朝前述平台的表面使空氣喷出並由平台表 面使前述基板導件本體浮起。 而且,能以如下之構成:前述浮起單元的氣墊藉由與 月'J述基板導件本體的基板抵接部不同體而形成。 依照該構成,因可作成基板不直接抵接氣墊的構成’ 故可抑制因基板的抵接而使氣塾的安裝位置變化。 而且’也可以作成如下之構成:前述浮起單元的氣墊 配設於前述平台中的基板運送區域以外的位置。 依照該構成,因可防止由氣墊喷出的空氣直接碰觸平 台中的基板被運送的基板運送區域,故可抑制平台中的 基板運送區域的溫度變化。據此,可抑制形成於基板上 的塗佈膜的乾燥不均。 而且,另一個具體的前述基板導件的實施態樣能以如 下之構成:前述基板導件在與平台的表面對向的前述基板 導件本體的底面部包含氣墊,前述浮起單元藉由空氣被 供給到前述氣塾而由前述氣墊使空氣喷出並由平台表面 使前述基板導件本體浮起。 而且’也可以作成如下之構成:前述基板導件更包含 支撐前述基板導件本體的導件支撐部,藉由該導件支撐 100127327 1003351886-0 第6頁/共44頁 表單編號A0101 201214609 部’前述基板導件本體可位移於對平台的表面接離 (attach and detach)的方向而被支撐,於彈簧構件在 前述導件支撐部與基板導件本體之間收縮的狀態下被配 設,藉由該彈簧構件,基板導件本體被推迫於平台 面側。 'Generally, the floating substrate transfer device is provided with a substrate guide that ejects air from the platform and forms an air layer between the substrate and the surface of the platform, and floats the substrate to guide the floating substrate to a predetermined direction. (transporting member). The substrate guide is a member that restricts the movement of the floating substrate by abutting the substrate, and the substrate can be guided (conveyed) in a predetermined direction by performing a transport operation while the substrate guide abuts against the substrate. For example, in the following patent document, a roller (transport member) that protrudes from the surface of the stage is disposed, and the back surface of the substrate is brought into contact with the roller, and the roller is rotated in this state to transport the substrate. . However, when the roller is brought into contact with the back surface of the substrate, the dry state of the coating film applied to the surface of the substrate is different between the portion that abuts the roller and the portion that does not abut the roller, and thus the drying is uneven. Hey. Therefore, as shown in Fig. 10 of Patent Document 1 below, the substrate guide has a configuration in which a plurality of substrate guides are perpendicular to the surface of the platform in the transport direction. Form No. A0101 Page 3 / Total 44 pages 1003351886 a guide roller having a rotating shaft in the direction of 201214609, and transmitting a substrate by rotating the guide roller in this state by abutting the side surface of the substrate against the guide roller. Inhibition of uneven drying. [Patent Document 1] Japanese Laid-Open Patent Publication No. 20 08-1 66359. [0003] However, in the above-described floating substrate transfer device (substrate transfer device), even a plurality of side faces of the substrate are abutted. The case of the guide roller also cannot suppress the problem of uneven drying. In the substrate transfer device described in Patent Document 1, since the side surface of the substrate is restricted by the guide roller, a part of the substrate is exposed by the land. That is, the platform width is set smaller than the size of the substrate. In this state, the coating film of the substrate formed on the substrate is different from the portion in which the substrate is on the stage and the portion in which the substrate is exposed, and the coated film has a problem of uneven drying. Here, in order to make the entire surface of the substrate uniform, it is also considered to have a configuration in which the substrate is entirely opposed to the surface of the stage, the platform width is set to be larger than the size of the substrate, and the guide roller is exposed to the surface of the stage to abut. The side of the substrate. However, the surface of a general platform has a flatness error throughout the longitudinal direction, and there is a case where the straightness of the arrangement of the guide rollers has an error. Therefore, when the manufacturing and assembly errors of the devices are large, there is a possibility that the minute gap between the guide roller and the surface of the platform cannot be effectively maintained, and particles are generated due to contact between the guide roller and the surface of the platform. problem. The present invention has been made in view of the above problems, and an object of the invention is to provide a substrate transport apparatus capable of suppressing drying unevenness of a coating film on a substrate and transporting the substrate, and even if the apparatus is manufactured and assembled in a form of 100127327 No. A0101 Page 4 of 44 1003351886-0 201214609 The large error can also suppress the generation of particles. In order to solve the above problems, the substrate transfer device of the present invention transports a substrate that is floated by the surface of the stage by a substrate guide, wherein the substrate guide includes: abutting the substrate a substrate guide body that laterally limits the substrate and is displaceable in a direction perpendicular to a surface of the platform; a floating unit that floats the substrate guide body by a surface of the platform; and urges the substrate guide body to a surface of the platform The substrate guiding body has a base Q plate (four) portion abutting the side surface of the substrate, and the height position of the substrate abutting portion is maintained on the surface of the platform by the floating unit and the pushing means The height position of the floating substrate. According to the substrate transporting device described above, since the substrate is restricted by the side surface of the substrate, it is possible to suppress the coating on the substrate to cause unevenness in drying and transport the substrate. Further, since the height position of the substrate abutting portion of the substrate guide main body is maintained at the height position of the flat (10) substrate by the floating unit and the pressing means, even if a flatness error of the stage is generated, In the case of loading xe and assembly errors, the generation of particles can also be suppressed. Specifically, the substrate guide body is subjected to a floating force by the surface of the platform by the floating unit, and is pressed against the surface side of the platform by the pushing means. That is, the substrate guide body is held at a position where the floating force of the floating unit is balanced with the pushing force of the pushing means. Moreover, while the substrate is being confined to the substrate guide '- while the substrate guide row is transporting the substrate in the transport direction of the platform', even if the flatness of the platform is generated, the portion of the substrate is disturbed (tUrbUleilCe), the substrate guide body It is also pressed against the surface side of the platform by the pushing force, so that the substrate guide body can follow the surface of the platform to walk and transport the substrate. Therefore, 100127327 Form No. A〇101, Page 5 of 44, 1003351886-0 201214609, even if the manufacturing device is manufactured and assembled, the amount of floating of the substrate guide body is determined by (4) * The substrate guide body is brought into contact with the surface of the platform, so that the generation of particles caused by the surface of the substrate guide contacting the platform can be suppressed. Specifically, the embodiment of the substrate guide can be configured such that the substrate guide includes an air pad at a position facing the surface of the platform, and the floating unit is supplied to the air cushion by air. Air is ejected from the surface of the aforementioned platform by the aforementioned air cushion and the substrate guide body is floated by the surface of the platform. Further, the air cushion of the floating unit may be formed by a different body from the substrate abutting portion of the substrate guide main body. According to this configuration, since the configuration in which the substrate does not directly contact the air cushion can be formed, it is possible to suppress the change in the mounting position of the air dam due to the contact of the substrate. Further, the air cushion of the floating unit may be disposed at a position other than the substrate transporting region in the stage. According to this configuration, it is possible to prevent the air ejected from the air cushion from directly colliding with the substrate transporting region on which the substrate in the stage is transported, so that the temperature change of the substrate transporting region in the stage can be suppressed. According to this, drying unevenness of the coating film formed on the substrate can be suppressed. Furthermore, another specific embodiment of the substrate guide can be configured such that the substrate guide includes an air cushion on a bottom surface portion of the substrate guide body opposite to a surface of the platform, and the floating unit is air The gas is supplied to the gas chamber to eject the air by the air cushion and to float the substrate guide body by the surface of the platform. Further, 'the following configuration may be adopted: the substrate guide further includes a guide supporting portion for supporting the substrate guide body, and the guide member supports 100127327 1003351886-0 page 6/44 page form number A0101 201214609' The substrate guide body is displaceably supported in a direction of attaching and detaching the surface of the platform, and is disposed in a state in which the spring member is contracted between the guide support portion and the substrate guide body. From the spring member, the substrate guide body is urged to the deck surface side. '

依照該構成,可藉由前述彈簧構件的推迫力與前塊v 起單元的浮起力平衡,在基板導件本_底面部與平台年 的表面之間形成有規定的間隙,前述基板導件本體的ΰ 板抵接部可維持於由平台的表面浮起的基板的高度位^ 而且,也可以作成如下之構成:在前述導件支標部 前述基板導件本體被讀的近旁形成有吸引部,該、 部開口於前述基板抵接部側β ΛAccording to this configuration, a predetermined gap can be formed between the bottom surface of the substrate guide and the surface of the platform year by the biasing force of the spring member and the floating force of the front block v, and the substrate guide can be formed. The yoke abutting portion of the main body may be maintained at a height position of the substrate floating on the surface of the platform, or may be configured to be formed in the vicinity of the substrate guide main body to be read at the guide member branch portion. a portion that is open on the side of the substrate abutting portion β Λ

依照該構成,在前述基㈣件本體對前料件 相對地位移時,有因該雙方的接觸狀態而產生微粒部 能性。假設是產生微粒的情形,也能藉由微粒被由 部的開口吸引而抑難粒擴散至基板抵接部側。 而且,也能以如下之構成:前述導件支擇部包含延伸 於前述基板抵接部側料子(eQver),該蓋子 述吸引部關口還相m基料件本_全^別 被配設,在前述蓋子與前述基板抵接部之間形成有間隙 〇 依照該構成’當由吸引部 丨P的開口產生吸引力時,因太 前述蓋子與基板抵接部之問*丄 ^ 因在 產生朝向吸引部的開口的吸 引力,故可抑制因前述導侔^ Μ口的及 的接觸而產生的微軚落下到基==述基板導件本體 100127327 表單編號Α0101 第7頁/共从冥 面側。 1003351886-0 201214609 ―」【發明的功效】 依照本發明的基板運送裝置,可抑制基板上的塗佈臈 產生乾燥不均而運送基板,而且,即使是裝置的製造上 及組裝上的誤差大的情形也能抑制微粒的產生。 【實施方式】 [0005] .. m 使用圖面說明與本發明的基板運送裝置有關的實施的 形態。 [實施例一] 圖1是顯示基板運送裝置的一實施形態之俯視圖,圖2 &玫大基板運送裝置的一單元之俯視圖,圖3是基板運送 裝置的一單元之侧視圖,圖4是基板運送裝置的一單元之 前視圖。 在圖1〜圖4中,基板運送裝置1為用以在使基板2浮起 的狀態下運送基板2的裝置,為由上游侧的基板處理裝置 將基板2運送到下一個製程的下游側的基板處理裝置之裝 置 。例如藉由吐出光阻液等的塗佈液的塗佈装置在基板2 圯成塗佈膜後,將基板2運送到使塗佈膜乾燥的乾燥裝 置時,可在使由塗佈裝置供給的基板2浮起的狀態下原封 動地不改變方向而運送到乾燥裝置。 社以下的說明中,擬設基板2被運送的運送方 方向’設與X軸方向在水平面上正交的方向為W 向進行=交於X袖方向Μ轴方向的雙方的方向為2轴方 100127327 台單具有平台單元10與運送單元2。’在平 β 的¥轴方向兩侧配置有運送單元20。平台單 的構V可將被承載的基板2保持於浮起的 第8頁/共44頁 1003351886-0 201214609 狀態。而且,運送單元20是一邊限制浮起的基板2,一邊 將基板2運送於運送方向(久轴方向)的構件。亦即,被由 上游侧供給到平台單元10的基板2浮起於平台12上,並且 藉由配設於運送單元20的基板導件限制。然後,藉由基 板導件行走於X轴方向,使得基板2被運送於χ軸方向。 平台單元10如圖3、圖4所示具有:被承載於基台 成平坦狀之平台12 ;由該平纟12的表面使基板2浮起之浮 起手段13。平台12為矩形狀的金屬製平板狀構件,沿著 、運送方向配置有複數塊。在圖丨的例子中配置有4塊平台 12。而且,平台12具有與被供給的基板2對向的平台面 12a(也僅稱為平台的表面12a),全體形成平坦狀。在本 實施形態中,平台面12a形成比基板2大的尺寸,使得被 供給的基板2全面不會露出而對向於該平台面12a。據此 ,因基板2全體與平台面i2a對面,故乾燥環境變成一定 ,形成於基板2上的塗佈膜在運送中進行乾燥時,可抑制 因乾燥環境不均勻造成的乾燥不均。 》 ❿且,好自12崎有定位銷14,藉由該定位銷“ ’被運送來的基板2蚊位於蚊的位置。妓位銷歸 -塊平台12配設有4根’各兩根配置於一條對角線上。具 體上’被配置於在基板2被供給到平台12上時,失住基板 2的對角線中的兩個隅角部分的位置。亦即,定位銷慮 配置於依照所運送的基板2的尺寸在基板2與定位銷_ 成-點點雜的位置。而且,該定位銷14可進行升降動 作,在收隸態下,^料14全體餘容於平㈣内, 在突出狀態下,定位鎖14突出於平台12表面上。因此, 在定位銷14為收容狀態下供給基板2,基板2_被供給到 1003351886-0 100127327 表單編號A0101 第9頁/共44頁 201214609^ 平台面12a上,定位銷14就變成突出狀態,藉由使基板2 的側面2a接觸定位銷14,使基板2被定位。亦即,變成基 板2 —被供給到平台12上基板2就可一邊浮起,一邊自 由地移動的狀態’惟藉由定位鎖14接觸基板2的側面2a, 使基板2的移動被限制,基板2被定位於平台12上的規定 位置(定位範圍)。 而且,浮起手段13是使被供給的基板2由平台面12a '予起的構件。在本實施形態中如圖3、圖4所示,在平台 12的背面(平台面l2a的背面)配設有振動器 Cvibi'atoOUa ’可藉由以該振動器Ua供給由特定的 頻率產生的振動,使得平台12上的基板2由平台面12a浮 起。具體上,例如若以超音波使振動器13a振動,則該振 動被傳遞,平台12自身以超音波振動。據此,在平台面 12a與基板2之間形成有一點點的空氣層,基板2由平台面 12&洋起。亦即,若以特定頻率使振動器13a振動,則基 板2在由平台面12a浮起到規定的高度位置的狀態下被保 持於平台1 2上。 而且,運送單元20是透過基板導件30將平台12上的 基板2運送於料方向的構件。料單元2G具有延伸於-向的土 〇lla沿著平台12的運送方向夾住平台12而被 設置。而且,運送單元2〇具有基板導件30,可藉由以基 台11a上的運送驅動部4〇使複數個基板導件3〇移動而運送 基板2。亦即’基板導件3〇為對應每—平台12而被配設, 各個基板導件30可由-個平台12移動到下-個下游側的 平台1 2,然後進行返回到原來的平台丨2的動作。每一平 台12的基板導件3G可藉由同時進行㈣動作將基板2運送 100127327 表單編號A0101 第1〇頁/共44頁 1003351886-0 201214609 於運送方向β 、體上,—被供給到一個平台12,基板2就藉由基板 限制(圖1的狀態)。然後,藉由基板導件的移動 被運送到下—個下游侧的平台12(圖5的狀態),被承載於 下游側的平台12(圖6的狀態)。然後,下游側的基板導件 3〇返回到上游側的原來的平台12(圖7的狀態),重新限制 藉由上游側的基板導件30運送的基板2。藉由以各平台12 複進行上述步驟,使得基板2被運送於運送方向。亦即According to this configuration, when the base member is relatively displaced with respect to the front member, the particulate component is generated due to the contact state between the two members. Assuming that the particles are generated, it is also possible to prevent the particles from being diffused to the substrate abutting portion side by the particles being attracted by the opening of the portion. Further, the guide member supporting portion may include an eQver extending from the substrate abutting portion side, and the cover portion of the suction portion is further disposed with the m base member. A gap is formed between the cover and the substrate abutting portion. According to the configuration, when the attraction force is generated by the opening of the suction portion 丨P, the contact between the cover and the substrate is too large. Since the attraction of the opening of the suction portion is suppressed, it is possible to suppress the micro-slipping due to the contact of the guide opening and the mouth from falling to the base == the substrate guide body 100127327. Form No. 1010101 Page 7 / Total from the side of the face . 1003351886-0 201214609 ―"Effects of the Invention] According to the substrate transfer device of the present invention, it is possible to suppress the unevenness of the coating on the substrate and to transport the substrate, and the error in manufacturing and assembly of the device is large. The situation can also suppress the generation of particles. [Embodiment] [0005] .. m The embodiment of the substrate transfer device of the present invention will be described with reference to the drawings. [First Embodiment] Fig. 1 is a plan view showing an embodiment of a substrate transfer device, Fig. 2 is a plan view of a unit of a large substrate transfer device, Fig. 3 is a side view of a unit of the substrate transfer device, and Fig. 4 is a view A front view of a unit of the substrate transport device. In FIG. 1 to FIG. 4, the substrate transfer device 1 is a device for transporting the substrate 2 in a state where the substrate 2 is floated, and the substrate 2 is transported to the downstream side of the next process by the substrate processing device on the upstream side. A device for a substrate processing apparatus. For example, when the substrate 2 is formed into a coating film by a coating device that discharges a coating liquid such as a photoresist, and then the substrate 2 is transported to a drying device that dries the coating film, the coating device can be supplied. When the substrate 2 is floated, it is conveyed to the drying device without changing the direction as it is. In the following description, it is assumed that the direction in which the substrate 2 is transported is set to a direction orthogonal to the X-axis direction on the horizontal plane, and the direction in which the X-axis direction is perpendicular to the X-axis direction is two-axis. The 100127327 platform has a platform unit 10 and a transport unit 2. The transport unit 20 is disposed on both sides of the ¥ axis direction of the flat β. The structure V of the platform unit can hold the substrate 2 to be carried on the floating page 8/44 page 1003351886-0 201214609 state. Further, the transport unit 20 is a member that transports the substrate 2 in the transport direction (long-axis direction) while restricting the floating substrate 2. That is, the substrate 2 supplied to the stage unit 10 from the upstream side floats on the stage 12 and is restricted by the substrate guides disposed on the transport unit 20. Then, the substrate guide is moved in the X-axis direction so that the substrate 2 is transported in the x-axis direction. As shown in Figs. 3 and 4, the platform unit 10 has a platform 12 which is carried on a flat platform, and a floating means 13 for floating the substrate 2 from the surface of the flat plate 12. The platform 12 is a rectangular metal flat member, and a plurality of blocks are arranged along the transport direction. In the example of Figure 配置, there are four platforms 12 configured. Further, the stage 12 has a land surface 12a (also referred to simply as a surface 12a of the platform) opposed to the substrate 2 to be supplied, and is formed in a flat shape as a whole. In the present embodiment, the land surface 12a is formed to have a larger size than the substrate 2, so that the supplied substrate 2 is not exposed to the entire surface and faces the land surface 12a. According to this, since the entire substrate 2 is opposed to the land surface i2a, the drying environment becomes constant, and when the coating film formed on the substrate 2 is dried during transportation, drying unevenness due to unevenness in the drying environment can be suppressed. ❿ , 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 Specifically, it is disposed on the position where the two corners of the diagonal of the substrate 2 are lost when the substrate 2 is supplied onto the stage 12. That is, the positioning pins are disposed in accordance with The size of the substrate 2 to be transported is at a position where the substrate 2 and the positioning pin _ are mixed. Moreover, the positioning pin 14 can be lifted and lowered, and in the retracted state, the entire material 14 is contained in the flat (four). In the protruding state, the positioning lock 14 protrudes from the surface of the platform 12. Therefore, the substrate 2 is supplied in the accommodating state, and the substrate 2_ is supplied to 1003351886-0 100127327. Form No. A0101 Page 9 / Total 44 Page 201214609 ^ On the land surface 12a, the positioning pin 14 is in a protruding state, and the substrate 2 is positioned by contacting the side surface 2a of the substrate 2 with the positioning pin 14. That is, the substrate 2 is supplied to the substrate 2 on the platform 12. The state of freely moving while floating, but only by the positioning lock 14 The side surface 2a of the substrate 2 restricts the movement of the substrate 2, and the substrate 2 is positioned at a predetermined position (positioning range) on the stage 12. Further, the floating means 13 causes the supplied substrate 2 to be lifted by the land surface 12a' In the present embodiment, as shown in Figs. 3 and 4, a vibrator Cvibi'atoOUa' is disposed on the back surface of the stage 12 (the back surface of the deck surface 12a), and can be supplied by the vibrator Ua. The vibration generated by the frequency causes the substrate 2 on the stage 12 to float by the land surface 12a. Specifically, for example, if the vibrator 13a is vibrated by ultrasonic waves, the vibration is transmitted, and the stage 12 itself vibrates by ultrasonic waves. A slight air layer is formed between the land surface 12a and the substrate 2, and the substrate 2 is lifted by the land surface 12&; that is, if the vibrator 13a is vibrated at a specific frequency, the substrate 2 is floated by the land surface 12a. It is held on the stage 1 2 in a state of a predetermined height position. Further, the transport unit 20 is a member that transports the substrate 2 on the stage 12 in the material direction through the substrate guide 30. The material unit 2G has an extension-direction. Transport of bandit lla along platform 12 The transport unit 2 has a substrate guide 30, and the substrate 2 can be transported by moving the plurality of substrate guides 3 by the transport drive unit 4 on the base 11a. That is, the 'substrate guides 3' are arranged corresponding to each of the platforms 12, and the respective substrate guides 30 can be moved from the platform 12 to the lower-downstream side platform 12, and then returned to the original platform 丨2. The substrate guide 3G of each platform 12 can transport the substrate 2 by simultaneous (4) operations 100127327 Form No. A0101 Page 1 / Total 44 Page 1003351886-0 201214609 In the transport direction β, body, - is supplied On a platform 12, the substrate 2 is limited by the substrate (state of Figure 1). Then, the substrate 12 (the state of Fig. 5) on the downstream side by the movement of the substrate guide is carried on the platform 12 on the downstream side (the state of Fig. 6). Then, the substrate guide 3 on the downstream side returns to the original stage 12 on the upstream side (the state of Fig. 7), and the substrate 2 conveyed by the substrate guide 30 on the upstream side is restricted. The substrate 2 is transported in the transport direction by repeating the above steps on each of the stages 12. that is

,基板2藉由複數個基板導件30的中繼(relay)方式而被 運送。 運送驅動部40具有:延伸於一方向的導軌(rail)41 ; 搭載基板導件30的運送本體部42 ;使運送本體部42驅動 的線性馬達(linear m〇t〇r)43。導軌41為具有平滑面 的平板狀構件,平滑面成朝上被配設於各個基台11上。 亦即’導軌41如圖2、圖4所示’在距平台12各自·等距離 的位置沿著平台12的運送方向夾住平台面丨2a而被配設。The substrate 2 is transported by a relay of a plurality of substrate guides 30. The transport drive unit 40 has a rail 41 extending in one direction, a transport main body portion 42 on which the substrate guide 30 is mounted, and a linear motor 43 that drives the main body portion 42. The guide rail 41 is a flat member having a smooth surface, and the smooth surface is disposed on each of the bases 11 upward. That is, the "guide rails 41" are disposed at positions equidistant from the platform 12 at positions equidistant from the platform 12 so as to sandwich the deck surface 2a in the transport direction of the stage 12.

而且,各個導軌41的平滑面的高度位置各自被設定為共 通的高度位置。 而且’在導軌41的平滑面上配設有LM導件(LinearFurther, the height positions of the smooth faces of the respective guide rails 41 are each set to a common height position. Moreover, the LM guide (Linear) is disposed on the smooth surface of the guide rail 41.

Motion guide:線運動導件)44與線性馬達43。具體上 ,在平滑面的Y轴方向中央位置,線性馬達43的定子 (stator)(磁板:magnetic plate)延伸於X軸方向而被 配設,在該定子的兩側,LM導件44延伸於X轴方向而被配 設。而且,在該LM導件44連結有運送本體部42,配設於 運送本體部42的動子(mover)被連接於定子。因此,藉 100127327 由驅動線性馬達43,使得動子一沿著定子移動,運送本 表單編號A0101 第11頁/共44頁 1003351886-0 201214609 體部42就能沿著導轨41移動。亦即,可藉由驅動控制線 性馬達43使運送本體部42沿著χ轴方向移動,在任意的位 置停止。 運送本體部42具有搭載基板導件30的搭载部42a與由 該搭載部42a延伸的聊部42b,形成剖面略呈口的字形。 在該腳部42b連結有LM導件44,成為搭載部—朝上而被 配置》’在該搭载部42a配設有一個基板導件3〇,基 板導件30各自被配置於平台12的對角線上。亦即,被配 置於與存在定位銷14的對角線不同的對角線上。而且, -驅動控制祕馬達43,就在維持基板導件3()存在於對 角線上的位置關係下’運送本體部42移動於運送方向。 此外,圖2的二點鏈線是顯示移動後的運送本體部42及基 板導件30。 ι 基板導件30如圖8所示具有:限制基板2之基板導件本 體31 ;支撐該基板導件本體31之導件支撐部犯,更具有: 由平台面12a使基板導件本體31浮起之浮起單元5〇 ;將基 板導件本體31推迫於平台面12a侧之推迫手段6〇,藉由浮 起單兀50與推迫手段6〇,基板導件本體31可由平台面 12 a浮起。 導件支撐部32具有平板狀的臂部32a,在其頂端部分 配設有基板導件本體31。該臂部32a透過升降機構配設於 運送本體部42的搭載部42a(參照圖4),可對搭載部42& 於Z方向進行升降動作。具體上,可由基板導件本體31限 制基板2的位置上升到基板導件本體31不接觸突出狀態的 定位銷14的程度。亦即如圖5所示,將基板2傳送到下一 個下游侧的平台12後,如圖6所示,基板2藉由突出狀態 1003351886-0 100127327 表單編號A0101 第12頁/共44頁 201214609 的定位銷14限制。此外在圖1、圖5~圖7中,當定位銷14 為黑色時疋顯示突出狀態,為白色時是顯示收容狀態。 而且,藉由使基板導件本體31上升後,使運送本體部42 行走,可超過該突出狀態的定位銷14的上方且基板導件 30可返回到原來的平台12(圖7的狀態)。 Ο 而且,導件支撐部32具有進退機構,可使臂部323對 基板2進行進退動作。亦即,在將基板2限制於基板導件 本體31的情形下,使臂部32a突出於基板2側(圖了—圖" ,在基板導件本體31抵接基板2的狀態下使其停止。而且 如圖5所示,當將基板2運送到下一個平台12時,可藉由 使突出的臂部32a移動到與基板2相反側並使其成退避狀 態以釋放基板2(圖6的狀態)。 此外,在臂部32a配設有可伸縮於進退方向的彈簧, 即使在被供給的基板2的隅角部分的位置有偏移,也仍舊 使臂部32a進入並抵接基板導件本體31的話,則可藉由彈 簧吸收該偏移量而確實地使基板導件本體31抵接基板2的 隅角部分。 ❹ 基板導件本體31如圖8所示被支樓於導件支撑部μ的 臂部32a,藉由該基板導件本體31抵接基板2,使基板2被 限制具體上,在臂部32a安裝有兩個基板導件本體 參照圖2),可藉由配置於對角線上的該等兩個基板導件 本體31接觸基板2而限制基板2 ^該基板導件本體31具有: 導件軸部33 ;形成於該導件軸部33的平台面12a侧之基板 -接4 3 4 了藉由基板抵接部3 4抵接基板2的側面2 a限制 基板2。 100127327 而且,基板導件本體31可位移於z方向而被導件支撐 1003351886-0 表單編號A0101 第13頁/共44頁 201214609 P32支樓。具體上,導件軸部33形成圓筒狀,該 =3透過滑_〜Ude _35被切於形成於臂 。阳a的貫軌。據此,純導件本㈣ r位移於z方向而被支撑。亦即,基板導件 台面12a位移於Z方向。 j耵十 土板抵接』34是藉由抵接基板2的側面2a限制式板2 的構件。該基板抵接部34形成樹脂製的圓筒狀,直土徑比 導件軸。卩33的直彳$還大而形^而且,可藉由導件支撑 部32的臂部仏突出於基板2側並使基板導件本體31抵接 基板2,使基板抵接部34的㈣面抵接基板2_面 限制基板2。亦即,藉由配置於對角線上的各個基板導件 3〇的基板抵接部34稍微壓接基板2的隅角部分中的側面2a ,使浮起於平台面12a的基板2的移動被限制。此外,在 本實施形態中雖然藉由基板抵接部34透過小的緊壓限制 基板2,惟即使是在不藉由基板抵接部34給予基板〗的側 面2a緊壓而能形成一點點間隙的程度下抵接基板2的侧面 2a的情形也能限制基板2。亦即,限制基板2是指使其成 為抑制浮起於平台面12a的基板2自由地移動的狀態並保 持基板2之意。 而且’浮起單元50是由平台面12a使基板導件本體31 浮起的構件。本實施形態的浮起單元50是藉由配設於基 板導件本體31的底面部36的氣塾51,與連通於該氣塾51 的空氣供給路徑52構成。該空氣供給路徑52連接於氣缸 (air cylinder)(未圖示),藉由閥(valve)(未圖示) 的開關動作透過空氣供給路徑52供給空氣。亦即,被供 給到空氣供給路徑52的空氣被由氣墊51喷出到平台面i2a 100127327 表單編號A0101 第14頁/共44頁 1003351886-0 201214609 側。據此,在基板導件本體31產生浮起力,基板導件本 體31由平台面12a稍微浮起。此處,雖然基板導件本體31 的浮起量是透過閥的開口量進行調整,但在本實施形態 中被調整,俾基板抵接部34成為浮起於平台面12a上的基 板2的高度位置。此外,基板抵接部34被調整到浮起的基 板2的高度位置是指不僅基板2的浮起量與基板抵接部34 的浮起量為共通的情形,也可以被調整到在基板抵接部 34浮起的狀態下,基板抵接部34可抵接基板2的側面的高 度位置。Motion guide: line motion guide 44 and linear motor 43. Specifically, at a central position in the Y-axis direction of the smooth surface, a stator (magnetic plate) of the linear motor 43 is extended in the X-axis direction, and LM guides 44 are extended on both sides of the stator. It is arranged in the X-axis direction. Further, the transport main body portion 42 is coupled to the LM guide 44, and a mover disposed on the transport main body portion 42 is connected to the stator. Therefore, the linear motor 43 is driven by 100127327, so that the mover moves along the stator, and the form number A0101 is 11/page 44 1003351886-0 201214609 The body 42 can be moved along the guide rail 41. That is, the transport main body portion 42 can be moved in the z-axis direction by the drive control linear motor 43, and stopped at an arbitrary position. The transport main body portion 42 has a mounting portion 42a on which the substrate guide 30 is mounted and a chat portion 42b extending from the mounting portion 42a, and has a shape in which the cross section is slightly hatched. The LM guide 44 is connected to the leg portion 42b, and the mounting portion is placed upwards. A substrate guide 3 is disposed on the mounting portion 42a, and the substrate guides 30 are disposed on the platform 12. Corner line. That is, it is placed on a diagonal different from the diagonal line where the positioning pin 14 is present. Further, the drive control motor 43 is moved in the transport direction while maintaining the positional relationship in which the substrate guide 3 () exists on the diagonal line. Further, the two-dot chain line of Fig. 2 is a transport main body portion 42 and a substrate guide 30 after the movement is displayed. As shown in FIG. 8, the substrate guide member 30 has a substrate guide body 31 for restricting the substrate 2, and a guide support portion for supporting the substrate guide body 31, and further includes: the substrate guide body 31 is floated by the land surface 12a. The lifting unit 5〇; the pushing means 6〇 for pushing the substrate guiding body 31 to the side of the platform surface 12a, by the floating unit 50 and the pushing means 6〇, the substrate guiding body 31 can be made of the platform surface 12 a floats. The guide supporting portion 32 has a flat arm portion 32a, and a substrate guide body 31 is disposed at a tip end portion thereof. The arm portion 32a is disposed in the mounting portion 42a (see Fig. 4) of the transport main body portion 42 via the elevating mechanism, and can elevate and lower the mounting portion 42& in the Z direction. Specifically, the position of the substrate 2 can be restricted by the substrate guide body 31 to the extent that the substrate guide body 31 does not contact the positioning pin 14 in the protruding state. That is, as shown in FIG. 5, after the substrate 2 is transferred to the platform 12 on the next downstream side, as shown in FIG. 6, the substrate 2 is protruded by the state 1003351886-0 100127327 Form No. A0101 Page 12 of 44 201214609 The positioning pin 14 is limited. Further, in Fig. 1 and Fig. 5 to Fig. 7, when the positioning pin 14 is black, the display state is highlighted, and when it is white, the display state is displayed. Further, by raising the substrate guide main body 31, the transport main body portion 42 is moved, and the above-described protruding state of the positioning pin 14 can be exceeded and the substrate guide 30 can be returned to the original stage 12 (state of Fig. 7). Further, the guide supporting portion 32 has an advancing and retracting mechanism, and the arm portion 323 can advance and retract the substrate 2. That is, in the case where the substrate 2 is restricted to the substrate guide body 31, the arm portion 32a is protruded from the substrate 2 side (Fig. - Fig.), and the substrate guide body 31 is brought into contact with the substrate 2 in a state where the substrate 2 is abutted against the substrate 2 As shown in FIG. 5, when the substrate 2 is transported to the next stage 12, the substrate 2 can be released by moving the protruding arm portion 32a to the opposite side of the substrate 2 and making it retracted (FIG. 6). Further, the arm portion 32a is provided with a spring that is expandable and contractible in the advancing and retracting direction, and the arm portion 32a is allowed to enter and abut the substrate guide even if the position of the corner portion of the supplied substrate 2 is shifted. In the case of the body 31, the substrate guide body 31 can be surely abutted against the corner portion of the substrate 2 by the spring absorbing the offset. 基板 The substrate guide body 31 is supported by the guide as shown in FIG. The arm portion 32a of the support portion μ is abutted against the substrate 2 by the substrate guide body 31, so that the substrate 2 is restricted. Specifically, two substrate guide bodies are mounted on the arm portion 32a. Referring to FIG. 2), The two substrate guide bodies 31 on the diagonal line contact the substrate 2 to limit the substrate 2 The guide body 31 has: a guide shaft portion 33; and a substrate-connecting portion 34B formed on the land surface 12a side of the guide shaft portion 33 is abutted against the side surface 2a of the substrate 2 by the substrate abutting portion 34 Substrate 2. 100127327 Moreover, the substrate guide body 31 can be displaced in the z direction and supported by the guide 1003351886-0 Form No. A0101 Page 13 of 44 201214609 P32 branch. Specifically, the guide shaft portion 33 is formed in a cylindrical shape, and the =3 transmission slip_~Ude_35 is cut and formed on the arm. The cross of the yang a. According to this, the pure guide (4) r is displaced in the z direction and supported. That is, the substrate guide mesa 12a is displaced in the Z direction. The jagged earth plate abutting portion 34 is a member that restricts the plate 2 by abutting against the side surface 2a of the substrate 2. The substrate abutting portion 34 is formed in a cylindrical shape made of resin, and the straight soil diameter is smaller than the guide shaft. The straight 彳 的 of the 卩 33 is also large and shaped, and the arm portion 导 of the guide supporting portion 32 protrudes from the substrate 2 side and the substrate guide body 31 abuts against the substrate 2 to make the substrate abutting portion 34 (4) The surface abuts the substrate 2_surface to limit the substrate 2. That is, the substrate 2 abutting portion 34 of each of the substrate guides 3A disposed on the diagonal line is slightly pressed against the side surface 2a of the corner portion of the substrate 2, so that the movement of the substrate 2 floating on the land surface 12a is limit. Further, in the present embodiment, the substrate abutting portion 34 transmits a small pressing restriction to the substrate 2, but a small gap can be formed even if the side surface 2a of the substrate is not pressed by the substrate abutting portion 34. The substrate 2 can also be restricted in the case of abutting against the side surface 2a of the substrate 2. In other words, the restriction substrate 2 is intended to prevent the substrate 2 floating on the land surface 12a from moving freely and to hold the substrate 2. Further, the 'floating unit 50' is a member that floats the substrate guide body 31 by the land surface 12a. The floating unit 50 of the present embodiment is constituted by a gas cylinder 51 disposed on the bottom surface portion 36 of the substrate guide body 31, and an air supply path 52 that communicates with the air cylinder 51. The air supply path 52 is connected to an air cylinder (not shown), and air is supplied through the air supply path 52 by a switching operation of a valve (not shown). That is, the air supplied to the air supply path 52 is ejected by the air cushion 51 to the deck surface i2a 100127327. Form No. A0101 Page 14 of 44 page 1003351886-0 201214609 side. According to this, a floating force is generated in the substrate guide body 31, and the substrate guide body 31 is slightly floated by the land surface 12a. Here, although the amount of floating of the substrate guide main body 31 is adjusted by the opening amount of the transmission valve, in the present embodiment, the height of the substrate 2 abutting on the land surface 12a is adjusted in the present embodiment. position. Further, the height adjustment of the substrate abutting portion 34 to the height of the floating substrate 2 means that not only the floating amount of the substrate 2 and the floating amount of the substrate abutting portion 34 are common, but also the substrate can be adjusted to In a state in which the connecting portion 34 is floated, the substrate abutting portion 34 can abut against the height position of the side surface of the substrate 2.

而且’推迫手段6〇是將基板導件本體31緊壓於平台面 12a側的構件。本實施形態的推迫手段60在基板抵接部34 與導件支撐部32之間配設有螺旋彈簧(c〇i 1 spring)61(彈簧構件),透過該螺旋彈簧61的彈性力使 基板導件本體31被緊壓於平台面i2a側。具體上,在基板 抵接部34與導件支撐部32之間,與導件軸部33的中心成 大致同心而在螺旋彈簧61收縮一定量的狀態下被配設。Further, the 'urging means 6' is a member for pressing the substrate guide body 31 against the side of the land surface 12a. In the urging means 60 of the present embodiment, a coil spring 61 (spring member) is disposed between the substrate abutting portion 34 and the guide supporting portion 32, and the substrate is transmitted through the elastic force of the coil spring 61. The guide body 31 is pressed against the side of the deck surface i2a. Specifically, between the substrate abutting portion 34 and the guide supporting portion 32, the center of the guide shaft portion 33 is substantially concentric, and the coil spring 61 is contracted by a predetermined amount.

藉由該螺旋彈簧61的恢復力當作推迫力作用於基板抵接 部34,使基板抵接部34(基板導件本體31)被緊壓於平台 面12a側。 此處,若藉由打開浮起單元5〇的閥而增加空氣供給量 ,則藉由由氣墊51喷出的空氣增加而增加浮起力,使基 板導件本體31朝上位移。另一方面,藉由基板導件本體 31—朝上位移,推迫手段60的螺旋彈簧61的恢復力就增 大,使得基板抵接部34朝下受到緊壓力。如此,可透過 浮起單元50的浮起力與推迫手段6〇的推迫力平衡的位置 調整基板抵接部34的高度位置。在本實施形態中,浮起 100127327 表單編號A0101 第15頁/共44頁 1003351886-0 201214609 早兀50的空氣供給量被調節,俾基板抵接邹⑽為浮起 於平台面12a的基板2的高度位置。 藉由這種基板導件30,即使是產生平台12表面的平面 度誤差等裝置的製造上及組裝上的誤差的情形,也能抑 制微粒的產生而運送基板2。亦即可藉由基板導件3〇,在 浮起單元50的浮起力與減手細的麵力平衡的位置 ’基板抵接部34抵接基板2的側面2a而限制基板2。在該 狀態下於正使基板導件30移動於運送方向並運送基板㈣ 時候,當在平台12表面產生平面度誤差時,例如假設平 台12表面隆起的話,則因來自基板導件本體3ι的氣塾η 的空氣的喷出量不變,故基板導件本體31由接近的平台 面12a透過由空氣噴出產生的浮起力而受到朝上的力並朝 上位移。但是,因臂部32a對平台12表面被固定故在臂 部32a與基板抵接部34之間螺旋彈黄㈣到壓縮變形其 恢復力作用於基板抵接部34。亦即,即使平台面…接近 或分離’也因浮起單元50的浮起力與推迫手段60的推迫 力(恢復力)在新的高度位置平衡,故基板導件本體31的 浮起狀態被維持,俾基板導件本體31追賧平台面12a。因 此’即使產生平台12表面的平面度誤差等裝置的製造上 及乡且裝上的誤差,也能抑制行走中的基板導件30接觸平 α12表® ’可抑制因基板導件3Q接觸平台似面所造 的微粒的產生。 而且’在該基板導件30配設有防塵機構。亦即,可藉 由配設於導件支撐部32的臂部32a的吸引部71與防塵蓋曰 72抑制在基板導件本體31位移於z轴方向時所造 的產生。 100127327 表單編號A0101 第16頁/共44頁 1003351886-0 201214609 吸引部7 1是藉由吸引產生的微粒而防止微粒附著於基 板2上的構件。該吸引部71配設於基板導件本體31所插通 的臂部32a的貫通孔附近。具體上,在臂部32a形成有開 口於基板抵接部34側的開口部71 a,在該開口部71a由基 板抵接部34的相反側連接有真空泵(vacuuin pump)。因 此,藉由一使真空泵動作,就在開口部7la的基板抵接部 34側開口產生吸引力,可吸引在臂部32a與基板抵接部 之間產生的微粒。亦即,可吸引在基板導件本體3丨位移The restoring force of the coil spring 61 acts as a pressing force on the substrate abutting portion 34, and the substrate abutting portion 34 (substrate guide body 31) is pressed against the deck surface 12a side. Here, when the air supply amount is increased by opening the valve of the floating unit 5, the floating force is increased by the increase in the air discharged from the air cushion 51, and the substrate guide body 31 is displaced upward. On the other hand, by the substrate guide body 31 being displaced upward, the restoring force of the coil spring 61 of the biasing means 60 is increased, so that the substrate abutting portion 34 receives the pressing force downward. In this manner, the height position of the substrate abutting portion 34 can be adjusted by the position at which the lifting force of the floating unit 50 and the pressing force of the pushing means 6 are balanced. In the present embodiment, the floating 100127327 Form No. A0101 Page 15 / Total 44 page 1003351886-0 201214609 The air supply amount of the early 兀50 is adjusted, and the 俾 substrate abuts (10) as the substrate 2 floating on the platform surface 12a. Height position. With such a substrate guide 30, even in the case of manufacturing or assembly errors such as flatness errors on the surface of the stage 12, the generation of fine particles can be suppressed and the substrate 2 can be transported. Alternatively, the substrate 2 can be restrained by the substrate guide 3, and the substrate contact portion 34 abuts against the side surface 2a of the substrate 2 at a position where the floating force of the floating unit 50 and the surface force of the hand-reduced surface are balanced. In this state, when the substrate guide 30 is being moved in the transport direction and the substrate (4) is being transported, when a flatness error is generated on the surface of the stage 12, for example, assuming that the surface of the stage 12 is raised, the air is caused by the substrate guide body 3i. Since the discharge amount of the air of η does not change, the substrate guide body 31 is displaced upward by the upward force by the floating force generated by the air ejection from the approaching deck surface 12a. However, since the arm portion 32a is fixed to the surface of the stage 12, the spring portion (4) is spirally rotated between the arm portion 32a and the substrate abutting portion 34 to compressively deform and its restoring force acts on the substrate abutting portion 34. That is, even if the deck surface is close to or separated, the floating state of the substrate guide body 31 is balanced because the floating force of the floating unit 50 and the pressing force (restoring force) of the pushing means 60 are balanced at the new height position. The substrate guide body 31 is maintained to track the deck surface 12a. Therefore, even if the manufacturing and the installation error of the device such as the flatness error of the surface of the platform 12 is generated, the substrate guide 30 in the walking can be prevented from contacting the flat α12 table®', which can suppress the substrate guide 3Q from contacting the platform. The production of particles made by the surface. Further, a dustproof mechanism is disposed on the substrate guide 30. In other words, the suction portion 71 disposed on the arm portion 32a of the guide supporting portion 32 and the dustproof cover 72 can be prevented from being generated when the substrate guide body 31 is displaced in the z-axis direction. 100127327 Form No. A0101 Page 16 of 44 1003351886-0 201214609 The attraction portion 7 1 is a member that prevents particles from adhering to the substrate 2 by attracting generated particles. The suction portion 71 is disposed in the vicinity of the through hole of the arm portion 32a through which the substrate guide body 31 is inserted. Specifically, the arm portion 32a is formed with an opening portion 71a that opens to the side of the substrate abutting portion 34, and a vacuum pump is connected to the opposite side of the substrate abutting portion 34 in the opening portion 71a. Therefore, when the vacuum pump is operated, an attractive force is generated in the opening of the substrate abutting portion 34 of the opening portion 71a, and particles generated between the arm portion 32a and the substrate abutting portion can be attracted. That is, it can attract the displacement of the substrate guide body 3

100127327 於Z轴方向時,導件轴部33與滑動襯套35滑動時產生的微 粒0 々正座玍的儆祖的擴散的構件。該 防塵蓋72配設於比吸引部71的開口還靠外徑侧,並且由 臂部32a朝基板抵接部34延伸,形成圓筒狀。而且,防塵 蓋72遍及全周覆蓋導件轴部33的外周面與基板抵接部以 的外周面的-部分。亦即,防塵蓋72形成錢比基板抵 接部34的直徑還大,在與基板抵接部34的外周面之間形 成有間隙。據此’可防止在臂部32a與基板抵接部以之間 產生的微粒的擴散。亦即,若在導件㈣33與滑動襯套 35滑動時產生微粒,則雖然微粒擴散,但因圓筒狀的防 塵蓋72的存在而能賴粒的擴㈣在防塵蓋加。秋後 ,若使真U動作並使利力產生於別部Η,則會 成空氣由形成於防塵蓋72與基板抵接部W之間的間隙進 入且被吸弓丨到㈣部71此—线的”。據此,擴散於 =防塵蓋72覆蓋的區域的微粒不會㈣到防塵蓋72的 外側,可由吸引部71排出微粒。 二:針對基的動作根據,示的流程 第17頁/共44頁 1003351886-0 201214609 圖來說明。 此處’在基板2被運送前的狀態中,各基板導件3〇待 機於接鄰各個平台12的位置’導件支推部32的臂部32a成 為退避狀態。然後,定位銷14被收容於比平台面12&還下 方,收容狀態被維持。 首先,透過步驟S1進行基板2的定位。亦即,為了以 基板導件30限制基板2而進行基板2的定位動作。具體上 藉由疋成則製程的基板2 一被供給,處於收容狀態的定 位鎖14就由平台面12a突出,使基板2被定位於定位範圍 。亦即’基板2 —被供給到藉由振動器i3a振動的平台12 上,基板2就由平台面12a浮起且自由地移動於平台面12& 上,惟藉由接觸突出狀態的定位銷14而使基板2的移動被 限制。據此,基板2被定位於定位範圍(圖7)。 其次,透過步驟S2進行利用基板導件30進行的限制動 作。亦即,導件支撐部32的臂部32a延伸於基板2側。具 體上,空氣由基板導件本體31的氣墊51喷出,該浮起力 與螺旋彈簧61的推迫力平衡且基板導件本體31-邊被臂 部32a支撐,一邊浮起於平台面12a上。在該狀態下,基 板抵接部34的高度位置被調整到抵接基板2的側面2a的高 度位置。然後,臂部32a—延伸,基板導件本體31就接近 基板2的側面2a,藉由基板抵接部34抵接基板2的側面2a 而使臂部32a停止延伸動作。亦即,藉由基板2的隅角部 分t的侧面2a抵接配置於對角線上的4個基板導件本體31 的基板抵接部34使得基板2被限制(圖1)。因此在該狀態 下’基板2的移動藉由基板導件30及定位銷14限制。 100127327 其次,透過步驟S3運送基板2。亦即,被限制的基板 1003351886-0 表單編號A0I01 第18頁/共44頁 201214609 2件30由現在的平台丨2被承载到接鄰下游侧的下—個平 台12 ’藉由該動作被重複而運送基板2。具體上,使其成 .使限制純2的移動的錢編下降且僅藉由基板導件 3〇限制基板2的移動的狀態。然後,親動運送驅動部4〇, 使基板導件3G移動到下游側。移動中可藉由自基板導件’ Ο 的氣塾51持續噴出空氣,使得基板導件本體31可維持 由平台面12a浮起的狀態。而且,即使假設是平台面“a 的平面度產生誤差的情形,也能藉由追蹤該平台面ha的 形狀,藉由導件支撐部32的臂部32a接觸平台面12a抑制 微粒的產生。而且,基板2 —到達接鄰下游侧的下—個平 台12,運送驅動部4〇就被驅動控制而使基板導件3〇停止 °亦即’被停止於當定位銷成為突出狀態時,基板2的 背面與定位銷14不碰撞的位置(圖5)。100127327 A member that diffuses the granules of the granules when the guide shaft portion 33 and the sliding bushing 35 slide in the Z-axis direction. The dust cover 72 is disposed on the outer diameter side of the opening of the suction portion 71, and extends from the arm portion 32a toward the substrate abutting portion 34 to form a cylindrical shape. Further, the dustproof cover 72 covers the portion of the outer peripheral surface of the outer peripheral surface of the guide shaft portion 33 and the outer peripheral surface of the substrate abutting portion over the entire circumference. That is, the dust cover 72 is formed to have a larger diameter than the substrate abutting portion 34, and a gap is formed between the outer peripheral surface of the substrate abutting portion 34. According to this, the diffusion of the particles generated between the arm portion 32a and the substrate abutting portion can be prevented. In other words, when the guide member (four) 33 and the sliding bush 35 slide to generate fine particles, the fine particles are diffused. However, due to the presence of the cylindrical dustproof cover 72, the expansion of the particles (four) can be applied to the dust cover. After the autumn, if the real U is operated and the force is generated in other parts, the air enters through the gap formed between the dust cover 72 and the substrate abutting portion W and is sucked to the (four) portion 71. According to this, the particles diffused in the area covered by the dust cover 72 are not (four) to the outside of the dust cover 72, and the particles can be discharged by the suction portion 71. Second, the operation of the base is based on the flow shown on page 17/ A total of 44 pages 1003351886-0 201214609 are illustrated. Here, in the state before the substrate 2 is transported, each of the substrate guides 3 〇 stands by the position of the respective stages 12 adjacent to the arm portion 32a of the guide pushing portion 32. Then, the positioning pin 14 is housed below the deck surface 12& and the storage state is maintained. First, the positioning of the substrate 2 is performed in step S1. That is, the substrate 2 is restricted by the substrate guide 30. The positioning operation of the substrate 2 is specifically provided by the substrate 2 of the process, and the positioning lock 14 in the receiving state is protruded by the land surface 12a, so that the substrate 2 is positioned in the positioning range. Is supplied to the flat vibration by the vibrator i3a 12, the substrate 2 is floated by the land surface 12a and freely moved on the land surface 12&, but the movement of the substrate 2 is restricted by the contact pin 14 in contact with the protruding state. Accordingly, the substrate 2 is positioned at Positioning range (Fig. 7) Next, the restricting operation by the substrate guide 30 is performed through the step S2. That is, the arm portion 32a of the guide supporting portion 32 extends on the side of the substrate 2. Specifically, the air is guided by the substrate guiding body The air cushion 51 of 31 is ejected, and the floating force is balanced with the biasing force of the coil spring 61, and the substrate guide main body 31 side is supported by the arm portion 32a, and floats on the deck surface 12a. In this state, the substrate abuts. The height position of the portion 34 is adjusted to abut against the height position of the side surface 2a of the substrate 2. Then, the arm portion 32a extends, the substrate guide body 31 approaches the side surface 2a of the substrate 2, and the substrate abuts portion 34 abuts the substrate The side surface 2a of the second portion 2a stops the extending operation of the arm portion 32a. That is, the side surface 2a of the corner portion t of the substrate 2 abuts against the substrate abutting portion 34 of the four substrate guide bodies 31 disposed on the diagonal line. The substrate 2 is limited (Fig. 1). Therefore, in this state, the substrate The movement of 2 is limited by the substrate guide 30 and the positioning pin 14. 100127327 Next, the substrate 2 is transported through the step S3. That is, the limited substrate 1003351886-0 Form No. A0I01 Page 18 of 44 201214609 2 pieces 30 by The current platform 丨 2 is carried to the lower platform 12' adjacent to the downstream side, and the substrate 2 is transported by repeating the action. Specifically, it is made to reduce the amount of money that restricts the movement of pure 2 and only borrow The state in which the substrate 2 is moved is restricted by the substrate guide 3. Then, the driving portion 4A is transported by the side, and the substrate guide 3G is moved to the downstream side. During the movement, air can be continuously ejected from the gas cylinder 51 of the substrate guide ’, so that the substrate guide body 31 can maintain the state of being floated by the land surface 12a. Further, even if it is assumed that the flatness of the land surface "a" causes an error, the generation of the particles can be suppressed by the arm portion 32a of the guide supporting portion 32 contacting the land surface 12a by tracking the shape of the land surface ha. The substrate 2 reaches the lower platform 12 adjacent to the downstream side, and the transport driving unit 4 is driven and controlled to stop the substrate guide 3, that is, 'stopped when the positioning pin becomes protruding, the substrate 2 The back side does not collide with the positioning pin 14 (Fig. 5).

其次’透過步驟S4進行利用基板導件30進行的基板2 的釋放。具體上,定位銷14由平台面12a突出,藉由該定 位銷14 ’被運送的基板2在下游侧的下一個平台面l2a上 被限制。亦即’基板2藉由定位銷14與基板導件30限制。 然後’基板導件30的臂部32a退避且一邊返回到原來的位 置’一邊藉由升降機構使臂部32a上升。亦即,上升到基 板導件本體31不接觸定位銷14的位置。據此,利用基板 導件30進行的基板2的釋放被進行,基板2僅藉由定位銷 14限制(圖6)。 其次,若臂部32a的退避動作及上升動作完了 ’則透 過步驟S5基板導件3〇返回到原來的位置(圖7)。亦即,驅 動運送驅動部40,使基板導件30移動到接鄰釋放了基板2 的平台12的上游侧的平台12。此時’定位銷14因限制基 100127327 表單編號A0101 第19頁/共44頁 1003351886-0 201214609 … 板2而為突出狀態,惟因基板導件本體31比定位銷14還上 升,故不會因基板導件30的移動而使基板導件本體μ與 定位銷14接觸。 而且,被運送到下游側的平台12的基板2藉由當初就 配s又於平台12的基板導件30,亦即由比該平台12還靠下 游側的平台12返回的基板導件30限制,進而被運送到下 游侧的平台12。如此,藉由透過配設於各個平台12的基 板導件30,使基板2被中繼地限制且被移到下一個下游侧 的平台12,基板2被運送到基板運送裝置丨的最終位置。 如此,依照上述基板運送裝置1,因抵接基板2的側面 2a並限制基板2,故可抑制基板2上的塗佈.膜產生乾燥不 均而運送基板2。而且,因基板導件本體31的基板抵接部 34的鬲度位置藉由前述浮起單元5〇與前述推迫手段6〇維 持於由平台12的表面12a浮起的基板2的高度位置,故即 使疋平台12的平面度產生誤差的情形等裝置的製造上及 組裝上的誤差大的情形,也能藉由基板導件本體3丨的浮 起量被保持一定而不會使基板導件本體31接觸平台12的 表面12a ’故可抑制因基板導件3〇接觸平台12的表面i2a 所造成的微粒的產生。 而且,在上述實施形態中’推迫手段6〇雖然是針對使 用螺旋彈簧61的情形進行了說明,惟也可以使用磁鐵將 基板抵接部34推迫於平台面12a側而構成。亦即,可藉由 配設於基板抵接部34侧的n極(或s極)與臂部32a側的N極 (或S極)對面的位置,以基板抵接部34接近臂部32a時的 磁鐵的斥力當作推迫力而使用。 [實施例二] 100127327 表單編號A0101 第20頁/共44頁 1003351886-0 而且,針對基板運送裝置中的其他的實施形態,使用 圖10、圖11來說明。此處,關是由上面看其他的實施 形態中的基板導件30之圖,圖u是圖1〇2A_A剖面圖。 在該圖1G、mi所示的實施形態中,浮起單元5G的氣塾 51為藉由與基板導件本體31的基板抵接部34不同體而形 成的例子。此外,針對基板導件30以外的其他的構成由 於與上述的實施形態一樣,故說明省略。 基板導件30如圖1〇、圖η所示具有:限制基板2之基 板導件本體31 ;支撐該基板導件本體31之導件支撐部32 ,更具有:由平台面Ua使基板導件本體31浮起之浮起單 兀50,將基板導件本體31推迫於平台面12a側之推迫手段 60,藉由浮起單元50與推迫手段6〇 ,基板導件本體“可 由平台面12a浮起。 導件支撐部32具有平板狀的臂部32a,在其頂端部分 配設有基板導件本體31。該臂部32a透過升降機構配設於 運送本體部42的搭載部42a(參照圖4),可對搭載部42a 於Z方向進行升降動作。在本實施形態中升降機構使用氣 壓滑台(air slide table)81,可藉由控制給予該氣壓 滑台81的空氣的供給量,使臂部32a移動於z方向β亦即 ,氣壓滑台81為直線狀地移動的台桌(table)81a可移動 於z方向而被安裝,在該台桌81a透過氣壓滑台82安裝有 臂部32a。然後,藉由控制空氣的供給量,使臂部朝 下移動,藉由使基板導件本體31接近基板2,使臂部32a 朝上移動,使得基板導件本體31移動於離開基板2的方向 。在本實施形態中與上述的實施形態(實施例一)一樣, 基板導件本體31可由限制基板2的位置上升到不接觸突出 表單編號A0101 第21頁/共44頁 丨ηίη 201214609 狀悲的定位銷14的程度。此外,該氣壓滑台81如後述也 當作推迫手段作用。 而且’導件支撐部32具有進退機構,可使臂部32a對 基板2進行進退動作。在本實施形態中該進退機構使用氣 麼滑台82 ’可藉由控制給予該氣壓滑台82的空氣的供給 量,使基板導件本體31可對基板2接離而動作。具體上, 氣壓滑台82的本體被安装於氣壓滑台μ,直線狀地移動 的氣壓滑台82的台桌82a可移動地被安裝於朝被定位的基 板2的中心的方向。然後’藉由控制給予氣壓滑台82的空 氣的供給量’使台桌82a可進行進退動作於基板2的中心 方向。亦即可移動於:臂部32a延伸於基板2的中心方向的 突出狀態,與臂部32a縮回本體側的待避狀態。亦即,在 將基板2限制於基板導件本體31的情形下,使臂部32a突 出於基板2側(圖,在基板導件本體31抵接基板2 的狀1、下使其V止。而且,如圖5所示’當將基板2運送 到下-個平台12時,可藉由使臂部32a移動到與基板2相 反侧並使其成退避狀態,釋放基板2(圖6的狀態)。 基板導件本體31如圖1G、® 11所示被錢於導件支 撐部32的臂部32a ’藉由該基板導件本體㈣接基板2, 使基板2被限制。具體上,在臂部32&的頂端部分安裝有 兩個基板導件本體31(參照圖2),可藉由配置於對角線上 的該等兩個基板導件本體31接觸基板2而限制基板2。 具體上,基板導件本體31具有:圓柱狀的導件軸部33 ;形成於該導件軸部33的平台面12a側的側面之基板抵接 部34,該等兩個基板導件本體31被固定於距臂部…的中 心等距離的位置。然後,可藉由驅動氣壓滑台82,藉由 1003351886-0 100127327 表單編號A0101 第22頁/共44頁 201214609 使導件支撑部32的臂部32a突出於基板2側,使得基板抵 接部34抵接基板2的側面2a而限制基板2。亦即,藉由配 置於對角線上的各個基板導件30的基板抵接部34稍微壓 接基板2的隅角部分中的侧面2a,使浮起於平台面丨2a的 基板2的移動被限制。此外,在本實施形態中即使是在不 藉由基板抵接部34給予基板2的侧面2a緊壓而能形成一點 點間隙的程度下抵接基板2的側面2a的情形也會限制基板 Ο 2。亦即,若為浮起於平台面12a的基板2自由地移動被抑 制的狀態的話即可》 Ο 而且,浮起單元50是由平台面12a使基板導件本體31 浮起的構件。本實施形態的浮起單元5〇被固定配設於導 件支撐部32,且被配置於基板導件本體31與進退機構的 氣壓滑台82之間。該浮起單元5〇具有浮起單元本體^與 氣塾5卜如圖11所示,在浮起單元本體55的底面部配設 有氣塾51。亦即,氣墊51被安I於對向於平台面12a的位 置。而且,氣墊51連接於氣缸(未圖示),藉由閥(未圖示 )的開關動作供給空氣。亦即’藉由空氣一被供給到氣塾 51,就由氣墊51噴出到平台面12a側,使得導件支撐部 32梵到·斤起力,並且連結於導件支撐部32的基板導件本 體31也受到浮起力,基板導件本體31由平台面%稍微浮 起。此處,基板導件本體31的浮起量是透過閥的開口量 進行調整,而在本實_態中被㈣,俾純抵接部Μ 成為浮起於平台面12a上的基板2的高度位置。此外,美 板抵接部34被調整到浮起的基板2的高度位置是指不僅美 板2的浮起量與基板抵接部34的浮起量為共通的情形,也 可以被調整到在基板抵接部34浮起的狀態下,基板抵接 100127327 表單編號A0101 第23頁/共44頁 1003351886-0 201214609 部34可抵接基板2的側面的高度位置。 而且’推迫手段60是將基板導件本體31緊壓於平台面 123側的構件。本實施形態的推迫手段60為氣壓滑台81, 藉由控制供給到氣壓滑台81的空氣使基板導件本體31被 緊壓於平台面12a侧。具體上’藉由透過控制空氣使得氣 壓滑台81的台桌81a欲朝下移動,連結於台桌81 ^的進退 機構、導件支撐部32及基板導件本體31 —直朝下受力, 使基板導件本體31被緊壓於平台面12a侧。 此處’若藉由打開浮起單元50的闊而增加空氣供給量 ’則因由氣墊51喷出的空氣增加而增加浮起力,使基板 導件本體31朝上位移。另一方面,若基板導件本體31想 朝上位移’則因供給到推迫手段60的氣壓滑台81的氣壓 不變’故氣壓僅微小地增大台桌81a微小地朝上位移的部 分’台桌81a想朝下位移的推力增大。亦即,基板導件本 體31朝下受到緊壓力。如此,可透過浮起單元5〇的浮起 力與推迫手段60的推迫力平衡的位置使基板抵接部34的 高度位置維持於基板2的側面的高度位置。 藉由這種基板導件30,即使是產生平台12表面的平面 度誤差等裝置的製造上及組裝上的誤差的情形,也能抑 制微粒的產生而運送基板2。亦即可藉由基板導件3〇,在 浮起單元50的浮起力與推迫手段6〇的推迫力平衡的位置 ’基板抵接部34抵接基板2的侧面2a而限制基板2 ^在該 狀態下於正使基板導件3〇移動於運送方向並運送基板2的 時候,當平台12表面產生平面度誤差時,例如假設平台 12表面隆起的話,則因來自氣墊51的空氣的喷出量不變 故基板導件本體31由接近的平台面〗2a透過由空氣喷出 100127327 表單編號A0101 第24頁/共44頁 1003351886-0 201214609 產生的浮起力而受到釦丄 月上的力並朝上位移。若基板導件 本體31朝上位移,則麩 g戰*^滑台81的台桌81a微小地朝 上位移,使得台桌8la的# W朝下的推力增大,基板導件本體 31朝下受到緊壓力。亦 P ’即使平台面12a接近或離開基 板導件本體31,也因浮起單 &早tg5〇的浮起力與推迫手段6〇 的推迫力(恢復力)在新的高度位置平衡,而使基板導件 被維持’俾基板導件本舰追縱平台 面12a。因此’即使產生平台12表面的平面度誤差等裝置Next, the release of the substrate 2 by the substrate guide 30 is performed through the step S4. Specifically, the positioning pin 14 is protruded from the land surface 12a, and the substrate 2 conveyed by the positioning pin 14' is restricted on the next land surface 12a on the downstream side. That is, the substrate 2 is limited by the positioning pin 14 and the substrate guide 30. Then, the arm portion 32a of the substrate guide 30 is retracted and the arm portion 32a is raised by the elevating mechanism while returning to the original position. That is, it rises to a position where the substrate guide body 31 does not contact the positioning pin 14. Accordingly, the release of the substrate 2 by the substrate guide 30 is performed, and the substrate 2 is limited only by the positioning pins 14 (Fig. 6). Then, when the retracting operation and the rising operation of the arm portion 32a are completed, the substrate guide 3 is returned to the original position through the step S5 (Fig. 7). That is, the transport driving unit 40 is driven to move the substrate guide 30 to the stage 12 on the upstream side of the stage 12 on which the substrate 2 is released. At this time, the locating pin 14 is in a protruding state due to the restriction base 100127327, the form number A0101, the 19th page, and the 44th page, 1003351886-0 201214609 ..., because the substrate guide body 31 is raised more than the positioning pin 14, so it is not caused by The movement of the substrate guide 30 causes the substrate guide body μ to come into contact with the positioning pin 14. Moreover, the substrate 2 transported to the platform 12 on the downstream side is limited by the substrate guide 30 which is initially provided with the substrate 12, that is, the substrate guide 30 returned by the platform 12 on the downstream side of the platform 12, It is then transported to the platform 12 on the downstream side. Thus, by passing through the substrate guides 30 disposed on the respective stages 12, the substrate 2 is relay-restricted and moved to the platform 12 on the next downstream side, and the substrate 2 is transported to the final position of the substrate transfer device. As described above, according to the substrate transfer apparatus 1, since the substrate 2 is restricted by the side surface 2a of the substrate 2, it is possible to suppress the unevenness of the coating on the substrate 2 and transport the substrate 2. Further, the position of the substrate abutting portion 34 of the substrate guide body 31 is maintained at a height position of the substrate 2 which is floated by the surface 12a of the stage 12 by the floating unit 5〇 and the pressing means 6〇, Therefore, even if the flatness of the platform 12 is in an error condition, the manufacturing and assembly errors of the device are large, and the floating amount of the substrate guide body 3 can be kept constant without the substrate guide. The body 31 contacts the surface 12a' of the stage 12 so that the generation of particles caused by the substrate guide 3〇 contacting the surface i2a of the stage 12 can be suppressed. Further, in the above-described embodiment, the "urging means 6" has been described with respect to the case where the coil spring 61 is used, but the magnet abutting portion 34 may be urged to the side of the land surface 12a by a magnet. In other words, the substrate abutting portion 34 can approach the arm portion 32a by the position of the n-pole (or s-pole) disposed on the side of the substrate abutting portion 34 and the N-pole (or S-pole) on the side of the arm portion 32a. The repulsive force of the magnet is used as a pushing force. [Embodiment 2] 100127327 Form No. A0101 Page 20 of 44 1003351886-0 Further, other embodiments of the substrate transfer apparatus will be described with reference to Figs. 10 and 11 . Here, the closing is a view of the substrate guide 30 in the other embodiment, and Fig. 1 is a sectional view of Fig. 1A-2A. In the embodiment shown in Figs. 1G and 1m, the air cylinder 51 of the floating unit 5G is formed by being different from the substrate abutting portion 34 of the substrate guide body 31. Incidentally, the configuration other than the substrate guide 30 is the same as that of the above-described embodiment, and therefore the description thereof is omitted. As shown in FIG. 1A and FIG. 7A, the substrate guide member 30 has a substrate guide body 31 for limiting the substrate 2, and a guide support portion 32 for supporting the substrate guide body 31, and further comprising: a substrate guide member by the platform surface Ua. The floating unit 50 that floats on the body 31 pushes the substrate guide body 31 against the pushing means 60 on the side of the platform surface 12a. By the floating unit 50 and the pushing means 6〇, the substrate guiding body can be “platable by the platform” The guide support portion 32 has a flat arm portion 32a, and a substrate guide main body 31 is disposed at a distal end portion thereof. The arm portion 32a is disposed on the mounting portion 42a of the transport main body portion 42 via a lifting mechanism ( Referring to Fig. 4), the mounting portion 42a can be moved up and down in the Z direction. In the present embodiment, the air slide table 81 is used for the elevating mechanism, and the amount of air supplied to the air slide table 81 can be controlled. The table portion 81a in which the arm portion 32a is moved in the z direction β, that is, the air table 81 is linearly moved, is attached to the z direction, and is mounted on the table 81a through the air pressure table 82. The arm portion 32a. Then, by controlling the supply amount of air, the arm portion is moved downward By bringing the substrate guide body 31 closer to the substrate 2, the arm portion 32a is moved upward, so that the substrate guide body 31 is moved in a direction away from the substrate 2. In the present embodiment and the above-described embodiment (Example 1) Similarly, the substrate guide body 31 can be raised from the position of the restriction substrate 2 to the extent that it does not contact the positioning pin 14 of the form number A0101, which is sorrowful. Further, the air slide table 81 is also described later. The guide support portion 32 has an advancing and retracting mechanism, and the arm portion 32a can advance and retract the substrate 2. In the present embodiment, the advancing and retracting mechanism can be controlled by using the air slide 82'. The air supply amount of the air pressure slide 82 causes the substrate guide main body 31 to move away from the substrate 2. Specifically, the main body of the air pressure slide 82 is attached to the air pressure slide μ, and the air pressure slides linearly. The table 82a of the table 82 is movably mounted in the direction toward the center of the substrate 2 to be positioned. Then, by controlling the amount of supply of air to the air slide table 82, the table 82a can be moved forward and backward to the substrate 2. The center direction of the arm portion 32a is extended in the protruding direction of the center of the substrate 2, and the arm portion 32a is retracted to the standby side of the body side. That is, the substrate 2 is restrained to the substrate guide body 31. In this case, the arm portion 32a is protruded from the substrate 2 side (in the figure, the substrate guide body 31 is in contact with the substrate 2 in the shape 1 and is stopped by V. Further, as shown in FIG. 5, when the substrate 2 is transported to When the lower stage 12 is placed, the substrate 2 can be released (the state of Fig. 6) by moving the arm portion 32a to the side opposite to the substrate 2 and in a retracted state. The substrate guide body 31 is as shown in Figs. 1G and 11 The arm portion 32a' of the guide member supporting portion 32 is connected to the substrate 2 by the substrate guide body (4), so that the substrate 2 is restricted. Specifically, two substrate guide bodies 31 (see FIG. 2) are attached to the top end portions of the arm portions 32 & the substrate can be restrained by the two substrate guide bodies 31 disposed on the diagonal lines contacting the substrate 2 2. Specifically, the substrate guide body 31 has a cylindrical guide shaft portion 33, a substrate abutting portion 34 formed on a side surface of the guide shaft portion 33 on the side of the land surface 12a, and the two substrate guide bodies 31. It is fixed at a position equidistant from the center of the arm. Then, the arm portion 32a of the guide supporting portion 32 can be protruded from the substrate 2 side by driving the air pressure sliding table 82 by the 1003351886-0 100127327 form number A0101 page 22/total 44 page 201214609, so that the substrate abutting portion 34 The substrate 2 is restricted by abutting against the side surface 2a of the substrate 2. That is, the side surface 2a of the corner portion of the substrate 2 is slightly pressed by the substrate abutting portion 34 of each of the substrate guides 30 disposed on the diagonal line, so that the movement of the substrate 2 floating on the land surface 2a is limit. Further, in the present embodiment, the substrate Ο 2 is restricted even when the side surface 2a of the substrate 2 is abutted without being pressed by the side surface 2a of the substrate 2 by the substrate abutting portion 34. . That is, if the substrate 2 floating on the land surface 12a is freely moved to the suppressed state, the floating unit 50 is a member for floating the substrate guide body 31 by the land surface 12a. The floating unit 5A of the present embodiment is fixedly disposed between the guide supporting portion 32 and disposed between the substrate guide main body 31 and the air pressure sliding table 82 of the advancing and retracting mechanism. The floating unit 5 has a floating unit body and a gas cylinder 5, and as shown in Fig. 11, a gas cylinder 51 is disposed on the bottom surface portion of the floating unit body 55. That is, the air cushion 51 is placed at a position facing the deck surface 12a. Further, the air cushion 51 is connected to a cylinder (not shown), and air is supplied by a switching operation of a valve (not shown). That is, by the air being supplied to the air cylinder 51, the air cushion 51 is ejected to the side of the deck surface 12a, so that the guide support portion 32 is lifted, and the substrate guide body coupled to the guide support portion 32 is attached. 31 is also subjected to the floating force, and the substrate guide body 31 is slightly floated by the deck surface %. Here, the amount of floating of the substrate guide body 31 is adjusted by the amount of opening of the valve, and in the actual state, (4), the pure abutting portion Μ becomes the height of the substrate 2 floating on the land surface 12a. position. Further, the adjustment of the height of the substrate abutment portion 34 to the height of the floating substrate 2 means that not only the floating amount of the beauty plate 2 and the floating amount of the substrate abutting portion 34 are common, but also can be adjusted to In a state in which the substrate abutting portion 34 is floated, the substrate abuts 100127327. Form No. A0101 Page 23/44 pages 1003351886-0 201214609 The portion 34 can abut the height position of the side surface of the substrate 2. Further, the 'urging means 60 is a member for pressing the substrate guide body 31 against the side of the land surface 123. The urging means 60 of the present embodiment is the air pressure stage 81, and the substrate guide body 31 is pressed against the land surface 12a side by controlling the air supplied to the air pressure stage 81. Specifically, the table 87a of the air slide table 81 is moved downward by the control air, and the advancing and retracting mechanism, the guide support portion 32, and the substrate guide body 31 connected to the table 81 are directly biased downward. The substrate guide body 31 is pressed against the deck surface 12a side. Here, if the air supply amount is increased by opening the width of the floating unit 50, the floating force is increased by the increase in the air discharged from the air cushion 51, and the substrate guide body 31 is displaced upward. On the other hand, if the substrate guide main body 31 is intended to be displaced upward, the air pressure supplied to the air slide table 81 of the urging means 60 does not change, so that the air pressure slightly increases the portion of the table 81a that is slightly displaced upward. The thrust of the table 87a that is intended to move downward is increased. That is, the substrate guide body 31 is subjected to a pressing force downward. In this manner, the height position of the substrate abutting portion 34 can be maintained at the height position of the side surface of the substrate 2 by the position at which the floating force of the floating unit 5'''''''''' With such a substrate guide 30, even in the case of manufacturing or assembly errors such as flatness errors on the surface of the stage 12, the generation of fine particles can be suppressed and the substrate 2 can be transported. Alternatively, the substrate guide 3 can be used to terminate the substrate 2 by the substrate contact portion 34 abutting the side surface 2a of the substrate 2 at a position where the floating force of the floating unit 50 and the pushing force of the pushing means 6 are balanced. In this state, when the substrate guide 3 is being moved in the transport direction and the substrate 2 is being transported, when the flatness error occurs on the surface of the stage 12, for example, assuming that the surface of the stage 12 is raised, the air from the air cushion 51 is sprayed. When the output is constant, the substrate guide body 31 is subjected to the force of the buckle by the floating surface force generated by the air ejection 100127327 form number A0101 page 24/44 pages 1003351886-0 201214609. Displace upwards. If the substrate guide body 31 is displaced upward, the table 81a of the brazing unit 81 is slightly displaced upward, so that the thrust of the #W downward of the table 8la is increased, and the substrate guide body 31 faces downward. Under pressure. Also, even if the deck surface 12a approaches or leaves the substrate guide body 31, the floating force of the floating single & early tg5〇 and the pushing force (restoring force) of the pushing means 6〇 are balanced at the new height position. And the substrate guide is maintained as '俾 substrate guides the ship's tracking platform surface 12a. Therefore, even devices that produce flatness errors on the surface of the platform 12

的製造上及組裝上的誤差,也能抑制行走中的基板導件 3〇接觸平台面12&,可抑制因基板導件30接觸平台面12a 所造成的微粒的產生。The manufacturing and assembly errors can also suppress the substrate guides 3 in the walking contact with the deck surface 12& and can suppress the generation of particles caused by the substrate guide 30 contacting the deck surface 12a.

⑽而且’在上述實施形態(實施例二)中_是針對浮起 單元50的氣倾對兩個基板導件轉31為共通的情形進 仃了說明’但如圖12所示的例子,對基板導件本體31的 每-個配設洋起單元5G的驗者也可n關於各構成由 於與實施例二一樣,故說明省略,惟在該圖12的例子中 ,因基板導件本體31各自獨立配設浮起單元5〇,故基板 導件本體31的浮起量更確實地被保持。但是在圖1〇、圖 11的例子中,因浮起單元50的氣墊51配置於基板2被運送 的區域(基板運送區域)的外側,故可抑制由於自氣塾51 喷出的空氣而在基板運送區域產生溫度變化。亦即,因 可抑制在基板運送區域形成有溫度不均,故可抑制在形 成於基板2的塗佈膜產生基板運送區域的溫度不均所引起 的乾燥不均。 而且,在上述實施形態中雖然是針對基板導件本體31 的基板抵接部34對基板2的側面具有垂直的面的情形進行 100127327 表單編號Α0101 第25頁/共44頁 1003351886-0 201214609 了說明,惟對基板2的側面具有傾斜面3“者也可以。亦 即,因基板導件本體31由平台面12a浮起,故在基板導件 本體31的底面與平台面12a之間形成有間隙。因此,有正 在運送基板2的時候基板2鑽進該間隙,使基板2損傷之虞 。因此如圖13所示,藉由形成使基板抵接部34朝平台面 12a擴徑的傾斜面34a,可避免基板2鑽進間隙的問題。亦 即,开》成朝平台面12a擴徑的傾斜面34a的基板抵接部34 一抵接基板2的側面,與基板抵接部34為垂直面的情形比 較,藉由朝上的力作用於基板2,可抑制基板2朝下位移 。而且,當假设基板2朝下位移時,因形成傾斜面348的 基板抵接部34的保持間隔變窄’故夾持基板2的力更進一 步增加,可抑制基板2朝下位移。亦即,藉由將基板抵接 部34形成上述傾斜面34a,可抑制基板2鑽進因透過氣墊 浮起而形成的在基板導件本艘31與平台面12a之間產生的 間隙。 而且,在上述實施形態中雖然是針對浮起手段13使用 振動器13a使平台12振動並使基板2浮起的例子進行了說 明,惟藉由自平台面12a使空氣噴出而使基板2浮起者也 可以。 而且,在上述實施形態中雖然是針對排列配置有4塊 平台12的例子進行了說明,惟最小構成單位為排列配置 兩塊者也可以,依照運送距離排列配置4塊以上者也可以 〇 而且,在上述實施形態中雖然是針對將基板2運送到 乾燥裝置的例子進行了說明,惟在基板運送裝置1設有乾 燥功能,運送到下一個製程中的曝光裝置(exposure 100127327 表單編號A0101 第26頁/共44頁 201214609 、 eduipment)者也可以。亦即’若為運送基板2的用途的 話,則該用途未被特別限定。 而且,在上述實施形態中雖然是針對基板抵接部34的 形狀為圓筒狀的情形進行了說明,惟刮面為橢圓狀的筒 狀構件也可以’未被特別限定。但是,藉由與基板2的抵 接部分形成圓弧狀而容易調節接觸基板2側面此點較佳。 而且’上述實施形態中的基板運送裝置不僅FpD,若 為太陽電池(solar cell)、有機EL(〇rganic eiec_ troluminescence:有機電致發光)等需使基板的表面的(10) Further, in the above-described embodiment (Embodiment 2), _ is a description of the case where the air tilt of the floating unit 50 is common to the two substrate guide turns 31. However, as shown in the example of FIG. 12, The examiner of each of the substrate guide bodies 31 in which the ejector unit 5G is disposed may also be omitted from the description of the second embodiment. However, in the example of FIG. 12, the substrate guide body is omitted. Since the floating unit 5 is disposed independently of each other, the floating amount of the substrate guide body 31 is more reliably held. However, in the example of FIGS. 1A and 11 , the air cushion 51 of the floating unit 50 is disposed outside the region (substrate transport region) where the substrate 2 is transported, so that the air ejected from the air cylinder 51 can be suppressed on the substrate. The transport area produces temperature changes. In other words, since unevenness in temperature formation in the substrate transporting region can be suppressed, drying unevenness due to temperature unevenness in the substrate transporting region of the coating film formed on the substrate 2 can be suppressed. Further, in the above-described embodiment, the case where the substrate abutting portion 34 of the substrate guide main body 31 has a vertical surface on the side surface of the substrate 2 is 100127327. The form number Α0101 is 25 pages/total 44 pages 1003351886-0 201214609 However, it is also possible to have the inclined surface 3 on the side surface of the substrate 2. That is, since the substrate guide body 31 is floated by the land surface 12a, a gap is formed between the bottom surface of the substrate guide body 31 and the land surface 12a. Therefore, when the substrate 2 is being transported, the substrate 2 is drilled into the gap to damage the substrate 2. Therefore, as shown in Fig. 13, the inclined surface 34a which expands the diameter of the substrate abutting portion 34 toward the land surface 12a is formed. The problem that the substrate 2 is drilled into the gap can be avoided. That is, the substrate abutting portion 34 of the inclined surface 34a which is expanded toward the flat surface 12a abuts against the side surface of the substrate 2, and is perpendicular to the substrate abutting portion 34. In the case of the case, the substrate 2 is prevented from being displaced downward by the upward force. Further, when the substrate 2 is displaced downward, the holding interval of the substrate abutting portion 34 forming the inclined surface 348 is narrowed. 'So the force of clamping the substrate 2 is further advanced By increasing in one step, the substrate 2 can be prevented from being displaced downward. That is, by forming the inclined surface 34a by the substrate abutting portion 34, it is possible to suppress the substrate 2 from being drilled by the floating guide through the air cushion to form the substrate guide 31 and A gap is formed between the deck surfaces 12a. In the above embodiment, an example in which the vibrator 13a is used to vibrate the platform 12 and the substrate 2 is floated by the floating means 13 is described, but the self-platform surface 12a is used. Although the substrate 2 may be ejected and the substrate 2 may be floated. In the above embodiment, the example in which four stages 12 are arranged in a row is described. However, the minimum unit of arrangement may be two in a row. In the above embodiment, the case where the substrate 2 is transported to the drying device has been described. However, the substrate transport device 1 is provided with a drying function and is transported to the next process. The exposure device (exposure 100127327 Form No. A0101, page 26/44 pages 201214609, eduipment) can also be used. That is, if it is used for transporting the substrate 2 In the above embodiment, the case where the shape of the substrate abutting portion 34 is a cylindrical shape has been described, but the cylindrical member having an arcuate surface may be ' However, it is preferable that the contact surface of the substrate 2 is formed in an arc shape to easily adjust the side surface of the contact substrate 2. Further, the substrate transfer device in the above embodiment is not only FpD but also a solar cell ( Solar cell), organic EL (〇rganic eiec_ troluminescence: organic electroluminescence), etc.

Cj 乾燥狀態一定而進行運送的領域的話,則可適用於遍及 許多種類的領域。 【圖式簡單說明】 圖1是顯示本發明的一實施形態中的基板運送裝置之 俯視圖。 圖2是放大上述基板運送裝置的—單元之俯視圖。 圖3是上述基板運送裝置的一單元之侧視圖。 圖4是上述基板運送装置的一單元之前視圖。 圖5是顯示藉由上述基板運送裝置的基板導件將基板 運送到接鄰的平台的狀態之俯視圖。 圖6是顯不上述基板導件退避,定位銷為突出狀態的 狀態之俯視圖。 圖7是顯示上述基板導件返回到原來的位置的狀態之 俯視圖。 圖8是顯示上述基板導件之圖,U)為其侧視圖,㈤ 為其剖面圖。 100127327 圖9是顯示上述基板運送裴置的動作之流程圖。 表單編號A0101 第27頁/共44頁 1003351886-0 201214609 圖ίο是其他的實施形態中的基板導件之俯視圖。 圖11是圖10之A-A剖面圖。 圖12是其他的實施形態中的基板導件之俯視圖。 圖13是顯示其他的實施形態中的在基板抵接部保持有 基板的狀態之圖。 【主要元件符號說明】 [0007] 1:基板運送裝置 2:基板 2 a:基板的側面 10:平台單元 11 .·基台 12:平台 1 2a:平台面 13:浮起手段 1 3 a:振動器 14 :定位銷 20:運送單元 30:基板導件 31 :基板導件本體 32:導件支撐部 32a :臂部 33.·導件軸部 34:基板抵接部 3 4 a :傾斜面 3 5 :滑動襯套 4 0 :運送驅動部 表單編號A0101 100127327 第28頁/共44頁 1003351886-0 201214609 41 :導軌 42:運送本體部 42a:搭載部 42b:腳部 43:線性馬達 44:LM導件 50:浮起單元 51 :氣墊When Cj is in a dry state, it can be applied to many types of fields. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a substrate transfer device according to an embodiment of the present invention. Fig. 2 is a plan view showing a unit in which the substrate transfer device is enlarged. Fig. 3 is a side view of a unit of the above substrate transfer device. Figure 4 is a front elevational view of a unit of the above substrate transport device. Fig. 5 is a plan view showing a state in which the substrate is transported to the adjacent platform by the substrate guide of the substrate transfer device. Fig. 6 is a plan view showing a state in which the substrate guide is retracted and the positioning pin is in a protruding state. Fig. 7 is a plan view showing a state in which the substrate guide is returned to the original position. Fig. 8 is a view showing the above substrate guide, U) is a side view thereof, and (5) is a sectional view thereof. 100127327 Fig. 9 is a flow chart showing the operation of the above substrate transporting device. Form No. A0101 Page 27 of 44 1003351886-0 201214609 Fig. 1 is a plan view of a substrate guide in another embodiment. Figure 11 is a cross-sectional view taken along line A-A of Figure 10; Fig. 12 is a plan view showing a substrate guide in another embodiment. Fig. 13 is a view showing a state in which a substrate is held by a substrate abutting portion in another embodiment. [Description of main component symbols] [0007] 1: Substrate transport device 2: Substrate 2 a: Side surface 10 of the substrate: Platform unit 11 · Base 12: Platform 1 2a: Platform surface 13: Floating means 1 3 a: Vibration The locating pin 20: the transport unit 30: the substrate guide 31: the substrate guide body 32: the guide support portion 32a: the arm portion 33. the guide shaft portion 34: the substrate abutment portion 3 4 a : the inclined surface 3 5 : Sliding bushing 4 0 : Transport drive unit form No. A0101 100127327 Page 28 / Total 44 pages 1003351886-0 201214609 41 : Guide rail 42 : Transport main body portion 42 a : Mounting portion 42 b : Foot portion 43 : Linear motor 44 : LM guide Item 50: Floating unit 51: air cushion

52:空氣供給路徑 60:推迫手段 61 :螺旋彈簧 71:吸引部 71a:開口部 72:防塵蓋 81、82:氣壓滑台 100127327 表單編號A0101 第29頁/共44頁 1003351886-052: Air supply path 60: Push means 61: Coil spring 71: Suction portion 71a: Opening portion 72: Dust cover 81, 82: Air slide table 100127327 Form No. A0101 Page 29 of 44 1003351886-0

Claims (1)

201214609 七、τ請專利範圍: -種基板運送裝置…邊藉由基板 1千導引由平台的主 使,、浮起的基板,一邊運送,其特徵為 、面 該基板導件包含: 並且可位移於與平A 浮起之浮起單元;以 藉由抵接基板的側面限制基板, 的表面垂直的方向之基板導件本體; 由平台的表面使該基板導件本體 及 肝这巷板導件本體推迫於平台的表 具有抵接基板的:’ 该基板抵接部的高度位置藉由該浮起單- 、钱4, 2 維持於由平台的表面浮起的基板的高度位置該推追手段被 ==利範圍第1項之基板運心,其中。該基板導件 在,、該千口的表面對向的位置包含氣墊 空氣被供^該氣墊而由該氣_該平台的表面使 出並由平台表面使該基板導件本體浮起。 '、、 如申請專利範圍第i項或第"之基板運送裝置其中 起單元的氣塾U與該基板導件本體的基板抵接部不同體 而形成。 4. 如中請專利範圍第i項至第3項中任_項之基板運送裝置, 其中該浮起單元的氣塾配設於該平台中的基板運送區域以 外的位置。 5. 如f請專利_第丨項或第2項之基板運送裝置,其中該基 板導件在與平台的表面對向的該基板導件本體的底面部包 含氣墊,该净起單元藉由空氣被供給到該氣墊而由該氣墊 100127327 表單編號A0101 第30頁/共44頁 1003351886-0 201214609 6201214609 VII, τ, the scope of the patent: - a kind of substrate transport device ... while the substrate is guided by a thousand guides, the floating substrate is transported, characterized in that the substrate guide comprises: Displacement of the floating unit that floats with the flat A; the substrate guide body that is perpendicular to the surface of the substrate by the side surface of the abutting substrate; the substrate guide body and the liver plate are guided by the surface of the platform The table body is urged to the table of the platform to abut the substrate: 'the height position of the substrate abutting portion is maintained by the height position of the substrate floating on the surface of the platform by the floating single-, money 4, 2 The chasing method is the heart of the substrate of the == profit range item 1, among them. The substrate guide includes air cushions at a position opposite the surface of the thousand ports. The air cushion is supplied to the air cushion to be lifted by the surface of the air and the substrate guide body is floated by the platform surface. ',, as in the substrate transfer device of the i-th or the " patent application scope, the gas cartridge U of the unit is formed differently from the substrate abutting portion of the substrate guide body. 4. The substrate transport apparatus of any of clauses 1-4, wherein the air raft of the floating unit is disposed at a position other than the substrate transport area in the platform. 5. The substrate transport device of claim 2, wherein the substrate guide comprises an air cushion on a bottom surface portion of the substrate guide body opposite to a surface of the platform, the clean unit being air Is supplied to the air cushion by the air cushion 100127327 Form No. A0101 Page 30 / Total 44 Page 1003351886-0 201214609 6 8 .如8. As 使空氣喷出並由平台表面使該基板導件本體浮起 如申請專利範圍第1項或第5項之基板運送裝=,其中1某 板導件更包含錢該基板導件本體㈣件切邹,、藉由: 導件支採部,縣板導件本體可位移於料^表面㈣ 的方向而被讀’於㈣構件在科件支料與基板導件 本體之間收縮的狀態下被配設,藉由該彈簧構件:基板導 件本體被推迫於平台的表面側。 如申請專職項之基板運送裝置,其巾在 禮部於該基㈣件本體被切的衫魏有則部,該吸 引部開口於該基板抵接部側。 申請專利_第7項之基板運送裝置,其巾該導件支撑 部包含延料該基減接独岐子,該蓋托置於比該 =引部的開π還外側,以覆蓋基板導件本體的全周而被配 «又在-玄蓋子與该基板抵接部之間形成有間隙。 如申請專利範圍第1項至第8射任-項之基板運送裝置’ 其中該基板抵接部具㈣基㈣側涵斜的傾斜面, 斜面具有朝平㈣表面擴徑的形狀。 該傾 100127327 表單編號AO! 第31頁/共44頁 1003351886-0Ejecting air and floating the substrate guide body by the surface of the platform, as in the substrate transporting device of claim 1 or 5, wherein 1 a plate guide further includes money for the substrate guide body (four) Zou, by: the guide branch mining section, the county plate guide body can be displaced in the direction of the surface (four) of the material and is read 'in the state of the (four) member is contracted between the article material and the substrate guide body Provided by the spring member: the substrate guide body is urged to the surface side of the platform. For example, in the case of the substrate transporting device for the full-time item, the towel is cut in the body of the base (four), and the suction portion is opened on the side of the substrate abutting portion. The substrate transport device of claim 7, wherein the guide support portion comprises a material extending the base, and the cover is placed outside the opening π of the = lead to cover the substrate guide body. The entire circumference is matched with a gap formed between the - cover and the substrate abutment. The substrate transfer device of the first to eighth shots of the patent application range is wherein the substrate abutting portion has a sloped surface on which the base (4) side is inclined, and the inclined surface has a shape that expands toward the flat (four) surface. The inclination 100127327 Form number AO! Page 31 of 44 1003351886-0
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