WO2011102410A1 - Transfer apparatus, transfer method, exposure apparatus, and device manufacturing method - Google Patents

Transfer apparatus, transfer method, exposure apparatus, and device manufacturing method Download PDF

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Publication number
WO2011102410A1
WO2011102410A1 PCT/JP2011/053356 JP2011053356W WO2011102410A1 WO 2011102410 A1 WO2011102410 A1 WO 2011102410A1 JP 2011053356 W JP2011053356 W JP 2011053356W WO 2011102410 A1 WO2011102410 A1 WO 2011102410A1
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WO
WIPO (PCT)
Prior art keywords
substrate
support
unit
plate holder
supporting
Prior art date
Application number
PCT/JP2011/053356
Other languages
French (fr)
Japanese (ja)
Inventor
麻子 金城
康之 牛島
哲嗣 花崎
Original Assignee
株式会社ニコン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=44482996&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2011102410(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 株式会社ニコン filed Critical 株式会社ニコン
Priority to CN201180009815.0A priority Critical patent/CN102763209B/en
Priority to KR1020127023739A priority patent/KR101883319B1/en
Priority to KR1020197026974A priority patent/KR102172551B1/en
Priority to KR1020187021346A priority patent/KR102023655B1/en
Priority to JP2012500640A priority patent/JP5915521B2/en
Publication of WO2011102410A1 publication Critical patent/WO2011102410A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
    • B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
    • B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Definitions

  • the present invention relates to a transport apparatus, a transport method, an exposure apparatus, and a device manufacturing method.
  • processing apparatuses for large substrates such as exposure apparatuses and inspection apparatuses are used.
  • a transport apparatus as disclosed in the following patent document that transports a large substrate (for example, a glass substrate) to the processing apparatus is used.
  • An object of the present invention is to provide a transport apparatus, a transport method, an exposure apparatus, and a device manufacturing method capable of delivering a substrate without causing displacement and deformation.
  • a gas is supplied to one surface of the substrate, and a first support portion capable of supporting the substrate in a floating manner via the gas, and a first support portion capable of supporting the one surface of the substrate.
  • Two support parts a driving part that moves at least one of the first and second support parts, and that arranges the first and second support parts in proximity to or in contact with each other in the first direction, and the driving part.
  • a transfer device including a transfer unit that moves the substrate supported by one of the arranged first and second support units to the other side along the first direction.
  • a gas is supplied to one surface of the substrate, the first support portion capable of supporting the substrate in a levitating manner through the gas, and the first support portion capable of supporting the one surface of the substrate.
  • 2 and 3rd support part, and the 1st drive part which moves at least one of said 1st and 2nd support part, and makes this 1st and 2nd support part adjoin or contact mutually, and is arranged in the 1st direction
  • a second driving unit that moves at least one of the first and third support units and arranges the first and third support units in the second direction by bringing them into close proximity or contact with each other, and the first driving unit.
  • the first transfer unit that moves the substrate supported by the second support unit arranged in the first support unit toward the first support unit along the first direction, and the second driving unit,
  • the substrate supported by the first support portion arranged in a third support portion is arranged along the second direction.
  • Serial and second transfer portion, the transfer device comprising a are provided for moving the third support part side.
  • a transport method for transporting a substrate wherein the first support portion capable of levitating and supporting the substrate via a gas supplied to the one surface of the substrate and the one surface of the substrate are provided.
  • Moving at least one of the supportable second support parts, arranging the first and second support parts in the first direction in proximity to or in contact with each other, and arranging the arranged first and second support parts Moving the substrate supported by one side to the other side along the first direction is provided.
  • a gas is supplied to one surface of the substrate, a first support part capable of supporting the substrate in a levitating manner through the gas, and a second support for supporting the one surface of the substrate.
  • a support unit a drive unit that moves at least one of the first and second support units, and arranges the first and second support units in close proximity to or in contact with each other; and the first unit arranged by the drive unit 2
  • the substrate supported by the support part is placed on the placement part of the first support part by stopping the supply of the gas and the transfer part that moves to the first support part side along the arrangement direction.
  • a lifting mechanism that supports the substrate and lifts it above the placement portion; and a carry-out mechanism that unloads the substrate supported above the placement portion by the lifting mechanism from the first support portion.
  • a transport apparatus is provided.
  • the substrate placed on the placement portion of the first support portion is supported by transferring to the first support portion side along the arrangement direction and stopping the supply of the gas.
  • a transport method including lifting up above the part and carrying out the substrate supported above the placement part from the first support part.
  • an exposure apparatus that exposes a substrate with exposure light
  • the exposure apparatus comprising the transport device that holds the substrate and moves the substrate to an irradiation area of the exposure light.
  • the pattern is transferred to the substrate, and the substrate to which the pattern is transferred is processed based on the pattern.
  • a device manufacturing method is provided.
  • FIG. 1 It is a figure explaining the structure which conveys a board
  • Embodiments of the present invention will be described with reference to the drawings. Note that the present invention is not limited to this.
  • an exposure apparatus that includes the transport apparatus according to the present invention and performs an exposure process for exposing a liquid crystal display device pattern to a substrate coated with a photosensitive agent will be described, and the transport method and device manufacture according to the present invention will be described. An embodiment of the method is also described.
  • FIG. 1 is a cross-sectional plan view showing a schematic configuration of the exposure apparatus of the present embodiment.
  • the exposure apparatus 1 includes an exposure apparatus main body 3 that exposes a liquid crystal display device pattern on a substrate, a carry-in unit 4, and a carry-out unit 5, which are highly purified. And housed in a chamber 2 adjusted to a predetermined temperature.
  • the substrate is a large glass plate, and the size of one side thereof is, for example, 500 mm or more.
  • FIG. 2 is an external perspective view showing a specific configuration in the chamber 2.
  • the exposure apparatus main body 3 includes an illumination system (not shown) that illuminates the mask M with exposure light IL, a mask stage (not shown) that holds the mask M on which a liquid crystal display device pattern is formed, Projection optical system PL disposed below the mask stage, and a plate holder 9 as a substrate holder provided so as to be movable two-dimensionally on a base portion (not shown) disposed below the projection optical system PL. And a first moving mechanism 33 that holds the plate holder 9 and moves the plate holder 9 in the chamber 2.
  • the two-dimensional movement of the plate holder 9 with respect to a base portion (not shown) provided in the chamber 2 is performed in a horizontal plane, and the X axis is orthogonal to each other in the horizontal plane.
  • the Y axis is set.
  • the holding surface of the plate holder 9 with respect to the substrate P is parallel to the horizontal plane in a reference state (for example, a state when the substrate P is transferred).
  • the Z axis is set in a direction orthogonal to the X axis and the Y axis, and the optical axis of the projection optical system PL is parallel to the Z axis.
  • the directions around the X, Y, and Z axes are referred to as the ⁇ X direction, the ⁇ Y direction, and the ⁇ Z direction, respectively.
  • the first moving mechanism 33 includes a moving mechanism main body 35 and a holding portion 34 that is disposed on the moving mechanism main body 35 and holds the plate holder 9.
  • the moving mechanism body 35 is supported by a gas bearing in a non-contact manner on a guide surface (base portion) (not shown) and can move on the guide surface in the XY directions. Based on such a configuration, the plate holder 9 can move within a predetermined region of the guide surface on the light emission side (image surface side of the projection optical system PL) while holding the substrate P.
  • the moving mechanism main body 35 can move in the XY plane on the guide surface by the operation of a coarse motion system including an actuator such as a linear motor.
  • the holding unit 34 can move in the Z-axis, ⁇ X, and ⁇ Y directions with respect to the moving mechanism body 35 by operation of a fine movement system including an actuator such as a voice coil motor.
  • the holding unit 34 operates in six directions including the X axis, the Y axis, the Z axis, the ⁇ X, the ⁇ Y, and the ⁇ Z directions while holding the substrate P by the operation of the substrate stage driving system including the coarse movement system and the fine movement system. It is movable.
  • the exposure apparatus 1 performs step-and-scan exposure with the rectangular substrate P placed on the plate holder 9, and a plurality of patterns formed on the mask P, for example 4
  • the images are sequentially transferred to two exposure areas (pattern transfer areas). That is, in the exposure apparatus 1, the slit M on the mask M is illuminated by the exposure light IL from the illumination system, and the mask M is moved by a controller (not shown) via a drive system (not shown).
  • the pattern of the mask M in one exposure region on the substrate P is obtained by moving the mask stage to be held and the plate holder 9 for holding the substrate P in synchronization in a predetermined scanning direction (here, the Y-axis direction). Is transferred, that is, scanning exposure is performed.
  • the exposure apparatus 1 is a so-called multi-lens scan in which the projection optical system PL includes a plurality of projection optical modules, and the illumination system includes a plurality of illumination modules corresponding to the plurality of projection optical modules. It constitutes an exposure apparatus.
  • a stepping operation for moving the plate holder 9 in the X direction by a predetermined amount to the scanning start position of the next exposure area is performed.
  • the pattern of the mask M is sequentially transferred to the four exposure regions by repeatedly performing such scanning exposure and stepping operation.
  • the substrate P coated with a photosensitive agent is carried in a coater / developer (not shown) arranged adjacent to the exposure apparatus 1 as shown in FIG. ) And a second moving mechanism 43 that moves the carry-in table 40.
  • the carry-in unit 4 can adjust the temperature of the substrate P carried into the carry-in table 40.
  • the second moving mechanism 43 includes a moving mechanism main body 45 and a holding portion 44 that is disposed on the moving mechanism main body 45 and holds the loading table 40.
  • the moving mechanism main body 45 is supported by a gas bearing in a non-contact manner on a guide surface (not shown) and can move in the XY directions on the guide surface. Based on such a configuration, the carry-in table 40 can move within a predetermined region of the guide surface while holding the substrate P.
  • the support of the moving mechanism main body 45 with respect to the guide surface (not shown) is not limited to the support by the gas bearing, and a well-known guide mechanism (drive mechanism for the guide surface) different from the gas bearing can also be used.
  • the moving mechanism main body 45 has the same configuration as that of the moving mechanism main body 35 and can move in the XY plane on the guide surface.
  • the holding unit 44 has the same configuration as the holding unit 34 and can move in the Z-axis, ⁇ X, and ⁇ Y directions with respect to the moving mechanism main body 45.
  • the holding unit 44 can move in six directions including the X axis, the Y axis, the Z axis, the ⁇ X, the ⁇ Y, and the ⁇ Z directions while holding the substrate P.
  • the carry-out unit 5 supports the one surface (lower surface) of the substrate P when the substrate P subjected to the exposure process by the exposure apparatus main body 3 is delivered as shown in FIG. And a third moving mechanism 53 that moves the unloading table 50.
  • the third moving mechanism 53 includes a moving mechanism main body 55 and a holding portion 54 that is disposed on the moving mechanism main body 55 and holds the unloading table 50.
  • the moving mechanism body 55 is supported by a gas bearing in a non-contact manner on a guide surface (not shown) and can move in the XY directions on the guide surface. Based on such a configuration, the carry-out table 50 can move within a predetermined region of the guide surface while holding the substrate P.
  • the moving mechanism main body 55 has the same configuration as the moving mechanism main bodies 35 and 45, and can move in the XY plane on the guide surface.
  • the holding portion 54 has the same configuration as the holding portions 34 and 44 and can move in the Z-axis, ⁇ X, and ⁇ Y directions with respect to the moving mechanism main body 55.
  • the holding unit 54 can move in six directions including the X axis, the Y axis, the Z axis, the ⁇ X, the ⁇ Y, and the ⁇ Z directions while holding the substrate P.
  • FIG. 3A is a diagram illustrating a planar configuration of the plate holder 9
  • FIG. 3B is a diagram illustrating a side configuration of the plate holder 9.
  • the plate holder 9 is formed with a substrate placement portion 31 on which the substrate P is placed.
  • the upper surface of the substrate platform 31 is finished so that the substantial holding surface of the plate holder 9 with respect to the substrate P has good flatness.
  • a plurality of suction holes K1 are provided on the upper surface of the substrate mounting portion 31 for bringing the substrate P into close contact with this surface.
  • Each suction hole K1 is connected to a vacuum pump (not shown).
  • a plurality of gas injection holes K ⁇ b> 2 are provided on the upper surface of the substrate mounting portion 31 to levitate and support the substrate P through the gas by injecting a gas such as air onto the lower surface of the substrate P.
  • Each gas injection hole K2 is connected to a gas injection pump (not shown).
  • the suction holes K1 and the gas injection holes K2 are arranged in a staggered manner.
  • the guide pins 36 and the positioning pins 37 can be moved together with the plate holder 9 in the exposure apparatus main body 3.
  • the plate holder 9 is provided with a position detection sensor 19 on the side surface portion 9 a for detecting the relative positions of the carry-in table 40 and the carry-out table 50.
  • the position detection sensor 19 is a distance detection sensor 19a for detecting a relative distance with respect to the carry-in table 40 and the carry-out table 50, and a height for detecting a relative height with respect to the carry-in table 40 and the carry-out table 50.
  • a detection sensor 19b A concave portion is formed at a position corresponding to the position detection sensor 19 in the carry-in table 40 and the carry-out table 50, so that the position detection sensor 19 interferes with the carry-in table 40 and the carry-out table 50. Is preventing.
  • FIG. 4A is a plan view showing a peripheral configuration of the loading table 40
  • FIG. 4B is a diagram showing a cross section taken along line AA in FIG. 4A.
  • the carry-in unit 4 is provided with a first transfer unit 42 that transfers the substrate P from the carry-in table 40 to the plate holder 9.
  • the first transfer part 42 includes a guide part 42 a and a contact part 42 b that comes into contact with the substrate P.
  • the guide portion 42a is provided in the recess 40a.
  • the contact portion 42b is attached to the guide portion 42a in a state of protruding from the upper surface of the loading table 40.
  • the contact portion 42b is made of an elastic member such as rubber, and can reduce damage to the substrate P at the time of contact.
  • a plurality of gas injection holes K3 are provided on the upper surface of the carry-in table 40 to levitate and support the substrate P through the gas by injecting a gas such as air onto the lower surface of the substrate P.
  • Each gas injection hole K3 is connected to a gas injection pump (not shown).
  • a plurality of suction holes K4 are provided on the upper surface of the loading table 40 for bringing the substrate P into close contact with the surface.
  • Each suction hole K4 is connected to a vacuum pump (not shown).
  • the gas injection holes K3 and the suction holes K4 are arranged in a staggered manner along the Y direction.
  • the gas injection holes K3 and the suction holes K4 are not limited to the staggered arrangement, and may be arranged in various forms (for example, they may be arranged alternately along the Y direction).
  • the gas injection hole K3 and the suction hole K4 are not limited to being provided independently from each other, and the same hole may be used as the gas injection hole K3 and the suction hole K4. In this case, each hole may be connected to a gas injection pump and a vacuum pump so as to be appropriately switched.
  • the carry-in table 40 is formed with a through-hole 47 through which a substrate support pin of a vertical movement mechanism for passing the substrate P to and from a coater / developer (not shown) can be inserted as will be described later. ing.
  • the unloading unit 5 is provided with a second transfer unit 52 that transfers the substrate P from the plate holder 9 to the unloading table 50.
  • the second transfer part 52 includes a guide part 52 a and a suction part 52 b that sucks and holds the substrate P.
  • the suction unit 52b includes a vacuum suction pad that holds the substrate P by vacuum suction, for example.
  • the suction portion 52b is provided with a contact portion 58 that contacts the substrate P pushed out from the plate holder 9 when the substrate is carried out.
  • the contact portion 58 is made of an elastic member such as rubber.
  • a plurality of gas injection holes K5 are provided on the upper surface of the carry-out table 50 to levitate and support the substrate P by injecting a gas such as air onto the lower surface of the substrate P.
  • Each gas injection hole K5 is connected to a gas injection pump (not shown).
  • a plurality of suction holes K6 are provided on the upper surface of the unloading table 50 for bringing the substrate P into close contact with the surface.
  • Each suction hole K6 is connected to a vacuum pump (not shown).
  • the gas injection holes K5 and the suction holes K6 are arranged in a staggered manner.
  • the unloading table 50 is formed with a through-hole 57 through which a substrate support pin of a vertical movement mechanism for passing the substrate P to and from a coater / developer (not shown) can be inserted as will be described later. ing.
  • the carry-in table 40 of the carry-in unit 4 and the carry-out table 50 of the carry-out unit 5 are arranged at different positions in the same horizontal plane. That is, the carry-in table 40 and the carry-out table 50 are arranged at positions that do not overlap each other in a plan view state (a state seen from the + Z direction shown in FIG. 2).
  • a substrate P coated with a photosensitive agent is carried into the carry-in section 4 by a coater / developer (not shown).
  • the vertical movement mechanism 49 positioned below the loading table 40 has the substrate support pins 49 a disposed above the loading table 40 through the through holes 47.
  • the arm portion 48 of the coater / developer (not shown) is inserted between the substrate support pins 49a as shown in FIG.
  • the arm portion 48 moves down to deliver the substrate P to the substrate support pins 49a and then retracts from the carry-in portion 4.
  • the vertical movement mechanism 49 finishes the operation of loading the substrate P onto the loading table 40 by lowering the substrate support pins 49a that support the substrate P. Thereafter, when the vacuum pump is driven, the substrate P is sucked and held on the upper surface of the loading table 40 via the suction hole K4.
  • the plate holder 9 moves so as to be close to the loading table 40 of the loading section 4 as shown in FIG. 7A.
  • the first moving mechanism 33 arranges the plate holder 9 and the carry-in table 40 close to each other along the Y direction.
  • the state where the plate holder 9 and the carry-in table 40 are close to each other means a state where the plate holder 9 and the carry-in table 40 are separated by a distance at which the movement of the substrate P is smoothly performed during delivery of the substrate P described later.
  • the second moving mechanism 43 can be driven.
  • the loading table 40 and the plate holder 9 can be moved to the delivery position of the substrate P in a short time, and the time required for the loading operation of the substrate P can be shortened.
  • the carry-out table 50 is retracted to a position where it does not interfere with the carry-in table 40.
  • the substrate P is sucked and held on the upper surface of the loading table 40 through the suction hole K4, the substrate P is prevented from moving on the loading table 40 when the second moving mechanism 43 is driven. be able to.
  • the substrate P is disposed higher than the plate holder 9.
  • the first moving mechanism 33 brings the plate holder 9 close to the loading table 40 so that the upper surface of the loading table 40 supporting the substrate P is higher than the upper surface of the plate holder 9.
  • the loading table 40 can be raised by the second moving mechanism 43 so that the upper surface of the loading table 40 is higher than the upper surface of the plate holder 9.
  • the 1st moving mechanism 33 can also be arranged in the state which contacted the plate holder 9 and the table 40 for carrying in. If it does in this way, delivery of the board
  • the carry-in table 40 injects gas from a plurality of gas injection holes K3 formed on the upper surface, and supports the substrate P in a state of floating through the gas.
  • the plate holder 9 injects gas from the plurality of gas injection holes K2 formed on the upper surface.
  • the carry-in section 4 brings the contact portion 42b into contact with one end portion of the substrate P as shown in FIG. 9 while the substrate P is levitated and supported on the carry-in table 40.
  • the contact part 42b moves the substrate P toward the plate holder 9 by moving along the guide part 42a in the recess 40a.
  • the contact portion 42b can smoothly slide the substrate P to the plate holder 9 side.
  • the upper surface of the plate holder 9 supports the substrate P as described above.
  • the gas injected from the gas injection holes K3 and K2 may have directivity.
  • the substrate P that slides on the upper surface of the loading table 40 by the abutting portion 42b smoothly moves to the upper surface of the plate holder 9 as shown in FIG.
  • the substrate P since the upper surface of the loading table 40 is higher than the upper surface of the plate holder 9, the substrate P can smoothly transfer onto the plate holder 9 without contacting the side surface of the plate holder 9. it can.
  • the substrate P slides in a state where the position in the X direction in the drawing is defined by the guide pins 36 provided in the periphery of the plate holder 9.
  • the abutting portion 42b moves the substrate P until it abuts on a positioning pin 37 provided on the downstream side of the plate holder 9 in the substrate transport direction.
  • the position of the substrate P in the X direction in the figure is defined by the guide pins 36, and the position in the Y direction in the figure is defined by being sandwiched between the positioning pins 37 and the contact portions 42b.
  • the plate holder 9 stops gas injection from the gas injection hole K2.
  • the substrate P is placed in a state of being aligned with the substrate platform 31.
  • the substrate is displaced (displacement from a predetermined placement position) or the substrate is deformed.
  • One possible cause of this displacement is that the substrate floats due to a thin air layer generated between the substrate and the plate holder immediately before the substrate is placed, for example.
  • the substrate swells due to an air pocket interposed between the substrate and the plate holder after the substrate is placed.
  • the substrate P since the substrate P is transported in a state of being floated by gas injection as described above, the substrate P is transferred to the plate holder 9 with no distortion and high flatness. Further, since the substrate P is placed on the substrate platform 31 from the height at which the substrate P is levitated, it is possible to prevent an air pool or an air layer from being generated between the substrate P and the substrate platform 31. . Therefore, it becomes possible to prevent the substrate P from being swollen and prevent the substrate P from being displaced or deformed. Therefore, the substrate P can be placed at a predetermined position with respect to the plate holder 9 with high flatness. Thereafter, when the vacuum pump is driven, the substrate P is adsorbed and held on the upper surface of the substrate platform 31 via the suction hole K1.
  • the mask M After placing the substrate P on the plate holder 9, the mask M is illuminated with the exposure light IL from the illumination system.
  • the pattern of the mask M illuminated with the exposure light IL is projected and exposed to the substrate P placed on the plate holder 9 via the projection optical system PL. Since the exposure apparatus 1 can satisfactorily place the substrate P on the plate holder 9 as described above, predetermined exposure can be performed at an appropriate position on the substrate P with high accuracy, and reliability can be improved. High exposure processing can be realized.
  • the photosensitive agent is applied by a coater / developer (not shown) while the substrate P is being exposed or while the exposed substrate P is being transported to the carry-out unit 5 as will be described later.
  • the next coated substrate P can be placed on the loading table 40 of the loading unit 4.
  • the plate holder 9 moves so as to be close to the unloading table 50 of the unloading unit 5 as shown in FIG.
  • the first moving mechanism 33 arranges the plate holder 9 and the unloading table 50 close to each other along the Y direction. At this time, since the substrate P is sucked and held through the suction hole K1, it is possible to prevent the substrate P from moving on the substrate platform 31 when the first moving mechanism 33 is driven.
  • the third moving mechanism 53 can be driven.
  • the loading table 40 and the plate holder 9 can be moved to the delivery position of the substrate P in a short time, and the time required for the unloading operation of the substrate P can be shortened.
  • the carry-in table 40 is retracted to a position where it does not interfere with the carry-out table 50.
  • the substrate P is arranged higher than the plate holder 9 corresponding to the transfer destination of the substrate P, as when the plate holder 9 and the carry-in table 40 are brought close to each other. is doing. That is, the first moving mechanism 33 brings the plate holder 9 close to the unloading table 50 so that the upper surface of the plate holder 9 supporting the substrate P is higher than the upper surface of the unloading table 50. Note that the carry-out table 50 can be lowered by the third moving mechanism 53 so that the upper surface of the carry-out table 50 is lower than the upper surface of the plate holder 9.
  • the first moving mechanism 33 can be arranged in a state where the plate holder 9 and the unloading table 50 are in contact with each other. If it does in this way, delivery of substrate P between plate holder 9 mentioned below and carrying-out table 50 can be performed smoothly.
  • the plate holder 9 stops driving the vacuum pump, and releases the suction holding of the substrate P to the substrate mounting portion 31 through the suction hole K1. Subsequently, as shown in FIG. 13, the plate holder 9 injects gas from the plurality of gas injection holes K2 formed on the upper surface of the substrate mounting portion 31 and floats the substrate P through the gas. Support with. On the other hand, when the unloading unit 5 receives the substrate P, the unloading unit 5 injects gas from a plurality of gas injection holes K5 formed on the upper surface of the unloading table 50.
  • the unloading section 5 moves the suction section 52b of the second transfer section 52 along the guide section 52a toward the substrate P that is levitated and supported on the substrate placement section 31 of the plate holder 9.
  • the positioning pins 37 press the end of the substrate P that floats on the substrate platform 31 as shown in FIG. 14A.
  • the substrate P that floats on the substrate platform 31 slides toward the carry-out table 50 and comes into contact with the contact portion 58 attached to the suction portion 52b as shown in FIG. 14B.
  • the suction portion 52b sucks and holds the substrate P and moves along the Y direction in the drawing along the guide portion 52a as shown in FIG. 14C.
  • the suction portion 52b can smoothly slide the substrate P toward the unloading table 50 side. Further, the upper surface of the carry-out table 50 supports the substrate P as described above.
  • the gas injected from the gas injection holes K2 and K5 may have directivity.
  • the substrate P that slides on the upper surface of the substrate platform 31 by the movement of the suction unit 52b smoothly moves to the upper surface of the carry-out table 50.
  • the substrate P since the upper surface of the plate holder 9 is higher than the upper surface of the unloading table 50, the substrate P smoothly transfers onto the unloading table 50 without contacting the side surface of the unloading table 50. be able to.
  • the carry-out table 50 stops the gas injection from the gas injection hole K5 and holds the substrate P by suction through the suction hole K6.
  • the unloading unit 5 drives the third moving mechanism 53 in a state where the substrate P is sucked and held, and moves the unloading table 50 to the unloading position of the substrate P.
  • the exposure apparatus 1 transfers the substrate P from the plate holder 9 to the carry-out unit 5, and then moves the plate holder 9 close to the carry-in table 40 of the carry-in unit 4. Similarly, the substrate P can be transferred between the loading table 40 and the plate holder 9, and the exposure process can be performed on the substrate P placed on the plate holder 9.
  • the next substrate P is placed on the carry-out table 50 while the next substrate P is being carried into the plate holder 9 from the carry-in unit 4 or while the next substrate P is being subjected to the exposure process.
  • the exposed substrate P is unloaded.
  • the vertical movement mechanism 60 located below the carry-out table 50 arranges the substrate support pins 60 a above the carry-out table 50 through the through holes 57.
  • substrate P will be hold
  • the arm 48 of the coater / developer (not shown) is inserted between the substrate support pins 60a as shown in FIG.
  • substrate P is delivered to the arm part 48 by dropping the board
  • the arm unit 48 moves the substrate P into a coater / developer (not shown) and performs development processing.
  • the plate holder 9 alternately accesses the carry-in unit 4 and the carry-out unit 5 by moving in the same horizontal plane (XY plane), thereby performing the carry-in / out operation of the substrate P with respect to the exposure apparatus main body 3. It can be carried out.
  • the plate holder 9 since the plate holder 9 is moved along the arrangement direction of the carry-in unit 4 and the carry-out unit 5, the plate holder 9 and the carry-in unit 4 and the carry-out unit 5 are arranged close to or in contact with each other. Can be done in a short time. Therefore, the processing time (so-called tact) associated with the loading / unloading operation of the substrate P can be shortened.
  • the substrate P supported to be levitated can be slid and transferred from the loading unit 4 to the plate holder 9, an air pool or air is provided between the substrate P and the substrate platform 31. It is possible to prevent the generation of a layer, and to prevent the substrate P from being displaced or deformed. Therefore, highly reliable exposure processing can be performed.
  • the upper surface of the loading table 40 can be inclined.
  • the holding portion 44 of the second moving mechanism 43 has the upper surface of the loading table 40 that supports the substrate P in a state of being floated by gas injection from the gas injection hole K3 on the plate holder 9 side ( ⁇ Y direction). Tilt. Accordingly, the substrate P can be moved to the plate holder 9 side by utilizing the weight of the substrate P.
  • the upper surface of the plate holder 9 can be inclined.
  • the holding portion 34 of the first moving mechanism 33 inclines the upper surface of the plate holder 9 that supports the substrate P in the state of floating by the gas injection from the gas injection hole K2 toward the unloading table 50 ( ⁇ Y direction). Let Thereby, the substrate P can be moved to the unloading table 50 side by utilizing the weight of the substrate P.
  • FIG. 16A and 16B are diagrams showing a configuration of the carry-in unit 104 according to the present embodiment
  • FIG. 16A is a diagram showing a planar configuration of the carry-in unit 104
  • FIG. It is a figure which shows the side cross section by A line arrow.
  • the first transfer unit 149 of the carry-in unit 104 has a roller mechanism 148 instead of a configuration in which the gas is injected to one surface of the substrate P to support floating. is doing.
  • a plurality of notches 141 are formed on one end side of the loading table 140.
  • a roller 142 constituting the roller mechanism 148 is rotatably supported by a shaft 143.
  • the roller 142 can be rotated by a driving mechanism (not shown).
  • the roller mechanism 148 is configured such that the roller 142 can contact or be separated from the substrate P.
  • the roller mechanism 148 rotates the substrate P in a predetermined direction while bringing the rollers 142 into contact with the lower surface of the substrate P supported on the loading table 140, thereby causing the plate holder 9 to rotate the substrate P. Can move to the side.
  • an elastic member such as rubber that generates a large frictional force with the substrate P can be used. By configuring the roller 142 using such an elastic member, damage (such as scratches) to the substrate P can be prevented. Further, only the suction hole K4 is provided on the upper surface of the loading table 140.
  • a substrate P coated with a photosensitive agent is carried into the carry-in section 104 by a coater / developer (not shown).
  • the substrate P is sucked and held on the upper surface of the loading table 140 through the suction hole K4.
  • the plate holder 9 moves so as to approach the carry-in table 140 (see FIG. 7A).
  • the plate holder 9 is brought close to the loading table 140 so that the upper surface of the loading table 140 supporting the substrate P is higher than the upper surface of the plate holder 9 (see FIG. 7B). .
  • the substrate that has run on the roller 142. P can be reliably conveyed from the loading table 40 side to the plate holder 9 side.
  • the carry-in table 140 causes the roller 142 of the roller mechanism 148 to contact the lower surface of the substrate P and to rotate in a predetermined direction.
  • the plate holder 9 injects gas from the plurality of gas injection holes K2 formed on the upper surface. The substrate P slides smoothly toward the plate holder 9 due to the frictional force with the roller 142.
  • the plate holder 9 which is the transport destination of the substrate P is configured such that the substrate P is supported by being floated on the substrate mounting portion 31 by ejecting gas from the gas ejection hole K2. Therefore, the substrate P that slides on the upper surface of the loading table 140 by the roller mechanism 148 smoothly transfers to the upper surface of the plate holder 9.
  • the substrate P slides in a state where the position in the X direction in the drawing is defined by the guide pins 36 provided in the periphery of the plate holder 9.
  • the roller mechanism 148 moves the substrate P until it comes into contact with a positioning pin 37 provided on the downstream side of the plate holder 9 in the substrate transport direction.
  • the position of the substrate P in the X direction in the figure is defined by the guide pins 36, and the position in the Y direction in the figure is defined by being sandwiched between the positioning pins 37 and the contact portions 42b.
  • the plate holder 9 stops gas injection from the gas injection hole K3. As a result, the substrate P is placed in a state of being aligned with the substrate placement unit 31.
  • the substrate P since the substrate P is transported in a state of being floated by gas injection as described above, it can be transferred to the plate holder 9 with no distortion and high flatness. It is possible to prevent an air pool or an air layer from being generated between the mounting portion 31 and the mounting portion 31. Therefore, the substrate P can be placed at a predetermined position with respect to the plate holder 9 with high flatness. Therefore, predetermined exposure can be performed with high accuracy at an appropriate position on the substrate P, and highly reliable exposure processing can be performed.
  • finish of exposure processing is the same as that of 1st Embodiment, the description shall be abbreviate
  • roller mechanism 148 is employed as the first transfer unit 149 of the carry-in unit 104
  • a roller mechanism may be employed as the second transfer unit 52 of the carry-out unit 5.
  • substrate P by gas injection can also be employ
  • the third embodiment is mainly different in that the plate holder 9 includes a first transfer mechanism.
  • FIG. 19 is a diagram showing a configuration of the plate holder 109 according to the present embodiment.
  • the plate holder 109 according to the present embodiment includes a first transfer unit 249 that transfers the substrate P from the loading table 40 to the plate holder 9 as shown in FIG.
  • the first transfer unit 249 includes a suction unit 250 that sucks and holds both side portions of the substrate P in the width direction.
  • the suction part 250 is freely movable in the XY plane along the surface direction of the substrate P.
  • a position detection sensor 252 for detecting the position of the substrate P carried by the first transfer unit 249 relative to the substrate platform 31 is provided in the peripheral part of the plate holder 9.
  • a potentiometer can be exemplified.
  • either a contact type or non-contact type meter can be used.
  • the suction part 250 sucks and holds the end of the substrate P that is levitated and supported on the carry-in table 40 by gas injection from the gas injection hole K3, and moves from the carry-in table 40 to the plate holder 9 as shown in FIG. 20A. And carry.
  • the plate holder 9 injects gas from the plurality of gas injection holes K2 formed on the upper surface. At this time, the gas injected from the gas injection holes K2, K3 may have directivity.
  • the exposure unit 1 can detect a positional shift of the substrate P with respect to the substrate mounting unit 31 by bringing the end of the substrate P into contact with the position detection sensor 252 as illustrated in FIG. 20B. .
  • the suction unit 250 is configured to be driven based on the detection result of the position detection sensor 252. Therefore, the exposure apparatus 1 can correct the position of the substrate P held by the suction unit 250 relative to the substrate placement unit 31 based on the detection result of the position detection sensor 252.
  • the substrate P since the substrate P is transported in a state of being floated by gas injection as described above, it can be transferred to the plate holder 9 with no distortion and high flatness. It is possible to prevent an air pool or an air layer from being generated between the mounting portion 31 and the mounting portion 31. Therefore, the substrate P can be placed at a predetermined position with respect to the plate holder 9 with high flatness. Therefore, predetermined exposure can be performed with high accuracy at an appropriate position on the substrate P, and highly reliable exposure processing can be performed.
  • finish of exposure processing is the same as that of 1st Embodiment, the description shall be abbreviate
  • the fourth embodiment is mainly different from the first embodiment in that the carry-in table 40 and the carry-out table 50 are arranged at positions overlapping each other in a plan view. That is, when the substrate P is transferred to and from the plate holder 9, the carry-in table 40 and the carry-out table 50 move up and down with respect to the plate holder 9.
  • the carry-out table 50 is arranged in the state of being close to the plate holder 9 along the Y direction.
  • the carry-out table 50 waiting downward is raised with respect to the plate holder 9 to a position where the substrate P can be received.
  • the upper surface of the carry-out table 50 can be arranged lower than the upper surface of the plate holder 9 (see FIG. 13).
  • substrate P is delivered to the carrying-in table 40 from the coater / developer (not shown).
  • the carry-in table 40 stands by above the plate holder 9 with the next substrate P being placed while the substrate P is being carried out from the plate holder 9 to the carry-out table 50.
  • the plate holder 9 stops driving the vacuum pump, and releases the suction holding of the substrate P to the substrate mounting portion 31 through the suction hole K1. Subsequently, the plate holder 9 ejects a gas from the gas ejection hole K2, and supports the substrate P in a state where the substrate P is floated through the gas (see FIGS. 14A to 14C). On the other hand, when the unloading unit 5 receives the substrate P, the unloading unit 5 injects gas from a plurality of gas injection holes K5 formed on the upper surface of the unloading table 50. At this time, the gas injected from the gas injection holes K2 and K5 may have directivity.
  • the carry-out unit 5 moves the substrate P held by the suction unit 52b along the Y direction in the figure, as in the first embodiment.
  • the substrate P since the substrate P is supported in a state of floating on the plate holder 9, the substrate P smoothly slides on the carry-out table 50. Further, the upper surface of the carry-out table 50 supports the substrate P as described above. Therefore, the board
  • the carry-out table 50 stops the gas injection from the gas injection hole K5 and holds the substrate P by suction through the suction hole K6.
  • the unloading table 50 moves the substrate P downward as shown in FIG. 22C while holding the substrate P by suction.
  • the unloading table 50 is removed from the plate holder 9 so that the substrate P does not interfere with the plate holder 9.
  • the above-described descending operation is performed in a state of being retracted in the + Y direction in FIG.
  • the carry-out table 50 starts to move downward, and as shown in FIG. 22C, the carry-out table 40 waiting above the plate holder 9 reaches a position where the substrate P can be delivered to the plate holder 9. Descend. Thereby, the plate holder 9 and the table 40 for carrying in are arranged in the state which adjoined along the Y direction. At this time, the upper surface of the carry-in table 40 can be arranged lower than the upper surface of the plate holder 9 (see FIG. 8).
  • the carry-in table 40 ejects gas from a plurality of gas ejection holes K3 formed on the upper surface, and supports the substrate P in a state where the substrate P is floated through the gas.
  • the plate holder 9 injects gas from the plurality of gas injection holes K2 formed on the upper surface. At this time, the gas injected from the gas injection holes K2, K3 may have directivity.
  • the carry-in part 4 brings the contact part 42b into contact with one end of the substrate P in a state where the substrate P is levitated and supported on the carry-in table 40.
  • the abutting portion 42b moves along the guide portion 42a in the recess 40a to move the substrate P toward the plate holder 9 (see FIGS. 9 and 10).
  • the substrate P Since the substrate P is in a state of floating on the loading table 40, it smoothly slides and moves to the plate holder 9 side. Further, since the upper surface of the plate holder 9 supports the substrate P as described above, the substrate P smoothly moves from the loading table 40 to the plate holder 9 as shown in FIG. 22D. It becomes.
  • the substrate P can be placed in a state of being aligned at a predetermined position with respect to the substrate placement portion 31 by the guide pins 36 and the positioning pins 37 (see FIG. 9). Then, an exposure process is performed on the substrate P.
  • the substrate P while the substrate P is being carried into the plate holder 9 from the carry-in unit 4 or during the exposure process for the substrate P, the substrate P that has been subjected to the exposure process placed on the unloading table 50 is carried out. .
  • the carry-in unit 4 and the carry-out unit 5 are moved in the height direction (Z direction) with respect to the plate holder 9 and accessed alternately in this way, thereby carrying out the substrate P to the exposure apparatus main body 3. Can be performed. Moreover, since the carrying-in part 4 and the carrying-out part 5 stand by above the plate holder 9 when not in use and each moves up and down, the plate holder 9 can be accessed. Processing time (so-called tact) can be shortened.
  • the present invention is not limited to this, and the present invention can also be applied to a case where the first direction and the second direction are different directions (for example, orthogonal).
  • the fifth embodiment is mainly different in that it includes a carry-in / out unit that functions as a carry-in unit or a carry-out unit.
  • FIG. 23 is a perspective view showing a configuration inside the chamber
  • FIGS. 24A and 24B are plan views showing a schematic configuration of the carry-in / out section 400.
  • the carry-in / out unit 400 includes a substrate mounting table 401 and a moving mechanism 402 that moves the substrate mounting table 401.
  • the moving mechanism 402 has the same configuration as the first and second moving mechanisms 33 and 43 of the first embodiment. Based on such a configuration, the substrate mounting table 401 can move within a predetermined region of the guide surface on the light emission side (image surface side of the projection optical system PL) while holding the substrate P. .
  • the substrate mounting table 401 is also movable along the Z-axis direction. Therefore, the substrate mounting table 401 functions as a carry-in table and a carry-out table.
  • the carry-in / out unit 400 includes a transfer unit 405 that transfers the substrate P from the substrate mounting table 401 to the plate holder 9.
  • the transfer unit 405 includes a guide unit 406 and a suction unit 408 that sucks and holds the substrate P.
  • the guide portion 406 is provided in the recess 401a.
  • the suction unit 408 is attached to the guide unit 406 so as to protrude from the upper surface of the substrate mounting table 401.
  • the suction unit 408 includes a vacuum suction pad that holds the substrate P by vacuum suction, for example.
  • the upper surface of the substrate mounting table 401 is provided with a plurality of gas injection holes K7 that float and support the substrate P through the gas by injecting a gas such as air onto the lower surface of the substrate P. .
  • Each gas injection hole K7 is connected to a gas injection pump (not shown).
  • a plurality of suction holes K8 are provided on the upper surface of the substrate mounting table 401 for bringing the substrate P into close contact with this surface.
  • Each suction hole K8 is connected to a vacuum pump (not shown).
  • the gas injection holes K7 and the suction holes K8 are arranged in a staggered manner.
  • the substrate mounting table 401 is formed with a through hole 407 through which a substrate support pin of a vertical movement mechanism for passing the substrate P to and from a coater / developer (not shown) can be inserted as will be described later. Has been.
  • the plate holder 9 is provided with the position detection sensor 19 for detecting a relative position with respect to the substrate mounting table 401 on the side surface thereof, as in the above-described embodiment.
  • the position detection sensor 19 includes a distance detection sensor 19a for detecting a relative distance with respect to the substrate placement table 401 and a height detection sensor 19b for detecting a relative height with respect to the substrate placement table 401. (See FIG. 3B).
  • a substrate P coated with a photosensitive agent is carried into a carry-in / out unit 400 by a coater / developer (not shown).
  • the vertical movement mechanism 409 located below the substrate placement table 401 arranges the substrate support pins 410 above the substrate placement table 401 through the through holes 407.
  • the arm portion 48 of the coater / developer (not shown) is inserted between the substrate support pins 410 as shown in FIG. The arm portion 48 descends to transfer the substrate P to the substrate support pins 410 and then retract from the carry-in / out portion 400.
  • the vertical movement mechanism 409 lowers the substrate support pins 410 that support the substrate P, thereby completing the operation of loading the substrate P onto the substrate mounting table 401. Thereafter, by driving the vacuum pump, the substrate P is sucked and held on the upper surface of the substrate mounting table 401 through the suction hole K8.
  • the plate holder 9 moves so as to be close to the substrate placement table 401 of the loading / unloading unit 400.
  • the transfer unit 405 is driven to move the substrate placement table 401 and the plate holder 9 to the delivery position of the substrate P in a short time. You may make it shorten the time which carrying-in operation requires. In this case, since the substrate P is sucked and held on the upper surface of the substrate placement table 401 through the suction hole K8, the substrate P is prevented from moving on the substrate placement table 401 when the transfer unit 405 is driven.
  • the plate holder 9 is close to the substrate mounting table 401 so that the upper surface of the substrate mounting table 401 supporting the substrate P is higher than the upper surface of the plate holder 9. To do.
  • the plate holder 9 and the substrate mounting table 401 may be arranged in contact with each other so that the moving distance of the substrate P can be shortened and the transfer can be performed more smoothly.
  • the substrate mounting table 401 ejects gas from the plurality of gas ejection holes K7 formed on the upper surface, and supports the substrate P in a state where the substrate P is floated through the gas.
  • the plate holder 9 injects gas from the plurality of gas injection holes K2 formed on the upper surface. At this time, the gas injected from the gas injection holes K2 and K7 may have directivity.
  • the carry-in / out unit 400 sucks and holds one end of the substrate P by the suction unit 408 in a state where the substrate P is levitated and supported on the substrate mounting table 401.
  • the suction portion 408 moves along the guide portion 406 in the recess 401a to move the substrate P toward the plate holder 9 (see FIGS. 24A and 24B).
  • the suction unit 408 can smoothly slide the substrate P to the plate holder 9 side. Further, the upper surface of the plate holder 9 supports the substrate P as described above.
  • the substrate P that slides on the upper surface of the substrate mounting table 401 by the suction unit 408 smoothly transfers to the upper surface of the plate holder 9.
  • the substrate P since the upper surface of the substrate mounting table 401 is higher than the upper surface of the plate holder 9, the substrate P does not contact the side surface of the plate holder 9 and smoothly It is possible to transfer onto the holder 9.
  • the substrate P is brought into a state of being aligned at a predetermined position with respect to the substrate mounting portion 31 by contacting the guide pins 36 and the positioning pins 37 provided in the peripheral portion of the plate holder 9 (FIG. 9). reference).
  • the substrate P since the substrate P is transported in a state of being floated by gas injection as described above, it is possible to prevent an air pool or an air layer from being generated between the substrate P and the substrate platform 31, Generation
  • substrate P can be prevented. Therefore, the substrate P can be placed at a predetermined position with respect to the plate holder 9 with high flatness. Thereafter, when the vacuum pump is driven, the substrate P is adsorbed and held on the upper surface of the substrate platform 31 via the suction hole K1. Then, after placing the substrate P on the plate holder 9, exposure processing is performed on the substrate P.
  • the plate holder 9 moves so as to be close to the substrate mounting table 401 of the carry-in / out unit 400.
  • the plate holder 9 and the substrate mounting table 401 are brought close to each other so that the upper surface of the plate holder 9 is higher than the upper surface of the substrate mounting table 401.
  • the time required for the unloading operation of the substrate P can be shortened by moving the substrate mounting table 401.
  • the plate holder 9 and the substrate mounting table 401 can be arranged in contact with each other. In this way, since no gap is formed between the plate holder 9 and the substrate mounting table 401, the transfer of the substrate P can be performed smoothly.
  • the plate holder 9 stops driving the vacuum pump, and releases the suction holding of the substrate P to the substrate mounting portion 31 through the suction hole K1. Subsequently, as shown in FIG. 27, the plate holder 9 injects a gas from the plurality of gas injection holes K2 formed on the upper surface of the substrate mounting portion 31, and floats the substrate P through the gas. Support with.
  • the carry-out unit 5 receives the substrate P, the carry-out unit 5 injects gas from a plurality of gas injection holes K7 formed on the upper surface of the substrate mounting table 401. At this time, the gas injected from the gas injection holes K2 and K7 may have directivity.
  • the carry-in / out unit 400 moves the suction unit 408 of the transfer unit 405 along the guide unit 406 toward the substrate P that is levitated and supported on the substrate platform 31 of the plate holder 9.
  • the suction unit 408 sucks and holds the substrate P, and moves the substrate P along the + Y direction in the drawing (see FIGS. 24A and 24B).
  • the suction unit 408 can smoothly slide the substrate P toward the substrate mounting table 401. Further, the upper surface of the substrate mounting table 401 supports the substrate P as described above.
  • the substrate P that slides on the upper surface of the substrate platform 31 smoothly moves to the upper surface of the substrate platform table 401.
  • the substrate P since the upper surface of the plate holder 9 is higher than the upper surface of the substrate mounting table 401, the substrate P does not come into contact with the side surface of the substrate mounting table 401, and smoothly moves on the substrate mounting table 401. Can be transferred to.
  • the substrate mounting table 401 stops the gas injection from the gas injection hole K7 and holds the substrate P by suction through the suction hole K8.
  • the carry-in / out unit 400 drives the transfer unit 405 in a state where the substrate P is sucked and held, and moves the substrate placement table 401 to the carry-out position of the substrate P.
  • the exposed substrate P placed on the substrate placement table 401 is unloaded.
  • the vertical movement mechanism 409 located below the substrate placement table 401 arranges the substrate support pins 410 above the substrate placement table 401 through the through holes 407.
  • the substrate P is supported by the substrate support pins 410 and is held above the substrate placement table 401 (see FIG. 25).
  • the arm portion 48 of the coater / developer (not shown) is inserted between the substrate support pins 410, and the substrate P is transferred to the arm portion 48 by lowering the substrate support pins 410.
  • the arm unit 48 moves the substrate P into a coater / developer (not shown) and performs development processing.
  • the substrate P supported to be levitated can be slid and transported from the loading / unloading unit 400 to the plate holder 9, an air pocket or air is interposed between the substrate P and the substrate platform 31. It is possible to prevent the generation of a layer, and to prevent the substrate P from being displaced or deformed. Therefore, highly reliable exposure processing can be performed.
  • the carry-in / out unit 400 also serves as the carry-in unit 4 and the carry-out unit 5 in the first to third embodiments, the configuration of the apparatus can be simplified.
  • the upper surface of the substrate mounting table 401 can be inclined.
  • the moving mechanism 402 inclines the upper surface of the substrate mounting table 401 that supports the substrate P in the state of being floated by gas injection from the gas injection hole K7 toward the plate holder 9 ( ⁇ Y direction). Accordingly, the substrate P can be moved to the plate holder 9 side by utilizing the weight of the substrate P.
  • the upper surface of the plate holder 9 can be inclined.
  • the first moving mechanism 33 holding unit 34
  • the first moving mechanism 33 has the upper surface of the plate holder 9 that supports the substrate P in a state of being floated by gas injection from the gas injection hole K2 on the substrate mounting table 401 side ( ⁇ Y direction). Tilt to. Thereby, the substrate P can be moved to the substrate mounting table 401 side by utilizing the weight of the substrate P.
  • a roller mechanism 148 as shown in the second embodiment can be adopted as the transfer unit 405.
  • the transfer part 405 as shown in 3rd Embodiment, the adsorption
  • FIG. 28 is a sectional plan view showing a schematic configuration of the exposure apparatus of the present embodiment
  • FIG. 29 is a perspective view showing a schematic configuration of the apparatus in the chamber.
  • the exposure apparatus 1 includes an exposure apparatus main body 3 and a carry-in unit 4 as shown in FIG.
  • the exposure apparatus 1 includes a carry-out robot 205. These are housed in a chamber 2 that is highly cleaned and adjusted to a predetermined temperature.
  • the carry-out robot 205 has, for example, a horizontal joint type structure, and is connected to the arm part 10 composed of a plurality of parts connected via a vertical joint axis, and the tip of the arm part 10.
  • the fork part 12 and the drive device 13 are provided.
  • the arm unit 10 can be moved, for example, in the vertical direction (Z-axis direction) by the driving device 13.
  • the driving of the driving device 13 is controlled by a control device (not shown).
  • the carry-out robot 205 receives the substrate P from the plate holder 9.
  • the carry-out robot 205 is not limited to a horizontal joint type robot, and can be realized by appropriately adopting or combining known robots (generally, a transport mechanism).
  • FIG. 30A is a diagram illustrating a planar configuration of the plate holder 9, and FIG. 30B is a diagram illustrating a side configuration of the plate holder 9.
  • the plate holder 9 is provided with a substrate placement portion 31 on which the substrate P is placed.
  • the plate holder 9 is formed with a groove 30 for accommodating the fork portion 12 of the unloading robot 205 when the substrate P is unloaded.
  • the groove portion 30 is formed along the moving direction of the fork portion 12 (Y direction in the figure).
  • a region other than the groove portion 30 on the upper surface of the plate holder 9 constitutes the substrate mounting portion 31.
  • the thickness of the fork part 12 is smaller than the depth of the groove part 30.
  • the plate holder 9 includes a position detection sensor 19 that detects a relative position with respect to the loading table 40 on the side surface portion 9a.
  • the position detection sensor 19 includes a distance detection sensor 19 a for detecting a relative distance with respect to the carry-in table 40 and a height detection sensor 19 b for detecting a relative height with respect to the carry-in table 40.
  • a recess is formed at a position corresponding to the position detection sensor 19 in the carry-in table 40, thereby preventing the position detection sensor 19 and the carry-in table 40 from interfering with each other.
  • a substrate P coated with a photosensitive agent is carried into the carry-in section 4 by a coater / developer (not shown).
  • the vertical movement mechanism 49 positioned below the loading table 40 has the substrate support pins 49 a disposed above the loading table 40 through the through holes 47.
  • the arm portion 48 of the coater / developer (not shown) is inserted between the substrate support pins 49a as shown in FIG.
  • the arm portion 48 moves down to deliver the substrate P to the substrate support pins 49a and then retracts from the carry-in portion 4.
  • the vertical movement mechanism 49 finishes the operation of loading the substrate P onto the loading table 40 by lowering the substrate support pins 49a that support the substrate P. Thereafter, when the vacuum pump is driven, the substrate P is sucked and held on the upper surface of the loading table 40 via the suction hole K4.
  • the plate holder 9 moves so as to be close to the loading table 40 of the loading unit 4 as shown in FIG. 31A.
  • FIGS. 31A and 31B illustration of the carry-out robot is omitted.
  • the first moving mechanism 33 arranges the plate holder 9 and the carry-in table 40 close to each other along the Y direction.
  • the state where the plate holder 9 and the carry-in table 40 are close to each other means a state where the plate holder 9 and the carry-in table 40 are separated by a distance at which the movement of the substrate P is smoothly performed during delivery of the substrate P described later.
  • the second moving mechanism 43 can be driven.
  • the loading table 40 and the plate holder 9 can be moved to the delivery position of the substrate P in a short time, and the time required for the loading operation of the substrate P can be shortened.
  • the substrate P is sucked and held on the upper surface of the loading table 40 through the suction hole K4
  • the substrate P is prevented from moving on the loading table 40 when the second moving mechanism 43 is driven. can do.
  • the substrate P is arranged higher than the plate holder 9.
  • the first moving mechanism 33 brings the plate holder 9 close to the loading table 40 so that the upper surface of the loading table 40 supporting the substrate P is higher than the upper surface of the plate holder 9.
  • the loading table 40 can be raised by the second moving mechanism 43 so that the upper surface of the loading table 40 is higher than the upper surface of the plate holder 9.
  • the first moving mechanism 33 can also be arranged in a state where the plate holder 9 and the loading table 40 are in contact with each other. If it does in this way, delivery of the board
  • the carry-in table 40 injects gas from a plurality of gas injection holes K3 formed on the upper surface, and supports the substrate P in a state where the substrate P is floated through the gas.
  • the plate holder 9 injects gas from the plurality of gas injection holes K2 formed on the upper surface.
  • the carry-in unit 4 brings the contact portion 42b into contact with one end of the substrate P as shown in FIG. 33 in a state where the substrate P is levitated and supported on the carry-in table 40.
  • the contact part 42b moves the substrate P toward the plate holder 9 by moving along the guide part 42a in the recess 40a.
  • the contact portion 42b can smoothly slide the substrate P to the plate holder 9 side.
  • the upper surface of the plate holder 9 supports the substrate P as described above.
  • the gas injected from the gas injection holes K3 and K2 may have directivity.
  • the substrate P that slides on the upper surface of the loading table 40 by the contact portion 42b smoothly transfers to the upper surface of the plate holder 9.
  • the substrate P since the upper surface of the loading table 40 is higher than the upper surface of the plate holder 9, the substrate P can smoothly transfer onto the plate holder 9 without contacting the side surface of the plate holder 9. it can.
  • the substrate P slides in a state where the position in the X direction in the drawing is defined by the guide pins 36 provided in the peripheral portion of the plate holder 9.
  • the abutting portion 42b moves the substrate P until it abuts on a positioning pin 37 provided on the downstream side of the plate holder 9 in the substrate transport direction.
  • the position of the substrate P in the X direction in the figure is defined by the guide pins 36, and the position in the Y direction in the figure is defined by being sandwiched between the positioning pins 37 and the contact portions 42b.
  • the plate holder 9 stops gas injection from the gas injection hole K2.
  • the substrate P is placed in a state of being aligned with the substrate platform 31.
  • the substrate is displaced (displacement from a predetermined placement position) or the substrate is deformed.
  • One possible cause of this displacement is that the substrate floats due to a thin air layer generated between the substrate and the plate holder immediately before the substrate is placed, for example.
  • the substrate swells due to an air pocket interposed between the substrate and the plate holder after the substrate is placed.
  • the substrate P since the substrate P is transported in a state of being floated by gas injection as described above, the substrate P is transferred to the plate holder 9 with no distortion and high flatness. Further, since the substrate P is placed on the substrate platform 31 from the height at which the substrate P is levitated, it is possible to prevent an air pool or an air layer from being generated between the substrate P and the substrate platform 31. . Therefore, it becomes possible to prevent the substrate P from being swollen and prevent the substrate P from being displaced or deformed. Therefore, the substrate P can be placed at a predetermined position with respect to the plate holder 9 with high flatness. Thereafter, when the vacuum pump is driven, the substrate P is adsorbed and held on the upper surface of the substrate platform 31 via the suction hole K1.
  • the mask M After placing the substrate P on the plate holder 9, the mask M is illuminated with the exposure light IL from the illumination system. The pattern of the mask M illuminated with the exposure light IL is projected and exposed to the substrate P placed on the plate holder 9 via the projection optical system PL.
  • the exposure apparatus 1 can perform predetermined exposure at an appropriate position on the substrate P with high accuracy, and a highly reliable exposure process. Can be realized.
  • the photosensitive agent is applied by a coater / developer (not shown) while the substrate P is being exposed or while the unloading robot 205 is transporting the exposed substrate P as will be described later.
  • the next coated substrate P can be placed on the loading table 40 of the loading unit 4.
  • FIG. 35 is a perspective view for explaining the operation of the unloading robot 205
  • FIGS. 36A and 36B are cross-sectional configuration diagrams when the substrate P is unloaded from the plate holder 9 when viewed from the Y-axis direction. These are side views when the operation of carrying the substrate P out of the plate holder 9 is viewed from the X-axis direction.
  • FIG. 35 only the fork portion 12 is shown, and the entire configuration of the carry-out robot 205 is omitted.
  • FIGS. 36A and 36B the fork portion 12 that supports the substrate P is simplified for convenience.
  • the carry-out robot 205 inserts the fork portion 12 into the groove portion 30 formed in the plate holder 9 from the ⁇ Y direction side as shown in FIG.
  • the drive device 13 moves the fork portion 12 upward by a predetermined amount, thereby bringing the fork portion 12 into contact with the lower surface of the substrate P as shown in FIG. 36A.
  • the fork unit 12 moves further upward to lift the substrate P above the plate holder 9 and separate it from the substrate platform 31.
  • the carry-out robot 205 raises (retreats) the fork unit 12 to a height that does not contact the carry-in table 40 of the carry-in unit 4 on which the next substrate P coated with the photosensitive agent is placed.
  • the loading table 40 of the loading unit 4 moves so as to be close to the plate holder 9 as shown in FIG. Then, the substrate P is transported to the plate holder 9 side.
  • the carry-out robot 205 moves the substrate P placed on the fork unit 12 into a coater / developer (not shown). As described above, the operation for unloading the substrate P from the exposure apparatus main body 3 is completed.
  • the substrate P supported to be levitated can be transported from the carry-in unit 4 to the plate holder 9 by sliding, so that the air is interposed between the substrate P and the substrate platform 31. It is possible to prevent the accumulation or air layer from being generated, and to prevent the substrate P from being displaced or deformed. Therefore, highly reliable exposure processing can be performed.
  • the fork unit 12 of the unloading robot 205 is inserted into the groove unit 30 and the substrate P is lifted from the lower surface so that the substrate P is retracted from the plate holder 9. Since P can be carried into the plate holder 9, the total tact time required for carrying the substrate P in and out of the plate holder 9 can be made substantially the same as when a conventional tray is used. Therefore, the substrate P can be loaded into the plate holder 9 in a good state without increasing the tact time when loading and unloading the substrate P.
  • the upper surface of the loading table 40 can be inclined.
  • the holding portion 44 of the second moving mechanism 43 has the upper surface of the loading table 40 that supports the substrate P in a state of being floated by gas injection from the gas injection hole K3 on the plate holder 9 side ( ⁇ Y direction). Tilt. Accordingly, the substrate P can be moved to the plate holder 9 side by utilizing the weight of the substrate P.
  • the carry-in unit 104 is the same as that described with reference to FIGS. 16A and 16B.
  • the operation of the exposure apparatus 1 in the present embodiment is the same as that described with reference to FIGS.
  • the substrate P since the substrate P is transported in a state of being floated by gas injection as described above, the substrate P can be transferred to the plate holder 9 without distortion and with high flatness. It is possible to prevent an air pool or an air layer from being generated between the portion 31. Therefore, the substrate P can be placed at a predetermined position with respect to the plate holder 9 with high flatness. Therefore, predetermined exposure can be performed with high accuracy at an appropriate position on the substrate P, and highly reliable exposure processing can be performed.
  • the eighth embodiment is mainly different from the sixth and seventh embodiments in that the plate holder 9 includes a transfer unit.
  • FIG. 38 is a diagram showing a configuration of the plate holder 109 according to the present embodiment.
  • the plate holder 109 according to this embodiment includes a first transfer unit 249 that transfers the substrate P from the loading table 40 to the plate holder 9.
  • the first transfer unit 249 includes a suction unit 250 that sucks and holds both side portions of the substrate P in the width direction.
  • the suction part 250 is freely movable in the XY plane along the surface direction of the substrate P.
  • a position detection sensor 252 for detecting the position of the substrate P carried by the first transfer unit 249 relative to the substrate platform 31 is provided in the peripheral part of the plate holder 9.
  • a potentiometer can be exemplified.
  • either a contact type or non-contact type meter can be used.
  • the suction portion 250 sucks and holds the end of the substrate P that is levitated and supported on the carry-in table 40 by gas injection from the gas injection hole K3, and moves from the carry-in table 40 to the plate holder 9 side as shown in FIG. 39A. And carry.
  • the plate holder 9 injects gas from the plurality of gas injection holes K2 formed on the upper surface. At this time, the gas injected from the gas injection holes K2, K3 may have directivity.
  • the exposure unit 1 can detect a positional shift of the substrate P with respect to the substrate placement unit 31 by bringing the end of the substrate P into contact with the position detection sensor 252. .
  • the suction unit 250 is configured to be driven based on the detection result of the position detection sensor 252. Therefore, the exposure apparatus 1 can correct the position of the substrate P held by the suction unit 250 relative to the substrate placement unit 31 based on the detection result of the position detection sensor 252.
  • the substrate P since the substrate P is transported in a state of being floated by gas injection as described above, it can be transferred to the plate holder 9 with no distortion and high flatness. It is possible to prevent an air pool or an air layer from being generated between the mounting portion 31 and the mounting portion 31. Therefore, the substrate P can be placed at a predetermined position with respect to the plate holder 9 with high flatness. Therefore, predetermined exposure can be performed with high accuracy at an appropriate position on the substrate P, and highly reliable exposure processing can be performed.
  • finish of exposure processing is the same as that of 1st Embodiment, the description shall be abbreviate
  • FIG. 40 is a perspective view showing a schematic configuration of the exposure apparatus main body 3 according to the present embodiment.
  • the exposure apparatus main body 3 of this embodiment includes a plate holder 9, a substrate lifting mechanism 150 provided on the plate holder 9, and a first moving mechanism 33.
  • the substrate lifting mechanism 150 is for lifting the substrate P upward when the substrate P is unloaded.
  • FIG 41 is a diagram showing a planar configuration of the plate holder 9
  • FIGS. 42A and 42B are side sectional views of the plate holder 9
  • FIG. 42A is a diagram showing a state before the substrate is delivered
  • FIG. It is a figure which shows the state after delivery of.
  • the lifting mechanism 150 includes a plurality of substrate support members 151 that support the substrate P, a vertical operation unit 152 that moves the substrate support member 151 up and down (see FIG. 43), It has.
  • the substrate support member 151 includes a first linear member 119 installed in the X direction (first direction) in FIG. 41 with respect to the shaft portion (vertical movement member) 155, and the Y direction (second direction) in FIG.
  • the second linear member 120 is installed, and is formed in a substantially lattice shape as a whole.
  • the first linear member 119 and the second linear member (second erection portion) 120 are welded to each other or combined in a lattice shape.
  • Each substrate support member 151 is installed between a plurality of (for example, six in this embodiment) shaft portions 155.
  • Each lattice shape constituting each substrate support member 151 has a plurality of substantially rectangular openings 121 that are smaller than the substrate P.
  • the shape of the substrate support member 151 is not limited to the shape shown in FIG. 41, and may be a frame-like single frame in which only one opening 121 is formed, for example.
  • the four substrate support members 151 are arranged with a gap S along the extending direction of the second linear member 120 (the Y direction shown in FIG. 41). Such a gap S between the substrate support members 151 serves to constitute a space into which the fork portion 12 is inserted when the substrate P is unloaded from the plate holder 9 as will be described later.
  • substrate support member 151 (the 1st linear member 119 and the 2nd linear member 120)
  • substrate support member 151 supports the board
  • substrate P is suppressed.
  • various synthetic resins or metals can be used. Specific examples include nylon, polypropylene, AS resin, ABS resin, polycarbonate, fiber reinforced plastic, and stainless steel. Examples of the fiber reinforced plastic include GFRP (Glass Fiber Reinforced Plastic) and CFRP (Carbon Fiber Reinforced Plastic).
  • the vertical movement unit 152 includes a shaft portion (vertical movement member) 155 and a drive device 153 that drives the shaft portion 155 up and down.
  • the driving device 153 is provided for each shaft portion 155, and thereby each shaft portion 155 performs an up and down operation independently.
  • the substrate support member 151 moves up and down with respect to the substrate placement portion 31 of the plate holder 9 as the up and down operation portion 152 (shaft portion 155) moves up and down. To do.
  • the plate holder 9 is formed with a recess 130 for accommodating the substrate support member 151.
  • the recesses 130 are provided in a lattice shape corresponding to the frame structure of the substrate support member 151.
  • a region (partial placement portion) other than the concave portion 130 on the upper surface of the plate holder 9 constitutes a substrate placement portion 31 that holds the substrate P.
  • the thickness of the substrate support member 151 is smaller than the depth of the recess 130. As a result, as shown in FIG. 42B, only the substrate P placed on the substrate support member 151 is transferred to the substrate placement portion 31 and placed by placing the substrate support member 151 in the recess 130. It has come to be.
  • the substrate platform 31 is finished so that the substantial holding surface of the plate holder 9 with respect to the substrate P has good flatness. Furthermore, the substrate holding surface (upper surface) of the substrate mounting portion 31 has a suction port for bringing the substrate P into close contact with the surface, or air (gas) is ejected when a substrate is loaded as described later.
  • An opening K205 is formed which functions as a gas injection port that floats and supports the surface. A vacuum pump (not shown) and a gas injection pump (not shown) are connected to the opening K205. By switching the driving of these pumps, the opening K205 can function as a suction port or an injection port as described above. .
  • the plate holder 9 Around the periphery of the plate holder 9, there are guide pins 36 for guiding the substrate P when the substrate P is carried in, and positioning pins 37 for defining the position of the substrate P with respect to the substrate mounting portion 31 of the plate holder 9. (See FIGS. 44A and 44B).
  • the guide pins 36 and the positioning pins 37 can be moved together with the plate holder 9 in the exposure apparatus main body 3.
  • a substrate P coated with a photosensitive agent is carried into the carry-in section 4 by a coater / developer (not shown). At this time, the substrate P is sucked and held on the upper surface of the loading table 40 through the suction hole K4.
  • the plate holder 9 moves so as to be close to the loading table 40 of the loading unit 4 as shown in FIG. 44A.
  • the carry-out robot is not shown.
  • the first moving mechanism 33 arranges the plate holder 9 and the carry-in table 40 close to each other along the Y direction.
  • the loading table 40 and the plate holder 9 can be moved to the delivery position of the substrate P in a short time, and the time required for the loading operation of the substrate P can be shortened. Since the substrate P is sucked and held on the upper surface of the loading table 40 through the suction hole K4, the substrate P does not move on the loading table 40 when the second moving mechanism 43 is driven.
  • the first moving mechanism 33 loads the plate holder 9 so that the upper surface of the loading table 40 that supports the substrate P is higher than the upper surface of the plate holder 9. It is brought close to the work table 40.
  • the loading table 40 can be raised by the second moving mechanism 43 so that the upper surface of the loading table 40 is higher than the upper surface of the plate holder 9.
  • the 1st moving mechanism 33 can also be arranged in the state which contacted the plate holder 9 and the carrying-in table 40, and thereby can deliver the board
  • the carry-in table 40 injects gas from a plurality of gas injection holes K3 formed on the upper surface, and supports the substrate P in a state where the substrate P is floated through the gas.
  • the plate holder 9 drives a gas injection pump (not shown) and injects air from the opening K205 provided in the substrate mounting portion 31.
  • the carry-in unit 4 brings the contact part 42b into contact with one end of the substrate P as shown in FIG. 46 while the substrate P is levitated and supported on the carry-in table 40.
  • the contact part 42b moves the substrate P toward the plate holder 9 by moving along the guide part 42a in the recess 40a.
  • the contact portion 42b can smoothly slide the substrate P to the plate holder 9 side.
  • the upper surface of the plate holder 9 supports the substrate P as described above.
  • the gas injected from the gas injection hole K3 and the opening K205 may have directivity.
  • the substrate P that slides on the upper surface of the loading table 40 by the abutting portion 42b smoothly transfers to the upper surface of the plate holder 9.
  • the substrate P since the upper surface of the loading table 40 is higher than the upper surface of the plate holder 9, the substrate P can smoothly transfer onto the plate holder 9 without contacting the side surface of the plate holder 9. it can.
  • the position of the substrate P in the X direction in the figure is defined by the guide pins 36, and the position in the Y direction in the figure is defined by being sandwiched between the positioning pins 37 and the contact portion 42b.
  • the plate holder 9 stops gas injection from the opening K205. As a result, the substrate P is placed in a state of being aligned with the substrate placement unit 31.
  • the substrate P since the substrate P is transported in a state of being floated by gas injection as described above, the substrate P is transferred to the plate holder 9 with no distortion and high flatness. Further, since the substrate P is placed on the substrate platform 31 from the height at which the substrate P is levitated, it is possible to prevent an air pool or an air layer from being generated between the substrate P and the substrate platform 31. . Therefore, it becomes possible to prevent the substrate P from being swollen and prevent the substrate P from being displaced or deformed. Therefore, the substrate P is placed at a predetermined position with respect to the plate holder 9 with a high flatness. Thereafter, by driving the vacuum pump, the substrate P is adsorbed and held on the upper surface of the substrate platform 31 through the opening K205.
  • the mask M After placing the substrate P on the plate holder 9, the mask M is illuminated with the exposure light IL from the illumination system. The pattern of the mask M illuminated with the exposure light IL is projected and exposed to the substrate P placed on the plate holder 9 via the projection optical system PL.
  • the exposure apparatus 1 can perform predetermined exposure at an appropriate position on the substrate P with high accuracy. Highly reliable exposure processing can be realized.
  • FIG. 48 is a perspective view for explaining the operation of the unloading robot 205.
  • FIGS. 49A, 49B, and 49C are cross-sectional configuration diagrams when the substrate P is viewed from the Y-axis direction when unloading the substrate P from the plate holder 9. It is. In FIG. 48, only the fork unit 12 is shown, and the entire configuration of the carry-out robot 205 is omitted. In the present embodiment, the substrate support portion in the fork portion 12 is different from that in the above embodiment, corresponding to the shape of the lifting mechanism 150. 49A, 49B, and 49C, the fork portion 12 that supports the substrate P is simplified for convenience.
  • the suction through the opening K205 by the vacuum pump is released, and the suction of the substrate P by the plate holder 9 is released.
  • the lifting mechanism 150 drives the shaft portion 155 to raise the substrate support member 151.
  • the substrate P placed on the substrate platform 31 together with the substrate support member 151 is lifted upward.
  • the substrate P is lifted upward by being supported by the plurality of substrate support members 151, so that occurrence of peeling electrification can be prevented.
  • substrate P can be supported in a large surface compared with the case where the board
  • the unloading robot 205 drives the fork unit 12 to move the fork unit 12 toward the gap S between the substrate support members 151 arranged above the substrate platform 31 and both ends in the X-axis direction as shown in FIG. Moving from the Y direction side, the forks 12 are inserted into the gap S and both ends (FIG. 49B).
  • the drive device 13 moves the fork portion 12 upward by a predetermined amount, the fork portion 12 comes into contact with the lower surface of the substrate P.
  • the substrate P is lifted above the plate holder 9 and separated from the lifting mechanism 150 as shown in FIG. 49C.
  • the lifting mechanism 150 accommodates the substrate support member 151 in the recess 130 after the substrate P is separated. After the substrate support member 151 is accommodated in the recess 130, the plate holder 9 moves so as to be close to the loading table 40 of the loading section 4, and transports the substrate P to the plate holder 9 side as described above. .
  • the carry-out robot 205 moves the substrate P placed on the fork unit 12 into a coater / developer (not shown). As described above, the operation for unloading the substrate P from the exposure apparatus main body 3 is completed.
  • the substrate P supported to be levitated is slid and transported from the carry-in unit 4 to the plate holder 9, so that it is possible to prevent the substrate P from being displaced and deformed.
  • the overall tact time required for loading and unloading the substrate P with respect to the plate holder 9 can be made substantially the same as when a conventional tray is used. Therefore, the substrate P can be loaded into the plate holder 9 in a good state without increasing the tact time during loading / unloading of the substrate P.
  • the gas injection port may be formed on the upper surface of the substrate support member 151. In this way, when the substrate P is carried into the plate holder 9, the amount of gas injected onto the substrate conveyance surface increases, so that the substrate P can be conveyed more smoothly.
  • the tenth embodiment is mainly different from the above-described embodiment in that a suction mechanism for sucking the substrate P in a non-contact state is provided as means for carrying the substrate P out of the plate holder 9.
  • the suction mechanism is for holding the substrate P, lifting the substrate P upward from the substrate mounting portion 31 of the plate holder 9 and moving it into a coater / developer (not shown).
  • FIG. 50A shows the configuration of the suction surface
  • FIG. 50B is a diagram showing the overall configuration of the suction mechanism.
  • the suction mechanism 350 moves a plurality of holding portions 351 that hold the substrate P in a non-contact state, a base portion 352 that holds these holding portions 351, and the base portion 352.
  • a possible drive mechanism 355 and a base portion 352 are provided.
  • the base portion 352 is a plate-like member having a size substantially equal to that of the substrate P.
  • the holding portions 351 are regularly arranged on the base portion 352, and thereby the substrate P can be favorably held.
  • the holding unit 351 As the holding portion 351, a so-called Bernoulli chuck was used.
  • the holding unit 351 generates a negative pressure between the holding portion 351 and the substrate P by injecting the compressed air between the holding portion 351 and the substrate P. Thereby, the pressing force which presses the board
  • the gap between the holding unit 351 and the substrate P becomes small, the flow rate of the compressed air decreases, and the pressure between the holding unit 351 and the substrate P increases. As a result, a force for separating the substrate P from the holding portion 351 is generated.
  • the holding unit 351 holds the substrate P in a state where the distance between the substrate P and the holding unit 351 is held constant, that is, in a non-contact state, by injecting compressed air so as to balance such two forces. can do.
  • 51A and 51B are side views when the operation of unloading the substrate P from the plate holder 9 is viewed from the X-axis direction.
  • the suction of the suction hole K1 by the vacuum pump is released, and the suction of the substrate P by the plate holder 9 is released.
  • the suction mechanism 350 moves above the plate holder 9.
  • the suction mechanism 350 is lowered to a position where the holding portion 351 can hold the substrate P as shown in FIG. 51A.
  • the upper surface of the substrate P is held in a non-contact state by the plurality of holding portions 351.
  • the plurality of holding portions 351 can hold the substrate P by being driven simultaneously or sequentially.
  • the suction mechanism 350 lifts the substrate P above the plate holder 9 by the drive mechanism 355 in a state where the substrate P is held by the plurality of holding units 251 and separates the substrate P from the substrate mounting unit 31 as shown in FIG. 51B. At this time, since the holding portion 351 is not in contact with the substrate P, no suction mark remains on the substrate P.
  • the loading table 40 of the loading unit 4 moves so as to be close to the plate holder 9. And like the said embodiment, it conveys from the loading table 40 to the plate holder 9 in the state which carried out the floating support of the board
  • the suction mechanism 350 moves the substrate P held by the holding unit 351 into a coater / developer (not shown). As described above, the operation for unloading the substrate P from the exposure apparatus main body 3 is completed.
  • a support member 353 that supports the lower surface of the substrate P can be provided around the base portion 352.
  • the support member 353 is made of a frame-like member that surrounds the periphery of the substrate P, and has a plurality of projecting portions 354 that project in the surface direction of the substrate P.
  • the overhang portion 334 comes into contact with the lower surface of the substrate P. According to this configuration, when holding a large substrate that may cause sagging of the substrate P, the peripheral end portion of the substrate P is supported by the overhanging portion 354. Therefore, even if the large substrate is held, The substrate P can be held in a state where the flatness is high by the holding portion 351 while preventing the end of the P from sagging.
  • the substrate P in the above-described embodiment not only a glass substrate for a display device but also a semiconductor wafer for manufacturing a semiconductor device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus ( Synthetic quartz, silicon wafer) or the like is applied.
  • a step-and-scan type scanning exposure apparatus that moves the mask M and the substrate P synchronously to scan and expose the substrate P with the exposure light IL through the pattern of the mask M.
  • the present invention may be applied to a step-and-repeat projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the mask M and the substrate P are stationary, and the substrate P is sequentially moved stepwise. it can.
  • the present invention can also be applied to a twin stage type exposure apparatus having a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like.
  • the present invention also provides a substrate stage for holding a substrate and a reference in which a reference mark is formed without holding the substrate, as disclosed in US Pat. No. 6,897,963, European Patent Application No. 1713113, and the like.
  • the present invention can also be applied to an exposure apparatus that includes a measurement stage on which members and / or various photoelectric sensors are mounted.
  • An exposure apparatus including a plurality of substrate stages and measurement stages can be employed.
  • a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used.
  • a variable shaped mask also called an electronic mask, an active mask, or an image generator
  • a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element.
  • the exposure apparatus is manufactured by assembling various subsystems including each component so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. To ensure these various accuracies, before and after this assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy.
  • the assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus.
  • the exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.
  • a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for manufacturing a mask (reticle) based on the design step, and a substrate which is a base material of the device.
  • Manufacturing step 203 including substrate processing (exposure processing) including exposing the substrate with exposure light using a mask pattern and developing the exposed substrate (photosensitive agent) according to the above-described embodiment
  • the substrate is manufactured through a substrate processing step 204, a device assembly step (including processing processes such as a dicing process, a bonding process, and a packaging process) 205, an inspection step 206, and the like.
  • the photosensitive agent is developed to form an exposure pattern layer (developed photosensitive agent layer) corresponding to the mask pattern, and the substrate is processed through the exposure pattern layer. It is.

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  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
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  • Fluid Mechanics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
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Abstract

Disclosed is a transfer apparatus which is provided with: a first supporting section (3), which supplies a gas to one surface of a substrate, and which can float and support the substrate by means of the gas; a second supporting section (400), which can support said surface of the substrate; a drive section (402), which moves the first supporting section and/or the second supporting section, and which arranges the first and the second supporting sections in the first direction by having the supporting sections close to or in contact with each other; and a transfer section, which moves the substrate supported by the first supporting section or the second supporting section to the other supporting section along the first direction, said first supporting section and second supporting section being arranged by the drive section.

Description

搬送装置、搬送方法、露光装置、及びデバイス製造方法Conveying apparatus, conveying method, exposure apparatus, and device manufacturing method
　本発明は、搬送装置、搬送方法、露光装置、及びデバイス製造方法に関するものである。
　本願は、２０１０年２月１７日に出願された米国仮出願第６１／３０５，３５５号、及び６１／３０５，４３９号に基づき優先権を主張しその内容をここに援用する。 The present invention relates to a transport apparatus, a transport method, an exposure apparatus, and a device manufacturing method.
This application claims priority based on US Provisional Application Nos. 61 / 305,355 and 61 / 305,439 filed on Feb. 17, 2010, the contents of which are incorporated herein by reference.
　フラットパネルディスプレイ等の電子デバイスの製造工程においては、露光装置や検査装置等の大型基板の処理装置が用いられている。これらの処理装置を用いた露光工程、検査工程では、大型基板（例えばガラス基板）を処理装置に搬送する下記特許文献に開示されるような搬送装置が用いられる。 In the manufacturing process of electronic devices such as flat panel displays, processing apparatuses for large substrates such as exposure apparatuses and inspection apparatuses are used. In an exposure process and an inspection process using these processing apparatuses, a transport apparatus as disclosed in the following patent document that transports a large substrate (for example, a glass substrate) to the processing apparatus is used.
特開２００１－１００１６９号公報Japanese Patent Laid-Open No. 2001-1000016
　上述の大型基板の搬送装置においては、基板支持部材に支持された基板を基板保持部へ受け渡した際に基板と基板保持部との間に空気の層が介在することで、受け渡し後の基板に変形が生じたり、基板保持部上の載置位置に対して基板の載置ずれが生じる場合がある。受け渡し後の基板に載置ずれや変形が生じると、例えば露光装置では、基板上の適正な位置に所定の露光を行うことができなくなる等の露光不良の問題が生じる。基板の載置ずれや変形が生じた場合、それを解消するために例えば基板の受け渡しをやり直すことにより、基板の処理が遅延するという問題が生じる。また、受け渡し後に空気の層を残留させないように、例えば基板の受け渡し速度を低くすると、さらに基板の処理が遅延するという問題が生じる。 In the above-described large-sized substrate transfer apparatus, when the substrate supported by the substrate support member is transferred to the substrate holding unit, an air layer is interposed between the substrate and the substrate holding unit, so that the substrate after transfer is transferred to the substrate holding unit. Deformation may occur or the substrate may be displaced with respect to the mounting position on the substrate holder. When mounting displacement or deformation occurs on the substrate after delivery, for example, in the exposure apparatus, there arises a problem of exposure failure such that predetermined exposure cannot be performed at an appropriate position on the substrate. If the substrate is displaced or deformed, there is a problem that processing of the substrate is delayed by re-delivering the substrate, for example, in order to eliminate it. Further, for example, if the substrate delivery speed is lowered so that the air layer does not remain after delivery, there arises a problem that the processing of the substrate is further delayed.
　本発明の態様は、載置ずれや変形を生じさせることなく基板の受け渡しを行うことができる搬送装置、搬送方法、露光装置、及びデバイス製造方法を提供することを目的としている。 An object of the present invention is to provide a transport apparatus, a transport method, an exposure apparatus, and a device manufacturing method capable of delivering a substrate without causing displacement and deformation.
　本発明の第１の態様に従えば、基板の一面に対して気体を供給し、該気体を介して前記基板を浮上支持可能な第１支持部と、前記基板の前記一面を支持可能な第２支持部と、前記第１及び第２支持部の少なくとも１つを移動し、該第１及び第２支持部を互いに近接又は接触させて第１方向に配列する駆動部と、前記駆動部によって配列された前記第１及び第２支持部の一方が支持する前記基板を、前記第１方向に沿って他方側に移動する移送部と、を備える搬送装置が提供される。 According to the first aspect of the present invention, a gas is supplied to one surface of the substrate, and a first support portion capable of supporting the substrate in a floating manner via the gas, and a first support portion capable of supporting the one surface of the substrate. Two support parts, a driving part that moves at least one of the first and second support parts, and that arranges the first and second support parts in proximity to or in contact with each other in the first direction, and the driving part. There is provided a transfer device including a transfer unit that moves the substrate supported by one of the arranged first and second support units to the other side along the first direction.
　本発明の第２の態様に従えば、基板の一面に対して気体を供給し、該気体を介して前記基板を浮上支持可能な第１支持部と、前記基板の前記一面を支持可能な第２及び第３支持部と、前記第１及び第２支持部の少なくとも１つを移動し、該第１及び第２支持部を互いに近接又は接触させて第１方向に配列する第１駆動部と、前記第１及び第３支持部の少なくとも１つを移動し、該第１及び第３支持部を互いに近接又は接触させて第２方向に配列する第２駆動部と、前記第１駆動部によって前記第１支持部に配列された前記第２支持部が支持する前記基板を、前記第１方向に沿って前記第１支持部側へ移動する第１移送部と、前記第２駆動部によって前記第３支持部に配列された前記第１支持部が支持する前記基板を、前記第２方向に沿って前記第３支持部側へ移動する第２移送部と、を備える搬送装置が提供される。 According to the second aspect of the present invention, a gas is supplied to one surface of the substrate, the first support portion capable of supporting the substrate in a levitating manner through the gas, and the first support portion capable of supporting the one surface of the substrate. 2 and 3rd support part, and the 1st drive part which moves at least one of said 1st and 2nd support part, and makes this 1st and 2nd support part adjoin or contact mutually, and is arranged in the 1st direction A second driving unit that moves at least one of the first and third support units and arranges the first and third support units in the second direction by bringing them into close proximity or contact with each other, and the first driving unit. The first transfer unit that moves the substrate supported by the second support unit arranged in the first support unit toward the first support unit along the first direction, and the second driving unit, The substrate supported by the first support portion arranged in a third support portion is arranged along the second direction. Serial and second transfer portion, the transfer device comprising a are provided for moving the third support part side.
　本発明の第３の態様に従えば、基板を搬送する搬送方法であって、前記基板の一面に供給する気体を介して前記基板を浮上支持可能な第１支持部及び前記基板の前記一面を支持可能な第２支持部の少なくとも一方を移動し、該第１及び第２支持部を互いに近接又は接触させて第１方向に配列することと、配列された前記第１及び第２支持部の一方が支持する前記基板を、前記第１方向に沿って他方側に移動することと、を含む搬送方法が提供される。 According to a third aspect of the present invention, there is provided a transport method for transporting a substrate, wherein the first support portion capable of levitating and supporting the substrate via a gas supplied to the one surface of the substrate and the one surface of the substrate are provided. Moving at least one of the supportable second support parts, arranging the first and second support parts in the first direction in proximity to or in contact with each other, and arranging the arranged first and second support parts Moving the substrate supported by one side to the other side along the first direction is provided.
　本発明の第４の態様に従えば、基板の一面に供給する気体を介して前記基板を浮上支持可能な第１支持部及び前記基板の前記一面を支持可能な第２支持部の少なくとも１つを移動し、該第１及び第２支持部を互いに近接又は接触させて第１方向に配列することと、前記第１支持部に配列された前記第２支持部が支持する前記基板を、前記第１方向に沿って前記第１支持部側へ移動することと、前記第１支持部及び前記基板の一方の面を支持する第３支持部の少なくとも一方を移動し、該第１及び第３支持部を互いに近接又は接触させて第２方向に配列することと、前記第３支持部に配列された前記第１支持部が支持する前記基板を、前記第２方向に沿って前記第３支持部側へ移動することと、を含む搬送方法が提供される。 According to the fourth aspect of the present invention, at least one of a first support part capable of supporting the substrate in a levitating manner via a gas supplied to one surface of the substrate and a second support part capable of supporting the one surface of the substrate. And moving the first and second support portions closer to or in contact with each other and arranging them in the first direction, and supporting the substrate supported by the second support portions arranged on the first support portion, Moving to the first support portion side along the first direction; moving at least one of the first support portion and the third support portion supporting one surface of the substrate; Arranging the support parts close to or in contact with each other in the second direction; and supporting the substrate supported by the first support parts arranged in the third support part along the second direction. Moving to the part side is provided.
　本発明の第５の態様に従えば、基板の一面に対して気体を供給し、該気体を介して前記基板を浮上支持可能な第１支持部と、前記基板の前記一面を支持する第２支持部と、前記第１及び第２支持部の少なくとも１つを移動し、該第１及び第２支持部を互いに近接又は接触させて配列する駆動部と、前記駆動部によって配列された前記第２支持部が支持する前記基板を、前記配列方向に沿って前記第１支持部側へ移動する移送部と、前記気体の供給を停止することで前記第１支持部の載置部に載置された前記基板を支持し、該載置部の上方に持ち上げる持ち上げ機構と、該持ち上げ機構により前記載置部の上方に支持される前記基板を前記第１支持部から搬出する搬出機構と、を備える搬送装置が提供される。 According to the fifth aspect of the present invention, a gas is supplied to one surface of the substrate, a first support part capable of supporting the substrate in a levitating manner through the gas, and a second support for supporting the one surface of the substrate. A support unit, a drive unit that moves at least one of the first and second support units, and arranges the first and second support units in close proximity to or in contact with each other; and the first unit arranged by the drive unit 2 The substrate supported by the support part is placed on the placement part of the first support part by stopping the supply of the gas and the transfer part that moves to the first support part side along the arrangement direction. A lifting mechanism that supports the substrate and lifts it above the placement portion; and a carry-out mechanism that unloads the substrate supported above the placement portion by the lifting mechanism from the first support portion. A transport apparatus is provided.
　本発明の第６の態様に従えば、基板を搬送する搬送方法であって、前記基板の一面に供給する気体を介して前記基板を浮上支持可能な第１支持部、及び前記基板の前記一面を支持可能な第２支持部の少なくとも一方を移動し、該第１及び第２支持部を互いに近接又は接触させて配列することと、配列された前記第２支持部が支持する前記基板を、前記配列方向に沿って前記第１支持部側へ移送することと、前記気体の供給を停止することで前記第１支持部の載置部に載置された前記基板を支持し、該載置部の上方に持ち上げることと、前記載置部の上方に支持される前記基板を前記第１支持部から搬出することと、を含む搬送方法が提供される。 According to a sixth aspect of the present invention, there is provided a transport method for transporting a substrate, the first support portion capable of levitating and supporting the substrate via a gas supplied to the one surface of the substrate, and the one surface of the substrate. Moving at least one of the second support portions capable of supporting the first support portion and arranging the first and second support portions in proximity to or in contact with each other; and the substrate supported by the arranged second support portions, The substrate placed on the placement portion of the first support portion is supported by transferring to the first support portion side along the arrangement direction and stopping the supply of the gas. There is provided a transport method including lifting up above the part and carrying out the substrate supported above the placement part from the first support part.
　本発明の第７の態様に従えば、露光光で基板を露光する露光装置であって、前記基板を保持し、前記露光光の照射領域に前記基板を移動させる上記の搬送装置を備える露光装置が提供される。 According to a seventh aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light, the exposure apparatus comprising the transport device that holds the substrate and moves the substrate to an irradiation area of the exposure light. Is provided.
　本発明の第８の態様に従えば、上記の露光装置を用いて、前記基板に前記パターンを転写することと、前記パターンが転写された前記基板を該パターンに基づいて加工することと、を含むデバイス製造方法が提供される。 According to the eighth aspect of the present invention, using the exposure apparatus, the pattern is transferred to the substrate, and the substrate to which the pattern is transferred is processed based on the pattern. A device manufacturing method is provided.
　本発明の態様によれば、載置ずれや変形を生じさせることなく基板の受け渡しを行うことができる。 According to the aspect of the present invention, it is possible to transfer the substrate without causing any mounting displacement or deformation.
露光装置の全体概略を示す断面平面図である。It is a cross-sectional top view which shows the whole exposure apparatus outline. チャンバ内の具体構成を示す外観斜視図である。It is an external appearance perspective view which shows the specific structure in a chamber. プレートホルダの周辺構成を示す図である。It is a figure which shows the periphery structure of a plate holder. プレートホルダの周辺構成を示す図である。It is a figure which shows the periphery structure of a plate holder. 搬入部の要部構成を示す図である。It is a figure which shows the principal part structure of a carrying-in part. 搬入部の要部構成を示す図である。It is a figure which shows the principal part structure of a carrying-in part. 搬出部の要部構成を示す図である。It is a figure which shows the principal part structure of a carrying-out part. 搬出部の要部構成を示す図である。It is a figure which shows the principal part structure of a carrying-out part. 搬入用テーブルへの基板の受け渡し工程を説明する図である。It is a figure explaining the delivery process of the board | substrate to the table for carrying in. プレートホルダ及び搬出部間における基板の搬送工程の説明図である。It is explanatory drawing of the conveyance process of the board | substrate between a plate holder and a carrying-out part. プレートホルダ及び搬出部間における基板の搬送工程の説明図である。It is explanatory drawing of the conveyance process of the board | substrate between a plate holder and a carrying-out part. 搬入用テーブル上に基板を浮上支持した状態を示す図である。It is a figure which shows the state which floated and supported the board | substrate on the loading table. 搬入用テーブル上の基板を搬送する工程を説明する図である。It is a figure explaining the process of conveying the board | substrate on the table for carrying in. 基板がプレートホルダ側に乗り移る工程を説明する図である。It is a figure explaining the process in which a board | substrate transfers to the plate holder side. プレートホルダ上に基板が載置された状態を示す図である。It is a figure which shows the state in which the board | substrate was mounted on the plate holder. 搬出用テーブルへの基板の受け渡し工程を説明する図である。It is a figure explaining the delivery process of the board | substrate to the table for carrying out. プレートホルダ上に基板を浮上支持した状態を示す図である。It is a figure which shows the state which carried out the floating support of the board | substrate on the plate holder. プレートホルダから搬出部側への基板の搬送を説明する図である。It is a figure explaining conveyance of a substrate from a plate holder to the carrying-out part side. プレートホルダから搬出部側への基板の搬送を説明する図である。It is a figure explaining conveyance of a substrate from a plate holder to the carrying-out part side. プレートホルダから搬出部側への基板の搬送を説明する図である。It is a figure explaining conveyance of a substrate from a plate holder to the carrying-out part side. 搬出部から基板を搬出する動作を説明する図である。It is a figure explaining the operation | movement which carries a board | substrate out from a carrying-out part. 第２実施形態に係る搬入部の構成を示す図である。It is a figure which shows the structure of the carrying-in part which concerns on 2nd Embodiment. 第２実施形態に係る搬入部の構成を示す図である。It is a figure which shows the structure of the carrying-in part which concerns on 2nd Embodiment. 搬入部からプレートホルダ側へ基板を搬送する構成を説明する図である。It is a figure explaining the structure which conveys a board | substrate from a carrying-in part to the plate holder side. 図１８に続く工程を説明するための図である。It is a figure for demonstrating the process of following FIG. 第３実施形態に係るプレートホルダの構成を示す図である。It is a figure which shows the structure of the plate holder which concerns on 3rd Embodiment. 搬入部からプレートホルダ側へ基板を搬送する構成を説明する図である。It is a figure explaining the structure which conveys a board | substrate from a carrying-in part to the plate holder side. 搬入部からプレートホルダ側へ基板を搬送する構成を説明する図である。It is a figure explaining the structure which conveys a board | substrate from a carrying-in part to the plate holder side. 第４実施形態に係る構成を示す図である。It is a figure which shows the structure which concerns on 4th Embodiment. 第４実施形態に係る基板の受け渡し動作を説明する図である。It is a figure explaining the delivery operation | movement of the board | substrate concerning 4th Embodiment. 第４実施形態に係る基板の受け渡し動作を説明する図である。It is a figure explaining the delivery operation | movement of the board | substrate concerning 4th Embodiment. 第４実施形態に係る基板の受け渡し動作を説明する図である。It is a figure explaining the delivery operation | movement of the board | substrate concerning 4th Embodiment. 第４実施形態に係る基板の受け渡し動作を説明する図である。It is a figure explaining the delivery operation | movement of the board | substrate concerning 4th Embodiment. 第５実施形態に係るチャンバ内部の構成を示す斜視図である。It is a perspective view which shows the structure inside the chamber which concerns on 5th Embodiment. 搬出入部の概略構成を示す平面図である。It is a top view which shows schematic structure of a carrying in / out part. 搬出入部の概略構成を示す平面図である。It is a top view which shows schematic structure of a carrying in / out part. 第５実施形態に係る基板の搬入工程を説明する図である。It is a figure explaining the board | substrate carrying-in process which concerns on 5th Embodiment. 搬出入部からプレートホルダ側への基板の受け渡しを説明する図である。It is a figure explaining delivery of the board | substrate from the carrying in / out part to the plate holder side. プレートホルダから搬出入部側への基板の受け渡しを説明する図である。It is a figure explaining the delivery of the board | substrate from the plate holder to the carrying in / out part side. 露光装置の全体概略を示す断面平面図である。It is a cross-sectional top view which shows the whole exposure apparatus outline. チャンバ内の具体構成を示す外観斜視図である。It is an external appearance perspective view which shows the specific structure in a chamber. プレートホルダの周辺構成を示す図である。It is a figure which shows the periphery structure of a plate holder. プレートホルダの周辺構成を示す図である。It is a figure which shows the periphery structure of a plate holder. プレートホルダ及び搬出部間における基板の搬送工程の説明図である。It is explanatory drawing of the conveyance process of the board | substrate between a plate holder and a carrying-out part. プレートホルダ及び搬出部間における基板の搬送工程の説明図である。It is explanatory drawing of the conveyance process of the board | substrate between a plate holder and a carrying-out part. 搬入用テーブル上に基板を浮上支持した状態を示す図である。It is a figure which shows the state which carried out the floating support of the board | substrate on the carrying-in table. 搬入用テーブル上の基板を搬送する工程を説明する図である。It is a figure explaining the process of conveying the board | substrate on the table for carrying in. 基板がプレートホルダ側に乗り移る工程を説明する図である。It is a figure explaining the process in which a board | substrate transfers to the plate holder side. 搬出ロボットの動作を説明するための図である。It is a figure for demonstrating operation | movement of a carrying-out robot. プレートホルダから基板を搬出する動作を説明する正面図である。It is a front view explaining the operation | movement which carries a board | substrate out from a plate holder. プレートホルダから基板を搬出する動作を説明する正面図である。It is a front view explaining the operation | movement which carries a board | substrate out from a plate holder. プレートホルダから基板を搬出する動作を説明する側面図である。It is a side view explaining the operation | movement which carries a board | substrate out from a plate holder. 第３実施形態に係る搬入部の構成を示す図である。It is a figure which shows the structure of the carrying-in part which concerns on 3rd Embodiment. 搬入部からプレートホルダ側へ基板を搬送する構成を説明する図である。It is a figure explaining the structure which conveys a board | substrate from a carrying-in part to the plate holder side. 搬入部からプレートホルダ側へ基板を搬送する構成を説明する図である。It is a figure explaining the structure which conveys a board | substrate from a carrying-in part to the plate holder side. 第４実施形態に係る露光装置本体の構成を示す図である。It is a figure which shows the structure of the exposure apparatus main body which concerns on 4th Embodiment. プレートホルダの平面構成を示す図である。It is a figure which shows the plane structure of a plate holder. プレートホルダにおける側断面図である。It is a sectional side view in a plate holder. プレートホルダにおける側断面図である。It is a sectional side view in a plate holder. 上下動部の構成を示す図である。It is a figure which shows the structure of a vertical motion part. 搬入部からプレートホルダ側へ基板を搬送する構成を説明する図である。It is a figure explaining the structure which conveys a board | substrate from a carrying-in part to the plate holder side. 搬入部からプレートホルダ側へ基板を搬送する構成を説明する図である。It is a figure explaining the structure which conveys a board | substrate from a carrying-in part to the plate holder side. 搬入用テーブル上に基板が浮上支持される状態を示す図である。It is a figure which shows the state by which a board | substrate is levitated and supported on the table for carrying in. 基板の端部に当接部が接触した状態を示す図である。It is a figure which shows the state which the contact part contacted the edge part of the board | substrate. 搬入用テーブルからプレートホルダに基板が移動する工程の説明図である。It is explanatory drawing of the process in which a board | substrate moves to a plate holder from a loading table. 搬出ロボットの動作を説明するための斜視図である。It is a perspective view for demonstrating operation | movement of a carrying-out robot. 基板をプレートホルダから搬出する工程の説明図である。It is explanatory drawing of the process of carrying out a board | substrate from a plate holder. 基板をプレートホルダから搬出する工程の説明図である。It is explanatory drawing of the process of carrying out a board | substrate from a plate holder. 基板をプレートホルダから搬出する工程の説明図である。It is explanatory drawing of the process of carrying out a board | substrate from a plate holder. 第５実施形態に係る吸着機構の構成を示す平面図である。It is a top view which shows the structure of the adsorption | suction mechanism which concerns on 5th Embodiment. 第５実施形態に係る吸着機構の構成を示す側面図である。It is a side view showing the composition of the adsorption mechanism concerning a 5th embodiment. 基板をプレートホルダから搬出する動作を説明する側面図である。It is a side view explaining the operation | movement which carries a board | substrate out from a plate holder. 基板をプレートホルダから搬出する動作を説明する側面図である。It is a side view explaining the operation | movement which carries a board | substrate out from a plate holder. 吸着機構の変形例に係る構成を示す図である。It is a figure which shows the structure which concerns on the modification of an adsorption | suction mechanism. 吸着機構の変形例に係る構成を示す図である。It is a figure which shows the structure which concerns on the modification of an adsorption | suction mechanism. マイクロデバイスの製造工程の一例を説明するためのフローチャートである。It is a flowchart for demonstrating an example of the manufacturing process of a microdevice.
　本発明の実施形態について図面を参照しながら説明する。なお、本発明はこれに限定されることはない。以下では、本発明に係る搬送装置を備え、感光剤を塗布された基板に対して液晶表示デバイス用パターンを露光する露光処理を行う露光装置について説明するとともに、本発明に係る搬送方法およびデバイス製造方法の一実施形態についても説明する。 Embodiments of the present invention will be described with reference to the drawings. Note that the present invention is not limited to this. Hereinafter, an exposure apparatus that includes the transport apparatus according to the present invention and performs an exposure process for exposing a liquid crystal display device pattern to a substrate coated with a photosensitive agent will be described, and the transport method and device manufacture according to the present invention will be described. An embodiment of the method is also described.
　（第１実施形態）
　図１は、本実施形態の露光装置の概略構成を示す断面平面図である。露光装置１は、図１に示すように、基板に液晶表示デバイス用パターンを露光する露光装置本体３と、搬入部４と、搬出部５と、を備えており、これらは高度に清浄化され、且つ所定温度に調整されたチャンバ２内に収められている。本実施形態において、基板は、大型のガラスプレートであり、その一辺のサイズは、例えば５００ｍｍ以上である。 (First embodiment)
FIG. 1 is a cross-sectional plan view showing a schematic configuration of the exposure apparatus of the present embodiment. As shown in FIG. 1, the exposure apparatus 1 includes an exposure apparatus main body 3 that exposes a liquid crystal display device pattern on a substrate, a carry-in unit 4, and a carry-out unit 5, which are highly purified. And housed in a chamber 2 adjusted to a predetermined temperature. In the present embodiment, the substrate is a large glass plate, and the size of one side thereof is, for example, 500 mm or more.
　図２は、チャンバ２内の具体構成を示す外観斜視図である。露光装置本体３は、図２に示すように、マスクＭを露光光ＩＬで照明する不図示の照明系と、液晶表示デバイス用パターンが形成されたマスクＭを保持する不図示のマスクステージと、このマスクステージの下方に配置された投影光学系ＰＬと、投影光学系ＰＬの下方に配置されたベース部（不図示）上を２次元的に移動可能に設けられた基板ホルダとしてのプレートホルダ９と、プレートホルダ９を保持するとともに該プレートホルダ９をチャンバ２内において移動させる第１移動機構３３とを備えている。 FIG. 2 is an external perspective view showing a specific configuration in the chamber 2. As shown in FIG. 2, the exposure apparatus main body 3 includes an illumination system (not shown) that illuminates the mask M with exposure light IL, a mask stage (not shown) that holds the mask M on which a liquid crystal display device pattern is formed, Projection optical system PL disposed below the mask stage, and a plate holder 9 as a substrate holder provided so as to be movable two-dimensionally on a base portion (not shown) disposed below the projection optical system PL. And a first moving mechanism 33 that holds the plate holder 9 and moves the plate holder 9 in the chamber 2.
　なお、以下の説明においては、チャンバ２に設けられたベース部（不図示）に対するプレートホルダ９の２次元的な移動が水平面内で行われるものとし、この水平面内で互いに直交する方向にＸ軸およびＹ軸を設定している。基板Ｐに対するプレートホルダ９の保持面は、基準の状態（例えば、基板Ｐの受け渡しを行う時の状態）において水平面に平行とされる。また、Ｘ軸およびＹ軸と直交する方向にＺ軸を設定しており、投影光学系ＰＬの光軸はＺ軸に平行とされている。なお、Ｘ軸、Ｙ軸およびＺ軸まわりの各方向を、それぞれθＸ方向、θＹ方向およびθＺ方向と呼ぶ。 In the following description, it is assumed that the two-dimensional movement of the plate holder 9 with respect to a base portion (not shown) provided in the chamber 2 is performed in a horizontal plane, and the X axis is orthogonal to each other in the horizontal plane. And the Y axis is set. The holding surface of the plate holder 9 with respect to the substrate P is parallel to the horizontal plane in a reference state (for example, a state when the substrate P is transferred). The Z axis is set in a direction orthogonal to the X axis and the Y axis, and the optical axis of the projection optical system PL is parallel to the Z axis. The directions around the X, Y, and Z axes are referred to as the θX direction, the θY direction, and the θZ direction, respectively.
　第１移動機構３３は、移動機構本体３５と、移動機構本体３５上に配置され、プレートホルダ９を保持する保持部３４とを有する。移動機構本体３５は、気体軸受によって、不図示のガイド面（ベース部）に非接触で支持されており、ガイド面上をＸＹ方向に移動可能となっている。このような構成に基づき、プレートホルダ９は、基板Ｐを保持した状態で、光射出側（投影光学系ＰＬの像面側）において、ガイド面の所定領域内を移動可能とされている。 The first moving mechanism 33 includes a moving mechanism main body 35 and a holding portion 34 that is disposed on the moving mechanism main body 35 and holds the plate holder 9. The moving mechanism body 35 is supported by a gas bearing in a non-contact manner on a guide surface (base portion) (not shown) and can move on the guide surface in the XY directions. Based on such a configuration, the plate holder 9 can move within a predetermined region of the guide surface on the light emission side (image surface side of the projection optical system PL) while holding the substrate P.
　移動機構本体３５は、例えばリニアモータ等のアクチュエータを含む粗動システムの作動により、ガイド面上でＸＹ平面内を移動可能である。保持部３４は、例えばボイスコイルモータ等のアクチュエータを含む微動システムの作動により、移動機構本体３５に対してＺ軸、θＸ、θＹ方向に移動可能である。保持部３４は、粗動システム及び微動システムを含む基板ステージ駆動システムの作動により、基板Ｐを保持した状態で、Ｘ軸、Ｙ軸、Ｚ軸、θＸ、θＹ、およびθＺ方向の６つの方向に移動可能である。 The moving mechanism main body 35 can move in the XY plane on the guide surface by the operation of a coarse motion system including an actuator such as a linear motor. The holding unit 34 can move in the Z-axis, θX, and θY directions with respect to the moving mechanism body 35 by operation of a fine movement system including an actuator such as a voice coil motor. The holding unit 34 operates in six directions including the X axis, the Y axis, the Z axis, the θX, the θY, and the θZ directions while holding the substrate P by the operation of the substrate stage driving system including the coarse movement system and the fine movement system. It is movable.
　露光装置１は、上記プレートホルダ９上に長方形の基板Ｐが載置された状態でステップ・アンド・スキャン方式の露光が行われ、マスクＭに形成されたパターンが基板Ｐ上の複数、例えば４つの露光領域（パターン転写領域）に順次転写されるようになっている。すなわち、この露光装置１では、照明系からの露光光ＩＬにより、マスクＭ上のスリット状の照明領域が照明された状態で、不図示のコントローラによって不図示の駆動系を介して、マスクＭを保持するマスクステージと基板Ｐを保持するプレートホルダ９とを同期して所定の走査方向（ここではＹ軸方向とする）に移動させることにより、基板Ｐ上の１つの露光領域にマスクＭのパターンが転写される、すなわち走査露光が行われる。なお、本実施形態に係る露光装置１は、投影光学系ＰＬが複数の投影光学モジュールを有し、上記照明系が複数の投影光学モジュールに対応する複数の照明モジュールを含む、所謂マルチレンズ型スキャン露光装置を構成するものである。 The exposure apparatus 1 performs step-and-scan exposure with the rectangular substrate P placed on the plate holder 9, and a plurality of patterns formed on the mask P, for example 4 The images are sequentially transferred to two exposure areas (pattern transfer areas). That is, in the exposure apparatus 1, the slit M on the mask M is illuminated by the exposure light IL from the illumination system, and the mask M is moved by a controller (not shown) via a drive system (not shown). The pattern of the mask M in one exposure region on the substrate P is obtained by moving the mask stage to be held and the plate holder 9 for holding the substrate P in synchronization in a predetermined scanning direction (here, the Y-axis direction). Is transferred, that is, scanning exposure is performed. Note that the exposure apparatus 1 according to the present embodiment is a so-called multi-lens scan in which the projection optical system PL includes a plurality of projection optical modules, and the illumination system includes a plurality of illumination modules corresponding to the plurality of projection optical modules. It constitutes an exposure apparatus.
　この１つの露光領域の走査露光の終了後に、プレートホルダ９を次の露光領域の走査開始位置まで所定量Ｘ方向に移動するステッピング動作が行われる。そして、露光装置本体３では、このような走査露光とステッピング動作を繰り返し行うことにより、順次４つの露光領域にマスクＭのパターンが転写される。 After the completion of the scanning exposure of this one exposure area, a stepping operation for moving the plate holder 9 in the X direction by a predetermined amount to the scanning start position of the next exposure area is performed. In the exposure apparatus main body 3, the pattern of the mask M is sequentially transferred to the four exposure regions by repeatedly performing such scanning exposure and stepping operation.
　搬入部４は、図２に示すように露光装置１に隣接配置されたコータ・デベロッパ（不図示）において感光剤が塗布された基板Ｐが搬入された際、該基板Ｐの一方の面（下面）を支持する搬入用テーブル４０と、該搬入用テーブル４０を移動する第２移動機構４３と、を備えている。なお、搬入部４は、搬入用テーブル４０に搬入された基板Ｐの温度を調整可能となっている。 As shown in FIG. 2, when the substrate P coated with a photosensitive agent is carried in a coater / developer (not shown) arranged adjacent to the exposure apparatus 1 as shown in FIG. ) And a second moving mechanism 43 that moves the carry-in table 40. The carry-in unit 4 can adjust the temperature of the substrate P carried into the carry-in table 40.
　第２移動機構４３は、移動機構本体４５と、移動機構本体４５上に配置され、搬入用テーブル４０を保持する保持部４４とを有する。移動機構本体４５は、気体軸受によって、不図示のガイド面に非接触で支持されており、ガイド面上をＸＹ方向に移動可能となっている。このような構成に基づき、搬入用テーブル４０は、基板Ｐを保持した状態で、ガイド面の所定領域内を移動可能となっている。なお、不図示のガイド面に対する移動機構本体４５の支持は、気体軸受けによる支持に限定されるものではなく、気体軸受けとは異なる周知のガイド機構（ガイド面に対する駆動機構）を用いることもできる。 The second moving mechanism 43 includes a moving mechanism main body 45 and a holding portion 44 that is disposed on the moving mechanism main body 45 and holds the loading table 40. The moving mechanism main body 45 is supported by a gas bearing in a non-contact manner on a guide surface (not shown) and can move in the XY directions on the guide surface. Based on such a configuration, the carry-in table 40 can move within a predetermined region of the guide surface while holding the substrate P. The support of the moving mechanism main body 45 with respect to the guide surface (not shown) is not limited to the support by the gas bearing, and a well-known guide mechanism (drive mechanism for the guide surface) different from the gas bearing can also be used.
　移動機構本体４５は、上記移動機構本体３５と同一構成からなるものであり、ガイド面上でＸＹ平面内を移動可能である。また、保持部４４は、上記保持部３４と同一構成からなるものであり、移動機構本体４５に対してＺ軸、θＸ、θＹ方向に移動可能である。保持部４４は、基板Ｐを保持した状態で、Ｘ軸、Ｙ軸、Ｚ軸、θＸ、θＹ、およびθＺ方向の６つの方向に移動可能である。 The moving mechanism main body 45 has the same configuration as that of the moving mechanism main body 35 and can move in the XY plane on the guide surface. The holding unit 44 has the same configuration as the holding unit 34 and can move in the Z-axis, θX, and θY directions with respect to the moving mechanism main body 45. The holding unit 44 can move in six directions including the X axis, the Y axis, the Z axis, the θX, the θY, and the θZ directions while holding the substrate P.
　また、搬出部５は、図２に示すように露光装置本体３によって露光処理が施された基板Ｐが受け渡された際、該基板Ｐの一方の面（下面）を支持する搬出用テーブル５０と、該搬出用テーブル５０を移動する第３移動機構５３と、を備えている。 Further, the carry-out unit 5 supports the one surface (lower surface) of the substrate P when the substrate P subjected to the exposure process by the exposure apparatus main body 3 is delivered as shown in FIG. And a third moving mechanism 53 that moves the unloading table 50.
　第３移動機構５３は、移動機構本体５５と、移動機構本体５５上に配置され、搬出用テーブル５０を保持する保持部５４とを有する。移動機構本体５５は、気体軸受によって、不図示のガイド面に非接触で支持されており、ガイド面上をＸＹ方向に移動可能となっている。このような構成に基づき、搬出用テーブル５０は、基板Ｐを保持した状態で、ガイド面の所定領域内を移動可能となっている。 The third moving mechanism 53 includes a moving mechanism main body 55 and a holding portion 54 that is disposed on the moving mechanism main body 55 and holds the unloading table 50. The moving mechanism body 55 is supported by a gas bearing in a non-contact manner on a guide surface (not shown) and can move in the XY directions on the guide surface. Based on such a configuration, the carry-out table 50 can move within a predetermined region of the guide surface while holding the substrate P.
　移動機構本体５５は、上記移動機構本体３５、４５と同一構成からなるものであり、ガイド面上でＸＹ平面内を移動可能である。また、保持部５４は、上記保持部３４、４４と同一構成からなるものであり、移動機構本体５５に対してＺ軸、θＸ、θＹ方向に移動可能である。保持部５４は、基板Ｐを保持した状態で、Ｘ軸、Ｙ軸、Ｚ軸、θＸ、θＹ、およびθＺ方向の６つの方向に移動可能である。 The moving mechanism main body 55 has the same configuration as the moving mechanism main bodies 35 and 45, and can move in the XY plane on the guide surface. The holding portion 54 has the same configuration as the holding portions 34 and 44 and can move in the Z-axis, θX, and θY directions with respect to the moving mechanism main body 55. The holding unit 54 can move in six directions including the X axis, the Y axis, the Z axis, the θX, the θY, and the θZ directions while holding the substrate P.
　次に、プレートホルダ９の周辺構成について図３Ａ及び図３Ｂを参照しながら説明する。図３Ａはプレートホルダ９の平面構成を示す図であり、図３Ｂはプレートホルダ９の側面構成を示す図である。図３Ａに示されるように、プレートホルダ９には、基板Ｐが載置される基板載置部３１が形成されている。基板載置部３１の上面は、基板Ｐに対するプレートホルダ９の実質的な保持面が良好な平面度を有するように仕上げられている。さらに、基板載置部３１の上面には、基板Ｐをこの面に倣わせて密着させるための吸引孔Ｋ１が複数設けられている。各吸引孔Ｋ１は、不図示の真空ポンプに接続されている。 Next, the peripheral configuration of the plate holder 9 will be described with reference to FIGS. 3A and 3B. FIG. 3A is a diagram illustrating a planar configuration of the plate holder 9, and FIG. 3B is a diagram illustrating a side configuration of the plate holder 9. As shown in FIG. 3A, the plate holder 9 is formed with a substrate placement portion 31 on which the substrate P is placed. The upper surface of the substrate platform 31 is finished so that the substantial holding surface of the plate holder 9 with respect to the substrate P has good flatness. Furthermore, a plurality of suction holes K1 are provided on the upper surface of the substrate mounting portion 31 for bringing the substrate P into close contact with this surface. Each suction hole K1 is connected to a vacuum pump (not shown).
　また、基板載置部３１の上面には、基板Ｐの下面に対してエアー等の気体を噴射することで、該気体を介して基板Ｐを浮上支持する気体噴射孔Ｋ２が複数設けられている。各気体噴射孔Ｋ２は、不図示の気体噴射用ポンプに接続されている。なお、吸引孔Ｋ１と気体噴射孔Ｋ２とは互いが千鳥状に配置されている。 In addition, a plurality of gas injection holes K <b> 2 are provided on the upper surface of the substrate mounting portion 31 to levitate and support the substrate P through the gas by injecting a gas such as air onto the lower surface of the substrate P. . Each gas injection hole K2 is connected to a gas injection pump (not shown). The suction holes K1 and the gas injection holes K2 are arranged in a staggered manner.
　また、プレートホルダ９の周辺部には、基板Ｐの搬入時に該基板Ｐをガイドするためのガイド用ピン３６と、プレートホルダ９の基板載置部３１に対する基板Ｐの位置を規定する位置決めピン３７とが設けられている。これらガイド用ピン３６及び位置決めピン３７は、露光装置本体３内をプレートホルダ９とともに移動可能とされている。 Further, on the periphery of the plate holder 9, guide pins 36 for guiding the substrate P when the substrate P is carried in, and positioning pins 37 for defining the position of the substrate P with respect to the substrate mounting portion 31 of the plate holder 9. And are provided. The guide pins 36 and the positioning pins 37 can be moved together with the plate holder 9 in the exposure apparatus main body 3.
　プレートホルダ９は、図３Ｂに示されるように、その側面部９ａに、搬入用テーブル４０及び搬出用テーブル５０との相対位置を検出する位置検出センサ１９を備えている。位置検出センサ１９は、搬入用テーブル４０及び搬出用テーブル５０に対する相対距離を検出するための距離検出用センサ１９ａと、搬入用テーブル４０及び搬出用テーブル５０に対する相対高さを検出するための高さ検出用センサ１９ｂとを含んでいる。なお、搬入用テーブル４０及び搬出用テーブル５０における位置検出センサ１９に対応する位置には凹部が形成されており、これにより位置検出センサ１９と搬入用テーブル４０及び搬出用テーブル５０とが干渉するのを防止している。 As shown in FIG. 3B, the plate holder 9 is provided with a position detection sensor 19 on the side surface portion 9 a for detecting the relative positions of the carry-in table 40 and the carry-out table 50. The position detection sensor 19 is a distance detection sensor 19a for detecting a relative distance with respect to the carry-in table 40 and the carry-out table 50, and a height for detecting a relative height with respect to the carry-in table 40 and the carry-out table 50. And a detection sensor 19b. A concave portion is formed at a position corresponding to the position detection sensor 19 in the carry-in table 40 and the carry-out table 50, so that the position detection sensor 19 interferes with the carry-in table 40 and the carry-out table 50. Is preventing.
　次に、搬入部４の要部構成について図４Ａ及び図４Ｂを参照しながら説明する。図４Ａは、搬入用テーブル４０の周辺構成を示す平面図であり、図４Ｂは図４ＡのＡ－Ａ線矢視による断面を示す図である。 Next, the configuration of the main part of the carry-in unit 4 will be described with reference to FIGS. 4A and 4B. 4A is a plan view showing a peripheral configuration of the loading table 40, and FIG. 4B is a diagram showing a cross section taken along line AA in FIG. 4A.
　図４Ａ及び４Ｂに示すように、搬入部４は、基板Ｐを搬入用テーブル４０からプレートホルダ９へと移送する第１移送部４２が設けられている。第１移送部４２は、ガイド部４２ａと、基板Ｐに当接する当接部４２ｂと、を含む。 As shown in FIGS. 4A and 4B, the carry-in unit 4 is provided with a first transfer unit 42 that transfers the substrate P from the carry-in table 40 to the plate holder 9. The first transfer part 42 includes a guide part 42 a and a contact part 42 b that comes into contact with the substrate P.
　搬入用テーブル４０の上面には、一方向（同図で示されるＹ方向）に沿って形成される２つの溝状の凹部４０ａが形成されている。この凹部４０ａ内には、上記ガイド部４２ａが設けられている。ガイド部４２ａには、搬入用テーブル４０の上面から突出した状態で上記当接部４２ｂが取り付けられている。当接部４２ｂは、例えばゴム等の弾性部材から構成されるものであり、当接時における基板Ｐへのダメージを低減することができる。 On the upper surface of the loading table 40, two groove-shaped recesses 40a formed along one direction (the Y direction shown in the figure) are formed. The guide portion 42a is provided in the recess 40a. The contact portion 42b is attached to the guide portion 42a in a state of protruding from the upper surface of the loading table 40. The contact portion 42b is made of an elastic member such as rubber, and can reduce damage to the substrate P at the time of contact.
　また、搬入用テーブル４０の上面には、基板Ｐの下面に対してエアー等の気体を噴射することで、該気体を介して基板Ｐを浮上支持する気体噴射孔Ｋ３が複数設けられている。各気体噴射孔Ｋ３は、不図示の気体噴射用ポンプに接続されている。 Also, a plurality of gas injection holes K3 are provided on the upper surface of the carry-in table 40 to levitate and support the substrate P through the gas by injecting a gas such as air onto the lower surface of the substrate P. Each gas injection hole K3 is connected to a gas injection pump (not shown).
　さらに、搬入用テーブル４０の上面には、基板Ｐをこの面に倣わせて密着させるための吸引孔Ｋ４が複数設けられている。各吸引孔Ｋ４は、不図示の真空ポンプに接続されている。気体噴射孔Ｋ３と吸引孔Ｋ４とは、Ｙ方向に沿って互いが千鳥状に配置されている。なお、気体噴射孔Ｋ３と吸引孔Ｋ４とは、かかる千鳥状の配置に限定されず、種々の形態で配置して構わない（例えばＹ方向に沿って交互に配置してもよい）。また、気体噴射孔Ｋ３と吸引孔Ｋ４とは、互いに独立して設けることに限定されず、同一の孔を気体噴射孔Ｋ３及び吸引孔Ｋ４として兼用してもよい。この場合、各孔を気体噴射用ポンプと真空ポンプとに適宜切り換え可能に接続するとよい。 Furthermore, a plurality of suction holes K4 are provided on the upper surface of the loading table 40 for bringing the substrate P into close contact with the surface. Each suction hole K4 is connected to a vacuum pump (not shown). The gas injection holes K3 and the suction holes K4 are arranged in a staggered manner along the Y direction. The gas injection holes K3 and the suction holes K4 are not limited to the staggered arrangement, and may be arranged in various forms (for example, they may be arranged alternately along the Y direction). Further, the gas injection hole K3 and the suction hole K4 are not limited to being provided independently from each other, and the same hole may be used as the gas injection hole K3 and the suction hole K4. In this case, each hole may be connected to a gas injection pump and a vacuum pump so as to be appropriately switched.
　また、搬入用テーブル４０には、後述するようにコータ・デベロッパ（不図示）との間で基板Ｐの受け渡しを行うための上下動機構の基板支持ピンを挿通可能とする貫通孔４７が形成されている。 The carry-in table 40 is formed with a through-hole 47 through which a substrate support pin of a vertical movement mechanism for passing the substrate P to and from a coater / developer (not shown) can be inserted as will be described later. ing.
　次に、搬出部５の要部構成について図５Ａ及び図５Ｂを参照しながら説明する。図５Ａ及び５Ｂに示すように、搬出部５は、基板Ｐをプレートホルダ９から搬出用テーブル５０へと移送する第２移送部５２が設けられている。第２移送部５２は、ガイド部５２ａと、基板Ｐを吸着保持する吸着部５２ｂと、を含む。 Next, the configuration of the main part of the carry-out unit 5 will be described with reference to FIGS. 5A and 5B. As shown in FIGS. 5A and 5B, the unloading unit 5 is provided with a second transfer unit 52 that transfers the substrate P from the plate holder 9 to the unloading table 50. The second transfer part 52 includes a guide part 52 a and a suction part 52 b that sucks and holds the substrate P.
　搬出用テーブル５０の上面には、一方向（同図で示されるＹ方向）に沿って形成される２つの溝状の凹部５０ａが形成されている。この凹部５０ａ内には、上記ガイド部５２ａが設けられている。ガイド部５２ａには、搬出用テーブル５０の上面から突出した状態で上記吸着部５２ｂが取り付けられている。吸着部５２ｂは、例えば真空吸着により基板Ｐを吸着保持する真空吸着パッドを含む。 On the upper surface of the unloading table 50, two groove-shaped recesses 50a formed along one direction (Y direction shown in the figure) are formed. The guide portion 52a is provided in the recess 50a. The suction portion 52b is attached to the guide portion 52a so as to protrude from the upper surface of the carry-out table 50. The suction unit 52b includes a vacuum suction pad that holds the substrate P by vacuum suction, for example.
　また、吸着部５２ｂには、基板搬出時にプレートホルダ９から押し出された基板Ｐに当接する当接部５８が設けられている。この当接部５８は、例えばゴム等の弾性部材から構成されている。 Further, the suction portion 52b is provided with a contact portion 58 that contacts the substrate P pushed out from the plate holder 9 when the substrate is carried out. The contact portion 58 is made of an elastic member such as rubber.
　また、搬出用テーブル５０の上面には、基板Ｐの下面に対してエアー等の気体を噴射することで、該気体を介して基板Ｐを浮上支持する気体噴射孔Ｋ５が複数設けられている。各気体噴射孔Ｋ５は、不図示の気体噴射用ポンプに接続されている。 In addition, a plurality of gas injection holes K5 are provided on the upper surface of the carry-out table 50 to levitate and support the substrate P by injecting a gas such as air onto the lower surface of the substrate P. Each gas injection hole K5 is connected to a gas injection pump (not shown).
　さらに、搬出用テーブル５０の上面には、基板Ｐをこの面に倣わせて密着させるための吸引孔Ｋ６が複数設けられている。各吸引孔Ｋ６は、不図示の真空ポンプに接続されている。なお、気体噴射孔Ｋ５と吸引孔Ｋ６とは互いが千鳥状に配置されている。 Furthermore, a plurality of suction holes K6 are provided on the upper surface of the unloading table 50 for bringing the substrate P into close contact with the surface. Each suction hole K6 is connected to a vacuum pump (not shown). The gas injection holes K5 and the suction holes K6 are arranged in a staggered manner.
　また、搬出用テーブル５０には、後述するようにコータ・デベロッパ（不図示）との間で基板Ｐの受け渡しを行うための上下動機構の基板支持ピンを挿通可能とする貫通孔５７が形成されている。 The unloading table 50 is formed with a through-hole 57 through which a substrate support pin of a vertical movement mechanism for passing the substrate P to and from a coater / developer (not shown) can be inserted as will be described later. ing.
　次に、露光装置１の動作について図６～図１５を参照にしながら説明する。具体的には搬入部４とプレートホルダ９との間における基板Ｐの受け渡し動作、及びプレートホルダ９と搬出部５との間における基板Ｐの受け渡し動作を主に説明する。なお、本実施形態においては、搬入部４の搬入用テーブル４０と、搬出部５の搬出用テーブル５０とが同一水平面内における異なる位置に配置されている。すなわち、搬入用テーブル４０と搬出用テーブル５０とは、平面視した状態（図２に示される+Ｚ方向から視た状態）で相互に重ならない位置に配置されている。 Next, the operation of the exposure apparatus 1 will be described with reference to FIGS. Specifically, the transfer operation of the substrate P between the carry-in unit 4 and the plate holder 9 and the transfer operation of the substrate P between the plate holder 9 and the carry-out unit 5 will be mainly described. In the present embodiment, the carry-in table 40 of the carry-in unit 4 and the carry-out table 50 of the carry-out unit 5 are arranged at different positions in the same horizontal plane. That is, the carry-in table 40 and the carry-out table 50 are arranged at positions that do not overlap each other in a plan view state (a state seen from the + Z direction shown in FIG. 2).
　まず、搬入部４にコータ・デベロッパ（不図示）において感光剤が塗布された基板Ｐを搬入する。このとき、搬入用テーブル４０の下方に位置する上下動機構４９は、貫通孔４７を介して基板支持ピン４９ａを搬入用テーブル４０の上方に配置しておく。続いて、コータ・デベロッパ（不図示）のアーム部４８は、図６に示すように基板支持ピン４９ａの間に挿入される。アーム部４８は降下することで基板Ｐを基板支持ピン４９ａへと受け渡した後、搬入部４から退避する。上下動機構４９は、基板Ｐを支持した基板支持ピン４９ａを降下することで搬入用テーブル４０への基板Ｐの搬入動作が終了する。その後、真空ポンプが駆動されることにより、基板Ｐは、搬入用テーブル４０の上面に吸引孔Ｋ４を介して吸着保持される。 First, a substrate P coated with a photosensitive agent is carried into the carry-in section 4 by a coater / developer (not shown). At this time, the vertical movement mechanism 49 positioned below the loading table 40 has the substrate support pins 49 a disposed above the loading table 40 through the through holes 47. Subsequently, the arm portion 48 of the coater / developer (not shown) is inserted between the substrate support pins 49a as shown in FIG. The arm portion 48 moves down to deliver the substrate P to the substrate support pins 49a and then retracts from the carry-in portion 4. The vertical movement mechanism 49 finishes the operation of loading the substrate P onto the loading table 40 by lowering the substrate support pins 49a that support the substrate P. Thereafter, when the vacuum pump is driven, the substrate P is sucked and held on the upper surface of the loading table 40 via the suction hole K4.
　続いて、プレートホルダ９は、図７Ａに示すように、搬入部４の搬入用テーブル４０に近接するように移動する。具体的に、第１移動機構３３は、プレートホルダ９及び搬入用テーブル４０をＹ方向に沿って近接させた状態で配列する。ここで、プレートホルダ９及び搬入用テーブル４０が近接した状態とは、後述する基板Ｐの受け渡し時に基板Ｐの移動が円滑に行われる距離だけ離間した状態を意味する。 Subsequently, the plate holder 9 moves so as to be close to the loading table 40 of the loading section 4 as shown in FIG. 7A. Specifically, the first moving mechanism 33 arranges the plate holder 9 and the carry-in table 40 close to each other along the Y direction. Here, the state where the plate holder 9 and the carry-in table 40 are close to each other means a state where the plate holder 9 and the carry-in table 40 are separated by a distance at which the movement of the substrate P is smoothly performed during delivery of the substrate P described later.
　また、搬入用テーブル４０とプレートホルダ９とを配列する際、第２移動機構４３を駆動することもできる。このようにすれば、搬入用テーブル４０及びプレートホルダ９を基板Ｐの受け渡し位置に短時間で移動させることができ、基板Ｐの搬入動作に要する時間を短縮することができる。この場合、搬出用テーブル５０は、搬入用テーブル４０に干渉しない位置に退避する。 Also, when the carry-in table 40 and the plate holder 9 are arranged, the second moving mechanism 43 can be driven. In this way, the loading table 40 and the plate holder 9 can be moved to the delivery position of the substrate P in a short time, and the time required for the loading operation of the substrate P can be shortened. In this case, the carry-out table 50 is retracted to a position where it does not interfere with the carry-in table 40.
　また、基板Ｐは、吸引孔Ｋ４を介して搬入用テーブル４０の上面に吸着保持されているので、第２移動機構４３の駆動時に基板Ｐが搬入用テーブル４０上において動いてしまうのを防止することができる。 Further, since the substrate P is sucked and held on the upper surface of the loading table 40 through the suction hole K4, the substrate P is prevented from moving on the loading table 40 when the second moving mechanism 43 is driven. be able to.
　本実施形態では、図７Ｂに示されるように、プレートホルダ９及び搬入用テーブル４０を近接させる際、基板Ｐがプレートホルダ９よりも高く配置している。すなわち、第１移動機構３３は、基板Ｐを支持している搬入用テーブル４０の上面がプレートホルダ９の上面よりも高くなるようにプレートホルダ９を搬入用テーブル４０に近接させる。なお、第２移動機構４３により搬入用テーブル４０の上面がプレートホルダ９の上面よりも高くなるように搬入用テーブル４０を上昇させることもできる。 In the present embodiment, as shown in FIG. 7B, when the plate holder 9 and the loading table 40 are brought close to each other, the substrate P is disposed higher than the plate holder 9. In other words, the first moving mechanism 33 brings the plate holder 9 close to the loading table 40 so that the upper surface of the loading table 40 supporting the substrate P is higher than the upper surface of the plate holder 9. The loading table 40 can be raised by the second moving mechanism 43 so that the upper surface of the loading table 40 is higher than the upper surface of the plate holder 9.
　なお、第１移動機構３３は、プレートホルダ９及び搬入用テーブル４０を接触させた状態で配列することもできる。このようにすれば、後述するプレートホルダ９及び搬入用テーブル４０間における基板Ｐの受け渡しをスムーズに行うことができる。 In addition, the 1st moving mechanism 33 can also be arranged in the state which contacted the plate holder 9 and the table 40 for carrying in. If it does in this way, delivery of the board | substrate P between the plate holder 9 mentioned later and the loading table 40 can be performed smoothly.
　続いて、搬入用テーブル４０は、図８に示すように、上面に形成された複数の気体噴射孔Ｋ３から気体を噴射し、該気体を介して基板Ｐを浮上させた状態で支持する。一方、プレートホルダ９は、基板Ｐを受けとるに際し、上面に形成された複数の気体噴射孔Ｋ２から気体を噴射しておく。 Subsequently, as shown in FIG. 8, the carry-in table 40 injects gas from a plurality of gas injection holes K3 formed on the upper surface, and supports the substrate P in a state of floating through the gas. On the other hand, when receiving the substrate P, the plate holder 9 injects gas from the plurality of gas injection holes K2 formed on the upper surface.
　搬入部４は、搬入用テーブル４０上に基板Ｐを浮上支持した状態で、図９に示されるように、当接部４２ｂを基板Ｐの一端部に当接させる。当接部４２ｂは、凹部４０ａ内のガイド部４２ａに沿って移動することで基板Ｐをプレートホルダ９側へと移動する。 The carry-in section 4 brings the contact portion 42b into contact with one end portion of the substrate P as shown in FIG. 9 while the substrate P is levitated and supported on the carry-in table 40. The contact part 42b moves the substrate P toward the plate holder 9 by moving along the guide part 42a in the recess 40a.
　基板Ｐは搬入用テーブル４０上に浮上した状態となっているので、当接部４２ｂは基板Ｐをプレートホルダ９側にスムーズにスライドさせることができる。なお、プレートホルダ９の上面は、上述のように基板Ｐを浮上支持するようになっている。ここで、気体噴射孔Ｋ３，Ｋ２から噴射する気体に指向性を持たせるようにしてもよい。 Since the substrate P is in a state of floating on the loading table 40, the contact portion 42b can smoothly slide the substrate P to the plate holder 9 side. Note that the upper surface of the plate holder 9 supports the substrate P as described above. Here, the gas injected from the gas injection holes K3 and K2 may have directivity.
　当接部４２ｂにより搬入用テーブル４０の上面をスライドする基板Ｐは、図１０に示されるように、プレートホルダ９の上面へとスムーズに乗り移ることとなる。本実施形態では、搬入用テーブル４０の上面がプレートホルダ９の上面よりも高くなっているので、基板Ｐはプレートホルダ９の側面に接触することなく、スムーズにプレートホルダ９上へと乗り移ることができる。 The substrate P that slides on the upper surface of the loading table 40 by the abutting portion 42b smoothly moves to the upper surface of the plate holder 9 as shown in FIG. In the present embodiment, since the upper surface of the loading table 40 is higher than the upper surface of the plate holder 9, the substrate P can smoothly transfer onto the plate holder 9 without contacting the side surface of the plate holder 9. it can.
　基板Ｐは、図９に示したように、プレートホルダ９の周辺部に設けられたガイド用ピン３６により同図中Ｘ方向における位置が規定された状態でスライドする。当接部４２ｂは、プレートホルダ９における基板搬送方向の下流側に設けられた位置決めピン３７に当接させるまで基板Ｐを移動する。基板Ｐは、ガイド用ピン３６により同図中Ｘ方向における位置が規定されるとともに、位置決めピン３７及び当接部４２ｂに挟まれることで同図中Ｙ方向における位置が規定された状態となる。プレートホルダ９は、気体噴射孔Ｋ２からの気体噴射を停止する。基板Ｐは、図１１に示すように、基板載置部３１に対して位置合わせされた状態で載置される。 As shown in FIG. 9, the substrate P slides in a state where the position in the X direction in the drawing is defined by the guide pins 36 provided in the periphery of the plate holder 9. The abutting portion 42b moves the substrate P until it abuts on a positioning pin 37 provided on the downstream side of the plate holder 9 in the substrate transport direction. The position of the substrate P in the X direction in the figure is defined by the guide pins 36, and the position in the Y direction in the figure is defined by being sandwiched between the positioning pins 37 and the contact portions 42b. The plate holder 9 stops gas injection from the gas injection hole K2. As shown in FIG. 11, the substrate P is placed in a state of being aligned with the substrate platform 31.
　ところで、従来基板をプレートホルダに載置する場合、基板の載置ずれ（所定の載置位置からの位置ずれ）や基板の変形が生じる可能性があった。この載置ずれが生じる原因の一つとして、例えば基板の載置直前に基板とプレートホルダとの間に生じる薄い空気層によって基板が浮遊状態となることが考えられる。また、基板の変形を生じさせる原因の一つとして、例えば基板を載置した後に基板とプレートホルダとの間に空気溜りが介在することで基板が膨らんだ状態となることが考えられる。 By the way, when the conventional substrate is placed on the plate holder, there is a possibility that the substrate is displaced (displacement from a predetermined placement position) or the substrate is deformed. One possible cause of this displacement is that the substrate floats due to a thin air layer generated between the substrate and the plate holder immediately before the substrate is placed, for example. Further, as one of the causes for causing the deformation of the substrate, for example, it is conceivable that the substrate swells due to an air pocket interposed between the substrate and the plate holder after the substrate is placed.
　これに対し、本実施形態においては、基板Ｐが上述のように気体の噴射によって浮上した状態で搬送されるので、歪みが無く平面度の高い状態でプレートホルダ９に受け渡される。また、基板Ｐは浮上支持されていた高さから基板載置部３１へと載置されるため、基板Ｐと基板載置部３１との間に空気溜りや空気層が生じることが防止される。よって、基板Ｐが膨らんだ状態となることが抑制され、基板Ｐの載置ずれや変形の発生を防止することができる。よって、プレートホルダ９に対する所定の位置に平面度が高い状態で基板Ｐを載置することができる。その後、真空ポンプが駆動されることにより、基板Ｐは、基板載置部３１の上面に吸引孔Ｋ１を介して吸着保持される。 In contrast, in the present embodiment, since the substrate P is transported in a state of being floated by gas injection as described above, the substrate P is transferred to the plate holder 9 with no distortion and high flatness. Further, since the substrate P is placed on the substrate platform 31 from the height at which the substrate P is levitated, it is possible to prevent an air pool or an air layer from being generated between the substrate P and the substrate platform 31. . Therefore, it becomes possible to prevent the substrate P from being swollen and prevent the substrate P from being displaced or deformed. Therefore, the substrate P can be placed at a predetermined position with respect to the plate holder 9 with high flatness. Thereafter, when the vacuum pump is driven, the substrate P is adsorbed and held on the upper surface of the substrate platform 31 via the suction hole K1.
　プレートホルダ９に基板Ｐを載置した後、マスクＭは照明系からの露光光ＩＬで照明される。露光光ＩＬで照明されたマスクＭのパターンは、プレートホルダ９に載置されている基板Ｐに投影光学系ＰＬを介して投影露光される。
　露光装置１では、上述のようにプレートホルダ９上に良好に基板Ｐを載置することができるため、基板Ｐ上の適正な位置に所定の露光を高精度に行うことができ、信頼性の高い露光処理を実現できる。 After placing the substrate P on the plate holder 9, the mask M is illuminated with the exposure light IL from the illumination system. The pattern of the mask M illuminated with the exposure light IL is projected and exposed to the substrate P placed on the plate holder 9 via the projection optical system PL.
Since the exposure apparatus 1 can satisfactorily place the substrate P on the plate holder 9 as described above, predetermined exposure can be performed at an appropriate position on the substrate P with high accuracy, and reliability can be improved. High exposure processing can be realized.
　本実施形態では、基板Ｐに露光処理を行っている最中、或いは後述するように露光処理済みの基板Ｐを搬出部５に搬送している間、コータ・デベロッパ（不図示）によって感光剤が塗布された次の基板Ｐが搬入部４の搬入用テーブル４０上に載置することができる。 In the present embodiment, the photosensitive agent is applied by a coater / developer (not shown) while the substrate P is being exposed or while the exposed substrate P is being transported to the carry-out unit 5 as will be described later. The next coated substrate P can be placed on the loading table 40 of the loading unit 4.
　次に、露光処理終了後のプレートホルダ９からの基板Ｐの搬出動作について説明する。
　露光処理が終了すると、プレートホルダ９は、図１２に示されるように搬出部５の搬出用テーブル５０に近接するように移動する。具体的に、第１移動機構３３は、プレートホルダ９及び搬出用テーブル５０をＹ方向に沿って近接させた状態で配列する。このとき、基板Ｐは、吸引孔Ｋ１を介して吸着保持されているので、第１移動機構３３の駆動時に基板Ｐが基板載置部３１上において動いてしまうのを防止することができる。 Next, the carrying-out operation of the substrate P from the plate holder 9 after the exposure process is completed will be described.
When the exposure process ends, the plate holder 9 moves so as to be close to the unloading table 50 of the unloading unit 5 as shown in FIG. Specifically, the first moving mechanism 33 arranges the plate holder 9 and the unloading table 50 close to each other along the Y direction. At this time, since the substrate P is sucked and held through the suction hole K1, it is possible to prevent the substrate P from moving on the substrate platform 31 when the first moving mechanism 33 is driven.
　また、搬出用テーブル５０とプレートホルダ９とを配列する際、第３移動機構５３を駆動することもできる。このようにすれば、搬入用テーブル４０及びプレートホルダ９を基板Ｐの受け渡し位置に短時間で移動させることができ、基板Ｐの搬出動作に要する時間を短縮することができる。この場合、搬入用テーブル４０は、搬出用テーブル５０に干渉しない位置に退避する。 Further, when the carry-out table 50 and the plate holder 9 are arranged, the third moving mechanism 53 can be driven. In this way, the loading table 40 and the plate holder 9 can be moved to the delivery position of the substrate P in a short time, and the time required for the unloading operation of the substrate P can be shortened. In this case, the carry-in table 40 is retracted to a position where it does not interfere with the carry-out table 50.
　本実施形態では、プレートホルダ９及び搬出用テーブル５０を近接させる際、プレートホルダ９及び搬入用テーブル４０を近接させる際同様、基板Ｐの搬送先に相当するプレートホルダ９よりも基板Ｐを高く配置している。すなわち、第１移動機構３３は、基板Ｐを支持しているプレートホルダ９の上面が搬出用テーブル５０の上面よりも高くなるようにプレートホルダ９を搬出用テーブル５０に近接させる。なお、第３移動機構５３により搬出用テーブル５０の上面がプレートホルダ９の上面よりも低くなるように搬出用テーブル５０を下降させることもできる。 In the present embodiment, when the plate holder 9 and the carry-out table 50 are brought close to each other, the substrate P is arranged higher than the plate holder 9 corresponding to the transfer destination of the substrate P, as when the plate holder 9 and the carry-in table 40 are brought close to each other. is doing. That is, the first moving mechanism 33 brings the plate holder 9 close to the unloading table 50 so that the upper surface of the plate holder 9 supporting the substrate P is higher than the upper surface of the unloading table 50. Note that the carry-out table 50 can be lowered by the third moving mechanism 53 so that the upper surface of the carry-out table 50 is lower than the upper surface of the plate holder 9.
　第１移動機構３３は、プレートホルダ９及び搬出用テーブル５０を接触させた状態で配列することもできる。このようにすれば、後述するプレートホルダ９及び搬出用テーブル５０間における基板Ｐの受け渡しをスムーズに行うことができる。 The first moving mechanism 33 can be arranged in a state where the plate holder 9 and the unloading table 50 are in contact with each other. If it does in this way, delivery of substrate P between plate holder 9 mentioned below and carrying-out table 50 can be performed smoothly.
　プレートホルダ９は、真空ポンプの駆動を停止し、吸引孔Ｋ１を介した基板Ｐの基板載置部３１に対する吸着保持を解除する。続いて、プレートホルダ９は、図１３に示すように、基板載置部３１の上面に形成された複数の気体噴射孔Ｋ２から気体を噴射し、該気体を介して基板Ｐを浮上させた状態で支持する。一方、搬出部５は、基板Ｐを受けとるに際し、搬出用テーブル５０の上面に形成された複数の気体噴射孔Ｋ５から気体を噴射しておく。 The plate holder 9 stops driving the vacuum pump, and releases the suction holding of the substrate P to the substrate mounting portion 31 through the suction hole K1. Subsequently, as shown in FIG. 13, the plate holder 9 injects gas from the plurality of gas injection holes K2 formed on the upper surface of the substrate mounting portion 31 and floats the substrate P through the gas. Support with. On the other hand, when the unloading unit 5 receives the substrate P, the unloading unit 5 injects gas from a plurality of gas injection holes K5 formed on the upper surface of the unloading table 50.
　搬出部５は、プレートホルダ９の基板載置部３１上に浮上支持される基板Ｐ側に第２移送部５２の吸着部５２ｂをガイド部５２ａに沿って移動する。位置決めピン３７は、図１４Ａに示すように基板載置部３１上に浮上する基板Ｐの端部を押圧する。これにより、基板載置部３１上に浮上する基板Ｐは搬出用テーブル５０側へとスライドし、図１４Ｂに示すように吸着部５２ｂに取り付けられた当接部５８に接触する。このように位置決めピン３７を用いて基板Ｐを当接部５８側にスライドさせることで、プレートホルダ９上の基板Ｐに対向する位置まで吸着部５２ｂをガイド部５２ａに沿って移動させる必要が無い。当接部５８に基板Ｐの端部が接触した後、吸着部５２ｂは基板Ｐを吸着保持し、図１４Ｃに示すようにガイド部５２ａに沿って同図中Ｙ方向に沿って移動する。 The unloading section 5 moves the suction section 52b of the second transfer section 52 along the guide section 52a toward the substrate P that is levitated and supported on the substrate placement section 31 of the plate holder 9. The positioning pins 37 press the end of the substrate P that floats on the substrate platform 31 as shown in FIG. 14A. As a result, the substrate P that floats on the substrate platform 31 slides toward the carry-out table 50 and comes into contact with the contact portion 58 attached to the suction portion 52b as shown in FIG. 14B. By sliding the substrate P to the contact portion 58 side using the positioning pins 37 in this way, there is no need to move the suction portion 52b along the guide portion 52a to a position facing the substrate P on the plate holder 9. . After the end portion of the substrate P comes into contact with the contact portion 58, the suction portion 52b sucks and holds the substrate P and moves along the Y direction in the drawing along the guide portion 52a as shown in FIG. 14C.
　このとき、基板Ｐはプレートホルダ９上に浮上した状態で支持されているので、吸着部５２ｂは基板Ｐを搬出用テーブル５０側にスムーズにスライドさせることができる。また、搬出用テーブル５０の上面は、上述のように基板Ｐを浮上支持するようになっている。ここで、気体噴射孔Ｋ２，Ｋ５から噴射する気体に指向性を持たせるようにしてもよい。 At this time, since the substrate P is supported in a state of floating on the plate holder 9, the suction portion 52b can smoothly slide the substrate P toward the unloading table 50 side. Further, the upper surface of the carry-out table 50 supports the substrate P as described above. Here, the gas injected from the gas injection holes K2 and K5 may have directivity.
　吸着部５２ｂの移動により基板載置部３１の上面をスライドする基板Ｐは、搬出用テーブル５０の上面へとスムーズに乗り移ることとなる。本実施形態では、プレートホルダ９の上面が搬出用テーブル５０の上面よりも高くなっているので、基板Ｐは搬出用テーブル５０の側面に接触することなく、スムーズに搬出用テーブル５０上へと乗り移ることができる。 The substrate P that slides on the upper surface of the substrate platform 31 by the movement of the suction unit 52b smoothly moves to the upper surface of the carry-out table 50. In this embodiment, since the upper surface of the plate holder 9 is higher than the upper surface of the unloading table 50, the substrate P smoothly transfers onto the unloading table 50 without contacting the side surface of the unloading table 50. be able to.
　吸着部５２ｂによる基板Ｐの移動が終了した後、搬出用テーブル５０は、気体噴射孔Ｋ５からの気体噴射を停止するとともに、吸引孔Ｋ６を介して基板Ｐを吸着保持する。搬出部５は、基板Ｐを吸着保持した状態で、第３移動機構５３を駆動し、搬出用テーブル５０を基板Ｐの搬出位置へと移動する。 After the movement of the substrate P by the suction part 52b is completed, the carry-out table 50 stops the gas injection from the gas injection hole K5 and holds the substrate P by suction through the suction hole K6. The unloading unit 5 drives the third moving mechanism 53 in a state where the substrate P is sucked and held, and moves the unloading table 50 to the unloading position of the substrate P.
　露光装置１は、プレートホルダ９から基板Ｐを搬出部５へと受け渡した後、搬入部４の搬入用テーブル４０にプレートホルダ９を近接するように移動する。そして、同様に、搬入用テーブル４０とプレートホルダ９との間で基板Ｐの受け渡しを行い、プレートホルダ９に載置された基板Ｐに対して露光処理を行うことができる。 The exposure apparatus 1 transfers the substrate P from the plate holder 9 to the carry-out unit 5, and then moves the plate holder 9 close to the carry-in table 40 of the carry-in unit 4. Similarly, the substrate P can be transferred between the loading table 40 and the plate holder 9, and the exposure process can be performed on the substrate P placed on the plate holder 9.
　本実施形態では、次の基板Ｐを搬入部４からプレートホルダ９に搬入している間、或いは該次の基板Ｐに対して露光処理を行っている間に、搬出用テーブル５０に載置される露光処理済みの基板Ｐを搬出する。このとき、搬出用テーブル５０の下方に位置する上下動機構６０は、貫通孔５７を介して、基板支持ピン６０ａを搬出用テーブル５０の上方に配置する。これにより、基板Ｐは、基板支持ピン６０ａに支持されることで搬出用テーブル５０の上方に保持されたものとなる。続いて、コータ・デベロッパ（不図示）のアーム部４８は、図１５に示すように基板支持ピン６０ａの間に挿入される。その後、基板支持ピン６０ａを降下することにより、アーム部４８に基板Ｐが受け渡される。アーム部４８は、コータ・デベロッパ（不図示）内に基板Ｐを移動し、現像処理を行う。 In the present embodiment, the next substrate P is placed on the carry-out table 50 while the next substrate P is being carried into the plate holder 9 from the carry-in unit 4 or while the next substrate P is being subjected to the exposure process. The exposed substrate P is unloaded. At this time, the vertical movement mechanism 60 located below the carry-out table 50 arranges the substrate support pins 60 a above the carry-out table 50 through the through holes 57. Thereby, the board | substrate P will be hold | maintained above the carrying-out table 50 by being supported by the board | substrate support pin 60a. Subsequently, the arm 48 of the coater / developer (not shown) is inserted between the substrate support pins 60a as shown in FIG. Then, the board | substrate P is delivered to the arm part 48 by dropping the board | substrate support pin 60a. The arm unit 48 moves the substrate P into a coater / developer (not shown) and performs development processing.
　このように、プレートホルダ９は搬入部４と搬出部５とに対して同一水平面（ＸＹ平面）内を移動することで交互にアクセスすることで、露光装置本体３に対する基板Ｐの搬出入動作を行うことができる。本実施形態では、搬入部４及び搬出部５の配列方向に沿ってプレートホルダ９を移動する構成としたので、プレートホルダ９と搬入部４及び搬出部５とを近接或いは接触させた状態に配列することを短時間で行うことができる。よって、基板Ｐの搬出入動作に伴う処理時間（所謂、タクト）を短縮することができる。 As described above, the plate holder 9 alternately accesses the carry-in unit 4 and the carry-out unit 5 by moving in the same horizontal plane (XY plane), thereby performing the carry-in / out operation of the substrate P with respect to the exposure apparatus main body 3. It can be carried out. In this embodiment, since the plate holder 9 is moved along the arrangement direction of the carry-in unit 4 and the carry-out unit 5, the plate holder 9 and the carry-in unit 4 and the carry-out unit 5 are arranged close to or in contact with each other. Can be done in a short time. Therefore, the processing time (so-called tact) associated with the loading / unloading operation of the substrate P can be shortened.
　本実施形態によれば、浮上支持された基板Ｐをスライドすることで搬入部４からプレートホルダ９へと搬送することができるので、基板Ｐと基板載置部３１との間に空気溜りや空気層が生じることが防止され、基板Ｐの載置ずれや変形の発生を防止できる。よって、信頼性の高い露光処理を行うことができる。 According to this embodiment, since the substrate P supported to be levitated can be slid and transferred from the loading unit 4 to the plate holder 9, an air pool or air is provided between the substrate P and the substrate platform 31. It is possible to prevent the generation of a layer, and to prevent the substrate P from being displaced or deformed. Therefore, highly reliable exposure processing can be performed.
　なお、第１実施形態において、搬入用テーブル４０からプレートホルダ９へと基板Ｐを搬送する際、搬入用テーブル４０の上面を傾斜させることもできる。具体的には、第２移動機構４３の保持部４４は、気体噴射孔Ｋ３からの気体噴射によって浮上した状態で基板Ｐを支持する搬入用テーブル４０の上面をプレートホルダ９側（θＹ方向）に傾斜させる。これにより、基板Ｐの自重を利用して該基板Ｐをプレートホルダ９側に移動させることができる。 In the first embodiment, when the substrate P is transported from the loading table 40 to the plate holder 9, the upper surface of the loading table 40 can be inclined. Specifically, the holding portion 44 of the second moving mechanism 43 has the upper surface of the loading table 40 that supports the substrate P in a state of being floated by gas injection from the gas injection hole K3 on the plate holder 9 side (θY direction). Tilt. Accordingly, the substrate P can be moved to the plate holder 9 side by utilizing the weight of the substrate P.
　また、プレートホルダ９から搬出用テーブル５０へと基板Ｐを搬送する際、プレートホルダ９の上面を傾斜させることもできる。具体的に、第１移動機構３３の保持部３４は、気体噴射孔Ｋ２からの気体噴射によって浮上した状態で基板Ｐを支持するプレートホルダ９の上面を搬出用テーブル５０側（θＹ方向）に傾斜させる。これにより、基板Ｐの自重を利用して該基板Ｐを搬出用テーブル５０側に移動させることができる。 Further, when the substrate P is transported from the plate holder 9 to the unloading table 50, the upper surface of the plate holder 9 can be inclined. Specifically, the holding portion 34 of the first moving mechanism 33 inclines the upper surface of the plate holder 9 that supports the substrate P in the state of floating by the gas injection from the gas injection hole K2 toward the unloading table 50 (θY direction). Let Thereby, the substrate P can be moved to the unloading table 50 side by utilizing the weight of the substrate P.
　（第２実施形態）
　続いて、本発明の第２実施形態に係る構成について説明する。なお、本実施形態においては、第１実施形態の構成要素と同一の要素については同一符号を付し、その説明を省略する。第２実施形態は、搬入部１０４における第１移送部１４９の構成が第１実施形態と異なっている。 (Second Embodiment)
Next, the configuration according to the second embodiment of the present invention will be described. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted. The second embodiment is different from the first embodiment in the configuration of the first transfer unit 149 in the carry-in unit 104.
　図１６Ａ及び図１６Ｂは、本実施形態に係る搬入部１０４の構成を示す図であり、図１６Ａは搬入部１０４の平面構成を示す図であり、図１６Ｂは搬入部１０４の図１６Ａ中Ａ－Ａ線矢視による側断面を示す図である。 16A and 16B are diagrams showing a configuration of the carry-in unit 104 according to the present embodiment, FIG. 16A is a diagram showing a planar configuration of the carry-in unit 104, and FIG. It is a figure which shows the side cross section by A line arrow.
　本実施形態に係る搬入部１０４の第１移送部１４９は、図１６Ａ及び１６Ｂに示すように、基板Ｐの一方の面に気体を噴射することで浮上支持する構成に代え、コロ機構１４８を有している。 As shown in FIGS. 16A and 16B, the first transfer unit 149 of the carry-in unit 104 according to the present embodiment has a roller mechanism 148 instead of a configuration in which the gas is injected to one surface of the substrate P to support floating. is doing.
　搬入用テーブル１４０の一端側には、図１６Ａに示すように、複数の切欠１４１が形成されている。この切欠１４１の各々には、上記コロ機構１４８を構成するコロ１４２が軸１４３に回転可能に支持されており、コロ１４２は不図示の駆動機構により自転可能となっている。コロ機構１４８は、図１６Ｂに示すように、コロ１４２が基板Ｐに対して接触或いは離間可能に構成されている。 As shown in FIG. 16A, a plurality of notches 141 are formed on one end side of the loading table 140. In each of the notches 141, a roller 142 constituting the roller mechanism 148 is rotatably supported by a shaft 143. The roller 142 can be rotated by a driving mechanism (not shown). As shown in FIG. 16B, the roller mechanism 148 is configured such that the roller 142 can contact or be separated from the substrate P.
　このような構成に基づき、コロ機構１４８は、搬入用テーブル１４０上に支持される基板Ｐの下面に複数のコロ１４２を接触させつつ、所定方向に回転させることで、該基板Ｐをプレートホルダ９側に移動することができる。コロ１４２の形成材料としては、基板Ｐとの間で大きな摩擦力を生じる、例えばゴム等の弾性部材を用いることができる。このような弾性部材を用いてコロ１４２を構成することで、基板Ｐに対するダメージ（傷など）を防止することができる。また、搬入用テーブル１４０の上面には、上記吸引孔Ｋ４のみが設けられている。 Based on such a configuration, the roller mechanism 148 rotates the substrate P in a predetermined direction while bringing the rollers 142 into contact with the lower surface of the substrate P supported on the loading table 140, thereby causing the plate holder 9 to rotate the substrate P. Can move to the side. As a material for forming the roller 142, an elastic member such as rubber that generates a large frictional force with the substrate P can be used. By configuring the roller 142 using such an elastic member, damage (such as scratches) to the substrate P can be prevented. Further, only the suction hole K4 is provided on the upper surface of the loading table 140.
　次に、本実施形態における露光装置１の動作について説明する。具体的には、第１実施形態と異なる、搬入部１０４とプレートホルダ９との間における基板Ｐの受け渡し動作について述べる。 Next, the operation of the exposure apparatus 1 in this embodiment will be described. Specifically, the transfer operation of the substrate P between the carry-in unit 104 and the plate holder 9 different from the first embodiment will be described.
　はじめに、コータ・デベロッパ（不図示）において感光剤を塗布した基板Ｐを搬入部１０４に搬入する。基板Ｐは、搬入用テーブル１４０の上面に吸引孔Ｋ４を介して吸着保持される。その後、プレートホルダ９は、搬入用テーブル１４０に近接するように移動する（図７Ａ参照）。 First, a substrate P coated with a photosensitive agent is carried into the carry-in section 104 by a coater / developer (not shown). The substrate P is sucked and held on the upper surface of the loading table 140 through the suction hole K4. Thereafter, the plate holder 9 moves so as to approach the carry-in table 140 (see FIG. 7A).
　本実施形態においても、基板Ｐを支持している搬入用テーブル１４０の上面がプレートホルダ９の上面よりも高くなるようにプレートホルダ９を搬入用テーブル１４０に近接させることが望ましい（図７Ｂ参照）。 Also in this embodiment, it is desirable that the plate holder 9 is brought close to the loading table 140 so that the upper surface of the loading table 140 supporting the substrate P is higher than the upper surface of the plate holder 9 (see FIG. 7B). .
　しかしながら、本実施形態では、仮に、搬入用テーブル１４０の上面がプレートホルダ９の上面よりも低い場合でも、少なくともコロ１４２の上面がプレートホルダ９の上面より高ければ、コロ１４２上に乗り上がった基板Ｐを搬入用テーブル４０側からプレートホルダ９側へと確実に搬送することができる。 However, in the present embodiment, even if the upper surface of the loading table 140 is lower than the upper surface of the plate holder 9, if the upper surface of the roller 142 is at least higher than the upper surface of the plate holder 9, the substrate that has run on the roller 142. P can be reliably conveyed from the loading table 40 side to the plate holder 9 side.
　続いて、搬入用テーブル１４０は、図１７に示すように、コロ機構１４８のコロ１４２を基板Ｐの下面に当接させるとともに、所定方向に回転させる。一方、プレートホルダ９は、基板Ｐを受けとるに際し、上面に形成された複数の気体噴射孔Ｋ２から気体を噴射しておく。基板Ｐはコロ１４２との摩擦力によってプレートホルダ９側にスムーズにスライド移動する。 Subsequently, as shown in FIG. 17, the carry-in table 140 causes the roller 142 of the roller mechanism 148 to contact the lower surface of the substrate P and to rotate in a predetermined direction. On the other hand, when receiving the substrate P, the plate holder 9 injects gas from the plurality of gas injection holes K2 formed on the upper surface. The substrate P slides smoothly toward the plate holder 9 due to the frictional force with the roller 142.
　ここで、基板Ｐの搬送先であるプレートホルダ９は、気体噴射孔Ｋ２から気体が噴射されることで基板載置部３１上に基板Ｐが浮上支持されるようになっている。
　したがって、コロ機構１４８により搬入用テーブル１４０の上面をスライドする基板Ｐは、プレートホルダ９の上面へとスムーズに乗り移ることとなる。 Here, the plate holder 9 which is the transport destination of the substrate P is configured such that the substrate P is supported by being floated on the substrate mounting portion 31 by ejecting gas from the gas ejection hole K2.
Therefore, the substrate P that slides on the upper surface of the loading table 140 by the roller mechanism 148 smoothly transfers to the upper surface of the plate holder 9.
　基板Ｐは、図１８に示されるように、プレートホルダ９の周辺部に設けられたガイド用ピン３６により同図中Ｘ方向における位置が規定された状態でスライドする。コロ機構１４８は、プレートホルダ９における基板搬送方向の下流側に設けられた位置決めピン３７に当接させるまで基板Ｐを移動する。基板Ｐは、ガイド用ピン３６により同図中Ｘ方向における位置が規定されるとともに、位置決めピン３７及び当接部４２ｂに挟まれることで同図中Ｙ方向における位置が規定された状態となる。プレートホルダ９は、気体噴射孔Ｋ３からの気体噴射を停止する。これにより、基板Ｐは基板載置部３１に対して位置合わせされた状態で載置される。 As shown in FIG. 18, the substrate P slides in a state where the position in the X direction in the drawing is defined by the guide pins 36 provided in the periphery of the plate holder 9. The roller mechanism 148 moves the substrate P until it comes into contact with a positioning pin 37 provided on the downstream side of the plate holder 9 in the substrate transport direction. The position of the substrate P in the X direction in the figure is defined by the guide pins 36, and the position in the Y direction in the figure is defined by being sandwiched between the positioning pins 37 and the contact portions 42b. The plate holder 9 stops gas injection from the gas injection hole K3. As a result, the substrate P is placed in a state of being aligned with the substrate placement unit 31.
　本実施形態においても、基板Ｐが上述のように気体の噴射によって浮上した状態で搬送されるので、歪みが無く平面度の高い状態でプレートホルダ９に受け渡すことができ、基板Ｐと基板載置部３１との間に空気溜りや空気層が生じることが防止される。よって、プレートホルダ９に対する所定の位置に平面度が高い状態で基板Ｐを載置することができる。したがって、基板Ｐ上の適正な位置に所定の露光を高精度に行うことができ、信頼性の高い露光処理を行うことができる。
　なお、露光処理終了後のプレートホルダ９からの基板Ｐの搬出動作については第１実施形態と同様であるため、その説明を省略するものとする。 Also in this embodiment, since the substrate P is transported in a state of being floated by gas injection as described above, it can be transferred to the plate holder 9 with no distortion and high flatness. It is possible to prevent an air pool or an air layer from being generated between the mounting portion 31 and the mounting portion 31. Therefore, the substrate P can be placed at a predetermined position with respect to the plate holder 9 with high flatness. Therefore, predetermined exposure can be performed with high accuracy at an appropriate position on the substrate P, and highly reliable exposure processing can be performed.
In addition, since the carrying-out operation | movement of the board | substrate P from the plate holder 9 after completion | finish of exposure processing is the same as that of 1st Embodiment, the description shall be abbreviate | omitted.
　なお、上記説明では、搬入部１０４の第１移送部１４９としてコロ機構１４８を採用する場合について説明したが、搬出部５の第２移送部５２としてコロ機構を採用することもできる。また、搬入用テーブル１４０において第１実施形態同様、気体噴射により基板Ｐを浮上支持する構成を採用することもできる。この構成によれば、基板Ｐが浮上した状態でコロ機構１４８によって搬送されるので、基板Ｐをプレートホルダ９側にスムーズに搬送することができる。 In the above description, the case where the roller mechanism 148 is employed as the first transfer unit 149 of the carry-in unit 104 has been described, but a roller mechanism may be employed as the second transfer unit 52 of the carry-out unit 5. Moreover, the structure which floats and supports the board | substrate P by gas injection can also be employ | adopted in the carrying-in table 140 like 1st Embodiment. According to this configuration, since the substrate P is transported by the roller mechanism 148 in a state where the substrate P is floated, the substrate P can be smoothly transported to the plate holder 9 side.
　（第３実施形態）
　続いて、本発明の第３実施形態に係る構成について説明する。なお、本実施形態においては、第１、２実施形態の構成要素と同一の要素については同一符号を付し、その説明を省略する。第３実施形態は、プレートホルダ９が第１移送機構を備える点が主に異なっている。 (Third embodiment)
Next, the configuration according to the third embodiment of the present invention will be described. In the present embodiment, the same components as those in the first and second embodiments are denoted by the same reference numerals, and the description thereof is omitted. The third embodiment is mainly different in that the plate holder 9 includes a first transfer mechanism.
　図１９は、本実施形態に係るプレートホルダ１０９の構成を示す図である。本実施形態に係るプレートホルダ１０９は、図１９に示すように基板Ｐを搬入用テーブル４０からプレートホルダ９へと移送する第１移送部２４９を備えている。この第１移送部２４９は、基板Ｐの幅方向における両側部を吸着保持する吸着部２５０を含む。この吸着部２５０は、基板Ｐの面方向に沿うＸＹ平面内において自由に移動可能とされている。 FIG. 19 is a diagram showing a configuration of the plate holder 109 according to the present embodiment. The plate holder 109 according to the present embodiment includes a first transfer unit 249 that transfers the substrate P from the loading table 40 to the plate holder 9 as shown in FIG. The first transfer unit 249 includes a suction unit 250 that sucks and holds both side portions of the substrate P in the width direction. The suction part 250 is freely movable in the XY plane along the surface direction of the substrate P.
　また、本実施形態では、プレートホルダ９の周辺部に、第１移送部２４９により搬入される基板Ｐの基板載置部３１に対する位置を検出するための位置検出センサ２５２が設けられている。この位置検出センサ２５２としては、例えばポテンショメータを例示することができ、本発明は接触方式或いは非接触方式のいずれのメータを用いることができる。 In the present embodiment, a position detection sensor 252 for detecting the position of the substrate P carried by the first transfer unit 249 relative to the substrate platform 31 is provided in the peripheral part of the plate holder 9. As this position detection sensor 252, for example, a potentiometer can be exemplified. In the present invention, either a contact type or non-contact type meter can be used.
　吸着部２５０は、気体噴射孔Ｋ３からの気体噴射によって搬入用テーブル４０上に浮上支持される基板Ｐの端部を吸着保持し、図２０Ａに示すように搬入用テーブル４０からプレートホルダ９側へと搬送する。一方、プレートホルダ９は、基板Ｐを受けとるに際し、上面に形成された複数の気体噴射孔Ｋ２から気体を噴射しておく。このとき、気体噴射孔Ｋ２，Ｋ３から噴射する気体に指向性を持たせるようにしてもよい。 The suction part 250 sucks and holds the end of the substrate P that is levitated and supported on the carry-in table 40 by gas injection from the gas injection hole K3, and moves from the carry-in table 40 to the plate holder 9 as shown in FIG. 20A. And carry. On the other hand, when receiving the substrate P, the plate holder 9 injects gas from the plurality of gas injection holes K2 formed on the upper surface. At this time, the gas injected from the gas injection holes K2, K3 may have directivity.
　吸着部２５０は、図２０Ｂに示すように、基板Ｐの端部を位置検出センサ２５２に接触させることで、露光装置１は、基板Ｐにおける基板載置部３１に対する位置ズレを検知することができる。なお、吸着部２５０は、上記位置検出センサ２５２の検出結果に基づいて駆動するように構成されている。
　したがって、露光装置１は、位置検出センサ２５２の検出結果に基づき、吸着部２５０に保持された基板Ｐの基板載置部３１に対する位置を補正することができる。 As illustrated in FIG. 20B, the exposure unit 1 can detect a positional shift of the substrate P with respect to the substrate mounting unit 31 by bringing the end of the substrate P into contact with the position detection sensor 252 as illustrated in FIG. 20B. . The suction unit 250 is configured to be driven based on the detection result of the position detection sensor 252.
Therefore, the exposure apparatus 1 can correct the position of the substrate P held by the suction unit 250 relative to the substrate placement unit 31 based on the detection result of the position detection sensor 252.
　本実施形態においても、基板Ｐが上述のように気体の噴射によって浮上した状態で搬送されるので、歪みが無く平面度の高い状態でプレートホルダ９に受け渡すことができ、基板Ｐと基板載置部３１との間に空気溜りや空気層が生じることが防止される。よって、プレートホルダ９に対する所定の位置に平面度が高い状態で基板Ｐを載置することができる。したがって、基板Ｐ上の適正な位置に所定の露光を高精度に行うことができ、信頼性の高い露光処理を行うことができる。
　なお、露光処理終了後のプレートホルダ９からの基板Ｐの搬出動作については第１実施形態と同様であるため、その説明を省略するものとする。 Also in this embodiment, since the substrate P is transported in a state of being floated by gas injection as described above, it can be transferred to the plate holder 9 with no distortion and high flatness. It is possible to prevent an air pool or an air layer from being generated between the mounting portion 31 and the mounting portion 31. Therefore, the substrate P can be placed at a predetermined position with respect to the plate holder 9 with high flatness. Therefore, predetermined exposure can be performed with high accuracy at an appropriate position on the substrate P, and highly reliable exposure processing can be performed.
In addition, since the carrying-out operation | movement of the board | substrate P from the plate holder 9 after completion | finish of exposure processing is the same as that of 1st Embodiment, the description shall be abbreviate | omitted.
　（第４実施形態）
　続いて、本発明の第４実施形態に係る構成について説明する。なお、本実施形態においては、第１実施形態の構成要素と同一の要素については同一符号を付し、その説明を省略する。第４実施形態は、図２１に示すように、搬入用テーブル４０及び搬出用テーブル５０が平面視した状態で相互に重なる位置に配置される点が第１実施形態と主に異なっている。すなわち、プレートホルダ９との間で基板Ｐの受け渡しを行う際、搬入用テーブル４０及び搬出用テーブル５０がプレートホルダ９に対して上下動作を行うようになっている。 (Fourth embodiment)
Next, a configuration according to the fourth embodiment of the present invention will be described. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted. As shown in FIG. 21, the fourth embodiment is mainly different from the first embodiment in that the carry-in table 40 and the carry-out table 50 are arranged at positions overlapping each other in a plan view. That is, when the substrate P is transferred to and from the plate holder 9, the carry-in table 40 and the carry-out table 50 move up and down with respect to the plate holder 9.
　以下、本実施形態における基板Ｐの受け渡し動作について図２２Ａ、図２２Ｂ、及び図２２Ｃを参照にしつつ説明する。
　プレートホルダ９に載置した基板Ｐに対する露光処理が終了した後、搬出用テーブル５０はＹ方向に沿ってプレートホルダ９に近接した状態に配列する。本実施形態では、図２２Ａに示すように、プレートホルダ９に対し、下方に待機している搬出用テーブル５０を、基板Ｐを受け取り可能な位置まで上昇させる。このとき、搬出用テーブル５０の上面をプレートホルダ９の上面よりも低く配置することもできる（図１３参照）。 Hereinafter, the transfer operation of the substrate P in the present embodiment will be described with reference to FIGS. 22A, 22B, and 22C.
After the exposure process for the substrate P placed on the plate holder 9 is completed, the carry-out table 50 is arranged in the state of being close to the plate holder 9 along the Y direction. In the present embodiment, as shown in FIG. 22A, the carry-out table 50 waiting downward is raised with respect to the plate holder 9 to a position where the substrate P can be received. At this time, the upper surface of the carry-out table 50 can be arranged lower than the upper surface of the plate holder 9 (see FIG. 13).
　なお、基板Ｐに対する露光処理が行われている間、搬入用テーブル４０にはコータ・デベロッパ（不図示）から次の基板Ｐが受け渡されている。これにより、搬入用テーブル４０は、プレートホルダ９から搬出用テーブル５０に基板Ｐを搬出している間、次の基板Ｐを載置した状態でプレートホルダ９の上方で待機している。 In addition, while the exposure process with respect to the board | substrate P is performed, the next board | substrate P is delivered to the carrying-in table 40 from the coater / developer (not shown). As a result, the carry-in table 40 stands by above the plate holder 9 with the next substrate P being placed while the substrate P is being carried out from the plate holder 9 to the carry-out table 50.
　プレートホルダ９は、真空ポンプの駆動を停止し、吸引孔Ｋ１を介した基板Ｐの基板載置部３１に対する吸着保持を解除する。続いて、プレートホルダ９は、気体噴射孔Ｋ２から気体を噴射し、該気体を介して基板Ｐを浮上させた状態で支持する（図１４Ａ－１４Ｃ参照）。一方、搬出部５は、基板Ｐを受けとるに際し、搬出用テーブル５０の上面に形成された複数の気体噴射孔Ｋ５から気体を噴射しておく。このとき、気体噴射孔Ｋ２，Ｋ５から噴射する気体に指向性を持たせるようにしてもよい。 The plate holder 9 stops driving the vacuum pump, and releases the suction holding of the substrate P to the substrate mounting portion 31 through the suction hole K1. Subsequently, the plate holder 9 ejects a gas from the gas ejection hole K2, and supports the substrate P in a state where the substrate P is floated through the gas (see FIGS. 14A to 14C). On the other hand, when the unloading unit 5 receives the substrate P, the unloading unit 5 injects gas from a plurality of gas injection holes K5 formed on the upper surface of the unloading table 50. At this time, the gas injected from the gas injection holes K2 and K5 may have directivity.
　図２２Ｂに示すように、搬出部５は、第１実施形態と同様に、吸着部５２ｂが保持した基板Ｐを同図中Ｙ方向に沿って移動する。このとき、基板Ｐはプレートホルダ９上に浮上した状態で支持されているので、基板Ｐは搬出用テーブル５０上にスムーズにスライド移動する。また、搬出用テーブル５０の上面は、上述のように基板Ｐを浮上支持するようになっている。したがって、基板Ｐは、搬出用テーブル５０の上面へとスムーズに乗り移ることとなる。 As shown in FIG. 22B, the carry-out unit 5 moves the substrate P held by the suction unit 52b along the Y direction in the figure, as in the first embodiment. At this time, since the substrate P is supported in a state of floating on the plate holder 9, the substrate P smoothly slides on the carry-out table 50. Further, the upper surface of the carry-out table 50 supports the substrate P as described above. Therefore, the board | substrate P will transfer to the upper surface of the table 50 for carrying out smoothly.
　基板Ｐの移動が終了した後、搬出用テーブル５０は気体噴射孔Ｋ５からの気体噴射を停止するとともに、吸引孔Ｋ６を介して基板Ｐを吸着保持する。搬出用テーブル５０は、基板Ｐを吸着保持した状態で、図２２Ｃに示されるように基板Ｐを下方へと移動する。なお、基板Ｐのサイズが大きく、搬出用テーブル５０の上面からはみ出た状態で載置されている場合においては、搬出用テーブル５０は、基板Ｐがプレートホルダ９に干渉しないようにプレートホルダ９から離間する同図中+Ｙ方向に退避した状態で上記下降動作を行う。 After the movement of the substrate P is completed, the carry-out table 50 stops the gas injection from the gas injection hole K5 and holds the substrate P by suction through the suction hole K6. The unloading table 50 moves the substrate P downward as shown in FIG. 22C while holding the substrate P by suction. When the size of the substrate P is large and the substrate P is placed in a state of protruding from the upper surface of the unloading table 50, the unloading table 50 is removed from the plate holder 9 so that the substrate P does not interfere with the plate holder 9. The above-described descending operation is performed in a state of being retracted in the + Y direction in FIG.
　一方、搬出用テーブル５０が下降動作を開始するとともに、図２２Ｃに示すように、プレートホルダ９の上方で待機していた搬入用テーブル４０がプレートホルダ９に対して基板Ｐを受け渡し可能な位置まで下降する。これにより、プレートホルダ９及び搬入用テーブル４０がＹ方向に沿って近接した状態で配列する。このとき、搬入用テーブル４０の上面がプレートホルダ９の上面よりも低く配置することもできる（図８参照）。 On the other hand, the carry-out table 50 starts to move downward, and as shown in FIG. 22C, the carry-out table 40 waiting above the plate holder 9 reaches a position where the substrate P can be delivered to the plate holder 9. Descend. Thereby, the plate holder 9 and the table 40 for carrying in are arranged in the state which adjoined along the Y direction. At this time, the upper surface of the carry-in table 40 can be arranged lower than the upper surface of the plate holder 9 (see FIG. 8).
　搬入用テーブル４０は、上面に形成された複数の気体噴射孔Ｋ３から気体を噴射し、該気体を介して基板Ｐを浮上させた状態で支持する。一方、プレートホルダ９は、基板Ｐを受けとるに際し、上面に形成された複数の気体噴射孔Ｋ２から気体を噴射しておく。このとき、気体噴射孔Ｋ２，Ｋ３から噴射する気体に指向性を持たせるようにしてもよい。 The carry-in table 40 ejects gas from a plurality of gas ejection holes K3 formed on the upper surface, and supports the substrate P in a state where the substrate P is floated through the gas. On the other hand, when receiving the substrate P, the plate holder 9 injects gas from the plurality of gas injection holes K2 formed on the upper surface. At this time, the gas injected from the gas injection holes K2, K3 may have directivity.
　搬入部４は、搬入用テーブル４０上に基板Ｐを浮上支持した状態で、当接部４２ｂを基板Ｐの一端部に当接させる。当接部４２ｂは、凹部４０ａ内のガイド部４２ａに沿って移動することで基板Ｐをプレートホルダ９側へと移動する（図９，１０参照）。 The carry-in part 4 brings the contact part 42b into contact with one end of the substrate P in a state where the substrate P is levitated and supported on the carry-in table 40. The abutting portion 42b moves along the guide portion 42a in the recess 40a to move the substrate P toward the plate holder 9 (see FIGS. 9 and 10).
　基板Ｐは搬入用テーブル４０上に浮上した状態となっているので、プレートホルダ９側にスムーズにスライド移動する。また、プレートホルダ９の上面は、上述のように基板Ｐを浮上支持するようになっているので、基板Ｐは、図２２Ｄに示すように搬入用テーブル４０からプレートホルダ９へとスムーズに乗り移ることとなる。 Since the substrate P is in a state of floating on the loading table 40, it smoothly slides and moves to the plate holder 9 side. Further, since the upper surface of the plate holder 9 supports the substrate P as described above, the substrate P smoothly moves from the loading table 40 to the plate holder 9 as shown in FIG. 22D. It becomes.
　基板Ｐは、第１実施形態と同様、ガイド用ピン３６及び位置決めピン３７によって基板載置部３１に対して所定の位置に位置合わせされた状態で載置することができる（図９参照）。そして、基板Ｐに対して露光処理を行う。 As in the first embodiment, the substrate P can be placed in a state of being aligned at a predetermined position with respect to the substrate placement portion 31 by the guide pins 36 and the positioning pins 37 (see FIG. 9). Then, an exposure process is performed on the substrate P.
　本実施形態では、基板Ｐを搬入部４からプレートホルダ９に搬入している間、或いは基板Ｐに対する露光処理の間に、搬出用テーブル５０に載置される露光処理済みの基板Ｐを搬出する。 In the present embodiment, while the substrate P is being carried into the plate holder 9 from the carry-in unit 4 or during the exposure process for the substrate P, the substrate P that has been subjected to the exposure process placed on the unloading table 50 is carried out. .
　本実施形態においては、このように搬入部４及び搬出部５をプレートホルダ９に対して高さ方向（Ｚ方向）に移動して交互にアクセスすることで、露光装置本体３に対する基板Ｐの搬出入動作を行うことができる。また、搬入部４及び搬出部５は、非使用時にプレートホルダ９の上方に待機しており、それぞれが上下動作することでプレートホルダ９に対してアクセスできるので、基板Ｐの搬出入動作に伴う処理時間（所謂、タクト）を短縮することができる。 In this embodiment, the carry-in unit 4 and the carry-out unit 5 are moved in the height direction (Z direction) with respect to the plate holder 9 and accessed alternately in this way, thereby carrying out the substrate P to the exposure apparatus main body 3. Can be performed. Moreover, since the carrying-in part 4 and the carrying-out part 5 stand by above the plate holder 9 when not in use and each moves up and down, the plate holder 9 can be accessed. Processing time (so-called tact) can be shortened.
　なお、上述の実施形態においては、搬入用テーブル４０及びプレートホルダ９が配列される第１方向と、搬出用テーブル５０及びプレートホルダ９が配列される第２方向とが、平行となる場合について説明したが、本発明はこれに限定されず、上記第１方向と第２方向とが異なる方向（例えば、直交する）となる場合についても本発明は適応可能である。 In the above-described embodiment, a case where the first direction in which the carry-in table 40 and the plate holder 9 are arranged and the second direction in which the carry-out table 50 and the plate holder 9 are arranged is parallel to each other will be described. However, the present invention is not limited to this, and the present invention can also be applied to a case where the first direction and the second direction are different directions (for example, orthogonal).
　（第５実施形態）
　続いて、本発明の第５実施形態に係る構成について説明する。なお、本実施形態においては、第１実施形態の構成要素と同一の要素については同一符号を付し、その説明を省略する。第５実施形態は、搬入部或いは搬出部として機能する搬出入部を備える点が主に異なっている。 (Fifth embodiment)
Subsequently, a configuration according to a fifth embodiment of the present invention will be described. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted. The fifth embodiment is mainly different in that it includes a carry-in / out unit that functions as a carry-in unit or a carry-out unit.
　図２３は、チャンバ内部の構成を示す斜視図であり、図２４Ａ及び図２４Ｂは搬出入部４００の概略構成を示す平面図である。
　図２３に示されるように、搬出入部４００は、基板載置テーブル４０１と、該基板載置テーブル４０１を移動する移動機構４０２と、を備えている。なお、移動機構４０２は、第１実施形態の第１、第２移動機構３３，４３と同一の構成からなるものである。このような構成に基づき、基板載置テーブル４０１は、基板Ｐを保持した状態で、光射出側（投影光学系ＰＬの像面側）において、ガイド面の所定領域内を移動可能となっている。また、基板載置テーブル４０１はＺ軸方向に沿っても移動可能となっている。したがって、基板載置テーブル４０１は、搬入用テーブル及び搬出用テーブルとして機能している。 FIG. 23 is a perspective view showing a configuration inside the chamber, and FIGS. 24A and 24B are plan views showing a schematic configuration of the carry-in / out section 400.
As shown in FIG. 23, the carry-in / out unit 400 includes a substrate mounting table 401 and a moving mechanism 402 that moves the substrate mounting table 401. The moving mechanism 402 has the same configuration as the first and second moving mechanisms 33 and 43 of the first embodiment. Based on such a configuration, the substrate mounting table 401 can move within a predetermined region of the guide surface on the light emission side (image surface side of the projection optical system PL) while holding the substrate P. . The substrate mounting table 401 is also movable along the Z-axis direction. Therefore, the substrate mounting table 401 functions as a carry-in table and a carry-out table.
　図２４Ａ及び２４Ｂに示すように、搬出入部４００は、基板Ｐを基板載置テーブル４０１からプレートホルダ９へと移送する移送部４０５を備えている。移送部４０５は、ガイド部４０６と、基板Ｐに吸着保持する吸着部４０８と、を含む。 As shown in FIGS. 24A and 24B, the carry-in / out unit 400 includes a transfer unit 405 that transfers the substrate P from the substrate mounting table 401 to the plate holder 9. The transfer unit 405 includes a guide unit 406 and a suction unit 408 that sucks and holds the substrate P.
　基板載置テーブル４０１の上面には、一方向（同図で示されるＹ方向）に沿って形成される２つの溝状の凹部４０１ａが形成されている。この凹部４０１ａ内には、上記ガイド部４０６が設けられている。ガイド部４０６には、基板載置テーブル４０１の上面から突出した状態で上記吸着部４０８が取り付けられている。吸着部４０８は、例えば真空吸着により基板Ｐを吸着保持する真空吸着パッドを含む。 On the upper surface of the substrate mounting table 401, two groove-shaped concave portions 401a formed along one direction (Y direction shown in the figure) are formed. The guide portion 406 is provided in the recess 401a. The suction unit 408 is attached to the guide unit 406 so as to protrude from the upper surface of the substrate mounting table 401. The suction unit 408 includes a vacuum suction pad that holds the substrate P by vacuum suction, for example.
　また、基板載置テーブル４０１の上面には、基板Ｐの下面に対してエアー等の気体を噴射することで、該気体を介して基板Ｐを浮上支持する気体噴射孔Ｋ７が複数設けられている。各気体噴射孔Ｋ７は、不図示の気体噴射用ポンプに接続されている。さらに、基板載置テーブル４０１の上面には、基板Ｐをこの面に倣わせて密着させるための吸引孔Ｋ８が複数設けられている。各吸引孔Ｋ８は、不図示の真空ポンプに接続されている。なお、気体噴射孔Ｋ７と吸引孔Ｋ８とは互いが千鳥状に配置されている。 The upper surface of the substrate mounting table 401 is provided with a plurality of gas injection holes K7 that float and support the substrate P through the gas by injecting a gas such as air onto the lower surface of the substrate P. . Each gas injection hole K7 is connected to a gas injection pump (not shown). Furthermore, a plurality of suction holes K8 are provided on the upper surface of the substrate mounting table 401 for bringing the substrate P into close contact with this surface. Each suction hole K8 is connected to a vacuum pump (not shown). The gas injection holes K7 and the suction holes K8 are arranged in a staggered manner.
　また、基板載置テーブル４０１には、後述するようにコータ・デベロッパ（不図示）との間で基板Ｐの受け渡しを行うための上下動機構の基板支持ピンを挿通可能とする貫通孔４０７が形成されている。 The substrate mounting table 401 is formed with a through hole 407 through which a substrate support pin of a vertical movement mechanism for passing the substrate P to and from a coater / developer (not shown) can be inserted as will be described later. Has been.
　プレートホルダ９は、上述の実施形態と同様、その側面部に、基板載置テーブル４０１との相対位置を検出する上記位置検出センサ１９を備えている。位置検出センサ１９は、基板載置テーブル４０１に対する相対距離を検出するための距離検出用センサ１９ａと、基板載置テーブル４０１に対する相対高さを検出するための高さ検出用センサ１９ｂとを含んでいる（図３Ｂ参照）。 The plate holder 9 is provided with the position detection sensor 19 for detecting a relative position with respect to the substrate mounting table 401 on the side surface thereof, as in the above-described embodiment. The position detection sensor 19 includes a distance detection sensor 19a for detecting a relative distance with respect to the substrate placement table 401 and a height detection sensor 19b for detecting a relative height with respect to the substrate placement table 401. (See FIG. 3B).
　次に、搬出入部４００とプレートホルダ９との間における基板Ｐの受け渡し動作について図面を参照にしながら説明する。まず、搬出入部４００にコータ・デベロッパ（不図示）において感光剤が塗布された基板Ｐを搬入する。このとき、基板載置テーブル４０１の下方に位置する上下動機構４０９は、貫通孔４０７を介して基板支持ピン４１０を基板載置テーブル４０１の上方に配置しておく。続いて、コータ・デベロッパ（不図示）のアーム部４８は、図２５に示すように基板支持ピン４１０の間に挿入される。アーム部４８は降下することで基板Ｐを基板支持ピン４１０へと受け渡した後、搬出入部４００から退避する。上下動機構４０９は、基板Ｐを支持した基板支持ピン４１０を降下することで基板載置テーブル４０１への基板Ｐの搬入動作が終了する。その後、真空ポンプが駆動されることにより、基板Ｐは、基板載置テーブル４０１の上面に吸引孔Ｋ８を介して吸着保持される。 Next, the transfer operation of the substrate P between the loading / unloading unit 400 and the plate holder 9 will be described with reference to the drawings. First, a substrate P coated with a photosensitive agent is carried into a carry-in / out unit 400 by a coater / developer (not shown). At this time, the vertical movement mechanism 409 located below the substrate placement table 401 arranges the substrate support pins 410 above the substrate placement table 401 through the through holes 407. Subsequently, the arm portion 48 of the coater / developer (not shown) is inserted between the substrate support pins 410 as shown in FIG. The arm portion 48 descends to transfer the substrate P to the substrate support pins 410 and then retract from the carry-in / out portion 400. The vertical movement mechanism 409 lowers the substrate support pins 410 that support the substrate P, thereby completing the operation of loading the substrate P onto the substrate mounting table 401. Thereafter, by driving the vacuum pump, the substrate P is sucked and held on the upper surface of the substrate mounting table 401 through the suction hole K8.
　続いて、プレートホルダ９は、搬出入部４００の基板載置テーブル４０１に近接するように移動する。なお、基板載置テーブル４０１とプレートホルダ９とを配列する際、移送部４０５を駆動することで基板載置テーブル４０１及びプレートホルダ９を基板Ｐの受け渡し位置に短時間で移動させ、基板Ｐの搬入動作に要する時間を短縮するようにしてもよい。この場合、基板Ｐは吸引孔Ｋ８を介して基板載置テーブル４０１の上面に吸着保持されているので、移送部４０５の駆動時に基板Ｐが基板載置テーブル４０１上において動いてしまうことが防止される。 Subsequently, the plate holder 9 moves so as to be close to the substrate placement table 401 of the loading / unloading unit 400. When the substrate placement table 401 and the plate holder 9 are arranged, the transfer unit 405 is driven to move the substrate placement table 401 and the plate holder 9 to the delivery position of the substrate P in a short time. You may make it shorten the time which carrying-in operation requires. In this case, since the substrate P is sucked and held on the upper surface of the substrate placement table 401 through the suction hole K8, the substrate P is prevented from moving on the substrate placement table 401 when the transfer unit 405 is driven. The
　本実施形態では、図２６に示すように、基板Ｐを支持している基板載置テーブル４０１の上面がプレートホルダ９の上面よりも高くなるように、プレートホルダ９が基板載置テーブル４０１に近接する。なお、プレートホルダ９及び基板載置テーブル４０１を接触させた状態で配列することで基板Ｐの移動距離を短くして受け渡しをよりスムーズに行うようにしてもよい。 In the present embodiment, as shown in FIG. 26, the plate holder 9 is close to the substrate mounting table 401 so that the upper surface of the substrate mounting table 401 supporting the substrate P is higher than the upper surface of the plate holder 9. To do. The plate holder 9 and the substrate mounting table 401 may be arranged in contact with each other so that the moving distance of the substrate P can be shortened and the transfer can be performed more smoothly.
　続いて、基板載置テーブル４０１は、図２６に示したように、上面に形成された複数の気体噴射孔Ｋ７から気体を噴射し、該気体を介して基板Ｐを浮上させた状態で支持する。一方、プレートホルダ９は、基板Ｐを受けとるに際し、上面に形成された複数の気体噴射孔Ｋ２から気体を噴射しておく。このとき、気体噴射孔Ｋ２，Ｋ７から噴射する気体に指向性を持たせるようにしてもよい。 Subsequently, as shown in FIG. 26, the substrate mounting table 401 ejects gas from the plurality of gas ejection holes K7 formed on the upper surface, and supports the substrate P in a state where the substrate P is floated through the gas. . On the other hand, when receiving the substrate P, the plate holder 9 injects gas from the plurality of gas injection holes K2 formed on the upper surface. At this time, the gas injected from the gas injection holes K2 and K7 may have directivity.
　搬出入部４００は、基板載置テーブル４０１上に基板Ｐを浮上支持した状態で、吸着部４０８により基板Ｐの一端部を吸着保持する。吸着部４０８は、凹部４０１ａ内のガイド部４０６に沿って移動することで基板Ｐをプレートホルダ９側へと移動する（図２４Ａ及び２４Ｂ参照）。 The carry-in / out unit 400 sucks and holds one end of the substrate P by the suction unit 408 in a state where the substrate P is levitated and supported on the substrate mounting table 401. The suction portion 408 moves along the guide portion 406 in the recess 401a to move the substrate P toward the plate holder 9 (see FIGS. 24A and 24B).
　基板Ｐは基板載置テーブル４０１上に浮上した状態となっているので、吸着部４０８は基板Ｐをプレートホルダ９側にスムーズにスライドさせることができる。また、プレートホルダ９の上面は、上述のように基板Ｐを浮上支持するようになっている。 Since the substrate P is in a state of floating on the substrate mounting table 401, the suction unit 408 can smoothly slide the substrate P to the plate holder 9 side. Further, the upper surface of the plate holder 9 supports the substrate P as described above.
　したがって、吸着部４０８により基板載置テーブル４０１の上面をスライドする基板Ｐは、プレートホルダ９の上面へとスムーズに乗り移ることとなる。本実施形態では、図２６に示したように基板載置テーブル４０１の上面がプレートホルダ９の上面よりも高くなっているので、基板Ｐはプレートホルダ９の側面に接触することなく、スムーズにプレートホルダ９上へと乗り移ることができる。 Therefore, the substrate P that slides on the upper surface of the substrate mounting table 401 by the suction unit 408 smoothly transfers to the upper surface of the plate holder 9. In this embodiment, as shown in FIG. 26, since the upper surface of the substrate mounting table 401 is higher than the upper surface of the plate holder 9, the substrate P does not contact the side surface of the plate holder 9 and smoothly It is possible to transfer onto the holder 9.
　基板Ｐは、プレートホルダ９の周辺部に設けられたガイド用ピン３６及び位置決めピン３７に当接することで基板載置部３１に対して所定の位置に位置合わせされた状態とされる（図９参照）。 The substrate P is brought into a state of being aligned at a predetermined position with respect to the substrate mounting portion 31 by contacting the guide pins 36 and the positioning pins 37 provided in the peripheral portion of the plate holder 9 (FIG. 9). reference).
　本実施形態においても、基板Ｐが上述のように気体の噴射によって浮上した状態で搬送されるので、基板Ｐと基板載置部３１との間に空気溜りや空気層が生じることが防止され、基板Ｐの載置ずれや変形の発生を防止できる。よって、プレートホルダ９に対する所定の位置に平面度が高い状態で基板Ｐを載置することができる。その後、真空ポンプが駆動されることにより、基板Ｐは、基板載置部３１の上面に吸引孔Ｋ１を介して吸着保持される。そして、プレートホルダ９に基板Ｐを載置した後、基板Ｐに対し、露光処理を行う。 Also in this embodiment, since the substrate P is transported in a state of being floated by gas injection as described above, it is possible to prevent an air pool or an air layer from being generated between the substrate P and the substrate platform 31, Generation | occurrence | production of the mounting displacement and deformation | transformation of the board | substrate P can be prevented. Therefore, the substrate P can be placed at a predetermined position with respect to the plate holder 9 with high flatness. Thereafter, when the vacuum pump is driven, the substrate P is adsorbed and held on the upper surface of the substrate platform 31 via the suction hole K1. Then, after placing the substrate P on the plate holder 9, exposure processing is performed on the substrate P.
　露光処理が終了すると、プレートホルダ９は、搬出入部４００の基板載置テーブル４０１に近接するように移動する。本実施形態では、プレートホルダ９の上面が基板載置テーブル４０１の上面よりも高くなるようにプレートホルダ９及び基板載置テーブル４０１を近接させる。 When the exposure process is completed, the plate holder 9 moves so as to be close to the substrate mounting table 401 of the carry-in / out unit 400. In the present embodiment, the plate holder 9 and the substrate mounting table 401 are brought close to each other so that the upper surface of the plate holder 9 is higher than the upper surface of the substrate mounting table 401.
　なお、基板載置テーブル４０１とプレートホルダ９とを配列する際、基板載置テーブル４０１を移動することで基板Ｐの搬出動作に要する時間を短縮することができる。また、プレートホルダ９及び基板載置テーブル４０１を接触させた状態で配列することもできる。このようにすれば、プレートホルダ９及び基板載置テーブル４０１間に隙間が形成されないため、基板Ｐの受け渡しをスムーズに行うことができる。 It should be noted that when arranging the substrate mounting table 401 and the plate holder 9, the time required for the unloading operation of the substrate P can be shortened by moving the substrate mounting table 401. Alternatively, the plate holder 9 and the substrate mounting table 401 can be arranged in contact with each other. In this way, since no gap is formed between the plate holder 9 and the substrate mounting table 401, the transfer of the substrate P can be performed smoothly.
　プレートホルダ９は、真空ポンプの駆動を停止し、吸引孔Ｋ１を介した基板Ｐの基板載置部３１に対する吸着保持を解除する。続いて、プレートホルダ９は、図２７に示すように、基板載置部３１の上面に形成された複数の気体噴射孔Ｋ２から気体を噴射し、該気体を介して基板Ｐを浮上させた状態で支持する。一方、搬出部５は、基板Ｐを受けとるに際し、基板載置テーブル４０１の上面に形成された複数の気体噴射孔Ｋ７から気体を噴射しておく。このとき、気体噴射孔Ｋ２，Ｋ７から噴射する気体に指向性を持たせるようにしてもよい。 The plate holder 9 stops driving the vacuum pump, and releases the suction holding of the substrate P to the substrate mounting portion 31 through the suction hole K1. Subsequently, as shown in FIG. 27, the plate holder 9 injects a gas from the plurality of gas injection holes K2 formed on the upper surface of the substrate mounting portion 31, and floats the substrate P through the gas. Support with. On the other hand, when the carry-out unit 5 receives the substrate P, the carry-out unit 5 injects gas from a plurality of gas injection holes K7 formed on the upper surface of the substrate mounting table 401. At this time, the gas injected from the gas injection holes K2 and K7 may have directivity.
　搬出入部４００は、プレートホルダ９の基板載置部３１上に浮上支持される基板Ｐ側に移送部４０５の吸着部４０８をガイド部４０６に沿って移動する。吸着部４０８は基板Ｐを吸着保持し、同図中＋Ｙ方向に沿って基板Ｐを移動する（図２４Ａ及び２４Ｂ参照）。 The carry-in / out unit 400 moves the suction unit 408 of the transfer unit 405 along the guide unit 406 toward the substrate P that is levitated and supported on the substrate platform 31 of the plate holder 9. The suction unit 408 sucks and holds the substrate P, and moves the substrate P along the + Y direction in the drawing (see FIGS. 24A and 24B).
　このとき、基板Ｐはプレートホルダ９上に浮上した状態で支持されているので、吸着部４０８は基板Ｐを基板載置テーブル４０１側にスムーズにスライドさせることができる。また、基板載置テーブル４０１の上面は、上述のように基板Ｐを浮上支持するようになっている。 At this time, since the substrate P is supported in a state of being floated on the plate holder 9, the suction unit 408 can smoothly slide the substrate P toward the substrate mounting table 401. Further, the upper surface of the substrate mounting table 401 supports the substrate P as described above.
　したがって、基板載置部３１の上面をスライドする基板Ｐは、基板載置テーブル４０１の上面へとスムーズに乗り移ることとなる。本実施形態では、プレートホルダ９の上面が基板載置テーブル４０１の上面よりも高くなっているので、基板Ｐは基板載置テーブル４０１の側面に接触することなく、スムーズに基板載置テーブル４０１上へと乗り移ることができる。 Therefore, the substrate P that slides on the upper surface of the substrate platform 31 smoothly moves to the upper surface of the substrate platform table 401. In the present embodiment, since the upper surface of the plate holder 9 is higher than the upper surface of the substrate mounting table 401, the substrate P does not come into contact with the side surface of the substrate mounting table 401, and smoothly moves on the substrate mounting table 401. Can be transferred to.
　吸着部４０８による基板Ｐの移動が終了した後、基板載置テーブル４０１は、気体噴射孔Ｋ７からの気体噴射を停止するとともに、吸引孔Ｋ８を介して基板Ｐを吸着保持する。搬出入部４００は、基板Ｐを吸着保持した状態で、移送部４０５を駆動し、基板載置テーブル４０１を基板Ｐの搬出位置へと移動する。 After the movement of the substrate P by the suction unit 408 is finished, the substrate mounting table 401 stops the gas injection from the gas injection hole K7 and holds the substrate P by suction through the suction hole K8. The carry-in / out unit 400 drives the transfer unit 405 in a state where the substrate P is sucked and held, and moves the substrate placement table 401 to the carry-out position of the substrate P.
　続いて、基板載置テーブル４０１に載置される露光処理済みの基板Ｐを搬出する。このとき、基板載置テーブル４０１の下方に位置する上下動機構４０９は、貫通孔４０７を介して、基板支持ピン４１０を基板載置テーブル４０１の上方に配置する。これにより、基板Ｐは、基板支持ピン４１０に支持されることで基板載置テーブル４０１の上方に保持されたものとなる（図２５参照）。続いて、コータ・デベロッパ（不図示）のアーム部４８が基板支持ピン４１０の間に挿入され、基板支持ピン４１０を降下することにより、アーム部４８に基板Ｐが受け渡される。アーム部４８は、コータ・デベロッパ（不図示）内に基板Ｐを移動し、現像処理を行う。 Subsequently, the exposed substrate P placed on the substrate placement table 401 is unloaded. At this time, the vertical movement mechanism 409 located below the substrate placement table 401 arranges the substrate support pins 410 above the substrate placement table 401 through the through holes 407. As a result, the substrate P is supported by the substrate support pins 410 and is held above the substrate placement table 401 (see FIG. 25). Subsequently, the arm portion 48 of the coater / developer (not shown) is inserted between the substrate support pins 410, and the substrate P is transferred to the arm portion 48 by lowering the substrate support pins 410. The arm unit 48 moves the substrate P into a coater / developer (not shown) and performs development processing.
　本実施形態によれば、浮上支持された基板Ｐをスライドすることで搬出入部４００からプレートホルダ９へと搬送することができるので、基板Ｐと基板載置部３１との間に空気溜りや空気層が生じることが防止され、基板Ｐの載置ずれや変形の発生を防止できる。よって、信頼性の高い露光処理を行うことができる。また、搬出入部４００が上記第１～第３実施形態における搬入部４及び搬出部５を兼ねているので、装置構成を簡略化することができる。 According to the present embodiment, since the substrate P supported to be levitated can be slid and transported from the loading / unloading unit 400 to the plate holder 9, an air pocket or air is interposed between the substrate P and the substrate platform 31. It is possible to prevent the generation of a layer, and to prevent the substrate P from being displaced or deformed. Therefore, highly reliable exposure processing can be performed. In addition, since the carry-in / out unit 400 also serves as the carry-in unit 4 and the carry-out unit 5 in the first to third embodiments, the configuration of the apparatus can be simplified.
　なお、第５実施形態においては、基板載置テーブル４０１からプレートホルダ９へと基板Ｐを搬送する際、基板載置テーブル４０１の上面を傾斜させることもできる。具体的には、移動機構４０２は、気体噴射孔Ｋ７からの気体噴射によって浮上した状態で基板Ｐを支持する基板載置テーブル４０１の上面をプレートホルダ９側（θＹ方向）に傾斜させる。これにより、基板Ｐの自重を利用して該基板Ｐをプレートホルダ９側に移動させることができる。 In the fifth embodiment, when the substrate P is transported from the substrate mounting table 401 to the plate holder 9, the upper surface of the substrate mounting table 401 can be inclined. Specifically, the moving mechanism 402 inclines the upper surface of the substrate mounting table 401 that supports the substrate P in the state of being floated by gas injection from the gas injection hole K7 toward the plate holder 9 (θY direction). Accordingly, the substrate P can be moved to the plate holder 9 side by utilizing the weight of the substrate P.
　また、プレートホルダ９から基板載置テーブル４０１へと基板Ｐを搬送する際、プレートホルダ９の上面を傾斜させることもできる。具体的に、第１移動機構３３（保持部３４）は、気体噴射孔Ｋ２からの気体噴射によって浮上した状態で基板Ｐを支持するプレートホルダ９の上面を基板載置テーブル４０１側（θＹ方向）に傾斜させる。これにより、基板Ｐの自重を利用して該基板Ｐを基板載置テーブル４０１側に移動させることができる。 Further, when the substrate P is transported from the plate holder 9 to the substrate mounting table 401, the upper surface of the plate holder 9 can be inclined. Specifically, the first moving mechanism 33 (holding unit 34) has the upper surface of the plate holder 9 that supports the substrate P in a state of being floated by gas injection from the gas injection hole K2 on the substrate mounting table 401 side (θY direction). Tilt to. Thereby, the substrate P can be moved to the substrate mounting table 401 side by utilizing the weight of the substrate P.
　なお、本実施形態において、移送部４０５として、第２実施形態に示したようなコロ機構１４８を採用することもできる。また、移送部４０５として、第３実施形態に示したように移送部４０５を構成する吸着部４０８をプレートホルダ９側に設けることもできる。 In this embodiment, a roller mechanism 148 as shown in the second embodiment can be adopted as the transfer unit 405. Moreover, as the transfer part 405, as shown in 3rd Embodiment, the adsorption | suction part 408 which comprises the transfer part 405 can also be provided in the plate holder 9 side.
　（第６実施形態）
　次に、本発明の第６実施形態に係る構成について説明する。なお、以下の説明において、上述の実施形態の構成要素と同一または同様の要素については同一符号を付し、その説明を簡略または省略する。　　 (Sixth embodiment)
Next, the structure concerning 6th Embodiment of this invention is demonstrated. In the following description, the same or similar elements as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.
　図２８は、本実施形態の露光装置の概略構成を示す断面平面図であり、図２９は、チャンバ内の装置構成の概略を示す斜視図である。
　上述した実施形態と同様に、露光装置１は、図２８に示すように、露光装置本体３と、搬入部４と、を備えている。また、本実施形態において、露光装置１は、搬出ロボット２０５を備えている。これらは高度に清浄化され、且つ所定温度に調整されたチャンバ２内に収められている。 FIG. 28 is a sectional plan view showing a schematic configuration of the exposure apparatus of the present embodiment, and FIG. 29 is a perspective view showing a schematic configuration of the apparatus in the chamber.
As in the embodiment described above, the exposure apparatus 1 includes an exposure apparatus main body 3 and a carry-in unit 4 as shown in FIG. In the present embodiment, the exposure apparatus 1 includes a carry-out robot 205. These are housed in a chamber 2 that is highly cleaned and adjusted to a predetermined temperature.
　図２９に示すように、搬出ロボット２０５は、例えば水平関節型構造を有するものであり、垂直な関節軸を介して連結された複数部分からなるアーム部１０と、このアーム部１０の先端に連結されるフォーク部１２と、駆動装置１３と、を備えている。アーム部１０は、駆動装置１３により例えば上下方向（Ｚ軸方向）に移動可能となっている。駆動装置１３は、不図示の制御装置により、その駆動が制御されている。これにより搬出ロボット２０５は基板Ｐをプレートホルダ９から受け取るようになっている。なお、搬出ロボット２０５は、水平関節型構造のロボットに限定されるものではなく、公知のロボット（一般には搬送機構）を適宜採用もしくは組み合わせて実現可能なものである。 As shown in FIG. 29, the carry-out robot 205 has, for example, a horizontal joint type structure, and is connected to the arm part 10 composed of a plurality of parts connected via a vertical joint axis, and the tip of the arm part 10. The fork part 12 and the drive device 13 are provided. The arm unit 10 can be moved, for example, in the vertical direction (Z-axis direction) by the driving device 13. The driving of the driving device 13 is controlled by a control device (not shown). As a result, the carry-out robot 205 receives the substrate P from the plate holder 9. The carry-out robot 205 is not limited to a horizontal joint type robot, and can be realized by appropriately adopting or combining known robots (generally, a transport mechanism).
　図３０Ａはプレートホルダ９の平面構成を示す図であり、図３０Ｂはプレートホルダ９の側面構成を示す図である。本実施形態において、図３０Ａに示されるように、プレートホルダ９には、基板Ｐが載置される基板載置部３１が形成されている。 FIG. 30A is a diagram illustrating a planar configuration of the plate holder 9, and FIG. 30B is a diagram illustrating a side configuration of the plate holder 9. In the present embodiment, as shown in FIG. 30A, the plate holder 9 is provided with a substrate placement portion 31 on which the substrate P is placed.
　また、本実施形態において、プレートホルダ９には、基板Ｐの搬出時において、搬出ロボット２０５のフォーク部１２を収容するための溝部３０が形成されている。この溝部３０は、フォーク部１２の移動方向（同図Ｙ方向）に沿って形成されている。プレートホルダ９の上面における溝部３０以外の領域は上記基板載置部３１を構成している。 In this embodiment, the plate holder 9 is formed with a groove 30 for accommodating the fork portion 12 of the unloading robot 205 when the substrate P is unloaded. The groove portion 30 is formed along the moving direction of the fork portion 12 (Y direction in the figure). A region other than the groove portion 30 on the upper surface of the plate holder 9 constitutes the substrate mounting portion 31.
　なお、フォーク部１２の厚さは、溝部３０の深さよりも小さくなっている。これにより、後述するようにフォーク部１２を溝部３０内に収容した後、上昇させることで基板載置部３１上に載置された基板Ｐがフォーク部１２に受け渡されて載置されるようになっている。 In addition, the thickness of the fork part 12 is smaller than the depth of the groove part 30. As a result, as described later, after the fork portion 12 is accommodated in the groove portion 30, the substrate P placed on the substrate placement portion 31 is transferred to and placed on the fork portion 12 by being raised. It has become.
　図３Ｂと同様に、プレートホルダ９は、図３０Ｂに示されるように、その側面部９ａに、搬入用テーブル４０との相対位置を検出する位置検出センサ１９を備えている。位置検出センサ１９は、搬入用テーブル４０に対する相対距離を検出するための距離検出用センサ１９ａと、搬入用テーブル４０に対する相対高さを検出するための高さ検出用センサ１９ｂとを含んでいる。なお、搬入用テーブル４０における位置検出センサ１９に対応する位置には凹部が形成されており、これにより位置検出センサ１９と搬入用テーブル４０とが干渉するのを防止している。 3B, as shown in FIG. 30B, the plate holder 9 includes a position detection sensor 19 that detects a relative position with respect to the loading table 40 on the side surface portion 9a. The position detection sensor 19 includes a distance detection sensor 19 a for detecting a relative distance with respect to the carry-in table 40 and a height detection sensor 19 b for detecting a relative height with respect to the carry-in table 40. A recess is formed at a position corresponding to the position detection sensor 19 in the carry-in table 40, thereby preventing the position detection sensor 19 and the carry-in table 40 from interfering with each other.
　次に、本実施形態における露光装置１の動作について図６、図１１、３１Ａ～図３４を参照にしながら説明する。具体的には搬入部４とプレートホルダ９との間における基板Ｐの受け渡し動作、及びプレートホルダ９と搬出ロボット２０５との間における基板Ｐの受け渡し動作を主に説明する。 Next, the operation of the exposure apparatus 1 in the present embodiment will be described with reference to FIGS. 6, 11, 31A to 34. FIG. Specifically, the transfer operation of the substrate P between the carry-in unit 4 and the plate holder 9 and the transfer operation of the substrate P between the plate holder 9 and the carry-out robot 205 will be mainly described.
　まず、搬入部４にコータ・デベロッパ（不図示）において感光剤が塗布された基板Ｐを搬入する。このとき、搬入用テーブル４０の下方に位置する上下動機構４９は、貫通孔４７を介して基板支持ピン４９ａを搬入用テーブル４０の上方に配置しておく。続いて、コータ・デベロッパ（不図示）のアーム部４８は、図６に示すように基板支持ピン４９ａの間に挿入される。アーム部４８は降下することで基板Ｐを基板支持ピン４９ａへと受け渡した後、搬入部４から退避する。上下動機構４９は、基板Ｐを支持した基板支持ピン４９ａを降下することで搬入用テーブル４０への基板Ｐの搬入動作が終了する。その後、真空ポンプが駆動されることにより、基板Ｐは、搬入用テーブル４０の上面に吸引孔Ｋ４を介して吸着保持される。 First, a substrate P coated with a photosensitive agent is carried into the carry-in section 4 by a coater / developer (not shown). At this time, the vertical movement mechanism 49 positioned below the loading table 40 has the substrate support pins 49 a disposed above the loading table 40 through the through holes 47. Subsequently, the arm portion 48 of the coater / developer (not shown) is inserted between the substrate support pins 49a as shown in FIG. The arm portion 48 moves down to deliver the substrate P to the substrate support pins 49a and then retracts from the carry-in portion 4. The vertical movement mechanism 49 finishes the operation of loading the substrate P onto the loading table 40 by lowering the substrate support pins 49a that support the substrate P. Thereafter, when the vacuum pump is driven, the substrate P is sucked and held on the upper surface of the loading table 40 via the suction hole K4.
　続いて、プレートホルダ９は、図３１Ａに示すように、搬入部４の搬入用テーブル４０に近接するように移動する。なお、図３１Ａ及び３１Ｂにおいては搬出ロボットの図示を省略している。
　具体的に、第１移動機構３３は、プレートホルダ９及び搬入用テーブル４０をＹ方向に沿って近接させた状態で配列する。ここで、プレートホルダ９及び搬入用テーブル４０が近接した状態とは、後述する基板Ｐの受け渡し時に基板Ｐの移動が円滑に行われる距離だけ離間した状態を意味する。 Subsequently, the plate holder 9 moves so as to be close to the loading table 40 of the loading unit 4 as shown in FIG. 31A. In FIGS. 31A and 31B, illustration of the carry-out robot is omitted.
Specifically, the first moving mechanism 33 arranges the plate holder 9 and the carry-in table 40 close to each other along the Y direction. Here, the state where the plate holder 9 and the carry-in table 40 are close to each other means a state where the plate holder 9 and the carry-in table 40 are separated by a distance at which the movement of the substrate P is smoothly performed during delivery of the substrate P described later.
　また、搬入用テーブル４０とプレートホルダ９とを配列する際、第２移動機構４３を駆動することもできる。このようにすれば、搬入用テーブル４０及びプレートホルダ９を基板Ｐの受け渡し位置に短時間で移動させることができ、基板Ｐの搬入動作に要する時間を短縮することができる。このとき、基板Ｐは、吸引孔Ｋ４を介して搬入用テーブル４０の上面に吸着保持されているので、第２移動機構４３の駆動時に基板Ｐが搬入用テーブル４０上において動いてしまうのを防止することができる。 Also, when the carry-in table 40 and the plate holder 9 are arranged, the second moving mechanism 43 can be driven. In this way, the loading table 40 and the plate holder 9 can be moved to the delivery position of the substrate P in a short time, and the time required for the loading operation of the substrate P can be shortened. At this time, since the substrate P is sucked and held on the upper surface of the loading table 40 through the suction hole K4, the substrate P is prevented from moving on the loading table 40 when the second moving mechanism 43 is driven. can do.
　本実施形態では、図３１Ｂに示されるように、プレートホルダ９及び搬入用テーブル４０を近接させる際、基板Ｐがプレートホルダ９よりも高く配置している。すなわち、第１移動機構３３は、基板Ｐを支持している搬入用テーブル４０の上面がプレートホルダ９の上面よりも高くなるようにプレートホルダ９を搬入用テーブル４０に近接させる。なお、第２移動機構４３により搬入用テーブル４０の上面がプレートホルダ９の上面よりも高くなるように搬入用テーブル４０を上昇させることもできる。 In this embodiment, as shown in FIG. 31B, when the plate holder 9 and the loading table 40 are brought close to each other, the substrate P is arranged higher than the plate holder 9. In other words, the first moving mechanism 33 brings the plate holder 9 close to the loading table 40 so that the upper surface of the loading table 40 supporting the substrate P is higher than the upper surface of the plate holder 9. The loading table 40 can be raised by the second moving mechanism 43 so that the upper surface of the loading table 40 is higher than the upper surface of the plate holder 9.
　また、第１移動機構３３は、プレートホルダ９及び搬入用テーブル４０を接触させた状態で配列することもできる。このようにすれば、後述するプレートホルダ９及び搬入用テーブル４０間における基板Ｐの受け渡しをスムーズに行うことができる。 The first moving mechanism 33 can also be arranged in a state where the plate holder 9 and the loading table 40 are in contact with each other. If it does in this way, delivery of the board | substrate P between the plate holder 9 mentioned later and the loading table 40 can be performed smoothly.
　続いて、搬入用テーブル４０は、図３２に示すように、上面に形成された複数の気体噴射孔Ｋ３から気体を噴射し、該気体を介して基板Ｐを浮上させた状態で支持する。一方、プレートホルダ９は、基板Ｐを受けとるに際し、上面に形成された複数の気体噴射孔Ｋ２から気体を噴射しておく。 Subsequently, as shown in FIG. 32, the carry-in table 40 injects gas from a plurality of gas injection holes K3 formed on the upper surface, and supports the substrate P in a state where the substrate P is floated through the gas. On the other hand, when receiving the substrate P, the plate holder 9 injects gas from the plurality of gas injection holes K2 formed on the upper surface.
　搬入部４は、搬入用テーブル４０上に基板Ｐを浮上支持した状態で、図３３に示されるように、当接部４２ｂを基板Ｐの一端部に当接させる。当接部４２ｂは、凹部４０ａ内のガイド部４２ａに沿って移動することで基板Ｐをプレートホルダ９側へと移動する。 The carry-in unit 4 brings the contact portion 42b into contact with one end of the substrate P as shown in FIG. 33 in a state where the substrate P is levitated and supported on the carry-in table 40. The contact part 42b moves the substrate P toward the plate holder 9 by moving along the guide part 42a in the recess 40a.
　基板Ｐは搬入用テーブル４０上に浮上した状態となっているので、当接部４２ｂは基板Ｐをプレートホルダ９側にスムーズにスライドさせることができる。なお、プレートホルダ９の上面は、上述のように基板Ｐを浮上支持するようになっている。ここで、気体噴射孔Ｋ３，Ｋ２から噴射する気体に指向性を持たせるようにしてもよい。 Since the substrate P is in a state of floating on the loading table 40, the contact portion 42b can smoothly slide the substrate P to the plate holder 9 side. Note that the upper surface of the plate holder 9 supports the substrate P as described above. Here, the gas injected from the gas injection holes K3 and K2 may have directivity.
　当接部４２ｂにより搬入用テーブル４０の上面をスライドする基板Ｐは、図３４に示されるように、プレートホルダ９の上面へとスムーズに乗り移ることとなる。本実施形態では、搬入用テーブル４０の上面がプレートホルダ９の上面よりも高くなっているので、基板Ｐはプレートホルダ９の側面に接触することなく、スムーズにプレートホルダ９上へと乗り移ることができる。 As shown in FIG. 34, the substrate P that slides on the upper surface of the loading table 40 by the contact portion 42b smoothly transfers to the upper surface of the plate holder 9. In the present embodiment, since the upper surface of the loading table 40 is higher than the upper surface of the plate holder 9, the substrate P can smoothly transfer onto the plate holder 9 without contacting the side surface of the plate holder 9. it can.
　基板Ｐは、図３３に示したように、プレートホルダ９の周辺部に設けられたガイド用ピン３６により同図中Ｘ方向における位置が規定された状態でスライドする。当接部４２ｂは、プレートホルダ９における基板搬送方向の下流側に設けられた位置決めピン３７に当接させるまで基板Ｐを移動する。基板Ｐは、ガイド用ピン３６により同図中Ｘ方向における位置が規定されるとともに、位置決めピン３７及び当接部４２ｂに挟まれることで同図中Ｙ方向における位置が規定された状態となる。プレートホルダ９は、気体噴射孔Ｋ２からの気体噴射を停止する。基板Ｐは、図１１に示すように、基板載置部３１に対して位置合わせされた状態で載置される。 33. As shown in FIG. 33, the substrate P slides in a state where the position in the X direction in the drawing is defined by the guide pins 36 provided in the peripheral portion of the plate holder 9. The abutting portion 42b moves the substrate P until it abuts on a positioning pin 37 provided on the downstream side of the plate holder 9 in the substrate transport direction. The position of the substrate P in the X direction in the figure is defined by the guide pins 36, and the position in the Y direction in the figure is defined by being sandwiched between the positioning pins 37 and the contact portions 42b. The plate holder 9 stops gas injection from the gas injection hole K2. As shown in FIG. 11, the substrate P is placed in a state of being aligned with the substrate platform 31.
　ところで、従来基板をプレートホルダに載置する場合、基板の載置ずれ（所定の載置位置からの位置ずれ）や基板の変形が生じる可能性があった。この載置ずれが生じる原因の一つとして、例えば基板の載置直前に基板とプレートホルダとの間に生じる薄い空気層によって基板が浮遊状態となることが考えられる。また、基板の変形を生じさせる原因の一つとして、例えば基板を載置した後に基板とプレートホルダとの間に空気溜りが介在することで基板が膨らんだ状態となることが考えられる。 By the way, when the conventional substrate is placed on the plate holder, there is a possibility that the substrate is displaced (displacement from a predetermined placement position) or the substrate is deformed. One possible cause of this displacement is that the substrate floats due to a thin air layer generated between the substrate and the plate holder immediately before the substrate is placed, for example. Further, as one of the causes for causing the deformation of the substrate, for example, it is conceivable that the substrate swells due to an air pocket interposed between the substrate and the plate holder after the substrate is placed.
　これに対し、本実施形態においては、基板Ｐが上述のように気体の噴射によって浮上した状態で搬送されるので、歪みが無く平面度の高い状態でプレートホルダ９に受け渡される。また、基板Ｐは浮上支持されていた高さから基板載置部３１へと載置されるため、基板Ｐと基板載置部３１との間に空気溜りや空気層が生じることが防止される。よって、基板Ｐが膨らんだ状態となることが抑制され、基板Ｐの載置ずれや変形の発生を防止することができる。よって、プレートホルダ９に対する所定の位置に平面度が高い状態で基板Ｐを載置することができる。その後、真空ポンプが駆動されることにより、基板Ｐは、基板載置部３１の上面に吸引孔Ｋ１を介して吸着保持される。 In contrast, in the present embodiment, since the substrate P is transported in a state of being floated by gas injection as described above, the substrate P is transferred to the plate holder 9 with no distortion and high flatness. Further, since the substrate P is placed on the substrate platform 31 from the height at which the substrate P is levitated, it is possible to prevent an air pool or an air layer from being generated between the substrate P and the substrate platform 31. . Therefore, it becomes possible to prevent the substrate P from being swollen and prevent the substrate P from being displaced or deformed. Therefore, the substrate P can be placed at a predetermined position with respect to the plate holder 9 with high flatness. Thereafter, when the vacuum pump is driven, the substrate P is adsorbed and held on the upper surface of the substrate platform 31 via the suction hole K1.
　プレートホルダ９に基板Ｐを載置した後、マスクＭは照明系からの露光光ＩＬで照明される。露光光ＩＬで照明されたマスクＭのパターンは、プレートホルダ９に載置されている基板Ｐに投影光学系ＰＬを介して投影露光される。 After placing the substrate P on the plate holder 9, the mask M is illuminated with the exposure light IL from the illumination system. The pattern of the mask M illuminated with the exposure light IL is projected and exposed to the substrate P placed on the plate holder 9 via the projection optical system PL.
　上述のようにプレートホルダ９上に良好に基板Ｐが載置されるため、露光装置１は基板Ｐ上の適正な位置に所定の露光を高精度に行うことができ、信頼性の高い露光処理を実現できる。 Since the substrate P is satisfactorily placed on the plate holder 9 as described above, the exposure apparatus 1 can perform predetermined exposure at an appropriate position on the substrate P with high accuracy, and a highly reliable exposure process. Can be realized.
　本実施形態では、基板Ｐに露光処理を行っている最中、或いは後述するように露光処理済みの基板Ｐを搬出ロボット２０５が搬送している間、コータ・デベロッパ（不図示）によって感光剤が塗布された次の基板Ｐが搬入部４の搬入用テーブル４０上に載置することができる。 In the present embodiment, the photosensitive agent is applied by a coater / developer (not shown) while the substrate P is being exposed or while the unloading robot 205 is transporting the exposed substrate P as will be described later. The next coated substrate P can be placed on the loading table 40 of the loading unit 4.
　次に、露光処理終了後のプレートホルダ９からの基板Ｐの搬出動作について説明する。
　具体的には搬出ロボット２０５により基板Ｐを搬出する方法について説明する。図３５は搬出ロボット２０５の動作を説明するための斜視図であり、図３６Ａ及び３６Ｂは基板Ｐをプレートホルダ９から搬出する際にＹ軸方向から視た際の断面構成図であり、図３７は基板Ｐをプレートホルダ９から搬出する動作をＸ軸方向から視た際の側面図である。なお、図３５においてはフォーク部１２のみを図示しており、搬出ロボット２０５の全体構成は省略している。また、図３６Ａ及び３６Ｂにおいては、便宜上、基板Ｐを支持するフォーク部１２の図示を簡略化している。 Next, the carrying-out operation of the substrate P from the plate holder 9 after the exposure process is completed will be described.
Specifically, a method for unloading the substrate P by the unloading robot 205 will be described. FIG. 35 is a perspective view for explaining the operation of the unloading robot 205, and FIGS. 36A and 36B are cross-sectional configuration diagrams when the substrate P is unloaded from the plate holder 9 when viewed from the Y-axis direction. These are side views when the operation of carrying the substrate P out of the plate holder 9 is viewed from the X-axis direction. In FIG. 35, only the fork portion 12 is shown, and the entire configuration of the carry-out robot 205 is omitted. In FIGS. 36A and 36B, the fork portion 12 that supports the substrate P is simplified for convenience.
　露光処理が終了すると、真空ポンプによる吸引孔Ｋ１の吸着が解除され、プレートホルダ９による基板Ｐの吸着が解除される。続いて、搬出ロボット２０５は、図３５に示すようにプレートホルダ９に形成された溝部３０にフォーク部１２を－Ｙ方向側から挿入する。 When the exposure process is completed, the suction of the suction hole K1 by the vacuum pump is released, and the suction of the substrate P by the plate holder 9 is released. Subsequently, the carry-out robot 205 inserts the fork portion 12 into the groove portion 30 formed in the plate holder 9 from the −Y direction side as shown in FIG.
　そして、駆動装置１３はフォーク部１２を所定量上方に移動することで、図３６Ａに示すように基板Ｐの下面にフォーク部１２を当接させる。また、図３６Ｂに示されるように、フォーク部１２はさらに上方に移動することで基板Ｐをプレートホルダ９の上方に持ち上げて基板載置部３１から離間させる。 Then, the drive device 13 moves the fork portion 12 upward by a predetermined amount, thereby bringing the fork portion 12 into contact with the lower surface of the substrate P as shown in FIG. 36A. In addition, as shown in FIG. 36B, the fork unit 12 moves further upward to lift the substrate P above the plate holder 9 and separate it from the substrate platform 31.
　また、搬出ロボット２０５は、感光剤が塗布された次の基板Ｐを載置した搬入部４の搬入用テーブル４０に接触しない高さまでフォーク部１２を上昇（退避）させる。フォーク部１２が搬入用テーブル４０上の基板Ｐに接触しない位置まで上昇した後、図３７に示すように搬入部４の搬入用テーブル４０はプレートホルダ９に近接するように移動し、上述のようにして基板Ｐをプレートホルダ９側へと搬送する。 Further, the carry-out robot 205 raises (retreats) the fork unit 12 to a height that does not contact the carry-in table 40 of the carry-in unit 4 on which the next substrate P coated with the photosensitive agent is placed. After the fork unit 12 has moved up to a position where it does not come into contact with the substrate P on the loading table 40, the loading table 40 of the loading unit 4 moves so as to be close to the plate holder 9 as shown in FIG. Then, the substrate P is transported to the plate holder 9 side.
　搬入部４からプレートホルダ９へと基板Ｐが搬送されている間、搬出ロボット２０５は、フォーク部１２に載置された基板Ｐをコータ・デベロッパ（不図示）内に移動させる。以上のようにして、露光装置本体３からの基板Ｐの搬出動作が完了する。 While the substrate P is being transported from the carry-in unit 4 to the plate holder 9, the carry-out robot 205 moves the substrate P placed on the fork unit 12 into a coater / developer (not shown). As described above, the operation for unloading the substrate P from the exposure apparatus main body 3 is completed.
　このように本実施形態によれば、浮上支持された基板Ｐをスライドすることで搬入部４からプレートホルダ９へと搬送することができるので、基板Ｐと基板載置部３１との間に空気溜りや空気層が生じることが防止され、基板Ｐの載置ずれや変形の発生を防止できる。よって、信頼性の高い露光処理を行うことができる。 As described above, according to the present embodiment, the substrate P supported to be levitated can be transported from the carry-in unit 4 to the plate holder 9 by sliding, so that the air is interposed between the substrate P and the substrate platform 31. It is possible to prevent the accumulation or air layer from being generated, and to prevent the substrate P from being displaced or deformed. Therefore, highly reliable exposure processing can be performed.
　また、本実施形態では、気体噴射を用いて基板Ｐを搬入部４からプレートホルダ９側へとスライドさせて搬入するため、従来のトレイを用いたプレートホルダへの基板搬入に比べてタクトタイムが長くなる。 Moreover, in this embodiment, since the board | substrate P is slid and carried in from the carrying-in part 4 to the plate holder 9 side using gas injection, tact time is compared with the board | substrate carrying-in to the plate holder using the conventional tray. become longer.
　これに対し、本実施形態では、搬出ロボット２０５のフォーク部１２を溝部３０に挿入して基板Ｐを下面から持ち上げてプレートホルダ９から基板Ｐを退避させた状態で、搬入部４が次の基板Ｐをプレートホルダ９に搬入することができるので、プレートホルダ９に対する基板Ｐの搬出入に要する全体のタクトタイムが従来のトレイを用いた場合と略同等にすることができる。したがって、基板Ｐの搬出入時におけるタクトタイムを増加させることなく、基板Ｐを良好な状態でプレートホルダ９に搬入することができる。 On the other hand, in the present embodiment, the fork unit 12 of the unloading robot 205 is inserted into the groove unit 30 and the substrate P is lifted from the lower surface so that the substrate P is retracted from the plate holder 9. Since P can be carried into the plate holder 9, the total tact time required for carrying the substrate P in and out of the plate holder 9 can be made substantially the same as when a conventional tray is used. Therefore, the substrate P can be loaded into the plate holder 9 in a good state without increasing the tact time when loading and unloading the substrate P.
　なお、本実施形態において、搬入用テーブル４０からプレートホルダ９へと基板Ｐを搬送する際、搬入用テーブル４０の上面を傾斜させることもできる。具体的には、第２移動機構４３の保持部４４は、気体噴射孔Ｋ３からの気体噴射によって浮上した状態で基板Ｐを支持する搬入用テーブル４０の上面をプレートホルダ９側（θＹ方向）に傾斜させる。これにより、基板Ｐの自重を利用して該基板Ｐをプレートホルダ９側に移動させることができる。 In the present embodiment, when the substrate P is transported from the loading table 40 to the plate holder 9, the upper surface of the loading table 40 can be inclined. Specifically, the holding portion 44 of the second moving mechanism 43 has the upper surface of the loading table 40 that supports the substrate P in a state of being floated by gas injection from the gas injection hole K3 on the plate holder 9 side (θY direction). Tilt. Accordingly, the substrate P can be moved to the plate holder 9 side by utilizing the weight of the substrate P.
　（第７実施形態）
　続いて、本発明の第７実施形態に係る構成について説明する。なお、本実施形態においては、第６実施形態の構成要素と同一の要素については同一符号を付し、その説明を省略する。第７実施形態は、搬入部の構成が第６実施形態と異なっている。 (Seventh embodiment)
Subsequently, a configuration according to a seventh embodiment of the present invention will be described. In the present embodiment, the same components as those in the sixth embodiment are denoted by the same reference numerals, and the description thereof is omitted. The seventh embodiment is different from the sixth embodiment in the configuration of the carry-in section.
　本実施形態において、搬入部１０４は、図１６Ａ及び図１６Ｂを用いて説明したものと同様である。 In the present embodiment, the carry-in unit 104 is the same as that described with reference to FIGS. 16A and 16B.
　また、本実施形態における露光装置１の動作についても、図１７及び図１８を用いて説明したものと同様である。 Also, the operation of the exposure apparatus 1 in the present embodiment is the same as that described with reference to FIGS.
　本実施形態において、基板Ｐが上述のように気体の噴射によって浮上した状態で搬送されるので、歪みが無く平面度の高い状態でプレートホルダ９に受け渡すことができ、基板Ｐと基板載置部３１との間に空気溜りや空気層が生じることが防止される。よって、プレートホルダ９に対する所定の位置に平面度が高い状態で基板Ｐを載置することができる。したがって、基板Ｐ上の適正な位置に所定の露光を高精度に行うことができ、信頼性の高い露光処理を行うことができる。 In the present embodiment, since the substrate P is transported in a state of being floated by gas injection as described above, the substrate P can be transferred to the plate holder 9 without distortion and with high flatness. It is possible to prevent an air pool or an air layer from being generated between the portion 31. Therefore, the substrate P can be placed at a predetermined position with respect to the plate holder 9 with high flatness. Therefore, predetermined exposure can be performed with high accuracy at an appropriate position on the substrate P, and highly reliable exposure processing can be performed.
　（第８実施形態）
　続いて、本発明の第８実施形態に係る構成について説明する。なお、本実施形態においては、第６、７実施形態の構成要素と同一の要素については同一符号を付し、その説明を省略する。第８実施形態は、プレートホルダ９が移送部を備える点が第６及び第７実施形態と主に異なっている。 (Eighth embodiment)
Subsequently, a configuration according to the eighth embodiment of the present invention will be described. In the present embodiment, the same components as those in the sixth and seventh embodiments are denoted by the same reference numerals, and the description thereof is omitted. The eighth embodiment is mainly different from the sixth and seventh embodiments in that the plate holder 9 includes a transfer unit.
　図３８は、本実施形態に係るプレートホルダ１０９の構成を示す図である。本実施形態に係るプレートホルダ１０９は、図３８に示すように基板Ｐを搬入用テーブル４０からプレートホルダ９へと移送する第１移送部２４９を備えている。この第１移送部２４９は、基板Ｐの幅方向における両側部を吸着保持する吸着部２５０を含む。この吸着部２５０は、基板Ｐの面方向に沿うＸＹ平面内において自由に移動可能とされている。 FIG. 38 is a diagram showing a configuration of the plate holder 109 according to the present embodiment. As shown in FIG. 38, the plate holder 109 according to this embodiment includes a first transfer unit 249 that transfers the substrate P from the loading table 40 to the plate holder 9. The first transfer unit 249 includes a suction unit 250 that sucks and holds both side portions of the substrate P in the width direction. The suction part 250 is freely movable in the XY plane along the surface direction of the substrate P.
　また、本実施形態では、プレートホルダ９の周辺部に、第１移送部２４９により搬入される基板Ｐの基板載置部３１に対する位置を検出するための位置検出センサ２５２が設けられている。この位置検出センサ２５２としては、例えばポテンショメータを例示することができ、本発明は接触方式或いは非接触方式のいずれのメータを用いることができる。 In the present embodiment, a position detection sensor 252 for detecting the position of the substrate P carried by the first transfer unit 249 relative to the substrate platform 31 is provided in the peripheral part of the plate holder 9. As this position detection sensor 252, for example, a potentiometer can be exemplified. In the present invention, either a contact type or non-contact type meter can be used.
　吸着部２５０は、気体噴射孔Ｋ３からの気体噴射によって搬入用テーブル４０上に浮上支持される基板Ｐの端部を吸着保持し、図３９Ａに示すように搬入用テーブル４０からプレートホルダ９側へと搬送する。一方、プレートホルダ９は、基板Ｐを受けとるに際し、上面に形成された複数の気体噴射孔Ｋ２から気体を噴射しておく。このとき、気体噴射孔Ｋ２，Ｋ３から噴射する気体に指向性を持たせるようにしてもよい。 The suction portion 250 sucks and holds the end of the substrate P that is levitated and supported on the carry-in table 40 by gas injection from the gas injection hole K3, and moves from the carry-in table 40 to the plate holder 9 side as shown in FIG. 39A. And carry. On the other hand, when receiving the substrate P, the plate holder 9 injects gas from the plurality of gas injection holes K2 formed on the upper surface. At this time, the gas injected from the gas injection holes K2, K3 may have directivity.
　吸着部２５０は、図３９Ｂに示すように、基板Ｐの端部を位置検出センサ２５２に接触させることで、露光装置１は、基板Ｐにおける基板載置部３１に対する位置ズレを検知することができる。なお、吸着部２５０は、上記位置検出センサ２５２の検出結果に基づいて駆動するように構成されている。
　したがって、露光装置１は、位置検出センサ２５２の検出結果に基づき、吸着部２５０に保持された基板Ｐの基板載置部３１に対する位置を補正することができる。 As shown in FIG. 39B, the exposure unit 1 can detect a positional shift of the substrate P with respect to the substrate placement unit 31 by bringing the end of the substrate P into contact with the position detection sensor 252. . The suction unit 250 is configured to be driven based on the detection result of the position detection sensor 252.
Therefore, the exposure apparatus 1 can correct the position of the substrate P held by the suction unit 250 relative to the substrate placement unit 31 based on the detection result of the position detection sensor 252.
　本実施形態においても、基板Ｐが上述のように気体の噴射によって浮上した状態で搬送されるので、歪みが無く平面度の高い状態でプレートホルダ９に受け渡すことができ、基板Ｐと基板載置部３１との間に空気溜りや空気層が生じることが防止される。よって、プレートホルダ９に対する所定の位置に平面度が高い状態で基板Ｐを載置することができる。したがって、基板Ｐ上の適正な位置に所定の露光を高精度に行うことができ、信頼性の高い露光処理を行うことができる。
　なお、露光処理終了後のプレートホルダ９からの基板Ｐの搬出動作については第１実施形態と同様であるため、その説明を省略するものとする。 Also in this embodiment, since the substrate P is transported in a state of being floated by gas injection as described above, it can be transferred to the plate holder 9 with no distortion and high flatness. It is possible to prevent an air pool or an air layer from being generated between the mounting portion 31 and the mounting portion 31. Therefore, the substrate P can be placed at a predetermined position with respect to the plate holder 9 with high flatness. Therefore, predetermined exposure can be performed with high accuracy at an appropriate position on the substrate P, and highly reliable exposure processing can be performed.
In addition, since the carrying-out operation | movement of the board | substrate P from the plate holder 9 after completion | finish of exposure processing is the same as that of 1st Embodiment, the description shall be abbreviate | omitted.
　（第９実施形態）
　続いて、本発明の第９実施形態に係る構成について説明する。なお、本実施形態においては、第６～８実施形態の構成要素と同一の要素については同一符号を付し、その説明を省略する。第６実施形態は、露光装置本体の構成が第６～８実施形態と主に異なっている。図４０は、本実施形態に係る露光装置本体３の概略構成を示す斜視図である。 (Ninth embodiment)
Subsequently, a configuration according to the ninth embodiment of the present invention will be described. Note that in this embodiment, the same components as those in the sixth to eighth embodiments are denoted by the same reference numerals, and description thereof is omitted. The sixth embodiment is mainly different from the sixth to eighth embodiments in the configuration of the exposure apparatus main body. FIG. 40 is a perspective view showing a schematic configuration of the exposure apparatus main body 3 according to the present embodiment.
　図４０に示されるように、本実施形態の露光装置本体３は、プレートホルダ９と、該プレートホルダ９に設けられた基板持ち上げ機構１５０と、第１移動機構３３と、を備えている。基板持ち上げ機構１５０は、基板Ｐを搬出する際に基板Ｐを上方に持ち上げるためのものである。 As shown in FIG. 40, the exposure apparatus main body 3 of this embodiment includes a plate holder 9, a substrate lifting mechanism 150 provided on the plate holder 9, and a first moving mechanism 33. The substrate lifting mechanism 150 is for lifting the substrate P upward when the substrate P is unloaded.
　図４１はプレートホルダ９の平面構成を示す図であり、図４２Ａ及び図４２Ｂはプレートホルダ９における側断面図であり、図４２Ａは基板の受け渡し前の状態を示す図であり、図４２Ｂは基板の受け渡し後の状態を示す図である。 41 is a diagram showing a planar configuration of the plate holder 9, FIGS. 42A and 42B are side sectional views of the plate holder 9, FIG. 42A is a diagram showing a state before the substrate is delivered, and FIG. It is a figure which shows the state after delivery of.
　持ち上げ機構１５０は、図４１、４２Ａ、及び４２Ｂに示すように、基板Ｐを支持する複数の基板支持部材１５１と、該基板支持部材１５１を上下動する上下動作部１５２（図４３参照）と、を備えている。 As shown in FIGS. 41, 42A, and 42B, the lifting mechanism 150 includes a plurality of substrate support members 151 that support the substrate P, a vertical operation unit 152 that moves the substrate support member 151 up and down (see FIG. 43), It has.
　基板支持部材１５１は、軸部（上下動部材）１５５に対して図４１中Ｘ方向（第１方向）に架設される第１線状部材１１９と、図４１中Ｙ方向（第２方向）に架設される第２線状部材１２０とを含んでおり、全体として略格子状に形成されている。これら第１線状部材１１９及び第２線状部材（第２架設部）１２０は、ここでは相互に溶接され、あるいは格子状に組み合わされている。各基板支持部材１５１は、複数（本実施形態では、例えば６つ）の軸部１５５間に架設されている。 The substrate support member 151 includes a first linear member 119 installed in the X direction (first direction) in FIG. 41 with respect to the shaft portion (vertical movement member) 155, and the Y direction (second direction) in FIG. The second linear member 120 is installed, and is formed in a substantially lattice shape as a whole. Here, the first linear member 119 and the second linear member (second erection portion) 120 are welded to each other or combined in a lattice shape. Each substrate support member 151 is installed between a plurality of (for example, six in this embodiment) shaft portions 155.
　各基板支持部材１５１を構成する各格子形状は、いずれもが基板Ｐよりも小さい略矩形状の複数の開口部１２１を有している。なお、基板支持部材１５１の形状は図４１に示す形状に限定されることはなく、例えば開口部１２１が一つのみ形成された枠状の単一フレームであってもよい。 Each lattice shape constituting each substrate support member 151 has a plurality of substantially rectangular openings 121 that are smaller than the substrate P. The shape of the substrate support member 151 is not limited to the shape shown in FIG. 41, and may be a frame-like single frame in which only one opening 121 is formed, for example.
　本実施形態では、４つの基板支持部材１５１が、第２線状部材１２０の延在方向（図４１に示されるＹ方向）に沿って隙間Ｓを空けた状態で配置されている。このような基板支持部材１５１間の隙間Ｓは、後述するようにプレートホルダ９からの基板Ｐの搬出時にフォーク部１２が挿入される空間を構成するためのものである。 In the present embodiment, the four substrate support members 151 are arranged with a gap S along the extending direction of the second linear member 120 (the Y direction shown in FIG. 41). Such a gap S between the substrate support members 151 serves to constitute a space into which the fork portion 12 is inserted when the substrate P is unloaded from the plate holder 9 as will be described later.
　なお、基板支持部材１５１（第１線状部材１１９及び第２線状部材１２０）の形成材料としては、基板支持部材１５１が基板Ｐを支持した際に基板Ｐの自重による撓みを抑制することが可能な材料を用いることが好ましく、例えば各種合成樹脂、あるいは金属を用いることができる。具体的には、ナイロン、ポリプロピレン、ＡＳ樹脂、ＡＢＳ樹脂、ポリカーボネート、繊維強化プラスチック、ステンレス鋼等が挙げられる。繊維強化プラスチックとしては、ＧＦＲＰ（Glass Fiber Reinforced Plastic：ガラス繊維強化熱硬化性プラスチック）やＣＦＲＰ（Carbon Fiber Reinforced Plastic：炭素繊維強化熱硬化性プラスチック）が挙げられる。 In addition, as a forming material of the board | substrate support member 151 (the 1st linear member 119 and the 2nd linear member 120), when the board | substrate support member 151 supports the board | substrate P, suppressing the bending by the dead weight of the board | substrate P is suppressed. It is preferable to use a material that can be used. For example, various synthetic resins or metals can be used. Specific examples include nylon, polypropylene, AS resin, ABS resin, polycarbonate, fiber reinforced plastic, and stainless steel. Examples of the fiber reinforced plastic include GFRP (Glass Fiber Reinforced Plastic) and CFRP (Carbon Fiber Reinforced Plastic).
　上下動作部１５２は、図４３に示すように軸部（上下動部材）１５５と、該軸部１５５を上下駆動する駆動装置１５３とを有している。駆動装置１５３は各軸部１５５に対して設けられており、これにより各軸部１５５は独立して上下動作を行う。 As shown in FIG. 43, the vertical movement unit 152 includes a shaft portion (vertical movement member) 155 and a drive device 153 that drives the shaft portion 155 up and down. The driving device 153 is provided for each shaft portion 155, and thereby each shaft portion 155 performs an up and down operation independently.
　この構成に基づき、基板支持部材１５１は、図４２Ａ及び図４２Ｂに示すように上下動作部１５２（軸部１５５）の上下動に伴い、プレートホルダ９の基板載置部３１に対し、上下動作を行うようになっている。 Based on this configuration, as shown in FIGS. 42A and 42B, the substrate support member 151 moves up and down with respect to the substrate placement portion 31 of the plate holder 9 as the up and down operation portion 152 (shaft portion 155) moves up and down. To do.
　一方、プレートホルダ９には、基板支持部材１５１を収容するための凹部１３０が形成されている。この凹部１３０は、基板支持部材１５１のフレーム構造に対応して格子状に設けられている。プレートホルダ９の上面における凹部１３０以外の領域（部分載置部）は、基板Ｐを保持する基板載置部３１を構成している。 On the other hand, the plate holder 9 is formed with a recess 130 for accommodating the substrate support member 151. The recesses 130 are provided in a lattice shape corresponding to the frame structure of the substrate support member 151. A region (partial placement portion) other than the concave portion 130 on the upper surface of the plate holder 9 constitutes a substrate placement portion 31 that holds the substrate P.
　基板支持部材１５１の厚さは、凹部１３０の深さよりも小さくなっている。これにより、図４２Ｂに示すように、基板支持部材１５１が凹部１３０内に収容されることで基板支持部材１５１上に載置された基板Ｐのみが基板載置部３１に受け渡されて載置されるようになっている。 The thickness of the substrate support member 151 is smaller than the depth of the recess 130. As a result, as shown in FIG. 42B, only the substrate P placed on the substrate support member 151 is transferred to the substrate placement portion 31 and placed by placing the substrate support member 151 in the recess 130. It has come to be.
　また、基板載置部３１は、基板Ｐに対するプレートホルダ９の実質的な保持面が良好な平面度を有するように仕上げられている。さらに、基板載置部３１の基板保持面（上面）には、基板Ｐをこの面に倣わせて密着させるための吸引口、或いは後述の基板搬入時にエアー（気体）を噴射することで基板Ｐをこの面上に浮上支持する気体噴射口として機能する開口部Ｋ２０５が形成されている。開口部Ｋ２０５には、不図示の真空ポンプ及び気体噴射用ポンプがそれぞれ接続されており、これらポンプの駆動を切り替えることで開口部Ｋ２０５を上述のように吸引口或いは噴射口として機能させることができる。 Further, the substrate platform 31 is finished so that the substantial holding surface of the plate holder 9 with respect to the substrate P has good flatness. Furthermore, the substrate holding surface (upper surface) of the substrate mounting portion 31 has a suction port for bringing the substrate P into close contact with the surface, or air (gas) is ejected when a substrate is loaded as described later. An opening K205 is formed which functions as a gas injection port that floats and supports the surface. A vacuum pump (not shown) and a gas injection pump (not shown) are connected to the opening K205. By switching the driving of these pumps, the opening K205 can function as a suction port or an injection port as described above. .
　プレートホルダ９の周辺部には、基板Ｐの搬入時に該基板Ｐをガイドするためのガイド用ピン３６と、プレートホルダ９の基板載置部３１に対する基板Ｐの位置を規定する位置決めピン３７とが設けられている（図４４Ａ及び図４４Ｂ参照）。これらガイド用ピン３６及び位置決めピン３７は、露光装置本体３内をプレートホルダ９とともに移動可能とされている。 Around the periphery of the plate holder 9, there are guide pins 36 for guiding the substrate P when the substrate P is carried in, and positioning pins 37 for defining the position of the substrate P with respect to the substrate mounting portion 31 of the plate holder 9. (See FIGS. 44A and 44B). The guide pins 36 and the positioning pins 37 can be moved together with the plate holder 9 in the exposure apparatus main body 3.
　次に、本実施形態の露光装置１の動作について図４４Ａ～図５０Ｂを参照にしながら説明する。具体的には搬入部４とプレートホルダ９との間における基板Ｐの受け渡し動作、及びプレートホルダ９と搬出ロボット２０５との間における基板Ｐの受け渡し動作を主に説明する。 Next, the operation of the exposure apparatus 1 of the present embodiment will be described with reference to FIGS. 44A to 50B. Specifically, the transfer operation of the substrate P between the carry-in unit 4 and the plate holder 9 and the transfer operation of the substrate P between the plate holder 9 and the carry-out robot 205 will be mainly described.
　まず、第６実施形態と同様、搬入部４にコータ・デベロッパ（不図示）において感光剤が塗布された基板Ｐを搬入する。このとき、基板Ｐは搬入用テーブル４０の上面に吸引孔Ｋ４を介して吸着保持される。 First, as in the sixth embodiment, a substrate P coated with a photosensitive agent is carried into the carry-in section 4 by a coater / developer (not shown). At this time, the substrate P is sucked and held on the upper surface of the loading table 40 through the suction hole K4.
　続いて、プレートホルダ９は、図４４Ａに示すように、搬入部４の搬入用テーブル４０に近接するように移動する。なお、図４４Ａ及び図４４Ｂにおいては搬出ロボットの図示を省略している。具体的に、第１移動機構３３は、プレートホルダ９及び搬入用テーブル４０をＹ方向に沿って近接させた状態で配列する。このとき、第２移動機構４３を駆動することで、搬入用テーブル４０及びプレートホルダ９を基板Ｐの受け渡し位置に短時間で移動させ、基板Ｐの搬入動作に要する時間を短縮することができる。なお、基板Ｐは、吸引孔Ｋ４を介して搬入用テーブル４０の上面に吸着保持されているので、第２移動機構４３の駆動時に基板Ｐが搬入用テーブル４０上において動いてしまうことがない。 Subsequently, the plate holder 9 moves so as to be close to the loading table 40 of the loading unit 4 as shown in FIG. 44A. In FIGS. 44A and 44B, the carry-out robot is not shown. Specifically, the first moving mechanism 33 arranges the plate holder 9 and the carry-in table 40 close to each other along the Y direction. At this time, by driving the second moving mechanism 43, the loading table 40 and the plate holder 9 can be moved to the delivery position of the substrate P in a short time, and the time required for the loading operation of the substrate P can be shortened. Since the substrate P is sucked and held on the upper surface of the loading table 40 through the suction hole K4, the substrate P does not move on the loading table 40 when the second moving mechanism 43 is driven.
　本実施形態では、図４４Ｂに示されるように、第１移動機構３３は、基板Ｐを支持している搬入用テーブル４０の上面がプレートホルダ９の上面よりも高くなるようにプレートホルダ９を搬入用テーブル４０に近接させる。なお、第２移動機構４３により搬入用テーブル４０の上面がプレートホルダ９の上面よりも高くなるように搬入用テーブル４０を上昇させることもできる。また、第１移動機構３３は、プレートホルダ９及び搬入用テーブル４０を接触させた状態で配列することもでき、これにより基板Ｐの受け渡しをスムーズに行うことができる。 In the present embodiment, as shown in FIG. 44B, the first moving mechanism 33 loads the plate holder 9 so that the upper surface of the loading table 40 that supports the substrate P is higher than the upper surface of the plate holder 9. It is brought close to the work table 40. The loading table 40 can be raised by the second moving mechanism 43 so that the upper surface of the loading table 40 is higher than the upper surface of the plate holder 9. Moreover, the 1st moving mechanism 33 can also be arranged in the state which contacted the plate holder 9 and the carrying-in table 40, and thereby can deliver the board | substrate P smoothly.
　続いて、搬入用テーブル４０は、図４５に示すように、上面に形成された複数の気体噴射孔Ｋ３から気体を噴射し、該気体を介して基板Ｐを浮上させた状態で支持する。一方、プレートホルダ９は、基板Ｐを受けとるに際し、不図示の気体噴射用ポンプを駆動し、基板載置部３１に設けられた開口部Ｋ２０５からエアーを噴射しておく。 Subsequently, as shown in FIG. 45, the carry-in table 40 injects gas from a plurality of gas injection holes K3 formed on the upper surface, and supports the substrate P in a state where the substrate P is floated through the gas. On the other hand, when receiving the substrate P, the plate holder 9 drives a gas injection pump (not shown) and injects air from the opening K205 provided in the substrate mounting portion 31.
　搬入部４は、搬入用テーブル４０上に基板Ｐを浮上支持した状態で、図４６に示されるように、当接部４２ｂを基板Ｐの一端部に当接させる。当接部４２ｂは、凹部４０ａ内のガイド部４２ａに沿って移動することで基板Ｐをプレートホルダ９側へと移動する。 The carry-in unit 4 brings the contact part 42b into contact with one end of the substrate P as shown in FIG. 46 while the substrate P is levitated and supported on the carry-in table 40. The contact part 42b moves the substrate P toward the plate holder 9 by moving along the guide part 42a in the recess 40a.
　基板Ｐは搬入用テーブル４０上に浮上した状態となっているので、当接部４２ｂは基板Ｐをプレートホルダ９側にスムーズにスライドさせることができる。なお、プレートホルダ９の上面は、上述のように基板Ｐを浮上支持するようになっている。ここで、気体噴射孔Ｋ３及び開口部Ｋ２０５から噴射する気体に指向性を持たせるようにしてもよい。 Since the substrate P is in a state of floating on the loading table 40, the contact portion 42b can smoothly slide the substrate P to the plate holder 9 side. Note that the upper surface of the plate holder 9 supports the substrate P as described above. Here, the gas injected from the gas injection hole K3 and the opening K205 may have directivity.
　当接部４２ｂにより搬入用テーブル４０の上面をスライドする基板Ｐは、図４７に示されるように、プレートホルダ９の上面へとスムーズに乗り移ることとなる。本実施形態では、搬入用テーブル４０の上面がプレートホルダ９の上面よりも高くなっているので、基板Ｐはプレートホルダ９の側面に接触することなく、スムーズにプレートホルダ９上へと乗り移ることができる。 As shown in FIG. 47, the substrate P that slides on the upper surface of the loading table 40 by the abutting portion 42b smoothly transfers to the upper surface of the plate holder 9. In the present embodiment, since the upper surface of the loading table 40 is higher than the upper surface of the plate holder 9, the substrate P can smoothly transfer onto the plate holder 9 without contacting the side surface of the plate holder 9. it can.
　基板Ｐは、ガイド用ピン３６により同図中Ｘ方向における位置が規定されるとともに、位置決めピン３７及び当接部４２ｂに挟まれることで同図中Ｙ方向における位置が規定された状態となる。プレートホルダ９は、開口部Ｋ２０５からの気体噴射を停止する。これにより、基板Ｐは基板載置部３１に対して位置合わせされた状態で載置される。 The position of the substrate P in the X direction in the figure is defined by the guide pins 36, and the position in the Y direction in the figure is defined by being sandwiched between the positioning pins 37 and the contact portion 42b. The plate holder 9 stops gas injection from the opening K205. As a result, the substrate P is placed in a state of being aligned with the substrate placement unit 31.
　本実施形態においては、基板Ｐが上述のように気体の噴射によって浮上した状態で搬送されるので、歪みが無く平面度の高い状態でプレートホルダ９に受け渡される。また、基板Ｐは浮上支持されていた高さから基板載置部３１へと載置されるため、基板Ｐと基板載置部３１との間に空気溜りや空気層が生じることが防止される。よって、基板Ｐが膨らんだ状態となることが抑制され、基板Ｐの載置ずれや変形の発生を防止することができる。したがって、基板Ｐは、プレートホルダ９に対する所定の位置に平面度が高い状態で載置される。その後、真空ポンプが駆動されることにより、基板Ｐは、基板載置部３１の上面に開口部Ｋ２０５を介して吸着保持される。 In the present embodiment, since the substrate P is transported in a state of being floated by gas injection as described above, the substrate P is transferred to the plate holder 9 with no distortion and high flatness. Further, since the substrate P is placed on the substrate platform 31 from the height at which the substrate P is levitated, it is possible to prevent an air pool or an air layer from being generated between the substrate P and the substrate platform 31. . Therefore, it becomes possible to prevent the substrate P from being swollen and prevent the substrate P from being displaced or deformed. Therefore, the substrate P is placed at a predetermined position with respect to the plate holder 9 with a high flatness. Thereafter, by driving the vacuum pump, the substrate P is adsorbed and held on the upper surface of the substrate platform 31 through the opening K205.
　プレートホルダ９に基板Ｐを載置した後、マスクＭは照明系からの露光光ＩＬで照明される。露光光ＩＬで照明されたマスクＭのパターンは、プレートホルダ９に載置されている基板Ｐに投影光学系ＰＬを介して投影露光される。 After placing the substrate P on the plate holder 9, the mask M is illuminated with the exposure light IL from the illumination system. The pattern of the mask M illuminated with the exposure light IL is projected and exposed to the substrate P placed on the plate holder 9 via the projection optical system PL.
　本実施形態に係る露光装置１は、上述のようにプレートホルダ９上に良好に基板Ｐが載置されるので、基板Ｐ上の適正な位置に所定の露光を高精度に行うことができ、信頼性の高い露光処理を実現できる。 Since the substrate P is satisfactorily placed on the plate holder 9 as described above, the exposure apparatus 1 according to the present embodiment can perform predetermined exposure at an appropriate position on the substrate P with high accuracy. Highly reliable exposure processing can be realized.
　次に、露光処理終了後のプレートホルダ９からの基板Ｐの搬出動作について説明する。
　具体的には搬出ロボット２０５により基板Ｐを搬出する方法について説明する。図４８は搬出ロボット２０５の動作を説明するための斜視図であり、図４９Ａ、図４９Ｂ、及び図４９Ｃは基板Ｐをプレートホルダ９から搬出する際にＹ軸方向から視た際の断面構成図である。なお、図４８においてはフォーク部１２のみを図示しており、搬出ロボット２０５の全体構成は省略している。本実施形態では、持ち上げ機構１５０の形状に対応し、フォーク部１２における基板支持部が上記実施形態と異なっている。また、図４９Ａ、図４９Ｂ、及び図４９Ｃにおいては、便宜上、基板Ｐを支持するフォーク部１２の図示を簡略化している。 Next, the carrying-out operation of the substrate P from the plate holder 9 after the exposure process is completed will be described.
Specifically, a method for unloading the substrate P by the unloading robot 205 will be described. FIG. 48 is a perspective view for explaining the operation of the unloading robot 205. FIGS. 49A, 49B, and 49C are cross-sectional configuration diagrams when the substrate P is viewed from the Y-axis direction when unloading the substrate P from the plate holder 9. It is. In FIG. 48, only the fork unit 12 is shown, and the entire configuration of the carry-out robot 205 is omitted. In the present embodiment, the substrate support portion in the fork portion 12 is different from that in the above embodiment, corresponding to the shape of the lifting mechanism 150. 49A, 49B, and 49C, the fork portion 12 that supports the substrate P is simplified for convenience.
　露光処理が終了すると、真空ポンプによる開口部Ｋ２０５を介した吸着が解除され、プレートホルダ９による基板Ｐの吸着が解除される。続いて、持ち上げ機構１５０は、軸部１５５を駆動して基板支持部材１５１を上昇させる。このとき、図４９Ａに示すように、基板支持部材１５１とともに基板載置部３１上に載置されている基板Ｐが上方へと持ち上げられる。このとき、基板Ｐは、複数の基板支持部材１５１により支持されることで上方へと持ち上げられるので、剥離帯電の発生を防止することができる。また、従来のようにピンによって基板Ｐを持ち上げる場合に比べ、広い面で基板Ｐを支持することができるので、基板Ｐに生じる撓み量を低減することができ、基板Ｐに割れが生じるのを防止することができる。 When the exposure process is completed, the suction through the opening K205 by the vacuum pump is released, and the suction of the substrate P by the plate holder 9 is released. Subsequently, the lifting mechanism 150 drives the shaft portion 155 to raise the substrate support member 151. At this time, as shown in FIG. 49A, the substrate P placed on the substrate platform 31 together with the substrate support member 151 is lifted upward. At this time, the substrate P is lifted upward by being supported by the plurality of substrate support members 151, so that occurrence of peeling electrification can be prevented. Moreover, since the board | substrate P can be supported in a large surface compared with the case where the board | substrate P is lifted with a pin like the past, the amount of bending which arises in the board | substrate P can be reduced, and a crack occurs in the board | substrate P. Can be prevented.
　搬出ロボット２０５はフォーク部１２を駆動し、図４８に示すように基板載置部３１の上方に配置される基板支持部材１５１間の隙間Ｓ及びＸ軸方向両端部に向けてフォーク部１２を－Ｙ方向側から移動し、隙間Ｓ及び両端部にフォーク部１２を挿入する（図４９Ｂ）。 The unloading robot 205 drives the fork unit 12 to move the fork unit 12 toward the gap S between the substrate support members 151 arranged above the substrate platform 31 and both ends in the X-axis direction as shown in FIG. Moving from the Y direction side, the forks 12 are inserted into the gap S and both ends (FIG. 49B).
　そして、駆動装置１３がフォーク部１２を所定量上方に移動すると、フォーク部１２が基板Ｐの下面に当接する。さらにフォーク部１２を上方に移動させると、図４９Ｃに示されるように、基板Ｐがプレートホルダ９の上方に持ち上げられることで持ち上げ機構１５０から離間する。 Then, when the drive device 13 moves the fork portion 12 upward by a predetermined amount, the fork portion 12 comes into contact with the lower surface of the substrate P. When the fork portion 12 is further moved upward, the substrate P is lifted above the plate holder 9 and separated from the lifting mechanism 150 as shown in FIG. 49C.
　持ち上げ機構１５０は、基板Ｐが離間した後、基板支持部材１５１を凹部１３０内に収容する。凹部１３０内に基板支持部材１５１を収容した後、プレートホルダ９は、搬入部４の搬入用テーブル４０に近接するように移動し、上述のようにして基板Ｐをプレートホルダ９側へと搬送する。 The lifting mechanism 150 accommodates the substrate support member 151 in the recess 130 after the substrate P is separated. After the substrate support member 151 is accommodated in the recess 130, the plate holder 9 moves so as to be close to the loading table 40 of the loading section 4, and transports the substrate P to the plate holder 9 side as described above. .
　搬入部４からプレートホルダ９へと基板Ｐが搬送されている間、搬出ロボット２０５は、フォーク部１２に載置された基板Ｐをコータ・デベロッパ（不図示）内に移動させる。以上のようにして、露光装置本体３からの基板Ｐの搬出動作が完了する。 While the substrate P is being transported from the carry-in unit 4 to the plate holder 9, the carry-out robot 205 moves the substrate P placed on the fork unit 12 into a coater / developer (not shown). As described above, the operation for unloading the substrate P from the exposure apparatus main body 3 is completed.
　このように本実施形態によれば、浮上支持された基板Ｐをスライドすることで搬入部４からプレートホルダ９へと搬送するので、基板Ｐの載置ずれや変形の発生を防止できる。また、本実施形態においても、プレートホルダ９に対する基板Ｐの搬出入に要する全体のタクトタイムが従来のトレイを用いた場合と略同等とすることができる。よって、基板Ｐの搬出入時におけるタクトタイムを増加させることなく、基板Ｐを良好な状態でプレートホルダ９に搬入することができる。 As described above, according to the present embodiment, the substrate P supported to be levitated is slid and transported from the carry-in unit 4 to the plate holder 9, so that it is possible to prevent the substrate P from being displaced and deformed. Also in the present embodiment, the overall tact time required for loading and unloading the substrate P with respect to the plate holder 9 can be made substantially the same as when a conventional tray is used. Therefore, the substrate P can be loaded into the plate holder 9 in a good state without increasing the tact time during loading / unloading of the substrate P.
　なお、上記実施形態では、基板載置部３１のみに気体噴射口としての開口部Ｋ２０５を形成する場合について説明したが、基板支持部材１５１の上面に気体噴射口を形成することもできる。このようにすれば、基板Ｐをプレートホルダ９に搬入する際、基板搬送面に噴射される気体の量が増加するので、基板Ｐをよりスムーズに搬送することができる。 In the above embodiment, the case where the opening K205 as the gas injection port is formed only in the substrate mounting portion 31 has been described, but the gas injection port may be formed on the upper surface of the substrate support member 151. In this way, when the substrate P is carried into the plate holder 9, the amount of gas injected onto the substrate conveyance surface increases, so that the substrate P can be conveyed more smoothly.
　（第１０実施形態）
　続いて、本発明の第１０実施形態に係る構成について説明する。なお、本実施形態においては、第６実施形態の構成要素と同一の要素については同一符号を付し、その説明を省略する。第１０実施形態は、プレートホルダ９から基板Ｐを搬出する手段として非接触状態で基板Ｐを吸着する吸着機構を備える点が上記実施形態と主に異なっている。 (10th Embodiment)
Subsequently, a configuration according to the tenth embodiment of the present invention will be described. In the present embodiment, the same components as those in the sixth embodiment are denoted by the same reference numerals, and the description thereof is omitted. The tenth embodiment is mainly different from the above-described embodiment in that a suction mechanism for sucking the substrate P in a non-contact state is provided as means for carrying the substrate P out of the plate holder 9.
　吸着機構は基板Ｐを保持し、基板Ｐをプレートホルダ９の基板載置部３１から上方に持ち上げ、コータ・デベロッパ（不図示）内に移動させるためのものである。図５０Ａは吸着面の構成を示し、図５０Ｂは吸着機構の全体構成を示す図である。 The suction mechanism is for holding the substrate P, lifting the substrate P upward from the substrate mounting portion 31 of the plate holder 9 and moving it into a coater / developer (not shown). FIG. 50A shows the configuration of the suction surface, and FIG. 50B is a diagram showing the overall configuration of the suction mechanism.
　図５０Ａ及び図５０Ｂに示されるように、吸着機構３５０は、非接触状態で基板Ｐを保持する複数の保持部３５１と、これら保持部３５１を保持するベース部３５２と、該ベース部３５２を移動可能な駆動機構３５５と、ベース部３５２を備えている。ベース部３５２は、基板Ｐと略同等の大きさを有する板状部材である。保持部３５１は、ベース部３５２上に規則的に配置されており、これにより基板Ｐを良好に保持できるようになっている。 As shown in FIGS. 50A and 50B, the suction mechanism 350 moves a plurality of holding portions 351 that hold the substrate P in a non-contact state, a base portion 352 that holds these holding portions 351, and the base portion 352. A possible drive mechanism 355 and a base portion 352 are provided. The base portion 352 is a plate-like member having a size substantially equal to that of the substrate P. The holding portions 351 are regularly arranged on the base portion 352, and thereby the substrate P can be favorably held.
　保持部３５１としては、所謂ベルヌーイチャックを用いた。保持部３５１は、圧縮空気を基板Ｐとの間に噴射することで基板Ｐとの間に負圧を発生させる。これにより、基板Ｐを保持部３５１側に押し付ける押し付け力を生じさせる。一方、保持部３５１は、基板Ｐとの隙間が小さくなると圧縮空気の流速が低下し、保持部３５１と基板Ｐとの間の圧力が上昇する。これにより、基板Ｐを保持部３５１から離そうとする力を生じさせる。保持部３５１は、このような２つの力の釣り合いを取るように圧縮空気を噴射することで、基板Ｐと保持部３５１との間隔を一定に保持した状態、すなわち非接触状態で基板Ｐを保持することができる。 As the holding portion 351, a so-called Bernoulli chuck was used. The holding unit 351 generates a negative pressure between the holding portion 351 and the substrate P by injecting the compressed air between the holding portion 351 and the substrate P. Thereby, the pressing force which presses the board | substrate P toward the holding | maintenance part 351 side is produced. On the other hand, when the gap between the holding unit 351 and the substrate P becomes small, the flow rate of the compressed air decreases, and the pressure between the holding unit 351 and the substrate P increases. As a result, a force for separating the substrate P from the holding portion 351 is generated. The holding unit 351 holds the substrate P in a state where the distance between the substrate P and the holding unit 351 is held constant, that is, in a non-contact state, by injecting compressed air so as to balance such two forces. can do.
　次に、露光装置１の動作について図面を参照にしながら説明する。なお、搬入部４とプレートホルダ９との間における基板Ｐの受け渡し動作については、第１実施形態と同様であることから説明を省略する。 Next, the operation of the exposure apparatus 1 will be described with reference to the drawings. In addition, about the delivery operation | movement of the board | substrate P between the carrying-in part 4 and the plate holder 9, since it is the same as that of 1st Embodiment, description is abbreviate | omitted.
　以下、プレートホルダ９から基板Ｐを搬出する動作について説明する。具体的に、上記吸着機構３５０により基板Ｐをプレートホルダ９から搬出する方法について説明する。図５１Ａ及び図５１Ｂは基板Ｐをプレートホルダ９から搬出する動作をＸ軸方向から視た際の側面図である。 Hereinafter, the operation of unloading the substrate P from the plate holder 9 will be described. Specifically, a method for carrying the substrate P out of the plate holder 9 by the suction mechanism 350 will be described. 51A and 51B are side views when the operation of unloading the substrate P from the plate holder 9 is viewed from the X-axis direction.
　露光処理が終了すると、真空ポンプによる吸引孔Ｋ１の吸着が解除され、プレートホルダ９による基板Ｐの吸着が解除される。続いて、吸着機構３５０はプレートホルダ９の上方に移動する。そして、吸着機構３５０は、図５１Ａに示されるように保持部３５１が基板Ｐを保持可能な位置まで下降する。そして、複数の保持部３５１によって基板Ｐの上面を非接触状態で保持する。このとき、複数の保持部３５１は同時に駆動させる、或いは順次駆動させることで基板Ｐを保持することができる。 When the exposure process is completed, the suction of the suction hole K1 by the vacuum pump is released, and the suction of the substrate P by the plate holder 9 is released. Subsequently, the suction mechanism 350 moves above the plate holder 9. Then, the suction mechanism 350 is lowered to a position where the holding portion 351 can hold the substrate P as shown in FIG. 51A. Then, the upper surface of the substrate P is held in a non-contact state by the plurality of holding portions 351. At this time, the plurality of holding portions 351 can hold the substrate P by being driven simultaneously or sequentially.
　吸着機構３５０は、複数の保持部２５１によって基板Ｐを保持した状態で、駆動機構３５５によって基板Ｐをプレートホルダ９の上方に持ち上げ、図５１Ｂに示すように基板載置部３１から離間させる。このとき、保持部３５１は基板Ｐに非接触であるため、基板Ｐに吸着跡が残ることが無い。 The suction mechanism 350 lifts the substrate P above the plate holder 9 by the drive mechanism 355 in a state where the substrate P is held by the plurality of holding units 251 and separates the substrate P from the substrate mounting unit 31 as shown in FIG. 51B. At this time, since the holding portion 351 is not in contact with the substrate P, no suction mark remains on the substrate P.
　吸着機構３５０が搬入用テーブル４０上の基板Ｐに接触しない位置まで上昇した後、搬入部４の搬入用テーブル４０はプレートホルダ９に近接するように移動する。そして、上記実施形態と同様、基板Ｐを浮上支持した状態で搬入用テーブル４０からプレートホルダ９へと搬送する。 After the suction mechanism 350 has moved up to a position where it does not contact the substrate P on the loading table 40, the loading table 40 of the loading unit 4 moves so as to be close to the plate holder 9. And like the said embodiment, it conveys from the loading table 40 to the plate holder 9 in the state which carried out the floating support of the board | substrate P. FIG.
　搬入部４からプレートホルダ９へと基板Ｐが搬送されている間、吸着機構３５０は、保持部３５１に保持された基板Ｐをコータ・デベロッパ（不図示）内に移動させる。以上のようにして、露光装置本体３からの基板Ｐの搬出動作が完了する。 While the substrate P is being transported from the carry-in unit 4 to the plate holder 9, the suction mechanism 350 moves the substrate P held by the holding unit 351 into a coater / developer (not shown). As described above, the operation for unloading the substrate P from the exposure apparatus main body 3 is completed.
　なお、図５２Ａ及び図５２Ｂに示すように、ベース部３５２の周囲に基板Ｐの下面を支持する支持部材３５３を設けることもできる。支持部材３５３は、基板Ｐの周囲を囲む枠状部材からなり、基板Ｐの面方向に張り出した張り出し部３５４を複数有する。この張り出し部３３４は、基板Ｐの下面に当接するようになっている。この構成によれば、基板Ｐのダレが生じるおそれのある大型基板を保持する場合、基板Ｐの周端部が張り出し部３５４によって支持されるので、大型基板を保持する場合であっても、基板Ｐの端部にダレが生じるのを防止しつつ、保持部３５１によって平面度が高い状態で基板Ｐを保持することができる。 As shown in FIGS. 52A and 52B, a support member 353 that supports the lower surface of the substrate P can be provided around the base portion 352. The support member 353 is made of a frame-like member that surrounds the periphery of the substrate P, and has a plurality of projecting portions 354 that project in the surface direction of the substrate P. The overhang portion 334 comes into contact with the lower surface of the substrate P. According to this configuration, when holding a large substrate that may cause sagging of the substrate P, the peripheral end portion of the substrate P is supported by the overhanging portion 354. Therefore, even if the large substrate is held, The substrate P can be held in a state where the flatness is high by the holding portion 351 while preventing the end of the P from sagging.
　また、上述の実施形態の基板Ｐとしては、ディスプレイデバイス用のガラス基板のみならず、半導体デバイス製造用の半導体ウエハ、薄膜磁気ヘッド用のセラミックウエハ、あるいは露光装置で用いられるマスクまたはレチクルの原版（合成石英、シリコンウエハ）等が適用される。 Further, as the substrate P in the above-described embodiment, not only a glass substrate for a display device but also a semiconductor wafer for manufacturing a semiconductor device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus ( Synthetic quartz, silicon wafer) or the like is applied.
　また、露光装置としては、マスクＭと基板Ｐとを同期移動してマスクＭのパターンを介した露光光ＩＬで基板Ｐを走査露光するステップ・アンド・スキャン方式の走査型露光装置（スキャニングステッパ）の他に、マスクＭと基板Ｐとを静止した状態でマスクＭのパターンを一括露光し、基板Ｐを順次ステップ移動させるステップ・アンド・リピート方式の投影露光装置（ステッパ）にも適用することができる。 Further, as the exposure apparatus, a step-and-scan type scanning exposure apparatus (scanning stepper) that moves the mask M and the substrate P synchronously to scan and expose the substrate P with the exposure light IL through the pattern of the mask M. In addition, the present invention may be applied to a step-and-repeat projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the mask M and the substrate P are stationary, and the substrate P is sequentially moved stepwise. it can.
　また、本発明は、米国特許第６３４１００７号、米国特許第６２０８４０７号、米国特許第６２６２７９６号等に開示されているような、複数の基板ステージを備えたツインステージ型の露光装置にも適用できる。 The present invention can also be applied to a twin stage type exposure apparatus having a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like.
　また、本発明は、米国特許第６８９７９６３号、欧州特許出願公開第１７１３１１３号等に開示されているような、基板を保持する基板ステージと、基板を保持せずに、基準マークが形成された基準部材及び／又は各種の光電センサを搭載した計測ステージとを備えた露光装置にも適用することができる。また、複数の基板ステージと計測ステージとを備えた露光装置を採用することができる。 The present invention also provides a substrate stage for holding a substrate and a reference in which a reference mark is formed without holding the substrate, as disclosed in US Pat. No. 6,897,963, European Patent Application No. 1713113, and the like. The present invention can also be applied to an exposure apparatus that includes a measurement stage on which members and / or various photoelectric sensors are mounted. An exposure apparatus including a plurality of substrate stages and measurement stages can be employed.
　なお、上述の実施形態においては、光透過性の基板上に所定の遮光パターン（又は位相パターン・減光パターン）を形成した光透過型マスクを用いたが、このマスクに代えて、例えば米国特許第６７７８２５７号明細書に開示されているように、露光すべきパターンの電子データに基づいて透過パターン又は反射パターン、あるいは発光パターンを形成する可変成形マスク（電子マスク、アクティブマスク、あるいはイメージジェネレータとも呼ばれる）を用いてもよい。また、非発光型画像表示素子を備える可変成形マスクに代えて、自発光型画像表示素子を含むパターン形成装置を備えるようにしても良い。 In the above-described embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in US Pat. No. 6,778,257, a variable shaped mask (also called an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. ) May be used. Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element.
　上述の実施形態の露光装置は、各構成要素を含む各種サブシステムを、所定の機械的精度、電気的精度、光学的精度を保つように、組み立てることで製造される。これら各種精度を確保するために、この組み立ての前後には、各種光学系については光学的精度を達成するための調整、各種機械系については機械的精度を達成するための調整、各種電気系については電気的精度を達成するための調整が行われる。各種サブシステムから露光装置への組み立て工程は、各種サブシステム相互の、機械的接続、電気回路の配線接続、気圧回路の配管接続等が含まれる。この各種サブシステムから露光装置への組み立て工程の前に、各サブシステム個々の組み立て工程があることはいうまでもない。各種サブシステムの露光装置への組み立て工程が終了したら、総合調整が行われ、露光装置全体としての各種精度が確保される。なお、露光装置の製造は温度およびクリーン度等が管理されたクリーンルームで行うことが望ましい。 The exposure apparatus according to the above-described embodiment is manufactured by assembling various subsystems including each component so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. To ensure these various accuracies, before and after this assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.
　半導体デバイス等のマイクロデバイスは、図５３に示すように、マイクロデバイスの機能・性能設計を行うステップ２０１、この設計ステップに基づいたマスク（レチクル）を製作するステップ２０２、デバイスの基材である基板を製造するステップ２０３、上述の実施形態に従って、マスクのパターンを用いて露光光で基板を露光すること、及び露光された基板（感光剤）を現像することを含む基板処理（露光処理）を含む基板処理ステップ２０４、デバイス組み立てステップ（ダイシング工程、ボンディング工程、パッケージ工程などの加工プロセスを含む）２０５、検査ステップ２０６等を経て製造される。なお、ステップ２０４では、感光剤を現像することで、マスクのパターンに対応する露光パターン層（現像された感光剤の層）を形成し、この露光パターン層を介して基板を加工することが含まれる。 As shown in FIG. 53, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for manufacturing a mask (reticle) based on the design step, and a substrate which is a base material of the device. Manufacturing step 203, including substrate processing (exposure processing) including exposing the substrate with exposure light using a mask pattern and developing the exposed substrate (photosensitive agent) according to the above-described embodiment The substrate is manufactured through a substrate processing step 204, a device assembly step (including processing processes such as a dicing process, a bonding process, and a packaging process) 205, an inspection step 206, and the like. In step 204, the photosensitive agent is developed to form an exposure pattern layer (developed photosensitive agent layer) corresponding to the mask pattern, and the substrate is processed through the exposure pattern layer. It is.
　なお、上述の実施形態及び変形例の要件は、適宜組み合わせることができる。また、一部の構成要素を用いない場合もある。また、法令で許容される限りにおいて、上述の実施形態及び変形例で引用した露光装置などに関する全ての公開公報及び米国特許の開示を援用して本文の記載の一部とする。 It should be noted that the requirements of the above-described embodiments and modifications can be combined as appropriate. Some components may not be used. In addition, as long as it is permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.
Ｐ…基板、Ｋ１，Ｋ４，Ｋ６，Ｋ８…吸引孔、Ｋ２，Ｋ３，Ｋ５，Ｋ７…気体噴射孔、Ｋ２０５…開口部、１…露光装置、４，１０４…搬入部、５…搬出部、９，１０９…プレートホルダ、１２…フォーク部、１９…位置検出センサ、３３…第１移動機構、４０，１４０…搬入用テーブル、４２，１４９，２４９…第１移送部、４３…第２移動機構、５０…搬出用テーブル、５２…第２移送部、５３…第３移動機構、１０９…プレートホルダ、１４２…コロ、１４８…コロ機構、１４９…第１移送部、１５０…持ち上げ機構、２０５…搬出ロボット、２５０…吸着部、２５１…保持部、２５２…位置検出センサ、３５０…吸着機構、３５１…保持部、４０１…基板載置テーブル、４０５…移送部、４０８…吸着部 P ... Substrate, K1, K4, K6, K8 ... Suction hole, K2, K3, K5, K7 ... Gas injection hole, K205 ... Opening, 1 ... Exposure device, 4,104 ... Carry-in part, 5 ... Carry-out part, 9 , 109 ... Plate holder, 12 ... Fork part, 19 ... Position detection sensor, 33 ... First movement mechanism, 40, 140 ... Loading table, 42, 149, 249 ... First transfer part, 43 ... Second movement mechanism, DESCRIPTION OF SYMBOLS 50 ... Unloading table, 52 ... 2nd transfer part, 53 ... 3rd moving mechanism, 109 ... Plate holder, 142 ... Roller, 148 ... Roller mechanism, 149 ... 1st transfer part, 150 ... Lifting mechanism, 205 ... Unloading robot , 250 ... Suction part, 251 ... Holding part, 252 ... Position detection sensor, 350 ... Suction mechanism, 351 ... Holding part, 401 ... Substrate mounting table, 405 ... Transfer part, 408 ... Suction part

Claims (66)

  1. 　基板の一面に対して気体を供給し、該気体を介して前記基板を浮上支持可能な第１支持部と、
    　前記基板の前記一面を支持可能な第２支持部と、
    　前記第１及び第２支持部の少なくとも１つを移動し、該第１及び第２支持部を互いに近接又は接触させて第１方向に配列する駆動部と、
    　前記駆動部によって配列された前記第１及び第２支持部の一方が支持する前記基板を、前記第１方向に沿って他方側に移動する移送部と、
    　を備える搬送装置。     Supplying a gas to one surface of the substrate, and a first support portion capable of supporting the substrate by floating through the gas;
    A second support part capable of supporting the one surface of the substrate;
    A driving unit configured to move at least one of the first and second support units and to arrange the first and second support units in a first direction by bringing them into proximity or contact with each other;
    A transfer unit that moves the substrate supported by one of the first and second support units arranged by the drive unit to the other side along the first direction;
    A transport apparatus comprising:
  2. 　前記駆動部は、前記第１及び第２支持部の一方が支持している前記基板が前記第１及び第２支持部の他方よりも高い位置に配置されるように前記第１及び第２支持部を前記第１方向に配列する請求項１に記載の搬送装置。 The drive unit is configured to support the first and second supports so that the substrate supported by one of the first and second support units is disposed at a position higher than the other of the first and second support units. The transport device according to claim 1, wherein the portions are arranged in the first direction.
  3. 　前記駆動部は、前記基板を支持している前記第１及び第２支持部の一方の上面部が前記第１及び第２支持部の他方の上面部よりも高い位置に配置されるように前記第１及び第２支持部を前記第１方向に配列する請求項２に記載の搬送装置。 The drive unit is arranged such that one upper surface portion of the first and second support portions supporting the substrate is disposed at a position higher than the other upper surface portion of the first and second support portions. The transport apparatus according to claim 2, wherein the first and second support portions are arranged in the first direction.
  4. 　前記駆動部は、少なくとも一部が前記第２支持部と一体的に設けられる請求項１～３のいずれか一項に記載の搬送装置。 The transfer device according to any one of claims 1 to 3, wherein at least a part of the drive unit is provided integrally with the second support unit.
  5. 　前記駆動部は、少なくとも一部が前記第１支持部と一体的に移動可能に設けられる請求項１～４のいずれか一項に記載の搬送装置。 The transfer device according to any one of claims 1 to 4, wherein at least a part of the drive unit is provided so as to be movable integrally with the first support unit.
  6. 　前記第２支持部は、前記基板の前記一面に対して気体を供給し、該気体を介して前記基板を浮上支持可能である請求項１～５のいずれか一項に記載の搬送装置。 The transfer device according to any one of claims 1 to 5, wherein the second support portion is capable of supplying a gas to the one surface of the substrate and floatingly supporting the substrate via the gas.
  7. 　前記１及び第２支持部は、少なくとも一部が平面視で相互に重なるように配置され、前記駆動部は、前記第１及び第２支持部を少なくとも鉛直方向に移動させる請求項１～６のいずれか一項に記載の搬送装置。 The first and second support parts are arranged so that at least a part thereof overlaps each other in a plan view, and the drive part moves the first and second support parts at least in the vertical direction. The conveyance apparatus as described in any one.
  8. 　前記移送部は、前記基板の下面に接触した状態で回転するコロ機構と、前記第１又は第２支持部に対する前記基板の位置を規定する位置規定部と、を有し、
    　前記コロ機構は、前記位置規定部に当接させるように前記基板を移動する請求項１～７のいずれか一項に記載の搬送装置。     The transfer unit has a roller mechanism that rotates in contact with the lower surface of the substrate, and a position defining unit that defines the position of the substrate with respect to the first or second support unit,
    The transport apparatus according to any one of claims 1 to 7, wherein the roller mechanism moves the substrate so as to contact the position defining portion.
  9. 　前記移送部は、前記基板の端部を吸着保持する吸着機構と、前記第１又は第２支持部に対する前記基板の位置を検出する位置検出部と、を有し、
    　前記吸着機構は、前記位置検出部の検出結果に基づいて前記基板を移動する請求項１～７のいずれか一項に記載の搬送装置。     The transfer unit includes an adsorption mechanism that adsorbs and holds an end portion of the substrate, and a position detection unit that detects a position of the substrate with respect to the first or second support unit,
    The transfer device according to any one of claims 1 to 7, wherein the suction mechanism moves the substrate based on a detection result of the position detection unit.
  10. 　前記基板を支持する前記第１又は第２支持部の上面部を傾斜させる傾斜機構を有する請求項１～９のいずれか一項に記載の搬送装置。 10. The transfer apparatus according to claim 1, further comprising an inclination mechanism for inclining an upper surface portion of the first or second support portion that supports the substrate.
  11. 　前記第１支持部と前記第２支持部との相対位置を検出する位置検出部を備えることを特徴とする請求項１～１０のいずれか一項に記載の搬送装置。 11. The transport apparatus according to claim 1, further comprising a position detection unit that detects a relative position between the first support unit and the second support unit.
  12. 　基板の一面に対して気体を供給し、該気体を介して前記基板を浮上支持可能な第１支持部と、
    　前記基板の前記一面を支持可能な第２及び第３支持部と、
    　前記第１及び第２支持部の少なくとも１つを移動し、該第１及び第２支持部を互いに近接又は接触させて第１方向に配列する第１駆動部と、
    　前記第１及び第３支持部の少なくとも１つを移動し、該第１及び第３支持部を互いに近接又は接触させて第２方向に配列する第２駆動部と、
    　前記第１駆動部によって前記第１支持部に配列された前記第２支持部が支持する前記基板を、前記第１方向に沿って前記第１支持部側へ移動する第１移送部と、
    　前記第２駆動部によって前記第３支持部に配列された前記第１支持部が支持する前記基板を、前記第２方向に沿って前記第３支持部側へ移動する第２移送部と、
    　を備える搬送装置。     Supplying a gas to one surface of the substrate, and a first support portion capable of supporting the substrate by floating through the gas;
    Second and third support portions capable of supporting the one surface of the substrate;
    A first driving unit that moves at least one of the first and second support units and arranges the first and second support units in a first direction by bringing them into close proximity or contact with each other;
    A second driving unit configured to move at least one of the first and third support units, and to arrange the first and third support units in a second direction by bringing them close to or in contact with each other;
    A first transfer unit configured to move the substrate supported by the second support unit arranged on the first support unit by the first driving unit toward the first support unit along the first direction;
    A second transfer unit configured to move the substrate supported by the first support unit arranged on the third support unit by the second driving unit toward the third support unit along the second direction;
    A transport apparatus comprising:
  13. 　前記第１駆動部は、前記第２支持部が支持している前記基板が前記第１支持部よりも高い位置に配置されるように前記第１及び第２支持部を前記第１方向に配列する請求項１２に記載の搬送装置。 The first driving unit arranges the first and second support units in the first direction so that the substrate supported by the second support unit is disposed at a higher position than the first support unit. The transport apparatus according to claim 12.
  14. 　前記第１駆動部は、前記基板を支持している前記第２支持部の上面部が前記第１支持部の上面部よりも高い位置に配置されるように前記第１及び第２支持部を前記第１方向に配列する請求項１３に記載の搬送装置。 The first driving unit includes the first and second support units so that an upper surface portion of the second support portion supporting the substrate is disposed at a position higher than an upper surface portion of the first support portion. The transport apparatus according to claim 13, which is arranged in the first direction.
  15. 　前記第２駆動部は、前記第１支持部が支持している前記基板が前記第３支持部よりも高い位置に配置されるように前記第１及び第３支持部を前記第２方向に配列する請求項１２～１４のいずれか一項に記載の搬送装置。 The second driving unit arranges the first and third support units in the second direction so that the substrate supported by the first support unit is disposed at a higher position than the third support unit. The transport apparatus according to any one of claims 12 to 14.
  16. 　前記第２駆動部は、前記基板を支持している前記第１支持部の上面部が前記第３支持部の上面部よりも高い位置に配置されるように前記第１及び第３支持部を前記第２方向に配列する請求項１５に記載の搬送装置。 The second drive unit includes the first and third support units such that an upper surface portion of the first support portion supporting the substrate is disposed at a position higher than an upper surface portion of the third support portion. The transport device according to claim 15, which is arranged in the second direction.
  17. 　前記第１駆動部は、少なくとも一部が前記第２支持部と一体的に設けられ、
    　前記第２駆動部は、少なくとも一部が前記第３支持部と一体的に設けられる請求項１２～１６のいずれか一項に記載の搬送装置。     The first drive unit is at least partially provided integrally with the second support unit,
    The transfer device according to any one of claims 12 to 16, wherein at least a part of the second drive unit is provided integrally with the third support unit.
  18. 　前記第１及び第２駆動部は、それぞれ少なくとも一部が前記第１支持部と一体的に移動可能に設けられる請求項１２～１７のいずれか一項に記載の搬送装置。 The transfer device according to any one of claims 12 to 17, wherein at least a part of each of the first and second drive units is provided so as to be movable integrally with the first support unit.
  19. 　前記第２及び第３支持部は、同一の水平面内における異なる位置に配置される請求項１２～１８のいずれか一項に記載の搬送装置。 The transfer device according to any one of claims 12 to 18, wherein the second and third support portions are arranged at different positions in the same horizontal plane.
  20. 　前記第２及び第３支持部は、少なくとも一部が平面視で相互に重なるように配置され、前記第１及び第２駆動部は、それぞれ前記第２及び第３支持部を少なくとも鉛直方向に移動させる請求項１２～１９のいずれか一項に記載の搬送装置。 The second and third support portions are arranged so that at least a part thereof overlaps each other in plan view, and the first and second drive portions move at least the second and third support portions in the vertical direction, respectively. The conveying device according to any one of claims 12 to 19,
  21. 　前記第２支持部及び前記第３支持部の少なくとも一方は、前記基板の前記一面に対して気体を供給し、該気体を介して前記基板を浮上支持可能である請求項１２～２０のいずれか一項に記載の搬送装置。 The at least one of the second support portion and the third support portion can supply a gas to the one surface of the substrate and can support the substrate by floating through the gas. The transfer device according to one item.
  22. 　前記基板を支持する前記第２支持部の上面部を傾斜させる第１傾斜機構と、前記基板を支持する前記第１支持部の上面部を傾斜させる第２傾斜機構と、を有する請求項１２～２１のいずれか一項に記載の搬送装置。 A first tilt mechanism that tilts the upper surface portion of the second support portion that supports the substrate, and a second tilt mechanism that tilts the upper surface portion of the first support portion that supports the substrate. The transport device according to any one of 21.
  23. 　前記第１支持部と前記第２又は前記第３支持部との相対位置を検出する位置検出部を備えることを特徴とする請求項１２～２２のいずれか一項に記載の搬送装置。 The transport apparatus according to any one of claims 12 to 22, further comprising a position detection unit that detects a relative position between the first support unit and the second or third support unit.
  24. 　前記第１移送部及び第２移送部の少なくとも一方は、前記基板の下面に接触した状態で回転するコロ機構と、前記基板の移動先となる前記第１支持部又は第２支持部に対する前記基板の位置を規定する位置規定部と、を有し、
    　前記コロ機構は、前記位置規定部に当接させるように前記基板を移動する請求項１２～２３のいずれか一項に記載の搬送装置。     At least one of the first transfer unit and the second transfer unit is a roller mechanism that rotates in contact with the lower surface of the substrate, and the substrate with respect to the first support unit or the second support unit that is the destination of the substrate A position defining portion that defines the position of
    The transport apparatus according to any one of claims 12 to 23, wherein the roller mechanism moves the substrate so as to contact the position defining portion.
  25. 　前記第１移送部及び第２移送部の少なくとも１つは、前記基板の端部を吸着保持する吸着機構と、前記基板の移動先となる前記第１支持部又は第２支持部に対する前記基板の位置を検出する位置検出部と、を有し、
    　前記吸着機構は、前記位置検出部の検出結果に基づいて前記基板を移動する請求項１２～２３のいずれか一項に記載の搬送装置。     At least one of the first transfer unit and the second transfer unit includes an adsorption mechanism that adsorbs and holds an end of the substrate, and the substrate with respect to the first support unit or the second support unit to which the substrate is moved. A position detection unit for detecting the position,
    The transfer device according to any one of claims 12 to 23, wherein the suction mechanism moves the substrate based on a detection result of the position detection unit.
  26. 　前記第１駆動部が前記第１及び第２支持部を配列する前記第１方向と、前記第２駆動部が前記第１及び第３支持部を配列する前記第２方向とが、平行である請求項１２～２５のいずれか一項に記載の搬送装置。 The first direction in which the first driving unit arranges the first and second support units and the second direction in which the second driving unit arranges the first and third support units are parallel to each other. The transport device according to any one of claims 12 to 25.
  27. 　前記第１支持部は、前記気体の供給を停止して該基板を上面部に載置させる請求項１～２０のいずれか一項に記載の搬送装置。 The transfer device according to any one of claims 1 to 20, wherein the first support portion stops the supply of the gas and places the substrate on an upper surface portion.
  28. 　基板を搬送する搬送方法であって、
    　前記基板の一面に供給する気体を介して前記基板を浮上支持可能な第１支持部及び前記基板の前記一面を支持可能な第２支持部の少なくとも一方を移動し、該第１及び第２支持部を互いに近接又は接触させて第１方向に配列することと、
    　配列された前記第１及び第２支持部の一方が支持する前記基板を、前記第１方向に沿って他方側に移動することと、
    　を含む搬送方法。     A transport method for transporting a substrate,
    The first and second supports are moved by moving at least one of a first support portion capable of supporting the substrate in a levitating manner and a second support portion capable of supporting the one surface of the substrate via a gas supplied to one surface of the substrate. Arranging the parts close to or in contact with each other in the first direction;
    Moving the substrate supported by one of the arranged first and second support portions to the other side along the first direction;
    Conveying method including.
  29. 　前記第１及び第２支持部の一方が支持している前記基板が前記第１及び第２支持部の他方よりも高い位置に配置されるように前記第１及び第２支持部を前記第１方向に配列する請求項２８に記載の搬送方法。 The first and second support portions are arranged so that the substrate supported by one of the first and second support portions is positioned higher than the other of the first and second support portions. The transport method according to claim 28, which is arranged in a direction.
  30. 　基板を搬送する搬送方法であって、
    　前記基板の前記一面に供給する気体を介して前記基板を浮上支持可能な第１支持部及び前記基板の前記一面を支持可能な第２支持部の少なくとも一方を移動し、該第１及び第２支持部を互いに近接又は接触させて第１方向に配列することと、
    　前記第１支持部に配列された前記第２支持部が支持する前記基板を、前記第１方向に沿って前記第１支持部側へ移動することと、
    　前記第１支持部及び前記基板の前記一面を支持可能な第３支持部の少なくとも一方を移動し、該第１及び第３支持部を互いに近接又は接触させて第２方向に配列することと、
    　前記第３支持部に配列された前記第１支持部が支持する前記基板を、前記第２方向に沿って前記第３支持部側へ移動することと、
    　を含む搬送方法。     A transport method for transporting a substrate,
    Moving at least one of a first support part capable of supporting the substrate in a levitating manner and a second support part capable of supporting the one surface of the substrate via a gas supplied to the one surface of the substrate, the first and second Arranging the support portions close to or in contact with each other in the first direction;
    Moving the substrate supported by the second support portion arranged in the first support portion toward the first support portion along the first direction;
    Moving at least one of the first support part and the third support part capable of supporting the one surface of the substrate, and arranging the first and third support parts in proximity to or in contact with each other;
    Moving the substrate supported by the first support portion arranged in the third support portion toward the third support portion along the second direction;
    Conveying method including.
  31. 　前記第２支持部が支持している前記基板が前記第１支持部よりも高い位置に配置されるように前記第１及び第２支持部を前記第１方向に配列する請求項３０に記載の搬送方法。 The said 1st and 2nd support part is arranged in the said 1st direction so that the said board | substrate which the said 2nd support part is supporting may be arrange | positioned in a position higher than a said 1st support part. Transport method.
  32. 　前記第１支持部が支持している前記基板が前記第３支持部よりも高い位置に配置されるように前記第１及び第３支持部を前記第２方向に配列する請求項３０又は３１に記載の搬送方法。 32. The arrangement according to claim 30, wherein the first and third support portions are arranged in the second direction so that the substrate supported by the first support portion is disposed at a position higher than the third support portion. The conveying method described.
  33. 　前記第１支持部は、同一の水平面内における異なる位置に配置される前記第２支持部及び前記第３支持部に対して、前記第２支持部及び前記第３支持部の配列方向に沿って移動する請求項３０～３２のいずれか一項に記載の搬送方法。 The first support part is arranged along an arrangement direction of the second support part and the third support part with respect to the second support part and the third support part arranged at different positions in the same horizontal plane. The transport method according to any one of claims 30 to 32, which moves.
  34. 　前記第１支持部と、少なくとも一部が平面視で相互に重なるように配置され、かつ鉛直方向において異なる位置に配置される前記第２及び第３支持部と、が相対移動を行うことにより、前記第１、及び第２又は第３支持部が配列する請求項３０～３２のいずれか一項に記載の搬送方法。 By performing relative movement between the first support part and the second and third support parts that are arranged so that at least a part thereof overlaps each other in a plan view and are arranged at different positions in the vertical direction, The transport method according to any one of claims 30 to 32, wherein the first and second or third support portions are arranged.
  35. 　露光光で基板を露光する露光装置であって、
    　前記基板を保持し、前記露光光の照射領域に前記基板を移動させる請求項１～２７のいずれか一項に記載の搬送装置を備える露光装置。     An exposure apparatus that exposes a substrate with exposure light,
    An exposure apparatus comprising the transfer device according to any one of claims 1 to 27, which holds the substrate and moves the substrate to an irradiation region of the exposure light.
  36. 　請求項３５に記載の露光装置を用いて、感光剤が塗布された前記基板の露光を行い、該基板にパターンを転写することと、
    　前記露光によって露光された前記感光剤を現像して、前記パターンに対応する露光パターン層を形成することと、
    　前記露光パターン層を介して前記基板を加工することと、
    　を含むデバイス製造方法。     Using the exposure apparatus according to claim 35, exposing the substrate coated with a photosensitive agent, and transferring a pattern to the substrate;
    Developing the photosensitive agent exposed by the exposure to form an exposure pattern layer corresponding to the pattern;
    Processing the substrate through the exposed pattern layer;
    A device manufacturing method including:
  37. 　基板の一面に対して気体を供給し、該気体を介して前記基板を浮上支持可能な第１支持部と、
    　前記基板の前記一面を支持可能な第２支持部と、
    　前記第１及び第２支持部の少なくとも１つを移動し、該第１及び第２支持部を互いに近接又は接触させて配列する駆動部と、
    　前記駆動部によって配列された前記第２支持部が支持する前記基板を、前記配列方向に沿って前記第１支持部側へ移動する移送部と、
    　前記気体の供給を停止することで前記第１支持部の載置部に載置された前記基板を支持し、該載置部の上方に持ち上げる持ち上げ機構と、
    　該持ち上げ機構により前記載置部の上方に支持される前記基板を前記第１支持部から搬出する搬出機構と、を備える搬送装置。     Supplying a gas to one surface of the substrate, and a first support portion capable of supporting the substrate by floating through the gas;
    A second support part capable of supporting the one surface of the substrate;
    A drive unit that moves at least one of the first and second support units and arranges the first and second support units in proximity to or in contact with each other; and
    A transfer unit that moves the substrate supported by the second support unit arranged by the driving unit to the first support unit side along the arrangement direction; and
    A lifting mechanism that supports the substrate placed on the placement portion of the first support portion by stopping the supply of the gas, and lifts the substrate above the placement portion;
    And a carry-out mechanism for carrying out the substrate supported above the placement unit by the lifting mechanism from the first support unit.
  38. 　前記持ち上げ機構は、前記載置部に対して上下動する複数の可動部材と、
    　少なくとも２つの前記可動部材に架設され、前記基板を支持可能な少なくとも１つの支持部材と、を備え、
    　前記可動部材は、前記支持部材における前記基板との接触部が前記載置部に対して突没するように上下動する請求項３７に記載の搬送装置。     The lifting mechanism includes a plurality of movable members that move up and down with respect to the placement unit,
    And at least one support member that is installed on at least two movable members and can support the substrate,
    The said movable member is a conveying apparatus of Claim 37 which moves up and down so that the contact part with the said board | substrate in the said supporting member may protrude and sunk with respect to the said mounting part.
  39. 　前記支持部材は、少なくとも２つの前記可動部材に対して第１方向に架設された複数の第１架設部及び第２方向に架設された複数の第２架設部を含み、格子形状に形成されている請求項３８に記載の搬送装置。 The support member includes a plurality of first erection parts erected in the first direction with respect to at least two of the movable members, and a plurality of second erection parts erected in the second direction, and is formed in a lattice shape. 40. The transport apparatus according to claim 38.
  40. 　複数の前記支持部材は、前記第１方向に沿って前記格子形状の長手方向に配置され、前記第２方向に沿って相互に間隔をおいて配置されている請求項３９に記載の搬送装置。 40. The transport device according to claim 39, wherein the plurality of support members are arranged in the longitudinal direction of the lattice shape along the first direction, and are spaced apart from each other along the second direction.
  41. 　前記可動部材は、前記第１支持部から突出するように設けられている請求項３８～４０のいずれか一項に記載の搬送装置。 The transfer device according to any one of claims 38 to 40, wherein the movable member is provided so as to protrude from the first support portion.
  42. 　前記支持部材は、前記第１支持部のうち前記載置部と異なる場所に収納される請求項３８～４１のいずれか一項に記載の搬送装置。 The transfer device according to any one of claims 38 to 41, wherein the support member is housed in a location different from the placement portion in the first support portion.
  43. 　前記載置部は、前記第１支持部に形成された溝状の凹部によって区画された複数の部分載置部を含み、
    　前記支持部材は、前記凹部に収納される請求項４２に記載の搬送装置。     The mounting portion includes a plurality of partial mounting portions partitioned by a groove-shaped recess formed in the first support portion,
    43. The transport device according to claim 42, wherein the support member is housed in the recess.
  44. 　前記可動部材は、前記凹部から突出するように設けられている請求項４３に記載の搬送装置。 44. The transfer device according to claim 43, wherein the movable member is provided so as to protrude from the recess.
  45. 　前記搬出機構は、前記支持部材に支持される前記基板を受け取るフォーク部を含む請求項３８～４４のいずれか一項に記載の搬送装置。 The transfer device according to any one of claims 38 to 44, wherein the carry-out mechanism includes a fork portion that receives the substrate supported by the support member.
  46. 　前記持ち上げ機構は、複数の前記支持部材を備え、
    　前記フォーク部は、隣り合う前記支持部材間において前記基板を支持する請求項４５に記載の搬送装置。     The lifting mechanism includes a plurality of the supporting members,
    The said fork part is a conveying apparatus of Claim 45 which supports the said board | substrate between the said adjacent support members.
  47. 　前記載置部は、前記第１支持部に形成された溝状の凹部によって区画された複数の部分載置部を含み、
    　前記持ち上げ機構は、前記凹部に挿入された状態で上昇することにより前記基板の下面を支持するフォーク部を含む請求項３７に記載の搬送装置。     The mounting portion includes a plurality of partial mounting portions partitioned by a groove-shaped recess formed in the first support portion,
    38. The transfer device according to claim 37, wherein the lifting mechanism includes a fork portion that supports the lower surface of the substrate by moving upward while being inserted into the recess.
  48. 　前記持ち上げ機構は、前記基板を支持するフォーク部を前記第１支持部とは異なる位置に移動させるように駆動する駆動部を含み、該持ち上げ機構が前記搬出機構を兼ねる請求項４７に記載の搬送装置。 48. The transport according to claim 47, wherein the lifting mechanism includes a driving unit that drives the fork unit that supports the substrate to move to a position different from the first supporting unit, and the lifting mechanism also serves as the carry-out mechanism. apparatus.
  49. 　前記持ち上げ機構は、前記基板を保持して上昇する保持部を含む請求項３７に記載の搬送装置。 38. The transfer device according to claim 37, wherein the lifting mechanism includes a holding portion that holds and lifts the substrate.
  50. 　前記保持部は、非接触状態で前記基板を保持する請求項４９に記載の搬送装置。 The transfer device according to claim 49, wherein the holding unit holds the substrate in a non-contact state.
  51. 　前記持ち上げ機構は、前記保持部を複数有する請求項４９又は５０に記載の搬送装置。 51. The transport apparatus according to claim 49 or 50, wherein the lifting mechanism includes a plurality of the holding portions.
  52. 　前記持ち上げ機構は、前記基板における端部を支持する支持部材を含む請求項４９～５１のいずれか一項に記載の搬送装置。 The transfer device according to any one of claims 49 to 51, wherein the lifting mechanism includes a support member that supports an end portion of the substrate.
  53. 　前記持ち上げ機構は、前記基板を保持する前記保持部を前記第１支持部とは異なる位置に移動させるように駆動する駆動部を含み、該持ち上げ機構が前記搬出機構を兼ねる請求項４９～５２のいずれか一項に記載の搬送装置。 The lifting mechanism includes a drive unit that drives the holding unit that holds the substrate to move to a position different from the first support unit, and the lifting mechanism also serves as the carry-out mechanism. The conveyance apparatus as described in any one.
  54. 　前記駆動部は、前記第２支持部が支持している前記基板が前記第１支持部よりも高い位置に配置されるように前記第１及び第２支持部を配列する請求項３７～５３のいずれか一項に記載の搬送装置。 The drive unit is configured to arrange the first and second support units so that the substrate supported by the second support unit is disposed at a position higher than the first support unit. The conveyance apparatus as described in any one.
  55. 　前記駆動部は、前記基板を支持している前記第２支持部の上面部が前記第１支持部の上面部よりも高い位置に配置されるように前記第１及び第２支持部を配列する請求項５４に記載の搬送装置。 The driving unit arranges the first and second support units so that an upper surface portion of the second support portion supporting the substrate is disposed at a position higher than an upper surface portion of the first support portion. 55. A transport apparatus according to claim 54.
  56. 　前記駆動部は、少なくとも一部が前記第２支持部と一体的に設けられる請求項３７～５５のいずれか一項に記載の搬送装置。 The transport device according to any one of claims 37 to 55, wherein at least a part of the drive unit is provided integrally with the second support unit.
  57. 　前記駆動部は、少なくとも一部が前記第１支持部と一体的に移動可能に設けられる請求項３７～５６のいずれか一項に記載の搬送装置。 The transfer device according to any one of claims 37 to 56, wherein at least a part of the drive unit is provided so as to be movable integrally with the first support unit.
  58. 　前記第２支持部は、前記基板の前記一面に対して気体を供給し、該気体を介して前記基板を浮上支持可能である請求項３７～５７のいずれか一項に記載の搬送装置。 The transfer device according to any one of claims 37 to 57, wherein the second support part is capable of supplying a gas to the one surface of the substrate and floatingly supporting the substrate via the gas.
  59. 　前記移送部は、前記基板の下面に接触した状態で回転するコロ機構と、前記第１又は第２支持部に対する前記基板の位置を規定する位置規定部と、を有し、
    　前記コロ機構は、前記位置規定部に当接させるように前記基板を移動する請求項３７～５８のいずれか一項に記載の搬送装置。     The transfer unit has a roller mechanism that rotates in contact with the lower surface of the substrate, and a position defining unit that defines the position of the substrate with respect to the first or second support unit,
    The transport apparatus according to any one of claims 37 to 58, wherein the roller mechanism moves the substrate so as to contact the position defining portion.
  60. 　前記移送部は、前記基板の端部を吸着保持する吸着機構と、前記第１又は第２支持部に対する前記基板の位置を検出する位置検出部と、を有し、
    　前記吸着機構は、前記位置検出部の検出結果に基づいて前記基板を移動する請求項３７～５９のいずれか一項に記載の搬送装置。     The transfer unit includes an adsorption mechanism that adsorbs and holds an end portion of the substrate, and a position detection unit that detects a position of the substrate with respect to the first or second support unit,
    The transfer device according to any one of claims 37 to 59, wherein the suction mechanism moves the substrate based on a detection result of the position detection unit.
  61. 　前記基板を支持する前記第１又は第２支持部の上面部を傾斜させる傾斜機構を有する請求項３７～６０のいずれか一項に記載の搬送装置。 The transport apparatus according to any one of claims 37 to 60, further comprising an inclination mechanism for inclining an upper surface portion of the first or second support portion that supports the substrate.
  62. 　前記第１支持部と前記第２支持部との相対位置を検出する相対位置検出部を備えることを特徴とする請求項３７～６１のいずれか一項に記載の搬送装置。 The transport apparatus according to any one of claims 37 to 61, further comprising a relative position detection unit that detects a relative position between the first support unit and the second support unit.
  63. 　基板を搬送する搬送方法であって、
    　前記基板の一面に供給する気体を介して前記基板を浮上支持可能な第１支持部、及び前記基板の前記一面を支持可能な第２支持部の少なくとも一方を移動し、該第１及び第２支持部を互いに近接又は接触させて配列することと、
    　配列された前記第２支持部が支持する前記基板を、前記配列方向に沿って前記第１支持部側へ移送することと、
    　前記気体の供給を停止することで前記第１支持部の載置部に載置された前記基板を支持し、該載置部の上方に持ち上げることと、
    　前記載置部の上方に支持される前記基板を前記第１支持部から搬出することと、
    　を含む搬送方法。     A transport method for transporting a substrate,
    Moving at least one of a first support portion capable of supporting the substrate in a levitating manner and a second support portion capable of supporting the one surface of the substrate via a gas supplied to one surface of the substrate, the first and second Arranging the support parts close to or in contact with each other;
    Transferring the substrate supported by the arranged second support parts to the first support part side along the arrangement direction;
    Supporting the substrate placed on the placement portion of the first support portion by stopping the supply of the gas, and lifting up the placement portion;
    Unloading the substrate supported above the placement unit from the first support unit;
    Conveying method including.
  64. 　前記第２支持部が支持している前記基板が前記第１支持部よりも高くなるように前記第１及び第２支持部を配列する請求項６３に記載の搬送方法。 64. The transport method according to claim 63, wherein the first and second support portions are arranged so that the substrate supported by the second support portion is higher than the first support portion.
  65. 　露光光で基板を露光する露光装置であって、
    　前記基板を保持し、前記露光光の照射領域に前記基板を移動させる請求項３７～６２のいずれか一項に記載の搬送装置を備える露光装置。     An exposure apparatus that exposes a substrate with exposure light,
    An exposure apparatus comprising the transfer device according to any one of claims 37 to 62, which holds the substrate and moves the substrate to an irradiation region of the exposure light.
  66. 　請求項６５に記載の露光装置を用いて、感光剤が塗布された前記基板の露光を行い、該基板にパターンを転写することと、
    　前記露光によって露光された前記感光剤を現像して、前記パターンに対応する露光パターン層を形成することと、
    　前記露光パターン層を介して前記基板を加工することと、
    　を含むデバイス製造方法。     Using the exposure apparatus according to claim 65, exposing the substrate coated with a photosensitive agent, and transferring a pattern to the substrate;
    Developing the photosensitive agent exposed by the exposure to form an exposure pattern layer corresponding to the pattern;
    Processing the substrate through the exposed pattern layer;
    A device manufacturing method including:
PCT/JP2011/053356 2010-02-17 2011-02-17 Transfer apparatus, transfer method, exposure apparatus, and device manufacturing method WO2011102410A1 (en)

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