TWI699582B - Manufacturing device and manufacturing method of bonded device - Google Patents

Abstract

The invention provides a manufacturing device and a manufacturing method of a bonded device. Remove the local stress remaining on the lower workpiece and fit the upper workpiece in a smooth state. The upper holding member has a holding portion in which the upper workpiece is held immovably. The lower holding member has: a floating part with a mechanism for separately generating separation pressure and approach pressure in the opposite direction from the lower workpiece; and a contact holding part with a mechanism for adjusting the separation pressure and approach pressure. The control part maintains the balance of the separation pressure and the approach pressure of the lifting part with respect to the lower holding member, and the lower workpiece is supported in a non-contact manner so as to float from the lower chuck surface. The floating part is switched to the contact holding part, the approach pressure is gradually increased compared to the separation pressure, and the lower workpiece is held in contact with the lower chuck surface. Either or both of the upper holding member and the lower holding member are moved relatively close by the lift drive unit, and the upper workpiece held on the upper chuck surface by the holding unit overlaps the lower workpiece.

Description

Manufacturing device and manufacturing method of bonded device

The present invention relates to a flat panel display (FPD) or sensor device such as a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (PDP), a flexible display, or, for example, a touch panel type Liquid crystal modules (LCM) such as FPD or 3D (3-dimensional) displays or e-books or plate-like workpieces (substrates) such as flexible printed circuit boards (FPC), which are bonded to touch panels, cover glasses, cover films, or FPD, etc. Another bonding device manufacturing apparatus of a plate-shaped workpiece (substrate), and a bonding device manufacturing method.

Conventionally, as a manufacturing apparatus and manufacturing method of such a bonded device, there has been a substrate stacking device that is used to transfer the upper substrate and the lower substrate along the through holes provided in the upper substrate holder and the lower substrate holder The lift pins are individually set to move up and down, and when carried in under atmospheric pressure, they are held by the arm of the transfer robot and transport the upper and lower substrates so as to protrude from the surfaces of the upper substrate holder and the lower substrate holder. The ground is received by the upper lifting pin and the lower lifting pin that move up and down. Next, the upper lift pin and the lower lift pin are moved in opposite directions, and the upper substrate and the lower substrate are individually transferred to the surfaces of the upper substrate holder and the lower substrate holder (for example, see Patent Document 1).

In particular, in the lower substrate, the upper side is the surface of the component. Therefore, the lower surface is vacuum sucked and transported by the arm of the transfer robot, and the lower substrate is vacuum sucked by the raised lower lift pin at a position that does not interfere with the arm. The arm of the transfer robot is transferred to the lower lift pin. After that, transfer the lower substrate from the lower lift pin to the lower substrate holder, and the vacuum suction machine The structure operates to vacuum the lower substrate to the lower substrate holder.

At this time, the lower substrate holder is evenly provided with a plurality of (for example, 4) through holes for lift pins. The lower lift pins are raised from the through holes by the lift mechanism to receive the lower substrate, and descend to transfer the lower substrate. After reaching the lower substrate holder, the lower lift pin further descends and stops at the predetermined standby position.

After the upper substrate and the lower substrate are further transferred, the upper substrate holder and the lower substrate holder move closer, and the vacuum container between the two is set to a vacuum state, and the upper substrate and the lower substrate are overlapped to temporarily fix the space between the two After the sealing material in the vacuum container becomes atmospheric pressure, the upper and lower substrates that are bonded are transferred to the arm of the transfer robot by the lift pins, and are carried out from the vacuum container.

[Advanced Technical Literature] [Patent Literature]

Patent Document 1: Japanese Patent Publication No. 2002-229471

However, in this conventional bonding device manufacturing apparatus, the surface of the lower substrate holder used for bonding the upper substrate and the lower substrate is open and has a plurality of through holes for lift pins, grooves, etc. A part of the side substrate is lowered due to its own weight, and locally expands and contracts to bend into a concavo-convex shape, and is bonded to the upper substrate in a state where stress due to the local expansion and contraction remains.

The local stress generated on the lower substrate before the lamination will eventually become the residual stress of the substrate after the lamination, which not only affects the lamination accuracy, but also has the following problem that bubbles are generated between the upper substrate and the lower substrate to reduce quality. Lead to a decline in yield.

Furthermore, there is a problem that the holding part of the lower substrate based on the arm of the transfer robot is a local linear shape instead of the entire surface of the lower substrate, and the holding part of the lower substrate based on the vacuum suction of the lower lift pin is Localized dots rather than the entire surface of the lower substrate. Therefore, in this holding state, the lower substrate locally stretches and bends due to its own weight Curved into a bumpy shape. In other words, the transfer of the lower substrate from the arm of the transfer robot to the lower lift pin also becomes the main cause of the stress caused by the local expansion and contraction remaining on the lower substrate when held individually, which further reduces the bonding accuracy. The problem of reduced yield.

In addition, there is also a problem in that foreign matter such as foreign matter adheres to the area where the arm of the transport robot or the lower lift pin touches on the lower substrate, causing unevenness with other areas, and high-precision bonding cannot be performed.

In particular, in recent LCDs, etc., substrates tend to be larger and thinner. Generally, the thickness of the G8 (2200×2500mm) size liquid crystal glass substrate is 0.2mm, and the G11 (3000×3320mm) size liquid crystal glass substrate thickness It becomes 0.5mm, which is very easy to bend and deform. In addition, 4k×2k boards, high-definition boards, and multi-view 3D technology boards require high-definition boards. For the entire board surface, the alignment error between the TFT substrate and the color filter substrate is required to be less than 2 μm.

On the other hand, the position of the fiducial mark for the alignment of the laminating device and the camera for confirming the mark position are not performed on the entire surface of the substrate. Generally, even for the G8 size liquid crystal glass substrate, it is performed at the end position. Alignment from place to 8 places.

Therefore, if there is a local stress in the center of the glass substrate, there will be very little positional deviation at the end position where the camera is used for mark alignment. However, at the center of the glass substrate, compared with the end position, it is between the substrates. The relative positional deviation becomes large, and it is very difficult to control the alignment error of the G8 size liquid crystal glass substrate to sub-micron accuracy.

In order to achieve such a problem, the manufacturing apparatus of the bonding device of the present invention is as follows. In the bonding space, the upper workpiece is held by the upper holding member and the lower workpiece is held by the lower holding member. The upper holding member and the aforementioned The lower holding member moves relatively close to each other, bonding the upper workpiece and the lower workpiece, and the manufacturing device of the bonding device It is characterized by comprising: the upper holding member arranged in the bonding space and having an upper chuck surface for detachably holding the upper workpiece; and the lower holding member arranged in the bonding space and having detachably holding the lower The smooth lower chuck surface of the side workpiece; a lift drive unit that moves either or both of the upper holding member or the lower holding member relatively close to overlap the upper workpiece and the lower workpiece; and a control unit , The upper chuck surface, the lower chuck surface, and the lifting drive unit are individually actuated and controlled, the upper holding member has a holding portion in which the upper workpiece is held immovably, and the lower holding member has: a lifting portion , Equipped with a mechanism for separately generating separation pressure and approach pressure in the opposite direction between the lower workpiece; and a contact holding section equipped with a mechanism for adjusting the separation pressure and the approach pressure, the control section controls as follows, relative to The lower holding member allows the lower workpiece to maintain the balance of the separation pressure and the approach pressure of the floating portion, and the lower workpiece is supported in a non-contact manner so as to float from the lower chuck surface to float from the The lifting part is switched to the contact holding part, so that the approach pressure is gradually increased compared to the separation pressure and the lower workpiece is contacted and held on the lower chuck surface. The lifting driving part causes the upper holding member or the lower Either one or both of the side holding members move relatively close to each other, and the upper workpiece held on the upper chuck surface by the holding portion overlaps the lower workpiece.

And the manufacturing method of the bonding device of the present invention is a method in which the upper workpiece is held by the upper holding member and the lower workpiece is held by the lower holding member in the bonding space, by the upper holding member and the lower holding member The upper workpiece and the lower workpiece are bonded relatively close to each other. The method of manufacturing the bonding device is characterized by including a holding step of holding the upper workpiece on the upper chuck surface of the upper holding member, and holding the lower side The workpiece is held on the smooth lower chuck surface of the lower holding member; and in the joining step, by moving either or both of the upper holding member or the lower holding member relatively close to each other to overlap the upper workpiece and The aforementioned lower workpiece, the aforementioned In the holding step, the lower workpiece is held relative to the lower holding member by a balance between the separation pressure and the approach pressure generated in the opposite direction from the lower workpiece by the floating portion, so as to move from the lower side The chuck surface is lifted to support the lower workpiece in a non-contact manner. Then, the approach pressure is gradually increased compared to the separation pressure by the contact holding portion, so that the lower workpiece is in contact with the lower chuck surface and held as Unable to move, in the aforementioned joining step, the aforementioned upper workpiece and the aforementioned lower workpiece are overlapped.

A: Manufacturing equipment for bonded devices

1: Upper holding member

11: Upper chuck surface

11a: Holding part

12: Handover Organization

12a: Drive unit for handover

12b: Lift pin

12c: connecting member

2: Lower holding member

21: Lower chuck surface

21a: Contact holding part

22: Floating part

22a: Air film

22b: Porous layer

23: positioning guide

23a: rail

3: Lifting drive

4: move in components

41: move in noodles

41a: Lifting part for moving in

41b: Air film

42: Drive unit for moving in

43: Floating transport department

44: transport guide

5: Move out the components

51: move out

52: Drive unit for moving out

6: Chamber

6a: Decompression drive unit

61: entrance and exit

61a: Move into the channel

62: Driving part for opening and closing

63: cover wall

64: bottom wall

7: Control Department

S1: Fitting space

S2: External space

W1: Upper workpiece

W2: Lower workpiece

W: bonded device

Fig. 1 is an explanatory diagram showing the overall structure of a manufacturing apparatus for a bonded device according to an embodiment of the present invention. Fig. 1(a) is a longitudinal sectional front view when the upper workpiece is loaded in, and Fig. 1(b) is a view when the upper workpiece is transferred Front view in longitudinal section.

Fig. 2 is an explanatory diagram showing the overall structure of the manufacturing apparatus of the bonded device according to the embodiment of the present invention. Fig. 2(a) is a longitudinal sectional front view when the lower workpiece is loaded in, and Fig. 2(b) is a longitudinal view when the lower workpiece is loaded. Sectional front view.

Fig. 3 is an explanatory view showing the overall structure of the manufacturing apparatus of the bonded device according to the embodiment of the present invention, Fig. 3(a) is a longitudinal sectional front view after bonding, and Fig. 3(b) is when the bonded device is carried out Front view in longitudinal section.

Fig. 4 is an explanatory view showing the overall structure of the manufacturing apparatus of the bonded device according to the embodiment of the present invention, Fig. 4(a) is a cross-sectional plan view of Fig. 2(a), and Fig. 4(b) is Fig. 3(b) Cross-sectional top view.

Fig. 5 is an explanatory diagram showing a modification of the manufacturing apparatus of the bonded device according to the embodiment of the present invention. Fig. 5(a) is a longitudinal sectional front view when the upper workpiece is loaded in, and Fig. 5(b) is a view when the upper workpiece is transferred Front view in longitudinal section.

Fig. 6 is an explanatory diagram showing a modification of the manufacturing apparatus of the bonded device according to the embodiment of the present invention. Fig. 6(a) is a longitudinal sectional front view when the lower workpiece is loaded in, and Fig. 6(b) is a longitudinal view when the lower workpiece is loaded. Sectional front view.

Fig. 7 is an explanatory diagram showing a modification of the manufacturing apparatus of the bonded device according to the embodiment of the present invention, Fig. 7(a) is a longitudinal sectional front view after bonding, and Fig. 7(b) is a view when the bonded device is carried out Front view in longitudinal section.

Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

As shown in FIGS. 1 to 7, in the manufacturing apparatus A and manufacturing method of the bonded device W according to the embodiment of the present invention, the upper holding member 1 and the lower holding member 2 are arranged in the bonding space S1, and the upper workpiece W1 is held by the upper holding member 1 and the lower workpiece W2 is held by the lower holding member 2. After that, by moving either or both of the upper holding member 1 or the lower holding member 2 relative to each other, the upper workpiece W1 and the lower workpiece W2 overlap in an atmospheric or reduced pressure atmosphere, and are pasted with a predetermined gap合 (join).

Furthermore, in the bonding of the work, it is preferable to perform bonding of the upper work W1 and the lower work W2 after the relative alignment of the upper work W1 and the lower work W2 is completed. In the bonding of the work, it is preferable to bond the upper work W1 and the lower work W2 in a vacuum atmosphere in the bonding space S1 where the pressure can be adjusted.

In particular, in the bonding of the work in the bonding space S1, the upper work W1 and the lower work W2 are carried in to the bonding space S1, and they are individually transferred to the upper holding member 1 and the lower holding member 2 to be held relatively. good. In addition, the bonding device W whose bonding has been completed in the bonding space S1 is carried out from the bonding space S1, and then, by repeating the above-mentioned operation, it is preferable to continuously produce a plurality of bonding devices W.

At this time, the manufacturing apparatus A of the bonding device W of the embodiment of the present invention becomes a vacuum work bonding apparatus for manufacturing the bonding device W.

In detail, the manufacturing apparatus A of the bonding device W according to the embodiment of the present invention includes as main components: an upper holding member 1 arranged in the bonding space S1 and holding the upper workpiece W1; and a lower holding member 2 arranged on the pasting Combine space S1 and hold the lower workpiece W2; the lift drive 3 makes either or both of the upper holding member 1 or the lower holding member 2 The two move in a relatively close or separate manner to overlap the upper workpiece W1 and the lower workpiece W2.

In addition, it is equipped with: the member 4 is carried in, and at least the lower workpiece W2 is loaded into the bonding space S1; the member 5 is carried out, and the bonding device W after the bonding is carried out from the bonding space S1 to the external space S2; the chamber 6 , The bonding space S1 is formed; and the control unit 7, and it is preferable to individually control the operation of the upper holding member 1, the lower holding member 2, the up-and-down driving unit 3, the carry-in member 4, and the carry-out member 5.

In addition, as shown in Figures 1 to 7, the upper workpiece W1 and the lower workpiece W2 are usually arranged to face each other in the vertical direction. The direction in which the upper workpiece W1 and the lower workpiece W2 overlap, that is, the workpiece bonding direction is called "Z direction". The direction along the bonding surfaces of the upper workpiece W1 and the lower workpiece W2 intersecting the Z direction is referred to as "XY direction".

The bonding device W is, for example, a thin plate-shaped structure in which a plurality of constituent components such as an FPD or a sensor device are assembled together.

As a specific example of the bonding device W, in the case of the examples shown in FIGS. 1 to 7, the upper workpiece W1 is a rectangular thin plate made of LCM, FPC, or the like. The lower workpiece W2 is a rectangular thin plate composed of a touch panel, a cover glass, or a cover film thinner than the upper workpiece W1, and is bonded to cover the upper workpiece W1 to form an FPD or a sensor device.

It is preferable to apply a sealing material (not shown) to either or both of the bonding surfaces composed of the film surface and the like on the upper workpiece W1 and the lower workpiece W2 by a quantitative discharge nozzle such as a dispenser. As the sealing material, it is preferable to use a photocurable adhesive such as a UV curable optically transparent resin (OCR) that is cured by absorbing light energy such as ultraviolet rays and superimposed to express adhesiveness.

The space surrounded by the sealing material is filled with a sealing material (not shown) such as liquid crystal.

In addition, although not shown in the figure as another example, it can be modified as follows, that is, bonding the upper workpiece W1 thinner than the lower workpiece W2, or using a thermosetting adhesive that is superimposed and cured by the absorption of thermal energy, or Two-component mixed-curing adhesive, etc., as the aforementioned sealing material to replace the light-curing adhesive, or without including the aforementioned sealing material or the aforementioned sealing material. Fit the work pieces together.

The upper holding member 1 and the lower holding member 2 are, for example, formed of flat plate-like flat plates having a thickness that is not subject to stress (bending) deformation due to steel bodies such as metals or ceramics, and have opposing sides in the Z direction. These upper chuck surface 11 and smooth lower chuck surface 21.

The upper holding member 1 and the lower holding member 2 are provided so that the upper chuck surface 11 and the lower chuck surface 21 are parallel to each other in the bonding space S1.

The upper chuck surface 11 of the upper holding member 1 has a holding portion 11a, and the upper workpiece W1 carried in by the carrying-in member 4 described later is held in the holding portion 11a so as to be detachable and immovable.

As the holding part 11a of the upper chuck surface 11, the adsorption force by negative pressure suction, the adhesion force by the adhesive material, the electrostatic adsorption force, or a combination of these etc. are used. The configuration is such that by arranging these in a planar shape covering substantially the entire upper chuck surface 11 or individually distributing a plurality of them on the entire upper chuck surface 11, even if the bonding space S1 is reduced to a vacuum, the upper workpiece W1 may not be dropped. Fall and continue to maintain.

In addition to the upper chuck surface 11, the upper holding member 1 also has a transfer mechanism 12 for holding the upper workpiece W1 carried in by the loading member 4 described later and transferring it from the lower chuck surface 21 to the upper chuck surface 11 described later. Better. The delivery mechanism 12 is composed of a lift pin or other structure, and has a delivery drive unit 12a for approaching and holding an upper workpiece W1 carried in by a carry-in member 4 described later, and delivering it to the upper chuck surface 11.

As a specific example of the transfer mechanism 12, in the case of the examples shown in Figs. 1 to 3, a lift pin 12b that can move freely in the Z direction is used. As shown in Fig. 1(b), at the tip of the descending lift pin 12b The non-bonding surface (upper surface) of the upper workpiece W1 is adsorbed and held freely by the surface. After that, as shown in FIG. 2( a ), the lift pin 12 b is raised by the actuation of the transfer driving portion 12 a, and the non-bonding surface of the upper workpiece W1 is brought into contact with the upper chuck surface 11. At the same time, it is switched to the workpiece holding by the holding portion 11a, and the upper workpiece W1 can be delivered.

In the case of the example in the figure, the lift pins 12b are arranged in plural at predetermined intervals along the XY direction However, these ends are integrated by the connecting member 12c, and all the lift pins 12b are configured to be reciprocally movable in the Z direction via the connecting member 12c by the transfer driving portion 12a.

In addition, as another example, the transfer mechanism 12 may be changed to another structure instead of the lift pin 12b.

The smooth lower chuck surface 21 of the lower holding member 2 has a raised portion 22, and the lower workpiece W2 is carried in by the carrying-in member 4 described later to be supported so as to be movable so as to float from the lower chuck surface 21 in a non-contact manner. ; And the contact holding portion 21a, which is in contact with the lower chuck surface 21 and is held to be detachable and immovable.

The floating portion 22 of the lower chuck surface 21 uses gas ejection force, ultrasonic force, or the like. The floating portion 22 is configured such that in the opposing space between the lower chuck surface 21 and the non-bonding surface of the lower workpiece W2, the separation pressure from the lower chuck surface 21 side to the lower workpiece W2 side and the separation pressure and Contrary to this, the approach pressure from the lower workpiece W2 side to the lower chuck surface 21 side. That is, the floating portion 22 has a mechanism for generating separation pressure and approach pressure, and by maintaining the balance of the aforementioned separation pressure and the aforementioned proximity pressure, an air film 22a is formed in the Z direction between the lower chuck surface 21 and the lower workpiece W2. The non-contact state in which the lower workpiece W2 floats from the lower chuck surface 21 is maintained.

As a specific example of the floating portion 22, in the case of the examples shown in FIGS. 1 to 7, a plate-shaped porous layer 22b made of a porous material is laminated and formed on the surface of the lower chuck surface 21. The aforementioned separation pressure is generated by ejecting gas from the entire porous layer 22b to the lower workpiece W2, and the aforementioned separation pressure is generated by negative pressure suction from a plurality of tiny suction holes (not shown) opened in the porous layer 22b. Close to pressure.

The contact holding portion 21a uses an attraction force based on negative pressure suction, an electrostatic attraction force, a combination of these, or the like. The contact holding portion 21a is provided with a mechanism for adjusting the balance of the aforementioned separation pressure and the aforementioned proximity pressure by the floating portion 22. In detail, the contact holding portion 21a adjusts the balance of the aforementioned separation pressure and the aforementioned proximity pressure based on the floating portion 22 by the control portion 7 described later, and is actuated and controlled so that the aforementioned proximity pressure gradually increases compared to the aforementioned separation pressure. system. Thereby, the thickness of the air film 22a gradually becomes thinner, the non-bonding surface of the lower workpiece W2 smoothly reaches the surface of the lower chuck surface 21, and the lower workpiece W2 is held immovable by the aforementioned proximity pressure contact.

As a specific example of the contact holding portion 21a, in the case of the example shown in FIGS. 1 to 7, the flow rate of the gas ejected from the entire porous layer 22b to the lower workpiece W2 is gradually reduced to suppress the separation pressure while maintaining or The negative pressure suction from the plurality of tiny suction holes opened in the porous layer 22b is increased.

In addition, although not shown in the figure as another example, it may be modified as follows. A plate-shaped ultrasonic probe is integrally laminated on the surface of the lower chuck surface 21 instead of the porous layer 22b, and the air on the surface of the ultrasonic probe is energized. The cyclical compression and decompression of the ultrasonic waves generate the aforementioned separation pressure, and at the same time, the aforementioned proximity pressure is generated by negative pressure suction from a plurality of tiny suction holes opened in the ultrasonic probe.

Furthermore, any one of the upper holding member 1 or the lower holding member 2, or both the upper holding member 1 and the lower holding member 2 are supported movably in the Z direction, and the upper holding member 1 is moved by the lift drive unit 3 It moves relatively close to or away from the lower holding member 2.

The lift drive unit 3 is composed of an actuator and the like. The lift drive unit 3 is controlled by the control unit 7 described later to move either or both of the upper holding member 1 or the lower holding member 2 relatively close to each other in the Z direction to move the upper workpiece W1 It overlaps with the lower workpiece W2 via the aforementioned sealing material applied to one or both of these bonding surfaces.

As a specific example of the raising/lowering drive part 3, in the case of the example mentioned above in FIGS.

In addition, although not shown in the figure as another example, it may be modified as follows. That is, the lower holding member 2 is raised instead of the upper holding member 1, or the upper holding member 1 and the lower holding member 2 are mutually Move closer, or rotate the upper holding member 1 and It is reversed to face the lower holding member 2 in the Z direction, and then either or both of the upper holding member 1 or the lower holding member 2 are relatively moved closer to the Z direction.

The carry-in member 4 is a workpiece carrying mechanism for carrying in the upper workpiece W1 and the lower workpiece W2 from the external space S2 to the bonding space S1.

As the carry-in member 4, there is a floating transport method in which the upper workpiece W1 and the lower workpiece W2 are transported without contact by floating from its smooth carry-in surface 41, and the upper workpiece W1 and the lower workpiece W1 and the lower workpiece are transported by a transport robot (not shown). The robot conveying method of the side workpiece W2, the conveyor conveying method of conveying the upper workpiece W1 and the lower workpiece W2 by a conveyor (not shown), and the like. These floating conveyance methods, robot conveyance methods, or conveyor belt conveyance methods, etc., have a drive for moving in from the external space S2 to the bonding space S1 to move the loading surface 41 or the aforementioned transport robot or the aforementioned conveyor in a manner of approaching or separating.部42.

In particular, when the carry-in member 4 is a floating transport method, it is preferable to have a smooth carry-in surface 41 and a floating transport portion 43 that is transported in a non-contact state in which the upper workpiece W1 and the lower workpiece W2 float from the carry-in surface 41.

The driving portion 42 for carrying in of the carrying member 4 is constituted by an actuator or the like. The drive unit 42 for carrying in is controlled by the control unit 7 described later to move the upper workpiece W1 and the lower workpiece W2 to the lower holding member 2 such as the carrying surface 41 or the transport robot or the conveyor. The side chuck surface 21 moves close to the X direction, the Y direction, or the like. After the upper workpiece W1 and the lower workpiece W2 are carried in, the carry-in surface 41, the transport robot, the conveyor, and the like are moved separately from the lower chuck surface 21 of the lower holding member 2 in the X direction or the Y direction.

In addition, in the carry-in member 4 of the floating conveyance method, the smooth carry-in surface 41 is supported so as to be freely movable in the X direction or the Y direction intersecting the Z direction, and has the upper workpiece W1 and the lower workpiece W2 to be moved from The surface 41 is supported in a non-contact manner in which the surface 41 is lifted as a lifting portion 41a for carrying in that can move.

The lifting portion 41a for loading uses gas ejection force or ultrasonic force, etc., in the opposing space between the loading surface 41 and the non-bonding surface of the lower workpiece W2. The separation pressure from the surface 41 side to the lower workpiece W2 side and the approach pressure from the lower workpiece W2 side to the carrying-in surface 41 side on the contrary. By maintaining the balance of these separation pressures and approach pressures, an air film 41b is formed in the Z direction between the carrying-in surface 41 and the lower workpiece W2, and the state of the lower workpiece W2 floating from the carrying-in surface 41 is maintained.

There are "Bernoulli type" and "porous type" as the lifting part 41a for carrying in using the gas ejection force.

In the "Bernoulli type", the upper workpiece W1 and the lower workpiece W2 are held in non-contact with the pressure difference between the negative pressure air film 41b and the atmospheric atmosphere. To explain in detail, in the "Bernoulli type", the negative pressure air film 41b formed by blowing gas from the carrying surface 41 side to the lower workpiece W2 side and the pressure difference between the atmospheric atmosphere pull the lower workpiece W2 to Move into the 41 side. Following this, if the interval of the negative pressure air film 41b becomes narrow and the pressure rises sharply, the lower workpiece W2 is pushed away, and the pressure of the air film 41b is kept balanced. Therefore, a large amount of gas needs to be ejected during non-contact holding.

In the "porous type", by blowing gas from the entire porous layer to the lower workpiece W2, the aforementioned separation pressure is generated, and at the same time, vacuum suction is performed from a plurality of suction holes (not shown) opened in the porous layer And the aforementioned proximity pressure is generated.

Therefore, as a specific example of the lift-in portion 41a for loading, as shown in FIGS. 1 to 7, compared with the aforementioned "Bernoulli type", the instantaneous discharge flow rate of gas can be used at least between the upper workpiece W1 and the lower workpiece W2. An air film 41b is formed therebetween, and the aforementioned "porous type" that can float the upper workpiece W1 and the lower workpiece W2 from the carrying-in surface 41 is preferable.

In the carry-in member 4 of the floating transport method, the floating transport section 43 has an operation to hold the upper work W1 and the lower work W2 that are supported in a non-contact manner by floating from the loading surface 41 by the floating section 41a for loading. Institutions (not shown), etc.

The operating mechanism uses an actuator or the like, and is configured to be supported movably in the XY direction of the carry-in surface 41.

Moreover, the operating mechanism has an overall gripping of the upper work W1 and the lower work The workpiece W2 or a chuck part (not shown) that partially grips the ends of the upper workpiece W1 and the lower workpiece W2. The operating mechanism is configured to move in the X direction, the Y direction, or the like in a floating (floating) state from the carrying-in surface 41 and to be transferred to the lower chuck surface 21 of the lower holding member 2.

As a specific example of the carry-in member 4, in the case of the examples shown in FIGS. 1 to 7, the carry-in drive section 42 moves the carry-in surface 41 toward the lower chuck surface 21 of the lower holding member 2 in the X direction. . The upper work piece W1 and the lower work piece W2 are sequentially floated and conveyed in the X direction by the floating conveyance part 43, and are conveyed into the lower chuck surface 21 of the lower holding member 2.

In addition, although not shown as another example, it is also possible to change the direction of movement of the loading surface 41 of the loading drive 42 and the loading direction of the upper workpiece W1 and the lower workpiece W2 to the X direction. In other directions, or without lifting the upper workpiece W1 and the lower workpiece W2 from the loading surface 41, use the loading member 4 to carry it into the bonding space S1, or use the aforementioned transport robot or the aforementioned conveyor as the loading member 4 instead Floating transport method.

The carrying-out member 5 is a conveyance mechanism for a workpiece|work which carries out the bonding device W after bonding from the bonding space S1 to the external space S2.

As the carry-out member 5, similar to the carry-in member 4, there are a floating transport method that transports the bonding device W without contact by floating from the carry-out surface 51, and a robot that uses a transport robot (not shown) to transport the bonding device W A conveying method, a conveyor belt conveying method in which the bonding device W is conveyed by a conveyor (not shown), etc. These floating conveyance systems, robot conveyance systems, conveyor belt conveyance systems, and the like have a driving unit 52 for carrying out that moves the carrying out surface 51 or the carrying robot to approach or separate from the external space S2 to the bonding space S1.

In particular, when the carry-out member 5 is a floating transport method, it is preferable to have a smooth carry-out surface 51 and a carry-out floating transport unit 53 that transports the bonding device W so as to float from the carry-out surface 51 in a non-contact manner.

The driving part 52 for carrying out of the carrying out member 5 is comprised by an actuator etc. The drive unit 52 for carrying out is controlled by the control unit 7 to be described later as follows: the upper workpiece W1 and the lower workpiece After bonding of W2, the unloading surface 51, the transport robot, the conveyor, or the like is moved closer to the lower chuck surface 21 of the lower holding member 2 in the X direction, the Y direction, or the like. After the bonding device W is carried out, the carry-out surface 51, the transport robot, the conveyor, and the like are separated and moved from the lower chuck surface 21 of the lower holding member 2 in the X direction, the Y direction, or the like.

As a specific example of the unloading member 5, in the case of the examples shown in FIGS. 1 to 7, the unloading surface 51 is moved from the outer space S2 to the lower chuck surface 21 of the lower holding member 2 by the unloading drive unit 52 Approaching movement in X direction. The bonding device W is lifted and conveyed from the lower chuck surface 21 of the lower holding member 2 by the lift-out conveyance part 53, and is conveyed out in line with the conveying direction toward the conveying surface 51.

In addition, although not shown in the figure as another example, it is also possible to change the movement direction of the unloading surface 51 based on the unloading drive unit 52 and the unloading direction of the bonding device W to directions other than the X direction, or The workpiece carrying direction of the carry-in member 4 and the workpiece carry-out direction based on the carry-out member 5 are bent at a predetermined angle in the XYθ direction, or the carry-in member 4 and the carry-out member 5 are integrated and carried out in the opposite direction of the workpiece carry-in direction, or changed to not use The bonding device W floats from the carry-out surface 51 and is carried out by the carry-out member 5, or uses the aforementioned transport robot or the aforementioned conveyor as the carry-out member 5 instead of the floating transport method.

In addition, the bonding space S1 is formed inside the variable pressure chamber 6, and the outer space S2 is divided by the wall of the chamber 6, and the bonding space S1 in the chamber 6 is equipped with an upper holding member 1 and a lower holding member 2 is better.

The chamber 6 has an entrance 61 through which the upper workpiece W1 and the lower workpiece W2 are passed by the carry-in member 4 and the carry-out member 5; a driving part 62 for opening and closing, an opening and closing entrance 61; and a driving part 6a for pressure reduction, which is used for The bonding space S1 is configured by a compressor or the like that reduces pressure.

In addition, either or both of the upper holding member 1 or the lower holding member 2 are provided with a position detection unit (not shown) such as a camera that detects marks or corners marked on the upper workpiece W1 and the lower workpiece W2 in advance. ), and an alignment drive unit (not shown) that moves either the upper holding member 1 or the lower holding member 2 relative to the other in the XYθ direction. The positioning drive unit is actuated according to the output by the position extraction unit, and the upper holding member 1 and the lower holding member 2 are relatively moved in the XYθ direction, so that the upper workpiece W1 and the lower workpiece W2 are aligned in the XYθ direction .

To explain in detail, in an atmospheric atmosphere, the upper workpiece W1 and the lower workpiece W2 are individually loaded from the external space S2 to the bonding space S1 in the chamber 6 by the loading member 4, and performed in the pressure-reduced bonding space S1 While overlapping the upper workpiece W1 and the lower workpiece W2, alignment in the XYθ direction is performed. After that, under the atmosphere, the bonding device W where the bonding of the upper work W1 and the lower work W2 has been completed is carried out from the bonding space S1 to the external space S2 by the unloading member 5.

As a specific example of the chamber 6, in the case of the example shown in Figs. 1 to 7, the cover wall 63 provided with the upper holding member 1 in the chamber 6 is configured to be opposite to the bottom provided with the lower holding member 2. The wall 64 can be divided in the Z direction. By reciprocating so as to relatively approach or separate in the Z direction, the bonding space S1 is configured to be freely opened and closed and becomes a sealed structure. When the cover wall 63 of the chamber 6 is separated from the bottom wall 64 in the Z direction by the opening/closing drive portion 62, the carrying-in passage 61a and the carrying-out passage 61b are opened as the entrance and exit 61, and the upper holding member 1 and the lower holding member 2 Relatively separate and move.

Therefore, it is also possible to configure the opening/closing drive section 62 and the elevation drive section 3 of the chamber 6 with one drive source.

In addition, the lower holding member 2 is movably supported in the XYθ direction with respect to the bottom wall 64 of the chamber 6, and the lower workpiece W2 is held by the lower holding member 2 through the actuation of the aforementioned positioning drive unit. The upper workpiece W1 of the upper holding member 1 is aligned in the XYθ direction.

In addition, although not shown in the figure as another example, it is also possible to change it by reversing any one of the chambers 6 divided in the Z direction toward the other so as to be freely opened and closed and have a sealed structure, or A door that can be opened and closed is provided in a part of the chamber 6, and the bonding space S1 is configured so that it can be opened and closed freely and has a sealed structure, instead of the split type of the chamber 6, Or the opening/closing driving part 62 and the raising and lowering driving part 3 of the chamber 6 are formed by different driving sources, or the upper workpiece W1 of the upper holding member 1 and the lower workpiece W2 of the lower holding member 2 are aligned in the XYθ direction.

The control part 7 is the holding part 11a of the upper holding member 1, the transfer driving part 12a of the transfer mechanism 12, the floating part 22 of the lower holding member 2, the lifting driving part 3, the driving part 42 for carrying in of the carrying member 4 and The floating conveying part 43, the driving part 52 for carrying out of the carrying-out member 5, and the floating carrying part 53 for carrying out are individually electrically connected to the controller. In addition, the control unit 7 also interacts with the drive unit 62 for opening and closing of the chamber 6 and the drive unit for transformation, and the drive unit for positioning for relatively moving the upper workpiece W1 and the lower workpiece W2 in the XYθ direction. The curing mechanism for curing the sealing material is electrically connected.

The controller serving as the control unit 7 sequentially and individually performs operation control at a preset time point in accordance with a program preset in its control circuit (not shown).

In detail, for example, as shown in Fig. 1(a) or Fig. 5(a), the control unit 7 performs actuation control as follows: the entrance and exit 61 (carry-in passage 61a) of the chamber 6 are opened and closed by the drive unit 62 (lift drive unit) 3) Perform an opening operation to make the bonding space S1 in the chamber 6 into an atmospheric atmosphere.

In this state, the control unit 7 performs operation control as follows. The loading drive unit 42 of the loading member 4 brings the loading surface 41 or the transfer robot close to the lower chuck surface 21 of the lower holding member 2 by floating The conveyance part 43, the conveyance robot, etc. carry in the upper workpiece W1 toward the lower chuck surface 21 in an atmospheric atmosphere through the entrance 61 (carry-in passage 61a).

After that, as shown in Fig. 1(b) or Fig. 5(b), the control unit 7 performs operation control as follows: the upper workpiece W1 is transferred to the upper card of the upper holding member 1 by the transfer drive 12a of the transfer mechanism 12 The disk surface 11 is held immovably by the holding portion 11a.

Next, as shown in Fig. 2(a) or Fig. 6(a), the control unit 7 performs operation control by lifting the conveying unit 43 or the conveying robot to make the lower workpiece W2 from the outer space using the conveying guide 44 S2 carries in the lower chuck surface 21 under the atmosphere through the entrance 61 (carry-in passage 61a) while restricting the position.

At this time, even if the upper workpiece W1 and the lower workpiece W2 are carried into the lower chuck surface 21 of the lower holding member 2 by either the floating conveying part 43 or the conveying robot, the operation control is performed as follows, that is, the upper workpiece W1 and the lower workpiece W2 are firstly supported to be movable by the floating portion 22 so as to float from the smooth lower chuck surface 21 in a non-contact manner.

Next, the operation control is performed such that the floating portion 22 is switched to the contact holding portion 21a, and the lower workpiece W2 is in contact with the lower chuck surface 21 and held immovably.

After that, as shown in Fig. 2(b) or Fig. 6(b), the control unit 7 performs the operation control as follows, and the entrance and exit 61 (carry-in passage 61a) of the chamber 6 is performed by the drive unit 62 for opening and closing (the lifting drive unit 3) The closing operation starts the pressure reduction of the bonding space S1 in the chamber 6 by the pressure reduction drive unit 6a.

At about the same time, the upper holding member 1 and the lower holding member 2 are moved closer to each other by the lift drive unit 3. At this point in time, the control is performed as follows: the upper holding member 1 or the lower holding member 2 is adjusted and moved in XYθ relative to the other by the aforementioned positioning drive unit, and the upper workpiece W1 and the lower workpiece W2 are performed. Alignment (alignment).

After the alignment is completed, the control unit 7 controls as follows: the upper chuck surface 11 of the upper holding member 1 and the lower chuck surface 21 of the lower holding member 2 are moved closer and held on the upper chuck surface by the lift drive 3 The upper workpiece W1 of 11 and the lower workpiece W2 held in contact with the lower chuck surface 21 overlap each other in the Z direction via the sealing material and the sealing material.

At the end of the aforementioned positioning, control is performed as follows, that is, the bonding space S1 is decompressed to a vacuum or a decompression atmosphere close to a vacuum by the decompression drive unit 6a, and the upper workpiece W1 and the lower workpiece W2 are directed in a vacuum atmosphere The Z direction overlaps.

Next, as shown in Fig. 3(a) or Fig. 7(a), the control unit 7 performs the operation control as follows, and the entrance and exit 61 (carrying out path 61b) of the chamber 6 is performed by the driving unit 62 for opening and closing (the lifting driving unit 3) The opening operation causes the bonding space S1 in the chamber 6 to communicate with the outside air space S2 to become an atmospheric atmosphere.

Therefore, the upper workpiece W1 and the lower workpiece W2 are squashed into a predetermined gap by atmospheric pressure It becomes the bonding device W.

After that, as shown in Fig. 3(b) or Fig. 7(b), the control unit 7 makes the unloading surface 51 or the conveying robot approach the lower chuck surface of the lower holding member 2 by the unloading drive 52 of the unloading member 5 twenty one. Thereafter, the operation control is performed to carry out the bonding device W from the lower chuck surface 21 to the external space S2 through the entrance 61 (carrying out path 61b) by the carrying-out floating transport unit 53 or the transport robot.

Furthermore, the program of the control circuit set in the control unit 7 will be described as a method of manufacturing the bonded device W.

The manufacturing method of the bonding device W of the embodiment of the present invention includes, as a main step, a holding step of holding the upper workpiece W1 on the upper chuck surface 11 of the upper holding member 1 and holding the lower workpiece W2 on the smoothness of the lower holding member 2 The lower chuck surface 21; and the joining step, by moving either or both of the upper holding member 1 or the lower holding member 2 relatively close to each other, the upper workpiece W1 and the lower workpiece W2 are overlapped.

In addition, as a previous step of the holding step, a loading step is included, from the external space S2 to the upper chuck surface 11 of the upper holding member 1 arranged in the bonding space S1, using the loading member 4 to load the upper workpiece W1 into The smooth lower chuck surface 21 of the lower holding member 2 of the combined space S1 is preferably carried in the lower workpiece W2 by the carry-in member 4.

Furthermore, in the holding step, with respect to the lower holding member 2, the lower workpiece W2 carried in by the carrying-in member 4 into the bonding space S1 is supported by the floating portion 22 so as to float from the lower chuck surface 21 in a non-contact manner. Then, before the pressure reduction of the bonding space S1 by the pressure reducing drive unit 6a is completed, the lower workpiece W2 is contacted and held on the lower chuck surface 21 by the contact holding portion 21a.

In the joining step, either the upper holding member 1 or the lower holding member 2 is relatively moved closer to the other in the Z direction by the lift drive 3, or both the upper holding member 1 and the lower holding member 2 Move closer to each other in the Z direction. Thereby, after the pressure reduction of the bonding space S1 by the pressure reduction drive portion 6a is completed, the upper workpiece W1 and the lower The side workpieces W2 overlap each other in the Z direction via the sealing material or the sealing material, or directly overlap the workpieces.

With the manufacturing apparatus A and manufacturing method of the bonded device W according to this embodiment of the present invention, even if the lower workpiece W2 has residual stress due to local expansion and contraction during loading by a transfer robot, it can be The floating portion 22 supports the lower workpiece W2 in a non-contact manner so as to float from the lower chuck surface 21. Thereby, the local stress of the lower workpiece W2 is released, and the lower workpiece W2 becomes a smooth state along the smooth lower chuck surface 21 of the lower holding member 2.

Then, the lower workpiece W2 in a smooth state is brought into contact with the lower chuck surface 21 by the contact holding portion 21a, and is held immovably.

After that, the lift drive unit 3 moves one or both of the upper holding member 1 or the lower holding member 2 relatively close to each other through the control unit 7. Thereby, the lower workpiece W2 in the smooth state and the upper workpiece W1 held by the upper chuck surface 11 by the holding portion 11a can be overlapped without positional deviation.

Therefore, the local stress remaining on the lower workpiece W2 can be removed and the upper workpiece W1 can be bonded in a smooth state.

As a result, compared with the conventional holder in which a plurality of through holes or grooves for lift pins are recessed in the surface of the lower substrate holder, the surface with the lower holding member 2 does not have through holes or grooves for lift pins, etc. The concave and smooth lower chuck surface 21 does not cause a part of the lower workpiece W2 to locally expand and contract due to its own weight and bend into an uneven shape. Thereby, the bonding accuracy of the upper workpiece W1 and the lower workpiece W2 can be improved. At the same time, even if it is an ultra-thin plate-like workpiece (substrate) with low rigidity, it can prevent the formation of bubbles on the bonding surface between the upper workpiece W1 and the lower workpiece W2, enabling uniform bonding without bubbles .

Furthermore, the arm or lower lift pin of the transport robot can transport the plate-shaped workpiece (substrate) without contacting the plate-shaped workpiece (substrate). Therefore, it is possible to prevent contact with the arm of the transport robot Or foreign matter such as foreign matter adhered to the lower lift pin, there is no unevenness with other parts, and very uniform bonding can be performed.

As a specific example, even if a G8-size glass substrate for liquid crystal with a thickness of 0.2 mm is bonded by a conventional alignment method, the alignment error of the upper workpiece W1 and the lower workpiece W2 can be improved to sub-micron accuracy, which can be realized Improved yield.

In particular, a loading member 4 for loading at least the lower workpiece W2 into the bonding space S1 is provided. The upper holding member 1 and the lower holding member 2 are provided inside the variable pressure chamber 6, and the chamber 6 has a passage through which the loading member 4 can pass. A freely opening and closing entrance 61 is preferable.

At this time, the entrance and exit 61 of the chamber 6 is opened in the atmosphere, and the lower workpiece W2 is carried into the lower chuck surface 21 of the lower holding member 2 by the carrying member 4. After that, in a state where the inlet and outlet 61 are closed and the chamber 6 is decompressed, by moving either or both of the upper holding member 1 or the lower holding member 2 relatively close to each other, under a reduced pressure atmosphere, The lower workpiece W2 in the smooth state overlaps the upper workpiece W1.

Therefore, it is possible to bond the lower workpiece W2 and the upper workpiece W1 in a smooth state from which residual local stresses have been removed under a vacuum atmosphere.

As a result, the lower workpiece W2 and the upper workpiece W1 are bonded under a vacuum or a reduced pressure atmosphere close to a vacuum, and therefore, it is possible to reliably prevent air from entering the overlapping surface of the upper workpiece W1 and the lower workpiece W2 from the bonding space S1. As a result, it is possible to prevent the occurrence of localized unevenness in the predetermined gap due to bubbles entering the overlapping surfaces of the upper workpiece W1 and the lower workpiece W2, and it is possible to produce a bonding device W of higher quality.

Furthermore, the carry-in member 4 has a floating transport part 43, and it is preferable to transport the lower workpiece W2 in a non-contact manner so as to float from the smooth carry-in surface 41 at least.

At this time, when at least the lower workpiece W2 is loaded into the lower holding member 2 by the loading member 4, the floating conveying portion 43 is used to lift the lower side from the smooth loading surface 41 of the loading member 4 without contact. Workpiece W2. As a result, no local stress is generated in a part of the lower workpiece W2, and the lower workpiece W2 is transferred to the lower holding member in a smooth floating (floating) state 2 The lower side of the chuck surface 21.

Therefore, the local stress remaining on the lower workpiece W2 can be further removed, and the upper workpiece W1 can be bonded in a smoother state.

As a result, compared with the conventional case where a part of the lower substrate is transferred under a state where local stress remains on a part of the lower substrate by vacuum suction by the arm of the transfer robot or the lift pins, the transfer robot or lift pins are not required, so there is virtually no unevenness. The lower workpiece W2 is conveyed in the state of. As a result, even if the lower workpiece W2 is held on the smooth lower chuck surface 21 of the lower holding member 2, no localized stress will remain at all. When the upper workpiece W1 and the lower workpiece W2 are bonded together, a bonding surface can be achieved Uniform and high precision fit inside.

In addition, it is difficult to transport glass or plastic films with a thickness of several tens of um by carrying in by a conventional transport robot, especially large and thin substrates such as G8 size. However, the lower workpiece W2 of the floating conveyance portion 4b can be loaded directly without using a conveying robot or lift pins, and thin substrates can be directly bonded to each other with high precision even without using auxiliary brackets or jigs.

[Example 1]

Next, embodiments of the present invention will be described based on the drawings.

As shown in Figure 1 (a), Figure 1 (b) ~ Figure 4 (a), Figure 4 (b), in the manufacturing apparatus A of the bonded device W of the embodiment 1 of the present invention, the loading member 4 adopts the aforementioned The floating conveying method in which the workpiece is lifted and conveyed, and the positioning guide for the workpiece is set, instead of the aforementioned robot conveying method based on the conveying robot.

In detail, the carry-in member 4 has a transport guide 44, which is in contact with the upper workpiece W1 and the lower workpiece W2 during the workpiece transport by the floating transport unit 43, and moves along the workpiece transport direction (X direction) by the floating transport unit 43. ) Position restriction in the cross direction (Y direction).

The transport guide 44 is preferably arranged in plural in the Y direction that intersects the X direction which is the workpiece transport direction by the floating transport section 43 at an interval substantially equivalent to the width dimension of the upper workpiece W1 and the lower workpiece W2.

When a plurality of transport guides 44 are arranged, when the workpiece is transported by the floating transport section 43, either or both of the transport guides 44 are directed in the direction (Y direction) intersecting the workpiece transport direction (X direction) ) It is better to move either one or both of the conveying guides 44 separately during the standby time other than the workpiece conveying.

In the examples shown in Figs. 1(a), 1(b) to 4(a), and 4(b), the conveyance guide 44 is a pair of guide rails. The ends of the upper workpiece W1 and the lower workpiece W2 that are transported in a state of being floated from the carry-in surface 41 by the floating transport portion 43 directly or indirectly contact the pair of transport guides 44 in a non-contact manner. As a result, the upper workpiece W1 and the lower workpiece W2 are guided to the fixed position of the lower chuck surface 21 of the lower holding member 2 without deviating their positions in the Y direction.

In the case of the example shown in the figure, the ends of the upper workpiece W1 and the lower workpiece W2 are brought into sliding contact with the inner surfaces of the pair of rails serving as the conveying guide 44 individually.

In addition, although not shown in the figure as another example, various changes can be made, that is, by arranging a rotating body such as a roller on the inner surface of the guide rail that becomes the conveying guide 44 to reduce the frictional resistance with the workpiece, or from one of the guide rails The inner side faces the workpiece and blows gas such as compressed air to push the workpiece against the inner side of the other rail, or as a conveying guide 44, a position limiter for positioning the workpiece in the X direction is attached.

The lower chuck surface 21 of the lower holding member 2 has contact with the upper workpiece W1 and the lower workpiece W2 carried in by the floating conveying portion 43 of the carrying member 4, and is in contact with the workpiece conveying direction (X direction) and the cross direction (Y direction) Positioning guide 23 for position restriction.

The positioning guide 23 is composed of a pair of guide rails 23a arranged in the Y direction, a position limiter 23b that positions the work in the X direction, and the like.

The pair of guide rails 23a individually approach and move in the cross direction (Y direction) of the workpiece conveying direction (X direction) when the workpieces of the loading member 4 are conveyed by the floating conveying portion 43, and individually move them in standby other than workpiece conveying. It is better to separate the movement, and to stand by at a position where it does not interfere with the movement of the upper holding member 1 by the lift drive unit 3.

Figure 1 (a), Figure 1 (b) ~ Figure 4 (a), Figure 4 (b) shown in the example, using the transport guide 44 The pair of guide rails 23a configured as the guide rails directly or indirectly respectively directly or indirectly contact the ends of the upper workpiece W1 and the lower workpiece W2 that are transported in a non-contact state while being floated from the carrying-in surface 41 by the floating transport portion 43. As a result, the upper workpiece W1 and the lower workpiece W2 are guided to the fixed position of the lower chuck surface 21 of the lower holding member 2 without deviating their positions in the Y direction.

The position limiter 23b is provided on the lower chuck surface 21 so as to protrude or sink, and is positioned by contact with the front end surface of the workpiece in the X direction.

According to the manufacturing apparatus A of the bonded device W of the embodiment 1 of the present invention, at least the lower workpiece W2 is lifted and conveyed from the carrying-in surface 41 of the carrying-in member 4 to the lower holding member 2 by the floating and transporting portion 43 At this time, it contacts the conveying guide 44 and the positioning guide 23 in sequence, and positioning is performed in a direction (Y direction) intersecting the workpiece conveying direction (X direction).

Therefore, the lower workpiece W2 can be accurately floated and transported to a predetermined position on the lower holding member 2.

As a result, there is an advantage that the bonding accuracy of the upper workpiece W1 and the lower workpiece W2 can be improved, and a higher-quality bonding device W can be produced.

In addition, in the manufacturing method of the bonded device W of the first embodiment of the present invention, as a post-step of the aforementioned bonding step, the bonding device W that has completed bonding of the upper workpiece W1 and the lower workpiece W2 is removed from the bonding device W using the unloading member 5 The unloading step of the bonding space S1 to the external space S2.

In the aforementioned unloading step, the lamination device W is moved from the lower chuck surface 21 of the lower holding member 2 toward the unloading surface 51 of the unloading member 5 to the outside space by the unloading floating transport portion 53 of the unloading member 5 S2 moved out.

Like the carry-in member 4, the carry-out surface 51 of the carry-out member 5 of the floating-conveyance method has a carry-out floating portion 51a that supports the bonding device W in a non-contact manner so as to float from the carry-out surface 51. The lifting portion 51a for carrying out uses gas ejection force or ultrasonic force, etc., and an air film 51b for carrying out is formed in the Z direction in the space between the carrying out surface 51 and the lower workpiece W2 of the bonding device W, and is configured to hold the paste The combined device W is in a floating state from the carrying-out surface 51.

According to the method of manufacturing the bonding device W of the embodiment 1 of the present invention, after the bonding of the upper workpiece W1 and the lower workpiece W2 in the bonding space S1 is completed, they are lifted from the carrying-out surface 51 of the carrying-out member 5 The state of floating and carrying out the bonding device W after bonding is completed.

Therefore, even if the lower workpiece W2 is a thin plate-like substrate such as a film, the upper workpiece W1 and the lower workpiece W2 that have been bonded will not locally expand and contract, and the relative positions of the two will deviate or stress will be generated. It is carried out in a state of accuracy at the time.

Therefore, the bonding device W to which the film-like lower workpiece W2 is bonded can be carried out while maintaining high positional accuracy.

As a result, it is possible to produce a bonding device W of higher quality than the conventional method of carrying out by a transport robot or a lift pin.

[Example 2]

As shown in Figure 5 (a), Figure 5 (b) ~ Figure 7 (a), Figure 7 (b), in the manufacturing apparatus A of the bonded device W of Example 2 of the present invention, as the upper holding member 1 The transfer mechanism 12 is configured to transfer the upper workpiece W1 to the upper chuck surface 11 by the relatively close movement of either or both of the upper holding member 1 or the lower holding member 2 as shown in FIGS. 1 to 4 Example 1 is different. The structure other than this is the same as that of Example 1 shown in FIGS. 1 to 4.

To explain in detail, in the second embodiment, as the transfer mechanism 12 of the upper holding member 1, instead of the lifting pin 12b shown in FIGS. 1 to 3, as shown in FIGS. 5(b) and 6(a), by lifting The driving portion 3 moves the upper holding member 1 and the lower holding member 2 relatively close to each other, and the upper workpiece is held in a non-contact manner by the floating portion 22 of the lower holding member 2 by floating from the lower chuck surface 21 W1 maintains a floating state and is transferred to the holding portion 11a of the upper chuck surface 11 in a planar shape.

Furthermore, the holding portion 11a of the upper chuck surface 11 serving as the transfer destination is configured to hold the upper workpiece W1 in a smooth surface shape along the upper chuck surface 11 by a combination of suction force based on negative pressure suction, adhesion force or electrostatic suction force It is better to maintain the structure instead of the locality of the lift pin 12b shown in Figs. 1 to 3.

The control unit 7 moves either the upper holding member 1 or the lower holding member 2 closer to the other by the up-and-down drive unit 3 when the upper workpiece W1 is transferred as shown in FIG. 5(b). Thereby, the holding portion 11a of the upper chuck surface 11 is in surface contact with the non-bonding surface of the upper workpiece W1 raised from the lower chuck surface 21 by the lifting portion 22, and the operation is controlled.

After the upper chuck surface 11 of the upper holding member 1 is in surface contact with the upper workpiece W1, it is switched to workpiece holding by the holding portion 11a, and the upper workpiece W1 can be delivered.

Next, as shown by the two-dot chain line in Fig. 5(b) and Fig. 6(a), the lift drive section 3 separates and moves either the upper holding member 1 or the lower holding member 2 from the other. This can carry in the subsequent lower workpiece W2.

In the examples shown in FIGS. 5(a), 5(b) to 7(a), and 7(b), the opening/closing drive portion 62 and the elevation drive portion 3 of the chamber 6 are constituted by one drive source. The cover wall 63 of the chamber 6 is moved closer to the bottom wall 64 by the opening/closing drive portion 62, and the entrance 61 (carry-in passage 61a) is closed. At the same time, the upper chuck surface 11 is moved by the lifting drive portion 3 The holding portion 11a of the upper side is in contact with the non-bonding surface of the upper workpiece W1 to hold it. Thereby, the upper workpiece W1 is transferred to the holding portion 11a of the upper chuck surface 11 in a state of floating from the lower chuck surface 21.

Also, although not shown as another example, the opening and closing drive section 62 and the elevation drive section 3 of the chamber 6 may be constituted by independent drive sources, and the entrance and exit 61 of the chamber 6 based on the opening and closing drive section 62 Regardless of the closing operation of the (carry-in path 61a), the upper holding member 1 is moved close to the non-adhesive surface of the upper workpiece W1 floating from the lower chuck surface 21 and the holding portion 11a of the upper chuck surface 11 by the lift drive unit 3 The location of surface contact.

According to the manufacturing apparatus A and manufacturing method of the bonded device W of Example 2 of the present invention, the upper side held by the lower chuck surface 21 is floated (floated) by the raised portion 22 of the lower holding member 2 The workpiece W1 is transferred to the upper chuck surface 11 of the upper holding member 1 in a planar shape while maintaining the floating state.

Therefore, it is possible to transfer the upper workpiece W1 to the upper chuck surface 11 of the upper holding member 1 without local stress at all.

As a result, there is an advantage that the bonding accuracy of the upper workpiece W1 and the lower workpiece W2 can be improved, and a higher-quality bonding device W can be produced.

Moreover, as the transfer mechanism 12 of the upper holding member 1, it has the following advantages, as shown in FIGS. 1 to 3, by penetrating the cover wall 63 of the chamber 6, and using the lift pin 12b that can move freely in the Z direction. Compared with Example 1, there is no need to provide a sealing member such as an O-ring between the cover wall 63 of the chamber 6 and the lift pin 12b, and the structure of the transfer mechanism 12 and the chamber 6 can be simplified.

In addition, in the aforementioned embodiment, the upper workpiece W1 carried in (floating and transported) by the carry-in member 4 is transferred to the upper chuck surface 11 of the upper holding member 1 by the transfer mechanism 12, and is held immovably by the holding portion 11a. However, it is not limited to this, and the transfer mechanism 12 and the holding portion 11a in the upper holding member 1 may be changed to the aforementioned floating portion and contact holding portion.

At this time, the upper holding member 1 has a lifting part having a mechanism for generating separation pressure and an approach pressure in the opposite direction between the upper workpiece W1 and a contact holding part having a mechanism for adjusting the separation pressure and approach pressure.

Thereby, even if stress caused by local expansion and contraction remains on the upper workpiece W1 due to the loading member 4 and the like, the upper workpiece W1 is supported by the floating portion so as to float from the upper chuck surface 11 in a non-contact manner. Therefore, the local stress of the upper workpiece W1 is released, and the upper workpiece W1 becomes a smooth state along the smooth upper chuck surface 11 of the upper holding member 1. Next, the upper workpiece W1 in a smooth state is brought into contact with the upper chuck surface 11 by the contact holding portion, and is held immovably. Therefore, the local stress remaining on the upper workpiece W1 can be removed, and the upper chuck surface 11 can be held in a smooth state.

In addition, in the foregoing embodiment, as the carry-in member 4 and the carry-out member 5, a floating transport method of floating and transporting the workpiece is adopted, but it is not limited to this, and the carried-in member 4 or the carry-out member 5 One or both of them are changed to the robot conveying method or the conveyor belt conveying method.

A: Manufacturing equipment for bonded devices

1: Upper holding member

2: Lower holding member

3: Lifting drive

4: move in components

5: Move out the components

6: Chamber

6a: Decompression drive unit

7: Control Department

11: Upper chuck surface

11a: Holding part

12: Handover Organization

12a: Drive unit for handover

12b: Lift pin

12c: connecting member

21: Lower chuck surface

21a: Contact holding part

22: Floating part

22a: Air film

22b: Porous layer

23: positioning guide

23a: rail

41: move in noodles

41a: Lifting part for moving in

41b: Air film

42: Drive unit for moving in

43: Floating transport department

44: transport guide

51: move out

52: Drive unit for moving out

61: entrance and exit

61a: Move into the channel

62: Driving part for opening and closing

63: cover wall

64: bottom wall

S1: Fitting space

S2: External space

W1: Upper workpiece

W2: Lower workpiece

W: bonded device

Claims (6)

A manufacturing apparatus for a bonding device, characterized in that it is connected to a bonding space to hold an upper workpiece on an upper holding member and a lower workpiece on a lower holding member, by means of the upper holding member and the lower holding member The upper workpiece and the lower workpiece are attached to each other by the relative approaching movement, and the upper holding member is arranged in the attachment space and has an upper chuck surface for detachably holding the upper workpiece ; The lower holding member, which is arranged in the bonding space, and has a smooth lower chuck surface for detachably holding the lower workpiece; a lift drive section that enables the upper holding member or the lower holding member Either one or both of them move relatively close to overlap the upper workpiece and the lower workpiece; and a control unit that respectively controls the upper chuck surface, the lower chuck surface, and the lift drive unit; and The upper holding member has a holding portion that holds the upper workpiece so that it cannot move, and the lower chuck surface of the lower holding member has: a raised portion provided with an opposite direction between it and the lower workpiece A mechanism for separating pressure and approaching pressure; and a contact holding portion provided with a mechanism for adjusting the separation pressure and the approaching pressure; the floating portion has a porous layer made of a porous material, and the separation is generated by blowing gas from the porous layer Pressure, and use the suction from the porous layer to generate the approach pressure; the control section controls in such a way that the lower workpiece is relative to the lower holding member to cause the separation pressure of the floating section and the Close to The pressure is balanced, and the lower workpiece is supported in a non-contact manner such that the lower workpiece is lifted from the lower chuck surface, and the lifting part is switched to the contact holding part, and the approach pressure is gradually increased compared to the separation pressure. The lower workpiece is held in contact with the lower chuck surface, and either or both of the upper holding member or the lower holding member is moved relatively close to each other by the lift drive portion, and the holding portion is held in The upper workpiece on the upper chuck surface overlaps the lower workpiece. For example, the manufacturing apparatus of the bonding device of claim 1, which includes a carry-in member that carries at least the lower workpiece into the bonding space, and the upper holding member and the lower holding member are equipped with variable pressure Inside the chamber, the chamber has a freely openable and closable entrance for the passage of the carrying member. The manufacturing apparatus of a bonded device according to claim 2, wherein the carry-in member has a floating and conveying portion, and the floating and conveying portion is transported in a non-contact manner such that at least the lower workpiece floats from its smooth carrying surface. The manufacturing apparatus of the bonded device of claim 3, wherein the loading member has a conveying guide, and the conveying guide is in contact with at least the lower workpiece during the process of conveying the workpiece by the floating and conveying part, The position is restricted in the direction intersecting the direction in which the workpiece is conveyed by the floating and conveying part; the lower chuck surface of the lower holding member has a positioning guide which is connected to at least the lower workpiece carried in by the carrying member Connect, and restrict the position in the workpiece conveying direction and the crossing direction. A method of manufacturing a laminating device, characterized in that it holds an upper workpiece on an upper holding member and a lower workpiece on a lower holding member in a laminating space, by a combination of the upper holding member and the lower holding member A relatively close movement to attach the upper workpiece to the lower workpiece, and includes: a holding step of holding the upper workpiece on the upper holding member The upper chuck surface, which holds the lower workpiece on the smooth lower chuck surface of the lower holding member; and the joining step, which is performed by either or both of the upper holding member or the lower holding member The relative approaching movement of the above-mentioned upper workpiece and the above-mentioned lower side workpiece overlap; and the lower chuck surface of the lower side holding member has: a lifting part, which is provided with a reverse direction between it and the lower side workpiece The separation pressure and the approach pressure mechanism; and the contact holding portion, which is provided with a mechanism for adjusting the separation pressure and the approach pressure; the floating portion has a porous layer made of porous material, and the gas is ejected from the porous layer to generate the Separation pressure, and use suction from the porous layer to generate the proximity pressure; the holding step is to balance the separation pressure and the proximity pressure of the floating portion with the lower workpiece relative to the lower holding member, and balance the The lower workpiece is supported in a non-contact manner by floating from the lower chuck surface, and then by switching from the floating portion to the contact holding portion, the approach pressure is gradually increased compared to the separation pressure, and The lower workpiece is brought into contact with the lower chuck surface and held immovably, and the joining step is to overlap the upper workpiece with the lower workpiece. For example, the method of manufacturing a bonded device of claim 5, which includes an unloading step that completes the bonding of the upper workpiece and the lower workpiece through the unloaded member from the bonding space to the outside The space is carried out, and in the carrying out step, the bonding device is carried out to the external space while maintaining a floating state from the carrying out surface of the carrying out member.

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