KR101018909B1 - Substrate alignment apparatus, substrate processing apparatus and substrate transfer apparatus - Google Patents

Abstract

In a state where the substrate G is placed on the stage 100, the gas is blown out through the ventilation path 114a in the gas supply pipe 118 and the cylindrical support 114 through the high-pressure air from the high-pressure gas supply source. By discharging at 116 to a predetermined pressure, the substrate G is substantially floated from the support pin 108. Since the gas discharge part 116 is formed in a horn shape, the air which touches the lower surface of the board | substrate G flows out through the gap g smoothly without generating a vortex flow. This configuration makes it possible to securely and accurately position the substrate, and furthermore, efficiently, without leaving scratches or rub marks on the substrate to be processed and without generating particles.

Description

SUBSTRATE ALIGNMENT APPARATUS, SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE TRANSFER APPARATUS

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing the configuration of a coating and developing treatment system to which the substrate alignment apparatus, substrate processing apparatus and substrate transfer apparatus of the present invention can be applied.

FIG. 2 is a flowchart showing a processing procedure in the coating and developing processing system of FIG. 1.

FIG. 3 is a plan view showing a configuration of main parts of a coating system processing unit group in the coating and developing processing system of FIG. 1.

FIG. 4 is a side view showing the configuration of main parts of a coating system processing unit group in the coating and developing processing system of FIG. 1.

Fig. 5 is a perspective view showing the configuration of main parts of the alignment mechanism according to the first embodiment of the present invention.

Fig. 6 is a diagram showing the configuration and one state of the main parts of the alignment mechanism according to the first embodiment of the present invention.

Fig. 7 is a partial cross-sectional side view showing the configuration and one state of main parts of the alignment mechanism according to the first embodiment of the present invention.

Fig. 8 is a perspective view showing the configuration of main parts of the alignment mechanism according to the second embodiment of the present invention.

Fig. 9 is an enlarged perspective view showing the configuration of main parts of the alignment mechanism according to the second embodiment of the present invention.

Fig. 10 is a block diagram showing the configuration of main parts of the alignment mechanism according to the second embodiment of the present invention.

Fig. 11 is a longitudinal sectional view showing the configuration and one state of main parts of the alignment mechanism according to the second embodiment of the present invention.

12 is a block diagram showing the configuration of main parts of the alignment mechanism according to the second embodiment of the present invention.

Fig. 13 is a longitudinal sectional view showing the configuration and one state of main parts of the alignment mechanism according to the second embodiment of the present invention.

Fig. 14 is a longitudinal sectional view showing the configuration and one state of main parts of the alignment mechanism according to the third embodiment of the present invention.

Fig. 15 is a longitudinal sectional view showing the configuration and one state of main parts of the alignment mechanism according to the third embodiment of the present invention.

Fig. 16 is a longitudinal sectional view showing the construction and one state of a modification of the third embodiment of the present invention.

Fig. 17 is a longitudinal sectional view showing the configuration and one state of main parts of the alignment mechanism according to the fourth embodiment of the present invention.

It is a top view which shows the structure of one Embodiment of the conveyance mechanism of this invention.                 

FIG. 19 is a longitudinal cross-sectional view showing one modification of the fourth embodiment shown in FIG. 17.

It is a longitudinal cross-sectional view which expands and shows the principal part of the modification shown in FIG.

FIG. 21 is an enlarged longitudinal sectional view of a main part of another modification of the fourth embodiment illustrated in FIG. 17.

<Description of the symbols for the main parts of the drawings>

20, 59: Transfer mechanism 44: Edge remover unit (ER)

100, 160: stage 102: alignment mechanism

106: pressing portion 108, 164: support pin

110: buoyant 112: adsorption fixing part

114: support member 116: gas discharge portion

120: protrusion 122: lower cylindrical portion

124: gas guide 126: upper cylindrical portion

134: high pressure gas supply source 136: vacuum source

140: support pad 142: base member

144: left part 150, 156: coil spring

152: support 154: caster

166: push pin 170: push arm

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate alignment apparatus, a substrate processing apparatus, and a substrate transport apparatus used in a manufacturing process such as a liquid crystal display (LCD), and more particularly, to a technique for mechanically positioning a substrate to be processed.

Background Art [0002] Conventionally, in order to position a substrate to be processed (glass substrate) in the XY direction on a stage before or during processing in the LCD manufacturing process, the substrate is almost attached to a plurality of support pins provided at predetermined intervals on the stage. While supporting horizontally, a mechanical alignment mechanism, such as positioning by pressing each side or side of each side of the substrate in a predetermined direction with a suitable jig, is used (for example, Fig. 2 of Japanese Patent Laid-Open No. 2001-44118 and its equivalent). According to the above description, and FIGS. 5 and 6 and Japanese Patent Application Laid-Open No. 6-143177). In the case where the substrate is fixed at the set position on the stage, a plurality of vacuum adsorption pads are provided at predetermined intervals on the stage, and each pad is placed on the vacuum source immediately after the substrate is placed on the pad at the set position. The substrate is connected to vacuum suction (for example, see Fig. 4 of Japanese Patent Laid-Open No. 10-106945 and the explanation based thereon).

The conventional mechanical alignment mechanism as described above can be easily aligned when the substrate is small. In recent years, however, substrates have become considerably larger in size, for example, 850 × 1000 mm, 1000 × 1200 mm, and weights of 2 to 4 kg per sheet. In the case of such a large substrate, in the conventional alignment mechanism, even if the side surface of the substrate is pressed with a jig, the substrate does not slip on the support pins, or if the substrate is bent or slips, the back surface of the substrate is strongly rubbed at the end of the pins to scratch or particles. There is a problem that sometimes occurs.

An object of the present invention is to provide a substrate alignment apparatus capable of safely, accurately and even efficiently aligning a substrate without scratching or rubbing the substrate to be processed and generating particles.

Another object of the present invention is to provide a substrate processing apparatus which improves processing quality and efficiency by aligning a substrate to be processed that is safe, accurate, and efficient.

It is still another object of the present invention to provide a substrate transfer device which improves the precision, reliability and efficiency of substrate transfer by aligning a substrate to be processed safely and accurately.

In order to achieve the above object, the substrate alignment apparatus of the present invention includes a plurality of support parts arranged discretely to support the substrate to be placed almost horizontally, and to the substrate to be processed in the vicinity of each support. And a means for aligning the substrate to be processed by applying pressure of the gas to substantially float the substrate to be processed, and positioning means for pressing the substrate to be processed in a predetermined direction within a horizontal plane.

In the present invention, when the substrate to be processed is positioned, the lifting means substantially lifts the substrate from the support, and presses the substrate to be processed by the alignment means in a predetermined direction in a horizontal plane. Because of the positioning, the substrate can be smoothly positioned with high accuracy without any scratches or rubs on the lower surface of the substrate and without causing any contamination. Further, since the flotation means locally floats the substrate to be processed in the vicinity of the supporting portion, it is possible to reduce the consumption amount of power such as a high-pressure gas.

A preferred embodiment of the present invention has a support pin attached vertically upward on a stage where the support portion is almost horizontal, and the substrate to be processed is placed on the end of the support pin. In this case, in order to obtain an efficient flotation function, it is preferable that the flotation means has a gas discharge portion for discharging gas at a predetermined pressure from the periphery of the support pin toward the lower surface of the substrate to be processed, more preferably gas discharge. It is good as a structure which has a horn-shaped discharge member which an addition diameter gradually increases toward an upper end.

Another preferable aspect is a configuration in which the support portion includes a support member having an upper surface for placing the substrate to be processed and a through hole extending in the vertical direction. In this case, in order to obtain an efficient flotation function, it is preferable that the flotation means has a gas discharge portion for discharging the gas at a predetermined pressure toward the lower surface of the substrate to be processed in the through hole of the support member, more preferably. And a lower cylinder fixed vertically upward on the stage where the support member is substantially horizontal, and an upper cylinder displaceably attached upwardly on the lower cylinder via the gas discharge portion.

According to another preferred aspect, the support portion is attached to a pad having an upper surface for placing the substrate to be processed and a lower surface subjected to gas pressure, and on a substantially horizontal stage, the pad being vertically and horizontally within a predetermined range. The pad support means for supporting the displaceable in the direction. In this case, in order to obtain an efficient flotation function, preferably, the flotation means has a gas discharge portion for discharging gas at a predetermined pressure toward the lower surface of the pad.

In the present invention, it is also possible to use a fixing means for fixing the substrate to be processed by the vacuum suction force to the support portion, and as a preferred embodiment, a gas guide portion common to the fixing means and the supporting means may be provided.

The second substrate alignment apparatus of the present invention comprises a horizontally displaceable support portion which is arranged in a plurality of discretely on a substantially horizontal stage to support the substrate to be placed almost horizontally, and the substrate to be placed on the support portion. Has positioning means for positioning by pressing in a predetermined direction within a horizontal plane.

In the second substrate alignment device, in the alignment of the substrate to be processed, the support portion is also displaced in the horizontal direction to follow the displacement of the substrate, whereby scratches and rub marks on the lower surface of the substrate are less likely to occur. Can be suppressed.

In the present invention, the positioning means may preferably position the substrate to be processed by pressing a pair of respective portions facing the substrate to be processed diagonally, or the side surface of one or all sides of the substrate to be processed. The substrate to be processed may be positioned by pressing in a direction perpendicular to the sides.                     

The substrate processing apparatus of the present invention includes the substrate alignment apparatus of the present invention and processing means for performing a predetermined process on the substrate to be processed positioned by the substrate alignment apparatus. Since the substrate can be safely, accurately and quickly positioned using the substrate alignment apparatus of the present invention, desired processing can be safely, accurately and efficiently performed on the substrate to be processed.

The substrate conveyance apparatus of this invention has the substrate alignment apparatus of this invention, and the conveyance means which conveys the to-be-processed board | substrate positioned by this substrate alignment apparatus to a predetermined place. Since the alignment of the substrate to be processed can be made safe, accurate and rapid by using the substrate alignment apparatus of the present invention, the accuracy, reliability and efficiency of substrate transfer can be improved.

These and other objects, features, aspects and advantages of the present invention will become apparent from the following detailed description of the invention which is understood in conjunction with the accompanying drawings.

[Embodiment of the Invention]

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of this invention is described with reference to an accompanying drawing.

Fig. 1 shows a coating and developing processing system as an example of the configuration to which the substrate alignment apparatus, substrate processing apparatus and substrate transfer apparatus of the present invention can be applied. This coating and developing system is installed in a clean room and, for example, uses an LCD substrate as a substrate to be treated, and performs cleaning, resist coating, prebaking, development, and post-baking in a photolithography process in an LCD manufacturing process. will be. The exposure treatment is performed in an external exposure apparatus (not shown) provided adjacent to this system.                     

This coating and developing processing system is roughly divided into a cassette station (C / S) 10, a process station (P / S) 12, and an interface unit 1 / F 14.

The cassette station (C / S) 10 provided at one end of the system includes a cassette stage 16 capable of placing a predetermined number, for example, up to four cassettes C containing a plurality of substrates G thereon. On the cassette stage 16 and parallel to the arrangement direction of the cassette C, and on the cassette C on the stage 16, which is free to move on the conveying path 17. The conveyance mechanism 20 which carries out the taking-out of the board | substrate G is provided. The conveying mechanism 20 has a means capable of holding the substrate G, for example, a conveying arm, which is operable in four axes of X, Y, Z, and θ, and which will be described later. The transfer device 38 on the) side and the substrate G can be exchanged.

The process station (P / S) 12 sequentially moves the cleaning process unit 22, the application process unit 24, and the development process unit 26 from the cassette station (C / S) 10 side. The substrate relay unit 23, the chemical solution supply unit 25, and the space 27 are provided in a horizontal line.

The cleaning process unit 22 includes two scrubber cleaning units (SCR) 28, two upper and lower UV irradiation / cooling units (UV / COL) 30, a heating unit (HP) 32, and cooling A unit (COL) 34 is included.

The coating process part 24 includes a resist coating unit (CT) 40, a vacuum drying unit (VD) 42, an edge remover unit (ER) 44, and a top and bottom two-stage type advice / cooling unit ( AD / COL) 46, a top and bottom two-stage heating / cooling unit (HP / COL) 48, and a heating unit (HP) 50.

The developing process unit 26 includes three developing units (DEV) 52, two upper and lower two-stage heating / cooling units (HP / COL) 53, and a heating unit (HP) 55. have.

The conveyance paths 36, 51, and 58 are provided in the center part of each process part 22, 24, and 26 in the longitudinal direction, and the main conveying apparatus 38, 54, 60 moves along each conveyance path, and is in each process part. Each unit of is accessed and the board | substrate G is carried in / out or conveyed. Moreover, in this system, in each process part 22, 24, 26, a spinner type unit (SCR, CT, DEV etc.) is arrange | positioned at one side of the conveyance paths 36, 51, 58, and the other side heat-processes. System units (HP, COL, etc.) are arranged.

The interface unit (I / F) 14 provided at the other end of the system is provided with an extension (substrate transfer unit) 56 and a buffer stage 57 on the side adjacent to the process station 12, and is exposed. The conveyance mechanism 59 is provided in the side adjacent to an apparatus. The conveyance mechanism 59 is a movable free material on the conveyance path 19 extending in the Y direction, and the substrate G is withdrawn from the buffer stage 57, or an extension (substrate transfer part) 56 or the adjacent portion is provided. The exposure apparatus is exchanged with the substrate G.

2 shows the procedure of processing in this coating and developing processing system. First, in the cassette station (C / S) 10, the conveyance mechanism 20 extracts one substrate G from the predetermined cassette C on the stage 12, and the process station P / S. (12) to the conveying device 38 of the cleaning process section 22 (step S1).

In the cleaning process unit 22, the substrate G is first loaded into the ultraviolet irradiation / cooling unit (UV / COL) 30 in sequence, and the first ultraviolet irradiation unit (UV) is subjected to dry cleaning by ultraviolet irradiation. Then, the next cooling unit COL is cooled to a predetermined temperature (step S2). Ultraviolet cleaning mainly removes organic matter from the substrate surface.

Subsequently, the substrate G is subjected to a scrubbing cleaning process by one of the scrubber cleaning units (SCRs) 28 to remove particulate dirt from the surface of the substrate (step S3). After scrubbing, the substrate G is subjected to dehydration by heating in the heating unit HP 32 (step S4), and then cooled to a constant substrate temperature in the cooling unit COL 34 (step S5). . As a result, the pretreatment in the cleaning process unit 22 is completed, and the substrate G is conveyed to the coating process unit 24 through the substrate transfer unit 23 by the main transport device 38.

In the coating process section 24, the substrate G is first loaded into the Advance / Cooling Unit (AD / COL) 46 sequentially, and the hydrophobic treatment (HMDS) is received by the first Advance Unit (AD) ( In step S6), the cooling unit COL is cooled to a constant substrate temperature (step S7).

Subsequently, the resist liquid is coated on the resist coating unit (CT) 40, and then the substrate G is subjected to a drying process under reduced pressure in the vacuum drying unit (VD) 42, followed by the edge remover unit (ER). In step (44), an extra (unnecessary) resist at the edge of the substrate is excluded (step S8).

Subsequently, the substrate G is sequentially loaded into the heating / cooling unit (HP / COL) 48, and baking (prebaking) after application is performed in the first heating unit HP (step S9). The cooling unit COL is cooled to a constant substrate temperature (step 10). Moreover, the heating unit (HP) 50 can also be used for baking after this application | coating.                     

After the coating process, the substrate G is connected to the interface unit I / F 14 by the main transport device 54 of the coating process part 24 and the main transport device 60 of the developing process part 26. It is conveyed and passed to an exposure apparatus there (step 11). In the exposure apparatus, a predetermined circuit pattern is exposed to the resist on the substrate G. Subsequently, after the pattern exposure, the substrate G is returned to the interface unit I / F 14 from the exposure apparatus. The conveyance mechanism 59 of the interface portion (I / F) 14 receives the substrate G received from the exposure apparatus through the extension 56 and the developing process portion 26 of the process station P / S 12. It is passed to (step S11).

In the developing process section 26, the substrate G is subjected to the developing treatment by any one of the developing units (DEVs) 52 (step S12), and then one of the heating / cooling units (HP / COL) 53. It is carried in to a dog one by one, post-baking is performed in the first heating unit HP (step S13), and it is cooled to a constant substrate temperature in the cooling unit COL (step S14). The heating unit (HP) 55 can be used for this postbaking.

The substrate G, which has been subjected to a series of processing in the developing process section 26, is transferred to the cassette station (C / S) 10 by the transfer devices 60, 54, 38 in the process station (P / S) 24. Is returned to, and is accommodated in any one cassette C by the conveyance mechanism 20 (step S1).

In this coating and developing processing system, the present invention can be applied to, for example, the edge remover unit (ER) 44 of the coating process section 24. 3 to 17, an embodiment in which the present invention is applied to the edge remover unit (ER) 44 will be described.

3 and 4, the main parts of the resist coating unit (CT) 40, the vacuum drying unit (VD) 42, and the edge remover unit (ER) 44 in the coating process unit 12. Indicates.

These coating system processing unit groups (CT) 40, (VD) 42, and (ER) 44 are arrange | positioned on the support 60 in a horizontal line according to the order of a process. A pair of guide rails 62 and 62 are provided on both sides of the support 60, and a unit or a plurality of conveyance arms 64 and 64 which move in parallel with the guide rails 62 and 62 are used for the unit. The board | substrate G can be directly sent (without placing the main conveyance apparatus 54 on the main conveyance path 52 side) between them.

The resist coating unit (CT) 40 includes a cup-shaped processing container 66 having an upper surface opened, and a liftable stage 68 for horizontally placing and holding the substrate G in the processing container 66. ), And a lift nozzle 70 for dropping the resist liquid from the upper side with respect to the lifting and lowering drive unit 70 provided below the processing container 66 to raise and lower the stage 68, and the substrate G on the stage 68. Nozzle scanning mechanism 74 for driving 72 in the XY direction, a nozzle holding unit 76 for maintaining the non-moving resist nozzle 72 outside the processing vessel 66, and a controller for controlling each unit. (Not shown). The nozzle holding unit 76 includes a nozzle washing unit 78 and a nozzle holding unit 80.

The nozzle scanning mechanism 74 arranges a pair of Y guide rails 82 and 82 extending in the Y direction on both sides of the processing vessel 66, and in the X direction between the two Y guide rails 82 and 82. The extended X guide rail 84 is temporarily handed over so that it can move to a Y direction. For example, the Y-direction drive unit 86 disposed at one end of one Y guide rail 82 moves both X guide rails 84 through an electric mechanism (not shown) such as an endless belt. The guide rails 82 and 82 are driven in the Y direction. In addition, a carriage (carrier) 88 that is movable along the X guide rail 84 in the X direction, for example, self-propelled or externally driven, is set, and a resist nozzle 72 is provided on the carriage 88. It is attached detachably.

The pressure reducing drying unit (VD) 42 has a lower chamber 90 of a tray or a shallow bottom of an upper surface thereof, and a lid shape configured to be hermetically adhered or fitted to the surface of the lower chamber 90. Has an upper chamber 92. The lower chamber 90 has a substantially rectangular shape, and a stage 94 for horizontally supporting the substrate G is disposed at the center thereof, and an exhaust port 96 is provided at four corners of the bottom surface. The exhaust pipe 98 connected to each exhaust port 96 under the lower chamber 90 is connected to a vacuum pump (not shown). In the state where the upper chamber 92 is covered by the lower chamber 90, the processing spaces in both chambers 90 and 92 can be decompressed to a predetermined degree of vacuum by the vacuum pump.

In the edge remover unit ER 44, a stage 100 made of, for example, an aluminum plate on which the substrate G is placed horizontally, and a first embodiment in which the substrate G is positioned on the stage 100 An alignment mechanism 102 according to an example and four remover heads 104 for removing excess resist from four peripheral edges (edges) of the substrate G are provided. Each remover head 104 moves along each side of the substrate G while the alignment mechanism 102 positions the substrate G at the set position on the stage 100 and is held in a horizontal position. In addition, the extra resist adhering to the periphery of each side of a board | substrate is melt | dissolved and removed with a solvent, for example, a thinner.

The alignment mechanism 102 of this first embodiment is arranged to face each other in the direction of one diagonal of the stage 100, and has a pair of pressing portions 106 and 106 that are movable in the same direction. As shown in FIG. 3, both pressing parts 106 and 106 have the end effector whose front end opened in the substantially right angle (90 degree) in a horizontal plane. When positioning the substrate G on the stage 100, both pressing portions 106 are arranged so that both end effectors fit in the corner portions of the substrate G facing from both sides in the diagonal direction of the substrate G. And 106 are moved from the standby position toward the center of the stage 100 to predetermined reciprocating positions, respectively.

In addition, as shown in FIG. 5, the alignment mechanism 102 includes a support pin 108 and a substrate G for horizontally supporting a plurality of discretely arranged substrates G on the stage 100 at predetermined intervals. ) Has a support 110 for substantially floating the support pin 108 and an adsorption fixing portion 112 for fixing the substrate G by vacuum adsorption. In the example of illustration, the column of the support pin 108 and the support part 110, and the column of the adsorption | suction fixing | fixed part 112 are arrange | positioned alternately in a row direction.

As shown in FIG. 6, the support pin 108 extends or protrudes vertically upward from the center of the upper end of the cylindrical support 114 fixedly attached to the stage 100, so that the bottom surface of the substrate G is extended from the pin end. It is supposed to be received. The support portion 110 includes a horn-shaped gaseous outlet portion 116 extending upwardly from an upper circumferential edge of the cylindrical support body 114, and a ventilation path in the cylindrical support body 114 to the gaseous outlet portion 116. 114a) and a high pressure gas supply source (not shown) connected through the gas supply pipe 118. As shown in FIG. In the middle of the gas supply pipe 118, an on / off control valve (not shown) is provided. The upper end of the gas outlet portion 116 may be provided at a height position such that a small gap g is formed between the back surface (lower surface) of the substrate G on which the support pin 108 is placed.

As shown in FIG. 7, in the state where the board | substrate G is mounted on the stage 100, the gas supply pipe 118 carries out the high pressure gas from the said high pressure gas supply source, for example, air (it may be nitrogen gas, etc.). And when the gravity of the substrate G is denied from the gas discharge section 116 through the ventilation path 114a in the cylindrical support 114, or discharged at a pressure above that, the substrate G is discharged. It is floating substantially from the support pin 108. Since the gas discharge part 116 is formed in a horn shape, the air which touched the lower surface of the board | substrate G falls out through the clearance gap g smoothly without generating a vortex flow.

Since the material of the support pin 108 hardly rubs with the board | substrate G hardly, it is good for arbitrary materials with high physical strength, but rubber | gum, resin, etc. with a low friction coefficient with respect to the board | substrate G are preferable. Although the gas discharge part 116 of the support part 110 may be made of arbitrary materials, rubber, cloth, engineering plastics, etc., which are plastic materials which are elastically bent and hard to be scratched even when they touch the substrate G, are preferable. Do.

As shown in FIG. 5, the adsorption fixing unit 112 is formed of a cylindrical body attached to the upper surface of the stage 100 at a height substantially equal to that of the support pin 108, and is sucked from behind the stage 100. It is connected to a vacuum source, for example, a vacuum pump or an ejector (not shown) via an engine (not shown). In a state where the substrate G is placed on the stage 100, the on / off control valve (not shown) provided in the middle of the suction pipe is turned on so that the adsorption fixing part 112 is turned on. When connected to the substrate G, the substrate G is held and fixed to the adsorption fixing portion 112 by vacuum suction force. Moreover, as for the material of the adsorption fixing part 112, the rubber | gum, resin, etc. which are hard to damage a board | substrate at least the upper end which contact | connects the board | substrate G are preferable.

Here, the overall operation of the alignment mechanism 102 in this embodiment will be described. As described above, the resist liquid is applied by the resist coating unit (CT) 40 and then dried by the vacuum drying unit (VD) 42 by the transfer arms 64 and 64. It is carried in the edge remover unit (ER) 44, and is mounted on the stage 101 more horizontally on the support pin 108 more accurately. When the substrate is loaded, the support 110 and the suction fixing part 112 are in an inoperative state.

After the substrate is loaded, the buoy 110 is first operated to discharge the high pressure air from the gas discharge unit 116 as described above to substantially lift the substrate G from the support pin 108 at the pressure of the air. In this way, in the state where the board | substrate G is floated, the press parts 106 and 106 operate | move, and when both end effectors fit into each leg part in one diagonal direction of the board | substrate G as mentioned above, In the process of movement, the position of the substrate G is finely adjusted in the XY direction and positioned at the set position on the stage 100.

At the time of the alignment, the substrate G may float completely in the air, but may be in light contact with some or all of the support pins 108. Since the gravity of the substrate G is almost negative due to the air pressure, and the lower surface of the substrate G smoothly slides even when it comes in contact with the support pin 108, no scratches or rubbing traces are generated. There is no concern. In addition, the substrate G in the floating state should be higher than the pin end locally at least near each of the support pins 108, and bent downward between the adjacent pins 108 and 108 or at the edge of the substrate. It may be lower than the height position of the tip.

After the alignment of the substrate G is completed as described above, the buoy 110 is turned off to stop the discharge of the high pressure air. Then, in order to replace this, the adsorption fixing unit 112 is operated to apply the vacuum suction force to hold the substrate G in a set position in a horizontal posture. The pressing portions 106 and 106 may retreat from the substrate G to the standby position at this stage or immediately after the previous positioning is completed.

In this way, the alignment mechanism 102 positions the substrate G on the stage 100 at the set position and is held in a horizontal position. In this state, as described above, the remover head 104 is operated to remove and rinse excess resist from the peripheral portion of the substrate G. After the end of the edge rinse, the adsorption fixing portion 112 is turned off in the alignment mechanism 102 to release the vacuum suction force. Immediately afterwards, the substrates G on which the transfer arms 64 and 64 or other conveying means have been processed are carried out on the stage 100 and conveyed to the processing section of the subsequent step.

As described above, in the alignment mechanism 102 of this embodiment, when the aligning portions in the XY direction are mechanically aligned by the pressing portions 106 and 106 on the stage 100, the supporting portion 110 is the substrate G. Is substantially lifted from the support pins 108, so that the lower surface of the substrate G is not scratched or rubbed, and no conduit is generated. Positioning can be performed smoothly and accurately at the set position of the image. Furthermore, since the gas ejection part 116 of the support part 110 is installed in the vicinity of the support pin 108 so as to surround the support pin 108, the substrate G is localized from the support pin 108. It is possible to float efficiently, so that the consumption of high pressure gas can be reduced as much as possible.

In addition, in the edge remover unit (ER) 44 of this embodiment, the alignment mechanism 102 can safely, accurately and quickly position the substrate G at the set position on the stage 100. Therefore, the edge rinse processing by the remover head 104 can be safely, accurately and efficiently performed on the peripheral portion of each side of the substrate G.

8 to 13, the alignment mechanism 102 according to the second embodiment will be described. The alignment mechanism 102 of the second embodiment can also be applied to, for example, the edge remover unit (ER) 44 of this embodiment, and has the same pressing portion 106 as in the first embodiment (FIG. 3, FIG. 3). Have 4)

As shown in Fig. 8, in this embodiment, for example, a cylindrical shape serving as a support part, a support part, and an adsorption fixing part in a discrete arrangement, for example, in a lattice shape at a predetermined interval on the stage 100, for example. Of the projections 120 are arranged.                     

As shown in FIGS. 9, 11, and 13, the protrusion 120 has a lower cylindrical body 122 fixedly attached to an upper surface of the stage 100 and a lower cylindrical body through a horn-type gas guide 124. The upper cylindrical body 126 attached so that displacement is possible in the up-down direction and the horizontal direction on the 122 is provided. An inner wall of the lower cylindrical body 122 is formed with a ring-shaped groove portion 122a for inserting and fixing the flange-shaped lower end portion 124a of the gas guide portion 124, and the gas guide on the inner wall of the upper cylindrical body 126. An annular groove portion 126a is formed to insert and fix the horn upper end portion 124b of the portion 124. The lower end of the gas guide portion 124 is connected to a gas pipe 128 penetrating the stage 100.

The material of the lower cylindrical body 122 may be any member having high physical strength. Since the material of the upper cylindrical body 126 is in direct contact with the lower surface of the substrate G, rubber or resin that is hard to be scratched on the substrate G is preferable. The material of the gas guide 124 is preferably a flexible rubber or cloth.

The gas pipe 128 connected to the projection part 120 (more precisely the gas guide part 124) shown to FIG. 10 and FIG. It communicates with the high pressure gas supply source 134 and the vacuum source 136 through the valve 132. The shut-off valve 130 and the three-way valve 132, for example, consisting of a solenoid valve, the control unit 138 controls the on / off position of the on-off valve 130 and the switching position of the three-way valve 132. In addition, a pressure control device (not shown) is included in the high pressure gas supply source 134 and the vacuum source 136, respectively.

In the state where the substrate G is placed on the stage 100, as shown in FIG. 10, the on-off valve 130 is turned on and the three-way valve 132 is turned on the high-pressure gas supply source 134. The high pressure gas from the high pressure gas supply source 134, for example, air (which may be nitrogen gas or the like), is supplied to the gas guide portion 124 in each cylindrical body 120 through the gas pipe 128. Thereby, as shown in FIG. 11, the gas guide part 124 acts as a discharge part, and blows up the high pressure air of a vertical upward direction to the lower surface of the board | substrate G. As shown in FIG. By setting the air pressure on the high-pressure gas supply source 134 side such that the pressure of the vertically upward air cancels the gravity of the substrate G or exceeds it, the substrate G is lifted from the surface of the upper cylindrical body 126. Can be. At this time, the air discharged upwardly from the gas guide portion 124 escapes out through the gap g formed between the lower surface of the substrate G and the upper surface of the upper cylindrical body 126. 11, the gas guide part 124 is pulled upward by the pressure of a vertical upward air, and the upper cylindrical body 126 floats upward from the lower cylindrical body 122. As shown in FIG.

Also in this embodiment, the lower surface of the substrate G may be in light contact with the upper surface of the upper cylindrical body 126 in the floated state. In this case, when the substrate G is displaced or moved in the horizontal direction by the pressing force in the horizontal direction by the pressing parts 106 and 106, the upper cylindrical body 126 is supported by the flexible gas guide part 124. Therefore, it can displace in the same direction as the substrate G moves. For this reason, there is no such thing as a scratch or a rubbing trace on the board | substrate G. Therefore, the substrate G can be safely, quickly and accurately positioned at the set position on the stage 100.

After the above-described positioning is completed, as shown in FIG. 12, when the three-way valve 132 is replaced on the vacuum source 132 side, the high pressure gas supply source 134 is cut off, and the vacuum source is replaced to replace it. 136 is connected to the gas guide portion 124 in each cylindrical body 120 through the gas pipe 128. Thereby, as shown in FIG. 13, the gas guide part 124 acts as an intake part, and the board | substrate G is made to adsorb | suck to the upper surface of the upper cylindrical body 126, and is hold | maintained. At this time, the gas guide part 124 and the upper cylindrical body 126 are pulled vertically downward by the vacuum suction force, and the upper cylindrical body 126 is attached to the lower cylindrical body 122, and is fixed. In this way, the board | substrate G is hold | maintained at the setting position on the stage 100. In the edge remover unit ER 44, in this state, by operating the remover head 104 as described above, the edge rinse treatment can be satisfactorily performed on the peripheral edge portion of the substrate G. .

As described above, also in this second embodiment, the projections 120 on the stage 100 are provided in the XY direction alignment by the pressing portions 106 and 106 on the stage 100. By raising the substrate G substantially from the substrate support portion (upper surface of the upper cylindrical body 126) by the provided flotation function, the lower surface of the substrate G is not scratched or rubbed, and the cone No termination occurs, and the substrate G can be smoothly and accurately positioned at the set position on the stage 100. In addition, since the flotation mechanism is provided inside the substrate support in the protrusion 120, the substrate G can be floated locally efficiently at the substrate support, and the consumption of the high pressure gas can be reduced as much as possible. .

In addition, in this second embodiment, since the cylindrical body 120 on the stage 100 also has a vacuum adsorption function, the exclusive adsorption fixing unit can be omitted, so that the cost of parts and the stage mounting surface can be reduced. The flatness can be improved.

In addition, various modifications are possible in the shape and structure of the protrusion 120. For example, the structure which forms the protrusion part 120 in a horn-shaped cylinder, and the structure which integrally forms the upper cylinder 126 and the lower cylinder 122 are also possible. Instead of the horn type, the gas guide portion 124 may be formed in a cylindrical shape, or may be replaced with a through hole of a cylinder.

14 and 15 show the configuration of main parts of the alignment mechanism 102 according to the third embodiment. The alignment mechanism 102 of this embodiment can also be applied to, for example, the edge remover unit (ER) 44 of this embodiment, and has the same pressing portion 106 (FIGS. 3 and 4) as in the first embodiment. Have

In this third embodiment, the movable support pads 140, which serve as support portions and support portions, are arranged discretely on the stage 100 at predetermined intervals. The function of holding and holding the substrate G may be assigned to a dedicated adsorption member, for example, the adsorption fixing portion 112 in the first embodiment.

14 and 15, the support pad 140 is configured as a disk body having a flange portion 140a at its lower end, and is horizontally formed in a circular concave portion 142a formed on the upper surface of the cylindrical base member 142. And displaceable in the vertical direction. More specifically, a protrusion or a seat 144 having a flat top surface is formed at the center of the bottom surface of the recess 142a so that the support pad 140 can be attached to the top surface of the seat 144. The annular flange portion 142c protruding horizontally above the concave portion 142a from the upper circumferential edge of the base member 142 has a supporting function in which the substrate G is placed on the upper surface, and a supporting pad on the lower surface. It has a stopper function for receiving the flange portion 140a of the 140.

As shown in FIG. 14, when the support pad 140 is attached to the seat 144, the upper surface of the support pad 140 is set to be lower than the upper surface of the flange portion 142c of the base member 142. . The seat portion 144 is provided with a plurality of gas discharge holes 144a penetrating in the vertical direction, and these gas discharge holes 144a have a gas passage or a gas supply pipe passing through the base member 142 and the stage 100. 146). The gas supply pipe 146 communicates with a high pressure gas generating source (not shown) through an on / off control opening / closing valve (not shown).

Several exhaust ports 142d are formed on the bottom surface of the recess 142a of the base member 142. These exhaust ports 142d communicate with an exhaust system, for example, an exhaust pipe (not shown), through an exhaust passage or an exhaust pipe 148 passing through the base member 142 and the stage 100.

In this embodiment, when aligning the substrate G on the stage 100, as shown in FIG. 15, the high pressure gas, for example, air from the high pressure gas generating source, for example, air is supplied to the seat portion ( It supplies to the gas discharge hole 144a of the back part 144, and air is discharged by the predetermined pressure from the gas discharge hole 144a. Air that has contacted the lower surface of the substrate G is guided to the lower surface curved downward of the flange portion 140a of the support pad 140 so as to fall toward the left portion 144 and is exhausted from the exhaust port 142d. The support pad 140 is lifted up from the seat 144 with the substrate G on by the vertical upward pressure by the high pressure air. In this state, by operating the pressing portions 106 and 106, the substrate G can be integrally displaced with the support pad 140 to be positioned at the set position on the stage 100.

After the positioning is completed, the high pressure gas from the high pressure gas source is cut off to lower the support pad 140. The substrate G is moved to the flange portion 142c of the base member 142 during the lowering of the support pad 140, and is fixed and held by the vacuum suction force of the suction fixing part 112 at the height position thereof.

In this embodiment, it is preferable that the support pad 140 mounts the substrate G at the center position in the base member recess 142a in the neutral state immediately before the pressing portions 106 and 106 operate. In order to realize such a neutral position function, as shown in FIG. 16, for example, a plurality (for example, radially) between the outer peripheral surface of the support pad 140 and the inner surface of the recessed part 142a. It is good as a structure which provides three coil coil springs 150 in a circumferential direction at intervals of 120 degrees.

Also in this embodiment, in the mechanical alignment of the XY direction by the pressing portions 106 and 106 on the stage 100, the support pads 140 discretely disposed on the stage 100 are interposed therebetween. By bringing the substrate G into a substantially floating state by the gas pressure floating function, the substrate G is not scratched or rubbed on the lower surface of the substrate G, and no contamination is generated. (G) can be positioned smoothly and accurately at the setting position on the stage 100. In addition, since the support pads 140 and the flotation mechanism act discretely and locally on the stage 100, the substrate G can be floated efficiently, and the consumption of the high pressure gas can be reduced.

17 shows a configuration of main parts of the alignment mechanism 102 according to the fourth embodiment. The alignment mechanism 102 of this embodiment can also be applied to, for example, the edge remover unit (ER) 44 of this embodiment, and has the same pressing portion 106 (FIGS. 3 and 4 as in the first embodiment). )

In the alignment mechanism 102 of this embodiment, the support part 152 which is displaceable in a discrete horizontal direction at a predetermined interval is arranged on the stage 100. The function of holding and holding the substrate G may be carried on the dedicated adsorption member, for example, the adsorption fixing portion 112 in the first embodiment.

As shown in FIG. 17, for example, the recess 100a is formed on the upper surface of the stage 100, and the recess 100a has a ball-shaped caster 154 rotatable in an arbitrary direction from the horizontal direction. A cylindrical support portion 152 is provided, and the support portion 152 is supported by a plurality of radially arranged coil springs 156 (eg, arranged at 120 ° intervals in the circumferential direction).

When positioning the substrate G on the stage 100, as shown in FIG. 17, the substrate G is placed on the upper surface of the support portion 152, and the pressing portions 106 and 106 are operated in this state. Let's do it. The support part 152 is displaced horizontally integrally with the board | substrate G, and the board | substrate G is positioned in a setting position.                     

In this fourth embodiment, since the gas pressure floating mechanism as in the first to third embodiments is not provided, it is not possible to displace the substrate G in the vertical direction during alignment. By the mechanism which displaces the support part 152 so that the displacement of the board | substrate G may follow the displacement of the board | substrate G in a horizontal direction, it can make it hard to produce a scratch or a rubbing trace on the lower surface of the board | substrate G. In addition, the support part 152 is not limited to a cylinder, but can be various shapes.

In the coating and developing processing system of this embodiment, in addition to the edge remover unit (ER) 44 of the coating process section 24 described above, the conveyance mechanism 20 and the interface of the cassette station (C / S) 10 are described. The present invention can also be applied to the conveyance mechanism 59 of the part (I / F) 14.

18 shows one embodiment of the structure of the conveyance mechanism 59. Has a substantially horizontal, substantially rectangular conveying stage 160 attached to a conveying body (not shown) which is movable along the conveying mechanism 19 and rotatably attached in a θ direction and movably (elevated) in a vertical direction. have.

On the upper surface of the conveyance stage 160, a conveyance arm 162 capable of advancing / removing horizontally in the longitudinal direction of the stage is attached. In FIG. 18, the carrier arm 162 is located at the home position on the stage 160. On the upper surface of the transfer arm 162, a plurality of plate-shaped suction pads 162a for suction fixing and fixing the substrate G are provided.

In addition, on the upper surface of the transfer stage 160, several (for example, four) support pins 164 and several (for example, four) presses for positioning at positions not interfering with the carrier arm 162 are pressed. The pins 166 are provided freely for raising and lowering, respectively. In the state where the transfer arm 162 has released the suction holding | maintenance with respect to the board | substrate G in a home position, the support pin 164 protrudes (rises) from a retracted position to a predetermined height position, and the board | substrate G moves to a carrier arm. It passes to the support pin 164 from 162.

Each push pin 166 is disposed close to the outer side of the substrate G on which the transfer arm 162 or the support pin 164 of the home position is placed in the longitudinal direction (arm movement direction) of the transfer stage 160. It is possible to move in the longitudinal direction of the stage in the guide groove or the long hole 168. When the substrate G is placed on the support pin 164 and each push pin 166 moves to a predetermined reciprocating position toward the substrate center, the substrate G is pressed on both sides in the stage longitudinal direction. It is pressed by the pin 166 and positioned. In addition, a rubber or resin roller (not shown) that can be rotated around the vertical axis may be provided at a portion in contact with the substrate G of each push pin 166.

In addition, in order to position in the width direction orthogonal to the stage longitudinal direction (arm movement direction), a pair of left and right push arms 170 and 170 movable in the width direction are provided on the stage 100. The pressing pads 172 and 172 attached to these pressing arms 170 and 170 respectively press the side surfaces of the substrate G on which the supporting pins 164 face. These press pads 172 may also be provided with a rotatable rubber or resin roller 174 around the vertical axis in order to reduce the impact and friction when contacting the substrate G.

In this embodiment, the support part 110 in the said 1st Example can be couple | bonded with the support pin 164, for example. That is, in the first embodiment, a configuration similar to the configuration in which the support 110 is coupled to the support pin 108 (FIGS. 5 to 7) may be applied to the support pin 164. However, it is necessary to deform to the lifting type, not fixed to the stage 160. Also in this embodiment, the high pressure gas is supplied to the buoy 110 so that the substrate G can be substantially floated from the support pin 108 as in the first embodiment. Then, the push pin 166 and the push arm 170 are acted on the substrate G that has been floated as described above, so that the lower surface of the substrate G is not scratched or rubbed, and the contamination is performed. It is possible to smoothly and accurately position the substrate G at the set position on the stage 100 without generating the?

After the alignment is completed, the support 110 is turned off to support the substrate G on the support pin 164 at the set position. Subsequently, each push pin 166 and the push arm 170 are separated from the substrate G to retract to a predetermined original position, and the support pin 164 is also retracted to the original position, that is, lowered vertically. As the support pin 164 descends, the substrate G is moved from the support pin 164 to the transfer arm 162. When the carrier arm 162 receives the substrate G, the carrier arm 162 fixes the substrate G by the vacuum suction force of the suction pad 162a. In this way, the conveyance mechanism 59 can convey the board | substrate G positioned on the stage 160 to the buffer stage 57, the extension 56, or the adjacent exposure apparatus.

Moreover, although the mechanism accompanies complicated and large size, in this embodiment, the structure which applies the movable support pad 140 (FIGS. 14-16) of the said 3rd Example instead of the support pin 164 is also possible. .

In addition, even when the present invention is applied to the conveying mechanism 20 of the cassette station (C / S) 10, the above-described configuration and effect can be obtained.

In the fourth embodiment shown in FIG. 17, the supporting portion 152 is integrally displaced in the horizontal direction with the substrate G, and the substrate G is positioned at the set position. It is also possible to position the substrate G. In the modification shown in FIG. 19, for example, a cylindrical support portion 182 having a ball member 184 made of, for example, ceramic, which is movable in an arbitrary direction in the horizontal direction, is attached to the upper surface of the stage 100. Is twisted and fixed, the substrate G is displaced in the horizontal direction by the rotation of the ball member 184, and the substrate G is positioned at the set position.

20 is an enlarged view of the main part of the support part 182 shown in FIG. The ball bearing 186 is attached to the upper surface of the support portion 182, the ball member 184 is attached to the movable.

In addition, it is also possible to position the board | substrate G by the structure as shown in FIG. In the modification shown in FIG. 21, the ventilation path 188 is formed inside the support part 182, and the high-pressure gas, for example, air (nitrogen) before the substrate G is placed on the ball member 184. Gas or the like) may be supplied to the ventilation path 188, and the substrate G is placed thereon with the ball member 184 floating. When the pressing portions 106 and 106 are operated in this state, the ball member 184 rotates, the substrate G is displaced in the horizontal direction, and the substrate G is positioned at the set position. Next, when supply of air to the ventilation path 188 is stopped, the ball member 184 descends and rotation is suppressed. Thereafter, the pressing on the substrate G from the pressing portions 106 and 106 is released.                     

In addition, in order to suppress rotation of the ball member 184, the ventilation path 188 may be connected to a vacuum source (not shown), and the rotation of the ball member 184 may be fixed by a suction force.

The above-described state in which the air is supplied, the state in which the air supply is stopped, and the suction state are controlled by the configuration as shown in FIGS. 10 and 12, for example.

As described above, when the substrate G is displaced in the horizontal direction, the ball member 184 is floated and made rotatable. When the substrate G is positioned, the rotation of the member 184 is suppressed. (G) can be positioned without scratching or rubbing.

Moreover, this invention is applicable to various board | substrate processing apparatuses or board | substrate conveyance apparatuses other than the said embodiment. In addition, the substrate to be processed in the present invention is not limited to an LCD substrate, and various substrates for flat panel displays, semiconductor wafers, CD substrates, glass substrates, photomasks, printed substrates, and the like can also be used.

As described above, according to the substrate alignment apparatus of the present invention, the alignment of the substrate can be safely, accurately, and efficiently carried out without scratching or rubbing the substrate to be processed and without generating particles. .

In addition, according to the substrate processing apparatus of the present invention, it is possible to align the substrate to be processed that is safe, accurate, and efficient, and improve the processing quality and efficiency.

In addition, according to the substrate transfer apparatus of the present invention, the substrate to be processed can be safely, accurately, and efficiently aligned, thereby improving the accuracy, reliability, efficiency, and the like of the substrate transfer.

Although the present invention has been described in detail, it is to be understood that this is for purposes of illustration only and not limitation, and the spirit and scope of the invention is limited only by the appended claims.

Claims (20)

A plurality of support portions for horizontally supporting the substrate G; Floating means 110 for applying the pressure of the gas from below to the substrate to be processed in the vicinity of each of the support portion to float the substrate to be processed, And positioning means 102 for positioning by pressing the substrate to be processed in a predetermined direction in a horizontal plane, The support portion has a support pin 108 which is attached vertically upwards on the horizontal stage 100, the substrate G to be placed on the end of the support pin, The support means 110 has a gas discharge portion 116 for discharging the gas at a predetermined pressure toward the lower surface of the substrate to be processed around the support pin 108, And the gas discharging part 116 has a horn-type discharge member in which the inlet diameter gradually increases toward the upper end. delete delete delete A plurality of support portions for horizontally supporting the substrate G; Floating means 110 for applying the pressure of the gas from below to the substrate to be processed in the vicinity of each of the support portion to float the substrate to be processed, And positioning means 102 for positioning by pressing the substrate to be processed in a predetermined direction in a horizontal plane, And a support member having an upper surface for placing the substrate to be processed (G) and a through hole extending in a vertical direction. delete delete A plurality of support portions for horizontally supporting the substrate G; Floating means 110 for applying the pressure of the gas from below to the substrate to be processed in the vicinity of each of the support portion to float the substrate to be processed, And positioning means 102 for positioning by pressing the substrate to be processed in a predetermined direction in a horizontal plane, A pad 140 having an upper surface for mounting the substrate G on the substrate and a lower surface receiving the pressure of the gas; And pad support means attached to a horizontal stage (100), the pad supporting means supporting the pad so as to be displaceable in a vertical direction and a horizontal direction within a predetermined range. delete A plurality of support portions for horizontally supporting the substrate G; Floating means 110 for applying the pressure of the gas from below to the substrate to be processed in the vicinity of each of the support portion to float the substrate to be processed, And positioning means 102 for positioning by pressing the substrate to be processed in a predetermined direction in a horizontal plane, And a fixing means (112) for fixing the substrate (G) to the support portion with a vacuum suction force. delete delete delete A plurality of support portions 182 for horizontally supporting the substrate G; Positioning means 102 for positioning by pressing the substrate to be processed in a predetermined direction in the horizontal plane, And a ball member (184) attached to an upper surface of each of the supporting parts so as to be able to roll the substrate to be processed in an arbitrary direction in a horizontal direction. 15. The substrate alignment apparatus of claim 14, wherein the ball member (184) is attached through a ball bearing (186) disposed on an upper surface of the support portion (182). 15. A substrate alignment apparatus according to claim 14, wherein said ball member (184) is supportably attached by support means (188) by high pressure gas disposed on an upper surface of said support portion (182). A plurality of support portions 182 for horizontally supporting the substrate G; On the upper surface of the support portion, the substrate horizontal holding means provided to support the substrate to be processed, to maintain the horizontal state and to be movable in any horizontal direction; And positioning means (102) for positioning the substrate to be processed held horizontally by the substrate horizontal holding means in a predetermined direction in a horizontal plane. delete The substrate alignment apparatus as described in any one of Claims 1, 5, 8, 10, 14-17, A substrate processing apparatus having processing means for performing a predetermined processing on a substrate to be processed (G) positioned by the substrate alignment apparatus. The substrate alignment apparatus as described in any one of Claims 1, 5, 8, 10, 14-17, And a conveying means (38, 54, 60) for conveying the substrate to be processed (G) positioned by the substrate alignment apparatus to a predetermined place.

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