JP2004273965A - Substrate processing equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing device by which a retaining state of a substrate is suitably grasped even if the substrate runs on a member such as a guide pin. <P>SOLUTION: First lift pins 101 to 104 are arranged near the guide pins 41, by which the first lift pins 101 to 104 do not adsorb the substrate even if the substrate is placed on the guide pin 41, and for example the substrate becomes flexible by a deadweight. Thus, the run-on of the substrate over the guide pins 41 is surely detected, and the retaining state of the substrate is suitably grasped. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate processing apparatus that performs a predetermined process on a glass substrate used for a liquid crystal display device or the like.
[0002]
[Prior art]
In a manufacturing process of an LCD (Liquid Crystal Display) or the like, in order to form a thin film or an electrode pattern of ITO (Indium Tin Oxide) on a glass substrate for the LCD, the same photolithography as that used for manufacturing a semiconductor device is used. Technology is used. In the photolithography technique, a photoresist is applied to a glass substrate, which is exposed and further developed. Further, the substrate is washed before the photolithography process.
[0003]
For example, a cleaning apparatus for cleaning a substrate is provided with a spin chuck for holding the substrate. For example, guide pins for guiding four corners of the substrate are attached to the edge of the spin chuck. In addition, this cleaning apparatus is provided with a suction nozzle for sucking the substrate and transferring the substrate to and from the outside so as to be able to move up and down near the center of the spin chuck. The suction nozzle suctions the substrate by the action of negative pressure. It is determined whether or not the peripheral edge of the substrate rides on the guide pin, for example, based on whether or not the negative pressure is acting, that is, whether or not the substrate is being sucked by the suction nozzle. This is because when the substrate rides on the guide pins, the substrate floats from the spin chuck, and thus, for example, a suction nozzle provided at the same height as the spin chuck does not suction the substrate. In this way, it is determined whether or not the substrate is held at a normal position (for example, see Patent Document 1).
[0004]
[Patent Document 1]
JP-A-11-274278 (paragraph [0025], FIGS. 6 and 7).
[0005]
[Problems to be solved by the invention]
However, recent substrates are large in size, so that the vicinity of the center is easily bent by its own weight. Therefore, even when the substrate rides on the guide pins, the substrate is sucked by the suction nozzle provided near the center. As a result, it is determined that the board is held at the normal position even when the board is on the guide pin. In this state, since the substrate is not properly held, it is very dangerous if, for example, the spin chuck is rotated at a high speed for a cleaning process.
[0006]
In view of the circumstances as described above, an object of the present invention is to provide a substrate processing apparatus capable of appropriately grasping a holding state of a substrate even when the substrate rides on a member such as a guide pin.
[0007]
An object of the present invention is to provide a substrate processing apparatus capable of correcting a substrate to be placed at a normal position even when the substrate rides on a member such as a guide pin.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a holding member for mounting and holding a substrate, and is attached to the holding member, and guides at least a part of a peripheral portion of the substrate for mounting and holding the substrate. A guide member, a first suction unit that is arranged to be able to move up and down in the vicinity of the guide member, and suctions the substrate by a pressure difference, and that the holding member holds based on whether the pressure difference is generated or not. Determining means for determining whether or not the position of the substrate is normal.
[0009]
The determination means determines whether the position of the substrate held by the holding member is normal based on, for example, a predetermined threshold value of the pressure near the first suction part (or whether the pressure is within a predetermined range). can do. The degree in the vicinity of the guide member, that is, the distance between the first suction part and the guide member depends on the size of the substrate or the hardness (degree of bending) of the substrate. In other words, for example, when the substrate is placed on the holding member, the first suction portion does not suck the substrate even when the substrate is bent by the substrate getting on the guide member and the substrate is bent, so that a pressure difference is not generated.
[0010]
In the present invention, when the substrate is held by the holding member, the first suction member is arranged at a position substantially equal to or lower than the height of the guide member. Since the first suction portion is disposed near the guide member, even if the substrate rides on the guide member and the substrate is bent by its own weight, for example, the first suction portion does not suck the substrate. Thus, it is possible to reliably detect that the substrate has got on the guide member. Therefore, the holding state of the substrate can be properly grasped.
[0011]
In one embodiment of the present invention, the apparatus further includes a second suction unit that is arranged to be able to move up and down on the center side of the substrate held by the holding member from the first suction unit and that sucks the substrate with a pressure difference. In the present invention, by using both the first suction unit and the second suction unit, it is possible to transfer the substrate without bending the substrate. For example, if a drive unit that integrally drives the first suction unit and the second suction unit to move up and down is provided, efficient substrate transfer can be performed.
[0012]
In one embodiment of the present invention, a first pipe connected to the first suction section, a second pipe connected to the second suction section, the first pipe and the second pipe are connected to each other. A merging pipe that joins with the pipes to join, and a decompression for generating a pressure difference between the first and second adsorption parts by reducing the pressure in the first and second pipes connected to the merging pipe. Means for detecting the pressure in the first pipe, and a second sensor for detecting at least the pressure in the junction pipe. In the present invention, the first sensor detects whether the board has climbed on the guide member. On the other hand, the second sensor detects whether or not the substrate has climbed on the guide member, and also detects whether or not the second suction portion is sucking the central portion of the substrate. Even if the first sensor or the second sensor breaks down for some reason, it is safe to detect the climbing of the substrate.
[0013]
In one embodiment of the present invention, a determination unit that determines a normal value or an abnormal value of each detection signal of the first sensor and the second sensor, and the determination unit determines only a detection signal of the second sensor. If it is determined that is an abnormal value, the apparatus further comprises means for stopping the pressure reducing action by the pressure reducing means and controlling the pressure to be reduced again by the pressure reducing means. When only the detection signal of the second sensor has an abnormal value, the board does not run over the guide member, and for example, a state in which the center of the board is raised from the peripheral edge is considered. In this case, it is considered that the cause is that the position of the substrate to be sucked by the first suction portion is closer to the center of the substrate than the predetermined position. Therefore, in this case, by stopping the depressurizing action by the depressurizing means, the central part of the substrate sinks downward by its own weight. By reducing the pressure again from that state, the first suction unit can suction the substrate at a predetermined position.
[0014]
In one aspect of the present invention, when the determination unit determines that at least the detection signal of the first sensor is an abnormal value, the drive unit raises the first and second suction units and reduces the pressure. The apparatus further includes means for stopping the decompression action of the means and controlling the transfer of the substrate to a transfer mechanism for transferring the substrate to and from the holding member. When the detection signal of the first sensor is an abnormal value, the board has got on the guide member. In this case, the substrate is transferred to the transport mechanism again, and the transport mechanism corrects the position of the substrate, for example, and places the substrate on the holding member again. This enables more efficient work than when the substrate processing apparatus simply stops. For example, a third sensor for detecting the holding position of the substrate may be provided. Thus, the transport mechanism can correct the position of the substrate based on the detection signal of the third sensor.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0016]
FIG. 1 is a plan view showing a coating and developing apparatus according to an embodiment of the present invention.
[0017]
The coating and developing apparatus includes a cassette station 1 on which a cassette C accommodating a plurality of substrates G is mounted, and a processing unit including a plurality of processing units for performing a series of processing including resist coating and development on the substrates G. 2 and an interface unit 3 for transferring a substrate G between the exposure unit (not shown) and a cassette station 1 and an interface unit 3 at both ends of the processing unit 2. .
[0018]
The cassette station 1 includes a transport mechanism 10 for transporting an LCD substrate between the cassette C and the processing unit 2. Then, the cassette C is loaded and unloaded at the cassette station 1. The transport mechanism 10 includes a transport arm 11 that can move on a transport path 10 a provided along the direction in which the cassettes are arranged. The transport arm 11 transports the substrate G between the cassette C and the processing unit 2. Done.
[0019]
The processing section 2 is divided into a front section 2a, a middle section 2b, and a rear section 2c, each having transport paths 12, 13, and 14 in the center, and processing units disposed on both sides of these transport paths. I have. Then, relay portions 15 and 16 are provided between them.
[0020]
The front section 2a includes a main transport device 17 that can move along the transport path 12. On one side of the transport path 12, two cleaning units (SCRs) 21a and 21b are disposed. On the other side of 12, an ultraviolet irradiation / cooling unit 25 in which an ultraviolet irradiation device (UV) and a cooling device (COL) are vertically stacked, and a heat treatment unit in which two heat treatment devices (HP) are vertically stacked 26, and a cooling unit 27 in which two cooling devices (COL) are vertically stacked.
[0021]
The middle section 2b includes a main transport device 18 that can move along the transport path 13. On one side of the transport path 13, a resist coating device (CT) 22 as a liquid supply device according to the present invention, A reduced-pressure drying device (VD) 44 and an edge remover (ER) 23 for removing the resist on the peripheral portion of the substrate G are integrally provided and arranged, and constitute a coating system processing unit group 50. In this coating system processing unit group 50, after the resist is applied to the substrate G by the resist coating device (CT) 22, the substrate G is transported to the reduced-pressure drying device (VD) 44 to be dried, and thereafter, the edge remover ( ER) 23 is performed to remove the peripheral edge resist. On the other side of the transport path 13, a heat treatment unit 28 in which two heating devices (HP) are vertically stacked, and a heat treatment in which a heat treatment device (HP) and a cooling treatment device (COL) are vertically stacked. / Cooling unit 29 and an adhesion processing / cooling unit 30 in which an adhesion processing device (AD) and a cooling device (COL) for performing a hydrophobic treatment on the substrate surface are vertically stacked.
[0022]
Further, the rear section 2c includes a main transport device 19 that can move along the transport path 14. On one side of the transport path 14, three developing devices (DEV) 24a, 24b, and 24c are arranged. On the other side of the transport path 14, a heat treatment unit 31 in which two heat treatment devices (HP) are vertically stacked, and a heat treatment device (HP) and a cooling device (COL) are vertically stacked. The two heat treatment / cooling units 32 and 33 are disposed.
[0023]
The main transporting devices 17, 18, and 19 each include an X-axis driving mechanism, a Y-axis driving mechanism, and a vertical Z-axis driving mechanism in two directions in a horizontal plane, and further, a rotation that rotates about the Z axis. A drive mechanism is provided, and has arms 17a, 18a, and 19a for supporting the substrate G, respectively.
[0024]
The processing unit 2 includes a liquid supply system unit such as a cleaning unit (SCR) 21a, 21b, a resist coating device (CT) 22, and a development processing device 24a, 24b, 24c on one side of the transport path. Are arranged, and only the thermal processing units such as the heating processing unit and the cooling processing unit are arranged on the other side.
[0025]
Further, a chemical solution supply unit 34 is arranged at a portion of the relay units 15 and 16 on the side where the liquid supply system is arranged, and a space 35 where maintenance is possible is provided.
[0026]
The interface unit 3 includes an extension 36 for temporarily holding the substrate when transferring the substrate to and from the processing unit 2, and two buffer stages 37 provided on both sides thereof for disposing a buffer cassette. And a transport mechanism 38 for carrying in and out the substrate G between the substrate G and an exposure device (not shown). The transport mechanism 38 includes a transport arm 39 that can move on a transport path 38 a provided along the direction in which the extension 36 and the buffer stage 37 are arranged. The transport arm 39 allows the substrate G to be moved between the processing unit 2 and the exposure apparatus. Is carried out.
[0027]
A series of processes of the coating and developing apparatus configured as described above will be described.
[0028]
The substrate G in the cassette C is transported to the processing unit 2, and in the processing unit 2, first, the surface modification and cleaning processing is performed in the ultraviolet irradiation unit (UV) of the processing block 25 in the former stage 2 a, and the cooling unit (COL) After scrubbing is performed in the scrubbing units (SCR) 21a and 21b and heated and dried in any one of the heat treatment units (HP) in the processing block 26, the cooling unit in any of the processing blocks 27 is used. (COL).
[0029]
Thereafter, the substrate G is transported to the middle section 2b and subjected to hydrophobizing treatment (HMDS processing) in the upper adhesion processing unit (AD) of the processing block 30 in order to enhance the fixability of the resist, and to the lower cooling unit (COL). ), The resist is applied by a resist coating unit (CT) 22, and an excess resist on the periphery of the substrate G is removed by an edge remover (ER) 23. Thereafter, the substrate G is pre-baked in one of the heat processing units (HP) in the middle section 2b, and is cooled in the lower cooling unit (COL) of the processing block 29 or 30.
[0030]
Thereafter, the substrate G is transported from the relay section 16 to the exposure apparatus via the interface section 3 by the main transport apparatus 19, where a predetermined pattern is exposed. Then, the substrate G is again carried in through the interface unit 3 and subjected to post-exposure bake processing in any one of the heat processing units (HP) of the processing blocks 31, 32, and 33 of the subsequent stage unit 2c as necessary. Developing processing is performed by any of the developing processing units (DEV) 24a, 24b, and 24c to form a predetermined circuit pattern. The developed substrate G is subjected to post-baking in one of the heat treatment units (HP) in the subsequent stage 2c, and then cooled in one of the cooling units (COL). It is stored in a predetermined cassette on the cassette station 1 by the transfer mechanism 18 and 17.
[0031]
FIG. 2 is a plan view of the cleaning units (SCR) 21a and 21b, and FIG. 3 is a sectional view thereof.
[0032]
The cleaning unit (SCR) 21a is provided in a sink or a casing (not shown). At an almost center of the cleaning unit (SCR) 21a, an upper cup 61 and a lower cup 62 for accommodating a substrate are provided. The upper cup 61 can be moved up and down with respect to the lower cup 62 by a driving device (not shown). For example, during the cleaning process, the upper cup 61 rises, whereby it is possible to prevent the cleaning water and mist from scattering around. In the cups 61 and 62, a spin plate 42 for mounting and holding the substrate G is arranged. The spin plate 42 is supported by a support 40, which is rotatable by a motor 45. This allows the spin plate 42 to rotate. An umbrella-shaped partition plate 52 is provided below the spin plate 42. An exhaust chamber 63 is provided below the partition plate 52 in the lower cup 62, and an exhaust port 60 is provided below the exhaust chamber 63. As a result, the cleaning liquid, mist, and the like collected in the exhaust chamber 63 are exhausted from the exhaust port 60 during the cleaning process.
[0033]
A cleaning brush 56 and a cleaning water nozzle 54 that are movable along the guide member 51 are provided above the cups 61 and 62, respectively. The cleaning brush 56 and the cleaning water nozzle 54 are supported by supporting members 55 and 53, respectively, and these supporting members are configured to be movable along the guide member 51 by a motor (not shown) or the like. The cleaning water nozzle 54 is configured to discharge the cleaning water in a spray shape while applying, for example, ultrasonic waves.
[0034]
FIG. 4 is a perspective view showing the spin plate 42. Guide pins 41 are attached to, for example, four corners of the spin plate 42. The guide pins 41 guide the four corners of the substrate G when the substrate G is placed on the spin plate 42. A plurality of support pins 43 for supporting the substrate are discretely provided on the spin plate 42. The support pins 43 are set lower than the guide pins 41.
[0035]
Below the partition plate 52, for example, first lift pins 101, 102, 103, 104 and second lift pins 105, 106 which can be moved up and down by an air cylinder 57 are provided. The first lift pins 101, 102, 103, 104 and the second lift pins 105, 106 are connected to the connecting plate 59 and move up and down integrally. The first lift pins 101, 102, 103, and 104 move up and down through holes 42a, 52a formed in the spin plate 42 and the partition plate 52, respectively. The second lift pins 105 and 106 move up and down through holes 42b and 52b formed in the spin plate 42 and the partition plate 52, respectively. Four holes 42a of the spin plate 42 are provided near the guide pins 41, and four first lift pins 101, 102, 103, and 104 penetrate therethrough. The hole 42b is provided near the center of the spin plate 42 so that the two second lift pins 105 and 106 penetrate.
[0036]
FIG. 5 is a perspective view showing the distal ends of the lift pins 101 to 106. The distal ends of the lift pins 101 to 106 have a head 75 and a pedestal 76 for accommodating the head 75, and have a structure in which a rod 74 is attached to the bottom of the pedestal 76. The head 75 is configured such that the outer diameter of the upper part 75a in contact with the substrate G and the lower part 75b accommodated in the pedestal 76 is smaller at the upper part 75a and larger at the lower part 75b. The head 75 has a tapered portion 75c in which an intermediate portion between the upper portion 75a and the lower portion 75b is formed in a tapered shape. The tapered portion 75c mainly has an upper portion 75a and a tapered portion 75c projecting upward from the upper surface of the base 76.
[0037]
As described above, by forming the tapered portion 75c by reducing the outer diameter of the upper portion 75a of the head 75, even if the cleaning liquid adheres to the head 75, the cleaning liquid easily flows down the tapered portion 75c. Further, since the distance between the upper end surface of the head 75 and the upper surface of the pedestal 76 is long, even if the cleaning liquid stays in the upper part of the pedestal 76, the cleaning liquid does not adhere to the substrate G. Thus, even when the lift pins 101 to 106 are wet on the lower surface of the substrate G by the cleaning liquid, traces of the cleaning liquid on the substrate G are avoided.
[0038]
Suction holes 77 are formed in the lift pins 101 to 106 so as to penetrate the head 75, the pedestal 76, and the rod 74. By operating a vacuum pump 64, which will be described later, and sucking and holding the substrate G using the suction holes 77, it is possible to more reliably hold the substrate G at the tip surfaces of the lift pins 101 to 106. Such a lift pin structure can be used not only for handling a rectangular substrate, but also for handling a substrate having another shape such as a circle.
[0039]
Vacuum pipes 121, 122, 123, 124, 125, and 126 are connected to the lift pins 101 to 106, respectively. These pipes 121 to 126 are joined and connected to a merge pipe 128, and the merge pipe 128 is connected to the vacuum pump 64. First sensors 111, 112, 113, and 114 for measuring pressures in the pipes are attached to pipes 121 to 124 connected to the first lift pins 101 to 104, respectively. Further, a second sensor 118 for measuring a pressure in the pipe is attached to the merging pipe 128. When the first lift pins 101 to 104 suck the substrate G, the first sensors 111 to 114 indicate a predetermined normal value or a predetermined normal range. When at least one of the first lift pins 101 to 104 and the second lift pins 105 and 106 does not adsorb the substrate, the second sensor 118 does not indicate a predetermined normal value or a predetermined normal range, and an abnormal value is detected. Show.
[0040]
FIG. 6 is a block diagram showing a control system of the cleaning units (SCR) 21a, 21b. The control unit 100 controls the cleaning units (SCR) 21a and 21b as a whole. Specifically, the control unit 100 mainly controls the operation of the vacuum pump 64, the driving of the air cylinder 57, the driving mechanism 69 of the cleaning brush 56 and the cleaning water nozzle 54, the driving of the motor 45, and the timing thereof. In particular, the control unit 100 controls the vacuum pump 64, the air cylinder 57, and the like to operate based on the information measured by the sensors 111 to 114, 118. For example, the control unit 100 can determine whether the position of the substrate held by the spin plate 42 is normal based on a predetermined threshold value of the pressure of the pipes 121 to 124 and the merging pipe 128.
[0041]
Next, the operation of the cleaning units (SCR) 21a, 21b configured as described above will be described. FIG. 9 is a flowchart showing a main part of the operation.
[0042]
First, the cleaning unit (SCR) 21a, 21b is accessed while the transfer arm 17a of the main transfer device 17 holds the substrate G. At this time, the cleaning brush 56 and the cleaning water nozzle 54 are waiting outside the cups 61 and 62. When the transfer arm 17a moves to a position immediately above the cups 61 and 62, the lift pins 101 to 106 rise and receive the substrate G as shown in FIG. At this time, the vacuum pump 64 is operating, and the lift pins 101 to 106 vacuum-adsorb the substrate G. The lift pins 101 to 106 descend after receiving the substrate G (step 901). During this downward movement, the control unit 100 determines whether or not any of the four corners of the substrate G runs on the guide pins 41 as shown in FIG. 7B. Then, as shown in FIG. 7C, the substrate G is placed and held on the spin plate 42 by lowering the lift pins 101 to 106 to the lowest position.
[0043]
Here, riding on the guide pins 41 of the substrate G will be described in more detail.
[0044]
For example, the control unit 100 detects a value of the second sensor 118 to detect a ride (Step 902). If the second sensor 118 indicates a normal value, the controller 100 guides the substrate to the guide pins 41 at the normal position and places the substrate G on the spin plate 42, as indicated by a dashed line G ′. It is determined that it is placed and held (step 903).
[0045]
On the other hand, for example, when the transfer arm 17a transfers the substrate to the lift pins 101 to 106, the position of the substrate is shifted and not a normal position, and the corner of the substrate G rides on the guide pin 41 as shown in FIG. Is placed. At this time, the substrate G is bent, and the lift pins 105 and 106 near the center of the substrate G attract the substrate G. However, the suction of the lift pins 101 to 106 near the guide pins 41 is released. In this case, among the first sensors 111 to 114, the first sensor corresponding to the lift pin that is not sucked and the second sensor 118 indicate abnormal values.
[0046]
When the second sensor 118 indicates an abnormal value, the control unit 100 detects the values of the first sensors 111 to 114 (Step 904). If the values of the first sensors 111 to 114 indicate normal values, it is possible that the first lift pins 101 to 104 are sucking the substrate G and the second lift pins 105 and 106 are not sucking. is there. In such a state, the board G does not run over the guide pins 41, and for example, a state in which the center of the board G is raised from the peripheral edge is considered (step 905). In this case, for example, the control unit 100 sends a signal of a command to raise the lift pins 101 to 106 to the air cylinder 57 (Step 906), and temporarily stops the operation of the vacuum pump 64 to stop the vacuum suction (Step 907). By stopping the vacuum suction, the substrate sinks downward at its center by its own weight. Then, the control unit 100 sends a vacuum suction command to the vacuum pump 64 again (step 908). A command to lower the lift pins 101 to 106 is sent to the air cylinder 57 to place the substrate G on the spin plate 42 (step 909).
[0047]
On the other hand, if the values of the first sensors 111 to 114 indicate an abnormal value in step 904, the control unit 100 determines that the substrate G is riding on the guide pins 41 (step 910). In this case, the control unit 100 sends a signal of a command to raise the lift pins 101 to 106 to the air cylinder 57 (step 911). The control unit 100 instructs a main controller (not shown) of the main transport device 17 to receive the substrate G (Step 912). When the arm 17a receives the substrate, the arm 17a transfers the substrate G to the lift pins 101 to 106 again. When the substrate is transferred to the lift pins 101 to 106, the control unit 100 sends a command to lower the lift pins 101 to 106 to the air cylinder 57 to place the substrate G on the spin plate 42 (Step 913).
[0048]
After the substrate G is placed at the normal position on the spin plate 42, a predetermined cleaning process is performed while moving the cleaning brush 56 and the water purification nozzle 54 on the substrate. When the cleaning process using the cleaning brush 56 and the water purification nozzle 54 is completed, the spin plate 42 rotates to shake off the cleaning water or the like on the substrate and dry it. Thereafter, the substrate G is transferred to the main transfer device 17 via the lift pins 101 to 106.
[0049]
As described above, in the present embodiment, since the first lift pins 101 to 104 are arranged near the guide pins 41, even if the substrate rides on the guide pins 41 and the substrate is bent by its own weight, for example, the first The lift pins 101 to 104 do not attract the substrate. Thus, it is possible to reliably detect that the substrate has got on the guide pins 41. Therefore, the holding state of the substrate can be properly grasped.
[0050]
In the present embodiment, even if one of the first sensors 111 to 114 or the second sensor 118 fails for some reason, it is possible to detect the climbing of the board, which is safe.
[0051]
In the present embodiment, when it is detected that the board has climbed onto the guide pins 41, the board is transferred to the main transfer device 17 and held again in step 911 and later, and the vacuum suction is stopped in step 907 to normalize the board. Position. This enables more efficient work than when the coating and developing apparatus is simply stopped when, for example, the board climbs over the guide pins 41.
[0052]
FIG. 10 shows another embodiment. This figure is a diagram showing a relationship between a control system of the cleaning units (SCRs) 21 a and 21 b and a control system of the main transfer device 17. The main transfer device 17 has a main controller 80, an XY drive system controller 86, and a correction program 87. The XY drive system controller 86 controls the driving of the main transfer device 17 in the horizontal plane. The correction program is a program for correcting the transfer position of the substrate to the cleaning units (SCRs) 21a and 21b of the main transfer device 17 in the horizontal plane.
[0053]
In the present embodiment, as described in the above embodiment, after the board rides on the guide pins 41 and passes the board to the main transfer device 17 (Step 911 in FIG. 9), the control unit 100 determines that the board has climbed. This is communicated to the main transfer device 17. Then, the main controller 80 uses the correction program to correct the position of the main transport device 17 in the horizontal plane. Specifically, when one first sensor corresponding to one lift pin closest to the guide pin 41 that has climbed has detected an abnormal value, the control unit 100 transmits the position information of the guide pin to the main controller 80. Just fine. Then, the main controller 80 corrects the position of the main transfer device 17 in the horizontal plane based on the position information of the guide pin that has climbed. Accordingly, when the substrate is again placed on the spin plate 42 and held, the substrate can be reliably placed at the normal position.
[0054]
The present invention is not limited to the embodiments described above, and various modifications are possible.
[0055]
The arrangement positions and numbers of the guide pins 41 and the lift pins 101 to 106 are not limited to the above-described embodiment.
[0056]
The correction program shown in FIG. 10 may be provided in the cleaning units (SCR) 21a and 21b. Further, in the embodiment shown in FIG. 10, by providing an optical sensor in addition to the pressure sensor for correcting the position of the substrate, the correction can be performed with higher accuracy.
[0057]
Although the cleaning unit has been described in the above embodiment, the present invention can be applied to, for example, the resist coating unit 22, the developing unit 24, and other units having a chuck mechanism.
[0058]
【The invention's effect】
As described above, according to the present invention, the holding state of the substrate can be properly grasped even when the substrate rides on a member such as a guide pin.
[Brief description of the drawings]
FIG. 1 is a plan view showing a coating and developing apparatus according to an embodiment of the present invention.
FIG. 2 is a plan view showing a cleaning unit according to one embodiment of the present invention.
FIG. 3 is a sectional view of the cleaning unit shown in FIG. 2;
FIG. 4 is a perspective view showing a spin plate, piping, and the like.
FIG. 5 is a perspective view showing a tip portion of a lift pin.
FIG. 6 is a block diagram showing a control system of the cleaning unit shown in FIG.
FIG. 7 is a diagram showing a part of the operation of the cleaning unit.
FIG. 8 is a diagram showing a state in which the substrate has been mounted on guide pins.
FIG. 9 is a flowchart showing a main part of the operation of the cleaning unit.
FIG. 10 is a block diagram for explaining another embodiment.
[Explanation of symbols]
G ... substrate
17, 18, 19: Main transfer device
41… Guide pin
42 ... Spin plate
57 ... Air cylinder
59 ... Connecting plate
64 ... Vacuum pump
80: Main controller
100 ... control unit
101 to 104: first lift pins
105, 106 ... second lift pins
111 to 114: first sensor
118 ... second sensor
121-126 ... Piping
128 ... confluence pipe

Claims (6)

A holding member for placing and holding the substrate,
A guide member attached to the holding member, for guiding at least a part of the peripheral edge of the substrate for mounting and holding the substrate,
A first suction unit that is disposed to be able to move up and down in the vicinity of the guide member and that sucks the substrate with a pressure difference;
A substrate processing apparatus comprising: a determination unit configured to determine whether a position of the substrate held by the holding member is normal based on whether the pressure difference is generated. The substrate processing apparatus according to claim 1,
The substrate processing apparatus further includes a second suction unit that is arranged to be vertically movable at a center side of the substrate held by the holding member from the first suction unit and that sucks the substrate with a pressure difference. The substrate processing apparatus according to claim 2,
The substrate processing apparatus further comprises a driving unit that integrally drives the first suction unit and the second suction unit to move up and down. The substrate processing apparatus according to claim 3, wherein
A first pipe connected to the first suction unit,
A second pipe connected to the second suction unit;
A merging pipe in which the first pipe and the second pipe are joined and merged;
A pressure reducing unit connected to the merging pipe to reduce the pressure in the first and second pipes to generate a pressure difference between the first and second suction units;
The determining means includes:
A first sensor for detecting a pressure in the first pipe;
A substrate processing apparatus having at least a second sensor for detecting a pressure in the merging pipe. The substrate processing apparatus according to claim 4, wherein:
A determination unit that determines a normal value or an abnormal value of each detection signal of the first sensor and the second sensor;
When the determination section determines that only the detection signal of the second sensor is an abnormal value, the apparatus further includes means for stopping the pressure reducing operation by the pressure reducing means and controlling the pressure to be reduced again by the pressure reducing means. A substrate processing apparatus characterized by the above-mentioned. The substrate processing apparatus according to claim 5, wherein
When the determination unit determines that at least the detection signal of the first sensor is an abnormal value, the driving unit raises the first and second suction units and stops the depressurizing operation by the depressurizing unit, A substrate processing apparatus further comprising: means for controlling transfer of a substrate to a transfer mechanism that transfers the substrate to and from the holding member.

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