JP2010147294A - Substrate holding method, substrate holding device, exposure device using the same, and method of manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce a down time of an exposure device by determining the cause of suction trouble without installing a special detection device when a substrate is not normally sucked onto a temperature regulation means. <P>SOLUTION: This substrate holding method includes: a temperature regulation means to regulate the temperature of a substrate by sucking and holding the substrate; a drop prevention member for preventing the drop of the substrate from the temperature regulation means; a knocking-up pin including a suction mechanism and a vertical drive mechanism for transferring the substrate; and a control system for controlling the suction mechanism and the drive mechanism; and is used for holding the substrate and regulating the temperature thereof. The substrate holding method includes a determination process S12 of determining whether suction trouble is caused by the substrate having run on the drop prevention member when the suction trouble occurs in sucking and holding the substrate to the temperature regulation means. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate holding method and a substrate holding apparatus, an exposure apparatus using the same, and a device manufacturing method.

  A semiconductor manufacturing system for manufacturing a semiconductor element has various manufacturing processes for applying a plurality of processes to a substrate (wafer). Among the processes, the exposure apparatus is an apparatus that transfers a pattern of an original (reticle) to a photosensitive substrate (for example, a wafer having a resist layer formed on the surface) via a projection optical system in a lithography process. . In general, this exposure apparatus is connected to a coating / developing apparatus responsible for a resist processing process of coating, baking and developing, and the substrate to be processed is transported through a delivery station located between the apparatuses.

The delivery station has a substrate holding device for temporarily holding the substrate. For example, Patent Document 1 is a substrate holding device provided with a temperature control plate, and when the substrate carried on three pins is placed on the temperature control plate and the temperature of the substrate is controlled, the temperature of the plate Discloses a substrate temperature control device that determines the temperature control time of a substrate and reliably controls the temperature of the substrate. However, when the substrate is transported onto the plate of the substrate holding device, there may be a problem such as displacement of the delivery position of the substrate, vibration during pin lowering drive, and dropping of the substrate due to external force such as wind pressure. Therefore, in order to prevent these problems, a drop prevention member that holds the outer peripheral surface of the substrate at a plurality of locations on the plate, or an abnormality in the adsorption of the substrate to the plate is detected. Measures are taken to avoid such problems. For example, Patent Document 2 discloses a substrate transport apparatus that predicts a suction error in advance by detecting the vacuum pressure of a substrate suction unit and calculating a plurality of pieces of substrate data.
JP 2002-83756 A JP 2007-281073 A

  However, when the fall prevention member is employed in the substrate holding device, if the amount of deviation of the substrate is larger than an allowable value, the conveyed substrate may ride on the fall prevention member. Here, according to the substrate transport apparatus disclosed in Patent Document 2, if the suction abnormality is caused by the adhesion of foreign matter on the plate, the substrate transport apparatus changes the suction threshold value to reduce the transport speed and acceleration. Thus, the substrate recovery operation can be continued. However, in the case of a suction abnormality caused by the board riding on the fall prevention member, the board is tilted by the pin raising drive, and cannot be dealt with by the recovery means described in Patent Document 2 by changing the suction threshold, the conveyance speed, and the acceleration. The substrate may fall off the plate. This is because the adsorption pressure is equal depending on the degree of foreign matter adhesion between the adsorption abnormality due to foreign matter adhesion and the adsorption abnormality due to climbing on the fall prevention member, so the cause of the adsorption abnormality cannot be specified by adsorption pressure detection. caused by. That is, in the conventional substrate holding apparatus, when an adsorption error is generated, in order to identify the cause of the adsorption abnormality, it is necessary to visually check the substrate, and there is a problem that downtime occurs in each apparatus. . On the other hand, it is conceivable to install a mechanism for detecting the climbing onto the fall prevention member in the substrate holding device in order to judge the adsorption malfunction due to the adhesion of foreign matter and the adsorption malfunction due to climbing on the fall prevention member. However, there is a problem that the device configuration is complicated and the cost is increased.

  The present invention has been made in view of such a situation. When the substrate is not normally sucked on the plate, the cause of the suction abnormality is determined without installing a special detection device, and exposure is performed. It is an object of the present invention to provide a substrate holding method and apparatus that reduce downtime of the apparatus.

  In order to solve the above-described problems, a temperature control unit that holds the substrate by suction and controls the temperature of the substrate, a fall prevention member that prevents the substrate from dropping from the temperature control unit, and a suction for performing transfer of the substrate In a substrate holding method that includes a push-up pin having a mechanism and a vertical drive mechanism and a control system that controls the suction mechanism and the drive mechanism, and holds and temperature-controls the substrate, when the substrate is suction-held by the temperature control means, It is characterized by having a determination step of determining whether the cause of the suction abnormality is caused by the board riding on the fall prevention member when the suction abnormality occurs.

  According to the present invention, in the determination step, it is possible to determine whether the cause of the adsorption abnormality is due to adhesion of foreign matter or the like, or due to the board riding on the fall prevention member. As a result, it is possible to reduce the downtime of the exposure apparatus by automatically recovering the substrate transfer sequence from an adsorption abnormality that does not require human intervention by an operator or the like, thereby improving the productivity in the semiconductor manufacturing process. Can do.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

(Exposure equipment)
FIG. 1 is a schematic view showing a main part (hereinafter referred to as “exposure unit”) of an exposure apparatus according to an embodiment of the present invention. The exposure unit 1 is an apparatus that exposes a reticle pattern onto a wafer by a step-and-scan method or a step-and-repeat method, but the exposure method is not particularly limited. In FIG. 1, the Z axis is parallel to the optical axis of the projection optical system constituting the exposure unit 1, and the reticle (original) and wafer (substrate) are scanned during scanning exposure in a plane perpendicular to the Z axis. A description will be given by taking the Y axis in the direction and the X axis in the non-scanning direction orthogonal to the Y axis.

  The exposure unit 1 positions an illumination optical system 2, a reticle stage system 4 that holds a reticle 3 on which a pattern is formed, a reticle position measurement unit 5, a projection optical system 6, and a wafer 7 coated with a photosensitive agent. The substrate stage system 8 is provided.

  The illumination optical system 2 introduces illumination light through a beam line from a built-in light source (discharge lamp such as an ultra-high pressure mercury lamp) or a light source device (light source unit) installed separately from the exposure unit 1, and various lenses, Slit light is generated by the diaphragm, and the reticle 3 is illuminated from above. The reticle stage system 4 is a stage that can move in the XY directions. The reticle position measurement unit 5 is a device that measures the position of the reticle 3. The projection optical system 6 reduces and projects the pattern of the reticle 3 onto the wafer 7 at a predetermined magnification (for example, 4: 1). The substrate stage system 8 includes an XY stage 9 that can move the wafer 7 in the XY directions, and a Z stage 10 that can move the wafer 7 in the Z direction. The exposure unit 1 further includes a laser interferometer 11 that measures the position of the XY stage 9 in the XY direction, and a focus unit 12 that measures the position of the wafer 7 in the Z direction.

(Device manufacturing equipment)
FIG. 2 is a schematic view (plan view) showing the device manufacturing apparatus according to the embodiment of the present invention. The device manufacturing apparatus 13 includes an exposure apparatus 15 having the exposure unit 1 shown in FIG.

  The exposure apparatus 15 includes an exposure processing unit 17 including the exposure unit 1, a first transfer unit 19 including a hand 18 that holds a wafer that is a processing target, a control unit 20 that controls the exposure apparatus 15, and a user interface. The input / output device 21 is. Further, the exposure apparatus 15 includes a main power source 22, a sub power source 23, and a first transport control unit 24 that controls the first transport unit 19. These components are arranged in the exposure chamber 25, respectively.

  Here, the main power supply 22 supplies power to at least the exposure processing unit 17, the control unit 20, and the input / output device 21, respectively. On the other hand, the sub power supply 23 supplies power to the first transport control unit 24. The sub power source 23 is configured to continue power supply instead when the power supply to the power supply target by the main power source 22 is interrupted. Specifically, the sub power source 23 can be configured to include, for example, a secondary battery. In this case, when the main power source 22 is normal, the sub power source 23 charges the secondary battery with the power provided from the main power source 22, while the main power source 22 uses the main power source 22 due to an abnormality or a power failure. When the power supply is interrupted, power is supplied to the power supply target by the secondary battery.

  The coating and developing apparatus 16 includes a coating and developing unit 26 including a coating and developing unit having a function of applying a photosensitive agent to a wafer and developing an exposed wafer, a second transport unit 28 including a hand 27 for holding the wafer, and the like. And a control unit 29 for controlling the coating and developing apparatus 16. Further, the coating and developing apparatus 16 includes a main power supply 30, a sub power supply 31, and a second transport control unit 32 that controls the second transport unit 28. These components are arranged in the coating and developing chamber 33, respectively. The operations of the main power supply 30 and the sub power supply 31 are the same as the operations of the main power supply 22 and the sub power supply 23 provided in the exposure apparatus 15.

  In addition, the device manufacturing apparatus 13 includes a delivery station 34 that delivers a wafer between the exposure apparatus 15 and the coating and developing apparatus 16. First, the second transport unit 28 transports the wafer coated with the photosensitive agent to the carry-in unit 35 in the delivery station 34. The first transfer unit 19 receives the transferred wafer in the loading unit 35 and transfers it to the exposure processing unit 17. After the exposure process is completed, the first transfer unit 19 transfers the wafer from the exposure processing unit 17 to the unloading unit 36 in the delivery station 34. Then, the second transfer unit 28 receives the transferred wafer in the unloading unit 36, transfers it to the coating and developing unit 26, and performs development processing.

  The first transfer unit 19 may transfer the wafer to the XY stage 9 shown in FIG. 1 via a wafer alignment unit (not shown). Further, the exposure apparatus 15 may include a plurality of wafer transfer units.

(Substrate holding device)
Next, a substrate holding device according to an embodiment of the present invention will be described. FIG. 3 is a schematic view (side view) showing the configuration of the substrate holding device. The substrate holding device is applied to the carry-in unit 35 or the carry-out unit 36 in the delivery station 34.

  First, the substrate holding device 50 includes a temperature adjusting means 52 on which the wafer 51 is placed, an installation base 53 for holding the temperature adjusting means 52, a push-up pin 54 for moving the wafer 51 up and down, and the push-up pin 54. And a vertical drive mechanism 55 for driving the motor.

  The temperature control means 52 is a plate that controls the temperature of the wafer 51 that is loaded and unloaded, and includes an upper layer chuck layer 57 on which the wafer 51 is placed, an intermediate layer Peltier layer 58, and a lower layer heat dissipation layer 59. Has a three-layer structure. The chuck layer 57 is a soaking layer for managing the temperature of the wafer 51 at a constant temperature and eliminating uneven heat distribution. A temperature sensor 60 is embedded in the chuck layer 57. The Peltier layer 58 is a thermal layer having a thermoelectric element (Peltier element) having a Peltier effect inside. The heat radiation layer 59 is a layer having a heat radiation pipe 61 therein, and releases heat discharged downward from the Peltier layer 58 to the outside by a refrigerant circulating in the heat radiation pipe 61.

  The push-up pin 54 is composed of three pins that can be driven up and down so that the upper end of the push-up pin 54 can protrude and retract with respect to the surface of the chuck layer 57 while passing through the temperature adjusting means 52. A thin tube is penetrated inside the shaft of each pin, and the wafer 51 is pressed against the tip of the pin by vacuum suction by a suction mechanism (not shown). In the present embodiment, the number of pins is three, but the number of pins and the material and shape of the pins are not particularly limited as long as the object of holding the substrate is achieved.

  The vertical drive mechanism 55 includes a support base 62 that supports the push-up pin 54, a linear guide 63 that holds the support base 62 so as to be vertically movable, and a ball screw 64 that is guided by the linear guide 63 and drives the support base 62. And a motor 65 for rotating the ball screw 64.

  The substrate holding device 50 also includes a fall prevention member 66 for preventing the wafer 51 from falling from the chuck layer 57 when the wafer 51 is placed on the chuck layer 57. The fall prevention member 66 is a member having a plurality of protrusions around the chuck layer 57. In FIG. 3, the recognizable enlarged representation is shown, but the actual height of the protrusion is about 1 to 2 mm. Generally, the material of the fall prevention member 66 is a resin, but is not particularly limited.

  Further, the substrate holding device 50 is connected to the suction mechanism provided on the push-up pin 54 and the suction mechanism (not shown) provided on the surface of the chuck layer 57 provided on the temperature adjustment means 52. The vacuum device 67 is provided. Further, the substrate holding device 50 includes a control system 68 that controls the vertical drive mechanism 55 and the vacuum device 67. The control system 68 is a control device including a sequencer or a computer with a built-in recording medium. The control system 68 is communicably connected to the control unit 20 in the exposure apparatus 15.

  Next, a temperature adjustment method of the temperature adjustment means 52 in the substrate holding device 50 will be described. First, in the coating and developing apparatus 16 shown in FIG. 2, the wafer 51 coated with a resist, which is a photosensitive material, is placed on the push-up pins 54 waiting on the temperature adjustment means 52 by the second transport unit 28. Placed. Next, by lowering the push-up pins 54, the wafer 51 is placed in surface contact on the chuck layer 57 of the temperature adjustment means 52 and held by suction. At this time, a plurality of minute pins may be disposed on the chuck layer 57, and the wafer 51 may be placed with a minute gap between the wafer 51 and the chuck layer 57 instead of being in surface contact. On the other hand, a plurality of proximity balls may be provided on the chuck layer 57 instead of the minute pins, and the wafer 51 may be placed on the proximity ball with a minute gap provided between the wafer 51 and the chuck layer 57.

  When the wafer 51 is placed on the chuck layer 57, the heat amount of the wafer 51 is gradually transmitted to the chuck layer 57. Next, the temperature of the chuck layer 57 is raised, and the value of the current supplied to the Peltier layer 58 is PID controlled so that the temperature of the temperature sensor 60 becomes constant with respect to the temperature rise of the temperature sensor 60 accompanying this temperature rise. To do. The Peltier layer 58 absorbs the heat of the chuck layer 57 and converges the temperature of the wafer 51 together with the chuck layer 57 to a desired temperature.

  Next, the operation of the substrate holding device 50 will be described. FIG. 4 is a schematic view showing an operation flow of the substrate holding device 50 according to the embodiment of the present invention. In FIG. 4, the same components as those in FIG. 3 are denoted by the same reference numerals, and description thereof is omitted. In the following description, it is assumed that the wafer 51 is displaced when the wafer 51 is carried in and the wafer 51 is placed on the fall prevention member 66.

  FIG. 4A is a diagram illustrating a case where the wafer 51 is loaded into a position within a range that does not exceed the allowable amount with respect to the normal position on the push-up pin 54. The “regular position” indicates a position where the wafer 51 is carried in at the center of the chuck layer 57 inside the fall prevention member 66. The “allowable amount” indicates a shift range of the loading position where the wafer 51 can be held by the push-up pins 54 without requiring suction.

  Here, after the wafer 51 is placed on the push-up pins 54, the control system 68 confirms whether the loading position of the wafer 51 is a position that does not exceed the allowable amount with respect to the normal position. Specifically, the loading confirmation is determined based on whether the wafer 51 is normally sucked when the wafer 51 is sucked by the push-up pins 54. After the confirmation of the loading of the wafer 51 is completed, the control system 68 drives the push-up pins 54 downward to move the wafer 51 onto the chuck layer 57. In consideration of an improvement in the transfer processing speed of the wafer 51 from the push-up pin 54 to the chuck layer 57, the suction state of the wafer 51 is turned off in advance before the push-up pin 54 is lowered.

  FIG. 4B is a diagram showing a case where the wafer 51 is disposed at a position where the wafer 51 is displaced within the allowable range with respect to the normal position and rides on the fall prevention member 66. Here, since the suction state of the wafer 51 is OFF before the push-up pin 54 is lowered, the control system 68 indicates that the wafer 51 has been placed on the fall prevention member 66 while the push-up pin 54 is being lowered. It cannot be detected by monitoring. Therefore, the control system 68 does not interrupt the transfer sequence for transferring the wafer 51, and the push-up pin 54 continues to be lowered and stops at the designated lower position.

  Next, when the temperature of the wafer 51 is controlled, the control system 68 starts an adsorption sequence for attracting the wafer 51 onto the chuck layer 57 by an unillustrated adsorption mechanism provided on the chuck layer 57. However, since the wafer 51 is on the fall prevention member 66, the chuck layer 57 cannot normally attract the wafer 51. Therefore, an adsorption error occurs, and the control system 68 interrupts the adsorption sequence.

  FIG. 4C shows that when returning from the interruption of the adsorption sequence to the normal operation, the adsorption abnormality, which is a feature of the present invention, is caused by adhesion of foreign matter, or the wafer 51 rides on the fall prevention member 66. It is a figure which shows the start of the sequence which judges whether it originates in.

  First, the control system 68 drives the push-up pin 54 upward from the designated lower position. Here, the control system 68 divides the drive amount of the push-up pin 54 into minute units (for example, about 0.1 mm) so that the wafer 51 does not jump up due to the rise of the push-up pin 54, and the push-up pin 54 is separated. Drive up in stages. Hereinafter, this upward drive method of the push-up pin 54 is referred to as “step upward drive”. Next, the control system 68 executes the step-up drive until the tip of the push-up pin 54 reaches a position (upward limit position) that is one step lower than the height of the fall prevention member 66. Here, “one step” indicates, for example, one unit of the minute unit, and the driving amount from the surface of the chuck layer 57 to a position one step lower than the height of the fall prevention member 66 is “drive”. Defined amount.

  Further, in the step-up drive of the push-up pin 54, when temporarily stopping during each lift-up drive, the control system 68 causes the suction mechanism provided in the push-up pin 54 to perform suction confirmation. Here, when it is confirmed that the suction state of the wafer 51 is turned on before reaching the position one step lower than the height of the fall prevention member 66, which is the final height of the push-up pin 54, the wafer 51 Is placed on the push-up pin 54 in a state parallel to the surface of the chuck layer 57. That is, it can be determined that the wafer 51 does not ride on the fall prevention member 66. On the other hand, if it cannot be confirmed that the suction state of the wafer 51 is ON even at the final height of the push-up pin 54, it can be determined that the wafer 51 is riding on the fall prevention member 66.

  Next, the conveyance sequence and determination sequence of the control system 68, which is a feature of the present invention, will be described with reference to the flowcharts of FIGS. FIG. 5 is a flowchart showing a transport sequence of the control system 68.

  First, the second transport unit 28 transports the wafer 51 from the coating and developing apparatus 16 to the substrate holding device 50 in the carry-in unit 35 (step S1). At this time, the push-up pin 54 of the substrate holding device 50 stands by at the designated upper position.

  Next, after the wafer 51 is transferred, the control system 68 moves the wafer 51 onto the push-up pins 54 in order to check whether the loading position of the wafer 51 is a position that does not exceed the allowable amount with respect to the normal position. Adsorption is performed (step S2).

  Here, when the suction of the wafer 51 is not normally completed, the first transport control unit 24 in the exposure apparatus 15 is configured so that the coating / developing apparatus control unit 29 in the coating / developing apparatus 16 or the second transport control unit 32. Is notified of the substrate position abnormality (step S15). Next, the second transfer unit 28 unloads the wafer 51 from the substrate holding device 50 to the coating and developing apparatus 16, and the control system 68 restores the transfer sequence (step S16).

  On the other hand, when the adsorption of the wafer 51 is normally completed, the control system 68 lowers the push-up pin 54 and places the wafer 51 on the chuck layer 57 (step S3). As described with reference to FIG. 4A, the suction state of the wafer 51 is turned off in advance before the push-up pins 54 are lowered.

  Next, when the temperature of the wafer 51 is adjusted by the temperature adjustment means 52, the wafer 51 is sucked by the suction mechanism provided in the chuck layer 57 (step S4).

  Next, the control system 68 confirms the holding of the wafer 51 based on the result of whether the wafer 51 is normally attracted onto the chuck layer 57 (step S5). Here, when the wafer 51 is normally adsorbed on the chuck layer 57, the control system 68 shifts to a substrate temperature adjustment sequence and starts temperature adjustment of the wafer 51 (step S6). On the other hand, when the wafer 51 is not normally attracted, the process proceeds to a determination sequence for determining whether the wafer 51 has been placed on the fall prevention member 66 (determination step: step S12). The determination sequence will be described with reference to FIG.

  Next, after the substrate temperature adjustment sequence is completed, the control system 68 ends the adsorption of the wafer 51 and releases the wafer 51 from the chuck layer 57 (step S7). Next, the control system 68 turns on the suction of the push-up pins 54 in advance so that the wafer 51 does not shift when the push-up pins 54 are raised (step S8), and drives the push-up pins 54 up (step S8). S9). Next, the control system 68 raises the push-up pin 54 to a predetermined position, and then turns off the suction of the push-up pin 54 (step S10). Then, the first transfer unit 19 in the exposure apparatus 15 unloads the wafer 51 from the substrate holding apparatus 50 and loads the wafer 51 into the exposure processing unit 17 (step S11).

  FIG. 6 is a flowchart showing a determination sequence (step S12) that is a feature of the present invention.

  First, as shown in FIG. 4C, the control system 68 raises the push-up pin 54 from the designated lower position, and starts the step-up drive after the tip of the push-up pin 54 reaches the surface of the chuck layer 57. (Step rising drive process: step S121).

  Next, when temporarily stopping during each ascending drive in the step ascending drive, the control system 68 performs suction confirmation of the push-up pin 54 every time (suction confirmation step: step S122). In order to determine whether or not the wafer 51 is riding on the fall prevention member 66 in the suction confirmation when the push-up pin 54 is temporarily stopped, the control system 68 confirms the holding by the push-up pin 54 (step S123), and then drives. The amount is confirmed (step S124).

  Here, if it can be confirmed that the suction state of the wafer 51 is turned on before the rising drive amount of the push-up pin 54 reaches the drive specified amount, the control system 68 rides the wafer 51 on the fall prevention member 66. It is determined that it is not present (step S127). On the other hand, even if the raising drive amount of the push-up pin 54 reaches the drive specified amount, if it cannot be confirmed that the suction state of the wafer 51 is turned ON, the control system 68 rides the wafer 51 on the fall prevention member 66. (Step S125). If it is determined in step S125 that the wafer 51 is riding on the fall prevention member 66, the control system 68 transmits the detection result to the control unit 20 in the exposure apparatus 15 and stores it (step S126).

  Next, based on the detection result stored in the control unit 20, the exposure apparatus 15 automatically recovers to the transfer sequence of step S9 in FIG. 5 when the loading of the wafer 51 is not detected (step S13). On the other hand, when the loading of the wafer 51 is detected, the control system 68 requests the operator to carry out the substrate, and after the substrate is carried out by the operator, the normal transfer sequence is restored (step S14).

  As described above, according to the present invention, the determination sequence determines whether the cause of the adsorption abnormality is due to adhesion of foreign matter or the like, or due to the board riding on the fall prevention member. It becomes possible. Therefore, in the case of an adsorption abnormality that does not require human intervention by an operator or the like, the substrate transfer sequence can be automatically restored, so that the downtime of the exposure apparatus can be reduced.

(Device manufacturing method)
Next, an embodiment of a device manufacturing method using the above exposure apparatus will be described.

  Devices such as semiconductor elements, liquid crystal display elements, imaging elements (CCDs, etc.), thin film magnetic heads, etc., expose a substrate (wafer, glass plate, etc.) coated with a resist (photosensitive agent) using the above exposure apparatus. Go through the process. Subsequently, a device is manufactured by performing a process of developing the exposed substrate and other known processes. The known processes include at least one process such as oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, and packaging.

(Other embodiments)
The present invention is not limited to the above-described embodiment, and each configuration may be alternatively substituted as long as the object of the present invention is achieved.

  In the above-described embodiment, the case where the positional deviation occurs in the substrate at the time of carrying in the substrate is illustrated. However, for example, even when the positional deviation of the substrate due to external force such as vibration or wind pressure occurs when the push-up pin 54 is driven downward. The present invention is applicable.

  Further, the substrate holding apparatus of the present invention can define the accuracy of the substrate delivery position based on the determination result by the determination sequence shown in step S12. In this case, the fall prevention member is arbitrarily arranged according to the size and shape of the wafer to be transferred in advance. For example, the fall prevention member may be arranged so as to surround the substrate in accordance with a desired delivery accuracy. According to this, if it can be confirmed by the determination sequence that the substrate is not on the fall prevention member, it can be determined that the substrate delivery position satisfies the accuracy.

Note that the present invention can be realized in various forms without departing from the spirit or main features thereof. Accordingly, the above-described embodiment is merely an example in all respects and should not be interpreted in a limited manner.

It is the schematic which shows the structure of the main-body part of the exposure apparatus which concerns on embodiment of this invention. It is the schematic which shows the structure of the device manufacturing apparatus which concerns on embodiment of this invention. It is a schematic diagram showing the composition of the substrate holding device concerning the embodiment of the present invention. It is the schematic which shows the flow of operation | movement of the substrate holding apparatus which concerns on embodiment of this invention. It is a flowchart which shows the conveyance sequence of the control system which concerns on embodiment of this invention. It is a flowchart which shows the determination sequence of the control system which concerns on embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 2 Illumination optical system 3 Reticle 4 Reticle stage system 6 Projection optical system 7 Wafer 8 Substrate stage system 15 Exposure apparatus 34 Delivery station 50 Substrate holding apparatus 51 Wafer 52 Temperature control means 54 Push-up pin 55 Vertical drive mechanism 66 Drop prevention member 68 Control system

Claims (11)

Temperature control means for adsorbing and holding the substrate and adjusting the temperature of the substrate; a fall prevention member for preventing the substrate from dropping from the temperature adjustment means; an adsorption mechanism and a vertical drive mechanism for delivering the substrate A substrate holding method for holding and controlling the temperature of the substrate, comprising a push-up pin provided with a control system for controlling the suction mechanism and the vertical drive mechanism,
A determination step of determining whether the cause of the adsorption abnormality is caused by the board riding on the fall prevention member when the adsorption abnormality occurs when the substrate is adsorbed and held by the temperature control means; A substrate holding method. The determination step further includes
A step-up drive step of dividing the drive amount of the push-up pin into small units, and driving the push-up pin up in stages based on the fine units;
An adsorption confirmation process for confirming adsorption of the substrate at the time of temporary stop during each ascending drive in the step-up drive process,
The substrate holding method according to claim 1, wherein:   The substrate holding method according to claim 2, wherein the rising limit position of the tip of the push-up pin is a position that is one step lower than the height of the fall prevention member.   The substrate holding method according to claim 1, wherein the accuracy of the delivery position of the substrate is defined based on a determination result in the determination step. Temperature control means for adsorbing and holding the substrate and adjusting the temperature of the substrate; a fall prevention member for preventing the substrate from dropping from the temperature adjustment means; an adsorption mechanism and a vertical drive mechanism for delivering the substrate In a substrate holding apparatus comprising a push-up pin provided with a control system for controlling the suction mechanism and the vertical drive mechanism,
The control system determines whether or not the cause of the adsorption abnormality is caused by the board riding on the fall prevention member when the adsorption abnormality occurs when the substrate is adsorbed and held by the temperature control means. A substrate holding apparatus having a determination sequence to perform.   The determination sequence divides the drive amount of the push-up pin into minute units, controls the vertical drive mechanism to drive the push-up pin stepwise based on the minute unit, and further, The substrate holding apparatus according to claim 5, wherein the suction mechanism is controlled so as to check the suction of the substrate when it is temporarily stopped.   The substrate holding apparatus according to claim 6, wherein the rising limit position of the tip of the push-up pin is a position that is one step lower than the height of the fall prevention member.   The substrate holding apparatus according to claim 5, wherein the accuracy of the delivery position of the substrate is defined based on a determination result by the determination sequence. An illumination optical system that illuminates a reticle with light from a light source unit, a reticle stage system that can be moved by placing the reticle, a projection optical system that guides light from the reticle to the substrate, and a substrate that is placed An exposure apparatus having a movable and movable substrate stage system,
At least one of a plurality of substrate holding devices provided in a delivery station that delivers the substrate to the substrate stage system employs the substrate holding method according to any one of claims 1 to 4, or An exposure apparatus comprising the substrate holding apparatus according to claim 5.   The conveyance sequence for conveying the substrate is automatically restored based on the determination result of the determination sequence of the control system included in the substrate holding device according to any one of claims 5 to 8. 9. The exposure apparatus according to 9. A step of exposing the substrate using the exposure apparatus according to claim 9 or 10;
Developing the substrate;
A device manufacturing method characterized by comprising:

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