JP2003289098A - Substrate treatment device, substrate holding device, exposure method, and aligner - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate treatment device which possesses improved responsibility for substrate sucking action and is capable of transferring and holding a substrate and controlling its position with high throughput. <P>SOLUTION: A solenoid valve 39 is changed in condition when an electric current is applied to the solenoid of the solenoid valve 39, and a suction force induced by a vacuum source acts on the substrate mounted on a substrate mounting surface 24A through a suction opening 40 of a substrate holder 24. The solenoid valve 39 is provided near the suction opening 40 inside the substrate holder 24, so that the solenoid valve 39 is low in piping resistance, and a vacuum suction force acts on the wafer soon after the solenoid valve 39 is actuated. That is, responsibility is high. After the solenoid valve 39 is changed in condition, the solenoid valve 39 keeps retaining its condition even if a current is not applied to any of solenoids, and the substrate is kept being sucked up. Therefore, the solenoid valve 39 is restrained from heating, so that the solenoid valve 39 can be installed near the substrate holder 24. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the supply or replacement of substrates, such as transporting a substrate such as a semiconductor wafer, placing it on a stage or the like, subjecting it to a desired process, and transporting it again for recovery. Regarding the substrate processing apparatus to perform,
A substrate processing apparatus capable of handling such a substrate at high speed and appropriately, a substrate holding apparatus for appropriately holding the substrate, an exposure method capable of appropriately performing an exposure process using the substrate processing apparatus, and the same The present invention relates to an exposure apparatus that includes a substrate holding device and can appropriately process a substrate.

[0002]

2. Description of the Related Art Electronic devices such as semiconductor integrated circuits, liquid crystal display elements, and thin film magnetic heads, or photomasks such as reticles for manufacturing these electronic devices (hereinafter simply referred to as microdevices or semiconductor devices).
When manufacturing a wafer, a wafer such as a single crystal substrate or a glass substrate for manufacturing a mask (hereinafter, simply referred to as a substrate) is processed, and oxidation, thin film formation, doping,
Various treatments such as resist treatment, exposure, etching, cleaning, CMP (chemical mechanical polishing) are performed. Substrates loaded in such a process are handled in units of lots of a predetermined number of sheets, are accommodated in a storage case such as a wafer cassette for each lot, and are transported automatically or by an operator. It is supplied to the processing equipment.

In each processing apparatus in each step, each substrate is sequentially taken out from the wafer cassette, transferred to the stage or inside a chamber, the position thereof is controlled with high accuracy, and the processing is sequentially performed in the apparatus. To be done. When the processing is completed, the substrates are transferred again, housed in a housing case such as a wafer cassette, and transported to the processing apparatus for the next process. Therefore, each processing device is a stage device that is mounted on a substrate and holds the substrate to perform position control with high accuracy in order to perform processing in the processing device on a desired region defined on the substrate with extremely high accuracy. A loader for transferring the loaded substrates one by one to such a stage device,
Further, it has a device such as an unloader that collects the processed substrate from the stage device and stores it in a case such as a wafer cassette. That is, each processing apparatus includes a substrate processing apparatus that performs such substrate transfer, holding, and position control,
Usually constructed as a unit.

[0004]

By the way, when mass-producing semiconductor devices manufactured through these steps,
The processing capacity of how many substrates can be processed in a given time in each step, that is, the throughput is very important, and it is desired to improve it. For that purpose, it is necessary to perform the above-described processing such as substrate transfer, holding, and position control at high speed in the processing apparatus of each process, for example, to perform the main processing on the substrate in each processing apparatus such as exposure and polishing at high speed. It's just as important as becoming.

However, in the conventional substrate processing apparatus for performing such substrate transfer, holding, position control, etc., the response of the operation of holding the substrate and the operation of releasing the held substrate is not fast. Needless to say, it is an obstacle to speeding up the processing and improving the throughput. In such a substrate processing apparatus, the substrate is often held by applying a vacuum suction force in order to handle it so as not to mechanically damage the substrate. That is, a suction hole, a suction groove, a suction pad, or the like on which a vacuum suction force acts is provided on the surface contacting the substrate, and the substrate is held by this.

[0006] This vacuum suction mechanism usually has a suction force acting portion such as a suction hole, a suction groove or a suction pad.
A vacuum source, a pipe connecting these, and an electromagnetic valve that is provided in the middle of this pipe and controls whether the vacuum suction force from the vacuum source is applied to the suction force acting part or whether the suction operation is stopped by opening to the atmosphere. And a valve. This solenoid valve normally moves in a stable state where the internal valve body is maintained by elastic force such as spring force, and when the current is applied to the solenoid coil to excite the magnetic force to move the valve body against the elastic force. It is configured to switch the connection of the pipes by switching between the above-mentioned state and the above-mentioned state. Due to the structure of such an electromagnetic valve, it is necessary to keep energizing the solenoid when attempting to maintain the valve body in a state of being moved against the elastic force in order to maintain the suctioned state or the opened state of the substrate. There was a fever. Therefore, in such a vacuum suction mechanism, it is avoided to arrange the solenoid valve near the substrate, and as a result, the distance between the suction force acting portion and the solenoid valve becomes long, and the piping between them becomes long, and From when the solenoid resistance is activated until the suction force is applied, the pipe resistance increases.
Alternatively, it takes a long time from the adsorption action to release, resulting in poor responsiveness.

More specifically, in a substrate processing apparatus provided in, for example, an exposure apparatus, a loader, an unloader, a stage, and a substrate holding table that operates when wafers are transferred between the stage and the loader and the unloader. In the above, a wafer is held by a vacuum suction mechanism using such an electromagnetic valve. However, for example, in a wafer stage or a substrate holding table, even if a space for arranging the solenoid valve can be secured in the stage or the like, arranging the solenoid valve in such a place causes the stage to become hot due to the heat generated, There is a risk of affecting the substrate to be processed, and the solenoid valve has been arranged at a location away from the stage. As a result, the distance from the solenoid valve to the stage becomes long, the piping becomes long, the piping resistance increases, and eventually the time from the operation of the solenoid valve to the adsorption and release of the substrate becomes long, resulting in poor responsiveness. It was Such poor response has a great influence on a manufacturing site where a large number of semiconductor devices are mass-produced, and countermeasures have been desired as a factor for improving throughput.

The present invention has been made in view of the above problems, and an object of the present invention is to improve the response of the suction operation of the substrate, that is, to improve the response time, thereby transferring the substrate. It is an object of the present invention to provide a substrate processing apparatus that can efficiently perform holding, position control, and the like with high throughput. Another object of the present invention is to improve the responsiveness of the suction operation of the substrate and efficiently hold the substrate,
Accordingly, it is an object of the present invention to provide a substrate holding device capable of performing desired processing with high throughput on an arbitrary substrate. Another object of the present invention is to provide an exposure method capable of performing exposure processing on a substrate with high throughput. Further, another object of the present invention is to improve the response of the suction operation of the substrate and efficiently perform the holding of the substrate, etc., so that it is possible to perform exposure with high throughput on an arbitrary substrate. Another object is to provide a simple exposure apparatus.

[0009]

In order to achieve the above object, according to a first aspect of the present invention, a substrate processing apparatus of the present invention is a substrate to be processed as in the invention according to claim 1. Substrate stage (22, 24, etc.) on which (W) is placed
And an opening of any shape such as a hole or a groove formed on the substrate mounting surface (24A) of the substrate stage that exerts an attractive force on the substrate mounted on the substrate stage (22, 24, etc.) In the middle of a pipe (38) that is connected to the first suction portion (40), which is a portion of the opening, and is connected to, for example, an opening on the surface of the opening opposite to the substrate mounting surface and that transmits suction force to the first suction portion. Is provided in the vicinity of the first adsorption portion (40) and has a plurality of solenoids (44, 45), and when any one of the solenoids (44 or 45) changes in state, the solenoid valve (44 or 45) is energized and the valve body (46 ) By moving the first suction part (4
0) and the first solenoid valve (38) for switching the state acting on 0) to the vacuum suction state or the open state. (See Figures 2 and 5)

In the substrate processing apparatus of the present invention having such a structure, the state of the first solenoid valve is changed by energizing a predetermined solenoid among the plurality of solenoids of the first solenoid valve, The suction force from the vacuum source acts on the pipe connected to the first suction section of the substrate stage. This suction force is transmitted to the first adsorption unit via the short pipe between the first electromagnetic valve and the first adsorption unit, which are arranged close to each other, to the first adsorption unit with good responsiveness because of the short pipe. It is applied to the substrate mounted on the substrate mounting surface of the stage. This allows the substrate to
By the suction action of the first suction unit, the substrate is placed on the substrate mounting surface with a force. After the state is changed, the first solenoid valve maintains the state even if any of the plurality of solenoids is not energized, and the adsorption state of the substrate is maintained. Also,
By energizing a predetermined other solenoid among the plurality of solenoids of the first solenoid valve, the state of the first solenoid valve is changed, and the pipe connected to the first adsorption unit of the substrate stage is, for example, the atmosphere. It will be released. The open state to the atmosphere is responsively transmitted to the first adsorption unit via the short pipe between the first solenoid valve and the first adsorption unit because the pipe is short, and the vacuum in the first adsorption unit is reduced. The adsorption state is ended. This allows
The substrate mounted on the substrate mounting surface of the substrate stage is released from the vacuum suction state. In this case as well, after the state changes, the first
The solenoid valve maintains its state, and the released state of the substrate is maintained.

Preferably, the first solenoid valve (38) is
According to the invention of claim 2, the substrate stage (2
2, 24). (See FIG. 2) Further, preferably, in the substrate processing apparatus of the present invention, as in the invention according to claim 3, contamination of the substrate or the substrate mounting surface due to the first electromagnetic valve (38). It further has the 1st pollution prevention member which prevents. With such a configuration, for example, the first
Even if the solenoid valve has a sliding portion, it is possible to prevent dust generation or contamination by oil or the like. At this time, the pollution prevention member may be provided downstream of the solenoid valve, that is, closer to the substrate than the solenoid valve, or for example, a mist filter may be used. Since the pollution prevention member can be a pipe resistance, it is advisable to decide whether or not to install the pollution prevention member in consideration of the installation location of the solenoid valve, the required cleanliness, responsiveness, and the like. Further, it is also possible to use only a solenoid valve that does not generate outgas that becomes a pollutant or does not generate much outgas, and at least the valve body is configured (or its surface is coated).

Further, preferably, in the substrate processing apparatus of the present invention, the substrate mounting surface (24) of the substrate stage (22, 24, etc.) of the substrate (W) is provided as in the invention of claim 4.
A) and the substrate mounting surface (24A) of the substrate stage (22, 24, etc.) of the mounted substrate.
A substrate mounting unit for separating the substrate from the substrate, and a first substrate holding unit (29) for holding the substrate to be mounted and separated.
And a second suction portion (41) formed on the first substrate holding portion (29) for exerting a suction force on the substrate (W),
A plurality of solenoids (44, 45) are provided in the middle of the pipe (42) for transmitting the suction force to the second suction portion, and any one solenoid (44 or 45) is energized only when the state changes. And a second electromagnetic valve (43) for switching the state of acting on the second adsorption section (41) to a vacuum suction state or an open state by moving the valve body (46). ) Is further included. (Fig. 2,
(See 4,5)

Preferably, the second solenoid valve (43) is
According to the invention of claim 5, the substrate stage (2
2, 24). (See Figure 2)

Further, as a preferred specific example, in the substrate processing apparatus of the present invention, the first substrate holding section (29).
Is the substrate mounting portion (2
5) The substrate (W) is held by the suction force acting on the second suction section (41) of 5), and the substrate stage (2) is held.
(2, 24, etc.) by projecting and moving from the substrate mounting surface (24A) in a direction perpendicular to the substrate mounting surface (24A) of the substrate (W) (24).
A) is mounted and the mounted board (W) is separated from the board mounting surface (24A). (See FIGS. 2 and 4)

Preferably, the substrate processing apparatus of the present invention prevents contamination of the substrate or the first substrate holding portion due to the second electromagnetic valve, as in the invention described in claim 7. 2 further has a pollution prevention member. With such a configuration, even if the second solenoid valve has a sliding portion, for example, it is possible to prevent dust generation or contamination by oil or the like. At this time, the pollution prevention member may be provided downstream of the solenoid valve, that is, closer to the substrate than the solenoid valve, or for example, a mist filter may be used. Since the pollution prevention member can be a pipe resistance, it is advisable to decide whether or not to install the pollution prevention member in consideration of the installation location of the solenoid valve, the required cleanliness, responsiveness, and the like. Further, it is also possible to use only a solenoid valve that does not generate outgas that becomes a pollutant or does not generate much outgas, and at least the valve body is configured (or its surface is coated).

Further, the substrate processing apparatus of the present invention comprises:
According to the invention described in (1), the accommodated substrate (W1) is held and conveyed to a position of the substrate mounting portion (25) that can be held by the first substrate holding portion (29), and the substrate mounting portion is held. The substrate (W1) is held by the first substrate holding section (29) in cooperation with (25), and the substrate mounting section (25) is also provided.
Substrate transfer means (52-) for holding the substrate (W) held by the first substrate holding part (29) in association with the substrate mounting part (25) and transferring it to a predetermined accommodation place (51).
55) is further included. (See Figures 1, 3-5)

Preferably, in the substrate processing apparatus of the present invention, the substrate transfer means (52-55) holds a second substrate holding the substrate (W, W1) as in the invention of claim 9. Part (52A, 52B, 53A, 53B) and the second substrate holding part (52A, 52B, 53A, 53B)
A third suction part formed on the substrate (W, W1) for exerting a suction force on the substrate and a pipe for transmitting a suction force to the third suction part, and provided with a plurality of solenoids. A third electromagnetic valve that switches the state of acting on the third adsorbing section to the vacuum suction state or the open state by energizing one of the solenoids and moving the valve element only when it changes. (See Figure 1)

In the substrate processing apparatus according to the present invention having such a structure, for example, the substrate carried by the substrate carrying means is projected from the substrate carrying surface by the substrate carrying part movable in a direction perpendicular to the substrate carrying surface. Receive at the position you made. At this time, the second portion provided for the suction portion (second suction portion) of the substrate holding portion (first substrate holding portion) of the substrate mounting portion.
In the solenoid valve, the state of the second solenoid valve is changed by energizing a predetermined solenoid among the plurality of solenoids, and the suction force from the vacuum source is applied to the pipe connected to the second suction section. Be acted upon. This suction force is transmitted to the second adsorption unit via the short pipe between the second electromagnetic valve and the second adsorption unit, which are arranged close to each other, to the second adsorption unit with good responsiveness because the pipe is short, It is applied to the substrate placed on the first substrate holder. As a result, the substrate is held by the substrate mounting portion with a force due to the suction action of the second suction portion. After the state is changed, the second solenoid valve maintains the state even if any of the plurality of solenoids is not energized, and the substrate suction state is maintained.

Then, in such a state, the substrate mounting portion moves to mount the substrate on the substrate mounting surface. And this time,
By energizing a predetermined solenoid of the plurality of solenoids of the second solenoid valve, the state of the second solenoid valve is changed, and the pipe connected to the second adsorption unit is opened to the atmosphere, for example. . The open state to the atmosphere is responsively transmitted to the second adsorption unit via the short pipe between the second electromagnetic valve and the second adsorption unit because the pipe is short, and the vacuum in the second adsorption unit is reduced. The adsorption state is ended. As a result, the substrate placed on the first substrate holding unit is released from the vacuum suction state, and this time, the action of the suction unit and the first electromagnetic valve relating to the substrate stage described above causes the substrate mounting surface of the substrate stage. Is forced to hold. Even in this case, after the state is changed, the second solenoid valve maintains the state and the released state of the substrate is maintained even if the solenoids are not energized.

Further, in the substrate processing apparatus of the present invention having such a structure, for example, the substrate mounted on the substrate stage has the substrate mounting portion, and the second electromagnetic valve has the first electromagnetic valve as described above. By operating so that the vacuum suction force is applied to the second suction portion of the substrate holding portion, the substrate is received and suction-held from the substrate mounting surface of the substrate stage. In such a state, the substrate mounting portion moves and conveys the substrate to a position on the substrate that protrudes from the substrate mounting surface. Then, this time, the second solenoid valve as described above operates to release the vacuum suction force of the second suction portion of the first substrate holding portion, so that the substrate is removed from the substrate holding portion of the substrate mounting portion. It is released and delivered to the substrate transfer section. Then, the substrate transferred to the substrate transfer section is transferred to a predetermined accommodation position.

Preferably, the substrate processing apparatus according to the present invention prevents contamination of the substrate or the second substrate holding portion due to the third electromagnetic valve, as in the invention described in claim 10. 3 further has a pollution prevention member. With such a structure, even if the third solenoid valve has a sliding portion, for example, it is possible to prevent dust generation or contamination by oil or the like.
At this time, the pollution prevention member may be provided downstream of the solenoid valve, that is, closer to the substrate than the solenoid valve, or for example, a mist filter may be used. Since the pollution prevention member can be a pipe resistance, it is advisable to decide whether or not to install the pollution prevention member in consideration of the installation location of the solenoid valve, the required cleanliness, responsiveness, and the like. Further, it is also possible to use only a solenoid valve that does not generate outgas that becomes a pollutant or does not generate much outgas, and at least the valve body is configured (or its surface is coated).

Further, preferably, in the substrate processing apparatus of the present invention, the substrate stage (22, 24, etc.) is a substrate mounting on which the substrate (W) is mounted as in the invention of claim 11. A holder (24) having a surface (24A), a holder mounting portion (22) on which the holder (24) is mounted,
A fourth suction portion (32) formed on the holder mounting surface of the holder mounting portion (22) for exerting a suction force on the holder (24) placed above, and the fourth suction portion (32). ) Has a plurality of solenoids (44, 45) provided in the middle of the pipe (33) for transmitting the suction force to the valve body () and energizes either solenoid (44 or 45) only when the state changes. 46) by moving the fourth suction part (3
And a fourth solenoid valve (34) for switching the state acting on 2) to the vacuum suction state or the open state. (Figs. 2, 3,
(See 5)

In the substrate processing apparatus of the present invention having such a configuration, the state of the fourth solenoid valve is changed by energizing a predetermined solenoid among the plurality of solenoids of the fourth solenoid valve, The suction force from the vacuum source acts on the fourth suction portion formed on the holder mounting portion and is applied to the mounted holder. As a result, the holder is held by the holder mounting portion with a force. After the state is changed, the fourth solenoid valve maintains the state even if the solenoids are not energized, and the suction state of the holder is maintained. Further, by energizing a predetermined other solenoid among the plurality of solenoids of the fourth solenoid valve, the state of the fourth solenoid valve is changed and connected to the fourth adsorption portion of the holder mounting portion. The piping is opened to the atmosphere, for example. As a result, the vacuum suction state of the fourth suction unit is ended, and the forced holding state of the holder is ended. In this case as well, after the state is changed, the state of the fourth solenoid valve is maintained even if none of the plurality of solenoids is energized.

Preferably, in the substrate processing apparatus of the present invention, as in the invention described in claim 12, a fourth method for preventing contamination of the substrate or the holder mounting surface due to the fourth electromagnetic valve is provided.
Further has a pollution prevention member. With such a configuration, even if the fourth solenoid valve has a sliding portion, for example, it is possible to prevent dust generation or contamination by oil or the like. At this time, the pollution prevention member may be provided downstream of the solenoid valve, that is, closer to the substrate than the solenoid valve, or for example, a mist filter may be used. Since the pollution prevention member can be a pipe resistance, it is advisable to decide whether or not to install the pollution prevention member in consideration of the installation location of the solenoid valve, the required cleanliness, responsiveness, and the like. Further, it is also possible to use only a solenoid valve that does not generate outgas that becomes a pollutant or does not generate much outgas, and at least the valve body is configured (or its surface is coated).

Further, as a preferred specific example, the substrate processing apparatus of the present invention is configured integrally with an exposure apparatus for transferring a desired pattern, as in the invention described in claim 13, and the substrate stage A substrate processing apparatus that supplies the substrate to an exposure apparatus so that the exposure processing is performed on the substrate mounted on the substrate mounting surface.

In order to achieve the above object, according to a second aspect of the present invention, the exposure method of the present invention comprises:
A pattern to be transferred onto the sensitive substrate by holding the sensitive substrate on the substrate mounting surface of the substrate stage using the substrate processing apparatus according to any one of claims 1 to 12 as in the invention described in claim 4. The sensitive substrate is exposed through the mask having the mask formed therein.

In order to achieve the above object, according to a third aspect of the present invention, the substrate holding device of the present invention sucks the back surface of the substrate (W) as in the invention described in claim 15. A substrate holding member (2) having a suction port (40) for holding
4) and a pipe (38) for transmitting a suction force to the suction port
And in the vicinity of the substrate holding member (24), the pipe (3
A solenoid valve (3) interposed in the middle of 8) and switching between a suction state in which a suction force is applied to the suction port or an open state in which the suction force is released by energizing only when the state changes.
9) and.

Preferably, the substrate processing apparatus of the present invention further comprises a contamination prevention member for preventing the substrate or the substrate holding member from being contaminated due to the electromagnetic valve. With such a configuration, even if the solenoid valve has a sliding portion, it is possible to prevent dust generation or contamination by oil or the like. At this time, the pollution prevention member may be provided downstream of the solenoid valve, that is, closer to the substrate than the solenoid valve, or for example, a mist filter may be used. Since the pollution prevention member can be a pipe resistance, it is advisable to decide whether or not to install the pollution prevention member in consideration of the installation location of the solenoid valve, the required cleanliness, responsiveness, and the like. Further, it is also possible to use only a solenoid valve that does not generate outgas that becomes a pollutant or does not generate much outgas, and at least the valve body is configured (or its surface is coated).

In order to achieve the above object, according to a fourth aspect of the present invention, an exposure apparatus of the present invention comprises:
An exposure apparatus for exposing a substrate through a mask on which a pattern is formed, as in the invention described in 7, having the substrate holding device.

In this section, the reference numerals assigned to the corresponding components shown in the accompanying drawings are associated with the respective components of the means for solving the described problems. The above is merely for facilitating understanding, and does not indicate that the means according to the present invention is limited to the modes of the embodiments described later with reference to the accompanying drawings.

[0031]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to FIGS. In this embodiment, a desired pattern used in a semiconductor device manufacturing process (in particular, a lithography process) is transferred onto a sensitive substrate (a wafer as a substrate on which a photoresist is applied on the surface), that is, on the wafer. A substrate processing apparatus applied to an exposure apparatus that exposes a wafer (photoresist) through a reticle (mask) on which a pattern to be transferred is formed. The wafer to be processed is taken out from a wafer cassette, conveyed, and exposed. It is mounted on the wafer stage (substrate stage) with high positional accuracy so that it can be used for processing.
The present invention will be described by exemplifying a substrate processing apparatus that is actually subjected to exposure processing.

FIG. 1 is a perspective view showing the structure of the substrate processing apparatus 1. More specifically, the state where the substrate stage section 10 is positioned at the wafer exchange position (loading position) with respect to the wafer loader section 50 is shown. It is a figure showing. As shown in FIG. 1, the substrate processing apparatus 1 has a substrate stage unit 10 and a wafer loader unit 50.

The substrate stage unit 10 receives the wafer to be processed carried by the wafer loader unit 50, places it on the substrate holder 24 on the upper surface of the substrate stage unit 10, and provides it for desired processing such as exposure. . For that purpose, the substrate stage unit 10 handles the wafer in the upper space of the substrate holder 24 by a moving mechanism capable of two-dimensional movement in the XY plane by an air bearing type guide and a linear motor, and a wafer loader unit 50 and the wafer. Equipped with a wafer holding / moving mechanism that lifts and lowers in an elevator manner.

Further, the wafer loader unit 50 sequentially takes out the wafers of each lot accommodated in the wafer cassette or the like and places them on the substrate holder 24 of the substrate stage unit 10 to perform desired processing in order. To be transported in order. For that purpose, the wafer loader unit 50 has a storage mechanism for storing the wafer, a transfer mechanism for unloading (unloading) the wafer to be processed from the substrate stage unit 10 and returning it to the storage mechanism. When the exposure apparatus is connected to the coater / developer via an infrastructure, the wafer loader unit 50 is used.
The storage mechanism may not be provided in the. That is, the wafer loader unit 5
0 may have at least a transfer mechanism that transfers a wafer between a predetermined position in the exposure apparatus and the substrate holder 24 of the substrate stage unit 10.

Hereinafter, each component will be described in detail.
First, the structure of the substrate stage unit 10 will be described with reference to FIGS. FIG. 2 is a view showing a detailed structure of the substrate stage unit 10, and is a cross-sectional view of the substrate stage unit 10 taken along the line AA in FIG. As shown in FIG. 2, in the substrate stage unit 10, a stage body 13 is provided on the surface (XY plane) of a surface plate 11 via air bearing pads 12A and 12B. An opening 14 is provided at the center of the stage body 13 so as to penetrate in the X direction (direction perpendicular to the plane of the drawing).
The movable linear guide portion 16 extending in the X direction penetrates through the air pads 15A and 15B.

Both ends of the movable linear guide portion 16 are fixed to the Y-direction movable portion 17 supported on the surface plate 11 via air pads 18A and 18B. The Y-direction movable portion 17 has a Y linear motor (not shown) that is guided and supported through a fixed linear guide portion 19 fixed to the surface plate 11 so as to linearly extend in the Y direction via an air pad, This drives in the Y direction. In addition, the stage body 13
, Two X linear motors 20A, 20B are arranged in parallel with the movable linear guide portion 16, and each of the motors 20A, 20B
The B stator, that is, either the coil row or the magnet row, is fixed to the Y-direction movable portions 17 on both sides.

As a result of such a structure, the Y-direction movable portion 1
7, movable linear guide section 16, two X linear motors 20
The stage main body 13 guided and supported by the A and 20B and the movable linear guide portion 16 moves in the Y direction integrally with the driving of the Y direction movable portion 17 along the fixed linear guide portion 19. Also, two X linear motors 20A, 20B
The stage main body 13 guided and supported by the movable linear guide portion 16 moves in the X direction on the surface plate 11 by the driving.

On the stage body 13 having such a structure, three Z-direction linear actuators 21A, 21B,
The ZL stage 22 is provided via 21C.
The Z-direction linear actuators 21A, 21B, and 21C translate the ZL stage 22 in the Z-direction by a small amount, or adjust the tilt with respect to the XY plane by a small amount. Further, at the side end portion of the ZL stage 22, coordinate positions in the XY directions of the stage, minute rotational displacement around the Z axis (yawing), minute rotational displacement around the X axis (rolling), minute rotational displacement around the Y axis ( A movable mirror 23 that reflects a beam from a laser interferometer that measures pitching is provided. Instead of providing the movable mirror 23 on the ZL stage 22, the end surface of the stage body 13 (for example, the XL stage 22) may be mirror-finished to form a reflecting surface.

A substrate holder (for example, a pin chuck holder having a large number of pins formed in a ring-shaped convex portion (rim portion) having a diameter substantially equal to that of the wafer W) 24 is mounted on the ZL stage 22. Has been done. ZL stage 2
The mounting state of the substrate holder 24 on the upper surface 2 will be described with reference to FIG. The substrate holder 24 is the ZL stage 22.
The position is defined by engaging the corresponding positioning hole 31 provided in the substrate holder 24 with the positioning pin 30 provided above. Further, on the ZL stage 22, a vacuum suction pad 32 (fourth suction portion) connected to a holder suction vacuum source (not shown) via a pipe (tube) 33 and a solenoid valve 34 (fourth solenoid valve). ) Is provided, and the bottom surface 24B of the substrate holder 24 is vacuum-adsorbed by this, so that the substrate holder 24 is attached to the ZL stage 22.
Stuck on top.

Further, since the wafer W is adsorbed on the mounting surface 24A of the substrate holder 24, the bottom surface 24B of the substrate holder 24 has a cap 35 connected to the adsorption hole 40 (first adsorption portion) of the mounting surface 24A. Is provided, and a base 36 that engages with the base 35 via a plate spring 37 as an elastic urging member is provided at a position corresponding to this on the ZL stage 22. The base 36 of the ZL stage 22 is connected to a wafer suction vacuum source (not shown) via a pipe (tube) 38 and a solenoid valve 39 (first solenoid valve). Accordingly, when the substrate holder 24 is placed on the ZL stage 22 so that the positioning pin 30 and the positioning hole 31 described above are engaged with each other, the mouthpiece 35 and the mouthpiece 36.
Are brought into close contact with each other by the bias of the leaf spring 37, and a vacuum path between the suction hole 40 provided in the substrate holder 24 and a wafer suction vacuum source (not shown) is formed via the solenoid valve 39. In the substrate stage unit 10, pressure sensors for detecting the vacuum suction state by the electromagnetic valves 34, 39 are provided near the electromagnetic valves 34, 39, but the illustration thereof is omitted.

With this structure, the wafer W to be processed is
At the center of the wafer mounting surface 24A of the ZL stage 22 and the substrate holder 24 that hold the wafer, a center-up portion 25 having three spoke-shaped surface supporting portions is provided as shown in FIG. . This center up part 25
When the wafer W is mounted on the mounting surface 24A of the substrate holder 24 and is vacuum-adsorbed, for example, when the desired processing is performed on the wafer W, for example, 1 is larger than the mounting surface 24A of the substrate holder 24. It is in a state of slightly sinking to the inside of the ZL stage 22 by about 2 mm.

Further, a new wafer W transferred from the load arms 52A and 52B of the wafer loader unit 50 described later.
1 is mounted on the mounting surface 24A of the substrate holder 24, and when the wafer W mounted on the substrate holder 24 is separated from the mounting surface 24A, the unload arms 53A and 53B of the wafer loader unit 50 are separated. When performing the operation of moving to, the center-up portion 25 moves to the upper surface direction (Z direction) of the substrate holder 24, that is, to a position protruding from the mounting surface 24A of the substrate holder 24. The mounting surface 2 of the substrate holder 24
4A, in the upper surface space of the substrate holder 24, the load arms 52A, 52 of the wafer loader unit 50 described later are provided.
B or between the unload arm 53A, 53B,
Wafer transfer is performed. The operation of transferring the wafer between the center-up unit 25 and the load arms 52A and 52B or the unload arms 53A and 53B will be described in detail later.

In order to perform such an operation, on the stage main body 13, a Z drive unit 26 that moves the center-up unit 25 up and down within a predetermined range, and the center-up unit 25 at the center position of the substrate holder 24 are slightly moved. A θ drive unit 27 for rotating the substrate holder 24 and rotating the substrate holder 24 slightly on the ZL stage 22 is provided. Note that FIG. 2 shows a state in which the center-up unit 25 is at the most raised position by the Z drive unit 26. In addition, the substrate holder 24 has the same size as the center-up portion 25 that can pass therethrough.
This spoke-shaped through hole 28 is also used for the ZL stage 2
An opening having a size including the through hole 28 is formed in the center of the second portion 2 so that the center-up portion 25 and the Z drive portion 26 can pass therethrough.

Further, the vertical movement of the center-up portion 25,
Alternatively, the load arm 52A of the wafer loader unit 50,
52B or the unload arms 53A and 53B, in order to properly support the wafer when transferring the wafer,
A suction groove 41 (second suction portion) for sucking the wafer is provided on the upper end surface 29 (first holding portion) of the center-up portion 25. The suction groove 41 is formed by molding the surface of the portion corresponding to each spoke as a concave groove in the center-up portion 25 having three spoke shapes. Each groove is connected to a solenoid valve 43 (second solenoid valve) via a shaft portion of the hollow center-up portion 25 and a pipe (tube) 42 connected to the shaft portion. The electromagnetic valve 43 is connected to a vacuum source for wafer suction for a center-up unit (not shown), and the vacuum suction force by this acts on the suction groove 41 of the center-up unit 25 via the solenoid valve 43. ing. A pressure sensor for detecting the vacuum suction state of the solenoid valve 43 is provided near the solenoid valve 43, but the illustration thereof is omitted. Further, FIG. 2 shows a state in which the wafer W is suction-held on the upper end surface 29 of the center-up portion 25 by this suction action.

Here, the substrate holder vacuum suction solenoid valve 34, the wafer vacuum suction solenoid valve 39, and the center-up wafer suction solenoid valve 43 according to the present invention used in the substrate stage section 10 having such a configuration. , Will be described with reference to FIG. FIG. 5 is a view showing the structure of a solenoid valve using a 5-port 2-point position stabilizing solenoid used as the center-up wafer suction solenoid valve 43. The substrate holder vacuum suction solenoid valve 34 and the wafer vacuum suction solenoid valve 39 have the same structure and operating principle as the center-up wafer suction solenoid valve 43. Solenoid valve 43
Will be described.

The solenoid valve 43 shown in FIG. 5 has two solenoids, a first solenoid 44 and a second solenoid 45. Then, when an electric current is applied to any one of the solenoids, the exciting force acts on the valve element 45, and the valve element 45 is brought into one of the first stable state and the second stable state. Will be migrated. That is, in the solenoid valve 43, the energization of the two solenoids corresponds to the transition to the two stable states, and the transition between the two stable states may be the transition between the states in either direction. It is carried out by the action of the exciting force due to the energization of.

In particular, this position-stabilized solenoid valve 43
In the above, the position of the valve element 45 is maintained by the frictional force even after the solenoid is de-energized and the exciting force on the valve element 45 disappears. Therefore, in the solenoid valve 43, it is sufficient to energize one of the solenoids only when the state is changed, and it is unnecessary to energize the solenoid when maintaining the state. Therefore, in each of the solenoid valves 34, 39, 43 applied to the substrate stage unit 10, the vacuum suction force acts on the vacuum suction pad 32, the suction hole 40 of the substrate holder 24 or the suction groove 41 of the center-up unit 25. The solenoids of the solenoid valves 34, 39 and 43 are energized only when the suction holding of the wafer or substrate holder 24 is started and when the suction action is released by opening them to the atmosphere. And their states are switched.

Further, the position-stabilized solenoid valve 43 is
Has a characteristic of generating very little heat, since it is sufficient to energize only when the state changes and no current needs to be applied to maintain the state. As a result, the solenoid valve 43
Can be installed at a desired position without worrying about heat generation. For an apparatus such as the substrate processing apparatus 1 according to the present embodiment, the responsiveness of the operation of adsorbing and releasing the wafer in the substrate holder 24 and the center-up unit 25 is very important for quick wafer exchange and increasing the throughput of the apparatus. Therefore, high response performance is desired. For that purpose, it is necessary to dispose the solenoid valve as close as possible to a portion where the suction force is applied, shorten the pipe from the solenoid valve, and reduce the pipe resistance.

In the substrate processing apparatus 1 having such a demand, the conventional solenoid valve generates a large amount of heat and cannot be provided in the vicinity of the substrate holder 24. If it is an electromagnetic valve, it can be installed even in the vicinity of the substrate holder 24 with a small amount of heat generation. Therefore, in the substrate stage unit 10,
As shown in FIG. 2, the wafer vacuum suction solenoid valve 39 and the center-up wafer suction solenoid valve 43 are disposed between the stage body 13 and the ZL stage 22, that is, the substrate holder 24.
Alternatively, these solenoid valves 39 called the center-up section 25,
43 is provided at a position very close to a portion for applying or releasing the vacuum suction force.

The substrate holder vacuum suction solenoid valve 34
Is for fixing the substrate holder 24 to the ZL stage 22, and the state is not changed sequentially during a series of wafer processing. Therefore, it is not necessary to provide it in the vicinity of a portion that exerts a special action, and the substrate stage portion 10 of the present embodiment does not show a specific position, but it may be provided in an arbitrary position. Further, the 5-port 2-point position stabilizing solenoid shown in FIG. 5 does not necessarily have to be used as the solenoid valve 34, and a solenoid valve having another configuration may be used.

Next, the structure of the wafer loader section 50 will be described with reference to FIGS. 1 and 2 again. The wafer loader unit 50 is a case 56 separated from the substrate stage unit 10 that accommodates wafers to be processed, a load arm slide guide 54 and an unload slide guide 55 extending from the case 56 toward the substrate stage unit 10. Further, it has a load side arm main body 52C and an unload side arm main body 53C that are guided by these slide guides 54 and 55 to hold the wafer and move between the substrate stage section 10 and the wafer loader section 50.

The position of the substrate stage section 10 is arbitrarily moved, and when the wafer is subjected to processing such as exposure, the position is controlled with high accuracy. And when unloading,
As shown in FIG. 1, the rotation center of the rotary table 51 of the wafer loader unit 50 and the substrate holder 2 of the substrate stage unit 10 are arranged.
The direction connecting the centers of 4 is moved to a position parallel to the slide guides 54 and 55. Hereinafter, description will be made assuming that the substrate stage unit 10 and the wafer loader unit 50 are arranged in such a positional relationship. Further, the extending direction of the slide guides 54, 55 is defined as the Y-axis direction.

The load arm slide guide 54 and the unload arm slide guide 55 are mounted on the substrate holder 24 in parallel with the Y axis from the housing 56 of the wafer loader mechanism 50.
2 is a pair of parallel linear slide guides that are extended to the side of the. This load arm slide guide 54
Further, the load side arm main body 52C extending in the X direction perpendicular to the slide guide 54 is supported by the linear guide (not shown) along the slide guide 54 so as to be linearly movable in the Y direction. Further, the unload arm slide guide 55 has an unload side arm main body 53C extending in the X direction perpendicular to the slide guide 55, guided by the linear motor (not shown) in the Y direction.
It is supported so that it can move linearly in any direction. The load-side arm main body 52C and the unload-side arm main body 53C are in a nesting state when viewed in the XZ plane, and are configured to be able to move by passing each other in the Y-axis direction.

The load side arm main body 52C includes the load arm 52A shown in FIG. 2 and this load arm 52A.
A load arm 52B having a shape and arrangement line-symmetrical to is provided. The upper surfaces of the load arms 52A and 52B have a substrate holding surface provided with a vacuum suction hole for sucking the mounted wafer, and thereby the back surface of the wafer is sucked and held at two positions in the X direction. . The unload arm main body 53C is provided with the unload arm 53A shown in FIG. 2 and the unload arm 53B having a shape and arrangement line-symmetrical to the unload arm 53A. The upper surfaces of these unload arms 53A and 53B are substrate holding surfaces provided with vacuum suction holes for sucking a mounted wafer, and thereby the back surface of the wafer is sucked and held at two positions in the X direction. .

The substrate suction mechanism for applying a vacuum suction force to the vacuum suction holes of the load arms 52A and 52B and the unload arms 53A and 53B is, for example, the wafer loader section 5.
0 inside the housing 56 or the vacuum source provided in the substrate processing apparatus 1, for example, the housing 56 of the wafer loader unit 50, the load arm slide guide 54, the unload arm slide guide 55, the load side arm main body 52C or the unload. It is composed of an electromagnetic valve provided on the side arm body 53C, a pressure sensor for detecting a vacuum suction state by the electromagnetic valve, and a pipe connecting these. The specific configuration thereof is the same as the substrate suction mechanism in the center-up portion 25 including the center-up portion 25, the suction groove 41, the solenoid valve 43, the pipe (tube) 42, and the like described above. Further, the load arms 52A and 52B and the unload arm 53 according to the present invention.
The solenoid valve (third solenoid valve) for controlling the vacuum suction force applied to the vacuum suction holes of A and 53B is the same as the center-up wafer suction solenoid valve 43 whose structure is shown in FIG. Therefore, illustration and detailed description of these structures and operations are omitted.

Incidentally, these load arms 52A, 52B
The unload arms 53A and 53B correspond to the second substrate holding portion recited in the claims, and the vacuum suction holes provided in these correspond to the third suction portions recited in the claims. The substrate holding surfaces of the load arms 52A and 52B and the unload arms 53A and 53B are the rotary table 5
1 is parallel to the upper end surface of the substrate stage 24, the mounting surface 24A of the substrate holder 24 of the substrate stage unit 10 and the substrate holding surface of the center-up unit 25.

The position of the height (Z direction) of the wafer mounting surface (upper surface) of these load arms 52A and 52B is, as shown in FIG.
Is set slightly lower than the height position Pu of the upper end surface when it is most lifted, for example, about several mm. Also,
As shown in FIG. 2, the position of the height (Z direction) of the back surface opposite to the wafer mounting surface (upper surface) of the unload arms 53A and 53B is set to the substrate holder 24 of the substrate stage unit 10.
It is set slightly above the height position Pd of the mounting surface 24A, for example, by several mm. Also, the load arm 52
The heights (Z direction) of the A and 52B and the unload arms 53A and 53B are set so as to be arranged in a hierarchy separated by a predetermined distance that is at least twice the thickness of the wafer W, for example.

As a result, when the center-up portion 25 of the substrate stage portion 10 holds the wafer W and is in the most raised state, the load arm 52A and the unloading are performed between the lifted wafer W and the upper surface of the substrate holder 24. Arm 5
A space into which both 3A can be inserted without contact is formed. In addition, in the stroke in which the load side arm main body 52C and the unload side arm main body 53C move in the Y direction along the load arm slide guide 54 and the unload arm slide guide 55, the wafers held by each other are included. All parts are designed to pass each other without contact.

The rotary table 51 is a mechanism for pre-aligning the wafer and transferring the wafer between the load arms 52A and 52B and the unload arms 53A and 53B, and photoelectrically detects the orientation flat and notch of the wafer W1. And a mechanism for rotating the wafer W1 by 360 ° or more to adsorb the wafer W1 for positioning, and after aligning the orientation flat and the notch in a predetermined direction, the wafer W1 is loaded by the load arm 5
A mechanism similar to that of the center-up part 25 of the substrate stage part 10 is provided for lifting to a position slightly above the upper surfaces of the 2A and 52B.

Although the configurations of the substrate stage unit 10 and the wafer loader unit 50 have been described above, various parts of the substrate processing apparatus 1, namely, the various linear motors, solenoid valves, and the like provided in the substrate stage unit 10 and the wafer loader unit 50. A drive unit such as a Z drive unit of the center-up unit and a correction unit for various positions and inclinations not shown are all operated based on a control signal from a control unit (not shown) included in the substrate processing apparatus 1. , And they work together to perform a desired operation. Further, the control unit is controlled by a higher-order overall control unit or the like, and operates so as to cooperate with a processing unit or the like that performs desired processing on a wafer, such as an exposure unit.

Next, the overall processing flow and operation of the substrate processing apparatus 1 having such a configuration will be described with reference to FIGS. 1 to 5 and further to FIG. 6 shows the operating state of the center-up unit 25 of the substrate stage unit 10, the substrate holder 2
4 is a diagram showing an operating state of No. 4 and operating states of loading and unloading arm portions 52 and 53 of the wafer loader unit 50. Here, as shown in FIG. 1, the preceding one exposed wafer W is suction-held by the substrate holder 24, and the next unexposed wafer W1 is the wafer loader unit 5.
The wafer W is unloaded from the state in which the wafer W is held by the load arms 52A and 52B.
The operation of loading 1 will be described.

First, when the exposure process for the wafer W is completed and the stage body 13 of the substrate stage unit 10 is moved to the wafer unloading / loading position as shown in FIG. A current is applied to one of the solenoids to open the wafer vacuum suction solenoid valve 39 to the atmosphere. As a result, the vacuum suction force applied to the wafer W from the suction holes 40 of the substrate holder 24 via the wafer vacuum suction solenoid valve 39 and the mouthpieces 36 and 37 disappears, and the wafer W is released on the substrate holder 24. It (Process P1)

At the same time as the release of the wafer W on the mounting surface 24A of the substrate holder 24, strictly speaking, the vacuum suction on the mounting surface 24A of the substrate holder 24 of the wafer W is released for several tens of msec to several hundreds. About msec before, the center-up unit 25 starts to slowly rise by the Z drive unit 26. (Process P2) Then, as the upper end surface 29 of the center-up portion 25 reaches the bottom surface of the wafer W1 placed on the placement surface 24A of the substrate holder 24, the center-up portion wafer adsorption electromagnetic valve 43 is formed. When one of the solenoids is energized, the center-up wafer chucking solenoid valve 43 is moved to a state where a vacuum suction force is applied to the upper end surface 29 of the center-up portion 25 via the pipe (tube) 42. (Process P
3)

As a result of these processes, the center-up unit 2
The wafer W placed on the upper end surface 29 of No. 5 is sucked and held by the upper end surface 29 of the center-up portion 25. Then, the pressure sensor (not shown) provided in the vicinity of the center-up unit wafer suction electromagnetic valve 43 sucks the wafer on the upper end surface 29 of the center-up unit 25, and also the wafer vacuum suction electromagnetic valve 39.
When the release of the wafer W from the mounting surface 24A of the substrate holder 24 is confirmed by a pressure sensor (not shown) provided in the vicinity of, the Z drive unit 26 moves the center up unit 25.
Is raised at a high speed, and the center up part 25 is lifted to the maximum raised position Pu. (Process P4)

When the wafer W is lifted to the re-raised position Pu of the substrate holder 24 by the ascent of the center-up portion 25, the unload arm body 53C waiting at the reset position is guided by the unload arm slide guide 55. Moving toward the substrate holder 24, the unload arms 53A and 53B are raised and the center-up part 2 is raised.
5 is arranged on the side of the wafer W and below the wafer W. (Process P5)

When the positioning of the unload arms 53A and 53B is completed, the center-up portion 25 starts to descend slowly (process P6), and at the same time, the center-up portion wafer adsorption solenoid valve 43 is moved to the atmosphere open state and the center-up portion is opened. The suction force of the wafer W on the upper end surface 29 of the portion 25 is gradually weakened (process P7). As a result, the wafer W
Of the unload arm 53A, 53B, and the wafer W is substantially in contact with the upper surface of the unload arm 53A, 53B.
It will be supported by 53B.

When the wafer W comes into contact with the substrate holding surfaces of the unload arms 53A and 53B, the wafer unload solenoid valve (not shown) provided in the wafer loader section 50 is actuated, and the upper surfaces of the unload arms 53A and 53B are removed. The suction holding of the wafer W on the substrate holding surface is started. (Process P
8) Then, the pressure sensor provided in the vicinity of the wafer unloading solenoid valve causes the unload arms 53A and 53A to move.
It is confirmed that the wafer W is securely attracted at B, and the release of the wafer W from the upper end surface 29 of the center-up portion 25 is confirmed by a pressure sensor provided in the vicinity of the center-up portion wafer adsorption electromagnetic valve 43. When the center-up portion 25 is sufficiently lowered so that the upper end surface 29 of the center-up portion 25 is separated from the back surface of the wafer W, the unload arms 53A and 53B start moving the wafer loader portion 50 toward the rotary table 51. , Retracted from the upper surface of the substrate holder 24. (Process P9)

At the same time, the loading arm body 52C moves toward the substrate holder 24. (Process P1
0) Unload arm 5 holding these exposed wafers W
3A and 53B, and the load arms 52A and 52B holding the unexposed wafer W1, slide guide portions 54 and 55.
Will pass each other in the middle of the moving stroke.

The unexposed wafer W1 is the load arm 52A,
When it is transferred to above the substrate holder 24 by 52B, the Z drive unit 26 of the center-up unit 25 is activated again, and the center-up unit 25 starts to move up again. (Process P11) Further, as the upper end surface 29 of the center-up portion 25 comes into contact with the bottom surface of the unexposed wafer W1 held by the load arms 52A and 52B, the center-up portion wafer suction electromagnetic valve 43 is set. The state is changed to the vacuum suction state again, and the upper end surface 29 of the center-up portion 25 starts the vacuum suction operation. (Processing P12) As a result, the wafer W1 held by the unload arms 53A and 53B is supported by the center-up unit 25.

Solenoid valve 43 for wafer suction at center-up section
When the suction support of the wafer W1 by the center-up unit 25 is confirmed by a pressure sensor (not shown) provided in the vicinity of, the loading solenoid valve (not shown) provided in the wafer loader unit 50 is moved to the atmosphere open state. , The attraction force for the wafer W1 by the unload arms 53A and 53B is released. (Process P13) Then, the center-up unit 25 moves up to the highest lift position Pu while holding the wafer W1 (process P14).
As a result, the bottom surface of the wafer W1 is attached to the load arm 52
The wafer W1 is lifted from the substrate holding surfaces of A and 52B.
Is separated from the load arms 52A and 52B.

The load arm 52 of the wafer W1 is controlled by the pressure sensor provided near the loading solenoid valve.
When the release from A and 52B is confirmed, the load arms 52A and 52B are moved from the lower space of the unexposed wafer W1 to the wafer loader section 50 side and retracted to the same reset position as the unload arms 53A and 53B.
(Process P15)

When the unload arms 52A and 52B are retracted, the center-up unit 25 slowly descends while the upper end surface 29 holds the unexposed wafer W1 by suction.
(Processing P16) Then, the wafer W1 held by the center-up unit 25
As the wafer comes into contact with the mounting surface 24A of the substrate holder 24, the wafer vacuum suction electromagnetic valve 39 is moved to the vacuum suction state, and the suction hole 4 in the mounting surface 24A of the substrate holder 24 is moved.
The vacuum suction operation via 0 is started (process P17), the center-up unit wafer suction electromagnetic valve 43 is moved to the atmosphere open state, and the suction operation of the wafer W1 by the center-up unit 25 is finished ( Process P18).

Solenoid valve 43 for wafer suction at center-up section
When the release of the wafer W1 on the upper end surface 29 of the center-up portion 25 is confirmed by a pressure sensor (not shown) provided in the vicinity of the center-up portion 25, the center-up portion 25 is slightly sunk below the mounting surface 24A of the substrate holder 24. It is moved to and maintained at a position. (Processing P19) In this way, the unprocessed wafer W1 is transferred to the substrate holder 24.
After that, the stage main body 13 is moved to a desired position, and the mounted wafer W1 is subjected to pretreatment such as wafer alignment and subsequent exposure treatment.

As described above, the substrate processing apparatus 1 according to the present embodiment
In FIG. 1, as electromagnetic valves 39 and 43 for performing vacuum suction and release of the wafer on the mounting surface 24A of the substrate holder 24 and vacuum suction and release of the wafer on the upper end surface 29 of the center-up portion 25, A 2-solenoid position-stabilized solenoid valve whose structure is shown in FIG. 5 is used. Therefore, it suffices to energize only when the state needs to be changed, power consumption can be reduced, and heat generation in the solenoid valve can be suppressed. as a result,
It becomes possible to provide a solenoid valve in a place very close to the acting portion, that is, between the stage body 13 below the substrate holder 24 and the ZL stage 22, and the solenoid valve acts on the acting portion, that is, the suction hole 40 of the substrate holder 24 or The distance to the upper end surface 29 of the center-up portion 25 can be shortened and the piping resistance can be reduced. By reducing the piping resistance, the operation time from the operation of the solenoid valve to the application and release of the vacuum suction force, that is, the responsiveness can be shortened, and by extension, a series of these steps for loading or unloading the wafer can be performed. It is possible to provide a substrate processing apparatus with a high throughput capable of shortening the wafer processing time and efficiently performing wafer processing.

Further, in such a two-solenoid position-stabilized solenoid valve, any state change is performed by the action of exciting force by energization of the solenoid, so that compared with the case where elastic force such as spring force is used. Control is easy and high-speed switching is possible, and in this respect also, a substrate processing apparatus with higher throughput can be realized.

More specifically, it is mounted on the substrate holder 24 during a process in which the time from the switching of the solenoid valve to the completion of vacuum suction directly affects the processing time, for example, when the wafer is unloaded. Wafer center up part 25
The process of vacuum suction of the wafer by the upper end surface 29 of the center-up portion 25 when the wafer is held by and transferred to the upper portion of the mounting surface 24A, and the suction hole 40 for the wafer mounted on the substrate holder 24 at the time of wafer loading. In a process such as vacuum suction of a wafer through the above, the time from the operation of the electromagnetic valve to the completion of vacuum suction is shortened, and therefore the entire time of a series of wafer processing is also shortened.

Further, in the substrate processing apparatus 1 of the present embodiment, although not shown, the load arms 52A and 52B and the unload arms 53A and 53A of the wafer loader unit 50 are omitted.
The suction and holding of the substrate at 53B are also carried out via a two-solenoid position-stabilized solenoid valve whose structure is shown in FIG. Therefore, it suffices to energize only when the state needs to be changed, power consumption can be reduced, and heat generation in the solenoid valve can be suppressed. Further, since any state change is performed by the action of the exciting force by energizing the solenoid, control is easy and high-speed switching is possible. Further, since the heat generation is small, the solenoid valve is placed at a position as close as structurally possible to the substrate holding surfaces of the load arms 52A and 52B and the substrate holding surfaces of the unload arms 53A and 53B that exert an attractive force on the substrates. It becomes possible to provide the load arms 52A and 52B and the unload arms 53A and 53B.
The responsiveness of holding and releasing the substrate is improved, and a device with higher throughput can be realized as a whole device.

Further, in the substrate processing apparatus 1 of the present embodiment, the electromagnetic valve 34 for holding the substrate holder 24 may also be
A two-solenoid position-stabilized solenoid valve whose structure is shown in FIG. 5 is used. Therefore, even when the substrate holder 24 is kept on the ZL stage 22 for a long time, it is not necessary to keep energizing, power consumption can be reduced, and heat generation can be eliminated. In addition, the substrate holder 24 only needs to insert the positioning hole 31 into the positioning pin 30 and apply the vacuum suction force by the vacuum suction pad 32 as described above.
It is mounted at an appropriate position on the ZL stage 22. Therefore, the ZL stage 22 can be easily removed or attached, and cleaning work or replacement work can be easily performed.

Further, in the wafer loader unit 50 of the substrate processing apparatus 1 of the present embodiment, the wafer is loaded at two positions on both sides of the central portion in the X direction by the load arms 52A and 52B or the unload arms 53A and 53B. It is held and transported. Therefore, even if the vacuum suction action of the wafer on the upper surfaces of the load arms 52A and 52B or the unload arms 53A and 53B becomes defective due to a defect in the vacuum piping system or the like, the wafer does not drop from each load arm. It is possible to safely protect the wafer. In such a case, it is more preferable to stop the movement of the load side arm main body 52C or the unload side arm main body 53C.

By the way, the substrate processing apparatus 1 of the present embodiment
In the (exposure device), as shown in FIG. 5, the position of the valve element 45 is maintained by a frictional force, that is, an electromagnetic valve having a sliding portion is used. Therefore, the solenoid valve (especially the sliding part)
Due to the wafer W, the mounting surface 24A of the substrate holder 24,
The upper end surface 29 of the center-up portion 25, the contact surface of the load arm and unload arm with the wafer W (wafer mounting surface), the contact portion of the ZL stage 22 with the substrate holder 24 (holder mounting surface), and the like are contaminated. May be done. Therefore, in the substrate processing apparatus 1 of the present embodiment, although not shown, a contamination prevention member for preventing contamination of the wafer W or the mounting surface thereof, the holder mounting surface, or the like due to the electromagnetic valves is provided. The sliding parts are prevented from dusting or being contaminated by oil. Specifically, a mist filter is used as the contamination prevention member, and the mist filter is provided on the downstream side of each electromagnetic valve, that is, closer to the wafer W or the substrate holder 24 than the electromagnetic valve.

Since the pollution prevention member may be a pipe resistance, it is not necessary to provide the pollution prevention member for all the solenoid valves 34, 39, 43 and the solenoid valves of the load arm and the unload arm. Considering the position, required cleanliness, responsiveness, and the like, it may be determined whether or not the pollution prevention member is provided. For example, a pollution prevention member may be provided only corresponding to the electromagnetic valves 39 and 43 used for attracting the wafer W by the substrate holder 24 and the center-up unit 25, respectively. In addition, a solenoid valve to which a pollution prevention member is not applied does not generate outgas, which is a pollutant, or a material that does not generate much outgas (such as stainless steel).
It is preferable that at least the valve body is constituted (or its surface is coated).

The present embodiment has been described for facilitating the understanding of the present invention and does not limit the present invention in any way. Each element disclosed in the present embodiment includes all design changes and equivalents belonging to the technical scope of the present invention, and various suitable various modifications are possible. For example, each solenoid valve used in the substrate processing apparatus 1 (exposure apparatus) of the present embodiment is not limited to the 5-port 2-point position stable solenoid shown in FIG. 5, and only when the state changes, for example. Anything that can be energized may be used.
Further, in the substrate processing apparatus 1 (exposure apparatus) of the present embodiment, the solenoid valve shown in FIG. 5 is used for holding the wafer W by the substrate holder 24, the center-up unit 25, and each of the load arm and the unload arm. However, the solenoid valve of FIG. 5 may not be used in all of the substrate holder 24, the center-up part 25, and the load arm and the unload arm, and at least one of them may use the solenoid valve of FIG. You can just do it.

Further, in the substrate processing apparatus 1 of the present embodiment, each of the above electromagnetic valves is provided on the wafer stage, but not all of the above-mentioned electromagnetic valves (FIG. 5) need be provided on the wafer stage. For example, when a cable such as a pipe or a wire connected to the wafer stage is held and a cable carrier that is movable to follow the movement of the wafer stage is provided, at least one of all the solenoid valves described above is provided.
One may be provided on the cable carrier. Although the substrate processing apparatus 1 according to the present embodiment is applied to the exposure apparatus, it is also applied to various apparatuses other than the exposure apparatus, such as an inspection apparatus for a wafer on which a circuit pattern is formed and a laser repair apparatus. be able to.

Further, the operation of the substrate processing apparatus 1 of the present embodiment as described with reference to FIG. 6 is not limited to this, and it may be operated according to an arbitrary control sequence. For example, the mounting surface 24A of the substrate holder 24 starts to release the wafer before the center-up unit 25 adsorbs the wafer, or the unload arm 53A,
The start timing of each operation such as releasing the vacuum suction of the wafer in the center-up unit 25 before the wafer touches 53B may be set arbitrarily. The timing of these operations is variously set in consideration of the effective timing of the action by the operation, the safety of the wafer, the contribution to the improvement of the throughput, etc., but whatever the control sequence is set, The present invention, in which the responsiveness from the operation of the solenoid valve to the vacuum suction and the release of the suction is improved, is effective and is not affected by the conditions such as the control sequence.

Further, in the present embodiment, the suction portion for sucking the substrate placed on the substrate holder 24 is the hole-shaped suction portion 40 as shown in FIG.
The suction portion for sucking the substrate mounted on the upper end surface 29 of the groove 5 is a groove-shaped suction portion 41 as shown in FIG. 4, and the suction portion for sucking the substrate holder 24 mounted on the ZL stage 22 is shown in FIG. The vacuum suction pad 32 is in the form of a pad as shown in FIG. 3, and the suction portion that sucks the substrates mounted on the load arms 52A and 52B and the unload arms 53A and 53B is a hole-shaped suction portion. However, the shape and form of each of these suction parts are not limited to any shape and form. For example, the mounting surface 24A of the substrate holder 24 and the suction portion of the substrate mounting surface of the center-up portion 25 have concentric grooves and an opening connected to a pipe for transmitting a vacuum suction force to the grooves. You may comprise by.

Further, while the center-up portion 25 is moved up and down when loading or unloading the wafer W, the substrate holder 24 may be moved up or down instead of or in addition to it. Further, as shown in FIG. 2, the center-up portion 25 has one pin, but it may have a plurality of pins, for example, three pins. Further, although the wafer W is transferred between the substrate holder 24 and the load arm or the unload arm using the center-up portion 25, the wafer W is transferred between the both without the center-up portion 25. The mounting structure may be adopted. Specifically, for example, JP-A-11-2840
As disclosed in Japanese Laid-Open Patent Publication No. 52-52, the substrate holder 2
4. A notch through which a load arm or an unload arm passes is formed at each of a plurality of peripheral portions of 4, and the substrate holder 24 and each arm are relatively moved in the vertical direction (Z direction) so that each arm passes through the notch. Then, the wafer may be transferred between them.

In addition, the structure of the stage main body 13, the moving method of the stage main body 13, the structure of the substrate holder 24, the shape and structure of the center-up portion 25, the load arms 52A, 5
The shapes of the 2B and the unload arms 53A and 53B, the substrate holding method, the load arm guiding method, and the like are not limited to those in the present embodiment, and can be arbitrarily modified.

[0088]

As described above, according to the present invention, the responsiveness of the suction operation of the substrate is improved, that is, the response time is shortened, whereby the transfer, holding and position control of the substrate can be efficiently performed with high throughput. It is possible to provide a substrate processing apparatus that can perform the processing. Further, according to the present invention, the responsiveness of the suction operation of the substrate can be improved, and the holding of the substrate can be efficiently performed, whereby the desired processing can be performed on any substrate with high throughput. It is possible to provide a simple substrate holding device. Further, according to the present invention, it is possible to provide an exposure method capable of performing the exposure processing of the substrate with high throughput. Further, according to the present invention, it is possible to improve the response of the suction operation of the substrate and efficiently perform the holding of the substrate, etc. As a result, it is possible to perform exposure with high throughput on any substrate. A device can be provided.

[Brief description of drawings]

FIG. 1 is a perspective view showing a structure of a substrate processing apparatus according to an embodiment of the present invention.

2 is a diagram showing a detailed structure of a substrate stage unit of the substrate processing apparatus shown in FIG. 1, and is a cross-sectional view of the substrate stage unit taken along the line AA in FIG.

FIG. 3 is a diagram showing a state in which a mounting surface of a substrate holder is mounted on a ZL stage in the substrate stage unit shown in FIG.

4 is a diagram showing a structure of a substrate holder and a center-up part of the substrate stage part shown in FIG.

5 is a diagram showing the structure of the center-up wafer chucking solenoid valve shown in FIG. 1;

6 is a diagram showing a processing flow of the substrate processing apparatus shown in FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Substrate processing apparatus 10 ... Substrate stage part 11 ... Surface plate 12 ... Air bearing pad 13 ... Stage body 14 ... Opening part 15 ... Air pad 16 ... Movable linear guide member 17 ... Y direction movable part 18 ... Air pad 19 ... Fixed linear guide Part 20 ... X linear motor 21 ... Z direction linear actuator 22 ... ZL stage 23 ... Moving mirror 24 ... Substrate holder 25 ... Center up part 26 ... Z drive part 27 ... θ drive part 28 ... Through hole 29 ... Center up part upper end surface 30 ... Positioning pin 31 ... Positioning hole 32 ... Vacuum adsorption pad 33 ... Piping (tube) 34 ... Substrate holder vacuum adsorption electromagnetic valve 35 ... Base 36 ... Base 37 ... Leaf spring 38 ... Pipe (tube) 39 ... Wafer vacuum adsorption Solenoid valve 40 ... Suction hole 41 ... Suction groove 42 ... Piping (tube) 43 ... Center-up part for wafer suction Solenoid valve 44 ... first solenoid 45 ... second solenoid 46 ... valve body 50 ... loader unit 51 ... turntable 52 ... load arm 53 ... unload arm 54 ... load arm slide guide 55 ... unload arm slide guide

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01L 21/30 502J F term (reference) 5F031 CA02 CA05 DA13 FA01 FA02 FA12 FA15 GA24 GA48 GA50 HA14 HA53 HA58 HA59 JA02 JA10 JA21 KA03 KA06 KA13 KA14 KA20 LA03 LA08 MA22 MA23 MA24 MA26 MA27 MA32 PA23 PA30 5F046 CC08 CC10 CD01

Claims (17)

[Claims] 1. A substrate stage on which a substrate to be processed is mounted, and a first suction unit formed on a substrate mounting surface of the substrate stage for exerting a suction force on the substrate mounted on the substrate stage. And a plurality of solenoids that are provided in the vicinity of the first suction portion of the pipe that transmits the suction force to the first suction portion, and have a solenoid valve that energizes one of the solenoids only when the state changes. And a first electromagnetic valve for switching the state of acting on the first adsorption unit to a vacuum suction state or an open state by moving the substrate. 2. The substrate processing apparatus according to claim 1, wherein the first electromagnetic valve is provided on the substrate stage. 3. The substrate processing apparatus according to claim 1, further comprising a first contamination preventing member for preventing contamination of the substrate or the substrate mounting surface due to the first electromagnetic valve. 4. A substrate mounting portion for mounting the substrate on the substrate mounting surface of the substrate stage and separating the mounted substrate from the substrate mounting surface of the substrate stage, A first substrate holding unit that holds the substrate to be mounted and separated, a second suction unit that is formed on the first substrate holding unit and applies a suction force to the substrate, and a suction unit that sucks the second suction unit. A state in which a plurality of solenoids are provided in the middle of a pipe for transmitting force and a valve element is moved by energizing one of the solenoids to move the valve element only when the state changes is a vacuum state. The substrate processing apparatus according to claim 1, further comprising a substrate mounting portion having a second electromagnetic valve that switches between a suction state and an open state. 5. The substrate processing apparatus according to claim 4, wherein the second electromagnetic valve is provided on the substrate stage. 6. The first substrate holding section holds the substrate by a suction force acting on the second suction section, and the substrate mounting surface of the substrate stage is perpendicular to the substrate mounting surface. The substrate processing apparatus according to claim 4 or 5, wherein the substrate is mounted on the substrate mounting surface and the mounted substrate is separated from the substrate mounting surface by moving the substrate so as to project further. 7. The substrate according to claim 4, further comprising a second contamination preventing member for preventing contamination of the substrate or the first substrate holder caused by the second electromagnetic valve. Processing equipment. 8. The first substrate holding unit holds the accommodated substrate and conveys it to a position of the substrate mounting unit that can be held by the first substrate holding unit, and cooperates with the substrate mounting unit. 5. The substrate transfer means further comprising: a substrate transfer unit for transferring the substrate to the substrate, receiving and holding the substrate held by the first substrate holding unit in association with the substrate mounting unit, and transferring the substrate to a predetermined accommodation place. 7. The substrate processing apparatus according to any one of 7. 9. The substrate carrying means comprises a second substrate holding part for holding the substrate, a third attracting part formed on the second substrate holding part for exerting an attracting force on the substrate, The third suction unit is provided in the middle of a pipe for transmitting suction force to the third suction unit, has a plurality of solenoids, and energizes one of the solenoids to move the valve element only when the state changes, thereby moving the third suction unit. 9. A third solenoid valve for switching the state of acting on the part to a vacuum suction state or an open state.
The substrate processing apparatus according to. 10. The substrate processing apparatus according to claim 9, further comprising a third contamination preventing member for preventing contamination of the substrate or the second substrate holder caused by the third electromagnetic valve. 11. The substrate stage includes a holder having a substrate mounting surface on which the substrate is mounted, a holder mounting part on which the holder is mounted, and a holder mounted on the holder mounting part. A fourth part formed on the holder mounting surface of the holder mounting part that applies suction force to the
And a plurality of solenoids which are provided in the middle of the pipe for transmitting the suction force to the fourth suction portion and the fourth suction portion, and energize one of the solenoids to move the valve element only when the state changes. A fourth solenoid valve for switching the state of acting on the fourth suction portion to a vacuum suction state or an open state by means of.
10. The substrate processing apparatus according to any one of 10 to 10. 12. The substrate processing apparatus according to claim 10, further comprising a fourth contamination preventing member for preventing contamination of the substrate or the holder mounting surface due to the fourth electromagnetic valve. 13. The exposure device, which is configured to transfer a desired pattern onto a sensitive substrate, is integrally formed, and the sensitive substrate is held by a substrate mounting surface of the substrate stage during the transfer.
The substrate processing apparatus according to any one of 1 to 12. 14. A substrate processing apparatus according to claim 1, wherein a sensitive substrate is held on a substrate mounting surface of the substrate stage, and a pattern to be transferred is formed on the sensitive substrate. Method of exposing the sensitive substrate through the mask. 15. A substrate holding member having a suction port for sucking and holding a back surface of the substrate, a pipe for transmitting a suction force to the suction port, and a pipe interposed in the vicinity of the substrate holding member and in the middle of the pipe. A substrate holding device having: a solenoid valve that switches to a suction state in which a suction force is applied to the suction port or an open state in which the suction force is released by energizing only when the state changes. 16. The substrate holding device according to claim 15, further comprising a contamination prevention member for preventing contamination of the substrate or the substrate holding member due to the electromagnetic valve. 17. An exposure apparatus for exposing a sensitive substrate through a mask having a pattern formed thereon, the exposure apparatus having the substrate holding device according to claim 15 or 16.