JP6015984B2 - Object carrying-out method, object exchange method, object holding device, object exchange system, exposure apparatus, flat panel display manufacturing method, and device manufacturing method - Google Patents

Description

  The present invention relates to an object carrying-out method, an object exchanging method, an object holding apparatus, an object exchanging system, an exposure apparatus, a flat panel display manufacturing method, and a device manufacturing method, and more specifically, an object holding apparatus. A method for carrying out from the object holding device, a method for exchanging an object on the object holding member including the object carrying method, an object holding device for holding the object, an object exchange system including the object holding device, the object holding device or The present invention relates to an exposure apparatus including the object exchange system, a flat panel display manufacturing method using the exposure apparatus, and a device manufacturing method using the exposure apparatus.

  Conventionally, in a lithography process for manufacturing electronic devices (microdevices) such as liquid crystal display elements, semiconductor elements (integrated circuits, etc.), a step-and-repeat type projection exposure apparatus (so-called stepper) or step-and- A scanning projection exposure apparatus (a so-called scanning stepper (also called a scanner)) or the like is used.

  As this type of exposure apparatus, one that carries in and out a glass plate or wafer (hereinafter collectively referred to as “substrate”), which is an object to be exposed, with respect to a substrate stage apparatus using a predetermined substrate transfer apparatus is known. (For example, refer to Patent Document 1).

  Here, in the exposure apparatus, when the exposure process on the substrate held by the substrate stage apparatus is completed, the substrate is unloaded from the substrate stage, and another substrate is transported onto the substrate stage, so that a plurality of substrates are transferred. The exposure process is continuously performed on the substrate. Therefore, it is preferable to quickly carry out the substrate from the substrate stage apparatus when performing the exposure process on a plurality of substrates continuously.

US Pat. No. 6,559,928

According to the first aspect of the present invention , there is provided an object exchange method for exchanging an object placed on an object holding member included in an object holding device, wherein an object to be carried is conveyed above the object holding member. Using the object receiving device provided in the object holding device, receiving the object to be carried conveyed above the object holding member, and placing the object on the object placement surface of the object holding member The object to be carried out is guided on a guide surface defined by a guide member included in the object holding device, and the object placement surface is placed on the object holding member using the object carry-out device included in the object holding device. wherein the method comprising carrying out in the direction along the body holding device object that holds the object of the unloading subject, and a moving toward the object unloading position for unloading the object from the object-holding member on the, Previous By carrying out, before the object-holding device reaches the object carry-out position, to that object exchanges method starts the unloading operation for unloading the object from the object-holding member on the, Ru is provided.

According to the second aspect of the present invention , the object holding member having an object placement surface on which the carried object is placed, and capable of holding the object placed on the object placement surface; An unloading device that unloads the object held by the object holding member from the object holding member to the outside, the object holding member having an object processing position at which a predetermined process is performed on the object, The unloading device is provided so as to be movable between an object unloading position where unloading is performed, and the unloading device unloads the object from the object holding member before the object holding member reaches the object unloading position. you start the object-holding device, Ru is provided.

According to a third aspect of the present invention, the object-holding device according to the second embodiment, the loading device for transporting the objects carrying the object above the object holding member, provided on the object holding device, the carry An object exchange system comprising: an object receiving device that receives a target object from the carry-in device; and a guide member that is provided in the object holding device and defines a guide surface that guides the object to be carried out and carried out by the carry-out device. but, Ru is provided.

According to a fourth aspect of the present invention, the object-holding device also according to the second aspect using the energy beam to the object held and object exchange system according to the third aspect, the object-holding device an exposure apparatus and a pattern forming device which forms a predetermined pattern Te is, Ru is provided.

According to a fifth aspect of the present invention, and exposing the object body using an exposure apparatus according to the fourth aspect, a method of making a flat panel display including the method comprising developing the exposed material body, a is , Ru is provided.

According to a sixth aspect of the present invention, and exposing the object body using an exposure apparatus according to the fourth aspect, the method comprising developing the exposed material body, a device manufacturing method comprising the can is provided The

It is a figure which shows schematically the structure of the liquid-crystal exposure apparatus of 1st Embodiment. FIG. 2 is a plan view of a substrate stage (substrate holder), a substrate carry-in device, and a port unit included in the liquid crystal exposure apparatus of FIG. 1. 3A is a cross-sectional view taken along the line AA in FIG. 2, and FIG. 3B is a cross-sectional view taken along the line BB in FIG. 4A and 4B are views (No. 1 and No. 2) for explaining the substrate exchange operation in the liquid crystal exposure apparatus. FIGS. 5A and 5B are views (No. 3 and No. 4) for explaining the substrate exchange operation in the liquid crystal exposure apparatus. FIGS. 6A and 6B are views (No. 5 and No. 6) for explaining the substrate exchanging operation in the liquid crystal exposure apparatus. FIGS. 7A and 7B are views (No. 7 and No. 8) for explaining the substrate exchange operation in the liquid crystal exposure apparatus. 8A and 8B are views (No. 9 and No. 10) for explaining the substrate replacement operation in the liquid crystal exposure apparatus. It is a figure for demonstrating the relationship between a board | substrate and a port part at the time of board | substrate carrying-out. FIGS. 10A to 10C are views (No. 1 to No. 3) for explaining the operation of the substrate when the substrate is carried out. It is a top view of a substrate stage (substrate holder) concerning a 2nd embodiment, a substrate carrying-in device, and a port part. FIG. 12 is a cross-sectional view of the substrate stage (substrate holder), substrate carry-in device, and port portion of FIG. 11. It is a top view of a substrate stage (substrate holder) concerning a 3rd embodiment, a substrate carrying-in device, and a port part. It is sectional drawing of the substrate stage which concerns on 4th Embodiment. FIG. 15A to FIG. 15C are views (No. 1 to No. 3) for explaining the substrate exchanging operation in the fourth embodiment. FIGS. 16A to 16C are views (No. 1 to No. 3) for explaining the substrate replacement operation in the first modified example. FIGS. 17A to 17C are views (No. 4 to No. 6) for explaining the substrate replacement operation in the first modified example. It is a top view of a substrate stage device (a substrate holder and a substrate carry-out device) concerning the 2nd modification. FIGS. 19A and 19B are views (No. 1 and No. 2) for explaining the substrate replacement operation in the third modification. FIGS. 20A and 20B are views (No. 3 and No. 4) for explaining the substrate replacement operation in the third modification.

<< First Embodiment >>
Hereinafter, a first embodiment will be described with reference to FIGS. 1 to 10C.

  FIG. 1 schematically shows the configuration of a liquid crystal exposure apparatus 10 of the first embodiment. The liquid crystal exposure apparatus 10 is a projection exposure apparatus that uses a rectangular (rectangular) glass substrate P (hereinafter simply referred to as a substrate P) used for, for example, a liquid crystal display device (flat panel display) as an exposure object.

  The liquid crystal exposure apparatus 10 holds an illumination system IOP, a mask stage MST that holds a mask M, a projection optical system PL, and a substrate P on which a surface (a surface facing the + Z side in FIG. 1) is coated with a resist (sensitive agent). Including a substrate stage device PST, a substrate carry-in device 80, a port unit 60 for transferring a substrate to and from an external device, and a control system thereof. In the following, the direction in which the mask M and the substrate P are relatively scanned with respect to the projection optical system PL at the time of exposure is defined as the X-axis direction, and the direction orthogonal to the X-axis in the horizontal plane is defined as the Y-axis direction, X-axis, and Y-axis. The direction orthogonal to the axis is defined as the Z-axis direction, and the rotation directions around the X-axis, Y-axis, and Z-axis are described as the θx, θy, and θz directions, respectively. Further, description will be made assuming that the positions in the X-axis, Y-axis, and Z-axis directions are the X position, the Y position, and the Z position, respectively.

  The illumination system IOP is configured similarly to the illumination system disclosed in, for example, US Pat. No. 6,552,775. That is, the illumination system IOP emits light emitted from a light source (not shown) (for example, a mercury lamp) through exposure mirrors (not shown), dichroic mirrors, shutters, wavelength selection filters, various lenses, and the like. Irradiation light) is applied to the mask M as IL. As the illumination light IL, for example, light such as i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm), or the combined light of the i-line, g-line, and h-line is used.

  On the mask stage MST, a mask M on which a circuit pattern or the like is formed is held by suction, for example, by vacuum suction. The mask stage MST is mounted on a lens barrel surface plate 16 which is a part of the apparatus body (body), and has a predetermined length in the scanning direction (X-axis direction) by a mask stage drive system (not shown) including a linear motor, for example. While being driven by a stroke, it is slightly driven as appropriate in the Y-axis direction and the θz direction. Position information (including rotation information in the θz direction) of the mask stage MST in the XY plane is measured by a mask interferometer system including a laser interferometer (not shown).

  Projection optical system PL is arranged below mask stage MST and supported by lens barrel surface plate 16. The projection optical system PL is configured similarly to the projection optical system disclosed in, for example, US Pat. No. 6,552,775. In other words, the projection optical system PL includes a plurality of projection optical systems (multi-lens projection optical systems) in which the projection areas of the pattern image of the mask M are arranged in a staggered pattern, and is a rectangular single unit whose longitudinal direction is the Y-axis direction. Functions in the same way as a projection optical system having one image field. In the present embodiment, as each of the plurality of projection optical systems, for example, a bilateral telecentric equal magnification system that forms an erect image is used.

  For this reason, when the illumination area on the mask M is illuminated by the illumination light IL from the illumination system IOP, the illumination light IL that has passed through the mask M causes the circuit of the mask M in the illumination area to pass through the projection optical system PL. A projected image (partial upright image) of the pattern is formed in the irradiation region (exposure region) of the illumination light IL conjugate to the illumination region on the substrate P. Then, by synchronous driving of the mask stage MST and the substrate stage apparatus PST, the mask M is moved relative to the illumination area (illumination light IL) in the scanning direction, and the substrate P is moved relative to the exposure area (illumination light IL). By performing relative movement in the scanning direction, scanning exposure of one shot area on the substrate P is performed, and the pattern formed on the mask M is transferred to the shot area. That is, in this embodiment, the pattern of the mask M is generated on the substrate P by the illumination system IOP and the projection optical system PL, and the pattern is formed on the substrate P by exposure of the sensitive layer (resist layer) on the substrate P by the illumination light IL. Is formed.

  The substrate stage apparatus PST includes a surface plate 12 and a substrate stage 20 a disposed above the surface plate 12.

  The surface plate 12 is made of a rectangular plate-like member in plan view (viewed from the + Z side), and the upper surface thereof is finished with a very high flatness. The surface plate 12 is mounted on a substrate stage frame 13 which is a part of the apparatus main body. The apparatus main body including the substrate stage pedestal 13 is mounted on a vibration isolator 14 installed on the floor 11 of the clean room, whereby the mask stage MST, the projection optical system PL, etc. vibrate with respect to the floor 11. Separated.

  The substrate stage 20a is mounted on the X coarse movement stage 23X and the X coarse movement stage 23X, and together with the X coarse movement stage 23X, forms a so-called gantry type XY two-axis stage device. Fine movement stage 21 disposed on (upper), substrate holder 30a for holding substrate P, weight canceling device 26 for supporting fine movement stage 21 on the surface plate 12 from below, and a plurality for separating substrate P from substrate holder 30a Substrate lift device 46a (not shown in FIG. 1, refer to FIG. 3A).

  The X coarse movement stage 23X is formed of a rectangular member having a longitudinal direction in the Y-axis direction in a plan view, and a long hole-like opening (not shown) having a longitudinal direction in the Y-axis direction is formed at the center thereof. Yes. The X coarse movement stage 23X is mounted on a guide member (not shown) that extends in the X-axis direction and is installed on the floor 11 separately from the apparatus main body. It is driven with a predetermined stroke in the X-axis direction by an X stage drive system including a linear motor.

  The Y coarse movement stage 23Y is made of a rectangular member in plan view, and an opening (see FIG. 3A) is formed at the center thereof. The Y coarse movement stage 23Y is mounted on the X coarse movement stage 23X via a Y linear guide device 25. For example, during the Y step operation during exposure, the Y coarse movement is performed by a Y stage drive system including a linear motor. It is driven with a predetermined stroke on the stage 23X in the Y-axis direction. The Y coarse movement stage 23Y is moved in the X-axis direction integrally with the X coarse movement stage 23X by the action of the Y linear guide device 25.

  Fine movement stage 21 is formed of a rectangular parallelepiped member having a substantially square shape in plan view. The fine movement stage 21 is controlled by a fine movement stage drive system including a plurality of voice coil motors (or linear motors) including a stator fixed to the Y coarse movement stage 23Y and a mover fixed to the fine movement stage 21. The moving stage 23Y is slightly driven in directions of six degrees of freedom (X axis, Y axis, Z axis, θx, θy, θz directions). In the plurality of voice coil motors, a plurality of X voice coil motors 29x (overlapping in the depth direction of the paper surface in FIG. 1) and fine movement stage 21 are slightly driven in the Y-axis direction. A plurality of Y voice coil motors (not shown) and a plurality of Z voice coil motors 29z (for example, arranged at positions corresponding to the four corners of the fine movement stage 21) for finely driving the fine movement stage 21 in the Z-axis direction are included. .

  Further, the fine movement stage 21 is guided to the Y coarse movement stage 23Y via the plurality of voice coil motors, so that the fine movement stage 21 and the Y coarse movement stage 23Y are along the XY plane in the X axis direction and / or the Y axis direction. Move with a predetermined stroke. The positional information of the fine movement stage 21 in the XY plane is obtained by using a movable mirror (an X movable mirror 22x having a reflective surface orthogonal to the X axis and a reflective surface orthogonal to the Y axis) fixed to the fine movement stage 21 via a mirror base 24. An interferometer (not shown) that irradiates a measuring beam to a Y moving mirror (not shown) having X (an X interferometer that measures the X position of fine movement stage 21 using X moving mirror 22x), and a Y moving mirror. And a Y interferometer that measures the Y position of the fine movement stage 21 using a substrate interferometer system. The configurations of the fine movement stage drive system and the substrate interferometer system are disclosed in, for example, US Patent Application Publication No. 2010/0018950.

  Further, as shown in FIG. 3A, the fine movement stage 21 has a plurality of holes 21a that open to the upper surface (+ Z surface) and the lower surface (−Z surface) (penetrate in the Z-axis direction). Are formed at positions corresponding to the plurality of substrate lift devices 46a. Similarly, a hole 24a is formed in the mirror base 24 at a position corresponding to the substrate lift device 46a.

  As shown in FIG. 2, the substrate holder 30 a is made of a rectangular parallelepiped member having a rectangular shape in plan view with the X-axis direction as the longitudinal direction, and is fixed on the upper surface of the fine movement stage 21. A plurality of holes (not shown) are formed on the upper surface of the substrate holder 30a. The substrate holder 30a can be selectively connected to a vacuum device and a compressor (not shown) provided outside, and holds and holds the substrate P by the vacuum device and is supplied from the compressor. By ejecting the pressurized gas, the substrate P can be floated through a minute clearance. Note that the suction and ejection of the gas may be performed using a common hole, or a dedicated hole may be used for each. Further, the area of the upper surface of the substrate holder 30a is set to be somewhat narrower than the area of the substrate P. When the substrate P is placed on the substrate holder 30a, the end of the substrate P is located at the substrate holder 30a. It protrudes outward from the end of the. This is because the sensitive agent (resist) applied to the front surface (upper surface) of the substrate P may wrap around the rear surface (lower surface) of the substrate P at the end of the substrate P. This is to prevent it from adhering to 30a.

  Further, as shown in FIG. 3A, the substrate holder 30a has a plurality of hole portions 31a that open to the upper surface (+ Z surface) and the lower surface (−Z surface) (penetrate in the Z-axis direction), as will be described later. Are formed at positions corresponding to the plurality of substrate lift devices 46a.

  In addition, as shown in FIG. 2, a plurality (for example, two) of X grooves 73x parallel to the X axis are formed at predetermined intervals in the Y axis direction on the upper surface (substrate mounting surface) of the substrate holder 30a. Yes. The X groove 73x is opened on each side surface of the substrate holder 30a on the + X side and the −X side.

A substrate carry-out device 70a is accommodated in each of the plurality of X grooves 73x. The substrate carry-out device 70a has an X travel guide 71 and a suction device 77a. The X traveling guide 71 is made of a member extending in the X-axis direction, and is fixed to the bottom surface that defines the X groove 73x as shown in FIG. The dimension of the X traveling guide 71 in the longitudinal (X-axis) direction is set longer than the dimension of the substrate holder 30a in the X-axis direction, and both end portions in the longitudinal direction protrude to the outside of the substrate holder 30a. The suction device 77a moves the suction pad 77a ₁ up and down (Z-axis) on the suction pad 77a ₁ for sucking and holding the lower surface of the substrate P (not shown in FIG. 3B; see FIG. 1) and the X traveling guide 71. ) and a Z actuator 77a ₂ is driven in the direction. The suction pad 77a ₁ is made of a plate-like member parallel to the XY plane, and is connected to a vacuum device (not shown) installed outside.

  The suction device 77a is slidably engaged with the X traveling guide 71 in the X axis direction, and is driven on the X traveling guide 71 with a predetermined stroke in the X axis direction. The type of drive device for driving the suction device 77a is not particularly limited. For example, an X linear motor composed of a stator included in the X travel guide 71 and a mover included in the suction device 77a, or an X travel guide 71 is provided. For example, a feed screw device including a feed screw having a nut and a nut of the suction device 77a can be used. Further, a belt driving device that pulls the suction device 77a with a belt (or a rope) or the like may be used.

  The weight canceling device 26 is composed of a single columnar member extending in the Z-axis direction (also referred to as a core column), and supports the central portion of the fine movement stage 21 from below via a device referred to as a leveling device 27. doing. The weight canceling device 26 is inserted into the openings of the X coarse movement stage 23X (not shown in FIG. 2B, see FIG. 1) and the Y coarse movement stage 23Y. The weight canceling device 26 floats on the surface plate 12 through a small clearance via a plurality of air bearings 26a attached to the lower surface portion thereof. The weight cancellation device 26 is connected to the Y coarse movement stage 23Y via a plurality of coupling devices 26b at the center of gravity height position in the Z-axis direction, and is pulled by the Y coarse movement stage 23Y. It moves on the surface plate 12 in the Y-axis direction and / or the X-axis direction together with the moving stage 23Y.

  The weight cancellation device 26 includes, for example, an air spring (not shown), and the weight (vertical downward force) of the fine movement stage 21, the leveling device 27, the substrate holder 30a, and the like by the upward force generated by the air spring. This reduces the load on the plurality of voice coil motors of the fine movement stage drive system. The leveling device 27 supports the fine movement stage 21 from below so as to be swingable (tilt operation) with respect to the XY plane. The leveling device 27 is supported in a non-contact manner from below on the weight cancellation device 26 via an air bearing (not shown). The amount of tilt information of the fine movement stage 21 with respect to the XY plane is obtained by using a target 26d attached to the weight cancellation device 26 by a plurality of Z sensors 26c attached to the lower surface of the fine movement stage 21. The detailed configuration and operation of the weight canceling device 26 including the leveling device 27 and the connecting device 26b are disclosed in, for example, US Patent Application Publication No. 2010/0018950.

  As shown in FIG. 3A, each of the plurality of substrate lift devices 46a is fixed to the upper surface of the Y coarse movement stage 23Y, and the upper surface (substrate mounting surface) of the substrate holder 30a by the Z actuator 47 and the Z actuator 47. And a lift pin 48a driven in the Z-axis (vertical) direction between a position protruding to the + Z side and a position retracted to the -Z side from the upper surface of the substrate holder 30a. The substrate lift device 46a includes lift pins 48a, and the vicinity of the + Z side end thereof is formed in the hole 21a formed in the fine movement stage 21 (or the hole 24a formed in the mirror base 24) and the substrate holder 30a. Is inserted into the hole 31a. A gap is set between the substrate lift device 46a and the wall surface defining the holes 21a and 31a so that the fine movement stage 21 does not come into contact with each other when the fine movement stage 21 is slightly driven on the Y coarse movement stage 23Y. .

  As shown in FIG. 2 (only the lift pin 48a is shown in FIG. 2 and the Z actuator 47 is not shown), the plurality of substrate lift devices 46a are spaced at predetermined intervals so that the lower surface of the substrate P can be supported almost evenly. They are spaced apart from each other. In the first embodiment, a plurality of (for example, four) substrate lift device rows each including a plurality of (for example, four) substrate lift devices 46a arranged at predetermined intervals in the Y-axis direction are provided at predetermined intervals in the X-axis direction. It is arranged. In the first embodiment, for example, the substrate P is separated (lifted) from the substrate holder 30a by using, for example, 24 substrate lift devices 46a, but the number and arrangement of the substrate lift devices 46a are not limited thereto. It is not limited, and can be appropriately changed according to the size of the substrate P, for example.

  Returning to FIG. 1, the substrate carry-in device 80 is disposed above (+ Z side) a port unit 60 described later. As shown in FIG. 2, the substrate carry-in device 80 includes a pair of X travel guides 81, a pair of X slide members 82 provided corresponding to the pair of X travel guides 81, and a pair of X slide members 82. An arranged road hand 83 is provided.

  The pair of X traveling guides 81 are each composed of a member extending in the X-axis direction, and the longitudinal dimension thereof is set somewhat longer than the X-axis dimension of the substrate P. The pair of X traveling guides 81 are arranged in parallel to each other at a predetermined interval in the Y-axis direction (spacing slightly larger than the dimension of the substrate P in the Y-axis direction). Each of the pair of X slide members 82 is engaged with the corresponding X traveling guide 81 so as to be slidable in the X axis direction. , And are driven synchronously with a predetermined stroke along the X travel guide 81.

Loading hand 83 includes a base portion 83 ₁ is a parallel plate-like portion to the XY plane extending in the Y-axis direction, a plurality of (e.g. four) is a X-axis direction parallel to the plate-like portion to the XY plane extending and a support portion 83 _2. Longitudinal direction (Y-direction) dimension of the base portion 83 ₁ is set somewhat shorter than the dimension in the Y-axis direction of the substrate P. A plurality of support portions 83 ₂ are arranged at predetermined intervals in the Y-axis direction, the ends of each of the + X side is integrally connected to the -X side end of the base portion 83 _1. A base portion 83 _1, and the plurality of support portions 83 _2, are integrally formed by, for example, CFRP (Carbon Fiber Reinforced Plastics). The longitudinal direction (X-axis direction) dimension of the plurality of support portions 83 ₂ is set somewhat shorter than the dimension in the X-axis direction of the substrate P, the substrate P includes the -X side of the area of the base portion 83 ₁ by a plurality of support portions 83 _2, is supported from below.

The plurality of support portions 83 ₂ each of the upper surfaces, the suction pads 84 of a plurality arranged in a predetermined interval in the X-axis direction (for example, three) are mounted. A vacuum device (not shown) is connected to the load hand 83, and the substrate P can be sucked and held using the plurality of suction pads 84. Loading hand 83, the base portion 83 ₁ of the + Y side end portion of the -Y side via an attachment member 83 ₃ + Y side are respectively connected to the X slide member 82 on the -Y side, a pair of X slide member By synchronously driving 82 in the X-axis direction, the substrate P is moved between the region above the port portion 60 shown in FIG. 1 and the region near the end on the + X side of the surface plate 12 XY. It can be moved with a predetermined stroke in the X-axis direction parallel to the plane.

  Returning to FIG. 1, the port unit 60 includes a gantry 61 and a substrate guide device 62. The gantry 61 is installed on the floor 11 and on the + X side of the surface plate 12, and is housed in a chamber (not shown) together with the substrate stage device PST.

  A plurality of substrate guide devices 62 are provided corresponding to the base 63, the plurality of Z actuators 64 mounted on the base 63, and the plurality of Z actuators 64, and driven in the vertical (Z-axis) direction by the corresponding Z actuator 64. The guide member 65 is provided. The base 63 is formed of a plate-like member having a rectangular shape in plan view parallel to the XY plane, and is fixed to the lower surface of the base 63 and a plurality of X linear guide members 66 fixed to the upper surface of the gantry 61. Are guided linearly in the X-axis direction by a plurality of X linear guide devices comprising X slide members 67 slidably engaged with each other. The base 63 is driven at a predetermined stroke in the X-axis direction by an X actuator (not shown) (for example, a feed screw device, a linear motor, etc.). Although the kind of Z actuator 64 is not specifically limited, For example, a cam apparatus, a feed screw apparatus, an air cylinder etc. can be used. The plurality of Z actuators 64 are driven synchronously by a main controller (not shown).

  Each of the plurality of guide members 65 is composed of a plate-like member parallel to the XY plane, and supports the substrate P from below. A plurality of minute holes (not shown) are formed on the upper surface of the guide member 65, and pressurized gas (for example, air) is ejected from the holes to support the substrate P in a floating manner through a minute clearance. Be able to. Further, the guide member 65 can also hold the substrate P by suction using the plurality of holes (or other holes).

  Here, the arrangement of the plurality of Z actuators 64 and the plurality of guide members 65 included in the substrate guide device 62 will be described with reference to FIG. In FIG. 2, the Z actuator 64 is not shown hidden behind the guide member 65 (−Z side). In FIG. 2, illustrations of the gantry 61 and the base 63 are omitted. The substrate guide device 62 has, for example, three rows of guide member rows made up of a plurality of guide members 65 arranged at predetermined intervals in the Y-axis direction at predetermined intervals in the X-axis direction. And the most -X side guide member row | line | column is comprised by the eight guide members 65, for example. The middle guide member row of the three guide member rows is constituted by, for example, six guide members 65. Further, the guide member row on the most + X side includes, for example, four guide members 65. As described above, the plurality of guide members 65 are arranged in a greater number in the −X side guide member row than in the + X side guide member row. In the substrate guide device 62, the substrate P is positioned below the Y axis direction. The range that can be supported from the −X side (substrate stage 20a side) is wider than the + X side. For example, the length (width) in the Y-axis direction of the guide member row on the most −X side (substrate stage 20a side) configured by the eight guide members 65 is the length (width) in the Y-axis direction of the substrate P. ) (For example, about 1.5 to 2 times).

Each of the plurality of guide members 65 is in a state where the load hand 83 of the substrate carry-in device 80 is positioned above the port portion 60 (the load hand 83 is positioned at the + X side stroke end). position relative to the plurality of support portions 83 ₂ and the Y-axis direction of the hand 83 are disposed so as not to overlap. Accordingly, when the plurality of guide members 65 are driven in the + Z direction in synchronization with the load hand 83 positioned above the port portion 60, the plurality of guide members 65 come into contact with the load hand 83. Without being able to pass between the _two support portions 832 adjacent to each other. Further, the intervals in the Y-axis direction of the plurality of substrate lift devices 46a included in the substrate stage 20a also correspond to the intervals in the Y-axis direction of the plurality of guide members 65, and the load hand 83 is located above the substrate holder 30a. When the plurality of lift pins 48a are driven in the + Z direction in the positioned state, the plurality of lift pins 48a may pass between the _two support portions 832 adjacent to each other without contacting the load hand 83. It can be done. The shape, number, and arrangement of the plurality of guide members 65 are set such that the dimension in the Y-axis direction on the −X side of the guide surface defined by the plurality of guide members is larger than the dimension in the Y-axis direction of the substrate P. However, the present invention is not limited to this, and can be changed as appropriate.

  In the liquid crystal exposure apparatus 10 (see FIG. 1) configured as described above, the mask M is loaded onto the mask stage MST by a mask loader (not shown) under the control of the main controller (not shown). At the same time, the substrate loading device 80 loads the substrate P onto the substrate holder 30a. After that, alignment measurement is performed by the main controller using an alignment detection system (not shown), and after the alignment measurement, a step-and-scan exposure operation is sequentially performed on a plurality of shot areas set on the substrate. Is done. Since this exposure operation is the same as a conventional step-and-scan exposure operation, a detailed description thereof will be omitted. Then, the substrate on which the exposure processing has been completed is carried out of the substrate holder 30a, and another substrate to be exposed next is transferred to the substrate holder 30a, whereby the substrate on the substrate holder 30a is exchanged, and a plurality of substrates are exchanged. An exposure operation or the like is continuously performed on the substrate.

Hereinafter, the exchange operation of the substrate P on the substrate holder 30a in the liquid crystal exposure apparatus 10 (for convenience, a plurality of substrates P will be referred to as substrate P ₀ , substrate P ₁ , substrate P ₂ , substrate P ₃ ) will be described with reference to FIGS. This will be described with reference to FIG. The following board replacement operation is performed under the control of a main controller (not shown). In order to facilitate understanding, the substrate stage 20a is shown in FIGS. 4A to 5A and FIGS. 6B to 8B, which are cross-sectional views taken along line AA in FIG. (B) and FIG. 6 (A) show cross-sectional views taken along line BB in FIG.

In FIG. 4 (A), the substrate holder 30a of the substrate stage 20a, the substrate _{P 1} is held. Further, the loading hand 83 of the substrate carry-in device 80, after the substrate _{P 1} is unloaded from the substrate holder 30a, and then the substrate _P that is to be carried to the substrate holder 30a ₂ (the next substrate _{P 2)} is Is retained. In addition, the exposed substrate P ₀ is held on the transfer hand 19 of the substrate carry-out robot installed outside the liquid crystal exposure apparatus 10 (see FIG. 1). Here, the shape of the transfer hand 19 of the substrate carry-out robot and the transfer hand 18 of the substrate carry-in robot described later are substantially the same as the load hand 83 of the substrate carry-in device 80, but the load hand 83 is a pair of X travel guides. 81 (not shown in FIG. 4A, see FIG. 2), the transport hand 19 and the transport hand 18 have robot arms 19a and 18a near the + X side ends, respectively. The robot arms 19a and 18a are appropriately controlled to move in the X-axis direction.

The main control unit, among the plurality of shot areas set on the substrate P _1, after exposure for the last shot area has been completed, as shown in FIG. 4 (B), the substrate stage 20a projection optical system From below the PL (see FIG. 1), it is moved to a position near the + X side end on the surface plate 12 and adjacent to the port section 60 (hereinafter referred to as a board replacement position). The substrate replacement position is a substrate unloading position (object unloading position) where the substrate P held by the substrate holder 30a (substrate stage 20a) is unloaded from the substrate holder 30a (substrate stage 20a) as described later. be able to.

Furthermore, the substrate stage 20a is in parallel with moving the substrate exchange position, the substrate carry-in device 80, the load hand 83 is driven in the -X direction, thereby the substrate P ₂ is positioned above the substrate exchange position. In the port portion 60, the Z positions of the plurality of guide members 65 are controlled such that the Z position of the upper surface thereof is substantially the same as the Z position of the upper surface of the substrate holder 30a.

When the substrate stage 20a is positioned at the substrate exchange position, the main controller, as shown in FIG. 5 (A), together to release the suction holding the substrate P ₁ by the substrate holder 30a, the pressure from the upper surface of the substrate holder 30a gas was allowed to ejected floating the substrate P _1. Further, for example, each of the suction pads 77a ₁ (not shown in FIG. 5A, see FIG. 3B) of each of the two substrate carry-out devices 70a (one not shown in FIG. 5A) is driven in the + Z direction. , it sucks and holds the lower surface of the substrate _{P 1.}

Thereafter, as illustrated in FIG. 5B, the suction device 77 a is driven in the + X direction on the X travel guide 71. Thus, the substrate P ₁ sucked and held by the suction pad 77a ₁ is aligned in the + X direction along a surface (guide surface) parallel to the XY plane formed by the upper surface of the substrate holder 30a and the upper surfaces of the plurality of guide members 65. It moves and is carried out from the substrate holder 30a to the port unit 60. At this time, pressurized gas is also ejected from the upper surfaces of the plurality of guide members 65. This makes it possible to move the substrate P ₁ high speed, low dust generation.

When unloading of the substrate P ₁ is completed, as shown in FIG. 6 (A), the substrate stage 20a, a plurality of substrate lift device 46a is controlled synchronously to move the lift pins 48a is in the + Z direction. At this time, each of the plurality of lift pins 48a, passes between the supporting portion 83 ₂ of the loading hand 83 to press the lower surface of the substrate P ₂ from below. Further, the loading hand 83, suction holding of the substrate P ₂ by the plurality of suction pads 84 is released. As a result, the substrate P ₂ is separated from the load hand 83. Furthermore, the port portion 60, a substrate guide device 62 which supports the substrate P ₁ is driven in the + X direction.

When the substrate P ₂ and load the hand 83 is spaced, as shown in FIG. 6 (B), it is driven to load the hand 83 is the + X direction, and retreated from above the substrate exchange position, above the position of the port portion 60 Return. Furthermore, the port portion 60, a plurality of guide members 65 are driven somewhat on the -Z side, the substrate P ₁ is moved slightly in the -Z direction. Furthermore, the substrate P _0, which is placed on the conveying hand 19 of the substrate carry-out robot while being conveyed to an external device, transfer hand 18 of the substrate loading robot comes to transporting the another substrate P ₃ from the external device.

Thereafter, as shown in FIG. 7 (A), the substrate stage 20a, a plurality of substrate lift device 46a is controlled synchronously so that the lift pins 48a is moved in the -Z direction, thereby the substrate P ₂ is the substrate holder 30a is placed on the upper surface of (being separated from the lower surface of the lift pin 48a and the substrate _{P 2).} Substrate _{P 2} is attracted to and held on the substrate holder 30a. In parallel with the suction holding operation of the substrate P _2, the substrate carry-out device 70a, the suction device 77a positioned at the + X side end portion on the near X running guide 71 (see Figure 2, respectively), -X direction To the position near the end of the X traveling guide 71 on the −X side.

Further, in the sky above the port portion 60, the conveying hand 18 of the substrate loading robot supporting the substrate P ₃ is driven in the -X direction, a pair of X running guide 81 (FIG. 7 of the substrate carry-in device 80 (A) In the not shown (See FIG. 2). Thereby, the conveyance hand 18 of the substrate loading robot and the load hand 83 of the substrate loading device 80 are arranged so as to overlap each other in the vertical direction. Also, transfer hand 19 of the substrate carry-out robot is driven in the -X direction, it is inserted into the lower substrate P _1. As described above, since the transport hand 19 has substantially the same shape as the load hand 83, it does not come into contact with the Z actuator 64 for driving the guide member 65. Thereby, the transfer hand 19 of the substrate carry-out robot and the load hand 83 of the substrate carry-in device 80 are arranged so as to overlap in the vertical direction.

Thereafter, by the plurality of guide members 65 are driven in the -Z direction, the substrate P ₁ is delivered to the conveying hand 19 of the substrate carry-out robot. Transfer hand 19 supporting the substrate P _1, as shown in FIG. 7 (B), is driven in the + X direction, it conveys the substrate P ₁ to an external device. Instead of driving the plurality of guide members 65 in the −Z direction and delivering the substrate P ₁ to the transport hand 19 of the substrate unloading robot, the transport hand 19 drives the substrate unloading robot in the + Z direction to transfer the substrate P _1. You may receive it. Also, it may be performed to transfer the substrate P ₁ by driving a plurality of guide members 65 and the substrate carry-out robot in the Z-direction, respectively.

After hands over the exposed substrate P ₁ to the conveying hand 19 of the substrate carry-out robot, each of the plurality of guide members 65, are driven in synchronism with the + Z direction as shown in FIG. 8 (A). Each of the plurality of guide members 65 faces the lower surface of the substrate P ₃ without contacting the load hand 83 and the transport hand 18, and is separated from the transport hand 18 by lifting the substrate P ₃ . At this time, the substrate P ₃ is attracted and held by the plurality of guide members 65.

Thereafter, as shown in FIG. 8B, the transfer hand 18 of the substrate loading robot is driven in the + X direction and retreats from the area above the port unit 60. Then, each of the plurality of guide members 65 for supporting the substrate P ₃ from below are driven synchronously in the -Z direction. At this time, each of the plurality of guide members 65 while passing between the support portions 83 ₂ adjacent to each other in the loading hand 83, the substrate P ₃ is supported from below on the supporting portion 83 ₂ of the load hand 83. Thus, the substrate _{P 3} is passed to the load hand 83 from the guide member 65, the state (but shown in FIG. 4 (A), the substrate _{P 0} is the substrate _{P 1,} the substrate _{P 1} is the substrate _{P 2,} a substrate the P ₂ is the substrate _{P 3,} back to are replaced respectively). In FIG. 7 (B) ~ FIG 8 (B), although the substrate stage 20a which holds the substrate _{P 2} are shown, after the substrate _{P 2} sucked and held in FIG 7 (A), immediately ports 60 Alignment measurement, exposure processing, etc. may be started away from.

As described above, according to the first embodiment, the upper surface of the substrate holder 30a is used as a guide surface for unloading the substrate P (the substrate P _{1 in} FIGS. 4A to 8B). When moving the substrate P away from the substrate holder 30a for carrying out the substrate, the moving amount (rising amount) of the substrate P may be small. Therefore, it is sufficient that there is a space in which the load hand 83 can be inserted above the substrate holder 30a of the substrate stage 20a in a state where the substrate stage 20a is located at the substrate replacement position. Therefore, even when the space between the substrate holder 30a and the lens barrel surface plate 16 (see FIG. 1) is narrow, the substrate on the substrate holder 30a can be quickly replaced.

  In addition, since the substrate stage 20a has the substrate carry-out device 70a, before the substrate stage 20a reaches the substrate exchange position, that is, when the exposure process to the final shot area is completed and moved to the substrate exchange position, In parallel with the movement, the unloading operation of the substrate P can be started. Therefore, the cycle time for exchanging the substrate on the substrate holder 30a can be shortened, and the number of substrates P processed per unit time can be increased. On the other hand, when the substrate carry-out device is provided outside the substrate stage 20a (for example, the port unit 60), the substrate stage 20a must be positioned at the substrate exchange position in order to start the substrate carry-out operation. In addition, it takes time to carry out the substrate compared to the first embodiment.

  Here, for example, when a plurality of shot areas are set on the substrate P, the shot area where the exposure process is performed last is usually the + Y side of the substrate P or -Y to reduce the total movement amount of the substrate P. Set to the side. Therefore, the substrate stage 20a after the exposure processing for the last shot area is completed moves in the X-axis direction and also in the Y-axis direction (moves in an oblique direction with respect to the X-axis). On the other hand, in the first embodiment, as shown in FIG. 9, among the plurality of guide members 65, the guide member row Y including, for example, eight guide members 65 arranged on the most −X side. Since the dimension in the axial direction is set longer than the dimension in the Y-axis direction of the substrate P, even when the substrate stage 20a moves in an oblique direction with respect to the X-axis, the substrate holder 30a of the substrate P The portion protruding from the + X side end is supported from below by the guide member 65. Thereby, the board | substrate P can be carried out more rapidly.

Specifically, using FIG. 10A to FIG. 10C, as shown in FIG. 10A, for example, six shot regions are set on the substrate P, and the last shot among them is set. region is the shot area S _6, which is set on the + Y side and the + X side of the substrate P. The center of the substrate P before the start of the exposure operation for the shot areas S ₆ is located at the position CP _1, the center of the substrate P when the exposure operation is completed, located at position CP _2. In addition, in FIG. 10 (A)-FIG.10 (C), illustration of the board | substrate carrying-out apparatus 70a, the port part 60, etc. is abbreviate | omitted.

In the first embodiment, the position of the substrate stage 20a can be controlled so that the center of the substrate P passes through the order of the positions CP ₁ → CP ₂ → CP ₃ in FIG. That is, if it is assumed that the dimension in the Y-axis direction of the guide member row closest to the −X side (see FIG. 9) is approximately the same as the dimension in the Y-axis direction of the substrate P, the substrate P becomes X when the substrate P is unloaded. Since it moves parallel to the axial direction, the Y position control of the substrate stage 20a is performed so that the center in the Y-axis direction of the guide member row on the most -X side and the center in the Y-axis direction of the substrate P substantially coincide with each other. In this case, it is necessary to control the position of the substrate stage 20a so that the center of the substrate P passes through the order of the positions CP ₁ → CP ₂ → CP ₄ → CP ₃ in FIG. On the other hand, in the first embodiment, the + X side end of the substrate P is supported by the guide member 65 regardless of the Y position of the substrate stage 20a, so that the substrate stage 20a is exposed to the final shot region. The substrate P can be moved directly to the substrate exchange position (position CP ₃ ) from the end position (position CP ₂ ), and the substrate P can be carried out quickly. After the substrate stage 20a is positioned at the substrate exchange position, the substrate P moves in parallel to the X axis as shown in FIG.

<< Second Embodiment >>
Next, a second embodiment will be described with reference to FIGS. Since the liquid crystal exposure apparatus according to the second embodiment is the same as the liquid crystal exposure apparatus 10 (see FIG. 1) of the first embodiment except for the configuration of the substrate holder 30b, only the differences will be described below. Elements having the same configuration and function as those of the first embodiment are denoted by the same reference numerals as those of the first embodiment, and description thereof is omitted.

In the first embodiment, the substrate P moves with the upper surface of the substrate holder 30a as a guide surface when the substrate is unloaded (see FIGS. 5A and 5B). , as shown in FIG. 12, that the unloading of the substrate P ₁ is carried out is different from the guide member 48b which is attached to the Z actuator 47 of each of the plurality of substrate lift device 46b as a guide surface.

In the substrate stage 20b according to the second embodiment shown in FIG. 11, on the upper surface of the substrate holder 30b, a plurality (e.g., four) at predetermined intervals X groove 31b ₁ extending in the X-axis direction in the Y-axis direction is formed ing. Further, as shown in FIG. 12, through holes 31b ₂ penetrating the substrate holder 30b in the vertical direction are formed on the bottom surface defining the X groove 31b ₁ at predetermined intervals (for example, three) in the X axis direction. , in its through-hole 31b _2, a portion of the Z actuator 47 is inserted.

Guide member 48b is (three for example) a plurality at predetermined intervals in the X-axis direction in one of the X groove 31b ₁ are housed. The guide member 48b is composed of a plate-like member parallel to the XY plane. The Z actuator 47 causes the upper surface of the guide member 48b to protrude to the + Z side from the upper surface (substrate mounting surface) of the substrate holder 30b and the upper surface of the substrate holder 30b. Driven synchronously in the Z-axis (vertical) direction with the position retracted to the Z side. A plurality of minute holes (not shown) are formed on the upper surface of the guide member 48b, and pressurized gas (for example, air) is ejected from the holes to support the substrate P in a floating manner through a minute clearance. Be able to. In the second embodiment, for example, four X grooves 31b ₁ are formed. However, the number of X grooves 31b ₁ and the number and arrangement of the guide members 48b are not limited thereto. It can be appropriately changed according to the size of the.

In the second embodiment, as shown in FIG. 12, when the substrate P to be carried out (the substrate P _{1 in} FIG. 12) is carried out, the suction and holding of the substrate P ₁ by the substrate holder 30b is released. by a plurality of guide members 48b is driven in the + Z direction, the lower surface of the substrate P ₁ is separated from the upper surface of the substrate holder 30b. Then, for example, two substrate carry-out device 70a (one is 12 the not shown) each of the suction pads 77a ₁ (see FIG. 11) is driven in the + Z direction, and the suction holding the lower surface of the substrate _{P 1,} the suction pad 77a By driving ₁ in the + X direction, the substrate P ₁ moves in the + X direction along a plane (guide surface) parallel to the XY plane formed by the upper surfaces of the plurality of guide members 48b, and the port from the substrate holder 30b It is carried out to the part 60. Regarding the carrying operation to another substrate P ₂ of the substrate holder 30b, a point that is supported from below in a plurality of guide members 48b and the substrate P ₂ is changed to a plurality of lift pins 48a (see FIG. 3 (A)) Except for this, since it is the same as that of the first embodiment (the plurality of guide members 48b also function as the plurality of lift pins 48a), the description thereof is omitted. According to the second embodiment, there is no need to form a hole for ejecting pressurized gas for floating the substrate P on the upper surface of the substrate holder 30b.

<< Third Embodiment >>
Next, a third embodiment will be described with reference to FIG. In the first and second embodiments, the substrate holders 30a and 30b (see FIGS. 2 and 9 respectively) have the substrate carry-out device 70a, whereas in the third embodiment, FIG. As shown, the substrate stage 20c has a substrate carry-out device 70a on the + Y side and the −Y side of the substrate holder 30c outside the substrate holder 30c. For example, the configuration of each of the two substrate carry-out devices 70a is the same as that in the first embodiment. Further, since the portions other than the arrangement of the substrate carry-out device 70a are the same as those in the second embodiment, only the differences will be described below, and elements having the same configurations and functions as those in the first and second embodiments will be described below. The same reference numerals as those of the second embodiment (or the first embodiment) are used, and the description thereof is omitted.

  In the third embodiment, the amount of protrusion (protrusion) of the substrate P from the + Y side and −Y side ends of the substrate holder 30c is set to be larger than that in the first and second embodiments. One substrate carry-out device 70a is arranged below the portion of the substrate P that protrudes from the substrate holder 30c to the + Y side, and the other substrate carry-out device 70a is arranged from the substrate holder 30c to the -Y side of the substrate P. It is arranged below the protruding part. Although not shown in FIG. 13, for example, each of the two substrate carry-out devices 70a is provided via a support member fixed to the upper surface of a Y coarse movement stage 23Y (see FIG. 1) disposed below the substrate holder 30c. The Y coarse movement stage 23Y is attached. That is, for example, each of the two substrate carry-out devices 70a is arranged separately from the substrate holder 30c.

  In the third embodiment, for example, each of the two substrate carry-out devices 70a is disposed outside the substrate holder 30c, so that a groove or the like for accommodating the substrate carry-out device 70a needs to be formed in the substrate holder 30c. Therefore, a decrease in rigidity of the substrate holder 30c can be suppressed. Further, since the substrate P can be sucked and held in a wider area, the flatness of the substrate P can be improved. Moreover, since the substrate holder 30c can be reduced in weight and the reaction force when driving the suction device 77a does not act on the substrate holder 30c, the position controllability of the substrate holder 30c (substrate P) is improved. Moreover, since the board | substrate carrying-out apparatus 70a is arrange | positioned outside the board | substrate holder 30c, it is excellent also in maintainability.

<< Fourth Embodiment >>
Next, a fourth embodiment will be described with reference to FIGS. 14 to 15C. In the third embodiment (see FIG. 13), the configuration of the substrate carry-out device 70a is the same as that in the first embodiment. On the other hand, in the fourth embodiment shown in FIG. The configuration of the device 70d is different. Since the portion other than the configuration of the substrate carry-out device 70d is the same as that of the third embodiment, only the differences will be described below, and elements having the same configuration and function as those of the third embodiment are described below. The same reference numerals as those in the third embodiment (or the first and second embodiments) are attached, and the description thereof is omitted.

In the substrate stage 20d according to the fourth embodiment, similarly to the third embodiment (see FIG. 13), the substrate carry-out device 70d is connected to the substrate holder 30c on the + Y side and the −Y side of the substrate holder 30c. They are arranged separately. The substrate carry-out device 70d is movable on the support member 28 fixed on the upper surface of the Y coarse movement stage 23Y from below, and on the X travel guide 71 with a predetermined stroke in the X-axis direction. A Y linear guide device 78 and a suction device 77d mounted on the X travel guide 71 via the Y linear guide device 78 are provided. Adsorber 77d includes a suction pad for attracting and holding the lower surface of the substrate P _1. The Y linear guide device 78 has a Y actuator (not shown) so that the suction device 77d can be driven with a predetermined stroke in the Y-axis direction with respect to the X travel guide 71. Further, the Z position on the lower surface of the suction device 77d is located slightly on the + Z side with respect to the Z position on the upper surface of the substrate holder 30c. The types of the X actuator that drives the Y linear guide device 78 in the X-axis direction and the Y actuator that drives the suction device 77d in the Y-axis direction are not particularly limited. For example, a feed screw device, a linear motor, or the like is used. be able to. Further, unlike the first to third embodiments, the suction device 77d does not have a Z actuator that drives the suction pad in the Z-axis direction.

In the fourth embodiment, from the state in which the substrate P is placed on the substrate holder 30c shown in FIG. 15A, the plurality of guide members 48b incorporated in the substrate holder 30c (or the fine movement stage 21 ( 14) is driven in the −Z direction), the substrate P (substrate P _{1 in} FIG. 14) is lifted from the upper surface of the substrate holder 30c, and then, for example, 2 as shown in FIG. 15B. The suction device 77d of each of the two substrate carry-out devices 70d is driven in a direction approaching the substrate holder 30c (see the arrow in FIG. 15B). Thus, the inserted (see FIG. 14 to the lower surface of the substrate P of the suction device 77d is the substrate holder 30c. However, in FIG. 14, the upper surface of the lower surface and the substrate holder 30c adsorbing device 77d is the substrate _{P 1} Inserted between).

Thereafter, the plurality of guide members 48b are lowered in the substrate holder 30c, whereby the suction and holding of the substrate P by the suction device 77d becomes possible. For example, each of the two suction devices 77d that hold the substrate P by suction is driven to the + X side synchronously as shown in FIG. Thereby, the board | substrate P is carried out toward the port part not shown from the board | substrate holder 30c. Incidentally, exchange operation between the substrate P ₁ and the substrate carry-in device 80 to load the hand 83 on the placed another (next) the substrate P ₂ on the substrate holder 30c shown in FIG. 14, the second embodiment Since it is the same as the form, the description is omitted. According to the fourth embodiment, since the suction device 77d can move in the Y-axis direction, the substrate P does not need to protrude greatly from both ends of the substrate holder 30c in the Y-axis direction, and the substrate P can be reduced in size.

  The configuration of the liquid crystal exposure apparatus including the substrate stage is not limited to those described in the first to fourth embodiments, and can be changed as appropriate. For example, in the substrate carry-out device 70d of the fourth embodiment, the suction device 77d is movable in the Y-axis direction with respect to the X travel guide 71, but is not limited to this, for example, FIG. 17C (hereinafter, referred to as a first modification), a suction device 77d may be attached in advance from the X travel guide 71 to the substrate holder 30c side (see FIG. 17C). The substrate carry-out device 70e does not include a Y actuator that drives the suction device 77d in the Y-axis direction with respect to the X travel guide 71). In this case, as shown in FIG. 16A, the suction device 77d is positioned on the −X side of the substrate P in a state where the substrate P is placed on the substrate holder 30c, and the substrate P is placed after the exposure is completed. After being lifted from the substrate holder 30c using the plurality of guide members 48b, it is inserted between the substrate holder 30c and the substrate P by being driven in the + X direction as shown in FIG. Thereafter, the substrate P is lowered, and the suction device 77d sucks and holds the substrate P and is driven in the + X direction as shown in FIG. Thereby, the board | substrate P is carried out from the board | substrate holder 30c. In addition, after the substrate P is unloaded, the suction device 77d is positioned on the + X side of the substrate P as shown in FIG. Then, when the exposure processing of the substrate P is completed and the substrate P is lifted from the substrate holder 30c by the plurality of guide members 48b for the unloading operation, the suction device 77d has the substrate as shown in FIG. It passes under P and returns to the initial position (position on the −X side of substrate P) shown in FIG. Then, as shown in FIG. 17C, the processing after FIG. 16B is repeated. According to the first modification, the structure and control of the substrate carry-out device 70e can be simplified.

  Further, in the substrate stage 20d of the fourth embodiment, the substrate carry-out device 70d is arranged on both sides (+ Y side and −Y side) of the substrate holder 30c, but FIG. 18 (hereinafter referred to as a second modification). As shown in FIG. 5A, the substrate carry-out device 70f may be disposed only on one side (+ Y side or -Y side) of the substrate holder 30c. In this case, the suction holding surface of the suction pad included in the suction device 77f is set higher than the suction device 77a of the first to fourth embodiments (see, for example, FIG. 2) so that the substrate P can be sucked and held with a stronger suction holding force. Should be set widely. In this case, the suction device 77f may be movable in the Y-axis direction with respect to the X travel guide 71 as in the fourth embodiment, or from the X travel guide 71 to the substrate as in the first modification. You may fix in the state protruded to the holder 30c.

  Further, in the substrate carry-out devices of the first to fourth embodiments, the suction pad is driven with respect to the substrate P in the Z-axis direction or the Y-axis direction so that the lower surface of the substrate P can be sucked. However, the present invention is not limited to this, and as shown in FIGS. 19A to 20B (hereinafter, referred to as a third modification), the substrate P is moved with respect to the suction device 77g. May be. As shown in FIG. 19A, the substrate carry-out device 70g is arranged on the + Y side of the substrate holder 30c (the suction device 77g cannot move in the Y-axis direction). Further, for example, two positioning devices 17a are arranged apart from each other in the X-axis direction on the −Y side of the substrate holder 30c, and for example, one positioning device 17b is arranged on the + Y side of the substrate holder 30c. Each of the plurality of positioning devices 17a and 17b is mounted on a Y coarse movement stage 23Y (see FIG. 1) via a support member (not shown), and is disposed at substantially the same Z position as the substrate P (accordingly, X travel). It does not conflict with the guide 71). The positioning devices 17a and 17b have an actuator such as an air cylinder, for example, and press the end of the substrate P to control the position of the substrate P. In the third modification, the substrate P is moved in the + Y direction by two positioning devices 17a, for example, as shown in FIG. 19B in a state where the exposed substrate P is levitated and supported by the plurality of guide members 48b. Driven by. At this time, excessive movement due to inertia in the + Y direction of the substrate P is suppressed by the movement preventing pin 17c and the positioning device 17b attached to the suction device 77g. A plurality of notches 17d are formed on the upper surface of the substrate holder 30c to prevent contact with the positioning device 17a. When the substrate P is positioned at a position where the suction device 77g can hold the substrate P by suction, the positioning devices 17a and 17b are retracted from the substrate P as shown in FIG. As shown in B), the substrate P is sucked and held by the sucking device 77g and carried out of the substrate holder 30c. In the third modified example, since the substrate P moves relative to the substrate carry-out device 70g, the amount of protrusion of the substrate P from the substrate holder 30c can be reduced in advance.

  In the first to fourth embodiments, the suction device for sucking and holding the substrate is driven by a uniaxial actuator such as a linear motor or a feed screw device, but may be pulled by a rope or the like. Further, the device for driving the substrate is not limited to the device that moves in the Y-axis direction as in the above-described adsorption device. For example, a roller that can contact the outer peripheral surface is provided on the substrate, and the substrate is rotated by rotating the roller. You may send out from a board | substrate holder. Further, the lower surface of the substrate P is sucked and held by the suction device, but the device for holding the substrate P is not limited to this, and may be a clamp device that mechanically grips the substrate P, for example. Further, the substrate lift devices 46a and 46b for lifting the substrate P from the substrate holder are mounted on the Y coarse movement stage 23Y, respectively, but are not limited thereto, and may be provided on the substrate holder, for example.

The illumination light may be ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm). As the illumination light, for example, a single wavelength laser beam oscillated from a DFB semiconductor laser or a fiber laser is amplified by a fiber amplifier doped with, for example, erbium (or both erbium and ytterbium). In addition, harmonics converted into ultraviolet light using a nonlinear optical crystal may be used. A solid laser (wavelength: 355 nm, 266 nm) or the like may be used.

  In the above-described embodiment, the case where the projection optical system PL is a multi-lens projection optical system including a plurality of projection optical units has been described. However, the number of projection optical units is not limited to this, and the number of projection optical units is one. That's all you need. The projection optical system is not limited to a multi-lens type projection optical system, and may be a projection optical system using an Offner type large mirror, for example. In the above-described embodiment, the case where the projection optical system PL has an equal magnification is described. However, the present invention is not limited to this, and the projection optical system may be either a reduction system or an enlargement system.

  In the above embodiment, a light transmissive mask in which a predetermined light shielding pattern (or phase pattern / dimming pattern) is formed on a light transmissive mask substrate is used. As disclosed in US Pat. No. 6,778,257, based on electronic data of a pattern to be exposed, an electronic mask (variable shaping mask) that forms a transmission pattern or a reflection pattern, or a light emission pattern, for example, You may use the variable shaping | molding mask using DMD (Digital Micro-mirror Device) which is 1 type of a non-light-emitting type image display element (it is also called a spatial light modulator).

  As an exposure apparatus, an exposure apparatus that exposes a substrate having a size (including at least one of an outer diameter, a diagonal length, and one side) of 500 mm or more, for example, a large substrate for a flat panel display such as a liquid crystal display element. It is particularly effective to apply to this.

  The exposure apparatus can also be applied to a step-and-repeat type exposure apparatus and a step-and-stitch type exposure apparatus.

  Further, the use of the exposure apparatus is not limited to a liquid crystal exposure apparatus that transfers a liquid crystal display element pattern onto a square glass plate. For example, an exposure apparatus for semiconductor manufacturing, a thin film magnetic head, a micromachine, and a DNA chip The present invention can also be widely applied to an exposure apparatus for manufacturing the above. Moreover, in order to manufacture not only microdevices such as semiconductor elements but also masks or reticles used in light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc., glass substrates, silicon wafers, etc. The present invention can also be applied to an exposure apparatus that transfers a circuit pattern. The object to be exposed is not limited to the glass plate, and may be another object such as a wafer, a ceramic substrate, a film member, or mask blanks. Moreover, when the exposure target is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and includes, for example, a film-like (flexible sheet-like member).

  The substrate (object) described in the first to fourth embodiments is not limited to the exposure apparatus, but may be applied to an object treatment apparatus that performs a predetermined process on an object, such as an object inspection apparatus used for inspection of a predetermined object. An exchange method may be applied.

  For electronic devices such as liquid crystal display elements (or semiconductor elements), the step of designing the function and performance of the device, the step of producing a mask (or reticle) based on this design step, and the step of producing a glass substrate (or wafer) A lithography step for transferring a mask (reticle) pattern to a glass substrate by the exposure apparatus and the exposure method of each embodiment described above, a development step for developing the exposed glass substrate, and a portion where the resist remains. It is manufactured through an etching step for removing the exposed member of the portion by etching, a resist removing step for removing a resist that has become unnecessary after etching, a device assembly step, an inspection step, and the like. In this case, in the lithography step, the above-described exposure method is executed using the exposure apparatus of the above embodiment, and a device pattern is formed on the glass substrate. Therefore, a highly integrated device can be manufactured with high productivity. .

  As described above, the object carrying-out method of the present invention is suitable for carrying out an object from the object holding device. The object exchange method of the present invention is suitable for exchanging an object held by the object holding device. The object holding device of the present invention is suitable for carrying out an object. The object exchange system of the present invention is suitable for exchanging an object held by the object holding device. The exposure apparatus of the present invention is suitable for exposing an object. Moreover, the manufacturing method of the flat panel display of this invention is suitable for manufacture of a flat panel display. The device manufacturing method of the present invention is suitable for manufacturing a micro device.

  DESCRIPTION OF SYMBOLS 10 ... Liquid crystal exposure apparatus, 20a ... Substrate stage, 30a ... Substrate holder, 36x ... X groove, 60 ... Port part, 70a ... Substrate carry-out device, 71 ... X travel guide, 77a ... Adsorption device, 80a ... Substrate carry-in device, 83 ... load hand, P ... substrate, PST ... substrate stage device.

Claims (26)

An object exchange method for exchanging an object placed on an object holding member of an object holding device,
Conveying an object to be carried in above the object holding member;
Using the object receiving device provided in the object holding device, receiving the object to be carried carried above the object holding member;
The object to be carried out placed on the object placement surface of the object holding member is guided on a guide surface defined by a guide member included in the object holding device, and the object carrying device included in the object holding device is used. Unloading from the object holding member in a direction along the object placement surface;
Moving the object holding device holding the object to be carried out toward the object carrying-out position for carrying out the object from the object holding member,
In the unloading, the object exchanging method of starting the unloading operation of unloading the object from the object holding member before the object holding device reaches the object unloading position . The object exchanging method according to claim 1 , wherein in the carrying out, the object holding member is used as the guide member, and the object to be carried out is moved using the object placement surface as the guide surface. The guide member is provided in the object receiving device,
Said By carrying The object exchange method according to claim 1, the object of the carry-object is passed to the guide member. An object holding surface on which the carried object is placed, and an object holding member capable of holding the object placed on the object placement surface;
An unloading device for unloading the object held by the object holding member from the object holding member;
The object holding member is provided movably between an object processing position where a predetermined process is performed on the object and an object unloading position where the object is unloaded,
The unloading device, before the object holding member reaches the object unloading position, object-holding device that initiates the unloading operation for unloading the object from the object retaining member. The object holding device according to claim 4 , wherein a plurality of the carry-out devices are provided. The carry-out device has a holding device for holding the object,
The holding device, and possible position holding the object, object-holding device according to claim 4 or 5 is relatively movable with respect to the object between a position spaced from the object. The object holding device according to claim 6 , wherein the holding device is relatively movable in at least one of a direction parallel to the surface of the object and a direction orthogonal to the surface of the object. The object holding device according to any one of claims 4 to 7 ,
A carry-in device for carrying an object to be carried above the object holding member;
An object receiving device provided in the object holding device for receiving the object to be carried in from the carry-in device;
An object exchange system comprising: a guide member that is provided in the object holding device and defines a guide surface that guides an object to be carried out and carried out by the carry-out device. 9. The object exchange system according to claim 8 , wherein the object to be carried out moves using the object holding member of the object holding device as the guide member and the object placement surface of the object holding member as the guide surface. The guide member is provided in the object receiving device,
The object exchange system according to claim 8 , wherein the object to be carried is delivered from the carry-in device to the guide member. The guide member is provided so as to be movable between a protruding position projected from the object placement surface and an accommodation position accommodated in the object holding member,
The object exchange system according to claim 10 , wherein the object to be carried out moves on the guide member positioned at the protruding position. The object exchange system according to any one of claims 8 to 11 , wherein the guide member supports the object to be carried out in a non-contact manner. The object exchange system according to any one of claims 8 to 12 , wherein the carry-out device moves the object to be carried out along a two-dimensional plane parallel to the object placement surface. The carry-in device moves the object to be carried along a two-dimensional plane parallel to the object placement surface,
The object receiving unit has a movable member movable in a direction perpendicular to the two-dimensional plane, any one of claims 8 to 13 for receiving the object of the carry object from the loading device with the movable member The object exchange system according to item. The carry-in device has a support member that supports the object to be carried in,
Said supporting the members, said the notch opened in the movement direction front side formed at the time of loading of an object carrying the target, the carry target object according to claim wherein the movable member into the cut-in-away is inserted when passing 14 The object exchange system described in 1. The carry-in device has guide members for guiding the movement of the support member on one side and the other side of the support member in a direction perpendicular to the movement direction of the support member in a plane parallel to the two-dimensional plane. The object exchange system according to claim 15 . Passing member for transferring an object of the carry-target from an external device to the support member before Ki搬 entry device, according to claim 16 which is inserted between the guide members on one side and arranged on the other side of the support member The object exchange system described in 1. A guidance device for guiding the object holding member along a predetermined two-dimensional plane with a predetermined stroke;
The object exchange system according to any one of claims 8 to 17 , wherein the object receiving device is provided in the guidance device. An unloading receiving member for guiding the unloading object to be unloaded by the unloading device together with the guide member, and receiving the unloading object unloaded from the recording object holding device;
The object exchange system according to any one of claims 8 to 18 , wherein the unloading receiving member has a guide surface set wider than a width of the object. The position of the object holding device when the object to be carried in is transferred from the loading device to the object receiving device, and the object holding device when the object to be carried out is carried out by the carrying out device The object exchange system according to any one of claims 8 to 19 , wherein the position of the object is the same. The object holding device according to any one of claims 4 to 7 ,
An exposure apparatus comprising: a pattern forming apparatus that forms a predetermined pattern on the object held by the object holding apparatus using an energy beam. The object exchange system according to any one of claims 8 to 20 ,
An exposure apparatus comprising: a pattern forming apparatus that forms a predetermined pattern on the object held by the object holding apparatus using an energy beam. The exposure apparatus according to claim 21 or 22 , wherein the object is a substrate used in a flat panel display device. The exposure apparatus according to claim 23 , wherein the substrate has a length of at least one side of 500 mm or more. Exposing the object using the exposure apparatus according to any one of claims 21 to 24 ;
Developing the exposed object. A method of manufacturing a flat panel display. Exposing the object using the exposure apparatus according to claim 21 or 22 ,
Developing the exposed object.

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