WO2014024465A1

WO2014024465A1 - Exposure method, method for manufacturing flat-panel display, and method for manufacturing device

Info

Publication number: WO2014024465A1
Application number: PCT/JP2013/004728
Authority: WO
Inventors: 青木　保夫; 篤史原
Original assignee: 株式会社ニコン
Priority date: 2012-08-07
Filing date: 2013-08-05
Publication date: 2014-02-13
Also published as: KR102206141B1; KR20150041037A; HK1205276A1; CN107015440A; CN104662481B; JP2014036023A; CN104662481A; JP6035670B2

Abstract

This exposure method includes the following: making the top surface of a mask (M), said mask (M) having a mask pattern, face the bottom surface of a mask air guide (40); having the mask air guide (40) support the mask (M) in a suspended manner without contact; having a mask-holding device (60) hold the mask (M) that is supported in a suspended manner by the mask air guide (40); using the mask-holding device (60) to move the mask (M) in a scanning direction relative to exposure light; and transferring the mask pattern to an exposure target, namely a substrate, by driving said substrate in the scanning direction relative to the exposure light.

Description

Exposure method, flat panel display manufacturing method, and device manufacturing method

The present invention relates to an exposure method, a flat panel display manufacturing method, and a device manufacturing method. More specifically, the present invention relates to an exposure method for moving a pattern holder relative to an energy beam in a scanning direction, and a flat using the exposure method. The present invention relates to a panel display manufacturing method and a device manufacturing method using the exposure method.

Conventionally, in a lithography process for manufacturing electronic devices (microdevices) such as liquid crystal display elements, semiconductor elements (integrated circuits, etc.), a mask (photomask) or reticle (hereinafter collectively referred to as “mask”), a glass plate or A step-and-step of transferring a pattern formed on a mask onto a substrate using an energy beam while synchronously moving a wafer (hereinafter collectively referred to as a “substrate”) along a predetermined scanning direction (scanning direction). A scanning exposure apparatus (a so-called scanning stepper (also called a scanner)) or the like is used.

In this type of exposure apparatus, a mask stage apparatus that controls the position of the mask by controlling the position of a frame-like member (called a mask holder or the like) that holds the edge of the mask by suction has been used. (For example, refer to Patent Document 1).

Here, with the recent increase in substrate size, the mask tends to increase in size. Thereby, there is a possibility that the exposure accuracy of the deflection (or vibration) caused by the weight of the mask will be affected.

US Patent Application Publication No. 2008/0030702

The present invention has been made under the circumstances described above. From the first viewpoint, the upper surface of the pattern holding body having a predetermined pattern can be suspended from the upper side in the gravity direction without contact. Opposing to the lower surface of the support member, suspending and supporting the pattern holder on the support member in a non-contact manner, and holding the pattern holder on the pattern holder that is suspended and supported on the support member A holding member that can be held, and the holding member is used to move the pattern holder in a scanning direction within at least a predetermined two-dimensional plane with respect to the energy beam, and an object to be exposed is moved relative to the energy beam. Driving the scanning direction to transfer the pattern to the object to be exposed, and maintaining the suspension of the pattern holder by the support member. And releasing the holding of the pattern holding body by the holding member, and separating the upper surface of the pattern holding body released from the holding by the holding member and the lower surface of the support member. It is an exposure method.

According to this, when the pattern holder moves relative to the energy beam, the upper surface of the pattern holder is suspended and supported by the support member in a non-contact manner, so that bending (or vibration) is suppressed. In addition, when the pattern holder is suspended and supported by the support member, the pattern holder is held and released by the holding member. Compared to the case where the pattern holder is directly recovered from the member, the pattern holder replacement operation is simplified.

From a second aspect, the present invention includes exposing the object to be exposed using the exposure method according to the first aspect of the present invention, and developing the exposed object to be exposed. It is a manufacturing method of a flat panel display.

From a third aspect, the present invention includes exposing the exposure target object using the exposure method according to the first aspect of the present invention, and developing the exposed exposure target object. It is a device manufacturing method.

It is a figure which shows schematically the structure of the liquid-crystal exposure apparatus which concerns on 1st Embodiment. It is a side surface (partial cross section) figure of a liquid-crystal exposure apparatus. It is a front view of the mask stage apparatus which the liquid-crystal exposure apparatus of FIG. 1 has. FIG. 4 is a view taken along the line AA in FIG. 3 (a view of the mask stage device as viewed from above). FIG. 4 is a view taken along the line BB in FIG. 3 (a view of the mask stage device as viewed from below). FIGS. 6A and 6B are views (No. 1 and No. 2) for explaining the operation of the mask loader device when the mask is carried in. FIGS. 7A to 7C are views (No. 1 to No. 3) for explaining the operation of the mask stage apparatus at the time of carrying in the mask. FIGS. 8A and 8B are views (No. 1 and No. 2) for explaining the mask loading operation using the mask loader device according to the second embodiment. FIGS. 9A and 9B are views (No. 3 and No. 4) for explaining the mask loading operation using the mask loader device according to the second embodiment. FIGS. 10A and 10B are views (No. 5 and No. 6) for explaining the mask loading operation using the mask loader device according to the second embodiment.

<< First Embodiment >>
Hereinafter, the first embodiment will be described with reference to FIGS. 1 to 7C.

FIG. 1 schematically shows a configuration of a liquid crystal exposure apparatus 10 according to the first embodiment. The liquid crystal exposure apparatus 10 employs a step-and-scan method in which a rectangular (square) glass substrate P (hereinafter simply referred to as a substrate P) used in, for example, a liquid crystal display device (flat panel display) is an exposure object. A projection exposure apparatus, a so-called scanner.

The liquid crystal exposure apparatus 10 includes an illumination system 12, a mask stage device 14 that holds a light-transmitting mask M, a projection optical system 16, an apparatus body 18, and a resist (sensitive agent) on the surface (the surface facing the + Z side in FIG. ) Is applied to the substrate stage device 20, the mask loader device 90 (not shown in FIG. 1, refer to FIG. 2), and their control system. Hereinafter, the direction in which the mask M and the substrate P are relatively scanned with respect to the projection optical system 16 at the time of exposure is defined as the X-axis direction, and the direction orthogonal to the X-axis in the horizontal plane is defined as the Y-axis direction, the X-axis, and the Y-axis. The description will be made assuming that the orthogonal direction is the Z-axis direction, and the rotation directions around the X-axis, Y-axis, and Z-axis are the θx, θy, and θz directions, respectively. Further, description will be made assuming that the positions in the X-axis, Y-axis, and Z-axis directions are the X position, the Y position, and the Z position, respectively.

The illumination system 12 is configured similarly to the illumination system disclosed in, for example, US Pat. No. 5,729,331. The illumination system 12 irradiates light emitted from a light source (not shown) (for example, a mercury lamp) through exposure mirrors (not shown), dichroic mirrors, shutters, wavelength selection filters, various lenses, and the like. ) Irradiate the mask M as IL. As the illumination light IL, for example, light such as i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm), or the combined light of the i-line, g-line, and h-line is used.

The illumination system 12 (an illumination system unit including the various lenses described above) is supported by an illumination system frame 30 installed on the floor 11 of the clean room. The illumination system frame 30 has a plurality of leg portions 32 (overlapping in the depth direction in FIG. 1) and an illumination system support portion 34 supported by the plurality of leg portions 32.

The mask stage device 14 drives the mask M with a predetermined long stroke in the X-axis direction (scan direction) with respect to the illumination system 12 (illumination light IL), and slightly drives it in the Y-axis direction and the θz direction. Is an element. The mask M is made of, for example, a rectangular plate-like member made of quartz glass, and a predetermined circuit pattern (mask pattern) is formed on the surface (lower surface portion) facing the −Z side in FIG. As shown in FIG. 3, a dustproof film called a pellicle Pe is attached to the lower surface of the mask M to protect the mask pattern. Here, regions where the mask pattern is not formed (hereinafter referred to as blank regions) are provided at both ends in the width direction (Y-axis direction) of the lower surface of the mask M. For this reason, the width direction dimension of the pellicle Pe is set shorter than the width direction dimension of the mask M. The detailed configuration of the mask stage device 14 will be described later.

1, the projection optical system 16 is disposed below the mask stage device 14. The projection optical system 16 is a so-called multi-lens projection optical system having the same configuration as the projection optical system disclosed in, for example, US Pat. No. 6,552,775, and is a double-sided telecentric equal magnification system. A plurality of projection optical systems for forming a vertical image are provided.

In the liquid crystal exposure apparatus 10, when the illumination area on the mask M is illuminated by the illumination light IL from the illumination system 12, the illumination light that has passed through the mask M causes the mask M in the illumination area to pass through the projection optical system 16. A projection image (partial upright image) of the circuit pattern is formed in an irradiation region (exposure region) of illumination light conjugate to the illumination region on the substrate P. Then, the mask M moves relative to the illumination area (illumination light IL) in the scanning direction, and the substrate P moves relative to the exposure area (illumination light IL) in the scanning direction. Scanning exposure of one shot area is performed, and the pattern formed on the mask M is transferred to the shot area.

The apparatus main body 18 supports the projection optical system 16 and is installed on the floor 11 via a plurality of vibration isolation devices 19. The apparatus main body 18 is configured in the same manner as the apparatus main body disclosed in, for example, US Patent Application Publication No. 2008/0030702, and includes an upper gantry 18a, a lower gantry 18b, and a pair of middle gantry 18c. is doing. The apparatus main body 18 is arranged so as to be vibrationally separated from the illumination system frame 30. Therefore, the projection optical system 16 and the illumination system 12 are vibrationally separated.

The substrate stage device 20 includes a base 22, an XY coarse movement stage 24, and a fine movement stage 26. The base 22 is made of a plate member that is rectangular in plan view (viewed from the + Z side), and is integrally mounted on the lower base 18b. The XY coarse movement stage 24 is, for example, a so-called gantry type that combines an X coarse movement stage that can move with a predetermined long stroke in the X-axis direction and a Y coarse movement stage that can move with a predetermined long stroke in the Y-axis direction. 2 axis stage device (X and Y coarse movement stages are not shown).

The fine movement stage 26 is made of a plate-shaped (or box-shaped) member having a rectangular shape in plan view, and includes a substrate holder that holds the lower surface of the substrate P by suction. The fine movement stage 26 is placed on the base 22 via a weight cancellation device (not shown in FIG. 1) as disclosed in, for example, US Patent Application Publication No. 2010/0018950. The fine movement stage 26 is guided (guided) by the XY coarse movement stage 24 to move with a predetermined long stroke in the X axis direction and / or the Y axis direction with respect to the projection optical system 16 (illumination light IL). To do.

Position information in the Y-axis direction of the fine movement stage 26 is obtained by a Y laser interferometer 28y fixed to the apparatus main body 18 using a Y bar mirror 27y fixed to the fine movement stage 26, and is output to the Y laser interferometer 28y. Based on this, the Y position of the substrate P is controlled. Further, as shown in FIG. 2, the position information of the fine movement stage 26 in the X-axis direction is fixed to an interferometer column 18d which is a part of the apparatus main body 18 using an X bar mirror 27x fixed to the fine movement stage 26. The X position of the substrate P is controlled based on the output of the X laser interferometer 28x. A plurality of Y laser interferometers 28y and X laser interferometers 28x are provided, respectively, so that rotation amount information of the substrate P in the θz direction can also be obtained. The configuration of the substrate stage device 20 is particularly limited as long as the substrate P can be driven with a predetermined long stroke in at least the X-axis (scanning) direction so as to be synchronized with the mask M held by the mask stage device 14. Not.

The mask loader device 90 is installed on the floor 11 and on the −X side of the device body 18 as shown in FIG. The mask loader device 90 includes a mask stocker 92 that stores a plurality of masks M, and a mask transport device 94 that transports the mask M from the mask stocker 92 to the mask stage device 14. The mask stocker 92 holds a plurality of masks M at predetermined intervals in the vertical direction. Although not shown in FIG. 2, a pellicle Pe (see FIG. 3) is attached in advance to each of the plurality of masks M stored in the mask stocker 92. The mask transfer device 94 includes a transfer table 94a, an elevating device 94b for moving the transfer table 94a up and down, and a pair of slide members 94c for transferring the mask M between the transfer table 94a and the mask stocker 92 (in FIG. 2). Only one is shown).

The transfer table 94a is made of a plate-like member having a rectangular shape in plan view and whose outer shape is set somewhat larger than the mask M. The lifting device 94b has a uniaxial actuator such as an air cylinder, for example, and moves the mask M supported by the transfer table 94a up and down. As shown in FIG. 7A, the pair of slide members 94c are arranged apart from each other in the Y-axis direction, one on the vicinity of the + Y side end of the transfer table 94a and the other of the − of the transfer table 94a. Mounted on the vicinity of the Y-side end portion through a mechanical X linear guide device 94d as disclosed in US Pat. No. 6,761,482, for example. Each of the pair of slide members 94c is made of a member extending in the X-axis direction having an L-shaped YZ cross section, and is arranged symmetrically with respect to the paper surface. The pair of slide members 94c is set with a spacing in the Y-axis direction so that the + M side and the −Y side end portions (margin regions) of the mask M can be supported from below without contacting the pellicle Pe. ing. Each of the pair of slide members 94c is synchronously driven with a predetermined stroke in the X-axis direction with respect to the transport table 94a by an X actuator (not shown).

When the mask M is carried in, as shown in FIG. 2, the mask transport device 94 has the Z position of the transport table 94 a so that the pair of slide members 94 c can be inserted below the desired (transport target) mask M. In this state, the pair of slide members 94c is inserted below the desired mask M, and the mask M is transferred from the mask stocker 92 to the slide member 94c. When the mask M is returned from the mask transfer device 94 to the mask stocker 92, the operation reverse to the above is performed. The delivery operation of the mask M between the mask loader device 90 and the mask stage device 14 will be described later. The configuration of the apparatus for storing the plurality of masks M and the configuration of the apparatus for transporting the mask M are not limited to this, and can be changed as appropriate. For example, the mask transport apparatus is an articulated robot arm or the like. May be. Further, the mask loader device 90 may be provided outside the liquid crystal exposure apparatus 10.

Next, the configuration of the mask stage device 14 will be described. As shown in FIG. 3, the mask stage device 14 includes a mask air guide 40, a pair of base plates 50, and a pair of mask holding devices 60.

The mask air guide 40 is suspended and supported by the mask air guide support frame 18e. The masquare guide support frame 18e is supported by the upper base 18a via a plurality of legs 18f. Accordingly, the mask air guide 40 is vibrationally separated from the illumination system 12 (not shown in FIG. 3, see FIG. 1).

The mask air guide 40 has a main body portion 42 made of a thin box-shaped member extending in the X-axis direction, and a porous member 44 formed in a plate shape extending in the X-axis direction. The porous member 44 is fitted in a recess formed on the lower surface of the main body 42. The mask M is arranged so that the upper surface (the surface opposite to the pattern surface) faces the lower surface of the porous member 44. The dimension in the longitudinal direction of the porous member 44 is set longer than the dimension in the longitudinal direction (X-axis direction) of the mask M, and the upper surface of the mask M is always on the lower surface of the porous member 44 during the exposure operation. opposite.

On the lower surface of the porous member 44, a plurality of minute holes are formed over almost the entire surface. The square pump 40 is connected to a not-shown pressurized gas supply device and a vacuum device installed outside the mask stage device 14. The square driver 40 sucks the gas between the lower surface of the porous member 44 and the upper surface of the mask M through a part of the plurality of holes of the porous member 44 to raise the floating force (+ Z Direction force), and a pressurized gas is jetted onto the upper surface of the mask M through the other portions of the plurality of holes, so that a slight amount is generated between the lower surface of the porous member 44 and the upper surface of the mask M. A clear clearance (for example, 5 to 10 μm) is formed. That is, the mask air guide 40 functions as a so-called vacuum preload air bearing. Note that the mask air guide 40 may always eject and suck the gas over the entire surface, or may partially eject and suck the gas only in the region facing the upper surface of the mask M.

Further, as shown in FIG. 2, an opening 46 is formed in the mask air guide 40 at a position immediately below the illumination system 12. The opening 46 opens in each of the upper surface portion and the lower surface portion of the mask air guide 40. As shown in FIG. 5, the opening 46 is formed in a rectangular shape in plan view with the Y-axis direction as the longitudinal direction, and illumination light IL (not shown in FIG. 5, respectively, see FIG. 1) emitted from the illumination system 12. The mask M is irradiated through the opening 46. The shape of the opening 46 is not particularly limited, and can be appropriately changed according to the shape of the illumination area on the mask M (for example, may be circular).

Here, as shown in FIG. 2, in the mask air guide 40, the opening 46 is formed somewhat on the + X side with respect to the central portion in the X-axis direction. In the mask air guide 40, a region on the + X side from the opening 46 and a partial region on the −X side from the opening 46 guide the mask M during the exposure operation (hereinafter, these regions are referred to as exposure regions). The region on the −X side from the exposure region (the region protruding in the −X side from the interferometer column 18d in FIG. 2) is exclusively used during the replacement operation of the mask M (hereinafter referred to as the mask replacement region). Called). The lifting / lowering device 94b of the mask loader device 90 described above is disposed immediately below the mask exchange region.

The pair of base plates 50 is composed of a plate-like member that extends in the X-axis direction and is arranged in parallel to the XY plane. As shown in FIG. 4, one is arranged on the + Y side of the mask air guide 40 in plan view. The other is arranged on the −Y side of the mask air guide 40 in plan view. As shown in FIG. 1, each of the pair of base plates 50 is supported by a mask stage support frame 36 fixed to a plurality of legs 32 of the illumination system frame 30 (see FIG. 2), and the apparatus main body 18. , And the substrate stage device 20 are separated from each other by vibration. In the present embodiment, the pair of base plates 50 are supported by the illumination system frame 30, but on the floor 11 in a state of being vibrationally separated from the apparatus main body 18 and the substrate stage apparatus 20. It may be mounted on another installed base.

On the upper surface of the base plate 50, as shown in FIG. 4, a plurality (for example, two in this embodiment) of X linear guides 52a are fixed at a predetermined interval in the Y-axis direction. An X magnet unit 54a including a plurality of permanent magnets arranged in the X-axis direction is fixed on the upper surface of the base plate 50, for example, in a region between the two X linear guides 52a.

One of the pair of mask holding devices 60 is placed on the base plate 50 on the + Y side, and the other is placed on the base plate 50 on the -Y side. The pair of mask holding devices 60 have the same configuration except that one is arranged so as to be rotated by 180 ° around the Z axis with respect to the other. Therefore, unless otherwise described below, the + Y side The mask holding device 60 will be described. As shown in FIG. 3, the mask holding device 60 is hidden behind the X table 62, the X voice coil motor 64X, and the Y voice coil motor 64Y (in FIG. 3, the back side of the X voice coil motor 64X. ), A suction holding unit 66, and an air cylinder 68a.

The X table 62 is made of a plate-like member having a rectangular shape in plan view arranged in parallel with the XY plane. On the lower surface of the X table 62, for example, two X slide members 52b (overlapping in the depth direction in FIG. 3) are fixed to one X linear guide 52a. The X slide member 52b is formed in an inverted U-shaped YZ cross-section, and together with the corresponding X linear guide 52a, for example, a mechanical X linear guide device as disclosed in US Pat. No. 6,761,482. 52 is constituted. An X coil unit 54b is fixed to the lower surface of the X table 62 so as to face the X magnet unit 54a with a predetermined clearance. The X coil unit 54b and the X magnet unit 54a constitute an X linear motor 54 as disclosed in, for example, US Pat. No. 8,030,804.

The X table 62 is linearly driven on the base plate 50 in the X axis direction via an X table driving system including the X linear motor 54. The type of the X actuator for driving the X table 62 in the X-axis direction is not particularly limited. For example, a feed screw including a screw portion fixed to the base plate 50 and a nut portion fixed to the X table 62. A device, a belt (or rope, etc.) driving device, or the like can be used. The X position information of the X table 62 is obtained by a linear encoder system (or an optical interferometer system) not shown.

The X voice coil motor 64X (in FIG. 3, the X voice coil motor 64X of the mask holding device 60 on the -Y side is hidden behind the Y voice coil motor 64Y. See FIG. 4). It includes a stator part 64a fixed to the upper surface via a mounting plate 63, and a mover part 64b fixed to a slide member 66b of the suction holding part 66. The mover portion 64b is formed in a U-shaped YZ cross section, and the stator portion 64a is inserted between a pair of opposing surfaces. The mover part 64b has, for example, a magnet unit on a pair of opposing surfaces, and the stator part 64a has, for example, a coil unit. The direction and magnitude of the current supplied to the coil unit are controlled by a main controller (not shown). The mask holding device 60 moves the sliding member 66b of the suction holding portion 66 in the X-axis direction with respect to the X table 62 by the Lorentz force in the X-axis direction that acts between the magnet unit and the coil unit of the X voice coil motor 64X. It can be driven with a small stroke. The mask holding device 60 can guide the suction holding unit 66 so as to move in the X-axis direction integrally with the X table 62 by using the Lorentz force.

The Y voice coil motor 64Y (in FIG. 3, the Y voice coil motor 64Y of the mask holding device 60 on the + Y side is hidden behind the X voice coil motor 64X. See FIG. 4). Since the configuration is the same as that of the X voice coil motor 64X except that the direction of the thrust is different, the description thereof is omitted. The mask holding device 60 moves the slide member 66b of the suction holding unit 66 in the Y-axis direction with respect to the X table 62 by the Lorentz force in the Y-axis direction that acts between the magnet unit and the coil unit of the Y voice coil motor 64Y. It can be driven with a small stroke. In the present embodiment, the X voice coil motor 64X and the Y voice coil motor 64Y are individually arranged, but can arbitrarily generate a Lorentz force in the X axis direction and / or the Y axis direction. A two-degree-of-freedom voice coil motor may be used.

The suction holding unit 66 includes a suction pad 66a, a slide member 66b, and a tube bearing 66c. In the present embodiment, as shown in FIG. 4, for example, two suction pads 66 a are provided at a predetermined interval in the X-axis direction for one mask holding device 60, but the number of suction pads 66 a is as follows. However, the present invention is not limited to this, and can be appropriately changed according to the size of the mask M, for example. Returning to FIG. 3, the suction pad 66 a is formed of a member having a substantially L-shaped YZ cross section, and one end portion thereof is disposed so as to protrude from the base plate 50 toward the mask M side. In the mask M, the above-described blank area (area where the mask pattern is not formed) is supported from below by the suction pad 66a. A vacuum device arranged outside the mask stage device 14 is connected to the suction pad 66a, and the mask M can be sucked and held using a vacuum suction force supplied from the vacuum device.

The slide member 66b is composed of a plate-like member having a T-shape (see FIG. 4) in plan view extending in the X-axis direction, and is disposed above the X table 62. The vicinity of the other end of the suction pad 66a is integrally connected to one end of the slide member 66b. The movable part 64b of the X voice coil motor 64X and the Y voice coil motor 64Y is fixed to the other end of the slide member 66b.

The tube bearing 66c is made of a cylindrical member having a rectangular XZ section, and the slide member 66b is inserted into a through hole having a rectangular XZ section defined by the inner wall surface with a predetermined clearance from the inner wall surface. ing. A pressurized gas supply device (not shown) arranged outside the mask stage device 14 is connected to the tube bearing 66c, and a slide member is formed from a plurality of minute holes formed on the upper and lower surfaces of the inner wall surface. Pressurized gas is jetted onto the upper and lower surfaces of 66b. The slide member 66b is supported in a non-contact manner on the tube bearing 66c by the static pressure of the pressurized gas. Here, with respect to the X-axis direction, a clearance is formed between the inner wall surface of the tube bearing 66c and the slide member 66b so as to allow the relative movement of the slide member 66b with respect to the tube bearing 66c in a minute stroke. On the other hand, the Z position is constrained).

The tube bearing 66c is supported by a bearing plate 66d fixed to the X table 62 so as to be tiltable at a predetermined angle in the θx direction via a shaft 66e. The Z position of the shaft 66e is such that the slide member 66b (and the pad surface of the suction pad 66a) is substantially parallel to the XY plane in a state where the mask M sucked and held by the suction pad 66a is suspended and supported by the mask air guide 40. Is set to On the other hand, the center of gravity in the Y-axis direction of the system combining the suction pad 66a and the slide member 66b is set to be closer to the mask M than the shaft 66e. When the suction pad 66a does not hold the mask M by suction, the tube bearing 66c, the slide member 66b, and the suction pad 66a are integrally tilted by their own weight (see FIG. 7B). The suction pad 66a is in a state where one end side (pad surface side) is lowered below the other end side. However, the movable part 64b of each of the X voice coil motor 64X and the Y voice coil motor 64Y is inserted between a pair of stopper plates 65 fixed to the mounting plate 63, and the X voice coil motor 64X and the Y voice. In the coil motor 64Y, contact between the stator portion 64a and the mover portion 64b is prevented.

The air cylinder 68a is used to limit relative movement between the X table 62 and the slide member 66b in the X-axis and Y-axis directions. The air cylinder 68a is spaced apart in the X-axis direction near the −Y side end on the upper surface of the + Y side X table 62 and near the + Y side end on the upper surface of the −Y side X table 62. For example, two are provided (in FIG. 3, they overlap in the depth direction of the page (see FIG. 5)). A ball 68b is fixed to the rod tip of the air cylinder 68a. In addition, a concave portion 68c defined by a tapered surface that widens on the lower surface side is formed at a position corresponding to the air cylinder 68a on the lower surface of the slide member 66b (see FIG. 4).

3, the X table 62 and the slide member 66b are allowed to move relative to each other in the X-axis and Y-axis directions (the slide member 66b with respect to the X table 62). In contrast, when the ball 68b is inserted (fitted) into the corresponding recess 68c, the X table 62 and the slide member 66b move relative to each other in the X axis and Y axis directions. Limited. In addition, when the ball 68b is inserted into the corresponding recess 68c, the slide member 66b (that is, the suction pad 66a) can be tilted (rotated) around the axis 66e by moving the ball 68b up and down.

The air cylinder 68a is also used during the initialization operation of the mask stage device 14. The initialization operation of the mask stage device 14 includes an operation of positioning the X table 62, the slide member 66b, etc. at the measurement origin position of the mask position measurement system. At this time, since the ball 68b is configured to fit into the concave portion 68c defined by the tapered surface, the X table 62 and the slide member 66b can be aligned with high reproducibility.

As shown in FIG. 3, the position information (including the rotation amount information in the θz direction) of the mask M driven by the mask stage device 14 in the XY plane includes a plurality of encoder heads 70 built in the mask air guide 40. Thus, the two-dimensional grating 72 formed on the upper surface of the mask M is obtained. The two-dimensional grating 72 is formed in a strip shape extending in the X-axis direction, is near the + Y side and −Y side ends of the mask M, and does not overlap the mask pattern (in the optical path of the illumination light IL (see FIG. 1)). It is formed at a position where it does not interfere. The two-dimensional grating 72 includes an X diffraction grating (X scale) whose periodic direction is the X axis direction and a Y diffraction grating (Y scale) whose periodic direction is the Y axis direction. As shown in FIG. 5, at least one encoder head 70 always faces the two-dimensional grating 72 in the vicinity of the + Y side and −Y side ends of the mask air guide 40 regardless of the X position of the mask M. Arranged at possible intervals. The configuration of the mask position measurement system is not limited to this, and may be, for example, an optical interferometer system, a combination of an encoder system and an optical interferometer system, or the position of the mask M based on the output of the image sensor. You may ask for information.

In the liquid crystal exposure apparatus 10 (see FIG. 2) configured as described above, the mask M is loaded onto the mask stage apparatus 14 by the mask loader apparatus 90 under the control of a main controller (not shown). The substrate P is loaded onto the substrate stage device 20 by a substrate loader (not shown). Thereafter, alignment measurement is performed by the main controller using an alignment detection system (not shown), and after completion of the alignment measurement, a plurality of shot areas set on the substrate P are sequentially exposed in a step-and-scan manner. Operation is performed.

Here, in the liquid crystal exposure apparatus 10, the mask M is appropriately replaced in accordance with the mask pattern formed on the substrate P. Hereinafter, the operations of the mask loader device 90 and the mask stage device 14 including the replacement operation of the mask M held by the mask stage device 14 will be described with reference to FIGS. 6 (A) to 7 (C).

FIG. 6A shows the liquid crystal exposure apparatus 10 in a state where the mask M is not held on the mask stage apparatus 14. The mask holding device 60 stands by somewhat on the + X side from the mask exchange area. In the mask loader device 90, the mask M is taken out from the mask stocker 92 by the mask transport device 94.

As shown in FIG. 6B, the mask loader device 90 drives the transfer table 94a in the + Z direction using the lifting device 94b after the mask M is completely taken out from the mask stocker 92. Accordingly, the mask M approaches the mask air guide 40 to a position where the mask air guide 40 can hold the mask M in a suspended manner. Also at this time, the mask holding device 60 stands by somewhat on the + X side from the mask exchange area. In the standby state, as shown in FIG. 7A, in the standby state, the ball of the air cylinder 68a is driven downward, and the suction pad 66a is tilted.

FIG. 7B shows a state in which the mask M is held in a non-contact suspended manner by the mask air guide 40. At this time, a mask air guide for the mask M is provided by a non-illustrated non-illustrated device provided in the mask air guide 40 so that the mask M does not move along the lower surface of the mask air guide 40 in a direction parallel to the XY plane. The relative movement with respect to 40 may be limited. Further, this flow stop device may have a function as a Z stopper for preventing the mask M from dropping. After delivering the mask M to the mask air guide 40, in the mask loader device 90, the transfer table 94a is driven in the −Z direction.

Thereafter, each of the pair of mask holding devices 60 is driven in the −X direction, and the suction pad 66a is inserted below the mask M. Then, as shown in FIG. 7C, when the ball 68b is driven up using the air cylinder 68a, the suction pad 66a is pushed up by the ball 68b. Thereby, the pad surface of the suction pad 66a and the lower surface of the mask M face each other. The mask holding device 60 sucks and holds the mask M using the suction pad 66a. At this time, when the above-described flow stopping device is used, the flow stopping device is controlled so as to retract from the mask M after the mask M is sucked and held.

In a state where the mask M is sucked and held by the suction pad 66a, the mask M and the plurality of suction pads 66a can be regarded as an integrated object, so that the ball 68b is driven to descend from the state shown in FIG. Even in the state shown in FIG. 3, the suction pad 66a does not tilt. At this time, a force that is pulled downward in the gravitational direction due to the weight of the suction pad 66a acts on the mask M. Therefore, at least one of the X voice coil motor 64X and the Y voice coil motor 64Y is also forced in the Z direction. A two-degree-of-freedom motor that can be generated may be used, and the two-degree-of-freedom motor may be controlled so as to push the mask M upward from below (control so that the voice coil motor generates a force in the −Z direction). In addition, since the operation | movement at the time of carrying out the mask M from the mask stage apparatus 14 is reverse to the operation | movement at the time of the said carrying in, description is abbreviate | omitted.

According to the mask stage apparatus 14 described above, almost the entire upper surface of the mask M (excluding the portion where the opening 46 is formed) is supported by the mask air guide 40 in a non-contact hanging manner from above, so that the mask M is bent. (Deformation) can be suppressed. Thereby, defocusing is suppressed and the mask pattern can be transferred to the substrate P with higher accuracy.

In addition, since almost the entire upper surface of the mask M is supported, the mask is compared with a case where a mask stage apparatus having a structure that supports only the end of the mask M (hereinafter referred to as a mask stage apparatus according to a comparative example) is used. The resonance frequency of M increases. Therefore, precise positioning controllability of the mask M during the exposure operation is improved, and unevenness of the pattern transferred to the substrate P is suppressed.

Further, since the mask stage device 14 directly drives the mask M using the pair of mask holding devices 60, for example, the mask stage device according to the comparative example that drives a frame-like member (mask holder) holding the mask M. Compared to the above, the driven object is light, and the position of the mask M can be controlled with higher accuracy. Also, the cost can be reduced.

Even if the supply of pressurized gas (or supply of vacuum suction force) to the mask air guide 40 (or mask holding device 60) is stopped, the tilting of the suction pad 66a is limited by the stopper plate 65. The state where the mask M is supported by the suction pad 66a from below is maintained. Therefore, there is no possibility that the mask M falls downward.

Further, the mask loader device 90 drives the mask M in the + Z direction to deliver to the mask air guide 40 when the mask M is carried in, and delivers it to the mask air guide 40, and drives the mask M in the −Z direction to carry out the mask M. Therefore, the configuration can be made simple and compact.

<< Second Embodiment >>
Next, a liquid crystal exposure apparatus 110 according to the second embodiment will be described with reference to FIGS. 8 (A) to 10 (B). The configuration of the liquid crystal exposure apparatus 110 according to the second embodiment is the same as that of the liquid crystal exposure apparatus 10 (see FIG. 1) of the first embodiment except for the configuration of the mask loader device 190. Only elements that have the same configurations and functions as those of the first embodiment are denoted by the same reference numerals as those of the first embodiment, and description thereof is omitted.

The mask loader device 190 includes a mask stocker 192 and a mask transport device 194. As in the first embodiment, the mask stocker 192 holds a plurality of masks M in the vertical direction at a predetermined interval. However, the mask stocker 192 pushes an arbitrary mask M toward the mask transport device 194 in the horizontal direction (non-extrusion device). As shown, see white arrow in FIG. The mask transfer device 194 includes a transfer table 94a and a lifting device 94b similar to those in the first embodiment.

In the second embodiment, the transfer table 94a has a plurality of movable pieces 94e instead of the pair of slide members 94c (see FIGS. 2, 7A, etc.) of the first embodiment. . There are a plurality of movable pieces 94e at predetermined intervals in the X-axis direction near the + Y side and −Y side ends of the transport table 94a (for example, three in FIGS. 8A to 10B). The number is not limited to this). The plurality of movable pieces 94e can move independently in the vertical direction (Z-axis direction) with respect to the transfer table 94a, and the Z position is set by a main controller (not shown) via a Z actuator (not shown). Be controlled. As in the first embodiment, the intervals between the + Y side movable pieces 94e and the −Y side movable pieces 94e are not in contact with the pellicle Pe (see FIG. 3), and are on the + Y side of the mask M. In addition, it is set so that the vicinity of each end (margin area) on each of the −Y side can be supported from below.

In the mask loader device 190, as shown in FIG. 8A, a desired mask M is pushed out from the mask stocker 192 and placed on the plurality of movable pieces 94e of the mask transport device 194. Next, as shown in FIG. 8B, the mask transfer device 194 drives the mask M up using the lifting device 94 b and delivers the mask M to the mask air guide 40. When the mask M is suspended and supported by the mask air guide 40 in a non-contact manner, the mask holding device 60 is driven in the −X direction to support the mask M from below as shown in FIG. 9A.

Here, in the first embodiment, as shown in FIG. 7B, the mask holding device 60 can support the mask M from below (the suction pad 66a does not contact the slide member 94c). In the second embodiment, as shown in FIG. 9A, the transport table 94a does not move and only the movable piece 94e is driven. Is done. That is, in the mask loader device 190, the movable piece 94e is driven downward so as not to contact the suction pad 66a according to the X position of the suction pad 66a when the mask holding device 60 slides in the -X direction. (Retreat from the moving path of the suction pad 66a). Further, as shown in FIG. 9B, the movable piece 94e is driven up after passing through the suction pad 66a, and supports the mask M from below. Thus, the mask M is always supported from below by at least one movable piece 94e regardless of the X position of the suction pad 66a. 9A, only the movable piece 94e closest to the + X side is retracted from the movement path of the suction pad 66a, and in FIG. 9B, only the central movable piece 94e is retracted from the movement path of the suction pad 66a. is doing.

After the mask holding device 60 holds the mask M, the transfer table 94a is driven downward as shown in FIG. 10A, and the mask holding device 60 holding the mask M is shown in FIG. In order to perform the exposure operation, the mask M is driven toward the lower side of the illumination system 12. According to the second embodiment, even if the supply of pressurized gas to the mask air guide 40 is stopped while the mask M is suspended and supported, the mask M is prevented from falling on the transfer table 94a. .

Note that the configurations of the first and second embodiments described above can be changed as appropriate. For example, in the first and second embodiments, when the mask M is exchanged, the mask M carry-out operation and the mask M carry-in operation are performed at the same position (mask exchange position). The position (loading position) and the mask unloading position (unloading position) may be different. For example, the unloading position is set to a region on one side (for example, −X side) in the X-axis direction with respect to the opening 46. In addition to setting, the loading position may be set to a region on the other side (for example, + X side) in the X-axis direction with respect to the opening 46. In this case, the carry-out operation of the mask M and the carry-in operation of another mask M can be partially performed in parallel, which is efficient.

In the first and second embodiments, the mask air guide 40 jets pressurized gas at high speed between the lower surface of the mask air guide 40 and the upper surface of the mask M (the mask air guide 40 is The mask M may be suspended and held (by functioning as a so-called Bernoulli chuck) (without sucking gas).

Further, in the above embodiment, the mask M is sucked and held near the end portions on the + Y side and the −Y side by the suction pads 66a of each of the pair of mask holding devices 60. The suction holding position of M is not limited to this, and more places (including the end portion in the X-axis direction) may be sucked and held. In this case, for example, the entire outer periphery of the mask M may be surrounded using a frame-shaped member.

The illumination light may be ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm). As the illumination light, for example, a single wavelength laser beam oscillated from a DFB semiconductor laser or a fiber laser is amplified by a fiber amplifier doped with, for example, erbium (or both erbium and ytterbium). In addition, harmonics converted into ultraviolet light using a nonlinear optical crystal may be used. A solid laser (wavelength: 355 nm, 266 nm) or the like may be used.

Further, the case where the projection optical system 16 is a multi-lens projection optical system including a plurality of optical systems has been described, but the number of projection optical systems is not limited to this, and one or more projection optical systems may be used. The projection optical system is not limited to a multi-lens projection optical system, and may be a projection optical system using an Offner type large mirror. Further, the projection optical system 16 may be an enlargement system or a reduction system.

Further, as a mask stage apparatus, for example, as disclosed in US Pat. No. 8,159,649, a mask on which two types of mask patterns are formed is moved stepwise in the Y-axis direction as appropriate. It may be a mask stage apparatus that can selectively transfer the two types of mask patterns to the substrate without replacement. In this case, the width of the mask air guide 40 according to the first to fourth embodiments may be formed wider than that of the above embodiment.

Further, the use of the exposure apparatus is not limited to the exposure apparatus for liquid crystal that transfers the liquid crystal display element pattern onto the square glass plate. For example, the exposure apparatus for manufacturing an organic EL (Electro-Luminescence) panel, the semiconductor manufacture The present invention can also be widely applied to an exposure apparatus for manufacturing an exposure apparatus, a thin film magnetic head, a micromachine, a DNA chip, and the like. Moreover, in order to manufacture not only microdevices such as semiconductor elements but also masks or reticles used in light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc., glass substrates, silicon wafers, etc. The present invention can also be applied to an exposure apparatus that transfers a circuit pattern.

The object to be exposed is not limited to the glass plate, but may be another object such as a wafer, a ceramic substrate, a film member, or a mask blank. Moreover, when the exposure target is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and includes, for example, a film-like (flexible sheet-like member). The exposure apparatus of the present embodiment is particularly effective when a substrate having a side length or diagonal length of 500 mm or more is an exposure target.

For electronic devices such as liquid crystal display elements (or semiconductor elements), the step of designing the function and performance of the device, the step of producing a mask (or reticle) based on this design step, and the step of producing a glass substrate (or wafer) A lithography step for transferring a mask (reticle) pattern to a glass substrate by the exposure apparatus and the exposure method of each embodiment described above, a development step for developing the exposed glass substrate, and a portion where the resist remains. It is manufactured through an etching step for removing the exposed member of the portion by etching, a resist removing step for removing a resist that has become unnecessary after etching, a device assembly step, an inspection step, and the like. In this case, in the lithography step, the above-described exposure method is executed using the exposure apparatus of the above embodiment, and a device pattern is formed on the glass substrate. Therefore, a highly integrated device can be manufactured with high productivity. .

It should be noted that the disclosure of all US patent application publications and US patent specifications related to the exposure apparatus and the like cited in the above description are incorporated herein by reference.

As described above, the exposure method of the present invention is suitable for moving the pattern holder relative to the energy beam. Moreover, the manufacturing method of the flat panel display of this invention is suitable for production of a flat panel display. The device manufacturing method of the present invention is suitable for the production of micro devices.

DESCRIPTION OF SYMBOLS 10 ... Liquid crystal exposure apparatus, 14 ... Mask stage apparatus, 40 ... Mask air guide, 46 ... Opening part, 60 ... Mask holding apparatus, IL ... Illumination light, M ... Mask, P ... Substrate.

Claims

The upper surface of the pattern holder having a predetermined pattern is opposed to the lower surface of the support member that can be suspended from the upper side in the direction of gravity in a non-contact manner;
Suspending and supporting the pattern holding body in a non-contact manner on the support member;
Holding the pattern holding body suspended and supported by the support member on a holding member capable of holding the pattern holding body;
The pattern holding body is moved in the scanning direction within at least a predetermined two-dimensional plane with respect to the energy beam using the holding member, and the exposure target object is driven in the scanning direction with respect to the energy beam. Transferring to the object to be exposed;
Releasing the holding of the pattern holding body by the holding member in a state where the suspension support of the pattern holding body by the supporting member is maintained;
An exposure method comprising: separating an upper surface of the pattern holding body released from being held by the holding member and a lower surface of the support member.
The exposure method according to claim 1, wherein the transferring causes the energy beam to pass through an opening formed in the support member.
3. The exposure method according to claim 1, wherein the pattern holding body is moved in a direction intersecting the two-dimensional plane with respect to the support member by the facing and the separating.
4. The exposure method according to claim 1, wherein a common transport device is used for the facing and the separating.
In the holding, by sliding the holding member from one side to the other side in the scanning direction on the lower surface side of the pattern holding body, the holding member is disposed below the pattern holding body,
And releasing the holding by sliding the holding member from the other side of the scanning direction to the one side on the lower surface side of the pattern holding body, thereby retracting the holding member from below the pattern holding body. 5. The exposure method according to any one of 1 to 4.
In the facing and the separating, a movable member provided to be movable between a first position that supports the lower surface of the pattern holding body and a second position that is separated from the lower surface of the pattern holding body. , A pattern carrier transport device having a plurality along the scanning direction is used,
6. The plurality of movable members are retracted from the first position to the second position according to a position along the scanning direction of the holding member by the holding and releasing the holding. An exposure method according to 1.
In the facing and releasing the holding, the pattern holding body is opposed to the first region on the lower surface of the support member,
The exposure method according to any one of claims 1 to 6, wherein in the transfer, the pattern holder is moved along a second region different from the first region on the lower surface of the support member.
In the transfer, the pattern holder is slightly driven with respect to the energy beam in a direction orthogonal to the scanning direction in the two-dimensional plane and around an axis orthogonal to the two-dimensional plane. The exposure method according to any one of the above.
The exposure method according to any one of claims 1 to 8, wherein the supporting member causes the supporting member to suck a gas between the lower surface of the supporting member and the upper surface of the pattern holding body.
In the suspension support, an upward force in the gravitational direction is applied to the pattern holder by allowing a gas to pass between the lower surface of the support member and the upper surface of the pattern holder at a high speed. The exposure method according to any one of the above.
11. The exposure method according to claim 1, wherein the object to be exposed is a substrate used in a flat panel display device.
The exposure method according to claim 11, wherein the substrate has a length of at least one side or a diagonal length of 500 mm or more.
Exposing the object to be exposed using the exposure method according to claim 11 or 12,
Developing the exposed object to be exposed, and manufacturing a flat panel display.
Exposing the object to be exposed using the exposure method according to any one of claims 1 to 10,
And developing the exposed object to be exposed.