JP2013051237A - Object processing device, manufacturing method of flat panel display, device manufacturing method, object transport device, and object carry-in method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To carry a substrate into an exposure device efficiently.SOLUTION: The method of carrying a substrate Pinto a liquid crystal exposure device includes the steps of: locating a fork hand 83 of a substrate carry-in device 80a that carries the substrate Pfor a substrate stage 20, capable of holding the substrate Pin an exposure region, outside of the exposure region (upper region of a port 60); locating the substrate P, supported by the load hand 91b of an external carry-in robot 90b from below, above the fork hand 83; and transferring the substrate P, supported by the load hand 91b from below, from on the load hand 91b to above the fork hand 83.

Description

  The present invention relates to an object processing apparatus, a flat panel display manufacturing method, a device manufacturing method, an object transport apparatus, and an object carry-in method, and more specifically, an object processing apparatus that performs predetermined processing on an object, and the object processing apparatus The present invention relates to a flat panel display manufacturing method and a device manufacturing method using an image processing apparatus, an object transporting apparatus for transporting an object in an object processing apparatus, and a method for bringing an object into the object processing apparatus from outside.

  Conventionally, in a lithography process for manufacturing electronic devices (microdevices) such as liquid crystal display elements and semiconductor elements (integrated circuits, etc.), a step-and-repeat projection exposure apparatus (so-called stepper) or step-and-scan method Projection exposure apparatuses (so-called scanning steppers (also called scanners)) are used.

  As this type of exposure apparatus, a glass plate or wafer (hereinafter collectively referred to as “substrate”), which is an exposure object, is applied to a substrate stage using a substrate carry-in apparatus (plate loader) installed in the exposure apparatus. Are known (for example, see Patent Document 1).

  In the exposure apparatus, the substrate stage, the substrate carry-in device, and the like are accommodated in a chamber shielded from the outside. Then, after the substrate is carried into the chamber by an external transfer device installed outside the chamber, the substrate is transferred to the substrate carrying device within the chamber. Here, it is desired to quickly perform a substrate carry-in operation from the external transfer device into the exposure apparatus and a substrate transfer operation to the substrate carry-in device in the exposure apparatus.

US Pat. No. 6,559,928

  The present invention has been made under the circumstances described above. From a first viewpoint, the present invention is an object processing apparatus that performs a predetermined process on an object in a predetermined processing area, wherein the object is processed in the processing area. An object holding device capable of holding; a first support member capable of supporting the object from below; an in-device transfer device that transfers the object from outside the predetermined region to the object holding device; and outside the predetermined region The object supported from below by the second support member of the apparatus outside the apparatus is located above the first support member located outside the predetermined region, and the object is supported by the second support member. And a delivery device that receives the object and delivers the object to the first support member after the second support member is retracted from above the first support member.

  Accordingly, the first support member of the in-device transport device and the second support member of the out-of-device transport device are overlapped in the vertical direction from the second support member (outside device transport device) to the first support member (in-device transport). Since the object is transferred to the apparatus, the object transfer operation in the object processing apparatus can be performed quickly. Further, it is possible to save the space of the object delivery unit in the object processing apparatus.

  According to a second aspect of the present invention, there is provided a flat panel display comprising: exposing the object using the object processing apparatus according to the first aspect of the present invention; and developing the exposed object. It is a manufacturing method.

  According to a third aspect of the present invention, there is provided a device manufacturing method comprising: exposing the object using the object processing apparatus according to the first aspect of the present invention; and developing the exposed object. It is.

  From a fourth aspect, the present invention is provided in an object processing apparatus that performs predetermined processing on an object held by an object holding device within a predetermined processing area, and the object holding apparatus is moved from outside the processing area to the object holding apparatus. A support member that can support the object from below, a drive system that drives the support member in a first direction in a horizontal plane, and a direction orthogonal to the first direction in the horizontal plane And a guide member that is disposed on each of the one side and the other side of the support member with respect to the second direction and guides the movement of the support member.

  According to a fifth aspect of the present invention, there is provided a method for carrying an object into an object processing apparatus that performs a predetermined process on the object, the object holding apparatus capable of holding the object in a processing area in which the process is performed. A first support member included in an in-device transfer device capable of transferring the object is positioned outside the predetermined area, and a second support member included in an out-of-device transfer device provided outside the object processing device. Positioning the object supported from below on the first support member, delivering the object from the second support member located above the first support member to the delivery device, An object carrying-in method including retracting the second support member from above the first support member and delivering the object onto the first support member from the delivery device.

It is a figure which shows schematically the structure of the liquid-crystal exposure apparatus of 1st Embodiment. It is a top view of the substrate stage (substrate holder) which the liquid-crystal exposure apparatus of FIG. 1 has. It is a top view of the board | substrate carrying-in apparatus which the liquid-crystal exposure apparatus of FIG. 1 has. FIGS. 4A and 4B are views (No. 1 and No. 2) for explaining the substrate replacement operation. FIGS. 5A and 5B are views (No. 3 and No. 4) for explaining the substrate replacement operation. FIGS. 6A and 6B are views (No. 5 and No. 6) for explaining the substrate replacement operation. FIGS. 7A and 7B are views (No. 7 and No. 8) for explaining the substrate replacement operation. FIGS. 8A and 8B are views (No. 9 and No. 10) for explaining the substrate replacement operation. FIGS. 9A and 9B are views (Nos. 11 and 12) for explaining the substrate replacement operation. It is a figure which shows schematically the structure of the liquid-crystal exposure apparatus of 2nd Embodiment. It is a top view of the board | substrate carrying-in apparatus which concerns on 2nd Embodiment. 12A to 12C are views (No. 1 to No. 3) for explaining the operation of the substrate carry-in apparatus of FIG. FIGS. 13A to 13C are views (No. 4 to No. 6) for explaining the operation of the substrate carrying-in apparatus of FIG. FIGS. 14A to 14C are views (Nos. 1 to 3) for explaining the operation of the port unit according to the first modification. FIGS. 15A to 15C are views (No. 4 to No. 6) for explaining the operation of the port unit according to the first modification. It is sectional drawing of the board | substrate carrying-in apparatus which concerns on a 2nd modification. FIGS. 17A and 17B are views (No. 1 and No. 2) for explaining the operation of the substrate carry-out apparatus according to the third modification.

<< First Embodiment >>
The first embodiment will be described below with reference to FIGS. 1 to 9B.

FIG. 1 schematically shows the configuration of the liquid crystal exposure apparatus 10a of the first embodiment. The liquid crystal exposure apparatus 10a is a rectangular (square) glass substrate P used in, for example, a liquid crystal display device (flat panel display) or the like (the substrate P ₁ and the substrate P _{2 in} FIG. 1; hereinafter, collectively referred to as the substrate P). Is a projection exposure apparatus that uses as an exposure object.

In the liquid crystal exposure apparatus 10a, a resist (sensitive agent) is applied to the illumination system IOP, the mask stage MST for holding the mask M, the projection optical system PL, the apparatus main body 30, and the surface (the surface facing the + Z side in FIG. 1). A substrate stage device PST that holds a substrate P (substrate P _{1 in} FIG. 1), a port unit 60 that transfers the substrate P to and from an external device (for example, a coater / developer device), and a substrate P ( In FIG. 1, a substrate carry-in device 80a for carrying a substrate P ₂ ) and a control system thereof are included. Hereinafter, the direction in which the mask M and the substrate P are relatively scanned with respect to the projection optical system PL at the time of exposure is defined as the X-axis direction, and the direction orthogonal to the X-axis in the horizontal plane is defined as the Y-axis direction, X-axis, and Y-axis. The description will be made assuming that the orthogonal direction is the Z-axis direction, and the rotation directions around the X-axis, Y-axis, and Z-axis are the θx, θy, and θz directions, respectively. Further, description will be made assuming that the positions in the X-axis, Y-axis, and Z-axis directions are the X position, the Y position, and the Z position, respectively.

  The illumination system IOP is configured similarly to the illumination system disclosed in, for example, US Pat. No. 6,552,775. That is, the illumination system IOP emits light emitted from a light source (not shown) (for example, a mercury lamp) through exposure mirrors (not shown), dichroic mirrors, shutters, wavelength selection filters, various lenses, and the like. Irradiation light) is applied to the mask M as IL. As the illumination light IL, for example, light such as i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm), or the combined light of the i-line, g-line, and h-line is used.

  On the mask stage MST, a mask M on which a circuit pattern or the like is formed is held by suction, for example, by vacuum suction. The mask stage MST is mounted on a lens barrel base plate 31 that is a part of the apparatus main body 30 (body), and is predetermined in the scanning direction (X-axis direction) by a mask stage drive system (not shown) including, for example, a linear motor. While being driven by a long stroke, it is slightly driven as appropriate in the Y-axis direction and the θz direction. Position information (including rotation information in the θz direction) of the mask stage MST in the XY plane is measured by a mask interferometer system including a laser interferometer (not shown).

  The projection optical system PL is disposed below the mask stage MST and supported by a lens barrel base plate 31 that is a part of the apparatus main body 30. The projection optical system PL is configured similarly to the projection optical system disclosed in, for example, US Pat. No. 6,552,775. In other words, the projection optical system PL includes a plurality of projection optical systems (multi-lens projection optical systems) in which the projection areas of the pattern image of the mask M are arranged in a staggered pattern, and is a rectangular single unit whose longitudinal direction is the Y-axis direction. Functions in the same way as a projection optical system having one image field. In the present embodiment, as each of the plurality of projection optical systems, for example, a bilateral telecentric equal magnification system that forms an erect image is used.

For this reason, when the illumination area on the mask M is illuminated by the illumination light IL from the illumination system IOP, the illumination light IL that has passed through the mask M causes the circuit of the mask M in the illumination area to pass through the projection optical system PL. A projected image (partial upright image) of the pattern is formed in the irradiation region (exposure region) of the illumination light IL conjugate to the illumination region on the substrate P (substrate P _{1 in} FIG. 1). Then, by synchronous driving of the mask stage MST and the substrate stage apparatus PST, the mask M is moved relative to the illumination area (illumination light IL) in the scanning direction, and the substrate P is moved relative to the exposure area (illumination light IL). By performing relative movement in the scanning direction, scanning exposure of one shot area on the substrate P is performed, and the pattern formed on the mask M is transferred to the shot area. That is, in this embodiment, the pattern of the mask M is generated on the substrate P by the illumination system IOP and the projection optical system PL, and the pattern is formed on the substrate P by exposure of the sensitive layer (resist layer) on the substrate P by the illumination light IL. Is formed.

  The apparatus main body 30 has a lens barrel surface plate 31 and a substrate stage frame 33. The lens barrel surface plate 31 is composed of a plate-like member arranged in parallel with the XY plane, and supports the projection optical system PL, the mask stage MST, and the like. The substrate stage mount 33 is made of a member extending in the Y-axis direction, and is supported from below by a vibration isolator 34 installed on the floor 11 of the clean room. The substrate stage base 33 and the lens barrel base plate 31 are integrally connected by a connecting member (not shown). As a result, the apparatus main body 30 (and projection optical system PL, mask stage MST, etc.) is vibrationally separated from the floor 11.

  The substrate stage apparatus PST includes a base frame 14 and a substrate stage 20. The base frame 14 is made of a member extending in the Y-axis direction, and is arranged on the floor 11 at a predetermined distance from the substrate stage mount 33 (in a non-contact state). The base frame 14 supports a Y coarse movement stage 23y, which is a part of a substrate stage 20, which will be described later, from below, and functions as a guide member when the substrate stage 20 moves with a predetermined long stroke in the Y-axis direction. . A pair of base frames 14 are provided spaced apart in the X-axis direction (one is not shown in FIG. 1), and supports the vicinity of both ends in the longitudinal direction of the Y coarse movement stage 23y from below. When a plurality of substrate stage stands 33 are provided at predetermined intervals in the X-axis direction, an auxiliary base that supports an intermediate portion in the longitudinal direction of the Y coarse movement stage 23y between the substrate stage stands 33 adjacent to each other. A frame may be arranged. A Y linear guide 16 a that is an element of the Y linear guide device 16 is fixed to the upper end surface (the end on the + Z side) of the base frame 14.

  The substrate stage 20 includes a Y coarse movement stage 23y, an X coarse movement stage 23x, a fine movement stage 21, a substrate holder 40, a plurality of substrate lift devices 45, a Y step surface plate 50, a weight cancellation device 54, and a substrate carry-out device 70. doing.

  The Y coarse movement stage 23 y is disposed above the substrate stage mount 33 and is mounted on the base frame 14. The Y coarse movement stage 23 y has an X beam 25. The X beam 25 is made of a member having a rectangular YZ section extending in the X-axis direction. Here, the Y coarse movement stage 23y has a pair of X beams 25 at a predetermined interval in the Y-axis direction. However, in order to facilitate understanding of the configuration of the substrate stage 20, one is shown in FIG. The X beam 25 is not shown. The pair of X beams 25 are integrally connected by a plate-like member called a Y carriage 26 in the vicinity of the + X side and −X side ends.

  A Y slide member 16b constituting the Y linear guide device 16 is fixed to the lower surface of the Y carriage 26 together with the Y linear guide 16a. The Y slide member 16b is slidably engaged with the corresponding Y linear guide 16a with low friction, and the Y coarse movement stage 23y has a predetermined stroke in the Y axis direction with low friction on the pair of base frames 14. It is movable. The Z position of the lower surface of the X beam 25 is set to the + Z side with respect to the upper surface of the substrate stage gantry 33, and the Y coarse movement stage 23y is vibrationally separated from the substrate stage gantry 33 (that is, the apparatus main body 30). Yes.

  The Y coarse movement stage 23y is driven in the Y-axis direction on the pair of base frames 14 by a Y actuator (not shown). Although the kind of Y actuator is not specifically limited, For example, a feed screw device, a linear motor, a belt drive device, etc. can be used. An X linear guide 27 a that is an element of the X linear guide device 27 is fixed to the upper surface of the X beam 25.

  The X coarse movement stage 23x is made of a plate member having a rectangular shape in plan view, and an opening (not shown) is formed at the center thereof. An X slide member 27b constituting the X linear guide device 27 together with the X linear guide 27a is fixed to the lower surface of the X coarse movement stage 23x. For example, four X slide members 27b are provided at a predetermined interval in the X-axis direction for each X linear guide 27a. The X slide member 27b is slidably engaged with the corresponding X linear guide 27a with low friction, and the X coarse movement stage 23x has a predetermined stroke in the X-axis direction with low friction on the pair of X beams 25. It is movable. The X coarse movement stage 23x is restricted in relative movement in the Y axis direction relative to the Y coarse movement stage 23y by the X linear guide device 27, and moves in the Y axis direction integrally with the Y coarse movement stage 23y. That is, the X coarse movement stage 23x and the Y coarse movement stage 23y constitute a gantry-type two-axis stage device.

  The X coarse movement stage 23x is driven in the X axis direction on the Y coarse movement stage 23y by an X actuator (not shown). Although the kind of X actuator is not specifically limited, For example, a linear motor, a feed screw device, a belt drive device, etc. can be used. The Y position information of the Y coarse movement stage 23y and the X position information of the X coarse movement stage 23x are respectively obtained by a linear encoder system (or an optical interferometer system) not shown.

  The fine movement stage 21 is made of a box-shaped member having a rectangular shape in plan view, and a substrate holder 40 is fixed on the upper surface thereof. In FIG. 1, the fine movement stage 21 and the substrate holder 40 are shown in the cross section along the line AA in FIG. 2. The fine movement stage 21 is moved on the X coarse movement stage 23x by a fine movement stage drive system including a plurality of voice coil motors including a stator fixed to the X coarse movement stage 23x and a mover fixed to the fine movement stage 21. It is slightly driven in the direction of three degrees of freedom (X axis, Y axis, θz direction). The plurality of voice coil motors include a plurality of X voice coil motors that generate thrust in the X-axis direction and a plurality of Y voice coil motors (not shown) that generate thrust in the Y-axis direction.

  The fine movement stage 21 is guided to the X coarse movement stage 23x via the plurality of voice coil motors, and moves with the X coarse movement stage 23x in a predetermined stroke in the X axis direction and / or the Y axis direction. The fine movement stage 21 is slightly driven in the three degrees of freedom direction with respect to the X coarse movement stage 23x by a plurality of voice coil motors. The fine movement stage drive system has a plurality of Z voice coil motors (not shown) for finely driving the fine movement stage 21 in the three degrees of freedom in the θx, θy, and Z-axis directions. The plurality of Z voice coil motors are disposed at locations corresponding to the four corners of fine movement stage 21, for example. The configuration of the fine movement stage drive system including a plurality of voice coil motors is disclosed in, for example, US Patent Application Publication No. 2010/0018950.

  Position information in the XY plane of fine movement stage 21 (including rotation amount information in the θz direction) includes a substrate including a laser interferometer (not shown) (including an X interferometer and a Y interferometer) fixed to apparatus main body 30. It is obtained by an interferometer system using a bar mirror 22 (including an X moving mirror and a Y moving mirror) fixed to the fine movement stage 21 via a mirror base 24. Further, the positional information of the fine movement stage 21 in the θx, θy, and Z-axis directions is obtained by using a target 57 fixed to a weight cancellation device 54 described later by a plurality of Z sensors 56 fixed to the lower surface of the fine movement stage 21. Is required. The configuration of the position measurement system of the fine movement stage 21 is disclosed in, for example, US Patent Application Publication No. 2010/0018950.

  As can be seen from FIGS. 1 and 2, the substrate holder 40 is made of a plate-like member having a rectangular shape in plan view parallel to the XY plane, and has a small hole on the upper surface for sucking and holding the substrate P by vacuum suction. A plurality of are formed. Further, as shown in FIG. 2, a plurality of (for example, four) X grooves 41 extending in the X axis direction are formed on the upper surface of the substrate holder 40 at predetermined intervals in the Y axis direction. The dimensions of the substrate holder 40 in the X-axis and Y-axis directions are set somewhat shorter than the dimensions of the substrate P in the X-axis and Y-axis directions, respectively, and the substrate P is placed on the substrate holder 40. The end portion of the substrate P protrudes somewhat from the end portion of the substrate holder 40. This is for preventing the resist from adhering to the back surface of the substrate P and preventing the resist from adhering to the substrate holder 40.

  Returning to FIG. 1, each of the plurality of substrate lift devices 45 includes a Z actuator 46 fixed to the upper surface of the X coarse movement stage 23 x and an air levitation device 47 attached to the + Z side end of the Z actuator 46. For example, three air levitation devices 47 are accommodated in one X groove 41 at a predetermined interval in the X-axis direction (that is, in this embodiment, for example, twelve substrate lift devices 45 are provided). A plurality of (for example, three) through-holes 42 penetrating the substrate holder 40 in the vertical direction are formed on the bottom surface defining the X groove 41 at predetermined intervals in the X-axis direction. Further, the fine movement stage 21 is formed with through holes 21 a at positions corresponding to the plurality of through holes 42. A part of the Z actuator 46 is inserted through the through holes 21 a and 42. The fine movement stage 21 is slightly smaller than the X coarse movement stage 23x between the wall surface defining the X groove 41 and the air levitation device 47 and between the Z actuator 46 and the wall surfaces defining the through holes 21a and 42. A gap is set so as not to contact each other when driven. Although the kind of Z actuator 46 is not specifically limited, For example, an air cylinder apparatus, a feed screw apparatus, a cam apparatus etc. can be used.

Each of the plurality of air levitation devices 47 is lowered by the corresponding Z actuator 46 to a position where the upper surface protrudes from the upper surface (substrate mounting surface) of the substrate holder 40 to the + Z side and from the upper surface of the substrate holder 40 to the −Z side. It is synchronously driven in the Z-axis (up and down) direction between the position (retracted). A plurality of minute holes are formed on the upper surface of the air levitation device 47. Pressurized gas (for example, air) is ejected from the holes, and the substrate P (the substrate P in FIG. ₁ ) can be levitated and supported. Further, at least a part of the plurality of air levitation devices 47 can suck and hold the substrate P by sucking the gas between the substrates P. In the air levitation device 47, the gas ejection hole and the gas suction hole may be the same or different from each other. Further, the number of X grooves 41 and the number and arrangement of the air levitation devices 47 (substrate lift devices 45) can be appropriately changed according to the size of the substrate P, for example.

  The Y-step surface plate 50 is made of a member having a rectangular YZ section extending in the X-axis direction, and is inserted between a pair of X beams 25 (one is not shown in FIG. 1). The dimension of the Y-step surface plate 50 in the X-axis direction is set somewhat longer than the movement stroke of the fine movement stage 21 in the X-axis direction. The upper surface of the Y-step surface plate 50 is finished with very high flatness. The Y step surface plate 50 is composed of a plurality of Y linear guides 35 a fixed to the upper surface of the substrate stage mount 33 and a plurality of Y slide members 35 b fixed to the lower surface of the Y step surface plate 50. The linear guide device 35 guides straightly on the substrate stage mount 33 with a predetermined stroke in the Y-axis direction.

  The Y-step surface plate 50 is mechanically connected to each of the pair of X beams 25 via a device called a flexure device 51 in the vicinity of both ends in the longitudinal direction. As a result, the Y-step surface plate 50 and the Y coarse movement stage 23y move integrally in the Y-axis direction. The flexure device 51 includes, for example, a thin strip-shaped steel plate arranged in parallel to the XY plane, and a slide device (for example, a ball joint) provided at both ends of the steel plate. Between the Y step surface plate 50 and the X beam 25. Accordingly, the flexure device 51 has lower rigidity in the other five degrees of freedom directions (X, Z, θx, θy, θz directions) compared to the rigidity in the Y-axis direction. The Y coarse movement stage 23y is vibrationally separated.

  The weight canceling device 54 supports the fine movement stage 21 from below via a device called a leveling device 59 described later. The weight cancellation device 54 is inserted into an opening formed in the X coarse movement stage 23x. The weight cancellation device 54 of this embodiment is configured in the same manner as the weight cancellation device disclosed in, for example, US 2010/0018950. That is, the weight canceling device 54 has an air spring (not shown) and the like, and the weight (weight) of the system including the fine movement stage 21, the substrate holder 40, and the like by the upward force in the gravity direction (+ Z direction) generated by the air spring. The downward force (−Z direction force) due to acceleration is canceled out, thereby reducing the load on the Z voice coil motor included in the fine movement stage drive system.

  The weight cancellation device 54 is mechanically connected to the X coarse movement stage 23x via a plurality of flexure devices 55, and moves in the X axis direction and / or the Y axis direction integrally with the X coarse movement stage 23x. . The configuration of the flexure device 55 is substantially the same as the configuration of the flexure device 51 that connects the Y-step surface plate 50 and the X beam 25 described above. The leveling device 59 includes a spherical bearing device (or a pseudo spherical bearing device as disclosed in, for example, US Patent Application Publication No. 2010/0018950), and swings (tilts) the fine movement stage 21 in the θx and θy directions. Support from below freely.

  Here, the weight cancellation device 54 is mounted in a non-contact state on the Y-step surface plate 50 via a plurality of air bearings 58 attached to the lower surface thereof. The weight cancellation device 54 moves on the Y-step surface plate 50 when moving in the X-axis direction integrally with the X coarse movement stage 23x. On the other hand, when the weight cancellation device 54 moves in the Y-axis direction integrally with the X coarse movement stage 23x, it moves in the Y-axis direction integrally with the Y coarse movement stage 23y and the Y step surface plate 50. As a result, the Y-step surface plate 50 does not fall off.

The substrate carry-out device 70 is a device that carries the substrate P (substrate P _{1 in} FIG. ₁ ) held by the substrate holder 40 toward the outside of the substrate stage device PST (a port unit 60 described later in the present embodiment). Of the pair of X beams 25, the X beam 25 is attached to the outer surface (the surface facing the + Y side) of the + Y side X beam 25. The substrate carry-out device 70 drives the suction pad 71 that sucks and holds the lower surface of the substrate P to be carried out, the support member 72 that supports the suction pad, and the support member 72 along the X beam 25 with a predetermined stroke in the X-axis direction. And a drive system (not shown).

  As shown in FIG. 2, the suction pad 71 is made of a plate-like member having a rectangular shape in plan view with the X-axis direction as the longitudinal direction. The suction pad 71 is connected to a vacuum device (not shown), and the upper surface (the surface portion facing the + Z side) functions as a substrate suction surface portion. As shown in FIG. 1, the support member 72 is made of a plate-like member parallel to the XZ plane extending in the Z-axis direction, and a suction pad 71 is attached in the vicinity of the upper end portion (the end portion on the + Z side). .

  As shown in FIG. 2, the suction pad 71 is connected to the support member 72 in the vicinity of the + Y side end, so that the −Y side end is −Y from the surface of the support member 72 facing the −Y side. When the substrate stage 20 is viewed from the + Z side, the suction pad 71 is positioned above the substrate holder 40, depending on the X position of the substrate holder 40. (Overlapping in the Z-axis direction). The suction pad 71 is supported by the support member 72 so that the Z position on the lower surface thereof is higher than the Z position on the upper surface of the substrate holder 40. As a result, the suction pad 71 is moved from the upper surface of the substrate holder 40 by the plurality of substrate lift devices 45 (not shown in FIG. 2, refer to FIG. 1) (lifted) to bring the suction pad 71 into the substrate P and the substrate P. It can be inserted between the holder 40.

  As shown in FIG. 1, the support member 72 is formed such that a portion on the + Z side is slightly bent toward the + X side from the central portion in the Z-axis direction. Thereby, in the substrate carry-out device 70, the suction pad 71 can be retracted outside the movable range in the X-axis direction of the substrate holder 40 while the exposure processing for the substrate P is performed (FIG. 4). (See (A)).

In the substrate stage 20, when the substrate P (substrate P _{1 in} FIG. 1) is carried out, as shown in FIG. 1, the upper surface of the air levitation device 47 of each of the plurality of substrate lift devices 45 is positioned at the Z position. The plurality of Z actuators 46 are controlled so as to be on the + Z side with respect to the upper surface of 40. The suction pad 71 sucks and holds the lower surface of the substrate P in the vicinity of the −X side and + Y side end portions (corner portions), and the support member 72 is driven in the + X direction in this state, so that the substrate P becomes the substrate. It moves on the holder 40 in the + X direction and is carried out to the port unit 60. At this time, from each of the plurality of air levitation devices 47, pressurized gas is ejected to the lower surface of the substrate P, and the substrate P is supported to be levitated. As a result, the substrate P moves on the substrate holder 40 with low friction.

  As can be seen from FIGS. 1 and 3, the port unit 60 is disposed on the + X side of the apparatus main body 30 and the substrate stage apparatus PST. The port unit 60 is accommodated in a chamber (not shown) together with the apparatus main body 30 and the substrate stage apparatus PST. In FIG. 3, members other than the substrate holder 40 in the substrate stage 20 are not shown in order to avoid complication of the drawing. Further, in the substrate stage 20 shown in FIG. 3, a Y coarse movement stage 23y (not shown in FIG. 3; see FIG. 1) is located approximately in the center of the movable range, and an X coarse movement stage 23x (not shown in FIG. 3). 1) is located at the stroke end on the + X side. Hereinafter, the position of the substrate holder 40 shown in FIG. 3 will be referred to as a substrate replacement position.

As shown in FIG. 1, the port unit 60 includes a substrate guide device 62 that receives an exposed substrate P (substrate P _{1 in} FIG. ₁ ) from the substrate stage 20. The substrate guide device 62 is mounted on a pedestal 61 installed on the floor 11. The substrate guide device 62 includes a base 63, a plurality of Z actuators 65, and a plurality of air levitation devices 66 corresponding to the plurality of Z actuators 65, respectively. Although the kind of Z actuator 65 is not specifically limited, For example, an air cylinder, a feed screw apparatus, a cam apparatus etc. can be used.

  The base 63 is made of a plate-like member having a rectangular shape in plan view and arranged parallel to the floor 11 (XY plane). The base 63 is linearly guided in the X-axis direction by an X linear guide device 64 configured by an X linear guide 64 a fixed to the upper surface of the gantry 61 and an X slider 64 b fixed to the lower surface of the base 63. The base 63 is driven with a predetermined stroke in the X-axis direction with respect to the gantry 61 by an X actuator (not shown). When the liquid crystal exposure apparatus 10a is used (including the exposure operation) except when the substrate is unloaded as described later, the base 63 (substrate guide apparatus 62) is at the + X side stroke end (position away from the substrate stage apparatus PST). Be positioned.

  Each of the plurality of air levitation devices 66 is composed of a plate-like member parallel to the XY plane, and is synchronously driven by the Z actuator 65 in the Z-axis (vertical) direction. A plurality of minute holes (not shown) are formed on the upper surface of the air levitation device 66. Pressurized gas (for example, air) is ejected from the holes, and the substrate P is levitated and supported through a minute clearance. Can be done. Further, at least a part of the air levitation device 66 can also hold the substrate P by suction using the plurality of holes (or other holes).

  As shown in FIG. 3, the plurality of air levitation devices 66 are spaced apart from each other at a predetermined interval so that the lower surface of the substrate P can be supported almost evenly. In the first embodiment, a plurality of (for example, three) air levitation device rows composed of a plurality of (for example, three) air levitation devices 66 arranged at predetermined intervals in the X-axis direction are plural (for example, four rows) at predetermined intervals in the Y-axis direction. It is arranged. Thus, in the first embodiment, the substrate P is supported from below by using, for example, 12 air levitation devices 66 in total. The number and arrangement of the air levitation devices 66 and the shape of the substrate guide surface formed by the plurality of air levitation devices 66 can be changed as appropriate according to the size of the substrate P, for example.

  The substrate carry-in device 80a is arranged above the port portion 60 (+ Z side). The substrate carry-in device 80a includes a pair of X travel guides 81a, a pair of X slide members 82 provided corresponding to the pair of X travel guides 81a, and a fork hand 83 supported by the pair of X slide members 82. Yes.

Each of the pair of X traveling guides 81a is composed of a member extending in the X-axis direction, and its longitudinal dimension is set to be somewhat longer than the X-axis dimension of the substrate P. The pair of X traveling guides 81a are arranged in parallel to each other at a predetermined interval in the Y-axis direction (spacing slightly wider than the dimension in the Y-axis direction of the substrate P). As shown in FIG. 1, the X traveling guide 81 a is mounted on a pedestal 88 installed on the floor 11. Multiple frame 88 includes a top plate portion 88 ₁ extending in the X-axis direction, a pair of leg portions 88 ₂ that supports the top plate 88 ₁ from below on the floor 11, which is installed between the pair of leg portions 88 ₂ of and a stiffening portion 88 _3. As shown in FIG. 3, a pair of gantry 88 is provided corresponding to a pair of X traveling guides 81a. A pair of frame 88, as shown in FIG. 1, are connected to each other by a connecting member 88 ₄ in the vicinity of the lower end portion of the leg portion 88 ₂ (however, one leg 88 ₂ in FIG. 1 is not shown). The X running guide 81a is mounted on the top plate portion 88 ₁ of the corresponding frame 88.

  Returning to FIG. 3, each of the pair of X slide members 82 is slidably engaged with the corresponding X travel guide 81a in the X axis direction, and an X actuator (not shown) (for example, a feed screw device, a linear motor, The belt is driven synchronously with a predetermined stroke along the X travel guide 81a. If the pair of X slide members 82 can be driven synchronously in the X axis direction, for example, when the X actuator is a feed screw device, the pair of X slide members 82 may be driven by a common motor, or Only one X slide member 82 may be driven by the X actuator.

Fork hand 83 includes a base portion 83 ₁ is a parallel plate-like portion to the XY plane extending in the Y-axis direction, a plurality of (e.g. four) is a X-axis direction parallel to the plate-like portion to the XY plane extending and a support portion 83 _2. A plurality of support portions 83 ₂ are disposed parallel to each other at predetermined intervals in the Y-axis direction, the ends of each of the + X side is connected to the -X side end of the base portion 83 _1. The base portion 83 ₁ and a plurality of support portions 83 ₂ are integrally formed by, for example, CFRP (Carbon Fiber Reinforced Plastics). That is, the fork hand 83 has a plate shape in which a plurality of cutouts (for example, three in this embodiment) are formed at predetermined intervals in the Y-axis direction on the front end portion side (−X direction side) of the substrate P in the transport direction. It can be said that. The longitudinal direction (X-axis direction) dimension of the plurality of support portions 83 ₂ is set somewhat shorter than the dimension in the X-axis direction of the substrate P, the substrate P includes the -X side of the area of the base portion 83 ₁ by a plurality of support portions 83 _2, is supported from below. Z position of the fork hand 83, as shown in FIG. 1, is set somewhat -Z side (substantially the same Z position the top plate portion 88 ₁ of the pedestal 88) than X running guide 81a. Incidentally, a base portion 83 ₁ and a plurality of support portions 83 ₂ may be a separate member from each other.

The plurality of support portions 83 ₂ each of the upper surfaces, the suction pads 84 of a plurality arranged in a predetermined interval in the X-axis direction (for example, three) are mounted. The fork hand 83 is connected to a vacuum device (not shown), and can hold the substrate P by suction using the plurality of suction pads 84. Fork hand 83, the base portion 83 ₁ of the + Y side end portion of the -Y side via an attachment member 83 ₃ + Y side are respectively connected to the X slide member 82 on the -Y side. In the substrate carry-in device 80a, the pair of X slide members 82 are moved synchronously in the X-axis direction, so that the region above the substrate guide device 62 in the port portion 60 and the region above the substrate holder 40 located at the substrate replacement position. The fork hand 83 (and the substrate P) can be moved parallel to the XY plane.

Here, the intervals in the Y-axis direction of the plurality of air levitation devices 47 included in the substrate stage 20 are such that the fork hand 83 is positioned above the substrate holder 40 located at the substrate replacement position (the fork hand 83 is -X the side while being positioned in the stroke end), are set so that a plurality of support portions 83 ₂ and Y position of the fork hand 83 do not overlap. Accordingly, when the plurality of air levitation devices 47 are driven in the + Z direction in synchronization with the fork hand 83 positioned above the substrate holder 40 located at the substrate replacement position, the plurality of air levitation devices 47 are without contacting the fork hand 83, so that it can pass between the support portions 83 ₂ adjacent to each other. Further, the intervals in the Y-axis direction of the plurality of air levitation devices 66 included in the port portion 60 are substantially the same as the intervals in the Y-axis direction of the plurality of air levitation devices 47, and the fork hand is located above the port portion 60. If 83 is driven a plurality of the air floating device 66 in the + Z direction while the position, a plurality of air floating device 66, without contacting the fork hand 83, to pass between the supporting portion 83 ₂ adjacent to each other Can be done.

In the liquid crystal exposure apparatus 10a (see FIG. 1) configured as described above, the mask M is loaded onto the mask stage MST by a mask loader (not shown) under the control of the main controller (not shown). At the same time, the substrate P is loaded onto the substrate holder 40 by the substrate carry-in device 80a. After that, alignment measurement is performed by the main controller using an alignment detection system (not shown), and after the alignment measurement, a step-and-scan exposure operation is sequentially performed on a plurality of shot areas set on the substrate. Is done. Since this exposure operation is the same as a conventional step-and-scan exposure operation, a detailed description thereof will be omitted. Then, the substrate P (the substrate P _{1 in} FIG. 1) for which the exposure processing has been completed is carried out of the substrate holder 40, and another substrate P (the substrate P _{2 in} FIG. 1) to be exposed next is transported to the substrate holder 40. As a result, the substrate P on the substrate holder 40 is exchanged, and the exposure operation and the like are continuously performed on the plurality of substrates P.

Hereinafter, the substrate P on the substrate holder 40 in the liquid crystal exposure device 10a (for convenience, the substrate _{P 1} a plurality of substrates P, the substrate _{P 2,} referred to as the substrate _{P 3)} 4 for the exchange operation (A) ~ FIG 9 (B ). The following board replacement operation is performed under the control of a main controller (not shown).

In FIG. 4A, the substrate P ₁ is held by the substrate holder 40 of the substrate stage 20. The fork hand 83 of the substrate carry-in device 80a holds the substrate P ₂ (next substrate P ₂ ) that is to be held next by the substrate holder 40 after the substrate P ₁ is unloaded from the substrate holder 40. ing. An external carry-out robot 90a and an external carry-in robot 90b (not shown in FIG. 4A, see FIG. 7B) outside the chamber in which the substrate stage 20, the port unit 60, and the substrate carry-in device 80a are accommodated. Is installed. The external carry-out robot 90a has an unload hand 91a that is cantilevered by a robot arm 92a. As shown in FIG. 7B, the external carry-in robot 90b also has a load hand 91b that is cantilevered by the robot arm 92b. Each configuration of the unload hand 91a and the load hand 91b is substantially the same as the fork hand 83 of the substrate carry-in device 80a.

The main control unit, among the plurality of shot areas set on the substrate P _1, after exposure for the last shot area has been completed, so the substrate holder 40 is a substrate exchange position shown in FIG. 4 (A) The substrate stage 20 is controlled so as to be positioned at the position. In parallel with this, the fork hand 83 of the substrate carry-in device 80a is driven in the -X direction, thereby the substrate P ₂ is positioned above the substrate exchange position. Further, in the port unit 60, the substrate guide device 62 is driven in a direction approaching the substrate stage 20 (−X direction). While the exposure process is being performed, the support member 72 of the substrate carry-out device 70 is positioned at the + X side stroke end, and the suction pad 71 is retracted outside the movable range of the substrate holder 40 in the X-axis direction. doing.

When the substrate holder 40 is positioned at the substrate exchange position, the main controller, as shown in FIG. 4 (B), together to release the suction holding of the substrate P ₁ by the substrate holder 40, controls a plurality of substrate lift device 45 Then, the air levitation device 47 is driven up. Thus, a gap is formed between the upper surface of the lower surface and the substrate holder 40 of the substrate P _1. Next, as shown in FIG. 5A, the support member 72 of the substrate carry-out device 70 is driven in the −X direction, whereby the suction pad 71 is located between the lower surface of the substrate P _{1 and} the upper surface of the substrate holder 40. passes through the gap, the end of the -X side and + Y side of the substrate P ₁ (corner) is located below the vicinity. Thereafter, the plurality of air levitation devices 47 are driven downward, and the lower surface of the substrate P ₁ is sucked and held by the suction pad 71. Further, a plurality of air floating device 47 floats supporting the substrate P ₁ by ejecting the pressurized gas to the lower surface of the substrate P _1. At this time, the plurality of air levitation devices 47 of the substrate stage 20 and the plurality of air levitation devices 66 of the port unit 60 are controlled so that the Z positions on the top surfaces thereof are substantially the same.

Thereafter, as shown in FIG. 5 (B), the support member 72 of the substrate carry-out device 70 is driven in the + X direction, thereby, the substrate P ₁ is more air floating device 47, and a plurality of air floating devices 66 It moves in the + X direction along a surface (guide surface) parallel to the XY plane defined by the upper surface of the substrate, and is carried out from the substrate holder 40 to the port unit 60. At this time, from the upper surface of the plurality of air floating device 66, pressurized gas is injected to the substrate P _1. This makes it possible to move the substrate P ₁ fast and with low dust generation.

When the substrate P ₁ is passed over a plurality of air floating device 66 from the substrate holder 40, as shown in FIG. 6 (A), together with the suction holding of the substrate P ₁ is released by the suction pads 71, a plurality The jet of pressurized gas from the air levitation device 66 is stopped. Substrate P ₁ is sucked and held on a plurality of air floating device 66, a substrate guide device 62 which supports the substrate P ₁ is driven in the + X direction. In the substrate stage 20, the plurality of air levitation devices 47 are driven upward to press the lower surface of the substrate P ₂ that has been waiting above the substrate stage 20 from below. In the fork hand 83, suction holding of the substrate P ₂ is released, thereby, the substrate P ₂ is separated from the fork hand 83. Note that the fork hand 83 may be lowered to deliver the substrate P ₂ to the plurality of air levitation devices 47.

When the substrate P ₂ and the fork hand 83 is spaced, as shown in FIG. 6 (B), the fork hand 83 is driven in the + X direction, and retreated from above the substrate exchange position, the position of the upper substrate guide device 62 Return to. Furthermore, the port portion 60, a plurality of air floating devices 66, somewhat lowered driven in preparation for unloading of the external device for the substrate P _1. Next, as shown in FIG. 7A, in the substrate stage 20, the plurality of air levitation devices 47 are driven down and the substrate P < _b > ₂ is placed on the substrate holder 40. Furthermore, the port portion 60, the unloading hand 91a of the external unloading robot 90a is inserted into the lower substrate _{P 1.} As described above, since the unload hand 91a has substantially the same shape as the fork hand 83, it does not come into contact with the Z actuator 65 for driving the air levitation device 66.

Thereafter, as shown in FIG. 7B, the substrate P ₂ is sucked and held by the substrate holder 40, and the substrate stage 20 is separated from the port portion 60 in order to perform alignment operation, exposure operation, and the like related to the substrate P _2. It is driven in the direction. Hereinafter, the description of the operation of the substrate stage 20 during the alignment process and during the exposure process will be omitted. Furthermore, the port portion 60, after which the suction holding the substrate P ₁ by a plurality of air floating device 66 is released, the substrate P ₁ is recovered from the port portion 60 by the unloading hand 91a of the external unloading robot 90a, not shown To the external device. At this time, the fork hand 83 may be retracted from above the port portion 60 so that the unload hand 91a and the fork hand 83 do not interfere with each other. External loading On loading hand 91b of the robot 90b, the substrate P ₃ that will next exposure processing of the substrate P ₂ is performed is placed.

Next, as shown in FIG. 8A, the plurality of air levitation devices 66 are driven to rise in synchronization in the port portion 60. At this time, each of the plurality of air floating device 66, passes between the supporting portion 83 ₂ adjacent to each other fork hand 83 has.

Then, as shown in FIG. 8 (B), loaded hand 91b of the external loading robot 90b which supports the substrate _{P 3} is driven in the -X direction, a pair of X travel guide 81a of the substrate carry-in device 80a (FIG. 7 ( In A), only one is shown (see FIG. 3). As described above, since the load hand 91b has substantially the same shape as the fork hand 83, it does not contact the air levitation device 66. As a result, the load hand 91b of the external carry-in robot 90b and the fork hand 83 of the board carry-in device 80a overlap in the vertical direction. In this case, a plurality of air floating device 66 has been positioned with respect to the Z-axis direction as the lower surface of the substrate P ₃ which is carried by the load hand 91b located below. In addition, after inserting the load hand 91b between the pair of X traveling guides 81a, the plurality of air levitation devices 66 may be driven up (the operations in FIGS. 8A and 8B may be reversed). Further, the load hand 91b may be inserted between the pair of X traveling guides 81a before the fork hand 83 returns to the position above the substrate guide device 62 (see FIG. 6B).

Next, as indicated by the solid arrows in FIG. 9A, the load hand 91b of the external carry-in robot 90b is driven in the −Z direction and then driven in the + X direction. Substrate P _3, which is supported by the loading hand 91b, by loading the hand 91b is driven in the -Z direction, in contact with the upper surface of the plurality of air floating devices 66, it is supported from below into a plurality of air floating devices 66 . Load hand 91b, after its upper surface and the substrate P ₃ is driven downward to a position spaced apart, being driven in the + X direction and retracted from the chamber (not shown). Note that by increasing driving a plurality of air floating device 66, may be separated and the substrate P ₃ and load hand 91b. Further, after the substrate P ₃ is passed to a plurality of air floating devices 66 may perform positioning with respect to the fork hand 83 while being floated substrate P ₃ on the plurality of air floating devices 66 (alignment) . The alignment may be performed, for example, by pressing a plurality of positions at the end of the substrate P ₃ while detecting the end (edge) position of the substrate P ₃ with an edge sensor or a CCD (Charge Coupled Device) camera. .

Thereafter, as shown in FIG. 9 (B), a plurality of air floating devices 66 for supporting the substrate P ₃ from below is driven downward in synchronization with the -Z direction. At this time, each of the plurality of air floating device 66 while passing between the support portions 83 ₂ adjacent to each other of the fork hand 83, the substrate P ₃ is supported from below on the supporting portion 83 ₂ of the fork hand 83. Accordingly, the substrate P ₃ is passed from a plurality of air floating device 66 to the fork hand 83.

  As described above, according to the first embodiment, the port unit 60 (a plurality of port units 60) is connected from the load hand 91b in a state where the fork hand 83 is previously positioned below the load hand 91b that supports the substrate P from below. Since the substrate P is delivered to the air levitation device 66) (see FIGS. 8B to 9A), the fork hand can be easily and quickly moved from the load hand 91b of the substrate P only by driving the substrate P up and down. The transfer operation to 83 can be performed. Further, the substrate carry-in device 80a is configured such that the fork hand 83 is disposed between the pair of X traveling guides 81a. Therefore, by inserting the load hand 91b of the external loading robot 90b between the pair of X traveling guides 81a, 83. Accordingly, it is possible to transfer the substrate P carried into the liquid crystal exposure apparatus 10a from the outside to the substrate carry-in apparatus 80a in a space-saving manner.

  Further, since the substrate P is transferred from the load hand 91b to the fork hand 83 using a plurality of air levitation devices 66 used when the substrate P is unloaded from the substrate holder 40 (see FIG. 5B), the efficiency is improved. good.

<< Second Embodiment >>
Next, a second embodiment will be described with reference to FIGS. The configuration of the liquid crystal exposure apparatus 10b according to the second embodiment is the same as that of the first embodiment except for the substrate carry-in apparatus 80b. Hereinafter, elements having the same configuration and function as those of the first embodiment are denoted by the same reference numerals as those of the first embodiment, and description thereof is omitted.

As shown in FIG. 3, in the first embodiment, the fork hand 83 of the substrate carry-in device 80a, the end of the base portion 83 1 _(fork hand 83 + X side connecting the plurality of support portions 83 ₂ mutually 11) is a cantilever support structure that is supported by a pair of X traveling guides 81 a, but as shown in FIG. 11, the substrate carry-in device 80 b of the second embodiment is the −X side of the fork hand 83. has an end portion holding the end (free end portion of the plurality of support portions 83 ₂₎ (supporting) capable of retaining member 87 further.

  As shown in FIG. 10, in the substrate carry-in device 80b according to the second embodiment, the X travel guide 81b is formed longer (almost twice as long) as the first embodiment. In the X travel guide 81b, the + X side region is supported from below on the pedestal 88 in the same manner as in the first embodiment, whereas the −X side region is suspended and supported on the lower surface of the lens barrel base plate 31. Has been. As shown in FIG. 11, the X travel guides 81b are spaced apart from each other in the Y-axis direction and arranged in parallel to each other. The substrate carry-in device 80b further includes a pair of X slide members 86 corresponding to the pair of X travel guides 81b. Each of the pair of X slide members 86 is disposed on the −X side with respect to the pair of X slide members 82 for driving the fork hand 83. The X position of each of the pair of X slide members 82 and the pair of X slide members 86 is independently controlled by an X actuator (not shown) (for example, a linear motor).

The holding member 87 is a member extending in the Y-axis direction, and is spanned between the pair of X slide members 86. The surface facing the + X side holding member 87, corresponding to the supporting portion 83 ₂ of the fork hand 83, a plurality (in the second embodiment, for example, four) predetermined intervals recess 87a is in the Y-axis direction It is formed with. The recess 87a is defined by a tapered surface that narrows from the + X side toward the -X side. In contrast, a plurality of support portions 83 ₂ each tip fork hand 83 has the (end of the -X side), insertable tapered member 85 in the recess 87a (frustoconical member) is fixed ing.

In the second embodiment, as shown in FIG. 12 (A), above the substrate stage 20 on which the substrate P ₂ placed on the fork hand 83 is positioned at the substrate exchange position from above the port portion 60 When transported, the taper member 85 is inserted into a recess 87 a formed in the holding member 87. As a result, the tip of the fork hand 83 is held by the holding member 87. As shown in FIGS. 12B and 12C, the exposed substrate P ₁ held on the substrate stage 20 is transferred to the port portion 60 by the substrate carry-out device 70 as in the first embodiment. It is carried out. After unloading of the substrate P _1, the substrate stage 20, as shown in FIG. 13 (A), a plurality of air floating device 47 is driven upward, the substrate P ₂ is supported from below into a plurality of air floating devices 47 it allows to separate the substrate _{P 2} and the fork hand 83.

When the substrate P ₂ is supported by the plurality of air floating device 47, the substrate carry-in device 80b, as shown in FIG. 13 (B), X slide pair (although FIG. 13 (B) in one is not shown) The member 82 is driven in the + X direction. As a result, the taper member 85 is detached from the recess 87 a of the holding member 87, and the fork hand 83 returns to a position above the port portion 60. In contrast, the pair of X slide members 86 (one of which is not shown in FIG. 13B) is driven in the −X direction. This is so that no contact with the holding member 87 and the substrate P ₂ when driven downward the substrate P _2.

Thereafter, as shown in FIG. 13 (C), the substrate P ₂ is driven downward while being placed on the substrate holder 40, a pair of X slide member 86 is driven in the + X direction. As a result, the taper member 85 of the fork hand 83 is inserted into the recess 87 a formed in the holding member 87. Although not shown, another substrate transported by the external carry-in robot 90b (see FIG. 7B) is placed on the fork hand 83 in the same procedure as in the first embodiment.

According to the second embodiment, in the substrate carry-in device 80b, the tip of the fork hand 83 is held by the holding member 87, so that the weight of the fork hand 83 and the substrate P placed on the fork hand 83 is reduced. The bending caused by the is suppressed. Accordingly, rigidity can be ensured even if the thickness of the fork hand 83 is reduced. Further, since it is possible to separate the fork hand 83 and the holding member 87, as in the first embodiment, in the state where air floating device 47 into a plurality of between the supporting portion 83 ₂ of the fork hand 83 is inserted The fork hand 83 can be returned to the position above the port portion 60.

  Note that the configurations described in the first and second embodiments can be modified as appropriate. For example, as shown in FIG. 14A, when the load hand 91b of the external loading robot 90c is supported from below by the robot arm 92b via the θz actuator 93c (so-called SCARA robot arm), FIG. As shown in (B), when the port unit 60 receives the substrate P from the external carry-in robot 90 c, the substrate guide device 62 is in a state where the plurality of air levitation devices 66 are positioned on the + Z side with respect to the upper surface of the fork hand 83. May be moved in the + X direction (direction approaching the external loading robot 90c side). In this case, as shown in FIG. 14C, the fork hand 83 and the load hand 91b cannot be completely overlapped in the vertical direction (Z-axis direction), but as shown in FIG. After the substrate P is transferred from the load hand 91b to the plurality of air levitation devices 66, the substrate guide device 62 is driven in the −X direction as shown in FIG. Similarly to the embodiment, the substrate P can be transferred from the plurality of air levitation devices 66 to the fork hand 83 (see FIG. 15C).

The holding structure of the distal end portion of the plurality of support portions 83 ₂ is not limited to the fitting structure between the concave 87a defined by the tapered member 85 and the tapered surface as the second embodiment (see FIG. 11) For example, as shown in FIG. 16, a columnar (shaft-shaped) member 185 having a tapered tip portion and a cylindrical member 187 (linear bush 187) may be combined. Further, by arranging the ball 187 a on the inner wall surface of the linear bush 187, the fork hand 83 can be smoothly connected to and separated from the linear bush 187. Incidentally, if suppressing the deflection of the fork hand 83 is not limited to this, for example, it is the tip of the plurality of support portions 83 ₂ simply be supported from below.

  Further, as shown in FIGS. 17A and 17B, a plurality of Y actuators 149a for sliding the substrate P placed on the substrate holder 140 in the Y-axis direction, and a positioning Y actuator 149c. The substrate slide device including the substrate holder 140 (or the fine movement stage 21 or the X coarse movement stage 23x (each not shown)) may be provided with the positioning pins 149b on the suction pad 71. Accordingly, the suction pad 71 can be disposed outside the substrate holder 140 (a position that does not overlap vertically). In FIGS. 17A and 17B, the substrate holder 140 is provided with lift pins 147 in place of the plurality of air levitation devices 47 (see FIG. 2). Is passed. When the substrate P is unloaded, the pressurized gas is ejected from the upper surface of the substrate holder 140 to the lower surface of the substrate P.

In the first embodiment, the fork hand 83 has a configuration in which the + X side end is cantilevered by the X travel guide 81a via the X slide member 82 (see FIG. 3). in addition to, for example, the outermost (+ Y side, and the -Y side) support part 83 ₂ of the front end portion of the (-X side end) is supported by the X traveling guide 81a via another X slide member in the vicinity Also good. In this case, it is necessary to extend the X travel guide 81a to above the substrate replacement position, as in the second embodiment, but the bending of the fork hand 83 can be further suppressed.

The substrate carry-in devices 80a and 80b may be movable up and down with respect to the floor 11. Further, only the fork hand 83 may be movable up and down with respect to the X slide member 82. In this case, from the fork hand 83 during delivering operation of the substrate P ₂ to the substrate stage 20 shown in FIG. 6 (A) and 6 (B), it is possible to lower the fork hand 83, the air floating devices 66 The amount of increase can be reduced. Further, the substrate unloading device for unloading the substrate P from the substrate stage 20 may be built in the substrate holder 40, or may be disposed on both sides of the substrate holder 40 when disposed outside the substrate holder 40. . Further, a substrate carry-out device may be installed in the port unit 60.

The illumination light may be ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm). As the illumination light, for example, a single wavelength laser beam oscillated from a DFB semiconductor laser or a fiber laser is amplified by a fiber amplifier doped with, for example, erbium (or both erbium and ytterbium). In addition, harmonics converted into ultraviolet light using a nonlinear optical crystal may be used. A solid laser (wavelength: 355 nm, 266 nm) or the like may be used.

  In the first and second embodiments, the case where the projection optical system PL is a multi-lens projection optical system including a plurality of projection optical units has been described. Not limited to this, it may be one or more. The projection optical system is not limited to a multi-lens type projection optical system, and may be a projection optical system using an Offner type large mirror, for example. In the above-described embodiment, the case where the projection optical system PL has an equal magnification is described. However, the present invention is not limited to this, and the projection optical system may be either a reduction system or an enlargement system.

  In the first and second embodiments, a light transmissive mask in which a predetermined light shielding pattern (or phase pattern / dimming pattern) is formed on a light transmissive mask substrate is used. Instead, for example, as disclosed in US Pat. No. 6,778,257, an electronic mask (variable) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. For example, a variable shaping mask using a DMD (Digital Micro-mirror Device) which is a kind of non-light-emitting image display element (also called a spatial light modulator) may be used.

  As an exposure apparatus, an exposure apparatus that exposes a substrate having a size (including at least one of an outer diameter, a diagonal length, and one side) of 500 mm or more, for example, a large substrate for a flat panel display such as a liquid crystal display element. It is particularly effective to apply to this.

  The exposure apparatus can also be applied to a step-and-repeat type exposure apparatus and a step-and-stitch type exposure apparatus.

  Further, the use of the exposure apparatus is not limited to a liquid crystal exposure apparatus that transfers a liquid crystal display element pattern onto a square glass plate. For example, an exposure apparatus for semiconductor manufacturing, a thin film magnetic head, a micromachine, and a DNA chip The present invention can also be widely applied to an exposure apparatus for manufacturing the above. Moreover, in order to manufacture not only microdevices such as semiconductor elements but also masks or reticles used in light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc., glass substrates, silicon wafers, etc. The present invention can also be applied to an exposure apparatus that transfers a circuit pattern. The object to be exposed is not limited to the glass plate, and may be another object such as a wafer, a ceramic substrate, a film member, or a mask blank. Moreover, when the exposure target is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and includes, for example, a film-like (flexible sheet-like member). Further, the object processing apparatus is not limited to the exposure apparatus, and may be a substrate inspection apparatus, for example. Further, the object to be transported may be a pattern holder such as a mask (the same transporting apparatus and method as in the above embodiment may be applied to transporting the mask to the exposure apparatus).

  For electronic devices such as liquid crystal display elements (or semiconductor elements), the step of designing the function and performance of the device, the step of producing a mask (or reticle) based on this design step, and the step of producing a glass substrate (or wafer) A lithography step for transferring a mask (reticle) pattern to a glass substrate by the exposure apparatus and the exposure method of each embodiment described above, a development step for developing the exposed glass substrate, and a portion where the resist remains. It is manufactured through an etching step for removing the exposed member of the portion by etching, a resist removing step for removing a resist that has become unnecessary after etching, a device assembly step, an inspection step, and the like. In this case, in the lithography step, the above-described exposure method is executed using the exposure apparatus of the above embodiment, and a device pattern is formed on the glass substrate. Therefore, a highly integrated device can be manufactured with high productivity. .

  As described above, the object processing apparatus of the present invention is suitable for processing an object. The manufacturing method of the flat panel display of this invention is suitable for manufacture of a flat panel display. The device manufacturing method of the present invention is suitable for manufacturing micro devices. The object carrying-in apparatus and method according to the present invention are suitable for carrying an object into the object processing apparatus.

  DESCRIPTION OF SYMBOLS 10a ... Liquid crystal exposure apparatus, 20 ... Substrate stage, 60 ... Port part, 70 ... Substrate carry-out device, 80a ... Substrate carry-in device, 81a ... X travel guide, 82 ... X slide member, 83 ... Fork hand, 90a ... External carry-out robot , 90b ... External loading robot, P ... Substrate, PST ... Substrate stage device.

Claims (15)

An object processing apparatus that performs a predetermined process on an object within a predetermined processing area,
An object holding device capable of holding the object in the processing region;
An in-device transport device that includes a first support member capable of supporting the object from below, and transports the object from outside the predetermined region to the object holding device;
The second object provided outside the predetermined area and supported from below by a second support member included in the apparatus outside the apparatus is positioned above the first support member located outside the predetermined area. An object processing apparatus comprising: a delivery device that receives the object from a support member and delivers the object to the first support member after the second support member has been retracted from above the first support member.   The in-device transport device includes the first support member, a drive system that drives the first support member in a first direction in a horizontal plane, and the second direction that is orthogonal to the first direction in the horizontal plane. The object processing apparatus according to claim 1, further comprising: a guide member that is arranged on each of one side and the other side of the one support member and guides the movement of the first support member.   In a state where the object supported by the second support member from below is positioned above the first support member, the second support member that supports the object has the one side and the other side with respect to the second direction. The object processing apparatus according to claim 2, wherein the object processing apparatus is inserted between the guide members.   The delivery device is movable relative to the second support member in a direction intersecting the horizontal plane, and is separated from the second support member by pressing the object supported by the second support member from below. The object processing apparatus according to any one of claims 1 to 3, further comprising a movable member to be moved. The movable member is provided to be movable in the first direction with respect to the first support member,
The object processing apparatus according to claim 4, wherein the object is moved in the first direction with respect to the first support member when the object is transferred from the second support member to the first support member.   6. The object processing apparatus according to claim 4, wherein the delivery device delivers the object to the first support member by being driven downward after the second support member is retracted from above the first support member. . The first support member is formed with a notch that opens to the front side in the transport direction when transporting the object to the object holding device,
The object processing apparatus according to claim 4, wherein the movable member is inserted into the notch.   The object processing device according to claim 5, wherein the movable member receives the object carried out from the object holding device outside the predetermined region.   The object processing apparatus according to claim 1, further comprising a pattern forming apparatus that forms a predetermined pattern on the object held by the object holding apparatus in the processing region using an energy beam.   The object processing apparatus according to claim 1, wherein the object is a substrate used for a flat panel display device.   The object processing apparatus according to claim 10, wherein the substrate has a length of at least one side or a diagonal length of 500 mm or more. Exposing the object using the object processing apparatus according to claim 10 or 11,
Developing the exposed object. A method of manufacturing a flat panel display. Exposing the object using the object processing apparatus according to any one of claims 1 to 9,
Developing the exposed object. An object conveying apparatus that is provided in an object processing apparatus that performs a predetermined process on an object held in an object holding apparatus within a predetermined processing area, and that conveys the object from outside the processing area to the object holding apparatus,
A support member capable of supporting the object from below;
A drive system for driving the support member in a first direction within a horizontal plane;
An object conveying apparatus comprising: a guide member that is disposed on each of one side and the other side of the support member with respect to a second direction orthogonal to the first direction in the horizontal plane and guides the movement of the support member. A method of carrying an object into an object processing apparatus that performs predetermined processing on the object,
Positioning a first support member included in an in-device transport device capable of transporting the object with respect to an object holding device capable of holding the object in a processing area where the processing is performed, outside the predetermined region;
Positioning the object supported from below by a second support member included in an out-of-device conveyance device provided outside the object processing device, above the first support member;
Delivering the object from the second support member located above the first support member to a delivery device;
Retracting the second support member from above the first support member;
Delivering the object from the delivery device onto the first support member.

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