JP2013219068A - Object driving system, exposure apparatus, flat panel display manufacturing method, device manufacturing method, and object driving method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently rotate a substrate on a substrate stage device.SOLUTION: The exposure apparatus comprises: a substrate stage device 20 having a substrate location plane parallel to a horizontal plane, and including a substrate holder 40 capable of holding a substrate P located on the substrate location plane; and a carrying-out device 60 carrying out the substrate P from the substrate stage device 20 along a guide plane defined by a substrate lift device 42 of the substrate stage device 20, and rotating the substrate P relative to the substrate holder 40, for example, by 90°.

Description

  The present invention relates to an object driving system, an exposure apparatus, a flat panel display manufacturing method, a device manufacturing method, and an object driving method, and more particularly, an object driving system for rotating an object relative to an object holding device, and the object The present invention relates to an exposure apparatus including a drive system, a flat panel display manufacturing method and device manufacturing method using the exposure apparatus, and an object driving method for rotating an object relative to an object holding device.

  Conventionally, in a lithography process for manufacturing an electronic device (microdevice) such as a liquid crystal display element, a semiconductor element (such as an integrated circuit), a mask or reticle (hereinafter collectively referred to as “mask”), a glass plate or a wafer (hereinafter referred to as “mask”). Step-and-scan exposure in which the pattern formed on the mask is transferred onto the substrate using an energy beam while the substrate is collectively moved along a predetermined scanning direction (scanning direction). The device is used.

  In this type of exposure apparatus, a plurality of shot areas are set on a single substrate, and a step-and-scan exposure operation is sequentially performed on the plurality of shot areas (see, for example, Patent Document 1).

  Here, depending on the size (width) of the shot area, an area (a blank area) where the pattern is not transferred may be formed on the substrate. Then, for example, by rotating the substrate by 90 °, the pattern may be transferred to the blank area. Therefore, an apparatus capable of efficiently rotating the substrate has been desired.

US Pat. No. 6,552,775

  The present invention has been made under the above circumstances. From a first viewpoint, the present invention has an object placement surface parallel to a predetermined two-dimensional plane and an object placed on the object placement surface. An object holding device including a holdable object holding member; and a drive system for rotating the object by a predetermined angle with respect to the object holding member along a guide surface defined by a guide member included in the object holding device. It is an object drive system.

  Here, the term “rotation” is not limited to a rotation operation around a fixed axis, and includes a case where an axis that defines the rotation center moves during the rotation operation.

  According to this, since the board | substrate holding apparatus has the guide member which prescribes | regulates the guide surface at the time of an object rotating, it is efficient.

  According to a second aspect of the present invention, there is provided an object driving system according to the first aspect of the present invention, and a pattern forming apparatus for forming a predetermined pattern on the object held by the object holding apparatus using an energy beam. And an exposure apparatus.

  According to a third aspect of the present invention, there is provided a flat panel display comprising: exposing the object using the exposure apparatus according to the second aspect of the present invention; and developing the exposed object. It is a manufacturing method.

  According to a fourth aspect of the present invention, there is provided a device manufacturing method comprising: exposing the object using the exposure apparatus according to the second aspect of the present invention; and developing the exposed object. is there.

  According to a fifth aspect of the present invention, an object placed on an object holding member of an object holding device is held by a predetermined holding device, and the object is held by driving the holding device. A method of driving an object, comprising: rotating a predetermined angle with respect to the object holding member along a guide surface defined by a guide member included in the apparatus.

It is a figure which shows schematically the structure of the liquid-crystal exposure apparatus which concerns on one Embodiment. FIG. 2 is a plan view (partially omitted) of a substrate stage device included in the liquid crystal exposure apparatus of FIG. 1. It is a front view which shows a substrate stage apparatus. It is a figure which shows the some substrate lift apparatus which a substrate stage apparatus has. FIGS. 5A and 5B are views (No. 1 and No. 2) for explaining the operation of the substrate lift apparatus. 6A and 6B are views (a front view and a side view) showing a carry-out device included in the substrate stage device. FIGS. 7A and 7B are views (No. 1 and No. 2) for explaining the substrate carry-in operation with respect to the substrate stage apparatus. FIG. 8A to FIG. 8C are diagrams (No. 1 to No. 3) for explaining the substrate carry-out operation using the carry-out device. FIGS. 9A to 9C are views (No. 1 to No. 3) for explaining the rotation operation of the substrate on the substrate holder. FIGS. 10A and 10B are views (a front view and a side view) showing the carry-out device according to the first modification. FIGS. 11A and 11B are views (a plan view and a cross-sectional view) showing a substrate holder according to a second modification.

  Hereinafter, an embodiment will be described with reference to FIGS. 1 to 9C.

  FIG. 1 schematically shows a configuration of a liquid crystal exposure apparatus 10 according to an embodiment. The liquid crystal exposure apparatus 10 employs a step-and-scan method in which a rectangular (square) glass substrate P (hereinafter simply referred to as a substrate P) used in, for example, a liquid crystal display device (flat panel display) is an exposure object. A projection exposure apparatus, a so-called scanner.

  The liquid crystal exposure apparatus 10 has an illumination system 12, a mask stage 14 that holds a mask M on which a circuit pattern and the like are formed, a projection optical system 16, an apparatus body 18, and a resist (surface facing the + Z side in FIG. 1) ( A port unit 70 (not shown in FIG. 1; not shown in FIG. 1) that transfers the substrate P between the substrate stage device 20 that holds the substrate P coated with a sensitive agent and an external device (for example, a coater / developer device). A)) and their control system. Hereinafter, the direction in which the mask M and the substrate P are relatively scanned with respect to the projection optical system 16 at the time of exposure is defined as the X-axis direction, and the direction orthogonal to the X-axis in the horizontal plane is defined as the Y-axis direction, the X-axis, and the Y-axis. The description will be made assuming that the orthogonal direction is the Z-axis direction, and the rotation directions around the X-axis, Y-axis, and Z-axis are the θx, θy, and θz directions, respectively.

  The illumination system 12 is configured similarly to the illumination system disclosed in, for example, US Pat. No. 5,729,331. The illumination system 12 irradiates the mask M with illumination light IL for exposure. As the illumination light IL, for example, light such as i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm), or the combined light of the i-line, g-line, and h-line is used.

  The mask stage 14 holds the mask M by, for example, vacuum suction. The mask stage 14 is driven with a predetermined long stroke in the scanning direction (X-axis direction) by a mask stage driving system (not shown) including a linear motor, for example, and is also slightly driven in the Y-axis direction and the θz direction as appropriate. . Position information of the mask stage 14 in the XY plane (including rotation amount information in the θz direction) is obtained by a mask interferometer system including a laser interferometer (not shown).

  The projection optical system 16 is disposed below the mask stage 14 and is supported by a lens barrel surface plate 18 a that is a part of the apparatus main body 18. The projection optical system 16 is configured similarly to the projection optical system disclosed in, for example, US Pat. No. 6,552,775. In other words, the projection optical system 16 includes a plurality of projection optical systems (multi-lens projection optical systems) in which the projection areas of the pattern image of the mask M are arranged in a staggered manner, and is a single rectangular shape whose longitudinal direction is the Y-axis direction. Functions in the same way as a projection optical system having one image field. In the present embodiment, as each of the plurality of projection optical systems, for example, a bilateral telecentric equal magnification system that forms an erect image is used.

  For this reason, when the illumination area on the mask M is illuminated by the illumination light IL from the illumination system 12, the illumination light that has passed through the mask M causes the circuit pattern of the mask M in the illumination area via the projection optical system 16. The projected image (partial upright image) is formed in the illumination light irradiation region (exposure region) conjugate to the illumination region on the substrate P. Then, by synchronous driving of the mask stage 14 and the substrate stage device 20, the mask M is moved relative to the illumination area (illumination light IL) in the scanning direction, and the substrate P is moved relative to the exposure area (illumination light IL). By performing relative movement in the scanning direction, scanning exposure of one shot area on the substrate P is performed, and the pattern formed on the mask M is transferred to the shot area. That is, in the liquid crystal exposure apparatus 10, the pattern of the mask M is generated on the substrate P by the illumination system 12 and the projection optical system 16, and the sensitive layer (resist layer) on the substrate P is exposed on the substrate P by the illumination light IL. That pattern is formed.

  The apparatus body 18 includes a lens barrel surface plate 18a, a pair of side columns 18b, and a pair of substrate stage mounts 18c (only one is shown in FIG. 1, see FIG. 2). The lens barrel surface plate 18a is made of a plate-like member parallel to the XY plane, and supports the mask stage 14 and the projection optical system 16. One of the pair of side columns 18b supports the vicinity of the + Y side end of the lens barrel surface plate 18a, and the other supports the vicinity of the −Y side end of the lens barrel surface plate 18a from below.

  As shown in FIG. 2, the pair of substrate stage mounts 18 c are each composed of a member extending in the Y-axis direction, and are arranged at predetermined intervals in the X-axis direction. The side column 18b is supported from below by a pair of substrate stage mounts 18c (see FIG. 1). For example, three Y linear guides 19a extending in the Y-axis direction are fixed on the upper surface of the substrate stage mount 18c at predetermined intervals in the X-axis direction. As shown in FIG. 1, the substrate stage base 18 c is installed on the floor 11 of the clean room via a vibration isolator 18 d, and the apparatus main body 18 (and the mask stage 14 and the projection optical system 16) is placed on the floor 11. Is isolated from the vibration.

  As shown in FIG. 2, the substrate stage apparatus 20 includes a pair of base frames 22, an auxiliary base frame 24, a pair of X beams 26, a coarse movement stage 30, and a fine movement stage 34 (not shown in FIG. 2, see FIG. 1). , A plurality of substrate lift devices 42 (not shown in FIG. 2, refer to FIG. 4), a weight canceling device 50, a Y step guide 56, and an unloading device 60.

  The pair of base frames 22 and the auxiliary base frame 24 are each made of a plate-like member parallel to the YZ plane extending in the Y-axis direction, and are arranged in parallel to each other at a predetermined interval in the X-axis direction. One base frame 22 is on the + X side of the + X side substrate stage gantry 18c, the other base frame 22 is on the -X side of the -X side substrate stage gantry 18c, and the auxiliary base frame 24 is a pair of substrate stages. It is arranged between the gantry 18c, and is installed on the floor 11 so as to be adjustable in height via a plurality of leg portions 22a (not shown in FIG. 2, refer to FIG. 1) including adjusters.

  A Y linear guide 21 a extending in the Y-axis direction is fixed to the + Z side ends of the pair of base frames 22 and the auxiliary base frame 24. A Y stator 23 a including a plurality of permanent magnets is fixed to both side surfaces of each of the pair of base frames 22.

  The pair of X beams 26 are members each having a rectangular YZ section extending in the X-axis direction, and are arranged in parallel to each other at a predetermined interval in the Y-axis direction. In each of the pair of X beams 26, the vicinity of both ends in the longitudinal direction is supported by the base frame 22 from below, and the central portion is supported by the auxiliary base frame 24 from below. A member called a Y carriage 28 is fixed to the lower surfaces of the X beam 26 in the vicinity of both ends in the longitudinal direction. The Y carriage 28 is formed of a member having an inverted U-shaped XZ cross section, and a corresponding base frame 22 is inserted between a pair of opposed surfaces.

  The two Y carriages 28 corresponding to the other (−X side) base frame 22 are connected by a connection plate 27. As shown in FIG. 3, two Y carriages 28 corresponding to one (+ X side) base frame 22 are also connected by a connection plate 27. Returning to FIG. 2, a plate-like member called an auxiliary carriage 29 is installed on the lower surface of the pair of X beams 26 at the center in the longitudinal direction via a spacer (not shown). The pair of X beams 26 are integrally connected via a connection plate 27, a Y carriage 28, and an auxiliary carriage 29.

  A plurality of Y slide members 21b that are slidably engaged with the Y linear guide 21a are fixed to the ceiling surface of the Y carriage 28 and the lower surface of the auxiliary carriage 29 (see FIG. 3). Accordingly, the pair of X beams 26 are guided in a straight line in the Y-axis direction on the pair of base frames 22 and the auxiliary base frame 24. Further, as shown in FIG. 3, a Y movable element 23b including a coil unit is fixed to a pair of opposing surfaces of the Y carriage 28 so as to face the Y stator 23a. The pair of X beams 26 are driven in the Y-axis direction on the pair of base frames 22 and the auxiliary base frame 24 by a Y linear motor including the Y stator 23a and the Y mover 23b. The Z position of the base frame 22 is on the + Z side with respect to the substrate stage gantry 18c, and the pair of X beams 26 pass over the substrate stage gantry 18c.

  An X linear guide 31 a extending in the X-axis direction is fixed to the upper surface of the X beam 26. Further, X stators 33 a including a plurality of permanent magnets are fixed to both side surfaces of the X beam 26.

  The coarse movement stage 30 is mounted on the pair of X beams 26 and has a pair of X carriages 32 corresponding to the pair of X beams 26. As shown in FIG. 2, the X carriage 32 includes a ceiling surface portion 32a made of a plate-like member parallel to the XY plane extending in the X-axis direction and a pair of side plate surface portions 32b made of a plate-like member parallel to the XZ plane. Have. The dimension in the X-axis direction of the side plate surface portion 32b is set shorter than the ceiling surface portion 32a. In the X carriage 32, the vicinity of the upper end portion of one side plate surface portion 32b is the central portion of the side surface on the + Y side of the ceiling surface portion 32a, and the vicinity of the upper end portion of the other side plate surface portion 32b is the central portion of the side surface on the −Y side of the ceiling surface portion 32a. By being connected, the YZ cross-section is formed in an inverted U shape (see FIG. 3). A corresponding X beam 26 is inserted between the pair of side plate surface portions 32b.

  An X slide member 31b that is slidably engaged with the X linear guide 31a is fixed to the lower surface of the ceiling surface portion 32a of the X carriage 32 as shown in FIG. As a result, the X carriage 32 is guided in a straight line along the corresponding X beam 26 in the X-axis direction. An X mover 33b including a coil unit is fixed to the pair of side plate surface portions 32b of the X carriage 32 so as to face the X stator 33a. The pair of X carriages 32 are synchronously driven in the X-axis direction along the corresponding X beam 26 by an X linear motor including the X stator 33a and the X mover 33b.

  As shown in FIG. 2, the pair of X carriages 32 are connected to each other in the vicinity of the + X side and −X side end portions by a connecting plate 35a extending in the Y-axis direction. The pair of X carriages 32 are connected to each other by connecting plates 35c extending in the Y-axis direction via brackets 35b protruding from the inner side plate surface portions 32b (see FIG. 3). For example, two connection plates 35c are provided apart from each other in the X-axis direction. As a result, the pair of X carriages 32 moves integrally on the pair of X beams 26 in the X-axis direction. Further, as shown in FIG. 3, the coarse movement stage 30 is restricted in relative movement in the Y-axis direction with respect to the pair of X beams 26 by the action of the X linear guide device 31. Moves integrally in the Y-axis direction. That is, the pair of X beams 26 and the coarse movement stage 30 constitute a so-called gantry type biaxial stage device.

  Returning to FIG. 1, the fine movement stage 34 is formed of a rectangular parallelepiped member having a low height, and is disposed above the coarse movement stage 30. A substrate holder 40 is fixed on the upper surface of the fine movement stage 34. A Y bar mirror 38 y having a reflecting surface orthogonal to the Y axis is fixed to the side surface on the −Y side of fine movement stage 34 via mirror base 37. Further, as shown in FIG. 5A, an X bar mirror 38x having a reflecting surface orthogonal to the X axis is fixed to the side surface on the −X side of fine movement stage 34, as shown in FIG.

  As shown in FIG. 2, the fine movement stage 34 includes a plurality of fixed elements fixed to the coarse movement stage 30 and a movable element fixed to the fine movement stage 34 (not shown in FIG. 2; see FIG. 3). By a fine movement stage drive system including a voice coil motor, the coarse movement stage 30 is slightly driven in directions of three degrees of freedom (X-axis, Y-axis, and θz directions). The plurality of (eg, two) X voice coil motors 36x and the plurality (eg, two) Y voice coil motors 36y are included in the plurality of voice coil motors. The fine movement stage 34 is guided in a non-contact manner to the coarse movement stage 30 by the thrust (electromagnetic force) generated by the plurality of voice coil motors. Move with a predetermined stroke in the Y-axis direction. Further, the fine movement stage drive system has a plurality of Z voice coil motors 36z for finely driving the fine movement stage 34 in the three degrees of freedom in the θx, θy, and Z-axis directions. The plurality of Z voice coil motors 36z are arranged at locations corresponding to the four corners of fine movement stage 34, for example. The configuration of the fine movement stage drive system including a plurality of voice coil motors is disclosed in, for example, US Patent Application Publication No. 2010/0018950.

  The X position information of the fine movement stage 34 is obtained by an X bar mirror 38x (not shown in FIG. 2) by an X laser interferometer 39x attached to a substrate stage base 18c on the −X side via a member called an interferometer column 18e. (See FIG. 5A). Further, the Y position information of the fine movement stage 34 is obtained by using a Y bar mirror 38y by a Y laser interferometer 39y fixed to the apparatus main body 18, as shown in FIG. The X laser interferometer 39x and the Y laser interferometer 39y irradiate a corresponding bar mirror with a plurality of length measurement lights in a horizontal plane, and can obtain θz position information of the fine movement stage 34. ing. Further, the position information of the fine movement stage 34 in the Z-axis, θx, and θy directions is fixed to the weight cancellation device 50 by a plurality of Z sensors 39z attached to the lower surface of the fine movement stage 34, as shown in FIG. Obtained using the target 38z.

  The substrate holder 40 is made of a plate member having a rectangular shape in plan view parallel to the XY plane, and a plurality of small holes (not shown) for holding the substrate P by vacuum suction are formed on its upper surface. Further, as shown in FIG. 4, a plurality of (e.g., eight) X grooves 41 for accommodating a part of the substrate lift device 42 are formed on the upper surface of the substrate holder 40 at predetermined intervals in the Y axis direction. (The X groove 41 and the substrate lift device 42 are not shown in FIGS. 1 and 3). The dimensions of the substrate holder 40 in the X-axis and Y-axis directions are set to be substantially the same, and the length is set somewhat shorter than the dimension in the longitudinal direction of the substrate P. Further, a notch 43 is formed in each of the corners on the + Y side and + X side and the corners on the + Y side and −X side of the substrate holder 40 (the notch 43 on the −X side is shown in FIG. B)).

  The plurality of substrate lift devices 42 are devices for separating the substrate P placed on the upper surface (substrate placement surface) of the substrate holder 40 from the substrate placement surface. For example, eight substrate lift devices 42 are provided corresponding to the plurality of X grooves 41. As shown in FIG. 5 (A), the substrate lift device 42 is composed of a rod-like member extending in the X-axis direction. The base portion 42a accommodated in the X-groove 41 and the upper surface of the base portion 42a are arranged in the X-axis direction. Are provided with a plurality of (for example, six) air bearings 42b attached at predetermined intervals, a pair of Z actuators 42c for driving the base portion 42a in the Z-axis direction (up and down movement), and the like.

  Leg portions 42d extending in the Z-axis direction are fixed to the lower surface of the base portion 42a and in the vicinity of both ends in the longitudinal direction of the base portion 42a. A pair of through holes 41a penetrating the substrate holder 40 in the vertical direction is formed on the bottom surface defining the X groove 41, and leg portions 42d are inserted into the pair of through holes 41a. Between the wall surface defining the X groove 41 and the base portion 42a and between the wall surface defining the through hole 41a and the leg portion 42d, the fine movement stage 34 is respectively the coarse movement stage 30 (FIG. 5A and FIG. 5). 5 (B) schematically shows a gap that does not contact each other when driven slightly.

  The pair of Z actuators 42c is fixed to the upper surface of the coarse movement stage 30 and corresponding to each of the pair of leg portions 42d. An air cylinder or the like can be used as the Z actuator 42c. A stay 42e made of an L-shaped member is fixed near the Z actuator 42c on the upper surface of the coarse movement stage 30. The base portion 42a can move up and down with respect to the coarse movement stage 30 by the action of a Z linear guide device including a Z linear guide 42f fixed to the leg portion 42d and a Z slide member 42g attached to the stay 42e. It has become.

  The plurality of air bearings 42b are accommodated in the X groove 41 shown in FIG. 5A and driven away from the lower surface of the substrate P (hereinafter referred to as “the base portion 42a” is driven in the vertical direction by the Z actuator 42c). , Referred to as a storage position) and a position protruding from the upper surface of the substrate holder 40 shown in FIG. 5B toward the + Z side (hereinafter referred to as a protruding position). The plurality of air bearings 42b are configured to separate the substrate P from the upper surface of the substrate holder 40 at the protruding position shown in FIG. 5B and to generate a static pressure of pressurized gas (for example, air) ejected to the lower surface of the substrate P. Thus, the substrate P can be supported in a non-contact manner from below.

  As shown in FIG. 3, the weight canceling device 50 supports the fine movement stage 34 from below via a leveling device 54. The weight cancellation device 50 is inserted between the pair of X beams 26. The weight cancellation device 50 has an air spring (not shown) and the like, and cancels the weight of the system including the fine movement stage 34, the substrate holder 40, etc. by the upward force in the gravity direction (+ Z direction) generated by the air spring. Thus, the load on the plurality of Z voice coil motors 36z is reduced. An air bearing 52 is attached to the lower surface of the weight cancellation device 50. The weight canceling device 50 floats on the Y step guide 56 via a predetermined clearance by the static pressure of pressurized gas (for example, air) ejected from the air bearing 52 to the Y step guide 56.

  As shown in FIG. 2, the weight cancellation device 50 is mechanically connected to the coarse movement stage 30 via a plurality of flexure devices 51, and is integrated with the coarse movement stage 30 in the X-axis direction and / or Move in the Y-axis direction. The configuration of the weight canceling device 50 according to the present embodiment including the flexure device 51 is disclosed in, for example, US Patent Application Publication No. 2010/0018950. Returning to FIG. 3, the leveling device 54 includes a spherical bearing device (or a pseudo spherical bearing device as disclosed in, for example, US Patent Application Publication No. 2010/0018950), and moves the fine movement stage 34 in the θx and θy directions. It is supported from below so that it can swing (tilt) freely. The weight canceling device 50 supports the leveling device 54 in a non-contact manner from below via an air bearing (not shown) so that the weight canceling device 50 and the fine movement stage 34 can move relative to each other in a direction parallel to the horizontal plane. .

  As shown in FIG. 2, the Y step guide 56 is composed of a member having a rectangular YZ section extending in the X-axis direction, and is disposed between the pair of X beams 26 in a plan view. The Y step guide 56 is mounted on, for example, two substrate stage stands 18c, and the height position thereof is substantially the same as that of the base frame 22, as shown in FIG. Returning to FIG. 2, the dimension of the Y step guide 56 in the longitudinal direction is set to be slightly longer than the movement stroke of the fine movement stage 34 (not shown in FIG. 2, see FIG. 3) in the X-axis direction. The upper surface of the Y step guide 56 is finished with extremely high flatness. A plurality of Y slide members 19b slidably engaged with a Y linear guide 19a fixed to the upper surface of the substrate stage mount 18c are fixed to the lower surface of the Y step guide 56. It is guided straight in the Y-axis direction on 18c. Here, the Z position of the base frame 22 is on the + Z side with respect to the substrate stage frame 18c (see FIG. 3), whereas the Z position of the auxiliary base frame 24 is substantially the same as the Z position of the substrate stage frame 18c. (The height is lower than the base frame 22). The auxiliary carriage 29 passes below the Y step guide 56 and is not in contact with the Y step guide 56.

  A connecting member 56 a is fixed to each of the + X and −X ends of the Y step guide 56. The connection member 56 a is connected to the Y carriage 28 via a plurality of flexure devices 57. When the pair of X beams 26 moves in the Y-axis direction, the Y step guide 56 is pulled by the one X beam 26 via the flexure device 57, so that the Y step guide 56 is integrated with the pair of X beams 26 in the Y-axis direction. Moving. When the weight canceling device 50 moves in the X-axis direction integrally with the coarse movement stage 30, it moves on the Y step guide 56, whereas it moves in the Y-axis direction integrally with the coarse movement stage 30. In doing so, the pair of X beams 26 and the Y step guide 56 move together in the Y-axis direction so that they do not fall off the Y step guide 56.

  Returning to FIG. 3, the unloading device 60 unloads the substrate P placed on the substrate holder 40 to the outside of the substrate stage device 20 (in the present embodiment, a port unit 70 (see FIG. 7A) described later). As shown in FIG. 2, the apparatus is mounted on the base frame 22 on the + X side and the auxiliary base frame 24. As shown in FIGS. 6A and 6B, the carry-out device 60 includes a pair of Y linear actuator units 61a, a pair of Y slide members 61b, an X linear actuator unit 62a, an X slide member 62b, and an intermediate support member. 63, a rotation device 64, a tip support member 65, and a suction pad 66. 6A and 6B, illustrations of members other than the substrate holder 40 and the carry-out device 60 are omitted from the viewpoint of avoiding the complication of the drawings.

  As shown in FIG. 2, the pair of Y linear actuator units 61 a are each composed of a member extending in the Y-axis direction, one of which corresponds to the base frame 22 on the + X side, for example, the + Y side of two Y carriages 28 The other is fixed on the auxiliary carriage 29. As described above, since the auxiliary base frame 24 is lower in height than the base frame 22, the other Y linear actuator unit 61a is fixed on the auxiliary carriage 29 via a spacer (not shown).

  Here, as shown in FIG. 3, the Y carriage 28 includes a ceiling surface portion 28 a and a pair of side plate surface portions 28 b (one side plate surface portion 28 b is hidden behind the base frame 22 in the drawing). It consists of a member having an inverted U-shaped cross section. Since the Y carriage 28 on the + Y side is mounted with one Y linear actuator unit 61a, the length of the ceiling surface portion 28a is longer than that of the other Y carriage 28 (for convenience, the same reference numerals are used for all Y carriages 28). The Y slide member 21b is slidably engaged with the Y linear guide 21a fixed to the base frame 22 on the lower surface of the ceiling surface portion 28a.

  As shown in FIG. 2, an extension base frame 25 is connected to the + Y side ends of the + X side base frame 22 and the auxiliary base frame 24 (see FIG. 1), and the Y linear guide 21a is extended to the + Y side as compared with the Y linear guide 21a fixed to the base frame 22 on the -X side. Thus, when the pair of X beams 26 are positioned at the stroke end on the + Y side, the pair of Y linear actuator units 61a can be retracted onto the extension base frame 25.

  Returning to FIG. 6B, the pair of Y slide members 61b is provided corresponding to each of the pair of Y linear actuator units 61a, and is synchronized with the Y axis direction along the corresponding Y linear actuator units 61a with a predetermined stroke. Driven.

  The X linear actuator unit 62a is composed of a member extending in the X axis direction. The pair of Y slide members 61b are fixed to the lower surface of the X linear actuator unit 62a, and the X linear actuator unit 62a is driven by the pair of Y linear actuator units 61a with a predetermined stroke in the Y-axis direction. The X slide member 62b is driven with a predetermined stroke in the X axis direction along the X linear actuator unit 62a. The types of the linear actuator for driving the Y slide member 61b included in the Y linear actuator unit 61a and the linear actuator for driving the X slide member 62b included in the X linear actuator unit 62a are not particularly limited. For example, a linear motor or a feed screw device can be used. The Y position information of the Y slide member 61b is obtained by a Y linear encoder system (not shown), and the X position information of the X slide member 62b is obtained by an X linear encoder system (not shown).

  As shown in FIG. 6A, the intermediate support member 63 is made of a member having an I-shaped cross section extending in the Z-axis direction, and the X slide member 62b is fixed to the lower end portion. The rotation device 64 is fixed to the upper end portion of the intermediate support member 63 and has a rotation motor (not shown) including a rotor that can rotate in the θz direction. The tip support member 65 is a plate member having an L-shaped cross section, and is rotated by a predetermined angle (in this embodiment, for example, at least 90 °) at a low speed in the θz direction by the rotating device 64.

  The suction pad 66 is made of a plate-like member having a rectangular shape in plan view parallel to the XY plane, and the vicinity of one end in the longitudinal direction is fixed near the end on the + Z side of the tip support member 65. As a result, the suction pad 66 protrudes from the tip support member 65 toward the substrate holder 40 side, and can be moved with a predetermined stroke in the X-axis and / or Y-axis directions, and rotated at least 90 ° in the θz direction. It is possible. The amount of rotation of the rotor of the rotating device 64 is measured with high resolution by a rotary encoder system (not shown). Hereinafter, the intermediate support member 63, the rotation device 64, the tip support member 65, and the suction pad 66 will be collectively referred to as a substrate suction hand 68.

  A vacuum suction force is supplied to the suction pad 66 from the outside of the substrate stage apparatus 20 through a piping member 67 including a hose and a joint. In addition, the suction pad 66 is provided with a step in the region on the other end side on the upper surface (thinner thickness is reduced) and a suction hole. The suction pad 66 has a lower surface positioned above the upper surface of the substrate holder 40 (since the Z position of the substrate holder 40 changes in a minute range, for example, the substrate holder 40 is positioned at a neutral position in the Z-axis direction). The Z position is set to be higher than the Z position on the upper surface of the substrate holder 40 in the state, and when the substrate is unloaded, it is inserted between the lower surface of the substrate P and the upper surface of the substrate holder 40, and Adsorb and hold the lower surface.

  In the present embodiment, the dimension of the X linear actuator unit 62a in the X axis direction, that is, the movable distance of the suction pad 66 in the X axis direction is formed to be somewhat longer than the dimension of the substrate holder 40 in the X axis direction. The Y-axis direction dimension of the Y linear actuator unit 61a, that is, the movable distance of the suction pad 66 in the Y-axis direction is half of the difference between the diagonal length of the substrate P and the short-side length of the substrate P in the Y-axis direction. Is set to about. Specifically, for example, when the dimension of the substrate P in the X-axis direction is 2500 mm and the dimension in the Y-axis direction is 2200 mm, the movable distance of the suction pad 66 in the X-axis direction is, for example, about 2600 mm. The possible distance is, for example, about 565 mm.

  As shown in FIG. 7A, the port unit 70 includes a carry-in device 71 for carrying the substrate P, which is carried from an external device (for example, a coater / developer device) by the external transfer robot 99, toward the substrate stage device 20. And a guide device 76 for receiving the exposed substrate (not shown in FIG. 7A) from the substrate stage device 20. The carry-in device 71 has a carry-in hand 72 formed in the same shape as the fork hand 98 included in the external transfer robot 99, and the carry-in hand 72 is separated from the region above the guide device 76 by a pair of X drive devices 73. The substrate can be moved along a horizontal plane between the region above the substrate holder 40 located at the substrate replacement position. The guide device 76 includes a plurality of air levitation devices 77, and the plurality of air levitation devices 77 can be used to support the substrate P from below and to hold it by suction. The plurality of air levitation devices 77 are configured to be movable up and down, and can pass between the notches of the fork hand 98 and the carry-in hand 72. Furthermore, the guide device 76 can also move in the X-axis direction, and can approach and separate from the substrate holder 40 located at the substrate replacement position.

  In the port portion 70, the substrate P is transported by the fork hand 98 above the carry-in hand 72 positioned above the guide device 76 (in this state, the fork hand 98 and the carry-in hand 72 overlap in the vertical direction). The plurality of air levitation devices 77 are driven up. Thereby, the board | substrate P leaves | separates from the fork hand 98, and the fork hand 98 retracts | saves from the upper direction of the guide apparatus 76 (and carrying-in hand 72) after that. Then, the plurality of air levitation devices 77 are driven downward, so that the substrate P is delivered to the carry-in hand 72. The carry-in hand 72 carries the substrate P above the substrate holder 40 as shown in FIG. In the substrate holder 40, as shown in FIG. 5 (B), the base portions 42a of the plurality of substrate lift devices 42 are driven upward (however, + Z side more than FIG. 5 (B)), and the loading hand 72 is cut off. Pass through the gap. As a result, the substrate P is separated from the carry-in hand 72 (not shown in FIG. 5B, see FIG. 7B). Then, after the carry-in hand 72 is retracted from above the substrate holder 40, the base portion 42 a is driven downward to place the substrate P on the upper surface of the substrate holder 40.

  In the liquid crystal exposure apparatus 10 (see FIG. 1) configured as described above, the mask M is loaded onto the mask stage 14 by a mask loader (not shown) under the control of a main controller (not shown). At the same time, the loading device 71 loads the substrate P onto the substrate holder 40. Thereafter, alignment measurement is performed by the main controller using an alignment detection system (not shown), and after completion of the alignment measurement, a plurality of shot areas set on the substrate P are sequentially exposed in a step-and-scan manner. Operation is performed. Since this exposure operation is the same as a conventional step-and-scan exposure operation, a detailed description thereof will be omitted. Then, the substrate P for which the exposure processing has been completed is carried out from the substrate holder 40 to the port unit 70 by the carry-out device 60, and another substrate P to be exposed next is carried to the substrate holder 40, whereby the substrate holder The substrate P on the substrate 40 is exchanged, and the exposure operation and the like are continuously performed on the plurality of substrates P.

  Hereinafter, the carrying-out operation of the substrate P using the carry-out device 60 included in the substrate stage device 20 will be described. As shown in FIG. 8A, the substrate P is unloaded from the substrate stage apparatus 20 with the substrate holder 40 positioned at the substrate replacement position. At the substrate replacement position, the substrate holder 40 is disposed on the −X side of the guide device 76 of the port unit 70.

  When carrying out the substrate P, the substrate holder 40 releases the suction holding of the substrate P, and as shown in FIG. 5B, the base portions 42a of the plurality of substrate lift devices 42 are driven up. . As a result, the substrate P is separated from the upper surface of the substrate holder 40. At this time, the Z position of the upper surface of the air bearing 42b of the substrate lift device 42 and the Z position of the air levitation device 77 (not shown in FIG. 5B, see FIG. 8A) of the guide device 76 are substantially the same. It is the same. The guide device 76 is positioned at a position approaching the substrate holder 40. Next, as shown in FIG. 8B, the suction pad 66 is inserted between the substrate P and the substrate holder 40. At this time, the X position of the suction pad 66 is positioned at a position where the vicinity of the corner on the + Y side and the −X side of the substrate P can be sucked and held. Thereafter, the substrate P is driven slightly downward, and the substrate P is sucked and held by the suction pad 66.

  Thereafter, as shown in FIG. 8C, the suction pad 66 is driven in the + X direction, whereby the substrate P moves in the + X direction. At this time, pressurized air is ejected from the air bearing 42b and the air levitation device 77 to the lower surface of the substrate P, respectively. As a result, the substrate P is transferred from the substrate holder 40 to the guide device 76 in a state where the substrate P floats on the air bearing 42 b and the air levitation device 77. Thereafter, the suction holding of the substrate P by the suction pad 66 is released, and the guide device 76 sucks and holds the substrate P and moves in the + X direction (a direction away from the substrate holder 40). Thereby, the board | substrate P is carried out from the board | substrate holder 40 at high speed and low dust generation.

  Here, the substrate stage device 20 (see FIG. 3) of the present embodiment uses the carry-out device 60 to place the substrate P placed on the substrate holder 40 in the θz direction on the substrate holder 40, for example, 90 °. It can be rotated. Hereinafter, an example of the rotation operation of the substrate P using the carry-out device 60 will be described with reference to FIGS. 9 (A) to 9 (C).

  As shown in FIG. 9A, the rotation operation of the substrate P is similar to the carry-out operation of the substrate P, and the suction pad 66 is moved between the substrate P and the substrate holder 40 in a state where the substrate P is separated from the substrate holder 40. The suction pad 66 is sucked and held near the corners of the substrate P on the + Y side and the −X side. Hereinafter, the position of the substrate P shown in FIG. 9A is referred to as an initial position. The longitudinal direction of the substrate P at the initial position is parallel to the X axis. At this time, as shown in FIG. 6A, a wide clearance is formed between the tip support member 65 and the substrate holder 40. This is to prevent the + Y side corner of the substrate holder 40 and the tip support member 65 from contacting each other when the substrate P is rotated on the substrate holder 40 around the center of the substrate P as a rotation center. Further, the notch 43 formed in the substrate holder 40 is for preventing the corner portion of the substrate holder 40 from contacting the tip support member 65 of the carry-out device when the substrate P is rotated. If the rotation center of the substrate P does not need to be the center of the substrate (if there is no obstacle in the rotation range of the substrate P, or the air bearing 42b that supports the substrate P (not shown in FIG. 6A)). (See FIG. 5A)), the clearance may be narrow or the notch 43 may not be formed.

  Next, as shown in FIG. 9B, the X linear actuator unit 62a is driven in the + Y direction (a direction away from the substrate holder 40), and the suction pad 66 is driven in the + X direction. In addition, the suction pad 66 is driven to rotate clockwise (clockwise) in plan view. As a result, the substrate P rotates clockwise with respect to the substrate holder 40. The rotation center of the substrate P substantially coincides with the center of the substrate P. At this time, pressurized gas is ejected from the plurality of air bearings 42b to the lower surface of the substrate P, and the substrate P is supported in a non-contact manner from below.

  As shown in FIG. 9B, when the substrate P is rotated from the initial position by about 45 °, for example, as shown in FIG. 9C, the X linear actuator unit 62a is moved in the −Y direction (to the substrate holder 40). Driven in the approaching direction). At the same time, the suction pad 66 is continuously driven in the + X direction and is rotated clockwise in a plan view (clockwise direction). As a result, the substrate P is rotated, for example, by 90 ° from the initial position, and the longitudinal direction of the substrate P becomes parallel to the Y axis. The final positioning of the substrate P on the substrate holder 40 may use positioning pins (not shown) provided on the substrate holder 40.

  Hereinafter, although not shown, the suction holding of the substrate P by the suction pad 66 is released, the substrate P is lifted by a small amount, the suction pad 66 is driven in the + Y direction, the substrate P is lowered, and the substrate by the substrate holder 40 The adsorption of P is sequentially performed. As shown in FIG. 9B, among the most + Y side substrate lift devices 42, the two air bearings 42b on the most + X side and −X side are provided with suction pads 66 when the substrate P is rotated. The length is shorter than other air bearings so as not to contact the air bearing.

  The rotation operation of the substrate P described above can be performed immediately after the substrate P is carried in, or can be performed immediately before the substrate P is carried out. Moreover, when performing the said rotation operation | movement, the board | substrate holder 40 does not need to be located in a board | substrate exchange position. Therefore, the substrate P may be rotated after the exposure process for a part of the plurality of shot areas set on the substrate P is completed, and the exposure process may be subsequently performed on the unexposed area of the substrate P after the rotation. In this case, when the shape of the shot region (mask pattern) is a rectangle, a vertically long shot region and a horizontally long shot region can be mixed on the substrate P. Further, by controlling the carry-out device 60 in a procedure reverse to the procedure shown in FIGS. 9A to 9C, the substrate P is driven to rotate counterclockwise (counterclockwise direction) in plan view. Then, the substrate P rotated by 90 °, for example, from the initial position can be returned to the initial position shown in FIG. 9A again. Further, after performing the control shown in FIGS. 9A to 9C, only the suction pad 66 is moved to the position shown in FIG. 9A (in the vicinity of the corner on the + Y side and the −X side of the substrate P). 9A to 9C, and the control shown in FIGS. 9A to 9C is performed again to rotate the substrate P by, for example, 180 ° and to repeat the control. 270 ° (or 360 °) can also be rotated.

  In the carry-out device 60, when the substrate stage 40 is moved in the X-axis direction during the operation of the substrate stage device 20 excluding the time when the substrate P is carried out and when the substrate P is rotated (for example, during the exposure operation). The substrate suction hand 68 (see FIG. 6A) is preferably retracted near the + Y side stroke end. Further, when the substrate holder 40 approaches the vicinity of the + Y side stroke end in the Y-axis direction, the substrate suction hand 68 may be placed in a standby state near the −Y side stroke end and near the + X side stroke end. Thereby, it is possible to prevent the substrate suction hand 68 from interfering with the + Y side column 18b (see FIG. 2) and to prevent the X linear actuator unit 61a from interfering with the side column 18b. The substrate suction hand 68 may be always retracted near the −Y side stroke end and near the + X side stroke end except when the substrate is unloaded and rotated.

  According to the present embodiment described above, the substrate P can be rotated at an arbitrary angle on the substrate holder 40 (the direction of the substrate P can be changed), so that, for example, a plurality of shots can be efficiently performed on one substrate P. Regions can be placed. Further, since the unloading device 60 for unloading the substrate P from the substrate stage device 20 is used as the device for rotating the substrate P, the device is simpler and less expensive than the case where a separate rotating device is provided. Further, since the substrate P is supported in a non-contact manner from below by the substrate lift device 42, the substrate P can be rotated at high speed and with low dust generation.

  In addition, the structure of the said embodiment can be changed suitably. For example, in the above embodiment, as shown in FIG. 3 and the like, the substrate stage apparatus 20 includes the unloading device 60 for unloading the substrate P from the substrate holder 40 and rotating the substrate P on the substrate holder 40. The Y-axis direction can be moved integrally with the substrate holder 40, but is not limited to this as long as it can be disposed at a position that does not interfere with the substrate stage apparatus 20, for example, FIG. As shown in FIG. 10B (hereinafter referred to as a first modification), the carry-out device 60 may be installed on the floor 11 via a table-like mount 69. The gantry 69 can suck and hold the vicinity of the + Y side and −X side corners of the substrate P in a state where the substrate holder 40 is positioned at the substrate replacement position (see FIG. 8A) for unloading the substrate P. It is installed in a proper position. In this case, since the carry-out device 60 is separated from the substrate stage device 120, the substrate stage device 120 is reduced in weight and the position controllability is improved.

  In the above embodiment, as shown in FIG. 3, the suction pad 66 of the carry-out device 60 is provided outside the substrate holder 40. However, the present invention is not limited to this, and as shown in FIG. A suction pad 266 that holds the substrate P by suction and rotates it on the substrate holder 240 may be provided inside the substrate holder 240 (hereinafter referred to as a second modification). The suction pad 266 has a cross-shaped suction surface in plan view, and is accommodated in a recess 44 formed in a shape corresponding to the suction pad 266 at the center of the substrate holder 240. As shown in FIG. 11B, the substrate holder 240 has a built-in Z / θz actuator 265 for driving the suction pad 266 in the vertical (Z-axis) direction and the θz direction. The suction pad 266 is accommodated in the substrate holder 240 and is movable between a position separated from the lower surface of the substrate P and a position protruding from the upper surface of the substrate holder 240 to the + Z side. The suction pad 266 sucks and holds the lower surface of the substrate P in a state where the substrate P is supported in a non-contact manner from below by a plurality of air bearings 42b. In the substrate stage device 220, the substrate P is rotated on the substrate holder 240 by the suction pad 266 being rotated in the θz direction, for example, 90 ° in that state. According to the substrate stage device 220, the configuration of the driving device for rotating the substrate P is simple and efficient (however, the substrate carry-out device needs to be provided separately).

  In the above-described embodiment (hereinafter, including modifications as appropriate), the substrate P is floated on the substrate holder 40 using the plurality of air bearings 42b accommodated in the substrate holder 40. However, the present invention is not limited to this. For example, the substrate P may be floated on the substrate holder 40 by ejecting pressurized gas from the upper surface of the substrate holder 40 toward the lower surface of the substrate P. In this case, a plurality of air bearings 42b are not necessary. (For the vertical movement of the substrate P, lift pins or the like may be used). In this case, the hole for ejecting the pressurized gas may be a vacuum hole for adsorbing and holding the substrate P. Further, when the substrate P is rotated with respect to the substrate holder 40, the substrate P and the substrate holder 40 may be in physical contact. For example, a plurality of balls are provided on the substrate holder 40, and the plurality of balls are used. The substrate P may be supported from below. Further, for example, if the influence of dust generation due to friction between the substrate P and the substrate holder 40 is small enough to be ignored, the substrate P is placed against the substrate holder 40 in a state where the substrate P and the substrate holder 40 are in contact with each other. It may be rotated.

  In the above embodiment, the carry-out device 60 is mounted on the base frame 22 and the auxiliary base frame 24, but is not limited thereto, and is attached to, for example, the coarse movement stage 30 or the fine movement stage 34 (including the substrate holder 40). May be. In this case, since the carry-out device 60 moves in the X axis direction together with the substrate holder 40, the substrate P can be rotated at an arbitrary position.

  Further, since the substrate P is not rotated during exposure (scanning operation) (the exposure accuracy is not affected), the carry-out device 60 may be mounted on the substrate stage mount 18c (see FIG. 1). Further, the carry-out device 60 may be hung from the ceiling. In the second modification, the suction pad 266 may be movable in the X-axis direction within the substrate holder 240, or may be used as a substrate carry-out device.

The illumination light may be ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm). As the illumination light, for example, a single wavelength laser beam oscillated from a DFB semiconductor laser or a fiber laser is amplified by a fiber amplifier doped with, for example, erbium (or both erbium and ytterbium). In addition, harmonics converted into ultraviolet light using a nonlinear optical crystal may be used. A solid laser (wavelength: 355 nm, 266 nm) or the like may be used.

  The projection optical system 16 is a multi-lens projection optical system including a plurality of projection optical units. However, the number of the projection optical units is not limited to this, and may be one or more. The projection optical system is not limited to a multi-lens type projection optical system, and may be a projection optical system using an Offner type large mirror, for example. In the above embodiment, the case where the projection optical system 16 has a projection magnification of the same magnification has been described. However, the present invention is not limited to this, and the projection optical system may be either a reduction system or an enlargement system.

  A light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting mask substrate is used. For example, it is disclosed in US Pat. No. 6,778,257. As described above, based on electronic data of a pattern to be exposed, an electronic mask (variable shaping mask) for forming a transmission pattern, a reflection pattern, or a light emission pattern, for example, a non-light-emitting image display element (spatial light modulator) A variable molding mask using DMD (Digital Micro-mirror Device), which is a kind of the same, may also be used.

  In addition, the moving body device (stage device) that moves the object along a predetermined two-dimensional plane is not limited to the exposure device, and an object that performs predetermined processing on the object, such as an object inspection device used for inspection of the object, for example. You may use for a treatment apparatus. The exposure apparatus can also be applied to a step-and-repeat type exposure apparatus and a step-and-stitch type exposure apparatus.

  As an exposure apparatus, an exposure apparatus that exposes a substrate having a size (including at least one of an outer diameter, a diagonal length, and one side) of 500 mm or more, for example, a large substrate for a flat panel display such as a liquid crystal display element. It is particularly effective to apply to this.

  Further, the use of the exposure apparatus is not limited to a liquid crystal exposure apparatus that transfers a liquid crystal display element pattern onto a square glass plate. For example, an exposure apparatus for semiconductor manufacturing, a thin film magnetic head, a micromachine, and a DNA chip The present invention can also be widely applied to an exposure apparatus for manufacturing the above. Moreover, in order to manufacture not only microdevices such as semiconductor elements but also masks or reticles used in light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc., glass substrates, silicon wafers, etc. The present invention can also be applied to an exposure apparatus that transfers a circuit pattern. The object to be exposed is not limited to the glass plate, and may be another object such as a wafer, a ceramic substrate, a film member, or mask blanks. Moreover, when the exposure target is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and includes, for example, a film-like (flexible sheet-like member).

  For electronic devices such as liquid crystal display elements (or semiconductor elements), the step of designing the function and performance of the device, the step of producing a mask (or reticle) based on this design step, and the step of producing a glass substrate (or wafer) A lithography step for transferring a mask (reticle) pattern to a glass substrate by the exposure apparatus and the exposure method of each embodiment described above, a development step for developing the exposed glass substrate, and a portion where the resist remains. It is manufactured through an etching step for removing the exposed member of the portion by etching, a resist removing step for removing a resist that has become unnecessary after etching, a device assembly step, an inspection step, and the like. In this case, in the lithography step, the above-described exposure method is executed using the exposure apparatus of the above embodiment, and a device pattern is formed on the glass substrate. Therefore, a highly integrated device can be manufactured with high productivity. .

  As described above, the object driving system and the object driving method of the present invention are suitable for rotating an object on the object holding device. The exposure apparatus of the present invention is suitable for forming a predetermined pattern on an object. Moreover, the manufacturing method of the flat panel display of this invention is suitable for manufacture of a flat panel display. The device manufacturing method of the present invention is suitable for the production of micro devices.

  DESCRIPTION OF SYMBOLS 10 ... Liquid crystal exposure apparatus, 20 ... Substrate stage apparatus, 40 ... Substrate holder, 42 ... Substrate lift apparatus, 60 ... Unloading apparatus, 66 ... Adsorption pad, P ... Substrate.

Claims (22)

An object holding device having an object placement surface parallel to a predetermined two-dimensional plane and including an object holding member capable of holding an object placed on the object placement surface;
An object driving system comprising: a driving system configured to rotate the object with respect to the object holding member by a predetermined angle along a guide surface defined by a guide member included in the object holding device.   The object drive system according to claim 1, wherein the drive system rotates the object at least 90 ° in a direction around an axis orthogonal to the guide surface.   The object driving system according to claim 1, wherein the object holding device is a movable body that can move a position along a direction parallel to the two-dimensional plane. The guide member is provided movably between a position accommodated in the object holding member and a position protruding from the object placement surface,
The object drive system according to any one of claims 1 to 3, wherein the drive system rotates the object along the guide surface defined by the guide member protruding from the object placement surface.   The object drive system according to any one of claims 1 to 3, wherein the drive system rotates the object using the object holding member as the guide member and the object placement surface as the guide surface. The drive system has a holding device that holds the object,
The object driving system according to claim 1, wherein the holding device is disposed outside the object holding member and holds an end portion of the object. The drive system further includes a drive device that drives the holding device along a direction parallel to the two-dimensional plane and a direction around an axis orthogonal to the two-dimensional plane,
The object driving system according to claim 6, wherein the driving device is provided in the object holding device. The drive system further includes a drive device that drives the holding device along a direction parallel to the two-dimensional plane and a direction around an axis orthogonal to the two-dimensional plane,
The object driving system according to claim 6, wherein the driving device is provided separately from the object holding device.   The object drive system according to claim 7 or 8, wherein the drive system carries the object out of the object holding device by driving the holding device holding the object using the drive device. The drive system has a holding device that holds the object and is rotatable about an axis orthogonal to the two-dimensional plane;
The object drive system according to claim 1, wherein the holding device is provided in the object holding member.   The object driving system according to claim 1, wherein the object holding member is capable of sucking and holding the object on the object placement surface.   The object driving system according to any one of claims 1 to 11, wherein the object holding device can float the object from the object placement surface.   The object driving system according to claim 12, wherein the object holding device causes the object to float from the object placement surface by ejecting a pressurized gas from the guide member to the object. The object driving system according to any one of claims 1 to 13,
An exposure apparatus comprising: a pattern forming apparatus that forms a predetermined pattern on the object held by the object holding apparatus using an energy beam.   The exposure apparatus according to claim 14, wherein the object is a substrate used in a flat panel display device.   The exposure apparatus according to claim 15, wherein the substrate has a length of at least one side or a diagonal length of 500 mm or more. Exposing the object using the exposure apparatus according to claim 15 or 16,
Developing the exposed object. A method of manufacturing a flat panel display. Exposing the object using the exposure apparatus of claim 14;
Developing the exposed object. Holding an object placed on an object holding member of the object holding device by a predetermined holding device;
A method of driving an object, comprising: driving the holding device to rotate the object by a predetermined angle with respect to the object holding member along a guide surface defined by a guide member included in the object holding device.   The object driving method according to claim 19, wherein the rotating causes the object to rotate at least 90 ° in a direction around an axis orthogonal to the guide surface.   21. The object driving method according to claim 19, wherein the rotating causes the object to float on the object holding member.   The method for driving an object according to any one of claims 19 to 21, further comprising carrying the object out of the object holding device by driving the holding device.

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