JP2013221961A - Exposure method, manufacturing method of flat panel display, device manufacturing method and exposure device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve a compact exposure device.SOLUTION: An exposure operation includes: transferring a mask pattern to regions (first and second shot regions SA1 and SA2) of a part of a substrate P through use of an energy beam; rotating the substrate P around a Z axis; and transferring the mask pattern to a remaining region (a third shot region SA3) of the substrate P through the use of the energy beam. Accordingly, an X step operation of the substrate P is not required, and a stroke in an X axis direction of the substrate P is made short and thus, a substrate stage can be made compact.

Description

  The present invention relates to an exposure method, a flat panel display manufacturing method, a device manufacturing method, and an exposure apparatus. More specifically, the exposure method and exposure apparatus for forming a predetermined pattern on an object using an energy beam, The present invention relates to a flat panel display manufacturing method and a device manufacturing method using an exposure method.

  Conventionally, in a lithography process for manufacturing an electronic device such as a liquid crystal display element or a semiconductor element, an exposure apparatus that transfers a pattern formed on a mask (or reticle) onto a glass substrate (or wafer) using an energy beam is used. ing.

  As this type of exposure apparatus, an exposure apparatus that includes a substrate stage that holds a glass substrate and guides the glass substrate along a horizontal plane with a predetermined long stroke is known (for example, see Patent Document 1).

  Here, with the recent increase in size of the substrate, the substrate stage also tends to increase in size. For this reason, development of a miniaturized substrate stage has been desired.

US Patent Application Publication No. 2010/0018950

  The present invention has been made under the above circumstances. From a first viewpoint, a predetermined pattern is formed using an energy beam on a first region of an object placed on an object holding member. Rotating the object about an axis that intersects the surface of the object, and applying the predetermined pattern using an energy beam to a second region different from the first region of the object. Forming an exposure method.

  According to this, the step operation of the object can be omitted by rotating the object. Therefore, the moving stroke in the step direction of the object holding member can be shortened, and the exposure apparatus can be downsized.

  According to a second aspect of the present invention, there is provided a flat panel display manufacturing method comprising: exposing the object by the exposure method according to the first aspect of the present invention; and developing the exposed object. It is.

  From a third aspect, the present invention is a device manufacturing method including exposing the object by the exposure method according to the first aspect of the present invention and developing the object.

  According to a fourth aspect of the present invention, there is provided an object holding member on which an object is placed, a rotary drive device that rotates the object around an axis that intersects the surface of the object, and the object holding member placed on the object holding member. A predetermined pattern is formed on the first region of the object using an energy beam, the object is rotated using the rotation driving device, and the object placed on the object holding member is rotated. An exposure apparatus comprising: an exposure control system that forms a predetermined pattern using an energy beam with respect to a second region different from the first region.

  According to this, the step operation of the object can be omitted by rotating the object. Therefore, the moving stroke in the step direction of the object holding member can be shortened, and the exposure apparatus can be downsized.

It is a figure which shows schematically the structure of the liquid-crystal exposure apparatus which concerns on 1st Embodiment. It is a top view of the substrate holder which the liquid-crystal exposure apparatus of FIG. 1 has. 3A is a cross-sectional view taken along line AA in FIG. 2, and FIG. 3B is a diagram illustrating a state in which a plurality of air bearings are driven up from the state illustrated in FIG. 3A. (C) is the BB sectional view taken on the line of FIG. FIG. 4A and FIG. 4B are diagrams for explaining the operation when the substrate rotates on the substrate holder. FIGS. 5A to 5C are views (No. 1 to No. 3) for explaining the exposure operation of the substrate according to the first embodiment. FIGS. 6A to 6C are views (No. 4 to No. 6) for explaining the exposure operation of the substrate according to the first embodiment. FIGS. 7A and 7B are views (No. 7 and No. 8) for explaining the exposure operation of the substrate according to the first embodiment. FIG. 8A is a cross-sectional view showing the substrate stage according to the second embodiment, and FIG. 8B is a plan view of the substrate stage shown in FIG. 8A. FIGS. 9A and 9B are views (No. 1 and No. 2) for explaining the exposure operation of the substrate according to the second embodiment. FIGS. 10A to 10C are views (No. 3 to No. 5) for explaining the exposure operation of the substrate according to the second embodiment. FIGS. 11A and 11B are views (No. 6 and No. 7) for explaining the exposure operation of the substrate according to the second embodiment. FIGS. 12A and 12B are views (No. 8 and No. 9) for explaining the exposure operation of the substrate according to the second embodiment. FIGS. 13A and 13B are views (No. 10 and No. 11) for explaining the exposure operation of the substrate according to the second embodiment. FIGS. 14A to 14C are views (No. 1 to No. 3) for explaining the exposure operation of the substrate according to the third embodiment. FIGS. 15A to 15C are views (No. 4 to No. 6) for explaining the exposure operation of the substrate according to the third embodiment. FIGS. 16A and 16B are views (No. 7 and No. 8) for explaining the exposure operation of the substrate according to the third embodiment. It is a top view of the substrate stage which concerns on a modification.

<< First Embodiment >>
The first embodiment will be described below with reference to FIGS. 1 to 7B.

  FIG. 1 schematically shows the configuration of a liquid crystal exposure apparatus 10 according to the first embodiment. The liquid crystal exposure apparatus 10 employs a step-and-scan method in which a rectangular (square) glass substrate P (hereinafter simply referred to as a substrate P) used in, for example, a liquid crystal display device (flat panel display) is an exposure object. A projection exposure apparatus, a so-called scanner.

  The liquid crystal exposure apparatus 10 includes an illumination system 12, a mask stage 14 that holds a mask M on which a circuit pattern (mask pattern) is formed, a projection optical system 16, an apparatus body 18, and a surface (a surface facing the + Z side in FIG. 1). A substrate stage 20 for holding a substrate P coated with a resist (sensitive agent) and a control system thereof. Hereinafter, the direction in which the mask M and the substrate P are relatively scanned with respect to the projection optical system 16 at the time of exposure is defined as the X-axis direction, and the direction orthogonal to the X-axis in the horizontal plane is defined as the Y-axis direction, the X-axis, and the Y-axis. The description will be made assuming that the orthogonal direction is the Z-axis direction, and the rotation directions around the X-axis, Y-axis, and Z-axis are the θx, θy, and θz directions, respectively.

  The illumination system 12 is configured similarly to the illumination system disclosed in, for example, US Pat. No. 5,729,331. The illumination system 12 irradiates the mask M with illumination light IL for exposure. As the illumination light IL, for example, light such as i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm), or the combined light of the i-line, g-line, and h-line is used.

  The mask stage 14 holds the mask M by, for example, vacuum suction. The mask stage 14 is driven with a predetermined long stroke in the scanning direction (X-axis direction) by a mask stage driving system (not shown) including a linear motor, for example, and is also slightly driven in the Y-axis direction and the θz direction as appropriate. . Position information of the mask stage 14 in the XY plane (including rotation amount information in the θz direction) is obtained by a mask interferometer system including a laser interferometer (not shown).

  The projection optical system 16 is disposed below the mask stage 14. The projection optical system 16 is a so-called multi-lens projection optical system having the same configuration as the projection optical system disclosed in, for example, US Pat. No. 6,552,775, and is a double-sided telecentric equal magnification system. A plurality of projection optical systems for forming a vertical image are provided.

  In the liquid crystal exposure apparatus 10, when the illumination area on the mask M is illuminated by the illumination light IL from the illumination system 12, the illumination light that has passed through the mask M causes the mask M in the illumination area to pass through the projection optical system 16. A projection image (partial upright image) of the circuit pattern is formed in the illumination light irradiation area (exposure area IA) conjugate to the illumination area on the substrate P. The mask M moves relative to the illumination area (illumination light IL) in the scanning direction, and the substrate P moves relative to the exposure area IA (illumination light IL) in the scanning direction. One shot area is scanned and exposed, and the pattern formed on the mask M is transferred to the shot area.

  The apparatus main body 18 supports the mask stage 14 and the projection optical system 16 and is installed on the floor 11 of the clean room via a plurality of vibration isolation devices 19. The apparatus main body 18 is configured in the same manner as the apparatus main body disclosed in, for example, US Patent Application Publication No. 2008/0030702, and has an upper frame part 18a, a lower frame part 18b, and a pair of middle frame parts 18c. doing.

  The substrate stage 20 is a device that drives the substrate P along the horizontal plane with a predetermined long stroke in the X-axis and / or Y-axis direction, and includes an X coarse movement stage 22, a Y coarse movement stage 24, a weight cancellation device 26, A fine movement stage 28, a substrate holder 30, and a plurality of substrate lift devices 32 (not shown in FIG. 1, refer to FIG. 2, etc.) are provided.

  The X coarse movement stage 22 is disposed on a pair of base frames 21 which are installed on the floor 11 in a non-contact state with respect to the apparatus main body 18, for example, as disclosed in US Pat. No. 6,761,482. It is mounted via a mechanical X linear guide device 23x and is driven with a predetermined long stroke in the X-axis direction by an X linear actuator (not shown) (for example, a linear motor, a ball screw device, etc.). The Y coarse movement stage 24 is mounted on the X coarse movement stage 22 via a mechanical Y linear guide device 23y as disclosed in US Pat. No. 6,761,482, for example. It is driven with a predetermined long stroke in the Y-axis direction on the X coarse movement stage 22 by the illustrated Y linear actuator (for example, a linear motor, a ball screw device, etc.). The Y coarse movement stage 24 is moved in the X-axis direction integrally with the X coarse movement stage 22 by the action of the Y linear guide device 23y. That is, the X coarse movement stage 22 and the Y coarse movement stage 24 constitute a so-called gantry type biaxial stage device.

  The weight canceling device 26 is composed of one columnar member extending in the Z-axis direction, and supports the central portion of the fine movement stage 28 from below without contact. The weight canceling device 26 is inserted into an opening (not shown) formed at the center of each of the X coarse moving stage 22 and the Y coarse moving stage 24, and is on the surface plate 25 fixed to the lower base 18b. It floats through an air bearing (not shown). The weight cancellation device 26 is connected to the Y coarse movement stage 24 via a connection device (not shown), and is integrated with the Y coarse movement stage 24 in a predetermined length in the X axis direction and / or the Y axis direction. Move with a stroke. The structure of the weight cancellation device 26 including a coupling device (not shown) is disclosed in, for example, US Patent Application Publication No. 2010/0018950.

  Fine movement stage 28 is formed of a rectangular parallelepiped member having a low height. The fine movement stage 28 is connected to the Y coarse movement stage 24 by a fine movement stage drive system including a plurality of voice coil motors including a stator fixed to the Y coarse movement stage 24 and a mover fixed to the fine movement stage 28. Are slightly driven in directions of three degrees of freedom (X-axis, Y-axis, and θz directions). The plurality of voice coil motors include an X voice coil motor (not shown) and a Y voice coil motor 27y. The fine movement stage 28 is guided in a non-contact manner to the Y coarse movement stage 24 by the thrust (electromagnetic force) generated by the plurality of voice coil motors. Move with a predetermined long stroke in the Y-axis direction. Further, the fine movement stage drive system has a plurality of Z voice coil motors 27z for finely driving the fine movement stage 28 in the three degrees of freedom in the θx, θy, and Z-axis directions. The configuration of the fine movement stage drive system including a plurality of voice coil motors is disclosed in, for example, US Patent Application Publication No. 2010/0018950.

  Position information of the fine movement stage 28 in the XY plane is obtained by using a movable mirror 29 fixed to the fine movement stage 28 via a mirror base 29a by a substrate interferometer system including a laser interferometer 17 fixed to the apparatus main body 18. Desired. In practice, a Y moving mirror having a reflecting surface orthogonal to the Y axis and an X moving mirror having a reflecting surface orthogonal to the X axis are fixed to the fine movement stage 28, and the above Y movement is used as the laser interferometer 17. A Y laser interferometer for obtaining the Y position information of the fine movement stage 28 using a mirror and an X laser interferometer for obtaining the X position information of the fine movement stage 28 using the X moving mirror are provided. Only the Y moving mirror and the Y laser interferometer are shown.

  The configuration of the substrate stage 20 is not limited to this. For example, an X coarse movement stage that moves with a predetermined long stroke in the X axis direction is mounted on a Y coarse movement stage that moves with a predetermined long stroke in the Y axis direction. May be. Further, as a surface plate for guiding the weight cancellation device 26, for example, as disclosed in the specification of US Patent Application No. 2010/0266961, the X plate extends in the Y axis direction and corresponds to the X position of the weight cancellation device 26. A movable surface plate that is movable in the direction (or that extends in the X-axis direction and is movable in the Y-axis direction) may be used.

  The substrate holder 30 is made of a rectangular plate-like member parallel to the XY plane, and a plurality of small holes (not shown) for holding the substrate P by vacuum suction are formed on the upper surface thereof. Further, as shown in FIG. 2, a plurality of X grooves 31 parallel to the X axis for accommodating a part of the substrate lift device 32 are provided on the upper surface of the substrate holder 30 at predetermined intervals in the Y axis direction (for example, 8) (in order to avoid complication of the drawing, the X groove 31 and the substrate lift device 32 are not shown in FIG. 1). The X groove 31 is open on each side surface of the substrate holder 30 on the + X side and the −X side.

  The dimensions of the substrate holder 30 in the X-axis and Y-axis directions are set to be substantially the same, and the length thereof is set somewhat shorter than the length of one side of the substrate P. Therefore, as shown in FIG. 4A, the end portion of the substrate P protrudes outward from the end portion of the substrate holder 30 in a state where the substrate P is placed on the substrate holder 30. This is to prevent the resist applied on the surface of the substrate P from adhering to the back side at the end of the substrate P, so that the resist on the back side does not adhere to the upper surface of the substrate holder 30. .

  A plurality of (for example, eight, for example, eight corresponding to the eight X grooves 31 formed in the substrate holder 30 in the present embodiment) are arranged at a predetermined interval in the Y-axis direction. The substrate lift device 32 is used when the substrate P placed on the upper surface (substrate placement surface) of the substrate holder 30 is separated from the substrate placement surface. As shown in FIG. 3A, the substrate lift device 32 is made up of a rod-like member extending in the X-axis direction, and is accommodated in the X groove 31, and the upper surface of the base portion 32a has an X-axis direction. Are provided with a plurality of (for example, four) air bearings 32b attached at predetermined intervals, a pair of Z actuators 32c for driving (up-and-down movement) the base portion 32a in the Z-axis direction, and the like.

  Leg portions 32d extending in the Z-axis direction are fixed to the lower surface of the base portion 32a and in the vicinity of both ends in the longitudinal direction of the base portion 32a. A pair of through holes 33 penetrating the substrate holder 30 in the vertical direction are formed on the bottom surface defining the X groove 31, and leg portions 32 d are inserted into the pair of through holes 33. The fine movement stage 28 is slightly driven with respect to the Y coarse movement stage 24 between the wall surface defining the X groove 31 and the base portion 32a and between the wall surface defining the through hole 33 and the leg portion 32d. In this case, a gap that does not contact each other is set.

  The pair of Z actuators 32c is fixed to the upper surface of the Y coarse movement stage 24 and corresponding to the pair of leg portions 32d. An air cylinder or the like can be used as the Z actuator 32c. A stay 32e made of an L-shaped member is fixed in the vicinity of the Z actuator 32c on the upper surface of the Y coarse movement stage 24. The base portion 32a can move up and down with respect to the Y coarse movement stage 24 by the action of a Z linear guide device comprising a Z linear guide 32f fixed to the leg portion 32d and a Z slide member 32g attached to the stay 32e. It has become.

  The plurality of air bearings 32b are accommodated in the X groove 31 and separated from the lower surface of the substrate P as shown in FIG. The position can be moved between the position protruding from the upper surface of the substrate holder 30 shown in FIG. 3B to the + Z side. The plurality of air bearings 32 b protrude from the upper surface of the substrate holder 30, thereby separating the substrate P from the upper surface of the substrate holder 30, and jetting pressurized gas (for example, air) to the lower surface of the substrate P. The substrate P can be supported in a non-contact manner from below by the static pressure of the pressurized gas. The plurality of air bearings 32b may be formed integrally with the base portion 32a.

  In the substrate stage 20, the loading hand member 98 shown in FIG. 2 conveys the substrate P above the substrate holder 30 when the substrate P is loaded into the substrate holder 30. Then, the base portions 32 a of the plurality of substrate lift devices 32 are driven to rise synchronously, thereby separating the substrate P from the loading hand member 98. The carry-in hand member 98 is retracted from above the substrate holder 30 after the substrate P is transferred to the substrate lift device 32, and then the base portion 32a that supports the substrate P from below is driven downward. The substrate P is placed on the substrate holder 30. The intervals in the Y-axis direction are set so that the plurality of substrate lift devices 32 can pass through the cutouts of the loading hand member 98 when the base portion 32a moves up and down (does not contact the loading hand member 98). ing.

  A substrate rotating device 34 is built in the central portion of the substrate holder 30. As shown in FIG. 3C, the substrate rotating device 34 includes a suction pad 34a and a Z / θz actuator 34b that moves the suction pad 34a up and down and rotationally drives it in the θz direction. As shown in FIG. 2, the suction pad 34 a has a cross-shaped suction surface in a plan view, and is accommodated in a recess 34 c formed in a shape corresponding to the suction pad 34 a at the center of the substrate holder 30. . Returning to FIG. 3C, the suction pad 34 a is accommodated in the substrate holder 30 by the Z · θz actuator 34 b and separated from the lower surface of the substrate P (hereinafter referred to as an accommodation position), and FIG. ) Is driven between a position protruding to the + Z side from the upper surface of the substrate holder 30 (hereinafter referred to as a protruding position), and is rotated and rotated, for example, 180 ° in the θz direction at the protruding position. . Although the shape of the suction pad 34a is not particularly limited, it is desirable that the suction pad 34a be as small as possible because the substrate holder 30 has a reduced function of correcting the substrate P to a flat surface when the concave portion 34c increases.

  A vacuum device (not shown) installed outside the substrate stage 20 is connected to the suction pad 34a, and the lower surface of the substrate P can be sucked and held at the protruding position. In the substrate stage 20, the suction pad 34a sucks and holds the lower surface of the substrate P, and the suction pad 34a is rotationally driven in the θz direction in a state where pressurized gas is jetted from the plurality of air bearings 32b to the lower surface of the substrate P. As a result, the substrate P rotates on the substrate holder 30 as shown in FIG. At this time, the height position of the movable mirror 29 is set so as not to contact the movable mirror 29 (not shown in FIG. 4B, see FIG. 1) fixed to the substrate P and the fine movement stage 28.

  In the liquid crystal exposure apparatus 10 (see FIG. 1) configured as described above, the mask M is loaded onto the mask stage 14 by a mask loader (not shown) under the control of a main controller (not shown). The substrate P is loaded onto the substrate holder 30 by the substrate loader including the loading hand member 98 shown in FIG. Thereafter, alignment measurement is performed by the main controller using an alignment detection system (not shown), and after completion of the alignment measurement, a plurality of shot areas set on the substrate P are sequentially exposed in a step-and-scan manner. Operation is performed.

  Hereinafter, an example of the operation of the substrate P in which position control is performed by the substrate stage 20 when the step-and-scan exposure operation is performed will be described with reference to FIGS. . In the following description, a case where four shot areas are set on one substrate P (in the case of so-called four-chamfering) will be described, but the number of shot areas set on one substrate P, And arrangement | positioning can be changed suitably. 5A to 7B, only the relative positional relationship between the substrate P and the exposure area IA is shown, and the illustration of the substrate holder 30 and the like is omitted. . The exposure area IA is an area (illumination area) formed on the substrate P by irradiating the illumination light IL (see FIG. 1) through the projection optical system 16 (see FIG. 1) during exposure. Actually, it is not formed except during exposure, but in FIGS. 5A to 7B, it is always shown in order to clarify the relative positional relationship between the substrate P and the exposure area IA. .

  As an example, the exposure process is performed from the first shot area SA1 set on the −Y side and the −X side of the substrate P as shown in FIG. After the alignment measurement, the substrate P is positioned so that the first shot area SA1 is located on the + X side of the exposure area IA (directly below the projection optical system 16 (see FIG. 1)). Thereafter, as indicated by an arrow in FIG. 5B, the substrate P is driven in the -X direction (acceleration, settling, constant speed drive, and deceleration), and a mask pattern is formed in the first shot area SA1 on the substrate P. Is transcribed.

  When the exposure process on the first shot area SA1 is completed, the substrate P is driven in the -Y direction (Y step drive) as indicated by an arrow in FIG. 5C, and is moved to the + Y side of the first shot area SA1. Positioning is performed so that the set second shot area SA2 is positioned on the −X side of the exposure area IA. 6A, the substrate P is driven to the + X side, and the mask pattern is transferred to the second shot area SA2 on the substrate P.

  In the present embodiment, when the transfer of the mask pattern to the second shot area SA2 is completed, the adsorption and holding of the substrate P by the substrate holder 30 is released as shown in FIG. The substrate P is driven to rise with respect to the substrate holder 30 by the substrate lift device 32. Then, as shown in FIG. 3C, the substrate P is sucked and held by the suction pad 34a of the substrate rotating device 34, and the suction pad 34a is driven to rotate in the θz direction, for example, by 180 °. As shown in (B), the substrate P rotates with respect to the substrate holder 30 by, for example, 180 °. Hereinafter, although not shown in FIG. 6B, the substrate P is driven downward by the plurality of substrate lift devices 32 (see FIG. 3A), and the substrate P is moved to the substrate holder 30 (FIG. 3A). (See)).

  In the substrate stage 20, after the substrate P is rotated by, for example, 180 °, the suction holding of the substrate P by the suction pad 34a is released. Hereinafter, after the alignment operation of the substrate P with respect to the substrate holder 30 using a not-shown pressing pin, non-contact sensor, etc. is performed, the substrate P is driven downward, and the substrate P is again sucked and held by the substrate holder 30. . Thereafter, as indicated by an arrow in FIG. 6C, the substrate P is driven in the −X direction, whereby the exposure operation for the third shot area SA3 set on the −X side of the first shot area SA1. And the mask pattern is transferred to the third shot area SA3.

  Next, as indicated by an arrow in FIG. 7A, the substrate P is driven in the + Y direction (Y step driving), and the fourth shot area SA4 set on the −X side of the second shot area SA2 is exposed. Positioning is performed so as to be positioned on the −X side of the region IA. Then, as indicated by an arrow in FIG. 7B, the substrate P is driven to the + X side, and the mask pattern is transferred to the fourth shot area SA4 on the substrate P.

  As described above, in the substrate stage 20 of the present embodiment, the substrate P can be rotated by, for example, 180 ° on the substrate holder 30, so in the above example, after the exposure of the second shot area SA2 is finished, the third stage It is not necessary to drive the substrate P in the X-axis direction in preparation for exposure of the shot area SA3. That is, the substrate stage 20 of the present embodiment does not require the X-step operation of the substrate P, and the stroke of the X coarse movement stage 22 (see FIG. 1) is shorter than that of the conventional substrate stage that performs the X-step operation of the substrate P. can do. Therefore, the substrate stage 20 becomes compact and the cost is reduced. Further, since the stroke in the X-axis direction of the fine movement stage 28 (see FIG. 1) is shortened, the surface plate 25 which is a guide for the fine movement stage 28 (weight canceling device 26) can be shortened. Further, the Y movable mirror (not shown) used for obtaining the positional information of the fine movement stage 28 can be made shorter than the conventional substrate stage. Therefore, it becomes easy to secure the rigidity of the Y movable mirror, and the positioning accuracy of the substrate P is improved. Moreover, since the substrate stage 20 can be reduced in weight, the substrate P can be driven at high speed.

<< Second Embodiment >>
Next, a second embodiment will be described with reference to FIGS. 8 to 13B. Note that, in the second embodiment, the third embodiment, and the modifications described below, elements having the same configuration and function as those of the first embodiment are described in the first embodiment. The same reference numerals are used and the description thereof is omitted.

  In the first embodiment, the area of the substrate holder 30 is set to be approximately the same as the area of the substrate P as shown in FIG. 4A, and the substrate P is placed on the substrate holder 30. In contrast, almost all of the substrate P is in contact with the upper surface of the substrate holder 30, whereas in the substrate stage 120 according to the second embodiment shown in FIG. A part of the substrate P is set in a state where the area is set smaller than the area of the substrate P (in the second embodiment, for example, about 2/3) and the substrate P is placed on the substrate holder 30. This is different in that the above area does not contact the upper surface of the substrate holder 30.

  More specifically, as shown in FIG. 8B, the substrate holder 130 is formed with a dimension that is almost the same as the length of the substrate P (actually somewhat shorter) in the Y-axis direction. In the X-axis direction, the length of the substrate P is, for example, about 2/3. The substrate stage 120 has a plurality of (for example, eight) substrate lift devices 32 arranged at a predetermined interval in the Y-axis direction, as in the first embodiment. As shown in FIG. 8A, in the X-axis direction, the size of the base portion 32a of the substrate lift device 32 is set to be substantially the same as that of the substrate P, and the end portion on the + X side of the base portion 32a is The substrate holder 130 protrudes from the + X side surface to the + X side.

  In the second embodiment, as shown in FIG. 8B, a region on the −X side including the central portion of the substrate P, for example, about 2/3, is on the substrate placement surface of the substrate holder 130. Placed on. For this reason, about 2/3 of the entire area of the substrate P is attracted and held by the substrate holder 30, and the remaining area (about 1/3 of the entire area) is not placed on the substrate holder 30. By being supported from below by the substrate lift device 32, bending due to its own weight is suppressed. Further, the suction pad 34a of the substrate rotating device 34 is disposed somewhat on the + X side from the central portion of the substrate holder 130 so that the central portion of the substrate P can be sucked and held, as in the first embodiment. Yes.

  Hereinafter, a step-and-scan exposure operation using the substrate stage 120 according to the second embodiment will be described. In the following description, as shown in FIG. 9A, when six shot areas (three faces in the X-axis direction and two faces in the Y-axis direction) are set on one substrate P (so-called “so-called”) In the case of 6 chamfering), the number and arrangement of shot regions set on one substrate P can be changed as appropriate. In the substrate stage 120 of the second embodiment, for example, when performing a six-chamfer exposure process, as shown in FIG. 9A, for example, among the six shot areas set on the substrate P, the + X side The other four shot areas other than the two shot areas are placed on the substrate placement surface of the substrate holder 130.

  Hereinafter, in order to facilitate understanding, in FIG. 9B to FIG. 13B, the shot region to which the mask pattern has been transferred will be described with an alphabetic letter F as an example. It is intended to clarify the orientation of the mask pattern and is not particularly related to the mask pattern that is actually transferred to the substrate P. Further, the Y position information of the substrate P is obtained by the Y laser interferometer 17y using the Y moving mirror 29y, and the X position information of the substrate P is obtained by the X laser interferometer 17x using the X moving mirror 29x. For example, two Y laser interferometers 17y and X laser interferometers 17x are provided, respectively, so that the θz position information of the substrate P can be obtained.

  As an example, the exposure processing is performed from the first shot area SA1 set on the −Y side and the −X side of the substrate P, as shown in FIG. 9A. Since the exposure operation for the first shot area SA1 and the second shot area SA2 set on the + Y side of the first shot area SA1 is the same as that in the first embodiment, description thereof is omitted here (FIG. 9A). ) To FIG. 10 (B)).

  When the exposure process for the second shot area SA2 is completed, the substrate P is driven in the −X direction (X step drive), and the third shot area SA3 set on the + X side of the second shot area SA2 is exposed in the exposure area IA. Is positioned so as to be located on the + X side of. Thereafter, as indicated by an arrow in FIG. 10C, the substrate P is driven in the −X direction, and the mask pattern is transferred to the third shot area SA3. When the exposure processing for the third shot area SA3 is completed, the substrate P is driven in the + Y direction (Y step driving) as shown by an arrow in FIG. 11A, and is set to the + X side of the first shot area SA1. The fourth shot area SA4 is positioned so as to be positioned on the −X side of the exposure area IA. Thereafter, as indicated by an arrow in FIG. 11B, the substrate P is driven in the + X direction, and the mask pattern is transferred to the fourth shot area SA4.

  When the transfer of the mask pattern to the fourth shot area SA4 is completed, the substrate P is positioned such that the exposure area IA is located outside (−X side) the substrate P as indicated by an arrow in FIG. Is driven in the + X direction, and the substrate P is rotated by 180 °, for example, with respect to the substrate holder 30. Since the operation of the substrate lift device 32 (not shown in FIG. 12A, see FIG. 8A) at this time is the same as that of the first embodiment, description thereof is omitted here.

  In the substrate stage 120, for example, after the substrate P is rotated by 180 °, the alignment operation of the substrate P is performed in the same manner as in the first embodiment, and thereafter, as shown by the arrow in FIG. When the substrate P is driven in the −X direction, the exposure operation for the fifth shot area SA5 set on the −X side of the third shot area SA3 is performed. The mask pattern transferred to the fifth shot area SA5 is upside down compared to the first to fourth shot areas SA1 to SA4.

  Hereinafter, as indicated by an arrow in FIG. 13A, the substrate P is driven in the −Y direction (Y step drive), and the sixth shot area SA6 set on the −X side of the fourth shot area SA4 is Positioning is performed so as to be positioned on the −X side of the exposure area IA, and the substrate P is driven in the + X direction as shown by an arrow in FIG. 13B, and the mask pattern is transferred to the sixth shot area SA6. Is done. Similarly to the mask pattern transferred to the fifth shot area SA5, the mask pattern transferred to the sixth shot area SA6 is also upside down compared to the first to fourth shot areas SA1 to SA4.

  In the second embodiment described above, the substrate P is rotated by, for example, 180 ° instead of the X step operation, as in the first embodiment, so that the X axis of the X coarse movement stage 22 (see FIG. 1). The direction stroke can be shortened, and the substrate stage 120 becomes compact. In addition, the substrate stage 120 according to the second embodiment is smaller than the conventional substrate stage using a substrate holder having a substrate mounting surface having the same area as the substrate P. The fine movement stage 128 and the substrate holder 130 are small in size. And the weight can be reduced, thereby improving the position controllability of the substrate P. Further, the cost is reduced by downsizing the actuator for driving the fine movement stage 128.

<< Third Embodiment >>
Next, a third embodiment will be described with reference to FIGS. 14 (A) to 16 (B). The substrate stage 220 according to the third embodiment differs from the second embodiment in the shape of the substrate holder 230. Specifically, as shown in FIG. 8B, the substrate holder 230 of the second embodiment is formed with substantially the same dimensions as the substrate P in the Y-axis direction, and the substrate P in the X-axis direction. In contrast, as shown in FIG. 14A, the substrate holder 230 according to the third embodiment has substantially the same dimensions as the substrate P in the X-axis direction. (Actually somewhat shorter) and about half the size of the substrate P in the Y-axis direction.

  Hereinafter, a step-and-scan exposure operation using the substrate stage 220 according to the third embodiment will be described. In the following description, as shown in FIG. 14A, a case where six shot areas are set on one substrate P (in the case of so-called six chamfering) will be described. The number and arrangement of the shot areas set in can be changed as appropriate. In the substrate stage 220 of the third embodiment, for example, in the case of performing a six-chamfer exposure process, as shown in FIG. 14A, for example, among the six shot areas set on the substrate P, −Y The three shot regions on the side are placed on the substrate placement surface of the substrate holder 130. Although not shown in FIGS. 14A to 16B, the substrate stage 220 includes a plurality (for example, eight) of substrate stages 220 arranged at predetermined intervals in the Y-axis direction, as in the first embodiment. ) Substrate lift device 32 (see FIG. 2), for example, three shot regions set on the + Y side of substrate P are supported from below by a plurality of substrate lift devices 32.

  As an example, the exposure process is performed from the first shot area SA1 set on the −Y side and the −X side of the substrate P as shown in FIG. The substrate P is positioned so that the first shot area SA1 is located on the + X side of the exposure area IA. Thereafter, as indicated by an arrow in FIG. 14B, the substrate P is driven in the −X direction, and the mask pattern is transferred to the first shot area SA1 on the substrate P.

  When the exposure process for the first shot area SA1 is completed, the substrate P is driven in the + X direction (X step drive), and the second shot area SA2 set on the + X side of the first shot area SA1 is in the exposure area IA. Positioning is performed so as to be positioned on the + X side. Thereafter, as indicated by an arrow in FIG. 14C, the substrate P is driven in the −X direction, and the mask pattern is transferred to the second shot area SA2. When the exposure process for the second shot area SA2 is completed, the substrate P is driven in the + X direction (X step drive), and the third shot area SA3 set on the + X side of the second shot area SA2 is exposed to the exposure area. Positioning is performed so as to be located on the + X side of IA. Thereafter, as indicated by an arrow in FIG. 15A, the substrate P is driven in the −X direction, and the mask pattern is transferred to the third shot area SA3.

  When the transfer of the mask pattern to the third shot area SA3 is completed, the substrate P is driven to rotate by 180 °, for example, with respect to the substrate holder 230, as indicated by an arrow in FIG. Since the operation of the substrate lift device 32 (not shown in FIG. 15B, see FIG. 3A) at this time is the same as that of the first embodiment, description thereof is omitted here.

  Thereafter, as indicated by an arrow in FIG. 15C, the substrate P is driven in the + X direction, and the mask pattern is transferred to the fourth shot area SA4 set on the −Y side of the first shot area SA1. . Hereinafter, as shown in FIGS. 16A and 16B, the fifth shot area SA5 set on the −X side of the fourth shot area SA4 and the −X side of the fifth shot area SA5 The mask pattern is sequentially transferred to the set sixth shot area SA6. The exposure process for the fifth and sixth shot areas SA5 and SA6 is the same as the exposure process for the first to third shot areas SA1 to SA3 except that the driving direction of the substrate P is opposite to the X-axis direction. Since there is, explanation is omitted here.

  According to the third embodiment described above, since it is possible to perform the exposure processing on all the shot areas SA1 to SA6 without performing the Y step operation of the substrate P, the substrate P is moved with a long stroke in the Y-axis direction. (In the third embodiment, for example, the Y coarse guide stage 24 and the fine guide stage 28 (weight canceling device 26) in the Y direction guide surface (see FIG. 1)) are not required. The configuration is simple (however, it is preferable to provide a mechanism for slightly driving the substrate P in the Y-axis direction). In the first and second embodiments, a so-called bar mirror extending in the Y-axis direction is used as the X moving mirror 29x used for obtaining the X position information of the fine movement stage 28 (see FIG. 1) ( In the third embodiment, the substrate P does not move in a long stroke in the Y-axis direction. Therefore, as shown in FIG. Corner cubes) can be used as the X moving mirror 29x (the same reference numerals as in the second embodiment are used because there is no functional difference).

  Note that the configurations of the substrate stages 20, 120, and 220 according to the first to third embodiments can be modified as appropriate. For example, in the third embodiment (see FIG. 14A), about half of the area of the substrate P with respect to the X-axis direction is attracted and held by the substrate holder 230. When the region is set, for example, about 2/3 of the substrate P in the Y-axis direction may be sucked and held by the substrate holder 330 like the substrate stage 320 shown in FIG. Unlike the third embodiment, the substrate stage 320 also performs a Y-step operation. However, in the conventional substrate stage in which the areas of the substrate P and the substrate holder are set to be equal, when performing three chamfering in the Y-axis direction, the stroke in the Y-axis direction of the substrate P is, for example, the length of the substrate in the Y-axis direction. However, in the substrate stage 320 shown in FIG. 17, the stroke of the substrate P in the Y-axis direction may be, for example, about 1/3 of the length of the substrate in the Y-axis direction.

  Further, when the substrate P is rotated, the substrate P is supported in a non-contact manner from below by an air bearing 32b included in the substrate lift device 32. However, the present invention is not limited to this. The substrate P may be floated by jetting to the lower surface of the substrate. In this case, in the second and third embodiments, a portion of the substrate P that is not attracted and held by the substrate holder 130 (or the substrate holder 230) (that protrudes from the substrate holder 130) is viewed from below using an air bearing or the like. A supporting member may be provided. Further, when the friction between the substrate P and the substrate holder 30 does not matter, the substrate P does not necessarily have to be lifted.

  Further, the substrate P is rotationally driven by the substrate rotating device 34 included in the substrate holder 30, but the configuration of the device that rotates the substrate P can be changed as appropriate. For example, the device for rotating the substrate P may be disposed outside the substrate holder 30. In this case, for example, the end of the substrate P may be held and the substrate P may be rotationally driven, or the upper surface of the substrate P may be held without contact and rotated.

  In the first to third embodiments (and modifications thereof), the substrate P is driven to rotate in the θz direction, for example, 180 °. However, the rotation angle of the substrate P is not limited to this, and is, for example, 90 °. It may be. Further, when performing an exposure operation on all shot regions of one substrate P, the substrate P may be rotated a plurality of times. In the first embodiment, the substrate P is rotated with respect to the substrate holder 30. However, the present invention is not limited to this, and the substrate holder 30 holding the substrate P by suction may be rotated with respect to the fine movement stage 28. .

The illumination light may be ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm). As the illumination light, for example, a single wavelength laser beam oscillated from a DFB semiconductor laser or a fiber laser is amplified by a fiber amplifier doped with, for example, erbium (or both erbium and ytterbium). In addition, harmonics converted into ultraviolet light using a nonlinear optical crystal may be used. A solid laser (wavelength: 355 nm, 266 nm) or the like may be used.

  The projection optical system 16 is a multi-lens projection optical system including a plurality of projection optical units. However, the number of the projection optical units is not limited to this, and may be one or more. The projection optical system is not limited to a multi-lens type projection optical system, and may be a projection optical system using an Offner type large mirror, for example. In the above embodiment, the case where the projection optical system 16 has a projection magnification of the same magnification has been described. However, the present invention is not limited to this, and the projection optical system may be either a reduction system or an enlargement system.

  In addition, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting mask substrate is used. For example, it is disclosed in US Pat. No. 6,778,257. As described above, based on electronic data of a pattern to be exposed, an electronic mask (variable shaping mask) for forming a transmission pattern, a reflection pattern, or a light emission pattern, for example, a non-light-emitting image display element (spatial light modulator) A variable molding mask using DMD (Digital Micro-mirror Device), which is a kind of the same, may also be used.

  The exposure apparatus may be a step-and-repeat type exposure apparatus or a step-and-stitch type exposure apparatus.

  As an exposure apparatus, an exposure apparatus that exposes a substrate having a size (including at least one of an outer diameter, a diagonal length, and one side) of 500 mm or more, for example, a large substrate for a flat panel display such as a liquid crystal display element. It is particularly effective to apply to this.

  Further, the use of the exposure apparatus is not limited to a liquid crystal exposure apparatus that transfers a liquid crystal display element pattern onto a square glass plate. For example, an exposure apparatus for semiconductor manufacturing, a thin film magnetic head, a micromachine, and a DNA chip The present invention can also be widely applied to an exposure apparatus for manufacturing the above. Moreover, in order to manufacture not only microdevices such as semiconductor elements but also masks or reticles used in light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc., glass substrates, silicon wafers, etc. The present invention can also be applied to an exposure apparatus that transfers a circuit pattern. The object to be exposed is not limited to the glass plate, and may be another object such as a wafer, a ceramic substrate, a film member, or mask blanks. Moreover, when the exposure target is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and includes, for example, a film-like (flexible sheet-like member).

  For electronic devices such as liquid crystal display elements (or semiconductor elements), the step of designing the function and performance of the device, the step of producing a mask (or reticle) based on this design step, and the step of producing a glass substrate (or wafer) A lithography step for transferring a mask (reticle) pattern to a glass substrate by the exposure apparatus and the exposure method of each embodiment described above, a development step for developing the exposed glass substrate, and a portion where the resist remains. It is manufactured through an etching step for removing the exposed member of the portion by etching, a resist removing step for removing a resist that has become unnecessary after etching, a device assembly step, an inspection step, and the like. In this case, in the lithography step, the above-described exposure method is executed using the exposure apparatus of the above embodiment, and a device pattern is formed on the glass substrate. Therefore, a highly integrated device can be manufactured with high productivity. .

  As described above, the exposure method and apparatus of the present invention are suitable for forming a predetermined pattern on an object using an energy beam. Moreover, the manufacturing method of the flat panel display of this invention is suitable for manufacture of a flat panel display. The device manufacturing method of the present invention is suitable for the production of micro devices.

  DESCRIPTION OF SYMBOLS 10 ... Liquid crystal exposure apparatus, 20 ... Substrate stage, 30 ... Substrate holder, 32 ... Substrate lift device, 34 ... Substrate rotation apparatus, P ... Substrate.

Claims (24)

Forming a predetermined pattern on the first region of the object placed on the object holding member using an energy beam;
Rotating the object about an axis that intersects the surface of the object;
Forming the predetermined pattern using an energy beam on a second region different from the first region of the object.   The exposure method according to claim 1, wherein the rotation rotates the object 180 degrees.   The exposure method according to claim 1, wherein a plurality of the predetermined patterns are formed in the first region and the second region, respectively.   The exposure method according to claim 1, wherein in the rotation, an object rotation device included in the object holding member is used.   The exposure method according to claim 1, wherein the rotating causes the object to float in a non-contact manner on the object holding member. The object holding member has an object placement surface having a smaller area than the object,
In forming the predetermined pattern in the first region, a part of the object including the first region is placed on the object placement surface,
The said predetermined pattern is formed in a said 2nd area | region, The other part of the said object containing the said 2nd area | region is mounted on the said object mounting surface. Exposure method. With a part of the object placed on the object placement surface, the other part of the object is supported by a support member different from the object holding member,
The exposure method according to claim 6, wherein a part of the object is supported by the support member in a state where the other part of the object is placed on the object placement surface.   The exposure method according to claim 6 or 7, wherein a part of the object partially overlaps with another part of the object.   The first region is provided on one side of the object and the second region is provided on the other side of the object with respect to a uniaxial direction in a two-dimensional plane parallel to the surface of the object. 9. The exposure method according to any one of 8 above.   The object is moved relative to the energy beam in a predetermined scanning direction by forming a predetermined pattern in the first region and forming a predetermined pattern in the second region. The exposure method as described in any one of -9.   The exposure method according to claim 1, wherein the object is a substrate used in a flat panel display device.   The exposure method according to claim 11, wherein the substrate has a length of at least one side of 500 mm or more. Exposing the object by the exposure method according to any one of claims 1 to 12,
Developing the exposed object. A method of manufacturing a flat panel display. Exposing the object by the exposure method according to any one of claims 1 to 10,
Developing the object. An object holding member on which the object is placed;
A rotation drive device for rotating the object around an axis intersecting the surface of the object;
A predetermined pattern is formed using an energy beam on the first region of the object placed on the object holding member, and then the object is rotated using the rotation driving device. An exposure apparatus comprising: an exposure control system that forms a predetermined pattern using an energy beam on a second area different from the first area of the object placed on the object.   The exposure apparatus according to claim 15, wherein the rotation driving device rotates the object 180 degrees.   The exposure apparatus according to claim 15 or 16, wherein the exposure control system forms a plurality of the predetermined patterns in each of the first region and the second region.   The exposure apparatus according to claim 15, wherein the rotation driving device is provided on the object holding member.   The exposure apparatus according to any one of claims 15 to 18, wherein the rotation driving device rotates the object in a state where the object floats on the object holding member in a non-contact manner. The object holding member has an object placement surface having a smaller area than the object,
When the predetermined pattern is formed in the first area, a part of the object including the first area is placed on the object placement surface, and the predetermined area is placed in the second area. The exposure apparatus according to claim 15, wherein when the pattern is formed, the other part including the second region is placed on the object placement surface.   The object is supported in a state where a part of the object is placed on the object placement surface, and the object is placed in a state where the other part of the object is placed on the object placement surface. The exposure apparatus according to claim 20, further comprising a support member that supports a part of the exposure apparatus.   The exposure apparatus according to claim 20 or 21, wherein a part of the object partially overlaps the other part of the object.   The first region is provided on one side of the object and the second region is provided on the other side of the object with respect to a uniaxial direction in a two-dimensional plane parallel to the surface of the object. The exposure apparatus according to any one of claims 22 to 22.   The exposure control system scans the object with respect to the energy beam when the predetermined pattern is formed in the first region and when the predetermined pattern is formed in the second region. The exposure apparatus according to any one of claims 15 to 23, which is relatively moved in a direction.

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