JP2007188987A - Object conveying apparatus, exposure device, measuring system, object processing system, and measuring method - Google Patents

Object conveying apparatus, exposure device, measuring system, object processing system, and measuring method Download PDF

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JP2007188987A
JP2007188987A JP2006004380A JP2006004380A JP2007188987A JP 2007188987 A JP2007188987 A JP 2007188987A JP 2006004380 A JP2006004380 A JP 2006004380A JP 2006004380 A JP2006004380 A JP 2006004380A JP 2007188987 A JP2007188987 A JP 2007188987A
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object
wafer
member
base member
position
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JP2006004380A
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Japanese (ja)
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Takashi Horiuchi
貴史 堀内
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Nikon Corp
株式会社ニコン
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Abstract

<P>PROBLEM TO BE SOLVED: To eliminate any error based on introduction reproducibility of an object into an apparatus at a conveyance destination while simplifying the construction of the apparatus of the conveyance destination of the object. <P>SOLUTION: An object conveying apparatus comprises a first base member WLB, and a conveying member 143 supported on the first base member WLB for holding and conveying the object W to a predetermined delivery position P4. In order to measure part of a periphery of the object W located at the delivery position P4 in cooperation with detection devices S1, S2, S3 supported on a second base member (MCL) separated in vibration transmission from the first base member WLB, illumination apparatuses EL1, EL2, EL3 are provided on the conveying member 143 for illuminating the part of the periphery. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an object conveying apparatus that conveys an object such as a substrate, an exposure apparatus including the object conveying apparatus, a measurement system that measures the position of the object, an object processing system that performs processing such as exposure processing on the object, and an object. The present invention relates to a measurement method for measuring the position and the like.

  In a photolithography process, which is one of the manufacturing processes of semiconductor elements, a resist coating apparatus (coater) for applying a photosensitive material (photoresist) onto a substrate (object) such as a wafer or a glass plate, and the photosensitive material is applied. An exposure apparatus (stepper) for projecting and transferring a pattern image of a reticle (mask) onto a substrate, and forming a latent image of the pattern; a developing apparatus (developer) for developing the latent image formed on the substrate; used. Transfer of substrates between the resist coating apparatus and the exposure apparatus, and between the exposure apparatus and the developing apparatus is performed collectively using a substrate carrier (substrate cassette) that can store a plurality of substrates, or There is a type in which the substrate is individually transferred to a resist coating apparatus or the like disposed in the vicinity of the exposure apparatus (so-called in-line type).

  The resist-coated substrate is housed in a substrate carrier or individually from a resist coating device, and is carried into a predetermined loading position, and individually exposed to an exposure main body (substrate stage) by a substrate transport device provided in the exposure device. The substrate is transferred to a predetermined delivery position for delivering the substrate. The substrate for which the exposure processing has been completed is transported from the exposure main body to a predetermined unloading position by the substrate transport device, and is stored in a substrate carrier or individually unloaded to the next developing device.

  Between the substrate loading / unloading position and the exposure body, a processing unit such as a pre-alignment mechanism that preliminarily adjusts the position and orientation of the substrate based on the outer shape reference and a cool plate that adjusts the substrate to a predetermined temperature is arranged. The substrate transport device sequentially transports the substrate between the loading / unloading position, the processing unit, and the exposure main body unit. Various types of substrate transfer devices are known. For example, an articulated robot transports a substrate from a loading position onto a cool plate, and requires a substrate whose temperature is adjusted to a predetermined temperature by the cool plate. In response to this, after pre-alignment (position measurement and position adjustment by measuring the outer shape of the substrate), the slider arm (load slider) that is linearly driven by a linear motor or the like is used to carry it to the delivery position with the exposure main body. The ones used are used.

  By the way, although it is necessary to support the exposure main body on a high-performance vibration isolator from the viewpoint of improving exposure accuracy, it is disadvantageous in cost to install the substrate transport device on the vibration isolator. In addition, since it is not preferable that the vibration accompanying the operation of each part of the substrate transport apparatus is transmitted to the exposure main body part, the exposure main body part and the substrate transport apparatus are generally separated from each other in vibration transmission, that is, respectively. It is common to be installed on a different base member (support).

Therefore, the vibration state of the two when the substrate is transferred from the transfer member (load arm or the like) of the substrate transfer apparatus to the substrate stage of the exposure main body is not related to each other. The input reproducibility of the substrate becomes worse. For this reason, conventionally, a substrate is once received from a substrate transport device by a transport arm (including a driving mechanism) provided on the exposure main body side, and illumination light is applied to the detection device and the detection device also provided on the exposure main body side. After detecting the outer periphery of the substrate with the illumination device to be supplied and adjusting the position and rotation of the substrate with the transfer arm of the exposure main body, the substrate is transferred onto the substrate stage, so that the substrate is loaded from the substrate transfer device. An error based on reproducibility was canceled.

  However, it is desirable that the configuration on the exposure main body side be as simple as possible, and vibrations due to the operation of the transfer arm provided on the exposure main body side and heat generation of the drive mechanism become problems. In addition, the outer shape detection of the substrate by the detection device is more accurate than the reflected illumination (illumination method when the reflected light is detected by illuminating the substrate from the detection device side). An illumination method in which illumination light is supplied from the opposite side is advantageous. In order to perform transmission illumination, it is not preferable to provide an illumination device on, for example, a substrate stage because the configuration of the stage becomes complicated. In addition, as described in the following patent document, the detection device and the illumination device are provided on the transport member on the substrate transport device side, and the substrate outer shape is detected during the transport of the substrate. The error based on the reproducibility of the input to the main body cannot be eliminated, and it is not a fundamental solution.

  The present invention has been made in view of the above points, and it is possible to eliminate an error based on the reproducibility of the input of an object to the transport destination apparatus while simplifying the configuration of the transport destination apparatus of the object. The purpose is to.

Japanese Patent Application Laid-Open No. 11-129175 JP-A-11-195686

  According to the present invention, it has a first base member and a transport member that is supported on the first base member and holds and transports an object to a predetermined delivery position, and is located at the delivery position. In addition, a part of the peripheral part of the object is measured in cooperation with a detection device supported on a second base member separated from the first base by vibration transmission. The object conveying apparatus which provided the illuminating device which illuminates on the said conveyance member is provided.

In the present invention, the illumination device provided on the conveyance member supported on the first base member cooperates with the detection device supported on the second base member from which vibration transmission is separated from the first base member. Thus, a part of the peripheral edge of the object is detected, and there is no need to separately provide a transport member and an illumination device on the second base member as in the prior art. The detection device is supported on the second base member, and the error based on the input reproducibility of the object with respect to the device provided on the second base member can be simplified. Can be resolved effectively. Other objects of the present invention, configurations for realizing the same, and the like will be clarified in the embodiments described below.

  According to the present invention, there is an effect that it is possible to effectively eliminate an error based on the reproducibility of the input of an object to the transfer destination device while simplifying the configuration of the transfer destination device of the object.

  Hereinafter, an exposure system according to an embodiment of the present invention will be described with reference to the drawings. The exposure system includes an exposure apparatus (exposure main body) that performs an exposure process, a wafer transfer apparatus that carries a wafer in and out of the exposure apparatus, and the like. Hereinafter, the overall configuration of the exposure apparatus will be outlined first, and then the wafer transfer apparatus will be described.

[Exposure equipment]
An outline of the entire configuration of the exposure apparatus is shown in FIG. The exposure apparatus EX is a so-called immersion type exposure apparatus, and moves an image of a pattern formed on the reticle R on the wafer W while moving the reticle stage RST and the wafer stage WST synchronously with respect to the projection optical system PL. Is a step-and-scan type exposure apparatus that sequentially transfers to a shot area.

The illumination optical system IL shapes the cross-sectional shape of laser light emitted from a light source such as an ArF excimer laser light source (wavelength 193 nm) into a slit shape extending in a direction (Y direction) perpendicular to the scanning direction (X direction), and The illuminance distribution is made uniform and emitted as illumination light EL. In this embodiment, the case where an ArF excimer laser light source is provided as a light source will be described as an example. In addition, an ultrahigh pressure mercury lamp that emits g-line (wavelength 436 nm) and i-line (wavelength 365 nm), or A KrF excimer laser (wavelength 248 nm), an F 2 laser (wavelength 157 nm), and other light sources can be used.

  The reticle R is attracted and held on the reticle stage RST, and a moving mirror MRr to which a length measuring laser beam from the reticle interferometer system IFR is irradiated is fixed to one end of the reticle stage RST. Positioning of the reticle R is performed by a reticle driving device (not shown) that translates the reticle stage RST in the XY plane perpendicular to the optical axis AX and rotates it slightly in the XY plane. When transferring the image of the pattern of the reticle R onto the wafer W, the reticle driving device scans the reticle stage RST in a predetermined scanning direction (X-axis direction) at a constant speed.

Above the reticle stage RST, alignment systems OB1 and OB2 for photoelectrically detecting a plurality of reticle alignment marks formed around the reticle R are provided along the scanning direction. The detection results of the alignment systems OB1 and OB2 are used for positioning the reticle R with a predetermined accuracy with respect to the optical axis AX of the projection optical system PL. Interferometer system IFR projects a laser beam onto movable mirror MRr, receives the reflected beam, and measures the positional change of reticle R.

  Below projection optical system PL having a plurality of optical elements such as lenses, there is provided wafer stage WST on which wafer W is placed and moved two-dimensionally along the XY plane. Wafer table WTB is provided on wafer stage WST, and wafer holder WH for vacuum-sucking wafer W is provided on wafer table WTB.

Wafer table WTB slightly moves and tilts wafer holder WH in the Z direction (optical axis AX direction) based on a measurement value of an autofocus mechanism (AF mechanism) (not shown). The movement coordinate position of wafer stage WST in the XY plane and the minute rotation amount by yawing are measured by wafer interferometer system IFW. This interferometer system IFW irradiates a moving mirror MRw fixed to wafer table WTB of wafer stage WST with a laser beam for length measurement from a laser light source (not shown), and reflects the reflected light and predetermined reference light. The coordinate position and minute rotation amount (yaw amount) of wafer stage WST are measured by interference. On the wafer table WTB, the outer shape is formed in a rectangular shape, and a water repellent plate PT in which an opening (circular opening) PTa having an inner diameter slightly larger than the outer diameter of the wafer W is formed at a substantially central portion thereof. It is provided so as to be exchangeable as appropriate. The surface of the water repellent plate PT is subjected to water repellent treatment (water repellent coating) using a fluorine-based material or the like.

  Although not shown in FIG. 1, a center table CT1 (see FIG. 2 or FIG. 4) that can move up and down in the vertical direction (Z direction) is provided at the center of the wafer holder WH. The center table CT1 is a vertical movement mechanism for carrying the wafer W in and out of the wafer stage WST (wafer holder WH). At the tip position, the top dead center above a predetermined delivery position described later and the wafer of the wafer holder It is configured to be positioned at an arbitrary position between the bottom dead center below the W mounting surface, and a suction port for suctioning the wafer W at a negative pressure is disposed at the center thereof.

  An off-axis type alignment sensor ALG for measuring position information of a wafer mark (alignment mark) formed on the wafer W is provided on the side of the projection optical system PL. In this embodiment, the alignment sensor ALG irradiates the target mark with broadband detection light that does not sensitize the resist on the wafer W, and receives the image of the target mark received on the light receiving surface by the reflected light from the target mark; An image of an index (not shown) (an index mark on an index plate provided in the sensor) is captured by an image sensor (camera) such as a two-dimensional CCD (Charge Coupled Device), and the image signals are output. An image processing type FIA (Field Image Alignment) type sensor is used. The measurement result by the alignment sensor ALG is supplied to a control device CNT that controls the exposure apparatus as a whole.

  On the wafer table WTB of the wafer stage WST, a reference plate FMB used for calibration of an AF sensor provided in the AF mechanism, measurement of a baseline amount, and the like is attached. On the surface of the reference plate FMB, a reference mark (fiscal mark) that can be detected by the alignment systems OB1 and OB2 and other marks are formed together with the mark of the reticle R. The AF sensor is a sensor that measures the amount of deviation of the surface of the wafer W from the image plane of the projection optical system PL. The baseline amount is an amount indicating the distance between the reference position (for example, the center of the pattern image) of the reticle pattern image projected onto the wafer W and the center of the visual field of the alignment sensor ALG.

  Since this exposure apparatus is a liquid immersion type, a liquid supply nozzle SUN constituting the liquid immersion mechanism is opposed to the liquid supply nozzle SUN constituting the liquid immersion mechanism in the vicinity of the front end portion on the image plane side (wafer W side) of the projection optical system PL. A liquid recovery nozzle REN is provided. The liquid supply nozzle SUN is connected to a liquid supply apparatus (not shown) via a supply pipe, and a recovery pipe connected to a liquid recovery apparatus (not shown) is connected to the liquid recovery nozzle REN. As the liquid, for example, ultrapure water that transmits ArF excimer laser light (wavelength 193 nm) is used. The refractive index n of water with respect to ArF excimer laser light is approximately 1.44. In this water, the wavelength of the illumination light (exposure light) EL is shortened to 193 nm × 1 / n = about 134 nm. The control device CNT appropriately controls the liquid supply device and the liquid recovery device to supply the liquid (pure water) from the liquid supply nozzle SUN and recover the liquid from the liquid recovery nozzle REN, whereby the projection optical system PL A certain amount of liquid Lq is held between the wafer W and the wafer W. In addition, this liquid Lq is always changing.

  The above-described reticle stage RST, projection optical system PL, alignment sensor ALG, and the like are supported by the main body column MCL. The main body column MCL is supported, for example, on a frame caster FC disposed on the floor of a semiconductor factory via a plurality (here, three) active vibration isolation tables AVS (only two are shown in the figure). . Wafer stage WST described above is supported on a wafer base WBS integrally provided on main body column MCL via a plurality of columns SCL. The main body column MCL is provided with a displacement sensor (not shown) such as an electric level or an optical tilt angle detector.

Each of the active vibration isolator AVS includes a mechanical damper that can withstand heavy weight such as an air damper or a hydraulic damper, and an electromagnetic damper that includes an electromagnetic actuator such as a voice coil motor, and is detected by a displacement sensor. The electromagnetic dampers in the three active vibration isolator AVS are driven so that the inclination angle of the main body column MCL with respect to the horizontal plane is within an allowable range, and the pneumatic or hydraulic pressure of the mechanical damper is driven as necessary. Etc. are controlled. In this case, the high frequency vibration from the floor is attenuated by the mechanical damper before being transmitted to the exposure main body, and the remaining low frequency vibration is attenuated by the electromagnetic damper.

[Wafer transfer equipment]
FIG. 2 is a plan view showing a configuration of a wafer transfer apparatus as an object transfer apparatus according to an embodiment of the present invention. The wafer transfer device WL is a wafer carrier (wafer cassette) WC carried into a predetermined FOUP position P1, a resist coating device (coater) that performs a resist coating process that is a processing step before the exposure device, or a subsequent processing step. Wafer (object, substrate) as a transfer target between a carry-in / out position P2 with respect to a developing device (developer) that performs a certain developing process and a predetermined delivery position P4 with respect to the wafer stage WST of the exposure device (exposure main body) EX It is a device that transports W.

  The wafer transfer device WL is housed in a wafer loader chamber (not shown), and on the wafer loader base WLB, a loading / unloading table unit 110, a load robot 120, a cooling unit 130, a load slider 140, an unload slider 150, an unload slider 150, A load robot 160 and a water removal unit (not shown) for removing the immersion exposure liquid remaining on the wafer, which are provided at a position P6 as necessary, are arranged. The carry-in / out table unit 110 is provided with a first pre-alignment unit, the cooling unit 130 is provided with a second pre-alignment unit, and the delivery position P4 is provided with a third pre-alignment unit. In the wafer loader chamber, a gas (here, air) whose temperature is adjusted to a predetermined temperature is supplied through a duct from an air conditioner attached to the exposure apparatus EX.

  Although the detailed illustration of the carry-in / out table unit (inline table) 110 is omitted, the carry-in / out table unit (inline table) 110 has two upper and lower tables on which the wafers W are respectively mounted, and the upper stage is fed from a resist coating apparatus (not shown). The lower table is a table for delivering the wafer W to a developing device (not shown). The carry-in / out table unit 110 is provided with a first pre-alignment unit.

In the first pre-alignment unit, first pre-alignment is performed in which the outer shape is detected while rotating the wafer W, and the orientation of the center and notch (or orientation flat) of the wafer W is roughly measured. The first pre-alignment section is provided above the upper table 111 and the turntable 112 that can be moved up and down and rotated in a state of passing through a through hole formed in the center of the upper table 111 of the carry-in / out table unit 110. A line sensor (line CCD sensor) S11 for detecting the outer shape is provided.

  The load robot 120 includes a first arm 122 whose one end is rotatably attached to the robot base 121, a second arm 123 whose one end is rotatably attached to the other end of the first arm 122, and a second arm 123. This is a scalar-type multi-joint robot configured to include a hand portion 124 having a base end portion rotatably attached to the other end side of the two arms 123.

The robot base 121 is supported by a Z-axis unit 127 so as to be slidable in the Z-axis direction (vertical direction). A predetermined range in the Z-axis direction is provided by a drive unit including a servo motor and a linear encoder provided in the Z-axis unit 127. It can be positioned at any position. Each of the connecting parts of the robot base 121, the first arm 122, the second arm 123, and the hand part 124 is provided with a drive part including a servo motor and a rotary encoder. The part 124 can be positioned at an arbitrary position in an arbitrary posture.

  The hand portion 124 has a pair of finger portions 125a and 125b on the tip side thereof, and suction grooves that supply negative pressure for vacuum-sucking the wafer W in the vicinity of the tip portions of the finger portions 125a and 125b. 126a and 126b are arranged. The finger parts 125a and 125b of the hand part 124 are configured to be asymmetrical so that the length of the other finger part 125b is shorter than the one finger part 125a. Such an asymmetrical configuration is due to the asymmetry of fingers 165a and 165b of the hand unit 164 of the unload robot 160, which will be described later, and the posture and direction of movement of the hand units 124 and 164 when the wafer W is delivered. This is to prevent interference with each other when the wafer W is delivered. The suction grooves 126a and 126b are formed so that the outer wall portions thereof are slightly high so that the back surface of the wafer W does not come into contact with the finger portions 125a and 125b when the wafer W is held, and the negative pressure supply pipe on the back surface side. The wafer W is sucked and held by vacuum suction through a hole (not shown) communicated with. Here, the suction grooves 126a and 126b are formed in an arc shape so that the sides facing each other are concave.

  The cooling unit 130 improves the overlay accuracy (the overlay accuracy of the pattern formed on a layer on the wafer W and the pattern formed thereafter) to approximately the temperature at which the wafer W is exposed by the exposure apparatus EX. This is a unit for cooling (temperature control) to the same temperature. The cooling unit 130 includes a temperature-controlled cool plate 131, and the temperature of the entire surface of the wafer W is adjusted to a predetermined temperature by placing the wafer W on the cool plate 131 for a predetermined time. It is.

The cooling unit 130 includes an elevating device having three pin members 132 that are radially provided equally to the center of the cool plate 131 in order to receive the wafer W to be temperature-controlled from the load robot 120. . The lifting device receives the wafer W, which is separated from the cool plate 131 at the position P3 by the load robot 120 and is loaded upward, by raising the pin member 132, and lowers the pin member 132 after the load arm 120 is retracted. Thus, the wafer W is placed on the upper surface of the cool plate 131. The wafer W whose temperature has been adjusted by the cool plate 131 is raised by the pin member 132 and transferred to a slider arm 143 to be described later. At the tip of each pin member 132, a suction port (not shown) for vacuum-sucking the wafer W is formed.

  The cooling unit 130 is provided with a second pre-alignment unit, where second pre-alignment is performed. For this reason, imaging devices S21, S22, and S23 including a two-dimensional CCD camera or the like for imaging three predetermined positions on the peripheral edge of the wafer W are provided above the cool plate 131.

In addition, illumination devices (here, organic EL light emitters) EL21, EL22, and EL23 that supply illumination light to the imaging devices S21, S22, and S23 are illuminated from below through through holes formed in the cool plate 131. It is provided to do. Three locations on the outer periphery of the wafer W positioned at the position P3 are respectively imaged by the imaging devices S21, S22, and S23, and based on the imaging results (position error and rotation error with respect to a predetermined reference), the cooling unit 130 is entirely A fine adjustment table (not shown) supported on the substrate is driven and rotated slightly, and moved in the X and Y directions to align the center position and rotation position of the wafer W with the predetermined reference. It is.

  The load slider 140 includes a slider arm (load slider arm) 143 attached to a slider 142 slidable along the guide 141, and the slider arm 143 includes the cooling unit 130 and the second pre-alignment unit. The position is moved back and forth between the position P3 and a predetermined delivery position P4 with respect to the exposure apparatus EX of the wafer stage WST.

The detailed configuration of the main part of the load slider 140 is shown in FIGS. The guide 141 has a concave cross section, and a linear motor LM including a stator and a mover is inserted and disposed along the groove in the groove inside the guide 141. The slider 142 is fixed to the mover of the linear motor LM and is driven by the linear motor LM. The position of the slider 142 is detected by the linear scale LS attached to the side surface of the guide 141 and the encoder (photo sensor) EC attached to the slider 142, and the slider 142 can be positioned at any position along the guide 141. ing.

  A heat sink 147 supported via a plurality of discrete heat insulating members (for example, heat insulating washers) 148 is provided on the slider 142, and a slider arm 143 is attached on the heat sink 147. As an example, the heat sink 147 is formed of aluminum having high thermal conductivity and light weight, and a refrigerant (for example, pure water, hydrofluoroether, etc.) is circulated through the supply pipe 147a and the recovery pipe 147b. It has a flow path.

  The slider arm 143 includes a hand portion 143a as an upper plate portion for holding the wafer W, a lower plate portion 143b attached to the heat sink 147, and a side plate portion 143c that interconnects the hand portion 143a and the lower plate portion 143b. Are integrally formed in a substantially U-shape. The hand part 143a has a pair of finger parts 145a and 145b, and each finger part 145a and 145b is provided with a pair of suction grooves 146a and 146b for vacuum-sucking the wafer W to be transferred. The suction grooves 146a and 146b have a slightly higher outer wall so that the back surface of the wafer W does not come into contact with the hand portion 143a when holding the wafer W, and communicate with the negative pressure supply pipe on the back surface side. The wafer W is sucked and held by vacuum suction through the hole (not shown).

  The hand unit 143a is provided with three illumination devices EL1, EL2, and EL3. Each illuminating device EL1, EL2, EL3 is comprised from the organic EL (Electro Luminescence) light-emitting body, and is provided in the recessed part formed in the hand part 143a. Such an organic EL light emitter is used as the lighting devices EL1, EL2, and EL3 because the organic EL light emitter uses a phenomenon that emits light when a voltage is applied to the phosphor, and hardly generates heat. Because it is thin and lightweight, there is little influence of heat on the hand portion 143a, and the weight of the hand portion 143a can be reduced, which is advantageous.

  These illuminating devices EL1, EL2, and EL3 have three imaging devices S1 including a two-dimensional CCD camera and the like that are supported and fixed to the main body column MCL of the exposure device EX in a state where the hand portion 143a is positioned at the delivery position P4. , S2 and S3 are opposed to each other, and the illumination light from the paired illumination devices EL1, EL2 and EL3 is received by the imaging devices S1, S2 and S3, and held by the hand unit 143a. The wafer W positioned at the delivery position P4 or three predetermined positions on the peripheral edge of the wafer W after being transferred from the hand portion 143a to the center table CT1 of the wafer stage WST can be imaged.

  In the present embodiment, three illumination devices EL1, EL2, and EL3 are provided corresponding to the three imaging devices S1, S2, and S3 provided in the main body column MCL of the exposure apparatus EX. However, in order to correspond to each size of the wafer W to be handled (for example, a 12-inch wafer, an 8-inch wafer, etc.), when a plurality of imaging devices are further provided, they are indicated by reference numerals EL4, EL5, and EL6 in FIG. As described above, a plurality of illumination devices can be provided corresponding to these imaging devices. Here, the wafer W to be handled is a wafer having a notch (V-shaped notch) formed in a part of the peripheral portion thereof, but in the case of a wafer having an orientation flat (a notch on a straight line). The image pickup devices S1, S2, S3 and the illumination devices EL1, EL2, EL3 (or EL4, EL5, EL6) are arranged at positions corresponding to the case (two locations on the orientation flat and one on the other peripheral portion. ). In FIG. 4, CT1 is a center table provided at the central portion of wafer holder WH of wafer stage WST so as to be movable up and down, and a negative pressure for vacuum suction holding wafer W on the front end surface of center table CT1. A plurality (three in this case) of suction holes BH are provided.

  The unload slider 150 includes a hand portion 153 attached to a slider 152 that can slide along the guide 151. The hand portion 153 has a pair of finger portions 155a and 155b arranged asymmetrically, and suction pins 156a, 156b, and 156c for vacuum-sucking the wafer W to be transferred are provided on the finger portions 155a and 155b. Is provided. The suction pins 156a, 156b, and 156c are formed so that the outer wall portions thereof are slightly high so that the back surface of the wafer W does not come into contact with the finger portions 155a and 155b when the wafer W is held. The wafer W is sucked and held by vacuum suction through a hole (not shown) communicated with the supply pipe. The slider 152 is driven by a drive unit having a linear motor and a linear encoder (not shown), and the hand unit 153 has a delivery position P4 with the wafer stage WST and a delivery position P5 with the hand unit 164 of the unload robot 160. It is designed to move back and forth between them.

  The unload robot 160 has a first arm 162 whose one end is rotatably attached to the robot base 161, a second arm 163 whose one end is rotatably attached to the other end of the first arm 162, and The second arm 163 is a scalar type multi-joint robot configured to include a hand portion 164 whose base end portion is rotatably attached to the other end side of the second arm 163. Each of the connecting portions of the robot base 161, the first arm 162, the second arm 163, and the hand unit 164 is provided with a drive unit including a servo motor and a rotary encoder. The part 164 can be positioned at an arbitrary position in an arbitrary posture.

  The hand portion 164 has a pair of finger portions 165a and 165b on the tip side thereof, and an adsorption groove for supplying a negative pressure for vacuum-sucking the wafer W in the vicinity of the tip portions of the finger portions 165a and 165b. 166a and 166b are arranged. The finger parts 165a and 165b of the hand part 164 are configured so as to be asymmetrical. Here, the length of the other finger portion 165b is shorter than that of the one finger portion 165a, and the shape formed such that the longitudinal direction of the finger portion 165a and the longitudinal direction of the finger portion 165b are oblique to each other. Have. The paired fingers 165a and 165b are made asymmetrical in the left and right directions because the fingers 125a and 125b in the hand portion 124 of the load robot 120 and the wafer portions W of the hand portions 124 and 164 are delivered. The wafer W is related to the asymmetry of the finger portions 155a and 155b of the hand portion 153 of the unload slider 150 and the posture and the traveling direction of the hand portions 153 and 164 when the wafer W is delivered. This is in order not to interfere with each other when handing over. The suction grooves 166a and 166b are formed so that the outer wall portions thereof are slightly high so that the back surface of the wafer W does not come into contact with the finger portions 165a and 165b when the wafer W is held. The wafer W is sucked and held by vacuum suction through a hole (not shown) communicated with. Here, the suction grooves 166a and 166b are formed in a straight line so as to be parallel to each other.

  Next, the transfer operation of the wafer W in the transfer device WL will be described. When processing the wafer W accommodated in the wafer carrier WC carried into the FOUP position P1, the wafer W in the wafer carrier WC is taken out by the load robot 120, and the carry-in / out table unit 110 is installed. Is transported to the position P2 and placed on the upper table 111.

Further, when processing the wafer W carried inline from the resist coating apparatus, the wafer W is placed on the upper table 111 by the transfer device of the resist coating apparatus. The carry-in / out table unit 110 is provided with a first pre-alignment unit, where first pre-alignment is performed. The first pre-alignment is performed to detect the position and eccentricity of the notch of the wafer W and correct the position and rotation. The wafer W placed on the upper table 111 is transferred onto the turntable 112 when the turntable 112 is raised, and is sucked and held on the turntable 112 by the sucking function of the turntable 112.

  Next, the turntable 112 is rotated, and the outer shape and notch portion (or orientation flat portion) of the wafer W are detected by the line CCD sensor S11. The deviation in the rotation direction of the wafer W is corrected by stopping at the position where the turntable 112 is rotated so as to cancel the deviation, and the deviation in the center position is corrected when the wafer W is taken out by the load robot 120. This is solved by correcting the position of the hand portion 124 of the road robot 120. The wafer W for which the first pre-alignment has been completed is taken out by the load robot 120, transferred to the delivery position P3 with the cooling unit 130, and transferred onto the three pin members 132 (hereinafter also referred to as the center table 132) that have been lifted. It is.

  Next, the second pre-alignment is performed by the second pre-alignment unit provided in the cooling unit 130. In other words, the illumination devices EL21, EL22, and EL23 provided in the cooling unit 130 are irradiated with illumination light, and the imaging device S21, S22, and S23 capture images of predetermined three locations on the peripheral edge of the wafer W. Based on the result, an error relative to a predetermined reference of the center position and the rotation position of the wafer W is detected. These errors are corrected by driving a fine adjustment table (not shown) that finely adjusts the position and rotation of the cooling unit 130.

  The wafer W for which the second pre-alignment has been completed is placed on the upper surface of the cooling plate 131 when the center table 132 is lowered, and is placed on the cooling plate 131 for a predetermined time. Is adjusted to a predetermined temperature uniformly over the entire surface. When the cooling of the wafer W is completed, the slider arm 143 is lifted after the center table 132 is lifted while the slider arm 143 of the load slider 140 is waiting in advance at a predetermined standby position on the −Y axis direction side. Is moved forward (moved in the + Y-axis direction) to a predetermined delivery position P3 and stopped. Thereafter, the center table 132 is lowered in a state where the suction holding by the center table 132 is released, and the temperature-controlled (cooled) wafer W is transferred to the slider arm 143. Next, it is transported in the + Y-axis direction by the load slider 140 and transported to the delivery position P4 with the wafer stage WST.

  A third pre-alignment unit is provided at the delivery position P4 of the wafer W between the wafer stage WST and the slider arm 143. The third pre-alignment unit includes imaging devices S1, S2, S3 supported by the main body column MCL of the exposure apparatus EX, and illumination devices EL1, EL2, EL3 provided on the arm slider 143. In the third pre-alignment unit, the wafer W before being transferred from the slider arm 143 to the center table CT1 of the wafer stage WST (that is, held by the slider arm 143), and after being transferred (that is, to the center table CT1) Pre-alignment is performed for each wafer W held. Hereinafter, for convenience, pre-alignment before the wafer W is transferred to the center table CT1 is referred to as third pre-alignment, and pre-alignment after the transfer is referred to as fourth pre-alignment.

  6 to 9 are views showing how the wafer W held by the slider arm 143 and positioned at the delivery position P4 is delivered to the wafer stage WST. First, as shown in FIG. 6, the third pre-alignment is performed in a state where the slider arm 143 holding the wafer W is positioned at the delivery position P4.

In the third pre-alignment, predetermined three locations on the peripheral edge of the wafer W held by the slider arm 143 are placed on the illumination devices EL1, EL2, EL3 provided on the arm slider 143 and the main body column MCL of the exposure device EX. The wafer is imaged by cooperating with the supported imaging devices S1, S2, and S3 (that is, the illumination devices EL1, EL2, and EL3 emit light, and image detection is performed by the imaging devices S1, S2, and S3), and the wafer An error with respect to a predetermined reference for the center position and the rotation position of W is detected.

  At this time, as shown in FIG. 5, the illumination light is emitted from the bottom to the top by the illumination device EL1, and the light passing through a part of the peripheral edge of the wafer W is imaged by the imaging device S1. The same applies to other imaging locations. Thus, by performing transmission illumination that illuminates the imaging device from the opposite side across the wafer W, compared to reflected illumination that illuminates the wafer W from above and receives the reflected light, It is possible to detect the edge of the wafer W more accurately.

Next, the center table CT1 starts to rise after performing a minute movement in the XY plane and a minute rotation around the Z axis of the wafer stage WST so as to cancel the error detected by the third pre-alignment. At the time of the ascent, the center table CT1 ascends while being sucked through a suction hole provided on the center table CT1. At this time, the adsorption of the wafer W by the slider arm 143 is released. Next, as shown in FIG. 7, the ascent of the center table CT1 is stopped while the front end surface of the center table CT1 is positioned slightly above the upper surface of the slider arm 143 (the upper surfaces of the suction grooves 146a and 146b). Then, the wafer W is sucked and held by the center table CT1.

  If the wafer W is attracted and held by the center table CT1, then the fourth pre-alignment is performed. In the fourth pre-alignment, the arm slider 143 is provided with three predetermined positions on the peripheral edge of the wafer W held by the center table CT1 in a state where the slider arm 143 is kept at the delivery position P4 without being retracted. The imaging devices S1, S2, and S3 supported by the illumination devices EL1, EL2, and EL3 and the imaging device S1, S2, and S3 supported by the main body column MCL of the exposure device EX cooperate with each other, and the center position and the rotation position of the wafer W are predetermined. An error relative to the reference is detected.

  The center position error and rotation error of the wafer W measured by the fourth pre-alignment can be corrected by minute movement of the wafer stage WST (that is, addition to the target value of stage movement) and minute rotation. However, if it is not preferable to perform the exposure process while the wafer stage WST is rotated, this rotation error may be corrected by a minute rotation of the reticle R during exposure.

Further, the minute movement and minute rotation performed to correct the position error and the rotation error related to the third pre-alignment result by the wafer stage WST, which were performed before the fourth pre-alignment, are also described in the fourth embodiment. When the stage WST moves to the target position after pre-alignment, it is returned to its original position. The operation for returning the minute movement and minute rotation performed to correct the position error and rotation error related to the third pre-alignment result is performed before the fourth pre-alignment described above. May be.

Next, as shown in FIG. 8, the slider arm 143 is retracted and the center table CT1 is lowered, and the center table CT1 immediately before the wafer W is placed on the wafer stage WST (wafer holder WH). By releasing the suction holding of the wafer W and further lowering the center table CT1, the wafer W is placed on the wafer stage WST as shown in FIG.

  Next, on wafer stage WST, wafer W is sucked and held by wafer holder WH, transferred to a predetermined exposure position by wafer stage WST, and search alignment and fine alignment for measuring a mark on wafer W by alignment sensor ALG are performed. After that, the image of the pattern of the reticle R is exposed and transferred onto the wafer W by the exposure apparatus EX. When the exposure process for wafer W is completed, wafer stage WST is moved and positioned again at delivery position P4. The wafer W for which the exposure processing has been completed is transferred to the unload arm 153 of the unload slider 150 via the center table CT1.

  Next, the wafer W is transferred by the unload slider 150 to the delivery position P5 with the unload robot 160, and is transferred to the hand unit 164 of the unload robot 160. When the wafer W transferred to the hand unit 164 of the unload robot 160 is transferred to the position P6 and a water removal unit is provided at the position P6, the load robot is removed after moisture on the wafer W is removed. It is transferred to the hand portion 124 of 120 and is transferred by the load robot 120 to the inside of the wafer carrier WC installed at the hoop position P1 or to the lower table for unloading to the developing device of the loading / unloading table unit 110 at the position P2. Is done.

  According to the embodiment described above, the first pre-alignment unit provided in the carry-in / out table unit 110, the second pre-alignment unit provided in the cooling unit 130, and the third pre-position provided at the delivery position P4 with the exposure apparatus EX. In the alignment unit, the first to third pre-alignments are performed, and the position and rotation error generated in the wafer W accompanying the transfer of the wafer W and other processes in the wafer transfer device WL are corrected at the respective positions. The position and rotation error at the time of transferring the wafer W to the center table CT1 of the wafer stage WST can be made extremely small, and good throwing reproducibility can be realized.

  As described above, although the position and rotation errors of the wafer W are extremely reduced by the first to third pre-alignments, the slider arm 143 that passes the wafer W to the center table CT1 is connected to the wafer loader base WLB via the load slider 140. On the other hand, the center table CT1 that receives the wafer W is supported by the frame caster FC via the wafer stage WST, the main body column MCL, and the vibration isolator AVS, and vibration transmission between them is completely separated. (That is, each has a separate vibration system).

This is an inevitable configuration because exposure accuracy is adversely affected when vibration is transmitted from the wafer transfer device WL having various drive units to the exposure apparatus EX. For this reason, the wafer W is transferred from the slider arm 143 to the center table CT1, and the vibration state of the two at that time is not constant, and the wafer W after being transferred to the center table CT1 has a difference in the vibration state. It is impossible to prevent the occurrence of position and rotation errors.

  Therefore, in the present embodiment, in addition to performing the third pre-alignment before delivering the wafer W to the wafer stage WST at the delivery position P4 of the wafer W with respect to the exposure apparatus EX, the wafer W is moved to the center table CT1 of the wafer stage WST. 4, the fourth pre-alignment is performed, and the position and rotation error of the wafer W generated due to the difference in the vibration state between the slider arm 143 and the center table CT1 is detected and corrected. Yes.

Therefore, in the subsequent measurement of the position of the mark on the wafer W, retry processing, error processing, and the like are not performed without the mark to be measured within the measurement visual field of the alignment sensor ALG. Throughput can be improved.

  Further, illumination devices EL1, EL2, and EL3 are provided on the slider arm 143 that transports the wafer W, and the third and third imaging devices S1, S2, and S3 supported by the body column MCL on the exposure device EX side cooperate with each other. Since the fourth pre-alignment is performed and there is no need to provide a transport device or an illumination device on the exposure apparatus EX side, it is possible to prevent the apparatus configuration of the exposure apparatus EX from becoming complicated.

  Note that, as the imaging devices S1, S2, and S3, the third pre-alignment and the fourth pre-alignment are different from each other in the position of the wafer W in the Z-axis direction. Further, the rotation error based on the third or fourth pre-alignment result may be corrected by slightly rotating the turntable, using the center table CT1 of the wafer stage WST as a turntable that can be slightly rotated. The center table CT1 may be finely moved in the X and Y axis directions, and the position error based on the third or fourth pre-alignment result may be corrected by the minute movement of the center table CT1.

  Further, since the fourth pre-alignment is performed with the center table CT1 raised, a position or rotation error occurs on the wafer W due to an error in the drive mechanism of the center table CT1 as the center table CT1 is lowered. If there is a concern, the offset of the position and rotation error is measured in advance between the position where the center table CT1 is raised and the position where it is lowered, and the wafer stage WST is driven to correct these. The reticle R may be rotated slightly.

  In the above-described embodiment, as illustrated in FIG. 5, the case of the transmitted illumination in which the illumination device EL <b> 1 and the imaging device S <b> 1 are arranged has been described. However, the embodiment is not limited to such a transmitted illumination and is illustrated in FIG. 10. As shown, the reflected illumination may be performed. That is, as shown in the figure, a support member 143d is integrally provided on the slider arm 143 so that the wafer W is held on the support member 143d via the suction groove 146a, and illumination light is irradiated obliquely from above. The illuminating device EL1 is attached as described above. The light reflected by the wafer W is detected by the imaging device S1. In this case, a diffusive reflector as shown by reference numeral 143e in the figure is provided, and the diffused reflector 143e is irradiated with illumination light from the illuminating device EL1, and the light diffused and reflected by the diffuse reflector 143e is irradiated. By detecting by the imaging device S1 through the wafer W, detection similar to that of the transmitted illumination can be performed.

  In addition, as described above, not only the edge measurement of the wafer W but also the alignment mark Ma formed on the wafer W placed on the wafer stage WST as shown in FIG. It is also possible to perform the position measurement of the alignment mark Ma with the imaging device S1 by illuminating from the obliquely upward direction with the illumination device EL1 provided in the imaging device S1.

In FIG. 11, the mark measurement of wafer W placed on wafer stage WST is performed, but the mark on wafer W held on arm slider 143 or held on center table CT1 of wafer stage WST. Of course, the mark on the wafer W may be measured.

  In the above-described embodiment, the second pre-alignment unit provided in the cooling unit 130 captures the illumination light from the illumination devices EL21, EL22, and EL23 provided on the cool plate 131 side so as to face each other through the wafer W. The detection is performed by the devices S21, S22, and S23, but the illumination devices EL21, EL22, and EL23 are omitted, and the slider arm 143 is slid to the position P3 and illuminated by the illumination devices EL1, EL2, and EL3 of the slider arm 143. Thus, the peripheral portion of the wafer W may be measured.

  A semiconductor element as a device is obtained by performing a function / performance design of the device, a step of manufacturing a reticle based on the design step, a step of manufacturing a wafer from a silicon material, the exposure apparatus of the above-described embodiment, and the like. It is manufactured through a step of exposing and transferring a reticle pattern to a wafer, a device assembly step (including a dicing process, a bonding process, and a package process), an inspection step, and the like.

  The embodiment described above is described for facilitating understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention. For example, in the above-described embodiment, the case where the present invention is applied to an immersion type step-and-scan type exposure apparatus has been described. However, exposure using a step-and-repeat method, a mirror projection method, a proximity method, a contact method, etc. It is also possible to apply to an apparatus or the like.

  Also, not only semiconductor elements and liquid crystal display elements, but also plasma apparatus, thin film magnetic heads, imaging elements (CCD, etc.), micromachines, exposure apparatuses used for manufacturing DNA chips, etc., and reticles or masks are manufactured. The present invention can also be applied to an exposure apparatus. In other words, the present invention can be applied regardless of the exposure method and application of the exposure apparatus. Furthermore, in the above-described embodiment, the transport apparatus that transports a substrate such as a wafer in the exposure apparatus has been described. However, the present invention is not limited to this, and a transport apparatus or an object that transports an object in an object processing system other than the exposure apparatus. The present invention can be applied to a measuring device that measures the position of the head.

It is a front view which shows typically the whole structure of the exposure apparatus which concerns on embodiment of this invention. It is a top view which shows the structure of the wafer conveyance apparatus which concerns on embodiment of this invention. It is a side view which shows the principal part of the load arm unit of embodiment of this invention. It is a top view which shows the principal part of the load arm unit of embodiment of this invention. It is a sectional side view which shows the principal part structure in the case of the transmitted illumination of embodiment of this invention. It is FIG. (1) which shows the mode of the wafer delivery of embodiment of this invention. It is a figure (the 2) which shows the mode of the wafer delivery of embodiment of this invention. It is FIG. (The 3) which shows the mode of the wafer delivery of embodiment of this invention. It is FIG. (4) which shows the mode of the wafer delivery of embodiment of this invention. It is a sectional side view which shows the principal part structure in the case of the reflective illumination of embodiment of this invention. It is a sectional side view which shows the principal part structure in the case of measuring the mark on the wafer of embodiment of this invention.

Explanation of symbols

  EX ... Exposure device, FC ... Frame caster, vibration isolation device ... AVS, MCL ... Main body column, WST ... Wafer stage, CT1 ... Center table, W ... Wafer, S1, S2, S3 ... Imaging device, WL ... Wafer transfer device, 141 ... guide, 142 ... slider, 143 ... slider arm, 146a, 146b ... suction groove, EL1, EL2, EL3 ... illumination device, LM ... linear motor, WLB ... wafer loader base, P4 ... delivery position.

Claims (13)

  1. A first base member;
    A transport member supported on the first base member and transporting the object while holding it to a predetermined delivery position;
    In order to measure a part of the peripheral edge of the object positioned at the delivery position in cooperation with a detection device supported on a second base member separated from the first base member by vibration transmission. An object conveying apparatus, wherein an illumination device for illuminating a part of the peripheral edge is provided on the conveying member.
  2.   The object transportation device according to claim 1, wherein the illumination device includes an organic EL light emitter.
  3. An exposure apparatus that exposes and transfers a mask pattern onto an object placed on a movable stage,
    An exposure apparatus comprising the object conveying apparatus according to claim 1.
  4.   The exposure apparatus according to claim 3, wherein the delivery position is a position for delivering the object from the transport member to the movable stage.
  5.   5. The exposure apparatus according to claim 3, wherein the detection device detects illumination light from the illumination device in a state where the conveyance member holding the object is in the delivery position. 6.
  6.   The movable stage has a lifting member that lifts and lowers the object between the placement surface of the object and the delivery position spaced from the placement surface, the object is held by the lifting member, and The exposure according to any one of claims 3 to 5, wherein the detection device detects illumination light from the illumination device in a state where the transport member is at the delivery position. apparatus.
  7. A measurement system that measures at least one of the position and orientation of an object positioned at a predetermined measurement position,
    An illumination device that emits measurement light to the object supported on the first member and positioned at the predetermined measurement position;
    A detection device that is supported on a second member from which vibration transmission from the first member is separated and detects the measurement light via the object;
    A measurement system characterized by comprising:
  8.   The measurement system according to claim 7, wherein the illumination device includes an organic EL light emitter.
  9.   The measurement system according to claim 7, wherein the detection device detects the measurement light so as to face the illumination device with the object interposed therebetween.
  10. An object processing system including a processing device that performs predetermined processing on an object, and a transport device that transports the object into the processing device,
    The transfer device
    A first base member;
    A transport member supported on the first base member and transporting the object to a predetermined delivery position in the processing apparatus;
    An illumination device that is provided on the transport member and irradiates measurement light to the object located at the predetermined delivery position;
    The processor is
    A second base member from which vibration transmission is separated from the first base member;
    An object processing system comprising: a detection device which is supported on the second base member and which detects the measurement light emitted from the illumination device and through the object.
  11. A measurement method for measuring at least one of a position and a posture of an object positioned at a predetermined delivery position for delivering the object between a first holding member and a second holding member that move while holding the object, respectively. ,
    Moving the first holding member supported on the first base member to convey the object to the delivery position;
    Transferring the object from the first holding member to the second holding member supported on a second base member separated from the first base member at the delivery position;
    A part of the object held on the second holding member is illuminated by an illumination device provided on the first holding member, and illumination light via the object is supported on the second base member. Detecting with a detection device,
    A measurement method comprising:
  12. The first holding member supported on the first base member and the second base member supported on the second base member from which vibration transmission is separated are moved while holding the object. A measurement method for measuring at least one of a position and a posture of an object positioned at a predetermined delivery position for delivering the object to and from a holding member,
    Moving the first holding member to convey the object to the delivery position;
    Detecting a part of the object held on the first holding member at the delivery position by a detection device supported on the second base member;
    A step of transferring the object from the first holding member to the second holding member at the delivery position after the detecting step;
    A measurement method comprising:
  13.   The detection step includes illuminating a peripheral portion of the object with an illuminating device, and detecting the illumination light using the detecting device disposed opposite to the illuminating device with the object interposed therebetween. The measurement method according to 11 or 12.
JP2006004380A 2006-01-12 2006-01-12 Object conveying apparatus, exposure device, measuring system, object processing system, and measuring method Granted JP2007188987A (en)

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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006004380A JP2007188987A (en) 2006-01-12 2006-01-12 Object conveying apparatus, exposure device, measuring system, object processing system, and measuring method

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009147144A (en) * 2007-12-14 2009-07-02 Tokyo Seimitsu Co Ltd Wafer conveying device and wafer conveying method
JP2018110271A (en) * 2009-05-15 2018-07-12 株式会社ニコン Mobile device, exposure device, device manufacturing method, and method for manufacturing flat panel display

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009147144A (en) * 2007-12-14 2009-07-02 Tokyo Seimitsu Co Ltd Wafer conveying device and wafer conveying method
JP2018110271A (en) * 2009-05-15 2018-07-12 株式会社ニコン Mobile device, exposure device, device manufacturing method, and method for manufacturing flat panel display

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