JP2000306825A - Treatment apparatus, treatment system, discriminating method, and detection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To minimize failures which occurs at heating or cooling of a substrate which is transferred onto a treating plate by quickly detecting whether the substrate is accurately positioned to be substrate placing position on the treating plate. SOLUTION: The temperature of a hot plate 31 becomes lower than a prescribed threshold, when a wafer is accurately positioned to the substrate placing position on the plate 1, but the temperature becomes a threshold when the wafer is not positioned accurately to the substrate placing position on the plate 31. When the temperature of the hot plate 31 reaches the threshold or higher when the water is placed on the plate 31, it is considered that the wafer is riding on a guide 43 and a warning is issued from a loudspeaker or on a displaying section.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus and a processing system which are provided in an apparatus for applying and developing a resist on a substrate, for example, a semiconductor wafer, an LCD substrate, etc., and for appropriately performing a heat treatment on the substrate. , A determination method and a detection method.

[0002]

2. Description of the Related Art In a coating and developing system of this kind,
In general, a resist is applied to a substrate and transferred to an exposure apparatus, the exposed substrate is received from the exposure apparatus, and development processing is performed. In addition, before and after the exposure, the substrate is subjected to a heat treatment. And cooling treatment.

FIG. 23 is a schematic front view of a heat treatment unit for performing a heat treatment on a semiconductor wafer (hereinafter, simply referred to as “wafer”).

[0005] In FIG. 23, reference numeral 101 denotes a hot plate for performing a heat treatment on the wafer W. Proximity pins 1 for holding the wafer W floating on the hot plate 101 are provided on the hot plate 101.
02 and a proximity sheet 102 ′, and a plurality of guides 10 having an inclined surface 104 toward a wafer mounting position 103 substantially at the center on the hot plate 101.
5 is provided so as to surround the wafer mounting position 103.

Further, in this unit, elevating pins (not shown) for transferring the wafer W to and from a transfer device for transferring the wafer W in the system can be protruded and retracted from the surface of the hot plate 101. Are located. Then, the wafer W is received from the transfer device with the elevating pins protruding from the surface of the hot plate 101, lowered, and immersed from the surface of the hot plate 101. Thus, the wafer W is placed on the surface of the hot plate 101.

[0006] At this time, the wafer W cannot be placed at the correct mounting position of the wafer mounting position 103 unless the transfer device transfers the wafer W to the accurate position. Therefore, the guide 105 is provided as described above, and even when the transfer device transfers the wafer W to a position slightly shifted with respect to the elevating pins, the wafer W is accurately positioned at the wafer mounting position 103 via the guide 105. It is guided to the mounting position.

[0007]

However, when the position at which the transfer device transfers the wafer W to the elevating pins is considerably displaced, the wafer W rides on the guide 105, and the heat treatment is not performed accurately. Product failure occurs. The occurrence of such a defect is usually found in a later inspection step, and the positional deviation of the transfer of the wafer W to the elevating pins by such a transport device is not accidental but continuous. Since defects often occur, when a defect is found, a considerable number of defects have already occurred, and the damage is enormous.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and quickly detects a state in which a substrate conveyed on a processing plate is not accurately placed at a substrate mounting position, and performs heating processing and cooling. It is an object of the present invention to provide a technique capable of minimizing defects during processing.

Another object of the present invention is to quickly detect a position of a substrate conveyed on a processing plate from a substrate mounting position,
It is an object of the present invention to provide a technique capable of performing adjustment quickly and accurately.

[0010]

In order to solve the above-mentioned problems, a processing apparatus according to the present invention comprises a processing plate on which a substrate is mounted on a surface, and a heating or cooling process for the mounted substrate; A guide member for guiding a substrate provided on the processing plate so as to surround the upper substrate mounting position, a temperature sensor provided at a predetermined position on the processing plate, and a substrate mounted on the processing plate. Means for determining that an abnormality has occurred when the temperature detected by the temperature sensor does not change by a predetermined amount or more (for example, when the temperature detected by the temperature sensor when a substrate is placed on the processing plate is Means for assuming that the substrate conveyed on the processing plate is not correctly placed at the substrate placing position when the change does not occur for a predetermined amount or more.

When the substrate conveyed onto the processing plate rides on the guide member and deviates from the substrate mounting position, the end of the substrate on the side opposite to the position where the substrate rides on the guide member is flush with the surface of the processing plate. Just by making contact, the substrate floats above the processing plate. On the other hand, for example, in the case of a processing plate that heats a substrate, when the substrate is placed on the processing plate, the processing plate loses heat from the substrate and the temperature temporarily drops. When the substrate floats from the processing plate, the temperature of the substrate when the substrate is placed on the processing plate is lower than when the substrate is accurately placed at the substrate mounting position. Become smaller. The present invention focuses on this point, and when the temperature of the processing plate detected by the temperature sensor when the substrate is mounted on the processing plate does not change by a predetermined amount or more, for example, the substrate conveyed on the processing plate is placed on the substrate. By assuming that it is not correctly placed at the placement position,
The state where the substrate conveyed on the processing plate is not accurately placed at the substrate placing position is quickly detected. Therefore, according to the present invention, it is possible to minimize defects during the heating process and the cooling process.

[0012] The processing apparatus of the present invention has a processing plate on which a substrate is mounted on a surface, and a heating or cooling process for the mounted substrate, and a processing plate on the processing plate surrounding the substrate mounting position on the processing plate. A guide member for guiding the substrate provided on the substrate, a temperature sensor provided at a position separated by a predetermined distance from the center of the substrate mounting position of the processing plate, and a substrate when the substrate is mounted on the processing plate. Means for estimating, based on the temperature detected by the temperature sensor, the position of the substrate conveyed on the processing plate, which is shifted from the substrate mounting position.

When the substrate conveyed onto the processing plate rides on the guide member and deviates from the substrate mounting position, the end of the substrate on the side opposite to the position where the substrate rides on the guide member is flush with the surface of the processing plate. Just by making contact, the substrate floats above the processing plate. On the other hand, for example, in the case of a processing plate that heats a substrate, when the substrate is placed on the processing plate, the processing plate loses heat from the substrate and the temperature temporarily drops. When the substrate floats from the processing plate, the temperature of the substrate when the substrate is placed on the processing plate is lower than when the substrate is accurately placed at the substrate mounting position. The temperature decreases, and such a decrease in temperature differs depending on the position on the processing plate.
For example, in the vicinity of the position where the substrate rides on the guide member and on the opposite side (near the position where the end of the substrate contacts the opposite side to the position where the substrate rides on the guide member), The temperature drop when placed on a plate is different. That is, since the distance between the substrate and the processing plate near the position where the substrate has landed on the guide member is larger than the distance between the substrate and the processing plate on the opposite side, the substrate has landed on the guide member. The temperature drop near the location when the substrate is placed on the processing plate is smaller. The present invention pays attention to this point, and based on the temperature detected by the temperature sensor at a predetermined position of the processing plate when the substrate is mounted on the processing plate, the substrate mounting position of the substrate transferred onto the processing plate By estimating the position of deviation from the substrate, the position of the substrate conveyed on the processing plate can be quickly detected from the substrate mounting position,
The adjustment can be performed quickly and accurately.

[0014] The processing system of the present invention comprises a processing plate on which a substrate is mounted on a surface, and a heating or cooling process for the mounted substrate; and a processing plate on the processing plate surrounding the substrate mounting position on the processing plate. A guide member for guiding the substrate provided on the substrate, a plurality of temperature sensors provided at separate positions on the processing plate, and the temperature sensors detected when the substrate is mounted on the processing plate. Means for estimating, based on the difference in temperature, the position of the substrate transferred onto the processing plate from the substrate mounting position.

In the present invention, when the substrate is placed on the processing plate, the temperature of the substrate conveyed onto the processing plate is determined based on the difference between the temperatures detected by the temperature sensors arranged at different positions on the processing plate. By estimating the shift position from the substrate mounting position, the shift position of the substrate transferred onto the processing plate from the substrate mounting position can be quickly detected, and the adjustment can be performed quickly and accurately. Things.

A processing system according to the present invention has a processing plate on which a substrate is mounted on a surface thereof, and a processing plate for heating or cooling the mounted substrate, and a processing plate on the processing plate surrounding the substrate mounting position on the processing plate. A guide member for guiding the substrate, a temperature sensor provided at a predetermined position on the processing plate, and a temperature detected by the temperature sensor when the substrate is placed on the processing plate. When the above change does not occur, a plurality of processing apparatuses including means for assuming that the substrate conveyed on the processing plate is not correctly placed at the substrate mounting position, and at least a substrate between the processing apparatuses A transfer device for transferring, and when it is considered that the substrate transferred onto the processing plate by one of the processing devices is not accurately placed at the substrate mounting position, the processing by the processing device is performed. Prohibit the rest of the process And means for causing the processing in the apparatus.

In the present invention, when it is considered that the substrate conveyed on the processing plate by one processing apparatus is not correctly placed on the substrate mounting position, the processing by the processing apparatus is prohibited and the remaining The processing is performed by the processing device of the above, so that it is possible to prevent the continuous occurrence of defects due to the heating process or the cooling process. Processing can be continued.

A processing system according to the present invention includes a processing plate on which a substrate is mounted on a front surface, a heating plate or a cooling plate for the mounted substrate, and a processing plate on the processing plate surrounding the substrate mounting position on the processing plate. A guide member for guiding the substrate, a temperature sensor provided at a predetermined position on the processing plate, and a temperature detected by the temperature sensor when the substrate is placed on the processing plate. When the above change does not occur, a plurality of processing apparatuses including means for assuming that the substrate conveyed on the processing plate is not correctly placed at the substrate mounting position, and at least a substrate between the processing apparatuses A transfer device for transferring and, when the substrate conveyed onto the processing plate by one of the processing devices is continuously regarded as not correctly placed on the substrate mounting position, the processing device; Prohibit processing by And means for causing the processing at Rino processor.

According to the present invention, when a substrate conveyed onto a processing plate by one processing apparatus is continuously regarded as not being correctly placed at the substrate mounting position, processing by the processing apparatus is prohibited. Then, the remaining processing devices are used to perform the processing, so that it is possible to prevent the continuous occurrence of defects due to the heat treatment or the cooling process, and to stop the system even if such defects occur. The normal processing can be continued without any further processing, and the processing by the processing apparatus is not prohibited when the substrate conveyed onto the processing plate by accident is not accurately placed at the substrate mounting position.

[0020] The processing system of the present invention comprises a processing plate on which a substrate is mounted on a surface, a heating process or a cooling process for the mounted substrate, and a processing plate on the processing plate surrounding the substrate mounting position on the processing plate. A guide member for guiding the substrate, a temperature sensor provided at a predetermined position on the processing plate, and a temperature detected by the temperature sensor when the substrate is placed on the processing plate. When the above change does not occur, a plurality of processing apparatuses including means for assuming that the substrate conveyed on the processing plate is not correctly placed at the substrate mounting position, and at least a substrate between the processing apparatuses A transfer device for transferring, and when it is considered that the substrate transferred onto the processing plate by one of the processing devices is not accurately placed at the substrate mounting position, the processing by the processing device is performed. Marquee on board And means for applying a grayed.

According to the present invention, when a substrate conveyed onto a processing plate by one processing apparatus is regarded as not being accurately placed at the substrate mounting position, marking is performed on the substrate processed by the processing apparatus. The normal processing can be continued without stopping the system even if a failure due to the heating process or the cooling process occurs, and the defective substrate can be easily separated from the normal substrate. Here, the term “marking” includes not only the marking actually applied directly to the board but also the case where marking is performed on a defective board so that it can be distinguished from a normal board on software.

According to the present invention, there is provided a processing plate on which a substrate is mounted on a surface, a heating or cooling process for the mounted substrate, and a processing plate provided on the processing plate so as to surround a substrate mounting position on the processing plate. A method for determining whether a substrate conveyed on the processing plate is accurately placed at the substrate mounting position in a processing apparatus having a guide member for guiding the substrate, Detecting the temperature at the predetermined position, and, when the detected temperature does not change by a predetermined amount or more, assuming that the substrate transported on the processing plate is not accurately placed at the substrate mounting position. And

According to the present invention, there is provided a processing plate on which a substrate is mounted on a surface, and a heat processing or a cooling processing of the mounted substrate, and a processing plate provided on the processing plate so as to surround a substrate mounting position on the processing plate. And a guide member for guiding the substrate, a method of detecting a position of the substrate transported on the processing plate from the substrate mounting position, wherein the predetermined position of the processing plate A step of detecting a temperature; and a step of estimating, based on the detected temperature, a position of the substrate transported on the processing plate from a position at which the substrate is placed.

According to the present invention, there is provided a processing plate on which a substrate is mounted on a surface, a heating process or a cooling process for the mounted substrate, and a processing plate provided on the processing plate so as to surround a substrate mounting position on the processing plate. And a guide member for guiding the substrate, wherein a method of detecting a shift position of the substrate transported on the processing plate from the substrate mounting position, comprising: A step of detecting a temperature, and a step of estimating a shift position of the substrate conveyed onto the processing plate from the substrate mounting position based on a difference between the detected temperatures at the plurality of positions.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the present invention is applied to a resist coating and developing system for applying and developing a chemically amplified resist on a semiconductor wafer will be described below with reference to the drawings.

FIG. 1 is a plan view of the resist coating and developing system according to this embodiment, FIG. 2 is a front view of the resist coating and developing system shown in FIG. 1, and FIG. 3 is a rear view of the resist coating and developing system shown in FIG. FIG. 4 is a front view showing the flow of air in the resist coating and developing system shown in FIG.

As shown in FIG. 1, the resist coating and developing system 1 has a configuration in which a cassette station 10, a processing station 11, and an interface unit 12 are integrally connected. At the cassette station 10,
A plurality of wafers W are loaded into the resist coating and developing system 1 from the outside in units of cassettes C, for example, 25 wafers, and are unloaded from the resist coating and developing system 1 to the outside.
Further, the wafer W is carried in / out of the cassette C. In the processing station 11, various single-wafer processing units for performing predetermined processing on the wafers W one by one in the coating and developing processing steps are arranged at predetermined positions in multiple stages. In the interface section 12, the wafer W is communicated with an exposure apparatus 13 provided adjacent to the resist coating and developing system 1.
Is passed.

In the cassette station 10, a plurality of, for example, four cassettes C are positioned at the positions of the positioning projections 20a on the cassette mounting table 20 in the X direction (in FIG. (Vertical direction). This cassette C arrangement direction (X
Direction) and the wafer transfer device 21 that can move in the wafer W arrangement direction (Z direction; vertical direction) of the wafers W accommodated in the cassette C, is movable along the transfer path 21a, and is selected for each cassette C. Access.

The wafer transfer device 21 is configured to be rotatable in the θ direction.
The alignment unit (ALIM) and the extension unit (EXT) belonging to the multi-stage unit of the third processing unit group G3 on the first side can also be accessed.

In the processing station 11, as shown in FIG. 1, a vertical transfer type transfer device 22 is provided at the center, and various processing units as processing chambers are provided around the transfer device 22.
A plurality of sets or a plurality of sets are multi-tiered to form a processing unit group. In this resist coating and developing system 1, five processing unit groups G1, G2, G
3, G4, G5 can be arranged, the first and second processing unit groups G1, G2 are arranged on the front side of the system, and the third processing unit group G3 is arranged adjacent to the cassette station 10. , The fourth processing unit group G4
Is disposed adjacent to the interface section 12, and a fifth processing unit group G5 indicated by a broken line can be disposed on the back side. The transfer device 22 is configured to be rotatable in the θ direction and movable in the Z direction, and is capable of transferring the wafer W to and from each processing unit.

In the first processing unit group G1, as shown in FIG. 2, two spinner-type processing units for mounting a wafer W on a spin chuck in a cup CP and performing predetermined processing, for example, a resist coating unit (COT) ) And the development processing unit (DEV) are stacked in two stages from the bottom. And like the first processing unit group G1, the second
In the processing unit group G2, two spinner type processing units, for example, a resist coating unit (COT) and a development processing unit (DEV) are stacked in two stages from the bottom.

In the third processing unit group G3, as shown in FIG. 3, an oven-type processing unit for performing a predetermined process by placing the wafer W on a mounting table (not shown), for example, a cooling process for performing a cooling process Unit (COL), an adhesion processing unit (AD) for performing a so-called hydrophobic treatment for improving the fixability of the resist, an alignment unit (ALIM) for positioning, an extension unit (EXT), and a heating processing unit (PR) for pre-baking
EBAKE) and a heat treatment unit (POBAKE) for performing post-baking are stacked in order from the bottom, for example, in eight stages.

Similarly, in the fourth processing unit group G4,
An oven-type processing unit that performs a predetermined process by placing the wafer W on a mounting table, for example, a cooling process unit (COL) that performs a cooling process, an extension / cooling process unit (EXTCOL) that also performs a cooling process, and an extension unit (EXT). , Adhesion processing unit (A
D), a pre-baking heat treatment unit (PREBA)
KE) and a heat treatment unit (PO
BAKE) are stacked in order from the bottom, for example, in eight layers.

As shown in FIG. 1, the interface section 12 has the same dimensions in the depth direction (X direction) as the processing station 11, but has a smaller size in the width direction. As shown in FIGS. 1 and 2, a portable pickup cassette CR and a stationary buffer cassette BR are arranged in two stages on the front side of the interface unit 12, and the peripheral exposure device 24 is arranged on the rear side. Are arranged.

At the center of the interface section 12, a wafer transfer device 25 is provided. Wafer transfer device 2
Numeral 5 moves in the X direction and the Z direction (vertical direction) so that the cassettes CR and BR and the peripheral exposure device 24 can be accessed. The wafer transfer device 25 is configured to be rotatable also in the θ direction, and includes an extension unit (EXT) belonging to the fourth processing unit group G4 on the processing station 11 side, and an adjacent exposure device side. A wafer transfer table (not shown) can also be accessed.

As shown in FIG. 4, a filter 26 is provided above the cassette station 10 and a processing station 11 is provided thereon.
The filter 27 is attached to the upper part of the interface unit 12, and the filter 28 is attached to the upper part of the interface unit 12. These filters share a headspace 29. The upper space 29 communicates with a lower air conditioner (not shown) through a duct (not shown) to remove ammonia and supply clean air of which humidity and temperature are controlled to the upper space 29 from the air conditioner. It is supposed to be. The clean air is blown downward from the upper space 29 through each filter, whereby the down flow of the clean air is reduced to each part 10,
11, 12 are formed.

FIG. 5 is a front view of the above-described heat treatment unit, and FIG. 6 is a plan view thereof.

As shown in FIGS. 5 and 6, a hot plate 31 as a processing plate for heating the wafer W is disposed substantially at the center of the heat processing unit. In the hot plate 31, for example, on the back side of a circular holding plate 32 having a diameter slightly larger than the wafer W, for example, a heating element 33 having substantially the same shape as the holding plate 32, such as a heater or a Peltier element, is attached to the holding plate 32. It is arranged so that it may adhere. The heating element 33 is formed of, for example, a resistor that generates heat when a current flows, and the temperature for the heat treatment is controlled by controlling the current value by the control unit 40 as a control mechanism. ing.

A plurality of, for example, three, through holes 34 are provided between the front and back surfaces of the hot plate 31. In these through holes 34, a plurality of, for example, three support pins 35 for transferring the wafer W are inserted so as to be able to protrude and retract. These support pins 35 are integrally connected on the back side of the holding plate 32 by a connecting member 36 disposed on the back side of the holding plate 32. Coupling member 36
Is connected to a lifting mechanism 37 arranged on the back side of the holding plate 32. Due to the elevating operation of the elevating mechanism 37, the support pins 35 protrude from the surface of the holding plate 32 or sink. The support pins 35 transfer the wafer W to and from the transfer device 22 while protruding from the surface of the holding plate 32. Support pins 3 receiving wafer W from transfer device 22
5 is lowered and immersed in the holding plate 32, whereby the wafer W comes into close contact with the surface of the holding plate 32, so that the wafer W is heated.

A lid 51 is arranged above the holding plate 32 so as to cover the wafer W held by the holding plate 32. The lid 51 can be moved up and down by a lifting mechanism (not shown). In the unit, the wafer W is transferred to and from the transfer device 22 in a state where the lid 51 is lifted and the lid 51 is opened, and is sealed in a state where the lid 51 is lowered and the lid 51 is closed. A space is formed, and heat treatment of the wafer W is performed.

The lid 51 has a structure that is inclined upward substantially toward the center thereof, and an exhaust port 52 is provided substantially at the center, that is, at a position corresponding to the approximate center of the wafer W held by the holding plate 32. Have been. An exhaust device 53 such as a vacuum pump is connected to the exhaust port 52 so that the inside of the sealed space is exhausted.

A shutter member 54 is provided around the hot plate 31 so as to surround the hot plate 31.
Are arranged so that they can appear and disappear. The shutter member 54 is
The hot plate 31 is raised and lowered by a lifting mechanism 55 arranged on the back surface. Further, on the inner wall of the shutter member 54, for example, a large number of ejection holes 56 for ejecting a high-temperature inert gas are provided. Vent hole 56
Is a high-temperature gas supply device 1 for supplying a high-temperature gas to the ejection holes 56.
06. When holding the wafer W on the holding plate 32 and heating the wafer W, the shutter member 54
Protrudes from the surface of the hot plate 31 and the high-temperature gas is ejected from the ejection holes 56 toward the surface of the wafer W held on the holding plate 32.

Here, in order to perform the heat treatment of the wafer W in the heat treatment unit satisfactorily, the wafer W needs to be placed almost at the center on the hot plate 31 with little variation in temperature distribution. The position where the wafer W should be originally placed on the hot plate 31 is called a substrate placing position, and an area 41 surrounded by a dotted line in FIG. 6 is the substrate placing position.

Then, the wafer W is floated on the hot plate 31 without adhering to the hot plate 31,
That is, the proximity sheet 42 ′ for holding the wafer W apart on the hot plate 31 at a predetermined interval so as not to directly contact the hot plate and the wafer W is provided at a plurality of locations on the outer peripheral portion of the substrate mounting position 41, For example, the proximity pins 42 are arranged at six places, and a proximity pin 42 is arranged at the center of the substrate mounting position 41.

The proximity sheets 42 ′ arranged on the outer periphery of the substrate mounting position 41 extend outside the substrate mounting position 41, respectively, and extend to the positions where the respective proximity sheets 42 ′ extend. Are provided with guide guides 43 for guiding the substrates. Therefore, in the present embodiment, six guides 43 are provided at the substrate mounting positions 41.
Is provided on the hot plate 31 so as to surround the hot plate. The guide 43 has, for example, a rectangular cross section and a height (at least the height of at least a substantially vertical portion of the wall surface on the substrate mounting position 41 side) of more than 1 mm, more preferably about 3 mm.

Further, at a position away from the center of the substrate mounting position 41 by a predetermined distance, for example, at a position close to the outer periphery of the substrate mounting position 41, a bottomed plate having a predetermined depth from the back surface to the surface of the hot plate 31 Hole 38 is provided. This hole 38
(The position closest to the surface of the holding plate 32 in the hole 38)
Is provided with a temperature sensor 39 which is, for example, a thermocouple. The detection result by the temperature sensor 39 is transmitted to the control unit 40.
The control unit 40 controls the current to the heating element 33 as a heating mechanism based on the detection result, and detects a wafer W mounting defect described later. Further, a speaker and a display unit (not shown) for issuing an alarm or the like are connected to the control unit 40. At this time, the display unit presents to the worker whether or not to continue the processing as it is, and in accordance with this presentation, the worker instructs the continuation of the work from a keyboard or a display unit also serving as an input unit (not shown). Alternatively, the processing may be interrupted. If the heating process is interrupted, it is possible to immediately correct a displacement between the transport device 22 and the support pin 35 described later. If the processing is continued, the processing can be performed without lowering the throughput in the system. However, in this case, the wafer W having poor heating flows in the system together with the non-defective product. Therefore, when the processing is continued as described above, the wafer W may be marked to indicate that it is defective. As such a marking method, in addition to actually marking the wafer W, the marking may be performed on the defective wafer W so that it can be distinguished from the non-defective product on software.

Next, the operation of the heat treatment apparatus thus configured will be described with reference to FIGS.

First, as shown in FIG. 7, the wafer W is transferred from the transfer device 22 onto the support pins 35 with the support pins 35 protruding from the surface of the hot plate 31.

Next, as shown in FIG. 8, the support pins 35 receiving the wafer W from the transfer device 22 are lowered and immersed in the hot plate 31, whereby the wafer W is placed on the hot plate 31. You. Then, the heat treatment of the wafer W is performed.

Thereafter, when the heating process of the wafer W is completed, the support pins 35 protrude again, and the transfer device 22 receives the wafer W placed on the support pins 35.

FIGS. 7 and 8 show that the transfer of the wafer W between the transfer device 22 and the support pins 35 is performed without displacement, and the wafer W is accurately placed in the substrate mounting position 41 of the hot plate 31. 2 shows an example placed on the screen.

However, as shown in FIG.
When the wafer W is transferred to a position deviated from a desired position (shown by a dotted line) on the support pins 35 when the wafer W is transferred from the support pins 35 to the support pins 35, the support pins 35 are then lowered and hot. When immersed in the plate 31, FIG.
As shown in (2), the wafer W is not accurately placed in the substrate placement position 41 and rides on the guide 43.

FIG. 11 shows a temperature change of the hot plate 31 detected by the temperature sensor 39 during the heating process. FIG. 11 shows a temperature change when the wafer W is accurately placed in the substrate placing position 41 of the hot plate 31 as shown in FIG. 8, and FIG. A temperature change when the user rides on the guide 43 without being accurately placed in the placement position 41 is shown.
As can be seen from FIG.
The temperature change differs between when the wafer W is accurately placed in the substrate mounting position 41 and when the wafer W rides on the guide 43 without being accurately placed in the substrate mounting position 41. Specifically, the temperature of the former temporarily drops more than the latter. This is because the closer the wafer W is placed in the substrate placement position 41, the larger the proximity area between them and the larger the amount of heat taken from the hot plate 31.

Therefore, in the present embodiment, the control unit 40 detects a mounting failure of the wafer W as shown in FIG. 10 based on such a difference in temperature change. That is, the control unit 40 receives the temperature detection result of the hot plate 31 from the temperature sensor 39, and when the wafer W is placed on the hot plate 31, the hot plate 31 is not more than a predetermined threshold. In the example of FIG. 11, when the temperature becomes, for example, 89 ° C. or lower, it is considered that the wafer W is accurately placed in the substrate placing position 41 of the hot plate 31 as shown in FIG. When the wafer W is placed on the hot plate 31, the hot plate 31
In the example of FIG. 11, for example, when the temperature reaches 89 ° C. or higher,
As shown in FIG. 10, it is assumed that the wafer W has not been accurately placed in the substrate placement position 41 and has climbed on the guide 43. When it is determined that the wafer W has run on the guide 43, an alarm is issued from a speaker or a display unit. The predetermined threshold may be the absolute temperature as described above, or may be a temperature lower than the reference temperature based on the temperature of the hot plate 31 before the wafer W is mounted.

As described above, in the heat treatment apparatus of the present embodiment, when the temperature of the hot plate 31 becomes higher than the predetermined threshold when the wafer W is mounted on the hot plate 31, Since it is assumed that the user has got on the guide guide 43 and an alarm is issued from the speaker or the display unit, the state in which the wafer W conveyed on the hot plate 31 is not accurately placed on the substrate placing position 41 can be quickly determined. , And defects in the heat treatment can be minimized. Further, since the temperature sensor 39 is a device conventionally required for controlling the temperature of the hot plate 31, the above-described effect can be obtained without requiring a special hardware configuration.

In this embodiment, the guide W 43 for guiding the wafer W into the substrate mounting position 41 has a rectangular cross section and a height of about 3 mm. The temperature at which the hot plate 31 is lowered when the user rides on the guide 43 without being accurately placed in the placement position 41 becomes smaller. That is, when the wafer W is accurately placed in the substrate placing position 41 of the hot plate 31, and when the wafer W rides on the guide 43 without being accurately placed in the substrate placing position 41. The difference in the temperature drop is larger. Therefore, the difference between these states can be more clearly distinguished, erroneous detection is eliminated, and the adjustment of the threshold value is facilitated. However, in the present invention, as shown in FIG. 12, the guide 43 may have a slope 43a for guiding the wafer toward the inside of the substrate mounting position 41, and the height may be set to 1 mm or less. Of course it doesn't matter. Since the guide 43 has the inclined surface 43a for guiding the wafer, the wafer W can be more reliably guided into the substrate mounting position 41.

Next, another embodiment of the present invention will be described.

Here, as shown in FIG. 13, if the position where the wafer W rides on the guide 43 is different (for example, a wafer W indicated by a solid line and a wafer W indicated by a dotted line in FIG. 13), FIG.
As shown in FIG. 4, the temperature change differs depending on the position on which the wafer W has climbed. For example, the case indicated by the solid line in FIG. 13 (FIG. 14) is indicated by the dotted line in FIG. 13 (FIG. 14).
The temperature change is large compared to. In other words, the former temporarily lowers the temperature more than the latter.

Therefore, in the present embodiment, the control unit 40 estimates the deviation position of the wafer W transferred onto the hot plate 31 from the substrate mounting position 41 based on such a difference in temperature change. Is displayed on the display unit 45, for example. Therefore, for example, the operator can easily correct the displacement between the transport device 22 and the support pins 35 based on the displayed contents. Further, the positional deviation between the transport device 22 and the support pins 35 may be automatically corrected according to the estimated positional deviation.

It is to be noted that the temperature sensors 39 are arranged at a plurality of positions on the hot plate 31, more preferably at three or more positions, for example, as shown in FIG. Then, the position of the shift of the wafer W on the hot plate 31 can be estimated.

Next, still another embodiment of the present invention will be described.

In this embodiment, the present invention is applied to a cooling processing unit in the coating and developing processing system shown in FIGS. FIG. 16 is a front view showing the configuration of the cooling plate in the cooling processing unit, and has substantially the same configuration as the above-described heating processing unit.

That is, as shown in FIG. 16, a cooling plate 61 as a processing plate for cooling the wafer W is disposed substantially at the center of the cooling unit. In the cooling plate 61, for example, many Peltier elements 62 are embedded. The temperature for the cooling process is controlled by controlling the value of the current flowing through the Peltier element 62 by a control unit (not shown).

Between the front surface and the back surface of the cooling plate 61,
The through holes 64 are provided at a plurality of places, for example, three places. In each of these through holes 64, a plurality of, for example, three support pins 65 for transferring the wafer W are inserted so as to be able to protrude and retract. These support pins 65 are connected by a coupling member 66 arranged on the back side of the cooling plate 61.
The cooling plate 61 is integrally connected on the back surface side. The coupling member 66 is connected to an elevating mechanism 67 disposed on the back side of the cooling plate 61. Due to the elevating operation of the elevating mechanism 67, the support pins 65 protrude or sink from the surface of the cooling plate 61. In addition, a lid (not shown) that can be moved up and down is arranged above the cooling plate 61.

The proximity sheets 72 ′ are arranged at a plurality of, for example, six, positions on the outer peripheral portion of the substrate mounting position 71, and are further disposed at the center of the substrate mounting position 71. Proximity sheets 72 ′ arranged on the outer peripheral portion of the substrate mounting position 71 extend outside the substrate mounting position 71, respectively. A guidance guide 73 for guidance is arranged.

A hole 78 having a bottom is provided at a position away from the center of the substrate mounting position 71 by a predetermined distance, and a bottom is provided at the bottom of the hole 78. A temperature sensor 79 is provided at the bottom of the hole 78. The result detected by the temperature sensor 79 is sent to the control unit.

Then, the control unit detects the mounting failure of the wafer W based on the difference in the temperature change of the cooling plate 61. That is, the control unit inputs the temperature detection result of the cooling plate 61 from the temperature sensor 79, and when the wafer W is mounted on the cooling plate 61, the cooling plate 61
Is greater than or equal to a predetermined threshold value, it is assumed that the wafer W is accurately placed in the substrate placement position 71 of the cooling plate 61, and the wafer W is placed on the cooling plate 61. When the temperature of the cooling plate 61 is equal to or lower than the predetermined threshold value, it is assumed that the wafer W has not been accurately placed in the substrate placement position 71 and has climbed onto the guide 73. Then, when it is considered that the wafer W has climbed on the guide 73, the support pins 65 are once moved up and down to float the wafer W from the cooling plate 61, and the support pins 65 are again lowered to place the wafer W on the surface of the cooling plate 61. Thus, an attempt is made to accurately place the wafer W in the substrate placement position 71 of the cooling plate 61. Then, an alarm or the like is issued when the wafer W is not correctly placed in the substrate placement position 71 of the cooling plate 61 even after the retry.

Therefore, in the cooling processing unit according to the present embodiment, defective cooling of the wafer W can be drastically reduced. In particular, in the case of heat treatment, since the heat history up to that point is important, it is very difficult to make a defective product once heat-treated again even if it is heat-treated again. Is not so problematic, it is effective to retry the positioning as in the present embodiment and perform the cooling process again within the correct substrate mounting position 71.

As means for retrying positioning,
For example, a vibration device for applying vibration to the cooling plate 61 may be provided, or the support pin may be configured to move the support pin 35 up and down at least once.

Further, as in the case of the above-described heat treatment unit, the shift position may be estimated in the cooling treatment unit.

Next, another embodiment of the present invention will be described.

Here, as shown in FIG. 17, when dust 80 such as particles adheres to the back surface of the transferred wafer W or dust 80 adheres to the hot plate 31, the above-described guide guide is used. 43, the temperature sensor 3 of the hot plate 31
9 will vary.

As shown in FIG. 18, such a factor is caused by a change in the shape of the wafer W itself, for example, when irregularities such as the sled 81 are generated, as compared with other normal flat wafers W. Temperature sensor 39 for plate 31
This causes variation in temperature detection.

The problem of the temperature processing of the wafer W due to such a factor is that it is not possible to automatically correct the displacement between the transfer device 22 or the support pins 35 and the wafer W automatically. The determination can be made in a sequence as shown in FIG. That is, it is determined whether the temperature detection by the plurality of temperature sensors 39 varies when the wafer W is transferred onto the hot plate 31 (step 82). If the variation amount at this time is equal to or less than a predetermined amount, it can be regarded as normal, and the process ends.

On the other hand, if the variation amount is equal to or more than the predetermined amount, it is abnormal, so the loop process (step 83) is repeated a predetermined number of times. In this repetition, the transfer device 22 or the support pins 35 correct the positional deviation of the wafer W. The operation (step 87) is performed a predetermined number of times, for example, three times (counter value 3).

If the variation in the temperature detection by the plurality of temperature sensors 39 when the wafer W is transferred onto the hot plate 31 during the predetermined number of times becomes equal to or less than a predetermined amount, that is, when the state can be regarded as normal, the counter of the counter is activated. The value is set to 0 (step 85), the positional information for transporting the next wafer W is calibrated and stored based on the displacement of the transport of the wafer W by the transport device 22, and the operation ends.

Further, a loop processing for a predetermined number of times (step 8)
Even if 3) is repeated, if the variation amount is equal to or more than the predetermined amount, that is, a cause due to a factor that the transfer device 22 or the support pins 35 cannot correct the positional deviation of the wafer W (for example, the adhesion of particles as described above) , Or the shape of the wafer W, or a malfunction of the transfer device 22 or the support pins 35), and proceeds to the route 84 to deal with the abnormality (step 88), sets the counter value to 0 (step 85), and ends. .

In the above-described abnormality handling (step 88), for example, an alarm may be issued to an operator or the like as described above. Further, since the processing of the wafer W is substantially incomplete, the wafer W It is preferable that the information is stored as a defect, and that the information is transmitted to the outside by a predetermined means, for example, a display or communication. As a result, the incomplete wafer W can be discharged to the cassette C or the like without being processed in a post-process of this processing, and waste of the processing can be reduced.

Next, another embodiment of the present invention will be described.

The temperature detection by the temperature sensor 39 when the wafer W is transferred onto the hot plate 31 is performed, for example, by referring to FIG.
When the threshold value is, for example, 89 ° C. as shown in FIG.
The case where the detected temperature value exists in the first area 90 is regarded as normal, and the case where the detected temperature value exists in the second area 91 is a factor in which the position shift of the wafer W cannot be corrected by the transfer device 22 or the support pins 35. Is considered to be caused by the above-mentioned factor (the cause of particles and the like as described above), and the case where the detected temperature value exists in the third region 92 is a factor by which the position shift of the wafer W can be corrected by the transfer device 22 or the support pin 35. (For example, when the wafer W rides on the guide 34 or the like).

The difference between the second area 91 and the third area 92 is also proportional to the distance between the hot plate 31 and the wafer W, and the hot plate when the wafer W rides on the guide 34 or the like. Since the distance between the wafer 31 and the wafer W is larger than the distance between the hot plate 31 and the wafer W due to particles or the like, a difference in temperature is generated to some extent.

The temperature sensor 39 in such a region
Each time the transfer device is determined by judging whether the displacement of the wafer W is corrected by the transfer device 22 or the support pins 35 based on the temperature detection value obtained by the method, or whether the position is caused by a factor that cannot correct the position shift of the wafer W. By using the support pins 22 or the support pins 35, it is possible to accurately perform an abnormal response operation without correcting a position shift of the wafer W. This makes it possible to improve the processing throughput or the operation rate of the apparatus.

Next, another embodiment of the present invention will be described.

FIG. 21 shows a plurality of heating elements 33, for example, four heaters H1-H4 of the hot plate 31 in the radial direction.
This is an example in which H4 is provided. Each of the heating elements 33 is provided with one or more temperature sensors 39, and is configured to be able to detect a temperature for each region.

The provision of a plurality of such heating elements 33 can control the in-plane uniformity of the temperature of the wafer W more than in a system provided with one heating element 33.

In such a configuration, when the wafer W is transported onto the hot plate 31, whether the temperature falls below the above-described threshold value or whether the temperature falls in a predetermined region depends on whether the temperature has fallen. The determination may be made based on information of the temperature sensor 39. For example, the total amount of heat generated with respect to the area of each heating element 33 of the hot plate 31 and each heating element 3
It is conceivable that the heat consumption per area of the wafer W corresponding to each of the three heating elements 33H1 to H4 is different for each of the heating elements 33H1 to H4. Therefore, it is preferable to set different areas Z1 to Z4 as shown in FIG. 22 to determine whether the temperature drop point exists in the normal area. These different areas Z1 to Z4 are set, and for each of the Z1 to Z4, FIG.
As described with reference to FIG. 0, an area for determining whether or not the positional deviation of the wafer W is caused by a factor that cannot be corrected may be set.

Further, when a plurality of heat processing units (or cooling processing units) are provided in the resist coating and developing system 1 as in the above-described embodiment, the configuration is as follows.

For example, when it is considered that the wafer W carried on the hot plate by one heat processing unit is not accurately placed on the substrate mounting position, the heat processing by the heat processing unit is prohibited. After that, the heat treatment is performed by the remaining heat treatment units. Thus, it is possible to prevent the failure caused by the heat treatment from occurring continuously, and even if such a failure occurs, it is possible to continue the normal heat treatment without stopping the system.

Further, the prohibition of the heat treatment by such a heat treatment unit may be performed only when it is continuously determined that the wafer W is not correctly placed at the substrate placing position. As a result, it is possible to prevent the continuous occurrence of defects due to the heat treatment, and even if such a defect occurs, the normal heat treatment can be continued without stopping the system, and furthermore, the accidental failure on the hot plate can be prevented. When the wafer W transferred to the substrate is not accurately placed at the substrate placement position, the heating processing by the heating processing unit is not prohibited.

Further, in the above embodiment, the speaker and the display unit are connected to the control unit 40 as means for issuing an alarm or the like. However, the present invention is not limited to this example. The control unit 40 may store the alarm information in a storage medium, for example, a storage memory such as a hard disk or a RAM, or a floppy disk, or may issue the alarm information to a CPU outside the apparatus by a predetermined communication. Is also good.

Further, in the above embodiment, the temperature sensors 39 for detecting the temperatures at a plurality of positions are arranged.
Needless to say, detection may be performed at one place instead of a plurality, and the invention is not limited to such an example.

Further, in the above-described embodiment, an example in which a wafer W is used as a substrate has been described. However, the present invention is not limited to such an example, and can be applied to, for example, an example using an LCD substrate. is there.

[0093]

As described above, according to the present invention,
It is possible to quickly detect, for example, a state in which the substrate conveyed on the processing plate is not accurately placed at the substrate placement position, and to minimize defects during the heating process and the cooling process. Further, according to the present invention, it is possible to quickly detect a shift position of the substrate transferred onto the processing plate from the substrate mounting position, and to perform adjustment quickly and accurately.

[Brief description of the drawings]

FIG. 1 is a plan view of a resist coating and developing system according to an embodiment of the present invention.

FIG. 2 is a front view of the resist coating and developing system shown in FIG.

FIG. 3 is a rear view of the resist coating and developing system shown in FIG. 1;

FIG. 4 is a front view showing a flow of air in the resist coating and developing system shown in FIG.

FIG. 5 is a front view showing the heat treatment unit shown in FIG. 3;

6 is a plan view of the heat treatment unit shown in FIG.

FIG. 7 is an explanatory diagram of an operation (part 1) of the heat treatment unit according to the embodiment of the present invention.

FIG. 8 is an explanatory diagram of an operation (part 2) of the heat treatment unit according to the embodiment of the present invention.

FIG. 9 is an explanatory diagram of an operation (part 3) of the heat treatment unit according to the embodiment of the present invention.

FIG. 10 is an explanatory diagram of an operation (part 4) of the heat treatment unit according to the embodiment of the present invention.

FIG. 11 is a diagram showing a temperature change in a heat treatment unit according to an embodiment of the present invention.

FIG. 12 is an explanatory diagram of a heat treatment unit according to another embodiment of the present invention.

FIG. 13 is an explanatory diagram of a heat treatment unit according to still another embodiment of the present invention.

FIG. 14 is a diagram showing a temperature change in a heat treatment unit according to still another embodiment of the present invention.

FIG. 15 is a plan view of a heat treatment unit according to still another embodiment of the present invention.

FIG. 16 is a front view of a cooling processing unit according to still another embodiment of the present invention.

FIG. 17 is a sectional view of a heat treatment unit according to still another embodiment of the present invention.

FIG. 18 is a cross-sectional view of a heat treatment unit according to still another embodiment of the present invention.

FIG. 19 is a process flowchart illustrating an operation according to an embodiment of the present invention.

FIG. 20 is a diagram showing a temperature change in a heat treatment unit according to still another embodiment of the present invention.

FIG. 21 is an explanatory diagram of a heat treatment unit according to still another embodiment of the present invention.

FIG. 22 is a diagram showing a temperature region in a heat treatment unit according to still another embodiment of the present invention.

FIG. 23 is a schematic front view of a heat treatment unit for explaining a conventional technique.

[Explanation of symbols]

 W wafer 22 transfer device 31 hot plate 35 support pin 39 temperature sensor 40 control unit 41 substrate mounting position 43 guide guide 61 cooling plate 65 support pin 71 substrate mounting position 73 guide guide 79 temperature sensor

Claims (25)

[Claims] 1. A processing apparatus for performing a heat treatment or a cooling treatment on a substrate, wherein the substrate is placed on the surface, a treatment plate for performing a heat treatment or a cooling treatment on the placed substrate, and a substrate placement position on the treatment plate A guide member for guiding the substrate provided on the processing plate so as to surround the processing plate; a temperature sensor provided at a predetermined position on the processing plate; and the temperature sensor when a substrate is placed on the processing plate. Means for determining that an abnormality has occurred when the temperature detected by the apparatus does not change by a predetermined amount or more. 2. The processing apparatus according to claim 1, wherein the abnormality occurrence deeming unit determines that the temperature detected by the temperature sensor when the substrate is placed on the processing plate does not change by a predetermined amount or more. A processing apparatus, wherein a substrate conveyed onto the processing plate is regarded as not correctly placed on the substrate placement position. 3. The processing apparatus according to claim 1, wherein the abnormality occurrence deeming unit determines that the temperature detected by the temperature sensor when the substrate is placed on the processing plate does not change by a predetermined amount or more. A processing apparatus, wherein the substrate is considered to be defective. 4. The processing apparatus according to claim 1, wherein the abnormality occurrence deeming unit determines that the temperature detected by the temperature sensor when the substrate is placed on the processing plate does not change by a predetermined amount or more. A processing apparatus, wherein it is regarded that dust is attached to the substrate. 5. The processing apparatus according to claim 1, wherein said abnormality occurrence deeming means detects a temperature detected by said temperature sensor when said substrate is placed on said processing plate, as a first temperature.
When the temperature is not changed more than the value, it is considered that the substrate conveyed on the processing plate is not accurately placed at the substrate mounting position, and the temperature sensor when the substrate is mounted on the processing plate When the detected temperature does not change by a second value smaller than the first temperature and smaller than the first value, it is considered that the substrate is defective or dust is attached to the substrate. Processing equipment. 6. The processing apparatus according to claim 1, further comprising: means for issuing an alarm when said abnormality occurrence deeming means determines that an abnormality has occurred. 7. The processing apparatus according to claim 1, wherein a plurality of pins are disposed so as to be able to protrude and retract from the surface of the processing plate and transfer the substrate, and the abnormality is regarded as having occurred by the abnormality occurrence determination means. And an immersion means for projecting the pin from the surface of the processing plate and immersing the pin again from the surface of the processing plate. 8. The processing apparatus according to claim 7, wherein the temperature detected by the temperature sensor does not change by more than a predetermined amount after the immersion means projects the pin from the surface of the processing plate and immerses the pin again from the surface of the processing plate. A processing unit for determining that the substrate is defective or that dust is attached to the substrate. 9. The processing apparatus according to claim 1, further comprising: means for applying vibration to the processing plate when the abnormality occurrence deeming means determines that an abnormality has occurred. . 10. The processing apparatus according to claim 9, wherein the processing plate cools a substrate. 11. The processing apparatus according to claim 1, wherein a height of a substantially vertical portion of a wall surface of the guide member on the substrate mounting position side exceeds 1 mm. 12. The processing apparatus according to claim 1, wherein the temperature change detected by the temperature sensor for deeming that the abnormality has occurred by the abnormality occurrence deeming unit is equal to the temperature detected by the temperature sensor. A processing device which is performed by comparing with a predetermined temperature. 13. The processing apparatus according to claim 1, wherein the temperature change detected by the temperature sensor for deeming that the abnormality has occurred by the abnormality occurrence deeming unit is a temperature change of the temperature detected by the temperature sensor. A processing device which is performed by comparing a change with a predetermined change temperature. 14. A processing apparatus for performing a heat treatment or a cooling treatment on a substrate, wherein the substrate is placed on the surface, a treatment plate for performing a heat treatment or a cooling treatment on the placed substrate, and a substrate placement position on the treatment plate A guide member for guiding the substrate provided on the processing plate so as to surround the processing plate; a temperature sensor provided at a predetermined distance from the center of the substrate mounting position of the processing plate; and a substrate on the processing plate. Means for estimating a position of the substrate conveyed on the processing plate, which is shifted from the substrate mounting position, based on a temperature detected by the temperature sensor when the substrate is mounted. apparatus. 15. A processing apparatus for performing a heat treatment or a cooling treatment on a substrate, wherein the substrate is placed on a surface, a treatment plate for performing a heat treatment or a cooling treatment on the placed substrate, and a substrate placement position on the treatment plate. A guide member for guiding the substrate provided on the processing plate so as to surround the processing plate, a plurality of temperature sensors provided at respective different positions on the processing plate, and when a substrate is placed on the processing plate. A processing unit for estimating a position of the substrate conveyed on the processing plate, which is shifted from the substrate mounting position, based on a difference between the temperatures detected by the temperature sensors. 16. The processing apparatus according to claim 15, wherein the temperature sensor is provided at three or more positions on the processing substrate. 17. A processing plate on which a substrate is mounted on a front surface, a processing plate for heating or cooling the mounted substrate, and a substrate provided on the processing plate so as to surround a substrate mounting position on the processing plate. A guide member for guidance, a temperature sensor provided at a predetermined position on the processing plate, and when a temperature detected by the temperature sensor when a substrate is placed on the processing plate does not change by a predetermined amount or more, A plurality of processing apparatuses including means for assuming that the substrate conveyed on the processing plate is not correctly placed at the substrate mounting position; and a transfer for transferring the substrate between at least the processing apparatuses. When the substrate conveyed on the processing plate by one of the processing devices is regarded as not being accurately placed at the substrate mounting position, the processing by the processing device is prohibited and the remaining Let the processing equipment do the processing Processing system characterized by comprising a means. 18. A processing plate on which a substrate is mounted on a surface, a processing plate for heating or cooling the mounted substrate, and a substrate provided on the processing plate so as to surround a substrate mounting position on the processing plate. A guide member for guidance, a temperature sensor provided at a predetermined position on the processing plate, and when a temperature detected by the temperature sensor when a substrate is placed on the processing plate does not change by a predetermined amount or more, A plurality of processing apparatuses including means for assuming that the substrate conveyed on the processing plate is not correctly placed at the substrate mounting position; and a transfer for transferring the substrate between at least the processing apparatuses. And when the substrate conveyed on the processing plate by one of the processing devices is continuously regarded as not correctly placed on the substrate mounting position, the processing by the processing device is prohibited. Processing with the remaining processing equipment Processing system characterized by comprising a means for causing. 19. A processing plate on which a substrate is mounted on a surface, a processing plate for heating or cooling the mounted substrate, and a substrate provided on the processing plate so as to surround a substrate mounting position on the processing plate. A guide member for guidance, a temperature sensor provided at a predetermined position on the processing plate, and when a temperature detected by the temperature sensor when a substrate is placed on the processing plate does not change by a predetermined amount or more, A plurality of processing apparatuses including means for assuming that the substrate conveyed on the processing plate is not correctly placed at the substrate mounting position; and a transfer for transferring the substrate between at least the processing apparatuses. When the substrate conveyed on the processing plate by one of the processing devices is regarded as not being accurately placed at the substrate mounting position, marking is performed on the substrate processed by the processing device. Means to apply Processing system characterized by. 20. A processing plate on which a substrate is mounted on a surface, a processing plate for heating or cooling the mounted substrate, and a substrate provided on the processing plate so as to surround a substrate mounting position on the processing plate. In a processing apparatus having a guide member for guiding, a method for determining whether or not a substrate transported on the processing plate is accurately placed at the substrate mounting position, comprising: Detecting the temperature of the position, and, when the detected temperature does not change by a predetermined amount or more, a step of deeming that the substrate conveyed on the processing plate is not accurately placed at the substrate mounting position A discrimination method characterized by comprising: 21. A processing plate on which a substrate is mounted on a surface, a processing plate for heating or cooling the mounted substrate, and a substrate provided on the processing plate so as to surround a substrate mounting position on the processing plate. A method for detecting a position of a substrate conveyed on the processing plate, which is shifted from the substrate mounting position, in a processing apparatus having a guide member for guiding, wherein a temperature of a predetermined position of the processing plate is determined. A detection method, comprising: a step of detecting; and a step of estimating, based on the detected temperature, a position of a substrate conveyed on the processing plate from a position at which the substrate is placed. 22. A processing plate on which a substrate is mounted on a surface, a processing plate for heating or cooling the mounted substrate, and a substrate provided on the processing plate so as to surround a substrate mounting position on the processing plate. In a processing apparatus having a guide member for guiding, a method of detecting a shift position of a substrate conveyed on the processing plate from the substrate mounting position, wherein a temperature of a plurality of positions of the processing plate is detected. Detecting, based on a difference between the detected temperatures at the plurality of positions, a step of estimating a shift position of the substrate transported on the processing plate from the substrate mounting position, Detection method. 23. A processing plate for heating or cooling the mounted substrate, a sheet for maintaining the processing plate and the substrate at a predetermined distance, and a temperature provided at a predetermined position on the processing plate. A sensor, when the temperature detected by the temperature sensor does not change by a predetermined value or more when the substrate is mounted on the processing plate, it is determined that the temperature is abnormal and / or the substrate is mounted again on the processing plate. A processing device, comprising: a control mechanism for determining. 24. The processing apparatus according to claim 23, wherein the processing plate is provided with a plurality of heat generating mechanisms, each of the heat generating mechanisms is provided with a temperature sensor, and a substrate is mounted on the processing plate. In this case, the allowable range of the temperature detected by each of the temperature sensors is considered to be normal. 25. The processing apparatus according to claim 23, wherein the substrate is displaced by a transfer device and / or a support pin according to a temperature detected by each of the temperature sensors when the substrate is placed on the processing plate. A processing device that determines whether or not the cause is caused by a factor that cannot be corrected.