JP2004273714A - Equipment and method for substrate treatment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide substrate treatment equipment which improves an operating ratio with reduced working manday, and to provide a method for substrate treatment using this. <P>SOLUTION: Long arms 91a and 91b are provided with suction pads 95a to 95j, which are connected with pipings 138a to 138j respectively through connection pipes 139a to 139j. The pipings 138a to 138j are connected with vacuum pumps 136a to 136j. The connection pipes 139a to 139j are provided with pressure sensors 131a to 131j for individually measuring the suction pressure of the suction pads 95a to 95j. Furthermore, the connection pipes 139a to 139j are provided with pressure control valves 135a to 135j for individually adjusting the suction pressure of the suction pads 95a to 95j. Thus, the substrate G can be sucked with vacuum independently by each suction pad. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate processing apparatus and a substrate processing method for processing a glass substrate used for a liquid crystal display device or the like.
[0002]
[Prior art]
In a manufacturing process of an LCD (Liquid Crystal Display) or the like, in order to form a thin film or an electrode pattern of ITO (Indium Tin Oxide) on a glass substrate for the LCD, the same photolithography as that used for manufacturing a semiconductor device is used. Technology is used. In the photolithography technique, a photoresist is applied to a glass substrate, which is exposed and further developed.
[0003]
Such a photolithography technique is conventionally performed using a coating and developing treatment apparatus. The coating and developing apparatus has not only a coating device and a developing device but also a cleaning device and a heating device. This coating and developing apparatus is provided with a removing device adjacent to the coating device for removing the excess resist at the edge of the glass substrate after the resist is applied by the coating device. The coating and developing apparatus has a transfer device for transferring the substrate between the coating device and the removing device.For example, the transfer device can be moved along a linear guide provided across the coating device and the removing device. It is provided in. The transfer device has a holding unit for holding the substrate. In order to prevent the substrate from being displaced on the transfer device during transfer, a suction hole is provided for holding the substrate on the holding unit by a pressure difference (for example, see Patent Document 1). The suction holes are set in advance by performing a simulation based on the size of the substrate and the like.
[0004]
[Patent Document 1]
JP-A-8-281184 (paragraph [0074], FIGS. 1 and 11).
[0005]
[Problems to be solved by the invention]
However, in recent years, the length of two sides of the glass substrate has been increased to, for example, 1.5 m and 1.2 m, so that the held substrate is bent by its own weight. This bending causes the substrate to bend on the holding portion, so that a suction hole that does not suck the substrate is generated, which causes an error. If this is forcibly absorbed, a stress is generated in the substrate, which adversely affects the quality of the substrate. Therefore, it is necessary to correct the position of the suction hole. Since the position correction is performed manually for each substrate, there is a problem that the number of work steps is increased.
[0006]
In view of the circumstances described above, an object of the present invention is to provide a substrate processing apparatus and a substrate processing method using the same, which reduce the number of man-hours and improve the operation rate.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, a substrate processing apparatus according to the present invention includes a holding member that holds at least a part of a peripheral portion of a substrate, and a substrate provided on the holding member, which sucks the substrate with a pressure difference to hold the substrate. And a pressure difference generating mechanism that independently generates the pressure difference for each of the suction units.
[0008]
In the present invention, the pressure difference generating mechanism is configured to generate the pressure difference independently for each suction unit. Thereby, for example, it is possible to stop the generation of the pressure difference in the suction portion that cannot suction the substrate. As a result, no error occurs, and the operation of correcting the position of the suction unit by a human can be eliminated, so that the number of operation steps of the substrate transfer apparatus can be reduced and the operation rate can be increased.
[0009]
In one embodiment of the present invention, the pressure difference generating mechanism includes means for controlling the generated pressure difference for each of the suction units. For example, by variably controlling the pressure difference, the suction state can be kept optimal according to the curved state of each part of the peripheral portion of the substrate.
[0010]
The control means may include a pressure measuring means for measuring a pressure generated in the vicinity of the suction section, and a means for controlling the pressure difference based on a signal obtained by the pressure measuring means. Further, the control means controls the pressure difference based on a signal obtained by the distance measuring means for measuring a distance between the holding member, a predetermined portion of the substrate held by the holding member, and the distance measuring means. And means for performing the operation.
[0011]
With these control means, the suction state in the suction section can be grasped from the measurement result of the pressure or the measurement result of the distance between the holding member and the substrate, and the pressure difference in the suction section can be effectively controlled. For example, when it is determined that the pressure does not reach the predetermined value or when it is determined that the pressure exceeds a predetermined distance, the generation of the pressure difference can be stopped. Of course, it is also possible to control to set the predetermined value stepwise and change the pressure difference for each step.
[0012]
In one embodiment of the present invention, the apparatus further comprises a moving mechanism for moving the holding member, and the control means includes means for controlling the pressure difference based on a speed state of the holding member moved by the moving mechanism. . For example, when the speed is relatively high, the suction force of the substrate can be increased by increasing the pressure difference. If the suction force is increased, it is safe even if the number of suction portions that are sucking the substrate is relatively small.
[0013]
The control means may include means for controlling the pressure difference based on whether the holding member is in an acceleration / deceleration state or a constant speed state.
[0014]
According to such a configuration, for example, in an acceleration / deceleration state, an external force is applied to the substrate, so that the pressure difference is increased, and in a constant velocity state, no external force is applied, so that the pressure difference can be reduced. Thereby, the substrate can be reliably sucked and the displacement can be prevented. An acceleration sensor or the like can be used as a means for detecting the acceleration state and the constant velocity state.
[0015]
A substrate processing method according to the present invention includes a holding member that holds at least a part of a peripheral portion of a substrate, a plurality of suction units provided on the holding member, and that sucks the substrate with a pressure difference to hold the substrate, A processing method for a substrate processing apparatus having a pressure difference generating mechanism for generating the pressure difference independently for each of the suction units, wherein a step of measuring a pressure generated in the vicinity of the suction unit; Controlling the pressure difference generated by the pressure difference generating mechanism based on the pressure. A step of measuring a distance between the holding member and a predetermined portion of the substrate held by the holding member; and controlling the pressure difference generated by the pressure difference generating mechanism based on the measured distance. And a step of performing the above. Further, the method may include a step of moving the holding member, and a step of controlling the pressure difference based on a speed state of the moving holding member.
[0016]
According to these methods, no error occurs, the operation of correcting the position of the suction unit by a human can be eliminated, and the number of work steps of the substrate transfer apparatus can be reduced and the operation rate can be increased.
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0018]
[First Embodiment]
(Coating and developing equipment)
FIG. 1 is a plan view showing an LCD substrate coating and developing apparatus to which the present invention is applied, FIG. 2 is a front view thereof, and FIG. 3 is a rear view thereof.
[0019]
The coating and developing apparatus 1 includes a cassette station 2 on which a cassette C accommodating a plurality of glass substrates G is mounted, and a plurality of processing units for performing a series of processing including resist coating and development on the substrate G. The processing unit 3 includes an interface unit 4 for transferring a substrate G between the exposure unit 32 and the cassette unit 2 and the interface unit 4 at both ends of the processing unit 3.
[0020]
The cassette station 2 includes a transport mechanism 10 for transporting an LCD substrate between the cassette C and the processing unit 3. Then, the cassette C is loaded and unloaded at the cassette station 2. The transport mechanism 10 includes a transport arm 11 that can move on a transport path 12 provided along the direction in which the cassettes are arranged. The transport arm 11 transports the substrate G between the cassette C and the processing unit 3. Done.
[0021]
The processing unit 3 includes an upstream part 3b in which processing units including a resist coating processing unit (CT) are arranged in parallel along the X direction and a downstream part in which processing units including a development processing unit (DEV) are arranged in parallel. 3c is provided.
[0022]
In the upstream portion 3b, an excimer UV processing unit (e-UV) 19 for removing organic substances on the substrate G from the cassette station 2 side and a cleaning process for the substrate G with a scrubbing brush are provided at the end of the cassette station 2 side. And a scrubber cleaning processing unit (SCR) for performing the following.
[0023]
Next to the scrubber cleaning processing unit (SCR), heat treatment system blocks 24 and 25 in which units for performing thermal processing on the glass substrate G are stacked in multiple stages are arranged. The vertical transfer unit 5 is disposed between the heat treatment system blocks 24 and 25, and the transfer arm 5a is movable in the Z direction and the horizontal direction, and is rotatable in the θ direction. The substrate G is transported by accessing each heat treatment system unit in the blocks 24 and 25. The vertical transport unit 7 has the same configuration as the vertical transport unit 5.
[0024]
As shown in FIG. 2, the heat treatment system block 24 includes a two-stage baking unit (BAKE) for performing a heat treatment before applying a resist to the substrate G, and an adhesion unit (AD) for performing a hydrophobic treatment with an HMDS gas. They are stacked in order from the bottom. On the other hand, in the heat treatment system block 25, a cooling unit (COL) for performing a cooling process on the substrate G is stacked in two stages, an adhesion unit (AD), and a transfer device 30 in this order from the bottom.
[0025]
A resist processing block 15 extends in the X direction adjacent to the heat treatment system block 25. The resist processing block 15 includes a resist coating processing unit (CT) for applying a resist to the substrate G, a reduced-pressure drying unit (VD) for drying the applied resist under reduced pressure, and a peripheral portion of the substrate G according to the present invention. And an edge remover (ER) for removing the resist. The resist processing block 15 is provided with a sub-arm (not shown) that moves from the resist coating processing unit (CT) to the edge remover (ER), and the substrate G is transported in the resist processing block 15 by the sub-arm. Has become.
[0026]
A heat treatment system block 26 having a multi-stage configuration is disposed adjacent to the resist processing block 15. In this heat treatment system block 26, a pre-baking unit (PREBAKE) for performing a heat treatment after applying a resist to the substrate G has three stages. They are stacked, and a transport device 40 is provided below them.
[0027]
In the downstream portion 3c, as shown in FIG. 3, a heat treatment system block 29 is provided at the end portion on the interface portion 4 side, which includes a cooling unit (COL), a heat treatment after exposure and before development. Are stacked in two stages from the bottom, in order from the bottom.
[0028]
A development processing unit (DEV) for performing the development processing is provided adjacent to the heat treatment system block 29 and extends in the X direction. Heat processing system blocks 28 and 27 are disposed adjacent to the development processing unit (DEV). Between the heat processing system blocks 28 and 27, the same structure as the vertical transport unit 5 is provided. And a vertical transport unit 6 accessible to each heat treatment system unit in 27. An i-line processing unit (i-UV) 33 is provided adjacent to the development processing unit (DEV).
[0029]
In the heat treatment system block 28, a cooling unit (COL) and a post-baking unit (POBAKE) for performing a heat treatment after development on the substrate G are stacked in two stages from the bottom. On the other hand, in the heat treatment system block 27, similarly, a cooling unit (COL) and a post-baking unit (POBAKE) are stacked in two stages from the bottom.
[0030]
The interface unit 4 is provided with a titler and a peripheral exposure unit (Titler / EE) 22 on the front side, an extension cooling unit (EXTCOL) 35 adjacent to the vertical transport unit 7, and a buffer cassette 34 on the back side. And a vertical transport unit 8 for transferring the substrate G between the titler / peripheral exposure unit (Titler / EE) 22, the extension cooling unit (EXTCOL) 35, and the exposure device 32 adjacent to the buffer cassette 34. Are located. The vertical transport unit 8 has the same configuration as the vertical transport unit 5.
[0031]
(Coating and developing process)
Processing steps of the coating and developing apparatus 1 configured as described above will be described. First, the substrate G in the cassette C is transported to the upstream section 3b in the processing section 3. In the upstream section 3b, surface modification and organic substance removal processing are performed in an excimer UV processing unit (e-UV) 19, and then, in a scrubber cleaning processing unit (SCR), cleaning processing is performed while the substrate G is transported substantially horizontally. A drying process is performed. Subsequently, the substrate G is taken out by the transfer arm 5a of the vertical transfer unit at the lowermost part of the heat treatment system block 24, heated by the baking unit (BAKE) of the heat treatment system block 24, and heated by the adhesion unit (AD). In order to enhance the adhesion between the glass substrate G and the resist film, a process of spraying the substrate G with HMDS gas is performed. Thereafter, a cooling process by the cooling unit (COL) of the heat treatment system block 25 is performed.
[0032]
Next, the substrate G is transferred from the transfer arm 5a to the transfer device 30, and the transfer device 30 transfers the substrate G to the resist coating unit (CT). After the resist is coated, the reduced-pressure drying unit ( VD), and a resist removal process at the periphery of the substrate is sequentially performed by an edge remover (ER).
[0033]
Next, the substrate G is transferred to the transfer device 40 and transferred to the transfer arm of the vertical transfer unit 7 by the transfer device 40. After the heat treatment is performed in the prebaking unit (PREBAKE) in the heat treatment system block 26, the cooling process is performed in the cooling unit (COL) in the heat treatment system block 29. Subsequently, the substrate G is cooled by an extension cooling unit (EXTCOL) 35 and is exposed by an exposure device.
[0034]
Next, the substrate G is transferred to the post-exposure baking unit (PEBAKE) of the heat treatment system block 29 via the transfer arms of the vertical transfer units 8 and 7, where the heat treatment is performed, and then the cooling unit (COL). The cooling process is performed. Then, the development processing, rinsing processing and drying processing are performed while the substrate G is transported substantially horizontally in the development processing unit (DEV) via the transport arm of the vertical transport unit 7.
[0035]
Next, the substrate G is transferred from the lowermost stage in the heat treatment system block 28 by the transfer arm 6a of the vertical transfer unit 6, and is subjected to heat treatment in the post baking unit (POBAKE) in the heat treatment system block 28 or 27, and the cooling unit A cooling process is performed at (COL). Then, the substrate G is delivered to the transport mechanism 10 and stored in the cassette C.
[0036]
(Resist processing block)
FIG. 4 is a plan view of the resist processing block 15. As described above, the resist processing block 15 includes the resist coating processing unit (CT), the reduced-pressure drying unit (VD), and the edge remover (ER). The length of this processing block in the Y direction is, for example, 3 m to 4 m.
[0037]
A fixing cup 61 is disposed substantially at the center of the resist coating unit (CT), and has a substantially cylindrical shape with an opening at the top. Inside the fixed cup 61, a rotating cup 62 for accommodating a substrate and a lid 37 provided on the upper part of the rotating cup 62 are accommodated. The lid 37 is provided with a handle 37a. The handle 37 a is configured to be held by a robot arm 39, which is provided to be able to move up and down by driving the elevating mechanism 36, so that the lid 37 is attached to and detached from the rotating cup 62. The rotating cup 62 accommodates a chuck member 63 for holding the substrate G when transferring the substrate G and applying resist. The chuck member 63 is configured to be driven up and down in a vertical direction (Z direction) by a driving device (not shown). A nozzle container 46 that accommodates, for example, a long nozzle 45 that discharges a resist is disposed adjacent to the fixed cup 61. The nozzle 45 has a discharge hole (not shown) formed along its longitudinal direction, and is held by a holding mechanism (not shown) to discharge the resist onto the substrate G while moving on the fixed cup 61.
[0038]
The reduced-pressure drying unit (VD) has a lower chamber (not shown) and an upper chamber 44 provided so as to cover the lower chamber and keeping the processing space therein airtight. The upper chamber 44 is configured to be vertically movable by, for example, an air cylinder mechanism 43. The air cylinder mechanism 43 is supported, for example, on both sides of the chamber 44 by supports 42 suspended on the support columns 41. The substrate G is subjected to reduced pressure drying in a reduced pressure chamber. At each corner of the lower chamber, four exhaust ports 83 are provided, and an exhaust pipe connected to the exhaust ports 83 is connected to an exhaust pump (not shown) such as a turbo molecular exhaust pump. The lower chamber and the upper chamber 44 are configured to be evacuated to a predetermined vacuum degree by evacuating a processing space in a state where the lower chamber and the upper chamber 44 are in close contact with each other. The lower chamber is provided with a stage (not shown) for holding the substrate during the transfer of the substrate G and during the drying under reduced pressure, and the stage is moved up and down in a vertical direction (Z direction) by a driving device (not shown). It is configured to be driven.
[0039]
The edge remover (ER) includes a mounting table 52 on which the substrate G is mounted, and a remover head 50 that is moved along a guide rail 51 by a driving device (not shown). The mounting table 52 holds the substrate G at the time of delivery of the substrate G and at the time of the resist removal processing, and is configured to be able to move up and down by a driving device (not shown). Four remover heads 50 and four guide rails 51 are provided. Each remover head 50 is configured to discharge, for example, thinner while being moved, and removes excess resist attached to each edge of the substrate G.
[0040]
The resist processing block 15 is provided with transfer robots 71, 72, 73, 74 that can move along the guide rail 60 extending in the X direction. These transfer robots have the same configuration.
[0041]
Reference numeral 30 indicates a transfer device provided at the lowermost stage of the heat treatment block 25. The transfer device 30 has, for example, a pair of tweezers 31 that can move in the X direction on a base 38. The base 38 can be moved in the X and Z directions by a driving device (not shown), and can be rotated in a horizontal plane. The base 38 is provided with, for example, a plurality of rod-shaped pins 47, and these pins 47 are configured to move up and down by a lifting drive built in the base.
[0042]
(Transport robot)
FIG. 5 is a perspective view showing a part of the transfer robots 71 to 74. FIG. 6 is a plan view of the transfer robots 71 to 74, and FIGS. 7 and 8 are views taken along arrows AA and BB in FIG. 6, respectively.
[0043]
The transfer robots 71 to 74 have half-frame long arms 91a and 91b for holding the glass substrate G, and long short arms 94a and 94b. As shown in FIG. 6, the long arms 91a and 91b hold, for example, two opposite short sides of the substrate G, and the short arms 94a and 94b hold two opposite long sides.
[0044]
The long arms 91a and 91b are connected by connecting portions 81a and 81b, respectively. As shown in FIGS. 6 and 7, the connecting portions 81a and 81b have the same configuration. The connecting portions 81a and 81b are formed of box-shaped members, and have long arm air cylinders 86a, 86b, 87a and 87b built therein. The drive rods 92a and 92b of the long arm air cylinders 86a and 86b are fixed to pieces 93a and 93b attached to both ends of the long arm 91a, respectively. Similarly, the drive rods 96a, 96b of the long arm air cylinders 87a, 87b are fixed to one-piece members 97a, 97b attached to both ends of the long arm 91b, respectively. Guide grooves 88a and 88b for moving the long arms 91a and 91b are formed inside the connecting portions 81a and 81b. By driving the long arm air cylinders 86a and 86b, the long arms 91a and 91b move toward and away from each other.
[0045]
The short arms 94a and 94b are connected to the drive rods 82a and 82b of the short arm air cylinders 85a and 85b built in the connecting portions 81a and 81b, respectively. The short arms 94a, 94b are supported by support members 98a, 98b that move along guide grooves 99a, 99b provided in the connecting portions 81a, 81b. The short arms 94a and 94b move closer to and away from each other due to the driving of the short arm air cylinders 85a and 85b.
[0046]
Referring to FIG. 8, the connecting portions 81a and 81b are supported on the lower surfaces thereof by supports 106a and 106b, respectively, and the supports 106a and 106b are supported by support columns 105a and 105b, respectively. The support columns 105a and 105b are movably provided on the guide rail 60 described above. Connecting members 103a and 103b for connecting the timing belts 102a and 102b are fixed to the support columns 105a and 105b. One of the timing belts 102a and 102b is connected to the motor 100 via the pulley 101. By driving the motor 100, the support columns 105a and 105b are moved along the guide rails 60, whereby the transfer robots 71 to 74 are moved in one direction.
[0047]
With such a configuration, problems such as bending of the long arms 91a and 91b can be eliminated, and the substrate G can be reliably held. Further, since the long arms 91a and 91b are supported by the supports 106a and 106b and the support columns 105a and 105b provided on both sides, the long arms 91a and 91b, the support and the support columns are integrally provided. Have been. With such a configuration, the substrate can be reliably transported without the risk of the support member supporting the arm being out of synchronization as in the related art.
[0048]
(Suction pad)
Next, the suction pad will be described with reference to FIGS.
[0049]
FIG. 9 shows an entire image of the suction pad when the pressure sensor is attached. Each of the long arms 91a and 91b and the short arms 94a and 94b is provided with a plurality of suction pads 95. These suction pads 95 are mounted on a mounting base 114, and the mounting base 114 is mounted on the inside of each of the arms 91 a, 91 b, 94 a, and 94 b by a mounting tool 112. The attachment 112 is fixed to the arms 91a, 91b, 94a, 94b by, for example, bolts 111. The mounting base 114 is configured such that the height of the arms 91 a, 91 b, 94 a, and 94 b can be adjusted by screws 113. The suction pad 95 is made of, for example, resin, and is connected to the vacuum pump 136 via the connection pipe 139 and the pipe 138. For example, one vacuum pump is provided, and the pipe 138 is branched corresponding to each of the plurality of suction pads 95. Thereby, the substrate G can be vacuum-sucked. The number of the vacuum pumps may be two or more, and the vacuum pumps 136 may be connected to one suction pad 95 one by one. Further, a pressure sensor 131 that measures the suction pressure of the suction pad 95 is attached to the connection pipe 139. The suction state of the suction pad 95 is determined by the pressure sensor 131.
[0050]
FIG. 11 shows a state where the long arms 91a and 91b are viewed from the side when the pressure sensor is attached. The long arms 91a and 91b are provided with suction pads 95a to 95j. The suction pads 95a to 95j are connected to a pipe 138 via connection pipes 139a to 139j, respectively. The pipe 138 is connected to the vacuum pump 136. Pressure sensors 131a to 131j for individually measuring the suction pressures of the suction pads 95a to 95j (for example, the respective pressures in the connection tubes 139a to 139j) are attached to the connection tubes 139a to 139j. The connection pipes 139a to 139j are provided with pressure control valves 135a to 135j for individually adjusting the suction pressure of the suction pads 95a to 95j.
[0051]
The measurement values of the pressure sensors 131a to 131j are transmitted to the sensor data processing unit 132. The sensor data processing unit 132 specifies which pressure sensor the sent measurement value is. The information of the specified pressure sensor and the information of the measured value are both transmitted to the main controller 133. The main controller 133 controls the pressure control valve based on the transmitted information. For example, as shown in FIG. 12, when the pressure measured by a certain pressure sensor does not reach a preset value (when it is higher than a set value), control for closing a pressure control valve of a corresponding suction pad is performed. Is possible. This makes it possible to independently stop the generation of the pressure difference based on the suction pressure of each suction pad, thereby eliminating errors during suction. At this time, when the number of closed pressure control valves becomes larger than a predetermined number, the operation of the transfer robots 71 to 74 may be stopped in consideration of safety and an alarm may be sounded. . Alternatively, the minimum number of suction pads required for transporting the substrate G may be set in advance as a predetermined value, and first, all the valves 135a to 135j may be closed, and the valves may be opened one by one with a time lag. . In this case, when the number of suction pads capable of sucking the substrate G reaches a predetermined value, the remaining valves are kept closed without opening. By doing so, it is possible to save the substrates having different warpages with reduced labor, and the vacuum pump can be downsized.
[0052]
Here, as shown in FIG. 14, for example, by attaching an acceleration sensor 150 to the long arm 91a or 91b, the acceleration state when the transfer robots 71 to 74 start moving or stop may be detected. A signal from the acceleration sensor 150 is transmitted to the main controller 133 via the sensor data processing unit 132. The main controller 133 controls the valve opening / closing controller 134 based on this signal. When the transfer robots 71 to 74 are in an acceleration state, an inertia force is applied to the substrate G, and thus the position is easily shifted particularly. According to the present invention, by attaching the acceleration sensor 150, it is possible to perform control to particularly increase the suction when the transfer robots 71 to 74 are in the acceleration state. As a result, displacement is less likely to occur. Instead of attaching the acceleration sensor 150, the suction of the suction pad may be strongly controlled when the main controller 133 controls acceleration and deceleration of the motor 100.
[0053]
Next, the operation of the transfer robots 71 to 74 will be described.
[0054]
For example, a worker inputs a recipe (processing content) and a substrate size from an input unit before processing. The transfer robot main controller 121 transmits the information on the size of the substrate to the air cylinder controller 124. Then, for example, in the future, the air cylinder controller 124 will adjust the long arm air cylinders 86a, 86b, 87a, 87b, and the short arm until the operator again inputs the size of the substrate. Drive air cylinders 85a and 85b.
[0055]
The transfer device 30 transfers the held substrate G to the transfer robot 71. FIG. 15 shows the delivery operation. As illustrated in FIG. 15A, the transfer device 30 moves to a position directly below the transfer robot 71 while holding the substrate G with the tweezers 31. The transfer device 30 raises the pins 47 to separate the substrate G from the tweezers 31, for example, as shown in FIG. The transfer robot 71 causes the long arms 91a and 91b to approach each other and the short arms 94a and 94b to approach each other as shown in FIG. The transport device 30 lowers the pins 47 as shown in FIG. Thus, the substrate G is placed on the long arms 91a and 91b and the short arms 94a and 94b of the transfer robot 71. Here, FIG. 16 shows a state of bending of the substrate G when the substrate G is placed on the long arms 91a and 91b and the short arms 94a and 94b. When the substrate G bends as shown in FIG. 16A, for example, the suction pads 95a to 95c and 95h to 95j stop suction and the suction pads 95d to 95g perform suction based on the measurement value of the pressure sensor. Is controlled. In the case of bending as shown in FIG. 16B, for example, the suction pads 95a, 95e, 95f, and 95j are controlled so as to stop suction and the suction pads 95b to 95d and 95g to 95i to perform suction. Then, the transport device 30 retreats as shown in FIG.
[0056]
As described above, the long arms 91a and 91b and the short arms 94a and 94b freely expand and contract, so that the transfer robot 71 can smoothly move the substrate without interfering with, for example, the transfer device 30 or the substrate G held by the transfer device 30. Can be handed over. Further, since the generation of the pressure difference of the suction pad 95 can be stopped independently according to the bending of the substrate G, no suction error occurs.
[0057]
When the substrate G is transferred from the transfer device 30 to the transfer robot 71 as described above, the transfer robot 71 holds the substrate G as shown in FIGS. (CT) to just above the chuck member 63. When the transfer robot 71 attempts to move, this operation is sensed by the acceleration sensor 150, and the suction pad that is performing suction is controlled so that the suction force is stronger than before. Thereby, the displacement of the substrate G is less likely to occur.
[0058]
Here, for example, before the transfer robot 71 is moved to a position directly above the chuck member 63, the lid 37 is separated from the rotary cup 62 by the driving of the elevating mechanism 36 and is raised to a predetermined height. The transfer robot 71 is moved at a position lower than the cover 37 at such a predetermined height in order to prevent interference with the cover 37.
[0059]
The transfer robot 71 is moved to above the chuck member 63, and the movement of the transfer robot 71 stops. This operation is also sensed by the acceleration sensor 150 when trying to stop, and the control is performed so that the suction force of the suction pad that is performing suction becomes stronger than before. Thereby, the displacement of the substrate G is less likely to occur. When the movement of the transfer robot 71 is completely stopped, all vacuum suction by the suction pad 95 of the transfer robot 71 is stopped. When the vacuum suction is stopped, the chuck member 63 moves up as shown in FIG. 18B to receive the substrate G from the arms 91a, 91b, 94a and 94b. When the chuck member 63 receives the substrate, as shown in FIGS. 17B and 18C, the long arms 91a and 91b move away from each other, and the short arms 94a and 94b also move away from each other. . Thereafter, as shown in FIG. 18D, the chuck member 63 is moved down, whereby the substrate G is accommodated in the rotating cup 62, and the resist coating process is performed. That is, the height of the transfer robot 71 is always constant, but the chuck member 63 moves up and down with respect to the transfer robot 71.
[0060]
As described above, the long arms 91a and 91b and the short arms 94a and 94b freely expand and contract, so that the transfer robot 71 can smoothly move without interfering with, for example, the chuck member 63 or the substrate G transferred to the chuck member 63. You can pass the substrate.
[0061]
When the resist coating process is completed, the substrate G is transferred to the transfer robot 72 in an operation opposite to the operation shown in FIGS. The transfer robot 72 having received the substrate G further moves in the X direction, and is moved to a position directly above a stage (not shown) in the lower chamber of the vacuum drying unit (VD).
[0062]
Here, for example, before the transfer robot 72 is moved to a position directly above the stage, the upper chamber 44 is separated from the lower chamber by the driving of the air cylinder mechanism 43 and is raised to a predetermined height. The transfer robot 72 is moved at a position lower than the stage at such a predetermined height to prevent interference with the stage.
[0063]
When the transfer robot 72 is moved to a position directly above a stage (not shown), the transfer of the substrate G is performed by the same operation as that described with reference to FIGS. In this case, the chuck member 63 shown in FIGS. 17 and 18 hits the stage.
[0064]
When the processing in the reduced-pressure drying unit (VD) is completed, the substrate G is transferred to the transfer robot 73 in the reverse order of the operations shown in FIGS. The transport robot 73 that has received the substrate G further moves in the X direction, and is moved to a position directly above the mounting table 52 of the edge remover (ER).
[0065]
When the transfer robot 73 is moved to a position directly above the mounting table 52, the transfer of the substrate G is performed by the same operation as the operation described with reference to FIGS. In this case, the chuck member 63 shown in FIG. 17 and FIG.
[0066]
When the processing by the edge remover (ER) is completed, the substrate G is transferred to the transfer robot 74 in the reverse order of the operations shown in FIGS. When the substrate G is transferred to the transfer robot 74, the transfer device 40 accesses the transfer robot 74 and receives the substrate G in an operation reverse to the operation described with reference to FIGS.
[0067]
When the transfer robots 72, 73, and 74 receive the substrate G, the generation of the pressure difference of the suction pad 95 is stopped independently similarly to the case where the transfer robot 71 receives the substrate G. Similarly, when the transfer robots 72, 73, and 74 on which the substrate G is mounted are about to move or stop, this operation is similarly detected by the acceleration sensor 150, and the suction pad is performing suction. Is controlled so that the adsorption force of the sapphire becomes stronger than before.
[0068]
[Second embodiment]
(Optical sensor)
The present invention can be implemented by attaching an optical sensor for measuring the distance between the suction pad and the substrate, instead of the pressure sensor. FIG. 10 shows a case where an optical sensor is attached. The optical sensor 141 is mounted on the mounting base 114. The optical sensor 141 determines the suction state of the suction pad 95. The optical sensor 141 includes, for example, a pair of a light emitting unit and a light receiving unit, and a sensor whose distance is calculated from the number of light emitting pulses received by the light receiving unit can be used.
[0069]
FIG. 19 shows a state where the long arms 91a and 91b are viewed from the side when the optical sensor is attached. As in the case where the pressure sensors 131a to 131j are used, the measured values of the optical sensors 141a to 141j are transmitted to the sensor data processing unit 132, and the measured values of the optical sensors are identified. Is transmitted to the main controller 133. The main controller 133 controls the pressure control valve based on the transmitted information. Also in this case, for example, as shown in FIG. 20A, when the distance measured by a certain optical sensor does not reach a preset value, the corresponding pressure control valves 135a to 135j are closed. Alternatively, as shown in FIG. 20 (b), it is possible to perform control in which a predetermined value is set stepwise and the opening degree of each of the pressure control valves 135a to 135j is changed in each step. Thus, the pressure difference can be independently controlled based on the distance for each suction pad, and errors during suction can be eliminated.
[0070]
[Third embodiment]
FIG. 21 shows a state where the long arms 91a and 91b are viewed from the side when a vacuum pump is connected to each of the suction pads. The long arms 91a and 91b are provided with suction pads 95a to 95j. The suction pads 95a to 95j are connected to pipes 138a to 138j via connection pipes 139a to 139j, respectively. The pipes 138a to 138j are connected to vacuum pumps 136a to 136j. Pressure sensors 131a to 131j that individually measure the suction pressures of the suction pads 95a to 95j (the respective pressures in the connection tubes 139a to 139j) are attached to the connection tubes 139a to 139j. The connection pipes 139a to 139j are provided with pressure control valves 135a to 135j for individually adjusting the suction pressure of the suction pads 95a to 95j.
[0071]
The measurement values of the pressure sensors 131a to 131j are transmitted to the sensor data processing unit 132. The sensor data processing unit 132 specifies which pressure sensor the transmitted data is a measurement value of. The information of the specified pressure sensor and the information of the measured value are both transmitted to the main controller 133. The main controller 133 controls the pressure control valve based on the transmitted information. For example, it is possible to control the opening and closing of the pressure control valves 135a to 135j. Further, as shown in FIG. 13, it is also possible to perform control in which a predetermined value is set stepwise and the opening degree of each of the pressure control valves 135a to 135j is changed for each step. Thus, the pressure difference can be independently variably controlled based on the pressure state of each suction pad, and errors during suction can be eliminated.
[0072]
Conventionally, suction was performed by controlling one pump and one valve. If there was at least one suction pad that could not suction a substrate, the pump sucked air from only the suction pad, causing an suction error. . However, according to the present embodiment, a valve or a pump is provided for each suction pad, and it is possible to control each of them independently, so that the problem of the suction error can be solved. If the suction hole of the suction pad is small, the suction force of the vacuum pump is larger than the flow rate sucked from the suction pad separated from the substrate by increasing the suction force of the vacuum pump as much as possible. Therefore, there is a possibility that a suction force is gradually generated in the separated suction pad and the suction pad is sucked. But that's not a good idea because it wastes energy and time.
[0073]
The present invention is not limited to the embodiments described above, and various modifications are possible.
[0074]
For example, a three-way valve may be attached to the connection pipe 138, and a supply pipe for supplying, for example, an inert gas or air may be provided to switch between the exhaust from the vacuum pump 136 and the supply of the inert gas from the supply pipe. Good. This makes it possible to switch the three-way valve immediately before transferring the substrate G to the processing unit, supply gas to the suction holes for several seconds, and facilitate removal of the substrate G from the suction pad. In this case, the inside of the connection pipe 138 can be maintained in a vacuum state by keeping the openings of the pressure control valves 135a to 135j during the suction operation. Therefore, the amount of gas supplied can be reduced by supplying gas there. After that, the held substrate G is transferred to the processing unit, and the pressure control valves 135a to 135j are fully opened immediately before the next substrate is placed on the transfer robots 71 to 74, and the suction operation of the next substrate is started. Just fine.
[0075]
Further, it is also possible to adopt a configuration in which only one of the long arms 91a and 91b moves and the other is fixed to the connecting portions 81a and 1b. This is the same for the short arms 94a and 94b.
[0076]
The shape of the long arms 91a and 91b is not limited to the square frame shape shown in the embodiment. Any configuration may be used as long as the arms 91a and 91b are integrally provided in the Y direction shown in FIG. Further, the length of the short arms 94a and 94b in the longitudinal direction is not limited to the above embodiment.
[0077]
In the above-described embodiment, an air cylinder is used as a mechanism for moving the arms 91a, 91b, 94a, and 94b. However, the present invention is not limited to this, and an electromagnetic linear motor or a belt driving mechanism may be used.
[0078]
【The invention's effect】
As described above, according to the present invention, no error occurs at the time of suction, so that the number of work steps can be reduced and the operation rate can be improved.
[Brief description of the drawings]
FIG. 1 is a plan view showing an overall configuration of a coating and developing apparatus according to an embodiment of the present invention.
FIG. 2 is a front view of the coating and developing apparatus shown in FIG.
FIG. 3 is a rear view of the coating and developing apparatus shown in FIG. 1;
FIG. 4 is a plan view of a resist processing block according to one embodiment of the present invention.
FIG. 5 is a perspective view showing a part of the transfer robot according to one embodiment of the present invention.
FIG. 6 is a plan view showing the transfer robot shown in FIG.
FIG. 7 is a side view showing the transfer robot shown in FIG.
FIG. 8 is a front view showing the transfer robot shown in FIG.
FIG. 9 is an enlarged view of a suction pad.
FIG. 10 is an enlarged view of a suction pad.
FIG. 11 is a diagram showing a control system of the suction pad.
FIG. 12 is a diagram showing a correlation between a measured value of a pressure sensor and an opening degree of a valve.
FIG. 13 is a diagram showing a correlation between a measured value of a pressure sensor and an opening degree of a valve.
FIG. 14 is a diagram showing a control system of the suction pad.
FIG. 15 is a diagram illustrating an operation of transferring a substrate to and from a processing apparatus.
FIG. 16 is a side view showing a part of the transfer robot according to one embodiment of the present invention.
FIG. 17 is a diagram illustrating an operation of transferring a substrate to and from another transfer device.
FIG. 18 is a diagram illustrating an operation of transferring a substrate to and from a processing apparatus.
FIG. 19 is a diagram showing a control system of the suction pad.
FIG. 20 is a diagram showing a correlation between a measured value of an optical sensor and an opening degree of a valve.
FIG. 21 is a diagram showing a control system of the suction pad.
[Explanation of symbols]
G ... Glass substrates 71-74 ... Transport robot 95 ... Suction pad 131 ... Pressure sensor 132 ... Sensor data processing unit 133 ... Main controller 134 ... Valve opening / closing controller 135 ... Pressure control valve 136 ... Vacuum pump 138 ... Piping 139 ... Connection pipe 141 ... Optical sensor 150 ... Acceleration sensor

Claims (9)

A holding member that holds at least a part of a peripheral portion of the substrate,
A plurality of suction units provided on the holding member and suctioning the substrate with a pressure difference to hold the substrate,
A substrate processing apparatus, comprising: a pressure difference generating mechanism that generates the pressure difference independently for each of the suction units. The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the pressure difference generating mechanism includes a unit that controls the pressure difference to be generated for each of the suction units. The substrate processing apparatus according to claim 2,
The control means,
Pressure measuring means for measuring the pressure generated in the vicinity of the suction section,
Means for controlling the pressure difference based on a signal obtained by the pressure measuring means. The substrate processing apparatus according to claim 2,
The control means,
The holding member, a distance measuring means for measuring a distance between a predetermined portion of the substrate held by the holding member,
Means for controlling the pressure difference based on a signal obtained by the distance measuring means. The substrate processing apparatus according to claim 2,
Further comprising a moving mechanism for moving the holding member,
The substrate processing apparatus according to claim 1, wherein the control means includes means for controlling the pressure difference based on a speed state of the holding member moved by the moving mechanism. The substrate processing apparatus according to claim 5, wherein
The substrate processing apparatus according to claim 1, wherein the control unit includes a unit that controls the pressure difference based on whether the holding member is in an acceleration / deceleration state or a constant speed state. A holding member that holds at least a part of a peripheral portion of the substrate, a plurality of suction portions provided on the holding member, and that sucks the substrate with a pressure difference to hold the substrate, and each of the suction portions independently. A processing method of a substrate processing apparatus having a pressure difference generating mechanism that generates the pressure difference,
Measuring the pressure generated in the vicinity of the suction section,
Controlling the pressure difference generated by the pressure difference generating mechanism on the basis of the measured pressure. A holding member that holds at least a part of a peripheral portion of the substrate, a plurality of suction portions provided on the holding member, and that sucks the substrate with a pressure difference to hold the substrate, and each of the suction portions independently. A processing method of a substrate processing apparatus having a pressure difference generating mechanism that generates the pressure difference,
The step of measuring the distance between the holding member and a predetermined portion of the substrate held by the holding member,
Controlling the pressure difference generated by the pressure difference generating mechanism based on the measured distance. A holding member that holds at least a part of a peripheral portion of the substrate, a plurality of suction portions provided on the holding member, and that sucks the substrate with a pressure difference to hold the substrate, and each of the suction portions independently. A processing method of a substrate processing apparatus having a pressure difference generating mechanism that generates the pressure difference,
Moving the holding member;
Controlling the pressure difference based on a speed state of the holding member being moved.

Images