CN108519693B - Substrate alignment device, substrate and substrate alignment method - Google Patents

Substrate alignment device, substrate and substrate alignment method Download PDF

Info

Publication number
CN108519693B
CN108519693B CN201810337872.5A CN201810337872A CN108519693B CN 108519693 B CN108519693 B CN 108519693B CN 201810337872 A CN201810337872 A CN 201810337872A CN 108519693 B CN108519693 B CN 108519693B
Authority
CN
China
Prior art keywords
substrate
alignment
magnetic
aligned
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201810337872.5A
Other languages
Chinese (zh)
Other versions
CN108519693A (en
Inventor
赵新宇
范晓旺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Ordos Yuansheng Optoelectronics Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN201810337872.5A priority Critical patent/CN108519693B/en
Publication of CN108519693A publication Critical patent/CN108519693A/en
Application granted granted Critical
Publication of CN108519693B publication Critical patent/CN108519693B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133354Arrangements for aligning or assembling substrates

Abstract

The invention provides a substrate alignment device, a substrate and a substrate alignment method, wherein the substrate alignment device is used for aligning and correcting a substrate to be aligned, and magnetic parts are arranged on two opposite sides of the substrate to be aligned; the substrate alignment device comprises two groups of alignment parts which are arranged at intervals, wherein a magnetic structure is arranged on each group of alignment parts, and the magnetic structures can generate magnetic acting force with the magnetic parts so as to enable the substrate to be aligned to be suspended and fixed between the two groups of alignment parts. The substrate alignment device, the substrate and the substrate alignment method provided by the invention can reduce the contact between the substrate and the alignment pins, thereby reducing the phenomena of damage, scratch, misalignment and the like to the substrate.

Description

Substrate alignment device, substrate and substrate alignment method
Technical Field
The invention relates to the technical field of display manufacturing, in particular to a substrate alignment device, a substrate and a substrate alignment method.
Background
In the display manufacturing process, an alignment procedure can be involved, for example, in the display manufacturing process, a glass substrate needs to be detected, the substrate to be detected is aligned and corrected through an alignment pin on a process machine during detection, and only if the alignment precision is within an allowable error range, the equipment can be produced. Generally, the alignment pins gather from the four sides of the substrate to the center of the substrate until the alignment pins clamp the substrate, and then the alignment pins are moved to realize alignment correction of the substrate. Because the alignment pin (alignment rod) used at present can be in direct contact with the substrate, the problems of easy damage, scratch, inaccurate alignment and the like of the substrate can be caused.
Disclosure of Invention
The invention aims to provide a substrate alignment device, a substrate and a substrate alignment method, which can reduce the contact between the substrate and alignment pins, thereby reducing the phenomena of damage, scratch, misalignment and the like to the substrate.
The technical scheme provided by the invention is as follows:
the invention provides a substrate aligning device, which is used for aligning and correcting a substrate to be aligned, wherein magnetic parts are arranged on two opposite sides of the substrate to be aligned; the substrate alignment device comprises two groups of alignment parts which are arranged at intervals, wherein a magnetic structure is arranged on each group of alignment parts, and the magnetic structures can generate magnetic acting force with the magnetic parts so as to enable the substrate to be aligned to be suspended and fixed between the two groups of alignment parts.
Optionally, the magnetic structure comprises an electromagnetic structure capable of generating the magnetic force when an electrical signal is applied; the substrate alignment device further comprises a signal applying unit connected with the electromagnetic structure and used for applying an electric signal to the electromagnetic structure so as to keep balance between the two groups of alignment parts and magnetic acting forces generated by the substrate to be aligned respectively.
Optionally, the electrical signal includes a current magnitude and/or a current direction, the electromagnetic structure includes an electromagnetic coil,
when the direction of current introduced by the electromagnetic coil is changed, the magnetic pole of the electromagnetic structure is changed;
when the current led in by the electromagnetic coil is changed, the magnetic field intensity generated by the electromagnetic coil is changed so as to change the magnetic acting force generated between the alignment component and the substrate to be aligned.
Optionally, each pair of positioning parts includes at least two positioning parts; wherein the content of the first and second substances,
the signal applying unit is connected with the electromagnetic structure on each alignment part independently, and can control the electric signal applied on the electromagnetic structure on each alignment part independently, so that the magnetic acting force between each alignment part and the substrate to be aligned is adjustable independently;
or the signal applying unit applies the same electrical signal to the same group of alignment parts, so that the magnetic acting force between the same group of alignment parts and the substrate to be aligned is synchronously adjustable.
In a second aspect, the present invention provides a substrate having magnetic components disposed on opposite sides of the substrate, respectively.
Optionally, the magnetic component is a magnetic layer formed by using a magnetic material.
In a third aspect, the present invention provides a substrate alignment method, which uses the substrate alignment apparatus as described above to perform alignment correction on the substrate; the method comprises the following steps:
and controlling the magnetic structure of each group of alignment parts and the magnetic part on the substrate to generate magnetic acting force so as to make the substrate suspended and fixed between the two groups of alignment parts.
Optionally, the controlling of the magnetic structure of each group of alignment components and the magnetic member on the substrate to generate a magnetic acting force therebetween to make the substrate be suspended and fixed between the two groups of alignment components specifically includes:
and applying an electric signal to the electromagnetic structure on the alignment parts so as to keep balance between the two groups of alignment parts and the magnetic acting force generated by the substrate to be aligned respectively.
Optionally, the applying an electrical signal to the electromagnetic structure on the alignment component to balance the two sets of alignment components with the magnetic acting force generated by the substrate to be aligned respectively includes:
changing the magnetic pole of the electromagnetic structure by changing the current direction led in by the electromagnetic coil so as to change the magnetic acting force generated between the alignment part and the substrate to be aligned;
and/or changing the intensity of the magnetic field generated by the electromagnetic coil by changing the current introduced by the electromagnetic coil so as to change the magnetic acting force generated between the alignment part and the substrate to be aligned.
Optionally, the applying an electrical signal to the electromagnetic structure on the alignment component to balance the two sets of alignment components with the magnetic acting force generated by the substrate to be aligned respectively includes:
controlling the electromagnetic structure on each alignment part to independently apply an electric signal;
or, the same electric signal is applied to the same group of alignment parts.
The beneficial effects brought by the invention are as follows:
the substrate alignment device, the substrate and the substrate alignment method provided by the invention have the advantages that the magnetic structures are arranged on the alignment parts, so that magnetic acting force can be generated between the alignment parts and the magnetic parts on the substrate to be aligned, when the substrate to be aligned is aligned, the substrate to be aligned is arranged between the two sets of alignment parts, thus, magnetic attraction or repulsion can be performed between each set of alignment parts and the magnetic parts on the substrate to be aligned, when the magnetic acting force generated between the two sets of alignment parts and the substrate to be aligned is balanced, the substrate to be aligned can be suspended and fixed between the two sets of alignment parts, compared with the mode that the alignment rods are directly contacted with the substrate in the prior art, the alignment parts and the substrate can be prevented from being contacted, and the phenomena of scratches or damages and the like caused by excessive contact of the substrate are reduced.
Drawings
Fig. 1 is a schematic structural diagram of a substrate alignment apparatus provided in an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment of the invention provides a substrate alignment device, a substrate and a substrate alignment method, which can reduce the contact between the substrate and alignment pins so as to reduce the phenomena of damage, scratch, misalignment and the like of the substrate.
In order to solve the above technical problem, as shown in fig. 1, a substrate alignment apparatus according to an embodiment of the present invention is used for performing alignment correction on a substrate 10 to be aligned, wherein magnetic members 11 are disposed on two opposite sides of the substrate 10 to be aligned; the substrate alignment device comprises two groups of alignment parts 20 which are arranged at intervals, wherein each group of alignment part 20 is provided with a magnetic structure, and the magnetic structures can generate magnetic acting force with the magnetic parts 11 so as to enable the substrate 10 to be aligned to be suspended and fixed between the two groups of alignment parts 20.
According to the substrate alignment device provided by the invention, the alignment part 20 is provided with the magnetic structure, so that a magnetic acting force can be generated between the alignment part 20 and the magnetic pieces 11 on the substrate 10 to be aligned, when the substrate 10 to be aligned is aligned, the substrate 10 to be aligned is arranged between the two sets of alignment parts 20, thus, magnetic attraction or repulsion can be performed between each set of alignment parts 20 and the magnetic pieces 11 on the substrate 10 to be aligned, when the magnetic acting forces generated between the two sets of alignment parts 20 and the substrate 10 to be aligned are balanced, the substrate 10 to be aligned can be suspended and fixed between the two sets of alignment parts 20, compared with the mode that the alignment rods are directly contacted with the substrate in the prior art, the alignment parts 20 and the substrate can be prevented from being contacted, and the phenomena of scratches or damages and the like caused by excessive contact of the substrate are reduced.
In the prior art, since the alignment pins are used to directly clamp the substrate, when aligning the substrates with different thicknesses, the substrate may be crushed or misaligned, and the substrate may be scratched due to contact between the substrate and the machine of the alignment apparatus. In the substrate alignment device provided by the invention, the substrate is fixed between the two groups of substrates 10 to be aligned in a suspension state, so that the contact between the substrates and the device can be reduced, the damage or scratch of the alignment part 20 to the substrates can be reduced, the problem of crushing or inaccurate alignment of the substrates when the substrates with different thicknesses are aligned can be solved, the contact between the substrates and a machine table can be reduced, and the generation of the scratch can be reduced.
In an exemplary embodiment provided by the present invention, the magnetic structure comprises an electromagnetic structure capable of generating the magnetic force upon application of an electrical signal; the substrate alignment device further comprises a signal applying unit connected with the electromagnetic structure, and is used for applying an electrical signal to the electromagnetic structure so as to keep balance between the two sets of alignment parts 20 and the magnetic acting force generated by the substrate 10 to be aligned.
By adopting the above scheme, the magnetic structure on the alignment component 20 is an electromagnetic structure, and the alignment component 20 generates magnetism by applying an electrical signal to the magnetic structure on the alignment component 20, so as to generate a magnetic attraction or repulsion force with the magnetic part 11 on the substrate 10 to be aligned, and the magnetic structure on the alignment component 20 and the substrate 10 to be aligned are controlled to generate a magnetic acting force by the electrical signal, so that the alignment device has the advantages of easy control and the like.
It is understood that, in practical applications, the magnetic structure on the alignment component 20 may also be implemented by using other structures capable of generating magnetism, for example, the magnetic structure on the alignment component 20 may also be a magnet, the magnetic structure is not limited, and any structure capable of generating a magnetic acting force with the magnetic element 11 on the substrate 10 to be aligned may be used as the magnetic structure.
In the embodiment provided by the present invention, preferably, the electrical signal includes a current magnitude and/or a current direction, the electromagnetic structure includes an electromagnetic coil,
when the direction of current introduced by the electromagnetic coil is changed, the magnetic pole of the electromagnetic structure is changed;
when the current passed through the electromagnetic coil changes, the magnetic field intensity generated by the electromagnetic coil changes, so as to change the magnetic acting force generated between the alignment part 20 and the substrate 10 to be aligned.
By adopting the above scheme, the electromagnetic structure is realized by using an electromagnetic coil, and the magnetic acting force between the alignment part 20 and the substrate 10 to be aligned can be adjusted by changing the current direction and the current magnitude on the electromagnetic coil, so that the magnetic acting forces on the two opposite sides of the substrate 10 to be aligned are balanced. Simple structure and easy control. The arrangement of the electromagnetic coil on the positioning member 20 is not limited. It should be noted that the signal applying unit may apply an alternating current to the electromagnetic coil to change the magnetic pole of the electromagnetic structure.
In addition, in the embodiment provided by the present invention, a set of the alignment components 20 is respectively disposed on two opposite sides of the substrate 10 to be aligned, and the number of the alignment components 20 in each set of the alignment components 20 is not limited, and may be one or more.
The magnetic members 11 on the substrate 10 to be aligned may be magnetic layers formed on two opposite sides of the substrate to be aligned, wherein one or more magnetic members may be disposed on the same side of the substrate 10 to be aligned, and when each alignment component includes only one alignment component, it is preferable that the magnetic members 11 are disposed in the middle of the substrate to be aligned; when there are a plurality of alignment units 10 in each set of alignment units, it is preferable that there are a plurality of magnetic members 11 on the substrate 10 to be aligned, and the plurality of magnetic members 11 are disposed at intervals.
It should be noted that, when each pair of positioning components includes at least two of the positioning components 20, it is preferable that the distance between each pair of positioning components 20 in the same pair of positioning components is adjustable, that is, two adjacent positioning components 20 in the same pair of positioning components can move toward or away from each other along a first direction, and two pairs of the positioning components can move toward or away from each other along a second direction, where the first direction is perpendicular to the second direction, for example, the first direction is a length extending direction of a substrate to be aligned, and the second direction is a width extending direction of the substrate to be aligned, so that the positions of the positioning components can be adjusted for different types of substrates.
In an exemplary embodiment of the present invention, as shown in fig. 1, each pair of positioning members 20 includes at least two positioning members 20; the signal applying unit is individually connected to the electromagnetic structure on each alignment unit 20, and can individually control the electrical signal applied to the electromagnetic structure on each alignment unit 20, so that the magnetic acting force between each alignment unit 20 and the substrate 10 to be aligned is individually adjustable.
By adopting the above scheme, at least two alignment components 20 are respectively arranged on each side of the substrate 10 to be aligned, which is more favorable for stably suspending and fixing the substrate 10 to be aligned between two sets of alignment components 20, and each alignment component 20 can respectively and independently apply an electrical signal, so that the electrical signals on each alignment component 20 can be respectively and independently adjusted, so that the magnetic acting forces on the two opposite sides of the substrate 10 to be aligned are finally balanced. And aiming at the substrates with different models, the electric signals on the alignment parts 20 can be adjusted in a targeted manner, so that the substrates with different models can be finally fixed between the two sets of alignment parts 20 in a suspended state.
In addition, in another exemplary embodiment provided by the present invention, the signal applying unit may also apply the same electrical signal to the same pair of positioning members 20, so that the magnetic acting force between the same pair of positioning members 20 and the substrate 10 to be aligned is synchronously adjustable.
With the above-mentioned solution, since the magnetic forces applied to the two opposite sides of the substrate 10 to be aligned need to be adjusted, the alignment components 20 of the same group are located on the same side of the substrate 10 to be aligned, and therefore, the same electrical signals may be applied to the alignment components 20 on the same side.
The substrate positioning apparatus may be applied to a detection device in a detection process of a product such as a liquid crystal display, or may be applied to various other devices as a stage for fixing a substrate.
When the substrate aligning device is applied to detection equipment of display products such as liquid crystal displays, the substrate aligning device further comprises:
a machine platform, wherein a working area is arranged on the machine platform, and the alignment part 20 is arranged above the machine platform;
an acquiring unit configured to acquire current position information of the substrate 10 to be aligned;
a moving unit for moving the aligning member 20;
and the control unit is connected with the acquisition unit and the moving unit and is used for controlling the moving unit to move the alignment parts 20 according to the current position information of the substrate 10 to be aligned, so that the substrate 10 to be aligned between the two groups of alignment parts 20 is moved to the working area.
In the above scheme, when aligning the substrate 10 to be aligned, firstly, the substrate 10 to be aligned is placed between two sets of alignment parts 20, an electrical signal is applied to the two sets of alignment parts 20, so that the substrate 10 to be aligned is suspended and fixed between the two sets of alignment parts 20, then, the obtaining unit obtains current position information of the substrate 10 to be aligned, and compares the current position information with preset position information to obtain a movement amount required by the movement of the substrate 10 to be aligned to the working area, the moving unit is controlled to move the alignment parts 20 according to the movement amount, and at this time, the substrate 10 to be aligned and the two sets of alignment parts 20 move synchronously until the substrate 10 to be aligned moves to the working area, and alignment correction of the substrate 10 to be aligned is completed.
It should be noted that, in the above scheme, the obtaining unit may adopt an image collecting unit, the substrate 10 to be aligned has an alignment mark, and the obtaining unit may obtain the current position information of the substrate 10 to be aligned by collecting the alignment mark, and for example, the obtaining unit may adopt a camera or the like.
In an embodiment of the present invention, there is also provided a substrate, on opposite sides of which magnetic parts are respectively disposed.
The substrate can be matched with the substrate alignment device provided by the embodiment of the invention, and magnetic parts are respectively arranged on two opposite sides of the substrate to generate magnetic acting force between the substrate and the two groups of alignment parts 20 on the substrate alignment device, so that the aim of suspending and fixing the substrate between the two groups of alignment parts 20 is finally realized.
When the substrate is aligned, the substrate 10 is disposed between the two sets of alignment parts 20, so that the magnetic attraction or repulsion between each set of alignment parts 20 and the magnetic part 11 on the substrate can be performed, when the magnetic acting force generated between the two sets of alignment parts 20 and the substrate is balanced, the substrate can be suspended and fixed between the two sets of alignment parts 20, compared with the direct contact mode of the alignment rods and the substrate in the prior art, the substrate and the alignment parts 20 can not be in contact with each other, and the occurrence of phenomena such as scratches or damages caused by excessive contact of the substrate is reduced.
Optionally, the magnetic component is a magnetic layer formed by using a magnetic material.
With the above scheme, the magnetic component can be realized by using a magnetic layer formed by a magnetic material, and the magnetic layer can be formed by sputtering, coating, evaporating and the like on the substrate.
Wherein one or more magnetic members may be disposed on the same side of the substrate, and when only one alignment member is included in each alignment member, it is preferable that the magnetic member 11 is disposed at a middle position of the substrate to be aligned; when there are a plurality of alignment members 10 in each set of alignment members, it is preferable that there are a plurality of magnetic members 11 on the substrate, and the plurality of magnetic members 11 are disposed at intervals.
In addition, the embodiment of the invention also provides a substrate alignment method, which is used for carrying out alignment correction on the substrate provided by the embodiment of the invention by adopting the substrate alignment device provided by the embodiment of the invention; the method comprises the following steps:
and controlling the magnetic structure of each group of alignment parts 20 and the magnetic part 11 on the substrate to generate a magnetic acting force, so that the substrate is suspended and fixed between the two groups of alignment parts 20.
According to the substrate alignment device provided by the invention, the alignment part 20 is provided with the magnetic structure, so that a magnetic acting force can be generated between the alignment part 20 and the magnetic pieces 11 on the substrate 10 to be aligned, when the substrate 10 to be aligned is aligned, the substrate 10 to be aligned is arranged between the two sets of alignment parts 20, thus, magnetic attraction or repulsion can be performed between each set of alignment parts 20 and the magnetic pieces 11 on the substrate 10 to be aligned, when the magnetic acting forces generated between the two sets of alignment parts 20 and the substrate 10 to be aligned are balanced, the substrate 10 to be aligned can be suspended and fixed between the two sets of alignment parts 20, compared with the mode that the alignment rods are directly contacted with the substrate in the prior art, the alignment parts 20 and the substrate can be prevented from being contacted, and the phenomena of scratches or damages and the like caused by excessive contact of the substrate are reduced.
In addition, the above only provides the step of fixing the substrate in a floating manner by using the alignment member 20, and when the substrate alignment method is applied to an inspection apparatus for a display product such as a liquid crystal display, the substrate alignment method further includes:
acquiring current position information of the substrate 10 to be aligned;
and moving the alignment parts 20 according to the current position information of the substrate 10 to be aligned, so that the substrate 10 to be aligned between the two sets of alignment parts 20 is moved to a working area of a machine.
In the above solution, when aligning the substrate 10 to be aligned, firstly, the substrate 10 to be aligned is placed between the two sets of alignment parts 20, and the substrate 10 to be aligned is suspended and fixed between the two sets of alignment parts 20 by applying an electrical signal to the two sets of alignment parts 20; then, the obtaining unit obtains current position information of the substrate 10 to be aligned, and compares the current position information with preset position information to obtain a movement amount required by the substrate 10 to be aligned to move to the working area, and controls the moving unit to move the alignment part 20 according to the movement amount, at this time, the substrate 10 to be aligned and two sets of the alignment parts 20 move synchronously until the substrate 10 to be aligned moves to the working area, and alignment correction of the substrate 10 to be aligned is completed.
Optionally, in the above method, the controlling a magnetic acting force generated between the magnetic structure of each alignment part 20 and the magnetic part 11 on the substrate to make the substrate float and be fixed between the two alignment parts 20 specifically includes:
applying an electrical signal to the electromagnetic structure on the alignment component 20, so as to balance the magnetic forces generated by the two sets of alignment components 20 and the substrate 10 to be aligned, respectively.
By adopting the above scheme, the magnetic structure on the alignment component 20 is an electromagnetic structure, and the alignment component 20 generates magnetism by applying an electrical signal to the magnetic structure on the alignment component 20, so as to generate a magnetic attraction or repulsion force with the magnetic part 11 on the substrate 10 to be aligned, and the magnetic structure on the alignment component 20 and the substrate 10 to be aligned are controlled to generate a magnetic acting force by the electrical signal, so that the alignment device has the advantages of easy control and the like.
Optionally, in the foregoing method, the applying an electrical signal to the electromagnetic structure on the alignment component 20 to balance the two sets of alignment components 20 with the magnetic acting force generated by the substrate 10 to be aligned respectively includes:
changing the magnetic pole of the electromagnetic structure by changing the current direction introduced by the electromagnetic coil so as to change the magnetic acting force generated between the alignment part 20 and the substrate 10 to be aligned;
and/or changing the intensity of the magnetic field generated by the electromagnetic coil by changing the current passed through the electromagnetic coil so as to change the magnetic acting force generated between the alignment part 20 and the substrate 10 to be aligned.
By adopting the above scheme, the electromagnetic structure is realized by using an electromagnetic coil, and the magnetic acting force between the alignment part 20 and the substrate 10 to be aligned can be adjusted by adjusting the electromagnetic coil to change the current direction and the current magnitude, so that the magnetic acting forces on the two opposite sides of the substrate 10 to be aligned are balanced. Simple structure and easy control.
Optionally, in the foregoing method, the applying an electrical signal to the electromagnetic structure on the alignment component 20 to balance the two sets of alignment components 20 with the magnetic acting force generated by the substrate 10 to be aligned respectively includes:
controlling the electromagnetic structure on each of the aligning members 20 to individually apply an electric signal.
By adopting the above scheme, at least two alignment components 20 are respectively arranged on each side of the substrate 10 to be aligned, which is more favorable for stably suspending and fixing the substrate 10 to be aligned between two sets of alignment components 20, and each alignment component 20 can respectively and independently apply an electrical signal, so that the electrical signals on each alignment component 20 can be respectively and independently adjusted, so that the magnetic acting forces on the two opposite sides of the substrate 10 to be aligned are finally balanced. And aiming at the substrates with different models, the electric signals on the alignment parts 20 can be adjusted in a targeted manner, so that the substrates with different models can be finally fixed between the two sets of alignment parts 20 in a suspended state.
Optionally, in the foregoing method, the applying an electrical signal to the electromagnetic structure on the alignment component 20 to balance the two sets of alignment components 20 with the magnetic acting force generated by the substrate 10 to be aligned respectively may further include: controls the same electrical signal applied to the alignment features 20 of the same set.
With the above-mentioned solution, since the magnetic forces applied to the two opposite sides of the substrate 10 to be aligned need to be adjusted, the alignment components 20 of the same group are located on the same side of the substrate 10 to be aligned, and therefore, the same electrical signals may be applied to the alignment components 20 on the same side.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (8)

1. A substrate alignment device is used for aligning and correcting a substrate to be aligned, wherein magnetic parts are arranged on two opposite sides of the substrate to be aligned; the substrate alignment device is characterized by comprising two groups of alignment parts which are arranged at intervals, wherein each group of alignment parts is respectively provided with a magnetic structure, and the magnetic structures can generate magnetic acting force with the magnetic parts so as to enable a substrate to be aligned to be suspended and fixed between the two groups of alignment parts.
2. The substrate alignment apparatus according to claim 1,
the magnetic structure comprises an electromagnetic structure capable of generating the magnetic force upon application of an electrical signal;
the substrate alignment device further comprises a signal applying unit connected with the electromagnetic structure and used for applying an electric signal to the electromagnetic structure so as to keep balance between the two groups of alignment parts and magnetic acting forces generated by the substrate to be aligned respectively.
3. The substrate alignment device of claim 2,
the electrical signal comprises a current magnitude and/or a current direction, the electromagnetic structure comprises an electromagnetic coil,
when the direction of current introduced by the electromagnetic coil is changed, the magnetic pole of the electromagnetic structure is changed;
when the current led in by the electromagnetic coil is changed, the magnetic field intensity generated by the electromagnetic coil is changed so as to change the magnetic acting force generated between the alignment component and the substrate to be aligned.
4. The substrate alignment device of claim 2,
each pair of positioning parts comprises at least two positioning parts; wherein the content of the first and second substances,
the signal applying unit is connected with the electromagnetic structure on each alignment part independently, and can control the electric signal applied on the electromagnetic structure on each alignment part independently, so that the magnetic acting force between each alignment part and the substrate to be aligned is adjustable independently;
or the signal applying unit applies the same electrical signal to the same group of alignment parts, so that the magnetic acting force between the same group of alignment parts and the substrate to be aligned is synchronously adjustable.
5. A substrate aligning method, characterized in that, the substrate aligning device according to any one of claims 1 to 4 is used to align and correct a substrate, and magnetic parts are respectively arranged on two opposite sides of the substrate; the method comprises the following steps:
and controlling the magnetic structure of each group of alignment parts and the magnetic part on the substrate to generate magnetic acting force so as to make the substrate suspended and fixed between the two groups of alignment parts.
6. The method according to claim 5, applied to the substrate alignment apparatus according to claim 2, wherein the controlling of the magnetic structure of each alignment component and the magnetic member on the substrate to generate a magnetic force therebetween to suspend and fix the substrate between the two alignment components comprises:
and applying an electric signal to the electromagnetic structure on the alignment parts so as to keep balance between the two groups of alignment parts and the magnetic acting force generated between the two groups of alignment parts and the substrate to be aligned respectively.
7. The method according to claim 6, applied to the substrate alignment apparatus according to claim 3, wherein the applying an electrical signal to the electromagnetic structures on the alignment components to balance the two sets of alignment components with the magnetic force generated by the substrate to be aligned respectively comprises:
changing the magnetic pole of the electromagnetic structure by changing the current direction led in by the electromagnetic coil so as to change the magnetic acting force generated between the alignment part and the substrate to be aligned;
and/or changing the intensity of the magnetic field generated by the electromagnetic coil by changing the current introduced by the electromagnetic coil so as to change the magnetic acting force generated between the alignment part and the substrate to be aligned.
8. The method according to claim 5, applied to the substrate alignment apparatus according to claim 4, wherein the applying an electrical signal to the electromagnetic structures on the alignment components to balance the two sets of alignment components with the magnetic force generated by the substrate to be aligned respectively comprises:
controlling the electromagnetic structure on each alignment part to independently apply an electric signal;
or, the same electric signal is applied to the same group of alignment parts.
CN201810337872.5A 2018-04-16 2018-04-16 Substrate alignment device, substrate and substrate alignment method Expired - Fee Related CN108519693B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810337872.5A CN108519693B (en) 2018-04-16 2018-04-16 Substrate alignment device, substrate and substrate alignment method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810337872.5A CN108519693B (en) 2018-04-16 2018-04-16 Substrate alignment device, substrate and substrate alignment method

Publications (2)

Publication Number Publication Date
CN108519693A CN108519693A (en) 2018-09-11
CN108519693B true CN108519693B (en) 2021-10-29

Family

ID=63429403

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810337872.5A Expired - Fee Related CN108519693B (en) 2018-04-16 2018-04-16 Substrate alignment device, substrate and substrate alignment method

Country Status (1)

Country Link
CN (1) CN108519693B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110018586B (en) * 2019-05-30 2022-01-18 京东方科技集团股份有限公司 Display panel, box aligning method thereof, display device and box aligning device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020170678A1 (en) * 2001-05-18 2002-11-21 Toshio Hayashi Plasma processing apparatus
JP2003282415A (en) * 2002-03-26 2003-10-03 Toppan Printing Co Ltd Photomask-storing method, and photomask and container used for the same
KR101018909B1 (en) * 2002-10-25 2011-03-02 도쿄엘렉트론가부시키가이샤 Substrate alignment apparatus, substrate processing apparatus and substrate transfer apparatus
JP4471708B2 (en) * 2004-03-31 2010-06-02 キヤノンアネルバ株式会社 Substrate transfer device
US8084896B2 (en) * 2008-12-31 2011-12-27 Electro Scientific Industries, Inc. Monolithic stage positioning system and method
KR20120050108A (en) * 2010-11-10 2012-05-18 (주)가온솔루션 Non-contact moving apparatus of floating table using magnet
CN203149245U (en) * 2012-12-28 2013-08-21 深圳市易天自动化设备有限公司 Glass alignment device
CN104009674B (en) * 2014-06-13 2016-03-23 哈尔滨工业大学 Six degree of freedom short stroke magnetic levitation worktable
CN104637843B (en) * 2015-02-02 2017-12-05 京东方科技集团股份有限公司 Sealed in unit and method for packing

Also Published As

Publication number Publication date
CN108519693A (en) 2018-09-11

Similar Documents

Publication Publication Date Title
US20180113061A1 (en) Circuit board testing apparatus and circuit board testing method
WO2015045475A1 (en) Alignment method and alignment device
CN108519693B (en) Substrate alignment device, substrate and substrate alignment method
JP2010156684A (en) Array testing device, method of measuring substrate one location position of the array testing device, and method of measuring specific position coordinate imaged by camera assembly
CN103659572A (en) Edge grinding apparatus and method for grinding glass substrate
CN106835023B (en) Evaporation coating device and evaporation coating method
KR101202320B1 (en) Instrumentation system using alignment scope and method for determining system parameters of alignment scope
US10689747B2 (en) Evaporation device
CN104459394A (en) OLED panel alignment device
CN110640689A (en) High-precision aligning device based on vision system
CN104766820A (en) Flexible display device manufacturing method
WO2014201747A1 (en) Etching measuring apparatus and method for target material
JP6100374B2 (en) Equipment for testing wafers
TW201515773A (en) Method and apparatus of symmetrically chamfering substrate
DK163390D0 (en) METHOD AND APPARATUS FOR MEASURING THE VISCOSITY OF SUBSTANCES
US9897381B2 (en) Supporting structure and oven
KR20120124217A (en) A jig for property measurement of flexible display panel
CN206177227U (en) Position detecting device , lens drive arrangement , camera device and electronic equipment
JP2010156685A (en) Array testing device and method of measuring substrate one location position of the array testing device
CN204536704U (en) A kind of horizontal focusing mechanism
DK287684D0 (en) METHOD AND APPARATUS FOR INSTALLING ELECTRONIC COMPONENTS ON A CIRCUIT CARD
KR20130017894A (en) Exposure apparatus and exposure method thereof
CN203179859U (en) Logo alignment device
CN109553287A (en) Scribing equipment and dicing method
CN105204199B (en) Tester table and test device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20211029